MAG.LAYERS
GMLB-160808-R Series
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GMLB chip beads can be used in a variety of electronic applications
including:
Computers and Computer Peripherals
Cellular Communication Equipment
Digital Cameras
Digital Televisions
Audio Equipment
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The GMLB Series is Mag.Layers’ line of high quality ferrite chip beads. Using
the latest in multilayer technology, we have developed chip beads that are able
to resolve all EMI/EMC issues. High quality, reliability, and versatility make the
GMLB series chip beads suitable for all your design needs.
High Reliability
The monolithic inorganic materials used to construct GMLB chips restrain magnetic
flux leakage thereby minimizing EMI concerns. GMLB chips are also extremely
effective with unstable grounding.
Small Chip-Shaped Design
The chip-shaped design makes GMLB chip beads ideal for automatic mounting.
High Soldering Heat Resistance
High quality termination allows both flow and re-flow soldering methods to be
applied.
Sharp High Frequency Characteristics
The GMLB high frequency chip series has sharp impedance characteristics, which
make it suitable for high-speed signal lines.
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G M L B
-
160808
-
0030
A
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N 8 □
□□
□
Product Code
Dimension Code
Impedance (at 100 MHz)
Series Type
Design Code
Code for Special Specification
MAG.LAYERS
GMLB-160808-R Series
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P
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NOTE：Dimensions in mm
PRODUCT NO. A B C D
GMLB-160808
(0603) 1.6±0.15
(0.063±0.006) 0.8±0.15
(0.031±0.006) 0.8±0.15
(0.031±0.006) 0.3±0.20
(0.012±0.008)
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CU
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G
G
In operating temperatures exceeding +85℃, derating of current is necessary for chip
ferrite beads for which rated current is 1.5A or over. Please apply the derating curve
shown below according to the operating temperature.
1
2
3
4
5
6
7
1.5
Operating Temperature(℃)
Rated Current (A)
85 125
MAG.LAYERS
GMLB-160808-R Series
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EQ
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Part Number Impedance (Ω)
at 100 MHz R
DC
(Ω) Max.
I
DC
(mA) Max.
Operating
Temp. Range (℃)
GMLB-160808-0080R-S2
80±25% 0.3
GMLB-160808-0120R-S2
120±25%
GMLB-160808-0240R-S2
240±25% 0.4
GMLB-160808-0300R-S2
300±25% 0.5
200
GMLB-160808-0600R-S2
600±25% 0.4 500
GMLB-160808-1000R-S2
1000±25% 0.8 200
-55
~ +125
Temperature rise should be less than 40℃ for P-type and less than 25℃ for other
types when rated current is applied.
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ET
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TH
H
HO
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D
D
/
/
/
C
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CO
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Test Instrument:
Z:
Agilent 4291B Impedance Analyzer, Test Fixture: Agilent 16192
Osc. Level: 500mV
R
DC
: Agilent 34401A
Test Condition:
< Unless otherwise specified >
Temperature: 15°C to 35°C Humidity: 25% to 85% RH
< In case of doubt >
Temperature: 25°C ± 2°C Humidity: 60% to 70% RH
MAG.LAYERS
GMLB-160808-R Series
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Y
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P
PI
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AL
L
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H
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(
(
(
T
T
T＝
＝＝
＝
＝
＝＝
＝
＝
＝＝
＝2
2
25
5
5℃
℃℃
℃
℃
℃℃
℃
℃
℃℃
℃)
)
)
GMLB-160808-0080R-S2
1 10 100 1000
0
20
40
60
80
100
120
X
R
Z
Impedance(Ohm)
Frequency(MHz)
GMLB-160808-0120R-S2
1 10 100 1000
0
30
60
90
120
150
X
R
Z
Impedance(Ohm)
Frequency(MHz)
GMLB-160808-0240R-S2
1 10 100 1000
0
50
100
150
200
250
300
X
R
Z
Impedance(Ohm)
Frequency(MHz)
GMLB-160808-0300R-S2
1 10 100 1000
0
50
100
150
200
250
300
350
X
R
Z
Impedance(Ohm)
Frequency(MHz)
GMLB-160808-0600R-S2
1 10 100 1000
0
100
200
300
400
500
600
700
X
R
Z
Impedance(Ohm)
Frequency(MHz)
GMLB-160808-1000R-S2
1 10 100 1000
0
200
400
600
800
1000
1200
X
R
Z
Impedance(Ohm)
Frequency(MHz)
MAG.LAYERS
GMLB-160808-R Series
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NG
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Peel-off Force
165° TO 180°
TOP COVER TAPE
BASE TAPE
The force for peeling off cover tape is 10 grams in the arrow direction.
Dimension (Unit: mm)
CD
A
E
B
F
TYPE SIZE A B W P T CHIPS/REEL
GMLB 160808 1.1 1.9 8 4 1.1,
*0.95±0.05
4000
*: For paper reels
TYPE
A
B
C D E
F
8 mm 178±1 60 +0.5
-0 - 13 ±0.2 9 ±0.5 12 ±0.5
12 mm
178±0.3
60 ±0.2
19.3 ±0.1
13.5 ±0.1
13.6 ±0.1
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MAG.LAYERS
GMLB-160808-R Series
Taping Quantity
SERIES 1608
PCS/Reel 4000
Tape Packing Case
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W
L
H
Unit: cm
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PC
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CB
B
B
L
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LA
A
AY
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YO
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AB B
C
Land
pattern
Component
Solder-resist
W
L
Component
Unit: mm
Type 1608
L 1.6
Size
W
0.8
A 0.6~0.8
B 0.6~0.8
C 0.6~0.8
No. of
Reels
W
L H
2 18
±
0.5 18
±
0.5 2.4
±
0.2
3 18
±
0.5 18
±
0.5 3.6
±
0.2
4 18
±
0.5 18
±
0.5 4.8
±
0.2
5 18
±
0.5 18
±
0.5 6.0
±
0.2
MAG.LAYERS
GMLB-160808-R Series
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•Mechanical Performance Test
ITEM SPECIFICATION TEST CONDITION
Solderability
More tha
n 90% of the terminal electrode shall
be covered with fresh solder. Solder: 96.5Sn-3.0Ag-0.5Cu
Solder Temperature: 245 ± 5℃
Flux: Rosin
Dip Time: 3 ± 1 Seconds
Soldering Heat Resistance
The chip shall not crack.
More tha
n 75% of the terminal electrode shall
be covered with solder.
Solder: 96.5Sn-3.0Ag-0.5Cu
Solder temperature : 260 ± 5℃
Flux: Rosin
Dip time: 10 ± 1 seconds
TYPE W(KGF)
TIME (SEC)
GMLB-160808
GMLB-201209
0.6
GMLB-321611
1.0
Terminal Strength
The terminal electrode shall not be broken off
nor the ferrite damaged.
W
GMLB-453215
1.5
30 ± 5
TYPE W(KGF)
TIME (SEC)
GMLB-160808
GMLB-201209
1.0
GMLB-321611
Terminal Strength
The terminal electrode shall not be broken off
nor the ferrite damaged.
GMLB-453215
2.0
10 ± 5
TYPE A(MM) P(KGF)
GMLB-160808
1.0
GMLB-201209
1.4 1.0
GMLB-321611
2.0 2.0
Bending Strength
No mechanical damage.
The ferrite shall not be damaged.
A
Chip
P
1.0
R0.5
GMLB-453215
2.7 2.5
Bending Test
Appearance: No damage
Substrate: PCB(100mm 40mm 1.6mm)
Solder: Reflow
Speed of Applying Force: 0.5mm / s
Deflection: 2mm
Hold Duration: 30 s
Vibration
Impedance shall be within ± 20% of the initial
value.
There shall be no mechanical damage.
The sample shall be soldered onto the printed
circuit board
and when a vibration having an
amplitude of 1.52mm
and a frequency of from
10 to 55Hz/1 minute repeated should
be
applied to the 3 directions (X,Y,Z) for 2 hours
each.
Drop shock No apparent damage
Dropped onto printed circuit board from
100cm height three times in x, y, z directions.
The terminals shall be protected.
W
MAG.LAYERS
GMLB-160808-R Series
• Climatic test
ITEM SPECIFICATION TEST CONDITION
Thermal Shock
(Temperature Cycle) Temperature: -55℃~125℃ for 30 minutes
each, 100 cycles.
Humidity Resistance Temperature : 60℃
Humidity: 95% RH
Time: 1000 ± 12 Hours
High Temperature
Resistance Temperature : 85℃±2℃
Time: 1000 ± 12 Hours
Low Temperature
Resistance
Impedance shall be within ±
20% of the initial
value.
Temperature : -40℃±2℃
Time: 1000 ± 12 Hours
1. Operating Temperature Range: -55 ℃ TO +125℃
2. Storage Condition: The temperature should be within -40℃~85℃ and humidity should be less than 75% RH.
The product should be used within 6 months from the time of delivery.
MAG.LAYERS
GMLB-160808-R Series
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EF
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FL
L
LO
O
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S
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SO
O
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L
LD
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G
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P
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OF
F
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Ts
min
Ts
max
tL
tP
tS
Preheat
TP
TL
Critical Zone
T
L
to T
P
Ramp-down
Ramp-up
t=25
℃
℃℃
℃
to Peak Time
Temperature
Profile Feature Sn-Pb Pb-Free
t
s
60~120 seconds 60~180 seconds
T
smin
100℃ 150℃
Preheat
T
smax
150℃ 200℃
Average ramp-up rate (T
smax
to T
P
) 3℃/second max. 3℃/second max.
Temperature (T
L
)
183℃ 217℃
Time main above
Time (t
L
) 60~150 seconds 60~150 seconds
Peak temperature (T
P
) 230℃ 250~260℃
Time within 5℃ of actual peak
temperature (t
P
) 10 seconds 10 seconds
Ramp-down rate 6℃/sec max. 6℃/sec max.
Time 25℃ to peak temperature 6 minutes max. 8 minutes max.
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The contents of this data sheet are subject to change without notice. Please
confirm the specifications and delivery conditions when placing your order.
