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TSZ22111･14･00
Datasheet
Operational Amplifiers Series
Low Noise Operational Amplifiers
BA4510xxx
●General Description
BA4510 is dual operational amplifier with high gain.
It has good performance of input referred noi se
voltage(6 HznV/ ) and total harmonic
distortion(0.007%). These are suitable for Audio
applications.
●Features
High voltage gain
Low input referred noise voltage
Low distortion
Wide operating supply voltage
●Application
Audio application
Consumer electronics
●Packages W(Typ.) x D(Typ.) x H(Max.)
SOP8 5.00mm x 6.20mm x 1.71mm
SSOP-B8 3.00mm x 6.40mm x 1.35mm
TSSOP-B8 3.00mm x 6.40mm x 1.20mm
MSOP8 2.90mm x 4.00mm x 0.90mm
●Key Specification
Wide Operating Suppl y Voltage
(split supply) : ±1.0V to ±3.5V
Wide Temperature Range: -20°C to +75°C
High Slew Rate: 5V/µs(Typ.)
Total Harmonic Distortion: 0.007%(Typ.)
Input Referred Noise Voltage: 6 HznV/ (Typ.)
●Block Diagrams
○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays.
Figure 1. Simplified schematic
－IN
＋IN VOU
T
VCC
VEE
OUT
VEE
+IN
-IN
VCC
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BA4510xxx
●Pin Configuration(TOP VIEW)
SOP8, SSOP-B8, TSSOP-B8, MSOP8
Pin No. Symbol
1 OUT1
2 -IN1
3 +IN1
4 VEE
5 +IN2
6 -IN2
7 OUT2
8 VCC
Package
SOP8 SSOP-B8 TSSOP-B8 MSOP8
BA4510F BA4510FV BA4510FVT BA4510FVM
●Ordering Information
B A 4 5 1 0 x x x - E2
Part Number
BA4510xxx Package
F : SOP8
FV : SSOP-B8
FVT : TSSOP-B8
FVM : MSOP8
Packaging and forming specific ation
E2: Embossed tape and reel
(SOP8/SSOP-B8/TSSOP-B8)
TR: Embossed tape and reel
(MSOP8)
●Line-up
Topr Operating
Supply Voltage
(split supply)
Supply
Current
(Typ.)
Slew Rate
(Typ.) Package Orderable
Part Number
-20°C to +75°C ±1.0V to ±3.5V 5mA 5V/µs
SOP8 Reel of 2500 BA4510F-E2
SSOP-B8 Reel of 2500 BA4510FV-E2
TSSOP-B8 Reel of 2500 BA4510FVT-E2
MSOP8 Reel of 3000 BA4510FVM-TR
45
36
27
18
CH1
- +
CH2
+ -
OUT1
-IN1
+IN1
VEE
OUT2
-IN2
+IN2
VCC
Datasheet
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BA4510xxx
●Absolute Maximum Ratings (Ta=25℃)
○BA4510
Parameter Symbol Ratings Unit
Supply Voltage VCC-VEE +10 V
Power dissipa tion Pd
SOP8 620*1*5
mW
SSOP-B8 550*2*5
TSSOP-B8 500*3*5
MSOP8 470*4*5
Differential Inpu t Voltage *6 Vid VCC-VEE V
Input Common-mode V oltage Range Vicm VEE to VCC V
Operating Supply Voltage Vopr 2 to 7(±1 to ±3.5) V
Operating Temperature Topr -20 to +75 ℃
Storage Temperature Tstg -40 to 125 ℃
Maximum Junction Temperature Tjmax +125 ℃
Note: Absolute maximum rating item indicates the condition which must not be exceeded.
Application of voltage in excess of absolute maximum rating or use out absolute maximum rated temperature environment may cause
deterioration of characteristics.
*1 To use at temperature above Ta＝25℃ reduce 6.2mW/℃
*2 To use at temperature above Ta＝25℃ reduce 5.5mW/℃
*3 To use at temperature above Ta＝25℃ reduce 5.0mW/℃
*4 To use at temperature above Ta＝25℃ reduce 4.8mW/℃
*5 Mounted on a FR4 glass epoxy PCB(70mm×70mm×1.6mm).
*6 The voltage difference between inverting input and non-inverting input is the differential input voltage.
Then input terminal voltage is set to more than VEE.
●Electrical Characteristics
○BA4510 (Unless otherwise specified VCC=+2.5V, VEE=-2.5V, Ta=25℃)
Parameter Symbol
Limits Unit Condition
Min. Typ. Max.
Input Offset Voltage *7 Vio - 1 6 mV RS=50Ω
Input Offset Current *7 Iio - 2 200 nA -
Input Bias Current *8 Ib - 80 500 nA -
Supply Current ICC 2.5 5.0 7.5 mA RL=∞, All Op-Amps
Maximum Output Voltage(High) VOH +2.0 + 2.4 - V RL=10kΩ
Maximum Output Voltage(Low) VOL - -2.4 -2.0 V RL=10kΩ
Large Signal Voltage Gain Av 60 90 - dB RL≧10kΩ
Input Common-mode V oltage Range Vicm -1.3 - +1.5 V -
Common-mode Rejection Ratio CMRR 60 80 - dB -
Power Supply Rejection Ratio PSRR 60 80 - dB RS=50Ω
Slew Rate SR - 5.0 - V/μsAv=1
Total Harmonic Distortion+ Noise THD＋N - 0.007 - %
Av=20dB, RL=10kΩ,
VIN=0.05Vrms, f=1kHz
DIN-AUDIO
Input Referred Noise Voltage Vn - 6 - HznV/ RS=100Ω, Vi=0V, f=1kHz
- 0.7 - μVrms DIN-AUDIO
Channel Separation CS - - dB R1=100Ω, f=1kHz
*7 Absolute value
*8 Current direction: Since first input stage is composed with PNP transistor, input bias current f l ows out of IC.
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BA4510xxx
Description of electrical characteristics
Described here are the terms of electric characteristics used in this datasheet. Items and s ymbols used are also shown.
Note that item name and symbol and their meaning may differ from those on another manufacture’s document or general document.
1. Absolute maximum ratings
Absolute maximum rating item indic ates the condition which must not be exceeded. Application of voltage in exc ess of
absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of
characteristics.
1.1 Power supply voltage (VCC/VEE)
Indicates the maximum voltage that can be applied between the positive power supply terminal and negative power
supply terminal without deterioration or destruction of characteristics of internal circuit.
1.2 Differential input voltage (Vid)
Indicates the maximum voltage that can be applied between non-inverting terminal and inverting terminal without
deterioration and destruction of characteristi cs of IC.
1.3 Input common-mode voltage range (Vicm)
Indicates the maximum voltage that can be applied to non-inverting terminal and inverting terminal without
deterioration or destruction of characteristics. Input common -mode voltage range of the maximum ratings not assure
normal operation of IC. When normal operation of IC is desired, the input common-mode voltage of characteristics
item must be followed.
1.4 Power dissipation (Pd)
Indicates the power that can be consumed by specified mounted board at the ambient temperature 25℃(normal temperature).
As for package product, Pd is determined by the temperature that can be permitted by IC chip in the package
(maximum junction temperatur e) and t herm al resistance of the package.
2. Electrical characteristics item
2.1 Input offset voltage (Vio)
Indicates the voltage difference between non-inverting terminal and inverting terminal. It can be translated into the
input voltage difference required for setting the output voltage at 0 V.
2.2 Input offset current (Iio)
Indicates the difference of input bias current between non-inverting terminal and inverting terminal.
2.3 Input bias current (Ib)
Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias current at
non-inverting terminal and input bias current at inverting terminal.
2.4 Input common-mode voltage range(Vicm)
Indicates the input voltage range where IC operates norm ally.
2.5 Large signal voltage gain (Av)
Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal
and Inverting terminal. It is normally the ampl ifying rate (gain) with reference to DC voltage.
Av = (Output voltage fluctuation) / (Input offset fluctuation)
2.6 Circuit current (ICC)
Indicates the IC current that flows under specified conditions and no-load steady status.
2.7 Maximum Output Voltage(High) / Maximum Output Voltage(Low) (VOH/VOL)
Indicates the voltage range that can be output by the IC under specified load condition. It is typically divided into
maximum output voltage High and low. Maximum output voltage high indicates the upper limit of output voltage.
Maximum output voltage low indicates the lower limit.
2.8 Common-mode rejection ratio (CMRR)
Indicates the ratio of fluctuation of input offset voltage when in-phase input voltage is changed. It is normally the
fluctuation of DC.
CMRR = (Change of Input common-mode voltage)/(Input offset fluctuation)
2.9 Power supply rejection ratio (PSRR)
Indicates the ratio of fluctuation of input offset voltage when supply voltage is change d. It is normally the fluctuation
of DC.
PSRR = (Change of power supply voltage) / (Input offset fluctuation)
2.10 Slew Rate (SR)
SR is a parameter that shows movement speed of operational amplifier. It indicates rate of variabl e output voltage
as unit time.
2.11 Total harmonic distortion + Noise (THD+N)
Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage
of driven channel.
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BA4510xxx
2.12 Input referred noise voltage (Vn)
Indicates a noise voltage generated inside the operational amplifier equivalent by i deal voltage source connecte d in
series with input terminal.
2.13 Channel separation (CS)
Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage
of driven channel.
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0
2
4
6
8
10
-50 -25 0 25 50 75 100
AMBIENT TEMPERATURE [℃
]
SUPPLY CURRENT [mA]
0
200
400
600
800
0255075100125
AMBIENT TEMPERATURE [℃]
POW ER D I SSIPATI ON [m W ] .
●Typical Performance Curves
○BA4510
(*) The above data is measurement value of typical sample, it is not guaranteed.
Figure 3.
Su
pp
l
y
Current - Su
pp
l
y
Volta
g
e
0
2
4
6
8
10
±0 ±1 ±2 ±3 ±4
S U PP LY VOLTAGE [V]
SUPPLY CURRENT [ mA]
75℃
25℃
-20℃
Figure 5.
Maximum Output Voltage Swing
- Load Resistance
(VCC/VEE=2.5V/-2.5V, Ta=25℃)
-3
-2
-1
0
1
2
3
0.1 1 10 100 1000 10000
LOAD RESISTANCE [kΩ]
OUTPUT VOLTAGE [V]
VOH
VOL
Figure 2.
Derating Curve
Figure 4.
Supply Current - Ambient Temperature
±1.5V
±3.5V
±2.5V
BA4510F
BA4510FV
BA4510FVT
BA4510FVM
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BA4510xxx
-4
-3
-2
-1
0
1
2
3
4
±1.0 ±1.5 ±2.0 ±2.5 ±3.0 ±3.5 ±4.0
SUPPLY VOLTAGE [V]
OUTPUT VOLTAGE [V]
VOH
VOL
-3.0
-2.5
-2.0
-1.5
-1.0
-0.5
0.0
0246810
O UTPUT S I NK CURRE NT [ mA ]
OU T PU T VOLT AGE [ V]
VOL
○BA4510
(*) The above data is measurement value of typical sample, it is not guaranteed.
Figure 7.
Maximum Output Voltage
- Ambient Temperature
(
VCC/VEE=2.5V/-2.5V
,
RL=10kΩ
)
-3
-2
-1
0
1
2
3
-50-250 255075100
AMBIENT TEMPERATURE [℃]
OUTPUT VOLTAGE [V]
VOH
VOL
Figure 6.
Maximum Output Voltage
- Supply Voltage
(RL=10kΩ, Ta=25℃)
Figure 9.
Maximum Output Voltage
- Output Sink Current
(VCC/VEE=2.5V/-2.5V, Ta=25℃)
Figure 8.
Maximum Output Voltage
- Output Source Current
(VCC/VEE=2.5V/-2.5V, Ta=25℃)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0 0.4 0.8 1.2 1.6 2
O UT PUT SO URCE CURRE NT [mA]
OUTPUT VOLTAGE [V]
VOH
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BA4510xxx
○BA4510
(*) The above data is measurement value of typical sample, it is not guaranteed.
0
50
100
150
200
250
300
±1.0 ±1.5 ±2.0 ±2.5 ±3.0 ±3.5 ±4.0
SUPPLY VOLTAGE [V]
INP UT BIAS C URRE NT [nA]
Figure 10.
Input Offset Voltage - Supply Voltage
(Vicm=0V, Vout=0V)
-6.0
-4.0
-2.0
0.0
2.0
4.0
6.0
±1.0 ±1.5 ±2.0 ±2.5 ±3.0 ±3.5 ±4.0
SUPPLY VOLTAGE [V]
INPUT OFFSET VOLTAGE [mV]
75°C
-20°C
25°C
Figure 11.
Input Offset Voltage - Ambient Temperature
(Vicm=0V, Vout=0V)
0.0
0.5
1.0
1.5
2.0
-50 -25 0 25 50 75 100
AMBIENT TEMPERATURE [°C]
INPUT OFFSET VOLTAGE [mV]
±1.5V
±2.5V
±3.5V
Figure 12.
Input Bias Current - Supply Voltage
(Vicm=0V, Vout=0V)
0
50
100
150
200
250
300
-50 -25 0 25 50 75 100
AMBIENT TEMPERATURE [°C]
INP UT BIAS C URRE NT [nA]
75°C
25°C
-20°C
Figure 13.
Input Bias Current - Ambient Temperature
(Vicm=0V, Vout=0V)
±3.5V
±2.5V
±1.5V
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BA4510xxx
○BA4510
(*) The above data is measurement value of typical sample, it is not guaranteed.
0
20
40
60
80
100
120
-50 -25 0 25 50 75 100
AMBIENT T EMPERAT URE [℃]
POW E R S UP PLY REJECT ION RATIO [dB]
Figure 14.
Input Offset Current - Supply Voltage
(Vicm=0V, Vout=0V)
-20
-15
-10
-5
0
5
10
15
20
±1.0 ±1.5 ±2.0 ±2.5 ±3.0 ±3.5 ±4.0
SUPPLY VOLTAGE [V]
I NPUT O FFSET CURRENT [ nA ]
75°C
-20°C
25°C
Figure 15.
Input Offset Current - Ambient Temperature
(Vicm=0V, Vout=0V)
-20
-15
-10
-5
0
5
10
15
20
-50 -25 0 25 50 75 100
AMBIENT TEMPERATURE [°C]
I N PUT OFFSE T CURRENT [ nA]
±3.5V
±2.5V ±1.5V
Figure 17.
Large Signal Voltage Gain
- Ambient Temperature
Figure 16.
Input Offset Voltage
- Common Mode Input Voltage
(VCC/VEE=2.5V/-2.5V)
-10
-5
0
5
10
-3 -2 -1 0 1 2 3
COM MON M ODE INPUT V OLTAGE [V]
INPUT O F F SET VO LTAG E [ mV]
-20℃
25℃
75℃
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BA4510xxx
○BA4510
(*) The above data is measurement value of typical sample, it is not guaranteed.
Figure 18.
Common Mode Rejection Ratio
- Ambient Temperature
0
20
40
60
80
100
120
-50 -25 0 25 50 75 100
AMBIENT TEMPERATURE [°C]
CO MMO N MODE RE J ECTI ON RA T IO [dB]
Figure 19.
Power Supply Rejecti on Ratio
- Ambient Temperature
0
20
40
60
80
100
120
-50-250 255075100
AMBIENT TEMPERATURE [℃]
PO WE R SUP PL Y RE J ECTI ON RA T I O [ dB]
Figure 21.
Slew Rate H-
L
- Ambient Tem
p
erature
0
2
4
6
8
10
-50 -25 0 25 50 75 100
AMBIENT TEMPERA TURE [℃]
SLEW RATE H-L [V/μs]
±1.5V
±2.5V
±3.5V
Figure 20.
Slew Rate L-H - Ambient Temperature
0
2
4
6
8
10
-50-250 255075100
AMBIENT TEMPERATURE [℃]
SLEW RATE L -H [V/µs]
±1.5V
±2.5V
±3.5V
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BA4510xxx
○BA4510
(*) The above data is measurement value of typical sample, it is not guaranteed.
Figure 23.
Equivalent Input Noise Voltage - Frequency
(VCC/VEE=2.5V/-2.5V)
Figure 24.
Voltage Gain・Phase - F r equency
(VCC/VEE=2.5V/-2.5V, Av=40dB, RL=10kΩ)
0
10
20
30
40
50
60
1.E+02 1.E+03 1.E+04 1.E+05 1.E+06 1.E+07
FREQ UENCY [Hz]
GAIN [d B]
-180
-150
-120
-90
-60
-30
0
PHASE [deg]
Phase
Gain
Figure 22.
Total Harmonic Distortion - Output Voltage
(VCC/VEE=2.5V/-2.5V, RL=3kΩ, 80kHz-LPF, Ta=25℃)
0.001
0.01
0.1
1
0.01 0.1 1 10
OUTPUT VOLTAGE [Vrm s]
TO TAL HA RMONI C DI STO RTION [ %]
1kHz
20Hz
20kHz
0
10
20
30
40
1 10 100 1000 10000
F REQUENCY [Hz]
I NPUT REFER RED NOI SE VOLTAGE
[nV/√Hz]
102 10
3 10
4 10
5 10
6 10
7
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BA4510xxx
●Applic at ion Informa tion
NULL method Condition for Test circuit1 VCC, VEE, EK, Vicm Unit: V
Parameter VF S1 S2 S3 VCC VEE EK Vicm calculatio
n
Input Offset Voltage VF1 ON ON OFF 2.5 -2.5 0 0 1
Input Offset Current VF2 OFF OFF OFF 2.5 -2.5 0 0 2
Input Bias Current VF3 OFF ON OFF 2.5 -2.5
0 0 3
VF4 ON OFF 0 0
Large Signal Voltage Gain VF5 ON ON ON
2.5 -2.5 0 0 4
VF6 2.5 -2.5 0 0
Common-mode Rejection Ratio (Input
common-mode Voltage Range) VF7 ON ON OFF
1 -4 0 0 5
VF8 3.8 -1.2 0 0
Power Supply
Rejection Ratio VF9 ON ON OFF
1 -1 0 0 6
VF10 2.5 -2.5 0 0
-Calculation-
1. Input Offset Voltage (Vio)
2. Input Offset Current (Iio)
3. Input Bias Current (Ib)
4. Large Signal Voltage Gain (Av)
5. Common-mode Rejecti on Ration (CMRR)
6. Power supply rejection ratio (PSRR)
Figure 25. Test circuit1 (one channel only)
VF
RL
0.1μF
500kΩ
500kΩ
RF=50kΩ
RS=50Ω
Ri=10kΩ
EK
NULL
DUT
V
SW1
SW2
Vicm 1000pF
SW3
VCC
VEE
-15V
+15V
Ri=10kΩ
RS=50Ω
50kΩ
0.1μF
[V]
RS / RF + 1 VF1
Vio
[A]
RS) / RF + (1× Ri VF1-VF2
Iio
[A]
RS) / RF + (1 ×Ri×2 VF3-VF4
Ib
[dB]
VF6-VF5 RF/RS)+(1×ΔEK
Log×20 Av
[dB]
VF7-VF8 RF/RS)+(1×ΔVicm
Log×20 CMRR
[dB]
VF9-VF10 RF/RS)+(1×ΔVcc
Log×20 PSRR
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BA4510xxx
Sw itch Condition for Test Circuit 2
SW No. SW1 SW2 SW3 SW4 SW5 SW6 SW7 SW8 SW9 SW10 SW11 SW12 SW13 SW14
Supply Current OFF OFF OFF ON OFF ON OFF OFF OFF OFF OFF OFF OFF OFF
Maximum Output Voltage(High) OFF OFF ON OFF OFF ON OFF OFF ON OFF OFF OFF ON OFF
Maximum Output Voltage(Low) OFF OFF ON OFF OFF ON OFF OFF OFF OFF OFF OFF ON OFF
Output Source Current OFF OFF ON OFF OFF ON OFF OFF OFF OFF OFF OFF OFF ON
Output Sink Current OFF OFF ON OFF OFF ON OFF OFF OFF OFF OFF OFF OFF ON
Slew Rate OFF OFF OFF ON OFF OFF OFF ON ON ON OFF OFF OFF OFF
Gain Bandwidth Product OFF ON OFF OFF ON ON OFF OFF ON ON OFF OF F OFF OFF
Equivalent Input Noise Voltage ON OFF OFF OFF ON ON OFF OFF OFF OFF ON OFF OFF OFF
Figure 26. Test Circuit 2 (each Op-Amp)
VH
VL
Time t
Input voltage
VH
VL
Δ
t
ΔV
Time
SR=ΔV/Δt
t
Output voltage
Figure 27. Slew Rate Input Waveform
SW1 SW2 SW3
－
＋
SW10 SW11 SW12
A
VIN- VIN+ RL
VCC
VEE
SW9
～ ～
SW6 SW7 SW8
～
CL
SW13 SW14
A
V
VOU
T
RS
SW5
SW4
V
R1
R2
C 90%
10%
Figure 28. Test Circuit 3 (Channel Separation)
(VCC=+2.5V. VEE=-2.5V, R1=100Ω, R2=10kΩ)
VCC
VEE
R1
V
R2
R1//R2
VOUT1
=0.5[Vrms]
VIN
VCC
VEE
R1
V
R2
R1//R2
VOUT2
OTHE
R
CH
CS＝20×log 100×VOUT1
VOUT2
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(b) Derating curve
●Power Dissipation
Power dissipation(total loss) indicates the power t hat can be consum ed by I C at Ta=25℃(normal temp erature). IC is heat ed
when it consumed p ower, a nd the temperature of IC chip becomes hi gher than ambient temperature. The t emperature that
can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited.
Power dissipation is determined by the temperature allowed in IC chip(maximum junction temperature) and thermal
resistance of package(heat dissipation capability). The maximum junction temperature is typically equal to the maximum
value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead
frame of the package. The parameter which indicates this heat dissipation capability(hardness of heat release)is called
thermal resistance, represent ed by the s ymbol θja℃/W. The t emperature of IC ins ide the package can be estimated by this
thermal resistance. Figure 29. (a) shows the model of thermal resistance of the package. Thermal resistance θja, ambient
temperature Ta, maximum junction temperature Tjmax, and power dissipation Pd can be calculated by the equatio n below:
θja = (Tjmax-Ta) / Pd ℃/W ・・・・・ (Ⅰ)
Derating curve in Figure 29. (b) indicates po wer that can be consumed b y IC with reference to ambient temperature. Power
that can be consumed by IC with ref erence to ambie nt t emperatur e. Po wer that can be c onsum ed by I C begi ns t o att e nuat e
at certain ambient temperature. This gradient is determined by thermal resistance θj a. Thermal resistance θja depends on
chip size, power consumptio n, package, ambient temp erature, package condition, wind velocity, etc even when the same of
package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Figure 30. (c)
show a derating curve for an exampl e of BA4510.
(*9) (*10) (*11) (*12) Unit
6.2 5.5 5.0 4.8
mW/℃
When using the unit above Ta=25℃, subtract the value above per degree℃. Permissible dissipation is the value.
Permissible dissipation is the value when FR4 glass epoxy board 70mm ×70mm ×1.6mm (cooper foil area below 3%) is mounted.
Figure 30. Derating curve
(a) Thermal resistance
Figure 29. Thermal resistance and derating curve
(c)BA4510 Derating curve
0 50 75 100 125 15025
P1
P2
Pd (m ax )
LSIの消費電力 [W]
θ' ja2
θ' ja1 Tj ' ( max)
θja2 < θja1
周囲温度 Ta [℃]
θ ja2
θ ja1 Tj ( ma x)
Power dissipation of LSI [W]
A
mbient temperature Ta [℃]
BA4510F
BA4510FV
620mW(
*
9)
550mW(
*
10)
500mW(
*
11)
470mW(
*
12)
BA4510FV
BA4510FVM
周囲温度 Ta [℃]
チップ表面温度 Tj [℃]
消費電力 P [ W]
Ambient temperature Ta [℃]
Chip sur face temper a ture Tj [℃]
Power dissipation P [W]
θja=(Tjmax-Ta)/Pd ℃/W
0
200
400
600
800
0 25 50 75 100 125
AMBIENT TEMPERATURE [℃]
POW ER D I SSI PAT I O N [ m W ] .
Datasheet
www.rohm.com TSZ02201-0RAR1G200080-1-2
© 2012 ROHM Co., Ltd. All rights reserved. 15/19 7.NOV.2012 Rev.001
TSZ22111･15･00
BA4510xxx
Application examples
○Voltage follo wer
○Inverting amplifier
○Non-inverting amplifier
Figure 31. Voltage follower circ uit
Figure 32. Inverting amplif ier circuit
Figure 33. Non-invertin g amplifier circuit
Voltage gain is 0 dB.
This circuit controls output voltage (Vout) equal input
voltage (Vin), and keeps Vout with stable because of
high input impedance and low output impedance.
Vout is shown next expression.
Vout=Vin
For inverting amplifier, Vin is amplified by voltage gain
decided R1 and R2, and phase reversed voltage is
output.
Vout is shown next expression.
Vout=-(R2/R1)・Vin
Input impedance is R1.
For non-inverting amplifier, Vin is amplified by voltage
gain decided R1 and R 2, and phase is same with Vin.
Vout is shown next expression.
Vout=(1 + R2/R1)・Vin
This circuit performs high input impedance because
Input impedance is operational amplifier’s input
Impedance.
VEE
Vout
Vin
VCC
R2
R1
VEE
R1//R2
Vin
Vout
VCC
VEE
R2
VCC
Vin Vout
R1
Datasheet
www.rohm.com TSZ02201-0RAR1G200080-1-2
© 2012 ROHM Co., Ltd. All rights reserved. 16/19 7.NOV.2012 Rev.001
TSZ22111･15･00
BA4510xxx
●Operational Notes
1) Processing of unused circuit
It is recommended to apply connection (see the Figure 34.) and set the non
inverting input terminal at the potential withi n input common-mode voltage range
(Vicm), for any unused circuit.
2) Input voltage
Please note th at the circuit operates normally only when th e input voltage is within
the common mode input voltage range of the electric characteristics.
3) Maximum output voltage
Because the output voltage range becomes narrow as the output current
Increases, design the application with margin by considering changes in
electrical charact erist ics and temperature characteristics.
4) Short-circuit of output terminal
When output terminal and VCC or VEE terminal are shorted, excessive Output
current may flow under some conditions, and heating may destroy IC. It is
necessary to connect a resistor as shown in Figure 35. t her eby protect in g against
load shorting.
5) Power supply (split supply / single supply) in used
Op-amp operates when specified voltage is applied between VCC and VEE.
Th e r efo re , t h e s i n g l e s u p p l y O p - A m p c a n be us e d f o r d o uble supply Op-Amp as w ell.
6) Power dissipation (Pd)
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating
conditions.
7) Short-circuit between pins and wrong mounting
Pay attention to the assembl y direction of the ICs. Wrong mounting direct ion or shorts between terminals, GND, or other
components on the circuits, can damage the IC.
8) Use in strong electromagnetic field
Using the ICs in strong elect r omagnetic field can cause oper ation malfunction.
9) Radiation
This IC is not designed to be radiation-resistant.
10) Handing of IC
When stress is applied to IC because of deflection or bend of board, the characteristics may fluctuate due to piezo
resistance effects.
11) Inspection on set board
During testing, turn on or off the power before mount ing or dismounting the board from the test Jig. Do not power up the
board without waiting for the output capacitors to discharge. The capacitors in the low output impedance terminal can
stress the device. Pay attention to the electro static voltages during IC handlin g, transportation, and storage.
12) Output capacitor
When VCC terminal is shorted to VEE (GND) potential and an electric charge has acc umulated on the external capacitor,
connected to output terminal, accumulated charge may be discharged VCC terminal via the parasitic element within the
ci rcui t or ter mina l prot e c t io n ele men t. The ele men t in the cir c uit may be d amaged (the rmal d estru ction). When using this IC
for an application circuit where there is oscillation, output capacitor load does not occur, as when using this IC as a
voltage comparator. Set the capacitor c onnected to output terminal below 0.1μF in order to prevent damage to IC.
Status of this document
The Japanese version of t his document is formal spec ification. A customer may use this translation versi on only for a reference
to help reading the formal version.
If there are any differences in translation version of this docum ent formal version takes priority.
application circuit for unused op-amp
output short protection
Figure 35. The example of
Connect
to Vicm
Figure 34. The example of
VCC
VEE
Vicm
-
+
VEE
VCC
+
-
protection
resistor
Datasheet
www.rohm.com TSZ02201-0RAR1G200080-1-2
© 2012 ROHM Co., Ltd. All rights reserved. 17/19 7.NOV.2012 Rev.001
TSZ22111･15･00
BA4510xxx
●Physical Dimensions Tape and Reel Information
Direction of feed
Reel
∗
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper right when you hold
reel on the left hand and you pull out the tape on the right hand
3000pcs
TR
()
1pin
(Unit : mm)
MSOP8
0.08 S
S
4.0±0.2
8
3
2.8±0.1
1
6
2.9±0.1
0.475
4
57
(MAX 3.25 include BURR)
2
1PIN MARK
0.9MAX
0.75±0.05
0.65
0.08±0.05
0.22 +0.05
−0.04
0.6±0.2
0.29±0.15
0.145 +0.05
−0.03
4°
+6°
−4°
∗
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
2500pcs
E2
()
Direction of feed
Reel 1pin
(Unit : mm)
SOP8
0.9±0.15
0.3MIN
4
°
+
6
°
−
4
°
0.17 +0.1
-
0.05
0.595
6
43
8
2
5
1
7
5.0±0.2
6.2±0.3
4.4±0.2
(MAX 5.35 include BURR)
1.27
0.11
0.42±0.1
1.5±0.1
S
0.1 S
∗
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
2500pcs
E2
()
Direction of feed
Reel 1pin
(Unit : mm)
SSOP-B8
0.08
M
0.3MIN
0.65
(0.52)
3.0±0.2
0.15±0.1
(MAX 3.35 include BURR)
S
S
0.1
1234
5678
0.22
6.4±0.3
4.4±0.2
+0.06
−0.04
0.1
1.15±0.1
Direction of feed
Reel ∗
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
3000pcs
E2
()
1pin
(Unit : mm)
TSSOP-B8
0.08 S
0.08
M
4 ± 4
234
8765
1
1.0±0.05
1PIN MARK
0.525
0.245+0.05
−0.04
0.65
0.145+0.05
−0.03
0.1±0.05
1.2MAX
3.0±0.1
4.4±0.1
6.4±0.2
0.5±0.15
1.0±0.2
(MAX 3.35 include BURR)
S
Datasheet
www.rohm.com TSZ02201-0RAR1G200080-1-2
© 2012 ROHM Co., Ltd. All rights reserved. 18/19 7.NOV.2012 Rev.001
TSZ22111･15･00
BA4510xxx
●Marking Diagrams
Product Name Package Type Marking
BA4510
F SOP8
4510
FV SSOP-B8
FVT TSSOP-B8
FVM MSOP8
●Land pattern data all dimensions in mm
PKG Land pitch
e Land space
MIE Land length
≧ℓ 2 Land width
b2
SOP8 1.27 4.60 1.10 0.76
SSOP-B8 0.65 4.60 1.20 0.35
TSSOP-B8 0.65 4.60 1.20 0.35
MSOP8 0.65 2.62 0.99 0.35
SOP8(TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
SSOP-B8(TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
TSSOP-B8(TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
MSOP8(TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
b 2
MIE
e
ℓ2
Datasheet
www.rohm.com TSZ02201-0RAR1G200080-1-2
© 2012 ROHM Co., Ltd. All rights reserved. 19/19 7.NOV.2012 Rev.001
TSZ22111･15･00
BA4510xxx
●Revision History
Date Revision Changes
2012.11.7 001 New Release
Datasheet
Datasheet
Notice - GE Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ
CLASSⅣ CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Datasheet
Datasheet
Notice - GE Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred by you or third parties resulting from inaccur acy or errors of or
concerning such information.
