Effective June 2017 Supersedes March 2013 Technical Data DS4072 TVSA HALOGEN HF Pb FREE Transient voltage ESD suppressor Applications 1 Surface Mount Device 2 * * * * * * * * * * Computers and peripherals Digital cameras Mobile phones DVD/Media Players MP3/Multimedia players A-V Equipment External storage DSL Modems Set top boxes Docking systems Equivalent Circuits MLVB Product features 04 * Lead free, halogen free and RoHS compliant for global applications * Single-line, bi-directional device for placement flexibility * Silicon based chip * Low capacitance to meet the needs for high speed single transient voltage protection * Provides ESD protection with fast response time (<1ns) allowing equipment to pass IEC 61000-4-2 level 4 test * Low profile designs for board space savings * Low leakage current reduces power consumption * Low clamping voltage * Solid-state silicon-avalanche technology TVSA02V05C004 TVSA04V05C006 C001 * Part numbers use "R" to denote decimal point for decimal values of pico farads. Packaging * Size 0402: 10,000 pieces per reel - EIA (EIAJ) * Size 0603: 4000 pieces per reel - EIA (EIAJ) Specifications Part Number V18 Product Family Size Working DC Voltage Capacitance in pF* Size Stand-Off Voltage Breakdown Voltage Clamping Voltage At I peak = 1A Capacitance pF ESD Air/Contact (kV) Leakage Current (typical) 0201 0402 5 5 10 10 17 17 4 6 15/8 15/8 < 10nA < 10nA Stand-off Voltage - Maximum DC operating voltage the diode can maintain and not exceed 1mA leakage current. Breakdown Voltage - Measured at any I/O pin to ground at 1mA DC current. Clamping Voltage - Maximum peak voltage across the diode with 8/20ms waveform and 1A pulse current. Capacitance - Device capacitance measured with zero volt bias at 1MHz. ESD Air/Contact - Voltages tested to IEC 61000-4-2. TVSA Transient voltage ESD suppressor Technical Data DS4072 Effective June 2017 Dimensions - mm Recommended Pad Layout - mm (in) c W a b C d L Size H L 0.600.05 1.000.15 W 0.300.05 0.500.10 0201 H 0.300.05 0.500.10 0402 C 0.200.10 0.250.15 0.37 0.69 0.03 0.03 W 8.0 0.1 E F P0 1.75 3.5 0.05 0.05 4.0 0.1 P1 c 0.45 (0.018) 0.51 (0.020) d 0.83 (0.033) 1.70 (0.067) * Compatible with lead and lead-free solder reflow processes * Peak reflow temperatures and durations: - IR Reflow = 260C max for 30 sec. max. - Wave Solder = 260C max. for 10 sec. max. * Recommended IR Reflow Profile: 0201 Carrier Dimensions B b 0.30 (0.012) 0.61 (0.024) Soldering Recommendations Tape Packaging Specifications - mm A a 0.23 (0.009) 0.51 (0.020) P2 2.0 2.0 0.05 0.05 D0 T 1.55 0.42 0.05 0.03 Temperature (C) Size 0201 0402 b Time (seconds) 0402 Carrier Dimensions 0.58 1.2 0.03 0.03 8.0 0.1 1.75 3.5 0.05 0.05 4.0 0.1 2.0 2.0 0.05 0.05 1.55 0.60 0.05 0.03 Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics (c) 2017 Eaton All Rights Reserved Printed in USA Publication No. DS4072 BU-SB13279 June 2017 Eaton is a registered trademark. All other trademarks are property of their respective owners. Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Eaton: TVSA02V05C004 TVSA04V05C006