Semiconductor Components Industries, LLC, 2000
August, 2000 – Rev. 4 1Publication Order Number:
MC14514B/D
MC14514B, MC14515B
4-Bit Transparent
Latch/4-to-16 Line Decoder
The MC14514B and MC14515B are two output options of a 4 to 16
line decoder with latched inputs. The MC14514B (output active high
option) presents a logical “1” at the selected output, whereas the
MC14515B (output active low option) presents a logical “0” at the
selected output. The latches are R–S type flip–flops which hold the
last input data presented prior to the strobe transition from “1” to “0”.
These high and low options of a 4–bit latch/4 to 16 line decoder are
constructed with N–channel and P–channel enhancement mode
devices in a single monolithic structure. The latches are R–S type
flip–flops and data is admitted upon a signal incident at the strobe
input, decoded, and presented at the output.
These complementary circuits find primary use in decoding
applications where low power dissipation and/or high noise immunity
is desired.
Supply Voltage Range = 3.0 Vdc to 18 Vdc
Capable of Driving Two Low–power TTL Loads or One Low–power
Schottky TTL Load Over the Rated Temperature Range
MAXIMUM RATINGS (Voltages Referenced to VSS) (Note 1.)
Symbol Parameter Value Unit
VDD DC Supply Voltage Range –0.5 to +18.0 V
Vin, Vout Input or Output Voltage Range
(DC or Transient) –0.5 to VDD + 0.5 V
Iin, Iout Input or Output Current
(DC or Transient) per Pin ±10 mA
PDPower Dissipation,
per Package (Note 2.) 500 mW
TAAmbient Temperature Range –55 to +125 °C
Tstg Storage Temperature Range –65 to +150 °C
TLLead Temperature
(8–Second Soldering) 260 °C
1. Maximum Ratings are those values beyond which damage to the device
may occur.
2. Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/C From 65C To 125C
This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
high–impedance circuit. For proper operation, Vin and Vout should be constrained
to the range VSS (Vin or Vout) VDD.
Unused inputs must always be tied to an appropriate logic voltage level (e.g.,
either VSS or VDD). Unused outputs must be left open.
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xx = Specific Device Code
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
Device Package Shipping
ORDERING INFORMATION
MC14514BCP PDIP–24 15/Rail
MC14514BDW SOIC–24 30/Rail
MC14514BDWR2 SOIC–24 1000/Tape & Reel
MARKING
DIAGRAMS
1
24
PDIP–24
P SUFFIX
CASE 709
MC145xxBCP
AWLYYWW
1
24
SOIC–24
DW SUFFIX
CASE 751E
145xxB
AWLYYWW
MC14515BCP PDIP–24 15/Rail
MC14515BDW SOIC–24 30/Rail
MC14515BDWR2 SOIC–24 1000/Tape & Reel
MC14514B, MC14515B
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2
S5
S7
D2
D1
ST
S3
S4
S6 S10
D3
D4
INH
VDD
S15
S14
S9
5
4
3
2
1
10
9
8
7
6
14
15
16
17
18
19
20
13
11
12
21
22
23
24
S13
S12
S8
S11
S0
VSS
S2
S1
PIN ASSIGNMENT
Data Inputs Selected Output
MC14514 = Logic “1”
Inhibit D C B A MC14515 = Logic “0”
00000 S0
00001 S1
00010 S2
00011 S3
00100 S4
00101 S5
00110 S6
00111 S7
01000 S8
01001 S9
0 1 0 1 0 S10
01011 S11
0 1 1 0 0 S12
0 1 1 0 1 S13
0 1 1 1 0 S14
0 1 1 1 1 S15
1 X X X X All Outputs = 0, MC14514
All Outputs = 1, MC14515
DECODE TRUTH TABLE (Strobe = 1)*
X = Don’t Care
*Strobe = 0, Data is latched
BLOCK DIAGRAM
VDD = PIN 24
VSS = PIN 12
4 TO 16
DECODER
TRANSPARENT
LATCH
STROBE
INHIBIT
2
3
1
21
22
23
DATA 1
DATA 2
DATA 3
DATA 4
A
B
C
D20
17
18
4
5
6
7
8
10
9
11
19
16
13
14
15
A B C D
A B C D
A B C D
A B C D
A B C D
A B C D
A B C D
A B C D
A B C D
A B C D
A B C D
A B C D
A B C D
A B C D
A B C D
A B C DS15
S14
S13
S12
S11
S10
S9
S8
S7
S6
S5
S4
S3
S2
S1
S0
MC14514B, MC14515B
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ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
VDD
– 55C 25C 125C
Characteristic Symbol
V
DD
Vdc Min Max Min Typ (3.) Max Min Max Unit
Output Voltage “0” Level
Vin = VDD or 0 VOL 5.0
10
15
0.05
0.05
0.05
0
0
0
0.05
0.05
0.05
0.05
0.05
0.05
Vdc
“1” Level
Vin = 0 or VDD
VOH 5.0
10
15
4.95
9.95
14.95
4.95
9.95
14.95
5.0
10
15
4.95
9.95
14.95
Vdc
Input Voltage “0” Level
(VO = 4.5 or 0.5 Vdc)
(VO = 9.0 or 1.0 Vdc)
(VO = 13.5 or 1.5 Vdc)
VIL 5.0
10
15
1.5
3.0
4.0
2.25
4.50
6.75
1.5
3.0
4.0
1.5
3.0
4.0
Vdc
“1” Level
(VO = 0.5 or 4.5 Vdc)
(VO = 1.0 or 9.0 Vdc)
(VO = 1.5 or 13.5 Vdc)
VIH 5.0
10
15
3.5
7.0
11
3.5
7.0
11
2.75
5.50
8.25
3.5
7.0
11
Vdc
Output Drive Current
(VOH = 2.5 Vdc) Source
(VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
IOH 5.0
5.0
10
15
– 1.2
– 0.25
– 0.62
– 1.8
– 1.0
– 0.2
– 0.5
– 1.5
– 1.7
– 0.36
– 0.9
– 3.5
– 0.7
– 0.14
– 0.35
– 1.1
mAdc
(VOL = 0.4 Vdc) Sink
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
IOL 5.0
10
15
0.64
1.6
4.2
0.51
1.3
3.4
0.88
2.25
8.8
0.36
0.9
2.4
mAdc
Input Current Iin 15 ± 0.1 ±0.00001 ± 0.1 ± 1.0 µAdc
Input Capacitance
(Vin = 0) Cin 5.0 7.5 pF
Quiescent Current
(Per Package) IDD 5.0
10
15
5.0
10
20
0.005
0.010
0.015
5.0
10
20
150
300
600
µAdc
Total Supply Current (4.) (5.)
(Dynamic plus Quiescent,
Per Package)
(CL = 50 pF on all outputs, all
buffers switching)
ITL 5.0
10
15
IT = (1.35 µA/kHz) f + IDD
IT = (2.70 µA/kHz) f + IDD
IT = (4.05 µA/kHz) f + IDD
µAdc
3. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
4. The formulas given are for the typical characteristics only at 25C.
5. To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL – 50) Vfk
where: IT is in µA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.002.
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4
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
SWITCHING CHARACTERISTICS (6.) (CL = 50 pF, TA = 25C)
All Types
Characteristic Symbol VDD Min Typ (7.) Max Unit
Output Rise Time
tTLH = (3.0 ns/pF) CL + 30 ns
tTLH = (1.5 ns/pF) CL + 15 ns
tTLH = (1.1 ns/pF) CL + 10 ns
tTLH 5.0
10
15
180
90
65
360
180
130
ns
Output Fall Time
tTHL = (1.5 ns/pF) CL + 25 ns
tTHL = (0.75 ns/pF) CL + 12.5 ns
tTHL = (0.55 ns/pF) CL + 9.5 ns
tTHL 5.0
10
15
100
50
40
200
100
80
ns
Propagation Delay Time; Data, Strobe to S
tPLH, tPHL = (1.7 ns/pF) CL + 465 ns
tPLH, tPHL = (0.86 ns/pF) CL + 192 ns
tPLH, tPHL = (0.5 ns/pF) CL + 125 ns
tPLH,
tPHL 5.0
10
15
550
225
150
1100
450
300
ns
Inhibit Propagation Delay Times
tPLH, tPHL = (1.7 ns/pF) CL + 315 ns
tPLH, tPHL = (0.66 ns/pF) CL + 117 ns
tPLH, tPHL = (0.5 ns/pF) CL + 75 ns
tPLH,
tPHL 5.0
10
15
400
150
100
800
300
200
ns
Setup Time
Data to Strobe tsu 5.0
10
15
250
100
75
125
50
38
ns
Hold Time
Strobe to Data th5.0
10
15
– 20
0
10
– 100
– 40
– 30
ns
Strobe Pulse Width tWH 5.0
10
15
350
100
75
175
50
38
ns
6. The formulas given are for the typical characteristics only at 25C.
7. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
Figure 1. Drain Characteristics Test Circuit
EXTERNAL
POWER SUPPLY
VSS
STROBE
INHIBIT
D1
D2
D3
D4
VDD
VDS
ID
For MC14515B
1. For P–channel: Inhibit = VDD
2. For N–channel: Inhibit = VSS
2. and D1–D4 constitute binary
2. code for “output under test.”
For MC14514B
1. For P–channel: Inhibit = VSS
1. and D1–D4 constitute
1. binary code for “output
1. under test.”
2. For N–channel: Inhibit = VDD
S15
S14
S13
S12
S11
S10
S9
S8
S7
S6
S5
S4
S3
S2
S1
S0
MC14514B, MC14515B
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5
Figure 2. Dynamic Power Dissipation Test Circuit and Waveform
PULSE
GENERATOR
CL
CL
VDD
VDD
VSS
S0
S15
12
24
ID0.01 µF
CERAMIC
500
µF
VDD
VSS
Vin
20 ns 20 ns
90%
10%
STROBE
D1
D2
D3
D4
INHIBIT
Figure 3. Switching Time Test Circuit and Waveforms
PROGRAMMABLE
PULSE
GENERATOR
VDD
STROBE
INHIBIT
D1
D2
D3
D4
CLVDD
VSS
VDD
VSS
S0
S1
S15
VSS
CL
CL
INPUT
OUTPUT
tTLH
tTLH tTHL
tTHL
tPHL
tPLH
20 ns
OUTPUT S0
OUTPUT S1
OUTPUT S15
90%
50%
10%
90%
50%
10%
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6
LOGIC DIAGRAM
DATA 1 2
DATA 2 3
DATA 3 21
DATA 4 22
STROBE 1
INHIBIT 23
Q
QR
S
Q
QR
S
Q
QR
S
Q
QR
S
A
B
C
D
IN MC14515B ONLY
AB C D 11 S0
9S1
10 S2
8S3
7S4
6S5
5S6
4S7
18 S8
17 S9
20 S10
19 S11
14 S12
13 S13
16 S14
15 S15
ABC D
ABCD
ABCD
A B CD
ABCD
ABCD
ABCD
A B C D
ABC D
ABCD
ABCD
ABCD
ABCD
ABCD
ABCD
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7
COMPLEX DATA ROUTING
Two MC14512 eight–channel data selectors are used here
with the MC14514B four–bit latch/decoder to effect a
complex data routing system. A total of 16 inputs from data
registers are selected and transferred via a 3–state data bus
to a data distributor for rearrangement and entry into 16
output registers. In this way sequential data can be re–routed
or intermixed according to patterns determined by data
select and distribution inputs.
Data is placed into the routing scheme via the eight inputs
on both MC14512 data selectors. One register is assigned to
each input. The signals on A0, A1, and A2 choose one of
eight inputs for transfer out to the 3–state data bus. A fourth
signal, labelled Dis, disables one of the MC14512 selectors,
assuring transfer of data from only one register.
In addition to a choice of input registers, 1 thru 16, the rate
of transfer of the sequential information can also be varied.
That is, if the MC14512 were addressed at a rate that is eight
times faster then the shift frequency of the input registers,
the most significant bit (MSB) from each register could be
selected for transfer to the data bus. Therefore, all of the
most significant bits from all of the registers can be
transferred to the data bus before the next most significant
bit is presented for transfer by the input registers.
Information from the 3–state bus is redistributed by the
MC14514B four–bit latch/decoder. Using the four–bit
address, D1 thru D4, the information on the inhibit line can
be transferred to the addressed output line to the desired
output re g i s t e rs, A thru P. This distribution of data bits to the
output registers can be made in many complex patterns. For
example, all of the most significant bits from the input
registers can be routed into output register A, all of the next
most significant bits into register B, etc. In this way
horizontal, vertical, or other methods of data slicing can be
implemented.
DATA ROUTING SYSTEM
INPUT
REGISTERS
DATA
TRANSFER
DATA
DISTRIBUTION
OUTPUT
REGISTERS
3-STATE
DATA BUS
REGISTER A
REGISTER P
REGISTER 1
REGISTER 8
REGISTER 9
REGISTER 16
DATA
SELECT
STROBE
INHIBIT
DIS
DIS
Q
Q
D1 D2 D3 D4
A0 A1 A2
A0 A1 A2
MC14514B
MC14512MC14512
D0
D1
D2
D3
D4
D5
D6
D7
D0
D1
D2
D3
D4
D5
D6
D7
S15
S14
S13
S12
S11
S10
S9
S8
S7
S6
S5
S4
S3
S2
S1
S0
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8
PACKAGE DIMENSIONS
PDIP–24
P SUFFIX
PLASTIC DIP PACKAGE
CASE 709–02
ISSUE C
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D),
SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM
MATERIAL CONDITION, IN RELATION TO
SEATING PLANE AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. CONTROLLING DIMENSION: INCH.
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A31.37 32.131.235 1.265
B13.72 14.220.540 0.560
C3.94 5.080.155 0.200
D0.36 0.560.014 0.022
F1.02 1.520.040 0.060
G2.54 BSC0.100 BSC
H1.65 2.030.065 0.080
J0.20 0.380.008 0.015
K2.92 3.430.115 0.135
L15.24 BSC0.600 BSC
M0 15 0 15
N0.51 1.020.020 0.040
 
112
1324
B
H
A
F
D
G
K
SEATING
PLANE
NC
M
J
L
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9
PACKAGE DIMENSIONS
SOIC–24
DW SUFFIX
PLASTIC SOIC PACKAGE
CASE 751E–04
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
–A–
–B– P12X
D24X
12
1324
1
M
0.010 (0.25) B M
S
A
M
0.010 (0.25) B S
T
–T–
G
22X
SEATING
PLANE K
C
RX 45
M
F
J
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A15.25 15.54 0.601 0.612
B7.40 7.60 0.292 0.299
C2.35 2.65 0.093 0.104
D0.35 0.49 0.014 0.019
F0.41 0.90 0.016 0.035
G1.27 BSC 0.050 BSC
J0.23 0.32 0.009 0.013
K0.13 0.29 0.005 0.011
M0 8 0 8
P10.05 10.55 0.395 0.415
R0.25 0.75 0.010 0.029
MC14514B, MC14515B
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10
Notes
MC14514B, MC14515B
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11
Notes
MC14514B, MC14515B
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12
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MC14514B/D
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