LeadFree Package Options Available! ispLSI 1016E (R) In-System Programmable High Density PLD Features Functional Block Diagram * HIGH-DENSITY PROGRAMMABLE LOGIC -- 2000 PLD Gates -- 32 I/O Pins, Four Dedicated Inputs * HIGH-PERFORMANCE E2CMOS(R) TECHNOLOGY -- fmax = 125 MHz Maximum Operating Frequency -- tpd = 7.5 ns Propagation Delay Logic A3 Array -- Unused Product Term Shutdown Saves Power B1 A6 Global Routing Pool (GRP) B0 CLK 0139C1-isp N Description * IN-SYSTEM PROGRAMMABLE -- In-System Programmable (ISPTM) 5V Only R The ispLSI 1016E is a High Density Programmable Logic Device containing 96 Registers, 32 Universal I/O pins, four Dedicated Input pins, three Dedicated Clock Input pins, one Global OE input pin and a Global Routing Pool (GRP). The GRP provides complete interconnectivity between all of these elements. The ispLSI 1016E offers 5V non-volatile in-system programmability of the logic, as well as the interconnect to provide truly reconfigurable systems. A functional superset of the ispLSI 1016 architecture, the ispLSI 1016E device adds a new global output enable pin. FO -- Increased Manufacturing Yields, Reduced Time-toMarket and Improved Product Quality B4 B2 A5 EW -- 100% Tested at Time of Manufacture D Q GLB D Q A7 -- Non-Volatile B5 D Q B3 A4 -- TTL Compatible Inputs and Outputs -- Electrically Erasable and Reprogrammable B6 ES IG N -- Small Logic Block Size for Random Logic A2 D Output Routing Pool -- Wide Input Gating for Fast Counters, State Machines, Address Decoders, etc. D Q A1 Output Routing Pool B7 A0 -- High-Speed Global Interconnect S -- 96 Registers -- Reprogram Soldered Device for Faster Prototyping I1 01 6E A * OFFERS THE EASE OF USE AND FAST SYSTEM SPEED OF PLDs WITH THE DENSITY AND FLEXIBILITY OF FIELD PROGRAMMABLE GATE ARRAYS -- Complete Programmable Device Can Combine Glue Logic and Structured Designs -- Enhanced Pin Locking Capability -- Three Dedicated Clock Input Pins The basic unit of logic on the ispLSI 1016E device is the Generic Logic Block (GLB). The GLBs are labeled A0, A1...B7 (see Figure 1). There are a total of 16 GLBs in the ispLSI 1016E device. Each GLB has 18 inputs, a programmable AND/OR/Exclusive OR array, and four outputs which can be configured to be either combinatorial or registered. Inputs to the GLB come from the GRP and dedicated inputs. All of the GLB outputs are brought back into the GRP so that they can be connected to the inputs of any other GLB on the device. -- Synchronous and Asynchronous Clocks LS -- Programmable Output Slew Rate Control to Minimize Switching Noise -- Flexible Pin Placement is p -- Optimized Global Routing Pool Provides Global Interconnectivity U SE -- Lead-Free Package Options Copyright (c) 2006 Lattice Semiconductor Corp. All brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. LATTICE SEMICONDUCTOR CORP., 5555 Northeast Moore Ct., Hillsboro, Oregon 97124, U.S.A. Tel. (503) 268-8000; 1-800-LATTICE; FAX (503) 268-8556; http://www.latticesemi.com 1016e_09 1 August 2006 Specifications ispLSI 1016E Functional Block Diagram Figure 1. ispLSI 1016E Functional Block Diagram D ES IG N S Generic Logic Blocks (GLBs) GOE 0/IN 3 MODE/IN 2 Output Routing Pool (ORP) B5 A2 B4 EW Global Routing Pool (GRP) A3 B3 A4 B2 I/O 12 I/O 13 I/O 14 I/O 15 N A5 A6 R I/O 8 I/O 9 I/O 10 I/O 11 B6 A1 Input Bus I/O 4 I/O 5 I/O 6 I/O 7 A0 FO A7 B0 Clock Distribution Network Megablock Y0 Y1/RESET* SCLK/Y2 16 ispEN 10 *Note: Y1 and RESET are multiplexed on the same pin I/O 27 I/O 26 I/O 25 I/O 24 I/O 23 I/O 22 I/O 21 I/O 20 I/O 19 I/O 18 I/O 17 I/O 16 B1 EA SDI/IN 0 SDO/IN 1 lnput Bus I/O 0 I/O 1 I/O 2 I/O 3 I/O 31 I/O 30 I/O 29 I/O 28 Output Routing Pool (ORP) B7 CLK 0 CLK 1 CLK 2 IOCLK 0 IOCLK 1 0139B(1a)-isp The GRP has, as its inputs, the outputs from all of the GLBs and all of the inputs from the bi-directional I/O cells. All of these signals are made available to the inputs of the GLBs. Delays through the GRP have been equalized to minimize timing skew. is pL SI The device also has 32 I/O cells, each of which is directly connected to an I/O pin. Each I/O cell can be individually programmed to be a combinatorial input, registered input, latched input, output or bi-directional I/O pin with 3-state control. The signal levels are TTL compatible voltages and the output drivers can source 4 mA or sink 8 mA. Each output can be programmed independently for fast or slow output slew rate to minimize overall output switching noise. U SE Clocks in the ispLSI 1016E device are selected using the Clock Distribution Network. Three dedicated clock pins (Y0, Y1 and Y2) are brought into the distribution network, and five clock outputs (CLK 0, CLK 1, CLK 2, IOCLK 0 and IOCLK 1) are provided to route clocks to the GLBs and I/O cells. The Clock Distribution Network can also be driven from a special clock GLB (B0 on the ispLSI 1016E device). The logic of this GLB allows the user to create an internal clock from a combination of internal signals within the device. Eight GLBs, 16 I/O cells, two dedicated inputs and one ORP are connected together to make a Megablock (see Figure 1). The outputs of the eight GLBs are connected to a set of 16 universal I/O cells by the ORP. Each ispLSI 1016E device contains two Megablocks. 2 Specifications ispLSI 1016E Absolute Maximum Ratings 1 Supply Voltage VCC ................................. -0.5 to +7.0V Input Voltage Applied ........................ -2.5 to VCC +1.0V Off-State Output Voltage Applied ..... -2.5 to VCC +1.0V S Storage Temperature ................................ -65 to 150C D ES IG N Case Temp. with Power Applied .............. -55 to 125C Max. Junction Temp. (TJ) with Power Applied ... 150C 1. Stresses above those listed under the "Absolute Maximum Ratings" may cause permanent damage to the device. Functional operation of the device at these or at any other conditions above those indicated in the operational sections of this specification is not implied (while programming, follow the programming specifications). EW DC Recommended Operating Conditions PARAMETER Supply Voltage VIL VIH Input Low Voltage MAX. UNITS 5.25 V TA = 0C to + 70C 4.75 Industrial TA = -40C to + 85C 4.5 5.5 V 0 0.8 V 2.0 EA Vcc+1 V Table 2-0005/1016E FO Input High Voltage Capacitance (TA=25oC, f=1.0 MHz) MIN. Commercial N VCC R SYMBOL TYPICAL UNITS C1 Dedicated Input, I/O, Y1, Y2, Y3, Clock Capacitance (Commercial/Industrial) 8 pf VCC = 5.0V, VPIN = 2.0V C2 Y0 Clock Capacitance 12 pf VCC = 5.0V, VPIN = 2.0V 16 PARAMETER TEST CONDITIONS Table 2-0006/1016E 10 SYMBOL SI Data Retention Specifications PARAMETER is pL Data Retention MAXIMUM UNITS 20 - Years 10000 - Cycles Table 2-0008/1016E U SE Erase/Reprogram Cycles MINIMUM 3 Specifications ispLSI 1016E Switching Test Conditions Figure 2. Test Load GND to 3.0V -125 2 ns -100, -80 3 ns Input Timing Reference Levels 1.5V Output Timing Reference Levels 1.5V Output Load + 5V R1 Device Output See Figure 2 Table 2-0003/1016E 3-state levels are measured 0.5V from steady-state active level. S Input Rise and Fall Time 10% to 90% Test Point D ES IG N Input Pulse Levels R2 Output Load Conditions (see Figure 2) R2 CL 470 390 35pF Active High 390 35pF Active Low 470 390 35pF Active High to Z at VOH -0.5V 390 5pF Active Low to Z at VOL +0.5V 470 390 5pF A B C *CL includes Test Fixture and Probe Capacitance. 0213a EW R1 N TEST CONDITION CL* FO R Table 2-0004/1016E DC Electrical Characteristics Over Recommended Operating Conditions SYMBOL VOL VOH IIL IIH IIL-isp IIL-PU IOS1 Output Low Voltage ICC2, 4 Operating Power Supply Current 3 MIN. TYP. IOL= 8 mA - - IOH = -4 mA MAX. UNITS 0.4 V - - V 0V VIN VIL (Max.) - - -10 A Input or I/O High Leakage Current 3.5V VIN VCC - - 10 A ispEN Input Low Leakage Current 0V VIN VIL - - -150 A I/O Active Pull-Up Current 0V VIN VIL - - -150 A Output Short Circuit Current VCC = 5V, VOUT = 0.5V - - -200 mA VIL = 0.5V, VIH = 3.0V Commercial - 90 - mA fCLOCK = 1 MHz Industrial - 90 - mA SI 10 16 2.4 Input or I/O Low Leakage Current is pL Output High Voltage CONDITION EA PARAMETER Table 2-0007/1016E U SE 1. One output at a time for a maximum duration of one second. VOUT = 0.5V was selected to avoid test problems by tester ground degradation. Characterized but not 100% tested. 2. Measured using four 16-bit counters. 3. Typical values are at VCC = 5V and TA= 25C. 4. Maximum I CC varies widely with specific device configuration and operating frequency. Refer to the Power Consumption section of this data sheet and Thermal Management section of the Lattice Semiconductor Data Book or CD-ROM to estimate maximum ICC . 4 Specifications ispLSI 1016E External Timing Parameters Over Recommended Operating Conditions 4 -80 -100 -125 1 MIN. MAX. MIN. MAX. MIN. MAX. UNITS 1 Data Prop. Delay, 4PT Bypass, ORP Bypass - 7.5 - 10.0 - 15.0 ns A 2 Data Prop. Delay, Worst Case Path - 10.0 - 13.0 - 18.5 ns 125 - 100 - 84.0 - 100 - - 3 Clk. Frequency with Int. Feedback 4 Clk. Frequency with Ext. Feedback( 1 tsu2 + tco1 1 twh + tw1 ) - 5 Clk. Frequency, Max. Toggle( - 6 GLB Reg. Setup Time before Clk., 4 PT Bypass A - 167 - 5.0 - 7 GLB Reg. Clk. to Output Delay, ORP Bypass - 4.5 8 GLB Reg. Hold Time after Clk., 4 PT Bypass 0.0 - 9 GLB Reg. Setup Time before Clk. - 10 GLB Reg. Clk. to Output Delay - 11 GLB Reg. Hold Time after Clk. C 15 Input to Output Disable - MHz - 57.0 - MHz 125 - 100 - MHz 7.0 - 8.5 - ns - 5.0 - 8.0 ns 0.0 - 0.0 - ns 8.0 - 9.5 - ns - 6.0 - 9.5 ns 0.0 - 0.0 - ns 13.5 - 17.0 ns 77.0 10.0 - 5.0 - 6.5 - ns 12.0 - 15.0 10.0 - - - 20.0 ns - 12.0 - 15.0 - 20.0 ns - 7.0 - 9.0 - 10.5 ns - 7.0 - 9.0 - 10.5 ns N 13 Ext. Reset Pulse Duration 14 Input to Output Enable 5.5 - R - - - 0.0 12 Ext. Reset Pin to Output Delay B 5.5 EW - A ) D ES IG N A 3 S A 16 Global OE Output Enable 17 Global OE Output Disable - 18 Ext. Sync. Clk. Pulse Duration, High 3.0 - 4.0 - 5.0 - ns - 19 Ext. Sync. Clk. Pulse Duration, Low 3.0 - 4.0 - 5.0 - ns - 20 I/O Reg. Setup Time before Ext. Sync. Clk. (Y2, Y3) 3.0 - 3.5 - 4.5 - ns - 0.0 - ns - FO B C 21 I/O Reg. Hold Time after Ext. Sync. Clk. (Y2, Y3) 0.0 - 10 Unless noted otherwise, all parameters use the GRP, 20 PTXOR path, ORP and Y0 clock. Refer to Timing Model in this data sheet for further details. Standard 16-bit counter using GRP feedback. Reference Switching Test Conditions Section. U SE is pL SI 1. 2. 3. 4. DESCRIPTION 16 tpd1 tpd2 fmax fmax (Ext.) fmax (Tog.) tsu1 tco1 th1 tsu2 tco2 th2 tr1 trw1 tptoeen tptoedis tgoeen tgoedis twh twl tsu3 th3 TEST 2 # COND. EA PARAMETER 5 0.0 Table 2-0030-16/125,100, 80 Specifications ispLSI 1016E Internal Timing Parameters1 PARAMETER 2 # -125 DESCRIPTION -100 -80 MIN. MAX. MIN. MAX. MIN. MAX. UNITS Inputs - 0.3 - 0.4 - 0.6 ns 23 I/O Latch Delay - 1.8 - 2.4 - 3.6 ns 24 I/O Register Setup Time before Clock 3.0 - 25 I/O Register Hold Time after Clock -0.3 - - 4.0 26 I/O Register Clock to Out Delay 27 I/O Register Reset to Out Delay 5.0 7.5 ns 5.0 - 7.5 ns - 2.6 - 3.9 ns - 1.9 - 2.9 ns - ns 29 GRP Delay, 1 GLB Load - 1.8 30 GRP Delay, 4 GLB Loads - 1.9 - 2.2 - 3.3 ns - 2.1 - 2.5 - 3.8 ns - 2.4 - 3.1 - 4.7 ns - 3.9 - 5.7 - 8.1 ns 35 4 Product Term Bypass Path Delay (Registered) - 3.9 - 5.6 - 7.3 ns - 4.4 - 6.1 - 7.1 ns - 4.4 - 6.1 - 8.2 ns - 4.4 - 6.6 - 8.3 ns - 1.0 - 1.6 - 1.9 ns 40 GLB Register Setup Time before Clock 0.2 - 0.2 - -0.6 - ns 41 GLB Register Hold Time after Clock 1.5 - 2.5 - 4.3 - ns 42 GLB Register Clock to Output Delay - 1.8 - 1.9 - 2.9 ns 43 GLB Register Reset to Output Delay - 4.4 - 6.3 - 7.0 ns 44 GLB Product Term Reset to Register Delay - 3.5 - 5.1 - 7.2 ns EW 32 GRP Delay, 16 GLB Loads R 34 4 Product Term Bypass Path Delay (Combinatorial) 36 1 Product Term/XOR Path Delay 37 20 Product Term/XOR Path Delay EA 38 XOR Adjacent Path Delay 3 10 16 39 GLB Register Bypass Delay - 5.5 - 7.1 - 9.7 ns 3.2 3.5 4.8 5.3 6.8 7.5 ns 47 ORP Delay - 1.0 - 1.0 - 1.5 ns 48 ORP Bypass Delay - 0.0 - 0.0 - 0.0 ns SI 45 GLB Product Term Output Enable to I/O Cell Delay 46 GLB Product Term Clock Delay is pL torp torpbp ns 2.2 GLB ORP - - -0.6 - - 31 GRP Delay, 8 GLB Loads t4ptbpc t4ptbpr t1ptxor t20ptxor txoradj tgbp tgsu tgh tgco tgro tptre tptoe tptck 4.5 - 28 Dedicated Input Delay GRP tgrp1 tgrp4 tgrp8 tgrp16 - -0.4 N 4.0 3.5 - FO - S 22 I/O Register Bypass D ES IG N tiobp tiolat tiosu tioh tioco tior tdin U SE 1. Internal Timing Parameters are not tested and are for reference only. 2. Refer to Timing Model in this data sheet for further details. 3. The XOR Adjacent path can only be used by Lattice hard macros. 6 Table 2-0036-16/125,100, 80 Specifications ispLSI 1016E Internal Timing Parameters1 PARAMETER #2 -125 DESCRIPTION -80 -100 MIN. MAX. MIN. MAX. MIN. MAX. UNITS Outputs - 1.4 - 1.7 - 3.0 ns 50 Output Slew Limited Delay Adder - 10.0 - 10.0 - 10.0 ns 51 I/O Cell OE to Output Enabled - 4.3 - 5.3 - 6.4 ns 52 I/O Cell OE to Output Disabled - 4.3 - 5.3 - 6.4 ns 53 Global Output Enable - 2.7 - 3.7 - 4.1 ns 54 Clock Delay, Y0 to Global GLB Clock Line (Ref. clock) 1.3 1.3 1.4 1.4 2.1 2.1 ns 55 Clock Delay, Y1 or Y2 to Global GLB Clock Line 2.3 2.7 2.4 2.9 3.6 4.4 ns 56 Clock Delay, Clock GLB to Global GLB Clock Line 0.8 1.8 0.8 1.8 1.2 2.7 ns 57 Clock Delay, Y1 or Y2 to I/O Cell Global Clock Line 0.0 0.3 0.0 0.4 0.0 0.6 ns 0.8 1.8 0.8 1.8 1.2 2.7 ns - 3.2 - 4.5 - 5.5 ns tgy0 tgy1/2 tgcp tioy1/2 tiocp 58 Clock Delay, Clock GLB to I/O Cell Global Clock Line tgr 59 Global Reset to GLB and I/O Registers U SE is pL SI 10 16 EA FO R 1. Internal Timing Parameters are not tested and are for reference only. 2. Refer to Timing Model in this data sheet for further details. N Global Reset 7 EW Clocks S 49 Output Buffer Delay D ES IG N tob tsl toen todis tgoe Table 2-0037-16/125,100,80 Specifications ispLSI 1016E ispLSI 1016E Timing Model I/O Cell GRP GLB ORP I/O Cell Feedback Comb 4 PT Bypass #34 Reg 4 PT Bypass GLB Reg Bypass ORP Bypass #35 #39 #48 GRP Loading Delay 20 PT XOR Delays GLB Reg Delay ORP Delay #29, 31, 32 #36-38 I/O Reg Bypass I/O Pin (Input) #22 #30 Input D Register Q RST #23 - 27 #59 D Q #59 Clock Distribution Y1,2 #40-43 Control RE PTs OE #44-46 CK #55-58 EW #54 Y0 #53 N GOE 0 Derivations of tsu, th and tco from the Product Term Clock 1 = = = 1.4 ns = Logic + Reg su - Clock (min) (tiobp + tgrp4 + t20ptxor) + (tgsu) - (tiobp + tgrp4 + tptck(min)) (#22 + #30 + #37) + (#40) - (#22 + #30 + #46) (0.3 + 1.9 + 4.4) + (0.2) - (0.3 + 1.9 + 3.2) th = = = 0.6 ns = Clock (max) + Reg h - Logic (tiobp + tgrp4 + tptck(max)) + (tgh) - (tiobp + tgrp4 + t20ptxor) (#22 + #30 + #46) + (#41) - (#22 + #30 + #37) (0.3 + 1.9 + 3.5) + (1.5) - (0.3 + 1.9 + 4.4) tco = = = 9.9 ns = Clock (max) + Reg co + Output (tiobp + tgrp4 + tptck(max)) + (tgco) + (torp + tob) (#22 + #30 + #46) + (#42) + (#47 + #49) (0.3 + 1.9 + 3.5) + (1.8) + (1.0 + 1.4) 10 16 EA FO R tsu Logic + Reg su - Clock (min) (tiobp + tgrp4 + t20ptxor) + (tgsu) - (tgy0(min) + tgco + tgcp(min)) (#22 + #30 + #37) + (#40) - (#54 + #42 + #56) (0.3 + 1.9 + 4.4) + (0.2) - (1.3 + 1.8 + 0.8) = = = -0.2 ns = Clock (max) + Reg h - Logic (tgy0(max) + tgco + tgcp(max)) + (tgh) - (tiobp + tgrp4 + t20ptxor) (#54 + #42 + #56) + (#41) - (#22 + #30 + #37) (1.3 + 1.8 + 1.8) + (1.5) - (0.3 + 1.9 + 4.4) is pL = = = 2.9 ns = U SE th SI Derivations of tsu, th and tco from the Clock GLB 1 tsu tco = = = 9.1 ns = Clock (max) + Reg co + Output (tgy0(max) + tgco + tgcp(max)) + (tgco) + (torp + tob) (#54 + #42 + #56) + (#42) + (#47 + #49) (1.3 + 1.8 + 1.8) + (1.8) + (1.0 + 1.4) Table 2-0042-16 1. Calculations are based upon timing specifications for the ispLSI 1016E-125 8 #51, 52 I/O Pin (Output) #47 RST Reset #49, 50 S #28 D ES IG N Ded. In 0491-16 Specifications ispLSI 1016E Maximum GRP Delay vs GLB Loads ispLSI 1016E-80 3 ispLSI 1016E-125 1 1 8 4 16 12 GLB Load 16E GRP/GLB.eps EW Power Consumption N Figure 3 shows the relationship between power and operating speed. Power consumption in the ispLSI 1016E device depends on two primary factors: the speed at which the device is operating and the number of Product Terms used. R Figure 3. Typical Device Power Consumption vs fmax FO 130 ispLSI 1016E 120 EA 100 10 80 16 ICC (mA) 110 90 SI 0 is pL S 2 D ES IG N GRP Delay (ns) ispLSI 1016E-100 20 40 60 80 100 120 140 fmax (MHz) Notes: Configuration of four 16-bit counters Typical current at 5V, 25C ICC can be estimated for the ispLSI 1016E using the following equation: U SE ICC(mA) = 23 + (# of PTs * 0.52) + (# of nets * max freq * 0.004) Where: # of PTs = Number of product terms used in design # of nets = Number of signals used in device Max freq = Highest clock frequency to the device (in MHz) The ICC estimate is based on typical conditions (VCC = 5.0V, room temperature) and an assumption of four GLB loads on average exists and the device is filled with four 16-bit counters. These values are for estimates only. Since the value of ICC is sensitive to operating conditions and the program in the device, the actual ICC should be verified. 0127B-16-80-isp/1016 9 Specifications ispLSI 1016E Pin Description PLCC PIN NUMBERS NAME 16, 20, 26, 30, 38, 42, 4, 8, 17, 21, 27, 31, 39, 43, 5, 9, 18, 22, 28, 32, 40, 44, 6, 10 TQFP PIN NUMBERS 10, 14, 20, 24, 32, 36, 42, 2, 9, 13, 19, 23, 31, 35, 41, 1, 11, 15, 21, 25, 33, 37, 43, 3, 12, 16, 22, 26, 34, 38, 44, 4 DESCRIPTION I/O 0 - I/O 3 I/O 4 - I/O 7 I/O 8 - I/O 11 I/O 12 - I/O 15 I/O 16 - I/O 19 I/O 20 - I/O 23 I/O 24 - I/O 27 I/O 28 - I/O 31 15, 19, 25, 29, 37, 41, 3, 7, GOE 0/IN 32 2 40 This is a dual function pin. It can be used either as Global Output Enable for all I/O cells or it can be used as a dedicated input pin. ispEN 13 7 Input - Dedicated in-system programming enable input pin. This pin is brought low to enable the programming mode. The MODE, SDI, SDO and SCLK controls become active. SDI/IN 01 14 8 Input - This pin performs two functions. When ispEN is logic low, it functions as an input pin to load programming data into the device. It is a dedicated input pin when ispEN is logic high.SDI/IN0 also is used as one of the two control pins for the isp state machine. MODE/IN 21 36 30 Input - This pin performs two functions. When ispEN is logic low, it functions as a pin to control the operation of the isp state machine. It is a dedicated input pin when ispEN is logic high. SDO/IN 11 24 18 Output/Input - This pin performs two functions. When ispEN is logic low, it functions as an output pin to read serial shift register data. It is a dedicated input pin when ispEN is logic high. SCLK/Y21 33 27 Input - This pin performs two functions. When ispEN is logic low, it functions as a clock pin for the Serial Shift Register. It is a dedicated clock input when ispEN is logic high. This clock input is brought into the Clock Distribution Network, and can optionally be routed to any GLB and/or I/O cell on the device. Y0 11 5 Dedicated Clock input. This clock input is connected to one of the clock inputs of all the GLBs on the device. Y1/RESET 35 29 GND 1, VCC 12, 34 10 16 EA FO R N EW D ES IG N S Input/Output Pins - These are the general purpose I/O pins used by the logic array. 17, 39 23 28 Ground (GND) Vcc SI 6, This pin performs two functions: - Dedicated clock input. This clock input is brought into the Clock Distribution Network, and can optionally be routed to any GLB and/or I/O cell on the device. - Active Low (0) Reset pin which resets all of the GLB and I/O registers in the device. Table 2-0002C-16-isp U SE is pL 1. Pins have dual function capability. 2. Pins have dual function capability which is software selectable. 10 Specifications ispLSI 1016E Pin Configurations I/O 21 I/O 20 I/O 19 I/O 22 GND I/O 23 GOE 0/IN 32 I/O 24 I/O 26 I/O 25 I/O 27 ispLSI 1016E 44-Pin PLCC Pinout Diagram I/O 29 I/O 30 I/O 31 Y0 VCC 7 8 9 10 11 39 I/O 18 38 37 I/O 17 I/O 16 36 MODE/IN 21 D ES IG N I/O 28 S 6 5 4 3 2 1 44 43 42 41 40 12 ispLSI 1016E 35 34 Y1/RESET VCC Top View 13 33 SCLK/Y21 14 32 I/O 15 I/O 0 I/O 1 I/O 2 15 16 17 31 30 29 I/O 14 I/O 13 I/O 12 EW ispEN SDI/IN 0 1 R N I/O 9 I/O 10 I/O 11 I/O 8 1 GND 1SDO/IN I/O 7 I/O 6 I/O 4 I/O 5 I/O 3 18 19 20 21 22 23 24 25 26 27 28 FO 1. Pins have dual function capability. 2. Pins have dual function capability which is software selectable. EA 0123A-isp1016 10 SI I/O 28 I/O 31 Y0 VCC ispEN 1SDI/IN 0 I/O 0 I/O 1 I/O 2 I/O 21 I/O 20 I/O 19 I/O 22 GND I/O 23 GOE 0/IN 32 I/O 24 44 43 42 41 40 39 38 37 36 35 34 1 2 33 I/O 18 32 31 I/O 17 I/O 16 30 MODE/IN 21 29 28 Y1/RESET VCC 27 SCLK/Y21 8 26 I/O 15 9 10 11 25 24 I/O 14 I/O 13 I/O 12 3 4 5 ispLSI 1016E 6 Top View 7 23 I/O 9 I/O 10 I/O 11 I/O 8 GND 1 1SDO/IN I/O 7 I/O 6 I/O 4 I/O 5 12 13 14 15 16 17 18 19 20 21 22 I/O 3 U SE is pL I/O 29 I/O 30 I/O 26 I/O 25 I/O 27 16 ispLSI 1016E 44-Pin TQFP Pinout Diagram 1. Pins have dual function capability. 2. Pins have dual function capability which is software selectable. 0851-16E/TQFP 11 Specifications ispLSI 1016E Part Number Description ispLSI 1016E - XXX X XXX X Grade Blank = Commercial I = Industrial Device Family Device Number S Package J = PLCC T44 = TQFP JN = Lead-Free PLCC TN44 = Lead-Free TQFP D ES IG N Speed 125 = 125 MHz fmax 100 = 100 MHz fmax 80 = 84 MHz fmax Power L = Low EW ispLSI 1016E Ordering Information Conventional Packaging COMMERCIAL ORDERING NUMBER PACKAGE 125 7.5 ispLSI 1016E-125LJ 44-Pin PLCC 125 7.5 ispLSI 1016E-125LT44 44-Pin TQFP 10 10 84 15 84 15 R 100 100 N tpd (ns) ispLSI 1016E-100LJ 44-Pin PLCC ispLSI 1016E-100LT44 44-Pin TQFP ispLSI 1016E-80LJ 44-Pin PLCC ispLSI 1016E-80LT44 44-Pin TQFP FO ispLSI fmax (MHz) EA FAMILY ispLSI fmax (MHz) tpd (ns) ORDERING NUMBER PACKAGE 84 15 ispLSI 1016E-80LJI 44-Pin PLCC ispLSI 1016E-80LT44I 44-Pin TQFP 84 15 FAMILY ispLSI COMMERCIAL fmax (MHz) tpd (ns) ORDERING NUMBER PACKAGE 125 7.5 ispLSI 1016E-125LJN Lead-Free 44-Pin PLCC 125 7.5 ispLSI 1016E-125LTN44 Lead-Free 44-Pin TQFP 100 10 ispLSI 1016E-100LJN Lead-Free 44-Pin PLCC 100 10 ispLSI 1016E-100LTN44 Lead-Free 44-Pin TQFP 84 15 ispLSI 1016E-80LJN Lead-Free 44-Pin PLCC 15 ispLSI 1016E-80LTN44 Lead-Free 44-Pin TQFP is pL U SE ispLSI SI Lead-Free Packaging FAMILY 10 FAMILY 16 INDUSTRIAL 84 INDUSTRIAL fmax (MHz) tpd (ns) ORDERING NUMBER PACKAGE 84 15 ispLSI 1016E-80LJNI Lead-Free 44-Pin PLCC 84 15 ispLSI 1016E-80LTN44I Lead-Free 44-Pin TQFP 12 Specifications ispLSI 1016E Revision History Version Change Summary -- 08 Previous Lattice release. August 2006 09 Updated for lead-free package options. U SE is pL SI 10 16 EA FO R N EW D ES IG N S Date 13