ASC Breakout Board User Guide EB92 Version 1.0, July 2015 ASC Breakout Board Introduction Thank you for choosing the Lattice Semiconductor ASC Breakout Board. This guide describes how to begin using the L-ASC10 (ASC) Breakout Board, an easy-to-use platform for evaluating and designing with the ASC programmable hardware management expander. This board is designed for use with a Lattice FPGA evaluation board such as the Platform Manager 2 evaluation board. The board cannot be used stand-alone as the ASC works with an FPGA to function as a programmable hardware management controller. The contents of this user guide include a description of the various portions of the evaluation board, the complete set of schematics and the bill of material for the ASC Breakout Board. The ASC Breakout Board is also known as the L-ASC10 Evaluation Board. Features The ASC Breakout Board features the following on-board components and circuits: * L-ASC10 (ASC) Hardware Management Expander * Two Potentiometers for Voltage Monitor Testing * One Push-Button Switch as GPIO Input * One 8-bit DIP Switch for I2C Address Selection * Nine LEDs for GPIO Output * Two PNP Transistors for Temperature Monitoring * Jumpers for Reset and Voltage Configuration * Header for Connection to FPGA Breakout Board * Footprints for 4 x DC-DC Converters and Components for Trimming Evaluation * Footprints for 5 V Hot Swap Circuit and 12 V Hot Swap Circuit * Footprint for 12 V Input DC-DC Converter The features are described in more detail in the Board Hardware Features. 2 ASC Breakout Board ASC Breakout Board Photos Photographs of the top and bottom of ASC Breakout Board are shown in Figure 1 and Figure 2 below. These photographs show the board with the Hot Swap and Trim circuits populated (which are not populated in the released version of the breakout board). See Board Hardware Features for more detail on which circuits are populated on the breakout board. Component location references are relative to the top of the board with the silk screen text in the readable orientation (as shown in the photo). Figure 1. ASC Breakout Board - Top View 3 ASC Breakout Board Figure 2. ASC Breakout Board - Bottom View 4 ASC Breakout Board Board Hardware Features The ASC Breakout Board is provided with a limited set of circuits populated. The circuits populated on the breakout board are described first. The breakout board also includes connections and footprints for evaluating the trimming and Hot Swap functions of the ASC. These unpopulated circuits are described in the later part of this section. L-ASC10 (ASC) Device The L-ASC10 (Analog Sense and Control - 10 rail) is a Hardware Management (Power, Thermal, and Control Plane Management) Expander designed to be used with Lattice FPGAs to implement the Hardware Management Control function in a circuit board. The L-ASC10 (referred to as ASC) enables seamless scaling of power supply voltage and current monitoring, temperature monitoring, sequence and margin control channels. The ASC includes dedicated interfaces supporting the exchange of monitor signal status and output control signals with these centralized hardware management controllers. Up to eight ASC devices can be used to implement a hardware management system. The list below summarizes the hardware features of the ASC used on the breakout board. These features are also shown in the block diagram in Figure 3. For detailed information on the operation of each feature, see DS1042, LASC10 Data Sheet. * Voltage Monitors (VMON) - Nine standard channels and one high voltage channel * Current Monitors (IMON) - One standard voltage and one high voltage * Temperature Monitors (TMON) - Two external and one internal * Trim and Margin Circuits (TRIM) - Four channels * General Purpose I/O (GPIO) - Nine channels * High Voltage Outputs (HVOUT) - Four channels * ASC Interface (ASC-I/F) - Connection to main FPGA * I2C Interface - A/D Converter measurement interface 5 ASC Breakout Board Figure 3. ASC Block Diagram MOSFET & Digital I/O Drive Output Control Block Current Sense ASC Interface (ASC-I/F) Temperature Sense Voltage Sense ADC Non Volatile Fault Log I2C Interface ADC Trim & Margin Control Voltage Monitoring There are 10 VMON inputs to the analog section of the device (including the HIMONN_HVMON pin). These are routed to slide potentiometers, board power supplies (not populated), and the on-board Hot Swap circuits (not populated). Most of the voltage monitors on the breakout board have low value series resistors connected between the onboard components and the voltage monitors. These series resistors are populated so that the on-board voltage monitor test points can be driven by an off-board source without damaging the on-board components. These series resistors are not required for a real-world application board. All voltages can be read out from the A/D converter using I2C. The VMON signal connections and board components are described in Table 1. The schematic sheet location for the given components and signals are also listed (see the Appendix A. Schematics section). Table 1. Voltage Monitor Components and Signals Component / Signals Schematic Sheet Ref. Des. Description Components Populated on Breakout Board Slider Potentiometers (POT1 and POT2) R50, R52 5 1 k slider pot: provides a variable Voltage from zero to 3.3 V. Connected to VMON7 and VMON8 of U1 with a 1k series resistor. Series Resistors R51, R53 5 1 k resistor allows the user to safely drive VMON7 and VMON8 test points with an off-board Voltage source. Series Resistors R51, R61 2 270 resistor allows the user to safely drive VMON5 and VMON6 test points with an off-board Voltage source. 6 ASC Breakout Board Component / Signals Schematic Sheet Ref. Des. Description Components Not Populated on Breakout Board Series Resistors R231, R321 3 270 resistor allows the user to safely drive VMON1 and VMON2 test points with an off-board voltage source. (Only needed when DCDC1 and DCDC2 are populated.) Ground Sense Resistors R241, R331 3 100 resistor allows the user to safely drive the VMON1_GS and VMON2_GS test points with an offboard voltage source (such as remote load sensing) without adding or removing components. (Only needed when DCDC1 and DCDC2 are populated.) Series Resistors R401, R481 4 270 resistor allows the user to safely drive VMON3 and VMON4 test points with an off-board voltage source. (Only needed when DCDC3 and DCDC4 are populated.) Ground Sense Resistors R411, R491 4 100 resistor allows the user to safely drive the VMON3_GS and VMON4_GS test points with an offboard voltage source (such as remote load sensing) without adding or removing components. (Only needed when DCDC3 and DCDC4 are populated.) VMON1 / GS_VMON1 2, 3 Connected to DCDC1 output - 5 V - via R23 series resistor. Also connected to J4 terminal. See the Closed Loop Trimming (Not Populated) section for more details. VMON2 / GS_VMON2 2, 3 Connected to DCDC2 output - 3.3 V - via R32 series resistor. Also connected to J5 terminal. See the Closed Loop Trimming (Not Populated) section for more details. VMON3 / GS_VMON3 2, 4 Connected to DCDC3 output - 2.5 V - via R40 series resistor. Also connected to J4 terminal. See the Closed Loop Trimming (Not Populated) section for more details. VMON4 / GS_VMON4 2, 4 Connected to DCDC4 output - 1.2 V - via R48 series resistor. Also connected to J4 terminal. See the Closed Loop Trimming (Not Populated) section for more details. VMON5 2, (6), 9 5 V switched input supply to 5 V Hot Swap circuit via R5 series resistor. Connected to SW1 in Board Power circuit. See the 5 V Hot Swap (Not Populated) section for more details. VMON6 2, (6) 5 V rail supply from either main FPGA board or Hot Swap output via R6 series resistor. See the 5 V Hot Swap (Not Populated) section for more details. VMON7 2, 5 Potentiometer 1 (R50) via R51 series resistor VMON8 2, 5 Potentiometer 2 (R52) via R53 series resistor VMON9 2, (7), 9 12 V switched input supply to 12 V Hot Swap circuit via R65 (part of resistor divider). Connected to SW1 in Board Power circuit. See the 12 V Hot Swap (Not Populated) section for more details. HVMON (HIMONN_HVMON) 2, 7 12 V rail supply from either main FPGA board or Hot Swap output. See the 12 V Hot Swap (Not Populated) section for more details. Signals 1. Not required for customer designs; this is only needed to support demonstrations on the breakout board. 7 ASC Breakout Board The two potentiometers (R50 and R52) are tied to VMON7 and VMON8 these can be used to simulate a fault or trip a comparator (see Figure 4). The slide potentiometers provide a voltage in the range of 0 V to 3.3 V depending on their position. R51 and R53 are 1 k series resistors which allow for the connection of an off-board source directly to the VMON7 and VMON8 test points. The voltage on either potentiometer can be read out from the A/D converter using the I2C port. Figure 4. Voltage Monitor Potentiometer Circuits +3.3V +3.3V VMON7 R51 1k 3 R50 1k 2 POT1 Sheet [2] 1 +3.3V 3 R52 1k R53 1k VMON8 2 POT2 Sheet [2] 1 Temperature Monitoring The board has PNP transistors mounted in the two corners opposite the main D-SUB connector. The PNP transistors are connected in the beta-compensated PNP temperature monitor configuration (preferred configuration for temperature monitors), as shown in Figure 5. Provided the temperature monitors are enabled in the design, the temperature of each sensor can be read out using I2C. The sensors can also be used to simulate over or under-temperature faults. Figure 5. Temperature Monitor Circuits TEMP_SENSE1P 2N3906 Q3 Temperature Sensor 1 TEMP_SENSE1N TEMP_SENSE2P 2N3906 Q4 Temperature Sensor 2 TEMP_SENSE2N The temperature sensors have 150 pF filter capacitors (C3 and C4) connected across the differential signals to improve noise-immunity that are located close to the ASC device, as shown in Figure 6. 8 ASC Breakout Board Figure 6. Temperature Monitor Connections 21 22 23 24 TEMP_SENSE1P C3 150pF TMON1P TMON1N TMON2P TMON2N TEMP_SENSE1N TEMP_SENSE2P C4 150pF TEMP_SENSE2N The temperature monitor components and signals are summarized in Table 2 below. Table 2. Temperature Monitor Components and Signals Component / Signals Schematic Sheet Ref. Des. Description Components Populated on Breakout Board Temperature Sensor Q3, Q4 5 2N3906 PNP Transistor connected in Beta-Compensated PNP configuration. Series Resistors C3, C4 2 150 pF input filter capacitors for temperature monitoring signals to reject noise. TEMP_SENSE1P / TEMP_SENSE1N 2, 5 Input from temperature sensor to TMON1 (temperature monitor input) of L-ASC10 TEMP_SENSE2P / TEMP_SENSE2N 2, 5 Input from temperature sensor to TMON2 (temperature monitor input) of L-ASC10 Signals LED Outputs The ASC Breakout Board has 9 LEDs tied to the ASC open-drain outputs. The LEDs are pulled up to 3.3 V and are lit when GPIO1-GPIO10 are driven to a logic low (GPIO7 is not bonded out of the ASC). The LED circuit is shown in Figure 7 below (taken from Sheet 8 of the schematic). Figure 7. ASC GPIO LEDs +3.3V 10 5 10 5 RN1A 2.2k RN1C 2.2k RN1E 2.2k RN1G 2.2k RN2A 2.2k RN2C 2.2k RN2E 2.2k RN2G 2.2k 1 RN1B 2.2k 3 RN1D 2.2k 6 RN1F 2.2k 8 RN1H 2.2k 1 RN2B 2.2k 3 RN2D 2.2k 6 RN2F 2.2k 8 RN2H 2.2k D1 2 D2 4 D3 7 D4 9 D5 2 D6 4 D7 7 D8 Red Red Red Red Red Red Red Red LED1 LED2 LED3 LED4 LED5 LED6 LED8 LED9 R81 2.2k R82 2.2k 9 D9 Red LED10 LED[1:10] Push Button The breakout board has one push-button (SW2), shown in Figure 8 (taken from Sheet 5 of the schematic). This signal is routed to GPIO10 of the ASC. This GPIO must be configured as an input in Platform Designer in order to use the push-button. When the button is pressed, GPIO10 is set to 0. When the button is released, GPIO10 is pulled to 1 by R82 (see the LED outputs section). The input signal can be used in the logic design of the main board FPGA. GPIO10 is shared with LED10, pressing the push-button (SW2) will cause LED10 to illuminate. 9 ASC Breakout Board Figure 8. Push-Button Circuit LED10 1 4 SW2 GPIO10 2 3 I2C Address Selection DIP Switch The ASC Breakout Board provides an 8-position DIP switch for I2C address selection of the ASC device. The switch combines with a set of on-board resistors (R9 - R15) to connect to the I2C_ADDR pin of the device (shown in Figure 9, taken from Sheet 2 of the schematic). Each switch corresponds to a different resistor setting and address selection (see the ASC Datasheet for more details). The ASC device only checks the resistor setting at power-onreset, updating the switches while the board is powered will have no effect. Only one switch should be closed at a time. Figure 9. I2C Address Selection DIP Switch ASC I2C Address Select 7 6 5 4 3 2 1 0 +3.3V R9 1K 1 16 SW3A R10 18.0K 2 15 SW3B R11 14.0K 3 14 SW3C R12 10.0K 4 13 SW3D R13 7.00K 5 12 SW3E R14 4.40K 6 11 SW3F R15 2.20K 7 10 SW3G 8 9 SW3H I2C_ADDR Reset Configuration Jumper The ASC on the breakout board can be configured as a Mandatory ASC or Optional ASC. This setting is configured in the Platform Designer software and described in the System Connections section of the ASC datasheet. The position of jumper J12 (shown in Figure 10, from Sheet 2 of the schematic) should match the setting in the software. This jumper routes the ASC RESETb signal to either the Mandatory Reset signal or to the Optional Reset signal on the ASC Interface Connector. Figure 10. Reset Configuration Jumper Mandatory ASC Jumper 2 to 3 Optional ASC Jumper 1 to 2 ASC_RESET 1 2 3 ASC_RESETb MANDATORY_RESET 10 J12 HEADER 3 ASC Breakout Board ASC Interface Connector The ASC Interface Connector (shown in Figure 11 from Schematic Sheet 2) is used to connect the ASC Breakout Board to the main FPGA Board. The connector has been designed to pair with other available Lattice Evaluation Boards, including the Platform Manager 2 Evaluation Board (see the related literature section for more details). The connector includes all the mandatory signals for connecting the ASC device to the hardware management controller as described in the system connections section of the ASC datasheet. This includes the ASC-Interface Signals, the I2C signals, and the Clock and Reset signals. The connector also includes a set of power rails as described in Table 3. Additionally, the connector provides the 5 V and 12 V Hot Swap signals. Figure 11. ASC Interface Connector ASC Interface Connector CONN DSUB 25-P +3.3V 13 +5V_HS 25 12 +5V_HS 11 +12V_HS 24 +12V_HS R7 10 +11.3V 22 0 LED2 23 9 5V_OC_SENSE +3.3V 21 8 ASC_CLK 7 I2C_WRITE_EN 20 ASC_5V_OC_SHUTDOWN I2C_SDA 19 6 R8 I2C_SCL 18 ASC_RESET 17 MANDATORY_RESET ASC_WRCLK 3 ASC_RDAT 2 ASC_WDAT 16 0 LED3 5 4 12V_OC_SENSE ASC_12V_OC_SHUTDOWN 15 14 1 J10 Table 3. ASC Interface Connector Pin Description Pin # Signal Name Description 1 GND Shared ground signal with main FPGA Board 2 ASC_WDAT ASC-Interface Signal - must be connected to FPGA PIO and assigned in Diamond 3 ASC_RDAT ASC-Interface Signal - must be connected to FPGA PIO and assigned in Diamond 4 ASC_WRCLK ASC-Interface Signal - must be connected to FPGA PIO and assigned in Diamond 5 MANDATORY_RESET RESETb signal if ASC device is declared as mandatory in Platform Designer. Must match J12 setting (Reset Configuration). Must be connected to FPGA PIO and assigned in Diamond. 6 GND Shared ground signal with main FPGA Board 7 I2C_WRITE_EN Connected to GPIO1 through R4. Used with optional ASC Write Protect feature. Connect to FPGA PIO and assign in Diamond if this feature is used. 8 ASC_CLK 8-MHz Clock Output by ASC0 in ASC hardware management controller systems. This signal is NC for all non-ASC0 ASC devices. ASC0 devices should connect to FPGA PCLK input and assign to ASCCLK signal in Diamond 11 ASC Breakout Board Pin # Signal Name Description 9 +3.3V ASC Supply Voltage. Provided by FPGA board or 12 V power supply (power supply not populated on Breakout Board). 10 +11.3V Voltage rail generated from diode OR of +12V_SW and +5_SW input supplies. FPGA main board may use as input to 12 V DC-DC converters. 11 +12V_HS 12 V supply rail. Output from either 12 V Hot Swap circuit or main FPGA board. This rail is the input for DCDC1 and DCDC2. 12 +5V_HS 5 V supply rail. Output from either 5 V Hot Swap circuit or main FPGA board. This rail is the input for DCDC3 and DCDC4. 13 GND Shared ground signal with main FPGA Board 14 ASC_12V_OC_SHUTDOWN Output from main FPGA board, connected to fast shutoff transistor (Q12) of 12 V Hot Swap circuit. Assign to FPGA PIO in Platform Designer and Diamond when using 12 V Hot Swap. 15 12V_OC_SENSE Output from ASC device (connected to GPIO3 through R8). Used as fast shutdown alarm to main FPGA board. Assign to FPGA PIO in Platform Designer and Diamond when using 12 V hot swap. 16 GND Shared ground signal with main FPGA Board 17 ASC_RESET RESETb signal if ASC device is declared as optional in Platform Designer. Must match J12 setting (Reset Configuration). Must be connected to FPGA PIO and assigned in Diamond. 18 I2C_SCL I2C Clock Signal. Should be connected to FPGA SCL pin. Main FPGA board should include pull-up resistors. Used for programming the ASC device. 19 I2C_SDA I2C Data Signal. Should be connected to FPGA SDA pin. Main FPGA board should include pull-up resistors. Used for programming the ASC device. 20 ASC_5V_OC_SHUTDOWN Output from main FPGA board, connected to fast shutoff transistor (Q7) of 5 V Hot Swap circuit. Assign to FPGA PIO in Platform Designer and Diamond when using 5 V Hot Swap. 21 5V_OC_SENSE Output from ASC device (connected to GPIO2 through R7). Used as fast shutdown alarm to main FPGA board. Assign to FPGA PIO in Platform Designer and Diamond when using 5 V Hot Swap. 22 GND Shared ground signal with main FPGA Board 23 +12V_HS 12 V supply rail. Output from either 12 V Hot Swap circuit or main FPGA board. This rail is the input for DCDC1 and DCDC2. 24 +5V_HS 5 V supply rail. Output from either 5 V Hot Swap circuit or main FPGA board. This rail is the input for DCDC3 and DCDC4. 25 +5V_HS 5 V supply rail. Output from either 5 V Hot Swap circuit or main FPGA board. This rail is the input for DCDC3 and DCDC4. 12 ASC Breakout Board Closed Loop Trimming (Not Populated) The ASC provides four Closed Loop Trim (CLT) cells which are used to accurately trim and margin power supplies. The ASC Breakout Board provides four DC-DC converter and trimming circuit footprints on the breakout board. Table 4 lists the components and signal associated with CLT operation on the ASC Breakout Board. Table 4. Closed Loop Trim Components & Signals Component / Signals SchematicSheet Ref. Des. Description Components Not Populated on Breakout Board DC-DC Converter DCDC1_A / DCDC1_B 3 Dual-footprint +12 V input adjustable output power supply. Trim circuit shown in schematic for DCDC1_A (NQR002A0X4Z) at 5 V output. DC-DC Converter DCDC2_A / DCDC2_B 3 Dual-footprint +12 V input adjustable output power supply. Trim circuit shown in schematic for DCDC2_A (NQR002A0X4Z) at 3.3 V output. DC-DC Converter DCDC3_A / DCDC3_B 4 Dual-footprint +5 V input adjustable output power supply. Trim circuit shown in schematic for DCDC3_A (NQR002A0X4Z) at 2.5 V output. DC-DC Converter DCDC4_A / DCDC4_B 4 Dual-footprint +5 V input adjustable output power supply. Trim circuit shown in schematic for DCDC4_A (NQR002A0X4Z) at 1.2 V output. N-Channel MOSFET - SOT-23 Q1, Q2 3 FDV301N N-Channel MOSFET. Inverts the DC-DC enable signal from ASC GPIO8 / GPIO9 and shifts the level up to +12 V. Green Indicator LED D19, D20, D21, D22 3, 4 LED indicates output of DC-DC is active. LED Bias Resistor R86, R88, R90, R92 3, 4 470 resistor limits the LED current. NPN Transistor - SOT-23 Q13, Q14, Q15, 3, 4 Q16 2N3904 NPN Transistor drives LED on when DC-DC output is active. NPN Bias Resistor R85, R87, R89, R91 4.7 k resistor limits the base current of NPN transistor. Tantalum Cap C5, C7, C9, C11 3, 4 6.8 F, 20 V capacitor DC-DC input filter. Tantalum Cap C6, C8, C10, C12 3, 4 10 F, 6.8 V capacitor DC-DC output filter. DC-DC Output Load Resistor R22,R31, R39, R47 3, 4 1k, 680, 470 and 330 resistors pull DC-DC outputs down to zero when disabled. DCDC1 Trim Resistors R17 - R21 3 Resistor values based on Platform Designer Trim Calculator for DCDC1_A at 5 V. DCDC2 Trim Resistors R26 - R30 3 Resistor values based on Platform Designer Trim Calculator for DCDC2_A at 3.3 V. DCDC3 Trim Resistors R34 - R38 4 Resistor values based on Platform Designer Trim Calculator for DCDC3_A at 2.5 V. DCDC4 Trim Resistors R42 - R46 4 Resistor values based on Platform Designer Trim Calculator for DCDC4_A at 1.2 V. Phoenix 4-Terminal Connector DCDC1-4 J4, J5, J7, J9 3, 4 Wire to board connectors to apply off-board loads to DC-DC with remote sensing. LED8 2, 3 DCDC1 control signal from GPIO8. Safe state is high. Inverted via Q1. LED9 2, 3 DCDC2 control signal from GPIO9. Safe state is high. Inverted via Q1. LED4 2, 4 DCDC3 control signal from GPIO4. Safe state is low. 3, 4 Signals 13 ASC Breakout Board Component / Signals Ref. Des. SchematicSheet Description LED5 2, 4 DCDC4 control signal from GPIO5. Safe state is low. OUT_DCDC1 2, 3 DCDC1 Output connected to VMON1 via R23. OUT_DCDC2 2, 3 DCDC2 Output connected to VMON2 via R32. OUT_DCDC3 2, 4 DCDC3 Output connected to VMON3 via R40. OUT_DCDC4 2, 4 DCDC4 Output connected to VMON4 via R48. TRIM_DCDC1 2, 3 DCDC1 Trim signal from TRIM1. TRIM_DCDC2 2, 3 DCDC2 Trim signal from TRIM2. TRIM_DCDC3 2, 4 DCDC3 Trim signal from TRIM3. TRIM_DCDC4 2, 4 DCDC4 Trim signal from TRIM4. Overview of Trim and Margin The board provides footprints for four DC-DC modules. Since all four are similarly designed and laid out, this section will provide an overview of the DC-DC circuit rather than provide a separate section for each DC-DC. Footprints are provided for both 5-pin SIP modules and DOSA power converters. The circuits shown in the schematic appendix support the NQR002A0X4 SIP from GE Industrial and the OKY-T/3-D12 DOSA converter from Murata. None of the components associated with the DC-DC operation (shown in Table 4) are populated on the breakout board. The ASC Breakout board provides footprints and circuit connections for five trimming resistors for each DC-DC. These five resistors are shared by both the SIP and DOSA footprints because only one supply can be populated at a time. The resistors are organized in an "H" pattern both in the schematic and on the board layout. The resistors are named in the schematic to match the names used in the Platform Designer Trim-view calculator. The names are listed and described in Table 5 below. Typically only three resistors are suggested by the calculator; a pull-up, a pull-down, and a series resistor. The exact population of the "H" pattern depends on many factors that the calculator takes into account such as type of DC-DC, output voltage, and range of trim. The ASC Breakout board provides pads and connections to support any result from the Trim Calculator. However, with certain supplies and option settings, the calculator can produce a result that only uses two resistors: a pull-down and series resistor. The DC-DCs on the ASC Breakout board are populated with the two resistor solution. A key requirement for the calculator to produce a two-resistor solution is the Bi-Polar Zero (BPZ) voltage of the Trim Cell has to match the DC-DC internal reference voltage. Otherwise the calculator will add a pull-up or pull-down resistor in attempt to offset the imbalance between the BPZ voltage setting and DC-DC reference voltage. The values shown in the schematic have been calculated for the NQR002A0X4 SIP from GE Industrial. For more information on the Trim interface and Calculator please see AN6074, Interfacing the Trim Output of Power Manager II Devices to DC-DC Converters and the Platform Designer 3.1 User Guide. Table 5. Trim Resistor "H-Network" Names. Schematic Name Calculator Name Description RpupS RpupSupply Pull Up Resistor at DC-DC Supply Trim input RpdnS RpdnSupply Pull Down Resistor at DC-DC Supply Trim input Rs Rseries Series Resistor between Trim DAC output and DC-DC Supply Trim input RpupD RpupDAC Pull Up Resistor at Trim DAC output RpdnD RpupDAC Pull Down Resistor at Trim DAC output In order for the CLT circuits within the ASC to operate properly the output of the supply needs to be monitored by the correct VMON input. The ASC Breakout board illustrates the correct connections by using TRIM1 with VMON1 for DCDC1, TRIM2 with VMON2 for DCDC2, all the way to TRIM4 with VMON4 for DCDC4. As discussed in the Voltage Monitor Operation section, the DC-DC outputs are connected to the VMON inputs using a series resistor with a value of 270 . The series resistor is not required in customer designs; its only function on the breakout board is to isolate the DC-DC outputs from the VMON test point. The VMON series resistor allows another voltage 14 ASC Breakout Board source to be applied to the VMON test point directly. If the voltage source is fairly weak, the VMON series resistor can be removed. Each of the DC-DC supplies has a load resistor connected to the output. The load resistor is not required in customer designs as the supply is typically connected to a real load. The load resistor is only used on the breakout board to prevent the output of the supply from "creeping up" when the supply is disabled. Without the load resistor some disabled supplies may output around 1 Volt that can be read by either the VMON or a Digital Volt Meter (DVM). The load resistors are sized based on the target DC-DC supply output voltage; lower values for lower voltages and higher values for higher voltages. In all cases they are 1/10 watt packages so there is minimal heat generated. DCDC1 - Enable and Trim This section discusses the specific circuits that support DCDC1. In Figure 12 the control signal LED8, which comes from GPIO8, is inverted and level shifted by a small signal N-channel MOSFET (Q1 FDV301N). For +12 V supplies a buffer or inverter is needed because the ASC GPIOs can only be pulled up to +5.5 V. All GPIOs of the ASC have a "safe state" which defines the behavior independent of configuration during Power-On-Reset (POR) or during programming; the safe sate of GPIO8 is high. Both the DOSA and SIP supplies are enabled when the On-Off pin is high (positive enable logic). Since the enable signal is inverted by Q1, the supplies will be off during "safe state". A 10 k pull-up resistor (R16) to 12 V is used to insure a full logic swing at the enable input of the supplies. (Note that DCDC3 and DCDC4 do not require the MOSFET circuit, this is because there input supply is +5 V. See Table 6 for more details). Figure 12. DCDC1 Trim and Control Circuit +3.3V Sheet [2,4,5,6,7,8,9,10] DCDC1_A NQR002A0X4Z 2 R90 470 DI Vin R16 10K +3.3V Vout 4 D21 Green SM_LED_0603 5V @ 2A 1 On-Off Control Trim 5 GND SIP 3 DCDC1_B OKY-T/3-D12P-C +12V_HS Sheet [2,7] DNI Vin Vout 5 On-Off Control Trim GND Q1 FDV301N 3 R20 open RpupD 4 Sheet [2] GS_VMON1 Sheet [2] C C6 10uF 6.8V R22 1K B A R18 2.74k RpdnS R19 11.0k Rs GPIO8 Sheet [2] VMON1 J4 DCDC1 D OUT_DCDC1 R17 open RpupS 5V @ 3A 1 LED8 R23 270 VMON1 2 +12V_HS C5 6.8uF 20V Sheet [2,8] Q15 2N3904 R89 4.7k R21 open RpdnD R24 100 TRIM_DCDC1 TRIM1 The control signal LED8 is also used to turn on a red LED (D7) when it is low and pulled up to +3.3 V by a 2.2 k resistor (RN2G - Sheet 8). Depending on the enable logic (positive or negative) of the installed supply, the illumination of LED D7 may not indicate that DCDC1 is enabled. (When the DC-DC converters from the schematic are used, DCDC1 and DCDC2 will be enabled when their control LED is illuminated. DCDC3 and DCDC4 will not be enabled when their control LED is illuminated. This is due to the inverting MOSFET used with DCDC1 and DCDC2). A separate green LED (D49) is used to indicate when the supply is enabled. An NPN transistor (Q15) is used to turn the green LED on when the supply has enough voltage to bias the emitter-base junction (slightly more than 0.7 V). Supply filtering is provided by a 6.8 F capacitor (C5) on the input and a 10 F capacitor on the output (C6). These are located close to the DC-DC footprints to ensure their effectiveness. Note that these values may not be optimal for all supplies and loading conditions, specific filtering requirements should be followed from the DC-DC data sheet. 15 ASC Breakout Board Table 6 shows a summary of the input voltage, output voltage, and control signal behavior for each of the four DCDC converters. The +12V_HS and +5V_HS rails which are used to power the DC-DC converters can be provided by either the Hot Swap circuits or the ASC Interface Board connector. See the connector section for more details. Table 6. Summary of DCDC Trim Circuits DC-DC Vin Vout VMON / Trim Channel GPIO Enable Control ON Logic Level RpdnS Rseries 1 +12V_HS 5V VMON1/TRIM1 GPIO8 0 2.74 k 11.0 k 2 +12V_HS 3.3 V VMON2/TRIM2 GPIO9 0 4.42 k 16.0 k 3 +5V_HS 2.5 V VMON3/TRIM3 GPIO4 1 6.34 k 22.0 k 4 +5V_HS 1.2 V VMON4/TRIM4 GPIO5 1 20.0 k 39.0 k Board Power Supplies (Not Populated) The breakout board is supplied by the +3.3 V rail from the ASC Interface connector. The breakout board also provides the footprint for the power supply circuit shown in Figure 13. Table 7 lists the power supply components on the ASC Breakout Board. Table 7. Power Supply Components Component Ref. Des. Schematic Sheet Description Components Not Populated on Breakout Board DC-DC Converter DCDC5 9 SIP +12 V input power supply (NQR002A0X4Z) trimmed for 3.3 V output. Provides board power supply from +12 V or +5 V rails. Power Jack J2 9 +12 V AC Adapter connector. Phoenix 2-Terminal Connector J1, J3 9 Input terminal for +5 V supply voltage (J1) and +12 V supply voltage (J3) Tranzorb TVS Diode D17 9 Transient voltage suppressor diode - protects +12 V input from external voltage. Schottky Diode D16, D18 9 Schottky diodes for diode ORing for +11.3 V rail Tantalum Capacitor C29 9 22 F, 25 V capacitor +12 V DC-DC input filter. Ceramic Bypass Capacitors C31, C32 9 100 nF 25 V capacitor +12 V DC-DC input and output filter. Tantalum Capacitor C30 9 22 F, 25 V capacitor +12 V DC-DC output filter. Trim Resistor R96 9 4.53 k trim resistor, sets DCDC5 output voltage at +3.3 V 2-pin Header J14 9 Selects +3.3 V sources - populating with jumper sources +3.3 V from +11.3 V rail, unpopulated sources +3.3 V from ASC Interface Board connector The terminal connector J1 connects the +5 V supply to the SW1 power switch. Either the J2 power supply jack or J3 terminal connect the +12 V supply to SW1. Switching SW1 to the on position will connect the terminals to the +12V_SW supply rail and the +5V_SW supply rail. The +12V_SW supply rail is connected to the D17 TRANZORB to protect the board from voltage transients. These voltage rails are the input supplies to the 12 V Hot Swap and 5 V Hot Swap circuits. 16 ASC Breakout Board Figure 13. Board Power Supply Circuit +11.3V +12V 1 2 3 J2 +11.3V J3 Sheet [2] D16 NSR0530P2T5G PWR JACK B +12V_SW SW1 Sheet [7,10] 3 2 A 1 6 D17 TRANZORB 5 2 Position Terminal Block 4 +5V SW DPDT J1 +3.3V B A +5V_SW Sheet [2,6,10] +3.3V Sheet [2,3,4,5,6,7,8,10] 2 Position Terminal Block Populate jumper to provide 3.3V power from ASC Eval Board DCDC5 NQR002A0X4Z +11.3V 12V to 4.8V input range 3.3V 1A 2 +11.3V C29 22uF 25V D18 NSR0530P2T5G Vin Vout C30 22uF 25V C31 100nF 25V 1 On-Off Control Trim GND 3 1 2 4 J14 HEADER 2 C32 100nF 5 R96 4.53K The +12 V connects through schottky diode D16 to the +11.3 V rail, while the +5 V connects through schottky diode D18 to the +11.3 V rail. Through this configuration, the +11.3 V rail will be sourced by either the +12V_SW rail (if present) or the +5V_SW rail (if present and +12V_SW rail not present). The +11.3 V rail is connected to the ASC Interface connector. This rail may be used as an input to a 12 V DC-DC converter on the main FPGA board. The +11.3 V rail is also used as the input voltage to DCDC5. DCDC5 steps down the +11.3 V input to a +3.3 V output voltage. The +11.3 V is buffered and filtered by C29 and C31. The +3.3 V output is buffered and filtered by C30 and C32. The +3.3 V output voltage is set by the 4.53 k resistor (R96) connected to the DCDC5 Trim pin. The header J14 is used to connect the DCDC5 output to the +3.3 V rail using a 2-pin jumper. Placing a jumper on J14 will supply the ASC Breakout Board +3.3 V from DCDC5. It will also provide +3.3 V to the ASC Interface Connector - this will power the FPGA main board from only the +12V_SW input on the ASC Breakout Board. No other input supply is required. 5 V Hot Swap (Not Populated) The ASC Breakout Board provides a set of footprints and connections for implementing a 5 V Hot Swap circuit using the ASC's built in hardware. Table 8 lists the components and signals associated with 5 V Hot Swap operation on the ASC Breakout Board. Table 8. 5 V Hot Swap Components and Signals Component / Signals Ref. Des. Schematic Sheet Description Components Not Populated on Breakout Board Current sense resistor R602 6 5 m 2 W resistor for supply side current monitoring with IMON1 input of ASC IMON1 Isolation Resistor R582, R592 6 Zero resistors - support population option for standard MOSFET versus MOSFET with Sense output MOSFET Switch Q62 6 N-Channel MOSFET load-side Hot Swap switch supplies power to +5V_HS and load capacitor C13. Gate Drive Resistor R612 6 2.2 k resistor, located close to MOSFET Q6, limits parasitic oscillations at the gate of Q6. Works with C22 to slow switching at Q6, limiting current ripple during hysteretic switching. Gate-Source Capacitor C222 6 100 nF capacitor, works with R61 to slow switching at Q6, limiting current ripple during hysteretic switching. 17 ASC Breakout Board Component / Signals Ref. Des. Schematic Sheet Description MOSFET with Sense Output Q53 6 N-Channel MOSFET supply-side Hot Swap switch supplies power to +5V_HS and load capacitor C13. Sense output provides proportional current to drain current. Gate Drive Resistor R543 6 2.2 k resistor, located close to MOSFET Q5, limits parasitic oscillations at the gate of Q5. Works with C23 to slow switching at Q5, limiting current ripple during hysteretic switching. Current sense resistor R573 6 3.30 sense resistor for supply-side current monitoring with IMON1 input of ASC, connected to Sense output of MOSFET (Q5) IMON1 Isolation Resistor R553, R563 6 Zero resistors - support population option for MOSFET with Sense output versus standard MOSFET Gate-Source Capacitor C233 6 100 nF capacitor, works with R54 to slow switching at Q5, limiting current ripple during hysteretic switching. Load Capacitors C131 6 680 F 10 V Bulk capacitance emulates a Hot Swap load. Discharge Resistors R621 6 4.7 k Resistor discharges load capacitor between Hot Swaps. LED Bias Resistor R63 6 3.3 k resistor limits the LED current for D10. LED to indicate Hot Swap has completed successfully. Red Indicator LED D10 6 Phoenix 2-Terminal Connector J6 6 +5V_HS terminal block connector Current Sense Amplifier U21 6 ZXCT1009 current sense amplifier - provides output current proportional to voltage across Vsense+ and Vsense-. Used for demonstration purpose only, not required in application. Current Sense Output Resistor R941 6 20 k resistor, sets output voltage at I_5V_HS test point to 1 V / 1A drain current of MOSFET. NPN Fast Shutoff Transistor Q7 6 NPN transistor, provides fast pull-down of Q5/Q6 gate voltage, enables fast shutdown from FPGA via ASC Interface connector during Hot Swap faults 6 1 k pull-up resistor - biases Q7 ON by default (shutting off Q5/Q6). Shutoff Transistor Pull-up Resistor R64 Signals +5V_SW 2, 6 5 V input voltage, from Power Supply circuit and J1 5V_HS_DRIVE 2, 6 HVOUT2 signal from ASC ASC_5V_OC_SHUTDOWN 2, 6 FPGA PIO signal, from ASC Interface Connector 5V_HS_CURRENT_P 2, 6 Connected to IMON1A_P, positive current monitor terminal 5V_HS_CURRENT_N 2, 6 Connected to IMON1A_N, negative current monitor terminal +5V_HS 2, 4, 6 5 V Hot Swap output voltage, provided to J6 terminal block, ASC Interface Connector, and DCDC1 and 2 input voltage Additional Test Points I_5V_HS Current Sense Amplifier Output Voltage - 1 V per 1A 1.Not required for customer designs; this is only needed to support ASC device evaluation. 2.Only populate for 5 V Standard MOSFET Hot Swap. Populate only from either Note 2 or Note 3, never both. 3.Only populate for 5 V MOSFET with Sense output Hot Swap. Populate only from either Note 3 or Note 3, never both. The 5 V Hot Swap circuit is designed to support two separate implementations. The Standard MOSFET implementation uses a standard power MOSFET (Q6) and a 5 m sense resistor (R60). The MOSFET with Sense output implementation uses a power MOSFET with current sense output (Q5) and a 3.30 sense resistor. The Standard MOSFET implementation is a Load-based Hot Swap implementation with the MOSFET connected between the current sensing resistor and the load capacitor. The MOSFET with Sense output implementation is a Supply-based Hot Swap implementation with the MOSFET connected between the supply and the current sensing resistor. The full 5 V Hot Swap circuit is shown in Figure 14 below. 18 ASC Breakout Board Figure 14. 5 V Hot Swap Circuit MOSFET w/ Sense (Option B) Population Options: Standard MOSFET (Option A): Q6, C22, R61, R60, R58, R59 MOSFET w/ Sense (Option B): Q5, R57, R55, C23, R54, R56 kelvin Q5 BUK7C06-40AITE sense sense X 600 C23 100nF R57 3.30 1% TP12 TP7 R55 0 Q6 IRF7832 R60 0.005 2W, 1% VMON5 Sheet [2,9,10] +5V_HS 5V_HS R56 0 1 R54 2.2k 1 5V_IN VMON6 +5V_SW +5V_HS R58 0 Sheet [2] R59 0 C22 100nF C13 680uF 10V 5V_HS_CURRENT_P IMON Sheet [2] R63 3.3k B R62 4.7k D10 Red SM_LED_0603 Sheet [2,4] J6 A R61 2.2k 2 Position Terminal Block 5V_HS_CURRENT_N 3 2 U2 ZXCT1009 Vsense+ Vsense- I_5V_HS - 1V per 1A sensed TP17 I_5V_HS 1 Iout HVOUT2 Sheet [2] 1 5V_HS_DRIVE TP16 +3.3V R94 20k 1% 5V_SDN Sheet [2] R64 1k 1 ASC INT Connector Demonstration Circuit to Output Monitored Current to Test Point (Not required for Hot Swap Operation) ASC_5V_OC_SHUTDOWN Fast Shutdown Q7 2N3904 The Hot Swap circuit is designed to work with the Hot Swap component in the Platform Designer software. Platform Designer will automatically generate the Hot Swap algorithm and device configuration based on user defined settings for input voltage, MOSFET characteristics, load capacitance, and other parameters. For more detail on the Hot Swap algorithm and working with Hot Swap in Platform Designer, see the References section. The Hot Swap circuit can be broken into three sections in order to understand the operation of the overall circuit: * Hot Swap - Load-Based Using Standard MOSFET - Supply-Based Using MOSFET with Sense Output * Fast Shutdown Circuit * Current Sensing Test Circuit Load-Based Hot Swap (Standard MOSFET) The circuit in Figure 15 illustrates the Load-based Hot Swap using Standard MOSFET. The Load-based Hot Swap circuit has Q6 connected between the current sensing resistor R60 and the load capacitor. The N type MOSFET Q6 is controlled by the high voltage output (HVOUT2) from the ASC. The gate resistor (R61) and gate-source capacitor (C22) are used to maintain a soft turn on of Q6. The increased gate capacitance smooths out the current during the hysteretic control stage (see the References section for more details on the Hot Swap behavior). 19 ASC Breakout Board Figure 15. 5 V Hot Swap - Load-Based, Standard MOSFET Shared Connection with MOSFET with Sense Hot Swap TP12 +5V_HS 5V_HS From 5V_SW Supply Voltage R60 0.005 2W, 1% R58 0 1 Q6 IRF7832 VMON6 R59 0 R63 3.3k C22 100nF C13 680uF 10V To ASC IMON 1P Current Monitor B R62 4.7k D10 Red SM_LED_0603 R61 2.2k J6 A 2 Position Terminal Block To ASC IMON 1N Current Monitor To Current Sense Amplifier From ASC HVOUT2 The signals 5V_HS_CURRENT_P and 5V_HS_CURRENT_N are connected to the IMON1P and IMON1N signals of the ASC. The sensing resistor R60 is connected through the zero isolation resistors (R58, 59) to the ASC using Kelvin connections and differential layout techniques to maximize the current sensing accuracy at the IMON1 inputs. The +5V_HS signal is used by the Hot Swap function to monitor the load capacitor C13 voltage using VMON6 of the ASC. The Hot Swap function monitors the load capacitor C13 voltage for the following reasons: * to see that C13 is charging up and there is not a short or open in the circuit * to see that C13 has reached a voltage where a higher current limit can be used * to know when C13 is close to the 5 V supply voltage - Hot Swap is complete. When Hot Swap is disabled R62 provides a discharge path for C13 to prepare the circuit for subsequent Hot Swaps. LED D10 and bias resistor R63 give a visual indication that the Hot Swap process is complete. Supply-Based Hot Swap (MOSFET with Sense Output) The circuit in Figure 16 illustrates the Supply-based Hot Swap using a MOSFET with Sense output. (Components from the Standard MOSFET Hot Swap are shown to illustrate the shared connections between the two circuits. Q6, R58, R59, R60, R61, C22 should not be populated when the MOSFET with Sense output is used.) The MOSFET with Sense output variation has Q5 connected to the supply side of R57. The SENSE output of Q5 provides a current proportional to the current flowing through the MOSFET drain (the BUK7C06 shown in the schematic has a typical drain current to sense current ratio of 615). The N type MOSFET Q5 is controlled by the HVOUT2 output from the ASC. The gate resistor (R54) and gate-source capacitor (C23) are used to maintain a soft turn on of Q5. The increased gate capacitance smooths out the current during the hysteretic control stage (see the References section for more details on the Hot Swap behavior). 20 ASC Breakout Board Figure 16. 5 V Hot Swap - Supply Based, SENSEFET MOSFET w/ Sense (Option B) Note: Components not populated on breakout board Population Options: Standard MOSFET (Option A): Q6, C22, R61, R60, R58, R59 MOSFET w/ Sense (Option B): Q5, R57, R55, C23, R54, R56 kelvin Q5 BUK7C06-40AITE sense sense X 600 R57 3.30 1% C23 100nF TP12 TP7 R55 0 VMON5 Sheet [2,9,10] +5V_HS 5V_HS R56 0 Q6 IRF7832 R60 0.005 2W, 1% 1 R54 2.2k 1 5V_IN VMON6 +5V_HS +5V_SW R58 0 Sheet [2] R59 0 C13 680uF 10V 5V_HS_CURRENT_P IMON Sheet [2] R63 3.3k C22 100nF B R62 4.7k D10 Red SM_LED_0603 R61 2.2k Sheet [2,4] J6 A 2 Position Terminal Block 5V_HS_CURRENT_N From ASC HVOUT2 To ASC IMON1 and Current Sense Amplifier From ASC HVOUT2 The signals 5V_HS_CURRENT_P and 5V_HS_CURRENT_N are connected to the IMON1P and IMON1N signals of the ASC. In the MOSFET with Sense output variation, R57 is used as the sensing resistor. R57 is tied between the sense current output and the Kelvin source pin of MOSFET Q5. R57 is connected through the zero isolation resistors (R55, 56) to the ASC using Kelvin connections and differential layout techniques to maximize the current sensing accuracy at the IMON1 inputs. VMON6 is used by the Hot Swap function to monitor the load capacitor C13 voltage. The Hot Swap function monitors the load capacitor C13 voltage for the following reasons: * to see that C13 is charging up and there is not a short or open in the circuit * to see that C13 has reached a voltage where a higher current limit can be used * to know when C13 is close to the 5 V supply voltage - Hot Swap is complete. When Hot Swap is disabled R62 provides a discharge path for C13 to prepare the circuit for subsequent Hot Swaps. LED D10 and bias resistor R63 give a visual indication that the Hot Swap process is complete. Fast Shutdown Circuit The fast shutdown circuit for the 5 V Hot Swap is shown in Figure 17 below. The ASC_5V_OC_SHUTDOWN signal is output from the main FPGA board via the ASC Interface Connector. The ASC_5V_OC_SHUTDOWN signal is active high, and by default pulled up to 3.3 V by R64. When ASC_5V_OC_SHUTDOWN is high, Q7 is biased on. This will pull the MOSFET gate low, holding the MOSFET off (see the Hot Swap circuit description above for more details). When ASC_5V_OC_SHUTDOWN is driven low, Q7 will be biased off. When Q7 is turned off, the Hot Swap MOSFET will be controlled by the ASC HVOUT2 voltage. The fast shutdown feature can be implemented using the Hot Swap component in Platform Designer. Assign the FPGA PIO connected to ASC_5V_OC_SHUTDOWN on the main FPGA board to the Fast Shut Down feature in Platform Designer. See the Reference section for more details. 21 ASC Breakout Board Figure 17. 5 V Hot Swap - Fast Shutdown Circuit To Hot Swap MOSFET Gate +3.3V TP16 5V_SDN Sheet [2] R64 1k 1 ASC INT Connector ASC_5V_OC_SHUTDOWN Q7 2N3904 Fast Shutdown Current Sense Feedback Circuit The 5 V Hot Swap circuit on the ASC Breakout board includes a current sense feedback circuit, shown in Figure 18. The purpose of this circuit is for demonstration and evaluation only, it does not need to be included on a customer application board. The current sense amplifier (U2 - ZXCT1009 from Diodes, Inc) provides an output current proportional to the voltage measured over R60. Based on the R60 resistance (5 m) and the R94 resistance (20 k), the ratio of output voltage at TP17 (I_5V_HS) to sensed current across R60 is about 1 V / 1A (this ratio is also maintained when Q5 and R57 are used instead of Q6 and R60). The test point I_5V_HS can be monitored on an oscilloscope to confirm the Hot Swap operation and evaluate the current behavior during Hot Swap. The internal current sense amplifier in the ASC is used in the Hot Swap algorithm, the circuit formed by U2 and R94 is only included to provide observable current feedback during the evaluation stage. Figure 18. 5 V Hot Swap - Current Sense Feedback Circuit From Hot Swap Standard MOSFET R60 0.005 2W, 1% R58 0 To 5V_HS Load Capacitor R59 0 To ASC IMON 1P Current Monitor To ASC IMON 1N Current Monitor 2 U2 ZXCT1009 3 Vsense+ Vsense- I_5V_HS - 1V per 1A sensed TP17 I_5V_HS 1 Iout 1 R94 20k 1% 22 Demonstration Circuit to Output Monitored Current to Test Point (Not required for Hot Swap Operation) ASC Breakout Board 12 V Hot Swap (Not Populated) The ASC Breakout Board provides a set of footprints and connections for implementing a 12 V Hot Swap circuit using the ASC's built in hardware. Table 9 lists the key elements associated with 12 V Hot Swap operation on the ASC Breakout Board. Table 9. 12 V Hot Swap Components and Signals Component / Signals Ref. Des. Schematic Sheet Description Components Not Populated on Breakout Board Voltage Divider Resistor R65, R66 7 3 k (R65) and 1.02 k (R66) to divide +12V_SW rail down to below 5.9 V limit for VMON input Zener Diode D11 7 Zener Diode for VMON input protection. Limits VMON9 input during transients and overvoltage. MOSFET Switch Q92, Q10 7 N-Channel MOSFET Supply-side Hot Swap switches supply power to +12V_HS and load capacitor C15. Gate Drive Resistor R712, R72 7 2.2 k resistors, located close to MOSFETs Q9 & Q10, limits parasitic oscillations at the gates of Q9 & Q10. Works with C2, C21 to slow switching at Q9 & Q10, limiting current ripple during hysteretic switching. Gate-Source Capacitor C202, C212 7 100nF capacitors, works with R71 & R72 to slow switching at Q9 & Q10, limiting inrush current during Hot Swap start and current ripple during hysteretic switching. Current Sense Resistor R73 7 10 m 3 W resistor for load side current monitoring with HIMON input of ASC HIMON Snubbing Resistor R742, R752 7 Snubber resistors (paired with C16, C17) protect HIMON input from momentary overvoltage, including inductive flyback voltages when Q9 and Q10 are turned off. Population option to support standard MOSFET Q9 versus MOSFET with Sense output Q11. MOSFET with Sense Output Q113 7 N-Channel MOSFET supply-side Hot Swap switch supplies power to +12V_HS and load capacitor C15 with Q10. Sense output provides proportional current to drain current. Gate Drive Resistor R673 7 2.2 k resistor, located close to MOSFET Q11, limits parasitic oscillations at the gate of Q11. Works with C26 to slow switching at Q11, limiting current ripple during hysteretic switching. Current sense resistor R683 7 6.20 resistor for supply-side current monitoring with HIMON input of ASC using MOSFET with Sense output HIMON Snubbing Resistor R693, R703 7 Snubber resistors (paired with C16, C17) protect HIMON input from momentary overvoltage, including inductive flyback voltages when Q10 and Q11 are turned off. Population option to support MOSFET with Sense output Q11 versus standard MOSFET Q9. Gate-Source Capacitor C263 7 100 nF capacitor, works with R67 to slow switching at Q11, limiting inrush current during Hot Swap start and current ripple during hysteretic switching. HIMON Snubbing Capacitor C16, C17 7 Snubber capacitors (paired with snubbing resistors) protect HIMON input from momentary overvoltage, including inductive flyback voltages when MOSFETs are turned off. Load Capacitors C151 7 1000 F 25 V Bulk capacitance emulates a Hot Swap load. Discharge Resistors R761 7 10 k Resistor discharges load capacitor between Hot Swaps. LED Bias Resistor R77 7 10 k resistor limits the current through LED D12 Red Indicator LED D12 7 LED to indicate 12 V Hot Swap is complete Phoenix 2-Terminal Connector J8 7 +12V_HS terminal block connector 23 ASC Breakout Board Component / Signals Ref. Des. Schematic Sheet Description Charge Pump Supply Diode D13 7 Diode provides path for current from +12V_SW supply to charge C18 when HVOUT1 = 0 V NPN Bias Resistor R78 7 4.7 M resistor limits the base current of NPN transistor, maintains NPN base voltage close to +12V_SW supply voltage NPN Transistor - SOT-23 Q17 7 NPN transistor, only biased ON when C18 voltage rises above +12V_SW supply voltage. Transistor stays off when HVOUT1 and charge pump are disabled - protects Q12 from thermal stress HVOUT Protection Zener Diode D14 7 Zener Diode for HVOUT1 protection. Limits HVOUT1 voltage in case of transients on +12V_SW supply Charge Pump Serial Capacitor C18 7 100 nF capacitor, works with D13 to add +12V_SW voltage to HVOUT1 voltage Charge Pump Diode D15 7 Diode provides path for current from C18 (via Q17) to charge C19 to boosted voltage Charge Pump Buffer Capacitor C19 7 Stores boosted charge pump voltage. Boosted voltage drives MOSFET gate to fully conduct +12V_SW input supply to +12V_HS and C15 load capacitor (controlled by Hot Swap algorithm). Charge Pump Discharge Resistor R80 7 10 k resistor, provides discharge path for C19 when Hot Swap is disabled NPN Fast Shutoff Transistor Q12 7 NPN transistor, provides fast pull-down of Q9/Q10/Q11 gate voltages, enables fast shutdown from FPGA via ASC Interface connector during Hot Swap faults Shutoff Transistor Pull-up Resistor R79 7 1 k pull-up resistor - biases Q12 ON by default (shutting off Q9/Q10/Q11). Current Sense Amplifier U31 7 ZXCT1009 current sense amplifier - provides output current proportional to voltage across Vsense+ and Vsense-. Used for demonstration purpose only, not required in application. Current Sense Output Resistor R951 7 20 k resistor, sets output voltage at I_12V_HS test point to 1 V / 1A drain current of MOSFET. +12V_SW 7, 9 12 V input voltage, from Power Supply circuit and J2/J3 MON_12V_IN 2, 7 12 V input voltage, divided down below 5.9 V, connected to VMON9 CHARGE_PUMP 2, 7 HVOUT1 signal from ASC, switched signal to charge pump circuit ASC_12V_OC_SHUTDOWN 2, 7 FPGA PIO signal, from ASC Interface Connector MON_12V_HS_VOLTAGE 5, 7 Connected to HIMONN_HVMON, negative current monitor terminal and high voltage monitor input MON_12V_HS_CURRENT 2, 7 Connected to HIMONP, positive current monitor terminal Signals Separate Test Points I_12V_HS 7 Current Sense Amplifier Output Voltage - 1 V per 1A PUMP_V 7 Charge Pump output voltage for Gate Drive 1.Not required for customer designs; this is only needed to support ASC device evaluation. 2.Only populate for 12 V standard MOSFET Hot Swap. Populate only from either Note 2 or Note 3, never both. 3.Only populate for 12 V MOSFET with Sense output Hot Swap. Populate only from either Note 3 or Note 3, never both. The 12 V Hot Swap circuit is designed to support two separate implementations. The standard MOSFET implementation uses standard power MOSFETs (Q9 and Q10) and a 10 m sense resistor (R73). The MOSFET with Sense output implementation uses a power MOSFET with current sense output (Q11) along with a standard power MOSFET (Q10) and a 6.20 sense resistor (R68). Both circuits are Supply-based Hot Swap implementations with the MOSFETs connected between the supply and the current sensing resistors. The full 12 V Hot Swap circuit is 24 ASC Breakout Board shown in Figure 19 below. Figure 19. 12 V HS Circuit Population Options: Standard MOSFET (Option A): Q9, C20, R71, R74, R75, C21 MOSFET w/ Sense (Option B): Q11, R68, C26, R69, R70, R67 MOSFET w/ Sense (Option B) Q11 BUK7C06-40AITE sense kelvin sense X 600 R68 6.20 1% TP13 Note: Components not populated on breakout board C26 100nF TP14 12V_HS 12V_IN 1 R67 2.2k Q9 IRF7832 R70 24 R69 24 Q10 IRF7832 R73 0.01 1% 3W +12V_HS 1 +12V_SW +12V_HS +12V_SW C20 100nF R65 3k C21 100nF R71 2.2k VMON9 C15 1000uF 25V R76 10k R72 2.2k D11 MMSZ5231BS-7-FL 5.1V B D12 Red SM_LED_0603 MON_12V_IN Sheet [2] R66 1.02k R77 10k J8 A 2 Position Terminal Block R74 24 R75 24 MON_12V_HS_VOLTAGE Sheet [2] HIMON MON_12V_HS_CURRENT C16 10nF +12V_SW D13 1N4148 R78 4.7M C18 100nF I_12V_HS - 1V per 1A sensed TP19 PUMP_V PUMP_V 1 U3 ZXCT1009 Vsense+ Vsense- TP18 I_12V_HS Iout 1 HVOUT1 3 2 Sheet [2] C17 10nF CHARGE_PUMP 1 TP15 1 12V_SDN ASC INT Connector +3.3V Q17 2N3906 D14 MMSZ5240B-7-F 10V D15 1N4148 R79 1k C19 R80 510k 10nF ASC_12V_OC_SHUTDOWN R95 10k 1% Demonstration Circuit to Output Monitored Current to Test Point (Not required for Hot Swap Operation) Q12 2N3904 The Hot Swap circuit is designed to work with the Hot Swap component in the Platform Designer software. Platform Designer will automatically generate the Hot Swap algorithm and device configuration based on user defined settings for input voltage, MOSFET characteristics, load capacitance, and other parameters. For more detail on the Hot Swap algorithm and working with Hot Swap in Platform Designer, see the References section. The Hot Swap circuit can be broken into five sections in order to understand the operation of the overall circuit: * Input Voltage Monitor * Charge Pump * Supply-Based Hot Swap - Using Standard MOSFET - Using MOSFET with Sense Output * Fast Shutdown Circuit * Current Sensing Test Circuit Input Voltage Monitor VMON9 is used to monitor the input voltage. The voltage monitors have a max input voltage of 5.9 V, so the circuit in Figure 20 below is required to monitor the 12 V input rail. R65 and R66 divide down the voltage within the operating range of the VMON. (The voltage at VMON9 will be approximately 25% of the voltage at +12V_SW). These resistors can be input into the Platform Designer tool in the Voltage view, and platform designer will automatically scale the trip points up to the input of the resistive divider. D11 is included in the circuit to protect the voltage monitor input from transient voltages above the 5.9 V input voltage. The clamp voltage of 5.1 V is well below the 5.9 V max operating voltage for the VMON channel. 25 ASC Breakout Board Figure 20. 12 V Hot Swap - Input Voltage Monitor Circuit TP13 12V_IN 1 +12V_SW Sheet [9, 10] To Supply-Based Hot Swap +12V_SW R65 3k VMON9 MON_12V_IN D11 MMSZ5231BS-7-FL 5.1V R66 1.02k Charge Pump The 12 V Hot Swap circuit requires a charge pump to boost the gate voltage to around 20 V to fully turn on the MOSFET to conduct 12 V. The circuit shown in Figure 21 is used to implement this external charge pump using diodes, capacitors, and a transistor. Figure 21. 12 V Hot Swap - Charge Pump Circuit To Supply-Based Hot Swap MOSFET gate +12V_SW D13 1N4148 R78 4.7M 1 HVOUT1 TP19 PUMP_V PUMP_V C18 100nF CHARGE_PUMP TP15 ASC INT Connector +3.3V Q17 2N3906 D14 MMSZ5240B-7-F 10V D15 1N4148 C19 R79 1k 1 12V_SDN R80 510k 10nF ASC_12V_OC_SHUTDOWN Q12 2N3904 The CHARGE_PUMP signal is output from HVOUT1. The Hot Swap component in Platform Designer will configure HVOUT1 in the switched mode output, so that the output will toggle between 12 V and 0 V with an 81.25% duty cycle at 31.25 kHz. D14 is connected to the CHARGE_PUMP signal to protect the HVOUT1 signal from transient voltages which may be present on the +12V_SW rail. D14 will clamp transient voltages above 10 V, keeping the HVOUT1 voltage below the 13.2 V maximum operating voltage. When the CHARGE_PUMP signal is at 0 V, C18 will be charged to the +12V_SW voltage through diode D13. At this time, PNP transistor Q17 will be off, due to the emitter-base voltage being below the Q17 cutoff voltage (the emitter voltage will be around +12V_SW minus 0.7 V, while the base voltage is +12V_SW). When the CHARGE_PUMP signal toggles up to 12 V, the voltage on C18 will be added to the CHARGE_PUMP output voltage, resulting in the generation of approximately 22 V at the junction of C18 and D13. This voltage will result in an emitter-base voltage that will bias on Q17 (the emitter voltage will be around 22 V, while the base voltage is +12V_SW). The 22 V will conduct through Q17 and D15 to charge up C19. C19 stores the voltage which is seen at the gate of the Hot Swap MOSFETs, and the MOSFETs will turn on as C19 is charged up. R80 provides a 26 ASC Breakout Board discharge path for C19 when the charge pump is disabled. The PUMP_V test point can be used for monitoring the charge pump voltage level. Supply-Based Hot Swap (Standard MOSFET) The circuit in Figure 22 illustrates the Supply-Based Hot Swap using Standard MOSFETs. The Supply-Based Hot Swap circuit has Q9 and Q10 connected between the supply and the current sensing resistor R73. The N type MOSFETs Q9 and Q10 are controlled by the output of the charge pump circuit (the charge pump is controlled by HVOUT1). Q9 and Q10 have their sources tied together. Q9 is connected in such a way that it only conducts from the supply to the load when the gate is biased and the MOSFET is on. Q10 is connected in such a way that it only conducts from the load to the supply when the gate is biased and the MOSFET is on. Connecting the MOSFETs in this way ensures that the Hot Swap algorithm can fully control current flowing in to charge up the load capacitor C15 and the current flowing out from C15 to the input supply (in case of input supply brown out). The gate resistors (R71, R72) and gate-source capacitors (C20, C21) are used to maintain a soft turn on of Q9 and Q10. The increased gate capacitance limits inrush current during the initial Hot Swap turn on and smooths out the current during the hysteretic control stage (see the References section for more details on the Hot Swap behavior). Figure 22. 12 V Hot Swap - Standard MOSFET Circuit Shared Connection with MOSFET with Sense 12V_HS R73 0.01 1% 3W Q10 IRF7832 From 12V_SW Supply Voltage +12V_HS 1 Q9 IRF7832 +12V_HS C20 100nF Shared Connection with MOSFET with Sense R71 2.2k C15 1000uF 25V C21 100nF R76 10k R77 10k B D12 Red SM_LED_0603 R72 2.2k A 2 Position Terminal Block R75 24 R74 24 MON_12V_HS_VOLTAGE Shared Connection with MOSFET with Sense Sheet [2] HIMON MON_12V_HS_CURRENT C16 10nF From Charge Pump Circuit J8 Sheet [2] C17 10nF To Current Sense Amplifier The signals MON_12V_HS_VOLTAGE and MON_12V_HS_CURRENT are connected to the HIMONN_HVMON and HIMONP signals of the ASC. These signals are protected from momentary over-voltage (including inductive flyback voltages when Q9 and Q10 are turned off) by the resistor (R74, R75) and capacitor (C16, C17) pair snubber circuit between the sensing resistor and the device inputs. The sensing resistor R73 is connected through the snubber circuit using Kelvin connections and differential layout techniques to maximize the current sensing accuracy at the HIMON inputs. The MON_12V_HS_VOLTAGE signal is also used by the Hot Swap function to monitor the load capacitor C15 voltage using the HVMON of the ASC. The Hot Swap function monitors the load capacitor C15 voltage for the following reasons: * to see that C15 is charging up and there is not a short or open in the circuit * to see that C15 has reached a voltage where a higher current limit can be used * to know when C15 is close to the 12 V supply voltage - Hot Swap is complete. When Hot Swap is disabled R76 provides a discharge path for C15 to prepare the circuit for subsequent Hot Swaps. LED D12 and bias resistor R77 give a visual indication that the Hot Swap process is complete. 27 ASC Breakout Board Supply-Based Hot Swap (MOSFET with Sense Output) The circuit in Figure illustrates the Supply-based Hot Swap using a MOSFET with Sense output. (Components from the Standard MOSFET Hot Swap are shown also to illustrate the shared connections between the two circuits. Q9, R71, R74, R75, C20, and C21 are not used with the MOSFET with Sense output). The MOSFET with Sense output variation has Q11 and R68 connected with Q10 and R73, with Q11 on the supply side of R68. The SENSE output provides a current proportional to the current flowing through the MOSFET drain (the BUK7C06 shown in the schematic has a typical drain current to sense current ratio of 615). The MOSFET with Sense output (Q11) takes the place of Q9 in this variation. The N type MOSFETs Q10 and Q11 are controlled by the output of the charge pump circuit (the charge pump is controlled by HVOUT1). Q10 and Q11 have their sources tied together. Q11 is connected in such a way that it only conducts from the supply to the load when the gate is biased and the MOSFET is on. Q10 is connected in such a way that it only conducts from the load to the supply when the gate is biased and the MOSFET is on. Connecting the MOSFETs in this way ensures that the Hot Swap algorithm can fully control current flowing in to charge up the load capacitor C15 and the current flowing out from C15 to the input supply (in case of input supply brown out). The gate resistors (R67, R72) and gate-source capacitors (C26, C21) are used to maintain a soft turn on of Q11 and Q10. The increased gate capacitance limits inrush current during the initial Hot Swap turn on and smooths out the current during the hysteretic control stage (see the References section for more details on the Hot Swap behavior). Figure 23. 12 V Hot Swap SENSEFET Circuit MOSFET w/ Sense (Option B) Q11 BUK7C06-40AITE sense X 600 R68 6.20 1% Population Options: Standard MOSFET (Option A): Q9, C20, R71, R74, R75, C21 MOSFET w/ Sense (Option B): Q11, R68, C26, R69, R70, R67 Note: Components not populated on breakout board C26 100nF TP14 12V_HS R69 24 R70 24 Q9 IRF7832 Q10 IRF7832 R73 0.01 1% 3W From 12V_SW Supply Voltage +12V_HS 1 R67 2.2k +12V_HS C20 100nF C15 1000uF 25V C21 100nF R71 2.2k R76 10k R72 2.2k R77 10k B D12 Red SM_LED_0603 J8 A 2 Position Terminal Block R74 24 R75 24 MON_12V_HS_VOLTAGE Sheet [2] HIMON MON_12V_HS_CURRENT C16 10nF From Charge Pump Circuit Sheet [2] C17 10nF To Current Sense Amplifier The signals MON_12V_HS_VOLTAGE and MON_12V_HS_CURRENT are connected to the HIMONN_HVMON and HIMONP signals of the ASC. These signals are protected from momentary over-voltage (including inductive flyback voltages when Q11 and Q10 are turned off) by the resistor (R69, R70) and capacitor (C16, C17) pair snubber circuit between the sensing resistor and the device inputs. In the MOSFET with Sense output variation, R68 is used as the sensing resistor. R68 is tied between the sense current output and the Kelvin source pin of MOSFET Q11. R68 is connected through the snubber circuit using differential layout techniques to maximize the current sensing accuracy at the HIMON inputs. (Note that a resistor must be populated at R73, even in the MOSFET with Sense output variation. R74 and R75 are not populated. This allows the current to flow to the load capacitor without affecting the sense current measurement by the HIMON in ASC). 28 ASC Breakout Board The MON_12V_HS_VOLTAGE signal is also used by the Hot Swap function to monitor the load capacitor C15 voltage using the HVMON of the ASC. The Hot Swap function monitors the load capacitor C15 voltage for the following reasons: * to see that C15 is charging up and there is not a short or open in the circuit * to see that C15 has reached a voltage where a higher current limit can be used * to know when C15 is close to the 12 V supply voltage - Hot Swap is complete. When Hot Swap is disabled R76 provides a discharge path for C15 to prepare the circuit for subsequent Hot Swaps. LED D12 and bias resistor R77 give a visual indication that the Hot Swap process is complete. Fast Shutdown Circuit The fast shutdown circuit for the 12 V Hot Swap is shown in Figure 24 below. The ASC_12V_OC_SHUTDOWN signal is output from the main FPGA board via the ASC Interface Connector. The ASC_12V_OC_SHUTDOWN signal is active high, and by default pulled up to 3.3 V by R79. When ASC_12V_OC_SHUTDOWN is high, Q12 is biased on. This will pull the MOSFET gate low, holding the MOSFET off. When ASC_12V_OC_SHUTDOWN is driven low, Q12 will be turned off. When Q12 is turned off, the Hot Swap MOSFET(s) will be controlled by the charge pump voltage. The fast shutdown feature can be implemented using the Hot Swap component in Platform Designer. Assign the FPGA PIO connected to ASC_12V_OC_SHUTDOWN on the main FPGA board to the Fast Shut Down feature in Platform Designer. See the References section for more details. Figure 24. 12 V Hot Swap - Fast Shutdown Circuit To Supply-Based Hot Swap MOSFET Gate +3.3V TP15 12V_SDN Sheet [2] R79 1k 1 ASC INT Connector ASC_12V_OC_SHUTDOWN Q12 2N3904 Current Sense Feedback Circuit The 12 V Hot Swap circuit on the ASC Breakout board includes a current sense feedback circuit, shown in Figure 25. The purpose of this circuit is for demonstration and evaluation only, it does not need to be included on a customer application board. The current sense amplifier (U3 - ZXCT1009 from Diodes, Inc) provides an output current proportional to the voltage measured over R73. Based on the R73 resistance (10 m) and the R95 resistance (10 k), the ratio of output voltage to sensed current across R73 is about 1 V / 1A (this ratio is also maintained when Q11 and R68 are used instead of Q9 and R73). The test point I_12V_HS can be monitored on an oscilloscope to confirm the Hot Swap operation and evaluate the current behavior during Hot Swap. The internal current sense amplifier in the ASC is used in the Hot Swap algorithm, the circuit formed by U3 and R95 is only included to provide observable current feedback during the evaluation stage. 29 ASC Breakout Board Figure 25. 12 V Hot Swap - Current Sense Feedback Circuit R73 0.01 1% 3W +12V_SW from Supply and MOSFETs +12_HS to Load Capacitor R74 24 R75 24 MON_12V_HS_VOLTAGE Shared Connections with MOSFET with Sense Hot Swap HIMON MON_12V_HS_CURRENT C16 10nF 2 U3 ZXCT1009 3 C17 10nF I_12V_HS - 1V per 1A sensed Vsense+ Vsense- TP18 I_12V_HS 1 Iout 1 R95 10k 1% Demonstration Circuit to Output Monitored Current to Test Point (Not required for Hot Swap Operation) Prototype Area The ASC Breakout Board provides multiple areas for prototyping circuits with the ASC. The Through Hole Prototype Area (see Sheet 10 of the schematic) is accessible from both the top and bottom side of the board. As shown in Figure 26, the Through Hole Prototype Area is arranged as a grid on the breakout board. The top three rows provide ten connections each to the +12V_SW, +5V_SW and +3.3 V voltage rails. The next eight rows provide ten open connections each - these can be used for mounting and connecting through hole components. The bottom row provides ten connections to the ground plane of the breakout board. 30 ASC Breakout Board Figure 26. Through Hole Prototype Area Through Hole Prototype Area Sheet [7] +12V_SW Sheet [2,6] +5V_SW AK22 AJ22 AH22 AG22 AF22 AE22 AD22 AC22 AB22 AA22 AK21 AJ21 AH21 AG21 AF21 AE21 AD21 AC21 AB21 AA21 +3.3V AK11 AK12 AK13 AK14 AK15 AK16 AK17 AK18 AK19 AK20 Sheet [2,3,4,5,6,7,8,9] AH11 AH12 AH13 AH14 AH15 AH16 AH17 AH18 AH19 AH20 AJ11 AJ12 AJ13 AJ14 AJ15 AJ16 AJ17 AJ18 AJ19 AJ20 AG11 AG12 AG13 AG14 AG15 AG16 AG17 AG18 AG19 AG20 AE11 AE12 AE13 AE14 AE15 AE16 AE17 AE18 AE19 AE20 AF11 AF12 AF13 AF14 AF15 AF16 AF17 AF18 AF19 AF20 AD11 AD12 AD13 AD14 AD15 AD16 AD17 AD18 AD19 AD20 AC11 AC12 AC13 AC14 AC15 AC16 AC17 AC18 AC19 AC20 AB11 AB12 AB13 AB14 AB15 AB16 AB17 AB18 AB19 AB20 AA11 AA12 AA13 AA14 AA15 AA16 AA17 AA18 AA19 AA20 The ASC Breakout Board also provides a surface-mount prototyping area on the bottom side of the board. The surface mount area is near the through hole prototyping area and provides a set of common footprints for resistors, capacitors, diodes, transistors and other integrated circuits as shown in Table 10. The schematic (Sheet 10) includes placeholder parts used to generate the footprints for the prototype area as shown in Figure 27. These surface mount footprints are unconnected - the user will need to connect any components placed on these footprints. Figure 27. Surface Mount Prototype Area Q20 SMD SOT-223 Prototype Area SOT-23 Package Prototype Area SOIC-8 Package Prototype Area Q21 Q22 2N3904 IRF7832 DNI DNI IRF7832 DNI Q23 2N3904 DNI DNI DNI Q25 2N3904 Q24 2N3904 Q26 NDT3055LCT DNI SMD 2512 Resistor Package Prototype Area SMD 0805 Cs, Ds, or Rs Prototype Area R100 1k DNI R101 1k DNI R102 1k DNI R103 1k DNI R104 1k DNI R105 1k DNI R106 1k DNI R107 1k DNI Q27 NDT3055LCT DNI R108 1k DNI R109 1k DNI R110 1k DNI R111 1k DNI R112 1k DNI R113 1k DNI Table 10. SMD Prototype Area - Footprint Summary Footprint Type Quantity Reference Designators Common Use SOIC-8 2 Q20, Q21 Power MOSFETs, other ICs SOT-23 4 Q22, Q23, Q24, Q25 NPN, PNP, MOSFET Transistors, and other ICs SOT-223 2 Q26, Q27 Power MOSFETs SMD-0805 12 R100, R101, R102, R103, R104, R105, R106, R107, R108, R109, R110, R111 Resistors, Inductors, Capacitors, and Diodes SMD-2512 2 R112, R113 Current Sense Resistors (Shunts) 31 ASC Breakout Board Mechanical Specifications Dimensions: 6 in. [L] x 3.5 in. [W] x 1 in. [H] Environmental Specifications The breakout board must be stored between -40C and 100C. The recommended operating temperature is between 0C and 55C. Electrical Specifications * 12 V Input +/- 15% (Input current requirement depending on Hot Swap settings and DC-DC Load Resistance) * 5 V Input +/- 10% (Input current requirement depending on Hot Swap settings and DC-DC Load Resistance) * 3.3 V Input +/- 5% (Breakout board current draw 100 mA typical) References * EB93, Platform Manager 2 Evaluation Board User Guide * DS1042, L-ASC10 Data Sheet * TN1225, Platform Manager 2 Hardware Checklist * Platform Designer 3.1 User Guide * AN6041, Extending the VMON Input Range of Power/Platform Management Devices * AN6074, Interfacing the Trim Output of Power Manager II Devices to DC-DC Converters Technical Support Assistance Submit a technical support case through www.latticesemi.com/techsupport. Revision History Date Version July 2015 1.0 Change Summary Initial release. (c) 2015 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 32 33 2 Contents Lattice Semiconductor Applications Email: techsupport@Latticesemi.com 1 C D Date: Size B Wednesday, April 30, 2014 Project Proj t ASC Breakout Board Title ASC System Block Diagram 1 Sheet B B Schematic Rev Board B d Rev 1 of 11 A 3 2 A 4 3 B 5 4 B C D 5 ASC System Block Diagram ASC Breakout Board Appendix A. Schematics Figure 28. ASC System Block Diagram 34 A B C D 7 6 5 4 3 2 1 0 15 SW3B 14 SW3C 13 SW3D 12 SW3E 11 SW3F 10 SW3G 9 SW3H 2 3 4 5 6 7 8 18.0K 14.0K 10.0K 7.00K 4.40K 2.20K R10 R11 R12 R13 R14 R15 5 16 SW3A 1 1K +3.3V R9 I2C_ADDR +5V_HS Sheet [2,4,6] ASC I2C Address Select +5V_SW TEMP_SENSE2N Sheet [5] Sheet [6,9,10] TEMP_SENSE1N TEMP_SENSE2P POT1 POT2 MON_12V_IN MON_12V_HS_CURRENT MON_12V_HS_VOLTAGE 5V_HS_CURRENT_P 5V_HS_CURRENT_N TEMP_SENSE1P VMON1 GS_VMON1 VMON2 GS_VMON2 VMON3 GS_VMON3 VMON4 GS_VMON4 C2 100nF Sheet [5] Sheet [5] Sheet [5] Sheet [5] Sheet [7] Sheet [7] Sheet [7] Sheet [6] Sheet [6] Sheet [5] Sheet [3] Sheet [3] Sheet [3] Sheet [3] Sheet [4] Sheet [4] Sheet [4] Sheet [4] C1 100nF +3.3V_ASC 270 270 C4 150pF C3 150pF R2 4 Sheet [7] Sheet [6] R6 R5 I2C_SCL I2C_ADDR I2C_SDA R1 4 LED2 R7 Sheet [3,7] Sheet [2,4,6] VMON6 VMON5 VMON5 VMON6 0 ASC_WDAT ASC_RDAT ASC_WRCLK ASC_CLK R8 0 +12V_HS 12V_OC_SENSE ASC_RESET I2C_SCL I2C_SDA ASC_12V_OC_SHUTDOWN LED3 1 2 3 RESETb TRIM1 TRIM2 TRIM3 TRIM4 GPIO8 GPIO9 GPIO10 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 HVOUT1 HVOUT2 HVOUT3 HVOUT4 HEADER 2 J11 14 15 16 17 18 19 20 21 22 23 24 25 J10 1 2 3 4 5 6 7 8 9 10 11 12 13 3 CONN DSUB 25-P LED8 LED9 LED10 11 12 13 43 ASC_WDAT ASC_RDAT ASC_WRCLK MANDATORY_RESET 1 2 3 2 Sheet [3,4,5,6,7,8,9,10] Sheet [9] MANDATORY_RESET +11.3V Sheet [7] Sheet [6] Size B Date: ASC TEST POINTS GPIO8 GPIO9 GPIO10 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 HVOUT1 HVOUT2 HVOUT3 HVOUT4 TRIM1 TRIM2 TRIM3 TRIM4 Wednesday, April 30, 2014 Project ASC Breakout Board 1 Sheet B B Schematic Rev Board Rev of 11 2 TMON1P TMON1N TMON2P TMON2N Lattice Semiconductor Applications Email: techsupport@Latticesemi.com LED8 LED9 LED10 LED1 LED2 LED3 LED4 LED5 LED6 CHARGE_PUMP 5V_HS_DRIVE HVOUT3 HVOUT4 TRIM_DCDC1 TRIM_DCDC2 TRIM_DCDC3 TRIM_DCDC4 TEMP_SENSE1P TEMP_SENSE1N TEMP_SENSE2P TEMP_SENSE2N HIMONP HIMONN_HVMON IMONP IMONN MON_12V_HS_CURRENT MON_12V_HS_VOLTAGE 5V_HS_CURRENT_P 5V_HS_CURRENT_N WDAT RDAT WCLK RESET ASC_CLK SDA SCL VMON1 VMON1_GS VMON2 VMON2_GS VMON3 VMON3_GS VMON4 VMON4_GS VMON5 VMON6 VMON7 VMON8 VMON9 1 VMON1 GS_VMON1 VMON2 GS_VMON2 VMON3 GS_VMON3 VMON4 GS_VMON4 VMON5 VMON6 POT1 POT2 MON_12V_IN ASC_WDAT ASC_RDAT ASC_WRCLK ASC_RESETb ASC_CLK I2C_SDA I2C_SCL Title Analog Sense and Control HEADER 3 J12 Sheet [3] Sheet [3] Sheet [4] Sheet [4] Sheet [3,4,5,8] I2C_WRITE_EN Optional ASC Jumper 1 to 2 ASC_RESETb +3.3V LED[1:10] 0 TRIM_DCDC1 TRIM_DCDC2 TRIM_DCDC3 TRIM_DCDC4 R4 CHARGE_PUMP 5V_HS_DRIVE 2 Mandatory ASC Jumper 2 to 3 ASC_RESET LED1 LED2 LED3 LED4 LED5 LED6 44 45 46 47 48 1 39 40 41 42 HVOUT3 HVOUT4 +3.3V R3 10k +3.3V_ASC 2 3 9 10 I2C_WRITE_EN ASC_CLK +12V_HS +5V_HS ASC Interface Connector ASC1012-48QFN VMON1 VMON1GS VMON2 VMON2GS VMON3 VMON3GS VMON4 VMON4GS VMON5 VMON6 VMON7 VMON8 VMON9 HIMONP HIMONN_HVMON IMON1P IMPN1N TMON1P TMON1N TMON2P TMON2N WDAT RDAT WRCLK ASCCLK SDA SCL 12C_ADDR U1 +5V_HS 26 25 28 27 30 29 32 31 34 35 36 37 38 17 18 19 20 21 22 23 24 4 5 6 7 14 15 16 5V_OC_SENSE ASC_5V_OC_SHUTDOWN 24 24 +3.3V 33 8 VCC VCC 5 GND 49 Analog Sense and Control A B C D ASC Breakout Board Figure 29. Analog Sense and Control 35 A B C D 5 5 Sheet [2] Sheet [2,8] Sheet [2] Sheet [2,8] Sheet [2,7] TRIM2 TRIM_DCDC2 GPIO9 LED9 TRIM1 TRIM_DCDC1 GPIO8 LED8 +12V_HS +12V_HS +12V_HS C7 6.8uF 20V C5 6.8uF 20V Trims DCDC 1-2 (Not Populated) 4 Q2 FDV301N Q1 FDV301N 4 R25 10K R16 10K 1 2 1 2 1 2 1 2 DI DNI On-Off Control 3 GND 3.3V @ 3A 3 GND DCDC2_B OKY-T/3-D12P-C On-Off Control Vin 3 GND 3.3V @ 2A DCDC2_A NQR002A0X4Z On-Off Control Vin DNI 5V @ 3A 3 GND DCDC1_B OKY-T/3-D12P-C Vin DI 5V @ 2A On-Off Control Vin DCDC1_A NQR002A0X4Z Trim Vout SIP Trim Vout Trim Vout SIP Trim Vout 4 5 5 4 4 5 5 4 3 R27 4.42k RpdnS R26 open RpupS R18 2.74k RpdnS R17 open RpupS 3 +3.3V R21 open RpdnD R28 16.0k Rs R30 open RpdnD R29 open RpupD C8 10uF 6.8V D22 Green SM_LED_0603 R92 470 C6 10uF 6.8V Q15 2N3904 R89 4.7k +3.3V OUT_DCDC2 Q16 2N3904 R91 4.7k R19 11.0k Rs R20 open RpupD OUT_DCDC1 Sheet [2,4,5,6,7,8,9,10] +3.3V R31 680 R22 1K 2 VMON2 VMON1 D21 Green SM_LED_0603 R90 470 2 A B C D J5 DCDC2 A B C D J4 DCDC1 Size B Date: Sheet [2] Sheet [2] Sheet [2] Sheet [2] Wednesday, April 30, 2014 Project ASC Breakout Board 1 Sheet Lattice Semiconductor Applications Email: techsupport@Latticesemi.com GS_VMON2 VMON2 GS_VMON1 VMON1 Title Trims DCDC2-1 (Do Not Populate) R33 100 R32 270 R24 100 R23 270 Note: Components not populated on breakout board 1 B B Schematic Rev Board Rev of 11 3 A B C D ASC Breakout Board Figure 30. Trims DCDC 1-2 (Not Populated on Breakout Board) 36 A B C D 5 5 Sheet [2] Sheet [2,8] Sheet [2] Sheet [2,8] Sheet [2,6] TRIM4 TRIM_DCDC4 GPIO5 LED5 TRIM3 TRIM_DCDC3 GPIO4 LED4 +5V_HS +5V_HS +5V_HS C11 6.8uF 20V C9 6.8uF 20V Trims DCDC 3-4 (Not Populated) 1 2 1 2 1 2 1 2 4 DI DNI On-Off Control 3 GND 1.2V @ 3A 3 GND DCDC4_B OKY-T/3-D12P-C On-Off Control Vin 3 GND 1.2V @ 2A DCDC4_A NQR002A0X4Z On-Off Control Vin DNI 2.5V @ 3A 3 GND DCDC3_B OKY-T/3-D12P-C Vin DI 2.5V @ 2A On-Off Control Vin DCDC3_A NQR002A0X4Z 4 Trim Vout SIP Trim Vout Trim Vout SIP Trim Vout 4 5 5 4 4 5 5 4 R43 20.0k RpdnS R42 open RpupS R35 6.34k RpdnS R34 open RpupS R44 39.0k Rs R36 22.0k Rs 3 R46 open RpdnD R45 open RpupD C10 10uF 6.8V Q13 2N3904 R85 4.7k +3.3V D19 Green SM_LED_0603 R86 470 R39 470 VMON3 +3.3V C12 10uF 6.8V R47 330 D20 VMON4 Green SM_LED_0603 R88 470 OUT_DCDC4 Q14 2N3904 R87 4.7k +3.3V R38 open RpdnD R37 open RpupD OUT_DCDC3 Sheet [2,3,5,6,7,8,9,10] 3 R49 100 R48 270 R41 100 R40 270 2 2 A B C D J9 DCDC4 A B C D J7 DCDC3 Size B Date: Wednesday, April 30, 2014 Project ASC Breakout Board 1 Sheet Lattice Semiconductor Applications Email: techsupport@Latticesemi.com Sheet [2] Sheet [2] Sheet [2] Sheet [2] Title Trims DCDC3-4 (Do Not Populate) GS_VMON4 VMON4 GS_VMON3 VMON3 Note: Components not populated on breakout board 1 B B Schematic Rev Board Rev of 11 4 A B C D ASC Breakout Board Figure 31. Trims DCDC 3-4 (Not Populated on Breakout Board) 37 A B C D 4 Sheet [2,3,4,6,7,8,9,10] Q4 2N3906 Q3 2N3906 5 +3.3V R52 1k R50 1k 2 1 1 3 +3.3V 1 3 +3.3V 2 2 3 4 Sheet [2,8] LED10 R53 1k R51 1k Sheet [2] POT2 Sheet [2] VMON8 POT1 VMON7 Sheet [2] TEMP_SENSE2N Sheet [2] Sheet [2] TEMP_SENSE1N Sheet [2] TEMP_SENSE2P TEMP_SENSE1P SW2 GPIO10 Temperature Sensor 2 Temperature Sensor 1 4 Inputs: Temperature Sensors, Trim Pots & Switches 5 3 3 2 2 Date: Size B Wednesday, April 30, 2014 Project ASC Breakout Board 1 Title Inputs: Temperature Sensors, Trim Pots, & Switches Sheet Lattice Semiconductor Applications Email: techsupport@Latticesemi.com 1 B B Schematic Rev Board Rev of 11 5 A B C D ASC Breakout Board Figure 32. Inputs: Temperature Sensors, Trim Pots & Switches A B C D +3.3V VMON5 5 +3.3V R54 2.2k ASC_5V_OC_SHUTDOWN ASC INT Connector 5V_HS_DRIVE HVOUT2 5V_HS_CURRENT_N 5V_HS_CURRENT_P Sheet [2,3,4,5,7,8,9,10] Sheet [2] Sheet [2] IMON +5V_SW Sheet [2] Sheet [2] Sheet [2,9,10] TP7 5V_IN R55 0 R57 3.30 1% 5V_SDN TP16 sense X 600 Q5 BUK7C06-40AITE MOSFET w/ Sense (Option B) Hot Swap, 5V (Not Populated) 1 kelvin sense 4 R56 0 +3.3V Fast Shutdown C23 100nF R64 1k R58 0 R60 0.005 2W, 1% Q7 2N3904 R59 0 3 R61 2.2k C22 100nF Q6 IRF7832 Population Options: Standard MOSFET (Option A): Q6, C22, R61, R60, R58, R59 MOSFET w/ Sense (Option B): Q5, R57, R55, C23, R54, R56 3 TP12 C13 680uF 10V R62 4.7k U2 ZXCT1009 5V_HS 1 4 1 38 3 1 Iout R94 20k 1% Vsense+ Vsense- 2 D10 Red SM_LED_0603 VMON6 +5V_HS +5V_HS J6 2 Position Terminal Block A B TP17 I_5V_HS 2 Size B Wednesday, April 30, 2014 Project ASC Breakout Board 1 Sheet Lattice Semiconductor Applications Email: techsupport@Latticesemi.com Sheet [2,4] Title Hot Swap, 5V (Do Not Populate) Demonstration Circuit to Output Monitored Current to Test Point (Not required for Hot Swap Operation) Date: 1 Note: Components not populated on breakout board I_5V_HS - 1V per 1A sensed R63 3.3k 2 1 5 B B Schematic Rev Board Rev of 11 6 A B C D ASC Breakout Board Figure 33. Hot Swap, 5 V (Not Populated on Breakout Board) A B C +3.3V Sheet [2] Sheet [2] CHARGE_PUMP ASC INT Connector +3.3V 5 R65 3k R66 1.02k HVOUT1 +12V_SW Sheet [2,3,4,5,6,8,9,10] ASC_12V_OC_SHUTDOWN Sheet [9,10] +12V_SW R67 2.2k Q11 BUK7C06-40AITE 12V_SDN TP15 4 D14 MMSZ5240B-7-F 10V C18 100nF R70 24 +3.3V R79 1k Q17 2N3906 C26 100nF +12V_SW D13 1N4148 R69 24 R68 6.20 1% sense X 600 MOSFET w/ Sense (Option B) MON_12V_IN Sheet [2] VMON9 D11 MMSZ5231BS-7-FL 5.1V 12V_IN TP13 1 kelvin sense D Hot Swap, 12V (Not Populated) 1 4 Q12 2N3904 D15 1N4148 R78 4.7M PUMP_V TP19 R71 2.2k C20 100nF Q9 IRF7832 10nF C19 R80 510k PUMP_V C21 100nF 3 Q10 IRF7832 Population Options: Standard MOSFET (Option A): Q9, C20, R71, R74, R75, C21 MOSFET w/ Sense (Option B): Q11, R68, C26, R69, R70, R67 3 U3 ZXCT1009 R72 2.2k 3 1 R95 10k 1% C16 10nF C17 10nF R76 10k I_12V_HS TP18 I_12V_HS - 1V per 1A sensed R75 24 C15 1000uF 25V 12V_HS TP14 2 2 Demonstration Circuit to Output Monitored Current to Test Point (Not required for Hot Swap Operation) Iout Vsense+ Vsense- 2 R74 24 R73 0.01 1% 3W 1 39 1 1 5 Size B Wednesday, April 30, 2014 Project ASC Breakout Board Title Hot Swap, 12V (Do Not Populate) Date: J8 Sheet [2] Sheet [2] 1 Sheet Lattice Semiconductor Applications Email: techsupport@Latticesemi.com MON_12V_HS_CURRENT HIMON A B +12V_HS 2 Position Terminal Block MON_12V_HS_VOLTAGE D12 Red SM_LED_0603 R77 10k +12V_HS Note: Components not populated on breakout board 1 B B Schematic Rev Board Rev of 11 7 Sheet [2,3] A B C D ASC Breakout Board Figure 34. Hot Swap, 12 V (Not Populated on Breakout Board) 40 2 4 4 LED3 LED2 LED1 7 LED4 Red D4 8 RN1H 2.2k RN1G 2.2k 9 LED5 Red D5 1 RN2B 2.2k RN2A 2.2k 10 2 LED6 Red D6 3 RN2D 2.2k RN2C 2.2k 4 3 RN2E 2.2k LED8 Red D7 6 RN2F 2.2k 5 7 RN2G 2.2k LED9 Red D8 8 RN2H 2.2k 9 LED10 Red D9 R81 2.2k R82 2.2k 2 Title LEDs Lattice Semiconductor Applications Email: techsupport@Latticesemi.com 1 C D Date: Size B Wednesday, April 30, 2014 Project ASC Breakout Board 1 Sheet B B Schematic Rev Board Rev of 11 8 A Red Red D3 Red D2 6 RN1F 2.2k 3 RN1D 2.2k 1 RN1B 2.2k D1 RN1E 2.2k 5 RN1C 2.2k RN1A 2.2k 10 2 A LED[1:10] +3.3V 3 B 5 Sheet [2,3,4,5] Sheet [2,3,4,5,6,7,9,10] 4 B C D LEDs 5 ASC Breakout Board Figure 35. LEDs 41 A B PWR JACK A B 4 NSR0530P2T5G D18 D17 TRANZORB +11.3V +11.3V +5V_SW +12V_SW C29 22uF 25V C31 100nF 25V 12V to 4.8V input range Sheet [2,6,10] Sheet [7,10] Sheet [2] 3 1 2 On-Off Control Vin DCDC5 NQR002A0X4Z 3 GND Trim Vout 5 4 R96 4.53K 3.3V 1A 2 C30 22uF 25V 1 2 C32 100nF +3.3V +3.3V HEADER 2 J14 Lattice Semiconductor Applications Email: techsupport@Latticesemi.com Schematic Rev Populate jumper to provide 3.3V power from ASC Eval Board Sheet [2,3,4,5,6,7,8,10] Note: Components not populated on breakout board 1 B C D Date: Size B Wednesday, April 30, 2014 ASC Breakout Board Project Title Board Power (Do Not Populate) 1 Sheet Board Rev of 11 9 B A 5 4 6 1 3 SW DPDT 5 SW1 +11.3V 2 A +5V 2 NSR0530P2T5G D16 +11.3V 3 B 2 Position Terminal Block J1 2 Position Terminal Block J3 J2 +12V 4 B C D 1 2 3 Board Power (Not Populated) 5 ASC Breakout Board Figure 36. Board Power (Not Populated on Breakout Board) A B C D +5V_SW Sheet [2,6] R100 1k DNI 5 R101 1k DNI Sheet [2,3,4,5,6,7,8,9] +3.3V +12V_SW Sheet [7] R102 1k DNI AJ11 AJ12 AJ13 AJ14 AJ15 AJ16 AJ17 AJ18 AJ19 AJ20 AJ21 AJ22 AH11 AH12 AH13 AH14 AH15 AH16 AH17 AH18 AH19 AH20 AH21 AH22 AG11 AG12 AG13 AG14 AG15 AG16 AG17 AG18 AG19 AG20 AG21 AG22 AF11 AF12 AF13 AF14 AF15 AF16 AF17 AF18 AF19 AF20 AF21 AF22 R103 1k DNI R104 1k DNI R105 1k DNI R106 1k DNI 4 R107 1k DNI R108 1k DNI AD21 AD22 R109 1k DNI AE11 AE12 AE13 AE14 AE15 AE16 AE17 AE18 AE19 AE20 AE21 AE22 Through Hole Prototype Area IRF7832 DNI Q21 SMD 0805 Cs, Ds, or Rs Prototype Area AK11 AK12 AK13 AK14 AK15 AK16 AK17 AK18 AK19 AK20 AK21 AK22 IRF7832 DNI Q20 SOIC-8 Package Prototype Area Prototype & Mounting Holes R110 1k DNI AD11 AD12 AD13 AD14 AD15 AD16 AD17 AD18 AD19 AD20 DNI AC21 AC22 R111 1k DNI AC11 AC12 AC13 AC14 AC15 AC16 AC17 AC18 AC19 AC20 Q22 2N3904 AB21 AB22 DNI AB11 AB12 AB13 AB14 AB15 AB16 AB17 AB18 AB19 AB20 Q23 2N3904 AA11 AA12 AA13 AA14 AA15 AA16 AA17 AA18 AA19 AA20 3 AA21 AA22 DNI Q24 2N3904 DNI SOT-23 Package Prototype Area 3 R112 1k DNI R113 1k DNI SMD 2512 Resistor Package Prototype Area Q25 2N3904 1 1 M_HOLE1 DI IW_MNT0 1 MH3 1 2 Size B Date: 1 Wednesday, April 30, 2014 Project ASC Breakout Board 1 Sheet Lattice Semiconductor Applications Email: techsupport@Latticesemi.com Title Prototype and Mounting Holes G3 E-Friendly M_HOLE1 DI IW_MNT0 1 MH4 G2 WEEE Board Logos M_HOLE1 DI IW_MNT0 1 MH2 Q27 NDT3055LCT DNI G1 Lattice Logo M_HOLE1 DI IW_MNT0 1 MH1 1 Q26 NDT3055LCT DNI SMD SOT-223 Prototype Area Board Mounting Holes 2 1 4 1 42 1 5 B B Schematic Rev Board Rev 10 of 11 A B C D ASC Breakout Board Figure 37. Prototype and Mounting Holes Title Mechanical Drawing Lattice Semiconductor Applications Email: techsupport@Latticesemi.com 1 43 Date: Wednesday, April 30, 2014 Project ASC Breakout Board 1 Sheet B B Schematic Rev Board Rev 11 of 11 A A Size B B B 5 C 2 2 C 3 3 D 4 4 D Mechanical Drawing 5 ASC Breakout Board Figure 38. Mechanical Drawing ASC Breakout Board Appendix B. Bill of Materials - Populated on Breakout Board Reference Designator Quantity Description Package Manufacturer Part Number ICs 1 TQFN_48 Lattice Semiconductor U1 ASC Device L-ASC10-1SG48I 2 C1, C2 0.1uF 16 V 10% Ceramic X7R SMD 0603 Murata GRM188R71C104KA01D 2 C3, C4 150pF 50 V 5% Ceramic NP0 SMD 0603 Murata GRM1885C1H151JA01D D1, D2, D3, D4, D5, D6, D7, D8, D9 Red LED SMD 0603 Lite-On Inc LTST-C190KRKT Capacitors Diodes 9 Jumpers 1 J10 25-pin DSUB Connector TE Connectivity 5745783-4 1 J11 2 Pin Header Header_1x2 Molex Inc 22-28-4364 1 J12 3 Pin Header Header_1x3 Molex Inc 22-28-4364 Q3,Q4 2N3906 PNP SOT23 Fairchild MMBT3906 2 RN1, RN2 2.2 k Resistor Network SMD 2512 CTS Resistor 745C101222JP 2 R1, R2 24 Resistor SMD 0603 Panasonic ERJ-3GEYJ240V 1 R3 10 k Resistor SMD 0603 Panasonic ERJ-3GEYJ103V 1 R4 0 Resistor SMD 0603 Panasonic ERJ-3GEY0R00V 2 R5, R6 270 Resistor SMD 0603 Panasonic ERJ-3GEYJ271V 3 R9, R51, R53 1 k Resistor SMD 0603 Panasonic ERJ-3GEYJ102V 1 R10 18.0 k Resistor 1% SMD 0603 Panasonic ERJ-3EKF1802V Transistors 2 Resistors 1 R11 14.0 k Resistor 1% SMD 0603 Panasonic ERJ-3EKF1402V 1 R12 10.0 k Resistor 1% SMD 0603 Panasonic ERJ-3EKF1002V 1 R13 7.00 k Resistor 1% SMD 0603 Panasonic ERJ-3EKF7001V 1 R14 4.40 k Resistor 1% SMD 0603 Panasonic ERJ-3EKF4401V ERJ-3EKF2201V 1 R15 2.20 k Resistor 1% SMD 0603 Panasonic 2 R50, R52 1 k Potentiometer TH_SLIDEPOT_4_25mm Alpha RA2043F-20-10EB1-B1K 2 R81, R82 2.2 k Resistor SMD 0603 Panasonic ERJ-3GEYJ222V Switches 1 SW2 Push Button Switch SMT_SW Panasonic EVQ-Q2K03W 1 SW3 8 Position Dip Switch 195_8MST CTS Electrocomponents 195-8MST 44 ASC Breakout Board Appendix C. Bill of Materials - Not Populated on Breakout Board Reference Designator Quantity Description Package Manufacturer Part Number ICs 2 U2, U3 Current Sense Amplifier SOT23 Diodes Inc ZXCT1009FTA 8 C18, C201, C211, C223, C234, C262, C31, C32 0.1 uF 16 V 10% Ceramic X7R SMD 0603 Murata GRM188R71C104KA01D 4 C5, C7, C9, C11 6.8 uF 16 V 10% Tantalum SMD 1206 Kemet T491A685K016AT 4 C6, C8, C10, C12 10 uF 10 V 10% Tantalum SMD 1206 Kemet T491A106K010AT 1 C13 680 uF 10 V 20% Aluminum Radial Panasonic EEU-FM1A681L 1 C15 1000 uF 25 V 20% Aluminum Radial Panasonic EEU-FM1E102 3 C16, C17, C19 10 nF 50 V 10% Ceramic X7R SMD 0603 Kemet C0603C103K5RACTU 2 C29, C30 22 uF 25 V 20% Aluminum Radial Panasonic EEA-GA1E220H 5 DCDC1_A, DCDC2_A, DCDC3_A, DCDC4_A, DCDC5 DC/DC Converter 0.6V-5.5 V 2A 5pin_SIP GE Critical Power NQR002A0X4Z 2 DCDC1_B, DCDC2_B DC/DC Converter 15W 12VIN 3AOUT DOSA-SMT Murata Power OKY-T/3-D12P-C 2 DCDC3_B, DCDC4_B DC/DC Converter 10.9W 5VIN 3AOUT DOSA-SMT Murata Power OKY-T/3-W5P-C Capacitors DCDCs Diodes 2 D10, D12 Red LED SMD 0603 Lite-On Inc LTST-C190KRKT 1 D11 Zener Diode 5.1 V SM_SOD_323_12 Diodes Inc MMSZ5231BS-7-F 2 D13, D15 Diode 100 V 0.15 A SOD-123_12 Micro Commercial Co 1N4148W-TP 1 D14 Zener Diode 10 V SM_SOD_123 Diodes Inc 2 D16, D18 Schottky 30 V 500 mA SM_SOD_923 ON Semiconductor NSR0530P2T5G 1 D17 TVS Diode 22 V 600 W SM_SOD_214AA_12 Littlefuse SMBJ22CA 4 D19, D20, D21, D22 Green LED SMD 0603 Lite-On Inc LTST-C190KGKT MMSZ5240B-7-F Jumpers 4 J1, J3, J6, J8 2 Position Terminal Block TERM_BLOCK_2POS Phoenix 1727010 1 J2 Pwr Jack PWR_JACK_PINS CUI Inc PJ-102AH 1 J4, J5, J7, J9 4 Position Terminal Block TERM_BLOCK_4POS Phoenix 1727036 1 J14 2 Pin Header Header_1x2 Molex Inc 22-28-4364 2 Q1, Q2 N-Channel MOSFET 25 V SOT23 Fairchild FDV301N 2 Q54, Q112 N-Channel TrenchPLUS FET with SOT427 SENSE output NXP Semiconductor BUK7C06-40AITE 3 Q63, Q91, Q10 N-Channel MOSFET 30 V SOIC8 International Rectifier IRF7832TRPBF 6 Q7, Q12, Q13, Q14, Q15, Q16 2N3904 NPN SOT23 Fairchild MMBT3904 1 Q17 2N3906 PNP SOT23 Fairchild MMBT3906 2 R741, R751 24 Resistor SMD 0603 Panasonic ERJ-3GEYJ240V 4 R16, R25, R76, R77 10 k Resistor SMD 0603 Panasonic ERJ-3GEYJ103V 4 R7, R8, R583, R593 0 Resistor SMD 0603 Panasonic ERJ-3GEY0R00V 4 R23, R32, R40, R48 270 Resistor SMD 0603 Panasonic ERJ-3GEYJ271V Transistors Resistors 3 R22, R64, R79 1 k Resistor SMD 0603 Panasonic ERJ-3GEYJ102V 1 R27 4.42 k Resistor SMD 0603 Panasonic ERJ-3EKF4421V 1 R28 16.0 k Resistor SMD 0603 Panasonic ERJ-3EKF1602V 1 R31 680 Resistor SMD 0603 Panasonic ERJ-3GEYJ681V 1 R35 6.34 k Resistor SMD 0603 Panasonic ERJ-3EKF6341V 1 R36 22.0 k Resistor SMD 0603 Panasonic ERJ-3EKF2202V 45 ASC Breakout Board 1 R39, R86, R88, R90, R92 470 Resistor SMD 0603 Panasonic ERJ-3GEYJ471V 5 R43 20.0 k Resistor SMD 0603 Panasonic ERJ-3EKF2002V 1 R44 39.0 k Resistor SMD 0603 Panasonic ERJ-3EKF3902V 1 R47 330 Resistor SMD 0603 Panasonic ERJ-3GEYJ331V 2 R544,R672 2.2 k SMD 0603 Panasonic ERJ-3GEYJ222V 2 R554,R564 0 SMD 0603 Panasonic ERJ-3GEY0R00V 1 R574 3.3 SMD 1206 Vishay-Dale CRCW12063R30FKEA 1 R603 0.005 SMD 2512 Rohm Semi PMR100HZPFU5L00 1 R62 4.7 k SMD 0603 Panasonic ERJ-3GEYJ472V 1 R63 3.3 k SMD 0603 Panasonic ERJ-3GEYJ332V 1 R65 3k SMD 0603 Panasonic ERJ-3GEYJ302V 1 R66 1.02 k SMD 0603 Panasonic ERJ-3EKF1021V 1 R682 6.2 SMD 1206 Vishay-Dale CRCW12066R20FKEA 2 R692, R702 24 SMD 0603 Panasonic ERJ-3GEYJ240V 3 R711, R72, R613 2.2 k SMD 0603 Panasonic ERJ-3GEYJ222V 1 R73 0.01 SMD 2512 Bourns CRA2512-FZ-R010ELF 1 R95 10 k SMD 0603 Panasonic ERJ-3EKF1002V 1 R78 4.7 M SMD 0603 Panasonic ERJ-3GEYJ475V 1 R80 510 k SMD 0603 Panasonic ERJ-3GEYJ514V 4 R85, R87, R89, R91 4.7 k SMD 0603 Panasonic ERJ-3GEYJ472V 1 R94 20 k SMD 0603 Panasonic ERJ-3EKF2002V 1 R96 4.53 k SMD 0603 Panasonic ERJ-3EKF4531V SW1 DPDT Power Switch SW DPDT NKK Switches M2022SS1W03_RO Switches 1 1. Only populate for 12 V Standard MOSFET Hot Swap. Populate only from either Note 1 or Note 2, never both. 2. Only populate for 12 V MOSFET with Sense Output Hot Swap. Populate only from either Note 1 or Note 2, never both. 3. Only populate for 5 V Standard MOSFET Hot Swap. Populate only from either Note 3 or Note 4, never both. 4. Only populate for 12 V MOSFET with Sense Output Hot Swap. Populate only from either Note 3 or Note 4, never both. 46 ASC Breakout Board Appendix D. Known Issues The populated components on the breakout board work as specified without issue. There is an issue related to the footprints and connections in the 12 V Hot Swap - Charge Pump section of the board. The footprint for Q17 contains an error in the connection to the device pins. Figure 39 shows the footprint of Q17, with each of the device pin connections labeled. The footprint has the base and collector pin connections swapped. Q17 needs to be populated according to Figure 40, with the connections swapped, in order for the 12 V Hot Swap circuit to function properly. Figure 39. 12 V Hot Swap - Charge Pump - Q17 Footprint Error Emitter Base* Collector* * - Incorrect Connections Figure 40. 12 V Hot Swap - Charge Pump - Q17 Correction Emitter Collector Swap Connection Base One method for fixing the connection on the board is to place Q17 (2N3906) in the configuration shown in Figure 41. In this configuration, Q17 is flipped upside down, and then rotated clockwise. This configuration results in the collector and base connections being swapped back to the correct pin connections. 47 ASC Breakout Board Figure 41. Q17 - Orientation for Corrected Connection 48 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Lattice: LPTM-ASC-B-EVN