1. Product profile
1.1 General description
Planar passivated sensitive gate four quadrant triac in a SOT223 (SC- 73 )
surface-mount able pla stic packa ge intended for applications re quiring dir ect interfacing to
logic level ICs and low power gate drivers.
1.2 Features and benefits
Direct interfacing to logic level ICs
Direct interfacing to low power gate
drive circuits
High blocking voltage capability
Planar passivated for voltage
ruggedness and reliability
Sensitive gate in four quadrants
Surface-mountable package
Triggering in all four quadrants
1.3 Applications
General purpose low power motor
control
Home appliances
Industrial pro cess control
Low power AC Fan controllers
1.4 Quick reference data
Z0109NN
4Q Triac
Rev. 05 — 18 March 2011 Product data sheet
SOT223
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VDRM repetitive peak
off-state voltage --800V
ITSM non-repetitive
peak on-state
current
full sine wave; Tj(init) =25°C;
tp= 20 ms; see Figure 4;
see Figure 5
--8A
IT(RMS) RMS on-state
current full sine wave; Tsp ≤105 °C;
see Figure 3; see Figure 1;
see Figure 2
--1A
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Product data sheet Rev. 05 — 18 March 2011 2 of 15
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4Q Triac
2. Pinning information
3. Ordering information
Static characteristics
IGT gate trigger
current VD=12V; I
T= 0.1 A; T2+ G+;
Tj=25°C; see Figure 9 --10mA
VD=12V; I
T= 0.1 A; T2+ G-;
Tj=25°C; see Figure 9 --10mA
VD=12V; I
T= 0.1 A; T2- G-;
Tj=25°C; see Figure 9 --10mA
VD=12V; I
T= 0.1 A; T2- G+;
Tj=25°C; see Figure 9 --10mA
Table 1. Quick reference data …continued
Symbol Parameter Conditions Min Typ Max Unit
Table 2. Pinning info rmation
Pin Symbol Description Simplified outline Graphi c sy mbol
1 T1 main terminal 1
SOT223 (SOT223)
2 T2 main terminal 2
3 G gate
4 T2 main terminal 2
132
4
sym051
T1
G
T2
Table 3. Ordering information
Type number Package
Name Description Version
Z0109NN SOT223 plastic surface-mounted package with increased heatsink; 4
leads SOT223
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Product data sheet Rev. 05 — 18 March 2011 3 of 15
NXP Semiconductors Z0109NN
4Q Triac
4. Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VDRM repetitive peak off-state voltage - 800 V
IT(RMS) RMS on-state current full sine wave; Tsp ≤105 °C;
see Figure 3; see Figure 1; see Figure 2 -1A
ITSM non-repetitive peak on-state
current full sine wave; Tj(init) =25°C;
tp= 20 ms; see Figure 4; see Figure 5 -8A
full sine wave; Tj(init) =25°C;
tp=16.7ms -8.5A
I2tI
2t for fusing tp= 10 ms; sine-wave pulse - 0.32 A2s
dIT/dt rate of rise of on-state current IT=1A; I
G=20mA; dI
G/dt = 0.1 A/µs;
T2+ G+ -50A/µs
IT=1A; I
G=20mA; dI
G/dt = 0.1 A/µs;
T2+ G- -50A/µs
IT=1A; I
G=20mA; dI
G/dt = 0.1 A/µs;
T2- G- -50A/µs
IT=1A; I
G=20mA; dI
G/dt = 0.1 A/µs;
T2- G+ -20A/µs
IGM peak gate current - 1 A
PGM peak gate power - 2 W
PG(AV) average gate power over any 20 ms period - 0.1 W
Tstg storage temperature -40 150 °C
Tjjunction temperature - 125 °C
Fig 1. RMS on-state current as a function of surge
duration; maximum values Fig 2. RMS on-state current as a function of solder
point temperature; maximum values
003aac269
0
2
4
6
8
10-2 10-1 1 10
surge duration (s)
IT(RMS)
(A)
003aac270
0
0.4
0.8
1.2
-50 0 50 100 150
T
sp
(°C)
I
T(RMS)
(A)
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Product data sheet Rev. 05 — 18 March 2011 4 of 15
NXP Semiconductors Z0109NN
4Q Triac
Fig 3. Total power dissipation as a function of RMS on-state current; maximum values
Fig 4. No n-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum
values
003aac259
0.0
0.4
0.8
1.2
1.6
2.0
0 0.2 0.4 0.6 0.8 1 1.2
I
T(RMS )
(A)
P
tot
(W)
a = 180
°
120
°
90
°
60
°
30
°
conduction
angle
(degrees)
form
factor
a
30
60
90
120
180
4
2.8
2.2
1.9
1.57
Ω
003aad318
0
2
4
6
8
10
1
10
10
2
10
3
number of cycles
I
TSM
(A)
I
TSM
t
I
T
T
j(init)
= 25
°
C max
1/f
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Product data sheet Rev. 05 — 18 March 2011 5 of 15
NXP Semiconductors Z0109NN
4Q Triac
Fig 5. No n-repetitive peak on-state current as a function of pulse width ; maximum value s
003aad319
1
10
10
2
10
3
10
-5
10
-4
10
-3
10
-2
10
-1
t
p
(s)
I
TS M
(A)
(1)
(2)
I
TSM
t
I
T
T
j(init)
= 25
°
C max
t
p
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Product data sheet Rev. 05 — 18 March 2011 6 of 15
NXP Semiconductors Z0109NN
4Q Triac
5. Thermal characteristics
Table 5. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-sp) thermal resistance
from junction to solder
point
full cycle; see Figure 8 --15K/W
Rth(j-a) thermal resistance
from junction to
ambient
full cycle; printed circuit board mounted;
minimum footprint; see Figure 6 - 156 - K/W
full cycle; printed circuit board mounted;
pad area; see Figure 7 -70-K/W
All dimensions are in mm
All dimensions are in mm
Printed circuit board:
FR4 epoxy glass (1.6 mm thick), copper laminate
(35 um thick)
Fig 6. Minimum footprint SOT223 Fig 7. Printed circuit board pad area: SOT223
001aab508
3.8 min
1.5
min
1.5
min
(3×)
2.3
4.6
6.3
1.5
min
001aab509
7
4.6
15
36
9
10
18
4.5
60
50
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Product data sheet Rev. 05 — 18 March 2011 7 of 15
NXP Semiconductors Z0109NN
4Q Triac
Fig 8. Transient thermal impedance from junction to solder po int as a junction of pulse width
003aac210
10
-2
10
-1
1
10
10
2
10
-5
10
-4
10
-3
10
-2
1
10
t
p
(s)
Z
th(j-sp)
(K/W)
tp
P
t
10
-1
Z0109NN All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 05 — 18 March 2011 8 of 15
NXP Semiconductors Z0109NN
4Q Triac
6. Characteristics
Table 6. Characteristics
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
IGT gate trigger current VD=12V; I
T= 0.1 A; T2+ G+;
Tj=25°C; see Figure 9 --10mA
VD=12V; I
T= 0.1 A; T2+ G-;
Tj=25°C; see Figure 9 --10mA
VD=12V; I
T= 0.1 A; T2- G-;
Tj=25°C; see Figure 9 --10mA
VD=12V; I
T= 0.1 A; T2- G+;
Tj=25°C; see Figure 9 --10mA
ILlatching current VD=12V; I
G= 0.1 A; T2+ G+;
Tj=25°C; see Figure 10 --15mA
VD=12V; I
G= 0.1 A; T2+ G-;
Tj=25°C; see Figure 10 --25mA
VD=12V; I
G= 0.1 A; T2- G-;
Tj=25°C; see Figure 10 --15mA
VD=12V; I
G= 0.1 A; T2- G+;
Tj=25°C; see Figure 10 --15mA
IHholding current VD=12V; T
j=25°C; see Figure 11 --10mA
VTon-stat e vo ltage IT= 1.4 A; Tj=25°C; see Figure 12 -1.31.6V
VGT gate trigger voltage VD=12V; I
T= 0.1 A; Tj=25°C;
see Figure 13 --1.3V
VD=800V; I
T= 0.1 A; Tj=125°C;
see Figure 13 0.2--V
IDoff-state current VD=800V; T
j= 125 °C - - 0.5 mA
Dynamic character istics
dVD/dt rate of rise of off-state
voltage VDM =536V; T
j= 110 °C; gate open
circuit; exponential waveform;
see Figure 14
50--V/µs
dVcom/dt rate of change of
commutating voltage VD=400V; T
j=110°C;
dIcom/dt = 0.44 A/ms; gate open circuit 2--V/µs
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Product data sheet Rev. 05 — 18 March 2011 9 of 15
NXP Semiconductors Z0109NN
4Q Triac
(1) T2- G+
(2) T2- G-
(3) T2+ G-
(4) T2+ G+
Fig 9. Normalized gate trigger cu rrent as a function of
junction temperature Fig 10. Normalized latching current as a function of
junction temperature
Vo = 1.13 V
Rs = 0.31 Ω
(1) Tj = 125 °C; typical values
(2) Tj = 125 °C; maximum values
(3) Tj = 25 °C; maximum values
Fig 11. Normalized holding current as a function of
junction temperature Fig 12. On-state current as a function of on-state
voltage
Tj (°C)
-50 150100050
003aaa205
2
1
3
4
0
IGT(25°C)
IGT
(1)
(2)
(3)
(4)
Tj (°C)
-50 150100050
003aaa203
1
2
3
0
IL
IL(25°C)
Tj (°C)
-50 150100050
003aaa204
1
2
3
0
IH(25°C)
IH
003aac258
0
0.4
0.8
1.2
1.6
2
0 0.4 0.8 1.2 1.6 2
VT
(V)
IT
(A)
(1) (2) (3)
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Product data sheet Rev. 05 — 18 March 2011 10 of 15
NXP Semiconductors Z0109NN
4Q Triac
Fig 13. Normalized gate trigger voltage as a function of
junction temperature Fig 14. Normalized critical rate of rise of off-state
voltage as a function of junction temperature;
typical values
Tj (°C)
-50 150100050
003aaa209
0.8
0.4
1.2
1.6
0
VGT(25°C)
VGT
1.6
1.2
0.8
0.4
0
A
0 50 100 150
Tj (°C)
003aaa208
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Product data sheet Rev. 05 — 18 March 2011 11 of 15
NXP Semiconductors Z0109NN
4Q Triac
7. Package outline
Fig 15. Package outline SOT223 (SOT223)
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Product data sheet Rev. 05 — 18 March 2011 12 of 15
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4Q Triac
8. Revision history
Table 7. Revision history
Document ID Release date Data sheet status Change notice Supersedes
Z0109NN v.5 20110318 Product data sheet - Z0109NN v.4
Modifications: •Various changes to content.
Z0109NN v.4 20100906 Product data sheet - Z0109NN v.3
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Product data sheet Rev. 05 — 18 March 2011 13 of 15
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4Q Triac
9. Legal information
9.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term 'short data sheet' is explained in section "Definitions".
[3] The p r oduct status of device(s) described in t his documen t may have changed since this documen t was publish ed and may differ in case of multiple devices. The latest product
status information is available on the Internet at URL http://www.nxp.com.
9.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall pre vail.
Product specifica t io n — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to off er functions and qualities beyond tho se described in the
Product data sheet.
9.3 Disclaimers
Limited warranty and liability — Information in this document is be lieved to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequ ential damages (including - wit hout limitatio n - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability t owards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
to the publication hereof .
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, lif e-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in perso nal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty tha t such application s will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and ope ration of their applications
and products using NXP Semiconductors product s, and NXP Semiconductors
accepts no liability for any assistance with applicati ons or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suit able and fit for the custome r’s applications and
products planned, as well as fo r the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for th e customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanent ly and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individua l agreement. In case an individual
agreement is concluded only the ter ms and conditions of the respective
Document status [1] [2] Product status [3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [shor t] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
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Product data sheet Rev. 05 — 18 March 2011 14 of 15
NXP Semiconductors Z0109NN
4Q Triac
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document ma y be interpret ed or
construed as an of fer to sell product s that is op en for accept ance or the grant ,
conveyance or implication of any license under any copyrights, p atents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) d escribed herein may
be subject to export control regulat i ons. Export might require a prior
authorization fro m national authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for aut omotive use. It i s neither qua lified nor test ed
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automot ive specifications and standard s, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting f rom customer design an d
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specificat ions.
9.4 Trademarks
Notice: All referenced b rands, produc t names, service names and trademarks
are the property of their respect i ve ow ners.
Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,
FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE,
ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse,
QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET,
TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V.
HD Radio and HD Radio logo — are trademarks of iBiquity Digital
Corporation.
10. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors Z0109NN
4Q Triac
© NXP B.V. 2011. All rights reserved.
For more information, please visit: http://www.nxp.co m
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 18 March 2011
Document identifier: Z0109NN
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
11. Contents
1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.1 General description . . . . . . . . . . . . . . . . . . . . . .1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . .1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . .1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . .2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . .2
4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3
5 Thermal characteristics . . . . . . . . . . . . . . . . . . .6
6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . .8
7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . .11
8 Revision history. . . . . . . . . . . . . . . . . . . . . . . . .12
9 Legal information. . . . . . . . . . . . . . . . . . . . . . . .13
9.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . .13
9.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
9.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . .13
9.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .14
10 Contact information. . . . . . . . . . . . . . . . . . . . . .14