2005-10-18
1
BFR182T
12
3
NPN Silicon RF Transistor*
For low noise, high-gain broadband amplifiers at
collector currents from 1 mA to 20 mA
fT = 8 GHz, F = 0.9 dB at 900 MHz
* Short term description
ESD (Electrostatic discharge) sensitive device, observe handling precaution!
Type Marking Pin Configuration Package
BFR182T RGs 1=B 2=E 3=C SC75
Maximum Ratings
Parameter Symbol Value Unit
Collector-emitter voltage VCEO 12 V
Collector-emitter voltage VCES 20
Collector-base voltage VCBO 20
Emitter-base voltage VEBO 2
Collector current IC35 mA
Base current IB4
Total power dissipation1)
TS 75 °C Ptot 250 mW
Junction temperature T
j
150 °C
Ambient temperature T
A
-65 ... 150
Storage temperature Tst
g
-65 ... 150
Thermal Resistance
Parameter Symbol Value Unit
Junction - soldering point2) RthJS 300 K/W
1TS is measured on the collector lead at the soldering point to the pcb
2For calculation of RthJA please refer to Application Note Thermal Resistance
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BFR182T
Electrical Characteristics at TA = 25°C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
DC Characteristics
Collector-emitter breakdown voltage
IC = 1 mA, IB = 0 V(BR)CEO 12 - - V
Collector-emitter cutoff current
VCE = 20 V, VBE = 0 ICES - - 100 µA
Collector-base cutoff current
VCB = 10 V, IE = 0 ICBO - - 100 nA
Emitter-base cutoff current
VEB = 1 V, IC = 0 IEBO - - 1 µA
DC current gain-
IC = 10 mA, VCE = 8 V, pulse measured hFE 70 100 140 -
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BFR182T
Electrical Characteristics at T
A
= 25°C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
AC Characteristics (verified by random sampling)
Transition frequency
IC = 15 mA, VCE = 8 V, f = 500 MHz fT6 8 - GHz
Collector-base capacitance
VCB = 10 V, f = 1 MHz, VBE = 0 ,
emitter grounded
Ccb - 0.32 0.5 pF
Collector emitter capacitance
VCE = 10 V, f = 1 MHz, VBE = 0 ,
base grounded
Cce - 0.2 -
Emitter-base capacitance
VEB = 0.5 V, f = 1 MHz, VCB = 0 ,
collector grounded
Ceb - 0.8 -
Noise figure
IC = 3 mA, VCE = 8 V, ZS = ZSopt,
f = 900 MHz
IC = 3 mA, VCE = 8 V, ZS = ZSopt,
f = 1.8 GHz
F
-
-
0.9
1.2
-
-
dB
Power gain, maximum stable1)
IC = 5 mA, VCE = 8 V, ZS = ZSopt, ZL = ZLopt ,
f = 900 MHz
Gms - 20.5 - dB
Power gain, maximum available2)
IC = 10 mA, VCE = 8 V, ZS = ZSopt, ZL = ZLopt ,
f = 1.8 GHz
Gma - 14 - dB
Transducer gain
IC = 10 mA, VCE = 8 V, ZS = ZL = 50 ,
f = 900 MHz
IC = 10 mA, VCE = 8 V, ZS = ZL = 50 ,
f = 1.8 GHz
|S21e|2
-
-
16.5
11
-
-
dB
1Gms = |S21 / S12|
2Gma = |S21e / S12e| (k-(k²-1)1/2),
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BFR182T
SPICE Parameter (Gummel-Poon Model, Berkley-SPICE 2G.6 Syntax):
Transitor Chip Data:
NF = 0.56639 -
ISE = 8.4254 fA
NR = 0.54818 -
ISC = 5.9438 fA
IRB = 0.071955 mA
RC = 1.8159
MJE = 0.40796 -
VTF = 0.34608 V
CJC = 490.25 fF
XCJC = 0.19281 -
VJS = 0.75 V
EG = 1.11 eV
TNOM 300 K
IS = 4.8499 fA
VAF = 21.742 V
NE = 0.91624 -
VAR = 2.2595 V
NC = 0.5641 -
RBM = 2.8263
CJE = 8.8619 fF
TF = 22.72 ps
ITF = 6.5523 mA
VJC = 1.0132 V
TR = 1.7541 ns
MJS = 0-
XTI = 3-
BF = 84.113 -
IKF = 0.14414 A
BR = 10.004 -
IKR = 0.039478 A
RB = 3.4217
RE = 2.1858 -
VJE = 1.0378 V
XTF = 0.43147 -
PTF = 0 deg
MJC = 0.31068 -
CJS = 0 fF
XTB = 0 -
FC = 0.64175
All parameters are ready to use, no scalling is necessary. Extracted on behalf of Infineon Technologies AG by:
Institut für Mobil- und Satellitentechnik (IMST)
Package Equivalent Circuit: L1 = 0.762 nH
L2 = 0.706 nH
L3 = 0.382 nH
C1 = 62 nH
C2 = 84 nH
C3 = 180 nH
C4 = 7fF
C5 =40 fF
C
C
E = 48 fF
EHA07524
Transistor C' L
E'
B'
3
4
C
C
Chip
E
L
1
5
C
B
2
L
C
6
C
1
C
2
C
3
For examples and ready to use parameters
please contact your local Infineon Technologies
distributor or sales office to obtain a Infineon
Technologies CD-ROM or see Internet:
http//www.infineon.com/silicondiscretes
Valid up to 6GHz
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BFR182T
Total power dissipation Ptot = ƒ(TS)
0 20 40 60 80 100 120 °C 150
TS
0
50
100
150
200
mW
300
Ptot
Permissible Pulse Load RthJS = ƒ(tp)
10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 10 0
s
tp
1
10
2
10
3
10
RthJS
D=0.5
0.2
0.1
0.05
0.02
0.01
0.005
0
Permissible Pulse Load
Ptotmax/PtotDC = ƒ(tp)
10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 10 0
s
tp
0
10
1
10
2
10
-
Ptotmax/PtotDC
D = 0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
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BFR182T
Package SC75
Package Outline
Foot Print
Marking Layout
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
1.6
±0.2
0.5
0.10 M0.5
A
0.2
0.2
+0.1
-0.05 1 2
-0.05
3
+0.1
1.6±0.2
0.20 MA
0.7
0.15
10˚
MAX.
0.1 MAX.
±0.1
±0.1
±0.1
0.8
MAX.
10˚
1.15
0.65
0.4
0.4
0.65
0.50.5
Manufacturer
Type code BCR108T
Example
Pin 1
4
8
1.8
0.2 MAX.
0.9
1.4
1.75
0.45
Pin 1
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BFR182T
Published by Infineon Technologies AG,
St.-Martin-Strasse 53,
81669 München
© Infineon Technologies AG 2005.
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be
considered as a guarantee of characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of
non-infringement, regarding circuits, descriptions and charts stated herein.
Information
For further information on technology, delivery terms and conditions and prices
please contact your nearest Infineon Technologies Office (www.Infineon.com).
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Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest Infineon
Technologies Office.
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device or system, or to affect the safety or effectiveness of that device or system.
Life support devices or systems are intended to be implanted in the human body, or
to support and/or maintain and sustain and/or protect human life. If they fail, it is
reasonable to assume that the health of the user or other persons may be endangered.