Teseo-LIV3R Tiny ROM GNSS module Datasheet - preliminary data die standalone positioning receiver IC working simultaneously on multiple constellations (GPS/Glonass/BeiDou/QZSS). The Teseo-LIV3R modules bring the proven accuracy and robustness of Teseo chips to the reach of everyone. The certified module with optimized RF, embedded firmware and the complete evaluation environment save development time, while the compactness and cost-effectiveness of this solution make it ideal for many, especially IoT applications, such as insurance, goods tracking, drones, tolling, antitheft systems, people and pet location, vehicle tracking, emergency calls, fleet management, vehicle sharing, diagnostics and public transportation. Features Simultaneous multi-constellation Within its 9.7x10.1 mm tiny size, Teseo-LIV3R is offering superior accuracy thanks to the on board 26 MHz Temperature Compensated Crystal Oscillator (TCXO) and a reduced Time To First Fix (TTFF) relying on its dedicated 32 KHz Real Time Clock (RTC) oscillator. -163 dBm tracking sensitivity 1.5 m CEP position accuracy 2.1 V to 4.3 V supply voltage range Tiny LCC 18 pin package (9.7x10.1) Operating temperature (-40 C, 85 C) 17 W standby current and 70 mW tracking power consumption Description Teseo-LIV3R also provides server based Real Time Assisted GNSS. Teseo-LIV3R module, being a certified solution, optimizes the time to market of the final applications with a temperature operating range from -40 C to 85 C. The Teseo-LIV3R module is an easy to use Global Navigation Satellite System (GNSS) standalone module, embedding Teseo III single Table 1. Device summary Order code Marking Temperature range [C] Package Packaging Teseo-LIV3R Teseo-LIV3R -40 C, 85 C LCC-18 (9.7 mm x 10.1 mm) Tape and reel November 2018 DS12821 Rev 1 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. 1/29 www.st.com Contents Teseo-LIV3R Contents 1 2 3 4 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1.1 GNSS performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1.2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 1.3 Pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1.4 Pin out description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Supported GNSS constellations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.1 GPS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.2 GLONASS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.3 BeiDou . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Augmentation systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3.1 Satellite-Based augmentation system . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3.2 QZSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3.3 Differential GPS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Assisted GNSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4.1 5 6 RealTime AGNSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 Clock generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 5.1 Temperature-Compensated Crystal Oscillator (TCXO) . . . . . . . . . . . . . . 12 5.2 Real Time Clock (RTC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 I/O interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6.1 UART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6.2 I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 7 FW configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 8 Power mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 2/29 8.1 Hardware standby . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 8.2 Software standby . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 DS12821 Rev 1 Teseo-LIV3R Contents 9 Geofencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 10 Odometer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 11 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 11.1 Parameter conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 11.2 Minimum and maximum values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 11.3 Typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 11.4 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 11.5 Recommended DC operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . 19 12 Mechanical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 13 Shipping information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 13.1 Reels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 13.2 Packing cartons for reels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 13.3 ESD handling precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 13.4 Moisture sensitivity levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 14 Labeling information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 15 Reflow soldering profile 16 ECOPACK(R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Appendix A Reference document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 DS12821 Rev 1 3/29 3 Description Teseo-LIV3R 1 Description 1.1 GNSS performance Receiver specification are the following: GPS L1C/A SBAS L1C/A QZSS L1C/A GLONASS L1OF BeiDou B1 Table 1. GNSS performance Parameter Time To First Fix (1) GNSS GPS & GLONASS GPS & BeiDou Unit Cold start Warm start <32 <25 <36 <29 s Hot start <1.5 <2.5 Tracking -163 -163 Navigation(5) -158 -158 -156 -156 Cold start -147 -147 Warm start -148 -148 Hot start -154 -151 (6),(7) Sensitivity(2),(3),(4) Reacquisition Max fix rate -- 10 10 Hz (8) -- 0.01 -- m/s (9) Velocity accuracy -- 0.1 -- m/s Heading accuracy(8) -- 0.01 -- accuracy(9) -- 2.3 -- Velocity accuracy Heading (10) <1.5 -- Autonomous SBAS <1.5(10) Accuracy of time pulse RMS 99% -- -- Frequency of time pulse -- -- -- -- Dynamic(12) <4.5g <4g -- Altitude 100000 100000 m Velocity 600 600 m/s Altitude 18000 18000 m Velocity 515 515 m/s limits(11) Operational ITAR limits(13) 1. All satellites at -130 dBm - TTFF at 50%. 2. Demonstrated with a good external LNA. DS12821 Rev 1 <1.8 (10) Horizontal position accuracy(10) Operational 4/29 dBm m Teseo-LIV3R Description 3. For hot start, all sats have the same signal level except one (pilot sat at -145 dBm). 4. For BEIDOU tracking sensitivity refers to MEO sats. For GEO the tracking sensitivity is -151 dBm 5. Configurable Value. 6. All satellites at same signal level. 7. Minimum level to get valid fix after reacquisition. 8. 50% at 30 m/s - linear path. 9. 50% at 0.5 g - shape path. 10. CEP 50%, 24h static, Roof Antenna. 11. Verified the limit checking the fix availability. 12. Special configuration for high dynamic scenario. 13. To be compliant with USA International Traffic in Arms Regulations (ITAR), when both the ITAR altitude limit and the ITAR velocity limit are overpass taken the Teseo-LIV3R stops providing NMEA stream. 1.2 Block diagram Figure 1. Teseo-LIV3R block schematic DS12821 Rev 1 5/29 27 Description 1.3 Teseo-LIV3R Pin configuration Figure 2. Teseo-LIV3R pin layout 1.4 Pin out description Table 2. Teseo-LIV3R pin out description 6/29 No Name I/O Description 1 GND Ground 2 TX O Serial Port Tx (if not used, must be left floating) 3 RX I Serial Port Rx 4 1PPS O Time pulse (1PPS) (if not used, must be left floating) 5 Wake-Up I External Interrupt Pin (if not used, must be left floating) 6 Vbatt I Backup voltage supply 7 VCC_IO I IO Supply Voltage (3.3 V) 8 VCC I Supply voltage (from 2.1 V to 4.2 V) 9 SYS_RSTn I RESET_N (if not used, must be left floating) 10 GND_RF I Ground 11 RF_IN I GNSS signal Input 12 GND_RF Ground 13 Ant_OFF O External Antenna Control (if not used, must be left floating) 14 VCC_RF O Output Voltage RF section (if not used, must be left floating) Note: Can be used to supply external active antenna 15 Reserved I Reserved (must be left floating) 16 SDA I/O Ground Ground I2C Data (if not used, must be left floating) DS12821 Rev 1 Teseo-LIV3R Description Table 2. Teseo-LIV3R pin out description (continued) No Name I/O 17 SCL I/O 18 Reserved I Description I2C Clock (if not used, must be left floating) Reserved (must be left floating) DS12821 Rev 1 7/29 27 Supported GNSS constellations 2 Teseo-LIV3R Supported GNSS constellations The embedded FW supports the following GNSS constellations (GPS, GLONASS, BEIDOU and QZSS). The user can select what the application needs by FW configuration. GPS+GLONASS are selected by default. 2.1 GPS The Teseo-LIV3R GNSS module is designed to receive and to track the L1C/A signals provided at 1575.42 MHz by the Global Positioning System (GPS). The Teseo-LIV3R can receive and process GPS concurrently with GLONASS or BeiDou (the last two are mutually exclusive). 2.2 GLONASS The Teseo-LIV3R module can receive and process GLONASS concurrently with GPS. The Russian GLONASS satellite system (; GLObal NAvigation Satellite System) is an alternative to US's GPS. 2.3 BeiDou The Teseo-LIV3R module can receive and process BeiDou concurrently with GPS. B1 signals provided at 1561.098 MHz by the BeiDou Navigation Satellite System can be tracked by Teseo-LIV3R positioning modules. The ability to receive and track BeiDou B1 satellite signals in conjunction with GPS results in higher coverage, improved reliability and better accuracy especially in the difficult urban environment of the big far east cities like Shanghai, Taipei, and Singapore. 8/29 DS12821 Rev 1 Teseo-LIV3R Augmentation systems 3 Augmentation systems 3.1 Satellite-Based augmentation system Teseo-LIV3R supports SBAS. SBAS is a Wide Area Differential GPS (WADGPS). It is a system which provides differential GPS corrections data; SBAS includes the WAAS within the United States, the EGNOS within Europe, the Multifunctional Transport Satellite (MTSAT)-based MSAS within Japan and Southeast Asia, and the GPS and GEO Augmented Navigation (GAGAN) system in India. SBAS data correction is used in the GNSS algorithm to provide better position estimation. The overall SBAS differential correction mechanism can be conceived and built in 2 phases: The "Acquire and Tracking" phase The "Decoding" phase The "Acquire and Track" phase relates to the capacity of the acquisition engine to reliably track the configured SBAS satellite; during decoding phase the SBAS message can be decoded to fetch the differential corrections. The current longitude limits for each service are: WAAS -180 to -25 degrees EGNOS -25 degrees to +50 degrees GAGAN +50 degrees to +100 degrees MSAS +100 degrees to +180 degrees The Teseo-LIV3R software with SBAS capability implements a command interface at the NMEA level to allow interaction with the SBAS library. It supports commands to enable/disable the SBAS functionality. 3.2 QZSS The Quasi-Zenith Satellite System (QZSS) is a Japanese regional communication service and positioning information for the mobile environment in the GPS L1C/A band. QZSS in conjunction with GPS signals provides GNSS augmentation service for the Pacific region covering Japan and Australia. QZSS satellites are placed in a periodic Highly Elliptical Orbit (HEO): these orbits allow the satellites to "dwell" for more than 12 hours a day at an elevation above 70 (it means that they appear almost overhead most of the time). 3.3 Differential GPS Teseo-LIV3R supports Differential-GPS data according to RTCM (Radio Technical Commission for Maritime Services) 2.3. Differential-GPS data improves position accuracy. Teseo-LIV3R supports the following RTCM messages. DS12821 Rev 1 9/29 27 Augmentation systems Teseo-LIV3R Table 3. Supported RTCM message on Teseo-LIV3R Message Type 10/29 Description 1 Differential GPS Corrections 9 GPS Partial Correction Set 31 Differential GLONASS Corrections 34 GLONASS Partial Correction Set DS12821 Rev 1 Teseo-LIV3R 4 Assisted GNSS Assisted GNSS GNSS receivers need accurate satellite position data from at least four satellites to produce a fix. Accurate satellite data -ephemeris data- is valid for 4 hours only for GPS and 30 minutes only for GLONASS. After that time, a receiver must download new ephemeris data. Ephemeris download can take from dozens of seconds to several minutes, hours or may fail to download. Assisted-GNSS is a mechanism to provide ephemeris assistance from external source, this reduces considerably the time to get fix especially in critical environments when the ephemeris download time could be very long. Teseo-LIV3R supports the Reat-Time Assisted GNSS. 4.1 RealTime AGNSS RealTime Assisted GNSS (RT-AGNSS) is a server based Assisted GNSS solution, therefore it requires a network connection to download assistance data from the server. RT-AGNSS works by downloading from an assistance server the real time ephemeris data. Server access is allowed thanks to internal keyword provided by Teseo-LIV3R to the Host processor and the acquired real-time data has to be provided to Teseo-LIV3R. Proprietary NMEA commands are supported on Teseo-LIV3R to acquire the credential access to the external server and to inject the data to Teseo-LIV3R. STMicroelectronics partner provides available server solution access for free on TeseoLIV3R solution. RealTime A-GNSS allows continuous real-time satellite position determination. DS12821 Rev 1 11/29 27 Clock generation Teseo-LIV3R 5 Clock generation 5.1 Temperature-Compensated Crystal Oscillator (TCXO) Highly stable 26 MHz oscillator controls the down conversion process in RF block of the Teseo-LIV3R. Characteristics of this component are important factors for higher sensitivity to maximize performance especially in weak-signal environments, as well as to minimize TTFF (Time To First Fix) and improve navigation stability. 5.2 Real Time Clock (RTC) This is an always-on power domain dedicated to RTC logic (backup system) with 32 KB SRAM and supplied with a dedicated voltage regulator. The RTC provides a high resolution clock which can be used for GPS. It keeps the time when the system is inactive and it is internally used to wake up the system when in low power mode. It has a clock trimming feature to compensate for the accuracy of the 32.768 KHz crystal and a secured time update. 12/29 DS12821 Rev 1 Teseo-LIV3R 6 I/O interfaces I/O interfaces Teseo-LIV3R supports two I/O interfaces: UART I2C Both these interfaces support NMEA protocol. 6.1 UART The Universal Asynchronous Receiver/Transmitter (UART) supports much of the functionality of the industry-standard 16C650 UART. The UART performs serial-to-parallel conversion on data asynchronously received from a peripheral device on RX0 pin, and parallel-to-serial conversion on data written by CPU for transmission on TX0 pin. The transmit and receive paths are buffered with internal FIFO memories allowing up to 64 data byte for transmission, and 64 data byte with 4-bit status (break, frame, parity, and overrun) for receive. 6.2 I2C Teseo-LIV3R includes a slave I2C interface configurable; I2C is a two-wire communication interface invented by Philips Semiconductor. Unlike all other interfaces, I2C is not able to communicate in full-duplex mode; it uses only two bidirectional open-drain lines, Serial Data Line on pin SDA and Serial Clock Line on pin SCL, pulled up with resistors. Teseo-LIV3R receiver always acts as slave and it cannot initiate data transmission on the bus; host has to periodically pull the receiver to check about data availability. The main features are: Normal speed (100 KHz) and Fast speed (400 KHz) supported I2C-slave address configurable using the firmware configurator DS12821 Rev 1 13/29 27 FW configuration 7 Teseo-LIV3R FW configuration All configuration parameters are grouped in a data block. Each field is addressed by a unique ID. The IDs are made by three digits: the most significant one represents the parameter type and the others are used to identify different parameters of the same type. Default setting of configuration data block is hard coded into the binary image file. A new configuration can be built using the PC Tool Teseo-Suite, available at www.st.com or using runtime configuration commands raised by the host. Teseo-LIV3R firmware configuration is maintained until voltage supply on VBAT pin (6) is provided. 14/29 DS12821 Rev 1 Teseo-LIV3R 8 Power mode Power mode Standby mode, is the mode where only low power backup domain is running. It means VBAT must be always maintained. It allows to have very low current consumption and fast GNSS reacquisition at the end of the standby time due to RTC. Teseo-LIV3R offers two different ways of standby: 8.1 Hardware standby Software standby Hardware standby This standby is ensured by switching OFF VCC (pin 6) and VCC_IO (pin 7) supplies and setting SYS_RESETn (pin 9) to 0 V. It can be activated asynchronously from GNSS binary with one GPIO switching OFF the supplies from a host. During this standby only VBAT (pin 6) is kept ON. It ensures a current below 6 A. During this standby mode VCC_RF (pin 14) is OFF. 8.2 Software standby Software standby is activated by the internal binary. Software standby can be: Host driven standby: where the host sends a NMEA commands to force Teseo-LIV3R into standby; host can woken up by Teseo-LIV3R using the Wakeup pin (pin 5); Periodic standby: where Teseo-LIV3R enters and exits from standby using internal RTC. Periodic fixes are from 5 seconds up to 24 hours between 2 fixes. It ensures a current below 12 A on Teseo-LIV3R. Be careful that VCC_RF is ON during this standby. In case of active antenna or external LNA, it is important to switch them OFF. DS12821 Rev 1 15/29 27 Geofencing 9 Teseo-LIV3R Geofencing Geofence feature allows the Teseo-LIV3R receiver to raise an autonomous NMEA message when the resolved GNSS position is close to a specific circle, entering or exiting from a circle. Teseo-LIV3R receiver supports at least 8 circular areas. Geofencing alarm can be notified over proprietary NMEA message. Geofencing can be configured and enabled in the firmware configurator or using the specific geofencing configuration command. 16/29 DS12821 Rev 1 Teseo-LIV3R 10 Odometer Odometer Teseo-LIV3Rreceiver supports Odometer feature. Odometer provides information on the traveled distance using only positioning information. Odometer can be configured using specific odometer commands during the runtime. While enabled the odometer reports the ground distance from the last reset. Odometer is also able to raise an autonomous message alarm when a programmed distance is reached. DS12821 Rev 1 17/29 27 Electrical characteristics Teseo-LIV3R 11 Electrical characteristics 11.1 Parameter conditions Unless otherwise specified, all voltages are referred to GND. 11.2 Minimum and maximum values Unless otherwise specified the minimum and maximum values are guaranteed in the worst conditions of ambient temperature, supply voltage and frequencies by tests in production on 100% of the devices with an ambient temperature at Tc = 25 C. 11.3 Typical values Unless otherwise specified, typical data are based on Tc = 25 C, VCC = 3.3 V, VCC_IO = 3.3 V. They are given only as design guidelines and are not tested. Unless otherwise specified, all typical curves are given only as design guidelines and are not tested. 11.4 Absolute maximum ratings This product contains devices to protect the inputs against damage due to high static voltages, however it is advisable to take normal precautions to avoid application of any voltage higher than the specified maximum rated voltages. Table 4. Voltage characteristics Symbol Parameter Min Max Unit VCC Digital supply voltage 2.1 4.3 V VBAT Backup LDO input supply voltage 2.1 4.3 V Min Max Unit -40 85 C Table 5. Thermal characteristics Symbol Toper 18/29 Parameter Operative ambient temperature DS12821 Rev 1 Teseo-LIV3R Electrical characteristics Table 6. Power consumption Symbol Pw PwStandby 11.5 Parameter Test condition Power consumption in standard condition Power consumption STANDBY mode Typ Unit G2 = GPS only; Tc = 25 C; VCC = 2.1 V; VCC_IO = 3.3 V TBC mW G2 = GPS/Glonass; Tc = 25 C; VCC = 2.1 V; VCC_IO = 3.3 V TBC mW G2 = GPS/Beidou; Tc = 25 C; VCC = 2.1 V; VCC_IO = 3.3 V TBC mW RTC running = 32.768 KHz; Tc = 25 C; VCC = VCC_IO = 0 V Vbat = 3.3 V TBC W Recommended DC operating conditions Table 7. Recommended DC operating conditions Symbol Min Typ Max Unit Power supply pins 2.1 3.3 4.3 V VCC_Bat Power supply pins for backup internal logic 2.1 3.3 4.3 V VCC_IO IO Supply Voltage 3.0 3.3 3.60 V VCC Parameter DS12821 Rev 1 19/29 27 Mechanical specifications 12 Teseo-LIV3R Mechanical specifications Figure 3. Teseo-LIV3R mechanical specification 20/29 DS12821 Rev 1 Teseo-LIV3R 13 Shipping information Shipping information Teseo-LIV3R is delivered as reeled tapes. For protection from physical damage, the reels are individually packed in cartons. 13.1 Reels Teseo-LIV3R reel specification is as shown in Figure 4 Figure 4. Carrier tape Figure 5. Teseo-LIV3R orientation DS12821 Rev 1 21/29 27 Shipping information Teseo-LIV3R Figure 6. Cover tape Figure 7. Plastic reel 22/29 DS12821 Rev 1 Teseo-LIV3R Shipping information Figure 8. PB band 13.2 Packing cartons for reels To avoid damage each Teseo-LIV3R reel has a dedicated carton box of 340 x 340 x 38 mm. 13.3 ESD handling precautions Teseo-LIV3R module is Electrostatic Sensitive Device (ESD). Observe precautions for handling! Failure to observe these precautions can result in severe damage to the GNSS receiver. GNSS receivers are Electrostatic Sensitive Devices (ESD) and require special precautions when handling. Particular care must be exercised when handling patch antennas, due to the risk of electrostatic charges. 13.4 Moisture sensitivity levels The Moisture Sensitivity Level (MSL) relates to the packaging and handling precautions required. Teseo-LIV3R modules are rated at MSL level 3 (three). DS12821 Rev 1 23/29 27 Labeling information 14 Teseo-LIV3R Labeling information The labeling of Teseo-LIV3R reports product information. Information layout of the product is shown in Figure 9. Figure 9. Labeling information of Teseo-LIV3R Information description are reported in Table 8. Table 8. Labeling information description Items 24/29 Description Internal production code Information code related only to the production line QR Sample code QR Sample code used for traceability information of any parts Product Name Official product name for Ordering Code Pin 1 hole Hole on the shield to identify Pin 1 DS12821 Rev 1 Teseo-LIV3R 15 Reflow soldering profile Reflow soldering profile The Teseo-LIV3R is a high temperature strength surface mount GNSS module supplied on a 18 pin, 6-layer PCB. The final assembly recommended reflow profiles are indicated here below. Soldering phase has to be executed with care: in order to avoid undesired melting phenomenon, particular attention has to be taken on the set up of the peak temperature. Some suggestions for the temperature profile based on following recommendations. Table 9. Soldering profile values Profile feature PB-free assembly Average ramp-up rate (TSMAX to Tp) 3 C/sec max Preheat: - Temperature min (TSmin) - Temperature max (TSmax) - Time (tSmin to tSmax) (tS) 150 C 200 C 60-100 sec Time maintained above: - Temperature (TL) - Time (tL) 217 C 60-70 sec Peak temperature (TP) 245 +/- 5 C Time within 5 C of actual peak temperature (TP) 10-20 sec Ramp-down rate 6 C/sec Time from 25 C to peak temperature 8 minute max. Figure 10. Soldering profiles DS12821 Rev 1 25/29 27 ECOPACK(R) 16 Teseo-LIV3R ECOPACK(R) In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. 26/29 DS12821 Rev 1 Teseo-LIV3R Reference document Appendix A 1. Reference document Teseo Suite - data brief (DB3224, DocID030398) DS12821 Rev 1 27/29 27 Revision history Teseo-LIV3R Revision history Table 10. Revision history 28/29 Date Revision 15-Nov-2018 1 Changes Initial release. DS12821 Rev 1 Teseo-LIV3R IMPORTANT NOTICE - PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST's terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers' products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. (c) 2018 STMicroelectronics - All rights reserved DS12821 Rev 1 29/29 29