Rev. 1.6 December 2010 www.aosmd.com Page 1 of 17
AOZ1022
EZBuck™ 3A Synchronous Buck Regulator
General Description
The AOZ1022 is a synchro nous high efficiency, simple
to use, 3A buck regulator. The AOZ1022 works from a
4.5V to 16V input voltage range, and provides up to 3A
of continuous output current with an output voltage
adjustable down to 0.8V.
The AOZ1022 comes in a DFN 5x4 and an EPAD SO-8
package and is rated over a -40°C to +85°C ambient
temperature range.
Features
4.5V to 16V operating input voltage range
Synchronous rectification: 100m internal high-side
switch and 20m Internal low-side switch
High efficiency: up to 95%
Internal soft start
Active high power good state
Output voltage adjustable to 0.8V
3A continuous output current
Fixed 500kHz PWM operatio n
Cycle-by-cycle current limit
Pre-bias start-up
Short-circuit protection
Thermal shutdown
Small size DFN 5x4 and EPAD SO-8 package
Applications
Point of load DC-DC conversion
PCIe graphics cards
Set top boxes
DVD drives and HDD
LCD panels
Cable modems
Telecom/networking/datacom equipment
Typical Application
Figure 1. 3.3V/3A Synchronous Buck Regulator
LX
PGOOD
VIN
VIN
VOUT
5V DC
FB
PGND
EN
COMP
AGND
C2, C3
22µF Ceramic
R1
R3
R2
CC
RC
C1
22µF
Ceramic
L1 4.7µH
AOZ1022
AOZ1022
Rev. 1.6 December 2010 www.aosmd.com Page 2 of 17
Ordering Information
AOS Green Products use reduced levels of Halogens, and are also RoHS compliant.
Please visit www.aosmd.com/web/quality/rohs_compliant.jsp for additional informatio n.
Pin Configuration
Pin Description
Part Number Ambient Temperature Range Package Environmental
AOZ1022DI -40°C to +85°C DFN 5x4
AOZ1022 -40°C to +85°C EPAD S0-8 Green
PGND
VIN
AGND
FB
PGOOD
LX
EN
COMP
5x4 DFN-8
(Top View)
1
2
3
4
8
7
6
5
GND
LX
1
2
3
4
PGND
VIN
AGND
FB
Exposed Pad SO-8
(Top View)
PAD
(LX)
NC
PGOOD
EN
COMP
8
7
6
5
Pin Number
Pin Name Pin Function5x4 DFN-8 Exposed
Pad SO-8
1 1 PGND Power ground. PGND needs to be electrical ly connected to AGND.
22V
IN Supply voltage input. When VIN rises above the UVLO threshold and EN is logic high,
the device starts up.
3 3 AGND Analog ground. AGND is the reference point for controller section. AGND needs to
be electrically connected to PGND.
4 4 FB Feedback input. The FB pin is used to set the output voltage via a resistor divider
between the output and AGND.
5 5 COMP External loop compensation pin. Connect a RC network between COMP and AGND
to compensate the control loop.
6 6 EN Enable pin. Pull EN to logic high to enable the device. Pull EN to logic low to disable
the device. if on/off control is not needed, connect it to VIN and do not leave it open.
7 Pad LX Switching node. LX is the drain of the internal PFET. LX is used as the thermal pad of
the power stage.
8 7 PGOOD Power Good Output. PGOOD is an open-drain output that indicates the status of out-
put voltage. PGOOD is pulled low when output is below 90% of the normal regula-
tion.
8 NC No Connect. Pin 8 is not internally connected.
Rev. 1.6 December 2010 www.aosmd.com Page 3 of 17
AOZ1022
Block Diagram
Absolute Maximum Ratings
Exceeding the Absolute Maximum Ratings may damage the
device.
Note:
1. Devices are inherently ESD sensitive, handling precautions are
required. Human body model rating: 1.5k in series with 100pF.
Recommended Operating Conditions
The device is not guaranteed to operate beyond the Maximum
Recommended Operating Conditions.
Note:
2. The value of ΘJA is measured with the device mounted on
1-in2 FR-4 board with 2oz. Copper, in a still air environment with
TA = 25°C. The value in any given application depends on the
user's specific board design.
Oscillator
AGND PGND
VIN
EN
FB
COMP
PGOOD
LX
OTP
Internal
+5V
ILimit
PWM
Control
Logic
5V LDO
Regulator
UVLO
& POR
Softstart
Reference
& Bias
0.8V
Q1
Q2
PWM
Comp
Level
Shifter
+
FET
Driver
ISen
EAmp
0.2V
+
+
+
+
+
0.72V
+
Frequency
Foldback
Comparator
Parameter Rating
Supply Voltage (VIN) 18V
LX to AGND -0.7V to VIN+0.3V
EN to AGND -0.3V to VIN+0.3V
FB to AGND -0.3V to 6V
COMP to AGND -0.3V to 6V
PGND to AGND -0.3V to 0.3V
PGOOD to AGND -0.3V to 6V
Junction Temperature (TJ) +150°C
Storage Temperature (TS) -65°C to +150°C
ESD Rating(1) 2.0kV
Parameter Rating
Supply Voltage (VIN) 4.5V to 18V
Output Voltage Range 0.8V to VIN
Ambient Temperature (TA) -40°C to +85°C
Package Thermal Resistance
Exposed Pad SO-8 (ΘJA)(2) 50°C/W
AOZ1022
Rev. 1.6 December 2010 www.aosmd.com Page 4 of 17
Electrical Characteristics
TA = 25°C, VIN = VEN = 12V, VOUT = 3.3V unless otherwise specified.(3)
Note:
3. Specifications in BOLD indicate an ambient temperature range of -40°C to +85°C. These specifications are guaranteed by design.
Symbol Parameter Conditions Min. Typ. Max. Units
VIN Supply Voltage 4.5 16 V
VUVLO Input Under-Voltage Lockout Threshold VIN Rising
VIN Falling
4.1
3.7 V
IIN Supply Current (Quiescent) IOUT = 0, VFB = 1.2V, VEN > 1.2V 1.6 2.5 mA
IOFF Shutdown Supply Current VEN = 0V 320µA
VFB Feedback Voltage TA = 25°C 0.788 0.8 0.812 V
Load Regulation 0.5 %
Line Regulation 1%
IFB Feedback Voltage Input Current 200 nA
ENABLE
VEN EN Input Threshold Off Threshold
On Threshold 2
0.6 V
VHYS EN Input Hysteresis 100 mV
MODULATOR
fOFrequency 350 500 600 kHz
DMAX Maximum Duty Cycle 100 %
DMIN Minimum Duty Cycle 6%
GVEA Error Amplifier Voltage Gain 500 V / V
GEA Error Amplifier T r ansconductance 200 µA / V
PROTECTION
ILIM Current Limit 4.0 5.0 A
Over-Temperature Shutdown Limit TJ Rising
TJ Falling 150
100 °C
tSS Soft Start Interva l 3 5 7 ms
POWER GOOD
VOLPG PGOOD LOW Voltage IOL = 1mA 0.5 V
PGOOD Leakage A
VPGL PGOOD Threshold Voltage 87 90 92 %VO
PGOOD Threshold Voltage Hysteresis 3 %
tPG PGOOD Delay Time 128 µs
PWM OUTPUT STAGE
High-Side Switch On-Resistance VIN = 12V
VIN = 5V 97
166 130
200 m
Low-Side Switch On-Resistance VIN = 12V
VIN = 5V 18
30 23
36 m
AOZ1022
Rev. 1.6 December 2010 www.aosmd.com Page 5 of 17
Light Load Operation Full Load (CCM) Operation
Startup to Full Load Short Circuit Protection
50% to 100% Load Transient Short Circuit Recovery
1s/div1s/div
1ms/div
100s/div
Vin ripple
0.1V/div
Vo ripple
20mV/div
Vo
2V/div
Vin
10V/div
lin
1A/div
Vo Ripple
100mV/div
lo
1A/div
IL
1A/div
VLX
10V/div
Vin ripple
0.1V/div
Vo ripple
20mV/div
IL
1A/div
VLX
10V/div
50µs/div
LX
10V/div
Vo
2V/div
IL
2A/div
1ms/div
LX
10V/div
Vo
2V/div
IL
2A/div
Typical Performance Characteristics
Circuit of Figure 1. TA = 25°C, VIN = VEN = 12V, VOUT = 3.3V unless otherwise specified.
AOZ1022
Rev. 1.6 December 2010 www.aosmd.com Page 6 of 17
Efficiency
Thermal Derating Curves
AOZ1022 Efficiency
Efficiency (V
IN
= 12V) vs. Load Current
75
80
70
65
85
90
95 5.0V OUTPUT
3.3V OUTPUT
1.8V OUTPUT
1.2V OUTPUT
1.8V
3.3V OUTPUT
100
00.5 1.0 1.5 2.0 2.5 3.0
Load Current (A)
Efficieny (%)
AOZ1022 Efficiency
Efficiency (V
IN
= 5V) vs. Load Current
75
80
70
65
85
90
95
100
00.5 1.0 1.5 2.0 2.5 3.0
Load Current (A)
Efficieny (%)
Derating Curve at 5V/6V Input
1.2V, 1.8V OUTPUT
3.3V
OUTPUT
Ambient Temperature (T
A
)
Output Current (I
O
)
5
4
3
2
1
0
25 35 45 55 65 75 85
Derating Curve at 12 Input
1.2V, 1.8V, 3.3V, 5.0V OUTPUT
Ambient Temperature (T
A
)
Output Current (I
O
)
3.3
3.2
3.1
3.0
2.9
2.8
25 35 45 55 65 75 85
AOZ1022
Rev. 1.6 December 2010 www.aosmd.com Page 7 of 17
Detailed Description
The AOZ1022 is a current-mode step down regulator
with integrated high-side PMOS switch and a low-side
NMOS switch. It operates from a 4.5V to 16V input
voltage range and supplies up to 3A of load curre nt.
The duty cycle can be adjusted from 6% to 100%
allowing a wide range of output voltage. Features include
enable control, Power-On Reset, input under voltage
lockout, output over voltage protection, active high power
good state, fixed internal soft-start and thermal shut
down.
Enable and Soft Start
The AOZ1022 has an internal soft start feature to limit
in-rush current and ensure the output voltage ramps up
smoothly to regulation voltage. A soft start process
begins when the input voltage rises to 4.1V and voltage
on EN pin is HIGH. In the soft start process, the output
voltage is typically ramped to regulation voltage in 4ms.
The 4ms soft start time is set internally.
The EN pin of the AOZ1022 is active HIGH. Connect the
EN pin to VIN if the enable function is not used.
Pulling EN to ground will disable the AOZ1022. Do not
leave it open. The voltage on the EN pin must be above
2V to enable the AOZ1022. When vo ltage on the EN
pin falls below 0.6V, the AOZ1022 is disabled . If an appli-
cation circuit requires the AOZ1022 to be disabled, an
open drain or open collector circuit should be used to
interface to the EN pin.
Power Good
The output of Power-Good is an open drain N-channel
MOSFET which supplies an active high power good
stage. A pull- up r esistor (R 3) should connect this pin to a
DC power trail with maximum voltage of 6V. The
AOZ1022 monitors the FB voltage. When FB voltage is
lower than 90% of the norma l voltage, N-channel
MOSFET turns on and the Power-Good pin is pulle d low.
This indicates the power is abno rmal.
Steady-State Operation
Under steady-state conditions, the converter operates in
fixed frequency and Continuous-Conduction Mode
(CCM).
The AOZ1022 integrates an internal P-MOSFET as the
high-side switch. In ductor current is sensed by amplifying
the voltage drop acro ss the drain to source of the high
side power MOSFET. Output voltage is divided down by
the external voltage divider at the FB pin. The difference
of the FB pin voltage and reference is amplified by the
internal tran sconductance error amplifier. The error
voltage, which shows on the COMP pin, is compared
against the current signal, which is sum of indu ctor
current signal and ramp compensation signal, at the
PWM comparator input. If the current signal is less than
the error voltage, the internal high-side switch is on. The
inductor current fl ows from the input thro ugh the in ductor
to the output. When the current signal exceeds the error
voltage, the high-side switch is off. The inductor current
is freewheeling through the inter nal low-side N-M OSFET
switch to output. The internal adaptive FET driver
guarantees no turn on overlap of both high-side and
low-side switch.
Comparing with regulators using freewheeling Schottky
diodes, the AOZ1022 uses freewheeling NMOSFET to
realize synchronous rectification. It greatly improves the
converter efficien cy and reduces power loss in the
low-side switch.
The AOZ1022 uses a P-Channel MOSFET as the high-
side switch. It saves the bootstrap capacitor normally
seen in a circuit which is using an NMOS switch. It allows
100% turn-on of the high-side switch to achieve linear
regulation mode of operatio n. The minimum volt age drop
from VIN to VO is the load current x DC resistance of
MOSFET + DC resistance of buck inductor. It can be
calculated by the equation below:
where;
VO_MAX is the maximum output voltage,
VIN is the input voltage from 4.5V to 16V,
IO is the output current from 0A to 3A, and
RDS(ON) is the on resi stance of internal MOSFET, the value is
between 97m and 200m depe nding on input voltage and
junction temperature.
Switching Frequency
The AOZ1022 switching frequency is fixed and set by
an internal oscillator. The practical switching frequency
could range from 350kHz to 600kHz due to device
variation.
Output Voltage Programming
Output voltage can be set by feeding back the output to
the FB pin by using a resistor divider network. See the
application circuit shown in Figure 1. The resistor divider
network includes R1 and R2. Usually, a design is started
by picking a fixed R2 value and calculating the required
R1 with equation on the next page:
VO_MAX VIN IORDS ON()
×=
VO0.8 1 R1
R2
-------
+
⎝⎠
⎜⎟
⎛⎞
×=
AOZ1022
Rev. 1.6 December 2010 www.aosmd.com Page 8 of 17
Some standard value of R1, R2 and most used output
voltage values ar e listed in Table 1.
The combination of R1 and R2 should be large enough to
avoid drawing excessive current from the output, which
will cause power loss.
Since the switch duty cycle can be as high as 100%, the
maximum output voltage can be set as high as the input
voltage minus the voltage drop on upper PMOS and
inductor.
Protection Features
The AOZ1022 has multip le protection features to preven t
system circuit damage under abnormal conditions.
Over Current Protection (OCP)
The sensed inductor current signal is also used for
over current pr ot ect i on . Sinc e the A OZ 1 02 2 em p loys
peak current mode control, the COMP pin voltage is
proportional to the peak inductor current. The COMP pin
voltage is limited to be betwee n 0.4V and 2.5V intern ally.
The peak inductor current is automatically limited cycle
by cycle.
When the output is shorted to ground under fault
conditions, the inductor current decays very slow during
a switching cycle beca us e of VO = 0V. To prevent cata-
strophic failure, a secondary current limit is designed
inside the AOZ1022. The measured inductor current is
compared against a preset voltage which represents the
current limit, between 3.5A and 5.0A. When the output
current is more than current limit, the high side switch will
be turned off. The converter will initiate a soft start once
the over-current condition is resolved.
Power-On Reset (POR)
A power-on reset circuit monitors the input voltage.
When the input voltage exceeds 4.1V, the converter
starts operation. When input voltage falls below 3.7V,
the converter shuts down.
Thermal Protection
An internal temperature sensor monitors the junction
temperature. It shut s down the inter nal control circuit and
high side PMOS if the junction temperature exceeds
150°C. The regulator will restart automatically under the
control of soft-start circui t when the junction temperature
decreases to 100°C.
Application Information
The basic AOZ1022 application circuit is show in
Figure 1. Component selection is explained below.
Input Capacitor
The input cap acitor must be connected to the VIN pin and
PGND pin of AOZ1022 to maintain steady input voltage
and filter out the pulsing inp ut curr ent. The vo ltage rating
of input capacitor must be greater than maximum input
voltage plus ripple voltage.
The input ripple voltage can be approximated by equa-
tion below:
Since the input current is discontinuous in a buck
converter, the current stress on the input capacitor is
another conc er n wh en sele ctin g th e ca pacitor. For a
buck circuit, the RMS value of input capacitor current
can be calculated by:
if we let m equal the conversion ratio:
The relation between the input capacitor RMS current
and voltage conversion ratio is calculated and shown in
Figure 2 on the next p age. It can be seen that when VO is
half of VIN, CIN is under the worst current stress. The
worst current stress on CIN is 0.5 x IO.
For reliable operation and best performance, the input
capacitors must have current rating higher than ICIN_RMS
at worst operating conditions. Ceramic capacitors are
preferred for input capacitors because of their low ESR
and high current rating. Depend ing on the application
circuits, other low ESR tantalum capacitor may also be
used. When selecting ceramic capacitors, X5R or X7R
type dielectric ceramic capacitors should be used for
their better temp er ature and voltage charac te ristics.
VO (V) R1 (k) R2 (k)
0.8 1.0 open
1.2 4.99 10
1.5 10 11.5
1.8 12.7 10.2
2.5 21.5 10
3.3 31.1 10
5.0 52.3 10
ΔVIN
IO
fC
IN
×
----------------- 1VO
VIN
---------
⎝⎠
⎜⎟
⎛⎞
VO
VIN
---------
××=
ICIN_RMS IO
VO
VIN
---------1VO
VIN
---------
⎝⎠
⎜⎟
⎛⎞
×=
VO
VIN
---------m=
AOZ1022
Rev. 1.6 December 2010 www.aosmd.com Page 9 of 17
Figure 2. ICIN vs. Voltage Conversion Ratio
Note that the ripple current rating from capacitor manu-
factures are based on certain amount of life time.
Further de-rating may be necessary in practical design.
Inductor
The inductor is used to supply constant current to output
when it is driven by a switching voltage. For given input
and output voltage, induct ance and switching frequency
together decide the inductor ripple current, which is:
The peak inductor current is:
High inductance gives low inductor ripple current but
requires larger size inductor to avoid saturation. Low
ripple current reduces inductor core losses. It also
reduces RMS current through inductor and switches,
which results in less conduction loss. Usually, peak to
peak ripple current on inductor is designed to be 20%
to 30% of output current.
When selecting the inductor, make sure it is able to
handle the peak current without saturation even at the
highest operating temperature.
The inductor takes the highest current in a buck circuit.
The conduction loss on inductor need to be checked for
thermal and efficiency requ ire m en ts.
Surface mount in ductors in diff erent shape and style s are
available from Coilcraft, Elytone and Murata. Shielded
inductors are small and radiate less EMI noise. But they
cost more than unshielded inductors. The choice
depends on EMI requirement, price and size.
Output Capacitor
The output cap acitor is selected based on the DC output
voltage rating, output ripple voltage specification and
ripple current rating.
The selected output capacitor must have a higher rated
voltage specification than the maximum desired output
voltage including ripple. De-rating needs to be consid-
ered for long term reliability.
Output ripple voltage specification is another important
factor for selecting the output capacitor. In a buck con-
verter circuit, ou tp ut ripple voltage is determi ne d by
inductor value, switching frequency, output capacitor
value and ESR. It can be calculated by the equation
below:
where,
CO is output capacitor value, and
ESRCO is the equivalent series resistance of the output
capacitor.
When low ESR ceramic capacitor is used as output
capacitor , th e impedance of the capacitor at the switchin g
frequency dominates. Output ripple is mainly caused by
capacitor value and inductor ripple current. The output
ripple voltage calculation can be simplified to:
If the impedance of ESR at switching frequency
dominates, the output ripple voltage is mainly decided
by capacitor ESR and inductor ripple current. The output
ripple voltage calculation can be further simplified to :
For lower output ripple voltage across the entire operat-
ing temperature range, X5R or X7R dielectric type of
ceramic, or other low ESR t antalu m are recommended to
be used as output capacitors.
In a buck converter , output capacitor current is continuous.
The RMS current of output capacitor is decided by the
peak to peak inductor ripple current. It can be calculated
by:
Usually, the ripple current rating of the output cap acitor is
a smaller issue because of the low current stress. When
the buck inductor is selected to be very small and induc-
0
0.1
0.2
0.3
0.4
0.5
0 0.5 1
m
I
CIN_RMS
(m)
I
O
ΔIL
VO
fL×
-----------1VO
VIN
---------
⎝⎠
⎜⎟
⎛⎞
×=
ILpeak IO
ΔIL
2
--------
+=
ΔVOΔILESRCO
1
8fC
O
××
-------------------------
+
⎝⎠
⎛⎞
×=
ΔVOΔIL
1
8fC
O
××
-------------------------
⎝⎠
⎛⎞
×=
ΔVOΔILESRCO
×=
ICO_RMS
ΔIL
12
----------
=
AOZ1022
Rev. 1.6 December 2010 www.aosmd.com Page 10 of 17
tor ripple current is high, the output capacitor could be
overstressed.
Loop Compensation
The AOZ1022 employs peak current mode control for
easy use and fast tr ansient response. Peak current mode
control eliminates the double pole effect of the output
L&C filter. It greatly simplifies the compensation loop
design.
With peak current mode control, the buck power stage
can be simplified to be a one-pole and one-zero system
in frequency domain. The pole is the dominant pole can
be calculated by:
The zero is an ESR zero due to output capacitor and its
ESR. It is can be calculated by:
where;
CO is the output filter capacitor,
RL is load resistor value, and
ESRCO is the equivalent series resistance of output capacitor.
The compensation design is actually to shape th e
converter control loop transfer function to get the desired
gain and phase. Several different types of compensation
network can be used for the AOZ1022. In most cases, a
series capacitor and resistor network connected to the
COMP pin set s the pole-zero and is adequate for a stable
high-bandwidth control loop.
In the AOZ1022, FB pin and COMP pin are the inverting
input and the output of internal error amplifier. A series R
and C compensation network connected to COMP
provides one pole and one zero. The pole is:
where;
GEA is the error amplifier transconductance, which is 200 x 10-6
A/V,
GVEA is the error amplifier voltage; and
C2 is compensation capacitor in Figure 1.
The zero given by the external compensation network,
capacitor C2 and resistor R3, is located at:
To design the compensation circuit, a target crossover
frequency fC for close loop must be se lected. The system
crossover frequency is wher e control loop has unity gain .
The crossover is the also called the con verter bandwid th.
Generally a hig her bandwidth means faster response to
load transient. Howe ver, the bandwid th should not be too
high because of system stability concern. When design-
ing the compensation loop, converter stability under all
line and load condition must be considered.
Usually, it is recommended to set the bandwidth to be
equal or less than 1/10 of switching frequency. The
AOZ1022 operates at a frequency range from 350kHz
to 600kHz. It is recommended to choose a crossover
frequency equal or less than 40kHz.
The strategy for choosing RC and CC is to set the
cross over frequency with RC and set the compensator
zero with CC. Using selected crossover frequency, fC,
to calculate R3:
where;
where fC is desired crossover frequency . For best performance,
fC is set to be about 1/10 of switching frequency,
VFB is 0.8V,
GEA is the error amplifier transconductance, which is 200 x 10-6
A/V, and
GCS is the current sense circuit transconductance, which is 6.86
A/V
The compensation capacitor CC and resistor RC together
make a zero. This zero is put somewhere close to the
dominate pole fp1 but lower than 1/5 of selected
crossover frequency. C2 can is selected by:
The above equation can be simplified to:
fp1
1
2πCORL
××
-----------------------------------
=
fZ1
1
2πCOESRCO
××
------------------------------------------------
=
fp2
GEA
2πCCGVEA
××
-------------------------------------------
=
fZ2
1
2πCCRC
××
-----------------------------------
=
fC40kHz=
RCfC
VO
VFB
---------- 2πC2
×
GEA GCS
×
------------------------------
××=
CC
1.5
2πRCfp1
××
-----------------------------------
=
CC
CORL
×
RC
---------------------
=
AOZ1022
Rev. 1.6 December 2010 www.aosmd.com Page 11 of 17
An easy-to-use application software which helps to
design and simulate the compensation loop can be found
at www.aosmd.com.
Thermal Management and Layout
Consideration
In the AOZ1022 buck regulator circuit, high pulsing
current flows through two circuit loops. The first loop
starts from the input capacitors, to the VIN pin, to the LX
pins, to the filter inductor, to the output capacitor and
load, and then return to the input capacitor through
ground. Current flows in the first loop when the high side
switch is on. The second loop starts from inductor, to the
output cap acitors and load, to the anode of Schottky
diode, to the cathode of Schottky diode. Current flows in
the second loop whe n the low sid e dio de is on.
In PCB layout, minimizing the two loops area redu ces the
noise of this circuit and improves efficiency. A ground
plane is strongly recommended to connect input capaci-
tor, output capacitor, and PGND pin of the AOZ1022.
In the AOZ1022 buck regulato r circuit, the major power
dissipating components are the AOZ1022 and the
output inductor. The total power dissipation of conver ter
circuit can be measured by inpu t power minus output
power.
The power dissipation of inductor can be approximately
calculated by output current and DCR of inductor.
The actual junction temperature can be calculated with
power dissipation in the AOZ 1 02 2 an d therm al
impedance from junction to ambient.
The maximum junction temperature of AOZ1022 is
150°C, which limits the maximum load current capability.
Please see the thermal de-rating curves for maximum
load current of the AOZ1022 under diffe rent ambient
temperature.
The thermal performance of the AOZ1022 is strongly
affected by the PCB layout. Extra care should be taken
by users during design process to ensure that the IC
will operate under the recommended environmental
conditions.
The AOZ1022 comes in an EPAD SO-8 package. L ayout
tips are listed below for the best electric and thermal
performance. Figure 3 illustrates a PCB layout example
of the AOZ1022.
1. The LX pins are connected to internal PFET and
NFET drains. They are low resistance thermal
conduction path and the most noisy switching node.
Connected a large copper pla ne to the LX pi n to help
thermal dissipation.
2. Do not use thermal relief connection to the VIN and
the PGND pin. Pour a maximized copper area to the
PGND pin and the VIN pin to help thermal dissipation.
3. Input capacitor should be connecte d to the VIN pin
and the PGND pin as close as possible.
4. A ground plane is preferr ed. If a ground plane is
not used, separate PGND from AGND and connect
them only at one point to avoid the PGND pin noise
coupling to the AGND pin.
5. Make the curren t trac e from LX pins to L to Co to the
PGND as short as possible .
6. Pour copper plane on all unused board area and
connect it to stable DC nodes, like VIN, GND or VOUT.
7. Keep sensitive signal trace far away form the LX
pins.
Ptotal_loss VIN IIN VOIO
××=
Pinductor_loss IO2Rinductor 1.1××=
Tjunction Ptotal_loss Pinductor_loss
()Θ×JA
=
AOZ1022
Rev. 1.6 December 2010 www.aosmd.com Page 12 of 17
Notes:
1. Dimensions and tolerancing conform to ASME Y14.5M-1994.
2. All dimensions are in millimeters.
3. The location of the terminal #1 identifier and terminal numbering convention conforms to JEDEC publication 95 SP-002.
4. Dimension b applies to metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. If the terminal has the
optional radius on the other end of the terminal, the dimension b should not be measured in that radius area.
5. Coplanarity applies to the terminals and all other bottom surface metallization.
6. Drawing shown are for illustration only.
7. The dimensions with * are just for reference
8. Pin #3 and Pin #7 are fused to DAP.
Symbols
A
A3
b
D
D2
D3
E
E2
e
L
L1
L2
L3
aaa
bbb
ccc
ddd
eee
Dimensions in millimeters
RECOMMENDED LAND PATTERN
FRONT VIEW
TOP VIEW BOTTOM VIEW
Min.
0.70
0.40
4.90
2.05
1.66
3.90
2.23
0.50
Nom.
0.75
0.20 Ref.
0.45
5.00
2.15
1.76
4.00
2.33
0.95 BSC
0.55
0.40
0.285 Ref.
0.835 Ref.
0.15
0.10
0.10
0.08
0.05
Max.
0.80
0.50
5.10
2.25
1.86
4.10
2.43
0.60
Symbols
A
A3
b
D
D2
D3
E
E2
e
L
L1
L2
L3
aaa
bbb
ccc
ddd
eee
Min.
0.028
0.016
0.190
0.080
0.064
0.154
0.088
0.020
Nom.
0.30
0.008 Ref.
0.018
0.200
0.085
0.070
0.157
0.092
0.037 BSC
0.022
0.016
0.011 Ref.
0.033 Ref.
0.006
0.004
0.004
0.003
0.002
Max.
0.032
0.020
0.210
0.089
0.074
0.161
0.096
0.024
4.51
0.285
2.33
1.65
0.285
1.86
0.40
2.25
0.50 Typ.
0.95 Typ.
0.65
4.20
Dimensions in inches
b
A
A3
Seating
Plane
D/2
E/2
D
E
L
L2*
L3*
E2
L2*
D3
L1
e
D2 Pin #1 IDA
Chamfer 0.30
Index Area
(D/2 x E/2)
Package Dimensions, DFN 5x4
AOZ1022
Rev. 1.6 December 2010 www.aosmd.com Page 13 of 17
R0.40
P0
K0 A0
E
E2 D0
E1
D1
B0
Package
DFN 5x4
(12 mm)
A0 B0 K0 E E1 E2D0 D1 P0 P1 P2 T
5.30
±0.10 ±0.10
4.30
±0.10
1.20
Min.
1.50 1.50 12.00
±0.10
1.75
±0.10
5.50
±0.10
8.00
±0.20
4.00
±0.10
2.00
±0.05
0.30
UNIT: mm
T
0.20
Feeding
Direction
Leader/Trailer and Orientation
±0.30
+0.10 / –0
Trailer Tape
300mm Min.
Components Tape
Orientation in Pocket
Leader Tape
500mm Min.
Tape Dimensions, DFN 5x4
AOZ1022
Rev. 1.6 December 2010 www.aosmd.com Page 14 of 17
VIEW: C
C
0.05 3-1.8
ø960.2
6.450.05
3-ø2.90.05
3-ø1/8"
3-ø1/4"
8.90.1
11.90
14 REF
1.8
5.0
12 REF
41.5 REF
43.00
44.50.1
2.00
6.50
10.0
10.71
10
3-ø3/16"
R48 REF
ø86.00.1
2.20
6.2
ø13.00
ø21.20
ø17.0
R1.10
R3.10
2.00
3.3
4.0
6.10
0.80
3.00
8.00
+0.050.00
R0.5
1.80
2.5
38
44.50.1
46.00.1
8.00.1
40
6
3-ø3/16"
R3.95
6.50
ø90.00
6.0
1.8
1.8
R1
8.00
0.00
-0.05
N=ø1002
A
A
A
R121
R127
R159
R6
R55
P
B
W1
M
II I
I
6.01
R1
Zoom In
III
Zoom In
II
Zoom In
A
Tape Size
12mm
Reel Size
ø330
M
ø330
+0.3
-4.0
W1
12.40
+2.0
-0.0
B
2.40
0.3
P
0.5
Reel Dimensions, DFN 5x4
AOZ1022
Rev. 1.6 December 2010 www.aosmd.com Page 15 of 17
Package Dimensions, EPAD SO-8
Notes:
1. Package body sizes exclude mold flash and gate burrs.
2. Dimension L is measured in gauge plane.
3. Tolerance 0.10mm unless otherwise specified.
4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.
5. Die pad exposure size is according to lead frame design.
6. Followed from JEDEC MS-012
Symbols
A
A1
A2
B
C
D
D0
D1
E
e
E1
E2
E3
L
y
θ
| L1–L1' |
L1
Dimensions in millimeters
RECOMMENDED LAND PATTERN
Min.
1.40
0.00
1.40
0.31
0.17
4.80
3.20
3.10
5.80
3.80
2.21
0.40
0
D0
UNIT: mm
θ
Nom.
1.55
0.05
1.50
0.406
4.96
3.40
3.30
6.00
1.27
3.90
2.41
0.40 REF
0.95
3
0.04
1.04 REF
Max.
1.70
0.10
1.60
0.51
0.25
5.00
3.60
3.50
6.20
4.00
2.61
1.27
0.10
8
0.12
Dimensions in inches
D1
E1 E
E3E2
Note 5
L1'
L1
L
Gauge plane
0.2500 C
D
7 (4x)
B
3.70
2.20
2.87
2.71
5.74
1.27 0.80
0.635
eA1
A2 A
Symbols
A
A1
A2
B
C
D
D0
D1
E
e
E1
E2
E3
L
y
θ
| L1–L1' |
L1
Min.
0.055
0.000
0.055
0.012
0.007
0.189
0.126
0.122
0.228
0.150
0.087
0.016
0
Nom.
0.061
0.002
0.059
0.016
0.195
0.134
0.130
0.236
0.050
0.153
0.095
0.016 REF
0.037
3
0.002
0.041 REF
Max.
0.067
0.004
0.063
0.020
0.010
0.197
0.142
0.138
0.244
0.157
0.103
0.050
0.004
8
0.005
AOZ1022
Rev. 1.6 December 2010 www.aosmd.com Page 16 of 17
Tape and Reel Dimensions, EPAD SO-8
Carrier Tape
Reel
Tape Size
12mm
Reel Size
ø330
M
ø330.00
±0.50
Package
SO-8
(12mm)
A0
6.40
±0.10
B0
5.20
±0.10
K0
2.10
±0.10
D0
1.60
±0.10
D1
1.50
±0.10
E
12.00
±0.10
E1
1.75
±0.10
E2
5.50
±0.10
P0
8.00
±0.10
P1
4.00
±0.10
P2
2.00
±0.10
T
0.25
±0.10
N
ø97.00
±0.10
K0
UNIT: mm
B0
G
M
W1
S
K
H
N
W
V
R
Trailer Tape
300mm min. or
75 empty pockets
Components Tape
Orientation in Pocket
Leader Tape
500mm min. or
125 empty pockets
A0
P1
P2
Feeding Direction
P0
E2
E1
E
D0
T
D1
W
13.00
±0.30
W1
17.40
±1.00
H
ø13.00
+0.50/-0.20
K
10.60
S
2.00
±0.50
G
R
V
Leader/Trailer and Orientation
UNIT: mm
AOZ1022
Rev. 1.6 December 2010 www.aosmd.com Page 17 of 17
Part Marking
Z1022
FAY
Part Number Code
Assembly Lot Code
Year & Week Code
WLT
Fab & Assembly Location
Z1022DI
FAYWLT
Part Number Code
Assembly Lot Code
Fab & Assembly Location
Year & Week Code
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body or (b) support or sustain life, and (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury of
the user.
2. A critical component in any component of a life
support, device, or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
This data sheet contains preliminary data; supplementary data may be published at a later date.
Alpha & Omega Semiconductor reserves the right to make changes at any time without notice.
LIFE SUPPORT POLICY
ALPHA & OMEGA SEMICONDUCTOR PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS.