SN74LV138AT 3-LINE TO 8-LINE DECODER/DEMULTIPLEXER www.ti.com SCLS691 - AUGUST 2005 FEATURES * * Ioff Supports Partial-Power Down Mode Operation Latch-Up Performance Exceeds 250 mA Per JESD 17 ESD Protection Exceeds JESD 22 - 2000-V Human-Body Model (A114-A) - 200-V Machine Model (A115-A) - 1000-V Charged-Device Model (C101) D, DB, DGV, NS, OR PW PACKAGE (TOP VIEW) A B C G2A G2B G1 Y7 GND 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 RGY PACKAGE (TOP VIEW) VCC Y0 Y1 Y2 Y3 Y4 Y5 Y6 B C G2A G2B G1 Y7 VCC * * 1 16 2 15 3 4 14 13 Y0 Y1 Y2 12 Y3 11 Y4 10 Y5 5 6 7 GND 8 9 Y6 * Inputs Are TTL-Voltage Compatible 4.5-V to 5.5-V VCC Operation Max tpd of 7.6 ns at 5 V Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 5 V, TA = 25C Typical VOHV (Output VOH Undershoot) >2.3 V at VCC = 5 V, TA = 25C Support Mixed-Mode Voltage Operation on All Ports A * * * * DESCRIPTION/ORDERING INFORMATION The SN74LV138AT is a 3-line to 8-line decoder/demultiplexer, designed for high-performance memory-decoding or data-routing applications requiring very short propagation delay times. In high-performance memory systems, this decoder can be used to minimize the effects of system decoding. When employed with high-speed memories utilizing a fast enable circuit, the delay times of the decoder and the enable time of the memory usually are less than the typical access time of the memory. This means that the effective system delay introduced by the decoder is negligible. ORDERING INFORMATION PACKAGE (1) TA QFN - RGY Tube of 40 SN74LV138ATD Reel fo 2500 SN74LV138ATDR SOP - NS Reel of 2000 SN74LV138ATNSR 74LV138AT SSOP - DB Reel of 2000 SN74LV138ATDBR LV138AT TVSOP - DGV Reel of 2000 SN74LV138ATDGVR LV138AT Tube of 90 SN74LV138ATPW Reel of 2000 SN74LV138ATPWR Reel of 250 SN74LV138ATPWT TSSOP - PW (1) TOP-SIDE MARKING SN74LV138ATRGYR SOIC - D -40C to 125C ORDERABLE PART NUMBER Reel of 1000 VV138AT LV138AT LV138AT Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2005, Texas Instruments Incorporated SN74LV138AT 3-LINE TO 8-LINE DECODER/DEMULTIPLEXER www.ti.com SCLS691 - AUGUST 2005 DESCRIPTION/ORDERING INFORMATION (CONTINUED) The conditions at the binary-select inputs (A, B, C) and the three enable inputs (G1, G2A, G2B) select one of eight output lines. The two active-low (G2A, G2B) and one active-high (G1) enable inputs reduce the need for external gates or inverters when expanding. A 24-line decoder can be implemented without external inverters and a 32-line decoder requires only one inverter. An enable input can be used as a data input for demultiplexing applications. This device is fully specified for partial-power-down application susing Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. FUNCTION TABLE ENABLE INPUTS 2 SELECT INPUTS OUTPUTS G1 G2A G2B C B A Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7 X H X X X X H H H H H H H H X X H X X X H H H H H H H H L X X X X X H H H H H H H H H L L L L L L H H H H H H H H L L L L H H L H H H H H H H L L L H L H H L H H H H H H L L L H H H H H L H H H H H L L H L L H H H H L H H H H L L H L H H H H H H L H H H L L H H L H H H H H H L H H L L H H H H H H H H H H L SN74LV138AT 3-LINE TO 8-LINE DECODER/DEMULTIPLEXER www.ti.com SCLS691 - AUGUST 2005 LOGIC DIAGRAM (POSITIVE LOGIC) 15 A 1 14 Select Inputs B 13 3 12 11 10 Enable Inputs 6 4 G2A G2B Y1 2 C G1 Y0 9 7 Y2 Y3 Data Outputs Y4 Y5 Y6 Y7 5 3 SN74LV138AT 3-LINE TO 8-LINE DECODER/DEMULTIPLEXER www.ti.com SCLS691 - AUGUST 2005 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage -0.5 7 V VI Input voltage range (2) -0.5 7 V -0.5 VCC + 0.5 range (2) (3) UNIT VO Output voltage IIK Input clamp current VI < 0 -20 mA IOK Output clamp current VO < 0 or VO > VCC 50 mA IO Continuous output current VO = 0 to VCC 25 mA 50 mA Continuous current through VCC or GND D package (4) 73 DB package (4) JA Package thermal impedance (1) (2) (3) (4) (5) 82 DGV package (4) 120 NS package (4) 64 PW package (4) 108 RGY Tstg package (5) Storage temperature range V C/W 39 -65 150 C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. This value is limited of 5.5 V maximum. The package thermal impedance is calculated in accordance with JESD 51-7. The package thermal impedance is calculated in accordance with JESD 51-5. Recommended Operating Conditions (1) VCC Supply voltage VIH High-level input voltage VCC = 4.5 V to 5.5 V VIL Low-level input voltage VCC = 4.5 V to 5.5 V VI Input voltage VO Output voltage IOH High-level output current IOL MIN MAX 4.5 5.5 2 UNIT V V 0.8 V 0 5.5 V 0 VCC V VCC = 4.5 V to 5.5 V -12 mA Low-level output current VCC = 4.5 V to 5.5 V 12 mA t/v Input transition rise or fall rate VCC = 4.5 V to 5.5 V 20 ns/V TA Operating free-air temperature 125 C (1) 4 -40 All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. SN74LV138AT 3-LINE TO 8-LINE DECODER/DEMULTIPLEXER www.ti.com SCLS691 - AUGUST 2005 Electrical Characteristics over operating free-air temperature range (unless otherwise noted) PARAMETER VOH VOL II ICC ICC (1) (1) TEST CONDITIONS TA = -40C to 85C TA = 25C VCC MIN TYP 4.5 IOH = -50 A 4.5 V 4.4 IOH = -12 mA 4.5 V 3.8 IOL = 50 A 4.5 V IOL = 12 mA 0 MAX MIN TA = -40C to 125C MAX MIN 4.4 4.4 3.8 3.8 UNIT MAX V 0.1 0.1 0.1 4.5 V 0.55 0.55 0.55 0 to 5.5 V V 0.1 1 1 A VI = VCC or GND, IO = 0 5.5 V 2 20 20 A One input at 3.4 V, Other inputs at VCC or GND 5.5 V 1.35 1.5 1.5 mA VI = 5.5 V or GND Ioff VI or VO = 0 to 5.5 V Ci VI = VCC or GND 0 4 0.5 5 5 A 10 10 10 pF This is the increase in supply current for each input at one of the specified TTL voltage levels rather than 0 V ot VCC. Switching Characteristics over recommended operating free-air temperature range, VCC = 5 V 0.5 V (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) LOAD CAPACITANCE A, B, or C tpd tpd G1 Y TA = -40C to 125C MIN TYP MAX MIN MAX MIN MAX 2.7 7.6 10.4 1 12 1 13 2.5 6.6 9.1 1 10.5 1 12 G2A or G2B 2.8 7 9.6 1 11 1 12 A, B, or C 3.9 8.1 11.4 1 13 1 14 3.7 7.1 10.1 1 11.5 1 12 4 7.5 10.6 1 12 1 13 G1 Y G2A or G2B CL = 15 pF TA = -40C to 85C TA = 25C CL = 50 pF UNIT ns ns Operating Characteristics VCC = 5 V, TA = 25C PARAMETER Cpd Power dissipation capacitance TEST CONDITIONS CL = 50 pF, f = 10 MHz TYP 79 UNIT pF 5 SN74LV138AT 3-LINE TO 8-LINE DECODER/DEMULTIPLEXER www.ti.com SCLS691 - AUGUST 2005 PARAMETER MEASUREMENT INFORMATION VCC From Output Under Test Test Point RL = 1 k From Output Under Test CL (see Note A) S1 Open TEST GND CL (see Note A) LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open Drain Open VCC GND VCC LOAD CIRCUIT FOR 3-STATE AND OPEN-DRAIN OUTPUTS 3V 1.5 V Timing Input 0V tw 3V 1.5 V Input 1.5 V th tsu 3V 1.5 V Data Input 1.5 V 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 3V 1.5 V Input 1.5 V 0V tPLH tPHL VOH In-Phase Output 50% VCC tPHL Out-of-Phase Output 50% VCC VOL Output Waveform 1 S1 at VCC (see Note B) VOH 50% VCC VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS 1.5 V 1.5 V 0V tPZL tPLZ VCC 50% VCC tPZH tPLH 50% VCC 3V Output Control Output Waveform 2 S1 at GND (see Note B) VOL + 0.3 V VOL tPHZ 50% VCC VOH - 0.3 V VOH 0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, ZO = 50 , tr 3 ns, tf 3 ns. D. The outputs are measured one at a time, with one input transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPHL and tPLH are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuits and Voltage Waveforms 6 PACKAGE OPTION ADDENDUM www.ti.com 5-Dec-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LV138ATD ACTIVE SOIC D 16 SN74LV138ATDBR ACTIVE SSOP DB SN74LV138ATDBRE4 ACTIVE SSOP SN74LV138ATDE4 ACTIVE SN74LV138ATDGVR 40 Lead/Ball Finish MSL Peak Temp (3) Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SOIC D 16 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ACTIVE TVSOP DGV 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV138ATDGVRE4 ACTIVE TVSOP DGV 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV138ATDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV138ATDRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV138ATNSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV138ATNSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV138ATPW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV138ATPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV138ATPWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV138ATPWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV138ATPWT ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV138ATPWTE4 ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV138ATRGYR ACTIVE QFN RGY 16 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1YEAR 40 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 5-Dec-2005 (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MPDS006C - FEBRUARY 1996 - REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0-8 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. Falls within JEDEC: 24/48 Pins - MO-153 14/16/20/56 Pins - MO-194 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C - JANUARY 1995 - REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0- 8 A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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