
VS-32CTQ...S-M3, VS-32CTQ...-1-M3 Series
www.vishay.com Vishay Semiconductors
Revision: 27-Oct-17 2Document Number: 94936
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Note
(1) Pulse width < 300 μs, duty cycle < 2 %
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum average forward current
See fig. 5 IF(AV) 50 % duty cycle at TC = 115 °C, rectangular waveform 30
A
Maximum peak one cycle non-repetitive
surge current
See fig. 7
IFSM
5 μs sine or 3 μs rect. pulse Following any rated load
condition and with rated
VRRM applied
900
10 ms sine or 6 ms rect. pulse 250
Non-repetitive avalanche energy EAS TJ = 25 °C, IAS = 1.20 A, L = 11.10 mH 13 mJ
Repetitive avalanche current IAR
Current decaying linearly to zero in 1 μs
Frequency limited by TJ maximum VA = 1.5 x VR typical 3A
ELECTRICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum forward voltage drop
See fig. 1 VFM (1)
15 A TJ = 25 °C 0.49
V
30 A 0.58
15 A TJ = 125 °C 0.40
30 A 0.53
Maximum reverse leakage current
See fig. 2 IRM (1) TJ = 25 °C VR = Rated VR
1.75 mA
TJ = 125 °C 97
Threshold voltage VF(TO) TJ = TJ maximum 0.233 V
Forward slope resistance rt9.09 m
Maximum junction capacitance per leg CTVR = 5 VDC (test signal range 100 kHz to 1 MHz), 25 °C 1300 pF
Typical series inductance per leg LSMeasured lead to lead 5 mm from package body 8.0 nH
Maximum voltage rate of change dV/dt Rated VR10 000 V/μs
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum junction and storage
temperature range TJ, TStg -55 to +150 °C
Maximum thermal resistance,
junction to case per leg RthJC DC operation
See fig. 4 3.25
°C/W
Typical thermal resistance,
case to heatsink RthCS Mounting surface, smooth and greased 0.50
Approximate weight 2g
0.07 oz.
Mounting torque minimum 6 (5) kgf cm
(lbf in)
maximum 12 (10)
Marking device
Case style D2PAK (TO-263AB) 32CTQ025S
32CTQ030S
Case style TO-262AA 32CTQ025-1
32CTQ030-1