BAS16S3 - CYStech Electronics Corp.

CYStech Electronics Corp.

Spec. No. : C303S3

Issued Date : 2004.04.07

Revised Date

Page No. : 1/4

BAS16S3 CYStek Product Specification

High –speed switching diode

BAS16S3

Description

The BAS16S3 is a high-speed switching diode fabricated in planar technology, and encapsulated in

a small SOT-323 plastic SMD package.

Equivalent Circuit Outline

Features

• Small plastic SMD package

• High switching speed: max. 4ns

• Continuous reverse voltage: max. 75V

• Repetitive peak reverse voltage: max. 85V

• Repetitive peak forward current: max. 500mA.

Applications

• High-speed switching in hybrid thick and thin-film circuits.

SOT-323

BAS16S3

1：Anode

2：Not Connected

3：Cathode

Anode

NC

Cathode

1 2

3

CYStech Electronics Corp.

Spec. No. : C303S3

Issued Date : 2004.04.07

Revised Date

Page No. : 2/4

BAS16S3 CYStek Product Specification

Absolute Maximum Ratings @TA=25℃

Parameters Symbol Min Max Unit

Repetitive peak reverse voltage VRRM - 85 V

Continuous reverse voltage VR - 75 V

Continuous forward current (Note 1) IF - 215 mA

Repetitive peak forward current IFRM 500 mA

Non-repetitive peak forward current

@square wave, Tj=125℃ prior to surge t=1µs

t=1ms

t=1s

IFSM

-

4

1

0.5

A

Total power dissipation (Note 1) Ptot 250 mW

Junction Temperature Tj - 150

°C

Storage Temperature Tstg -65 +150

°C

Note 1: Device mounted on an FR-4 PCB.

Electrical Characteristics @ Tj=25℃ unless otherwise specified

Parameters Symbol Conditions Min Typ. Max Unit

Forward voltage VF

IF=1mA

IF=10mA

IF=50mA

IF=150mA

- -

715

855

1

1.25

mV

V

Reverse current IR

VR=25V

VR=75V

VR=25V,Tj=150℃

VR=75V,Tj=150℃

- -

30

1

30

50

nA

µA

Diode capacitance Cd VR=0V, f=1MHz - - 1.5 pF

Reverse recovery time trr

when switched from IF=10mA to

IR=10mA,RL=100Ω, measured

at IR=1mA

- - 4 ns

Forward recovery voltage Vfr when switched from IF=10mA

tr=20ns - - 1.75 V

Thermal Characteristics

Symbol Parameter Conditions Value Unit

Rth,j-tp thermal resistance from junction to tie-point 360 ℃/W

Rth, j-a thermal resistance from junction to ambient Note 1 500 ℃/W

Note 1: Device mounted on an FR-4 PCB.

CYStech Electronics Corp.

Spec. No. : C303S3

Issued Date : 2004.04.07

Revised Date

Page No. : 3/4

BAS16S3 CYStek Product Specification

Characteristic Curves

Forward Biased Voltage & Forward Current

0

150

300

450

0 500 1000 1500 2000

Forward Biased Voltage-VF(mV)

Current-IF (mA)

Capacitance & Reverse-Biased Voltage

0.1

1

0.1 1 10 100

Reverse Biased Voltage-VR (V)

Capacitance-Cd (pF)

Capacitance & Reverse-Biased Voltage

0.1

1

0.1 1 10 100

Reverse Biased Voltage-VR (V)

Capacitance-Cd (pF)

Power Derating

0

50

100

150

200

250

300

0 20 40 60 80 100 120 140 160

Ta(oC ), Ambient Temperature

PD(mW), Power Dissipation

CYStech Electronics Corp.

Spec. No. : C303S3

Issued Date : 2004.04.07

Revised Date

Page No. : 4/4

BAS16S3 CYStek Product Specification

SOT-323 Dimension

*: Typical

Inches Millimeters Inches Millimeters

DIM Min. Max. Min. Max.

A 0.0315 0.0433 0.80 1.10 e1 0.0256 - 0.65 -

A1 0.0000 0.0039 0.00 0.10 He 0.0787 0.0886 2.00 2.25

bp 0.0118 0.0157 0.30 0.40 Lp 0.0059 0.0177 0.15 0.45

C 0.0039 0.0098 0.10 0.25 Q 0.0051 0.0091 0.13 0.23

D 0.0709 0.0866 1.80 2.20 v 0.0079 - 0.2 -

E 0.0453 0.0531 1.15 1.35 w 0.0079 - 0.2 -

e 0.0512 - 1.3 - θ - -

10° 0°

Notes: 1.Controlling dimension: millimeters.

2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.

Material:

• Lead: 42 Alloy ; solder plating

• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.

• CYStek reserves the right to make changes to its products without notice.

• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

He

E

A

A1 Q

Lp

e1

e

bp

12

3

D

W B

v A

Z

detail Z

A

C

θ

01 2

scale

mm

Style : Pin 1. Anode 2.No Connection

3 Cathode

3-Lead SOT-323 Plastic

Surface Mounted Package

CYStek Package Code: S3

Marking:

TE

A6