MDSL-00077-00 QUALITY SEMICONDUCTOR, INC. 1
MARCH 10, 1998
QS74FCT16652T, 162652T PRELIMINARY
Now an Company
High-Speed CMOS
16-Bit Bus Register
Transceiver
QS74FCT16652T
QS74FCT162652T
PRELIMINARY
FEATURES/BENEFITS
Pin and function compatible with T.I.
Widebus™ and IDT Double-Density™ families
CMOS power levels: <1µW typical standby
SSOP (PV) and TSSOP (PA) packages
Low output skew: 0.5ns tSK(O)
Flow-through pinout for easy layout
Power off disable allows hot plugging
Industrial temperature: –40°C to +85°C
Input hysteresis for noise immunity
Multiple power and ground pins for low noise
FCT16652T
High drive standard FCT-T outputs:
IOL = +64mA, IOH = –32mA
Incident switching for driving buses and large
loads
FCT162652T
Balanced output drivers: ±24mA
Reduced switching noise for point to point
signals
D
1
CLKAB
C
1
CLKBA
1
SBA
1
OEAB
1
SAB
D
C
A Register
B Register
1Bn
1An
TO 7 OTHER CHANNELS
1
OEBA
D
2
CLKAB
C
2
CLKBA
2
SBA
2
OEAB
2
SAB
D
C
2Bn
2An
TO 7 OTHER CHANNELS
2
OEBA
B Register
A Register
DESCRIPTION
The FCT16652 family of products are 16-bit bus
register transceivers with three-state outputs that are
ideal for driving address and data buses. The
FCT16652 and FCT162652 are organized for trans-
mission of data between A bus and B bus either
directly or from the internal storage registers. Easy
board layout is facilitated by the use of flow-through
pinouts and byte enable controls provide architectural
flexibility for systems designers. All outputs have
ground bounce suppression circuitry (see QSI Appli-
cation Note AN-01) and many power and ground pins
provide low ground bounce. To accommodate hot-
plug or live insertion applications, both versions of this
product were designed not to load an active bus when
VCC is removed. In applications where bus signals are
point-to-point or driving light capacitance loads, the
balanced drive FCT162652 is recommended.
Q
Q
UALITY
S
EMICONDUCTOR,
I
NC.
Q
Figure 1. Functional Block Diagram
2QUALITY SEMICONDUCTOR, INC. MDSL-00077-00
MARCH 10, 1998
QS74FCT16652T, 162652T PRELIMINARY
Now an Company
Figure 2. Pin Configuration
(All Pins Top View)
SSOP, TSSOP
Name Description
xAx Data Register A Inputs
Data Register B Outputs
xBx Data Register B Inputs
Data Register A Outputs
xCLKAB, xCLKBA Clock Inputs
xSAB, xSBA Output Source Select Inputs
X OEAB, xOEBA Output Enable Inputs
Table 1. Pin Description
Table 2. Absolute Maximum Ratings
Supply Voltage to Ground...............................................–0.5V to +7.0V
DC Output Voltage VOUT ................................................–0.5V to +7.0V
DC Input Voltage VIN.......................................................–0.5V to +7.0V
AC Input Voltage (for a pulse width 20ns) ................................. –3.0V
DC Input Diode Current with VIN < 0 ........................................... –20mA
DC Output Diode Current with VOUT < 0 ..................................... –50mA
DC Output Current Max. Sink Current/Pin.................................. 120mA
Maximum Power Dissipation ................................................... 1.0 watts
TSTG Storage Temperature............................................. –65° to +150°C
Note: Stresses greater than
those listed under ABSOLUTE
MAXIMUM RATINGS may
cause permanent damage to
this device resulting in func-
tional or reliability type failures.
Pins Typ Max Unit
All 6.0 9.0 pF
Table 3. Capacitance
TA = 25°C, f = 1MHz, VIN = 0V, VOUT = 0V
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
1OEAB
1CLKAB
1SAB
GND
1A1
1A2
V
CC
1A3
1A4
1A5
GND
1A6
1A7
1A8
2A1
2A2
2A3
GND
2A4
2A5
2A6
V
CC
2A7
2A8
GND
2SAB
2CLKAB
2OEAB
1OEBA
1CLKBA
1SBA
GND
1B1
1B2
V
CC
1B3
1B4
1B5
GND
1B6
1B7
1B8
2B1
2B2
2B3
GND
2B4
2B5
2B6
V
CC
2B7
2B8
GND
2SBA
2CLKBA
2OEBA
MDSL-00077-00 QUALITY SEMICONDUCTOR, INC. 3
MARCH 10, 1998
QS74FCT16652T, 162652T PRELIMINARY
Now an Company
Table 4. Function Table(2,3)
Inputs Data I/O(1)
xOEAB xOEBAOEBA
OEBAOEBA
OEBA xCLKAB xCLKBA xSAB xSBA xAx xBx Operation or Function
L H H or L H or L X X Input Input Isolation
LH ↑↑X X Store A and B Data
XH H or L X X Input
Unspecified
(1) Store A, Hold B
HH ↑↑X(2) X Output Store A in both Registers
L X H or L XX
Unspecified
(1) Input Hold A, Store B
LL ↑↑XX
(2) Output Store B in both Registers
L L X X X L Output Input Real Time B Data to A Bus
L L X H or L X H Stored B Data to A Bus
H H X X L X Input Output Real Time A Data to B Bus
H H H or L X H X Stored A Data to B Bus
H L H or L H or L H H Output Output Stored A Data to B Bus and
Stored B Data to A Bus
Notes:
1. The data output functions may be enabled or disabled by various signals at the xOEAB or xOEBA inputs. Data
input functions are always enabled; i.e., data at the bus pins will be stored on every LOW-to-HIGH transition on
the clock inputs.
2. Select control = L; clocks can occur simultaneously.
Select control = H; clocks must be staggered to load both registers.
3. H = HIGH Voltage Level
L = LOW Voltage Level
X = Don't Care
= LOW-to-HIGH Transition
Table 5. DC Electrical Characteristics Over Operating Range
Recommended Operating Ranges apply unless otherwise noted.
Symbol Parameter Test Conditions(1) Min Typ(2) Max Unit
VIH Input HIGH Voltage Logic HIGH for All Inputs 2.0 V
VIL Input LOW Voltage Logic LOW for All Inputs 0.8 V
VTInput Hysteresis VTLH – VTHL for All Inputs(4) 100 mV
| IIH | Input Current VCC = Max., 0 VIN < VCC —— 1µA
| IIL | Input HIGH or LOW
| IOZ | Off-State Output VCC = Max., 0 VOUT VCC —— 1µA
Current (Hi-Z)
| IOFF | Power off leakage VCC = 0V, VIN/OUT 4.5V(5) —— 1µA
IOS Short Circuit Current VCC = Max., VOUT = GND(3,4) –80 –140 –225 mA
VIK Input Clamp Voltage VCC = Min., IIN = –18mA –0.7 –1.2 V
Notes:
1. For conditions shown as Min. or Max. use appropriate value specified under Recommended Operating Conditions
for the applicable device type.
2. Typical values indicate VCC = 5.0V and TA = 25°C.
3. Not more than one output should be tested at one time. Duration of test should not exceed one second.
4. These parameters are guaranteed by design but not tested.
5. The test limit for this parameter is ± 5µA at TA = –55°C
4QUALITY SEMICONDUCTOR, INC. MDSL-00077-00
MARCH 10, 1998
QS74FCT16652T, 162652T PRELIMINARY
Now an Company
Symbol Parameter Min Max Unit
VCC Supply Voltage 4.5 5.5 V
VIN Input Voltage 0 VCC V
VOUT Voltage Applied to Output or I/O 0 VCC V
t/v Input Transition Slew Rate 10 ns/V
TAOperating Free Air Tempeature –40 +85 °C
Table 6. Recommended Operating Conditions
Table 8. Output Drive Characteristics for FCT162652T
Symbol Parameter Test Conditions(1) Min Typ(2) Max Unit
IODL Output LOW Current VCC = 5V, VIN = VIH or VIL 60 115 200 mA
VOUT =1.5V(3)
IODH Output HIGH Current VCC = 5V, VIN = VIH or VIL –60 –115 –200 mA
VOUT = 1.5V(3)
VOH Output HIGH Voltage VCC = Min. IOH = –24mA 2.4 3.1 V
VIN = VIH or VIL
VOL Output LOW Voltage VCC = Min. IOL = 24mA 0.3 0.55 V
VIN = VIH or VIL
Notes:
1. For conditions shown as Min. or Max. use appropriate value specified under Electrical Characteristics for the
applicable device type.
2. Typical values indicate VCC = 5.0V and TA = 25°C.
3. Not more than one output should be shorted and the duration is 1 second.
4. Duration of the condition should not exceed one second.
Table 7. Output Drive Characteristics for FCT16652T
Symbol Parameter Test Conditions(1) Min Typ(2) Max Unit
VOH Output HIGH Voltage VCC = Min. IOH = –3mA 2.5 3.4 V
VIN = VIH or VIL IOH = –15mA 2.4 3.2 V
IOH = –32mA(4) 2.0 3.0 V
VOL Output LOW Voltage VCC = Min. IOL = 64mA 0.3 0.55 V
VIN = VIH or VIL
MDSL-00077-00 QUALITY SEMICONDUCTOR, INC. 5
MARCH 10, 1998
QS74FCT16652T, 162652T PRELIMINARY
Now an Company
Symbol Parameter Test Conditions(1) Typ (2) Max Unit
ICCL Quiescent Power VCC = Max., VIN = GND or VCC 5 500 µA
ICCH Supply Current
ICCZ
ICC Supply Current per VCC = Max., VIN = 3.4V(3) 0.5 1.5 mA
Input @ TTL HIGH
QCCD Supply Current per VCC = Max., Outputs Open VIN = VCC 75 120 µA/
Input per MHz(4) One Bit Toggling VIN = GND MHz
@ 50% Duty Cycle
xDIR = xOE = GND
ICTotal Power VCC = Max., Outputs Open VIN = VCC 0.8 1.7(5) mA
Supply Current(6) One Bit Toggling VIN = GND
@ 50% Duty Cycle VIN = 3.4 V 1.3 3.2(5) mA
fI = 5MHz, VIN = GND
fCP = 10MHz (xCLKBA)
xOEAB = xOEBA = GND
VCC = Max., Outputs Open VIN = VCC 3.8 6.5(5) mA
Sixteen Bits Toggling VIN = GND
@ 50% Duty Cycle VIN = 3.4 V 8.3 20(5) mA
fI = 2.5MHz, VIN = GND
fCP = 10MHz (xCLKBA)
xOEAB = xOEBA = GND
Table 9. Power Supply Characteristics
Notes:
1. For conditions shown as Min. or Max., use the appropriate values specified under Recommended Operating
Conditions for applicable device type.
2. Typical values are at VCC = 5.0V, +25°C ambient.
3. Per TTL driven input (VIN = 3.4V). All Other Inputs at VCC or GND.
4. This parameter is not directly testable, but is derived for use in Total Power Supply Calculations.
5. Values for these conditions are examples of the ICC formula. These limits are guaranteed by design but not tested.
6. IC = IQUIESCENT + IINPUTS = IDYNAMIC.
IC = ICCQ + ICC DHNT + ICCD (fCPNCP/2 + fINI).
ICCQ = Quiescent Current (ICCL, ICCH, and ICCZ).
ICC = Power Supply Current for a TTL-High Input (VIN = 3.4V).
DH = Duty Cycle for TTL High Inputs.
NT = Number of TTL High Inputs.
ICCD = Dynamic Current Caused by an Input Transition Pair (HLH or LHL).
fCP = Clock Frequency for Register devices (Zero for Non-Register Devices).
NCP = Number of Clock Inputs at fCP.
fI = Input Frequency.
NI = Number of Inputs at fI.
6QUALITY SEMICONDUCTOR, INC. MDSL-00077-00
MARCH 10, 1998
QS74FCT16652T, 162652T PRELIMINARY
Now an Company
FCT16652T FCT16652AT FCT16652CT
FCT162652T FCT162652AT FCT162652CT
Symbol Description(1) Min Max Min Max Min Max Unit
tPHL Propagation Delay 2.0 9.0 2.0 6.3 2.0 5.4 ns
tPLH xAx to xBx
tPHL Propagation Delay 2.0 11.0 2.0 7.7 2.0 6.2 ns
tPLH xSBA or xSAB TO xAx, xBx
tPHL Propagation Delay 2.0 9.0 2.0 6.3 2.0 5.7 ns
tPLH xCLKAB or xCLKBA to xAx, xBx
tPZH Output Enable Time 1.5 14.0 1.5 9.8 1.5 7.8 ns
tPZL xOEAB or xOEBA to xAx, xBx
tPHZ Output Disable Time(3) 1.5 9.0 1.5 6.3 1.5 6.3 ns
tPLZ xOEAB or xOEBA to xAx, xBx
tSU Setup Time HIGH or LOW 4.0 2.0 2.0 ns
Bus to Clock
tHHold Time HIGH or LOW 2.0 1.5 1.5 ns
Bus to Clock
tWClock Pulse Width(3) 6.0 5.0 5.0 ns
LOW or HIGH
tSK(O) Output Skew(2) 0.5 0.5 0.5 ns
Table 10. Switching Characteristics Over Operating Range
Recommended Operating Ranges apply unless otherwise specified.
CLOAD = 50pF, RLOAD = 500 unless otherwise noted.
Notes:
1. Minimums guaranteed but not tested. See Test Circuit and Waveforms.
2. Skew between any two outputs of the same package switching in the same direction. This parameter is
guaranteed by design but not tested.
3. This condition is guaranteed by characterization, but not production tested.