FUTURE BUS CONNECTOR SPECIFICATIONS 1F Series Header Sol der Type 2.0mm Pitch 4 Row s Mechanical Contact Retention Force: 1.0Kg min. Electrical Voltage Rating: 750V Current Rating: 1A Contact Resistance: 45m max. Dielectrical Withstanding Voltage: 1000V Insulation Resistance: 1000M min. Physical Housing: LCP, UL 94-0 rated, Ivory White Contact: Phosphor Bronze Plating: See "ORDERING INFORMATION" DRAWING ORDERING I NF OR MATI ON PRODUCT NO.: 1 F 1 1 * * * * - S * * 4 0 * - * * POS. NO.: Lead Free Code: 024=024 pos. 048=048 pos. 072=072 pos. 096=096 pos. 120=120 pos. 192=192 pos. N=None F=Lead Free Mating Area Plating: 1=GOLD FLASH 3=0.76um(30u")MIN. GOLD PLATING 5=1.27um(50u")MIN. GOLD PLATING 6=0.25um(10u")MIN. GOLD PLATING A=0.76um(30u")MIN. FPT PLATING, 0.25um(10u")MIN. GOLD INCLUDED Tail Style: S=Solder Type Package Type: A=Tube Extension Code: N,T,L,M Body Style Mating Length(DIM.M) 1F11024*-S**40*-** 24 11.90 1F11048*-S**40*-** 48 23.90 22.00 1F11072*-S**40*-** 72 35.90 34.00 10.00 1F11096*-S**40*-** 96 47.90 46.00 1F11120*-S**40*-** 120 59.90 58.00 192 95.90 94.00 POS. DIM. A DIM. B 1F11192*-S**40*-** P/N 1=5.00 mm 2=5.75 mm 3=6.50 mm 4=7.25 mm 5=8.00 mm Tail Length(DIM.T) 4=2.65mm All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.