TEA1532AT/N1/DG,11 - NXP Semiconductors

1. General description

The GreenChip™II is the second generation of green Switched Mode Power Supply

(SMPS) controller ICs. Its high level of integration allows the design of a cost effective

power supply with a very low number of external components.

The TEA1532(A)P; TEA1532(A)T can also be used in ﬁxed frequency, Continuous

Conduction Mode (CCM) converter designs for low voltage, high current applications. At

low power (standby) levels, the system operates in cycle skipping mode which minimizes

the switching losses during standby.

The special built-in green functions allow the efﬁciency to be optimum at all power levels.

This holds for quasi-resonant operation at high power levels, as well as ﬁxed frequency

operation with valley switching at medium power levels. At low power (standby) levels, the

system operates in cycle skipping mode with valley detection.

The proprietary high voltage BCD800 process makes direct start-up possible from the

rectiﬁed universal mains voltage in an effective and green way. A second low voltage

BICMOS IC is used for accurate, high speed protection functions and control.

The TEA1532(A)P; TEA1532(A)T enables highly efﬁcient and reliable supplies to be

designed easily.

2. Features

2.1 Distinctive features

■Universal mains supply operation (70 V to 276 VAC)

■High level of integration, resulting in a very low external component count

■Fixed frequency Continuous Conduction Mode (CCM) operation capability

■Quasi-Resonant (QR) Discontinuous Conduction Mode (DCM) operation capability.

2.2 Green features

■Valley or zero voltage switching for minimum switching losses in QR operation

■Cycle skipping mode at very low loads; input power < 300 mW at no-load operation for

a typical adapter application

■On-chip start-up current source.

2.3 Protection features

■Safe restart mode for system fault conditions

■Zero current switch-on in QR mode

TEA1532(A)P; TEA1532(A)T

GreenChipII SMPS control IC

Rev. 02 — 4 February 2005 Product data sheet

Product data sheet Rev. 02 — 4 February 2005 2 of 27

Philips Semiconductors TEA1532(A)P; TEA1532(A)T

GreenChipII SMPS control IC

■Undervoltage protection (foldback during overload)

■IC OverTemperature Protection (OTP) (latched)

■Low and adjustable OverCurrent Protection (OCP) trip level

■Soft (re)start

■Mains voltage-dependent operation-enabling level

■TEA1532AP and TEA1532AT: General purpose input for latched or safe restart

protection and timing, e.g. to be used for overvoltage protection (OVP), output

short-circuit protection or system OTP.

■TEA1532P and TEA1532T: General purpose input for latched protection and timing,

e.g. to be used for OVP, output short-circuit protection or system OTP.

■Brown-out protection.

3. Applications

■Printer adapters and chargers. The device can also be used in all applications that

demand an efﬁcient and cost-effective solution up to 250 W.

4. Ordering information

Table 1: Ordering information

Type number Package

Name Description Version

TEA1532T SO8 plastic small outline package; 8 leads; body

width 3.9 mm SOT96-1

TEA1532AT

TEA1532P DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1

TEA1532AP

Product data sheet Rev. 02 — 4 February 2005 3 of 27

Philips Semiconductors TEA1532(A)P; TEA1532(A)T

GreenChipII SMPS control IC

5. Block diagram

(1) Switch S3 is not controlled in the TEA1532T and TEA1532P (ﬁxed as drawn).

Fig 1. Block diagram

SUPPLY

MANAGEMENT

internal

supply UVLO start

VCC 1

GND S1

CTRL

OSCILLATOR

DCM

AND

CCM

DETECTION

LOGIC

BROWN-OUT

PROTECTION

soft

start

OVER-

TEMPERATURE

PROTECTION

UVLO Q

MAXIMUM

ON-TIME

PROTECTION

POWER-ON

RESET

−1

VALLEY

clamp

DRIVER

START-UP

CURRENT SOURCE

0.5 V

6SENSE

7DRIVER

coa014

5DEM

8DRAIN

OCP

LEB

blank

Iss

Islopecomp

0.63 V

VCC < 4.5 V Q

−50

Iprot(dem)

TEA1532T

TEA1532AT

TEA1532P

TEA1532AP

Osc_Rdy

Duty_Max

SLOPE

COMPENSATION

5.6 V

control

detect

Icharge

PROTECT

5.6 V

Idischarge

300 Ω

protect

detect

3 V

2.5 V

(1)

DCM and CCM

Product data sheet Rev. 02 — 4 February 2005 4 of 27

Philips Semiconductors TEA1532(A)P; TEA1532(A)T

GreenChipII SMPS control IC

6. Pinning information

6.1 Pinning

6.2 Pin description

7. Functional description

The TEA1532(A)P; TEA1532(A)T is the controller of a compact ﬂyback converter, with the

IC situated at the primary side. An auxiliary winding of the transformer provides

demagnetization detection and powers the IC after start-up; see Figure 4.

Fig 2. Pin conﬁguration: TEA1532(A)T

(SOT96-1) Fig 3. Pin conﬁguration: TEA1532(A)P

(SOT97-1)

TEA1532T

TEA1532AT

VCC DRAIN

GND DRIVER

PROTECT SENSE

CTRL DEM

001aaa829

7TEA1532P

TEA1532AP

VCC DRAIN

GND DRIVER

PROTECT SENSE

CTRL DEM

001aaa828

Table 2: Pin description

Symbol Pin Description

VCC 1 supply voltage

GND 2 ground

PROTECT 3 protection and timing input

CTRL 4 control input

DEM 5 input from auxiliary winding for demagnetization timing

SENSE 6 programmable current sense input

DRIVER 7 MOSFET gate driver output

DRAIN 8 drain of the external MOS switch, input for start-up current and

valley sensing

Product data sheet Rev. 02 — 4 February 2005 5 of 27

Philips Semiconductors TEA1532(A)P; TEA1532(A)T

GreenChipII SMPS control IC

The TEA1532(A)P; TEA1532(A)T can operate in multi modes; see Figure 5.

In QR mode, the next converter stroke is started only after demagnetization of the

transformer current (zero current switching), while the drain voltage has reached the

lowest voltage to minimize switching losses (green function). The primary resonant circuit

of primary inductance and drain capacitor ensures this quasi-resonant operation. The

design can be optimized in such a way that zero voltage switching can extend over most of

the universal mains range.

To prevent very high frequency operation at lower loads, the quasi-resonant operation

changes smoothly in ﬁxed frequency Pulse Width Modulation (PWM) control.

Fig 4. Typical conﬁguration

Fig 5. Multi mode and FF-CCM operation

coa015

CVCC

CVIN

TEA1532T

TEA1532AT

TEA1532P

TEA1532AP

Cycle

skip fixed FF-CCM

P (W)

coa017

(kHz)

Product data sheet Rev. 02 — 4 February 2005 6 of 27

Philips Semiconductors TEA1532(A)P; TEA1532(A)T

GreenChipII SMPS control IC

In ﬁxed frequency continuous conduction mode, which can be activated by grounding

pin DEM, the internal oscillator determines the start of the next converter stroke.

In both operating modes, a cycle skipping mode is activated at very low power (standby)

levels.

7.1 Start-up, mains enabling operation level and undervoltage lock out

Refer to Figure 10 and Figure 11. Initially, the IC is self supplying from the rectiﬁed mains

voltage via pin DRAIN. Supply capacitor CVCC (at pin 1) is charged by the internal start-up

current source to a level of about 4 V or higher, depending on the drain voltage. Once the

drain voltage exceeds the Vm (mains-dependent operation-enabling level), the start-up

current source will continue charging capacitor CVCC (switch S1 will be opened); see

Figure 1. The IC will activate the power converter as soon as the voltage on pin VCC

passes the Vstart level. At this moment the IC supply from the high voltage pin is stopped

(green function). The IC supply is taken over by the auxiliary winding of the ﬂyback

converter.

The moment the voltage on pin VCC drops below VUVLO (undervoltage lock out), the IC

stops switching and performs a safe restart from the rectiﬁed mains voltage. In the safe

restart mode the driver output is disabled and pin VCC voltage is recharged via pin DRAIN.

7.2 Supply management

All (internal) reference voltages are derived from a temperature compensated, on-chip

band gap circuit.

7.3 Current control mode

Current control mode is used for its good line regulation behavior.

The on-time is controlled by an internal control voltage, which is compared with the

primary current information. The primary current is sensed across an external resistor.

The driver output is latched in the logic, preventing multiple switch-on.

The internal control voltage is inversely proportional to the external pin CTRL voltage, with

an offset of 1.5 V. This means that a voltage range from 1 V to approximately 1.5 V on

pin CTRL will result in an internal control voltage range from 0.5 V to 0 V (a high external

control voltage results in a low duty cycle).

Fig 6. The Vsense(max) voltage as a function of VCTRL

VCTRL (V)

1 V

(typ)

0.52 V

1.5 V

(typ)

coa016

Vsense(max) (V)

Cycle

skip

active

25 mV

Product data sheet Rev. 02 — 4 February 2005 7 of 27

Philips Semiconductors TEA1532(A)P; TEA1532(A)T

GreenChipII SMPS control IC

7.4 Oscillator

The ﬁxed frequency of the oscillator is set by an internal current source and capacitor.

7.5 Cycle skipping

At very low power levels, a cycle skipping mode activates. An internal control voltage

(Vsense(max)) lower than 25 mV will inhibit switch-on of the external power MOSFET until

this voltage increases to a higher value; see Figure 6.

7.6 Demagnetization (QR operation)

The system will be in Discontinuous Conduction Mode (DCM) (QR operation) when

resistor RDEM is applied. The oscillator will not start a new primary stroke until the previous

secondary stroke has ended.

Demagnetization features a cycle-by-cycle output short-circuit protection which

immediately reduces the frequency (longer off-time), thereby reducing the power level.

Demagnetization recognition is suppressed during the ﬁrst tsupp time (typical 1.5 µs). This

suppression may be necessary in applications where the transformer has a large leakage

inductance and at low output voltages or start-up.

7.7 Continuous Conduction Mode (CCM)

It is also possible to operate the IC in the so-called Fixed Frequency Continuous

Conduction Mode (FF CCM). This mode is activated by connecting pin DEM to ground

and connecting pin DRAIN to the rectiﬁed Vi voltage; see Figure 13.

7.8 OverCurrent Protection (OCP)

The primary current in the transformer is measured accurately by the internal

cycle-by-cycle source current limit circuit using the external sense resistor Rsense.

The accuracy of the current limit circuit allows the transformer core to have a minimum

speciﬁcation for the output power required. The OCP circuit limits the ‘sense’ voltage to an

internal level (the primary peak current in the transformer is also limited). The OCP

detection is suppressed during the leading edge blanking period, tleb generated by the

Leading Edge Blanking (LEB) circuit, to prevent false triggering caused by the switch-on

spikes.

7.9 Control pin protection

If pin CTRL becomes open-circuit or is disconnected, a fault condition is assumed and the

converter will stop switching immediately. Operation recommences when the fault

condition is removed.

7.10 Adjustable slope compensation

A slope compensation function has been added at pin CTRL; see Figure 7. The slope

compensation function prevents sub-harmonic oscillation in CCM at duty cycles over

50 %. The CTRL voltage is modulated by sourcing a (non-constant) current out of

pin CTRL and by adding externally a series resistor Rslopecomp. This increases the CTRL

voltage proportionally with the on-time, which therefore limits the OCP level. A longer

on-time results in a higher CTRL voltage, this increase in CTRL voltage will decrease the

Product data sheet Rev. 02 — 4 February 2005 8 of 27

Philips Semiconductors TEA1532(A)P; TEA1532(A)T

GreenChipII SMPS control IC

on-time. Slope compensation can be adjusted by changing the value of Rslopecomp. Slope

compensation prevents modulation of the on-time (duty cycle) while operating in FF CCM.

A possible drawback of sub-harmonic oscillation can be output voltage ripple.

The source current of pin CTRL is always active. In QR mode, the Rslopecomp resistor is

replaced by a short, so the modulation of the CTRL voltage is almost negligible.

7.11 Minimum and maximum on-time

The minimum on-time of the SMPS is determined by the LEB time (typical 400 ns). The IC

limits the on-time to a maximum time which is dependent on the mode of operation:

QR mode: When the system requires an ‘on-time’ of more than 25 µs, a fault condition is

assumed, the IC stops switching and enters the safe restart mode.

CCM: The driver duty cycle is limited to 70 %. So the maximum on-time is correlated to

the oscillator time which results in an accurate limit of the minimum input voltage of the

ﬂyback converter.

7.12 PROTECT and timing input

The PROTECT input (pin 3) is a multi-purpose (high-impedance) input, which can be used

to switch off the IC and create a relatively long timing function. As soon as the voltage on

this pin rises above 2.5 V, switching stops immediately. For the timing function, a current of

typically 50 µA ﬂows out of pin PROTECT and charges an external capacitor until the

activation level of 2.5 V is reached. This current source is only activated when the

converter is not in regulation, which is detected by the voltage on pin CTRL

(VCTRL < 0.63 V). A (small) discharge current is also implemented to ensure that the

capacitor is not charged, for example, by spikes A MOSFET switch is added to discharge

the external capacitor and ensure a deﬁned start situation. For the TEA1532AP and the

TEA1532AT, the voltage on pin CTRL determines whether the IC enters latched protection

mode, or safe restart protection mode:

Fig 7. Slope compensation

001aaa830

CTRL −1

Slope compensation

current

0.63 V

control

detect

5.6 V

RCTRL

Rslopecomp

Product data sheet Rev. 02 — 4 February 2005 9 of 27

Philips Semiconductors TEA1532(A)P; TEA1532(A)T

GreenChipII SMPS control IC

•When the voltage on pin CTRL is below 0.63 V, the IC is assumed to be out of

regulation (e.g. the control loop is open). In this case activating pin PROTECT

(VPROTECT > 2.5 V) will cause the converter to stop switching. Once VCC drops below

VUVLO, capacitor CVCC will be recharged and the supply will restart. This cycle will be

repeated until the fault condition is removed (safe restart mode).

•When the voltage on pin CTRL is above 0.63 V, the output is assumed to be in

regulation. In this case activating pin PROTECT (VPROTECT > 2.5 V), by external

means, will activate the latch protection of the IC: The voltage on pin VCC will cycle

between Vstart and VUVLO, but the IC will not start switching again until the latch

protection is reset. The latch is reset as soon as VCC drops below 4.5 V (typical value)

(this only occurs when the mains has been disconnected). The internal

overtemperature protection will also trigger this latch; see also Figure 1.

For the TEA1532P and the TEA1532T the IC always enters the latched mode protection

independent of the voltage on pin CTRL.

A voltage higher than 3 V on pin PROTECT will always latch the IC. This is independent of

the state of the IC.

7.13 Valley switching

Refer to Figure 8. A new cycle starts when the power switch is activated. After the on-time

(determined by the sense voltage and the internal control voltage), the switch is opened

and the secondary stroke starts. After the secondary stroke, the drain voltage shows an

oscillation with a frequency of approximately

where Lp is the primary self inductance of the transformer and Cd is the capacitance on

the drain node.

As soon as the oscillator voltage is high again and the secondary stroke has ended, the

circuit waits for the lowest drain voltage before starting a new primary stroke. This method

is called valley detection. Figure 8 shows the drain voltage, valley signal, secondary stroke

signal and the oscillator signal.

In an optimum design, the reﬂected secondary voltage on the primary side will force the

drain voltage to zero. Thus, zero voltage switching is possible, preventing large capacitive

switching losses , and allowing high frequency operation, which

results in small and cost effective magnetics.

2π× LpCd

××

------------------------------------------

---CV

×f××=





Product data sheet Rev. 02 — 4 February 2005 10 of 27

Philips Semiconductors TEA1532(A)P; TEA1532(A)T

GreenChipII SMPS control IC

7.14 Brown-out protection

During the so called brown-out test, the input voltage is slowly decreased. Since the

on-time depends on Vi, long on-times at low Vi can damage the (external) power device.

This is prevented by stopping the converter when the input voltage drops too low.

When the voltage on pin DEM drops below −50 mV during the on-time (QR mode), the

maximum on-time is set to 25 µs. The maximum on-time will be reached while Vi is low.

Subsequently, the IC stops switching and VCC drops below VUVLO. Capacitor CVCC will

only be recharged and the supply will restart only when voltage Vi is high enough (Vm,

also see Section 7.1). In addition to this, a Vi level at which the converter has to enter a

safe restart can be set with a demagnetization resistor. During the primary stroke, the

rectiﬁed mains input voltage is measured by sensing the current drawn from pin DEM.

This current depends on the mains voltage, according to the following formula:

Where:

The latter function requires an on-time of at least 2 µs. This on-time ensures that a reliable

demagnetization current can be measured.

(1) Start of new cycle at lowest drain voltage.

(2) Start of new cycle in a classical PWM system at high drain voltage.

Fig 8. Signals for valley switching

drain

secondary

stroke

mgu235

secondary

ringing

primary

stroke

valley

(2) (1)

secondary

stroke

oscillator

IDEM()

Vaux

RDEM

---------------NV

mains

RDEM

--------------------------

≈≈

NNaux

------------

Product data sheet Rev. 02 — 4 February 2005 11 of 27

Philips Semiconductors TEA1532(A)P; TEA1532(A)T

GreenChipII SMPS control IC

When pin DEM is grounded (CCM), the brown-out protection is disabled. In this case the

duty cycle is limited to 0.7, so at low mains voltage the on-time is limited and therefore the

dissipation in the FET is limited.

7.15 OverTemperature protection (OTP)

The IC provides accurate OTP. The IC will stop switching when the junction temperature

exceeds the thermal shutdown temperature. When VCC drops to VUVLO, capacitor CVCC

will be recharged to the Vstart level, however switching will not restart. Subsequently, VCC

will drop again to VUVLO, etc.

Operation only recommences when VCC drops below a level of about 4.5 V (typically,

when Vmains is disconnected for a short period).

7.16 Soft start-up (pin SENSE)

To prevent transformer rattle at start-up or during hiccup, the transformer peak current is

slowly increased by the soft start function. This can be achieved by inserting a resistor

and a capacitor between pin SENSE (pin 6) and sense resistor Rsense. An internal current

source charges the capacitor to Vsense =I

ss ×Rss (about 0.5 V maximum).

The start level and the time constant of the increasing primary current level can be

adjusted externally by changing the values of Rss and Css.

During the start-up phase, the charging current Iss will ﬂow as long as the voltage on

pin SENSE is below approximately 0.5 V. If the voltage on pin SENSE exceeds 0.5 V, the

soft start current source will start limiting current Iss. At Vstart, the Iss current source is

completely switched off; see Figure 9.

Since the soft start current Iss is subtracted from pin VCC charging current, the Rss value

will affect VCC charging current level by a maximum of 60 µA (typical).

Fig 9. Soft start-up

Iprimary(max) Vocp Iss Rss

×()–

Rsense

------------------------------------------

τRss Css

×=

Css

Rss

SENSE

Rsense

Iss

Vocp

start-up

mgu237

0.5 V

Product data sheet Rev. 02 — 4 February 2005 12 of 27

Philips Semiconductors TEA1532(A)P; TEA1532(A)T

GreenChipII SMPS control IC

7.17 Driver

The driver circuit to the gate of the power MOSFET has a current sourcing capability of

typically 170 mA and a current sink capability of typically 700 mA at VCC of 9.5 V. At

VCC = 15 V, the current sourcing capability is typically 300 mA and the current sink

capability typically 1.2 A. This permits fast turn-on and turn-off of the power MOSFET for

efﬁcient operation.

A low driver source current has been chosen to limit the ∆V/∆t at switch-on. This reduces

Electro Magnetic Interference (EMI) and also limits the current spikes across Rsense.

8. Limiting values

[1] Equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor.

[2] Equivalent to discharging a 200 pF capacitor through a 0.75 µH coil and a 10 Ω resistor.

Table 3: Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are measured

with respect to ground (pin 2); positive currents ﬂow into the chip; pin V

may not be current driven.

The voltage ratings are valid provided other ratings are not violated; current ratings are valid

provided the maximum power rating is not violated.

Symbol Parameter Conditions Min Max Unit

Voltages

VCC supply voltage continuous −0.4 +20 V

VPROTECT voltage on pin PROTECT continuous −0.4 +5 V

VCTRL voltage on pin CTRL −0.4 +5 V

VDEM voltage on pin DEM current limited - - V

VSENSE voltage on pin SENSE current limited −0.4 - V

VDRAIN voltage on pin DRAIN −0.4 +650 V

Currents

ICTRL current on pin CTRL d < 10 % - 50 mA

IDEM current on pin DEM −1000 +250 µA

ISENSE current on pin SENSE −1 +10 mA

IDRIVER current on pin DRIVER d < 10 % −0.8 +2 A

IDRAIN current on pin DRAIN - 5 mA

General

Ptot total power dissipation Tamb <70°C

SO8 package - 0.5 W

DIP8 package - 0.75 W

Tstg storage temperature −55 +150 °C

Tjjunction temperature −20 +145 °C

ESD

VESD electrostatic discharge

voltage class 1

human body model pins 1 to 7 [1] - 2000 V

pin 8 (DRAIN) [1] - 1500 V

machine model [2] - 200 V

Product data sheet Rev. 02 — 4 February 2005 13 of 27

Philips Semiconductors TEA1532(A)P; TEA1532(A)T

GreenChipII SMPS control IC

9. Thermal characteristics

10. Characteristics

Table 4: Thermal characteristics

Symbol Parameter Conditions Typ Unit

Rth(j-a) thermal resistance from

junction to ambient in free air; SO8 package 150 K/W

in free air; DIP8 package 95 K/W

Table 5: Characteristics

amb

=25

C; V

= 15 V; all voltages are measured with respect to ground (pin 2); currents are positive when ﬂowing into

the IC; unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

Start-up current source (pin DRAIN)

IDRAIN supply current drawn from

pin DRAIN VDRAIN > 100 V

VCC = 0 V 1.0 1.2 1.4 mA

with auxiliary supply - 100 300 µA

VBbreakdown voltage 650 - - V

Vmmains-dependent

operation-enabling level 60 - 100 V

Supply voltage management (pin VCC)

Vstart start-up voltage 10.3 11 11.7 V

VUVLO lock-out undervoltage 8.1 8.7 9.3 V

Vhys hysteresis voltage Vstart −VUVLO 2.0 2.3 2.6 V

Ich(h) high charging current VDRAIN > 100 V; VCC <3V −1.2 −1−0.8 mA

Ich(l) low charging current VDRAIN > 100 V;

3V<V

CC <V

UVLO

−1.2 −0.75 −0.45 mA

Irestart restart current VDRAIN > 100 V;

VUVLO <V

CC <V

start

−650 −550 −450 µA

Ioper supply current under normal

operation no load on pin DRIVER 1.1 1.3 1.5 mA

Demagnetization management (pin DEM)

Vth(DEM) demagnetization comparator

threshold voltage 50 80 110 mV

Vth(CCM) continuous conduction mode

detection threshold voltage −80 −50 −20 mV

Vclamp(neg) negative clamp voltage IDEM =−500 µA−0.5 −0.45 −0.40 V

Vclamp(pos) positive clamp voltage IDEM = 250 µA 0.5 0.7 0.9 V

tsupp suppression of transformer

ringing at start of secondary

stroke

1.1 1.5 1.9 µs

Pulse width modulator

ton(min) minimum on-time - tleb -ns

ton(max) maximum on-time QR mode 20 25 30 µs

δmax maximum duty-cycle 67 70 73 %

Product data sheet Rev. 02 — 4 February 2005 14 of 27

Philips Semiconductors TEA1532(A)P; TEA1532(A)T

GreenChipII SMPS control IC

Oscillator

fosc oscillator frequency (ﬁxed

frequency) VCTRL <1V 506375kHz

Duty cycle control (pin CTRL)

Vmin minimum voltage for maximum

duty cycle - 1.0 - V

Vmax maximum voltage for minimum

duty cycle - 1.5 - V

∆Islopecomp/∆t slope compensation current −1.2 −1−0.8 µA/µs

VCTRL(detect) Control detect level 0.56 0.63 0.70 V

Protection and timing input (pin PROTECT)

Vtrip trip level [1] 2.37 2.5 2.63 V

Vtrip(latch) trip level for latch 2.85 3 3.15 V

VCC(latch)(reset) voltage level on pin VCC which

resets the latch VCC(latch) < 2.3 V - 4.5 - V

Icharge charge current VCTRL < 0.63 V −57 −50 −43 µA

Idischarge discharge current - 100 - nA

Valley switch (pin DRAIN)

∆V/∆tvalley valley recognition voltage

change −43 - +43 V/µs

tvalley-swon delay from valley recognition to

switch-on [2] - 150 - ns

Overcurrent and winding short-circuit protection (pin SENSE)

Vsense(max) maximum source voltage for

OCP ∆V/∆t = 0.1 V/µs 0.48 0.52 0.56 V

tPD propagation delay from

detecting Vsense(max) to

switch-off

∆V/∆t = 0.5 V/µs - 140 185 ns

tleb blanking time for current and

winding short-circuit protection 330 400 470 ns

Iss soft start current Vsense <0.5V 456075µA

Brown-out protection (pin DEM)

Ibrown-out brown-out protection current A constant Ibrown-out is drawn

from pin DEM. [3] −68 −60 −52 µA

ton(min)(brown-out) minimum on-time for enabling

the brown-out protection. 1.5 2 2.5 µs

Driver (pin DRIVER)

Isource source current VCC = 9.5 V; VDRIVER =2V - −170 −88 mA

Isink sink current VCC = 9.5 V

VDRIVER = 2 V - 300 - mA

VDRIVER = 9.5 V 400 700 - mA

Vo(max) maximum output voltage VCC > 12 V - 11.5 12 V

Table 5: Characteristics

…continued

amb

=25

C; V

= 15 V; all voltages are measured with respect to ground (pin 2); currents are positive when ﬂowing into

the IC; unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

Product data sheet Rev. 02 — 4 February 2005 15 of 27

Philips Semiconductors TEA1532(A)P; TEA1532(A)T

GreenChipII SMPS control IC

[1] TEA1532AP and TEA1532AT: safe restart; TEA1532P and TEA1532T: latch.

[2] Guaranteed by design.

[3] Vi detection level. Set by the demagnetization resistor RDEM; see Section 7.14.

[4] Valid for VCC >2V.

11. Application information

A converter with the TEA1532(A)P; TEA1532(A)T consists of an input ﬁlter, a transformer

with a third winding (auxiliary), and an output stage with a feedback circuit.

Capacitor CVCC buffers the IC supply voltage, which is powered via the internal current

source, that is connected to the rectiﬁed mains, during start-up and via the auxiliary

winding during operation.

A sense resistor Rsense converts the primary current into a voltage at pin SENSE. The

value of Rsense deﬁnes the maximum primary peak current.

Figure 10 shows a ﬂyback conﬁguration using the discontinuous conduction mode.

Pin PROTECT is used in this example for external overvoltage protection and open loop

or output short-circuit protection. If this pin is not used, it must be tied to ground. Figure 13

shows a ﬂyback conﬁguration using the continuous conduction mode. Pin PROTECT is

used in this example for external overtemperature protection and open loop or output

short-circuit protection.

Temperature protection

Tprot(max) maximum temperature

protection level 130 140 150 °C

Tprot(hyst) hysteresis for the temperature

protection level [4] -8-°C

Table 5: Characteristics

…continued

amb

=25

C; V

= 15 V; all voltages are measured with respect to ground (pin 2); currents are positive when ﬂowing into

the IC; unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

Product data sheet Rev. 02 — 4 February 2005 16 of 27

Philips Semiconductors TEA1532(A)P; TEA1532(A)T

GreenChipII SMPS control IC

Fig 10. Flyback conﬁguration using the discontinuous conduction mode

VCC

Vmains

RCTRL RDEM

Rsense

GND

PROTECT

CTRL

DRAIN

power

MOSFET

SENSE

DEM

DRIVER

Rss

Css

coa011

TEA1532T

TEA1532AT

TEA1532P

TEA1532AP

Product data sheet Rev. 02 — 4 February 2005 17 of 27

Philips Semiconductors TEA1532(A)P; TEA1532(A)T

GreenChipII SMPS control IC

(1) In CCM, the brown-out protection is implemented by the maximum duty cycle in combination

with pin PROTECT.

Fig 11. Typical waveforms 1

001aaa840

VDRIVER

VPROTECT

Start-up

sequence Normal

operation OVP

(TEA1532A) Normal

operation Output

short-circuit

(TEA1532A)

Brown-out(1)

VCC

Vstart

VDRAIN

VUVLO

2.5 V

Product data sheet Rev. 02 — 4 February 2005 18 of 27

Philips Semiconductors TEA1532(A)P; TEA1532(A)T

GreenChipII SMPS control IC

(1) When VPROTECT is forced above 3 V, the protection is always latched. So the IC is not started at

Vstart unless the VCC voltage drops below the VCC(reset) level. This is the same action used for

external OTP compensation described in Section 7.15.

(2) External OTP for TEA1532T, TEA1532P, TEA1532AT and TEA1532AP; OVP and output short

circuit for TEA1532P and TEA1532T.

Fig 12. Typical waveforms 2

001aaa841

VDRIVER

VPROTECT(1)

Start-up

sequence Normal

operation

VCC

Vstart

VDRAIN

VUVLO

2.5 V

Protection

active(2)

Product data sheet Rev. 02 — 4 February 2005 19 of 27

Philips Semiconductors TEA1532(A)P; TEA1532(A)T

GreenChipII SMPS control IC

12. Test information

12.1 Quality information

The

General Quality Speciﬁcation for Integrated Circuits, SNW-FQ-611

is applicable.

(1) Pin PROTECT is used in this example for external OTP and open loop or output short-circuit

protection. Slope compensation is determined by the value of Rslopecomp.

Fig 13. Flyback conﬁguration using the continuous conduction mode

TEA1532T

TEA1532AT

TEA1532P

TEA1532AP

VCC

Vmains

RCTRL

Rsense

GND

PROTECT(1)

CTRL

DRAIN

power

MOSFET

SENSE

DEM

DRIVER

Rss

Css

coa013

Rslopecomp

Product data sheet Rev. 02 — 4 February 2005 20 of 27

Philips Semiconductors TEA1532(A)P; TEA1532(A)T

GreenChipII SMPS control IC

13. Package outline

Fig 14. Package outline SOT96-1 (SO8)

UNIT A

max. A1A2A3bpcD

(1) E(2) (1)

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

inches

1.75 0.25

0.10 1.45

1.25 0.25 0.49

0.36 0.25

0.19 5.0

4.8 4.0

3.8 1.27 6.2

5.8 1.05 0.7

0.6 0.7

0.3 8

0.25 0.10.25

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

1.0

0.4

SOT96-1

detail X

vMA

(A )

pin 1 index

076E03 MS-012

0.069 0.010

0.004 0.057

0.049 0.01 0.019

0.014 0.0100

0.0075 0.20

0.19 0.16

0.15 0.05 0.244

0.228 0.028

0.024 0.028

0.012

0.010.010.041 0.004

0.039

0.016

0 2.5 5 mm

scale

SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

99-12-27

03-02-18

Product data sheet Rev. 02 — 4 February 2005 21 of 27

Philips Semiconductors TEA1532(A)P; TEA1532(A)T

GreenChipII SMPS control IC

Fig 15. Package outline SOT97-1 (DIP8)

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

SOT97-1 99-12-27

03-02-13

UNIT A

max. 12 b1(1) (1) (1)

b2cD E e M Z

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

min. A

max. bmax.

1.73

1.14 0.53

0.38 0.36

0.23 9.8

9.2 6.48

6.20 3.60

3.05 0.2542.54 7.62 8.25

7.80 10.0

8.3 1.154.2 0.51 3.2

inches 0.068

0.045 0.021

0.015 0.014

0.009

1.07

0.89

0.042

0.035 0.39

0.36 0.26

0.24 0.14

0.12 0.010.1 0.3 0.32

0.31 0.39

0.33 0.0450.17 0.02 0.13

050G01 MO-001 SC-504-8

(e )

seating plane

0 5 10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

pin 1 index

DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1

Product data sheet Rev. 02 — 4 February 2005 22 of 27

Philips Semiconductors TEA1532(A)P; TEA1532(A)T

GreenChipII SMPS control IC

14. Soldering

14.1 Introduction

This text gives a very brief insight to a complex technology. A more in-depth account of

soldering ICs can be found in our

Data Handbook IC26; Integrated Circuit Packages

(document order number 9398 652 90011).

There is no soldering method that is ideal for all IC packages. Wave soldering is often

preferred when through-hole and surface mount components are mixed on one

printed-circuit board. Wave soldering can still be used for certain surface mount ICs, but it

is not suitable for ﬁne pitch SMDs. In these situations reﬂow soldering is recommended.

Driven by legislation and environmental forces the worldwide use of lead-free solder

pastes is increasing.

14.2 Through-hole mount packages

14.2.1 Soldering by dipping or by solder wave

Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C

or 265 °C, depending on solder material applied, SnPb or Pb-free respectively.

The total contact time of successive solder waves must not exceed 5 seconds.

The device may be mounted up to the seating plane, but the temperature of the plastic

body must not exceed the speciﬁed maximum storage temperature (Tstg(max)). If the

printed-circuit board has been pre-heated, forced cooling may be necessary immediately

after soldering to keep the temperature within the permissible limit.

14.2.2 Manual soldering

Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the

seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is

less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is

between 300 °C and 400 °C, contact may be up to 5 seconds.

14.3 Surface mount packages

14.3.1 Reﬂow soldering

Reﬂow soldering requires solder paste (a suspension of ﬁne solder particles, ﬂux and

binding agent) to be applied to the printed-circuit board by screen printing, stencilling or

pressure-syringe dispensing before package placement.

Several methods exist for reﬂowing; for example, convection or convection/infrared

heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)

vary between 100 seconds and 200 seconds depending on heating method.

Typical reﬂow peak temperatures range from 215 °Cto270°C depending on solder paste

material. The top-surface temperature of the packages should preferably be kept:

•below 225 °C (SnPb process) or below 245 °C (Pb-free process)

–for all BGA, HTSSON..T and SSOP..T packages

Product data sheet Rev. 02 — 4 February 2005 23 of 27

Philips Semiconductors TEA1532(A)P; TEA1532(A)T

GreenChipII SMPS control IC

–for packages with a thickness ≥2.5 mm

–for packages with a thickness < 2.5 mm and a volume ≥350 mm3 so called

thick/large packages.

•below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a

thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages.

Moisture sensitivity precautions, as indicated on packing, must be respected at all times.

14.3.2 Wave soldering

Conventional single wave soldering is not recommended for surface mount devices

(SMDs) or printed-circuit boards with a high component density, as solder bridging and

non-wetting can present major problems.

To overcome these problems the double-wave soldering method was speciﬁcally

developed.

If wave soldering is used the following conditions must be observed for optimal results:

•Use a double-wave soldering method comprising a turbulent wave with high upward

pressure followed by a smooth laminar wave.

•For packages with leads on two sides and a pitch (e):

–larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be

parallel to the transport direction of the printed-circuit board;

–smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the

transport direction of the printed-circuit board.

The footprint must incorporate solder thieves at the downstream end.

•For packages with leads on four sides, the footprint must be placed at a 45° angle to

the transport direction of the printed-circuit board. The footprint must incorporate

solder thieves downstream and at the side corners.

During placement and before soldering, the package must be ﬁxed with a droplet of

adhesive. The adhesive can be applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C

or 265 °C, depending on solder material applied, SnPb or Pb-free respectively.

A mildly-activated ﬂux will eliminate the need for removal of corrosive residues in most

applications.

14.3.3 Manual soldering

Fix the component by ﬁrst soldering two diagonally-opposite end leads. Use a low voltage

(24 V or less) soldering iron applied to the ﬂat part of the lead. Contact time must be

limited to 10 seconds at up to 300 °C.

When using a dedicated tool, all other leads can be soldered in one operation within

2 seconds to 5 seconds between 270 °C and 320 °C.

Product data sheet Rev. 02 — 4 February 2005 24 of 27

Philips Semiconductors TEA1532(A)P; TEA1532(A)T

GreenChipII SMPS control IC

14.4 Package related soldering information

[1] For more detailed information on the BGA packages refer to the

(LF)BGA Application Note

(AN01026); order a copy from your Philips

Semiconductors sales ofﬁce.

[2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with

respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of

the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the

Data Handbook IC26; Integrated

Circuit Packages; Section: Packing Methods

[3] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

[4] Hot bar soldering or manual soldering is suitable for PMFP packages.

[5] These transparent plastic packages are extremely sensitive to reﬂow soldering conditions and must on no account be processed

through more than one soldering cycle or subjected to infrared reﬂow soldering with peak temperature exceeding 217 °C±10 °C

measured in the atmosphere of the reﬂow oven. The package body peak temperature must be kept as low as possible.

[6] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate

between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the

heatsink surface.

[7] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint

must incorporate solder thieves downstream and at the side corners.

[8] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is deﬁnitely not suitable for

packages with a pitch (e) equal to or smaller than 0.65 mm.

[9] Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is deﬁnitely

not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

[10] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on ﬂex foil.

However, the image sensor package can be mounted by the client on a ﬂex foil by using a hot bar soldering process. The appropriate

soldering proﬁle can be provided on request.

Table 6: Suitability of IC packages for wave, reﬂow and dipping soldering methods

Mounting Package [1] Soldering method

Wave Reﬂow[2] Dipping

Through-hole mount CPGA, HCPGA suitable −−

DBS, DIP, HDIP, RDBS, SDIP, SIL suitable[3] −suitable

Through-hole-surface

mount PMFP[4] not suitable not suitable −

Surface mount BGA, HTSSON..T[5], LBGA,

LFBGA, SQFP, SSOP..T[5],

TFBGA, VFBGA, XSON

not suitable suitable −

DHVQFN, HBCC, HBGA, HLQFP,

HSO, HSOP, HSQFP, HSSON,

HTQFP, HTSSOP, HVQFN,

HVSON, SMS

not suitable[6] suitable −

PLCC[7], SO, SOJ suitable suitable −

LQFP, QFP, TQFP not recommended[7] [8] suitable −

SSOP, TSSOP, VSO, VSSOP not recommended[9] suitable −

CWQCCN..L[10], WQCCN..L[10] not suitable not suitable −

Product data sheet Rev. 02 — 4 February 2005 25 of 27

Philips Semiconductors TEA1532(A)P; TEA1532(A)T

GreenChipII SMPS control IC

15. Revision history

Table 7: Revision history

Document ID Release date Data sheet status Change notice Doc. number Supersedes

TEA1532_2 20050204 Product data sheet - 9397 750 14319 TEA1532_1

Modiﬁcations: •Products TEA1532AT and TEA1532AP added:

–Updated Section 4 “Ordering information”

–Updated Section 6 “Pinning information”

–Changed product numbers in Figure 1,Figure 4,Figure 7,Figure 10, and Figure 13

•Added note to Figure 1

•Modiﬁed Figure 6.

TEA1532_1 20040528 Preliminary data sheet - 9397 750 13113 -

Philips Semiconductors TEA1532(A)P; TEA1532(A)T

GreenChipII SMPS control IC

Product data sheet Rev. 02 — 4 February 2005 26 of 27

16. Data sheet status

[1] Please consult the most recently issued data sheet before initiating or completing a design.

[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at

URL http://www.semiconductors.philips.com.

[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

17. Deﬁnitions

Short-form speciﬁcation — The data in a short-form speciﬁcation is

extracted from a full data sheet with the same type number and title. For

detailed information see the relevant data sheet or data handbook.

Limiting values deﬁnition — Limiting values given are in accordance with

the Absolute Maximum Rating System (IEC 60134). Stress above one or

more of the limiting values may cause permanent damage to the device.

These are stress ratings only and operation of the device at these or at any

other conditions above those given in the Characteristics sections of the

speciﬁcation is not implied. Exposure to limiting values for extended periods

may affect device reliability.

Application information — Applications that are described herein for any

of these products are for illustrative purposes only. Philips Semiconductors

make no representation or warranty that such applications will be suitable for

the speciﬁed use without further testing or modiﬁcation.

18. Disclaimers

Life support — These products are not designed for use in life support

appliances, devices, or systems where malfunction of these products can

reasonably be expected to result in personal injury. Philips Semiconductors

customers using or selling these products for use in such applications do so

at their own risk and agree to fully indemnify Philips Semiconductors for any

damages resulting from such application.

Right to make changes — Philips Semiconductors reserves the right to

make changes in the products - including circuits, standard cells, and/or

software - described or contained herein in order to improve design and/or

performance. When the product is in full production (status ‘Production’),

relevant changes will be communicated via a Customer Product/Process

Change Notiﬁcation (CPCN). Philips Semiconductors assumes no

responsibility or liability for the use of any of these products, conveys no

license or title under any patent, copyright, or mask work right to these

products, and makes no representations or warranties that these products are

free from patent, copyright, or mask work right infringement, unless otherwise

speciﬁed.

19. Trademarks

GreenChip — is a trademark of Koninklijke Philips Electronics N.V.

20. Contact information

For additional information, please visit: http://www.semiconductors.philips.com

For sales ofﬁce addresses, send an email to: sales.addresses@www.semiconductors.philips.com

Level Data sheet status[1] Product status[2] [3] Deﬁnition

I Objective data Development This data sheet contains data from the objective speciﬁcation for product development. Philips

Semiconductors reserves the right to change the speciﬁcation in any manner without notice.

II Preliminary data Qualiﬁcation This data sheet contains data from the preliminary speciﬁcation. Supplementary data will be published

at a later date. Philips Semiconductors reserves the right to change the speciﬁcation without notice, in

order to improve the design and supply the best possible product.

III Product data Production This data sheet contains data from the product speciﬁcation. Philips Semiconductors reserves the

right to make changes at any time in order to improve the design, manufacturing and supply. Relevant

changes will be communicated via a Customer Product/Process Change Notiﬁcation (CPCN).

All rights are reserved. Reproduction in whole or in part is prohibited without the prior

written consent of the copyright owner. The information presented in this document does

not form part of any quotation or contract, is believed to be accurate and reliable and may

be changed without notice. No liability will be accepted by the publisher for any

consequence of its use. Publication thereof does not convey nor imply any license under

patent- or other industrial or intellectual property rights.Date of release: 4 February 2005

Document number: 9397 750 14319

Published in The Netherlands

Philips Semiconductors TEA1532(A)P; TEA1532(A)T

GreenChipII SMPS control IC

21. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

2.1 Distinctive features . . . . . . . . . . . . . . . . . . . . . . 1

2.2 Green features . . . . . . . . . . . . . . . . . . . . . . . . . 1

2.3 Protection features . . . . . . . . . . . . . . . . . . . . . . 1

3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

4 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4

6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4

7 Functional description . . . . . . . . . . . . . . . . . . . 4

7.1 Start-up, mains enabling operation level and

undervoltage lock out . . . . . . . . . . . . . . . . . . . . 6

7.2 Supply management. . . . . . . . . . . . . . . . . . . . . 6

7.3 Current control mode . . . . . . . . . . . . . . . . . . . . 6

7.4 Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

7.5 Cycle skipping. . . . . . . . . . . . . . . . . . . . . . . . . . 7

7.6 Demagnetization (QR operation) . . . . . . . . . . . 7

7.7 Continuous Conduction Mode (CCM). . . . . . . . 7

7.8 OverCurrent Protection (OCP) . . . . . . . . . . . . . 7

7.9 Control pin protection . . . . . . . . . . . . . . . . . . . . 7

7.10 Adjustable slope compensation . . . . . . . . . . . . 7

7.11 Minimum and maximum on-time. . . . . . . . . . . . 8

7.12 PROTECT and timing input . . . . . . . . . . . . . . . 8

7.13 Valley switching. . . . . . . . . . . . . . . . . . . . . . . . . 9

7.14 Brown-out protection. . . . . . . . . . . . . . . . . . . . 10

7.15 OverTemperature protection (OTP) . . . . . . . . 11

7.16 Soft start-up (pin SENSE). . . . . . . . . . . . . . . . 11

7.17 Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 12

9 Thermal characteristics. . . . . . . . . . . . . . . . . . 13

10 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 13

11 Application information. . . . . . . . . . . . . . . . . . 15

12 Test information. . . . . . . . . . . . . . . . . . . . . . . . 19

12.1 Quality information . . . . . . . . . . . . . . . . . . . . . 19

13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 20

14 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

14.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 22

14.2 Through-hole mount packages. . . . . . . . . . . . 22

14.2.1 Soldering by dipping or by solder wave . . . . . 22

14.2.2 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 22

14.3 Surface mount packages . . . . . . . . . . . . . . . . 22

14.3.1 Reﬂow soldering. . . . . . . . . . . . . . . . . . . . . . . 22

14.3.2 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 23

14.3.3 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 23

14.4 Package related soldering information. . . . . . 24

15 Revision history . . . . . . . . . . . . . . . . . . . . . . . 25

16 Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 26

17 Deﬁnitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

18 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

19 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

20 Contact information . . . . . . . . . . . . . . . . . . . . 26