DS15EA101 www.ti.com SNLS235H - SEPTEMBER 2006 - REVISED APRIL 2013 DS15EA101 0.15 to 1.5 Gbps Adaptive Cable Equalizer with LOS Detection Check for Samples: DS15EA101 FEATURES DESCRIPTION * The DS15EA101 is an adaptive equalizer optimized for equalizing data transmitted over copper cables. The DS15EA101 operates over a wide range of data rates from 150 Mbps to 1.5+ Gbps and automatically adapts to equalize any cable length from zero meters to lengths that attenuate the signal by 35 dB at 750 MHz. 1 2 * * * * * * * * Automatic Equalization of Coaxial, Twin-Ax and Twisted Pair Cables High Data Rates: 150 Mbps to 1.5+ Gbps Up to 35 dB of Boost at 750 MHz LOS Detection and Output Enable Single-Ended or Differential Input 50 Differential Outputs Low Power Operation, 210 mW (typ) at 1.5 Gbps Industrial -40C to +85C Temperature Space-Saving 4 x 4 mm WQFN-16 Package APPLICATIONS * * * * The DS15EA101 allows either single-ended or differential input drive. This enables equalization of coaxial cables as well as differential twin-ax and twisted pair cables. Additional features include an LOS output and an output enable which, when tied together, disable the output when no signal is present. The DS15EA101 is powered from a single 3.3V supply and consumes 210 mW at 1.5 Gbps. It operates over the full -40C to +85C industrial temperature range and is available in a space saving 4 x 4 mm WQFN-16 package which allows for high density placement of components in multi-channel applications. Cable Extention Applications Security Cameras Remote LCDs and LED Panels Data Recovery Equalization Typical Application Serializer 50-ohm Coaxial Cable (i.e. Belden 9914) CML DS15BA101 150 Mbps to 1.5 Gbps DS15EA101 Max Cable Loss ~ 35 dB @ 750 MHz Deserializer 100-ohm Differential Cable (i.e. CAT5e/6/7, Twinax) LVDS LVPECL 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2006-2013, Texas Instruments Incorporated DS15EA101 SNLS235H - SEPTEMBER 2006 - REVISED APRIL 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) -0.5V to 3.6V Supply Voltage -0.3V to VCC+0.3V Input Voltage (all inputs) -65C to +150C Storage Temperature Range Junction Temperature +150C Lead Temperature (Soldering 4 Sec) +260C Package Thermal Resistance JA RGH0016A JC RGH0016A +42.1C/W +8.2C/W ESD Rating (HBM) 8 kV ESD Rating (MM) 250V (1) "Absolute Maximum Ratings" are those parameter values beyond which the life and operation of the device cannot be ensured. The stating herein of these maximums shall not be construed to imply that the device can or should be operated at or beyond these values. The table of Electrical Characteristics specifies acceptable device operating conditions. Recommended Operating Conditions Supply Voltage (VCC ) 3.3V 5% Input Coupling Capacitance 1.0 F Loop Capacitor (Connected between CAP+ and CAP-) 1.0 F Operating Free Air Temperature (TA) -40C to +85C DC Electrical Characteristics Over Supply Voltage and Operating Temperature ranges, unless otherwise specified Symbol Parameter VCM Conditions Input Common Mode Voltage VIN (1) (2) Reference . Min IN+, IN- Typ 950 VOS Output Common Mode Voltage VOUT Output Voltage Swing 50 load, differential VLOS LOS Output Voltage Valid signal not present OUT+, OUTLOS ICC Supply Current Min to disable outputs V 750 mVP-P 2.6 V 0.4 EN (2) (3) (4) (5) 2 (5) V 3.0 V Max to enable outputs (1) mVP-P VCC - VOUT/2 Valid signal present EN Input Voltage Units V (3) (4) Input Voltage VIN(EN) Max 1.9 63 0.8 V 77 mA Current flow into device pins is defined as positive. Current flow out of device pins is defined as negative. All voltages are stated referenced to 0 volts. Typical values are stated for VCC = +3.3V and TA = +25C. Specification is ensured by characterization. The maximum input voltage amplitude assumes a DC-balanced signal. Supply current depends on the amount of cable being equalized. The current is highest for short cable and decreases as the cable length is increased. Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: DS15EA101 DS15EA101 www.ti.com SNLS235H - SEPTEMBER 2006 - REVISED APRIL 2013 AC Electrical Characteristics Over Supply Voltage and Operating Temperature ranges, unless otherwise specified Conditions (1) . Symbol Parameter Reference Min IN+, IN- 150 BRIN Input Data Rate tTRJ Total Residual Jitter @ BER-12 1.5 Gbps (2) 25m CAT5e (Belden 1700A), 0.25 UI 1.0 Gbps 50m CAT5e (Belden 1700A), 0.25 UI 0.5 Gbps 100m CAT5e (Belden 1700A), 0.25 UI 1.5 Gbps 50m CAT7 (Siemon Tera), 0.25 UI 1.5 Gbps 75m CAT7 (Siemon Tera), 0.30 UI 1.0 Gbps 100m CAT7 (Siemon Tera), 0.40 UI 1.5 Gbps 200m Belden 9914, 0.25 UI (1) (1) (1) (1) (1) (1) (1) tTLH Transition Time from Low to High 20% - 80%, (3) (3) tTHL Transition Time from High to Low 20% - 80%, ROUT Output Resistance single-ended, (1) (2) (3) (4) OUT+, OUT- (4) Typ Max Units 1500 Mbps 100 220 ps 100 220 ps 50 Typical values are stated for VCC = +3.3V and TA = +25C. The total residual jitter at BER-12 was calculated as DJ+14.1xRJ, where DJ is deterministic jitter and RJ is random jitter. The jitter is expressed as a portion of a unit interval (UI). One UI is a reciprocal of a bit rate (or data rate). For example, a 1.5 Gbps (gigabit per second) signal has 1 / (1.5 Gb/s) = 666.67 ps (picosecond) unit interval. A 0.25 UI jitter is equivalent to 0.25 x 666.67 ps = 166.67 ps. Specification is ensured by characterization. Specification is ensured by design. VCC LOS EN VCC 15 14 13 OUT- 9 GND 8 (GND) 7 4 OUT+ 10 GND GND 11 GND 3 6 2 IN- GND 5 IN+ 12 DAP CAP- 1 CAP+ GND 16 CONNECTION DIAGRAM 16-Pad WQFN Package Number RGH0016A Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: DS15EA101 3 DS15EA101 SNLS235H - SEPTEMBER 2006 - REVISED APRIL 2013 www.ti.com PIN DESCRIPTIONS Pin # 4 Name Description 1 GND Ground pin. 2 IN+ Non-inverting input pin. 3 IN- Inverting input pin. 4 GND Ground pin. 5 CAP+ Loop filter positive pin. 6 CAP- Loop filter negative pin. 7 GND Ground pin. 8 GND Ground pin. 9 GND Ground pin. 10 OUT- Inverting output pin. 11 OUT+ Non-inverting output pin. 12 GND Ground pin. 13 VCC Power supply pin. 14 EN Output enable pin. 15 LOS Los of signal circuitry output pin. 16 VCC Power supply pin. Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: DS15EA101 DS15EA101 www.ti.com SNLS235H - SEPTEMBER 2006 - REVISED APRIL 2013 DEVICE OPERATION Input Interfacing The DS15EA101 accepts either differential or single-ended input. The input must be AC coupled. Transformer coupling is not supported. If the signal is differential, its amplitude must be 800 mVp-p 10% (400 mV singleended). If the signal is single-ended, its amplitude must be 800 mV 10%. Output Interfacing The DS15EA101 uses current mode outputs. They are internally terminated with 50. The following two figures illustrate typical DC-coupled interface to common differential receivers and assume that the receivers have high impedance inputs. While most receivers have an input common mode voltage range that can accomodate CML signals, it is recommended to check respective receiver's datasheet prior to implementing the suggested interface implementations. DS15EA101 Output VCC 50: 50: 100: Differential T-Line IN+ OUT+ 100: LVDS IN- OUT- Figure 1. Typical DS15EA101 Output DC-Coupled Interface to an LVDS Receiver DS15EA101 Output VCC 50: 50: OUT+ 100: Differential T-Line IN+ 100: CML3.3V IN- OUT- Figure 2. Typical DS15EA101 Output DC-Coupled Interface to a CML Receiver Cable Extender Application The DS15EA101 together with the DS15BA101 form a cable extender chipset optimized for extending serial data streams from serializer/deserializer (SerDes) pairs and field programmable gate arrays (FPGAs) over 100 differential (i.e. CAT5e/6/7 and twinax) and 50 coaxial cables. Setting correct DS15BA101 output amplitude and proper cable termination are keys for optimal operation. The following two figures show recommended chipset configuration for 100 differential and 50 coaxial cables. Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: DS15EA101 5 DS15EA101 SNLS235H - SEPTEMBER 2006 - REVISED APRIL 2013 www.ti.com VCC VCC 50: 953: 50: 0.1 PF 0.1 PF 100: Differential TP Cable 100: 1 PF 1 PF RVO IN+ OUT+ IN+ 100: DS15BA101 DS15EA101 1 PF 1 PF IN- OUT- IN- OUT+ OUT- CAP+ CAP- 1 PF Figure 3. Cable Extender Chipset Connection Diagram for 100 Differential Cables VCC VCC 50: 487: 50: 0.1 PF 0.1 PF 50: Coaxial Cable IN+ 100: RVO OUT+ 1 PF 1 PF IN+ 50: DS15BA101 OUT+ DS15EA101 1 PF IN- OUT- IN- 25: OUT- CAP+ CAP- 1 PF Figure 4. Cable Extender Chipset Connection Diagram for 50 Coaxial Cables Reference Design There is a complete reference design (P/N: DriveCable02EVK) available for evaluation of the cable extender chipset (DS15BA101 and DS15EA101). For more information visit http://www.ti.com/tool/drivecable02evk 6 Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: DS15EA101 DS15EA101 www.ti.com SNLS235H - SEPTEMBER 2006 - REVISED APRIL 2013 Typical Performance Maximum Data Rate as a Function of CAT7 (Siemon CAT7 Tera) Length Maximum Data Rate as a Function of CAT5e (Belden 1700A) Length 3.0 3.0 VCC = 3.3V MAXIMUM DATA RATE (Gbps) MAXIMUM DATA RATE (Gbps) 0.5 UI TJ@BERT-12 2.5 0.25 UI TJ@BERT-12 2.0 1.5 1.0 VCC= 3.3V 0.5 TA=25C 2.5 TA = 25 C NRZ PRBS-7 2.0 0.5 UI TJ@BERT-12 1.5 1.0 0.5 0.25 UI TJ@BERT-12 NRZ PRBS-7 0 0 0 20 40 60 80 100 0 25 50 75 100 125 CAT5E LENGTH (m) CAT7 LENGTH (m) Figure 5. Figure 6. Maximum Data Rate as a Function of 50 Coaxial (Belden 9914) Length Residual Jitter as a Function of Data Rate and Temperature for the Chipset with 50m CAT5e 600 RESIDUAL JITTER @ BERT-12 (ps) MAXIMUM DATA RATE (Gbps) 3.0 2.5 2.0 1.5 0.25 UI TJ@BERT-12 0.5 UI TJ@BERT-12 1.0 VCC= 3.3V TA=25 C 0.5 NRZ PRBS-7 0 0 60 120 180 240 VCC = 3.3V 500 0.25 UI 400 0.5 UI 300 85 C 200 -40 C 100 25 C 0 300 50m CAT5e NRZ PRBS-7 0 0.4 0.8 1.2 1.6 2.0 DATA RATE (Gbps) BELDEN 9914 LENGTH (M) Figure 7. Figure 8. Residual Jitter as a Function of Data Rate and Temperature for the Chipset with 75m CAT5e Residual Jitter as a Function of Data Rate and Temperature for the Chipset with 100m CAT5e 600 VCC = 3.3V 75m CAT5e NRZ PRBS-7 500 400 85 C 300 0.5 UI -40 C 200 25 C 100 0 0.25 UI 0 0.4 0.8 1.2 1.6 RESIDUAL JITTER @ BERT-12 (ps) RESIDUAL JITTER @ BERT-12 (ps) 600 2.0 DATA RATE (Gbps) VCC = 3.3V 100m CAT5e NRZ PRBS-7 500 85 C 400 300 0.5 UI -40 C 200 25 C 100 0.25 UI 0 0 0.4 0.8 1.2 1.6 2.0 DATA RATE (Gbps) Figure 9. Figure 10. Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: DS15EA101 7 DS15EA101 SNLS235H - SEPTEMBER 2006 - REVISED APRIL 2013 www.ti.com Typical Performance (continued) 8 A 1.5 Gbps NRZ PRBS-7 After 25m CAT5e V:100 mV / DIV, H:100 ps / DIV An Equalized 1.5 Gbps NRZ PRBS-7 After 25m CAT5e V:100 mV / DIV, H:100 ps / DIV Figure 11. Figure 12. A 1.0 Gbps NRZ PRBS-7 After 50m CAT5e V:100 mV / DIV, H:150 ps / DIV An Equalized 1.0 Gbps NRZ PRBS-7 After 50m CAT5e V:100 mV / DIV, H:150 ps / DIV Figure 13. Figure 14. A 0.5 Gbps NRZ PRBS-7 After 100m CAT5e V:100 mV / DIV, H:400 ps / DIV An Equalized 0.5 Gbps NRZ PRBS-7 After 100m CAT5e V:100 mV / DIV, H:400 ps / DIV Figure 15. Figure 16. Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: DS15EA101 DS15EA101 www.ti.com SNLS235H - SEPTEMBER 2006 - REVISED APRIL 2013 Typical Performance (continued) A 1.5 Gbps NRZ PRBS-7 After 50m CAT7 V:100 mV / DIV, H:100 ps / DIV An Equalized 1.5 Gbps NRZ PRBS-7 After 50m CAT7 V:100 mV / DIV, H:100 ps / DIV Figure 17. Figure 18. An Equalized 1.5 Gbps NRZ PRBS-7 After 75m CAT7 V:100 mV / DIV, H:100 ps / DIV A 1.5 Gbps NRZ PRBS-7 After 75m CAT7 V:100 mV / DIV, H:100 ps / DIV Figure 19. Figure 20. A 1.0 Gbps NRZ PRBS-7 After 100m CAT7 V:100 mV / DIV, H:150 ps / DIV An Equalized 1.0 Gbps NRZ PRBS-7 After 100m CAT7 V:100 mV / DIV, H:150 ps / DIV Figure 21. Figure 22. Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: DS15EA101 9 DS15EA101 SNLS235H - SEPTEMBER 2006 - REVISED APRIL 2013 www.ti.com Typical Performance (continued) 10 A 1.5 Gbps NRZ PRBS-7 After 200m Belden 9914 V:100 mV / DIV, H:100 ps / DIV An Equalized 1.5 Gbps NRZ PRBS-7 After 200m Belden 9914, V:100 mV / DIV, H:100 ps / DIV Figure 23. Figure 24. Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: DS15EA101 DS15EA101 www.ti.com SNLS235H - SEPTEMBER 2006 - REVISED APRIL 2013 REVISION HISTORY Changes from Revision G (April 2013) to Revision H * Page Changed layout of National Data Sheet to TI format .......................................................................................................... 10 Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: DS15EA101 11 PACKAGE OPTION ADDENDUM www.ti.com 23-Aug-2017 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) DS15EA101SQ/NOPB ACTIVE WQFN RGH 16 1000 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 15EA101 DS15EA101SQE/NOPB ACTIVE WQFN RGH 16 250 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 15EA101 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. 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Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 23-Aug-2017 Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 24-Aug-2017 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DS15EA101SQ/NOPB WQFN RGH 16 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 DS15EA101SQE/NOPB WQFN RGH 16 250 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 24-Aug-2017 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS15EA101SQ/NOPB WQFN RGH 16 1000 210.0 185.0 35.0 DS15EA101SQE/NOPB WQFN RGH 16 250 210.0 185.0 35.0 Pack Materials-Page 2 PACKAGE OUTLINE RGH0016A WQFN - 0.8 mm max height SCALE 3.000 PLASTIC QUAD FLATPACK - NO LEAD 4.1 3.9 B A 0.5 0.3 PIN 1 INDEX AREA 0.3 0.2 4.1 3.9 DETAIL OPTIONAL TERMINAL TYPICAL DIM A OPT 1 OPT 1 (0.1) (0.2) C 0.8 MAX SEATING PLANE 0.05 0.00 0.08 2.6 0.1 5 SEE TERMINAL DETAIL (A) TYP 8 EXPOSED THERMAL PAD 12X 0.5 4 9 17 4X 1.5 SYMM 1 12 16X PIN 1 ID (OPTIONAL) 16 SYMM 13 16X 0.3 0.2 0.1 0.05 C A B 0.5 0.3 4214978/B 01/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance. www.ti.com EXAMPLE BOARD LAYOUT RGH0016A WQFN - 0.8 mm max height PLASTIC QUAD FLATPACK - NO LEAD ( 2.6) SYMM 16 13 16X (0.6) (R0.05) TYP 1 12 16X (0.25) SYMM 17 (3.8) (1) 12X (0.5) 9 4 ( 0.2) TYP VIA 8 5 (1) (3.8) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X 0.07 MIN ALL AROUND 0.07 MAX ALL AROUND EXPOSED METAL SOLDER MASK OPENING METAL EXPOSED METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS 4214978/B 01/2017 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. www.ti.com EXAMPLE STENCIL DESIGN RGH0016A WQFN - 0.8 mm max height PLASTIC QUAD FLATPACK - NO LEAD 4X ( 1.15) (0.675) TYP 16 13 17 16X (0.6) 1 12 (0.675) TYP 16X (0.25) SYMM (3.8) 12X (0.5) 9 4 EXPOSED METAL TYP 8 5 (R0.05) TYP SYMM (3.8) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD 17 78% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SCALE:20X 4214978/B 01/2017 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. 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