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LF412-N
SNOSBH7F –APRIL 1999–REVISED SEPTEMBER 2014
LF412-N Low Offset, Low Drift Dual JFET Input Operational Amplifier
1 Features 3 Description
These devices are low cost, high speed, JFET input
1• Internally Trimmed Offset Voltage: 1 mV (Max) operational amplifiers with very low input offset
• Input Offset Voltage Drift: 7 µV/°C (Typ) voltage and input offset voltage drift. They require low
• Low Input Bias Current: 50 pA supply current yet maintain a large gain bandwidth
product and fast slew rate. In addition, well matched
• Low Input Noise Current: 0.01 pA / √Hz high voltage JFET input devices provide very low
• Wide Gain Bandwidth: 3 MHz (Min) input bias and offset currents. The LF412-N dual is
• High Slew Rate: 10V/µs (Min) pin compatible with the LM1558, allowing designers
to immediately upgrade the overall performance of
• Low Supply Current: 1.8 mA/Amplifier existing designs.
• High Input Impedance: 1012ΩThese amplifiers may be used in applications such as
• Low Total Harmonic Distortion: ≤0.02% high speed integrators, fast D/A converters, sample
• Low 1/f Noise Corner: 50 Hz and hold circuits and many other circuits requiring low
• Fast Settling Time to 0.01%: 2 µs input offset voltage and drift, low input bias current,
high input impedance, high slew rate and wide
2 Applications bandwidth.
• High Speed Integrators Device Information(1)
• Fast D/A Converters PART NUMBER PACKAGE BODY SIZE (NOM)
• Sample and Hold Circuits LF412ACN PDIP 9.59 mm x 6.35 mm
LF412CN PDIP 9.59 mm x 6.35 mm
LF412MH TO 9.14 mm diameter
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Inverting Amplifier
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LF412-N
SNOSBH7F –APRIL 1999–REVISED SEPTEMBER 2014
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Table of Contents
7.2 Functional Block Diagram....................................... 12
1 Features.................................................................. 17.3 Feature Description................................................. 12
2 Applications ........................................................... 17.4 Device Functional Modes........................................ 13
3 Description............................................................. 18 Application and Implementation ........................ 14
4 Revision History..................................................... 28.1 Application Information............................................ 14
5 Pin Configuration and Functions......................... 28.2 Typical Application ................................................. 14
6 Specifications......................................................... 49 Power Supply Recommendations...................... 16
6.1 Absolute Maximum Ratings ...................................... 410 Layout................................................................... 16
6.2 Handling Ratings....................................................... 410.1 Layout Guidelines ................................................. 16
6.3 Recommended Operating Conditions....................... 410.2 Layout Example .................................................... 16
6.4 Thermal Information.................................................. 511 Device and Documentation Support................. 17
6.5 DC Electrical Characteristics ................................... 511.1 Trademarks........................................................... 17
6.6 AC Electrical Characteristics..................................... 511.2 Electrostatic Discharge Caution............................ 17
6.7 Typical Characteristics.............................................. 711.3 Glossary................................................................ 17
7 Detailed Description............................................ 12 12 Mechanical, Packaging, and Orderable
7.1 Overview................................................................. 12 Information........................................................... 17
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision E (March 2014) to Revision F Page
• Updated datasheet to new TI layout ...................................................................................................................................... 1
• Deleted note. ......................................................................................................................................................................... 5
• Deleted ΔVOS/ΔT Max specification for LF412A. ................................................................................................................... 5
• Deleted ΔVOS/ΔT Max specification for LF412. ..................................................................................................................... 5
• Added Application Note........................................................................................................................................................ 14
Changes from Revision D (March 2013) to Revision E Page
• Changed layout of National Data Sheet to TI format ........................................................................................................... 14
5 Pin Configuration and Functions
TO Package
See Package Number NEV0008A
Top View
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PDIP/CDIP Package
See Package Number P0008E or NAB0008A
Top View
Pin Functions
PIN I/O DESCRIPTION
NAME NO.
Output A 1 O Amplifier A Output
Inverting 2 I Amplifier A Inverting Input
Input A
Non-Inverting 3 I Amplifier A Non-Inverting Input
Input A
V- 4 P Negative Supply
Non-Inverting 5 I Amplifier B Non-Inverting Input
Input B
Inverting 6 I Amplifier B Inverting Input
Input B
Output B 7 O Amplifier B Output
V+ 8 P Positive Supply
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)(2)
LF412A LF412 UNIT
MIN MAX MIN MAX
Supply Voltage –22 22 –18 18 V
Differential Input Voltage –38 38 –30 30 V
Input voltage Range(3)
Output Short Circuit Duration(4) Continuous Continuous
TO Package PDIP Package
Power Dissipation(5) See (6) 670 mW
Tjmax 150 115 °C
Operating Temp. Range See (7) See (7)
Lead Temp. (Soldering, 10 sec.) 260 260 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Refer to RETS412X for LF412MH and LF412MJ military specifications.
(3) Unless otherwise specified the absolute maximum negative input voltage is equal to the negative power supply voltage.
(4) Any of the amplifier outputs can be shorted to ground indefintely, however, more than one should not be simultaneously shorted as the
maximum junction temperature will be exceeded.
(5) Max. Power Dissipation is defined by the package characteristics. Operating the part near the Max. Power Dissipation may cause the
part to operate outside guaranteed limits.
(6) For operating at elevated temperature, these devices must be derated based on a thermal resistance of θjA.
(7) These devices are available in both the commercial temperature range 0°C≤TA≤70°C and the military temperature range
−55°C≤TA≤125°C. The temperature range is designated by the position just before the package type in the device number. A “C”
indicates the commercial temperature range and an “M” indicates the military temperature range. The military temperature range is
available in TO package only. In all cases the maximum operating temperature is limited by internal junction temperature Tjmax.
6.2 Handling Ratings TO and PDIP Package UNIT
MIN MAX
Tstg Storage temperature range −65 150 °C
Human body model (HBM), -1700 1700(2)
per ANSI/ESDA/JEDEC JS-001, all pins(1)
V(ESD) Electrostatic discharge V
Charged device model (CDM),
per JEDEC specification JESD22-C101, all pins(3)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) Human body model, 1.5 kΩin series with 100 pF.
(3) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT
Supply Voltage LF412A ±20 V
Supply Voltage LF412 ±15 V
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6.4 Thermal Information
THERMAL METRIC(1) TO Package PDIP Package UNIT
RθJA Junction-to-ambient thermal resistance (Typical) 152 115
RθJC(top) Junction-to-case (top) thermal resistance
RθJB Junction-to-board thermal resistance °C/W
ψJT Junction-to-top characterization parameter
ψJB Junction-to-board characterization parameter
RθJC(bot) Junction-to-case (bottom) thermal resistance
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
6.5 DC Electrical Characteristics
over operating free-air temperature range (unless otherwise noted) LF412A(1) LF412(1)
PARAMETER TEST CONDITIONS UNIT
MIN TYP MAX MIN TYP MAX
VOS Input Offset Voltage RS=10 kΩ, TA=25°C 0.5 1.0 1.0 3.0 mV
ΔVOS/ΔAverage TC of Input RS=10 kΩ7 7 μV/°C
T Offset Voltage Tj=25°C 25 100 25 100 pA
IOS Input Offset Current VS=±15V(1)(2) Tj=70°C 2 2 nA
Tj=125°C 25 25 nA
Tj=25°C 50 200 50 200 pA
IBInput Bias Current VS=±15V(1)(2) Tj=70°C 4 4 nA
Tj=125°C 50 50 nA
RIN Input Resistance Tj=25°C 1012 1012 Ω
RL=2k, TA=25°C, VS=±15V, 50 200 25 200
Large Signal VO=±10V
AVOL V/mV
Voltage Gain Over Temperature 25 200 15 200
VOOutput Voltage Swing VS=±15V, RL=10k ±12 ±13.5 ±12 ±13.5 V
±16 +19.5 ±11 +14.5 V
Input Common-Mode
VCM Voltage Range −16.5 −11.5 V
Common-Mode
CMRR RS≤10k 80 100 70 100 dB
Rejection Ratio
Supply Voltage
PSRR See(3) 80 100 70 100 dB
Rejection Ratio
ISSupply Current VO= 0V, RL=∞3.6 5.6 3.6 6.5 mA
(1) Unless otherwise specified, the specifications apply over the full temperature range and for VS=±20V for the LF412A and for VS=±15V
for the LF412. VOS, IB, and IOS are measured at VCM=0.
(2) The input bias currents are junction leakage currents which approximately double for every 10°C increase in the junction temperature,
Tj. Due to limited production test time, the input bias currents measured are correlated to junction temperature. In normal operation the
junction temperature rises above the ambient temperature as a result of internal power dissipation, PD. Tj=TA+θjA PDwhere θjA is the
thermal resistance from junction to ambient. Use of a heat sink is recommended if input bias current is to be kept to a minimum.
(3) Supply voltage rejection ratio is measured for both supply magnitudes increasing or decreasing simultaneously in accordance with
common practice. VS= ±6V to ±15V.
6.6 AC Electrical Characteristics
over operating free-air temperature range (unless otherwise noted) LF412A(1) LF412(1)
PARAMETER TEST CONDITIONS UNIT
MIN TYP MAX MIN TYP MAX
Amplifier to TA=25°C, f=1 Hz-20 kHz −120 −120 dB
Amplifier Coupling (Input Referred)
(1) Unless otherwise specified, the specifications apply over the full temperature range and for VS=±20V for the LF412A and for VS=±15V
for the LF412. VOS, IB, and IOS are measured at VCM=0.
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AC Electrical Characteristics (continued)
over operating free-air temperature range (unless otherwise noted) LF412A(1) LF412(1)
PARAMETER TEST CONDITIONS UNIT
MIN TYP MAX MIN TYP MAX
SR Slew Rate VS=±15V, TA=25°C 10 15 8 15 V/μs
GBW Gain-Bandwidth Product VS=±15V, TA=25°C 3 4 2.7 4 MHz
AV=+10, RL=10k,
THD Total Harmonic Dist VO=20 Vp-p, ≤0.02% ≤0.02%
BW=20 Hz-20 kHz
Equivalent Input TA=25°C, RS=100Ω, nV /
en25 25
Noise Voltage f=1 kHz √Hz
Equivalent Input pA /
inTA=25°C, f=1 kHz 0.01 0.01
Noise Current √Hz
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6.7 Typical Characteristics
Figure 2. Input Bias Current
Figure 1. Input Bias Current
Figure 4. Positive Common-Mode
Figure 3. Supply Current Input Voltage Limit
Figure 5. Negative Common-Mode Figure 6. Positive Current Limit
Input Voltage Limit
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Typical Characteristics (continued)
Figure 7. Negative Current Limit Figure 8. Output Voltage Swing
Figure 10. Gain Bandwidth
Figure 9. Output Voltage Swing
Figure 11. Bode Plot Figure 12. Slew Rate
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Typical Characteristics (continued)
Figure 13. Distortion vs Figure 14. Undistorted Output Voltage
Frequency Swing
Figure 16. Common-Mode Rejection
Figure 15. Open Loop Frequency Ratio
Response
Figure 17. Power Supply Rejection Figure 18. Equivalent Input Noise
Ratio Voltage
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Typical Characteristics (continued)
Figure 19. Open Loop Voltage Gain Figure 20. Output Impedance
Figure 22. Small Signal Inverting
Figure 21. Inverter Settling Time (RL= 2 kΩ, CL= 10 pF)
Figure 23. Small Signal Non-Inverting Figure 24. Large Signal Inverting
(RL= 2 kΩ, CL= 10 pF) (RL= 2 kΩ, CL= 10 pF)
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Typical Characteristics (continued)
Figure 26. Current Limit (RL=100Ω)
Figure 25. Large Signal Non-Inverting (CL= 10 pF)
(RL= 2 kΩ, CL= 10 pF)
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7 Detailed Description
7.1 Overview
The LF412 devices are low cost, high speed, JFET input operational amplifiers with very low input offset voltage
and input offset voltage drift. They require low supply current yet maintain a large gain bandwidth product and
fast slew rate. In addition, well matched high voltage JFET input devices provide very low input bias and offset
currents. The LF412-N dual is pin compatible with the LM1558, allowing designers to immediately upgrade the
overall performance of existing designs.
These amplifiers may be used in applications such as high speed integrators, fast D/A converters, sample and
hold circuits and many other circuits requiring low input offset voltage and drift, low input bias current, high input
impedance, high slew rate and wide bandwidth.
7.2 Functional Block Diagram
Figure 27. Each Amplifier
7.3 Feature Description
The amplifier's differential inputs consist of a non-inverting input (+IN) and an inverting input (-IN). The amplifier
amplifies only the difference in voltage between the two inputs, which is called the differential input voltage. The
output voltage of the op-amp VOUT is given by the equation VOUT = AOL(IN+ - IN-).
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The LF412-N series of JFET input dual op amps are internally trimmed (BI-FET II™) providing very low input
offset voltages and input offset voltage drift. These JFETs have large reverse breakdown voltages from gate to
source and drain eliminating the need for clamps across the inputs. Therefore, large differential input voltages
can easily be accommodated without a large increase in input current. The maximum differential input voltage is
independent of the supply voltages. However, neither of the input voltages should be allowed to exceed the
negative supply as this will cause large currents to flow which can result in a destroyed unit.
8.2 Typical Application
Figure 29. Single Supply Sample and Hold
8.2.1 Design Requirements
Single supply.
8.2.2 Detailed Design Procedure
Exceeding the negative common-mode limit on either input will cause a reversal of the phase to the output and
force the amplifier output to the corresponding high or low state.
Exceeding the negative common-mode limit on both inputs will force the amplifier output to a high state. In
neither case does a latch occur since raising the input back within the common-mode range again puts the input
stage and thus the amplifier in a normal operating mode.
Exceeding the positive common-mode limit on a single input will not change the phase of the output, however, if
both inputs exceed the limit, the output of the amplifier may be forced to a high state.BI-FET II™
The amplifiers will operate with a common-mode input voltage equal to the positive supply; however, the gain
bandwidth and slew rate may be decreased in this condition. When the negative common-mode voltage swings
to within 3V of the negative supply, an increase in input offset voltage may occur.
Each amplifier is individually biased by a zener reference which allows normal circuit operation on ±6.0V power
supplies. Supply voltages less than these may result in lower gain bandwidth and slew rate.
The amplifiers will drive a 2 kΩload resistance to ±10V over the full temperature range. If the amplifier is forced
to drive heavier load currents, however, an increase in input offset voltage may occur on the negative voltage
swing and finally reach an active current limit on both positive and negative swings.
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(2.5ms/DIV)
(V)
0
2
4
6
8
10
D001
Output
Input
Sample and Hold Signal
LF412-N
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Typical Application (continued)
Precautions should be taken to ensure that the power supply for the integrated circuit never becomes reversed in
polarity or that the unit is not inadvertently installed backwards in a socket as an unlimited current surge through
the resulting forward diode within the IC could cause fusing of the internal conductors and result in a destroyed
unit.
As with most amplifiers, care should be taken with lead dress, component placement and supply decoupling in
order to ensure stability. For example, resistors from the output to an input should be placed with the body close
to the input to minimize “pick-up” and maximize the frequency of the feedback pole by minimizing the
capacitance from the input to ground.
A feedback pole is created when the feedback around any amplifier is resistive. The parallel resistance and
capacitance from the input of the device (usually the inverting input) to AC ground set the frequency of the pole.
In many instances the frequency of this pole is much greater than the expected 3 dB frequency of the closed
loop gain and consequently there is negligible effect on stability margin. However, if the feedback pole is less
than approximately 6 times the expected 3 dB frequency a lead capacitor should be placed from the output to the
input of the op amp. The value of the added capacitor should be such that the RC time constant of this capacitor
and the resistance it parallels is greater than or equal to the original feedback pole time constant.
8.2.3 Application Curves
Figure 30. Sample and Hold Waveforms
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9 Power Supply Recommendations
For proper operation, the power supplies must be properly decoupled. For decoupling the supply lines it is
suggested that 0.1µF capacitors be placed as close as possible to the op amp power supply pins. The minimum
power supply voltage is ±5V.
10 Layout
10.1 Layout Guidelines
As with most amplifiers, care should be taken with lead dress, component placement and supply decoupling in
order to ensure stability. For example, resistors from the output to an input should be placed with the body close
to the input to minimize “pick-up” and maximize the frequency of the feedback pole by minimizing the
capacitance from the input to ground.
10.2 Layout Example
Figure 31. LF412 Layout
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11 Device and Documentation Support
11.1 Trademarks
BI-FET II is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.2 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.3 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LF412ACN/NOPB ACTIVE PDIP P 8 40 Green (RoHS
& no Sb/Br) CU SN Level-1-NA-UNLIM 0 to 70 LF
412ACN
LF412CN/NOPB ACTIVE PDIP P 8 40 Green (RoHS
& no Sb/Br) CU SN Level-1-NA-UNLIM 0 to 70 LF
412CN
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
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Addendum-Page 2
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DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN
CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN
ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949
and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.
Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such
products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards
and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must
ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in
life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.
Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life
support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all
medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.
TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).
Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications
and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory
requirements in connection with such selection.
Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s non-
compliance with the terms and provisions of this Notice.
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