Not recommended for new designs. Please use SST38VF6401/6402/6403/64040 64 Mbit (x16) Multi-Purpose Flash Plus SST39VF6401B / SST39VF6402B A Microchip Technology Company Not Recommended for New Designs The SST39VF6401B / SST39VF6402B devices are 4M x16, CMOS Multi-Purpose Flash Plus (MPF+) manufactured with SST proprietary, high performance CMOS SuperFlash technology. The split-gate cell design and thick-oxide tunneling injector attain better reliability and manufacturability compared with alternate approaches. The SST39VF6401B / SST39VF6402B write (Program or Erase) with a 2.7-3.6V power supply. These devices conform to JEDEC standard pinouts for x16 memories and are command set compatible with other Flash devices, enabling customers to save time and resources in implementation. Features * Organized as 4M x16 * Fast Read Access Time: - 70 ns * Single Voltage Read and Write Operations * Latched Address and Data - 2.7-3.6V * Superior Reliability * Fast Erase and Word-Program: - Endurance: 100,000 Cycles (Typical) - Greater than 100 years Data Retention * Low Power Consumption (typical values at 5 MHz) - Active Current: 9 mA (typical) - Standby Current: 3 A (typical) - Auto Low Power Mode: 3 A (typical) * Hardware Block-Protection/WP# Input Pin - Top Block-Protection (top 32 KWord) for SST39VF6402B - Bottom Block-Protection (bottom 32 KWord) for SST39VF6401B * Sector-Erase Capability - Uniform 2 KWord sectors * Block-Erase Capability - Uniform 32 KWord blocks * Chip-Erase Capability * Erase-Suspend/Erase-Resume Capabilities * Hardware Reset Pin (RST#) - Sector-Erase Time: 18 ms (typical) - Block-Erase Time: 18 ms (typical) - Chip-Erase Time: 40 ms (typical) - Word-Program Time: 7 s (typical) * Automatic Write Timing - Internal VPP Generation * End-of-Write Detection - Toggle Bits - Data# Polling * CMOS I/O Compatibility * JEDEC Standard - Flash EEPROM Pin Assignments - Software command sequence compatibility - Address format is 11 bits, A10-A0 - Block-Erase 6th Bus Write Cycle is 30H - Sector-Erase 6th Bus Write Cycle is 50H * Packages Available - 48-lead TSOP (12mm x 20mm) - 48-ball TFBGA (8mm x 10mm) * All devices are RoHS compliant * Security-ID Feature - SST: 128 bits; User: 128 bits (c)2011 Silicon Storage Technology, Inc. www.microchip.com DS25008A 08/11 64 Mbit Multi-Purpose Flash Plus SST39VF6401B / SST39VF6402B A Microchip Technology Company Not Recommended for New Designs Product Description The SST39VF640xB devices are 4M x16 CMOS Multi-Purpose Flash Plus (MPF+) manufactured with SST's proprietary, high-performance CMOS SuperFlash technology. The split-gate cell design and thick-oxide tunneling injector attain better reliability and manufacturability compared with alternate approaches. The SST39VF640xB write (Program or Erase) with a 2.7-3.6V power supply. These devices conform to JEDEC standard pin assignments for x16 memories. Featuring high performance Word-Program, the SST39VF640xB devices provide a typical Word-Program time of 7 sec. These devices use Toggle Bit or Data# Polling to indicate the completion of Program operation. To protect against inadvertent write, they have on-chip hardware and Software Data Protection schemes. Designed, manufactured, and tested for a wide spectrum of applications, these devices are offered with a guaranteed typical endurance of 100,000 cycles. Data retention is rated at greater than 100 years. The SST39VF640xB devices are suited for applications that require convenient and economical updating of program, configuration, or data memory. For all system applications, they significantly improve performance and reliability, while lowering power consumption. They inherently use less energy during Erase and Program than alternative flash technologies. The total energy consumed is a function of the applied voltage, current, and time of application. Since for any given voltage range, the SuperFlash technology uses less current to program and has a shorter erase time, the total energy consumed during any Erase or Program operation is less than alternative flash technologies. These devices also improve flexibility while lowering the cost for program, data, and configuration storage applications. The SuperFlash technology provides fixed Erase and Program times, independent of the number of Erase/Program cycles that have occurred. Therefore the system software or hardware does not have to be modified or de-rated as is necessary with alternative flash technologies, whose Erase and Program times increase with accumulated Erase/Program cycles. To meet high-density, surface mount requirements, the SST39VF640xB devices are offered in 48-lead TSOP and 48-ball TFBGA packages. See Figures and 2 for pin assignments. (c)2011 Silicon Storage Technology, Inc. DS25008A 2 08/11 64 Mbit Multi-Purpose Flash Plus SST39VF6401B / SST39VF6402B A Microchip Technology Company Not Recommended for New Designs Block Diagram X-Decoder Memory Address SuperFlash Memory Address Buffer Latches Y-Decoder CE# OE# WE# WP# RESET# I/O Buffers and Data Latches Control Logic DQ15 - DQ0 1288 B1.0 Figure 1: Block Diagram (c)2011 Silicon Storage Technology, Inc. DS25008A 3 08/11 64 Mbit Multi-Purpose Flash Plus SST39VF6401B / SST39VF6402B A Microchip Technology Company Not Recommended for New Designs Pin Assignments A15 A14 A13 A12 A11 A10 A9 A8 A19 A20 WE# RST# A21 WP# NC A18 A17 A7 A6 A5 A4 A3 A2 A1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 A16 NC VSS DQ15 DQ7 DQ14 DQ6 DQ13 DQ5 DQ12 DQ4 VDD DQ11 DQ3 DQ10 DQ2 DQ9 DQ1 DQ8 DQ0 OE# VSS CE# A0 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 Standard Pinout Top View Die Up 1288 48-tsop P1.0 Pin Assignments for 48-lead TSOP 6 5 4 3 2 1 A13 A12 A14 A15 A16 NC DQ15 VSS A9 A10 A11 DQ7 DQ14 DQ13 DQ6 WE# RST# A21 A19 DQ5 DQ12 VDD DQ4 NC WP# A18 A20 DQ2 DQ10 DQ11 DQ3 A7 A17 A6 A5 DQ0 DQ8 DQ9 DQ1 A3 A4 A2 A1 A0 CE# OE# VSS A8 A B C D E F G H 1288 4-tfbga B1K P2.0 TOP VIEW (balls facing down) Figure 2: pin assignments for 48-ball TFBGA (c)2011 Silicon Storage Technology, Inc. DS25008A 4 08/11 64 Mbit Multi-Purpose Flash Plus SST39VF6401B / SST39VF6402B A Microchip Technology Company Not Recommended for New Designs Table 1: Pin Description Symbol Pin Name Functions AMS1-A0 Address Inputs To provide memory addresses. During Sector-Erase AMS-A11 address lines will select the sector. During Block-Erase AMS-A15 address lines will select the block. DQ15-DQ0 Data Input/output To output data during Read cycles and receive input data during Write cycles. Data is internally latched during a Write cycle. The outputs are in tri-state when OE# or CE# is high. WP# Write Protect To protect the top/bottom boot block from Erase/Program operation when grounded. RST# Reset To reset and return the device to Read mode. CE# Chip Enable To activate the device when CE# is low. OE# Output Enable To gate the data output buffers. WE# Write Enable To control the Write operations. To provide power supply voltage: 2.7-3.6V VDD Power Supply VSS Ground NC No Connection Unconnected pins. T1.0 25008 1. AMS = Most significant address AMS = A21 for SST39VF640xB (c)2011 Silicon Storage Technology, Inc. DS25008A 5 08/11 64 Mbit Multi-Purpose Flash Plus SST39VF6401B / SST39VF6402B A Microchip Technology Company Not Recommended for New Designs Device Operation Commands are used to initiate the memory operation functions of the device. Commands are written to the device using standard microprocessor write sequences. A command is written by asserting WE# low while keeping CE# low. The address bus is latched on the falling edge of WE# or CE#, whichever occurs last. The data bus is latched on the rising edge of WE# or CE#, whichever occurs first. The SST39VF640xB also have the Auto Low Power mode which puts the device in a near standby mode after data has been accessed with a valid Read operation. This reduces the IDD active read current from typically 9 mA to typically 3 A. The Auto Low Power mode reduces the typical IDD active read current to the range of 2 mA/MHz of Read cycle time. The device exits the Auto Low Power mode with any address transition or control signal transition used to initiate another Read cycle, with no access time penalty. Note that the device does not enter Auto-Low Power mode after power-up with CE# held steadily low, until the first address transition or CE# is driven high. Read The Read operation of the SST39VF640xB is controlled by CE# and OE#, both have to be low for the system to obtain data from the outputs. CE# is used for device selection. When CE# is high, the chip is deselected and only standby power is consumed. OE# is the output control and is used to gate data from the output pins. The data bus is in high impedance state when either CE# or OE# is high. Refer to the Read cycle timing diagram for further details (Figure 3). Word-Program Operation The SST39VF640xB are programmed on a word-by-word basis. Before programming, the sector where the word exists must be fully erased. The Program operation is accomplished in three steps. The first step is the three-byte load sequence for Software Data Protection. The second step is to load word address and word data. During the Word-Program operation, the addresses are latched on the falling edge of either CE# or WE#, whichever occurs last. The data is latched on the rising edge of either CE# or WE#, whichever occurs first. The third step is the internal Program operation which is initiated after the rising edge of the fourth WE# or CE#, whichever occurs first. The Program operation, once initiated, will be completed within 10 s. See Figures 4 and 5 for WE# and CE# controlled Program operation timing diagrams and Figure 19 for flowcharts. During the Program operation, the only valid reads are Data# Polling and Toggle Bit. During the internal Program operation, the host is free to perform additional tasks. Any commands issued during the internal Program operation are ignored. During the command sequence, WP# should be statically held high or low. Sector/Block-Erase Operation The Sector- (or Block-) Erase operation allows the system to erase the device on a sector-by-sector (or block-by-block) basis. The SST39VF640xB offer both Sector-Erase and Block-Erase mode. The sector architecture is based on uniform sector size of 2 KWord. The Block-Erase mode is based on uniform block size of 32 KWord. The Sector-Erase operation is initiated by executing a six-byte command sequence with Sector-Erase command (50H) and sector address (SA) in the last bus cycle. The BlockErase operation is initiated by executing a six-byte command sequence with Block-Erase command (30H) and block address (BA) in the last bus cycle. The sector or block address is latched on the falling edge of the sixth WE# pulse, while the command (50H or 30H) is latched on the rising edge of the sixth WE# pulse. The internal Erase operation begins after the sixth WE# pulse. The End-of-Erase operation can be determined using either Data# Polling or Toggle Bit methods. See Figures 9 and 10 for tim- (c)2011 Silicon Storage Technology, Inc. DS25008A 6 08/11 64 Mbit Multi-Purpose Flash Plus SST39VF6401B / SST39VF6402B A Microchip Technology Company Not Recommended for New Designs ing waveforms and Figure 23 for the flowchart. Any commands issued during the Sector- or BlockErase operation are ignored. When WP# is low, any attempt to Sector- (Block-) Erase the protected block will be ignored. During the command sequence, WP# should be statically held high or low. Erase-Suspend/Erase-Resume Commands The Erase-Suspend operation temporarily suspends a Sector- or Block-Erase operation thus allowing data to be read from any memory location, or program data into any sector/block that is not suspended for an Erase operation. The operation is executed by issuing one byte command sequence with EraseSuspend command (B0H). The device automatically enters read mode typically within 20 s after the Erase-Suspend command had been issued. Valid data can be read from any sector or block that is not suspended from an Erase operation. Reading at address location within erase-suspended sectors/ blocks will output DQ2 toggling and DQ6 at "1". While in Erase-Suspend mode, a Word-Program operation is allowed except for the sector or block selected for Erase-Suspend. To resume Sector-Erase or Block-Erase operation which has been suspended the system must issue Erase Resume command. The operation is executed by issuing one byte command sequence with Erase Resume command (30H) at any address in the last Byte sequence. Chip-Erase Operation The SST39VF640xB provide a Chip-Erase operation, which allows the user to erase the entire memory array to the "1" state. This is useful when the entire device must be quickly erased. The Chip-Erase operation is initiated by executing a six-byte command sequence with Chip-Erase command (10H) at address 555H in the last byte sequence. The Erase operation begins with the rising edge of the sixth WE# or CE#, whichever occurs first. During the Erase operation, the only valid read is Toggle Bit or Data# Polling. See Table 6 for the command sequence, Figure 9 for timing diagram, and Figure 23 for the flowchart. Any commands issued during the Chip-Erase operation are ignored. When WP# is low, any attempt to Chip-Erase will be ignored. During the command sequence, WP# should be statically held high or low. Write Operation Status Detection The SST39VF640xB provide two software means to detect the completion of a Write (Program or Erase) cycle, in order to optimize the system write cycle time. The software detection includes two status bits: Data# Polling (DQ7) and Toggle Bit (DQ6). The End-of-Write detection mode is enabled after the rising edge of WE#, which initiates the internal Program or Erase operation. The actual completion of the nonvolatile write is asynchronous with the system; therefore, either a Data# Polling or Toggle Bit read may be simultaneous with the completion of the write cycle. If this occurs, the system may possibly get an erroneous result, i.e., valid data may appear to conflict with either DQ7 or DQ6. In order to prevent spurious rejection, if an erroneous result occurs, the software routine should include a loop to read the accessed location an additional two (2) times. If both reads are valid, then the device has completed the Write cycle, otherwise the rejection is valid. (c)2011 Silicon Storage Technology, Inc. DS25008A 7 08/11 64 Mbit Multi-Purpose Flash Plus SST39VF6401B / SST39VF6402B A Microchip Technology Company Not Recommended for New Designs Data# Polling (DQ7) When the SST39VF640xB are in the internal Program operation, any attempt to read DQ7 will produce the complement of the true data. Once the Program operation is completed, DQ7 will produce true data. Note that even though DQ7 may have valid data immediately following the completion of an internal Write operation, the remaining data outputs may still be invalid: valid data on the entire data bus will appear in subsequent successive Read cycles after an interval of 1 s. During internal Erase operation, any attempt to read DQ7 will produce a `0'. Once the internal Erase operation is completed, DQ7 will produce a `1'. The Data# Polling is valid after the rising edge of fourth WE# (or CE#) pulse for Program operation. For Sector-, Block- or Chip-Erase, the Data# Polling is valid after the rising edge of sixth WE# (or CE#) pulse. See Figure 6 for Data# Polling timing diagram and Figure 20 for a flowchart. Toggle Bits (DQ6 and DQ2) During the internal Program or Erase operation, any consecutive attempts to read DQ6 will produce alternating "1"s and "0"s, i.e., toggling between 1 and 0. When the internal Program or Erase operation is completed, the DQ6 bit will stop toggling. The device is then ready for the next operation. For Sector, Block-, or Chip-Erase, the toggle bit (DQ6) is valid after the rising edge of sixth WE# (or CE#) pulse. DQ6 will be set to "1" if a Read operation is attempted on an Erase-Suspended Sector/Block. If Program operation is initiated in a sector/block not selected in Erase-Suspend mode, DQ6 will toggle. An additional Toggle Bit is available on DQ2, which can be used in conjunction with DQ6 to check whether a particular sector is being actively erased or erase-suspended. Table 2 shows detailed status bits information. The Toggle Bit (DQ2) is valid after the rising edge of the last WE# (or CE#) pulse of Write operation. See Figure 7 for Toggle Bit timing diagram and Figure 20 for a flowchart. Table 2: Write Operation Status Status Normal Operation Erase-Suspend Mode DQ7 DQ6 DQ2 DQ7# Toggle No Toggle Standard Erase 0 Toggle Toggle Read from Erase-Suspended Sector/Block 1 1 Toggle Read from Non- Erase-Suspended Sector/Block Data Data Data Program DQ7# Toggle N/A Standard Program T2.0 25008 Note: DQ7 and DQ2 require a valid address when reading status information. (c)2011 Silicon Storage Technology, Inc. DS25008A 8 08/11 64 Mbit Multi-Purpose Flash Plus SST39VF6401B / SST39VF6402B A Microchip Technology Company Not Recommended for New Designs Data Protection The SST39VF640xB provide both hardware and software features to protect nonvolatile data from inadvertent writes. Hardware Data Protection Noise/Glitch Protection: A WE# or CE# pulse of less than 5 ns will not initiate a write cycle. VDD Power Up/Down Detection: The Write operation is inhibited when VDD is less than 1.5V. Write Inhibit Mode: Forcing OE# low, CE# high, or WE# high will inhibit the Write operation. This prevents inadvertent writes during power-up or power-down. Hardware Block Protection The SST39VF6402B support top hardware block protection, which protects the top 32 KWord block of the device. The SST39VF6401B support bottom hardware block protection, which protects the bottom 32 KWord block of the device. The Boot Block address ranges are described in Table 3. Program and Erase operations are prevented on the 32 KWord when WP# is low. If WP# is left floating, it is internally held high via a pull-up resistor, and the Boot Block is unprotected, enabling Program and Erase operations on that block. Table 3: Boot Block Address Ranges Product Address Range Bottom Boot Block SST39VF6401B 000000H-007FFFH Top Boot Block SST39VF6402B 3F8000H-3FFFFFH T3.0 25008 (c)2011 Silicon Storage Technology, Inc. DS25008A 9 08/11 64 Mbit Multi-Purpose Flash Plus SST39VF6401B / SST39VF6402B A Microchip Technology Company Not Recommended for New Designs Hardware Reset (RST#) The RST# pin provides a hardware method of resetting the device to read array data. When the RST# pin is held low for at least TRP, any in-progress operation will terminate and return to Read mode. When no internal Program/Erase operation is in progress, a minimum period of TRHR is required after RST# is driven high before a valid Read can take place (see Figure 15). The Erase or Program operation that has been interrupted needs to be reinitiated after the device resumes normal operation mode to ensure data integrity. Software Data Protection (SDP) The SST39VF640xB provide the JEDEC approved Software Data Protection scheme for all data alteration operations, i.e., Program and Erase. Any Program operation requires the inclusion of the threebyte sequence. The three-byte load sequence is used to initiate the Program operation, providing optimal protection from inadvertent Write operations, e.g., during the system power-up or power-down. Any Erase operation requires the inclusion of six-byte sequence. These devices are shipped with the Software Data Protection permanently enabled. See Table 6 for the specific software command codes. During SDP command sequence, invalid commands will abort the device to read mode within TRC. The contents of DQ15-DQ8 can be VIL or VIH, but no other value, during any SDP command sequence. Common Flash Memory Interface (CFI) The SST39VF640xB also contain the CFI information to describe the characteristics of the device. In order to enter the CFI Query mode, the system must write three-byte sequence, same as product ID entry command with 98H (CFI Query command) to address 555H in the last byte sequence. Once the device enters the CFI Query mode, the system can read CFI data at the addresses given in Tables 7 through 9. The system must write the CFI Exit command to return to Read mode from the CFI Query mode. (c)2011 Silicon Storage Technology, Inc. DS25008A 10 08/11 64 Mbit Multi-Purpose Flash Plus SST39VF6401B / SST39VF6402B A Microchip Technology Company Not Recommended for New Designs Product Identification The Product Identification mode identifies the devices as the SST39VF6401B and SST39VF6402B, and the manufacturer as SST. This mode may be accessed through software operations. Users may use the Software Product Identification operation to identify the part (i.e., using the device ID) when using multiple manufacturers in the same socket. For details, see Table 6 for software operation, Figure 11 for the Software ID Entry and Read timing diagram and Figure 21 for the Software ID Entry command sequence flowchart. Table 4: Product Identification Address Data 0000H BFH SST39VF6401B 0001H 236DH SST39VF6402B 0001H 236CH Manufacturer's ID Device ID T4.0 25008 Product Identification Mode Exit/CFI Mode Exit In order to return to the standard Read mode, the Software Product Identification mode must be exited. Exit is accomplished by issuing the Software ID Exit command sequence, which returns the device to the Read mode. This command may also be used to reset the device to the Read mode after any inadvertent transient condition that apparently causes the device to behave abnormally, e.g., not read correctly. Please note that the Software ID Exit/CFI Exit command is ignored during an internal Program or Erase operation. See Table 6 for software command codes, Figure 13 for timing waveform, and Figures 21 and 22 for flowcharts. (c)2011 Silicon Storage Technology, Inc. DS25008A 11 08/11 64 Mbit Multi-Purpose Flash Plus SST39VF6401B / SST39VF6402B A Microchip Technology Company Not Recommended for New Designs Security ID The SST39VF640xB devices offer a 256-bit Security ID space. The Secure ID space is divided into two 128-bit segments - one factory programmed segment and one user programmed segment. The first segment is programmed and locked at SST with a random 128-bit number. The user segment is left un-programmed for the customer to program as desired. To program the user segment of the Security ID, the user must use the Security ID Word-Program command. To detect end-of-write for the SEC ID, read the toggle bits. Do not use Data# Polling. Once this is complete, the Sec ID should be locked using the User Sec ID Program Lock-Out. This disables any future corruption of this space. Note that regardless of whether or not the Sec ID is locked, neither Sec ID segment can be erased. The Secure ID space can be queried by executing a three-byte command sequence with Enter Sec ID command (88H) at address 555H in the last byte sequence. To exit this mode, the Exit Sec ID command should be executed. Refer to Table 6 for more details. (c)2011 Silicon Storage Technology, Inc. DS25008A 12 08/11 64 Mbit Multi-Purpose Flash Plus SST39VF6401B / SST39VF6402B A Microchip Technology Company Not Recommended for New Designs Operations Table 5: Operation Modes Selection Mode CE# OE# WE# DQ Address Read VIL VIL VIH DOUT AIN Program VIL VIH VIL DIN AIN VIL X1 Sector or block address, XXH for Chip-Erase Erase VIL Standby VIH X X High Z X X VIL X High Z/ DOUT X X X VIH High Z/ DOUT X VIL VIL VIH Write Inhibit VIH Product Identification Software Mode See Table 6 T5.0 25008 1. X can be VIL or VIH, but no other value. Table 6: Software Command Sequence Command Sequence 1st Bus Write Cycle Addr1 Data2 2nd Bus Write Cycle Addr1 3rd Bus Write Cycle 4th Bus Write Cycle Data2 Addr1 Data2 Addr1 Word-Program 555H AAH 2AAH 55H 555H A0H WA3 Sector-Erase 555H AAH 2AAH 55H 555H 80H 555H Data2 Data AAH 5th Bus Write Cycle Addr1 2AAH 6th Bus Write Cycle Data2 Addr1 Data2 55H SAX4 30H 10H Block-Erase 555H AAH 2AAH 55H 555H 80H 555H AAH 2AAH 55H BAX4 Chip-Erase 555H AAH 2AAH 55H 555H 80H 555H AAH 2AAH 55H 555H Erase-Suspend XXXXH B0H Erase-Resume XXXXH 30H Query Sec ID5 555H AAH 2AAH 55H 555H 88H User Security ID Word-Program 555H AAH 2AAH 55H 555H A5H WA6 Data User Security ID Program Lock-Out 555H AAH 2AAH 55H 555H 85H XXH6 0000H Software ID Entry7,8 555H AAH 2AAH 55H 555H 90H CFI Query Entry 555H AAH 2AAH 55H 555H 98H Software ID Exit9,10 /CFI Exit/Sec ID Exit 555H AAH 2AAH 55H 555H F0H Software ID Exit9,10 /CFI Exit/Sec ID Exit XXH F0H 50H T6.0 25008 1. Address format A10-A0 (Hex). Addresses A11- A21 can be VIL or VIH, but no other value, for Command sequence for SST39VF640xB. 2. DQ15-DQ8 can be VIL or VIH, but no other value, for Command sequence 3. WA = Program Word address 4. SAX for Sector-Erase; uses AMS-A11 address lines BAX, for Block-Erase; uses AMS-A15 address lines AMS = Most significant address AMS = A21 for SST39VF640xB 5. With AMS-A4 = 0; Sec ID is read with A3-A0, SST ID is read with A3 = 0 (Address range = 000000H to 000007H), User ID is read with A3 = 1 (Address range = 000010H to 000017H). Lock Status is read with A7-A0 = 0000FFH. Unlocked: DQ3 = 1 / Locked: DQ3 = 0. 6. Valid Word-Addresses for Sec ID are from 000000H-000007H and 000010H-000017H. (c)2011 Silicon Storage Technology, Inc. DS25008A 13 08/11 64 Mbit Multi-Purpose Flash Plus SST39VF6401B / SST39VF6402B A Microchip Technology Company Not Recommended for New Designs 7. The device does not remain in Software Product ID Mode if powered down. 8. With AMS-A1 =0; SST Manufacturer ID = 00BFH, is read with A0 = 0, SST39VF6401B Device ID = 236DH, is read with A0 = 1, SST39VF6402B Device ID = 236CH, is read with A0 = 1. AMS = Most significant address AMS = A21 for SST39VF640xB 9. Both Software ID Exit operations are equivalent 10. If users never lock after programming, Sec ID can be programmed over the previously unprogrammed bits (data=1) using the Sec ID mode again (the programmed "0" bits cannot be reversed to "1"). Valid Word-Addresses for Sec ID are from 000000H-000007H and 000010H-000017H. Table 7: CFI Query Identification String1 for SST39VF640xB Address Data 10H 0051H 11H 0052H 12H 0059H 13H 0002H 14H 0000H 15H 0000H 16H 0000H 17H 0000H 18H 0000H 19H 0000H 1AH 0000H Data Query Unique ASCII string "QRY" Primary OEM command set Address for Primary Extended Table Alternate OEM command set (00H = none exists) Address for Alternate OEM extended Table (00H = none exits) T7.0 25008 1. Refer to CFI publication 100 for more details. Table 8: System Interface Information for SST39VF640xB Address Data 1BH 0027H Data VDD Min (Program/Erase) DQ7-DQ4: Volts, DQ3-DQ0: 100 millivolts 1CH 0036H VDD Max (Program/Erase) DQ7-DQ4: Volts, DQ3-DQ0: 100 millivolts 1DH 0000H VPP min. (00H = no VPP pin) 1EH 0000H VPP max. (00H = no VPP pin) 1FH 0003H Typical time out for Word-Program 2N s (23 = 8 s) 20H 0000H Typical time out for min. size buffer program 2N s (00H = not supported) 21H 0004H Typical time out for individual Sector/Block-Erase 2N ms (24 = 16 ms) 22H 0005H Typical time out for Chip-Erase 2N ms (25 = 32 ms) 23H 0001H Maximum time out for Word-Program 2N times typical (21 x 23 = 16 s) 24H 0000H Maximum time out for buffer program 2N times typical 25H 0001H Maximum time out for individual Sector/Block-Erase 2N times typical (21 x 24 = 32 ms) 26H 0001H Maximum time out for Chip-Erase 2N times typical (21 x 25 = 64 ms) T8.0 25008 (c)2011 Silicon Storage Technology, Inc. DS25008A 14 08/11 64 Mbit Multi-Purpose Flash Plus SST39VF6401B / SST39VF6402B A Microchip Technology Company Not Recommended for New Designs Table 9: Device Geometry Information for SST39VF640xB Address Data 27H 0017H Device size = 2N Bytes (17H = 23; 223 = 8 MByte) Data 28H 0001H Flash Device Interface description; 0001H = x16-only asynchronous interface 29H 0000H 2AH 0000H 2BH 0000H Maximum number of bytes in multi-byte write = 2N (00H = not supported) 2CH 0002H Number of Erase Sector/Block sizes supported by device 2DH 00FFH Sector Information (y + 1 = Number of sectors; z x 256B = sector size) 2EH 0007H y = 2047 + 1 = 2048 sectors (07FFH = 2047) 2FH 0010H 30H 0000H z = 16 x 256 Bytes = 4 KBytes/sector (0010H = 16) 31H 007FH Block Information (y + 1 = Number of blocks; z x 256B = block size) 32H 0000H y =127 + 1 = 128 blocks (007FH = 127) 33H 0000H 34H 0001H z = 256 x 256 Bytes = 64 KBytes/block (0100H = 256) T9.0 25008 (c)2011 Silicon Storage Technology, Inc. DS25008A 15 08/11 64 Mbit Multi-Purpose Flash Plus SST39VF6401B / SST39VF6402B A Microchip Technology Company Not Recommended for New Designs Absolute Maximum Stress Ratings (Applied conditions greater than those listed under "Absolute Maximum Stress Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these conditions or conditions greater than those defined in the operational sections of this data sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.) Temperature Under Bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55C to +125C Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to +150C D. C. Voltage on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to VDD+0.5V Transient Voltage (<20 ns) on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . -2.0V to VDD+2.0V Voltage on A9 Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 13.2V Package Power Dissipation Capability (TA = 25C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0W Surface Mount Solder Reflow Temperature1 . . . . . . . . . . . . . . . . . . . . . . . . . . . 260C for 10 seconds Output Short Circuit Current2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA 1. Excluding certain with-Pb 32-PLCC units, all packages are 260C capable in both non-Pb and with-Pb solder versions. Certain with-Pb 32-PLCC package types are capable of 240C for 10 seconds; please consult the factory for the latest information. 2. Outputs shorted for no more than one second. No more than one output shorted at a time. Table 10:Operating Range Range Commercial Industrial Ambient Temp VDD 0C to +70C 2.7-3.6V -40C to +85C 2.7-3.6V T10.1 25008 Table 11:AC Conditions of Test1 Input Rise/Fall Time Output Load 5ns CL = 30 pF T11.1 25008 1. See Figures 17 and 18 (c)2011 Silicon Storage Technology, Inc. DS25008A 16 08/11 64 Mbit Multi-Purpose Flash Plus SST39VF6401B / SST39VF6402B A Microchip Technology Company Not Recommended for New Designs Table 12:DC Operating Characteristics VDD = 2.7-3.6V1 Limits Symbol Parameter IDD Power Supply Current ISB IALP ILI ILIW ILO VIL VILC VIH VIHC VOL VOH Min Max Units Read3 Program and Erase Standby VDD Current Auto Low Power 18 35 20 20 mA mA A A Input Leakage Current Input Leakage Current on WP# pin and RST# Output Leakage Current Input Low Voltage Input Low Voltage (CMOS) Input High Voltage Input High Voltage (CMOS) Output Low Voltage Output High Voltage 1 10 A A 10 0.8 0.3 A V V V V V V 0.7VDD VDD-0.3 0.2 VDD-0.2 Test Conditions Address input=VILT/VIHT2, at f=5 MHz, VDD=VDD Max CE#=VIL, OE#=WE#=VIH, all I/Os open CE#=WE#=VIL, OE#=VIH CE#=VIHC, VDD=VDD Max CE#=VILC, VDD=VDD Max All inputs=VSS or VDD, WE#=VIHC VIN=GND to VDD, VDD=VDD Max WP#=GND to VDD or RST#=GND to VDD VOUT=GND to VDD, VDD=VDD Max VDD=VDD Min VDD=VDD Max VDD=VDD Max VDD=VDD Max IOL=100 A, VDD=VDD Min IOH=-100 A, VDD=VDD Min T12.0 25008 1. Typical conditions for the Active Current shown on the front page of the data sheet are average values at 25C (room temperature), and VDD = 3V. Not 100% tested. 2. See Figure 17 3. The IDD current listed is typically less than 2mA/MHz, with OE# at VIH. Typical VDD is 3V. Table 13:Recommended System Power-up Timings Symbol TPU-READ1 TPU-WRITE1 Parameter Power-up to Read Operation Power-up to Program/Erase Operation Minimum 100 100 Units s s T13.0 25008 1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter. Table 14:Capacitance (TA = 25C, f=1 Mhz, other pins open) Parameter CI/O1 CIN1 Description I/O Pin Capacitance Input Capacitance Test Condition VI/O = 0V VIN = 0V Maximum 12 pF 6 pF T14.0 25008 1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter. Table 15:Reliability Characteristics Symbol NEND1,2 TDR1 ILTH1 Parameter Endurance Minimum Specification 10,000 Units Cycles Test Method JEDEC Standard A117 100 100 + IDD Years mA JEDEC Standard A103 JEDEC Standard 78 Data Retention Latch Up T15.0 25008 1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter. 2. NEND endurance rating is qualified as a 10,000 cycle minimum for the whole device. A sector- or block-level rating would result in a higher minimum specification. (c)2011 Silicon Storage Technology, Inc. DS25008A 17 08/11 64 Mbit Multi-Purpose Flash Plus SST39VF6401B / SST39VF6402B A Microchip Technology Company Not Recommended for New Designs AC Characteristics Table 16:Read Cycle Timing Parameters VDD = 2.7-3.6V SST39VF640xB-70 Symbol Parameter TRC Read Cycle Time Min Max Units 70 ns TCE Chip Enable Access Time 70 ns TAA Address Access Time 70 ns TOE Output Enable Access Time 35 ns TCLZ1 CE# Low to Active Output 0 1 OE# Low to Active Output 0 TOLZ TCHZ1 CE# High to High-Z Output TOHZ 1 OE# High to High-Z Output TOH1 Output Hold from Address Change TRP1 TRHR1 TRY 1,2 ns ns 20 ns 20 ns 0 ns RST# Pulse Width 500 ns RST# High before Read 50 ns RST# Pin Low to Read Mode 20 s T16.0 25008 1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter. 2. This parameter applies to Sector-Erase, Block-Erase, and Program operations. This parameter does not apply to Chip-Erase operations. Table 17:Program/Erase Cycle Timing Parameters Symbol Parameter Min Max Units TBP Word-Program Time TAS Address Setup Time 0 ns TAH Address Hold Time 30 ns TCS WE# and CE# Setup Time 0 ns TCH WE# and CE# Hold Time 0 ns TOES OE# High Setup Time 0 ns TOEH OE# High Hold Time 10 ns TCP CE# Pulse Width 40 ns TWP WE# Pulse Width 40 ns TWPH1 WE# Pulse Width High 30 ns TCPH1 CE# Pulse Width High 30 ns TDS Data Setup Time 30 ns TDH1 TIDA1 Data Hold Time 0 Software ID Access and Exit Time 150 ns TSE Sector-Erase 25 ms TBE Block-Erase 25 ms TSCE Chip-Erase 50 10 s ns ms T17.0 25008 1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter. (c)2011 Silicon Storage Technology, Inc. DS25008A 18 08/11 64 Mbit Multi-Purpose Flash Plus SST39VF6401B / SST39VF6402B A Microchip Technology Company Not Recommended for New Designs TRC TAA ADDRESS AMS-0 TCE CE# TOE OE# TOHZ TOLZ VIH WE# TCLZ TOH HIGH-Z DQ15-0 DATA VALID TCHZ HIGH-Z DATA VALID 1288 F03.0 Note: AMS = Most significant address AMS = A21 for SST39VF640xB Figure 3: Read Cycle Timing Diagram INTERNAL PROGRAM OPERATION STARTS TBP 555 ADDRESS AMS-0 2AA 555 ADDR TAH TDH TWP WE# TAS TWPH TDS OE# TCH CE# TCS DQ15-0 XXAA XX55 XXA0 DATA SW0 SW1 SW2 WORD (ADDR/DATA) 1288 F04.0 Note: AMS = Most significant address AMS = A21 for SST39VF640xB WP# must be held in proper logic state (VIL or VIH) 1 s prior to and 1 s after the command sequence. X can be VIL or VIH, but no other value. Figure 4: WE# Controlled Program Cycle Timing Diagram (c)2011 Silicon Storage Technology, Inc. DS25008A 19 08/11 64 Mbit Multi-Purpose Flash Plus SST39VF6401B / SST39VF6402B A Microchip Technology Company Not Recommended for New Designs INTERNAL PROGRAM OPERATION STARTS TBP 555 ADDRESS AMS-0 2AA 555 ADDR TAH TDH TCP CE# TAS TDS TCPH OE# TCH WE# TCS DQ15-0 XXAA XX55 XXA0 DATA SW0 SW1 SW2 WORD (ADDR/DATA) 1288 F05.0 Note: AMS = Most significant address AMS = A21 for SST39VF640xB WP# must be held in proper logic state (VIL or VIH) 1 s prior to and 1 s after the command sequence. X can be VIL or VIH, but no other value. Figure 5: CE# Controlled Program Cycle Timing Diagram ADDRESS AMS-0 TCE CE# TOES TOEH OE# TOE WE# DQ7 DATA DATA# DATA# DATA 1288 F06.0 Note: AMS = Most significant address AMS = A21 for SST39VF640xB Figure 6: Data# Polling Timing Diagram (c)2011 Silicon Storage Technology, Inc. DS25008A 20 08/11 64 Mbit Multi-Purpose Flash Plus SST39VF6401B / SST39VF6402B A Microchip Technology Company Not Recommended for New Designs ADDRESS AMS-0 TCE CE# TOEH TOES TOE OE# WE# DQ6 and DQ2 TWO READ CYCLES WITH SAME OUTPUTS 1288 F07.0 Note: AMS = Most significant address AMS = A21 for SST39VF640xB Figure 7: Toggle Bits Timing Diagram TSCE SIX-BYTE CODE FOR CHIP-ERASE ADDRESS AMS-0 555 2AA 555 555 2AA 555 CE# OE# TWP WE# DQ15-0 XXAA XX55 XX80 XXAA XX55 XX10 SW0 SW1 SW2 SW3 SW4 SW5 1288 F08.0 Note: This device also supports CE# controlled Chip-Erase operation The WE# and CE# signals are interchangeable as long as minimum timings are met. (See Table 17) AMS = Most significant address AMS = A21 for SST39VF640xB WP# must be held in proper logic state (VIL or VIH) 1 s prior to and 1 s after the command sequence. X can be VIL or VIH, but no other value. Figure 8: WE# Controlled Chip-Erase Timing Diagram (c)2011 Silicon Storage Technology, Inc. DS25008A 21 08/11 64 Mbit Multi-Purpose Flash Plus SST39VF6401B / SST39VF6402B A Microchip Technology Company Not Recommended for New Designs TBE SIX-BYTE CODE FOR BLOCK-ERASE ADDRESS AMS-0 555 2AA 555 555 2AA BAX CE# OE# TWP WE# DQ15-0 XXAA XX55 XX80 XXAA XX55 XX30 SW0 SW1 SW2 SW3 SW4 SW5 1288 F09.0 Note: This device also supports CE# controlled Block-Erase operation The WE# and CE# signals are interchangeable as long as minimum timings are met. (See Table 17) BAX = Block Address AMS = Most significant address AMS = A21 for SST39VF640xB WP# must be held in proper logic state (VIL or VIH) 1 s prior to and 1 s after the command sequence. X can be VIL or VIH, but no other value. Figure 9: WE# Controlled Block-Erase Timing Diagram (c)2011 Silicon Storage Technology, Inc. DS25008A 22 08/11 64 Mbit Multi-Purpose Flash Plus SST39VF6401B / SST39VF6402B A Microchip Technology Company Not Recommended for New Designs TSE SIX-BYTE CODE FOR SECTOR-ERASE ADDRESS AMS-0 555 2AA 555 555 2AA SAX CE# OE# TWP WE# DQ15-0 XXAA XX55 XX80 XXAA XX55 XX50 SW0 SW1 SW2 SW3 SW4 SW5 1288 F10.0 Note: This device also supports CE# controlled Sector-Erase operation The WE# and CE# signals are interchangeable as long as minimum timings are met. (See Table 17) SAX = Sector Address AMS = Most significant address AMS = A21 for SST39VF640xB WP# must be held in proper logic state (VIL or VIH) 1 s prior to and 1 s after the command sequence. X can be VIL or VIH, but no other value. Figure 10:WE# Controlled Sector-Erase Timing Diagram (c)2011 Silicon Storage Technology, Inc. DS25008A 23 08/11 64 Mbit Multi-Purpose Flash Plus SST39VF6401B / SST39VF6402B A Microchip Technology Company Not Recommended for New Designs Three-Byte Sequence for Software ID Entry ADDRESS A14-0 555 2AA 555 0000 0001 CE# OE# TIDA TWP WE# TWPH DQ15-0 TAA XXAA XX55 XX90 SW0 SW1 SW2 00BF Device ID 1288 F11.0 Note: Device ID = 236DH for SST39VF6401B and 236CH for SST39VF6402B WP# must be held in proper logic state (VIL or VIH) 1 s prior to and 1 s after the command sequence. X can be VIL or VIH, but no other value. Figure 11:Software ID Entry and Read Three-Byte Sequence for CFI Query Entry ADDRESS A14-0 555 2AA 555 CE# OE# TIDA TWP WE# TWPH DQ15-0 TAA XXAA XX55 XX98 SW0 SW1 SW2 1288 F12.0 Note: WP# must be held in proper logic state (VIL or VIH) 1 s prior to and 1 s after the command sequence. X can be VIL or VIH, but no other value. Figure 12:CFI Query Entry and Read (c)2011 Silicon Storage Technology, Inc. DS25008A 24 08/11 64 Mbit Multi-Purpose Flash Plus SST39VF6401B / SST39VF6402B A Microchip Technology Company Not Recommended for New Designs THREE-BYTE SEQUENCE FOR SOFTWARE ID EXIT AND RESET ADDRESS A14-0 555 DQ15-0 2AA XXAA 555 XX55 XXF0 TIDA CE# OE# TWP WE# TWHP SW0 SW1 SW2 1288 F13.0 Note: WP# must be held in proper logic state (VIL or VIH) 1 s prior to and 1 s after the command sequence. X can be VIL or VIH, but no other value. Figure 13:Software ID Exit/CFI Exit THREE-BYTE SEQUENCE FOR CFI QUERY ENTRY ADDRESS AMS-0 555 2AA 555 CE# OE# TIDA TWP WE# TWPH DQ15-0 TAA XXAA XX55 XX88 SW0 SW1 SW2 1288 F14.0 Note: AMS = Most significant address AMS = A21 for SST39VF640xB WP# must be held in proper logic state (VIL or VIH) 1 s prior to and 1 s after the command sequence. X can be VIL or VIH, but no other value. Figure 14:Sec ID Entry (c)2011 Silicon Storage Technology, Inc. DS25008A 25 08/11 64 Mbit Multi-Purpose Flash Plus SST39VF6401B / SST39VF6402B A Microchip Technology Company Not Recommended for New Designs TRP RST# CE#/OE# TRHR 1288 F15.0 Figure 15:RST# Timing Diagram (When no internal operation is in progress) TRP RST# TRY CE#/OE# End-of-Write Detection (Toggle-Bit) 1288 F16.0 Figure 16:RST# Timing Diagram (During Program or Erase operation) (c)2011 Silicon Storage Technology, Inc. DS25008A 26 08/11 64 Mbit Multi-Purpose Flash Plus SST39VF6401B / SST39VF6402B A Microchip Technology Company Not Recommended for New Designs VIHT INPUT VIT REFERENCE POINTS VOT OUTPUT VILT 1288 F17.0 AC test inputs are driven at VIHT (0.9 VDD) for a logic "1" and VILT (0.1 VDD) for a logic "0". Measurement reference points for inputs and outputs are VIT (0.5 VDD) and VOT (0.5 VDD). Input rise and fall times (10% 90%) are <5 ns. Note: VIT - VINPUT Test VOT - VOUTPUT Test VIHT - VINPUT HIGH Test VILT - VINPUT LOW Test Figure 17:AC Input/Output Reference Waveforms TO TESTER TO DUT CL 1288 F18.0 Figure 18:A Test Load Example (c)2011 Silicon Storage Technology, Inc. DS25008A 27 08/11 64 Mbit Multi-Purpose Flash Plus SST39VF6401B / SST39VF6402B A Microchip Technology Company Not Recommended for New Designs Start Load data: XXAAH Address: 555H Load data: XX55H Address: 2AAH Load data: XXA0H Address: 555H Load Word Address/Word Data Wait for end of Program (TBP, Data# Polling bit, or Toggle bit operation) Program Completed 1288 F19.0 X can be VIL or VIH, but no other value Figure 19:Word-Program Algorithm (c)2011 Silicon Storage Technology, Inc. DS25008A 28 08/11 64 Mbit Multi-Purpose Flash Plus SST39VF6401B / SST39VF6402B A Microchip Technology Company Not Recommended for New Designs Internal Timer Toggle Bit Data# Polling Program/Erase Initiated Program/Erase Initiated Program/Erase Initiated Wait TBP, TSCE, TSE or TBE Read word Read DQ7 Read same word Program/Erase Completed No Is DQ7 = true data Yes No Does DQ6 match Program/Erase Completed Yes Program/Erase Completed 1288 F20.0 Figure 20:Wait Options (c)2011 Silicon Storage Technology, Inc. DS25008A 29 08/11 64 Mbit Multi-Purpose Flash Plus SST39VF6401B / SST39VF6402B A Microchip Technology Company Not Recommended for New Designs CFI Query Entry Command Sequence Sec ID Query Entry Command Sequence Software Product ID Entry Command Sequence Load data: XXAAH Address: 555H Load data: XXAAH Address: 555H Load data: XXAAH Address: 555H Load data: XX55H Address: 2AAH Load data: XX55H Address: 2AAH Load data: XX55H Address: 2AAH Load data: XX98H Address: 555H Load data: XX88H Address: 555H Load data: XX90H Address: 555H Wait TIDA Wait TIDA Wait TIDA Read CFI data Read Sec ID Read Software ID X can be VIL or VIH, but no other value 1288 F21.0 Figure 21:Software ID/CFI Entry Command Flowcharts (c)2011 Silicon Storage Technology, Inc. DS25008A 30 08/11 64 Mbit Multi-Purpose Flash Plus SST39VF6401B / SST39VF6402B A Microchip Technology Company Not Recommended for New Designs Software ID Exit/CFI Exit/Sec ID Exit Command Sequence Load data: XXAAH Address: 555H Load data: XXF0H Address: XXH Load data: XX55H Address: 2AAH Wait TIDA Load data: XXF0H Address: 555H Return to normal operation Wait TIDA Return to normal operation X can be VIL or VIH, but no other value 1288 F22.0 Figure 22:Software ID/CFI Exit Command Flowcharts (c)2011 Silicon Storage Technology, Inc. DS25008A 31 08/11 64 Mbit Multi-Purpose Flash Plus SST39VF6401B / SST39VF6402B A Microchip Technology Company Not Recommended for New Designs Chip-Erase Command Sequence Sector-Erase Command Sequence Block-Erase Command Sequence Load data: XXAAH Address: 555H Load data: XXAAH Address: 555H Load data: XXAAH Address: 555H Load data: XX55H Address: 2AAH Load data: XX55H Address: 2AAH Load data: XX55H Address: 2AAH Load data: XX80H Address: 555H Load data: XX80H Address: 555H Load data: XX80H Address: 555H Load data: XXAAH Address: 555H Load data: XXAAH Address: 555H Load data: XXAAH Address: 555H Load data: XX55H Address: 2AAH Load data: XX55H Address: 2AAH Load data: XX55H Address: 2AAH Load data: XX10H Address: 555H Load data: XX50H Address: SAX Load data: XX30H Address: BAX Wait TSCE Wait TSE Wait TBE Chip erased to FFFFH Sector erased to FFFFH Block erased to FFFFH 1288 F23.0 X can be VIL or VIH, but no other value Figure 23:Erase Command Sequence (c)2011 Silicon Storage Technology, Inc. DS25008A 32 08/11 64 Mbit Multi-Purpose Flash Plus SST39VF6401B / SST39VF6402B A Microchip Technology Company Not Recommended for New Designs Product Ordering Information SST 39 VF XX XX 6401B XXXXX - 70 XX - 4I XX - QAE XXX Environmental Attribute E1 = non-Pb Package Modifier K = 48 balls or leads Package Type E = TSOP (type1, die up, 12mm x 20mm) B1 = TFBGA (8mm x 10mm, 0.8mm pitch) Temperature Range C = Commercial = 0C to +70C I = Industrial = -40C to +85C Minimum Endurance 4 = 10,000 cycles Read Access Speed 70 = 70 ns Hardware Block Protection 1 = Bottom Boot-Block 2 = Top Boot-Block Device Density 640 = 64 Mbit Voltage V = 2.7-3.6V Product Series 39 = Multi-Purpose Flash Plus 1. Environmental suffix "E" denotes non-Pb solder. SST non-Pb solder devices are "RoHS Compliant". Valid Combinations for SST39VF6401B SST39VF6401B-70-4C-EKE SST39VF6401B-70-4I-EKE SST39VF6401B-70-4C-B1KE SST39VF6401B-70-4I-B1KE Valid Combinations for SST39VF6402B SST39VF6402B-70-4C-EKE SST39VF6402B-70-4I-EKE SST39VF6402B-70-4C-B1KE SST39VF6402B-70-4I-B1KE Note:Valid combinations are those products in mass production or will be in mass production. Consult your SST sales representative to confirm availability of valid combinations and to determine availability of new combinations. (c)2011 Silicon Storage Technology, Inc. DS25008A 33 08/11 64 Mbit Multi-Purpose Flash Plus SST39VF6401B / SST39VF6402B A Microchip Technology Company Not Recommended for New Designs Packaging Diagrams 1.05 0.95 Pin # 1 Identifier 0.50 BSC 0.27 0.17 12.20 11.80 0.15 0.05 18.50 18.30 DETAIL 1.20 max. 0.70 0.50 20.20 19.80 0- 5 Note: 1. Complies with JEDEC publication 95 MO-142 DD dimensions, although some dimensions may be more stringent. 2. All linear dimensions are in millimeters (max/min). 1mm 3. Coplanarity: 0.1 mm 4. Maximum allowable mold flash is 0.15 mm at the package ends, and 0.25 mm between leads. 0.70 0.50 48-tsop-EK-8 Figure 24:48-lead Thin Small Outline Package (TSOP) 12mm x 20mm SST Package Code: EK (c)2011 Silicon Storage Technology, Inc. DS25008A 34 08/11 64 Mbit Multi-Purpose Flash Plus SST39VF6401B / SST39VF6402B A Microchip Technology Company Not Recommended for New Designs TOP VIEW BOTTOM VIEW 10.00 0.10 5.60 0.80 6 6 5 5 4.00 4 4 8.00 0.10 3 3 2 2 1 1 0.80 0.45 0.05 (48X) H G F E D C B A A B C D E F G H A1 CORNER A1 CORNER 1.10 0.10 SIDE VIEW 0.12 SEATING PLANE Note: 1mm 0.35 0.05 1. Although many dimensions are similar to those of JEDEC Publication 95, MO-210, this specific package is not registered. 2. All linear dimensions are in millimeters. 3. Coplanarity: 0.12 mm 4. Ball opening size is 0.38 mm ( 0.05 mm) 48-tfbga-B1K-8x10-450mic-5 Figure 25:48-ball Thin-profile, Fine-pitch Ball Grid Array (TFBGA) 8mm x 10mm SST Package Code: B1K (c)2011 Silicon Storage Technology, Inc. DS25008A 35 08/11 64 Mbit Multi-Purpose Flash Plus SST39VF6401B / SST39VF6402B A Microchip Technology Company Not Recommended for New Designs Table 18:Revision History Revision 00 01 02 A Description * * * * * * * * Date Initial release Clarified JEDEC software command compatibility on page 1 Changed document phase from Preliminary Information to Data Sheet Removed Pb and 90ns parts Marked the document "Not Recommended for New Designs" Applied new document format Released document under letter revision system Updated Spec number from S71288 to DS25008 Mar 2005 May 2005 Jul 2006 Aug 2011 ISBN:978-1-61341-547-4 (c) 2011 Silicon Storage Technology, Inc-a Microchip Technology Company. All rights reserved. SST, Silicon Storage Technology, the SST logo, SuperFlash, MTP, and FlashFlex are registered trademarks of Silicon Storage Technology, Inc. MPF, SQI, Serial Quad I/O, and Z-Scale are trademarks of Silicon Storage Technology, Inc. All other trademarks and registered trademarks mentioned herein are the property of their respective owners. Specifications are subject to change without notice. Refer to www.microchip.com for the most recent documentation. For the most current package drawings, please see the Packaging Specification located at http://www.microchip.com/packaging. Memory sizes denote raw storage capacity; actual usable capacity may be less. SST makes no warranty for the use of its products other than those expressly contained in the Standard Terms and Conditions of Sale. For sales office locations and information, please see www.microchip.com. Silicon Storage Technology, Inc. A Microchip Technology Company www.microchip.com (c)2011 Silicon Storage Technology, Inc. DS25008A 36 08/11