BAP64-05W
General
Purpose Pin Diodes
200mW
omponents
20736 Marilla Street Chatsworth
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MCC
ParameterSymbolLimitsUnit
Continuous Reverse Voltage V
R
175 V
Forward CurrentI
F
100 mA
Power Dissipation(TA=90oC) P
D
200mW
Junction and Storage temperatureT
j，
P
stg
-65~+150 ℃
Features
• Lead Free Finish/RoHS Compliant ("P" Suffix designates
RoHS Compliant. See ordering information)
• Epoxy meets UL 94 V-0 flammability rating
• Low diode capacitance
• Low diode forward resistance
• MARKING: 5W
Thermal Resistance Junction to
Revision: A 2011/01/01
1 of 3
TM
Micro Commercial Components
• Moisture Sensitivity Level 1
Maximum Ratings @ 25°C Unless Otherwise Specified
Ambient RthJA 625 oC/W
Parameter Symbol Min. TYP Max. Unit Conditions
Reverse Voltage IR 10 VR=175V
Diode forward
rD 2 3.8 Ω I F=10mA , f=100MHz
1.0 VR=20V
Forward voltage VF 1.1 V IF=50mA
Diode capacitance
Cd3 0.23 0.35 pF VR=20V,f=1MHz
Cd1 0.52 pF VR=0V,f=1MHz
Cd2 0.37 pF VR=1V,f=1MHz
rD 20 40 Ω IF=0.5mA, f=100MHz
rD 10 20 Ω I F=1mA , f=100MHz
Leakage
Electrical Characteristics @ 25°C Unless Otherwise Specified
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uA
Current
rD 0.7 1.35 Ω I F=100mA , f=100MHz
resistance
Charge carrier
τL
when switched from
I
F=10 mA to IR= 6 mA; RL=
100Ω;measured at IR=3mA
1.55 μS
life time
Series inductance LS 1.4 nH
IF=100mA, f=100MHz
SOT-323
Suggested Solder
Pad Layout
INCHES MM
DIM MIN MAX MIN MAX NOTE
A .071 .087 1.80 2.20
B .045 .053 1.15 1.35
C .079 .087 2.00 2.20
D .026 Nominal 0.65Nominal
E .047 .055 1.20 1.40
F .012 .016 .30 .40
G .000 .004 .000 .100
H .035 .039 .90 1.00
J .004 .010 .100 .250
K .012 .016 .30 .40
A
C
B
D
E
F
GH
J
1.90
0.70
0.90
0.65
0.65
DIMENSIONS
K
MCC TM
Micro Commercial Components
www.mccsemi.com
Revision: A 2011/01/01
2 of 3
Typical Characteristics
MCC
Revision: A 2011/01/01
TM
Micro Commercial Components
www.mccsemi.com
3 of 3
Ordering Information
Device Packing
(Part Number)-TP Tape&Reel;3Kpcs/Reel
2
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