STP6NK90Z - STP6NK90ZFP - STB6NK90Z
2/12
ABSOLUTE MAXIMUM RATINGS
(
) Pulse width limited by safe operating area
(1) ISD ≤5.8A, di/dt ≤200A/µs, VDD ≤V(BR)DSS,T
j≤T
JMAX.
(*) Limited only by maximum temperature allowed
THERMAL DATA
AVALANCHE CHARACTERISTICS
GATE-SOURCE ZENER DIODE
PROTECTION FEATURES OF GATE-TO-SOURCE ZENER DIODES
The built-in back-to-back Zener diodes have specifically been designed to enhance not only the device’s
ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be
applied from gate to source. In this respect the Zener voltage is appropriate to achieve an efficient and
cost-effective intervention to protect the device’s integrity. These integrated Zener diodes thus avoid the
usage of external components.
Symbol Parameter Value Unit
STP6NK90Z / STB6NK90Z STP6NK90ZFP
VDS Drain-source Voltage (VGS =0) 900 V
VDGR Drain-gate Voltage (RGS =20kΩ)900 V
VGS Gate- source Voltage ± 30 V
IDDrain Current (continuous) at TC= 25°C 5.8 5.8 (*) A
IDDrain Current (continuous) at TC= 100°C 3.65 3.65 (*) A
IDM (
)Drain Current (pulsed) 23.2 23.2 (*) A
PTOT Total Dissipation at TC= 25°C 140 30 W
Derating Factor 1.12 0.24 W/°C
VESD(G-S) Gate source ESD(HBM-C=100pF, R=1.5KΩ) 4000 V
dv/dt (1) Peak Diode Recovery voltage slope 4.5 V/ns
Viso Insulation Withstand Voltage (DC) -- 2500 V
Tj
Tstg Operating Junction Temperature
Storage Temperature -55 to 150 °C
TO-220 D2PAK TO-220FP Unit
Rthj-case Thermal Resistance Junction-case Max 0.89 4.2 °C/W
Rthj-pcb Thermal Resistance Junction-pcb Max (When
mounted on minimum Footprint) 60 °C/W
Rthj-amb Thermal Resistance Junction-ambient Max 62.5 °C/W
TlMaximum Lead Temperature For Soldering
Purpose 300 °C
Symbol Parameter Max Value Unit
IAR Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by Tjmax) 5.8 A
EAS Single Pulse Avalanche Energy
(starting Tj= 25 °C, ID=I
AR,V
DD =50V) 300 mJ
Symbol Parameter Test Conditions Min. Typ. Max. Unit
BVGSO Gate-Source Breakdown
Voltage Igs=± 1mA (Open Drain) 30 V