© Semiconductor Components Industries, LLC, 2010
April, 2010 − Rev. 16
1Publication Order Number:
MC74VHC1G135/D
MC74VHC1G135
2-Input NAND
Schmitt-Trigger with
Open Drain Output
The MC74VHC1G135 is a single gate CMOS Schmitt NAND
trigger with an open drain output fabricated with silicon gate CMOS
technology. It achieves high speed operation similar to equivalent
Bipolar Schottky TTL while maintaining CMOS low power
dissipation.
The internal circuit is composed of three stages, including an open
drain output which provides the capability to set the output switching
level. This allows the MC74VHC1G135 to be used to interface 5 V
circuits to circuits of any voltage between VCC and 7 V using an
external resistor and power supply.
The MC74VHC1G135 input structure provides protection when
voltages up to 7 V are applied, regardless of the supply voltage.
The MC74VHC1G135 can be used to enhance noise immunity or to
square up slowly changing waveforms.
Features
•High Speed: tPD = 4.9 ns (Typ) at VCC = 5 V
•Low Internal Power Dissipation: ICC = 1 mA (Max) at TA = 25°C
•Power Down Protection Provided on Inputs
•Pin and Function Compatible with Other Standard Logic Families
•Chip Complexity: FETs = 70; Equivalent Gates = 18
•Pb−Free Packages are Available
Figure 1. Pinout (Top View)
51
2
43
VCC
IN B
IN A
OUT Y
GND
IN A
IN B OUT Y
&
OVT
Figure 2. Logic Symbol
http://onsemi.com
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
ORDERING INFORMATION
L
L
H
H
L
H
L
H
FUNCTION TABLE
Inputs Output
AB
Z
Z
Z
L
Y
PIN ASSIGNMENT
1
2
3 GND
IN B
IN A
4
5V
CC
OUT Y
SC−88A/SOT−353/SC−70
DF SUFFIX
CASE 419A
TSOP−5/SOT−23/SC−59
DT SUFFIX
CASE 483
MARKING
DIAGRAMS
1
5
1
5
1
5
VZ M G
G
VZ = Device Code
M = Date Code*
G= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may vary
depending upon manufacturing location.
1
5
VZ M G
G
M
MC74VHC1G135
http://onsemi.com
2
MAXIMUM RATINGS
Symbol Characteristics Value Unit
VCC DC Supply Voltage −0.5 to +7.0 V
VIN DC Input Voltage −0.5 to +7.0 V
VOUT DC Output Voltage −0.5 to 7.0 V
IIK Input Diode Current −20 mA
IOK Output Diode Current VOUT < GND; VOUT > VCC +20 mA
IOUT DC Output Current, per Pin +25 mA
ICC DC Supply Current, VCC and GND +50 mA
PDPower dissipation in still air SC−88A, TSOP−5 200 mW
qJA Thermal resistance SC−88A, TSOP−5 333 °C/W
TLLead temperature, 1 mm from case for 10 secs 260 °C
TJJunction temperature under bias +150 °C
Tstg Storage temperature −65 to +150 °C
MSL Moisture Sensitivity Level 1
FRFlammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in
VESD ESD Withstand Voltage Human Body Model (Note 1)
Machine Model (Note 2)
Charged Device Model (Note 3)
> 2000
> 200
N/A
V
ILatchup Latchup Performance Above VCC and Below GND at 125°C (Note 4) ±500 mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Tested to EIA/JESD22−A114−A
2. Tested to EIA/JESD22−A115−A
3. Tested to JESD22−C101−A
4. Tested to EIA/JESD78
RECOMMENDED OPERATING CONDITIONS
Symbol Characteristics Min Max Unit
VCC DC Supply Voltage 2.0 5.5 V
VIN DC Input Voltage 0.0 5.5 V
VOUT DC Output Voltage 0.0 7.0 V
TAOperating Temperature Range −55 +125 °C
tr , tfInput Rise and Fall Time VCC = 3.3 V ± 0.3 V
VCC = 5.0 V ± 0.5 V
0
0
No limit
No limit
ns/V
Device Junction Temperature versus
Time to 0.1% Bond Failures
Junction
Temperature °CTime, Hours Time, Years
80 1,032,200 117.8
90 419,300 47.9
100 178,700 20.4
110 79,600 9.4
120 37,000 4.2
130 17,800 2.0
140 8,900 1.0
1
1 10 100 1000
TIME, YEARS
NORMALIZED FAILURE RATE
TJ= 80 C°
TJ= 90 C°
TJ= 100 C°
TJ= 110 C°
TJ= 130 C°
TJ= 120 C°
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
Figure 3. Failure Rate vs. Time Junction Temperature
MC74VHC1G135
http://onsemi.com
3
DC ELECTRICAL CHARACTERISTICS
Symbol Parameter Test Conditions
VCC
(V)
TA = 25°C TA ≤ 85°C−55 ≤ TA ≤ 125°C
Unit
Min Typ Max Min Max Min Max
VT+ Positive Threshold
Voltage
3.0
4.5
5.5
1.50
2.35
2.80
1.88
2.66
3.21
2.25
3.10
3.70
1.50
2.35
2.80
2.25
3.10
3.70
1.50
2.35
2.80
2.25
3.10
3.70
V
VT−Negative Threshold
Voltage
3.0
4.5
5.5
0.65
1.10
1.45
1.03
1.62
2.02
1.40
2.10
2.60
0.65
1.10
1.45
1.40
2.10
2.60
0.65
1.10
1.45
1.40
2.10
2.60
V
VHHysteresis Voltage 3.0
4.5
5.5
0.30
0.40
0.50
0.85
1.05
1.20
1.60
2.00
2.25
0.30
0.40
0.50
1.60
2.00
2.25
0.30
0.40
0.50
1.60
2.00
2.25
V
VOL Maximum Low−Level
Output Voltage
VIN = VIH or VIL
IOL = 50 mA
2.0
3.0
4.5
0.0
0.0
0.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
V
IOL = 4 mA
IOL = 8 mA
3.0
4.5
0.36
0.36
0.44
0.44
0.52
0.52
V
IIN Maximum Input
Leakage Current
VIN = 5.5 V or GND 0 to
5.5
±0.1 ±1.0 ±1.0 mA
ICC Maximum Quiescent
Supply Current
VIN = VCC or GND 5.5 1.0 20 40 mA
IOFF Power Off−Output
Leakage Current
VOUT = 5.5 V
VIN = 5.5 V
0 0.25 2.5 5 mA
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
AC ELECTRICAL CHARACTERISTICS Cload = 50 pF, Input tr/tf = 3.0 ns
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
Symbol
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
Parameter
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
Test Conditions
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
TA = 25°C
ÎÎÎÎ
ÎÎÎÎ
TA ≤ 85°C
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
−55 ≤ TA ≤ 125°C
ÎÎ
ÎÎ
ÎÎ
Unit
ÎÎÎ
ÎÎÎ
Min
ÎÎÎ
ÎÎÎ
Typ
ÎÎÎ
ÎÎÎ
Max
ÎÎ
ÎÎ
Min
ÎÎÎ
ÎÎÎ
Max
Min
Max
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
tPZL
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
Maximum Output
Enable Time, A or B to Y
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
VCC = 3.3 ± 0.3 V CL = 15 pF
RL = RI = 500 WCL = 50 pF
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
7.6
10.1
ÎÎÎ
ÎÎÎ
11.9
15.4
ÎÎ
ÎÎ
1.0
1.0
ÎÎÎ
ÎÎÎ
14.0
17.5
1.0
1.0
16.1
19.6
ÎÎ
ÎÎ
ns
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
VCC = 5.0 ± 0.5 V CL = 15 pF
RL = RI = 500 WCL = 50 pF
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
4.9
6.4
ÎÎÎ
ÎÎÎ
ÎÎÎ
7.7
9.7
ÎÎ
ÎÎ
ÎÎ
1.0
1.0
ÎÎÎ
ÎÎÎ
ÎÎÎ
9.0
11.0
1.0
1.0
10.3
12.3
ÎÎ
ÎÎ
ÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
tPLZ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
Maximum Output
Disable Time
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
VCC = 3.3 ± 0.3 V CL = 50 pF
RL = RI = 500 W
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
10.1
ÎÎÎ
ÎÎÎ
ÎÎÎ
15.4
ÎÎ
ÎÎ
ÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
17.5
19.6
ÎÎ
ÎÎ
ÎÎ
ns
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
VCC = 5.0 ± 0.5 V CL = 50 pF
RL = RI = 500 W
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
6.4
ÎÎÎ
ÎÎÎ
9.7
ÎÎ
ÎÎ
ÎÎÎ
ÎÎÎ
11.0
12.3
ÎÎ
ÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
CIN
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
Maximum Input
Capacitance
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
5.0
ÎÎÎ
ÎÎÎ
ÎÎÎ
10
ÎÎ
ÎÎ
ÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
10
10
ÎÎ
ÎÎ
ÎÎ
pF
CPD Power Dissipation Capacitance (Note 5)
Typical @ 25°C, VCC = 5.0 V
pF
16
5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
MC74VHC1G135
http://onsemi.com
4
RL
VCC − 7 V
Figure 4. Output Voltage Mismatch Application
OVT
VCC
A
B
Figure 5. Switching Waveforms
Figure 6. Test Circuit
50%
50% VCC
tPZL tPLZ
VOL +0.3 V
VCC
GND
HIGH
IMPEDANCE
Y
A or B
CL = 50 pF equivalent (Includes jig and probe capacitance)
RL = R1 = 500 W or equivalent
RT = ZOUT of pulse generator (typically 50 W)
PULSE
GENERATOR
RT
DUT
VCC
RL
R1
CL
MC74VHC1G135
Figure 7. Complex Boolean Functions
E = (A • B) + (C+D)
A
B
C
D
MC74VHC1G03
2.2 kW
1
2
3
5
4
RLED
Figure 8. LED Driver
A
B
3.3 V 1.5 V
GTL
220 W
Figure 9. GTL Driver
MC74VHC1G135
A
B
VCC x 2
VCC
VCC
VCC
ORDERING INFORMATION
Device Package Shipping†
MC74VHC1G135DFT1 SC70−5 / SC−88A / SOT−353
3000 Units / Tape & Reel
M74VHC1G135DFT1G SC70−5 / SC−88A / SOT−353
(Pb−Free)
MC74VHC1G135DFT2 SC70−5 / SC−88A / SOT−353
M74VHC1G135DFT2G SC70−5 / SC−88A / SOT−353
(Pb−Free)
MC74VHC1G135DTT1 SOT23−5 / TSSOP−5 / SC59−5
M74VHC1G135DTT1G SOT23−5 / TSSOP−5 / SC59−5
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MC74VHC1G135
http://onsemi.com
5
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
DIM
A
MIN MAX MIN MAX
MILLIMETERS
1.80 2.200.071 0.087
INCHES
B1.15 1.350.045 0.053
C0.80 1.100.031 0.043
D0.10 0.300.004 0.012
G0.65 BSC0.026 BSC
H--- 0.10---0.004
J0.10 0.250.004 0.010
K0.10 0.300.004 0.012
N0.20 REF0.008 REF
S2.00 2.200.079 0.087
B0.2 (0.008) MM
12 3
45
A
G
S
D 5 PL
H
C
N
J
K
−B−
SC−88A, SOT−353, SC−70
CASE 419A−02
ISSUE J
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
ǒmm
inchesǓ
SCALE 20:1
0.65
0.025
0.65
0.025
0.50
0.0197
0.40
0.0157
1.9
0.0748
MC74VHC1G135
http://onsemi.com
6
PACKAGE DIMENSIONS
TSOP−5
CASE 483−02
ISSUE H
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
5. OPTIONAL CONSTRUCTION: AN
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
DIM MIN MAX
MILLIMETERS
A3.00 BSC
B1.50 BSC
C0.90 1.10
D0.25 0.50
G0.95 BSC
H0.01 0.10
J0.10 0.26
K0.20 0.60
L1.25 1.55
M0 10
S2.50 3.00
123
54 S
A
G
L
B
D
H
C
J
__
0.7
0.028
1.0
0.039
ǒmm
inchesǓ
SCALE 10:1
0.95
0.037
2.4
0.094
1.9
0.074
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.20
5X
CAB
T0.10
2X
2X T0.20
NOTE 5
T
SEATING
PLANE
0.05
K
M
DETAIL Z
DETAIL Z
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
MC74VHC1G135/D
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative