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ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor's product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. "Typical" parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. TM FQP50N06 60V N-Channel MOSFET General Description Features These N-Channel enhancement mode power field effect transistors are produced using Fairchild's proprietary, planar stripe, DMOS technology. This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for low voltage applications such as automotive, DC/ DC converters, and high efficiency switching for power management in portable and battery operated products. * * * * * * * 50A, 60V, RDS(on) = 0.022 @VGS = 10 V Low gate charge ( typical 31 nC) Low Crss ( typical 65 pF) Fast switching 100% avalanche tested Improved dv/dt capability 175C maximum junction temperature rating D ! " G! ! FQP Series Absolute Maximum Ratings ID S TC = 25C unless otherwise noted Parameter Drain-Source Voltage - Continuous (TC = 25C) Drain Current - Continuous (TC = 100C) IDM Drain Current " " TO-220 G DS Symbol VDSS ! " - Pulsed (Note 1) FQP50N06 60 Units V 50 A 35.4 A 200 A VGSS Gate-Source Voltage 25 V EAS Single Pulsed Avalanche Energy (Note 2) 490 mJ IAR Avalanche Current (Note 1) 50 A EAR Repetitive Avalanche Energy Peak Diode Recovery dv/dt Power Dissipation (TC = 25C) (Note 1) 12 7.0 120 0.8 -55 to +175 mJ V/ns W W/C C 300 C dv/dt PD TJ, TSTG TL (Note 3) - Derate above 25C Operating and Storage Temperature Range Maximum lead temperature for soldering purposes, 1/8" from case for 5 seconds Thermal Characteristics Symbol RJC Parameter Thermal Resistance, Junction-to-Case Typ -- RCS Thermal Resistance, Case-to-Sink 0.5 -- C/W RJA Thermal Resistance, Junction-to-Ambient -- 62.5 C/W (c)2003 Fairchild Semiconductor Corporation Max 1.24 Units C/W Rev. A2, March 2003 FQP50N06 QFET Symbol TC = 25C unless otherwise noted Parameter Test Conditions Min Typ Max Units Off Characteristics BVDSS Drain-Source Breakdown Voltage VGS = 0 V, ID = 250 A 60 -- -- V BVDSS / TJ Breakdown Voltage Temperature Coefficient ID = 250 A, Referenced to 25C -- 0.06 -- V/C IDSS IGSSF IGSSR VDS = 60 V, VGS = 0 V -- -- 1 A VDS = 48 V, TC = 150C -- -- 10 A Gate-Body Leakage Current, Forward VGS = 25 V, VDS = 0 V -- -- 100 nA Gate-Body Leakage Current, Reverse VGS = -25 V, VDS = 0 V -- -- -100 nA 2.0 -- 4.0 V -- 0.018 0.022 -- 22 -- S -- 1180 1540 pF -- 440 580 pF -- 65 90 pF Zero Gate Voltage Drain Current On Characteristics VGS(th) Gate Threshold Voltage VDS = VGS, ID = 250 A RDS(on) Static Drain-Source On-Resistance VGS = 10 V, ID = 25 A gFS Forward Transconductance VDS = 25 V, ID = 25 A (Note 4) Dynamic Characteristics Ciss Input Capacitance Coss Output Capacitance Crss Reverse Transfer Capacitance VDS = 25 V, VGS = 0 V, f = 1.0 MHz Switching Characteristics td(on) Turn-On Delay Time tr Turn-On Rise Time td(off) Turn-Off Delay Time tf Turn-Off Fall Time Qg Total Gate Charge Qgs Gate-Source Charge Qgd Gate-Drain Charge VDD = 30 V, ID = 25 A, RG = 25 (Note 4, 5) VDS = 48 V, ID = 50 A, VGS = 10 V (Note 4, 5) -- 15 40 ns -- 105 220 ns -- 60 130 ns -- 65 140 ns -- 31 41 nC -- 8 -- nC -- 13 -- nC Drain-Source Diode Characteristics and Maximum Ratings IS Maximum Continuous Drain-Source Diode Forward Current -- -- 50 A ISM -- -- 200 A VSD Maximum Pulsed Drain-Source Diode Forward Current VGS = 0 V, IS = 50 A Drain-Source Diode Forward Voltage -- -- 1.5 V trr Reverse Recovery Time Qrr Reverse Recovery Charge VGS = 0 V, IS = 50 A, dIF / dt = 100 A/s (Note 4) -- 52 -- ns -- 75 -- nC Notes: 1. Repetitive Rating : Pulse width limited by maximum junction temperature 2. L = 230H, IAS = 50A, VDD = 25V, RG = 25 , Starting TJ = 25C 3. ISD 50A, di/dt 300A/s, VDD BVDSS, Starting TJ = 25C 4. Pulse Test : Pulse width 300s, Duty cycle 2% 5. Essentially independent of operating temperature (c)2003 Fairchild Semiconductor Corporation Rev. A2, March 2003 FQP50N06 Electrical Characteristics FQP50N06 Typical Characteristics VGS 15.0 V 10.0 V 8.0 V 7.0 V 6.0 V 5.5 V 5.0 V Bottom : 4.5 V Top : ID, Drain Current [A] 2 10 ID, Drain Current [A] 2 10 1 10 1 10 175 25 Note : 1. 250 s Pulse Test 2. TC = 25 0 Notes : 1. VDS = 30V 2. 250 s Pulse Test -55 10 0 -1 0 10 10 1 10 2 10 4 6 8 10 VGS, Gate-Source Voltage [V] VDS, Drain-Source Voltage [V] Figure 1. On-Region Characteristics Figure 2. Transfer Characteristics 0.05 2 VGS = 10V 0.03 IDR, Reverse Drain Current [A] R DS(ON) [ ], Drain-Source On-Resistance 10 0.04 VGS = 20V 1 10 0.02 0.01 Note : TJ = 25 Notes : 1. VGS = 0V 2. 250 s Pulse Test 25 175 0.00 0 50 100 150 200 0 10 ID, Drain Current [A] 0.2 1.0 1.2 1.4 1.6 12 Ciss = Cgs + Cgd (Cds = shorted) Coss = Cds + Cgd Crss = Cgd 10 Coss Ciss Notes : 1. VGS = 0 V 2. f = 1 MHz 1500 1000 Crss 500 V GS , Gate-Source Voltage [V] Capacitance [pF] 0.8 Figure 4. Body Diode Forward Voltage Variation vs. Source Current and Temperature 2500 2000 0.6 VSD, Source-Drain voltage [V] Figure 3. On-Resistance Variation vs. Drain Current and Gate Voltage 3000 0.4 VDS = 30V VDS = 48V 8 6 4 2 Note : ID = 50A 0 0 0 -1 10 0 10 VDS, Drain-Source Voltage [V] Figure 5. Capacitance Characteristics (c)2003 Fairchild Semiconductor Corporation 5 10 15 20 25 30 35 1 10 QG, Total Gate Charge [nC] Figure 6. Gate Charge Characteristics Rev. A2, March 2003 (Continued) 1.2 2.5 2.0 1.1 RDS(ON) , (Normalized) Drain-Source On-Resistance BV DSS , (Normalized) Drain-Source Breakdown Voltage FQP50N06 Typical Characteristics 1.5 1.0 1.0 Notes : 1. VGS = 0 V 2. ID = 250 A 0.9 0.8 -100 -50 0 50 100 0.5 150 Notes : 1. VGS = 10 V 2. ID = 25 A 0.0 -100 200 -50 10 150 200 Figure 7. Breakdown Voltage Variation vs. Temperature Figure 8. On-Resistance Variation vs. Temperature 3 60 50 100 s 2 ID , Drain Current [A] ID , Drain Current [A] 100 TJ, Junction Temperature [ C] 1 ms 10 ms DC 10 50 TJ, Junction Temperature [ C] Operation in This Area is Limited by R DS(on) 10 0 o o 1 Notes : o 40 30 20 10 1. TC = 25 C o 2. TJ = 175 C 3. Single Pulse 0 10 -1 10 10 0 1 10 10 0 25 2 50 100 125 150 175 Figure 10. Maximum Drain Current vs. Case Temperature 0 D = 0 .5 N otes : 1 . Z J C( t ) = 1 . 2 4 /W M a x . 2 . D u t y F a c t o r , D = t 1 /t 2 3 . T J M - T C = P D M * Z J C( t ) 0 .2 0 .1 10 -1 0 .0 5 PDM 0 .0 2 JC (t), T h e rm a l R e s p o n s e Figure 9. Maximum Safe Operating Area 10 75 TC, Case Temperature [] VDS, Drain-Source Voltage [V] t1 0 .0 1 t2 Z s in g le p u ls e 10 -2 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1 t1 , S q u a r e W a v e P u ls e D u r a tio n [s e c ] Figure 11. Transient Thermal Response Curve (c)2003 Fairchild Semiconductor Corporation Rev. A2, March 2003 FQP50N06 Gate Charge Test Circuit & Waveform VGS Same Type as DUT 50K Qg 200nF 12V 10V 300nF VDS VGS Qgs Qgd DUT 3mA Charge Resistive Switching Test Circuit & Waveforms VDS RL VDS 90% VDD VGS RG VGS DUT 10V 10% tr td(on) td(off) t on tf t off Unclamped Inductive Switching Test Circuit & Waveforms BVDSS 1 EAS = ---- L IAS2 -------------------2 BVDSS - VDD L VDS BVDSS IAS ID RG VDD DUT 10V tp (c)2003 Fairchild Semiconductor Corporation ID (t) VDS (t) VDD tp Time Rev. A2, March 2003 FQP50N06 Peak Diode Recovery dv/dt Test Circuit & Waveforms DUT + VDS _ I SD L Driver RG VGS VGS ( Driver ) Same Type as DUT VDD * dv/dt controlled by RG * ISD controlled by pulse period Gate Pulse Width D = -------------------------Gate Pulse Period 10V IFM , Body Diode Forward Current I SD ( DUT ) di/dt IRM Body Diode Reverse Current VDS ( DUT ) Body Diode Recovery dv/dt VSD VDD Body Diode Forward Voltage Drop (c)2003 Fairchild Semiconductor Corporation Rev. A2, March 2003 FQP50N06 Package Dimensions TO-220 4.50 0.20 2.80 0.10 (3.00) +0.10 1.30 -0.05 18.95MAX. (3.70) o3.60 0.10 15.90 0.20 1.30 0.10 (8.70) (1.46) 9.20 0.20 (1.70) 9.90 0.20 1.52 0.10 0.80 0.10 2.54TYP [2.54 0.20] 10.08 0.30 (1.00) 13.08 0.20 ) (45 1.27 0.10 +0.10 0.50 -0.05 2.40 0.20 2.54TYP [2.54 0.20] 10.00 0.20 Dimensions in Millimeters (c)2003 Fairchild Semiconductor Corporation Rev. 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PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. (c)2003 Fairchild Semiconductor Corporation Rev. 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