Product Data Sheet November 15, 2006 Wideband Dual Stage VPIN Limiter TGL2201 Key Features * * * * * * * 3-25 GHz Passive, High Isolation Limiter Low Loss < 0.5 dB , X-band Good Return Loss > 15 dB Flat Leakage < 18 dBm Input Power CW Survivability > 5W Integrated DC Block on both input and output Chip Dimensions: 1.1 x 1.1 x 0.1 mm Primary Applications * * Military Radar LNA Receiver Chain Protection 0.0 0 -0.5 -3 -1.0 -6 -1.5 -9 -2.0 -12 -2.5 -15 -3.0 -18 -3.5 -21 -4.0 Return Loss (dB) Insertion Loss (dB) Fixtured Measured Performance -24 0 3 6 9 12 15 18 21 24 27 30 Frequency (GHz) 26 Data taken @ 10 GHz Output Power (dBm) 24 22 20 18 16 14 12 10 8 9 12 15 18 21 24 27 30 33 36 Input Power (dBm) TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994 8504 Web: www.triquint.com 1 Product Data Sheet November 15, 2006 TGL2201 TABLE I MAXIMUM RATINGS Symbol Parameter 1/ Value PIN Input Continuous Wave Power 37 dBm TM Mounting Temperature (30 Seconds) 320 C TSTG 0 0 Storage Temperature -65 to 150 C 1/ These ratings represent the maximum operable values for this device TABLE II DC CHARACTERISTICS (TA = 25 C) Symbol Parameter Limit Min Max Units FWD_RES (D1, D2, D3, D4) Resistance Forward 1.9 3.9 Ohm VREV(D1,D4) Reverse Voltage -60 -30 V TABLE III RF CHARACTERISTICS (TA = 25 C) Symbol IL IRL ORL PWR Parameter Insertion Loss Input Return Loss Output Return Loss Output Power @ Pin = 27 dBm Test Condition Units Min Limit Typ F = 4-20 GHz F = 4-20 GHz F = 4-20 GHz -12 12 0.5 --- 1.0 --- dB dB dB F = 6.0 GHz F = 16.0 GHz --- --- 20 20 dBm dBm Max TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994 8504 Web: www.triquint.com 2 Product Data Sheet November 15, 2006 TGL2201 High Isolation Limiter Assembly RF In RF Out DC Schematic TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994 8504 Web: www.triquint.com 3 Product Data Sheet November 15, 2006 TGL2201 Mechanical Drawing GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test. TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994 8504 Web: www.triquint.com 4 Product Data Sheet November 15, 2006 TGL2201 Assembly Process Notes Reflow process assembly notes: Use AuSn (80/20) solder with limited exposure to temperatures at or above 300 C for 30 sec An alloy station or conveyor furnace with reducing atmosphere should be used. No fluxes should be utilized. Coefficient of thermal expansion matching is critical for long-term reliability. Devices must be stored in a dry nitrogen atmosphere. Component placement and adhesive attachment assembly notes: Vacuum pencils and/or vacuum collets are the preferred method of pick up. Air bridges must be avoided during placement. The force impact is critical during auto placement. Organic attachment can be used in low-power applications. Curing should be done in a convection oven; proper exhaust is a safety concern. Microwave or radiant curing should not be used because of differential heating. Coefficient of thermal expansion matching is critical. Interconnect process assembly notes: Thermosonic ball bonding is the preferred interconnect technique. Force, time, and ultrasonics are critical parameters. Aluminum wire should not be used. Maximum stage temperature is 200 C. GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test. TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994 8504 Web: www.triquint.com 5 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Qorvo: TGL2201