Number: DB-022
July 2011 Releas e, Rev ision F
Page 1
TAK CHEONG ®
SEMICONDUCTOR
Green Product
400mW SOD-123 SURFACE MOUNT
Small Outline Flat Lead Plastic Package
General Purpose Application
Fast Switching Diode
Absolute Ma ximum Ra ti ng s TA = 25°C unless otherwise noted
Symbol Parameter Value Units
PD Power Dissipation 400 mW
TSTG Storage Temperature Range -65 to +150 °C
TJ Operating Junction Temperature +150 °C
VRSM Non-Repetitive Peak Reverse Voltage 100 V
VRRM Repetitive Peak Reverse Voltage 75 V
IFRM Repetitive Peak Forward Current 300 mA
IO Continuous Forward Current 150 mA
IFSM Peak Forward Surge Current
(Pulse Width=1us) 2 A
These ratings are limiting values above which the serviceability of the diode may be impaired.
Specification Features:
Fast Switching Device (TRR <4.0 nS)
General Purpose Diodes
Flat Lead SOD-123 Small Outline Plastic Package
Surface Device Type Mounting
RoHS Compliant
Green EMC
Matte Tin(Sn) Lead Finish
Band Indicates Cathode
DEVICE MARKING CODE:
Device Type Device Marking
1N4148W D1
1N4448W D2
1N914BW D3
Electrical Characteristics TA = 25°C unless otherwise noted Limits
Symbol Parameter Test Condition
Min Max Unit
BV Breakdown Voltage IR=100µA
IR=5µA
100
75
Volts
IR Reverse Leakage Current VR=20V
VR=75V
25
5
nA
µA
VF Forward Voltage 1N4448W, 1N914BW
TC1N444 8W, 1N4148W
1N4448W, 1N914BW
IF=5mA
IF=10mA
IF=100mA
0.62 0.72
1.0
1.0
Volts
TRR Reverse Recovery Time IF=10mA
IR=60mA
RL=100Ω
IRR=1mA
4 nS
C Capacitance VR=0V, f=1MHZ 4 pF
1N4148W/1N4448W/1N914BW
SOD -123 F lat Lead
Number: DB-022
July 2011 Releas e, Rev ision F
Page 2
TAK CHEONG ®
SEMICONDUCTOR
Typical Performance Characteristics
Total Capacitance
Forward Voltage vs Ambient Temperature
Number: DB-022
July 2011 Releas e, Rev ision F
Page 3
TAK CHEONG ®
SEMICONDUCTOR
Power Derating Curve
Reverse Current vs Reverse Voltage
0
100
200
300
400
500
0 25 50 75 100 125 150 175 200
Temperature [℃]
P D- P ower P assipat ion [ mW]
Number: DB-022
July 2011 Releas e, Rev ision F
Page 4
TAK CHEONG ®
SEMICONDUCTOR
Flat Lead SOD-123 Package Outline
Note: Dimensions are exclusive of Burrs, Mold Flash & Tie Bar extrusions.
Number: DB-100
April 14, 2 008 / A
DISCLAIMER NOTICE
TAK CHEONG ®
NOTICE
The information presented in this document is for reference only. Tak Cheong reserves the right to make
changes without notice for the specification of the products displayed herein.
The product listed herein is designed to be used with ordinary electronic equipment or devices, and not
designed to be used with equipment or devices which require high level of reliability and the malfunctio n of with
would directly endanger human life (such as medical instruments, transportation equipment, aerospace
machinery, nuclear-reactor controllers, fuel controllers and other safety devices), Tak Cheong Semiconductor
Co., Ltd., or anyone on its behalf, assumes no responsibility or liability for any damagers resulting from such
improper use of sale.
This publication supersedes & replaces all information re viously supplied. For additio nal information , please visit
our website http://www.takcheong.com, o r consu lt your ne ares t Tak Cheong’s sales off ic e for further assis t anc e.
