(0.635 mm) .025" QMSS SERIES
Increased insertion
depth for rugged applications
Optional
Power Pins
QMSS–032–06.75–L–D–DP–PC4
QMSS–026–06.75–L–D–A
QMSS–052–06.75–L–D–A
Integral metal plane for
power or ground
Signal Pairs
Differential routing
Grounds
to shield
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
QFSS
QMSS
(11.00)
.433
For complete specifications and
recommended PCB layouts see
www.samtec.com?QMSS
Insulator Material:
Liquid Crystal Polymer
Terminal, Ground
Plane & Shield Material:
Phosphor Bronze
Plating:
Au over 50 µ" (1.27 µm) Ni
(Tin on Ground Plane Tail)
Voltage Rating:
300 VAC mated with QFSS
Operating Temp:
-55 °C to +125 °C
RoHS Compliant:
Ye s
QMSS PINS PER ROW
NO. OF PAIRS
PLATING
OPTION
–026, –052, –078
(52 total pins per bank
40 signals + 12 grounds to shield = –D)
–016, –032, –048
(16 pairs per bank = –D–DP)
–L
= 10 µ" (0.25 µm)
Gold on Signal
Pins, Shield and
Ground Plane
(Tin on Signal Pin
tails, and Ground
Plane tails)
–D
= Single-Ended
–D–DP
= Differential Pair
TYPE AOTHER
OPTION
–K
= (5.50 mm)
.217" DIA
Polyimide
film Pick &
Place Pad
(N/A with –PC4)
–PC4
= 4 Power
Pins/End
(N/A with –A)
06.75
(6.35)
.250
(6.35)
.250
(7.52)
.296
(0.25)
.010
(2.31)
.091
(3.18)
.125
(6.73)
.265
01
01
02
(0.23)
.009
01
02
(7.26)
.286
No. of Banks x (21.34) .840 - (0.51) .020
(0.635)
.025
(21.35) .840
(2.29)
.090
No. of Banks x (21.34) .840 + (13.21) .520
(2.00) .07874
(2.54)
.100
(2.54)
.100
–PC4
–D –D–DP
(1.30 mm)
.051"
NOMINAL
WIPE
SHIELDED GROUND PLANE HEADER
See SO Series for precision
machined standoffs.
OTHER
SOLUTIONS
APPLICATION
• Increased
insertion depth
• Integral guide post
Gbps
14
HIGH-SPEED CHANNEL PERFORMANCE
QMSS-DP/QFSS-DP @ 11 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
SPECIFICATIONS
For complete scope of
recognitions see
www.samtec.com/quality
RECOGNITIONS
FILE NO. E111594
PROCESSING
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (026-078)
Board Stacking:
For applications requiring more
than two connectors per board,
contact ipg@samtec.com
Board Mates:
QFSS
Standoffs:
SO
Notes:
Patented
Some lengths, styles and
options are non-standard,
non-returnable.
ALSO AVAILABLE
(MOQ Required)
• Headers without
Alignment Pins
• 8 Power Pins/End
• 4 or 8 Power Pins/End for
(2.36 mm) .093" thick board
• Guide Post
• Edge Mount
• 64 (-DP) and 104 pins per row
F-219
