7-203
7
VN2222
VN2224
Advanced DMOS Technology
These enhancement-mode (normally-off) transistors utilize a
vertical DMOS structure and Supertex’s well-proven silicon-gate
manufacturing process. This combination produces devices with
the power handling capabilities of bipolar transistors and with the
high input impedance and positive temperature coefficient inher-
ent in MOS devices. Characteristic of all MOS structures, these
devices are free from thermal runaway and thermally-induced
secondary breakdown.
Supertex’s vertical DMOS FET s are ideally suited to a wide range
of switching and amplifying applications where high breakdown
voltage, high input impedance, low input capacitance, and fast
switching speeds are desired.
N-Channel Enhancement-Mode
Vertical DMOS FETs
Package Options
Ordering Information
Absolute Maximum Ratings
Drain-to-Source Voltage BVDSS
Drain-to-Gate Voltage BVDGS
Gate-to-Source Voltage ± 20V
Operating and Storage Temperature -55°C to +150°C
Soldering Temperature* 300°C
* Distance of 1.6 mm from case for 10 seconds.
Order Number / Package
BVDSS /R
DS(ON) ID(ON)
BVDGS (max) (min) TO-92 20-Pin C-Dip
220V 1.255.0A VN2222NC
240V 1.255.0A VN2224N3
Applications
Motor controls
Converters
Amplifiers
Switches
Power supply circuits
Drivers (relays, hammers, solenoids, lamps,
memories, displays, bipolar transistors, etc.)
Features
Free from secondary breakdown
Low power drive requirement
Ease of paralleling
Low CISS and fast switching speeds
Excellent thermal stability
Integral Source-Drain diode
High input impedance and high gain
High Reliability Devices
See pages 5-4 and 5-5 for MILITARY STANDARD Process
Flows and Ordering Information.
Note: See Package Outline section for dimensions.
1
10
2
3
4
5
6
7
8
9
20
11
19
18
17
16
15
14
13
12
top view
SS
SS
SNC
G1 D1
G2 D2
G3 D3
G4 D4
SNC
SS
SS
TO-92
S G D
20-pin Ceramic DIP
7-204
Symbol Parameter Min Typ Max Unit Conditions
BVDSS VV
GS = 0V, ID = 5mA
VGS(th) Gate Threshold Voltage 1.0 3.0 V VGS = VDS, ID = 5mA
VGS(th) Change in VGS(th) with Temperature -4 -5 mV/°CV
GS = VDS, ID = 5mA
IGSS Gate Body Leakage 1 100 nA VGS = ±20V, VDS = 0V
IDSS Zero Gate Voltage Drain Current 50 µAV
GS = 0V, VDS = Max Rating
5mA V
GS = 0V, VDS = 0.8 Max Rating
TA = 125°C
ID(ON) ON-State Drain Current 2 VGS = 5V, VDS = 25V
510 V
GS = 10V, VDS = 25V
RDS(ON) 1.0 1.5 VGS = 5V, ID = 2A
0.9 1.25 VGS = 10V, ID = 2A
RDS(ON) Change in RDS(ON) with Temperature 1.0 1.4 %/°CV
GS = 10V, ID = 2A
GFS Forward Transconductance 1.0 2.2 VDS = 25V, ID = 2A
CISS Input Capacitance 300 350
COSS Common Source Output Capacitance 85 150 pF
CRSS Reverse Transfer Capacitance 20 35
td(ON) Turn-ON Delay Time 6 15
trRise Time 16 25
td(OFF) Turn-OFF Delay Time 65 90
tfFall Time 30 60
VSD Diode Forward Voltage Drop 0.8 1.0 V VGS = 0V, ISD = 100mA
trr Reverse Recovery Time 500 ns VGS = 0V, ISD = 1A
Notes:
1. All D.C. parameters 100% tested at 25°C unless otherwise stated. (Pulse test: 300µs pulse, 2% duty cycle.)
2. All A.C. parameters sample tested.
Package ID (continuous)* ID (pulsed) Power Dissipation
θ
jc
θ
ja IDR*I
DRM
@ TC = 25°C°C/W °C/W
TO-92 0.9A 5.0A 1.0W 125 170 0.9A 5.0A
*ID (continuous) is limited by max rated Tj.
Thermal Characteristics
90%
10%
90% 90%
10%
10%
PULSE
GENERATOR
VDD
RL
OUTPUT
D.U.T.
t(ON)
td(ON)
t(OFF)
td(OFF) tF
tr
INPUT
INPUT
OUTPUT
10V
VDD
Rgen
0V
0V
Switching Waveforms and Test Circuit
Electrical Characteristics (@ 25°C unless otherwise specified)
Drain-to-Source
Breakdown Voltage
A
VN2222/VN2224
Static Drain-to-Source
ON-State Resistance
VDD = 25V
ID = 2A
RGEN = 10
VGS = 0V, VDS = 25V
f = 1 MHz
ns
VN2224 240
VN2222 220
7-205
7
Typical Performance Curves
VN2222/VN2224
Output Characteristics
10
8
6
4
2
0
VDS (volts)
ID (amperes)
ID (amperes)
Saturation Characteristics
10
8
6
4
2
0
VDS (volts)
Maximum Rated Safe Operating Area
1 100010010
10
1
0.1
0.01
0.001
VDS (volts)
ID (amperes)
Thermal Response Characteristics
Thermal Resistance (normalized)
1.0
0.8
0.6
0.4
0.2
0
0.001 100.01 0.1 1
tp (seconds)
Transconductance vs. Drain Current
5
4
3
2
1
00105
GFS (siemens)
ID (amperes)
Power Dissipation vs. Case Temperature
0 15010050
10
5
0
1257525 TC (°C)
PD (watts)
TO-92
TC = 25°C
PD = 1W
TO-92
TA = -55°C
VDS = 25V
0102030 5040
4V
3V
0246 108
VGS = 10V
6V
4V
3V
TA = 25°C
TA = 125°C
VGS = 10V
6V
8V
8V
TO-92 (DC)
TC = 25°C
7-206
Typical Performance Curves
VN2222/VN2224
Gate Drive Dynamic Characteristics
QG (nanocoulombs)
VGS (volts)
Tj (°C)
VGS(th) (normalized)
RDS(ON) (normalized)
V(th) and RDS Variation with Temperature
On-Resistance vs. Drain Current
RDS(ON) (ohms)
BVDSS (normalized)
Tj (°C)
Transfer Characteristics
VGS (volts)
ID (amperes)
Capacitance vs. Drain-to-Source Voltage
400
C (picofarads)
VDS (volts)
ID (amperes)
BVDSS Variation with Temperature
0 10203040
300
200
0
0246810
10
5
-50 0 50 100 150
1.1
1.0
5
2
1.4
1.0
0.4
10
8
6
4
2
0246810
-50 0 50 100 150
300 pF
VDS = 40V
VDS = 10V
VGS = 5V
VGS = 10V
TA = -55°C
VDS = 25V
125°C
0246 108
0
3
4
f = 1MHz
CISS
COSS
CRSS
0.9
733 pF
0.6
0.8
1.2
2.4
2.0
1.6
1.2
0.8
0.4
Vth @ 5mA
25°C
0
100
0
1
RDS @ 10V, 2A
Note: Circle (e.g. B ) indicates JEDEC Reference.
Package Outline
E
0.065
± 0.003
B
1
0.080 ± 0.005
S
0.165
± 0.005
0.250
± 0.008
0.130
± 0.015
A
L
0.018
± 0.002
B
0.100 TYP.
e
1
0.035
± 0.005
Q
0.310 ± 0.010
E
1
0.011
± 0.002
C
0.760 ± 0.005
14
1
8
7
α = 0 - 15°
D
14-Lead Ceramic Dual-In Line Package (C)
CH06C Table Page 1 of 1
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Device
Number BVDSS
min (V)
RDS(ON)
max ()
CISS
typ (pf) SOT-23
K1 TO-39
N2 TO-92
N3 Quad1
N6 SOT-89
N8
VN0300 30 1.2 190 3
VN0104 40 3.0 35
VN3205 50 0.3 220
VN0106 60 3.0 55
VN2106 60 4.0 35
2N7000 60 5.0 60 2
VN10K 60 5.0 60
2N7002 60 7.5 50
2N7008 60 7.5 50 2
VN2222L 60 7.5 60 3
VN1306460 8.0 25
VN2210 100 0.35 300
VN2110 100 4.0 35
VN13104100 8.0 25
VN2222 220 1.25 300
VN2224 240 1.25 300
VN0550 500 60.0 45
VN2450 500 13.0 150
VN2460 600 20.0 150
Add package suffix for complete part number, e.g., VN0104N3 is VN0104 in a TO-92 package.
Notes:
1. Package options are defined on individual data sheets.
2. No package suffix required.
3. Use package suffix "L" instead of "N3".
4. Not recommended for new designs.
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