To all our customers Regarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp. The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.) Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand names are mentioned in the document, these names have in fact all been changed to Renesas Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and corporate statement, no changes whatsoever have been made to the contents of the document, and these changes do not constitute any alteration to the contents of the document itself. Renesas Technology Home Page: http://www.renesas.com Renesas Technology Corp. Customer Support Dept. April 1, 2003 Cautions Keep safety first in your circuit designs! 1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corporation product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corporation or a third party. 2. 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The revision list can be viewed directly by clicking the title page. The revision list summarizes the locations of revisions and additions. Details should always be checked by referring to the relevant text. Hitachi 16-Bit Single-Chip Microcomputer H8S/2329 Series, H8S/2328 Series Hardware Manual -- Specifications Common to All Series -- ADE-602-171C Rev. 4.0 3/20/2003 Hitachi, Ltd. Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi's or any third party's patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party's rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi's sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi's sales office for any questions regarding this document or Hitachi semiconductor products. Preface The H8S/2329 Series and H8S/2328 Series are series of high-performance microcontrollers with a 32-bit H8S/2000 CPU core, and a set of on-chip supporting functions required for system configuration. The H8S/2000 CPU can execute basic instructions in one state, and is provided with sixteen 16-bit general registers with a 32-bit internal configuration, and a concise and optimized instruction set. The CPU can handle a 16-Mbyte linear address space (architecturally 4 Gbytes). Programs based on the high-level language C can also be run efficiently. The address space is divided into eight areas. The data bus width and access states can be selected for each of these areas, and various kinds of memory can be connected fast and easily. Single-power-supply flash memory (F-ZTATTM) and mask ROM versions are available, providing a quick and flexible response to conditions from ramp-up through full-scale volume production, even for applications with frequently changing specifications. On-chip supporting functions include a 16-bit timer pulse unit (TPU), programmable pulse generator (PPG), 8-bit timer, watchdog timer (WDT), serial communication interface (SCI), A/D converter, D/A converter, and I/O ports. In addition, an on-chip DMA controller (DMAC) and data transfer controller (DTC) are provided, enabling high-speed data transfer without CPU intervention. Use of the H8S/2329 Series and H8S/2328 Series enables easy implementation of compact, highperformance systems capable of processing large volumes of data. Refer to the H8S/2600 Series, H8S/2000 Series Programming Manual for a detailed description of the instruction set and programming-related information. Rev. 4.0, 03/03 page iii of xliv Rev. 4.0, 03/03 page iv of xliv List of Main Revisions and Additions for This Version Item Page Revisions (See Manual for Details) All Package 1.1 Overview 4 Memory Table 1-1 Overview H8S/2326C F-ZTAT lineup added, and note amended Product Code ROM RAM H8S/2329, H8S/2329B* , H8S/2329E* 3 H8S/2328, H8S/2328B* 384 kbytes 32 kbytes 256 kbytes 8 kbytes H8S/2327 128 kbytes 8 kbytes H8S/2326 512 kbytes 8 kbytes 4 H8S/2326C* 512 kbytes 16 kbytes 1 2 H8S/2324S H8S/2323 32 kbytes 32 kbytes 8 kbytes H8S/2322R 8 kbytes H8S/2321 4 kbytes H8S/2320 4 kbytes Notes: *1 The H8S/2329B F-ZTAT is a low-cost version of the H8S/2329 F-ZTAT. Refer to the item of the H8S/2329 F-ZTAT. *2 The on-chip debug function can be used with the E10-A emulator (E10-A compatible version). However, some function modules and pin functions are unavailable when the on-chip debug function is in use. Refer to figures 1-7 and 1-8, Pin Arrangement. *3 The H8S/2328B F-ZTAT is a low-cost version of the H8S/2328 F-ZTAT. Refer to the item of the H8S/2328 F-ZTAT. *4 In planning 5 Operating modes * Eight MCU operating modes (H8S/2328 F-ZTAT, H8S/2326 F-ZTAT) Mode 0 deleted from table Rev. 4.0, 03/03 page v of xliv Item Page Revisions (See Manual for Details) 1.1 Overview 6 * Four MCU operating modes (ROMless, mask ROM versions, H8S/2329F-ZTAT and H8S/2326C F-ZTAT) Table 1-1 Overview Item of MCU Operating Mode 0 deleted from table, notes amended External Data Bus CPU Operating Mode Mode Description On-Chip Initial ROM Value Maximum Value 1 1* 2 2* 2 3* 3 4* Advanced On-chip ROM disabled Disabled 16 bits 16 bits expansion mode 3 5* On-chip ROM disabled Disabled 8 bits 16 bits expansion mode 6 On-chip ROM enabled Enabled 8 bits 16 bits expansion mode 7 Single-chip mode Enabled Notes: *1 User boot mode in the H8S/2326C F-ZTAT. See table 19.73 in section 19.33, On-Board Programming Modes, for information on H8S/2326C F-ZTAT user boot modes. *2 Boot mode in the H8S/2329 F-ZTAT, H8S/2326C F-ZTAT. See table 19.9 in section 19.6, On-Board Programming Modes, for information on H8S/2329C F-ZTAT user boot modes. See table 19.9 in section 19.6, On-Board Programming Modes, for information on H8S/2329C F-ZTAT user program modes. See table 19.73 in section 19.33, On-Board Programming Modes, for information on H8S/2326C F-ZTAT user program modes. See table 19.73 in section 19.33, On-Board Programming Modes, for information on H8S/2326C F-ZTAT user boot modes. *3 The ROMless versions can use only modes 4 and 5. 7 Product lineup Table and notes amended Condition A Condition B Operating power supply voltage 2.7 to 3.6 V 3.0 to 3.6 V Operating frequency 2 to 20 MHz 2 to 25 MHz Model 3 HD64F2328B* HD6432327 O O HD64F2326 O O 4 HD64F2326C* O HD6412324S O O HD6432323 O O HD6412322R O O HD6412321 O O HD6412320 O O *3 This is a low-cost version. For specifications, refer to the items for the H8S/2328 F-ZTAT. *4 In planning 8 Rev. 4.0, 03/03 page vi of xliv Item of Other features newly added Item Page Revisions (See Manual for Details) 1.2 Block Diagram 9 Figure amended (Before) (After) Figure 1-1 Mask ROM Versions, F-ZTAT Versions, H8S/2324S, H8S/2322R, H8S/2320 Internal Block Diagram 1.3.1 Pin Arrangement WDTOVF (FEW, EMLE) WDTOVF (FEW, EMLE, VCL) Note amended Note: *1 The EMLE pin applies to the H8S/2329 F-ZTAT only. The VCL pin applies to the H8S/2326C F-ZTAT only. 11 The 72nd pin name and note amended WDTOVF (FWE, EMLE) WDTOVF (FWE, EMLE, VCL) Figure 1-3 Mask ROM Versions, F-ZTAT Versions, H8S/2324S, H8S/2322R, H8S/2320 Pin Arrangement (TFP-120: Top View) (Before) (After) Figure 1-4 Mask ROM Versions, 12 F-ZTAT Versions, H8S/2324S, H8S/2322R, H8S/2320 Pin Arrangement (FP-128B: Top View) The 80th pin name and note amended Note amended Note: * The EMLE pin applies to the H8S/2329 F-ZTAT only. The VCL pin applies to the H8S/2326C F-ZTAT only. (Before) (After) WDTOVF (FWE, EMLE) WDTOVF (FWE, EMLE, VCL) Note amended Note: * The EMLE pin applies to the H8S/2329 F-ZTAT only. The VCL pin applies to the H8S/2326C F-ZTAT only. 1.3.2 Pin Functions in Each Operating Mode 19 Table 1-2 Pin Functions in Each Operating Mode 22 The 72nd pin name of TFP-120, and the 80th pin name of FP128B amended (Before) (After) WDTOVF (FWE, EMLE) WDTOVF (FWE, EMLE, VCL) (Before) (After) FWE, EMLE FWE, EMLE, VCL Note amended Note: *3 The EMLE pin applies to the H8S/2329 F-ZTAT only. The VCL pin applies to the H8S/2326C F-ZTAT only. 1.3.3 Pin Functions 23 Added to table Pin No. Table 1-3 Pin Functions Type Symbol TFP-120 FP-128B I/O Name and Function Power VCC 1, 33, 52, 76, 81 5, 39, 58, 84, 89 Input Power supply: For connection to the power supply. All VCC pins should be connected to the system power supply. VSS 6, 15, 24, 38, 47, 59, 79, 104 3, 10, 19, 28, 35, 36, 44, 53, 65, 67, 68, 87, 99, 100, 114 Input Ground: For connection to ground (0 V). All VSS pins should be connected to the system power supply (0 V). 72 80 Output An external capacitor should be connected between this pin and GND (0V). Do not connect it to VCC. Internal stepdown pin 1 VCL* Rev. 4.0, 03/03 page vii of xliv Item Page Revisions (See Manual for Details) 1.3.3 Pin Functions 24, 25 Operating mode control Table of the relation between the settings of pins MD2 to MD0 and the operating mode amended Table 1-3 Pin Functions H8S/2328 F-ZTAT, H8S/2326 F-ZTAT: Operating FWE MD2 MD1 MD0 Mode 0 0 0 1 1 0 1 Mask ROM and ROMless versions, H8S/2329 F-ZTAT, and H8S/2326C F-ZTAT: Operating Mode MD2 MD1 MD0 0 0 1 1 0 1 Mode 3* 0 0 1 Mode 4* 3 Mode 5* 1 0 Mode 6 1 Mode 7 1 1 Mode 1* 2 Mode 2* 2 3 Notes: *1 Applies to the H8S/2326C F-ZTAT only. *2 Applies to the H8S/2329 F-ZTAT and H8S/2326C F-ZTAT only. *3 The ROMless versions can use only modes 4 and 5. 30 Note added Note: *1 Applies to the H8S/2326C F-ZTAT only. 2.6.3 Table of Instructions Classified by Function 48 (Before) (After) Table 2-3 Instructions Classified by Function 2.7.1 Addressing Mode 60 (8) Memory Indirect 3.1.1 Operating Mode Selection (H8S/2328 F-ZTAT, H8S/2326 FZTAT) Table 3-1 MCU Operating Mode Selection (H8S/2328 F-ZTAT, H8S/2326 F-ZTAT) Rev. 4.0, 03/03 page viii of xliv MOVFPE and MOVTPE functions amended Cannot be used in the H8S/2357 Series. Cannot be used in the H8S/2329 and H8S/2328 Series. Description amended The upper bits of the absolute address are all assume to be 0, so the address range is 0 to 255 (H'000000 to H'0000FF). In advanced mode, the memory operand is a long word operand, the first byte of which is assumed to be all 0 (H'00). 75 Item of MCU Operating Mode 0 deleted from table. Item Page Revisions (See Manual for Details) 3.1.2 Operating Mode Selection (Mask ROM and ROMless Versions, H8S/2329 F-ZTAT, and H8S/2326C F-ZTAT) 76 Title description amended 3.1.2 Operating Mode Selection (Mask ROM and ROMless Versions, H8S/2329 F-ZTAT, and H8S/2326C F-ZTAT) 77 The ROMless and mask ROM versions have four operating modes (modes 4 to 7). H8S/2329 F-ZTAT has six operating modes (modes 2 to 7). H8S/2326C F-ZTAT has seven operating modes (modes 1 to 7). Item of MCU Operating Mode 0 deleted from table and notes amended MCU Operating Mode Table 3-2 MCU Operating Mode Selection (Mask ROM and ROMless Versions, H8S/2329 FZTAT, and H8S/2326C F-ZTAT) 1 1* 2 2* 2 3* 3 4* 3 5* Notes:*1 User boot mode in the H8S/2326C F-ZTAT. See table 19-73 in section 19.33, On-Board Programming Modes, for information on H8S/2326C F-ZTAT user boot modes. *2 Boot mode in the H8S/2329 F-ZTAT, H8S/2326C FZTAT. See table 19-9 in section 19.6, On-Board Programming Modes, for information on H8S/2329C F-ZTAT user boot modes. See table 19-9 in section 19.6, On-Board Programming Modes, for information on H8S/2329C F-ZTAT user program modes. See table 19-73 in section 19.33, On-Board Programming Modes, for information on H8S/2326C F-ZTAT user program modes. See table 19-73 in section 19.33, On-Board Programming Modes, for information on H8S/2326C F-ZTAT user boot modes. 77, 78 Description amended from the 10th line The ROMless and mask ROM versions can only be used in modes 4 to 7. This means that the mode pins must be set to select one of these modes. However, note that only mode 4 or 5 can be set for the ROMless version. H8S/2329 F-ZTAT can only be used in modes 2 to 7. This means that the mode pins must be set to select one of these modes. H8S/2326C F-ZTAT can only be used in modes 1 to 7. This means that the mode pins must be set to select one of these modes. Rev. 4.0, 03/03 page ix of xliv Item Page Revisions (See Manual for Details) 3.2.3 System Control Register 2 (SYSCR2) (F-ZTAT Version Only) 80, 81 Description and note amended Note: * R/W in the H8S/2329 F-ZTAT and H8S/2326C F-ZTAT. Bit 3--Flash Memory Control Register Enable (FLSHE): Controls CPU access to the flash memory control registers (FLMCR1, FLMCR2, EBR1, and EBR2 in the case of the H8S/2329 FZTAT, H8S/2328 F-ZTAT, and H8S/2326 F-ZTAT: FCCS, FPCS, FECS, FKEY, FMATS, and FTDAR in the case of the H8S/2326C F-ZTAT). For details, see section 19, ROM. Bit 3 FLSHE Description 0 H8S/2329F-ZTAT, H8S/2328F-ZTAT, and H8S/2326F-ZTAT * Flash control registers are not selected for addresses H'FFFFC8 to H'FFFFCB (Initial value) H8S/2326C F-ZTAT * 1 Flash control registers are not selected for addresses H'FFFFC4 to H'FFFFCF H8S/2329F-ZTAT, H8S/2328F-ZTAT, and H8S/2326F-ZTAT * Flash control registers are not selected for addresses H'FFFFC8 to H'FFFFCB H8S/2326C F-ZTAT * Flash control registers are not selected for addresses H'FFFFC4 to H'FFFFCF Bit 0--Reserved: In the H8S/2329F-ZTAT and H8S/2326C FZTAT, this bit is reserved and should only be written with 0. 3.3.1 Mode 1 (H8S/2326C FZTAT Only) 81 Title amended and description replaced This is a flash memory user boot mode. See section 19, ROM, for details. This is the same as advanced single chip ROM mode, except when erasing and reprogramming flash memory. 3.3.2 Mode 2 (H8S/2329F-ZTAT and H8S/2326C F-ZTAT Only) Title amended 3.3.3 Mode 3 (H8S/2329F-ZTAT and H8S/2326C F-ZTAT Only) Title amended Rev. 4.0, 03/03 page x of xliv Item Page Revisions (See Manual for Details) 3.4 Pin Functions in Each Operating Mode 84 Table and notes amended Mode 5 1* Port Table 3-4 Pin Functions in Each Mode Port PA7 to P A PA5 PA4 to PA0 Port B P Port C P Port D P Port E P Port PF7 F PF6 1 P* /C P PF5 to PF4 PF3 PF2 to PF0 *4 Valid only in the H8S/2329 F-ZTAT and H8S/2326C FZTAT. *5 Valid only in the H8S/2326C F-ZTAT. 95 Newly added Figure 3-5(b) H8S/2326C F-ZTAT 96 Address Map in Each Operating Mode Newly added 4.1.3 Exception Vector Table Description in the 7th line amended, and note added 3.5 Memory Map in Each Operating Mode Figure 3-5(a) H8S/2326C F-ZTAT Address Map in Each Operating Mode 102 In this case, clearing the EAE bit in BCRL enables the 256-kbyte (128 kbytes/384 kbytes/512 kbytes)* area comprising addresses H'000000 to H'03FFFF (to H'01FFFF/H'05FFFF/H'07FFFF) to be used. Note: * The amount of on-chip ROM differs depending on the product. 6.2.5 Bus Control Register L (BCRL) 158 Bit table and note amended Bit 5--External Address Enable (EAE) Description Bit 5 H8S/2329, H8S/2328, H8S/2326, H8S/2326C 0 On-chip ROM Note: *2 Addresses H'010000 to H'05FFFF in the H8S/2329. Addresses H'010000 to H'07FFFF in the H8S/2326 and H8S/2326C. Rev. 4.0, 03/03 page xi of xliv Item Page Revisions (See Manual for Details) 8.3.7 Block Transfer Mode 321 Description amended In block transfer mode, one operation transfers one block of area. Either the transfer source or the transfer destination is designated as a block area. 13.2.3 Reset Control/Status Register (RSTCSR) 573 Description amended Bit 7--Watchdog Timer Overflow Flag (WOVF) [Clearing Condition] amended (Before) TCSR (After) RSTCSR Bit 5--Reserved: This bit should be written with 0. 13.3.4 Timing of Watchdog Timer 578 Overflow Flag (WOVF) Setting Note added 13.5.5 Internal Reset in Watchdog Timer Mode Description in the 11th line amended 580 Note: * The WDTOVF pin function cannot be used in the FZTAT versions. (Before) TCSR (After) 15.2.2 Serial Status Register (SSR) 654 RSTCSR Bit table amended Bit 4*Error Signal Status (ERS) Bit 4 ERS Description 0 Indicates data received normally with no error signal [Clearing conditions] (Initial value) * Upon reset, and in standby mode or module stop mode * When 0 is written to ERS after reading ERS = 1 1 Indicates an error signal was sent showing detection of a parity error at the receiving side [Setting condition] When the low level of the error signal is sampled 655 Bit 2 Bit 2 TEND Description 0 Indicates transfer in progress [Clearing conditions] * When 0 is written to TDRE after reading TDRE = 1 * When the DMAC* or DTC is activated by a TXI interrupt and writes data to TDR 1 Indicates transfer complete [Setting conditions] (Initial value) * Upon reset, and in standby mode or module stop mode Rev. 4.0, 03/03 page xii of xliv Item Page Revisions (See Manual for Details) 15.2.4 Serial Control Register (SCR) 657 Bit table amended Bits 1 and 0--Clock Enable 1 and 0 (CKE1, CKE0) SCMR SMIF 18.1 Overview 709 SMR GM Description amended The H8S/2329 and H8S/2324S have 32 kbytes of on-chip highspeed static RAM, the H8S/2326C has 16 kbytes, the H8S/2328, H8S/2327, H8S/2326, H8S/2323, and H8S/2322R have 8 kbytes, and the H8S/2321 and H8S/2320 have 4 kbytes. 19.2.2 Bus Control Register L (BCRL) 715 Bit 5--External Address Enable (EAE) Description Bit 5 H8S/2329, H8S/2328, H8S/2326, H8S/2326C 0 On-chip ROM Note: *2 Addresses H'010000 to H'05FFFF in the H8S/2329. Addresses H'010000 to H'07FFFF in the H8S/2326 and H8S/2326C. 19.3 Operation 716 Item of Mode 0 deleted from table Table 19-2 Operating Modes and ROM (H8S/2328 F-ZTAT, H8S/2326 F-ZTAT) Rev. 4.0, 03/03 page xiii of xliv Item Page Revisions (See Manual for Details) 19.3 Operation 717 Item of Mode 0 deleted from table and notes amended Mode On-Chip ROM Table 19-3 Operating Modes and ROM (H8S/2329 F-ZTAT, H8S/2326C F-ZTAT, and Mask ROM Version) 3 1* 4 2* 4 3* 6 Enabled (256 kbytes)*1*2 7 Enabled (256 kbytes) *1*2 Enabled (64 kbytes) Enabled (64 kbytes) Notes: *2 The amount of on-chip RAM differs depending on the product. Refer to section 3.5, Memory Map in Each Operation Mode, for details. *3 User boot mode in the H8S/2326C F-ZTAT. See table 19-73 in section 19.33, On-Board Programming Modes, for information on H8S/2326C F-ZTAT user boot modes. *4 Boot mode in the H8S/2329 F-ZTAT, H8S/2326C FZTAT. See table 19-9 in section 19.6, On-Board Programming Modes, for information on H8S/2329C F-ZTAT user boot modes. See table 19-9 in section 19.6, On-Board Programming Modes, for information on H8S/2329C F-ZTAT user program modes. ee table 19-73 in section 19.33, On-Board Programming Modes, for information on H8S/2326C F-ZTAT user program modes. See table 19-73 in section 19.33, On-Board Programming Modes, for information on H8S/2326C F-ZTAT user boot modes. 19.5.5 System Control Register 2 733 (SYSCR2) Bit tale amended Bit : Initial value : R/W 734 : 0 0 R/W Description amended Bits 2 and 1--Reserved: These bits cannot be modified and are always read as 0. Bit 0--Reserved: This bit should not be written with 0. 19.7.2 Program-Verify Mode Figure 19-14 Program/ProgramVerify Flowchart Rev. 4.0, 03/03 page xiv of xliv 745 (Preliminary) deleted from figure title Item Page Revisions (See Manual for Details) 19.7.4 Erase-Verify Mode 747 (Preliminary) deleted from figure title 794 (Preliminary) deleted from figure title 796 (Preliminary) deleted from figure title 818 Figure amended Figure 19-15 Erase/Erase-Verify Flowchart 19.16.2 Program-Verify Mode Figure 19-41 Program/ProgramVerify Flowchart 19.16.4 Erase-Verify Mode Figure 19-42 Erase/Erase-Verify Flowchart 19.21 Flash Memory Programming and Erasing Precautions (Before)Wait time: 10s (After) Wait time: 100s Figure 19-56 Power On/Off Timing (Boot Mode) Figure 19-57 Power On/Off Timing (User Program Mode) SWE set SWE cleared SWE bit 819 Figure amended SWE set SWE cleared SWE bit Figure 19-58 Mode Transition Timing 820 Figure amended SWE bit 19.25.2 Program-Verify Mode 850 SWE set SWE cleared (Preliminary) deleted from figure title Figure 19-71 Program/ProgramVerify Flowchart 19.25.4 Erase-Verify Mode 852 Figure 19-72 Erase/Erase-Verify Flowchart 19.30 Flash Memory Programming and Erasing Precautions 874 Figure 19-86 Power On/Off Timing (Boot Mode) Figure 19-87 Power On/Off Timing (User Program Mode) Figure amended (Before) Wait time: 10s (After) Wait time: 100s SWE set SWE cleared SWE bit 875 Figure amended SWE set SWE bit Figure 19-88 Mode Transition Timing 876 SWE cleared Figure amended SWE bit SWE set SWE cleared Rev. 4.0, 03/03 page xv of xliv Item Page Revisions (See Manual for Details) 19.31 Overview of Flash Memory 877 to 982 (H8S/2326C F-ZTAT) to 19.38.3 Procedure Program and Storable Area for Programming Data Newly added 20.3.2 External Clock Input Condition amended 989 (Before) Vcc = 2.7 V to 3.3 V (After) Vcc = 2.7 V to 3.6 V Table 20-4 External Clock Input Conditions 21.1 Overview 992 Table 21-1 Operating Modes 22.1.4 A/D Conversion Characteristics CPU Operating Mode 1036 Modules Registers High speed mode High speed Mediumspeed mode Medium Function speed Function Registers High speed Function High/ Function medium 1 speed * Quantization error conditions amended Condition A Item Table 22-10 A/D Conversion Characteristics 22.2 Electrical Characteristics of F-ZTAT (H8S/2329F-ZTAT, H8S/2328F-ZTAT, H8S/2328B FZTAT, H8S/2326F-ZTAT) Table amended Min Typ Quantization error 1038 Max Condition B Min -0.5 Typ Max -0.5 LSB Title amended 22.2.1 Absolute Maximum Ratings Table and notes amended Table 22-12 Absolute Maximum Ratings (After) (Before) Input voltage (FWE)*2 Input voltage (FWE*2, EMLE*3) Notes:*2 The FWE pin applies to the H8S/2328 F-ZTAT, H8S/2328B F-ZTAT, and H8S/2326 F-ZTAT. *3 The EMLE pin applies to the H8S/2329 F-ZTAT, H8S/2329B F-ZTAT, and H8S/2329E F-ZTAT. Rev. 4.0, 03/03 page xvi of xliv Unit Item Page Revisions (See Manual for Details) 22.2.2 DC Characteristics 1039, 1040 Table amended and note added Table 22-13 DC Characteristics Item Input high voltage RES, STBY, NMI, 2 MD2 to MD0,, FWE* , 3 EMLE* Input low voltage RES, STBY, 2 MD2 to MD0, FWE* , 3 EMLE* Input leakage current RES STBY, NMI, 2 MD2 to MD0, FWE* , 3 EMLE* Note *3 The EMLE pin applies to the H8S/2329F-ZTAT and H8S/2329B F-ZTAT, and H8S/2329E F-ZTAT. 22.2.4 A/D Conversion Characteristics 1048 Quantization error conditions amended Condition B Item Table 22-20 A/D Conversion Characteristics Min Quantization error 1052 to 1064 Newly added A.1 Instruction Set 1069, 1088 Note *4 deleted from LDM and STM 1097, 1102, 1103 Note *3 deleted from LDM and STM A.4 Number of State Required for 1116, Instruction Execution 1120, 1121 Table A-5 Number of State Note *4 deleted from LDM and STM A.2 Instruction Codes Table A-2 Instruction Codes Max -0.5 22.3 Electrical Characteristics of the H8S/2326C F-ZTAT (In Planning) to 22.3.7 Usage Note (internal voltage step down for the H8S/2326C F-ZTAT) Table A-1 Instruction Set Typ Unit LSB Required for Instruction Execution A.5 Bus State during Instruction Execution Table A-6 Instruction Execution Cycles 1129, 1130, 1134, Note *9 deleted Rev. 4.0, 03/03 page xvii of xliv Item Page Revisions (See Manual for Details) B.1 List of Registers (Address Order) 1144 Table amended Data Register Module Bus Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Name Width H'FED0 ABWCR ABW7 ABW6 ABW5 ABW4 ABW3 ABW2 ABW1 ABW0 Bus 8 bits H'FED1 ASTCR AST7 AST6 AST5 AST4 AST3 AST2 AST1 AST0 H'FED2 WCRH W71 W70 W61 W60 W51 W50 W41 W40 H'FED3 WCRL W31 W30 W21 W20 W11 W10 W01 W00 H'FED4 BCRH ICIS1 ICIS0 BRSTRM BRSTS1 BRSTS0 H'FED5 BCRL BRLE BREQOE EAE TPC BE RCDM -- MXC1 MXC0 RLW1 RLW0 RFSHE RCW RMODE CMF CMIE CKS2 CKS1 CKS0 -- -- -- -- RAMS RAM2 RAM1 RAM0 controller *3 H'FED6 MCR H'FED7 DRAMCR H'FED8 RTCNT H'FED9 RTCOR H'FEDB RAMER *3 -- *2 DDS *2 *2 *2 RMTS2 RMTS1 RMTS0 -- *2 WDBE WAITE *3 *4 Flash 8 bits memory 1145 Table amended Data Register Address Name Bit 7 H'FF06 DMABCRH FAE1 Module Bus Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Name Width FAE0 SAE1 SAE0 DTA1B DTA1A DTA0B DTA0A Short address mode FAE1 FAE0 -- -- DTA1 -- DTA0 -- Full address mode 1148 Table amended Data Register Module Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Name Width H'FF98 ADCSR ADF ADIE ADST SCAN CKS CH2 CH1 CH0 A/D 8 bits H'FF99 ADCR TRGS1 TRGS0 -- -- CKS1 CH3 -- -- converter 1149 Item of Flash memory (H8S/2326C F-ZTAT) newly added to table 1151 Notes added Note: *15 Applies to the H8S/2326C F-ZTAT. Rev. 4.0, 03/03 page xviii of xliv Bus Address Item Page B.2 List of Registers (By Module) 1153 Revisions (See Manual for Details) Table amended Module Register DMAC0 Memory address register 0A I/O address register 0A Transfer count register 0A Memory address register 0B I/O address register 0B Transfer count register 0B DMAC1*7 Memory address register 1A I/O address register 1A Transfer count register 1A Memory address register 1B I/O address register 1B Transfer count register 1B Both DMAC channels*7 DMA write enable register DMA terminal control register DMA control register 0A DMA control register 0B DMA control register 1A DMA control register 1B DMA band control register Module stop control register 1159 Added to item of Flash memory Module Register Abbreviation R/W Flash memory Flash memory control register 1 17 FLMCR1* 17 FLMCR2* Flash memory control register 2 Erase block register 2 17 EBR1* 17 EBR2* Flash code control status register Erase block register 1 1 Initial Value Address* 14 15 R/W * H'00/H'80 * 14 R/W * H'00 14 16 R/W * H'00* 14 16 13 H'FFC8 * 13 H'FFC9 * 13 H'FFCA * R/W * H'00* H'FFCB 20 FCCS* R/W H'80 H'FFC4*13 20 R/W H'00 H'FFC5*13 R/W Flash program code select register FPCS* 20 Flash erase code select register FECS* 20 FKEY* 20 FMATS* R/W H'FFC6*13 21 H'00/H'AA* H'FFC8*13 R/W H'00 H'FFC9*13 Flash transfer destination address register 20 FTDAR* R/W H'00 H'FFCA*13 RAM emulation register RAMER*24 18 SYSCR2* R/W H'00 H'FEDB R/W H'00 H'FF42 Flash key code register Flash MAT select register System control register 2 H'00 Rev. 4.0, 03/03 page xix of xliv Item Page B.2 List of Registers (By Module) 1162 Revisions (See Manual for Details) Notes amended Notes: *17 FLMCR1, FLMCR2, EBR1, and EBR2 are 8-bit registers. Only byte access can be used on these registers, with the access requiring two states. (Applies to the H8S/2329F-ZTAT, H8S/2328FZTAT, and H8S/2326F-ZTAT.) *19 Value of bits 3 to 0. *20 Applies to the H8S/2326C F-ZTAT only. Can be accessed when on-chip flash memory is valid. *21 In user mode or user program mode, the initial value when wake up is H'00. *22 The initial value depends on the mode. *23 Value of bits 4 to 0. *24 Valid only in the F-ZTAT B.3 Functions 1194 Figure and note amended BCRL H'FED5 Bus Control Register L External Addresses H'010000 to H'03FFFF Enable 0 In the H8S/2329, H8S/2328, H8S/2326, and H8S/2326C, addresses H'010000 to H'03FFFF*2 are on-chip ROM In the H8S/2327, addresses H'010000 to H'01FFFF are on-chip ROM, and addresses H'020000 to H'03FFFF are a reserved area*1 In the H8S/2323, addresses H'010000 to H'03FFFF are a reserved area*1 Note *2 H'010000 to H'03FFFF in the H8S/2328, H'010000 to H'05FFFF in the H8S/2329, H'010000 to H'07FFFF in the H8S/2326 and H8S/2326C. 1198 Added RAMER*RAM Emulation Register (Valid only in the F-ZTAT) 1220 Figure amended System Clock Select SCK2 SCK1 SCK0 0 0 0 1 1 0 1 1 0 0 1 1 Rev. 4.0, 03/03 page xx of xliv Item Page Revisions (See Manual for Details) B.3 Functions 1208, 1209 Figure amended DMACR0A to DMACR1B H'FF02 to H'FF05 (Not supported in H8S/2321): DMAC DMACRB in Full address mode, and DMACR in Short address mode Data Transfer Factor DTF DTF DTF DTF 3 2 1 0 0 1 0 1 1222 Block Transfer Mode 0 Activated by SCI channel 0 transmission data-empty interrupt 1 Activated by SCI channel 0 reception data-full interrupt 0 Activated by SCI channel 1 transmission data-empty interrupt 1 Activated by SCI channel 1 reception data-full interrupt Figure amended SYSCR2 H'FF42(Valid only in F-ZTAT versions): MCU Bit : 3 2 1 0 0 0 FLSHE Initial value : 0 Read/Write : R/W 0 (R/W) In the H8S/2329 and H8S/2326C only this bit is R/W, and should only be written with 0 Flash Memory Control Register Enable 0 H8S/2329F-ZTAT, H8S/2328F-ZTAT, and H8S/2326F-ZTAT * Flash control registers are not selected for addresses H'FFFFC8 to H'FFFFCB H8S/2326C F-ZTAT * Flash control registers are not selected for addresses H'FFFFC4 to H'FFFFCF 1 H8S/2329F-ZTAT, H8S/2328F-ZTAT, and H8S/2326F-ZTAT * Flash control registers are not selected for addresses H'FFFFC8 to H'FFFFCB H8S/2326C F-ZTAT * Flash control registers are not selected for addresses H'FFFFC4 to H'FFFFCF 1245 Figure amended SCR0 H'FF7A Smart Card Interface 0 1254 Figure amended SCR1 H'FF82 Smart Card Interface 1 Rev. 4.0, 03/03 page xxi of xliv Item Page Revisions (See Manual for Details) B.3 Functions 1263 Figure amended SCR2 H'FF8A Smart Card Interface 2 1277 Figure amended TCSR H'FFBC (W) H'FFBC (R) WDT Bit : Initial value : Read/Write*1 : 7 6 5 OVF WT/IT TME 0 R/(W)*2 0 0 R/W R/W 4 1 3 2 1 0 CKS2 CKS1 CKS0 1 0 0 0 R/W R/W R/W Timer Mode Select 0 1 Interval timer mode: Sends the CPU an interval timer interrupt request (WOVI) when TCNT overflows Watchdog timer mode: Generates the WDTOVF signal*1 when TCNT overflows*2 Notes: *1 The WDTOVF pin function is not available in the F-ZTAT versions. *2 For details of the case where TCNT overflows in watchdog timer mode, see section 13.2.3, Reset Control/Status Register (RSTCSR). Overflow Flag 0 [Clearing condition] When 0 is written to OVF after reading OVF = 1 1 [Setting condition] When TCNT overflows from H'FF to H'00 in interval timer mode Notes: *1 The method for writing to TCSR is different from that for general registers to prevent accidental overwriting. For details, see section 13.2.4, Notes on Register Access. *2 Can only be written with 0 for flag clearing. 1278 Figure amended RSTCSR H'FFBE (W) H'FFBF (R) WDT (Before) This bit cannot be modified This bit should be written with 0 (After) Bit 7 [Clearing condition] (Before) When 0 is written to WOVF after reading WOVF = 1 (After) 1286 When 0 is written to WOVF after reading RSTCSR when WOVF = 1 Figure newly added H'FFC4 FCCS: FLASH (Valid only in the H8S/2326C F-ZTAT) 1287 Figures newly added H'FFC5 FPCS: FLASH (Valid only in the H8S/2326C F-ZTAT) H'FFC6 FECS: FLASH (Valid only in the H8S/2326C F-ZTAT) 1288 Figures newly added H'FFC8 FKEY: FLASH (Valid only in the H8S/2326C F-ZTAT) H'FFC9 FMATS: FLASH (Valid only in the H8S/2326C FZTAT) Rev. 4.0, 03/03 page xxii of xliv Item Page Revisions (See Manual for Details) B.3 Functions 1289 Figure newly added H'FFCA FTDAR: FLASH (Valid only in the H8S/2326C FZTAT) Appendix E Product Lineup 1356 HD64F2328B, HD64F2326C lineup added and note amended Product Type H8S/2328 Mask ROM version F-ZTAT Model Marking Package (Hitachi Package Code) HD6432328 HD6432328TE HD6432328F 120-pin TQFP (TFP-120) HD64F2328VTE 120-pin TQFP (TFP-120) HD64F2328 128-pin QFP (FP-128B) HD64F2328VF 128-pin QFP (FP-128B) 2 HD64F2328B* HD64F2328BVTE 120-pin TQFP (TFP-120) H8S/2327 Mask ROM version H8S/2326 F-ZTAT HD64F2328BVF 128-pin FP (FP-128B) HD6432327TE HD6432327F 120-pin TQFP (TFP-120) HD64F2326 HD64F2326VTE 120-pin TQFP (TFP-120) HD64F2326C HD64F2326CVTE HD6432327 HD64F2326VF 1 H8S/2326C* F-ZTAT HD64F2326CVF 128-pin QFP (FP-128B) 128-pin FP (FP-128B) 120-pin TQFP (TFP-120) 128-pin FP (FP-128B) Note: *1 In planning Rev. 4.0, 03/03 page xxiii of xliv Rev. 4.0, 03/03 page xxiv of xliv Contents Section 1 Overview ............................................................................................................. 1.1 1.2 1.3 Overview ........................................................................................................................... Block Diagram................................................................................................................... Pin Description .................................................................................................................. 1.3.1 Pin Arrangement................................................................................................... 1.3.2 Pin Functions in Each Operating Mode................................................................ 1.3.3 Pin Functions........................................................................................................ 1 1 9 11 11 17 23 Section 2 CPU ....................................................................................................................... 31 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 Overview ........................................................................................................................... 2.1.1 Features ................................................................................................................ 2.1.2 Differences between H8S/2600 CPU and H8S/2000 CPU................................... 2.1.3 Differences from H8/300 CPU ............................................................................. 2.1.4 Differences from H8/300H CPU .......................................................................... CPU Operating Modes ...................................................................................................... Address Space ................................................................................................................... Register Configuration....................................................................................................... 2.4.1 Overview .............................................................................................................. 2.4.2 General Registers ................................................................................................. 2.4.3 Control Registers.................................................................................................. 2.4.4 Initial Register Values .......................................................................................... Data Formats ..................................................................................................................... 2.5.1 General Register Data Formats............................................................................. 2.5.2 Memory Data Formats.......................................................................................... Instruction Set.................................................................................................................... 2.6.1 Overview .............................................................................................................. 2.6.2 Instructions and Addressing Modes...................................................................... 2.6.3 Table of Instructions Classified by Function ........................................................ 2.6.4 Basic Instruction Formats..................................................................................... Addressing Modes and Effective Address Calculation...................................................... 2.7.1 Addressing Mode ................................................................................................. 2.7.2 Effective Address Calculation .............................................................................. Processing States ............................................................................................................... 2.8.1 Overview .............................................................................................................. 2.8.2 Reset State ............................................................................................................ 2.8.3 Exception-Handling State..................................................................................... 2.8.4 Program Execution State ...................................................................................... 2.8.5 Bus-Released State ............................................................................................... 2.8.6 Power-Down State................................................................................................ 31 31 32 33 33 34 37 38 38 39 40 41 42 42 44 45 45 46 47 57 58 58 61 65 65 66 67 69 69 69 Rev. 4.0, 03/03 page xxv of xliv 2.9 Basic Timing ..................................................................................................................... 2.9.1 Overview .............................................................................................................. 2.9.2 On-Chip Memory (ROM, RAM).......................................................................... 2.9.3 On-Chip Supporting Module Access Timing ....................................................... 2.9.4 External Address Space Access Timing ............................................................... 2.10 Usage Note ........................................................................................................................ 2.10.1 TAS Instruction .................................................................................................... 70 70 70 72 73 73 73 Section 3 MCU Operating Modes ................................................................................... 75 3.1 3.2 3.3 3.4 3.5 Overview ........................................................................................................................... 3.1.1 Operating Mode Selection (H8S/2328 F-ZTAT, H8S/2326 F-ZTAT)................. 3.1.2 Operating Mode Selection (Mask ROM and ROMless Versions, H8S/2329 F-ZTAT, and H8S/2326C F-ZTAT) ................................................... 3.1.3 Register Configuration ......................................................................................... Register Descriptions......................................................................................................... 3.2.1 Mode Control Register (MDCR).......................................................................... 3.2.2 System Control Register (SYSCR)....................................................................... 3.2.3 System Control Register 2 (SYSCR2) (F-ZTAT Version Only) .......................... Operating Mode Descriptions............................................................................................ 3.3.1 Mode 1 (H8S/2326C F-ZTAT Only).................................................................... 3.3.2 Mode 2 (H8S/2329 F-ZTAT and H8S/2326C F-ZTAT Only) ............................. 3.3.3 Mode 3 (H8S/2329 F-ZTAT and H8S/2326C F-ZTAT Only) ............................. 3.3.4 Mode 4 (Expanded Mode with On-Chip ROM Disabled).................................... 3.3.5 Mode 5 (Expanded Mode with On-Chip ROM Disabled).................................... 3.3.6 Mode 6 (Expanded Mode with On-Chip ROM Enabled) ..................................... 3.3.7 Mode 7 (Single-Chip Mode) ................................................................................ 3.3.8 Modes 8 and 9 (H8S/2328 F-ZTAT and H8S/2326 F-ZTAT Only) .................... 3.3.9 Mode 10 (H8S/2328 F-ZTAT and H8S/2326 F-ZTAT Only).............................. 3.3.10 Mode 11 (H8S/2328 F-ZTAT and H8S/2326 F-ZTAT Only).............................. 3.3.11 Modes 12 and 13 (H8S/2328 F-ZTAT and H8S/2326 F-ZTAT Only) ................ 3.3.12 Mode 14 (H8S/2328 F-ZTAT and H8S/2326 F-ZTAT Only).............................. 3.3.13 Mode 15 (H8S/2328 F-ZTAT and H8S/2326 F-ZTAT Only).............................. Pin Functions in Each Operating Mode............................................................................. Memory Map in Each Operating Mode............................................................................. 75 75 76 78 78 78 79 80 81 81 81 81 81 82 82 82 82 82 83 83 83 83 84 85 Section 4 Exception Handling .......................................................................................... 101 4.1 4.2 Overview ........................................................................................................................... 101 4.1.1 Exception Handling Types and Priority ............................................................... 101 4.1.2 Exception Handling Operation ............................................................................. 102 4.1.3 Exception Vector Table........................................................................................ 102 Reset .................................................................................................................................. 104 4.2.1 Overview .............................................................................................................. 104 4.2.2 Reset Sequence..................................................................................................... 104 Rev. 4.0, 03/03 page xxvi of xliv 4.3 4.4 4.5 4.6 4.7 4.2.3 Interrupts after Reset ............................................................................................ 105 4.2.4 State of On-Chip Supporting Modules after Reset Release .................................. 105 Traces ................................................................................................................................ 106 Interrupts ........................................................................................................................... 107 Trap Instruction ................................................................................................................. 108 Stack Status after Exception Handling .............................................................................. 108 Notes on Use of the Stack.................................................................................................. 109 Section 5 Interrupt Controller ........................................................................................... 111 5.1 5.2 5.3 5.4 5.5 5.6 Overview ........................................................................................................................... 111 5.1.1 Features ................................................................................................................ 111 5.1.2 Block Diagram ..................................................................................................... 112 5.1.3 Pin Configuration ................................................................................................. 113 5.1.4 Register Configuration ......................................................................................... 113 Register Descriptions......................................................................................................... 114 5.2.1 System Control Register (SYSCR)....................................................................... 114 5.2.2 Interrupt Priority Registers A to K (IPRA to IPRK) ............................................ 115 5.2.3 IRQ Enable Register (IER)................................................................................... 116 5.2.4 IRQ Sense Control Registers H and L (ISCRH, ISCRL)...................................... 117 5.2.5 IRQ Status Register (ISR) .................................................................................... 118 Interrupt Sources ............................................................................................................... 119 5.3.1 External Interrupts................................................................................................ 119 5.3.2 Internal Interrupts ................................................................................................. 120 5.3.3 Interrupt Exception Vector Table......................................................................... 121 Interrupt Operation ............................................................................................................ 127 5.4.1 Interrupt Control Modes and Interrupt Operation ................................................ 127 5.4.2 Interrupt Control Mode 0 ..................................................................................... 130 5.4.3 Interrupt Control Mode 2 ..................................................................................... 132 5.4.4 Interrupt Exception Handling Sequence ............................................................... 134 5.4.5 Interrupt Response Times..................................................................................... 136 Usage Notes....................................................................................................................... 137 5.5.1 Contention between Interrupt Generation and Disabling...................................... 137 5.5.2 Instructions that Disable Interrupts....................................................................... 138 5.5.3 Times when Interrupts are Disabled ..................................................................... 138 5.5.4 Interrupts during Execution of EEPMOV Instruction .......................................... 138 DTC and DMAC Activation by Interrupt.......................................................................... 138 5.6.1 Overview .............................................................................................................. 138 5.6.2 Block Diagram ..................................................................................................... 139 5.6.3 Operation.............................................................................................................. 140 Section 6 Bus Controller .................................................................................................... 143 6.1 Overview ........................................................................................................................... 143 6.1.1 Features ................................................................................................................ 143 Rev. 4.0, 03/03 page xxvii of xliv 6.2 6.3 6.4 6.5 6.6 6.7 6.1.2 Block Diagram ..................................................................................................... 145 6.1.3 Pin Configuration ................................................................................................. 146 6.1.4 Register Configuration ......................................................................................... 148 Register Descriptions......................................................................................................... 149 6.2.1 Bus Width Control Register (ABWCR) ............................................................... 149 6.2.2 Access State Control Register (ASTCR) .............................................................. 150 6.2.3 Wait Control Registers H and L (WCRH, WCRL) .............................................. 151 6.2.4 Bus Control Register H (BCRH) .......................................................................... 154 6.2.5 Bus Control Register L (BCRL) ........................................................................... 157 6.2.6 Memory Control Register (MCR) ........................................................................ 159 6.2.7 DRAM Control Register (DRAMCR) .................................................................. 161 6.2.8 Refresh Timer Counter (RTCNT) ........................................................................ 163 6.2.9 Refresh Time Constant Register (RTCOR) .......................................................... 164 Overview of Bus Control................................................................................................... 165 6.3.1 Area Partitioning .................................................................................................. 165 6.3.2 Bus Specifications ................................................................................................ 166 6.3.3 Memory Interfaces................................................................................................ 167 6.3.4 Advanced Mode ................................................................................................... 168 6.3.5 Chip Select Signals............................................................................................... 169 Basic Bus Interface............................................................................................................ 170 6.4.1 Overview .............................................................................................................. 170 6.4.2 Data Size and Data Alignment ............................................................................. 170 6.4.3 Valid Strobes ........................................................................................................ 172 6.4.4 Basic Timing ........................................................................................................ 173 6.4.5 Wait Control......................................................................................................... 181 DRAM Interface (Not supported in the H8S/2321)........................................................... 183 6.5.1 Overview .............................................................................................................. 183 6.5.2 Setting DRAM Space ........................................................................................... 183 6.5.3 Address Multiplexing ........................................................................................... 183 6.5.4 Data Bus ............................................................................................................... 184 6.5.5 Pins Used for DRAM Interface ............................................................................ 184 6.5.6 Basic Timing ........................................................................................................ 185 6.5.7 Precharge State Control........................................................................................ 186 6.5.8 Wait Control......................................................................................................... 187 6.5.9 Byte Access Control ............................................................................................. 189 6.5.10 Burst Operation .................................................................................................... 191 6.5.11 Refresh Control .................................................................................................... 194 DMAC Single Address Mode and DRAM Interface (Not supported in the H8S/2321).... 197 6.6.1 When DDS = 1 ..................................................................................................... 197 6.6.2 When DDS = 0 ..................................................................................................... 198 Burst ROM Interface ......................................................................................................... 199 6.7.1 Overview .............................................................................................................. 199 6.7.2 Basic Timing ........................................................................................................ 199 Rev. 4.0, 03/03 page xxviii of xliv 6.7.3 Wait Control......................................................................................................... 201 Idle Cycle .......................................................................................................................... 202 6.8.1 Operation.............................................................................................................. 202 6.8.2 Pin States in Idle Cycle......................................................................................... 206 6.9 Write Data Buffer Function ............................................................................................... 207 6.10 Bus Release ....................................................................................................................... 208 6.10.1 Overview .............................................................................................................. 208 6.10.2 Operation.............................................................................................................. 208 6.10.3 Pin States in External Bus Released State ............................................................ 209 6.10.4 Transition Timing................................................................................................. 210 6.10.5 Usage Note ........................................................................................................... 211 6.11 Bus Arbitration .................................................................................................................. 211 6.11.1 Overview .............................................................................................................. 211 6.11.2 Operation.............................................................................................................. 211 6.11.3 Bus Transfer Timing............................................................................................. 212 6.11.4 External Bus Release Usage Note ........................................................................ 212 6.12 Resets and the Bus Controller............................................................................................ 212 6.8 Section 7 DMA Controller (Not Supported in the H8S/2321)................................ 213 7.1 7.2 7.3 7.4 7.5 Overview ........................................................................................................................... 213 7.1.1 Features ................................................................................................................ 213 7.1.2 Block Diagram ..................................................................................................... 214 7.1.3 Overview of Functions ......................................................................................... 215 7.1.4 Pin Configuration ................................................................................................. 217 7.1.5 Register Configuration ......................................................................................... 218 Register Descriptions (1) (Short Address Mode) .............................................................. 219 7.2.1 Memory Address Registers (MAR) ...................................................................... 220 7.2.2 I/O Address Register (IOAR) ............................................................................... 221 7.2.3 Execute Transfer Count Register (ETCR) ............................................................ 221 7.2.4 DMA Control Register (DMACR) ....................................................................... 222 7.2.5 DMA Band Control Register (DMABCR) ........................................................... 226 Register Descriptions (2) (Full Address Mode)................................................................. 231 7.3.1 Memory Address Register (MAR) ....................................................................... 231 7.3.2 I/O Address Register (IOAR) ............................................................................... 231 7.3.3 Execute Transfer Count Register (ETCR) ............................................................ 232 7.3.4 DMA Control Register (DMACR) ....................................................................... 233 7.3.5 DMA Band Control Register (DMABCR) ........................................................... 237 Register Descriptions (3) ................................................................................................... 242 7.4.1 DMA Write Enable Register (DMAWER)........................................................... 242 7.4.2 DMA Terminal Control Register (DMATCR) ..................................................... 244 7.4.3 Module Stop Control Register (MSTPCR) .......................................................... 245 Operation........................................................................................................................... 246 7.5.1 Transfer Modes .................................................................................................... 246 Rev. 4.0, 03/03 page xxix of xliv 7.5.2 7.5.3 7.5.4 7.5.5 7.5.6 7.5.7 7.5.8 7.5.9 7.5.10 7.5.11 7.5.12 7.5.13 7.5.14 7.6 7.7 Sequential Mode................................................................................................... 248 Idle Mode ............................................................................................................. 251 Repeat Mode ........................................................................................................ 254 Single Address Mode ........................................................................................... 258 Normal Mode ....................................................................................................... 261 Block Transfer Mode ........................................................................................... 264 DMAC Activation Sources................................................................................... 270 Basic DMAC Bus Cycles ..................................................................................... 273 DMAC Bus Cycles (Dual Address Mode) ........................................................... 274 DMAC Bus Cycles (Single Address Mode) ......................................................... 282 Write Data Buffer Function.................................................................................. 288 DMAC Multi-Channel Operation......................................................................... 289 Relation Between the DMAC and External Bus Requests, Refresh Cycles, and the DTC ......................................................................................................... 290 7.5.15 NMI Interrupts and DMAC .................................................................................. 291 7.5.16 Forced Termination of DMAC Operation ............................................................ 292 7.5.17 Clearing Full Address Mode................................................................................. 293 Interrupts ........................................................................................................................... 294 Usage Notes....................................................................................................................... 295 Section 8 Data Transfer Controller ................................................................................. 301 8.1 8.2 8.3 Overview ........................................................................................................................... 301 8.1.1 Features ................................................................................................................ 301 8.1.2 Block Diagram ..................................................................................................... 302 8.1.3 Register Configuration ......................................................................................... 303 Register Descriptions......................................................................................................... 304 8.2.1 DTC Mode Register A (MRA)............................................................................. 304 8.2.2 DTC Mode Register B (MRB) ............................................................................. 305 8.2.3 DTC Source Address Register (SAR) .................................................................. 307 8.2.4 DTC Destination Address Register (DAR) .......................................................... 307 8.2.5 DTC Transfer Count Register A (CRA) ............................................................... 307 8.2.6 DTC Transfer Count Register B (CRB) ............................................................... 308 8.2.7 DTC Enable Registers (DTCER) ......................................................................... 308 8.2.8 DTC Vector Register (DTVECR) ........................................................................ 309 8.2.9 Module Stop Control Register (MSTPCR) .......................................................... 310 Operation........................................................................................................................... 310 8.3.1 Overview .............................................................................................................. 310 8.3.2 Activation Sources................................................................................................ 314 8.3.3 DTC Vector Table................................................................................................ 315 8.3.4 Location of Register Information in Address Space............................................. 318 8.3.5 Normal Mode ....................................................................................................... 319 8.3.6 Repeat Mode ........................................................................................................ 320 8.3.7 Block Transfer Mode ........................................................................................... 321 Rev. 4.0, 03/03 page xxx of xliv 8.4 8.5 8.3.8 Chain Transfer...................................................................................................... 323 8.3.9 Operation Timing ................................................................................................. 324 8.3.10 Number of DTC Execution States ........................................................................ 325 8.3.11 Procedures for Using DTC ................................................................................... 327 8.3.12 Examples of Use of the DTC................................................................................ 328 Interrupts ........................................................................................................................... 333 Usage Notes....................................................................................................................... 333 Section 9 I/O Ports ............................................................................................................... 335 9.1 9.2 9.3 9.4 9.5 9.6 9.7 9.8 9.9 Overview ........................................................................................................................... 335 Port 1 ................................................................................................................................. 340 9.2.1 Overview .............................................................................................................. 340 9.2.2 Register Configuration ......................................................................................... 341 9.2.3 Pin Functions........................................................................................................ 343 Port 2 ................................................................................................................................. 351 9.3.1 Overview .............................................................................................................. 351 9.3.2 Register Configuration ......................................................................................... 352 9.3.3 Pin Functions........................................................................................................ 354 Port 3 ................................................................................................................................. 362 9.4.1 Overview .............................................................................................................. 362 9.4.2 Register Configuration ......................................................................................... 362 9.4.3 Pin Functions........................................................................................................ 365 Port 4 ................................................................................................................................. 367 9.5.1 Overview .............................................................................................................. 367 9.5.2 Register Configuration ......................................................................................... 368 9.5.3 Pin Functions........................................................................................................ 368 Port 5 ................................................................................................................................. 369 9.6.1 Overview .............................................................................................................. 369 9.6.2 Register Configuration ......................................................................................... 370 9.6.3 Pin Functions........................................................................................................ 374 Port 6 ................................................................................................................................. 376 9.7.1 Overview .............................................................................................................. 376 9.7.2 Register Configuration ......................................................................................... 377 9.7.3 Pin Functions........................................................................................................ 380 Port A ................................................................................................................................ 382 9.8.1 Overview .............................................................................................................. 382 9.8.2 Register Configuration ......................................................................................... 383 9.8.3 Pin Functions........................................................................................................ 388 9.8.4 MOS Input Pull-Up Function ............................................................................... 391 Port B ................................................................................................................................ 392 9.9.1 Overview .............................................................................................................. 392 9.9.2 Register Configuration ......................................................................................... 393 9.9.3 Pin Functions........................................................................................................ 395 Rev. 4.0, 03/03 page xxxi of xliv 9.9.4 MOS Input Pull-Up Function ............................................................................... 397 9.10 Port C ................................................................................................................................ 398 9.10.1 Overview .............................................................................................................. 398 9.10.2 Register Configuration ......................................................................................... 399 9.10.3 Pin Functions........................................................................................................ 401 9.10.4 MOS Input Pull-Up Function ............................................................................... 403 9.11 Port D ................................................................................................................................ 404 9.11.1 Overview .............................................................................................................. 404 9.11.2 Register Configuration ......................................................................................... 405 9.11.3 Pin Functions........................................................................................................ 407 9.11.4 MOS Input Pull-Up Function ............................................................................... 408 9.12 Port E................................................................................................................................. 409 9.12.1 Overview .............................................................................................................. 409 9.12.2 Register Configuration ......................................................................................... 410 9.12.3 Pin Functions........................................................................................................ 412 9.12.4 MOS Input Pull-Up Function ............................................................................... 414 9.13 Port F................................................................................................................................. 415 9.13.1 Overview .............................................................................................................. 415 9.13.2 Register Configuration ......................................................................................... 416 9.13.3 Pin Functions........................................................................................................ 420 9.14 Port G ................................................................................................................................ 422 9.14.1 Overview .............................................................................................................. 422 9.14.2 Register Configuration ......................................................................................... 423 9.14.3 Pin Functions........................................................................................................ 426 Section 10 16-Bit Timer Pulse Unit (TPU) .................................................................. 429 10.1 Overview ........................................................................................................................... 429 10.1.1 Features ................................................................................................................ 429 10.1.2 Block Diagram ..................................................................................................... 433 10.1.3 Pin Configuration ................................................................................................. 434 10.1.4 Register Configuration ......................................................................................... 436 10.2 Register Descriptions......................................................................................................... 438 10.2.1 Timer Control Registers (TCR)............................................................................ 438 10.2.2 Timer Mode Registers (TMDR) ........................................................................... 443 10.2.3 Timer I/O Control Registers (TIOR) .................................................................... 445 10.2.4 Timer Interrupt Enable Registers (TIER) ............................................................. 458 10.2.5 Timer Status Registers (TSR)............................................................................... 460 10.2.6 Timer Counters (TCNT)....................................................................................... 464 10.2.7 Timer General Registers (TGR) ........................................................................... 464 10.2.8 Timer Start Register (TSTR) ................................................................................ 465 10.2.9 Timer Synchro Register (TSYR) .......................................................................... 465 10.2.10 Module Stop Control Register (MSTPCR) .......................................................... 466 10.3 Interface to Bus Master ..................................................................................................... 467 Rev. 4.0, 03/03 page xxxii of xliv 10.4 10.5 10.6 10.7 10.3.1 16-Bit Registers.................................................................................................... 467 10.3.2 8-Bit Registers...................................................................................................... 467 Operation........................................................................................................................... 469 10.4.1 Overview .............................................................................................................. 469 10.4.2 Basic Functions .................................................................................................... 470 10.4.3 Synchronous Operation ........................................................................................ 476 10.4.4 Buffer Operation................................................................................................... 478 10.4.5 Cascaded Operation.............................................................................................. 482 10.4.6 PWM Modes ........................................................................................................ 484 10.4.7 Phase Counting Mode........................................................................................... 489 Interrupts ........................................................................................................................... 496 10.5.1 Interrupt Sources and Priorities ............................................................................ 496 10.5.2 DTC/DMAC* Activation ..................................................................................... 498 10.5.3 A/D Converter Activation .................................................................................... 498 Operation Timing .............................................................................................................. 499 10.6.1 Input/Output Timing............................................................................................. 499 10.6.2 Interrupt Signal Timing ........................................................................................ 503 Usage Notes....................................................................................................................... 507 Section 11 Programmable Pulse Generator (PPG) ..................................................... 517 11.1 Overview ........................................................................................................................... 517 11.1.1 Features ................................................................................................................ 517 11.1.2 Block Diagram ..................................................................................................... 518 11.1.3 Pin Configuration ................................................................................................. 519 11.1.4 Registers ............................................................................................................... 520 11.2 Register Descriptions......................................................................................................... 521 11.2.1 Next Data Enable Registers H and L (NDERH, NDERL) ................................... 521 11.2.2 Output Data Registers H and L (PODRH, PODRL)............................................. 522 11.2.3 Next Data Registers H and L (NDRH, NDRL) .................................................... 523 11.2.4 Notes on NDR Access .......................................................................................... 523 11.2.5 PPG Output Control Register (PCR) .................................................................... 525 11.2.6 PPG Output Mode Register (PMR) ...................................................................... 527 11.2.7 Port 1 Data Direction Register (P1DDR) ............................................................. 529 11.2.8 Port 2 Data Direction Register (P2DDR) ............................................................. 530 11.2.9 Module Stop Control Register (MSTPCR) .......................................................... 530 11.3 Operation........................................................................................................................... 531 11.3.1 Overview .............................................................................................................. 531 11.3.2 Output Timing ...................................................................................................... 532 11.3.3 Normal Pulse Output ............................................................................................ 533 11.3.4 Non-Overlapping Pulse Output ............................................................................ 535 11.3.5 Inverted Pulse Output ........................................................................................... 538 11.3.6 Pulse Output Triggered by Input Capture............................................................. 539 11.4 Usage Notes....................................................................................................................... 540 Rev. 4.0, 03/03 page xxxiii of xliv 11.4.1 Operation of Pulse Output Pins ............................................................................ 540 11.4.2 Note on Non-Overlapping Output ........................................................................ 540 Section 12 8-Bit Timers ..................................................................................................... 543 12.1 Overview ........................................................................................................................... 543 12.1.1 Features ................................................................................................................ 543 12.1.2 Block Diagram ..................................................................................................... 544 12.1.3 Pin Configuration ................................................................................................. 545 12.1.4 Register Configuration ......................................................................................... 545 12.2 Register Descriptions......................................................................................................... 546 12.2.1 Timer Counters 0 and 1 (TCNT0, TCNT1).......................................................... 546 12.2.2 Time Constant Registers A0 and A1 (TCORA0, TCORA1) ................................ 546 12.2.3 Time Constant Registers B0 and B1 (TCORB0, TCORB1) ................................ 547 12.2.4 Time Control Registers 0 and 1 (TCR0, TCR1)................................................... 547 12.2.5 Timer Control/Status Registers 0 and 1 (TCSR0, TCSR1) .................................. 549 12.2.6 Module Stop Control Register (MSTPCR) .......................................................... 552 12.3 Operation........................................................................................................................... 553 12.3.1 TCNT Incrementation Timing.............................................................................. 553 12.3.2 Compare Match Timing........................................................................................ 554 12.3.3 Timing of TCNT External Reset .......................................................................... 556 12.3.4 Timing of Overflow Flag (OVF) Setting .............................................................. 556 12.3.5 Operation with Cascaded Connection................................................................... 557 12.4 Interrupts ........................................................................................................................... 558 12.4.1 Interrupt Sources and DTC Activation ................................................................. 558 12.4.2 A/D Converter Activation .................................................................................... 558 12.5 Sample Application ........................................................................................................... 559 12.6 Usage Notes....................................................................................................................... 560 12.6.1 Contention between TCNT Write and Clear ........................................................ 560 12.6.2 Contention between TCNT Write and Increment................................................. 561 12.6.3 Contention between TCOR Write and Compare Match ....................................... 562 12.6.4 Contention between Compare Matches A and B .................................................. 563 12.6.5 Switching of Internal Clocks and TCNT Operation ............................................. 563 12.6.6 Interrupts and Module Stop Mode........................................................................ 565 Section 13 Watchdog Timer ............................................................................................. 567 13.1 Overview ........................................................................................................................... 567 13.1.1 Features ................................................................................................................ 567 13.1.2 Block Diagram ..................................................................................................... 568 13.1.3 Pin Configuration ................................................................................................. 569 13.1.4 Register Configuration ......................................................................................... 569 13.2 Register Descriptions......................................................................................................... 570 13.2.1 Timer Counter (TCNT) ........................................................................................ 570 13.2.2 Timer Control/Status Register (TCSR) ................................................................ 570 Rev. 4.0, 03/03 page xxxiv of xliv 13.2.3 Reset Control/Status Register (RSTCSR)............................................................. 572 13.2.4 Notes on Register Access ..................................................................................... 573 13.3 Operation........................................................................................................................... 575 13.3.1 Operation in Watchdog Timer Mode.................................................................... 575 13.3.2 Operation in Interval Timer Mode........................................................................ 577 13.3.3 Timing of Overflow Flag (OVF) Setting .............................................................. 577 13.3.4 Timing of Watchdog Timer Overflow Flag (WOVF) Setting .............................. 578 13.4 Interrupts ........................................................................................................................... 578 13.5 Usage Notes....................................................................................................................... 578 13.5.1 Contention between Timer Counter (TCNT) Write and Increment...................... 578 13.5.2 Changing Value of CKS2 to CKS0 ...................................................................... 579 13.5.3 Switching between Watchdog Timer Mode and Interval Timer Mode................. 579 13.5.4 System Reset by WDTOVF Signal....................................................................... 580 13.5.5 Internal Reset in Watchdog Timer Mode ............................................................. 580 Section 14 Serial Communication Interface (SCI) ..................................................... 581 14.1 Overview ........................................................................................................................... 581 14.1.1 Features ................................................................................................................ 581 14.1.2 Block Diagram ..................................................................................................... 583 14.1.3 Pin Configuration ................................................................................................. 584 14.1.4 Register Configuration ......................................................................................... 585 14.2 Register Descriptions......................................................................................................... 586 14.2.1 Receive Shift Register (RSR) ............................................................................... 586 14.2.2 Receive Data Register (RDR)............................................................................... 586 14.2.3 Transmit Shift Register (TSR).............................................................................. 587 14.2.4 Transmit Data Register (TDR) ............................................................................. 587 14.2.5 Serial Mode Register (SMR) ................................................................................ 588 14.2.6 Serial Control Register (SCR) .............................................................................. 591 14.2.7 Serial Status Register (SSR) ................................................................................. 594 14.2.8 Bit Rate Register (BRR)....................................................................................... 598 14.2.9 Smart Card Mode Register (SCMR)..................................................................... 606 14.2.10 Module Stop Control Register (MSTPCR) .......................................................... 608 14.3 Operation........................................................................................................................... 609 14.3.1 Overview .............................................................................................................. 609 14.3.2 Operation in Asynchronous Mode........................................................................ 611 14.3.3 Multiprocessor Communication Function ............................................................ 622 14.3.4 Operation in Synchronous Mode .......................................................................... 630 14.4 SCI Interrupts .................................................................................................................... 639 14.5 Usage Notes....................................................................................................................... 641 Section 15 Smart Card Interface ...................................................................................... 649 15.1 Overview ........................................................................................................................... 649 15.1.1 Features ................................................................................................................ 649 Rev. 4.0, 03/03 page xxxv of xliv 15.1.2 Block Diagram ..................................................................................................... 650 15.1.3 Pin Configuration ................................................................................................. 651 15.1.4 Register Configuration ......................................................................................... 652 15.2 Register Descriptions......................................................................................................... 653 15.2.1 Smart Card Mode Register (SCMR)..................................................................... 653 15.2.2 Serial Status Register (SSR) ................................................................................. 654 15.2.3 Serial Mode Register (SMR) ................................................................................ 655 15.2.4 Serial Control Register (SCR) .............................................................................. 657 15.3 Operation........................................................................................................................... 658 15.3.1 Overview .............................................................................................................. 658 15.3.2 Pin Connections.................................................................................................... 658 15.3.3 Data Format.......................................................................................................... 660 15.3.4 Register Settings................................................................................................... 662 15.3.5 Clock .................................................................................................................... 664 15.3.6 Data Transfer Operations ..................................................................................... 666 15.3.7 Operation in GSM Mode...................................................................................... 673 15.3.8 Operation in Block Transfer Mode....................................................................... 674 15.4 Usage Notes....................................................................................................................... 675 Section 16 A/D Converter (8 Analog Input Channel Version) ............................... 679 16.1 Overview ........................................................................................................................... 679 16.1.1 Features ................................................................................................................ 679 16.1.2 Block Diagram ..................................................................................................... 680 16.1.3 Pin Configuration ................................................................................................. 681 16.1.4 Register Configuration ......................................................................................... 682 16.2 Register Descriptions......................................................................................................... 683 16.2.1 A/D Data Registers A to D (ADDRA to ADDRD) .............................................. 683 16.2.2 A/D Control/Status Register (ADCSR) ................................................................ 684 16.2.3 A/D Control Register (ADCR) ............................................................................. 686 16.2.4 Module Stop Control Register (MSTPCR) .......................................................... 687 16.3 Interface to Bus Master ..................................................................................................... 688 16.4 Operation........................................................................................................................... 689 16.4.1 Single Mode (SCAN = 0) ..................................................................................... 689 16.4.2 Scan Mode (SCAN = 1) ....................................................................................... 691 16.4.3 Input Sampling and A/D Conversion Time .......................................................... 693 16.4.4 External Trigger Input Timing ............................................................................. 694 16.5 Interrupts ........................................................................................................................... 695 16.6 Usage Notes....................................................................................................................... 696 Section 17 D/A Converter ................................................................................................. 701 17.1 Overview ........................................................................................................................... 701 17.1.1 Features ................................................................................................................ 701 17.1.2 Block Diagram ..................................................................................................... 702 Rev. 4.0, 03/03 page xxxvi of xliv 17.1.3 Pin Configuration ................................................................................................. 703 17.1.4 Register Configuration ......................................................................................... 703 17.2 Register Descriptions......................................................................................................... 704 17.2.1 D/A Data Registers 0, 1 (DADR0, DADR1)........................................................ 704 17.2.2 D/A Control Registers 01 (DACR01)................................................................... 704 17.2.3 Module Stop Control Register (MSTPCR) .......................................................... 705 17.3 Operation........................................................................................................................... 706 Section 18 RAM ................................................................................................................... 709 18.1 Overview ........................................................................................................................... 709 18.1.1 Block Diagram ..................................................................................................... 709 18.1.2 Register Configuration ......................................................................................... 710 18.2 Register Descriptions......................................................................................................... 710 18.2.1 System Control Register (SYSCR)....................................................................... 710 18.3 Operation........................................................................................................................... 711 18.4 Usage Note ........................................................................................................................ 711 Section 19 ROM ................................................................................................................... 713 19.1 Overview ........................................................................................................................... 713 19.1.1 Block Diagram ..................................................................................................... 713 19.1.2 Register Configuration ......................................................................................... 714 19.2 Register Descriptions......................................................................................................... 714 19.2.1 Mode Control Register (MDCR).......................................................................... 714 19.2.2 Bus Control Register L (BCRL) ........................................................................... 715 19.3 Operation........................................................................................................................... 715 19.4 Overview of Flash Memory (H8S/2329 F-ZTAT)............................................................. 718 19.4.1 Features ................................................................................................................ 718 19.4.2 Overview .............................................................................................................. 719 19.4.3 Flash Memory Operating Modes .......................................................................... 720 19.4.4 On-Board Programming Modes ........................................................................... 721 19.4.5 Flash Memory Emulation in RAM ....................................................................... 723 19.4.6 Differences between Boot Mode and User Program Mode .................................. 724 19.4.7 Block Configuration ............................................................................................. 725 19.4.8 Pin Configuration ................................................................................................. 726 19.4.9 Register Configuration ......................................................................................... 727 19.5 Register Descriptions......................................................................................................... 728 19.5.1 Flash Memory Control Register 1 (FLMCR1) ..................................................... 728 19.5.2 Flash Memory Control Register 2 (FLMCR2) ..................................................... 731 19.5.3 Erase Block Register 1 (EBR1)............................................................................ 732 19.5.4 Erase Block Registers 2 (EBR2) .......................................................................... 732 19.5.5 System Control Register 2 (SYSCR2).................................................................. 733 19.5.6 RAM Emulation Register (RAMER).................................................................... 734 19.6 On-Board Programming Modes ........................................................................................ 736 Rev. 4.0, 03/03 page xxxvii of xliv 19.7 19.8 19.9 19.10 19.11 19.12 19.13 19.14 19.6.1 Boot Mode............................................................................................................ 736 19.6.2 User Program Mode ............................................................................................. 741 Programming/Erasing Flash Memory................................................................................ 743 19.7.1 Program Mode...................................................................................................... 743 19.7.2 Program-Verify Mode .......................................................................................... 744 19.7.3 Erase Mode........................................................................................................... 746 19.7.4 Erase-Verify Mode ............................................................................................... 746 Flash Memory Protection .................................................................................................. 748 19.8.1 Hardware Protection............................................................................................. 748 19.8.2 Software Protection .............................................................................................. 748 19.8.3 Error Protection.................................................................................................... 749 Flash Memory Emulation in RAM .................................................................................... 751 19.9.1 Emulation in RAM ............................................................................................... 751 19.9.2 RAM Overlap ....................................................................................................... 752 Interrupt Handling when Programming/Erasing Flash Memory ........................................ 753 Flash Memory PROM Mode ............................................................................................. 754 19.11.1 PROM Mode Setting........................................................................................... 754 19.11.2 Socket Adapters and Memory Map ..................................................................... 754 19.11.3 PROM Mode Operation ...................................................................................... 756 19.11.4 Memory Read Mode............................................................................................ 757 19.11.5 Auto-Program Mode ........................................................................................... 760 19.11.6 Auto-Erase Mode ................................................................................................ 762 19.11.7 Status Read Mode ............................................................................................... 763 19.11.8 Status Polling ...................................................................................................... 764 19.11.9 PROM Mode Transition Time ............................................................................ 765 19.11.10Notes on Memory Programming ......................................................................... 765 Flash Memory Programming and Erasing Precautions...................................................... 766 Overview of Flash Memory (H8S/2328 F-ZTAT)............................................................. 768 19.13.1 Features ................................................................................................................ 768 19.13.2 Overview .............................................................................................................. 769 19.13.3 Flash Memory Operating Modes .......................................................................... 770 19.13.4 On-Board Programming Modes ........................................................................... 771 19.13.5 Flash Memory Emulation in RAM ....................................................................... 773 19.13.6 Differences between Boot Mode and User Program Mode .................................. 774 19.13.7 Block Configuration ............................................................................................. 775 19.13.8 Pin Configuration ................................................................................................. 776 19.13.9 Register Configuration ......................................................................................... 777 Register Descriptions......................................................................................................... 778 19.14.1 Flash Memory Control Register 1 (FLMCR1) ..................................................... 778 19.14.2 Flash Memory Control Register 2 (FLMCR2) ..................................................... 781 19.14.3 Erase Block Register 1 (EBR1)............................................................................ 782 19.14.4 Erase Block Registers 2 (EBR2) .......................................................................... 782 19.14.5 System Control Register 2 (SYSCR2).................................................................. 783 Rev. 4.0, 03/03 page xxxviii of xliv 19.14.6 RAM Emulation Register (RAMER).................................................................... 784 19.15 On-Board Programming Modes ........................................................................................ 785 19.15.1 Boot Mode............................................................................................................ 786 19.15.2 User Program Mode ............................................................................................. 790 19.16 Programming/Erasing Flash Memory................................................................................ 792 19.16.1 Program Mode...................................................................................................... 792 19.16.2 Program-Verify Mode .......................................................................................... 793 19.16.3 Erase Mode........................................................................................................... 795 19.16.4 Erase-Verify Mode ............................................................................................... 795 19.17 Flash Memory Protection .................................................................................................. 797 19.17.1 Hardware Protection............................................................................................. 797 19.17.2 Software Protection .............................................................................................. 797 19.17.3 Error Protection.................................................................................................... 798 19.18 Flash Memory Emulation in RAM .................................................................................... 800 19.18.1 Emulation in RAM ............................................................................................... 800 19.18.2 RAM Overlap ....................................................................................................... 801 19.19 Interrupt Handling when Programming/Erasing Flash Memory ........................................ 802 19.20 Flash Memory PROM Mode ............................................................................................. 803 19.20.1 PROM Mode Setting........................................................................................... 803 19.20.2 Socket Adapters and Memory Map ..................................................................... 804 19.20.3 PROM Mode Operation ...................................................................................... 806 19.20.4 Memory Read Mode............................................................................................ 807 19.20.5 Auto-Program Mode ........................................................................................... 810 19.20.6 Auto-Erase Mode ................................................................................................ 812 19.20.7 Status Read Mode ............................................................................................... 813 19.20.8 Status Polling ...................................................................................................... 814 19.20.9 PROM Mode Transition Time ............................................................................ 815 19.20.10Notes on Memory Programming ......................................................................... 815 19.21 Flash Memory Programming and Erasing Precautions...................................................... 816 19.22 Overview of Flash Memory (H8S/2326 F-ZTAT)............................................................. 821 19.22.1 Features ................................................................................................................ 821 19.22.2 Overview .............................................................................................................. 822 19.22.3 Flash Memory Operating Modes .......................................................................... 823 19.22.4 On-Board Programming Modes ........................................................................... 824 19.22.5 Flash Memory Emulation in RAM ....................................................................... 826 19.22.6 Differences between Boot Mode and User Program Mode .................................. 827 19.22.7 Block Configuration ............................................................................................. 828 19.22.8 Pin Configuration ................................................................................................. 829 19.22.9 Register Configuration ......................................................................................... 830 19.23 Register Descriptions......................................................................................................... 831 19.23.1 Flash Memory Control Register 1 (FLMCR1) ..................................................... 831 19.23.2 Flash Memory Control Register 2 (FLMCR2) ..................................................... 834 19.23.3 Erase Block Register 1 (EBR1)............................................................................ 837 Rev. 4.0, 03/03 page xxxix of xliv 19.24 19.25 19.26 19.27 19.28 19.29 19.30 19.31 19.23.4 Erase Block Registers 2 (EBR2) .......................................................................... 838 19.23.5 System Control Register 2 (SYSCR2).................................................................. 839 19.23.6 RAM Emulation Register (RAMER).................................................................... 839 On-Board Programming Modes ........................................................................................ 841 19.24.1 Boot Mode............................................................................................................ 841 19.24.2 User Program Mode ............................................................................................. 846 Programming/Erasing Flash Memory................................................................................ 848 19.25.1 Program Mode (n = 1 for addresses H'000000 to H'03FFFF and n = 2 for addresses H'040000 to H'07FFFF).................................................................. 848 19.25.2 Program-Verify Mode (n = 1 for addresses H'000000 to H'03FFFF and n = 2 for addresses H'040000 to H'07FFFF).................................................................. 849 19.25.3 Erase Mode (n = 1 for addresses H'000000 to H'03FFFF and n = 2 for addresses H'040000 to H'07FFFF).................................................................. 851 19.25.4 Erase-Verify Mode (n = 1 for addresses H'000000 to H'03FFFF and n = 2 for addresses H'040000 to H'07FFFF).................................................................. 851 Flash Memory Protection .................................................................................................. 853 19.26.1 Hardware Protection............................................................................................. 853 19.26.2 Software Protection .............................................................................................. 853 19.26.3 Error Protection.................................................................................................... 854 Flash Memory Emulation in RAM .................................................................................... 856 19.27.1 Emulation in RAM ............................................................................................... 856 19.27.2 RAM Overlap ....................................................................................................... 857 Interrupt Handling when Programming/Erasing Flash Memory ........................................ 858 Flash Memory PROM Mode ............................................................................................. 859 19.29.1 PROM Mode Setting........................................................................................... 859 19.29.2 Socket Adapters and Memory Map ..................................................................... 860 19.29.3 PROM Mode Operation ...................................................................................... 862 19.29.4 Memory Read Mode............................................................................................ 863 19.29.5 Auto-Program Mode ........................................................................................... 866 19.29.6 Auto-Erase Mode ................................................................................................ 868 19.29.7 Status Read Mode ............................................................................................... 869 19.29.8 Status Polling ...................................................................................................... 870 19.29.9 PROM Mode Transition Time ............................................................................ 871 19.29.10Notes on Memory Programming ......................................................................... 871 Flash Memory Programming and Erasing Precautions...................................................... 872 Overview of Flash Memory (H8S/2326C F-ZTAT) .......................................................... 877 19.31.1 Features ................................................................................................................ 877 19.31.2 Overview .............................................................................................................. 879 19.31.3 Operating Mode of Flash Memory ....................................................................... 880 19.31.4 Mode Comparison ................................................................................................ 881 19.31.5 Flash MAT Configuration .................................................................................... 882 19.31.6 Block Division...................................................................................................... 882 19.31.7 Programming/Erasing Interface............................................................................ 883 Rev. 4.0, 03/03 page xl of xliv 19.32 19.33 19.34 19.35 19.36 19.37 19.38 19.31.8 Pin Configuration ................................................................................................. 886 19.31.9 Register Configuration ......................................................................................... 886 Register Description of Flash Memory.............................................................................. 888 19.32.1 Programming/Erasing Interface Register.............................................................. 888 19.32.2 Programming/Erasing Interface Parameter........................................................... 894 19.32.3 System Control Register 2 (SYSCR2).................................................................. 906 19.32.4 RAM Emulation Register (RAMER).................................................................... 907 On-Board Programming Mode .......................................................................................... 909 19.33.1 Boot Mode............................................................................................................ 910 19.33.2 User Program Mode ............................................................................................. 913 19.33.3 User Boot Mode ................................................................................................... 924 Protection .......................................................................................................................... 927 19.34.1 Hardware Protection............................................................................................. 927 19.34.2 Software Protection .............................................................................................. 928 19.34.3 Error Protection.................................................................................................... 929 Flash Memory Emulation in RAM .................................................................................... 931 Switching between User MAT and User Boot MAT......................................................... 934 19.36.1 Usage Notes.......................................................................................................... 935 PROM Mode ..................................................................................................................... 936 19.37.1 Pin Arrangement of the Socket Adapter ............................................................... 936 19.37.2 PROM Mode Operation ....................................................................................... 939 19.37.3 Memory-Read Mode ............................................................................................ 940 19.37.4 Auto-Program Mode............................................................................................. 940 19.37.5 Auto-Erase Mode ................................................................................................. 941 19.37.6 Status-Read Mode ................................................................................................ 941 19.37.7 Status Polling........................................................................................................ 942 19.37.8 Time Taken in Transition to PROM Mode .......................................................... 942 19.37.9 Notes on Using PROM Mode............................................................................... 942 Further Information ........................................................................................................... 944 19.38.1 Serial Communication Interface Specification for Boot Mode............................. 944 19.38.2 AC Characteristics and Timing in PROM Mode.................................................. 970 19.38.3 Procedure Program and Storable Area for Programming Data............................. 976 Section 20 Clock Pulse Generator................................................................................... 983 20.1 Overview ........................................................................................................................... 983 20.1.1 Block Diagram ..................................................................................................... 983 20.1.2 Register Configuration ......................................................................................... 984 20.2 Register Descriptions......................................................................................................... 984 20.2.1 System Clock Control Register (SCKCR) ............................................................ 984 20.3 Oscillator ........................................................................................................................... 986 20.3.1 Connecting a Crystal Resonator ........................................................................... 986 20.3.2 External Clock Input............................................................................................. 988 20.4 Duty Adjustment Circuit.................................................................................................... 990 Rev. 4.0, 03/03 page xli of xliv 20.5 Medium-Speed Clock Divider ........................................................................................... 990 20.6 Bus Master Clock Selection Circuit................................................................................... 990 Section 21 Power-Down Modes ...................................................................................... 991 21.1 Overview ........................................................................................................................... 991 21.1.1 Register Configuration ......................................................................................... 992 21.2 Register Descriptions......................................................................................................... 993 21.2.1 Standby Control Register (SBYCR) ..................................................................... 993 21.2.2 System Clock Control Register (SCKCR) ............................................................ 995 21.2.3 Module Stop Control Register (MSTPCR) .......................................................... 997 21.3 Medium-Speed Mode ........................................................................................................ 998 21.4 Sleep Mode........................................................................................................................ 999 21.5 Module Stop Mode............................................................................................................ 999 21.5.1 Module Stop Mode............................................................................................... 999 21.5.2 Usage Notes..........................................................................................................1000 21.6 Software Standby Mode ....................................................................................................1001 21.6.1 Software Standby Mode .......................................................................................1001 21.6.2 Clearing Software Standby Mode.........................................................................1001 21.6.3 Setting Oscillation Stabilization Time after Clearing Software Standby Mode....1002 21.6.4 Software Standby Mode Application Example.....................................................1002 21.6.5 Usage Notes..........................................................................................................1003 21.7 Hardware Standby Mode ...................................................................................................1004 21.7.1 Hardware Standby Mode......................................................................................1004 21.7.2 Hardware Standby Mode Timing .........................................................................1004 21.8 Clock Output Disabling Function ...................................................................................1005 Section 22 Electrical Characteristics ..............................................................................1007 22.1 Electrical Characteristics of Mask ROM Version (H8S/2328, H8S/2327, H8S/2323) and ROMless Version (H8S/2324S, H8S/2322R, H8S/2321, H8S/2320).........................1007 22.1.1 Absolute Maximum Ratings .................................................................................1007 22.1.2 DC Characteristics................................................................................................1008 22.1.3 AC Characteristics................................................................................................1012 22.1.4 A/D Conversion Characteristics ...........................................................................1036 22.1.5 D/A Conversion Characteristics ...........................................................................1037 22.2 Electrical Characteristics of F-ZTAT (H8S/2329 F-ZTAT, H8S/2329B F-ZTAT, H8S/2329E F-ZTAT, H8S/2328 F-ZTAT, H8S/2328B F-ZTAT, H8S/2326 F-ZTAT) ...1038 22.2.1 Absolute Maximum Ratings .................................................................................1038 22.2.2 DC Characteristics................................................................................................1039 22.2.3 AC Characteristics................................................................................................1042 22.2.4 A/D Conversion Characteristics ...........................................................................1048 22.2.5 D/A Conversion Characteristics ...........................................................................1049 22.2.6 Flash Memory Characteristics ..............................................................................1050 22.3 Electrical Characteristics of the H8S/2326C F-ZTAT (In Planning).................................1052 Rev. 4.0, 03/03 page xlii of xliv 22.3.1 Absolute Maximum Ratings .................................................................................1052 22.3.2 DC Characteristics................................................................................................1053 22.3.3 AC Characteristics................................................................................................1056 22.3.4 A/D Conversion Characteristics ...........................................................................1062 22.3.5 D/A Conversion Characteristics ...........................................................................1063 22.3.6 Flash Memory Characteristics ..............................................................................1063 22.3.7 Usage Note (internal voltage step down for the H8S/2326C F-ZTAT)................1064 22.4 Usage Note ........................................................................................................................1064 Appendix A Instruction Set ...............................................................................................1065 A.1 A.2 A.3 A.4 A.5 A.6 Instruction List...................................................................................................................1065 Instruction Codes...............................................................................................................1089 Operation Code Map .........................................................................................................1104 Number of States Required for Instruction Execution.......................................................1108 Bus States during Instruction Execution............................................................................1122 Condition Code Modification............................................................................................1136 Appendix B Internal I/O Registers ..................................................................................1142 B.1 B.2 B.3 List of Registers (Address Order)......................................................................................1142 List of Registers (By Module) ...........................................................................................1152 Functions ...........................................................................................................................1163 Appendix C I/O Port Block Diagrams ...........................................................................1309 C.1 C.2 C.3 C.4 C.5 C.6 C.7 C.8 C.9 C.10 C.11 C.12 C.13 Port 1 .................................................................................................................................1309 Port 2 .................................................................................................................................1312 Port 3 .................................................................................................................................1316 Port 4 .................................................................................................................................1319 Port 5 .................................................................................................................................1320 Port 6 .................................................................................................................................1324 Port A ................................................................................................................................1330 Port B ................................................................................................................................1333 Port C ................................................................................................................................1334 Port D ................................................................................................................................1335 Port E.................................................................................................................................1336 Port F.................................................................................................................................1337 Port G ................................................................................................................................1345 Appendix D Pin States........................................................................................................1349 D.1 Port States in Each Mode ..................................................................................................1349 Appendix E Product Lineup..............................................................................................1356 Appendix F Package Dimensions....................................................................................1357 Rev. 4.0, 03/03 page xliii of xliv Rev. 4.0, 03/03 page xliv of xliv Section 1 Overview 1.1 Overview The H8S/2329 Series and H8S/2328 Series are series of microcomputers (MCUs: microcomputer units), built around the H8S/2000 CPU, employing Hitachi's proprietary architecture, and equipped with supporting functions on-chip. The H8S/2000 CPU has an internal 32-bit architecture, is provided with sixteen 16-bit general registers and a concise, optimized instruction set designed for high-speed operation, and can address a 16-Mbyte linear address space. The instruction set is upward-compatible with H8/300 and H8/300H CPU instructions at the object-code level, facilitating migration from the H8/300, H8/300L, or H8/300H Series. On-chip supporting functions required for system configuration include DMA controller (DMAC)*1 and data transfer controller (DTC) bus masters, ROM and RAM memory, a 16-bit timer-pulse unit (TPU), programmable pulse generator (PPG), 8-bit timer, watchdog timer (WDT), serial communication interface (SCI), A/D converter, D/A converter, and I/O ports. A high-functionality bus controller is also provided, enabling fast and easy connection of DRAM and other kinds of memory. Single-power-supply flash memory (F-ZTATTM*2) and mask ROM versions are available, providing a quick and flexible response to conditions from ramp-up through full-scale volume production, even for applications with frequently changing specifications. ROM is connected to the CPU via a 16-bit data bus, enabling both byte and word data to be accessed in one state. Instruction fetching is thus speeded up, and processing speed increased. The features of the H8S/2329 Series and H8S/2328 Series are shown in table 1-1. Notes: *1 The DMAC is not supported in the H8S/2321. *2 F-ZTAT is a trademark of Hitachi, Ltd. Rev. 4.0, 03/03, page 1 of 1358 Table 1-1 Overview Item Specification CPU * General-register machine Sixteen 16-bit general registers (also usable as sixteen 8-bit registers or eight 32-bit registers) * High-speed operation suitable for realtime control Maximum clock rate: 25 MHz High-speed arithmetic operations 8/16/32-bit register-register add/subtract: 40 ns (at 25 MHz operation) 16 x 16-bit register-register multiply: 800 ns (at 25 MHz operation) 32 / 16-bit register-register divide: 800 ns (at 25 MHz operation) * Instruction set suitable for high-speed operation Sixty-five basic instructions 8/16/32-bit move/arithmetic and logic instructions Unsigned/signed multiply and divide instructions Powerful bit-manipulation instructions * CPU operating mode Advanced mode: Bus controller 16-Mbyte address space * Address space divided into 8 areas, with bus specifications settable independently for each area * Chip select output possible for each area * Choice of 8-bit or 16-bit access space for each area * 2-state or 3-state access space can be designated for each area * Number of program wait states can be set for each area * Burst ROM directly connectable * Maximum 8-Mbyte DRAM* directly connectable (or use of interval timer possible) * External bus release function DMA controller* (DMAC) * Choice of short address mode or full address mode * 4 channels in short address mode * 2 channels in full address mode * Transfer possible in repeat mode, block transfer mode, etc. * Single address mode transfer possible * Can be activated by internal interrupt Data transfer controller (DTC) * Can be activated by internal interrupt or software * Multiple transfers or multiple types of transfer possible for one activation source * Transfer possible in repeat mode, block transfer mode, etc. * Request can be sent to CPU for interrupt that activated DTC Rev. 4.0, 03/03, page 2 of 1358 Item Specification 16-bit timer-pulse unit (TPU) * 6-channel 16-bit timer * Pulse I/O processing capability for up to 16 pins * Automatic 2-phase encoder count capability Programmable pulse generator (PPG) * Maximum 16-bit pulse output possible with TPU as time base * Output trigger selectable in 4-bit groups * Non-overlap margin can be set * Direct output or inverse output setting possible 8-bit timer, 2 channels * 8-bit up-counter (external event count capability) * Two time constant registers * Two-channel connection possible Watchdog timer (WDT) * Watchdog timer or interval timer selectable Serial communication interface (SCI), 3 channels * Asynchronous mode or synchronous mode selectable A/D converter * Resolution: 10 bits * Multiprocessor communication function * Smart card interface function * Input: 8 channel * High-speed conversion: 6.7 s minimum conversion time (at 20 MHz operation) * Single or scan mode selectable * Sample-and-hold circuit * A/D conversion can be activated by external trigger or timer trigger D/A converter * Resolution: 8 bits * Output: 2 channels I/O ports * 87 input/output pins, 8 input pins Rev. 4.0, 03/03, page 3 of 1358 Item Specification Memory * Flash memory, mask ROM * High-speed static RAM Product Code ROM RAM H8S/2329, H8S/2329B , H8S/2329E 3 H8S/2328, H8S/2328B* 384 kbytes 32 kbytes 256 kbytes 8 kbytes H8S/2327 128 kbytes 8 kbytes H8S/2326 512 kbytes 8 kbytes 4 H8S/2326C* 512 kbytes 16 kbytes H8S/2324S -- 32 kbytes H8S/2323 32 kbytes 8 kbytes H8S/2322R -- 8 kbytes H8S/2321 -- 4 kbytes H8S/2320 -- 4 kbytes *1 *2 Notes: *1 The H8S/2329B F-ZTAT is a low-cost version of the H8S/2329 F-ZTAT. Refer to the item of the H8S/2329 F-ZTAT. *2 The on-chip debug function can be used with the E10-A emulator (E10-A compatible version). However, some function modules and pin functions are unavailable when the on-chip debug function is in use. Refer to figures 1-7 and 1-8, Pin Arrangement. *3 The H8S/2328B F-ZTAT is a low-cost version of the H8S/2328 F-ZTAT. Refer to the item of the H8S/2328 F-ZTAT. *4 In planning Interrupt controller Power-down state * 39 external interrupt pins (NMI, IRQ0 to IRQ7) * 52 internal interrupt sources * Eight priority levels settable * Medium-speed mode * Sleep mode * Module stop mode * Software standby mode * Hardware standby mode * Variable clock division ratio Rev. 4.0, 03/03, page 4 of 1358 Item Specification Operating modes * Eight MCU operating modes (H8S/2328 F-ZTAT, H8S/2326 F-ZTAT) External Data Bus CPU Operating Mode Mode Description On-Chip Initial ROM Value Maximum Value 1 -- -- -- -- -- 2 3 4 5 Advanced On-chip ROM disabled expansion mode 6 On-chip ROM enabled expansion mode 7 Single-chip mode 8 -- -- Disabled 16 bits 16 bits 8 bits 16 bits 8 bits 16 bits -- -- -- -- -- Enabled 8 bits 16 bits -- -- -- -- Enabled 9 10 Advanced Boot mode 11 12 -- -- -- 13 14 15 Advanced User program mode Enabled 8 bits 16 bits -- -- Rev. 4.0, 03/03, page 5 of 1358 Item Specification Operating modes * Four MCU operating modes (ROMless, mask ROM versions, H8S/2329 F-ZTAT and H8S/2326C F-ZTAT) CPU Operating Mode Mode Description 1 1* 2 2* 2 3* 3 4* -- -- External Data Bus On-Chip Initial ROM Value Maximum Value -- -- -- Advanced On-chip ROM disabled Disabled 16 bits 16 bits expansion mode 3 5* On-chip ROM disabled Disabled 8 bits 16 bits expansion mode 6 On-chip ROM enabled Enabled 8 bits 16 bits expansion mode 7 Single-chip mode Enabled -- -- Notes: *1 User boot mode in the H8S/2326C F-ZTAT. See table 19-73 in section 19.33, On-Board Programming Modes, for information on H8S/2326C F-ZTAT user boot modes. *2 Boot mode in the H8S/2329 F-ZTAT, H8S/2326C F-ZTAT. See table 19-9 in section 19.6, On-Board Programming Modes, for information on H8S/2329 F-ZTAT user boot modes. See table 19-9 in section 19.6, On-Board Programming Modes, for information on H8S/2329 F-ZTAT user program modes. See table 19-73 in section 19.33, On-Board Programming Modes, for information on H8S/2326C F-ZTAT user program modes. See table 19-73 in section 19.33, On-Board Programming Modes, for information on H8S/2326C F-ZTAT user boot modes. *3 The ROMless versions can use only modes 4 and 5. Clock pulse generator * Built-in duty correction circuit Rev. 4.0, 03/03, page 6 of 1358 Item Specification Product lineup Condition A Condition B Operating power supply voltage 2.7 to 3.6 V 3.0 to 3.6 V Operating frequency 2 to 20 MHz 2 to 25 MHz Model HD64F2329 -- O 1 HD64F2329B* 2 HD64F2329E* -- O -- O HD6432328 O -- O HD64F2328 O 3 HD64F2328B* -- O HD6432327 O HD64F2326 O -- O 4 HD64F2326C* -- O HD6412324S O O HD6432323 O O HD6412322R O O HD6412321 O O HD6412320 O O O: Products in the current lineup Notes: *1 Low-cost version. For the specifications refer to the H8S/2329 FZTAT item. *2 The on-chip debug function can be used with the E10-A emulator (E10-A compatible version). However, some function modules and pin functions are unavailable when the on-chip debug function is in use. Refer to figures 1-7 and 1-8, Pin Arrangement. *3 This is a low-cost version. For specifications, refer to the items for the H8S/2328 F-ZTAT. *4 In planning Rev. 4.0, 03/03, page 7 of 1358 Item Specification Other features * Differences between H8S/2326 F-ZTAT and H8S/2326C F-ZTAT On-chip RAM H8S/2326 F-ZTAT: 8 kbytes (H'FFDC00 to H'FFFBFF) H8S/2326C F-ZTAT: 16 kbytes (H'FFBC00 to H'FFFBFF) On-chip flash memory The H8S/2326 F-ZTAT and H8S/2326C F-ZTAT both have 512 kbytes of on-chip flash memory. However, the method for controlling the flash memory is different for the two LSIs. When the on-chip flash memory is enabled, the registers (parameters) used to control it are different. For details, see the section about the H8S/2326 F-ZTAT and H8S/2326C F-ZTAT in section 19, ROM. Address map The address maps of the H8S/2326 F-ZTAT and H8S/2326C F-ZTAT differ in places. For details, see section 3.5, Memory Map in Each Operating Mode. Note: * Not supported in the H8S/2321. Rev. 4.0, 03/03, page 8 of 1358 Port C PC7 /A7 PC6 /A6 PC5 /A5 PC4 /A4 PC3 /A3 PC2 /A2 PC1 /A1 PC0 /A0 Port 3 P35 /SCK1 P34 /SCK0 P33 /RxD1 P32 /RxD0 P31 /TxD1 P30 /TxD0 Port 5 P53 / ADTRG/IRQ7/WAIT/BREQO P52 /SCK2/IRQ6 P51 /RxD2/IRQ5 P50 /TxD2/IRQ4 WDT Port G 8-bit timer SCI TPU D/A converter PPG A/D converter Port 1 Port 2 Port 4 P47 / AN7 / DA1 P46 / AN6 / DA0 P45 / AN5 P44 / AN4 P43 / AN3 P42 / AN2 P41 / AN1 P40 / AN0 Port 6 Vref AVCC AVSS P67 / CS7 / IRQ3 P66 / CS6 / IRQ2 P65 / IRQ1 P64 / IRQ0 P63 / TEND1 P62 / DREQ1 P61 / TEND0 / CS5 P60 / DREQ0 / CS4 Port B PB7 /A15 PB6 /A14 PB5 /A13 PB4 /A12 PB3 / A11 PB2 /A10 PB1 /A9 PB0 /A8 RAM P27 / PO7 / TIOCB5 / TMO1 P26 / PO6 / TIOCA5 / TMO0 P25 / PO5 / TIOCB4 / TMCI1 P24 / PO4 / TIOCA4 / TMRI1 P23 / PO3 / TIOCD3 / TMCI0 P22 / PO2 / TIOCC3 / TMRI0 P21 / PO1 / TIOCB3 P20 / PO0 / TIOCA3 PG4 / CS0 PG3 / CS1 PG2 / CS2 PG1 / CS3 PG0 / CAS DMAC ROM*2 Port F P17 / PO15 / TIOCB2 / TCLKD P16 / PO14 / TIOCA2 P15 / PO13 / TIOCB1 / TCLKC P14 / PO12 / TIOCA1 P13 / PO11 / TIOCD0 / TCLKB P12 / PO10 / TIOCC0 / TCLKA P11 / PO9 / TIOCB0 / DACK1 P10 / PO8 / TIOCA0 / DACK0 PF7 / PF6 / AS PF5 / RD PF4 / HWR PF3 / LWR PF2 / LCAS / WAIT / BREQO PF1 / BACK PF0 / BREQ DTC Peripheral data bus Interrupt controller Port A PA7 /A23 / IRQ7 PA6 /A22 / IRQ6 PA5 /A21 / IRQ5 PA4 /A20 / IRQ4 PA3 /A19 PA2 /A18 PA1 /A17 PA0 /A16 Peripheral address bus PE7 /D7 PE6 /D6 PE5 /D5 PE4 /D4 PE3 /D3 PE2 /D2 PE1 /D1 PE0 /D0 H8S/2000 CPU Bus controller NMI Port E Internal data bus STBY RES WDTOVF (FWE, EMLE, VCL)*1 Port D Internal address bus Clock pulse generator MD2 MD1 MD0 EXTAL XTAL PD7 / D15 PD6 / D14 PD5 / D13 PD4 / D12 PD3 / D11 PD2 / D10 PD1 / D9 PD0 / D8 Block Diagram VCC VCC VCC VCC VCC VSS VSS VSS VSS VSS VSS VSS VSS 1.2 Notes: *1 The FWE pin applies to the H8S/2328 F-ZTAT and H8S/2326 F-ZTAT only. The EMLE pin applies to the H8S/2329 F-ZTAT only. The VCL pin applies to the H8S/2326C F-ZTAT only. The WDTOVF pin function is not available in the F-ZTAT versions. *2 ROM is not supported in the ROMless versions. Figure 1-1 Mask ROM Versions, F-ZTAT Versions, H8S/2324S, H8S/2322R, H8S/2320 Internal Block Diagram Rev. 4.0, 03/03, page 9 of 1358 Port C PC7 /A7 PC6 /A6 PC5 /A5 PC4 /A4 PC3 /A3 PC2 /A2 PC1 /A1 PC0 /A0 Port 3 P35 /SCK1 P34 /SCK0 P33 /RxD1 P32 /RxD0 P31 /TxD1 P30 /TxD0 Port 5 P53 / ADTRG/IRQ7/WAIT/BREQO P52 /SCK2/IRQ6 P51 /RxD2/IRQ5 P50 /TxD2/IRQ4 Peripheral address bus Port B PB7 /A15 PB6 /A14 PB5 /A13 PB4 /A12 PB3 / A11 PB2 /A10 PB1 /A9 PB0 /A8 WDT Port G 8-bit timer SCI TPU D/A converter PPG A/D converter Port 1 Port 2 Port 4 P47 / AN7 / DA1 P46 / AN6 / DA0 P45 / AN5 P44 / AN4 P43 / AN3 P42 / AN2 P41 / AN1 P40 / AN0 Port 6 Vref AVCC AVSS P67 / CS7 / IRQ3 P66 / CS6 / IRQ2 P65 / IRQ1 P64 / IRQ0 P63 P62 P61 / CS5 P60 / CS4 Port A PA7 /A23 / IRQ7 PA6 /A22 / IRQ6 PA5 /A21 / IRQ5 PA4 /A20 / IRQ4 PA3 /A19 PA2 /A18 PA1 /A17 PA0 /A16 RAM P27 / PO7 / TIOCB5 / TMO1 P26 / PO6 / TIOCA5 / TMO0 P25 / PO5 / TIOCB4 / TMCI1 P24 / PO4 / TIOCA4 / TMRI1 P23 / PO3 / TIOCD3 / TMCI0 P22 / PO2 / TIOCC3 / TMRI0 P21 / PO1 / TIOCB3 P20 / PO0 / TIOCA3 PG4 / CS0 PG3 / CS1 PG2 / CS2 PG1 / CS3 PG0 Port F P17 / PO15 / TIOCB2 / TCLKD P16 / PO14 / TIOCA2 P15 / PO13 / TIOCB1 / TCLKC P14 / PO12 / TIOCA1 P13 / PO11 / TIOCD0 / TCLKB P12 / PO10 / TIOCC0 / TCLKA P11 / PO9 / TIOCB0 P10 / PO8 / TIOCA0 PF7 / f PF6 / AS PF5 / RD PF4 / HWR PF3 / LWR PF2 / WAIT / BREQO PF1 / BACK PF0 / BREQ DTC Peripheral data bus Interrupt controller Bus controller PE7 / D7 PE6 / D6 PE5 / D5 PE4 / D4 PE3 / D3 PE2 / D2 PE1 / D1 PE0 / D0 H8S/2000 CPU Internal data bus NMI Port E Internal address bus Clock pulse generator STBY RES WDTOVF PD7 / D15 PD6 / D14 PD5 / D13 PD4 / D12 PD3 / D11 PD2 / D10 PD1 / D9 PD0 / D8 VCC VCC VCC VCC VCC VSS VSS VSS VSS VSS VSS VSS VSS MD2 MD1 MD0 EXTAL XTAL Port D Figure 1-2 H8S/2321 Internal Block Diagram Rev. 4.0, 03/03, page 10 of 1358 STBY 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 P60 / DREQ0 / CS4 VSS P35 /SCK1 P34 /SCK0 P33 /RxD1 P32 /RxD0 P31 /TxD1 P30 /TxD0 VCC PD7 /D15 PD6 /D14 PD5 /D13 PD4 /D12 VSS PD3 /D11 PD2 /D10 PD1 /D9 PD0 /D8 PE7 /D7 PE6 /D6 PE5 /D5 PE4 /D4 VSS PE3 /D3 PE2 /D2 PE1 /D1 PE0 /D0 VCC P64 / IRQ0 P65 / IRQ1 VCC PC0 / A0 PC1 / A1 PC2 / A2 PC3 / A3 VSS PC4 / A4 PC5 / A5 PC6 / A6 PC7 / A7 PB0 / A8 PB1 / A9 PB2 / A10 PB3 / A11 VSS PB4 / A12 PB5 / A13 PB6 / A14 PB7 / A15 PA0 / A16 PA1 /A17 PA2 / A18 PA3 / A19 VSS PA4 / A20 / IRQ4 PA5 / A21 / IRQ5 PA6 / A22 / IRQ6 PA7 / A23 / IRQ7 P67 / CS7/ IRQ3 P66 / CS6/ IRQ2 P52 /SCK2 / IRQ6 P53 /ADTRG/IRQ7/WAIT/BREQO AVCC Vref P40 /AN0 P41 /AN1 P42 /AN2 P43 /AN3 P44 /AN4 P45 /AN5 P46 /DA0 /AN6 P47 /DA1 /AN7 AVSS VSS P17 /PO15 /TIOCB2 /TCLKD P16 /PO14 /TIOCA2 P15 /PO13 /TIOCB1 /TCLKC P14 /PO12 /TIOCA1 P13 /PO11 /TIOCD0 /TCLKB P12 /PO10 /TIOCC0 /TCLKA P11 /PO9 /TIOCB0 / DACK1 P10 /PO8 /TIOCA0 / DACK0 MD0 MD1 MD2 PG0 / CAS PG1 / CS3 PG2 / CS2 PG3 / CS1 PG4 / CS0 P20 / PO0 / TIOCA3 P21 / PO1 / TIOCB3 P22 / PO2 / TIOCC3 / TMRI0 P23 / PO3 / TIOCD3 / TMCI0 P24 / PO4 / TIOCA4 / TMRI1 P25 / PO5 / TIOCB4 / TMCI1 P26 / PO6 / TIOCA5 / TMO0 P27 / PO7 / TIOCB5 / TMO1 P63 / TEND1 P62 / DREQ1 P61 / TEND0 / CS5 Pin Arrangement RES WDTOVF (FWE, EMLE, VCL)* 1.3.1 NMI Pin Description P51 / RxD2/IRQ5 P50 / TxD2/IRQ4 PF0 / BREQ PF1 / BACK PF2 / LCAS/WAIT / BREQO PF3 / LWR PF4 / HWR PF5 / RD PF6 / AS VCC PF7 / f VSS EXTAL XTAL VCC 1.3 Note: * The FWE pin applies to the H8S/2328 F-ZTAT and H8S/2326 F-ZTAT only. The EMLE pin applies to the H8S/2329 F-ZTAT only. The VCL pin applies to the H8S/2326C F-ZTAT only. The WDTOVF pin function is not available in the F-ZTAT versions. Figure 1-3 Mask ROM Versions, F-ZTAT Versions, H8S/2324S, H8S/2322R, H8S/2320 Pin Arrangement (TFP-120: Top View) Rev. 4.0, 03/03, page 11 of 1358 P20 /PO0 /TIOCA3 P21 /PO1 /TIOCB3 P22 /PO2 /TIOCC3 /TMRI0 P23 /PO3 /TIOCD3 /TMCI0 P24 /PO4 /TIOCA4 /TMRI1 P25 /PO5 /TIOCB4 /TMCI1 P26 /PO6 /TIOCA5 /TMO0 P27 /PO7 /TIOCB5 /TMO1 P63 / TEND1 P62 / DREQ1 P61 / TEND0 / CS5 VSS VSS P60 / DREQ0 / CS4 VSS RES WDTOVF (FWE, EMLE, VCL)* NMI STBY P53 / ADTRG/IRQ7/WAIT/BREQO P52 /SCK2 /IRQ6 VSS VSS P51 /RxD2/IRQ5 P50 /TxD2/IRQ4 PF0 / BREQ PF1 / BACK PF2 / LCAS/WAIT / BREQO PF3 / LWR PF4 / HWR PF5 / RD PF6 / AS VCC PF7 /f VSS EXTAL XTAL VCC 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 P35 / SCK1 P34 / SCK0 P33 / RxD1 P32 / RxD0 P31 / TxD1 P30 / TxD0 VCC PD7 / D15 PD6 / D14 PD5 / D13 PD4 / D12 VSS PD3 / D11 PD2 / D10 PD1 / D9 PD0 / D8 PE7 / D7 PE6 / D6 PE5 / D5 PE4 / D4 VSS PE3 / D3 PE2 / D2 PE1 / D1 PE0 / D0 VCC PG3 / CS1 PG4 / CS0 VSS VSSNC VCC PC0 /A0 PC1 /A1 PC2 /A2 PC3 /A3 VSS PC4 /A4 PC5 /A5 PC6 /A6 PC7 /A7 PB0 /A8 PB1 /A9 PB2 /A10 PB3 /A11 VSS PB4 /A12 PB5 /A13 PB6 /A14 PB7 /A15 PA0 /A16 PA1 /A17 PA2 /A18 PA3 /A19 VSS PA4 /A20 / IRQ4 PA5 /A21 / IRQ5 PA6 /A22 / IRQ6 PA7 /A23 / IRQ7 P67 / CS7/ IRQ3 P66 / CS6/ IRQ2 VSS VSS P65 / IRQ1 P64 / IRQ0 AVCC Vref P40 / AN0 P41 / AN1 P42 / AN2 P43 / AN3 P44 / AN4 P45 / AN5 P46 / AN6 / DA0 P47 / AN7 / DA1 AVSS VSS P17 / PO15 / TIOCB2 / TCLKD P16 / PO14 / TIOCA2 P15 / PO13 / TIOCB1 / TCLKC P14 / PO12 / TIOCA1 P13 / PO11 / TIOCD0 / TCLKB P12 / PO10 / TIOCC0 / TCLKA P11 / PO9 / TIOCB0 / DACK1 P10 / PO8 / TIOCA0 / DACK0 MD0 MD1 MD2 PG0 / CAS PG1 / CS3 PG2 / CS2 Note: * The FWE pin applies to the H8S/2328 F-ZTAT and H8S/2326 F-ZTAT only. The EMLE pin applies to the H8S/2329 F-ZTAT only. The VCL pin applies to the H8S/2326C F-ZTAT only. The WDTOVF pin function is not available in the F-ZTAT versions. Figure 1-4 Mask ROM Versions, F-ZTAT Versions, H8S/2324S, H8S/2322R, H8S/2320 Pin Arrangement (FP-128B: Top View) Rev. 4.0, 03/03, page 12 of 1358 P20 / PO0 / TIOCA3 P21 / PO1 / TIOCB3 P22 / PO2 / TIOCC3 / TMRI0 P23 / PO3 / TIOCD3 / TMCI0 P24 / PO4 / TIOCA4 / TMRI1 P25 / PO5 / TIOCB4 / TMCI1 P26 / PO6 / TIOCA5 / TMO0 P27 / PO7 / TIOCB5 / TMO1 P63 P62 P61 / CS5 RES WDTOVF NMI STBY P51 / RxD2/IRQ5 P50 / TxD2/IRQ4 PF0 / BREQ PF1 / BACK PF2 / WAIT / BREQO PF3 / LWR PF4 / HWR PF5 / RD PF6 / AS VCC PF7 / f VSS EXTAL XTAL VCC 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 P60 / CS4 VSS P35 /SCK1 P34 /SCK0 P33 /RxD1 P32 /RxD0 P31 /TxD1 P30 /TxD0 VCC PD7 /D15 PD6 /D14 PD5 /D13 PD4 /D12 VSS PD3 /D11 PD2 /D10 PD1 /D9 PD0 /D8 PE7 /D7 PE6 /D6 PE5 /D5 PE4 /D4 VSS PE3 /D3 PE2 /D2 PE1 /D1 PE0 /D0 VCC P64 / IRQ0 P65 / IRQ1 VCC PC0 / A0 PC1 / A1 PC2 / A2 PC3 / A3 VSS PC4 / A4 PC5 / A5 PC6 / A6 PC7 / A7 PB0 / A8 PB1 / A9 PB2 / A10 PB3 / A11 VSS PB4 / A12 PB5 / A13 PB6 / A14 PB7 / A15 PA0 / A16 PA1 /A17 PA2 / A18 PA3 / A19 VSS PA4 / A20 / IRQ4 PA5 / A21 / IRQ5 PA6 / A22 / IRQ6 PA7 / A23 / IRQ7 P67 / CS7/ IRQ3 P66 / CS6/ IRQ2 P52 /SCK2 / IRQ6 P53 /ADTRG/IRQ7/WAIT/BREQO AVCC Vref P40 /AN0 P41 /AN1 P42 /AN2 P43 /AN3 P44 /AN4 P45 /AN5 P46 /DA0 /AN6 P47 /DA1 /AN7 AVSS VSS P17 /PO15 /TIOCB2 /TCLKD P16 /PO14 /TIOCA2 P15 /PO13 /TIOCB1 /TCLKC P14 /PO12 /TIOCA1 P13 /PO11 /TIOCD0 /TCLKB P12 /PO10 /TIOCC0 /TCLKA P11 /PO9 /TIOCB0 P10 /PO8 /TIOCA0 MD0 MD1 MD2 PG0 PG1 / CS3 PG2 / CS2 PG3 / CS1 PG4 / CS0 Figure 1-5 H8S/2321 Pin Arrangement (TFP-120: Top View) Rev. 4.0, 03/03, page 13 of 1358 PG3 / CS1 PG4 / CS0 VSS VSSNC VCC PC0 /A0 PC1 /A1 PC2 /A2 PC3 /A3 VSS PC4 /A4 PC5 /A5 PC6 /A6 PC7 /A7 PB0 /A8 PB1 /A9 PB2 /A10 PB3 /A11 VSS PB4 /A12 PB5 /A13 PB6 /A14 PB7 /A15 PA0 /A16 PA1 /A17 PA2 /A18 PA3 /A19 VSS PA4 /A20 / IRQ4 PA5 /A21 / IRQ5 PA6 /A22 / IRQ6 PA7 /A23 / IRQ7 P67 / CS7/ IRQ3 P66 / CS6/ IRQ2 VSS VSS P65 / IRQ1 P64 / IRQ0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 AVCC Vref P40 / AN0 P41 / AN1 P42 / AN2 P43 / AN3 P44 / AN4 P45 / AN5 P46 / AN6 / DA0 P47 / AN7 / DA1 AVSS VSS P17 / PO15 / TIOCB2 / TCLKD P16 / PO14 / TIOCA2 P15 / PO13 / TIOCB1 / TCLKC P14 / PO12 / TIOCA1 P13 / PO11 / TIOCD0 / TCLKB P12 / PO10 / TIOCC0 / TCLKA P11 / PO9 / TIOCB0 P10 / PO8 / TIOCA0 MD0 MD1 MD2 PG0 PG1 / CS3 PG2 / CS2 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 Figure 1-6 H8S/2321 Pin Arrangement (FP-128B: Top View) Rev. 4.0, 03/03, page 14 of 1358 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 P35 / SCK1 P34 / SCK0 P33 / RxD1 P32 / RxD0 P31 / TxD1 P30 / TxD0 VCC PD7 / D15 PD6 / D14 PD5 / D13 PD4 / D12 VSS PD3 / D11 PD2 / D10 PD1 / D9 PD0 / D8 PE7 / D7 PE6 / D6 PE5 / D5 PE4 / D4 VSS PE3 / D3 PE2 / D2 PE1 / D1 PE0 / D0 VCC P20 /PO0 /TIOCA3 P21 /PO1 /TIOCB3 P22 /PO2 /TIOCC3 /TMRI0 P23 /PO3 /TIOCD3 /TMCI0 P24 /PO4 /TIOCA4 /TMRI1 P25 /PO5 /TIOCB4 /TMCI1 P26 /PO6 /TIOCA5 /TMO0 P27 /PO7 /TIOCB5 /TMO1 P63 P62 P61 / CS5 VSS VSS P60 / CS4 VSS RES WDTOVF NMI STBY P53 / ADTRG/IRQ7/WAIT/BREQO P52 /SCK2 /IRQ6 VSS VSS P51 /RxD2/IRQ5 P50 /TxD2/IRQ4 PF0 / BREQ PF1 / BACK PF2 / WAIT / BREQO PF3 / LWR PF4 / HWR PF5 / RD PF6 / AS VCC PF7 /f VSS EXTAL XTAL VCC RES NMI EMLE* P20 / PO0 / TIOCA3 P21 / PO1 / TIOCB3 P22 / PO2 / TIOCC3 / TMRI0 P23 / PO3 / TIOCD3 / TMCI0 P24 / PO4 / TIOCA4 / TMRI1 P25 / PO5 / TIOCB4 / TMCI1 P26 / PO6 / TIOCA5 / TMO0 P27 / PO7 / TIOCB5 / TMO1 P63 / TEND1/ T D O * P62 / DREQ1/ T D I * P61 / TEND0 / CS5/ T C K * 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 P60 / DREQ0 / CS4/ T M S * VSS P35 /SCK1 P34 /SCK0/ TRST* P33 /RxD1 P32 /RxD0 P31 /TxD1 P30 /TxD0 VCC PD7 /D15 PD6 /D14 PD5 /D13 PD4 /D12 VSS PD3 /D11 PD2 /D10 PD1 /D9 PD0 /D8 PE7 /D7 PE6 /D6 PE5 /D5 PE4 /D4 VSS PE3 /D3 PE2 /D2 PE1 /D1 PE0 /D0 VCC P64 / IRQ0 P65 / IRQ1 VCC PC0 / A0 PC1 / A1 PC2 / A2 PC3 / A3 VSS PC4 / A4 PC5 / A5 PC6 / A6 PC7 / A7 PB0 / A8 PB1 / A9 PB2 / A10 PB3 / A11 VSS PB4 / A12 PB5 / A13 PB6 / A14 PB7 / A15 PA0 / A16 PA1 /A17 PA2 / A18 PA3 / A19 VSS PA4 / A20 / IRQ4 PA5 / A21 / IRQ5 PA6 / A22 / IRQ6 PA7 / A23 / IRQ7 P67 / CS7/ IRQ3 P66 / CS6/ IRQ2 P52 /SCK2 / IRQ6 P53 /ADTRG/IRQ7/WAIT/BREQO AVCC Vref P40 /AN0 P41 /AN1 P42 /AN2 P43 /AN3 P44 /AN4 P45 /AN5 P46 /DA0 /AN6 P47 /DA1 /AN7 AVSS VSS P17 /PO15 /TIOCB2 /TCLKD P16 /PO14 /TIOCA2 P15 /PO13 /TIOCB1 /TCLKC P14 /PO12 /TIOCA1 P13 /PO11 /TIOCD0 /TCLKB P12 /PO10 /TIOCC0 /TCLKA P11 /PO9 /TIOCB0 / DACK1 P10 /PO8 /TIOCA0 / DACK0 MD0 MD1 MD2 PG0 / CAS PG1 / CS3 PG2 / CS2 PG3 / CS1 PG4 / CS0 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 STBY P51 / RxD2/IRQ5 P50 / TxD2/IRQ4 PF0 / BREQ PF1 / BACK PF2 / LCAS/WAIT / BREQO PF3 / LWR PF4 / HWR PF5 / RD PF6 / AS VCC PF7 / f VSS EXTAL XTAL VCC E10-A compatible version Note: * If an E10-A emulator is used, the TDO, TDI, TDK, TMS, and TRST pins are used exclusively for the H-UDI and the functions and function modules associated with these pins are not available. SCI channel 0 is not available. Also, the watchdog timer continues to operate during break states and, if the settings specify that an internal reset is to be performed, a reset is generated if an overflow occurs. Refer to the E10-A Emulator User's Manual for E10-A emulator connection examples. Figure 1-7 HD64F2329E Pin Arrangement (TFP-120: Top View) Rev. 4.0, 03/03, page 15 of 1358 EMLE* P20 / PO0 / TIOCA3 P21 / PO1 / TIOCB3 P22 / PO2 / TIOCC3 / TMRI0 P23 / PO3 / TIOCD3 / TMCI0 P24 / PO4 / TIOCA4 / TMRI1 P25 / PO5 / TIOCB4 / TMCI1 P26 / PO6 / TIOCA5 / TMO0 P27 / PO7 / TIOCB5 / TMO1 P63 / TEND1/TDO * P62 / DREQ1/TDI * P61 / TEND0 / CS5/TCK * VSS VSS P60 / DREQ0 / CS4/TMS * VSS NMI RES 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 P35 /SCK1 P34 /SCK0/ TRST* P33 /RxD1 P32 /RxD0 P31 /TxD1 P30 /TxD0 VCC PD7 /D15 PD6 /D14 PD5 /D13 PD4 /D12 VSS PD3 /D11 PD2 /D10 PD1 /D9 PD0 /D8 PE7 /D7 PE6 /D6 PE5 /D5 PE4 /D4 VSS PE3 /D3 PE2 /D2 PE1 /D1 PE0 /D0 VCC PG3 / CS1 PG4 / CS0 VSS NC VCC PC0 / A0 PC1 / A1 PC2 / A2 PC3 / A3 VSS PC4 / A4 PC5 / A5 PC6 / A6 PC7 / A7 PB0 / A8 PB1 / A9 PB2 / A10 PB3 / A11 VSS PB4 / A12 PB5 / A13 PB6 / A14 PB7 / A15 PA0 / A16 PA1 / A17 PA2 / A18 PA3 / A19 VSS PA4 / A20 / IRQ4 PA5 / A21 / IRQ5 PA6 / A22 / IRQ6 PA7 / A23 / IRQ7 P67 / CS7/ IRQ3 P66 / CS6/ IRQ2 VSS VSS P65 / IRQ1 P64 / IRQ0 AVCC Vref P40 /AN0 P41 /AN1 P42 /AN2 P43 /AN3 P44 /AN4 P45 /AN5 P46 /AN6 /DA0 P47 /AN7 /DA1 AVSS VSS P17 /PO15 /TIOCB2 /TCLKD P16 /PO14 /TIOCA2 P15 /PO13 /TIOCB1 /TCLKC P14 /PO12 /TIOCA1 P13 /PO11 /TIOCD0 /TCLKB P12 /PO10 /TIOCC0 /TCLKA P11 /PO9 /TIOCB0 / DACK1 P10 /PO8 /TIOCA0 / DACK0 MD0 MD1 MD2 PG0 / CAS PG1 / CS3 PG2 / CS2 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 STBY P53 / ADTRG/IRQ7/WAIT/BREQO P52 / SCK2 /IRQ6 VSS VSS P51 / RxD2/IRQ5 P50 / TxD2/IRQ4 PF0 / BREQ PF1 / BACK PF2 / LCAS/WAIT / BREQO PF3 / LWR PF4 / HWR PF5 / RD PF6 / AS VCC PF7 /f VSS EXTAL XTAL VCC E10-A compatible version Note: * If an E10-A emulator is used, the TDO, TDI, TDK, TMS, and TRST pins are used exclusively for the H-UDI and the functions and function modules associated with these pins are not available. SCI channel 0 is not available. Also, the watchdog timer continues to operate during break states and, if the settings specify that an internal reset is to be performed, a reset is generated if an overflow occurs. Refer to the E10-A Emulator User's Manual for E10-A emulator connection examples. Figure 1-8 HD64F2329E Pin Arrangement (FP-128B: Top View) Rev. 4.0, 03/03, page 16 of 1358 1.3.2 Pin Functions in Each Operating Mode Table 1-2 Pin Functions in Each Operating Mode Pin No. Pin Name TFP-120 FP-128B Mode 4* Mode 5* Mode 6 Mode 7 Flash Memory Programmer Mode 1 5 VCC VCC VCC VCC VCC 2 6 A0 A0 PC0/A0 PC0 A0 3 7 A1 A1 PC1/A1 PC1 A1 4 8 A2 A2 PC2/A2 PC2 A2 5 9 A3 A3 PC3/A3 PC3 A3 6 10 VSS VSS VSS VSS VSS 7 11 A4 A4 PC4/A4 PC4 A4 8 12 A5 A5 PC5/A5 PC5 A5 9 13 A6 A6 PC6/A6 PC6 A6 10 14 A7 A7 PC7/A7 PC7 A7 11 15 A8 A8 PB0/A8 PB0 A8 12 16 A9 A9 PB1/A9 PB1 A9 13 17 A10 A10 PB2/A10 PB2 A10 14 18 A11 A11 PB3/A11 PB3 A11 15 19 VSS VSS VSS VSS VSS 16 20 A12 A12 PB4/A12 PB4 A12 17 21 A13 A13 PB5/A13 PB5 A13 18 22 A14 A14 PB6/A14 PB6 A14 19 23 A15 A15 PB7/A15 PB7 A15 20 24 A16 A16 PA0/A16 PA0 A16 21 25 A17 A17 PA1/A17 PA1 A17 22 26 A18 A18 PA2/A18 PA2 A18 23 27 A19 A19 PA3/A19 PA3 NC 24 28 VSS VSS VSS VSS VSS 25 29 A20 A20 PA4/A20/IRQ4 PA4/IRQ4 NC 26 30 PA5/A21/IRQ5 PA5/A21/IRQ5 PA5/A21/IRQ5 PA5/IRQ5 NC 27 31 PA6/A22/IRQ6 PA6/A22/IRQ6 PA6/A22/IRQ6 PA6/IRQ6 NC 1 1 Rev. 4.0, 03/03, page 17 of 1358 Pin No. Pin Name TFP-120 FP-128B Mode 4* Mode 5* Mode 6 Mode 7 Flash Memory Programmer Mode 28 32 PA7/A23/IRQ7 PA7/A23/IRQ7 PA7/A23/IRQ7 PA7/IRQ7 NC 29 33 P67/IRQ3/CS7 P67/IRQ3/CS7 P67/IRQ3/CS7 P67/IRQ3 NC 30 34 P66/IRQ2/CS6 P66/IRQ2/CS6 P66/IRQ2/CS6 P66/IRQ2 VCC -- 35 VSS VSS VSS VSS VSS -- 36 VSS VSS VSS VSS VSS 31 37 P65/IRQ1 P65/IRQ1 P65/IRQ1 P65/IRQ1 VSS 32 38 P64/IRQ0 P64/IRQ0 P64/IRQ0 P64/IRQ0 VSS 33 39 VCC VCC VCC VCC VCC 34 40 PE0/D0 PE0/D0 PE0/D0 PE0 NC 35 41 PE1/D1 PE1/D1 PE1/D1 PE1 NC 36 42 PE2/D2 PE2/D2 PE2/D2 PE2 NC 37 43 PE3/D3 PE3/D3 PE3/D3 PE3 NC 38 44 VSS VSS VSS VSS VSS 39 45 PE4/D4 PE4/D4 PE4/D4 PE4 NC 40 46 PE5/D5 PE5/D5 PE5/D5 PE5 NC 41 47 PE6/D6 PE6/D6 PE6/D6 PE6 NC 42 48 PE7/D7 PE7/D7 PE7/D7 PE7 NC 43 49 D8 D8 D8 PD0 I/O0 44 50 D9 D9 D9 PD1 I/O1 45 51 D10 D10 D10 PD2 I/O2 46 52 D11 D11 D11 PD3 I/O3 47 53 VSS VSS VSS VSS VSS 48 54 D12 D12 D12 PD4 I/O4 49 55 D13 D13 D13 PD5 I/O5 50 56 D14 D14 D14 PD6 I/O6 51 57 D15 D15 D15 PD7 I/O7 52 58 VCC VCC VCC VCC VCC 53 59 P30/TxD0 P30/TxD0 P30/TxD0 P30/TxD0 NC 54 60 P31/TxD1 P31/TxD1 P31/TxD1 P31/TxD1 NC 55 61 P32/RxD0 P32/RxD0 P32/RxD0 P32/RxD0 NC 1 Rev. 4.0, 03/03, page 18 of 1358 1 Pin No. Pin Name TFP-120 FP-128B Mode 4* 1 Mode 5* Mode 6 Mode 7 Flash Memory Programmer Mode 56 62 P33/RxD1 P33/RxD1 P33/RxD1 P33/RxD1 NC 57 63 P34/SCK0 P34/SCK0 P34/SCK0 P34/SCK0 NC 58 64 P35/SCK1 P35/SCK1 P35/SCK1 P35/SCK1 NC 59 65 VSS VSS VSS VSS VSS 66 2 2 2 2 P60/DREQ0* / P60/DREQ0* / P60/DREQ0* / P60/DREQ0* 60 1 CS4 CS4 CS4 NC -- 67 VSS VSS VSS VSS VSS -- 68 VSS VSS VSS VSS VSS 69 2 P61/TEND0* / 2 P61/TEND0* / 2 P61/TEND0* / 2 P61/TEND0* NC CS5 CS5 CS5 61 70 P62/DREQ1* 2 P62/DREQ1* 2 P62/DREQ1* 2 P62/DREQ1* NC 63 71 P63/TEND1 *2 *2 *2 *2 NC 64 72 P27/PO7/ TIOCB5/TMO1 P27/PO7/ TIOCB5/TMO1 P27/PO7/ TIOCB5/TMO1 P27/PO7/ TIOCB5/TMO1 NC 65 73 P26/PO6/ TIOCA5/TMO0 P26/PO6/ TIOCA5/TMO0 P26/PO6/ TIOCA5/TMO0 P26/PO6/ TIOCA5/TMO0 NC 66 74 P25/PO5/ P25/PO5/ P25/PO5/ P25/PO5/ VSS TIOCB4/TMCI1 TIOCB4/TMCI1 TIOCB4/TMCI1 TIOCB4/TMCI1 67 75 P24/PO4/ P24/PO4/ P24/PO4/ P24/PO4/ WE TIOCA4/TMRI1 TIOCA4/TMRI1 TIOCA4/TMRI1 TIOCA4/TMRI1 68 76 P23/PO3/ P23/PO3/ P23/PO3/ P23/PO3/ CE TIOCD3/TMCI0 TIOCD3/TMCI0 TIOCD3/TMCI0 TIOCD3/TMCI0 69 77 P22/PO2/ P22/PO2/ P22/PO2/ P22/PO2/ OE TIOCC3/TMRI0 TIOCC3/TMRI0 TIOCC3/TMRI0 TIOCC3/TMRI0 70 78 P21/PO1/ TIOCB3 P21/PO1/ TIOCB3 P21/PO1/ TIOCB3 P21/PO1/ TIOCB3 NC 71 79 P20/PO0/ TIOCA3 P20/PO0/ TIOCA3 P20/PO0/ TIOCA3 P20/PO0/ TIOCA3 NC 72 80 WDTOVF (FWE, EMLE, 3 VCL)* WDTOVF (FWE, EMLE, 3 VCL)* WDTOVF (FWE, EMLE, 3 VCL)* WDTOVF (FWE, EMLE, 3 VCL)* FWE, EMLE, 3 VCL * 73 81 RES RES RES RES RES 74 82 NMI NMI NMI NMI VCC 75 83 STBY STBY STBY STBY VCC 62 P63/TEND1 P63/TEND1 2 P63/TEND1 Rev. 4.0, 03/03, page 19 of 1358 Pin No. Pin Name TFP-120 FP-128B Mode 4* Mode 5* Mode 6 Mode 7 Flash Memory Programmer Mode 76 84 VCC VCC VCC VCC VCC 77 85 XTAL XTAL XTAL XTAL XTAL 78 86 EXTAL EXTAL EXTAL EXTAL EXTAL 79 87 VSS VSS VSS VSS VSS 80 88 PF7/ PF7/ PF7/ PF7/ NC 81 89 VCC VCC VCC VCC VCC 82 90 PF6/AS PF6/AS PF6/AS PF6 NC 83 91 RD RD RD PF5 NC 84 92 HWR HWR HWR PF4 NC 85 93 PF3/LWR PF3 NC 86 94 PF2/LCAS* / WAIT/BREQO PF2/LCAS* / WAIT/BREQO PF2/LCAS* / WAIT/BREQO PF2 NC 87 95 PF1/BACK PF1/BACK PF1/BACK PF1 NC 88 96 PF0/BREQ PF0/BREQ PF0/BREQ PF0 NC 89 97 P50/TxD2/IRQ4 P50/TxD2/IRQ4 P50/TxD2/IRQ4 P50/TxD2/IRQ4 NC 90 98 P51/RxD2/IRQ5 P51/RxD2/IRQ5 P51/RxD2/IRQ5 P51/RxD2/IRQ5 VCC -- 99 VSS VSS VSS VSS VSS -- 100 VSS VSS VSS VSS VSS 91 101 P52/SCK2/ IRQ6 P52/SCK2/ IRQ6 P52/SCK2/ IRQ6 P52/SCK2/ IRQ6 NC 92 102 P53/ADTRG/ IRQ7/WAIT/ BREQO P53/ADTRG/ IRQ7/WAIT/ BREQO P53/ADTRG/ IRQ7/WAIT/ BREQO P53/ADTRG/ IRQ7 NC 93 103 AVCC AVCC AVCC AVCC VCC 94 104 Vref Vref Vref Vref VCC 95 105 P40/AN0 P40/AN0 P40/AN0 P40/AN0 NC 96 106 P41/AN1 P41/AN1 P41/AN1 P41/AN1 NC 97 107 P42/AN2 P42/AN2 P42/AN2 P42/AN2 NC 98 108 P43/AN3 P43/AN3 P43/AN3 P43/AN3 NC 1 1 PF3/LWR 4 PF3/LWR 4 4 99 109 P44/AN4 P44/AN4 P44/AN4 P44/AN4 NC 100 110 P45/AN5 P45/AN5 P45/AN5 P45/AN5 NC Rev. 4.0, 03/03, page 20 of 1358 Pin No. Pin Name TFP-120 FP-128B Mode 4* Mode 5* Mode 6 Mode 7 Flash Memory Programmer Mode 101 111 P46/AN6/DA0 P46/AN6/DA0 P46/AN6/DA0 P46/AN6/DA0 NC 102 112 P47/AN7/ DA1 P47/AN7/DA1 P47/AN7/DA1 P47/AN7/DA1 NC 103 113 AVSS AVSS AVSS AVSS VSS 104 114 VSS VSS VSS VSS VSS 105 115 P17/PO15/ TIOCB2/ TCLKD P17/PO15/ TIOCB2/ TCLKD P17/PO15/ TIOCB2/ TCLKD P17/PO15/ TIOCB2/ TCLKD NC 106 116 P16/PO14/ TIOCA2 P16/PO14/ TIOCA2 P16/PO14/ TIOCA2 P16/PO14/ TIOCA2 NC 107 117 P15/PO13/ TIOCB1/ TCLKC P15/PO13/ TIOCB1/ TCLKC P15/PO13/ TIOCB1/ TCLKC P15/PO13/ TIOCB1/ TCLKC NC 108 118 P14/PO12/ TIOCA1 P14/PO12/ TIOCA1 P14/PO12/ TIOCA1 P14/PO12/ TIOCA1 NC 109 119 P13/PO11/ TIOCD0/ TCLKB P13/PO11/ TIOCD0/ TCLKB P13/PO11/ TIOCD0/ TCLKB P13/PO11/ TIOCD0/ TCLKB NC 110 120 P12/PO10/ TIOCC0/ TCLKA P12/PO10/ TIOCC0/ TCLKA P12/PO10/ TIOCC0/ TCLKA P12/PO10/ TIOCC0/ TCLKA NC 111 121 P11/PO9/ TIOCB0/ 5 DACK1* P11/PO9/ TIOCB0/ 5 DACK1* P11/PO9/ TIOCB0/ 5 DACK1* P11/PO9/ TIOCB0/ 5 DACK1* NC 112 122 P10/PO8/ TIOCA0/ 6 DACK0* P10/PO8/ TIOCA0/ 6 DACK0* P10/PO8/ TIOCA0/ 6 DACK0* P10/PO8/ TIOCA0/ 6 DACK0* NC 113 123 MD0 MD0 MD0 MD0 VSS 114 124 MD1 MD1 MD1 MD1 VSS 115 125 MD2 MD2 MD2 MD2 VSS PG0 NC 1 1 *6 PG0/CAS *6 PG0/CAS *6 116 126 PG0/CAS 117 127 PG1/CS3 PG1/CS3 PG1/CS3 PG1 NC 118 128 PG2/CS2 PG2/CS2 PG2/CS2 PG2 NC 119 1 PG3/CS1 PG3/CS1 PG3/CS1 PG3 NC 120 2 PG4/CS0 PG4/CS0 PG4/CS0 PG4 NC Rev. 4.0, 03/03, page 21 of 1358 Pin No. Pin Name TFP-120 FP-128B Mode 4* Mode 5* Mode 6 Mode 7 Flash Memory Programmer Mode -- 3 VSS VSS VSS VSS VSS -- 4 1 *7 VSSNC 1 *7 VSSNC *7 VSSNC *7 VSSNC NC Notes: *1 Only modes 4 and 5 are provided in the ROMless version. *2 The DREQ0, TEND0, DREQ1, and TEND1 pin functions are not supported in the H8S/2321. *3 The FWE pin applies to the H8S/2328 F-ZTAT and H8S/2326 F-ZTAT only. The EMLE pin applies to the H8S/2329 F-ZTAT only. The VCL pin applies to the H8S/2326C FZTAT only. The WDTOVF pin function is not available in the F-ZTAT versions. *4 The LCAS pin function is not supported in the H8S/2321. *5 The DACK1 pin function is not supported in the H8S/2321. *6 The DACK0 and CAS pin functions are not supported in the H8S/2321. *7 The VSSNC pin is connected to the VSS pin or released. Rev. 4.0, 03/03, page 22 of 1358 1.3.3 Pin Functions Table 1-3 Pin Functions Pin No. Type Symbol TFP-120 FP-128B I/O Name and Function Power VCC 1, 33, 52, 76, 81 5, 39, 58, 84, 89 Input Power supply: For connection to the power supply. All VCC pins should be connected to the system power supply. VSS 6, 15, 24, 38, 47, 59, 79, 104 3, 10, 19, 28, 35, 36, 44, 53, 65, 67, 68, 87, 99, 100, 114 Input Ground: For connection to ground (0 V). All VSS pins should be connected to the system power supply (0 V). Internal stepdown pin VCL* 1 72 80 Output An external capacitor should be connected between this pin and GND (0V). Do not connect it to VCC. Clock XTAL 77 85 Input Connects to a crystal resonator. See section 20, Clock Pulse Generator for typical connection diagrams for a crystal resonator and external clock input. EXTAL 78 86 Input Connects to a crystal resonator. The EXTAL pin can also input an external clock. See section 20, Clock Pulse Generator for typical connection diagrams for a crystal resonator and external clock input. 80 88 Output System clock: Supplies the system clock to an external device. Rev. 4.0, 03/03, page 23 of 1358 Pin No. Type Symbol Operating mode MD2 to control MD0 TFP-120 FP-128B I/O Name and Function 115 to 113 125 to 123 Mode pins: These pins set the operating mode. The relation between the settings of pins MD2 to MD0 and the operating mode is shown below. These pins should not be changed while the chip is operating. Input H8S/2328 F-ZTAT, H8S/2326 F-ZTAT: Operating FWE MD2 MD1 MD0 Mode 0 0 1 1 0 0 1 -- 1 0 -- 1 -- 0 0 Mode 4 1 Mode 5 1 0 Mode 6 1 Mode 7 0 -- 1 -- 0 Mode 10 1 Mode 11 0 -- 1 -- 0 Mode 14 1 Mode 15 0 1 1 0 1 Rev. 4.0, 03/03, page 24 of 1358 Pin No. Type Symbol Operating mode MD2 to control MD0 TFP-120 FP-128B I/O Name and Function 115 to 113 125 to 123 Mask ROM and ROMless versions, H8S/2329 F-ZTAT, and H8S/2326C F-ZTAT: Input MD2 MD1 MD0 0 0 1 1 0 0 1 1 Mode 1* 2 Mode 2* 2 0 Mode 3* 3 Mode 4* 1 Mode 5* 0 Mode 6 1 Mode 7 1 1 Operating Mode 3 Notes: *1 Applies to the H8S/2326C F-ZTAT only. *2 Applies to the H8S/2329 F-ZTAT and H8S/2326C F-ZTAT only. *3 The ROMless versions can use only modes 4 and 5. System control RES 73 81 Input Reset input: When this pin is driven low, the chip is reset. STBY 75 83 Input Standby: When this pin is driven low, a transition is made to hardware standby mode. BREQ 88 96 Input Bus request: Used by an external bus master to issue a bus request to the chip. BREQO 86, 92 94, 102 Output Bus request output: The external bus request signal used when an internal bus master accesses external space in the external busreleased state. BACK 87 95 Output Bus request acknowledge: Indicates that the bus has been released to an external bus master. Rev. 4.0, 03/03, page 25 of 1358 Pin No. Type Symbol TFP-120 FP-128B I/O Name and Function System control 2 FWE* 72 80 Input Flash write enable: Enables/ disables flash memory programming. 3 EMLE* 72 80 Input Emulator enable: For connection to the power supply (0 V) NMI 74 82 Input Nonmaskable interrupt: Requests a nonmaskable interrupt. When this pin is not used, it should be fixed high. IRQ7 to IRQ0 28 to 25, 29 to 32, 89 to 92 32 to 29, Input 33, 34, 37, 38, 97, 98, 101, 102 Address bus A23 to A0 28 to 25, 23 to 16, 14 to 7, 5 to 2 32 to 29, 27 to 20, 18 to 11, 9 to 6 Output Address bus: These pins output an address. Data bus D15 to D0 51 to 48, 46 to 39, 37 to 34 57 to 54, 52 to 45, 43 to 40 I/O Bus control CS7 to CS0 29, 30, 33, 34, Output Chip select: Signals for selecting 61, 60, 69, 66, areas 7 to 0. 117 to 120 127, 128, 1, 2 AS 82 90 Output Address strobe: When this pin is low, it indicates that address output on the address bus is enabled. RD 83 91 Output Read: When this pin is low, it indicates that the external address space can be read. HWR 84 92 Output High write/write enable: A strobe signal that writes to external space and indicates that the upper half (D15 to D8) of the data bus is enabled. The 2-CAS type DRAM write enable signal. LWR 85 93 Output Low write: A strobe signal that writes to external space and indicates that the lower half (D7 to D0) of the data bus is enabled. Interrupts Rev. 4.0, 03/03, page 26 of 1358 Interrupt request 7 to 0: These pins request a maskable interrupt. Data bus: These pins constitute a bidirectional data bus. Pin No. Type Symbol TFP-120 FP-128B I/O Bus control 4 CAS* 116 126 Output Upper column address strobe/ column address strobe: The 2CAS type DRAM upper column address strobe signal. 4 LCAS* 86 94 Output Lower column address strobe: The 2-CAS type DRAM lower column address strobe signal. WAIT 86, 92 94, 102 Input Wait: Requests insertion of a wait state in the bus cycle when accessing external 3-state access space. DREQ1, DREQ0 62, 60 70, 66 Input DMA request 1 and 0: These pins request DMAC activation. TEND1, TEND0 63, 61 71, 69 Output DMA transfer end 1 and 0: These pins indicate the end of DMAC data transfer. DACK1, DACK0 111, 112 121, 122 Output DMA transfer acknowledge 1 and 0: These are the DMAC single address transfer acknowledge pins. TCLKD to TCLKA 105, 107, 115, 117, Input 109, 110 119, 120 Clock input D to A: These pins input an external clock. TIOCA0, TIOCB0, TIOCC0, TIOCD0 112 to 109 122 to 119 I/O Input capture/output compare match A0 to D0: The TGR0A to TGR0D input capture input or output compare output, or PWM output pins. TIOCA1, TIOCB1 108, 107 118, 117 I/O Input capture/output compare match A1 and B1: The TGR1A and TGR1B input capture input or output compare output, or PWM output pins. TIOCA2, TIOCB2 106, 105 116, 115 I/O Input capture/output compare match A2 and B2: The TGR2A and TGR2B input capture input or output compare output, or PWM output pins. TIOCA3, TIOCB3, TIOCC3, TIOCD3 71 to 68 79 to 76 I/O Input capture/output compare match A3 to D3: The TGR3A to TGR3D input capture input or output compare output, or PWM output pins. DMA controller 4 (DMAC) * 16-bit timer pulse unit (TPU) Name and Function Rev. 4.0, 03/03, page 27 of 1358 Pin No. Type Symbol TFP-120 FP-128B I/O Name and Function 16-bit timer pulse unit (TPU) TIOCA4, TIOCB4 67, 66 75, 74 I/O Input capture/output compare match A4 and B4: The TGR4A and TGR4B input capture input or output compare output, or PWM output pins. TIOCA5, TIOCB5 65, 64 73, 72 I/O Input capture/output compare match A5 and B5: The TGR5A and TGR5B input capture input or output compare output, or PWM output pins. Programmable PO15 to pulse generator PO0 (PPG) 105 to 112, 64 to 71 115 to 122, 72 to 79 Output Pulse output 15 to 0: Pulse output pins. 8-bit timer TMO0, TMO1 65, 64 73, 72 Output Compare match output: The compare match output pins. TMCI0, TMCI1 68, 66 76, 74 Input Counter external clock input: Input pins for the external clock input to the counter. TMRI0, TMRI1 69, 67 77, 75 Input Counter external reset input: The counter reset input pins. Watchdog timer (WDT) WDTOVF* 72 80 Output Watchdog timer overflow: The counter overflow signal output pin in watchdog timer mode. Serial communication interface (SCI)/ smart card interface TxD2, TxD1, TxD0 89, 54, 53 97, 60, 59 Output Transmit data (channel 0, 1, 2): Data output pins. RxD2, RxD1, RxD0 90, 56, 55 98, 62, 61 Input Receive data (channel 0, 1, 2): Data input pins. SCK2, SCK1, SCK0 91, 58, 57 101, 64, 63 I/O Serial clock (channel 0, 1, 2): Clock I/O pins. AN7 to AN0 102 to 95 112 to 105 Input Analog 7 to 0: Analog input pins. ADTRG 92 102 Input A/D conversion external trigger input: Pin for input of an external trigger to start A/D conversion. DA1, DA0 102, 101 112, 111 Output Analog output: D/A converter analog output pins. A/D converter D/A converter 5 Rev. 4.0, 03/03, page 28 of 1358 Pin No. Type Symbol TFP-120 FP-128B I/O Name and Function A/D converter and D/A converter AVCC 93 103 Input This is the power supply pin for the A/D converter and D/A converter. When the A/D converter and D/A converter are not used, this pin should be connected to the system power supply (+3 V). AVSS 103 113 Input This is the ground pin for the A/D converter and D/A converter. This pin should be connected to the system power supply (0 V). Vref 94 104 Input This is the reference voltage input pin for the A/D converter and D/A converter. When the A/D converter and D/A converter are not used, this pin should be connected to the system power supply (+3 V). P17 to P10 105 to 112 115 to 122 I/O Port 1: An 8-bit I/O port. Input or output can be designated for each bit by means of the port 1 data direction register (P1DDR). P27 to P20 64 to 71 72 to 79 I/O Port 2: An 8-bit I/O port. Input or output can be designated for each bit by means of the port 2 data direction register (P2DDR). P35 to P30 58 to 53 64 to 59 I/O Port 3: A 6-bit I/O port. Input or output can be designated for each bit by means of the port 3 data direction register (P3DDR). P47 to P40 102 to 95 112 to 105 Input Port 4: An 8-bit input port. P53 to P50 92 to 89 102, 101, I/O 98, 97 I/O ports Port 5: A 4-bit I/O port. Input or output can be designated for each bit by means of the port 5 data direction register (P5DDR). Rev. 4.0, 03/03, page 29 of 1358 Pin No. Type Symbol TFP-120 FP-128B I/O Name and Function I/O ports P67 to P60 29 to 32, 63 to 60 33, 34, 37, 38, 71 to 69, 66 I/O Port 6: An 8-bit I/O port. Input or output can be designated for each bit by means of the port 6 data direction register (P6DDR). PA7 to PA0 28 to 25, 23 to 20 32 to 29, 27 to 24 I/O PB7 to PB0 19 to 16, 14 to 11 23 to 20, 18 to 15 I/O PC7 to PC0 10 to 7, 5 to 2 14 to 11, 9 to 6 I/O PD7 to PD0 51 to 48, 46 to 43 57 to 54, 52 to 49 I/O Port A: An 8-bit I/O port. Input or output can be designated for each bit by means of the port A data direction register (PADDR). 6 Port B* : An 8-bit I/O port. Input or output can be designated for each bit by means of the port B data direction register (PBDDR). 6 Port C* : An 8-bit I/O port. Input or output can be designated for each bit by means of the port C data direction register (PCDDR). 6 Port D* : An 8-bit I/O port. Input or output can be designated for each bit by means of the port D data direction register (PDDDR). PE7 to PE0 42 to 39, 37 to 34 48 to 45, 43 to 40 I/O Port E: An 8-bit I/O port. Input or output can be designated for each bit by means of the port E data direction register (PEDDR). PF7 to PF0 80, 82 to 88 88, 90 to 96 I/O Port F: An 8-bit I/O port. Input or output can be designated for each bit by means of the port F data direction register (PFDDR). PG4 to PG0 120 to 116 2, 1, 128 to 126 I/O Port G: A 5-bit I/O port. Input or output can be designated for each bit by means of the port G data direction register (PGDDR). Notes: *1 *2 *3 *4 *5 *6 Applies to the H8S/2326C F-ZTAT only. Applies to the H8S/2328 F-ZTAT and H8S/2326 F-ZTAT only. Applies to the H8S/2329 F-ZTAT only. Not supported in the H8S/2321. Not available in the F-ZTAT versions. Cannot be used as an I/O port in the ROMless versions. Rev. 4.0, 03/03, page 30 of 1358 Section 2 CPU 2.1 Overview The H8S/2000 CPU is a high-speed central processing unit with an internal 32-bit architecture that is upward-compatible with the H8/300 and H8/300H CPUs. The H8S/2000 CPU has sixteen 16-bit general registers, can address a 16-Mbyte (architecturally 4-Gbyte) linear address space, and is ideal for realtime control. 2.1.1 Features The H8S/2000 CPU has the following features. * Upward-compatible with H8/300 and H8/300H CPUs Can execute H8/300 and H8/300H object programs * General-register architecture Sixteen 16-bit general registers (also usable as sixteen 8-bit registers or eight 32-bit registers) * Sixty-five basic instructions 8/16/32-bit arithmetic and logic instructions Multiply and divide instructions Powerful bit-manipulation instructions * Eight addressing modes Register direct [Rn] Register indirect [@ERn] Register indirect with displacement [@(d:16,ERn) or @(d:32,ERn)] Register indirect with post-increment or pre-decrement [@ERn+ or @-ERn] Absolute address [@aa:8, @aa:16, @aa:24, or @aa:32] Immediate [#xx:8, #xx:16, or #xx:32] Program-counter relative [@(d:8,PC) or @(d:16,PC)] Memory indirect [@@aa:8] * 16-Mbyte address space Program: 16 Mbytes Data: 16 Mbytes (4 Gbytes architecturally) Rev. 4.0, 03/03, page 31 of 1358 * High-speed operation All frequently-used instructions execute in one or two states Maximum clock rate : 25 MHz 8/16/32-bit register-register add/subtract : 40 ns 8 x 8-bit register-register multiply : 480 ns 16 / 8-bit register-register divide : 480 ns 16 x 16-bit register-register multiply : 800 ns 32 / 16-bit register-register divide : 800 ns * CPU operating mode Advanced mode * Power-down state Transition to power-down state by SLEEP instruction CPU clock speed selection 2.1.2 Differences between H8S/2600 CPU and H8S/2000 CPU The differences between the H8S/2600 CPU and the H8S/2000 CPU are as shown below. * Register configuration The MAC register is supported only by the H8S/2600 CPU. * Basic instructions The four instructions MAC, CLRMAC, LDMAC, and STMAC are supported only by the H8S/2600 CPU. * Number of execution states The number of exection states of the MULXU and MULXS instructions. Internal Operation Instruction Mnemonic MULXU MULXU.B Rs, Rd 3 12 MULXU.W Rs, ERd 4 20 MULXS.B Rs, Rd 4 13 MULXS.W Rs, ERd 5 21 MULXS H8S/2600 H8S/2000 There are also differences in the address space, CCR and EXR functions, power-down state, etc., depending on the product. Rev. 4.0, 03/03, page 32 of 1358 2.1.3 Differences from H8/300 CPU In comparison to the H8/300 CPU, the H8S/2000 CPU has the following enhancements. * More general registers and control registers Eight 16-bit expanded registers, and one 8-bit control register, have been added. * Expanded address space Advanced mode supports a maximum 16-Mbyte address space. * Enhanced addressing The addressing modes have been enhanced to make effective use of the 16-Mbyte address space. * Enhanced instructions Addressing modes of bit-manipulation instructions have been enhanced. Signed multiply and divide instructions have been added. Two-bit shift instructions have been added. Instructions for saving and restoring multiple registers have been added. A test and set instruction has been added. * Higher speed Basic instructions execute twice as fast. 2.1.4 Differences from H8/300H CPU In comparison to the H8/300H CPU, the H8S/2000 CPU has the following enhancements. * Additional control register One 8-bit control register has been added. * Enhanced instructions Addressing modes of bit-manipulation instructions have been enhanced. Two-bit shift instructions have been added. Instructions for saving and restoring multiple registers have been added. A test and set instruction has been added. * Higher speed Basic instructions execute twice as fast. Rev. 4.0, 03/03, page 33 of 1358 2.2 CPU Operating Modes The H8S/2329 and H8S/2328 Series CPU has advanced operating mode. Advanced mode supports a maximum 16-Mbyte total address space (architecturally a maximum 16-Mbyte program area and a maximum of 4 Gbytes for program and data areas combined). The mode is selected by the mode pins of the microcontroller. Advanced Mode Address Space: Linear access is provided to a 16-Mbyte maximum address space (architecturally a maximum 16-Mbyte program area and a maximum 4-Gbyte data area, with a maximum of 4 Gbytes for program and data areas combined). Extended Registers (En): The extended registers (E0 to E7) can be used as 16-bit registers, or as the upper 16-bit segments of 32-bit registers or address registers. Instruction Set: All instructions and addressing modes can be used. Rev. 4.0, 03/03, page 34 of 1358 Exception Vector Table and Memory Indirect Branch Addresses: In advanced mode the top area starting at H'00000000 is allocated to the exception vector table in units of 32 bits. In each 32 bits, the upper 8 bits are ignored and a branch address is stored in the lower 24 bits (figure 2-1). For details of the exception vector table, see section 4, Exception Handling. H'00000000 Reserved Power-on reset exception vector H'00000003 H'00000004 Reserved H'00000007 H'00000008 Exception vector table H'0000000B (Reserved for system use) H'0000000C H'00000010 Reserved Exception vector 1 Figure 2-1 Exception Vector Table (Advanced Mode) The memory indirect addressing mode (@@aa:8) employed in the JMP and JSR instructions uses an 8-bit absolute address included in the instruction code to specify a memory operand that contains a branch address. In advanced mode the operand is a 32-bit longword operand, providing a 32-bit branch address. The upper 8 bits of these 32 bits are a reserved area that is regarded as H'00. Branch addresses can be stored in the area from H'00000000 to H'000000FF. Note that the first part of this range is also the exception vector table. Rev. 4.0, 03/03, page 35 of 1358 Stack Structure: In advanced mode, when the program counter (PC) is pushed onto the stack in a subroutine call, and the PC, condition-code register (CCR), and extended control register (EXR) are pushed onto the stack in exception handling, they are stored as shown in figure 2-2. When EXR is invalid, it is not pushed onto the stack. For details, see section 4, Exception Handling. EXR*1 Reserved*1 *3 CCR SP SP Reserved PC (24 bits) (a) Subroutine Branch *2 (SP ) PC (24 bits) (b) Exception Handling Notes: *1 When EXR is not used it is not stored on the stack. *2 SP when EXR is not used. *3 Ignored when returning. Figure 2-2 Stack Structure in Advanced Mode Rev. 4.0, 03/03, page 36 of 1358 2.3 Address Space Figure 2-3 shows a memory map of the H8S/2000 CPU. The H8S/2000 CPU provides linear access to a maximum 16-Mbyte (architecturally 4-Gbyte) address space in advanced mode. H'00000000 Program area H'00FFFFFF Data area Cannot be used by the H8S/2329 and H8S/2328 Series H'FFFFFFFF Advanced Mode Figure 2-3 Memory Map Rev. 4.0, 03/03, page 37 of 1358 2.4 Register Configuration 2.4.1 Overview The CPU has the internal registers shown in figure 2-4. There are two types of registers: general registers and control registers. General Registers (Rn) and Extended Registers (En) 15 07 07 0 ER0 E0 R0H R0L ER1 E1 R1H R1L ER2 E2 R2H R2L ER3 E3 R3H R3L ER4 E4 R4H R4L ER5 E5 R5H R5L ER6 E6 R6H R6L ER7 (SP) E7 R7H R7L Control Registers (CR) 23 0 PC 7 6 5 4 3 2 1 0 EXR T I2 I1 I0 7 6 5 4 3 2 1 0 CCR I UI H U N Z V C Legend SP: PC: EXR: T: I2 to I0: CCR: I: UI: Stack pointer Program counter Extended control register Trace bit Interrupt mask bits Condition-code register Interrupt mask bit User bit or interrupt mask bit* H: U: N: Z: V: C: Half-carry flag User bit Negative flag Zero flag Overflow flag Carry flag Note: * In the H8S/2329 and H8S/2328 Series, this bit cannot be used as an interrupt mask. Figure 2-4 CPU Registers Rev. 4.0, 03/03, page 38 of 1358 2.4.2 General Registers The CPU has eight 32-bit general registers. These general registers are all functionally alike and can be used as both address registers and data registers. When a general register is used as a data register, it can be accessed as a 32-bit, 16-bit, or 8-bit register. When the general registers are used as 32-bit registers or address registers, they are designated by the letters ER (ER0 to ER7). The ER registers divide into 16-bit general registers designated by the letters E (E0 to E7) and R (R0 to R7). These registers are functionally equivalent, providing a maximum sixteen 16-bit registers. The E registers (E0 to E7) are also referred to as extended registers. The R registers divide into 8-bit general registers designated by the letters RH (R0H to R7H) and RL (R0L to R7L). These registers are functionally equivalent, providing a maximum sixteen 8-bit registers. Figure 2-5 illustrates the usage of the general registers. The usage of each register can be selected independently. Address registers 32-bit registers 16-bit registers 8-bit registers E registers (extended registers) (E0 to E7) RH registers (R0H to R7H) ER registers (ER0 to ER7) R registers (R0 to R7) RL registers (R0L to R7L) Figure 2-5 Usage of General Registers General register ER7 has the function of stack pointer (SP) in addition to its general-register function, and is used implicitly in exception handling and subroutine calls. Figure 2-6 shows the stack. Rev. 4.0, 03/03, page 39 of 1358 Free area SP (ER7) Stack area Figure 2-6 Stack 2.4.3 Control Registers The control registers are the 24-bit program counter (PC), 8-bit extended control register (EXR), and 8-bit condition-code register (CCR). (1) Program Counter (PC): This 24-bit counter indicates the address of the next instruction the CPU will execute. The length of all CPU instructions is 2 bytes (one word), so the least significant PC bit is ignored. (When an instruction is fetched, the least significant PC bit is regarded as 0.) (2) Extended Control Register (EXR): This 8-bit register contains the trace bit (T) and three interrupt mask bits (I2 to I0). Bit 7--Trace Bit (T): Selects trace mode. When this bit is cleared to 0, instructions are executed in sequence. When this bit is set to 1, a trace exception is generated each time an instruction is executed. Bits 6 to 3--Reserved: These bits are reserved. They are always read as 1. Bits 2 to 0--Interrupt Mask Bits (I2 to I0): These bits designate the interrupt mask level (0 to 7). For details, refer to section 5, Interrupt Controller. Operations can be performed on the EXR bits by the LDC, STC, ANDC, ORC, and XORC instructions. All interrupts, including NMI, are disabled for three states after one of these instructions is executed, except for STC. (3) Condition-Code Register (CCR): This 8-bit register contains internal CPU status information, including an interrupt mask bit (I) and half-carry (H), negative (N), zero (Z), overflow (V), and carry (C) flags. Rev. 4.0, 03/03, page 40 of 1358 Bit 7--Interrupt Mask Bit (I): Masks interrupts other than NMI when set to 1. (NMI is accepted regardless of the I bit setting.) The I bit is set to 1 by hardware at the start of an exception-handling sequence. For details, refer to section 5, Interrupt Controller. Bit 6--User Bit or Interrupt Mask Bit (UI): Can be written and read by software using the LDC, STC, ANDC, ORC, and XORC instructions. With the H8S/2329 and H8S/2328 Series, this bit cannot be used as an interrupt mask bit. Bit 5--Half-Carry Flag (H): When the ADD.B, ADDX.B, SUB.B, SUBX.B, CMP.B, or NEG.B instruction is executed, this flag is set to 1 if there is a carry or borrow at bit 3, and cleared to 0 otherwise. When the ADD.W, SUB.W, CMP.W, or NEG.W instruction is executed, the H flag is set to 1 if there is a carry or borrow at bit 11, and cleared to 0 otherwise. When the ADD.L, SUB.L, CMP.L, or NEG.L instruction is executed, the H flag is set to 1 if there is a carry or borrow at bit 27, and cleared to 0 otherwise. Bit 4--User Bit (U): Can be written and read by software using the LDC, STC, ANDC, ORC, and XORC instructions. Bit 3--Negative Flag (N): Stores the value of the most significant bit (sign bit) of data. Bit 2--Zero Flag (Z): Set to 1 to indicate zero data, and cleared to 0 to indicate non-zero data. Bit 1--Overflow Flag (V): Set to 1 when an arithmetic overflow occurs, and cleared to 0 at other times. Bit 0--Carry Flag (C): Set to 1 when a carry occurs, and cleared to 0 otherwise. Used by: * Add instructions, to indicate a carry * Subtract instructions, to indicate a borrow * Shift and rotate instructions, to store the value shifted out of the end bit The carry flag is also used as a bit accumulator by bit manipulation instructions. Some instructions leave some or all of the flag bits unchanged. For the action of each instruction on the flag bits, refer to Appendix A.1, Instruction List. Operations can be performed on the CCR bits by the LDC, STC, ANDC, ORC, and XORC instructions. The N, Z, V, and C flags are used as branching conditions for conditional branch (Bcc) instructions. 2.4.4 Initial Register Values Reset exception handling loads the CPU's program counter (PC) from the vector table, clears the trace bit in EXR to 0, and sets the interrupt mask bits in CCR and EXR to 1. The other CCR bits and the general registers are not initialized. In particular, the stack pointer (ER7) is not initialized. Rev. 4.0, 03/03, page 41 of 1358 The stack pointer should therefore be initialized by an MOV.L instruction executed immediately after a reset. 2.5 Data Formats The CPU can process 1-bit, 4-bit (BCD), 8-bit (byte), 16-bit (word), and 32-bit (longword) data. Bit-manipulation instructions operate on 1-bit data by accessing bit n (n = 0, 1, 2, ..., 7) of byte operand data. The DAA and DAS decimal-adjust instructions treat byte data as two digits of 4-bit BCD data. 2.5.1 General Register Data Formats Figure 2-7 shows the data formats in general registers. Data Type Register Number Data Format 1-bit data RnH 7 0 7 6 5 4 3 2 1 0 Don t care Don t care 7 0 7 6 5 4 3 2 1 0 1-bit data 4-bit BCD data RnL RnH 4 3 7 Upper 4-bit BCD data 0 Lower Don t care RnL Byte data RnH 4 3 7 Upper Don t care 7 0 Lower 0 Don t care MSB Byte data LSB RnL 7 0 Don t care MSB Figure 2-7 General Register Data Formats Rev. 4.0, 03/03, page 42 of 1358 LSB Data Type Register Number Word data Rn Word data En Data Format 15 0 MSB 15 0 MSB Longword data LSB ERn 31 MSB LSB 16 15 En 0 Rn LSB Legend ERn: General register ER En: General register E Rn: General register R RnH: General register RH RnL: General register RL MSB: Most significant bit LSB: Least significant bit Figure 2-7 General Register Data Formats (cont) Rev. 4.0, 03/03, page 43 of 1358 2.5.2 Memory Data Formats Figure 2-8 shows the data formats in memory. The CPU can access word data and longword data in memory, but word or longword data must begin at an even address. If an attempt is made to access word or longword data at an odd address, no address error occurs but the least significant bit of the address is regarded as 0, so the access starts at the preceding address. This also applies to instruction fetches. Data Type Data Format Address 7 1-bit data Address L Byte data Address L MSB Word data 7 0 6 5 4 3 2 1 0 LSB Address 2M MSB Address 2M + 1 Longword data LSB Address 2N MSB Address 2N + 1 Address 2N + 2 Address 2N + 3 LSB Figure 2-8 Memory Data Formats When ER7 is used as an address register to access the stack, the operand size should be word size or longword size. Rev. 4.0, 03/03, page 44 of 1358 2.6 Instruction Set 2.6.1 Overview The H8S/2000 CPU has 65 types of instructions. The instructions are classified by function in table 2-1. Table 2-1 Instruction Classification Function Instructions Size Types Data transfer MOV 1 1 POP* , PUSH* BWL 5 LDM, STM L Arithmetic operations WL 3 MOVFPE, MOVTPE* B ADD, SUB, CMP, NEG BWL ADDX, SUBX, DAA, DAS B INC, DEC BWL ADDS, SUBS L 19 MULXU, DIVXU, MULXS, DIVXS BW EXTU, EXTS 4 TAS* WL Logic operations AND, OR, XOR, NOT BWL 4 Shift SHAL, SHAR, SHLL, SHLR, ROTL, ROTR, ROTXL, ROTXR BWL 8 Bit manipulation B 14 Branch BSET, BCLR, BNOT, BTST, BLD, BILD, BST, BIST, BAND, BIAND, BOR, BIOR, BXOR, BIXOR 2 Bcc* , JMP, BSR, JSR, RTS -- 5 System control TRAPA, RTE, SLEEP, LDC, STC, ANDC, ORC, XORC, NOP -- 9 Block data transfer EEPMOV 1 B -- Total: 65 Notes: B-byte size; W-word size; L-longword size. *1 POP.W Rn and PUSH.W Rn are identical to MOV.W @SP+, Rn and MOV.W Rn, @-SP. POP.L ERn and PUSH.L ERn are identical to MOV.L @SP+, ERn and MOV.L ERn, @-SP. *2 Bcc is the general name for conditional branch instructions. *3 Cannot be used in the H8S/2329 and H8S/2328 Series. *4 Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction. Rev. 4.0, 03/03, page 45 of 1358 2.6.2 Instructions and Addressing Modes Table 2-2 indicates the combinations of instructions and addressing modes that the H8S/2600 CPU can use. Table 2-2 Combinations of Instructions and Addressing Modes @aa:16 BWL BWL BWL B BWL BWL POP, PUSH WL LDM, STM L MOVFPE, MOVTPE*1 Arithmetic operations ADD, CMP SUB ADDX, SUBX B BWL BWL WL BWL B B ADDS, SUBS L INC, DEC BWL DAA, DAS B MULXU, DIVXU BW MULXS, DIVXS BW NEG BWL EXTU, EXTS WL TAS*2 Logic operations AND, OR, XOR B BWL NOT BWL BWL Shift BWL Bit manipulation Branch @@aa:8 @aa:8 BWL @(d:16,PC) @ ERn/@ERn+ BWL @(d:8,PC) @(d:32,ERn) MOV @aa:32 @(d:16,ERn) BWL Instruction @aa:24 @ERn Data transfer Rn Function #xx Addressing Modes B B B B B Bcc, BSR JMP, JSR RTS System control TRAPA RTE SLEEP LDC B STC ANDC, ORC, XORC B W W W W W W B W W W W W W B NOP Block data transfer Legend B: Byte W: Word L: Longword Notes: *1 Cannot be used in the H8S/2329 and H8S/2328 Series. *2 Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction. Rev. 4.0, 03/03, page 46 of 1358 BW 2.6.3 Table of Instructions Classified by Function Table 2-3 summarizes the instructions in each functional category. The notation used in table 2-3 is defined below. Operation Notation Rs General register (destination)* General register (source)* Rn General register* ERn General register (32-bit register) (EAd) Destination operand (EAs) Source operand EXR Extended control register CCR Condition-code register N N (negative) flag in CCR Z Z (zero) flag in CCR V V (overflow) flag in CCR C C (carry) flag in CCR PC Program counter Rd SP Stack pointer #IMM Immediate data disp Displacement + Addition - Subtraction x Multiplication / Division Logical AND Logical OR Logical exclusive OR Move NOT (logical complement) :8/:16/:24/:32 8-, 16-, 24-, or 32-bit length Note: * General registers include 8-bit registers (R0H to R7H, R0L to R7L), 16-bit registers (R0 to R7, E0 to E7), and 32-bit registers (ER0 to ER7). Rev. 4.0, 03/03, page 47 of 1358 Table 2-3 Instructions Classified by Function 1 Type Instruction Size* Function Data transfer MOV B/W/L (EAs) Rd, Rs (Ead) Moves data between two general registers or between a general register and memory, or moves immediate data to a general register. MOVFPE B Cannot be used in the H8S/2329 and H8S/2328 Series. MOVTPE B Cannot be used in the H8S/2329 and H8S/2328 Series. POP W/L @SP+ Rn Pops a register from the stack. POP.W Rn is identical to MOV.W @SP+, Rn. POP.L ERn is identical to MOV.L @SP+, ERn. PUSH W/L Rn @-SP Pushes a register onto the stack. PUSH.W Rn is identical to MOV.W Rn, @-SP. PUSH.L ERn is identical to MOV.L ERn, @-SP. LDM L @SP+ Rn (register list) Pops two or more general registers from the stack. STM L Rn (register list) @-SP Pushes two or more general registers onto the stack. Rev. 4.0, 03/03, page 48 of 1358 1 Type Instruction Size* Function Arithmetic operations ADD SUB B/W/L Rd Rs Rd, Rd #IMM Rd Performs addition or subtraction on data in two general registers, or on immediate data and data in a general register. (Immediate byte data cannot be subtracted from byte data in a general register. Use the SUBX or ADD instruction.) ADDX SUBX B Rd Rs C Rd, Rd #IMM C Rd Performs addition or subtraction with carry or borrow on byte data in two general registers, or on immediate data and data in a general register. INC DEC B/W/L Rd 1 Rd, Rd 2 Rd Increments or decrements a general register by 1 or 2. (Byte operands can be incremented or decremented by 1 only.) ADDS SUBS L Rd 1 Rd, Rd 2 Rd, Rd 4 Rd Adds or subtracts the value 1, 2, or 4 to or from data in a 32-bit register. DAA DAS B Rd decimal adjust Rd Decimal-adjusts an addition or subtraction result in a general register by referring to the CCR to produce 4-bit BCD data. MULXU B/W Rd x Rs Rd Performs unsigned multiplication on data in two general registers: either 8 bits x 8 bits 16 bits or 16 bits x 16 bits 32 bits. MULXS B/W Rd x Rs Rd Performs signed multiplication on data in two general registers: either 8 bits x 8 bits 16 bits or 16 bits x 16 bits 32 bits. DIVXU B/W Rd / Rs Rd Performs unsigned division on data in two general registers: either 16 bits / 8 bits 8-bit quotient and 8bit remainder or 32 bits / 16 bits 16-bit quotient and 16-bit remainder. Rev. 4.0, 03/03, page 49 of 1358 1 Type Instruction Size* Function Arithmetic operations DIVXS B/W Rd / Rs Rd Performs signed division on data in two general registers: either 16 bits / 8 bits 8-bit quotient and 8bit remainder or 32 bits / 16 bits 16-bit quotient and 16-bit remainder. CMP B/W/L Rd - Rs, Rd - #IMM Compares data in a general register with data in another general register or with immediate data, and sets CCR bits according to the result. NEG B/W/L 0 - Rd Rd Takes the two's complement (arithmetic complement) of data in a general register. EXTU W/L Rd (zero extension) Rd Extends the lower 8 bits of a 16-bit register to word size, or the lower 16 bits of a 32-bit register to longword size, by padding with zeros on the left. EXTS W/L TAS B Rd (sign extension) Rd Extends the lower 8 bits of a 16-bit register to word size, or the lower 16 bits of a 32-bit register to longword size, by extending the sign bit. 2 @ERd - 0, 1 (<bit 7> of @Erd)* Tests memory contents, and sets the most significant bit (bit 7) to 1. Rev. 4.0, 03/03, page 50 of 1358 1 Type Instruction Size* Function Logic operations AND B/W/L Rd Rs Rd, Rd #IMM Rd Performs a logical AND operation on a general register and another general register or immediate data. OR B/W/L Rd Rs Rd, Rd #IMM Rd Performs a logical OR operation on a general register and another general register or immediate data. XOR B/W/L Rd Rs Rd, Rd #IMM Rd Performs a logical exclusive OR operation on a general register and another general register or immediate data. NOT B/W/L (Rd) (Rd) Takes the one's complement of general register contents. SHAL SHAR B/W/L Rd (shift) Rd Performs an arithmetic shift on general register contents. 1-bit or 2-bit shift is possible. SHLL SHLR B/W/L Rd (shift) Rd Performs a logical shift on general register contents. 1-bit or 2-bit shift is possible. ROTL ROTR B/W/L Rd (rotate) Rd Rotates general register contents. 1-bit or 2-bit rotation is possible. ROTXL ROTXR B/W/L Rd (rotate) Rd Rotates general register contents through the carry flag. 1-bit or 2-bit rotation is possible. Shift operations Rev. 4.0, 03/03, page 51 of 1358 1 Type Instruction Size* Function Bitmanipulation instructions BSET B 1 (<bit-No.> of <EAd>) Sets a specified bit in a general register or memory operand to 1. The bit number is specified by 3-bit immediate data or the lower three bits of a general register. BCLR B 0 (<bit-No.> of <EAd>) Clears a specified bit in a general register or memory operand to 0. The bit number is specified by 3-bit immediate data or the lower three bits of a general register. BNOT B (<bit-No.> of <EAd>) (<bit-No.> of <EAd>) Inverts a specified bit in a general register or memory operand. The bit number is specified by 3-bit immediate data or the lower three bits of a general register. BTST B (<bit-No.> of <EAd>) Z Tests a specified bit in a general register or memory operand and sets or clears the Z flag accordingly. The bit number is specified by 3-bit immediate data or the lower three bits of a general register. BAND B C (<bit-No.> of <EAd>) C ANDs the carry flag with a specified bit in a general register or memory operand and stores the result in the carry flag. BIAND B C (<bit-No.> of <EAd>) C ANDs the carry flag with the inverse of a specified bit in a general register or memory operand and stores the result in the carry flag. The bit number is specified by 3-bit immediate data. BOR B C (<bit-No.> of <EAd>) C ORs the carry flag with a specified bit in a general register or memory operand and stores the result in the carry flag. BIOR B C (<bit-No.> of <EAd>) C ORs the carry flag with the inverse of a specified bit in a general register or memory operand and stores the result in the carry flag. The bit number is specified by 3-bit immediate data. Rev. 4.0, 03/03, page 52 of 1358 1 Type Instruction Size* Function Bitmanipulation instructions BXOR B C (<bit-No.> of <EAd>) C Exclusive-ORs the carry flag with a specified bit in a general register or memory operand and stores the result in the carry flag. BIXOR B C (<bit-No.> of <EAd>) C Exclusive-ORs the carry flag with the inverse of a specified bit in a general register or memory operand and stores the result in the carry flag. The bit number is specified by 3-bit immediate data. BLD B (<bit-No.> of <EAd>) C Transfers a specified bit in a general register or memory operand to the carry flag. BILD B (<bit-No.> of <EAd>) C Transfers the inverse of a specified bit in a general register or memory operand to the carry flag. The bit number is specified by 3-bit immediate data. BST B C (<bit-No.> of <EAd>) Transfers the carry flag value to a specified bit in a general register or memory operand. BIST B C (<bit-No.> of <EAd>) Transfers the inverse of the carry flag value to a specified bit in a general register or memory operand. The bit number is specified by 3-bit immediate data. Rev. 4.0, 03/03, page 53 of 1358 1 Type Instruction Size* Function Branch instructions Bcc -- Branches to a specified address if a specified condition is true. The branching conditions are listed below. Mnemonic Description Condition BRA(BT) Always (true) Always BRN(BF) Never (false) Never BHI High CZ=0 BLS Low or same CZ=1 BCC(BHS) Carry clear (high or same) C=0 BCS(BLO) Carry set (low) C=1 BNE Not equal Z=0 BEQ Equal Z=1 BVC Overflow clear V=0 BVS Overflow set V=1 BPL Plus N=0 BMI Minus N=1 BGE Greater or equal NV=0 BLT Less than NV=1 BGT Greater than Z(N V) = 0 BLE Less or equal Z(N V) = 1 JMP -- Branches unconditionally to a specified address. BSR -- Branches to a subroutine at a specified address. JSR -- Branches to a subroutine at a specified address. RTS -- Returns from a subroutine. Rev. 4.0, 03/03, page 54 of 1358 Type Instruction System control TRAPA instructions RTE 1 Size* Function -- Starts trap-instruction exception handling. -- Returns from an exception-handling routine. SLEEP -- Causes a transition to a power-down state. LDC B/W (EAs) CCR, (EAs) EXR Moves the source operand contents or immediate data to CCR or EXR. Although CCR and EXR are 8-bit registers, word-size transfers are performed between them and memory. The upper 8 bits are valid. STC B/W CCR (EAd), EXR (EAd) Transfers CCR or EXR contents to a general register or memory. Although CCR and EXR are 8-bit registers, word-size transfers are performed between them and memory. The upper 8 bits are valid. ANDC B CCR #IMM CCR, EXR #IMM EXR Logically ANDs the CCR or EXR contents with immediate data. ORC B CCR #IMM CCR, EXR #IMM EXR Logically ORs the CCR or EXR contents with immediate data. XORC B CCR #IMM CCR, EXR #IMM EXR Logically exclusive-ORs the CCR or EXR contents with immediate data. NOP -- PC + 2 PC Only increments the program counter. Rev. 4.0, 03/03, page 55 of 1358 1 Type Instruction Size* Function Block data transfer instruction EEPMOV.B -- if R4L 0 then Repeat @ER5+ @ER6+ R4L-1 R4L Until R4L = 0 else next; EEPMOV.W -- if R4 0 then Repeat @ER5+ @ER6+ R4-1 R4 Until R4 = 0 else next; Transfers a data block according to parameters set in general registers R4L or R4, ER5, and ER6. R4L or R4: size of block (bytes) ER5: starting source address ER6: starting destination address Execution of the next instruction begins as soon as the transfer is completed. Notes: *1 Size refers to the operand size. B: Byte W: Word L: Longword *2 Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction. Rev. 4.0, 03/03, page 56 of 1358 2.6.4 Basic Instruction Formats The CPU instructions consist of 2-byte (1-word) units. An instruction consists of an operation field (op field), a register field (r field), an effective address extension (EA field), and a condition field (cc). Figure 2-9 shows examples of instruction formats. (1) Operation field only op NOP, RTS, etc. (2) Operation field and register fields op rm rn ADD.B Rn, Rm, etc. (3) Operation field, register fields, and effective address extension op rn rm MOV.B @(d:16, Rn), Rm, etc. EA (disp) (4) Operation field, effective address extension, and condition field op cc EA (disp) BRA d:16, etc Figure 2-9 Instruction Formats (Examples) (1) Operation Field: Indicates the function of the instruction, the addressing mode, and the operation to be carried out on the operand. The operation field always includes the first four bits of the instruction. Some instructions have two operation fields. (2) Register Field: Specifies a general register. Address registers are specified by 3 bits, data registers by 3 bits or 4 bits. Some instructions have two register fields. Some have no register field. (3) Effective Address Extension: Eight, 16, or 32 bits specifying immediate data, an absolute address, or a displacement. (4) Condition Field: Specifies the branching condition of Bcc instructions. Rev. 4.0, 03/03, page 57 of 1358 2.7 Addressing Modes and Effective Address Calculation 2.7.1 Addressing Mode The CPU supports the eight addressing modes listed in table 2-4. Each instruction uses a subset of these addressing modes. Arithmetic and logic instructions can use the register direct and immediate modes. Data transfer instructions can use all addressing modes except program-counter relative and memory indirect. Bit manipulation instructions use register direct, register indirect, or absolute addressing mode to specify an operand, and register direct (BSET, BCLR, BNOT, and BTST instructions) or immediate (3-bit) addressing mode to specify a bit number in the operand. Table 2-4 Addressing Modes No. Addressing Mode Symbol 1 Register direct Rn 2 Register indirect @ERn 3 Register indirect with displacement @(d:16,ERn)/@(d:32,ERn) 4 Register indirect with post-increment Register indirect with pre-decrement @ERn+ @-ERn 5 Absolute address @aa:8/@aa:16/@aa:24/@aa:32 6 Immediate #xx:8/#xx:16/#xx:32 7 Program-counter relative @(d:8,PC)/@(d:16,PC) 8 Memory indirect @@aa:8 (1) Register Direct--Rn: The register field of the instruction specifies an 8-, 16-, or 32-bit general register containing the operand. R0H to R7H and R0L to R7L can be specified as 8-bit registers. R0 to R7 and E0 to E7 can be specified as 16-bit registers. ER0 to ER7 can be specified as 32-bit registers. (2) Register Indirect--@ERn: The register field of the instruction code specifies an address register (ERn) which contains the address of the operand on memory. If the address is a program instruction address, the lower 24 bits are valid and the upper 8 bits are all assumed to be 0 (H'00). (3) Register Indirect with Displacement--@(d:16, ERn) or @(d:32, ERn): A 16-bit or 32-bit displacement contained in the instruction is added to an address register (ERn) specified by the register field of the instruction, and the sum gives the address of a memory operand. A 16-bit displacement is sign-extended when added. Rev. 4.0, 03/03, page 58 of 1358 (4) Register Indirect with Post-Increment or Pre-Decrement--@ERn+ or @-ERn: * Register indirect with post-increment--@ERn+ The register field of the instruction code specifies an address register (ERn) which contains the address of a memory operand. After the operand is accessed, 1, 2, or 4 is added to the address register contents and the sum is stored in the address register. The value added is 1 for byte access, 2 for word transfer instruction, or 4 for longword transfer instruction. For word or longword transfer instruction, the register value should be even. * Register indirect with pre-decrement--@-ERn The value 1, 2, or 4 is subtracted from an address register (ERn) specified by the register field in the instruction code, and the result becomes the address of a memory operand. The result is also stored in the address register. The value subtracted is 1 for byte access, 2 for word transfer instruction, or 4 for longword transfer instruction. For word or longword transfer instruction, the register value should be even. (5) Absolute Address--@aa:8, @aa:16, @aa:24, or @aa:32: The instruction code contains the absolute address of a memory operand. The absolute address may be 8 bits long (@aa:8), 16 bits long (@aa:16), 24 bits long (@aa:24), or 32 bits long (@aa:32). To access data, the absolute address should be 8 bits (@aa:8), 16 bits (@aa:16), or 32 bits (@aa:32) long. For an 8-bit absolute address, the upper 24 bits are all assumed to be 1 (H'FFFF). For a 16-bit absolute address the upper 16 bits are a sign extension. A 32-bit absolute address can access the entire address space. A 24-bit absolute address (@aa:24) indicates the address of a program instruction. The upper 8 bits are all assumed to be 0 (H'00). Table 2-5 indicates the accessible absolute address ranges. Table 2-5 Absolute Address Access Ranges Absolute Address Data address Program instruction address Advanced Mode 8 bits (@aa:8) H'FFFF00 to H'FFFFFF 16 bits (@aa:16) H'000000 to H'007FFF, H'FF8000 to H'FFFFFF 32 bits (@aa:32) H'000000 to H'FFFFFF 24 bits (@aa:24) Rev. 4.0, 03/03, page 59 of 1358 (6) Immediate--#xx:8, #xx:16, or #xx:32: The instruction contains 8-bit (#xx:8), 16-bit (#xx:16), or 32-bit (#xx:32) immediate data as an operand. The ADDS, SUBS, INC, and DEC instructions contain immediate data implicitly. Some bit manipulation instructions contain 3-bit immediate data in the instruction code, specifying a bit number. The TRAPA instruction contains 2-bit immediate data in its instruction code, specifying a vector address. (7) Program-Counter Relative--@(d:8, PC) or @(d:16, PC): This mode is used in the Bcc and BSR instructions. An 8-bit or 16-bit displacement contained in the instruction is sign-extended and added to the 24-bit PC contents to generate a branch address. Only the lower 24 bits of this branch address are valid; the upper 8 bits are all assumed to be 0 (H'00). The PC value to which the displacement is added is the address of the first byte of the next instruction, so the possible branching range is -126 to +128 bytes (-63 to +64 words) or -32766 to +32768 bytes (-16383 to +16384 words) from the branch instruction. The resulting value should be an even number. (8) Memory Indirect--@@aa:8: This mode can be used by the JMP and JSR instructions. The instruction code contains an 8-bit absolute address specifying a memory operand. This memory operand contains a branch address. The upper bits of the absolute address are all assumed to be 0, so the address range is 0 to 255 (H'000000 to H'0000FF). In advanced mode the memory operand is a long word operand, the first byte of which is assumed to be all 0 (H'00). Note that the first part of the address range is also the exception vector area. For further details, refer to section 4, Exception Handling. Specified by @aa:8 Reserved Branch address Advanced Mode Figure 2-10 Branch Address Specification in Memory Indirect Mode Rev. 4.0, 03/03, page 60 of 1358 If an odd address is specified in word or longword memory access, or as a branch address, the least significant bit is regarded as 0, causing data to be accessed or instruction code to be fetched at the address preceding the specified address. (For further information, see section 2.5.2, Memory Data Formats.) 2.7.2 Effective Address Calculation Table 2-6 indicates how effective addresses are calculated in each addressing mode. Rev. 4.0, 03/03, page 61 of 1358 Rev. 4.0, 03/03, page 62 of 1358 4 3 2 1 No. rm rn r r disp r op r Register indirect with pre-decrement @-DERn op Register indirect with post-increment or pre-decrement Register indirect with post-increment @ERn+ op Register indirect with displacement @(d:16, ERn) or @(d:32, ERn) op Register indirect (@ERn) op Register direct (Rn) Addressing Mode and Instruction Format disp 1 2 4 0 1, 2, or 4 General register contents Byte Word Longword 0 0 0 0 1, 2, or 4 General register contents Sign extension General register contents General register contents Operand Size Value added 31 31 31 31 31 Effective Address Calculation 24 23 24 23 24 23 24 23 Don't care 31 Don't care 31 Don't care 31 Don't care 31 Operand is general register contents. Effective Address (EA) 0 0 0 0 Table 2-6 Effective Address Calculation Rev. 4.0, 03/03, page 63 of 1358 6 op op abs abs abs op IMM Immediate #xx:8/#xx:16/#xx:32 @aa:32 op @aa:24 @aa:16 op abs Absolute address 5 @aa:8 Addressing Mode and Instruction Format No. Effective Address Calculation 24 23 24 23 24 23 24 23 87 16 15 Sign extension H'FFFF Operand is immediate data. Don't care 31 Don't care 31 Don't care 31 Don't care 31 Effective Address (EA) 0 0 0 0 Rev. 4.0, 03/03, page 64 of 1358 8 7 No. op abs Advanced mode Memory indirect @@aa:8 op @(d:8, PC)/@(d:16, PC) Program-counter relative disp Addressing Mode and Instruction Format 31 31 Memory contents H'000000 87 disp PC contents Sign extension 23 23 abs Effective Address Calculation 0 0 0 0 24 23 24 23 Don t care 31 Don t care 31 Effective Address (EA) 0 0 2.8 Processing States 2.8.1 Overview The CPU has five main processing states: the reset state, exception handling state, program execution state, bus-released state, and power-down state. Figure 2-11 shows a diagram of the processing states. Figure 2-12 indicates the state transitions. Reset state The CPU and all on-chip supporting modules have been initialized and are stopped. Exception-handling state A transient state in which the CPU changes the normal processing flow in response to a reset, interrupt, or trap instruction. Processing states Program execution state The CPU executes program instructions in sequence. Bus-released state The external bus has been released in response to a bus request signal from a bus master other than the CPU. Sleep mode Power-down state CPU operation is stopped to conserve power.* Software standby mode Hardware standby mode Note: * The power-down state also includes a medium-speed mode, module stop mode etc. Figure 2-11 Processing States Rev. 4.0, 03/03, page 65 of 1358 End of bus request Bus request Program execution state End of bus request Bus request SLEEP instruction with SSBY = 1 Bus-released state End of exception handling SLEEP instruction with SSBY = 0 Request for exception handling Sleep mode Interrupt request Exception-handling state External interrupt Software standby mode RES = high Reset state*1 STBY = high, RES = low Hardware standby mode*2 Power-down state Notes: *1 From any state except hardware standby mode, a transition to the reset state occurs whenever RES goes low. A transition can also be made to the reset state when the watchdog timer overflows. *2 From any state, a transition to hardware standby mode occurs when STBY goes low. Figure 2-12 State Transitions 2.8.2 Reset State When the RES input goes low all current processing stops and the CPU enters the reset state. All interrupts are masked in the reset state. Reset exception handling starts when the RES signal changes from low to high. The reset state can also be entered by a watchdog timer overflow. For details, refer to section 13, Watchdog Timer. Rev. 4.0, 03/03, page 66 of 1358 2.8.3 Exception-Handling State The exception-handling state is a transient state that occurs when the CPU alters the normal processing flow due to a reset, interrupt, or trap instruction. The CPU fetches a start address (vector) from the exception vector table and branches to that address. (1) Types of Exception Handling and Their Priority Exception handling is performed for traces, resets, interrupts, and trap instructions. Table 2-7 indicates the types of exception handling and their priority. Trap instruction exception handling is always accepted, in the program execution state. Exception handling and the stack structure depend on the interrupt control mode set in SYSCR. Table 2-7 Exception Handling Types and Priority Priority Type of Exception Detection Timing Start of Exception Handling High Reset Synchronized with clock Exception handling starts immediately after a low-to-high transition at the RES pin, or when the watchdog timer overflows Trace End of instruction execution or end of exception-handling 1 sequence* When the trace (T) bit is set to 1, the trace starts at the end of the current instruction or current exception-handling sequence Interrupt End of instruction execution or end of exception-handling 2 sequence* When an interrupt is requested, exception handling starts at the end of the current instruction or current exception-handling sequence Trap instruction When TRAPA instruction is executed Exception handling starts when a trap (TRAPA) instruction is 3 executed* Low Notes: *1 Traces are enabled only in interrupt control mode 2. Trace exception-handling is not executed at the end of the RTE instruction. *2 Interrupts are not detected at the end of the ANDC, ORC, XORC, and LDC instructions, or immediately after reset exception handling. *3 Trap instruction exception handling is always accepted, in the program execution state. Rev. 4.0, 03/03, page 67 of 1358 (2) Reset Exception Handling After the RES pin has gone low and the reset state has been entered, when RES goes high again, reset exception handling starts. When reset exception handling starts the CPU fetches a start address (vector) from the exception vector table and starts program execution from that address. All interrupts, including NMI, are disabled during reset exception handling and after it ends. (3) Traces Traces are enabled only in interrupt control mode 2. Trace mode is entered when the T bit of EXR is set to 1. When trace mode is established, trace exception handling starts at the end of each instruction. At the end of a trace exception-handling sequence, the T bit of EXR is cleared to 0 and trace mode is cleared. Interrupt masks are not affected. The T bit saved on the stack retains its value of 1, and when the RTE instruction is executed to return from the trace exception-handling routine, trace mode is entered again. Trace exceptionhandling is not executed at the end of the RTE instruction. Trace mode is not entered in interrupt control mode 0, regardless of the state of the T bit. (4) Interrupt Exception Handling and Trap Instruction Exception Handling When interrupt or trap-instruction exception handling begins, the CPU references the stack pointer (ER7) and pushes the program counter and other control registers onto the stack. Next, the CPU alters the settings of the interrupt mask bits in the control registers. Then the CPU fetches a start address (vector) from the exception vector table and program execution starts from that start address. Figure 2-13 shows the stack after exception handling ends. Rev. 4.0, 03/03, page 68 of 1358 Advanced mode SP SP EXR Reserved* CCR CCR PC (24 bits) PC (24 bits) (c) Interrupt control mode 0 (d) Interrupt control mode 2 Note: *Ignored when returning. Figure 2-13 Stack Structure after Exception Handling (Examples) 2.8.4 Program Execution State In this state the CPU executes program instructions in sequence. 2.8.5 Bus-Released State This is a state in which the bus has been released in response to a bus request from a bus master other than the CPU. While the bus is released, the CPU halts. There is one other bus master in addition to the CPU: the DMA controller (DMAC)* and data transfer controller (DTC). For further details, refer to section 6, Bus Controller. Note: * The DMAC is not supported in the H8S/2321. 2.8.6 Power-Down State The power-down state includes both modes in which the CPU stops operating and modes in which the CPU does not stop. There are three modes in which the CPU stops operating: sleep mode, software standby mode, and hardware standby mode. There are also two other power-down modes: medium-speed mode, and module stop mode. In medium-speed mode the CPU and other bus Rev. 4.0, 03/03, page 69 of 1358 masters operate on a medium-speed clock. Module stop mode permits halting of the operation of individual modules, other than the CPU. For details, refer to section 21, Power-Down State. (1) Sleep Mode: A transition to sleep mode is made if the SLEEP instruction is executed while the software standby bit (SSBY) in the standby control register (SBYCR) is cleared to 0. In sleep mode, CPU operations stop immediately after execution of the SLEEP instruction. The contents of CPU registers are retained. (2) Software Standby Mode: A transition to software standby mode is made if the SLEEP instruction is executed while the SSBY bit in SBYCR is set to 1. In software standby mode, the CPU and clock halt and all MCU operations stop. As long as a specified voltage is supplied, the contents of CPU registers and on-chip RAM are retained. The I/O ports also remain in their existing states. (3) Hardware Standby Mode: A transition to hardware standby mode is made when the STBY pin goes low. In hardware standby mode, the CPU and clock halt and all MCU operations stop. The on-chip supporting modules are reset, but as long as a specified voltage is supplied, on-chip RAM contents are retained. 2.9 Basic Timing 2.9.1 Overview The CPU is driven by a system clock, denoted by the symbol . The period from one rising edge of to the next is referred to as a "state." The memory cycle or bus cycle consists of one, two, or three states. Different methods are used to access on-chip memory, on-chip supporting modules, and the external address space. 2.9.2 On-Chip Memory (ROM, RAM) On-chip memory is accessed in one state. The data bus is 16 bits wide, permitting both byte and word transfer instruction. Figure 2-14 shows the on-chip memory access cycle. Figure 2-15 shows the pin states. Rev. 4.0, 03/03, page 70 of 1358 Bus cycle T1 f Internal address bus Address Internal read signal Read access Internal data bus Read data Internal write signal Write access Internal data bus Write data Figure 2-14 On-Chip Memory Access Cycle Bus cycle T1 f Address bus Unchanged AS High RD High HWR, LWR High Data bus High-impedance state Figure 2-15 Pin States during On-Chip Memory Access Rev. 4.0, 03/03, page 71 of 1358 2.9.3 On-Chip Supporting Module Access Timing The on-chip supporting modules are accessed in two states. The data bus is either 8 bits or 16 bits wide, depending on the particular internal I/O register being accessed. Figure 2-16 shows the access timing for the on-chip supporting modules. Figure 2-17 shows the pin states. Bus cycle T2 T1 f Internal address bus Address Internal read signal Read access Internal data bus Read data Internal write signal Write access Internal data bus Write data Figure 2-16 On-Chip Supporting Module Access Cycle Rev. 4.0, 03/03, page 72 of 1358 Bus cycle T1 T2 f Address bus Unchanged AS High RD High HWR, LWR High Data bus High-impedance state Figure 2-17 Pin States during On-Chip Supporting Module Access 2.9.4 External Address Space Access Timing The external address space is accessed with an 8-bit or 16-bit data bus width in a two-state or three-state bus cycle. In three-state access, wait states can be inserted. For further details, refer to section 6, Bus Controller. 2.10 Usage Note 2.10.1 TAS Instruction Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction. The TAS instruction is not generated by the Hitachi H8S and H8/300 Series C/C++ compilers. If the TAS instruction is used as a user-defined intrinsic function, ensure that only register ER0, ER1, ER4, or ER5 is used. Rev. 4.0, 03/03, page 73 of 1358 Rev. 4.0, 03/03, page 74 of 1358 Section 3 MCU Operating Modes 3.1 Overview 3.1.1 Operating Mode Selection (H8S/2328 F-ZTAT, H8S/2326 F-ZTAT) The H8S/2328 F-ZTAT and H8S/2326 F-ZTAT have eight operating modes (modes 4 to 7, 10, 11, 14 and 15). These modes are determined by the mode pin (MD2 to MD0) and flash write enable pin (FWE) settings. The CPU operating mode and initial bus width can be selected as shown in table 3-1. Table 3-1 lists the MCU operating modes. Table 3-1 MCU Operating Mode Selection (H8S/2328 F-ZTAT, H8S/2326 F-ZTAT) External Data Bus MCU CPU Operating Operating Description Mode FWE MD2 MD1 MD0 Mode On-Chip Initial ROM Value Max Value 1 -- -- 0 0 2 0 1 3 1 0 5 1 7 1 0 0 9 0 Advanced Expanded mode with on-chip ROM disabled 0 Expanded mode with on-chip ROM enabled 1 Single-chip mode 0 1 0 0 0 11 -- -- Disabled 16 bits 16 bits 8 bits 16 bits Enabled 8 bits 16 bits -- -- -- -- -- Advanced Boot mode Enabled 8 bits -- -- 1 1 13 15 -- 1 10 14 -- 0 1 6 12 -- 1 4 8 1 -- 16 bits -- -- -- -- 1 1 0 1 Advanced User program mode Enabled 8 bits -- 16 bits -- The CPU's architecture allows for 4 Gbytes of address space, but the H8S/2328 F-ZTAT and H8S/2326 F-ZTAT actually accesses a maximum of 16 Mbytes. Rev. 4.0, 03/03, page 75 of 1358 Modes 4 to 6 are externally expanded modes that allow access to external memory and peripheral devices. The external expansion modes allow switching between 8-bit and 16-bit bus modes. After program execution starts, an 8-bit or 16-bit address space can be set for each area, depending on the bus controller setting. If 16-bit access is selected for any one area, 16-bit bus mode is set; if 8-bit access is selected for all areas, 8-bit bus mode is set. Note that the functions of each pin depend on the operating mode. Modes 10, 11, 14, and 15 are boot modes and user program modes in which the flash memory can be programmed and erased. For details, see section 19, ROM. The H8S/2328 F-ZTAT and H8S/2326 F-ZTAT can only be used in modes 4 to 7, 10, 11, 14, and 15. This means that the flash write enable pin and mode pins must be set to select one of these modes. Do not change the inputs at the mode pins during operation. 3.1.2 Operating Mode Selection (Mask ROM and ROMless Versions, H8S/2329 F-ZTAT, and H8S/2326C F-ZTAT) The ROMless and mask ROM versions have four operating modes (modes 4 to 7). H8S/2329 F-ZTAT has six operating modes (modes 2 to 7). H8S/2326C F-ZTAT has seven operating modes (modes 1 to 7). The operating mode is determined by the mode pins (MD2 to MD0). The CPU operating mode, enabling or disabling of on-chip ROM, and the initial bus width setting can be selected as shown in table 3-2. Table 3-2 lists the MCU operating modes. Rev. 4.0, 03/03, page 76 of 1358 Table 3-2 MCU Operating Mode Selection (Mask ROM and ROMless Versions, H8S/2329 F-ZTAT, and H8S/2326C F-ZTAT) MCU CPU Operating Operating Description Mode MD2 MD1 MD0 Mode 1 1* 2 2* 0 0 1 1 0 2 3* 4 7 -- On-Chip Initial ROM Value Max. Value -- -- -- 1 1 0 5 6 -- External Data Bus 0 1 1 Advanced Expanded mode with Disabled 16 bits on-chip ROM disabled 8 bits 0 Expanded mode with on-chip ROM enabled 1 Single-chip mode Enabled 8 bits -- 16 bits 16 bits 16 bits -- Notes: *1 User boot mode in the H8S/2326C F-ZTAT. See table 19-73 in section 19.33, OnBoard Programming Modes, for information on H8S/2326C F-ZTAT user boot modes. *2 Boot mode in the H8S/2329 F-ZTAT, H8S/2326C F-ZTAT. See table 19-9 in section 19.6, On-Board Programming Modes, for information on H8S/2329 F-ZTAT user boot modes. See table 19-9 in section 19.6, On-Board Programming Modes, for information on H8S/2329 F-ZTAT user program modes. See table 19-73 in section 19.33, On-Board Programming Modes, for information on H8S/2326C F-ZTAT user program modes. See table 19-73 in section 19.33, On-Board Programming Modes, for information on H8S/2326C F-ZTAT user boot modes. The CPU's architecture allows for 4 Gbytes of address space, but the mask ROM and ROMless versions, H8S/2329 F-ZTAT, and H8S/2326C F-ZTAT actually access a maximum of 16 Mbytes. Modes 4 to 6 are externally expanded modes that allow access to external memory and peripheral devices. The external expansion modes allow switching between 8-bit and 16-bit bus modes. After program execution starts, an 8-bit or 16-bit address space can be set for each area, depending on the bus controller setting. If 16-bit access is selected for any one area, 16-bit bus mode is set; if 8-bit access is selected for all areas, 8-bit bus mode is set. Note that the functions of each pin depend on the operating mode. The ROMless and mask ROM versions can only be used in modes 4 to 7. This means that the mode pins must be set to select one of these modes. However, note that only mode 4 or 5 can be set for the ROMless version. H8S/2329 F-ZTAT can only be used in modes 2 to 7. This means that the mode pins must be set to select one of these modes. Rev. 4.0, 03/03, page 77 of 1358 H8S/2326C F-ZTAT can only be used in modes 1 to 7. This means that the mode pins must be set to select one of these modes. Do not change the inputs at the mode pins during operation. 3.1.3 Register Configuration The H8S/2329 and H8S/2328 Series have a mode control register (MDCR) that indicates the inputs at the mode pins (MD2 to MD0), and a system control register (SYSCR) and a system control register 2 (SYSCR2)*2 that control the operation of the chip. Table 3-3 summarizes these registers. Table 3-3 Registers 1 Name Abbreviation R/W Initial Value Address* Mode control register MDCR R Undefined H'FF3B System control register SYSCR R/W H'01 H'FF39 2 System control register 2* SYSCR2 R/W H'00 H'FF42 Notes: *1 Lower 16 bits of the address. *2 The SYSCR2 register can only be used in the F-ZTAT versions. In the mask ROM and ROMless versions this register will return an undefined value if read, and cannot be modified. 3.2 Register Descriptions 3.2.1 Mode Control Register (MDCR) Bit : 7 6 5 4 3 2 1 0 -- -- -- -- -- Initial value : 1 0 0 0 0 MDS2 --* MDS1 --* MDS0 --* R/W -- -- -- -- -- R R R : Note: * Determined by pins MD2 to MD0. MDCR is an 8-bit read-only register that indicates the current operating mode of the H8S/2329 and H8S/2328 Series chip. Bit 7--Reserved: This bit is always read as 1, and cannot be modified. Bits 6 to 3--Reserved: These bits are always read as 0, and cannot be modified. Bits 2 to 0--Mode Select 2 to 0 (MDS2 to MDS0): These bits indicate the input levels at pins MD2 to MD0 (the current operating mode). Bits MDS2 to MDS0 correspond to pins MD2 to MD0. Rev. 4.0, 03/03, page 78 of 1358 MDS2 to MDS0 are read-only bits, and cannot be written to. The mode pin (MD2 to MD0) input levels are latched into these bits when MDCR is read. These latches are canceled by a reset. 3.2.2 System Control Register (SYSCR) Bit : 7 6 5 4 3 -- -- INTM1 INTM0 NMIEG 0 0 0 0 0 0 0 1 R/W -- R/W R/W R/W R/W R/W R/W Initial value : R/W : 2 1 0 LWROD IRQPAS RAME Bit 7--Reserved: Only 0 should be written to this bit. Bit 6--Reserved: This bit is always read as 0, and cannot be modified. Bits 5 and 4--Interrupt Control Mode 1 and 0 (INTM1, INTM0): These bits select the control mode of the interrupt controller. For details of the interrupt control modes, see section 5.4.1, Interrupt Control Modes and Interrupt Operation. Bit 5 INTM1 Bit 4 INTM0 Interrupt Control Mode Description 0 0 0 Control of interrupts by I bit 1 -- Setting prohibited 0 2 Control of interrupts by I2 to I0 bits and IPR 1 -- Setting prohibited 1 (Initial value) Bit 3--NMI Edge Select (NMIEG): Selects the valid edge of the NMI interrupt input. Bit 3 NMIEG Description 0 An interrupt is requested at the falling edge of NMI input 1 An interrupt is requested at the rising edge of NMI input (Initial value) Bit 2--LWR Output Disable (LWROD): Enables or disables LWR output. Bit 2 LWROD Description 0 PF3 is designated as LWR output pin 1 PF3 is designated as I/O port, and does not function as LWR output pin (Initial value) Rev. 4.0, 03/03, page 79 of 1358 Bit 1--IRQ Port Switching Select (IRQPAS): Selects switching of input pins for IRQ4 to IRQ7. IRQ4 to IRQ7 input is always performed from one of the ports. Bit 1 IRQPAS Description 0 PA4 to PA7 are used for IRQ4 to IRQ7 input 1 P50 to P53 are used for IRQ4 to IRQ7 input (Initial value) Bit 0--RAM Enable (RAME): Enables or disables the on-chip RAM. The RAME bit is initialized when the reset state is released. It is not initialized in software standby mode. Bit 0 RAME Description 0 On-chip RAM is disabled 1 On-chip RAM is enabled 3.2.3 Bit (Initial value) System Control Register 2 (SYSCR2) (F-ZTAT Version Only) : 7 6 5 4 3 2 1 0 -- -- -- -- FLSHE -- -- -- Initial value : 0 0 0 0 0 0 0 0 R/W -- -- -- -- R/W -- -- -- (R/W)* : Note: * R/W in the H8S/2329 F-ZTAT and H8S/2326C F-ZTAT. SYSCR2 is an 8-bit readable/writable register that performs on-chip flash memory control. SYSCR2 is initialized to H'00 by a reset, and in hardware standby mode. Bits 7 to 4--Reserved: These bits are always read as 0, and cannot be modified. Bit 3--Flash Memory Control Register Enable (FLSHE): Controls CPU access to the flash memory control registers (FLMCR1, FLMCR2, EBR1, and EBR2 in the case of the H8S/2329 FZTAT, H8S/2328 F-ZTAT, and H8S/2326 F-ZTAT: FCCS, FPCS, FECS, FKEY, FMATS, and FTDAR in the case of the H8S/2326C F-ZTAT). For details, see section 19, ROM. Rev. 4.0, 03/03, page 80 of 1358 Bit 3 FLSHE Description 0 H8S/2329 F-ZTAT, H8S/2328 F-ZTAT, and H8S/2326 F-ZTAT * Flash control registers are not selected for addresses H'FFFFC8 to H'FFFFCB (Initial value) H8S/2326C F-ZTAT * Flash control registers are not selected for addresses H'FFFFC4 to H'FFFFCF 1 H8S/2329 F-ZTAT, H8S/2328 F-ZTAT, and H8S/2326 F-ZTAT * Flash control registers are not selected for addresses H'FFFFC8 to H'FFFFCB H8S/2326C F-ZTAT * Flash control registers are not selected for addresses H'FFFFC4 to H'FFFFCF Bits 2 and 1--Reserved: These bits are always read as 0. Only 0 should be written to these bits. Bit 0--Reserved: In the H8S/2328 F-ZTAT and H8S/2326 F-ZTAT, this bit is always read as 0 and should only be written with 0. In the H8S/2329 F-ZTAT and H8S/2326C F-ZTAT, this bit is reserved and should only be written with 0. 3.3 Operating Mode Descriptions 3.3.1 Mode 1 (H8S/2326C F-ZTAT Only) This is a flash memory user boot mode. See section 19, ROM, for details. This is the same as advanced single chip ROM mode, except when erasing and reprogramming flash memory. 3.3.2 Mode 2 (H8S/2329 F-ZTAT and H8S/2326C F-ZTAT Only) This is a flash memory boot mode. See section 19, ROM, for details. This is the same as advanced on-chip ROM enabled expansion mode, except when erasing and reprogramming flash memory. 3.3.3 Mode 3 (H8S/2329 F-ZTAT and H8S/2326C F-ZTAT Only) This is a flash memory boot mode. See section 19, ROM, for details. This is the same as advanced single-chip ROM mode, except when erasing and reprogramming flash memory. 3.3.4 Mode 4 (Expanded Mode with On-Chip ROM Disabled) The CPU can access a 16-Mbyte address space in advanced mode. The on-chip ROM is disabled. Ports A, B, and C function as an address bus, port D functions as a data bus, and part of port F carries bus control signals. Rev. 4.0, 03/03, page 81 of 1358 The initial bus mode after a reset is 16 bits, with 16-bit access to all areas. However, note that if 8bit access is designated by the bus controller for all areas, the bus mode switches to 8 bits. 3.3.5 Mode 5 (Expanded Mode with On-Chip ROM Disabled) The CPU can access a 16-Mbyte address space in advanced mode. The on-chip ROM is disabled. Ports A, B, and C function as an address bus, port D functions as a data bus, and part of port F carries bus control signals. The initial bus mode after a reset is 8 bits, with 8-bit access to all areas. However, note that if at least one area is designated for 16-bit access by the bus controller, the bus mode switches to 16 bits and port E becomes a data bus. 3.3.6 Mode 6 (Expanded Mode with On-Chip ROM Enabled) The CPU can access a 16-Mbyte address space in advanced mode. The on-chip ROM is enabled. Ports A, B, and C function as input ports immediately after a reset. These pins can be set to output addresses by setting the corresponding bits to 1 in pin function control register 1 (PFCR1) in the case of ports A and B, or in the data direction register (DDR) for port C. Port D functions as a data bus, and part of port F carries bus control signals. The initial bus mode after a reset is 8 bits, with 8-bit access to all areas. However, note that if at least one area is designated for 16-bit access by the bus controller, the bus mode switches to 16 bits and port E becomes a data bus. 3.3.7 Mode 7 (Single-Chip Mode) The CPU can access a 16-Mbyte address space in advanced mode. The on-chip ROM is enabled, but external addresses cannot be accessed. All I/O ports are available for use as input/output ports. 3.3.8 Modes 8 and 9 (H8S/2328 F-ZTAT and H8S/2326 F-ZTAT Only) Modes 8 and 9 are not supported and must not be set. 3.3.9 Mode 10 (H8S/2328 F-ZTAT and H8S/2326 F-ZTAT Only) This is a flash memory boot mode. For details, see section 19, ROM. Except for the fact that flash memory programming and erasing can be performed, operation in this mode is the same as in advanced expanded mode with on-chip ROM enabled. Rev. 4.0, 03/03, page 82 of 1358 3.3.10 Mode 11 (H8S/2328 F-ZTAT and H8S/2326 F-ZTAT Only) This is a flash memory boot mode. For details, see section 19, ROM. Except for the fact that flash memory programming and erasing can be performed, operation in this mode is the same as in advanced single-chip mode. 3.3.11 Modes 12 and 13 (H8S/2328 F-ZTAT and H8S/2326 F-ZTAT Only) Modes 12 and 13 are not supported and must not be set. 3.3.12 Mode 14 (H8S/2328 F-ZTAT and H8S/2326 F-ZTAT Only) This is a flash memory user program mode. For details, see section 19, ROM. Except for the fact that flash memory programming and erasing can be performed, operation in this mode is the same as in advanced expanded mode with on-chip ROM enabled. 3.3.13 Mode 15 (H8S/2328 F-ZTAT and H8S/2326 F-ZTAT Only) This is a flash memory user program mode. For details, see section 19, ROM. Except for the fact that flash memory programming and erasing can be performed, operation in this mode is the same as in advanced single-chip mode. Rev. 4.0, 03/03, page 83 of 1358 3.4 Pin Functions in Each Operating Mode The pin functions of ports A to F vary depending on the operating mode. Table 3-4 shows their functions in each operating mode. Table 3-4 Pin Functions in Each Mode Port Mode Mode Mode Mode Mode Mode Mode Mode Mode Mode Mode 5 4 4 2 2 3 3 3 3 1* 2* 3* 4 5 6* 7* 10* 11* 14* 15* Port PA7 to P A PA5 1 P* /A P PA4 to PA0 1 1 1 P* /A P* /A P* /A P A A 1 P* /A P 1 P* /A P Port B P 1 P* /A P A A 1 P* /A P 1 P* /A P 1 P* /A P Port C P 1 P* /A P A A 1 P* /A P 1 P* /A P 1 P* /A P Port D P D D D D D D Port E P 1 P* /D P Port PF7 F PF6 1 1 1 1 1 1 1 1 1 1 1 P* /C P/C* P* /C P/C* P/C* P/C* P* /C P/C* P* /C P/C* P* /C 1 1 1 1 1 1 P P/C* P P/C* P/C* P/C* P P/C* P P/C* P P 1 1 1 P/D* P* /D P* /D P PF5 to PF4 C C PF3 1 P/C* 1 P* /C 1 1 1 P/C* P/C* P/C* 1 1 1 P* /C P* /C P* /C PF2 to PF0 P C C P 1 P* /D P P 1 P* /D P C C 1 P/C* 1 P* /C 1 P/C* 1 P* /C Legend P: I/O port A: Address bus output D: Data bus I/O C: Control signals, clock I/O Notes: *1 After reset. *2 Setting is prohibited in the ROMless versions. *3 Setting prohibited except in case of the H8S/2328 F-ZTAT and H8S/2326 F-ZTAT. *4 Valid only in the H8S/2329 F-ZTAT and H8S/2326C F-ZTAT. *5 Valid only in the H8S/2326C F-ZTAT. Rev. 4.0, 03/03, page 84 of 1358 3.5 Memory Map in Each Operating Mode Figures 3-1 to 3-9 show memory maps for each of the operating modes. The address space is 16 Mbytes. The address space is divided into eight areas. Rev. 4.0, 03/03, page 85 of 1358 Mode 2 Boot Mode (advanced expanded mode with on-chip ROM enabled) H'000000 Mode 3 Boot Mode (advanced single-chip mode) H'000000 On-chip ROM H'010000 On-chip ROM H'010000 On-chip ROM/ external address space*1 H'060000 H'080000 H'FF7400 Reseved area*4 On-chip ROM/ reserved area*2 *5 H'060000 H'07FFFF Reseved area*4 H'FF7400 Reseved area*4 External address space Reseved area*4 H'FF7C00 H'FF7C00 On-chip RAM*3 On-chip RAM H'FFFBFF H'FFFC00 External address space H'FFFE50 Internal I/O registers H'FFFF08 External address space H'FFFF28 Internal I/O registers H'FFFFFF Notes: *1 *2 *3 *4 *5 H'FFFE50 H'FFFF07 Internal I/O registers H'FFFF28 H'FFFFFF Internal I/O registers External addresses when EAE = 1 in BCRL; on-chip ROM when EAE = 0. Reserved area when EAE = 1 in BCRL; on-chip ROM when EAE = 0. On-chip RAM is used for flash memory programming. Do not clear the RAME bit in SYSCR to 0. Access to the reserved areas H'060000 to H'07FFFF and H'FF7400 to H'FF7BFF is prohibited. Do not access a reserved area. Figure 3-1(a) H8S/2329 Memory Map in Each Operating Mode Rev. 4.0, 03/03, page 86 of 1358 Modes 4 and 5 (advanced expanded modes with on-chip ROM disabled) H'000000 Mode 6 (advanced expanded mode with on-chip ROM enabled) H'000000 Mode 7 (advanced single-chip mode) H'000000 On-chip ROM H'010000 H'080000 H'FF7400 Reseved area*4 External address space Reseved area*4 H'FF7C00 H'010000 On-chip ROM/ external address space*1 External address space H'060000 H'060000 H'080000 H'FF7400 Reseved area*4 On-chip ROM/ reserved area*2 *5 H'060000 H'07FFFF Reseved area*4 H'FF7400 Reseved area*4 External address space Reseved area*4 H'FF7C00 On-chip RAM*3 On-chip ROM H'FF7C00 On-chip RAM*3 On-chip RAM H'FFFBFF H'FFFC00 External address space H'FFFE50 Internal I/O registers H'FFFF08 External address space H'FFFF28 Internal I/O registers H'FFFFFF Notes: *1 *2 *3 *4 *5 H'FFFC00 External address space H'FFFE50 Internal I/O registers H'FFFF08 External address space H'FFFF28 Internal I/O registers H'FFFFFF H'FFFE50 H'FFFF07 Internal I/O registers H'FFFF28 H'FFFFFF Internal I/O registers External addresses when EAE = 1 in BCRL; on-chip ROM when EAE = 0. Reserved area when EAE = 1 in BCRL; on-chip ROM when EAE = 0. External addresses can be accessed by clearing the RAME bit in SYSCR to 0. Access to the reserved areas H'060000 to H'07FFFF and H'FF7400 to H'FF7BFF is prohibited. Do not access a reserved area. Figure 3-1(b) H8S/2329 Memory Map in Each Operating Mode Rev. 4.0, 03/03, page 87 of 1358 Modes 4 and 5 (advanced expanded modes with on-chip ROM disabled) H'000000 Mode 6 (advanced expanded mode with on-chip ROM enabled) H'000000 Mode 7 (advanced single-chip mode) H'000000 On-chip ROM External address space H'010000 On-chip ROM H'010000 On-chip ROM/ external address space*1 On-chip ROM/ reserved area*2 *4 H'03FFFF H'040000 H'FFDC00 External address space H'FFDC00 On-chip RAM*3 H'FFDC00 On-chip RAM*3 On-chip RAM H'FFFBFF H'FFFC00 External address space H'FFFE50 Internal I/O registers H'FFFF08 External address space H'FFFF28 Internal I/O registers H'FFFFFF Notes: *1 *2 *3 *4 H'FFFC00 External address space H'FFFE50 Internal I/O registers H'FFFF08 External address space H'FFFF28 Internal I/O registers H'FFFFFF H'FFFE50 H'FFFF07 Internal I/O registers H'FFFF28 H'FFFFFF Internal I/O registers External addresses when EAE = 1 in BCRL; on-chip ROM when EAE = 0. Reserved area when EAE = 1 in BCRL; on-chip ROM when EAE = 0. External addresses can be accessed by clearing the RAME bit in SYSCR to 0. Do not access a reserved area. Figure 3-2(a) H8S/2328 Memory Map in Each Operating Mode Rev. 4.0, 03/03, page 88 of 1358 Mode 10 Boot Mode (advanced expanded mode with on-chip ROM enabled) H'000000 Mode 11 Boot Mode (advanced single-chip mode) H'000000 On-chip ROM H'010000 On-chip ROM H'010000 On-chip ROM/ external address space*1 On-chip ROM/ reserved area*2 *4 H'03FFFF H'040000 External address space H'FFDC00 H'FFDC00 On-chip RAM*3 On-chip RAM*3 H'FFFBFF H'FFFC00 External address space H'FFFE50 Internal I/O registers H'FFFF08 External address space H'FFFF28 Internal I/O registers H'FFFFFF Notes: *1 *2 *3 *4 H'FFFE50 H'FFFF07 Internal I/O registers H'FFFF28 H'FFFFFF Internal I/O registers External addresses when EAE = 1 in BCRL; on-chip ROM when EAE = 0. Reserved area when EAE = 1 in BCRL; on-chip ROM when EAE = 0. On-chip RAM is used for flash memory programming. Do not clear the RAME bit in SYSCR to 0. Do not access a reserved area. Figure 3-2(b) H8S/2328 Memory Map in Each Operating Mode (F-ZTAT Only) Rev. 4.0, 03/03, page 89 of 1358 Mode 14 User Program Mode (advanced expanded mode with on-chip ROM enabled) Mode 15 User Program Mode (advanced single-chip mode) H'000000 H'000000 On-chip ROM H'010000 On-chip ROM H'010000 On-chip ROM/ external address space*1 On-chip ROM/ reserved area*2 *4 H'03FFFF H'040000 External address space H'FFDC00 H'FFDC00 On-chip RAM*3 On-chip RAM*3 H'FFFBFF H'FFFC00 External address space H'FFFE50 Internal I/O registers H'FFFF08 External address space H'FFFF28 Internal I/O registers H'FFFFFF Notes: *1 *2 *3 *4 H'FFFE50 H'FFFF07 Internal I/O registers H'FFFF28 H'FFFFFF Internal I/O registers External addresses when EAE = 1 in BCRL; on-chip ROM when EAE = 0. Reserved area when EAE = 1 in BCRL; on-chip ROM when EAE = 0. On-chip RAM is used for flash memory programming. Do not clear the RAME bit in SYSCR to 0. Do not access a reserved area. Figure 3-2(c) H8S/2328 Memory Map in Each Operating Mode(F-ZTAT Only) Rev. 4.0, 03/03, page 90 of 1358 Modes 4 and 5 (advanced expanded modes with on-chip ROM disabled) H'000000 Mode 6 (advanced expanded mode with on-chip ROM enabled) H'000000 Mode 7 (advanced single-chip mode) H'000000 On-chip ROM External address space H'010000 On-chip ROM H'010000 Reserved area*5/ on-chip ROM*3 External address space/on-chip ROM*1 H'020000 H'020000 External address space/reserved area*2 *5 Reserved area*5 H'03FFFF H'040000 H'FFDC00 External address space H'FFDC00 On-chip RAM*4 H'FFDC00 *4 On-chip RAM On-chip RAM H'FFFBFF H'FFFC00 External address space H'FFFE50 Internal I/O registers H'FFFF08 External address space H'FFFF28 Internal I/O registers H'FFFFFF Notes: *1 *2 *3 *4 *5 H'FFFC00 External address space H'FFFE50 Internal I/O registers H'FFFF08 External address space H'FFFF28 Internal I/O registers H'FFFFFF H'FFFE50 H'FFFF07 Internal I/O registers H'FFFF28 H'FFFFFF Internal I/O registers External addresses when EAE = 1 in BCRL; on-chip ROM when EAE = 0. External addresses when EAE = 1 in BCRL; reserved area when EAE = 0. Reserved area when EAE = 1 in BCRL; on-chip ROM when EAE = 0. External addresses can be accessed by clearing the RAME bit in SYSCR to 0. Do not access a reserved area. Figure 3-3 H8S/2327 Memory Map in Each Operating Mode Rev. 4.0, 03/03, page 91 of 1358 Modes 4 and 5 (advanced expanded modes with on-chip ROM disabled) H'000000 Mode 6 (advanced expanded mode with on-chip ROM enabled) H'000000 Mode 7 (advanced single-chip mode) H'000000 On-chip ROM On-chip ROM External address space H'010000 H'010000 On-chip ROM/ external address space*1 On-chip ROM/ reserved area*2 *4 H'07FFFF H'080000 H'FFDC00 External address space H'FFDC00 *3 On-chip RAM H'FFDC00 *3 On-chip RAM On-chip RAM H'FFFBFF H'FFFC00 External address space H'FFFE50 Internal I/O registers H'FFFF08 External address space H'FFFF28 Internal I/O registers H'FFFFFF Notes: *1 *2 *3 *4 H'FFFC00 External address space H'FFFE50 Internal I/O registers H'FFFF08 External address space H'FFFF28 Internal I/O registers H'FFFFFF H'FFFE50 H'FFFF07 Internal I/O registers H'FFFF28 H'FFFFFF Internal I/O registers External addresses when EAE = 1 in BCRL; on-chip ROM when EAE = 0. Reserved area when EAE = 1 in BCRL; on-chip ROM when EAE = 0. External addresses can be accessed by clearing the RAME bit in SYSCR to 0. Do not access a reserved area. Figure 3-4(a) H8S/2326 F-ZTAT Memory Map in Each Operating Mode Rev. 4.0, 03/03, page 92 of 1358 Mode 10 Boot Mode (advanced expanded mode with on-chip ROM enabled) H'000000 Mode 11 Boot Mode (advanced single-chip mode) H'000000 On-chip ROM H'010000 On-chip ROM H'010000 On-chip ROM/ external address space*1 On-chip ROM/ reserved area*2 *4 H'07FFFF H'080000 External address space H'FFDC00 H'FFDC00 On-chip RAM*3 On-chip RAM*3 H'FFFBFF H'FFFC00 External address space H'FFFE50 Internal I/O registers H'FFFF08 External address space H'FFFF28 Internal I/O registers H'FFFFFF Notes: *1 *2 *3 *4 H'FFFE50 H'FFFF07 Internal I/O registers H'FFFF28 H'FFFFFF Internal I/O registers External addresses when EAE = 1 in BCRL; on-chip ROM when EAE = 0. Reserved area when EAE = 1 in BCRL; on-chip ROM when EAE = 0. On-chip RAM is used for flash memory programming. Do not clear the RAME bit in SYSCR to 0. Do not access a reserved area. Figure 3-4(b) H8S/2326 F-ZTAT Memory Map in Each Operating Mode Rev. 4.0, 03/03, page 93 of 1358 Mode 14 User Program Mode (advanced expanded mode with on-chip ROM enabled) Mode 15 User Program Mode (advanced single-chip mode) H'000000 H'000000 On-chip ROM H'010000 On-chip ROM H'010000 On-chip ROM/ external address space*1 On-chip ROM/ reserved area*2 *4 H'07FFFF H'080000 External address space H'FFDC00 H'FFDC00 On-chip RAM*3 On-chip RAM*3 H'FFFBFF H'FFFC00 External address space H'FFFE50 Internal I/O registers H'FFFF08 External address space H'FFFF28 Internal I/O registers H'FFFFFF Notes: *1 *2 *3 *4 H'FFFE50 H'FFFF07 Internal I/O registers H'FFFF28 H'FFFFFF Internal I/O registers External addresses when EAE = 1 in BCRL; on-chip ROM when EAE = 0. Reserved area when EAE = 1 in BCRL; on-chip ROM when EAE = 0. On-chip RAM is used for flash memory programming. Do not clear the RAME bit in SYSCR to 0. Do not access a reserved area. Figure 3-4(c) H8S/2326 F-ZTAT Memory Map in Each Operating Mode Rev. 4.0, 03/03, page 94 of 1358 Mode 1 User Boot Mode (advanced single-chip mode) H'000000 Mode 2 Boot Mode (advanced expanded mode with on-chip ROM enabled) H'000000 H'000000 On-chip ROM H'010000 H'010000 On-chip ROM/ external address space*1 On-chip ROM/ reserved area*2*4 Reseved area*4 On-chip ROM/ reserved area*2*4 H'080000 H'080000 H'0FFFFF On-chip ROM On-chip ROM H'010000 H'080000 Mode 3 Boot Mode (advanced single-chip mode) Reseved area*4 Reseved area*4 H'0FFFFF H'100000 External address space H'FF7400 H'FFBC00 H'FFFBFF Reseved area*4 On-chip RAM*3 H'FFFE50 H'FFFF07 Internal I/O registers H'FFFF28 H'FFFFFF Internal I/O registers Notes: *1 *2 *3 *4 H'FF7400 H'FFBC00 Reseved area*4 On-chip RAM*3 H'FFFC00 External address space H'FFFE50 Internal I/O registers H'FFFF08 External address space H'FFFF28 Internal I/O registers H'FFFFFF H'FF7400 H'FFBC00 H'FFFBFF Reseved area*4 On-chip RAM*3 H'FFFE50 H'FFFF07 Internal I/O registers H'FFFF28 H'FFFFFF Internal I/O registers External addresses when EAE = 1 in BCRL; on-chip ROM when EAE = 0. Reserved area when EAE = 1 in BCRL; on-chip ROM when EAE = 0. On-chip RAM is used for flash memory programming. Do not clear the RAME bit in SYSCR to 0. Do not access a reserved area. Figure 3-5(a) H8S/2326C F-ZTAT Address Map in Each Operating Mode Rev. 4.0, 03/03, page 95 of 1358 Modes 4 and 5 (advanced expanded modes with on-chip ROM disabled) H'000000 Mode 6 (advanced expanded mode with on-chip ROM enabled) Mode 7 (advanced single-chip mode) H'000000 H'000000 On-chip ROM On-chip ROM H'010000 H'010000 On-chip ROM/ external address space*1 External address space On-chip ROM/ reserved area*2 *4 H'080000 H'080000 Reseved area*4 Reseved area*4 H'0FFFFF H'100000 External address space H'FF7400 H'FFBC00 Reseved area*4 On-chip RAM*3 H'FFFC00 External address space H'FFFE50 Internal I/O registers H'FFFF08 External address space H'FFFF28 Internal I/O registers H'FFFFFF Notes: *1 *2 *3 *4 H'FF7400 H'FFBC00 Reseved area*4 On-chip RAM*3 H'FFFC00 External address space H'FFFE50 Internal I/O registers H'FFFF08 External address space H'FFFF28 Internal I/O registers H'FFFFFF H'FF7400 H'FFBC00 H'FFFBFF Reseved area*4 On-chip RAM*3 H'FFFE50 H'FFFF07 Internal I/O registers H'FFFF28 H'FFFFFF Internal I/O registers External addresses when EAE = 1 in BCRL; on-chip ROM when EAE = 0. Reserved area when EAE = 1 in BCRL; on-chip ROM when EAE = 0. External addresses can be accessed by clearing the RAME bit in SYSCR to 0. Do not access a reserved area. Figure 3-5(b) H8S/2326C F-ZTAT Address Map in Each Operating Mode Rev. 4.0, 03/03, page 96 of 1358 Modes 4 and 5 (advanced expanded modes with on-chip ROM disabled) H'000000 External address space H'FF7C00 On-chip RAM* H'FFFC00 External address space H'FFFE50 Internal I/O registers H'FFFF08 External address space H'FFFF28 Internal I/O registers H'FFFFFF Note: * External addresses can be accessed by clearing the RAME bit in SYSCR to 0. Figure 3-6 H8S/2324S Memory Map in Each Operating Mode Rev. 4.0, 03/03, page 97 of 1358 Modes 4 and 5 (advanced expanded modes with on-chip ROM disabled) H'000000 Mode 6 (advanced expanded mode with on-chip ROM enabled) H'000000 Mode 7 (advanced single-chip mode) H'000000 On-chip ROM On-chip ROM H'008000 H'008000 Reserved area*3 External address space H'010000 Reserved area*3 H'010000 External address space/reserved area*1 *3 Reserved area*3 H'03FFFF H'040000 H'FFDC00 External address space H'FFDC00 On-chip RAM *2 H'FFDC00 On-chip RAM *2 On-chip RAM H'FFFBFF H'FFFC00 External address space H'FFFE50 Internal I/O registers H'FFFF08 External address space H'FFFF28 Internal I/O registers H'FFFFFF H'FFFC00 External address space H'FFFE50 Internal I/O registers H'FFFF08 External address space H'FFFF28 Internal I/O registers H'FFFFFF H'FFFE50 H'FFFF07 Internal I/O registers H'FFFF28 H'FFFFFF Internal I/O registers Notes: *1 External addresses when EAE = 1 in BCRL; reserved area when EAE = 0. *2 External addresses can be accessed by clearing the RAME bit in SYSCR to 0. *3 Do not access a reserved area. Figure 3-7 H8S/2323 Memory Map in Each Operating Mode Rev. 4.0, 03/03, page 98 of 1358 Modes 4 and 5 (advanced expanded modes with on-chip ROM disabled) H'000000 External address space H'FFDC00 On-chip RAM* H'FFFC00 External address space H'FFFE50 Internal I/O registers H'FFFF08 External address space H'FFFF28 Internal I/O registers H'FFFFFF Note: * External addresses can be accessed by clearing the RAME bit in SYSCR to 0. Figure 3-8 H8S/2322R Memory Map in Each Operating Mode Rev. 4.0, 03/03, page 99 of 1358 Modes 4 and 5 (advanced expanded modes with on-chip ROM disabled) H'000000 External address space H'FFDC00 H'FFEC00 Reserved area On-chip RAM* H'FFFC00 External address space H'FFFE50 Internal I/O registers H'FFFF08 External address space H'FFFF28 Internal I/O registers H'FFFFFF Note: * External addresses can be accessed by clearing the RAME bit in SYSCR to 0. Figure 3-9 H8S/2320 and H8S/2321 Memory Map in Each Operating Mode Rev. 4.0, 03/03, page 100 of 1358 Section 4 Exception Handling 4.1 Overview 4.1.1 Exception Handling Types and Priority As table 4-1 indicates, exception handling may be caused by a reset, trap instruction, or interrupt. Exception handling is prioritized as shown in table 4-1. If two or more exceptions occur simultaneously, they are accepted and processed in order of priority. Trap instruction exceptions are accepted at all times in the program execution state. Exception handling sources, the stack structure, and the operation of the CPU vary depending on the interrupt control mode set by the INTM0 and INTM1 bits of SYSCR. Table 4-1 Exception Types and Priority Priority Exception Type Start of Exception Handling High Reset Starts immediately after a low-to-high transition at the RES pin, or when the watchdog timer overflows. 1 Low Trace* Starts when execution of the current instruction or exception handling ends, if the trace (T) bit is set to 1 Interrupt Starts when execution of the current instruction or exception handling ends, if an interrupt request has been 2 issued* 3 Trap instruction (TRAPA) * Started by execution of a trap instruction (TRAPA) Notes: *1 Traces are enabled only in interrupt control mode 2. Trace exception handling is not executed after execution of an RTE instruction. *2 Interrupt detection is not performed on completion of ANDC, ORC, XORC, or LDC instruction execution, or on completion of reset exception handling. *3 Trap instruction exception handling requests are accepted at all times in the program execution state. Rev. 4.0, 03/03, page 101 of 1358 4.1.2 Exception Handling Operation Exceptions originate from various sources. Trap instructions and interrupts are handled as follows: 1. The program counter (PC), condition code register (CCR), and extend register (EXR) are pushed onto the stack. 2. The interrupt mask bits are updated. The T bit is cleared to 0. 3. A vector address corresponding to the exception source is generated, and program execution starts from that address. For a reset exception, steps 2 and 3 above are carried out. 4.1.3 Exception Vector Table The exception sources are classified as shown in figure 4-1. Different vector addresses are assigned to different exception sources. Table 4-2 lists the exception sources and their vector addresses. Reset Trace Exception sources External interrupts: NMI, IRQ7 to IRQ0 Interrupts Internal interrupts: interrupts from on-chip supporting modules Trap instruction Figure 4-1 Exception Sources In modes 6 and 7, the on-chip ROM available for use after a power-on reset is the 64-kbyte area comprising addresses H'000000 to H'00FFFF. Care is required when setting vector addresses. In this case, clearing the EAE bit in BCRL enables the 256-kbyte (128 kbytes/384 kbytes/512 kbytes)* area comprising addresses H'000000 to H'03FFFF (to H'01FFFF/H'05FFFF/H'07FFFF) to be used. For details, see section 6.2.5, Bus Control Register L (BCRL). Note: * The amount of on-chip ROM differs depending on the product. Rev. 4.0, 03/03, page 102 of 1358 Table 4-2 Exception Vector Table 1 Vector Address* Exception Source Vector Number Advanced Mode Reset 0 H'0000 to H'0003 Reserved 1 H'0004 to H'0007 Reserved for system use 2 H'0008 to H'000B 3 H'000C to H'000F 4 H'0010 to H'0013 Trace 5 H'0014 to H'0017 Reserved for system use 6 H'0018 to H'001B External interrupt 7 H'001C to H'001F 8 H'0020 to H'0023 9 H'0024 to H'0027 10 H'0028 to H'002B 11 H'002C to H'002F 12 H'0030 to H'0033 13 H'0034 to H'0037 14 H'0038 to H'003B 15 H'003C to H'003F IRQ0 16 H'0040 to H'0043 IRQ1 17 H'0044 to H'0047 IRQ2 18 H'0048 to H'004B IRQ3 19 H'004C to H'004F IRQ4 20 H'0050 to H'0053 IRQ5 21 H'0054 to H'0057 IRQ6 22 H'0058 to H'005B IRQ7 23 H'005C to H'005F 24 91 H'0060 to H'0063 H'016C to H'016F NMI Trap instruction (4 sources) Reserved for system use External interrupt 2 Internal interrupt* Notes: *1 Lower 16 bits of the address. *2 For details of internal interrupt vectors, see section 5.3.3, Interrupt Exception Vector Table. Rev. 4.0, 03/03, page 103 of 1358 4.2 Reset 4.2.1 Overview A reset has the highest exception priority. When the RES pin goes low, all processing halts and the chip enters the reset state. A reset initializes the internal state of the CPU and the registers of on-chip supporting modules. Immediately after a reset, interrupt control mode 0 is set. Reset exception handling begins when the RES pin changes from low to high. A reset can also be caused by watchdog timer overflow. For details see section 13, Watchdog Timer. 4.2.2 Reset Sequence The chip enters the reset state when the RES pin goes low. To ensure that the chip is reset, hold the RES pin low for at least 20 ms at power-up. To reset the chip during operation, hold the RES pin low for at least 20 states. When the RES pin goes high after being held low for the necessary time, the chip starts reset exception handling as follows: 1. The internal state of the CPU and the registers of the on-chip supporting modules are initialized, the T bit is cleared to 0 in EXR, and the I bit is set to 1 in EXR and CCR. 2. The reset exception vector address is read and transferred to the PC, and program execution starts from the address indicated by the PC. Figure 4-2 shows an example of the reset sequence. Rev. 4.0, 03/03, page 104 of 1358 Vector fetch f Internal Prefetch of first processing program instruction * * * (1) (3) (5) RES Address bus RD HWR, LWR High (2) D15 to D0 (1), (3) (2), (4) (5) (6) (4) (6) Reset exception handling vector address ((1) = H'000000, (3) = H'000002) Start address (contents of reset exception vector address) Start address ((5) = (2), (4)) First program instruction Note: * 3 program wait states are inserted. Figure 4-2 Reset Sequence (Mode 4) 4.2.3 Interrupts after Reset If an interrupt is accepted after a reset but before the stack pointer (SP) is initialized, the PC and CCR will not be saved correctly, leading to a program crash. To prevent this, all interrupt requests, including NMI, are disabled immediately after a reset. Since the first instruction of a program is always executed immediately after the reset state ends, make sure that this instruction initializes the stack pointer (example: MOV.L #xx:32, SP). 4.2.4 State of On-Chip Supporting Modules after Reset Release After reset release, MSTPCR is initialized to H'3FFF and all modules except the DMAC* and DTC enter module stop mode. Consequently, on-chip supporting module registers cannot be read or written to. Register reading and writing is enabled when module stop mode is exited. Note: * The DMAC is not supported in the H8S/2321. Rev. 4.0, 03/03, page 105 of 1358 4.3 Traces Traces are enabled in interrupt control mode 2. Trace mode is not activated in interrupt control mode 0, irrespective of the state of the T bit. For details of interrupt control modes, see section 5, Interrupt Controller. If the T bit in EXR is set to 1, trace mode is activated. In trace mode, a trace exception occurs on completion of each instruction. Trace mode is canceled by clearing the T bit in EXR to 0. It is not affected by interrupt masking. Table 4-3 shows the state of CCR and EXR after execution of trace exception handling. Interrupts are accepted even within the trace exception handling routine. The T bit saved on the stack retains its value of 1, and when control is returned from the trace exception handling routine by the RTE instruction, trace mode resumes. Trace exception handling is not carried out after execution of the RTE instruction. Table 4-3 Status of CCR and EXR after Trace Exception Handling CCR Interrupt Control Mode I 0 2 UI EXR I2 to I0 T Trace exception handling cannot be used. 1 Legend 1: Set to 1 0: Cleared to 0 --: Retains value prior to execution. Rev. 4.0, 03/03, page 106 of 1358 -- -- 0 4.4 Interrupts Interrupt exception handling can be requested by nine external sources (NMI, IRQ7 to IRQ0) and 52 internal sources in the on-chip supporting modules. Figure 4-3 classifies the interrupt sources and the number of interrupts of each type. The on-chip supporting modules that can request interrupts include the watchdog timer (WDT), refresh timer*, 16-bit timer-pulse unit (TPU), 8-bit timer, serial communication interface (SCI), data transfer controller (DTC), DMA controller (DMAC)*, and A/D converter. Each interrupt source has a separate vector address. NMI is the highest-priority interrupt. Interrupts are controlled by the interrupt controller. The interrupt controller has two interrupt control modes and can assign interrupts other than NMI to eight priority/mask levels to enable multiplexed interrupt control. For details of interrupts, see section 5, Interrupt Controller. Note: * The refresh timer and DMAC are not supported in the H8S/2321. External interrupts Interrupts Internal interrupts NMI (1) IRQ7 to IRQ0 (8) WDT*1 (1) Refresh timer*2 *3 (1) TPU (26) 8-bit timer (6) SCI (12) DTC (1) DMAC (4)*3 A/D converter (1) Notes: Numbers in parentheses are the numbers of interrupt sources. *1 When the watchdog timer is used as an interval timer, it generates an interrupt request at each counter overflow. *2 When the refresh timer is used as an interval timer, it generates an interrupt request at each compare match. *3 The refresh timer and DMAC are not supported in the H8S/2321. Figure 4-3 Interrupt Sources and Number of Interrupts Rev. 4.0, 03/03, page 107 of 1358 4.5 Trap Instruction Trap instruction exception handling starts when a TRAPA instruction is executed. Trap instruction exception handling can be executed at all times in the program execution state. The TRAPA instruction fetches a start address from a vector table entry corresponding to a vector number from 0 to 3, as specified in the instruction code. Table 4-4 shows the status of CCR and EXR after execution of trap instruction exception handling. Table 4-4 Status of CCR and EXR after Trap Instruction Exception Handling CCR Interrupt Control Mode I 0 1 2 1 Legend 1: Set to 1 0: Cleared to 0 --: Retains value prior to execution. 4.6 EXR UI I2 to I0 T -- -- -- -- -- 0 Stack Status after Exception Handling Figure 4-4 shows the stack after completion of trap instruction exception handling and interrupt exception handling. SP SP CCR EXR Reserved* CCR PC (24bits) PC (24bits) (a) Interrupt control mode 0 (b) Interrupt control mode 2 Note: * Ignored on return. Figure 4-4 Stack Status after Exception Handling (Advanced Modes) Rev. 4.0, 03/03, page 108 of 1358 4.7 Notes on Use of the Stack When accessing word data or longword data, the chip assumes that the lowest address bit is 0. The stack should always be accessed by word transfer instruction or longword transfer instruction, and the value of the stack pointer (SP, ER7) should always be kept even. Use the following instructions to save registers: PUSH.W Rn (or MOV.W Rn, @-SP) PUSH.L ERn (or MOV.L ERn, @-SP) Use the following instructions to restore registers: POP.W Rn (or MOV.W @SP+, Rn) POP.L ERn (or MOV.L @SP+, ERn) Setting SP to an odd value may lead to a malfunction. Figure 4-5 shows an example of what happens when the SP value is odd. CCR SP R1L SP PC PC H'FFFEFA H'FFFEFB H'FFFEFC H'FFFEFD SP TRAP instruction executed MOV.B R1L, @ ER7 SP set to H'FFFEFF Data saved above SP Contents of CCR lost Legend CCR: Condition code register PC: Program counter R1L: General register R1L SP: Stack pointer Note: This diagram illustrates an example in which the interrupt control mode is 0, in advanced mode. Figure 4-5 Operation when SP Value is Odd Rev. 4.0, 03/03, page 109 of 1358 Rev. 4.0, 03/03, page 110 of 1358 Section 5 Interrupt Controller 5.1 Overview 5.1.1 Features The chip controls interrupts by means of an interrupt controller. The interrupt controller has the following features. This chapter assumes the maximum number of interrupt sources available in these series--nine external interrupts and 52 internal interrupts. * Two interrupt control modes Either of two interrupt control modes can be set by means of the INTM1 and INTM0 bits in the system control register (SYSCR) * Priorities settable with IPRs Interrupt priority registers (IPRs) are provided for setting interrupt priorities. Eight priority levels can be set for each module for all interrupts except NMI NMI is assigned the highest priority level of 8, and can be accepted at all times * Independent vector addresses All interrupt sources are assigned independent vector addresses, making it unnecessary for the source to be identified in the interrupt handling routine * Nine external interrupt pins NMI is the highest-priority interrupt, and is accepted at all times. Rising edge or falling edge can be selected for NMI Falling edge, rising edge, or both edge detection, or level sensing, can be selected for IRQ7 to IRQ0 * DTC and DMAC* control DTC and DMAC* activation is controlled by means of interrupts Note: * The DMAC is not supported in the H8S/2321. Rev. 4.0, 03/03, page 111 of 1358 5.1.2 Block Diagram A block diagram of the interrupt controller is shown in figure 5-1. CPU INTM1 INTM0 SYSCR NMIEG NMI input NMI input unit IRQ input IRQ input unit ISR ISCR IER Interrupt request Vector number Priority determination I Internal interrupt request SWDTEND to TEI I2 to I0 IPR Interrupt controller Legend ISCR IER ISR IPR SYSCR : IRQ sense control register : IRQ enable register : IRQ status register : Interrupt priority register : System control register Figure 5-1 Block Diagram of Interrupt Controller Rev. 4.0, 03/03, page 112 of 1358 CCR EXR 5.1.3 Pin Configuration Table 5-1 summarizes the pins of the interrupt controller. Table 5-1 Interrupt Controller Pins Name Symbol I/O Function Nonmaskable interrupt NMI Input Nonmaskable external interrupt; rising or falling edge can be selected External interrupt requests 7 to 0 IRQ7 to IRQ0 Input 5.1.4 Maskable external interrupts; rising, falling, or both edges, or level sensing, can be selected Register Configuration Table 5-2 summarizes the registers of the interrupt controller. Table 5-2 Interrupt Controller Registers Name Abbreviation R/W Initial Value 1 Address* System control register SYSCR R/W H'01 H'FF39 IRQ sense control register H ISCRH R/W H'00 H'FF2C IRQ sense control register L ISCRL R/W H'00 H'FF2D IRQ enable register IER R/W H'00 H'FF2E H'00 H'FF2F *2 IRQ status register ISR R/(W) Interrupt priority register A IPRA R/W H'77 H'FEC4 Interrupt priority register B IPRB R/W H'77 H'FEC5 Interrupt priority register C IPRC R/W H'77 H'FEC6 Interrupt priority register D IPRD R/W H'77 H'FEC7 Interrupt priority register E IPRE R/W H'77 H'FEC8 Interrupt priority register F IPRF R/W H'77 H'FEC9 Interrupt priority register G IPRG R/W H'77 H'FECA Interrupt priority register H IPRH R/W H'77 H'FECB Interrupt priority register I IPRI R/W H'77 H'FECC Interrupt priority register J IPRJ R/W H'77 H'FECD Interrupt priority register K IPRK R/W H'77 H'FECE Notes: *1 Lower 16 bits of the address. *2 Can only be written with 0 for flag clearing. Rev. 4.0, 03/03, page 113 of 1358 5.2 Register Descriptions 5.2.1 System Control Register (SYSCR) Bit : Initial value : R/W : 7 6 5 4 3 -- -- INTM1 INTM0 NMIEG 2 1 0 LWROD IRQPAS RAME 0 0 0 0 0 0 0 1 R/W -- R/W R/W R/W R/W R/W R/W SYSCR is an 8-bit readable/writable register that selects the interrupt control mode, and the detected edge for NMI. Only bits 5 to 3 are described here; for details of the other bits, see section 3, MCU Operating Modes. SYSCR is initialized to H'01 by a reset and in hardware standby mode. It is not initialized in software standby mode. Bits 5 and 4--Interrupt Control Mode 1 and 0 (INTM1, INTM0): These bits select one of two interrupt control modes for the interrupt controller. Bit 5 INTM1 Bit 4 INTM0 Interrupt Control Mode Description 0 0 0 Interrupts are controlled by I bit 1 -- Setting prohibited 0 2 Interrupts are controlled by bits I2 to I0, and IPR 1 -- Setting prohibited 1 (Initial value) Bit 3--NMI Edge Select (NMIEG): Selects the input edge for the NMI pin. Bit 3 NMIEG Description 0 Interrupt request generated at falling edge of NMI input 1 Interrupt request generated at rising edge of NMI input (Initial value) Bit 1--IRQ Input Pin Select (IRQPAS): Selects switching of the pins that can be used for input of IRQ4 to IRQ7. IRQ4 to IRQ7 input is always performed from one of the ports. Rev. 4.0, 03/03, page 114 of 1358 5.2.2 Interrupt Priority Registers A to K (IPRA to IPRK) Bit : 7 6 5 4 3 2 1 0 -- IPR6 IPR5 IPR4 -- IPR2 IPR1 IPR0 Initial value : 0 1 1 1 0 1 1 1 R/W -- R/W R/W R/W -- R/W R/W R/W : The IPR registers are eleven 8-bit readable/writable registers that set priorities (levels 7 to 0) for interrupts other than NMI. The correspondence between IPR settings and interrupt sources is shown in table 5-3. The IPR registers set a priority (levels 7 to 0) for each interrupt source other than NMI. The IPR registers are initialized to H'77 by a reset and in hardware standby mode. Bits 7 and 3--Reserved: Read-only bits, always read as 0. Table 5-3 Correspondence between Interrupt Sources and IPR Settings Bits Register 6 to 4 2 to 0 IPRA IRQ0 IRQ1 IPRB IRQ2 IRQ3 IRQ4 IRQ5 IPRC IRQ6 IRQ7 DTC IPRD Refresh timer IPRE Watchdog timer 1 --* A/D converter IPRF TPU channel 0 TPU channel 1 IPRG TPU channel 2 TPU channel 3 IPRH TPU channel 4 TPU channel 5 IPRI 8-bit timer channel 1 IPRJ 8-bit timer channel 0 2 DMAC* SCI channel 0 IPRK SCI channel 1 SCI channel 2 Notes: *1 Reserved bits. *2 The refresh timer and DMAC are not supported in the H8S/2321. Rev. 4.0, 03/03, page 115 of 1358 As shown in table 5-3, multiple interrupts are assigned to one IPR. Setting a value in the range from H'0 to H'7 in the 3-bit groups of bits 6 to 4 and 2 to 0 sets the priority of the corresponding interrupt. The lowest priority level, level 0, is assigned by setting H'0, and the highest priority level, level 7, by setting H'7. When interrupt requests are generated, the highest-priority interrupt according to the priority levels set in the IPR registers is selected. This interrupt level is then compared with the interrupt mask level set by the interrupt mask bits (I2 to I0) in the extend register (EXR) in the CPU, and if the priority level of the interrupt is higher than the set mask level, an interrupt request is issued to the CPU. 5.2.3 Bit IRQ Enable Register (IER) : Initial value : R/W : 7 6 5 4 3 2 1 0 IRQ7E IRQ6E IRQ5E IRQ4E IRQ3E IRQ2E IRQ1E IRQ0E 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W IER is an 8-bit readable/writable register that controls enabling and disabling of interrupt requests IRQ7 to IRQ0. IER is initialized to H'00 by a reset and in hardware standby mode. Bits 7 to 0--IRQ7 to IRQ0 Enable (IRQ7E to IRQ0E): These bits select whether IRQ7 to IRQ0 are enabled or disabled. Bit n IRQnE Description 0 IRQn interrupts disabled 1 IRQn interrupts enabled (Initial value) (n = 7 to 0) Rev. 4.0, 03/03, page 116 of 1358 5.2.4 IRQ Sense Control Registers H and L (ISCRH, ISCRL) ISCRH Bit : 15 14 13 12 11 10 9 8 IRQ7SCB IRQ7SCA IRQ6SCB IRQ6SCA IRQ5SCB IRQ5SCA IRQ4SCB IRQ4SCA Initial value : R/W 0 0 0 0 0 0 0 0 : R/W R/W R/W R/W R/W R/W R/W R/W : 7 6 5 4 3 2 1 0 ISCRL Bit IRQ3SCB IRQ3SCA IRQ2SCB IRQ2SCA IRQ1SCB IRQ1SCA IRQ0SCB IRQ0SCA Initial value : R/W : 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W ISCR (composed of ISCRH and ISCRL) is a 16-bit readable/writable register that selects rising edge, falling edge, or both edge detection, or level sensing, for the input at pins IRQ7 to IRQ0. ISCR is initialized to H'0000 by a reset and in hardware standby mode. Bits 15 to 0--IRQ7 Sense Control A and B (IRQ7SCA, IRQ7SCB) to IRQ0 Sense Control A and B (IRQ0SCA, IRQ0SCB) Bits 15 to 0 IRQ7SCB to IRQ0SCB IRQ7SCA to IRQ0SCA 0 0 Interrupt request generated at IRQ7 to IRQ0 input low level (Initial value) 1 Interrupt request generated at falling edge of IRQ7 to IRQ0 input 1 Description 0 Interrupt request generated at rising edge of IRQ7 to IRQ0 input 1 Interrupt request generated at both falling and rising edges of IRQ7 to IRQ0 input Rev. 4.0, 03/03, page 117 of 1358 5.2.5 Bit IRQ Status Register (ISR) : Initial value : R/W : 7 6 5 4 3 2 1 0 IRQ7F IRQ6F IRQ5F IRQ4F IRQ3F IRQ2F IRQ1F IRQ0F 0 0 0 0 0 0 0 0 R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* Note: * Only 0 can be written, to clear the flag. ISR is an 8-bit readable/writable register that indicates the status of IRQ7 to IRQ0 interrupt requests. ISR is initialized to H'00 by a reset and in hardware standby mode. Bits 7 to 0--IRQ7 to IRQ0 flags (IRQ7F to IRQ0F): These bits indicate the status of IRQ7 to IRQ0 interrupt requests. Bit n IRQnF Description 0 [Clearing conditions] (Initial value) * Cleared by reading IRQnF flag when IRQnF = 1, then writing 0 to IRQnF flag * When interrupt exception handling is executed when low-level detection is set (IRQnSCB = IRQnSCA = 0) and IRQn input is high * When IRQn interrupt exception handling is executed when falling, rising, or both-edge detection is set (IRQnSCB = 1 or IRQnSCA = 1) * When the DTC is activated by an IRQn interrupt, and the DISEL bit in MRB of the DTC is cleared to 0 1 [Setting conditions] * When IRQn input goes low when low-level detection is set (IRQnSCB = IRQnSCA = 0) * When a falling edge occurs in IRQn input when falling edge detection is set (IRQnSCB = 0, IRQnSCA = 1) * When a rising edge occurs in IRQn input when rising edge detection is set (IRQnSCB = 1, IRQnSCA = 0) * When a falling or rising edge occurs in IRQn input when both-edge detection is set (IRQnSCB = IRQnSCA = 1) (n = 7 to 0) Rev. 4.0, 03/03, page 118 of 1358 5.3 Interrupt Sources Interrupt sources comprise external interrupts (NMI and IRQ7 to IRQ0) and internal interrupts (52 sources). 5.3.1 External Interrupts There are nine external interrupts: NMI and IRQ7 to IRQ0. NMI and IRQ7 to IRQ0 can be used to restore the chip from software standby mode. (IRQ7 to IRQ3 can be designated for use as software standby mode clearing sources by setting the IRQ37S bit in SBYCR to 1.) NMI Interrupt: NMI is the highest-priority interrupt, and is always accepted by the CPU regardless of the status of the CPU interrupt mask bits. The NMIEG bit in SYSCR can be used to select whether an interrupt is requested at a rising edge or a falling edge on the NMI pin. The vector number for NMI interrupt exception handling is 7. IRQ7 to IRQ0 Interrupts: Interrupts IRQ7 to IRQ0 are requested by an input signal at pins IRQ7 to IRQ0. Interrupts IRQ7 to IRQ0 have the following features: * Using ISCR, it is possible to select whether an interrupt is generated by a low level, falling edge, rising edge, or both edges, at pins IRQ7 to IRQ0. * Enabling or disabling of interrupt requests IRQ7 to IRQ0 can be selected with IER. * The interrupt priority level can be set with IPR. * The status of interrupt requests IRQ7 to IRQ0 is indicated in ISR. ISR flags can be cleared to 0 by software. A block diagram of interrupts IRQ7 to IRQ0 is shown in figure 5-2. IRQnE IRQnSCA, IRQnSCB IRQnF Edge/level detection circuit IRQn interrupt S Q request R IRQn input Clear signal Note: n = 7 to 0 Figure 5-2 Block Diagram of Interrupts IRQ7 to IRQ0 Rev. 4.0, 03/03, page 119 of 1358 Figure 5-3 shows the timing of setting IRQnF. f IRQn input pin IRQnF Figure 5-3 Timing of Setting IRQnF The vector numbers for IRQ7 to IRQ0 interrupt exception handling are 23 to 16. Detection of IRQ7 to IRQ0 interrupts does not depend on whether the relevant pin has been set for input or output. Therefore, when a pin is used as an external interrupt input pin, do not clear the corresponding DDR bit to 0 and use the pin as an I/O pin for another function. The pins that can be used for IRQ4 to IRQ7 interrupt input can be switched by means of the IRQPAS bit in SYSCR. 5.3.2 Internal Interrupts There are 52 sources for internal interrupts from on-chip supporting modules. * For each on-chip supporting module there are flags that indicate the interrupt request status, and enable bits that select enabling or disabling of these interrupts. If both of these are set to 1 for a particular interrupt source, an interrupt request is issued to the interrupt controller. * The interrupt priority level can be set by means of IPR. * The DMAC* and DTC can be activated by a TPU, SCI, or other interrupt request. When the DMAC* or DTC is activated by an interrupt, the interrupt control mode and interrupt mask bits have no effect. Note: * The DMAC is not supported in the H8S/2321. Rev. 4.0, 03/03, page 120 of 1358 5.3.3 Interrupt Exception Vector Table Table 5-4 shows interrupt exception handling sources, vector addresses, and interrupt priorities. For default priorities, the lower the vector number, the higher the priority. Interrupt sources can also be used to activate the DTC and DMAC*. Priorities among modules can be set by means of IPR. The situation when two or more modules are set to the same priority, and priorities within a module, are fixed as shown in table 5-4. Note: * The DMAC is not supported in the H8S/2321. Rev. 4.0, 03/03, page 121 of 1358 Table 5-4 Interrupt Sources, Vector Addresses, and Interrupt Priorities Interrupt Source Origin of Interrupt Source Vector Number Vector 1 Address* IPR 2 DTC DMAC* Activa- ActivaPriority tion tion High Power-on reset 0 H'0000 Reserved 1 H'0004 Reserved for system use 2 H'0008 3 H'000C 4 H'0010 Trace 5 H'0014 Reserved for system use 6 H'0018 7 H'001C NMI External pin Trap instruction (4 sources) -- -- -- 8 H'0020 9 H'0024 10 H'0028 11 H'002C 12 H'0030 13 H'0034 14 H'0038 15 H'003C 16 H'0040 IPRA6 to IPRA4 -- IRQ1 17 H'0044 IPRA2 to IPRA0 -- IRQ2 18 H'0048 -- IRQ3 19 H'004C IPRB6 to IPRB4 IRQ4 20 H'0050 -- IRQ5 21 H'0054 IPRB2 to IPRB0 IRQ6 22 H'0058 23 H'005C IPRC6 to IPRC4 Low -- IRQ7 Reserved for system use IRQ0 External pin Rev. 4.0, 03/03, page 122 of 1358 -- -- -- 2 DTC DMAC* Activa- ActivaPriority tion tion Origin of Interrupt Source Vector Vector 1 Number Address* IPR SWDTEND (softwareactivated data transfer end) DTC 24 H'0060 IPRC2 to High IPRC0 WOVI (interval timer) Watchdog 25 timer H'0064 IPRD6 to IPRD4 -- -- Interrupt Source 3 -- CMI (compare match)* Refresh controller 26 H'0068 IPRD2 to IPRD0 -- -- Reserved -- 27 H'006C IPRE6 to IPRE4 -- -- ADI (A/D conversion end) A/D 28 H'0070 IPRE2 to IPRE0 Reserved -- 29 H'0074 -- -- 30 H'0078 31 H'007C 32 H'0080 TGI0B (TGR0B input capture/compare match) 33 H'0084 -- TGI0C (TGR0C input capture/compare match) 34 H'0088 -- TGI0D (TGR0D input capture/compare match) 35 H'008C -- TGI0A (TGR0A input capture/compare match) TPU channel 0 TCI0V (overflow 0) Reserved -- IPRF6 to IPRF4 36 H'0090 -- -- 37 H'0094 -- -- 38 H'0098 39 H'009C Low Rev. 4.0, 03/03, page 123 of 1358 Vector Vector 1 Number Address* IPR 2 DTC DMAC* Activa- ActivaPriority tion tion 40 H'00A0 High TGI1B (TGR1B input capture/compare match) 41 H'00A4 TCI1V (overflow 1) 42 H'00A8 -- -- TCI1U (underflow 1) 43 H'00AC -- -- 44 H'00B0 TGI2B (TGR2B input capture/compare match) 45 H'00B4 TCI2V (overflow 2) 46 H'00B8 -- -- TCI2U (underflow 2) 47 H'00BC -- -- 48 H'00C0 TGI3B (TGR3B input capture/compare match) 49 H'00C4 -- TGI3C (TGR3C input capture/compare match) 50 H'00C8 -- TGI3D (TGR3D input capture/compare match) 51 H'00CC -- TCI3V (overflow 3) 52 H'00D0 -- -- 53 H'00D4 -- -- 54 H'00D8 55 H'00DC Interrupt Source TGI1A (TGR1A input capture/compare match) TGI2A (TGR2A input capture/compare match) TGI3A (TGR3A input capture/compare match) Reserved Origin of Interrupt Source TPU channel 1 TPU channel 2 TPU channel 3 -- Rev. 4.0, 03/03, page 124 of 1358 IPRF2 to IPRF0 -- IPRG6 to IPRG4 -- IPRG2 to IPRG0 Low Interrupt Source TGI4A (TGR4A input capture/compare match) Origin of Interrupt Source Vector Vector 1 Number Address* IPR 56 H'00E0 TGI4B (TGR4B input capture/compare match) 57 H'00E4 TCI4V (overflow 4) 58 H'00E8 -- -- TCI4U (underflow 4) 59 H'00EC -- -- 60 H'00F0 TGI5B (TGR5B input capture/compare match) 61 H'00F4 TCI5V (overflow 5) 62 H'00F8 -- -- TCI5U (underflow 5) 63 H'00FC -- -- 64 H'0100 CMIB0 (compare match B) 65 H'0104 OVI0 (overflow 0) 66 H'0108 -- -- -- -- TGI5A (TGR5A input capture/compare match) CMIA0 (compare match A) TPU channel 4 2 DTC DMAC* Activa- ActivaPriority tion tion TPU channel 5 8-bit timer channel 0 Reserved -- 67 H'010C CMIA1 (compare match A) 8-bit timer channel 1 68 H'0110 CMIB1 (compare match B) 69 H'0114 OVI1 (overflow 1) 70 H'0118 71 H'011C Reserved -- IPRH6 to High IPRH4 -- IPRH2 to IPRH0 -- IPRI6 to IPRI4 -- -- IPRI2 to IPRI0 -- -- Low -- -- -- -- Rev. 4.0, 03/03, page 125 of 1358 Origin of Interrupt Source Vector Vector 1 Number Address* IPR 2 DTC DMAC* Activa- ActivaPriority tion tion DMAC 72 H'0120 High DEND0B (channel 0B 3 transfer end) * 73 H'0124 -- DEND1A (channel 1/channel 1A transfer 3 end) * 74 H'0128 -- DEND1B (channel 1B 3 transfer end) * 75 H'012C -- 76 H'0130 77 H'0134 78 H'0138 79 H'013C 80 H'0140 81 H'0144 TXI0 (transmit data empty 0) 82 H'0148 TEI0 (transmit end 0) 83 H'014C 84 H'0150 85 H'0154 TXI1 (transmit data empty 1) 86 H'0158 TEI1 (transmit end 1) 87 H'015C 88 H'0160 89 H'0164 TXI2 (transmit data empty 2) 90 H'0168 TEI2 (transmit end 2) 91 H'016C Interrupt Source DEND0A (channel 0/channel 0A transfer 3 end)* Reserved ERI0 (receive error 0) RXI0 (reception data full 0) ERI1 (receive error 1) RXI1 (reception data full 1) ERI2 (receive error 2) RXI2 (reception data full 2) -- SCI channel 0 SCI channel 1 SCI channel 2 Notes: *1 Lower 16 bits of the start address. *2 The DMAC is not supported in the H8S/2321. *3 Reserved in the H8S/2321. Rev. 4.0, 03/03, page 126 of 1358 IPRJ6 to IPRJ4 IPRJ2 to IPRJ0 IPRK6 to IPRK4 IPRK2 to IPRK0 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Low -- -- 5.4 Interrupt Operation 5.4.1 Interrupt Control Modes and Interrupt Operation Interrupt operations in the chip differ depending on the interrupt control mode. NMI interrupts are accepted at all times except in the reset state and the hardware standby state. In the case of IRQ interrupts and on-chip supporting module interrupts, an enable bit is provided for each interrupt. Clearing an enable bit to 0 disables the corresponding interrupt request. Interrupt sources for which the enable bits are set to 1 are controlled by the interrupt controller. Table 5-5 shows the interrupt control modes. The interrupt controller performs interrupt control according to the interrupt control mode set by the INTM1 and INTM0 bits in SYSCR, the priorities set in IPR, and the masking state indicated by the I bit in the CPU's CCR, and bits I2 to I0 in EXR. Table 5-5 Interrupt Control Modes SYSCR Interrupt Priority Setting Control Mode INTM1 INTM0 Registers Interrupt Mask Bits Description 0 0 -- 2 -- 1 0 -- I Interrupt mask control is performed by the I bit. 1 -- -- Setting prohibited 0 IPR I2 to I0 8-level interrupt mask control is performed by bits I2 to I0. 8 priority levels can be set with IPR. 1 -- -- Setting prohibited Rev. 4.0, 03/03, page 127 of 1358 Figure 5-4 shows a block diagram of the priority decision circuit. Interrupt control mode 0 I Interrupt acceptance control Default priority determination Interrupt source Vector number 8-level mask control IPR I2 to I0 Interrupt control mode 2 Figure 5-4 Block Diagram of Interrupt Control Operation Interrupt Acceptance Control: In interrupt control mode 0, interrupt acceptance is controlled by the I bit in CCR. Table 5-6 shows the interrupts selected in each interrupt control mode. Table 5-6 Interrupts Selected in Each Interrupt Control Mode (1) Interrupt Mask Bits Interrupt Control Mode I Selected Interrupts 0 0 All interrupts 2 1 * All interrupts NMI interrupts * : Don't care Rev. 4.0, 03/03, page 128 of 1358 8-Level Control: In interrupt control mode 2, 8-level mask level determination is performed for the selected interrupts in interrupt acceptance control according to the interrupt priority level (IPR). The interrupt source selected is the interrupt with the highest priority level, and whose priority level set in IPR is higher than the mask level. Table 5-7 Interrupts Selected in Each Interrupt Control Mode (2) Interrupt Control Mode Selected Interrupts 0 All interrupts 2 Highest-priority-level (IPR) interrupt whose priority level is greater than the mask level (IPR > I2 to I0) Default Priority Determination: When an interrupt is selected by 8-level control, its priority is determined and a vector number is generated. If the same value is set for IPR, acceptance of multiple interrupts is enabled, and so only the interrupt source with the highest priority according to the preset default priorities is selected and has a vector number generated. Interrupt sources with a lower priority than the accepted interrupt source are held pending. Table 5-8 shows operations and control signal functions in each interrupt control mode. Table 5-8 Operations and Control Signal Functions in Each Interrupt Control Mode Interrupt Setting Control Mode INTM1 INTM0 0 0 0 2 1 0 Interrupt Acceptance Control 8-Level Control I X IM 1 --* X Default Priority T Determination (Trace) I2 to I0 IPR -- --* -- IM PR T 2 Legend : Interrupt operation control performed X : No operation (All interrupts enabled) IM : Used as interrupt mask bit PR : Sets priority -- : Not used Notes: *1 Set to 1 when interrupt is accepted. *2 Keep the initial setting. Rev. 4.0, 03/03, page 129 of 1358 5.4.2 Interrupt Control Mode 0 Enabling and disabling of IRQ interrupts and on-chip supporting module interrupts can be set by means of the I bit in the CPU's CCR. Interrupts are enabled when the I bit is cleared to 0, and disabled when set to 1. Figure 5-5 shows a flowchart of the interrupt acceptance operation in this case. [1] If an interrupt source occurs when the corresponding interrupt enable bit is set to 1, an interrupt request is sent to the interrupt controller. [2] The I bit is then referenced. If the I bit is cleared to 0, the interrupt request is accepted. If the I bit is set to 1, only an NMI interrupt is accepted, and other interrupt requests are held pending. [3] Interrupt requests are sent to the interrupt controller, the highest-ranked interrupt according to the priority system is accepted, and other interrupt requests are held pending. [4] When an interrupt request is accepted, interrupt exception handling starts after execution of the current instruction has been completed. [5] The PC and CCR are saved to the stack area by interrupt exception handling. The PC saved on the stack shows the address of the first instruction to be executed after returning from the interrupt handling routine. [6] Next, the I bit in CCR is set to 1. This masks all interrupts except NMI. [7] A vector address is generated for the accepted interrupt, and execution of the interrupt handling routine starts at the address indicated by the contents of that vector address. Rev. 4.0, 03/03, page 130 of 1358 Program execution state No Interrupt generated? Yes Yes NMI? No No I = 0? Hold pending Yes No IRQ0? Yes IRQ1? No Yes TEI2? Yes Save PC and CCR I 1 Read vector address Branch to interrupt handling routine Figure 5-5 Flowchart of Procedure Up to Interrupt Acceptance in Interrupt Control Mode 0 Rev. 4.0, 03/03, page 131 of 1358 5.4.3 Interrupt Control Mode 2 Eight-level masking is implemented for IRQ interrupts and on-chip supporting module interrupts by comparing the interrupt mask level set by bits I2 to I0 of EXR in the CPU with IPR. Figure 5-6 shows a flowchart of the interrupt acceptance operation in this case. [1] If an interrupt source occurs when the corresponding interrupt enable bit is set to 1, an interrupt request is sent to the interrupt controller. [2] When interrupt requests are sent to the interrupt controller, the interrupt with the highest priority according to the interrupt priority levels set in IPR is selected, and lower-priority interrupt requests are held pending. If a number of interrupt requests with the same priority are generated at the same time, the interrupt request with the highest priority according to the priority system shown in table 5-4 is selected. [3] Next, the priority of the selected interrupt request is compared with the interrupt mask level set in EXR. An interrupt request with a priority no higher than the mask level set at that time is held pending, and only an interrupt request with a priority higher than the interrupt mask level is accepted. [4] When an interrupt request is accepted, interrupt exception handling starts after execution of the current instruction has been completed. [5] The PC, CCR, and EXR are saved to the stack area by interrupt exception handling. The PC saved on the stack shows the address of the first instruction to be executed after returning from the interrupt handling routine. [6] The T bit in EXR is cleared to 0. The interrupt mask level is rewritten with the priority level of the accepted interrupt. If the accepted interrupt is NMI, the interrupt mask level is set to H'7. [7] A vector address is generated for the accepted interrupt, and execution of the interrupt handling routine starts at the address indicated by the contents of that vector address. Rev. 4.0, 03/03, page 132 of 1358 Program execution state Interrupt generated? No Yes Yes NMI? No Level 7 interrupt? No Yes Mask level 6 or below? Yes Level 6 interrupt? No No Yes Mask level 5 or below? Level 1 interrupt? No No Yes Yes Mask level 0? No Yes Save PC, CCR, and EXR Hold pending Clear T bit to 0 Update mask level Read vector address Branch to interrupt handling routine Figure 5-6 Flowchart of Procedure Up to Interrupt Acceptance in Interrupt Control Mode 2 Rev. 4.0, 03/03, page 133 of 1358 5.4.4 Interrupt Exception Handling Sequence Figure 5-7 shows the interrupt exception handling sequence. The example shown is for the case where interrupt control mode 0 is set in advanced mode, and the program area and stack area are in on-chip memory. Rev. 4.0, 03/03, page 134 of 1358 Figure 5-7 Interrupt Exception Handling Rev. 4.0, 03/03, page 135 of 1358 (1) (2) (4) (3) Instruction prefetch Internal operation Instruction prefetch address (Not executed. This is the contents of the saved PC, the return address.) (2), (4) Instruction code (Not executed.) (3) Instruction prefetch address (Not executed.) (5) SP-2 (7) SP-4 (1) Internal data bus Internal write signal Internal read signal Internal address bus Interrupt request signal f Interrupt level determination Wait for end of instruction Interrupt acceptance (5) (7) (8) (9) (10) Vector fetch (12) (11) (14) (13) Interrupt handling routine instruction prefetch (6), (8) Saved PC and saved CCR (9), (11) Vector address (10), (12) Interrupt handling routine start address (vector address contents) (13) Interrupt handling routine start address ((13) = (10), (12)) (14) First instruction of interrupt handling routine (6) Stack Internal operation 5.4.5 Interrupt Response Times The chip is capable of fast word transfer instruction to on-chip memory, and the program area is provided in on-chip ROM and the stack area in on-chip RAM, enabling high-speed processing. Table 5-9 shows interrupt response times--the interval between generation of an interrupt request and execution of the first instruction in the interrupt handling routine. The execution status symbols used in table 5-9 are explained in table 5-10. Table 5-9 Interrupt Response Times Advanced Mode No. Item *1 INTM1 = 0 INTM1 = 1 3 3 1 to (19+2*SI) 1 to (19+2*SI) 1 Interrupt priority determination 2 Number of wait states until executing 2 instruction ends* 3 PC, CCR, EXR stack save 2*SK 3*SK 4 Vector fetch 2*SI 2*SI 2*SI 2*SI *3 5 Instruction fetch 6 4 Internal processing* Total (using on-chip memory) Notes: *1 *2 *3 *4 2 2 12 to 32 13 to 33 Two states in case of internal interrupt. Refers to MULXS and DIVXS instructions. Prefetch after interrupt acceptance and interrupt handling routine prefetch. Internal processing after interrupt acceptance and internal processing after vector fetch. Table 5-10 Number of States in Interrupt Handling Routine Execution Object of Access External Device 8-Bit Bus Symbol Instruction fetch SI Branch address read SJ Stack manipulation SK Internal Memory 2-State Access 3-State Access 2-State Access 3-State Access 1 4 6+2m 2 3+m Legend m: Number of wait states in an external device access. Rev. 4.0, 03/03, page 136 of 1358 16-Bit Bus 5.5 Usage Notes 5.5.1 Contention between Interrupt Generation and Disabling When an interrupt enable bit is cleared to 0 to disable interrupts, the disabling becomes effective after execution of the instruction. In other words, when an interrupt enable bit is cleared to 0 by an instruction such as BCLR or MOV, if an interrupt is generated during execution of the instruction, the interrupt concerned will still be enabled on completion of the instruction, and so interrupt exception handling for that interrupt will be executed on completion of the instruction. However, if there is an interrupt request of higher priority than that interrupt, interrupt exception handling will be executed for the higher-priority interrupt, and the lower-priority interrupt will be ignored. The same also applies when an interrupt source flag is cleared. Figure 5-8 shows an example in which the TGIEA bit in the TPU's TIER0 register is cleared to 0. TIER0 write cycle by CPU TGI0A exception handling f Internal address bus TIER0 address Internal write signal TGIEA TGFA TGI0A interrupt signal Figure 5-8 Contention between Interrupt Generation and Disabling The above contention will not occur if an enable bit or interrupt source flag is cleared to 0 while the interrupt is masked. Rev. 4.0, 03/03, page 137 of 1358 5.5.2 Instructions that Disable Interrupts Instructions that disable interrupts are LDC, ANDC, ORC, and XORC. After any of these instructions is executed, all interrupts including NMI are disabled and the next instruction is always executed. When the I bit is set by one of these instructions, the new value becomes valid two states after execution of the instruction ends. 5.5.3 Times when Interrupts are Disabled There are times when interrupt acceptance is disabled by the interrupt controller. The interrupt controller disables interrupt acceptance for a 3-state period after the CPU has updated the mask level with an LDC, ANDC, ORC, or XORC instruction. 5.5.4 Interrupts during Execution of EEPMOV Instruction Interrupt operation differs between the EEPMOV.B instruction and the EEPMOV.W instruction. With the EEPMOV.B instruction, an interrupt request (including NMI) issued during the transfer is not accepted until the move is completed. With the EEPMOV.W instruction, if an interrupt request is issued during the transfer, interrupt exception handling starts at a break in the transfer cycle. The PC value saved on the stack in this case is the address of the next instruction. Therefore, if an interrupt is generated during execution of an EEPMOV.W instruction, the following coding should be used. L1: EEPMOV.W MOV.W R4,R4 BNE L1 5.6 DTC and DMAC Activation by Interrupt 5.6.1 Overview The DTC and DMAC* can be activated by an interrupt. In this case, the following options are available. 1. Interrupt request to CPU 2. Activation request to DTC 3. Activation request to DMAC* 4. Selection of a number of the above Rev. 4.0, 03/03, page 138 of 1358 For details of interrupt requests that can be used with to activate the DTC or DMAC*, see section 8, Data Transfer Controller, and section 7, DMA Controller. Note: * The DMAC is not supported in the H8S/2321. 5.6.2 Block Diagram Figure 5-9 shows a block diagram of the DTC, DMAC*, and interrupt controller. Note: * The DMAC is not supported in the H8S/2321. Interrupt request IRQ interrupt On-chip supporting module Interrupt source clear signal Clear signal Disable signal DMAC* DTC activation request vector number Selection circuit Select signal Clear signal DTCER Control logic DTC Clear signal DTVECR SWDTE clear signal Interrupt controller Determination of priority CPU interrupt request vector number CPU I, I2 to I0 Figure 5-9 Interrupt Control for DTC and DMAC* Rev. 4.0, 03/03, page 139 of 1358 5.6.3 Operation The interrupt controller has three main functions in DTC and DMAC* control. Selection of Interrupt Source: With the DMAC*, the activation source is input directly to each channel. The activation source for each DMAC* channel is selected with bits DTF3 to DTF0 in DMACR. Whether the selected activation source is to be managed by the DMAC* can be selected with the DTA bit of DMABCR. When the DTA bit is set to 1, the interrupt source constituting that DMAC* activation source is not a DTC activation source or CPU interrupt source. For interrupt sources other than interrupts managed by the DMAC*, it is possible to select DTC activation request or CPU interrupt request with the DTCE bit of DTCERA to DTCERF in the DTC. After a DTC data transfer, the DTCE bit can be cleared to 0 and an interrupt request sent to the CPU in accordance with the specification of the DISEL bit of MRB in the DTC. When the DTC has performed the specified number of data transfers and the transfer counter value is zero, the DTCE bit is cleared to 0 and an interrupt request is sent to the CPU after the DTC data transfer. Determination of Priority: The DTC activation source is selected in accordance with the default priority order, and is not affected by mask or priority levels. See section 7.6, Interrupts, and section 8.3.3, DTC Vector Table, for the respective priorities. With the DMAC*, the activation source is input directly to each channel. Operation Order: If the same interrupt is selected as a DTC activation source and a CPU interrupt source, the DTC data transfer is performed first, followed by CPU interrupt exception handling. If the same interrupt is selected as a DMAC* activation source and a DTC activation source or CPU interrupt source, operations are performed for them independently according to their respective operating statuses and bus mastership priorities. Table 5-11 summarizes interrupt source selection and interrupt source clearance control according to the settings of the DTA bit of DMABCR in the DMAC*, the DTCE bit of DTCERA to DTCERF in the DTC, and the DISEL bit of MRB in the DTC. Note: * The DMAC is not supported in the H8S/2321. Rev. 4.0, 03/03, page 140 of 1358 Table 5-11 Interrupt Source Selection and Clearing Control Settings DMAC DTC DTA DTCE DISEL 0 * 1 0 * 1 * 0 1 Interrupt Source Selection/Clearing Control 1 DMAC* DTC CPU X X X X Legend : The relevant interrupt is used. Interrupt source clearing is performed. (The CPU should clear the source flag in the interrupt handling routine.) : The relevant interrupt is used. The interrupt source is not cleared. X : The relevant interrupt cannot be used. * : Don't care Note: *1 The DMAC is not supported in the H8S/2321. Usage Note: SCI and A/D converter interrupt sources are cleared when the DMAC* or DTC reads or writes to the prescribed register, and are not dependent upon the DTA bit or DISEL bit. Note: * The DMAC is not supported in the H8S/2321. Rev. 4.0, 03/03, page 141 of 1358 Rev. 4.0, 03/03, page 142 of 1358 Section 6 Bus Controller 6.1 Overview The chip has a built-in bus controller (BSC) that manages the external address space divided into eight areas. The bus specifications, such as bus width and number of access states, can be set independently for each area, enabling multiple memories to be connected easily. The bus controller also has a bus arbitration function, and controls the operation of the internal bus masters: the CPU, DMA controller (DMAC)*, and data transfer controller (DTC). Note: * The DMAC is not supported in the H8S/2321. 6.1.1 Features The features of the bus controller are listed below. * Manages external address space in area units In advanced mode, manages the external space as 8 areas of 2 Mbytes Bus specifications can be set independently for each area DRAM*/burst ROM interfaces can be set * Basic bus interface Chip select (CS0 to CS7) can be output for areas 0 to 7 8-bit access or 16-bit access can be selected for each area 2-state access or 3-state access can be selected for each area Program wait states can be inserted for each area * DRAM interface* DRAM interface can be set for areas 2 to 5 (in advanced mode) Row address/column address multiplexed output (8/9/10 bits) 2-CAS access method Burst operation (fast page mode) TP cycle insertion to secure RAS precharging time Choice of CAS-before-RAS refreshing or self-refreshing * Burst ROM interface Burst ROM interface can be set for area 0 Choice of 1- or 2-state burst access Rev. 4.0, 03/03, page 143 of 1358 * Idle cycle insertion An idle cycle can be inserted in case of an external read cycle between different areas An idle cycle can be inserted when an external read cycle is immediately followed by an external write cycle * Write buffer functions External write cycle and internal access can be executed in parallel DMAC* single address mode and internal access can be executed in parallel * Bus arbitration function Includes a bus arbiter that arbitrates bus mastership among the CPU, DMAC, and DTC * Other features Refresh counter (refresh timer)* can be used as an interval timer External bus release function Note: * The DRAM interface, DMAC, and refresh counter are not supported in the H8S/2321. Rev. 4.0, 03/03, page 144 of 1358 6.1.2 Block Diagram Figure 6-1 shows a block diagram of the bus controller. CS0 to CS7 Internal address bus Area decoder ABWCR External bus control signals ASTCR BCRH BCRL BREQ BACK BREQO Bus controller Internal control signals WAIT Wait controller WCRH WCRL External DRAM signals* DRAM controller* Internal data bus Bus mode signal MCR DRAMCR RTCNT RTCOR CPU bus request signal DTC bus request signal Bus arbiter DMAC bus request signal* CPU bus acknowledge signal DTC bus acknowledge signal DMAC bus acknowledge signal* Note: * Not supported in the H8S/2321. Figure 6-1 Block Diagram of Bus Controller Rev. 4.0, 03/03, page 145 of 1358 6.1.3 Pin Configuration Table 6-1 summarizes the pins of the bus controller. Table 6-1 Bus Controller Pins Name Symbol I/O Function Address strobe AS Output Strobe signal indicating that address output on address bus is enabled. Read RD Output Strobe signal indicating that external space is being read. High write/write enable HWR Output Strobe signal indicating that external space is to be written, and upper half (D15 to D8) of data bus is enabled. 2-CAS DRAM write enable signal*. Low write LWR Output Strobe signal indicating that external space is to be written, and lower half (D7 to D0) of data bus is enabled. Chip select 0 CS0 Output Strobe signal indicating that area 0 is selected. Chip select 1 CS1 Output Strobe signal indicating that area 1 is selected. Chip select 2/row address strobe 2 CS2 Output Strobe signal indicating that area 2 is selected. DRAM row address strobe signal when area 2 is in DRAM space*. Chip select 3/row address strobe 3 CS3 Output Strobe signal indicating that area 3 is selected. DRAM row address strobe signal when area 3 is in DRAM space*. Chip select 4/row address strobe 4 CS4 Output Strobe signal indicating that area 4 is selected. DRAM row address strobe signal when area 4 is in DRAM space*. Chip select 5/row address strobe 5 CS5 Output Strobe signal indicating that area 5 is selected. DRAM row address strobe signal when area 5 is in DRAM space*. Rev. 4.0, 03/03, page 146 of 1358 Name Symbol I/O Function Chip select 6 CS6 Output Strobe signal indicating that area 6 is selected. Chip select 7 CS7 Output Strobe signal indicating that area 7 is selected. Upper column address strobe CAS* Output 2-CAS DRAM upper column address strobe signal. Lower column strobe LCAS* Output DRAM lower column address strobe signal. Wait WAIT Input Wait request signal when accessing external 3-state access space. Bus request BREQ Input Request signal that releases bus to external device. Bus request acknowledge BACK Output Acknowledge signal indicating that bus has been released. Bus request output BREQO Output External bus request signal used when internal bus master accesses external space when external bus is released. Note: * The DRAM interface and the CAS and LCAS pin functions are not supported in the H8S/2321. Rev. 4.0, 03/03, page 147 of 1358 6.1.4 Register Configuration Table 6-2 summarizes the registers of the bus controller. Table 6-2 Bus Controller Registers Initial Value 1 Address* Name Abbreviation R/W Reset Bus width control register ABWCR R/W H'FF/H'00* H'FED0 Access state control register ASTCR R/W H'FF H'FED1 Wait control register H WCRH R/W H'FF H'FED2 Wait control register L WCRL R/W H'FF H'FED3 Bus control register H BCRH R/W H'D0 H'FED4 Bus control register L BCRL 3 MCR* R/W H'3C H'FED5 R/W H'00 H'FED6 R/W H'00 H'FED7 Refresh timer counter 3 DRAMCR* 3 RTCNT* R/W H'00 H'FED8 Refresh time constant register 3 RTCOR* R/W H'FF H'FED9 Memory control register DRAM control register 2 Notes: *1 Lower 16 bits of the address. *2 Determined by the MCU operating mode. *3 In the H8S/2321 this register is reserved and must not be accessed. Rev. 4.0, 03/03, page 148 of 1358 6.2 Register Descriptions 6.2.1 Bus Width Control Register (ABWCR) Bit : 7 6 5 4 3 2 1 0 ABW7 ABW6 ABW5 ABW4 ABW3 ABW2 ABW1 ABW0 1 1 1 1 1 1 1 1 R/W R/W R/W R/W R/W R/W R/W R/W 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W Modes 5 to 7 Initial value : R/W : Mode 4 Initial value : R/W : ABWCR is an 8-bit readable/writable register that designates each area for either 8-bit access or 16-bit access. ABWCR sets the data bus width for the external memory space. The bus width for on-chip memory and internal I/O registers is fixed regardless of the settings in ABWCR. After a reset and in hardware standby mode, ABWCR is initialized to H'FF in modes 5 to 7,* and to H'00 in mode 4. It is not initialized in software standby mode. Note: * Modes 6 and 7 are not provided in the ROMless version. Bits 7 to 0--Area 7 to 0 Bus Width Control (ABW7 to ABW0): These bits select whether the corresponding area is to be designated for 8-bit access or 16-bit access. Bit n ABWn Description 0 Area n is designated for 16-bit access 1 Area n is designated for 8-bit access (n = 7 to 0) Rev. 4.0, 03/03, page 149 of 1358 6.2.2 Bit Access State Control Register (ASTCR) : Initial value : R/W : 7 6 5 4 3 2 1 0 AST7 AST6 AST5 AST4 AST3 AST2 AST1 AST0 1 1 1 1 1 1 1 1 R/W R/W R/W R/W R/W R/W R/W R/W ASTCR is an 8-bit readable/writable register that designates each area as either a 2-state access space or a 3-state access space. ASTCR sets the number of access states for the external memory space. The number of access states for on-chip memory and internal I/O registers is fixed regardless of the settings in ASTCR. ASTCR is initialized to H'FF by a reset and in hardware standby mode. It is not initialized in software standby mode. Bits 7 to 0--Area 7 to 0 Access State Control (AST7 to AST0): These bits select whether the corresponding area is to be designated as a 2-state access space or a 3-state access space. Wait state insertion is enabled or disabled at the same time. Bit n ASTn Description 0 Area n is designated for 2-state access Wait state insertion in area n external space is disabled 1 Area n is designated for 3-state access Wait state insertion in area n external space is enabled (Initial value) (n = 7 to 0) Rev. 4.0, 03/03, page 150 of 1358 6.2.3 Wait Control Registers H and L (WCRH, WCRL) WCRH and WCRL are 8-bit readable/writable registers that select the number of program wait states for each area. Program waits are not inserted in the case of on-chip memory or internal I/O registers. WCRH and WCRL are initialized to H'FF by a reset and in hardware standby mode. They are not initialized in software standby mode. WCRH Bit : Initial value : R/W : 7 6 5 4 3 2 1 0 W71 W70 W61 W60 W51 W50 W41 W40 1 1 1 1 1 1 1 1 R/W R/W R/W R/W R/W R/W R/W R/W Bits 7 and 6--Area 7 Wait Control 1 and 0 (W71, W70): These bits select the number of program wait states when area 7 in external space is accessed while the AST7 bit in ASTCR is set to 1. Bit 7 W71 Bit 6 W70 Description 0 0 Program wait not inserted when external space area 7 is accessed 1 1 program wait state inserted when external space area 7 is accessed 0 2 program wait states inserted when external space area 7 is accessed 1 3 program wait states inserted when external space area 7 is accessed (Initial value) 1 Bits 5 and 4--Area 6 Wait Control 1 and 0 (W61, W60): These bits select the number of program wait states when area 6 in external space is accessed while the AST6 bit in ASTCR is set to 1. Bit 5 W61 Bit 4 W60 Description 0 0 Program wait not inserted when external space area 6 is accessed 1 1 program wait state inserted when external space area 6 is accessed 0 2 program wait states inserted when external space area 6 is accessed 1 3 program wait states inserted when external space area 6 is accessed (Initial value) 1 Rev. 4.0, 03/03, page 151 of 1358 Bits 3 and 2--Area 5 Wait Control 1 and 0 (W51, W50): These bits select the number of program wait states when area 5 in external space is accessed while the AST5 bit in ASTCR is set to 1. Bit 3 W51 Bit 2 W50 Description 0 0 Program wait not inserted when external space area 5 is accessed 1 1 program wait state inserted when external space area 5 is accessed 0 2 program wait states inserted when external space area 5 is accessed 1 3 program wait states inserted when external space area 5 is accessed (Initial value) 1 Bits 1 and 0--Area 4 Wait Control 1 and 0 (W41, W40): These bits select the number of program wait states when area 4 in external space is accessed while the AST4 bit in ASTCR is set to 1. Bit 1 W41 Bit 0 W40 0 0 Program wait not inserted when external space area 4 is accessed 1 1 program wait state inserted when external space area 4 is accessed 0 2 program wait states inserted when external space area 4 is accessed 1 3 program wait states inserted when external space area 4 is accessed (Initial value) 1 Description Rev. 4.0, 03/03, page 152 of 1358 WCRL Bit : Initial value : R/W : 7 6 5 4 3 2 1 0 W31 W30 W21 W20 W11 W10 W01 W00 1 1 1 1 1 1 1 1 R/W R/W R/W R/W R/W R/W R/W R/W Bits 7 and 6--Area 3 Wait Control 1 and 0 (W31, W30): These bits select the number of program wait states when area 3 in external space is accessed while the AST3 bit in ASTCR is set to 1. Bit 7 W31 Bit 6 W30 Description 0 0 Program wait not inserted when external space area 3 is accessed 1 1 program wait state inserted when external space area 3 is accessed 0 2 program wait states inserted when external space area 3 is accessed 1 3 program wait states inserted when external space area 3 is accessed (Initial value) 1 Bits 5 and 4--Area 2 Wait Control 1 and 0 (W21, W20): These bits select the number of program wait states when area 2 in external space is accessed while the AST2 bit in ASTCR is set to 1. Bit 5 W21 Bit 4 W20 Description 0 0 Program wait not inserted when external space area 2 is accessed 1 1 program wait state inserted when external space area 2 is accessed 0 2 program wait states inserted when external space area 2 is accessed 1 3 program wait states inserted when external space area 2 is accessed (Initial value) 1 Rev. 4.0, 03/03, page 153 of 1358 Bits 3 and 2--Area 1 Wait Control 1 and 0 (W11, W10): These bits select the number of program wait states when area 1 in external space is accessed while the AST1 bit in ASTCR is set to 1. Bit 3 W11 Bit 2 W10 Description 0 0 Program wait not inserted when external space area 1 is accessed 1 1 program wait state inserted when external space area 1 is accessed 0 2 program wait states inserted when external space area 1 is accessed 1 3 program wait states inserted when external space area 1 is accessed (Initial value) 1 Bits 1 and 0--Area 0 Wait Control 1 and 0 (W01, W00): These bits select the number of program wait states when area 0 in external space is accessed while the AST0 bit in ASTCR is set to 1. Bit 1 W01 Bit 0 W00 0 0 Program wait not inserted when external space area 0 is accessed 1 1 program wait state inserted when external space area 0 is accessed 0 2 program wait states inserted when external space area 0 is accessed 1 3 program wait states inserted when external space area 0 is accessed (Initial value) 1 6.2.4 Bit Bus Control Register H (BCRH) : Initial value : R/W Description : 7 6 5 4 3 2 1 ICIS1 ICIS0 1 1 0 1 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W BRSTRM BRSTS1 BRSTS0 RMTS2* RMTS1* RMTS0* Note: * This bit is reserved in the H8S/2321. BCRH is an 8-bit readable/writable register that selects enabling or disabling of idle cycle insertion, and the memory interface for areas 2 to 5 and area 0. BCRH is initialized to H'D0 by a reset and in hardware standby mode. It is not initialized in software standby mode. Rev. 4.0, 03/03, page 154 of 1358 0 Bit 7--Idle Cycle Insert 1 (ICIS1): Selects whether or not one idle cycle state is to be inserted between bus cycles when successive external read cycles are performed in different areas. Bit 7 ICIS1 Description 0 Idle cycle not inserted in case of successive external read cycles in different areas 1 Idle cycle inserted in case of successive external read cycles in different areas (Initial value) Bit 6--Idle Cycle Insert 0 (ICIS0): Selects whether or not one idle cycle state is to be inserted between bus cycles when successive external read and external write cycles are performed . Bit 6 ICIS0 Description 0 Idle cycle not inserted in case of successive external read and external write cycles 1 Idle cycle inserted in case of successive external read and external write cycles (Initial value) Bit 5--Burst ROM Enable (BRSTRM): Selects whether area 0 is used as a burst ROM interface area. Bit 5 BRSTRM Description 0 Area 0 is basic bus interface area 1 Area 0 is burst ROM interface area (Initial value) Bit 4--Burst Cycle Select 1 (BRSTS1): Selects the number of burst cycles for the burst ROM interface. Bit 4 BRSTS1 Description 0 Burst cycle comprises 1 state 1 Burst cycle comprises 2 states (Initial value) Bit 3--Burst Cycle Select 0 (BRSTS0): Selects the number of words that can be accessed in a burst ROM interface burst access. Bit 3 BRSTS0 Description 0 Max. 4 words in burst access 1 Max. 8 words in burst access (Initial value) Rev. 4.0, 03/03, page 155 of 1358 Bits 2 to 0--RAM Type Select (RMTS2 to RMTS0): These bits select the memory interface for areas 2 to 5 in advanced mode. When DRAM space is selected, the relevant area is designated as a DRAM interface area. In the H8S/2321 these bits are reserved and should only be written with 0. Bit 2 Bit 1 Bit 0 Description RMTS2 RMTS1 RMTS0 Area 5 0 0 0 Normal space 1 Normal space 1 0 Normal space 1 DRAM space -- -- 1 -- Area 4 Area 3 Area 2 DRAM space DRAM space The LCAS pin is used for the LCAS signal on the 2-CAS DRAM interface. If it is wished to use BREQO output and WAIT input when using the LCAS signal, it is possible to switch to the P53 pin by means of the BREQOPS bit in PFCR2. For details, see section 9.6, Port 5 and section 9.13, Port F. Note: This note applies to the H8S/2323 only. If all areas selected as DRAM space are 8-bit space, the PF2 pin can be used as an I/O port, or as the BREQ0 or WAIT pin. However, if PF2 is used as the WAIT pin on the H8S/2323 only, normal space other than DRAM space should be designated as 16-bit bus space. The RAS down mode cannot be used in this case. Sample settings are shown below. RMTS2 RMTS1 RMTS0 Area 5 0 0 0 Normal space 1 Normal space (16-bit bus) 0 Normal space (16-bit bus) 1 DRAM space (8-bit bus) 1 Rev. 4.0, 03/03, page 156 of 1358 Area 4 Area 3 Area 2 DRAM space (8-bit bus) DRAM space (8-bit bus) 6.2.5 Bit Bus Control Register L (BCRL) : Initial value : R/W : 7 6 5 4 3 2 1 0 BRLE BREQOE EAE -- DDS* -- WDBE* WAITE 0 0 1 1 1 1 0 0 R/W R/W R/W R/W R/W R/W R/W R/W Note: * This bit is reserved in the H8S/2321. BCRL is an 8-bit readable/writable register that performs selection of the external bus-released state protocol, DMAC single address transfer, enabling or disabling of the write data buffer function, and enabling or disabling of WAIT pin input. BCRL is initialized to H'3C by a reset and in hardware standby mode. It is not initialized in software standby mode. Bit 7--Bus Release Enable (BRLE): Enables or disables external bus release. Bit 7 BRLE Description 0 External bus release is disabled. BREQ, BACK, and BREQO pins can be used as I/O ports (Initial value) 1 External bus release is enabled Bit 6--BREQO Pin Enable (BREQOE): Outputs a signal that requests the external bus master to drop the bus request signal (BREQ) in the external bus release state, when an internal bus master performs an external space access, or when a refresh request is generated. Bit 6 BREQOE Description 0 BREQO output disabled. BREQO pin can be used as I/O port 1 BREQO output enabled (Initial value) Rev. 4.0, 03/03, page 157 of 1358 Bit 5--External Address Enable (EAE): Selects whether addresses H'010000 to H'03FFFF*2 are to be internal addresses or external addresses. Description Bit 5 0 1 H8S/2329, H8S/2328, H8S/2326, H8S/2326C H8S/2327 H8S/2323 1 Addresses H'010000 to Reserved area* H'01FFFF are on-chip ROM or address H'020000 to H'03FFFF are reserved 1 area* 2 Addresses H'010000 to H'03FFFF* are external addresses in external expanded 1 (Initial value) mode or reserved area* in single-chip mode On-chip ROM Notes: *1 Do not access a reserved area. *2 Addresses H'010000 to H'05FFFF in the H8S/2329. Addresses H'010000 to H'07FFFF in the H8S/2326 and H8S/2326C. Bit 4--Reserved: Only 1 should be written to this bit. Bit 3--DACK Timing Select (DDS): Selects the DMAC single address transfer bus timing for the DRAM interface. In the H8S/2321 this bit is reserved and should only be written with 1. Bit 3 DDS 0 Description When DMAC single address transfer is performed in DRAM space, full access is always executed DACK signal goes low from Tr or T1 cycle 1 Burst access is possible when DMAC single address transfer is performed in DRAM space DACK signal goes low from Tc1 or T2 cycle (Initial value) Bit 2--Reserved: Only 1 should be written to this bit. Bit 1--Write Data Buffer Enable (WDBE): Selects whether or not the write buffer function is used for an external write cycle or DMAC single address cycle. In the H8S/2321 this bit is reserved and should only be written with 0. Bit 1 WDBE Description 0 Write data buffer function not used 1 Write data buffer function used Rev. 4.0, 03/03, page 158 of 1358 (Initial value) Bit 0--WAIT Pin Enable (WAITE): Selects enabling or disabling of wait input by the WAIT pin. Bit 0 WAITE Description 0 Wait input by WAIT pin disabled. WAIT pin can be used as I/O port 1 Wait input by WAIT pin enabled 6.2.6 Bit Memory Control Register (MCR) : Initial value : R/W (Initial value) : 7 6 5 4 3 2 1 0 TPC BE RCDM -- MXC1 MXC0 RLW1 RLW0 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W MCR is an 8-bit readable/writable register that selects the DRAM strobe control method, number of precharge cycles, access mode, address multiplexing shift size, and the number of wait states inserted during refreshing, when areas 2 to 5 are designated as DRAM interface areas. MCR is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in software standby mode. Note: In the H8S/2321 this register is reserved and must not be accessed. Bit 7--TP Cycle Control (TPC): Selects whether a 1-state or 2-state precharge cycle (TP) is to be used when areas 2 to 5 designated as DRAM space are accessed. Bit 7 TPC Description 0 1 1-state precharge cycle is inserted 2-state precharge cycle is inserted (Initial value) Bit 6--Burst Access Enable (BE): Selects enabling or disabling of burst access to areas 2 to 5 designated as DRAM space. DRAM space burst access is performed in fast page mode. Bit 6 BE Description 0 Burst disabled (always full access) 1 For DRAM space access, access in fast page mode (Initial value) Rev. 4.0, 03/03, page 159 of 1358 Bit 5--RAS Down Mode (RCDM): When areas 2 to 5 are designated as DRAM space and access to DRAM is interrupted, RCDM selects whether the next DRAM access is waited for with the RAS signal held low (RAS down mode), or the RAS signal is driven high again (RAS up mode). Bit 5 RCDM Description 0 1 DRAM interface: RAS up mode selected DRAM interface: RAS down mode selected (Initial value) Bit 4--Reserved: Only 0 should be written to this bit. Bits 3 and 2--Multiplex Shift Count 1 and 0 (MXC1, MXC0): These bits select the size of the shift to the lower half of the row address in row address/column address multiplexing for the DRAM interface. In burst operation on the DRAM interface, these bits also select the row address to be used for comparison. Bit 3 MXC1 Bit 2 MXC0 0 0 Description 8-bit shift (Initial value) * When 8-bit access space is designated: Row address A23 to A8 used for comparison * When 16-bit access space is designated: Row address A23 to A9 used for comparison 1 9-bit shift * When 8-bit access space is designated: Row address A23 to A9 used for comparison * When 16-bit access space is designated: Row address A23 to A10 used for comparison 1 0 10-bit shift * When 8-bit access space is designated: Row address A23 to A10 used for comparison * When 16-bit access space is designated: Row address A23 to A11 used for comparison 1 -- Bits 1 and 0--Refresh Cycle Wait Control 1 and 0 (RLW1, RLW0): These bits select the number of wait states to be inserted in a DRAM interface CAS-before-RAS refresh cycle. This setting is used for all areas designated as DRAM space. Wait input by the WAIT pin is disabled. Rev. 4.0, 03/03, page 160 of 1358 Bit 1 RLW1 Bit 0 RLW0 Description 0 0 No wait state inserted 1 1 wait state inserted 0 2 wait states inserted 1 3 wait states inserted 1 6.2.7 Bit DRAM Control Register (DRAMCR) : Initial value : R/W (Initial value) : 7 6 5 4 3 2 1 0 RFSHE RCW RMODE CMF CMIE CKS2 CKS1 CKS0 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W DRAMCR is an 8-bit readable/writable register that selects the DRAM refresh mode and refresh counter clock, and controls the refresh timer. DRAMCR is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in software standby mode. Note: In the H8S/2321 this register is reserved and must not be accessed. Bit 7--Refresh Control (RFSHE): Selects whether or not refresh control is performed. When refresh control is not performed, the refresh timer can be used as an interval timer. Bit 7 RFSHE Description 0 Refresh control is not performed 1 Refresh control is performed (Initial value) Bit 6--RAS-CAS Wait (RCW): Controls wait state insertion in DRAM interface CAS-beforeRAS refreshing. Bit 6 RCW Description 0 Wait state insertion in CAS-before-RAS refreshing disabled RAS falls in TRr cycle 1 One wait state inserted in CAS-before-RAS refreshing RAS falls in TRc1 cycle (Initial value) Rev. 4.0, 03/03, page 161 of 1358 Bit 5--Refresh Mode (RMODE): When refresh control is performed (RFSHE = 1), selects whether or not self-refresh control is performed in software standby mode. Bit 5 RMODE Description 0 Self-refreshing is not performed in software standby mode 1 Self-refreshing is performed in software standby mode (Initial value) Bit 4--Compare Match Flag (CMF): Status flag that indicates a match between the values of RTCNT and RTCOR. When refresh control is performed (RFSHE = 1), 1 should be written to the CMF bit when writing to DRAMCR. Bit 4 CMF Description 0 [Clearing condition] Cleared by reading the CMF flag when CMF = 1, then writing 0 to the CMF flag (Initial value) 1 [Setting condition] Set when RTCNT = RTCOR Bit 3--Compare Match Interrupt Enable (CMIE): Enables or disables interrupt requests (CMI) by the CMF flag when the CMF flag in DRAMCR is set to 1. When refresh control is performed (RFSHE = 1), the CMIE bit is always cleared to 0. Bit 3 CMIE Description 0 Interrupt request (CMI) by CMF flag disabled 1 Interrupt request (CMI) by CMF flag enabled Rev. 4.0, 03/03, page 162 of 1358 (Initial value) Bits 2 to 0--Refresh Counter Clock Select (CKS2 to CKS0): These bits select the clock to be input to RTCNT from among 7 internal clocks obtained by dividing the system clock (). When the input clock is selected with bits CKS2 to CKS0, RTCNT begins counting up. Bit 2 CKS2 Bit 1 CKS1 Bit 0 CKS0 Description 0 0 0 Count operation disabled 1 Count uses /2 0 Count uses /8 1 Count uses /32 0 Count uses /128 1 Count uses /512 0 Count uses /2048 1 Count uses /4096 1 1 0 1 6.2.8 Bit Refresh Timer Counter (RTCNT) : Initial value : R/W (Initial value) : 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W RTCNT is an 8-bit readable/writable up-counter. RTCNT counts up using the internal clock selected by bits CKS2 to CKS0 in DRAMCR. When RTCNT matches RTCOR (compare match), the CMF flag in DRAMCR is set to 1 and RTCNT is cleared to H'00. If the RFSHE bit in DRAMCR is set to 1 at this time, a refresh cycle is started. Also, if the CMIE bit in DRAMCR is set to 1, a compare match interrupt (CMI) is generated. RTCNT is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in software standby mode. Note: In the H8S/2321 this register is reserved and must not be accessed. Rev. 4.0, 03/03, page 163 of 1358 6.2.9 Bit Refresh Time Constant Register (RTCOR) : 7 6 5 4 3 2 1 0 Initial value : 1 1 1 1 1 1 1 1 R/W R/W R/W R/W R/W R/W R/W R/W R/W : RTCOR is an 8-bit readable/writable register that sets the period for compare match operations with RTCNT. The values of RTCOR and RTCNT are constantly compared, and if they match, the CMF flag in DRAMCR is set to 1 and RTCNT is cleared to H'00. RTCOR is initialized to H'FF by a reset and in hardware standby mode. It is not initialized in software standby mode. Note: In the H8S/2321 this register is reserved and must not be accessed. Rev. 4.0, 03/03, page 164 of 1358 6.3 Overview of Bus Control 6.3.1 Area Partitioning In advanced mode, the bus controller partitions the 16-Mbyte address space into eight areas, 0 to 7, in 2-Mbyte units, and performs bus control for external space in area units. Figure 6-2 shows an outline of the memory map. Chip select signals (CS0 to CS7) can be output for each area. H'000000 Area 0 (2 Mbytes) H'1FFFFF H'200000 Area 1 (2 Mbytes) H'3FFFFF H'400000 Area 2 (2 Mbytes) H'5FFFFF H'600000 Area 3 (2 Mbytes) H'7FFFFF H'800000 Area 4 (2 Mbytes) H'9FFFFF H'A00000 Area 5 (2 Mbytes) H'BFFFFF H'C00000 Area 6 (2 Mbytes) H'DFFFFF H'E00000 Area 7 (2 Mbytes) H'FFFFFF Advanced mode Figure 6-2 Overview of Area Partitioning Rev. 4.0, 03/03, page 165 of 1358 6.3.2 Bus Specifications The external space bus specifications consist of three elements: bus width, number of access states, and number of program wait states. The bus width and number of access states for on-chip memory and internal I/O registers are fixed, and are not affected by the bus controller. Bus Width: A bus width of 8 or 16 bits can be selected with ABWCR. An area for which an 8-bit bus is selected functions as an 8-bit access space, and an area for which a 16-bit bus is selected functions as a16-bit access space. If all areas are designated for 8-bit access, 8-bit bus mode is set; if any area is designated for 16-bit access, 16-bit bus mode is set. When the burst ROM interface is designated, 16-bit bus mode is always set. Number of Access States: Two or three access states can be selected with ASTCR. An area for which 2-state access is selected functions as a 2-state access space, and an area for which 3-state access is selected functions as a 3-state access space. With the DRAM interface* and burst ROM interface, the number of access states may be determined without regard to ASTCR. When 2-state access space is designated, wait insertion is disabled. Note: * The DRAM interface is not supported in the H8S/2321. Number of Program Wait States: When 3-state access space is designated by ASTCR, the number of program wait states to be inserted automatically is selected with WCRH and WCRL. From 0 to 3 program wait states can be selected. Table 6-3 shows the bus specifications for each basic bus interface area. Rev. 4.0, 03/03, page 166 of 1358 Table 6-3 Bus Specifications for Each Area (Basic Bus Interface) WCRH, WCRL Bus Specifications (Basic Bus Interface) ABWCR ABWn ASTCR ASTn Wn1 Wn0 Bus Width Program Wait Access States States 0 0 -- -- 16 2 0 1 0 0 3 0 1 1 6.3.3 1 1 0 2 1 3 0 -- -- 8 2 0 1 0 0 3 0 1 1 1 0 2 1 3 Memory Interfaces The chip's memory interfaces comprise a basic bus interface that allows direct connection of ROM, SRAM, and so on; a DRAM interface* that allows direct connection of DRAM; and a burst ROM interface that allows direct connection of burst ROM. The interface can be selected independently for each area. An area for which the basic bus interface is designated functions as normal space, an area for which the DRAM interface* is designated functions as DRAM space, and an area for which the burst ROM interface is designated functions as burst ROM space. Note: * The DRAM interface is not supported in the H8S/2321. Rev. 4.0, 03/03, page 167 of 1358 6.3.4 Advanced Mode The initial state of each area is basic bus interface, 3-state access space. The initial bus width is selected according to the operating mode. The bus specifications described here cover basic items only, and the sections on each memory interface (6.4, Basic Bus Interface, 6.5, DRAM Interface, and 6.7, Burst ROM Interface) should be referred to for further details. Area 0: Area 0 includes on-chip ROM*1, and in ROM-disabled expansion mode, all of area 0 is external space. In the ROM-enabled expansion mode, the space excluding on-chip ROM*1 is external space. When area 0 external space is accessed, the CS0 signal can be output. Either basic bus interface or burst ROM interface can be selected for area 0. Areas 1 and 6: In external expansion mode, all of area 1 and area 6 is external space. When area 1 and 6 external space is accessed, the CS1 and CS6 pin signals respectively can be output. Only the basic bus interface can be used for areas 1 and 6. Areas 2 to 5: In external expansion mode, all of area 2 to area 5 is external space. When area 2 to 5 external space is accessed, signals CS2 to CS5 can be output. Basic bus interface or DRAM interface*2 can be selected for areas 2 to 5. With the DRAM interface*2, signals CS2 to CS5 are used as RAS signals. Area 7: Area 7 includes the on-chip RAM and internal I/O registers. In external expansion mode, the space excluding the on-chip RAM and internal I/O registers is external space. The on-chip RAM is enabled when the RAME bit in the system control register (SYSCR) is set to 1; when the RAME bit is cleared to 0, the on-chip RAM is disabled and the corresponding space becomes external space . When area 7 external space is accessed, the CS7 signal can be output. Only the basic bus interface can be used for the area 7 memory interface. Notes: *1 Only applies to versions with ROM. *2 The DRAM interface is not supported in the H8S/2321. Rev. 4.0, 03/03, page 168 of 1358 6.3.5 Chip Select Signals The chip can output chip select signals (CS0 to CS7) to areas 0 to 7, the signal being driven low when the corresponding external space area is accessed. Figure 6-3 shows an example of CSn (n = 0 to 7) output timing. Enabling or disabling of the CSn signal is performed by setting the data direction register (DDR) for the port corresponding to the particular CSn pin. In ROM-disabled expansion mode, the CS0 pin is placed in the output state after a power-on reset. Pins CS1 to CS7 are placed in the input state after a power-on reset, and so the corresponding DDR bits should be set to 1 when outputting signals CS1 to CS7. In the ROM-enabled expansion mode, pins CS0 to CS7 are all placed in the input state after a power-on reset, and so the corresponding DDR bits should be set to 1 when outputting signals CS0 to CS7. For details, see section 9, I/O Ports. When areas 2 to 5 are designated as DRAM space*, outputs CS2 to CS5 are used as RAS signals. Note: * The DRAM interface is not supported in the H8S/2321. Bus cycle T1 T2 T3 f Address bus Area n external address CSn Figure 6-3 CSn Signal Output Timing (n = 0 to 7) Rev. 4.0, 03/03, page 169 of 1358 6.4 Basic Bus Interface 6.4.1 Overview The basic bus interface enables direct connection of ROM, SRAM, and so on. The bus specifications can be selected with ABWCR, ASTCR, WCRH, and WCRL (see table 6-3). 6.4.2 Data Size and Data Alignment Data sizes for the CPU and other internal bus masters are byte, word, and longword. The bus controller has a data alignment function, and when accessing external space, controls whether the upper data bus (D15 to D8) or lower data bus (D7 to D0) is used according to the bus specifications for the area being accessed (8-bit access space or 16-bit access space) and the data size. 8-Bit Access Space: Figure 6-4 illustrates data alignment control for the 8-bit access space. With the 8-bit access space, the upper data bus (D15 to D8) is always used for accesses. The amount of data that can be accessed at one time is one byte: a word transfer instruction is performed as two byte accesses, and a longword transfer instruction, as four byte accesses. Upper data bus Lower data bus D15 D8 D7 D0 Byte size Word size 1st bus cycle 2nd bus cycle 1st bus cycle Longword size 2nd bus cycle 3rd bus cycle 4th bus cycle Figure 6-4 Access Sizes and Data Alignment Control (8-Bit Access Space) Rev. 4.0, 03/03, page 170 of 1358 16-Bit Access Space: Figure 6-5 illustrates data alignment control for the 16-bit access space. With the 16-bit access space, the upper data bus (D15 to D8) and lower data bus (D7 to D0) are used for accesses. The amount of data that can be accessed at one time is one byte or one word, and a longword transfer instruction is executed as two word transfer instructions. In byte access, whether the upper or lower data bus is used is determined by whether the address is even or odd. The upper data bus is used for an even address, and the lower data bus for an odd address. Upper data bus Lower data bus D15 D 8 D7 D0 Byte size Even address Byte size Odd address Word size Longword size 1st bus cycle 2nd bus cycle Figure 6-5 Access Sizes and Data Alignment Control (16-Bit Access Space) Rev. 4.0, 03/03, page 171 of 1358 6.4.3 Valid Strobes Table 6-4 shows the data buses used and valid strobes for the access spaces. In a read, the RD signal is valid without discrimination between the upper and lower halves of the data bus. In a write, the HWR signal is valid for the upper half of the data bus, and the LWR signal for the lower half. Table 6-4 Area 8-bit access space Data Buses Used and Valid Strobes Access Read/ Size Write Address Valid Strobe Upper Data Bus (D15 to D8) Lower Data Bus (D7 to D0) Byte Read -- RD Valid Invalid Write -- HWR Read Even RD 16-bit access Byte space Odd Valid Invalid Invalid Valid Even HWR Valid Hi-Z Odd LWR Hi-Z Valid Read -- RD Valid Valid Write -- HWR, LWR Valid Valid Write Word Hi-Z Note: Hi-Z: High impedance Invalid: Input state; input value is ignored. Rev. 4.0, 03/03, page 172 of 1358 6.4.4 Basic Timing 8-Bit 2-State Access Space: Figure 6-6 shows the bus timing for an 8-bit 2-state access space. When an 8-bit access space is accessed, the upper half (D15 to D8) of the data bus is used. The LWR pin is fixed high. Wait states cannot be inserted. Bus cycle T2 T1 f Address bus CSn AS RD Read D15 to D8 Valid D7 to D0 Invalid HWR LWR High Write D15 to D8 D7 to D0 Valid High impedance Note: n = 0 to 7 Figure 6-6 Bus Timing for 8-Bit 2-State Access Space Rev. 4.0, 03/03, page 173 of 1358 8-Bit 3-State Access Space: Figure 6-7 shows the bus timing for an 8-bit 3-state access space. When an 8-bit access space is accessed, the upper half (D15 to D8) of the data bus is used. The LWR pin is fixed high. Wait states can be inserted. Bus cycle T1 T2 T3 f Address bus CSn AS RD Read D15 to D8 Valid D7 to D0 Invalid HWR LWR High Write D15 to D8 D7 to D0 Valid High impedance Note: n = 0 to 7 Figure 6-7 Bus Timing for 8-Bit 3-State Access Space Rev. 4.0, 03/03, page 174 of 1358 16-Bit 2-State Access Space: Figures 6-8 to 6-10 show bus timings for a 16-bit 2-state access space. When a 16-bit access space is accessed, the upper half (D15 to D8) of the data bus is used for the even address, and the lower half (D7 to D0) for the odd address. Wait states cannot be inserted. Bus cycle T2 T1 f Address bus CSn AS RD Read D15 to D8 Valid D7 to D0 Invalid HWR LWR High Write D15 to D8 D7 to D0 Valid High impedance Note: n = 0 to 7 Figure 6-8 Bus Timing for 16-Bit 2-State Access Space (1) (Even Address Byte Access) Rev. 4.0, 03/03, page 175 of 1358 Bus cycle T2 T1 f Address bus CSn AS RD Read D15 to D8 Invalid D7 to D0 Valid HWR High LWR Write D15 to D8 D7 to D0 High impedance Valid Note: n = 0 to 7 Figure 6-9 Bus Timing for 16-Bit 2-State Access Space (2) (Odd Address Byte Access) Rev. 4.0, 03/03, page 176 of 1358 Bus cycle T2 T1 f Address bus CSn AS RD Read D15 to D8 Valid D7 to D0 Valid HWR LWR Write D15 to D8 Valid D7 to D0 Valid Note: n = 0 to 7 Figure 6-10 Bus Timing for 16-Bit 2-State Access Space (3) (Word Access) Rev. 4.0, 03/03, page 177 of 1358 16-Bit 3-State Access Space: Figures 6-11 to 6-13 show bus timings for a 16-bit 3-state access space. When a 16-bit access space is accessed , the upper half (D15 to D8) of the data bus is used for the even address, and the lower half (D7 to D0) for the odd address. Wait states can be inserted. Bus cycle T1 T2 T3 f Address bus CSn AS RD Read D15 to D8 Valid D7 to D0 Invalid HWR LWR High Write D15 to D8 D7 to D0 Valid High impedance Note: n = 0 to 7 Figure 6-11 Bus Timing for 16-Bit 3-State Access Space (1) (Even Address Byte Access) Rev. 4.0, 03/03, page 178 of 1358 Bus cycle T1 T2 T3 f Address bus CSn AS RD Read D15 to D8 Invalid D7 to D0 Valid HWR High LWR Write D15 to D8 D7 to D0 High impedance Valid Note: n = 0 to 7 Figure 6-12 Bus Timing for 16-Bit 3-State Access Space (2) (Odd Address Byte Access) Rev. 4.0, 03/03, page 179 of 1358 Bus cycle T1 T2 T3 f Address bus CSn AS RD Read D15 to D8 Valid D7 to D0 Valid HWR LWR Write D15 to D8 Valid D7 to D0 Valid Note: n = 0 to 7 Figure 6-13 Bus Timing for 16-Bit 3-State Access Space (3) (Word Access) Rev. 4.0, 03/03, page 180 of 1358 6.4.5 Wait Control When accessing external space, the H8S/2329 Series, and H8S/2328 Series can extend the bus cycle by inserting one or more wait states (Tw). There are two ways of inserting wait states: program wait insertion and pin wait insertion using the WAIT pin. Program Wait Insertion: From 0 to 3 wait states can be inserted automatically between the T2 state and T3 state on an individual area basis in 3-state access space, according to the settings of WCRH and WCRL. Pin Wait Insertion: Setting the WAITE bit in BCRL to 1 enables wait insertion by means of the WAIT pin. When external space is accessed in this state, program wait insertion is first carried out according to the settings in WCRH and WCRL. Then , if the WAIT pin is low at the falling edge of in the last T2 or Tw state, a Tw state is inserted. If the WAIT pin is held low, Tw states are inserted until it goes high. This is useful when inserting four or more Tw states, or when changing the number of Tw states for different external devices. The WAITE bit setting applies to all areas. The WAITPS bit can be used to change the WAIT input pin from PF2 to P53. To make this change, select the input pin with the WAITPS bit, then set the WAITE bit. Rev. 4.0, 03/03, page 181 of 1358 Figure 6-14 shows an example of wait state insertion timing. By program wait T1 T2 Tw By WAIT pin Tw Tw T3 f WAIT Address bus AS RD Read Data bus Read data HWR, LWR Write Data bus Note: Write data indicates the timing of WAIT pin sampling. Figure 6-14 Example of Wait State Insertion Timing The settings after a power-on reset are: 3-state access, 3 program wait state insertion, and WAIT input disabled. Rev. 4.0, 03/03, page 182 of 1358 6.5 DRAM Interface (Not supported in the H8S/2321) 6.5.1 Overview When the chip is in advanced mode, external space areas 2 to 5 can be designated as DRAM space, and DRAM interfacing performed. With the DRAM interface, DRAM can be directly connected to the chip. A DRAM space of 2, 4, or 8 Mbytes can be set by means of bits RMTS2 to RMTS0 in BCRH. Burst operation is also possible, using fast page mode. 6.5.2 Setting DRAM Space Areas 2 to 5 are designated as DRAM space by setting bits RMTS2 to RMTS0 in BCRH. The relation between the settings of bits RMTS2 to RMTS0 and DRAM space is shown in table 6-5. Possible DRAM space settings are: one area (area 2), two areas (areas 2 and 3), and four areas (areas 2 to 5). Table 6-5 Settings of Bits RMTS2 to RMTS0 and Corresponding DRAM Spaces RMTS2 RMTS1 RMTS0 Area 5 0 0 1 Normal space 1 0 Normal space 1 DRAM space 6.5.3 Area 4 Area 3 Area 2 DRAM space DRAM space Address Multiplexing With DRAM space, the row address and column address are multiplexed. In address multiplexing, the size of the shift of the row address is selected with bits MXC1 and MXC0 in MCR. Table 6-6 shows the relation between the settings of MXC1 and MXC0 and the shift size. Table 6-6 Address Multiplexing Settings by Bits MXC1 and MXC0 MCR Shift MXC1 MXC0 Size Address Pins A23 to A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 Row 0 address 0 8 bits 1 9 bits A23 to A13 A12 A20 A19 A18 A17 A16 A15 A14 A13 A12 A11 A10 A9 1 0 10 bits A23 to A13 A12 A11 A20 A19 A18 A17 A16 A15 A14 A13 A12 A11 A10 1 Setting -- prohibited -- -- Column -- address A23 to A13 A20 A19 A18 A17 A16 A15 A14 A13 A12 A11 A10 A9 A8 -- -- -- -- -- -- -- -- -- -- -- -- -- A23 to A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 Rev. 4.0, 03/03, page 183 of 1358 6.5.4 Data Bus If the bit in ABWCR corresponding to an area designated as DRAM space is set to 1, that area is designated as 8-bit DRAM space; if the bit is cleared to 0, the area is designated as 16-bit DRAM space. In 16-bit DRAM space, x16-bit configuration DRAM can be connected directly. In 8-bit DRAM space the upper half of the data bus, D15 to D8, is enabled, while in 16-bit DRAM space both the upper and lower halves of the data bus, D15 to D0, are enabled. Access sizes and data alignment are the same as for the basic bus interface: see section 6.4.2, Data Size and Data Alignment. 6.5.5 Pins Used for DRAM Interface Table 6-7 shows the pins used for DRAM interfacing and their functions. Table 6-7 DRAM Interface Pins Pin With DRAM Setting Name I/O HWR WE Write enable Output When 2-CAS system is set, write enable for DRAM space access LCAS LCAS Lower column address strobe Output Lower column address strobe for 16-bit DRAM space access CS2 RAS2 Row address strobe 2 Output Row address strobe when area 2 is designated as DRAM space CS3 RAS3 Row address strobe 3 Output Row address strobe when area 3 is designated as DRAM space CS4 RAS4 Row address strobe 4 Output Row address strobe when area 4 is designated as DRAM space CS5 RAS5 Row address strobe 5 Output Row address strobe when area 5 is designated as DRAM space CAS UCAS Upper column address strobe Output Upper column address strobe for DRAM space access Function WAIT WAIT Wait Input A12 to A0 A12 to A0 Address pins Output Row address/column address multiplexed output D15 to D0 D15 to D0 Data pins I/O Rev. 4.0, 03/03, page 184 of 1358 Wait request signal Data input/output pins 6.5.6 Basic Timing Figure 6-15 shows the basic access timing for DRAM space. The basic DRAM access timing is 4 states. Unlike the basic bus interface, the corresponding bits in ASTCR control only enabling or disabling of wait insertion, and do not affect the number of access states. When the corresponding bit in ASTCR is cleared to 0, wait states cannot be inserted in the DRAM access cycle. The 4 states of the basic timing consist of one Tp (precharge cycle) state, one Tr (row address output cycle), and two Tc (column address output cycle) states, Tc1 and Tc2. Tp Tr Tc1 Tc2 f A23 to A0 Row Column CSn (RAS) CAS, LCAS HWR (WE) Read D15 to D0 HWR (WE) Write D15 to D0 Note: n = 2 to 5 Figure 6-15 Basic Access Timing Rev. 4.0, 03/03, page 185 of 1358 6.5.7 Precharge State Control When DRAM is accessed, an RAS precharging time must be secured. With the chip, one Tp state is always inserted when DRAM space is accessed. This can be changed to two Tp states by setting the TPC bit in MCR to 1. Set the appropriate number of Tp cycles according to the DRAM connected and the operating frequency of the chip. Figure 6-16 shows the timing when two Tp states are inserted. When the TCP bit is set to 1, two Tp states are also used for refresh cycles. Tp1 Tp2 Tr Tc1 f A23 to A0 Row Column CSn (RAS) CAS, LCAS HWR (WE) Read D15 to D0 HWR (WE) Write D15 to D0 Note: n = 2 to 5 Figure 6-16 Timing with 2-State Precharge Cycle Rev. 4.0, 03/03, page 186 of 1358 Tc2 6.5.8 Wait Control There are two ways of inserting wait states in a DRAM access cycle: program wait insertion and pin wait insertion using the WAIT pin. Program Wait Insertion: When the bit in ASTCR corresponding to an area designated as DRAM space is set to 1, from 0 to 3 wait states can be inserted automatically between the Tc1 state and Tc2 state, according to the settings of WCRH and WCRL. Pin Wait Insertion: When the WAITE bit in BCRH is set to 1, wait input by means of the WAIT pin is enabled regardless of the setting of the AST bit in ASTCR. When DRAM space is accessed in this state, a program wait is first inserted. If the WAIT pin is low at the falling edge of in the last Tc1 or Tw state, another Tw state is inserted. If the WAIT pin is held low, Tw states are inserted until it goes high. Figure 6-17 shows an example of wait state insertion timing. Rev. 4.0, 03/03, page 187 of 1358 By program wait Tp Tr Tc1 Tw By WAIT pin Tw Tc2 f WAIT* Address bus CSn (RAS) CAS Read Data bus Read data CAS Write Data bus Notes: Write data indicates the timing of WAIT pin sampling. n = 2 to 5 Figure 6-17 Example of Wait State Insertion Timing Rev. 4.0, 03/03, page 188 of 1358 6.5.9 Byte Access Control When DRAM with a x16 configuration is connected, the 2-CAS system can be used for the control signals required for byte access. Figure 6-18 shows the control timing in the 2-CAS system, and figure 6-19 shows an example of 2CAS type DRAM connection. Tp Tr Tc1 Tc2 f A23 to A0 Row Column CSn (RAS) CAS Byte control LCAS HWR (WE) Note: n = 2 to 5 Figure 6-18 2-CAS System Control Timing (Upper Byte Write Access) Rev. 4.0, 03/03, page 189 of 1358 Chip (Address shift size set to 9 bits) CS (RAS) CAS LCAS HWR (WE) 2-CAS type 4-Mbit DRAM 256-kbyte 16-bit configuration 9-bit column address RAS UCAS LCAS WE A9 A8 A8 A7 A7 A6 A6 A5 A5 A4 A4 A3 A3 A2 A2 A1 A1 A0 D15 to D0 Row address input: A8 to A0 Column address input: A8 to A0 D15 to D0 OE Figure 6-19 Example of 2-CAS DRAM Connection Rev. 4.0, 03/03, page 190 of 1358 6.5.10 Burst Operation With DRAM, in addition to full access (normal access) in which data is accessed by outputting a row address for each access, a fast page mode is also provided which can be used when making a number of consecutive accesses to the same row address. This mode enables fast (burst) access of data by simply changing the column address after the row address has been output. Burst access can be selected by setting the BE bit in MCR to 1. Burst Access (Fast Page Mode) Operation Timing: Figure 6-20 shows the operation timing for burst access. When there are consecutive access cycles for DRAM space, the CAS signal and column address output cycles (two states) continue as long as the row address is the same for consecutive access cycles. The row address used for the comparison is set with bits MXC1 and MXC0 in MCR. Tp Tr Tc1 Tc2 Tc1 Tc2 f A23 to A0 Row Column 1 Column 2 CSn (RAS) CAS, LCAS HWR (WE) Read D15 to D0 HWR (WE) Write D15 to D0 Note: n = 2 to 5 Figure 6-20 Operation Timing in Fast Page Mode The bus cycle can also be extended in burst access by inserting wait states. The wait state insertion method and timing are the same as for full access. For details, see section 6.5.8, Wait Control. Rev. 4.0, 03/03, page 191 of 1358 RAS Down Mode and RAS Up Mode: Even when burst operation is selected, it may happen that access to DRAM space is not continuous, but is interrupted by access to another space. In this case, if the RAS signal is held low during the access to the other space, burst operation can be resumed when the same row address in DRAM space is accessed again. * RAS down mode To select RAS down mode, set the RCDM bit in MCR to 1. If access to DRAM space is interrupted and another space is accessed, the RAS signal is held low during the access to the other space, and burst access is performed if the row address of the next DRAM space access is the same as the row address of the previous DRAM space access. Figure 6-21 shows an example of the timing in RAS down mode. Note, however, that the RAS signal will go high if a refresh operation interrupts RAS down mode. DRAM access Tp Tr Tc1 Tc2 External space access T1 T2 DRAM access Tc1 f A23 to A0 CSn (RAS) CAS, LCAS D15 to D0 Note: n = 2 to 5 Figure 6-21 Example of Operation Timing in RAS Down Mode Rev. 4.0, 03/03, page 192 of 1358 Tc2 * RAS up mode To select RAS up mode, clear the RCDM bit in MCR to 0. Each time access to DRAM space is interrupted and another space is accessed, the RAS signal goes high again. Burst operation is only performed if DRAM space is continuous. Figure 6-22 shows an example of the timing in RAS up mode. In the case of burst ROM space access, the RAS signal is not restored to the high level. DRAM access Tp Tr Tc1 DRAM access Tc2 Tc1 Tc2 External space access T1 T2 f A23 to A0 CSn (RAS) CAS, LCAS D15 to D0 Note: n = 2 to 5 Figure 6-22 Example of Operation Timing in RAS Up Mode Rev. 4.0, 03/03, page 193 of 1358 6.5.11 Refresh Control The chip is provided with a DRAM refresh control function. Either of two refreshing methods can be selected: CAS-before-RAS (CBR) refreshing, or self-refreshing. CAS-before-RAS (CBR) Refreshing: To select CBR refreshing, set the RFSHE bit in DRAMCR to 1, and clear the RMODE bit to 0. With CBR refreshing, RTCNT counts up using the input clock selected by bits CKS2 to CKS0 in DRAMCR, and when the count matches the value set in RTCOR (compare match), refresh control is performed. At the same time, RTCNT is reset and starts counting again from H'00. Refreshing is thus repeated at fixed intervals determined by RTCOR and bits CKS2 to CKS0. Set a value in RTCOR and bits CKS2 to CKS0 that will meet the refreshing interval specification for the DRAM used. When bits CKS2 to CKS0 are set, RTCNT starts counting up. RTCNT and RTCOR settings should therefore be completed before setting bits CKS2 to CKS0. Do not clear the CMF flag when refresh control is being performed (RFSHE = 1). RTCNT operation is shown in figure 6-23, compare match timing in figure 6-24, and CBR refresh timing in figure 6-25. Access to other normal space can be performed during the CBR refresh interval. RTCNT RTCOR H'00 Refresh request Figure 6-23 RTCNT Operation Rev. 4.0, 03/03, page 194 of 1358 f RTCNT N H'00 RTCOR N Refresh request signal and CMF bit setting signal Figure 6-24 Compare Match Timing TRp TRr TRc1 TRc2 f CS (RAS) CAS, LCAS Note: n = 2 to 5 Figure 6-25 CBR Refresh Timing When the RCW bit is set to 1, RAS signal output is delayed by one cycle. The width of the RAS signal should be adjusted with bits RLW1 and RLW0. These bits are only enabled in refresh operations. Rev. 4.0, 03/03, page 195 of 1358 Figure 6-26 shows the timing when the RCW bit is set to 1. TRp TRr TRc1 TRw TRc2 f CSn (RAS) CAS, LCAS Note: n = 2 to 5 Figure 6-26 CBR Refresh Timing (When RCW = 1, RLW1 = 0, RLW0 = 1) Self-Refreshing: A self-refresh mode (battery backup mode) is provided for DRAM as a kind of standby mode. In this mode, refresh timing and refresh addresses are generated within the DRAM. To select self-refreshing, set the RFSHE bit and RMODE bit in DRAMCR to 1. Then, when a SLEEP instruction is executed to enter software standby mode, the CAS and RAS signals are output and DRAM enters self-refresh mode, as shown in figure 6-27. When software standby mode is exited, the RMODE bit is cleared to 0 and self-refresh mode is cleared. When switching to software standby mode, if there is a CBR refresh request, CBR refreshing is executed before self-refresh mode is entered. TRp Software standby TRcr f CSn (RAS) CAS, LCAS HWR (WE) High Note: n = 2 to 5 Figure 6-27 Self-Refresh Timing Rev. 4.0, 03/03, page 196 of 1358 TRc3 6.6 DMAC Single Address Mode and DRAM Interface (Not supported in the H8S/2321) When burst mode is selected with the DRAM interface, the DACK output timing can be selected with the DDS bit. When DRAM space is accessed in DMAC single address mode at the same time, this bit selects whether or not burst access is to be performed. 6.6.1 When DDS = 1 Burst access is performed by determining the address only, irrespective of the bus master. The DACK output goes low from the TC1 state in the case of the DRAM interface. Figure 6-28 shows the DACK output timing for the DRAM interface when DDS = 1. Tp Tr Tc1 Tc2 f A23 to A0 Row Column CSn (RAS) CAS (UCAS) LCAS (LCAS) HWR (WE) Read D15 to D0 HWR (WE) Write D15 to D0 DACK Note: n = 2 to 5 Figure 6-28 DACK Output Timing when DDS = 1 (Example of DRAM Access) Rev. 4.0, 03/03, page 197 of 1358 6.6.2 When DDS = 0 When DRAM space is accessed in DMAC single address mode, full access (normal access) is always performed. The DACK output goes low from the Tr state in the case of the DRAM interface. In modes other than DMAC single address mode, burst access can be used when accessing DRAM space. Figure 6-29 shows the DACK output timing for the DRAM interface when DDS = 0. Tp Tr Tc1 Tc2 f A23 to A0 Row Column CSn (RAS) CAS (UCAS) LCAS (LCAS) HWR (WE) Read D15 to D0 HWR (WE) Write D15 to D0 DACK Note: n = 2 to 5 Figure 6-29 DACK Output Timing when DDS = 0 (Example of DRAM Access) Rev. 4.0, 03/03, page 198 of 1358 6.7 Burst ROM Interface 6.7.1 Overview With the chip, external space area 0 can be designated as burst ROM space, and burst ROM interfacing can be performed. The burst ROM space interface enables 16-bit configuration ROM with burst access capability to be accessed at high speed. Area 0 can be designated as burst ROM space by means of the BRSTRM bit in BCRH. Consecutive burst accesses of a maximum of 4 words or 8 words can be performed for CPU instruction fetches only. One or two states can be selected for burst access. 6.7.2 Basic Timing The number of states in the initial cycle (full access) of the burst ROM interface is in accordance with the setting of the AST0 bit in ASTCR. Also, when the AST0 bit is set to 1, wait state insertion is possible. One or two states can be selected for the burst cycle, according to the setting of the BRSTS1 bit in BCRH. Wait states cannot be inserted. When area 0 is designated as burst ROM space, it becomes 16-bit access space regardless of the setting of the ABW0 bit in ABWCR. When the BRSTS0 bit in BCRH is cleared to 0, burst access of up to 4 words is performed; when the BRSTS0 bit is set to 1, burst access of up to 8 words is performed. The basic access timing for burst ROM space is shown in figures 6-30 (a) and (b). The timing shown in figure 6-30 (a) is for the case where the AST0 and BRSTS1 bits are both set to 1, and that in figure 6-30 (b) is for the case where both these bits are cleared to 0. Rev. 4.0, 03/03, page 199 of 1358 Full access T1 T2 Burst access T3 T1 T2 T1 T2 f Only lower address changed Address bus CS0 AS RD Data bus Read data Read data Read data Figure 6-30 (a) Example of Burst ROM Access Timing (When AST0 = BRSTS1 = 1) Rev. 4.0, 03/03, page 200 of 1358 Full access T1 T2 Burst access T1 T1 f Only lower address changed Address bus CS0 AS RD Data bus Read data Read data Read data Figure 6-30 (b) Example of Burst ROM Access Timing (When AST0 = BRSTS1 = 0) 6.7.3 Wait Control As with the basic bus interface, either program wait insertion or pin wait insertion using the WAIT pin can be used in the initial cycle (full access) of the burst ROM interface. See section 6.4.5, Wait Control. Wait states cannot be inserted in a burst cycle. Rev. 4.0, 03/03, page 201 of 1358 6.8 Idle Cycle 6.8.1 Operation When the chip accesses external space, it can insert a 1-state idle cycle (TI) between bus cycles in the following two cases: (1) when read accesses in different areas occur consecutively, and (2) when a write cycle occurs immediately after a read cycle. By inserting an idle cycle it is possible, for example, to avoid data collisions between ROM, with a long output floating time, and highspeed memory, I/O interfaces, and so on. Consecutive Reads in Different Areas: If consecutive reads in different areas occur while the ICIS1 bit in BCRH is set to 1, an idle cycle is inserted at the start of the second read cycle. This is enabled in advanced mode. Figure 6-31 shows an example of the operation in this case. In this example, bus cycle A is a read cycle from ROM with a long output floating time, and bus cycle B is a read cycle from SRAM, each being located in a different area. In (a), an idle cycle is not inserted, and a collision occurs in cycle B between the read data from ROM and that from SRAM. In (b), an idle cycle is inserted, and a data collision is prevented. Bus cycle A f T1 T2 Bus cycle B T3 T1 Bus cycle A T2 f Address bus Address bus CS (area A) CS (area A) CS (area B) CS (area B) RD RD Data bus Data bus Long output floating time (a) Idle cycle not inserted (ICIS1 = 0) T1 T2 TI T1 Data collision (b) Idle cycle inserted (ICIS1 = 1 (initial value)) Figure 6-31 Example of Idle Cycle Operation (1) Rev. 4.0, 03/03, page 202 of 1358 T3 Bus cycle B T2 Write after Read: If an external write occurs after an external read while the ICIS0 bit in BCRH is set to 1, an idle cycle is inserted at the start of the write cycle. Figure 6-32 shows an example of the operation in this case. In this example, bus cycle A is a read cycle from ROM with a long output floating time, and bus cycle B is a CPU write cycle. In (a), an idle cycle is not inserted, and a collision occurs in cycle B between the read data from ROM and the CPU write data. In (b), an idle cycle is inserted, and a data collision is prevented. Bus cycle A f T1 T2 Bus cycle B T3 T1 Bus cycle A T2 f Address bus Address bus CS (area A) CS (area A) CS (area B) CS (area B) RD RD HWR HWR Data bus Data bus Long output floating time (a) Idle cycle not inserted (ICIS0 = 0) T1 T2 T3 Bus cycle B TI T1 T2 Data collision (b) Idle cycle inserted (ICIS0 = 1 (initial value)) Figure 6-32 Example of Idle Cycle Operation (2) Rev. 4.0, 03/03, page 203 of 1358 Relationship between Chip Select (CS CS) RD) CS Signal and Read (RD RD Signal: Depending on the system's load conditions, the RD signal may lag behind the CS signal. An example is shown in figure 6-33. In this case, with the setting for no idle cycle insertion (a), there may be a period of overlap between the bus cycle A RD signal and the bus cycle B CS signal. Setting idle cycle insertion, as in (b), however, will prevent any overlap between the RD and CS signals. In the initial state after reset release, idle cycle insertion (b) is set. Bus cycle A f T1 T2 T3 Bus cycle B T1 T2 Bus cycle A f Address bus Address bus CS (area A) CS (area A) CS (area B) CS (area B) RD RD T1 T2 T3 Bus cycle B TI T1 T2 Possibility of overlap between CS (area B) and RD (a) Idle cycle not inserted (ICIS1 = 0) (b) Idle cycle inserted (ICIS1 = 1 (initial value)) Figure 6-33 Relationship between Chip Select (CS CS) RD) CS and Read (RD RD Usage Notes: When DRAM space* is accessed, the ICIS0 and ICIS1 bit settings are disabled. In the case of consecutive reads between different areas, for example, if the second access is a DRAM access*, only a Tp cycle is inserted, and a TI cycle is not. The timing in this case is shown in figure 6-34. However, in burst access in RAS down mode these settings are enabled, and an idle cycle is inserted. The timing in this case is shown in figures 6-35 (a) and (b). Note: * The DRAM interface is not supported in the H8S/2321. Rev. 4.0, 03/03, page 204 of 1358 External read T1 T2 T3 DRAM space read Tp Tr Tc1 Tc2 f Address bus RD Data bus Figure 6-34 Example of DRAM Access after External Read DRAM space read Tp Tr Tc1 External read Tc2 T1 T1 T2 DRAM space read T3 Tc1 Tc1 Tc2 EXTAL Address RD RAS CAS, LCAS Data bus Idle cycle Figure 6-35 (a) Example of Idle Cycle Operation in RAS Down Mode (ICIS1 = 1) Rev. 4.0, 03/03, page 205 of 1358 DRAM space read Tp Tr Tc1 External read Tc2 T1 T1 T2 DRAM space write T3 Tc1 Tc1 Tc2 EXTAL Address RD HWR RAS CAS, LCAS Data bus Idle cycle Figure 6-35 (b) Example of Idle Cycle Operation in RAS Down Mode (ICIS0 = 1) 6.8.2 Pin States in Idle Cycle Table 6-8 shows the pin states in an idle cycle. Table 6-8 Pin States in Idle Cycle Pins Pin State A23 to A0 Contents of next bus cycle D15 to D0 2 CSn* High impedance 1 High* 4 CAS* High AS High RD High HWR High LWR High DACKm *3 *4 Notes: *1 *2 *3 *4 High Remains low in DRAM space RAS down mode or a refresh cycle. n = 0 to 7 m = 0 and 1 The CAS and DACKm pin functions are not supported in the H8S/2321. Rev. 4.0, 03/03, page 206 of 1358 6.9 Write Data Buffer Function The chip has a write data buffer function in the external data bus. Using the write data buffer function enables external writes and DMA single address mode transfers to be executed in parallel with internal accesses. The write data buffer function is made available by setting the WDBE bit in BCRL to 1. Figure 6-36 shows an example of the timing when the write data buffer function is used. When this function is used, if an external write or DMA single address mode transfer* continues for 2 states or longer, and there is an internal access next, only an external write is executed in the first state, but from the next state onward an internal access (on-chip memory or internal I/O register read/write) is executed in parallel with the external write rather than waiting until it ends. Note: * The DMAC is not supported in the H8S/2321. On-chip memory read Internal I/O register read External write cycle T1 T2 TW TW T3 Internal address bus Internal memory Internal I/O register address Internal read signal A23 to A0 External address CSn External space write HWR, LWR D15 to D0 Note: n = 0 to 7 Figure 6-36 Example of Timing when Write Data Buffer Function is Used Rev. 4.0, 03/03, page 207 of 1358 6.10 Bus Release 6.10.1 Overview The chip can release the external bus in response to a bus request from an external device. In the external bus released state, the internal bus master continues to operate as long as there is no external access. If an internal bus master wants to make an external access in the external bus released state, or if a refresh request* is generated, it can issue a bus request off-chip. The BREQOPS bit can be used to change the BREQO output pin from PF2 to P53. Note: * The DRAM interface is not supported in the H8S/2321. 6.10.2 Operation In external expansion mode, the bus can be released to an external device by setting the BRLE bit in BCRL to 1. Driving the BREQ pin low issues an external bus request to the chip. When the BREQ pin is sampled, at the prescribed timing the BACK pin is driven low, and the address bus, data bus, and bus control signals are placed in the high-impedance state, establishing the external bus released state. In the external bus released state, an internal bus master can perform accesses using the internal bus. When an internal bus master wants to make an external access, it temporarily defers activation of the bus cycle, and waits for the bus request from the external bus master to be dropped. Even if a refresh request* is generated in the external bus released state, refresh control* is deferred until the external bus master drops the bus request. If the BREQOE bit in BCRL is set to 1, when an internal bus master wants to make an external access in the external bus released state, or when a refresh request* is generated, the BREQO pin is driven low and a request can be made off-chip to drop the bus request. When the BREQ pin is driven high, the BACK pin is driven high at the prescribed timing and the external bus released state is terminated. If an external bus release request and external access occur simultaneously, the order of priority is as follows: (High) External bus release > Internal bus master external access (Low) Rev. 4.0, 03/03, page 208 of 1358 If a refresh request* and external bus release request occur simultaneously, the order of priority is as follows: (High) Refresh* > External bus release (Low) As a refresh* and an external access by an internal bus master can be executed simultaneously, there is no relative order of priority for these two operations. Note: * The DRAM interface is not supported in the H8S/2321. 6.10.3 Pin States in External Bus Released State Table 6-9 shows the pin states in the external bus released state. Table 6-9 Pin States in Bus Released State Pins Pin State A23 to A0 High impedance D15 to D0 1 CSn* High impedance High impedance 3 CAS* High impedance AS High impedance RD High impedance HWR High impedance LWR High impedance 2 3 DACKm* * High Notes: *1 n = 0 to 7 *2 m = 0 and 1 *3 The CAS and DACKm pin functions are not supported in the H8S/2321. Rev. 4.0, 03/03, page 209 of 1358 6.10.4 Transition Timing Figure 6-37 shows the timing for transition to the bus released state. CPU cycle T0 CPU cycle External bus released state T1 T2 f High impedance Address bus Address High impedance Data bus High impedance AS High impedance RD High impedance HWR, LWR BREQ BACK BREQO * Minimum 1 state [1] [2] [3] [4] [1] Low level of BREQ pin is sampled at rise of T2 state. [2] BACK pin is driven low at end of CPU read cycle, releasing bus to external bus master. [3] [4] [5] [6] BREQ pin state is still sampled in external bus released state. High level of BREQ pin is sampled. BACK pin is driven high, ending bus release cycle. BREQO signal goes high 1.5 clocks after BACK signal goes high. Note: * Output only when BREQOE is set to 1. Figure 6-37 Bus Released State Transition Timing Rev. 4.0, 03/03, page 210 of 1358 [5] [6] 6.10.5 Usage Note Do not set MSTPCR to H'FFFF or H'EFFF, since the external bus release function will halt if a transition is made to sleep mode when either of these settings has been made. 6.11 Bus Arbitration 6.11.1 Overview The chip has a bus arbiter that arbitrates bus master operations. There are three bus masters, the CPU, DTC, and DMAC*, which perform read/write operations when they have possession of the bus. Each bus master requests the bus by means of a bus request signal. The bus arbiter determines priorities at the prescribed timing, and permits use of the bus by means of a bus request acknowledge signal. The selected bus master then takes possession of the bus and begins its operation. Note: * The DMAC is not supported in the H8S/2321. 6.11.2 Operation The bus arbiter detects the bus masters' bus request signals, and if the bus is requested, sends a bus request acknowledge signal to the bus master making the request. If there are bus requests from more than one bus master, the bus request acknowledge signal is sent to the one with the highest priority. When a bus master receives the bus request acknowledge signal, it takes possession of the bus until that signal is canceled. The order of priority of the bus masters is as follows: (High) DMAC* > DTC > CPU (Low) An internal bus access by an internal bus master, external bus release, and refreshing*, can be executed in parallel. In the event of simultaneous external bus release request, refresh request*, and internal bus master external access request generation, the order of priority is as follows: (High) Refresh* > External bus release (Low) (High) External bus release > Internal bus master external access (Low) As a refresh* and an external access by an internal bus master can be executed simultaneously, there is no relative order of priority for these two operations. Note: * The DMAC and DRAM interface are not supported in the H8S/2321. Rev. 4.0, 03/03, page 211 of 1358 6.11.3 Bus Transfer Timing Even if a bus request is received from a bus master with a higher priority than that of the bus master that has acquired the bus and is currently operating, the bus is not necessarily transferred immediately. There are specific times at which each bus master can relinquish the bus. CPU: The CPU is the lowest-priority bus master, and if a bus request is received from the DTC or DMAC*, the bus arbiter transfers the bus to the bus master that issued the request. The timing for transfer of the bus is as follows: * The bus is transferred at a break between bus cycles. However, if a bus cycle is executed in discrete operations, as in the case of a longword-size access, the bus is not transferred between the operations. See Appendix A-5, Bus States during Instruction Execution, for timings at which the bus is not transferred. * If the CPU is in sleep mode, it transfers the bus immediately. DTC: The DTC sends the bus arbiter a request for the bus when an activation request is generated. The DTC can release the bus after a vector read, a register information read (3 states), a single data transfer, or a register information write (3 states). It does not release the bus during a register information read (3 states), a single data transfer, or a register information write (3 states). DMAC*: The DMAC sends the bus arbiter a request for the bus when an activation request is generated. In the case of an external request in short address mode or normal mode, and in cycle steal mode, the DMAC releases the bus after a single transfer. In block transfer mode, it releases the bus after transfer of one block, and in burst mode, after completion of a transfer. Note: * The DMAC is not supported in the H8S/2321. 6.11.4 External Bus Release Usage Note External bus release can be performed on completion of an external bus cycle. The RD signal and the DRAM interface* RAS and CAS signals remain low until the end of the external bus cycle. Therefore, when external bus release is performed, the RD, RAS, and CAS signals may change from the low level to the high-impedance state. Note: * The DRAM interface is not supported in the H8S/2321. 6.12 Resets and the Bus Controller In a reset, the chip, including the bus controller, enters the reset state at that point, and any executing bus cycle is discontinued. Rev. 4.0, 03/03, page 212 of 1358 Section 7 DMA Controller (Not Supported in the H8S/2321) 7.1 Overview The chip has a built-in DMA controller* (DMAC) which can carry out data transfer on up to 4 channels. Note: * The DMAC is not supported in the H8S/2321. 7.1.1 Features The features of the DMAC are listed below. * Choice of short address mode or full address mode Short address mode Maximum of 4 channels can be used Choice of dual address mode or single address mode In dual address mode, one of the two addresses, transfer source and transfer destination, is specified as 24 bits and the other as16 bits In single address mode, transfer source or transfer destination address only is specified as 24 bits In single address mode, transfer can be performed in one bus cycle Choice of sequential mode, idle mode, or repeat mode for dual address mode and single address mode Full address mode Maximum of 2 channels can be used Transfer source and transfer destination address specified as 24 bits Choice of normal mode or block transfer mode * 16-Mbyte address space can be specified directly * Byte or word can be set as the transfer unit * Activation sources: internal interrupt, external request, auto-request (depending on transfer mode) Six 16-bit timer-pulse unit (TPU) compare match/input capture interrupts Serial communication interface (SCI0, SCI1) transmission data empty interrupt, reception data full interrupt A/D converter conversion end interrupt Rev. 4.0, 03/03, page 213 of 1358 External request Auto-request * Module stop mode can be set The initial setting enables DMAC registers to be accessed. DMAC operation is halted by setting module stop mode 7.1.2 Block Diagram A block diagram of the DMAC is shown in figure 7-1. Internal address bus Address buffer Interrupt signals DEND0A DEND0B DEND1A DEND1B DMAWER DMATCR DMACR0A DMACR0B DMACR1A DMACR1B DMABCR Data buffer Internal data bus Legend DMAWER DMATCR DMABCR DMACR MAR IOAR ETCR : DMA write enable register : DMA terminal control register : DMA band control register (for all channels) : DMA control register : Memory address register : I/O address register : Execute transfer count register Figure 7-1 Block Diagram of DMAC Rev. 4.0, 03/03, page 214 of 1358 MAR0A IOAR0A ETCR0A MAR0B IOAR0B ETCR0B MAR1A IOAR1A ETCR1A MAR1B IOAR1B ETCR1B Module data bus DREQ0 DREQ1 TEND0 TEND1 DACK0 DACK1 Channel 1B Channel 1A Channel 0B Channel 0A Control logic Channel 0 Processor Channel 1 Internal interrupts TGI0A TGI1A TGI2A TGI3A TGI4A TGI5A TXI0 RXI0 TXI1 RXI1 ADI External pins 7.1.3 Overview of Functions Tables 7-1 (1) and (2) summarize DMAC functions in short address mode and full address mode, respectively. Table 7-1 (1) Overview of DMAC Functions (Short Address Mode) Address Register Bit Length Transfer Mode Transfer Source Dual address mode * TPU channel 0 to 5 24/16 compare match/input capture A interrupt * Sequential mode 1-byte or 1-word transfer executed for one transfer request Memory address incremented/decremented by 1 or 2 1 to 65,536 transfers * Idle mode Source Destination 16/24 * SCI transmit-dataempty interrupt * SCI receive-datafull interrupt * A/D converter conversion end interrupt 1-byte or 1-word transfer executed for one transfer request * External request Memory address fixed 1 to 65,536 transfers * Repeat mode 1-byte or 1-word transfer executed for one transfer request Memory address incremented/ decremented by 1 or 2 After specified number of transfers (1 to 256), initial state is restored and operation continues * Single address mode * External request 24/DACK DACK/24 * 1-byte or 1-word transfer executed for one transfer request * Transfer in 1 bus cycle using DACK pin in place of address specifying I/O * Specifiable for sequential, idle, and repeat modes Rev. 4.0, 03/03, page 215 of 1358 Table 7-1 (2) Overview of DMAC Functions (Full Address Mode) Address Register Bit Length Transfer Mode Transfer Source Source Destination * Normal mode * Auto-request 24 24 * TPU channel 0 to 5 24 compare Specified block size transfer match/input executed for one transfer request capture A interrupt 1 to 65,536 transfers * SCI transmit-dataEither source or destination empty interrupt specifiable as block area * SCI receive-dataBlock size: 1 to 256 bytes or full interrupt words * External request 24 Auto-request Transfer request retained internally Transfers continue for the specified number of times (1 to 65,536) Choice of burst or cycle steal transfer External request * External request 1-byte or 1-word transfer executed for one transfer request 1 to 65,536 transfers * Block transfer mode * A/D converter conversion end interrupt Rev. 4.0, 03/03, page 216 of 1358 7.1.4 Pin Configuration Table 7-2 summarizes the DMAC pins. In short address mode, external request transfer, single address transfer, and transfer end output are not performed for channel A. The DMA transfer acknowledge function is used in channel B single address mode in short address mode. When the DREQ pin is used, do not designate the corresponding port for output. With regard to the DACK pins, setting single address transfer automatically sets the corresponding port to output, functioning as a DACK pin. With regard to the TEND pins, whether or not the corresponding port is used as a TEND pin can be specified by means of a register setting. Table 7-2 DMAC Pins Channel Pin Name Symbol I/O Function 0 DMA request 0 DREQ0 Input DMAC channel 0 external request DMA transfer acknowledge 0 DACK0 Output DMAC channel 0 single address transfer acknowledge DMA transfer end 0 TEND0 Output DMAC channel 0 transfer end DMA request 1 DREQ1 Input DMAC channel 1 external request DMA transfer acknowledge 1 DACK1 Output DMAC channel 1 single address transfer acknowledge DMA transfer end 1 TEND1 Output DMAC channel 1 transfer end 1 Rev. 4.0, 03/03, page 217 of 1358 7.1.5 Register Configuration Table 7-3 summarizes the DMAC registers. Table 7-3 DMAC Registers Channel Name Abbreviation R/W Initial Value 0 Memory address register 0A MAR0A R/W Undefined H'FEE0 16 bits I/O address register 0A IOAR0A R/W Undefined H'FEE4 16 bits Transfer count register 0A ETCR0A R/W Undefined H'FEE6 16 bits Memory address register 0B MAR0B R/W Undefined H'FEE8 16 bits I/O address register 0B IOAR0B R/W Undefined H'FEEC 16 bits Transfer count register 0B ETCR0B R/W Undefined H'FEEE 16 bits Memory address register 1A MAR1A R/W Undefined H'FEF0 16 bits I/O address register 1A IOAR1A R/W Undefined H'FEF4 16 bits Transfer count register 1A ETCR1A R/W Undefined H'FEF6 16 bits Memory address register 1B MAR1B R/W Undefined H'FEF8 16 bits I/O address register 1B IOAR1B R/W Undefined H'FEFC 16 bits Transfer count register 1B ETCR1B R/W Undefined H'FEFE 16 bits DMA write enable register DMAWER R/W H'00 H'FF00 8 bits DMA terminal control register DMATCR R/W H'00 H'FF01 8 bits DMA control register 0A DMACR0A R/W H'00 H'FF02 16 bits DMA control register 0B DMACR0B R/W H'00 H'FF03 16 bits DMA control register 1A DMACR1A R/W H'00 H'FF04 16 bits DMA control register 1B DMACR1B R/W H'00 H'FF05 16 bits DMA band control register DMABCR R/W H'0000 H'FF06 16 bits Module stop control register MSTPCR R/W H'3FFF H'FF3C 8 bits 1 0, 1 Note: * Lower 16 bits of the address. Rev. 4.0, 03/03, page 218 of 1358 Bus Address* Width 7.2 Register Descriptions (1) (Short Address Mode) Short address mode transfer can be performed for channels A and B independently. Short address mode transfer is specified for each channel by clearing the FAE bit in DMABCR to 0, as shown in table 7-4. Short address mode or full address mode can be selected for channels 1 and 0 independently by means of bits FAE1 and FAE0. Table 7-4 Short Address Mode and Full Address Mode (For 1 Channel: Example of Channel 0) 0 Short address mode specified (channels A and B operate independently) MAR0A MAR0B Specifies transfer source/transfer destination address IOAR0A Specifies transfer destination/transfer source address ETCR0A Specifies number of transfers DMACR0A Specifies transfer size, mode, activation source, etc. Specifies transfer source/transfer destination address IOAR0B Specifies transfer destination/transfer source address ETCR0B Specifies number of transfers DMACR0B Specifies transfer size, mode, activation source, etc. Full address mode specified (channels A and B operate in combination) Channel 0 1 Channel 0A Description Channel 0B FAE0 MAR0A Specifies transfer source address MAR0B Specifies transfer destination address IOAR0A IOAR0B ETCR0A ETCR0B DMACR0A DMACR0B Not used Not used Specifies number of transfers Specifies number of transfers (used in block transfer mode only) Specifies transfer size, mode, activation source, etc. Rev. 4.0, 03/03, page 219 of 1358 7.2.1 Memory Address Registers (MAR) Bit : 31 30 29 28 27 26 25 24 MAR 23 22 21 20 19 18 17 16 * * * * * * * * : -- -- -- -- -- -- -- -- Initial value : 0 0 0 0 0 0 0 0 R/W : -- -- -- -- -- -- -- -- R/W R/W R/W R/W R/W R/W R/W R/W Bit : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 MAR : * * * * * * * * * * * * * * * * Initial value : R/W : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W *: Undefined MAR is a 32-bit readable/writable register that specifies the transfer source address or destination address. The upper 8 bits of MAR are reserved: they are always read as 0, and cannot be modified. Whether MAR functions as the source address register or as the destination address register can be selected by means of the DTDIR bit in DMACR. MAR is incremented or decremented each time a byte or word transfer is executed, so that the address specified by MAR is constantly updated. For details, see section 7.2.4, DMA Control Register (DMACR). MAR is not initialized by a reset or in standby mode. Rev. 4.0, 03/03, page 220 of 1358 7.2.2 I/O Address Register (IOAR) Bit : IOAR : Initial value : R/W 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 * * * * * * * * * * * * * * * * : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W *: Undefined IOAR is a 16-bit readable/writable register that specifies the lower 16 bits of the transfer source address or destination address. The upper 8 bits of the transfer address are automatically set to H'FF. Whether IOAR functions as the source address register or as the destination address register can be selected by means of the DTDIR bit in DMACR. IOAR is invalid in single address mode. IOAR is not incremented or decremented each time a transfer is executed, so the address specified by IOAR is fixed. IOAR is not initialized by a reset or in standby mode. 7.2.3 Execute Transfer Count Register (ETCR) ETCR is a 16-bit readable/writable register that specifies the number of transfers. The setting of this register is different for sequential mode and idle mode on the one hand, and for repeat mode on the other. Sequential Mode and Idle Mode Transfer Counter (ETCR) Bit : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 * * * * * * * * * * * * * * * * : Initial value : R/W : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W *: Undefined In sequential mode and idle mode, ETCR functions as a 16-bit transfer counter (with a count range of 1 to 65,536). ETCR is decremented by 1 each time a transfer is performed, and when the count reaches H'0000, the DTE bit in DMABCR is cleared, and transfer ends. Rev. 4.0, 03/03, page 221 of 1358 Repeat Mode Transfer Number Storage (ETCRH) Bit : 15 14 13 12 11 10 9 8 Initial value : * * * * * * * * R/W R/W R/W R/W R/W R/W R/W R/W 5 4 3 2 1 0 R/W : Transfer Counter (ETCRL) Bit : Initial value : R/W : 7 6 * * * * * * * * R/W R/W R/W R/W R/W R/W R/W R/W *: Undefined In repeat mode, ETCR functions as transfer counter ETCRL (with a count range of 1 to 256) and transfer number storage register ETCRH. ETCRL is decremented by 1 each time a transfer is performed, and when the count reaches H'00, ETCRL is loaded with the value in ETCRH. At this point, MAR is automatically restored to the value it had when the count was started. The DTE bit in DMABCR is not cleared, and so transfers can be performed repeatedly until the DTE bit is cleared by the user. ETCR is not initialized by a reset or in standby mode. 7.2.4 Bit DMA Control Register (DMACR) : Initial value : R/W : 7 6 5 4 3 2 1 0 DTSZ DTID5 RPE DTDIR DTF3 DTF2 DTF1 DTF0 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W DMACR is an 8-bit readable/writable register that controls the operation of each DMAC channel. DMACR is initialized to H'00 by a reset, and in standby mode. Rev. 4.0, 03/03, page 222 of 1358 Bit 7--Data Transfer Size (DTSZ): Selects the size of data to be transferred at one time. Bit 7 DTSZ Description 0 Byte-size transfer 1 Word-size transfer (Initial value) Bit 6--Data Transfer Increment/Decrement (DTID): Selects incrementing or decrementing of MAR after every data transfer in sequential mode or repeat mode. In idle mode, MAR is neither incremented nor decremented. Bit 6 DTID Description 0 MAR is incremented after a data transfer 1 (Initial value) * When DTSZ = 0, MAR is incremented by 1 after a transfer * When DTSZ = 1, MAR is incremented by 2 after a transfer MAR is decremented after a data transfer * When DTSZ = 0, MAR is decremented by 1 after a transfer * When DTSZ = 1, MAR is decremented by 2 after a transfer Bit 5--Repeat Enable (RPE): Used in combination with the DTIE bit in DMABCR to select the mode (sequential, idle, or repeat) in which transfer is to be performed. Bit 5 RPE DMABCR DTIE Description 0 0 Transfer in sequential mode (no transfer end interrupt) 1 Transfer in sequential mode (with transfer end interrupt) 0 Transfer in repeat mode (no transfer end interrupt) 1 Transfer in idle mode (with transfer end interrupt) 1 (Initial value) For details of operation in sequential, idle, and repeat mode, see section 7.5.2, Sequential Mode, section 7.5.3, Idle Mode, and section 7.5.4, Repeat Mode. Bit 4--Data Transfer Direction (DTDIR): Used in combination with the SAE bit in DMABCR to specify the data transfer direction (source or destination). The function of this bit is therefore different in dual address mode and single address mode. Rev. 4.0, 03/03, page 223 of 1358 DMABCR SAE Bit 4 DTDIR 0 0 Transfer with MAR as source address and IOAR as destination address (Initial value) 1 Transfer with IOAR as source address and MAR as destination address 0 Transfer with MAR as source address and DACK pin as write strobe 1 Transfer with DACK pin as read strobe and MAR as destination address 1 Description Bits 3 to 0--Data Transfer Factor (DTF3 to DTF0): These bits select the data transfer factor (activation source). There are some differences in activation sources for channel A and for channel B. Channel A Bit 3 DTF3 Bit 2 DTF2 Bit 1 DTF1 Bit 0 DTF0 Description 0 0 0 0 -- 1 Activated by A/D converter conversion end interrupt 1 0 -- 1 -- 0 0 Activated by SCI channel 0 transmit-data-empty interrupt 1 Activated by SCI channel 0 receive-data-full interrupt 0 Activated by SCI channel 1 transmit-data-empty interrupt 1 Activated by SCI channel 1 receive-data-full interrupt 0 Activated by TPU channel 0 compare match/input capture A interrupt 1 Activated by TPU channel 1 compare match/input capture A interrupt 0 Activated by TPU channel 2 compare match/input capture A interrupt 1 Activated by TPU channel 3 compare match/input capture A interrupt 0 Activated by TPU channel 4 compare match/input capture A interrupt 1 Activated by TPU channel 5 compare match/input capture A interrupt 0 -- 1 -- 1 1 1 0 0 1 1 0 1 Rev. 4.0, 03/03, page 224 of 1358 (Initial value) Channel B Bit 3 DTF3 Bit 2 DTF2 Bit 1 DTF1 Bit 0 DTF0 Description 0 0 0 0 -- 1 0 Activated by A/D converter conversion end interrupt Activated by DREQ pin falling edge input* 1 Activated by DREQ pin low-level input 0 Activated by SCI channel 0 transmit-data-empty interrupt 1 Activated by SCI channel 0 receive-data-full interrupt 0 Activated by SCI channel 1 transmit-data-empty interrupt 1 Activated by SCI channel 1 receive-data-full interrupt 0 Activated by TPU channel 0 compare match/input capture A interrupt 1 Activated by TPU channel 1 compare match/input capture A interrupt 0 Activated by TPU channel 2 compare match/input capture A interrupt 1 Activated by TPU channel 3 compare match/input capture A interrupt 0 Activated by TPU channel 4 compare match/input capture A interrupt 1 Activated by TPU channel 5 compare match/input capture A interrupt 0 -- 1 -- 1 1 0 1 1 0 0 1 1 0 1 (Initial value) Note: * Detected as a low level in the first transfer after transfer is enabled. The same factor can be selected for more than one channel. In this case, activation starts with the highest-priority channel according to the relative channel priorities. For relative channel priorities, see section 7.5.13, DMAC Multi-Channel Operation. Rev. 4.0, 03/03, page 225 of 1358 7.2.5 DMA Band Control Register (DMABCR) DMABCRH Bit : 15 14 13 12 11 10 9 8 FAE1 FAE0 SAE1 SAE0 DTA1B DTA1A DTA0B DTA0A 0 0 0 0 0 0 0 0 : R/W R/W R/W R/W R/W R/W R/W R/W : 7 6 5 4 3 2 1 0 DTE1B DTE1A DTE0B DTE0A DTIE1B DTIE1A DTIE0B DTIE0A Initial value : R/W DMABCRL Bit Initial value : R/W : 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W DMABCR is a 16-bit readable/writable register that controls the operation of each DMAC channel. DMABCR is initialized to H'0000 by a reset, and in hardware standby mode. Bit 15--Full Address Enable 1 (FAE1): Specifies whether channel 1 is to be used in short address mode or full address mode. In short address mode, channels 1A and 1B can be used as independent channels. Bit 15 FAE1 Description 0 Short address mode 1 Full address mode (Initial value) Bit 14--Full Address Enable 0 (FAE0): Specifies whether channel 0 is to be used in short address mode or full address mode. In short address mode, channels 0A and 0B can be used as independent channels. Bit 14 FAE0 Description 0 Short address mode 1 Full address mode Rev. 4.0, 03/03, page 226 of 1358 (Initial value) Bit 13--Single Address Enable 1 (SAE1): Specifies whether channel 1B is to be used for transfer in dual address mode or single address mode. This bit is invalid in full address mode. Bit 13 SAE1 Description 0 Transfer in dual address mode 1 Transfer in single address mode (Initial value) Bit 12--Single Address Enable 0 (SAE0): Specifies whether channel 0B is to be used for transfer in dual address mode or single address mode. This bit is invalid in full address mode. Bit 12 SAE0 Description 0 Transfer in dual address mode 1 Transfer in single address mode (Initial value) Bits 11 to 8--Data Transfer Acknowledge (DTA): These bits enable or disable clearing, when DMA transfer is performed, of the internal interrupt source selected by the data transfer factor setting. When DTE = 1 and DTA = 1, the internal interrupt source selected by the data transfer factor setting is cleared automatically by DMA transfer. When DTE = 1 and DTA = 1, the internal interrupt source selected by the data transfer factor setting does not issue an interrupt request to the CPU or DTC. When DTE = 1 and DTA = 0, the internal interrupt source selected by the data transfer factor setting is not cleared when a transfer is performed, and can issue an interrupt request to the CPU or DTC in parallel. In this case, the interrupt source should be cleared by the CPU or DTC transfer. When DTE = 0, the internal interrupt source selected by the data transfer factor setting issues an interrupt request to the CPU or DTC regardless of the DTA bit setting. Bit 11--Data Transfer Acknowledge 1B (DTA1B): Enables or disables clearing, when DMA transfer is performed, of the internal interrupt source selected by the channel 1B data transfer factor setting. Rev. 4.0, 03/03, page 227 of 1358 Bit 11 DTA1B Description 0 Clearing of selected internal interrupt source at time of DMA transfer is disabled (Initial value) 1 Clearing of selected internal interrupt source at time of DMA transfer is enabled Bit 10--Data Transfer Acknowledge 1A (DTA1A): Enables or disables clearing, when DMA transfer is performed, of the internal interrupt source selected by the channel 1A data transfer factor setting. Bit 10 DTA1A Description 0 Clearing of selected internal interrupt source at time of DMA transfer is disabled (Initial value) 1 Clearing of selected internal interrupt source at time of DMA transfer is enabled Bit 9--Data Transfer Acknowledge 0B (DTA0B): Enables or disables clearing, when DMA transfer is performed, of the internal interrupt source selected by the channel 0B data transfer factor setting. Bit 9 DTA0B Description 0 Clearing of selected internal interrupt source at time of DMA transfer is disabled (Initial value) 1 Clearing of selected internal interrupt source at time of DMA transfer is enabled Bit 8--Data Transfer Acknowledge 0A (DTA0A): Enables or disables clearing, when DMA transfer is performed, of the internal interrupt source selected by the channel 0A data transfer factor setting. Bit 8 DTA0A Description 0 Clearing of selected internal interrupt source at time of DMA transfer is disabled (Initial value) 1 Clearing of selected internal interrupt source at time of DMA transfer is enabled Bits 7 to 4--Data Transfer Enable (DTE): When DTE = 0, data transfer is disabled and the activation source selected by the data transfer factor setting is ignored. If the activation source is an internal interrupt, an interrupt request is issued to the CPU or DTC. If the DTIE bit is set to 1 when DTE = 0, the DMAC regards this as indicating the end of a transfer, and issues a transfer end interrupt request to the CPU or DTC. Rev. 4.0, 03/03, page 228 of 1358 The conditions for the DTE bit being cleared to 0 are as follows: * When initialization is performed * When the specified number of transfers have been completed in a transfer mode other than repeat mode * When 0 is written to the DTE bit to forcibly abort the transfer, or for a similar reason When DTE = 1, data transfer is enabled and the DMAC waits for a request by the activation source selected by the data transfer factor setting. When a request is issued by the activation source, DMA transfer is executed. The condition for the DTE bit being set to 1 is as follows: * When 1 is written to the DTE bit after the DTE bit is read as 0 Bit 7--Data Transfer Enable 1B (DTE1B): Enables or disables data transfer on channel 1B. Bit 7 DTE1B Description 0 Data transfer disabled 1 Data transfer enabled (Initial value) Bit 6--Data Transfer Enable 1A (DTE1A): Enables or disables data transfer on channel 1A. Bit 6 DTE1A Description 0 Data transfer disabled 1 Data transfer enabled (Initial value) Bit 5--Data Transfer Enable 0B (DTE0B): Enables or disables data transfer on channel 0B. Bit 5 DTE0B Description 0 Data transfer disabled 1 Data transfer enabled (Initial value) Bit 4--Data Transfer Enable 0A (DTE0A): Enables or disables data transfer on channel 0A. Bit 4 DTE0A Description 0 Data transfer disabled 1 Data transfer enabled (Initial value) Rev. 4.0, 03/03, page 229 of 1358 Bits 3 to 0--Data Transfer End Interrupt Enable (DTIE): These bits enable or disable an interrupt to the CPU or DTC when transfer ends. If the DTIE bit is set to 1 when DTE = 0, the DMAC regards this as indicating the end of a transfer, and issues a transfer end interrupt request to the CPU or DTC. A transfer end interrupt can be canceled either by clearing the DTIE bit to 0 in the interrupt handling routine, or by performing processing to continue transfer by setting the transfer counter and address register again, and then setting the DTE bit to 1. Bit 3--Data Transfer Interrupt Enable 1B (DTIE1B): Enables or disables the channel 1B transfer end interrupt. Bit 3 DTIE1B Description 0 Transfer end interrupt disabled 1 Transfer end interrupt enabled (Initial value) Bit 2--Data Transfer Interrupt Enable 1A (DTIE1A): Enables or disables the channel 1A transfer end interrupt. Bit 2 DTIE1A Description 0 Transfer end interrupt disabled 1 Transfer end interrupt enabled (Initial value) Bit 1--Data Transfer Interrupt Enable 0B (DTIE0B): Enables or disables the channel 0B transfer end interrupt. Bit 1 DTIE0B Description 0 Transfer end interrupt disabled 1 Transfer end interrupt enabled (Initial value) Bit 0--Data Transfer Interrupt Enable 0A (DTIE0A): Enables or disables the channel 0A transfer end interrupt. Bit 0 DTIE0A Description 0 Transfer end interrupt disabled 1 Transfer end interrupt enabled Rev. 4.0, 03/03, page 230 of 1358 (Initial value) 7.3 Register Descriptions (2) (Full Address Mode) Full address mode transfer is performed with channels A and B together. For details of full address mode setting, see table 7-4. 7.3.1 Bit Memory Address Register (MAR) : 31 30 29 28 27 26 25 24 -- -- -- -- -- -- -- -- 23 22 21 20 19 18 17 16 * * * * * * * * Initial value : 0 0 0 0 0 0 0 0 R/W : -- -- -- -- -- -- -- -- R/W R/W R/W R/W R/W R/W R/W R/W Bit : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Initial value : * * * * * * * * * * * * * * * * R/W : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W *: Undefined MAR is a 32-bit readable/writable register; MARA functions as the transfer source address register, and MARB as the destination address register. MAR is composed of two 16-bit registers, MARH and MARL. The upper 8 bits of MARH are reserved: they are always read as 0, and cannot be modified. MAR is incremented or decremented each time a byte or word transfer is executed, so that the source or destination memory address can be updated automatically. For details, see section 7.3.4, DMA Control Register (DMACR). MAR is not initialized by a reset or in standby mode. 7.3.2 I/O Address Register (IOAR) IOAR is not used in full address transfer. Rev. 4.0, 03/03, page 231 of 1358 7.3.3 Execute Transfer Count Register (ETCR) ETCR is a 16-bit readable/writable register that specifies the number of transfers. The function of this register is different in normal mode and in block transfer mode. ETCR is not initialized by a reset or in standby mode. Normal Mode ETCRA Transfer Counter Bit : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Initial value : * * * * * * * * * * * * * * * * R/W : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W *: Undefined In normal mode, ETCRA functions as a 16-bit transfer counter. ETCRA is decremented by 1 each time a transfer is performed, and transfer ends when the count reaches H'0000. ETCRB is not used at this time. ETCRB ETCRB is not used in normal mode. Block Transfer Mode ETCRA Block Size Storage (ETCRAH) Bit : 15 14 13 12 11 10 9 8 Initial value : * * * * * * * * R/W R/W R/W R/W R/W R/W R/W R/W R/W : Block Size Counter (ETCRAL) Bit : 7 6 5 4 3 2 1 0 Initial value : * * * * * * * * R/W R/W R/W R/W R/W R/W R/W R/W R/W : *: Undefined Rev. 4.0, 03/03, page 232 of 1358 ETCRB Block Transfer Counter Bit : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Initial value : * * * * * * * * * * * * * * * * R/W : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W *: Undefined In block transfer mode, ETCRAL functions as an 8-bit block size counter and ETCRAH holds the block size. ETCRAL is decremented each time a 1-byte or 1-word transfer is performed, and when the count reaches H'00, ETCRAL is loaded with the value in ETCRAH. So by setting the block size in ETCRAH and ETCRAL, it is possible to repeatedly transfer blocks consisting of any desired number of bytes or words. ETCRB functions in block transfer mode, as a 16-bit block transfer counter. ETCRB is decremented by 1 each time a block is transferred, and transfer ends when the count reaches H'0000. 7.3.4 DMA Control Register (DMACR) DMACR is a 16-bit readable/writable register that controls the operation of each DMAC channel. In full address mode, DMACRA and DMACRB have different functions. DMACR is initialized to H'0000 by a reset, and in hardware standby mode. DMACRA Bit : Initial value : R/W : 15 14 13 12 11 10 9 8 DTSZ SAID SAIDE BLKDIR BLKE -- -- -- 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W DMACRB Bit : Initial value : R/W : 7 6 5 4 3 2 1 0 -- DAID DAIDE -- DTF3 DTF2 DTF1 DTF0 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W Rev. 4.0, 03/03, page 233 of 1358 Bit 15--Data Transfer Size (DTSZ): Selects the size of data to be transferred at one time. Bit 15 DTSZ Description 0 Byte-size transfer 1 Word-size transfer (Initial value) Bit 14--Source Address Increment/Decrement (SAID) Bit 13--Source Address Increment/Decrement Enable (SAIDE): These bits specify whether source address register MARA is to be incremented, decremented, or left unchanged, when data transfer is performed. Bit 14 SAID Bit 13 SAIDE Description 0 0 MARA is fixed 1 MARA is incremented after a data transfer 1 (Initial value) * When DTSZ = 0, MARA is incremented by 1 after a transfer * When DTSZ = 1, MARA is incremented by 2 after a transfer 0 MARA is fixed 1 MARA is decremented after a data transfer * When DTSZ = 0, MARA is decremented by 1 after a transfer * When DTSZ = 1, MARA is decremented by 2 after a transfer Bit 12--Block Direction (BLKDIR) Bit 11--Block Enable (BLKE): These bits specify whether normal mode or block transfer mode is to be used. If block transfer mode is specified, the BLKDIR bit specifies whether the source side or the destination side is to be the block area. Bit 12 BLKDIR Bit 11 BLKE Description 0 0 Transfer in normal mode 1 Transfer in block transfer mode, destination side is block area 0 Transfer in normal mode 1 Transfer in block transfer mode, source side is block area 1 For operation in normal mode and block transfer mode, see section 7.5, Operation. Rev. 4.0, 03/03, page 234 of 1358 (Initial value) Bits 10 to 7--Reserved: Can be read or written to. Only 0 should be written to these bits. Bit 6--Destination Address Increment/Decrement (DAID) Bit 5--Destination Address Increment/Decrement Enable (DAIDE): These bits specify whether destination address register MARB is to be incremented, decremented, or left unchanged, when data transfer is performed. Bit 6 DAID Bit 5 DAIDE Description 0 0 MARB is fixed 1 MARB is incremented after a data transfer 1 (Initial value) * When DTSZ = 0, MARB is incremented by 1 after a transfer * When DTSZ = 1, MARB is incremented by 2 after a transfer 0 MARB is fixed 1 MARB is decremented after a data transfer * When DTSZ = 0, MARB is decremented by 1 after a transfer * When DTSZ = 1, MARB is decremented by 2 after a transfer Bit 4--Reserved: Can be read or written to. Only 0 should be written to this bit. Bits 3 to 0--Data Transfer Factor (DTF3 to DTF0): These bits select the data transfer factor (activation source). The factors that can be specified differ between normal mode and block transfer mode. * Normal Mode Bit 3 DTF3 Bit 2 DTF2 Bit 1 DTF1 Bit 0 DTF0 Description 0 0 0 0 -- 1 -- 0 Activated by DREQ pin falling edge input 1 Activated by DREQ pin low-level input 0 * -- 1 0 Auto-request (cycle steal) 1 Auto-request (burst) * -- 1 1 1 * * (Initial value) *: Don't care Rev. 4.0, 03/03, page 235 of 1358 * Block Transfer Mode Bit 3 DTF3 Bit 2 DTF2 Bit 1 DTF1 Bit 0 DTF0 Description 0 0 0 0 -- 1 0 Activated by A/D converter conversion end interrupt Activated by DREQ pin falling edge input* 1 Activated by DREQ pin low-level input 0 Activated by SCI channel 0 transmit-data-empty interrupt 1 Activated by SCI channel 0 receive-data-full interrupt 0 Activated by SCI channel 1 transmit-data-empty interrupt 1 Activated by SCI channel 1 receive-data-full interrupt 0 Activated by TPU channel 0 compare match/input capture A interrupt 1 Activated by TPU channel 1 compare match/input capture A interrupt 0 Activated by TPU channel 2 compare match/input capture A interrupt 1 Activated by TPU channel 3 compare match/input capture A interrupt 0 Activated by TPU channel 4 compare match/input capture A interrupt 1 Activated by TPU channel 5 compare match/input capture A interrupt 0 -- 1 -- 1 1 0 1 1 0 0 1 1 0 1 (Initial value) Note: * Detected as a low level in the first transfer after transfer is enabled. The same factor can be selected for more than one channel. In this case, activation starts with the highest-priority channel according to the relative channel priorities. For relative channel priorities, see section 7.5.13, DMAC Multi-Channel Operation. Rev. 4.0, 03/03, page 236 of 1358 7.3.5 DMA Band Control Register (DMABCR) DMABCRH Bit : 15 14 13 12 11 10 9 8 FAE1 FAE0 -- -- DTA1 -- DTA0 -- 0 0 0 0 0 0 0 0 : R/W R/W R/W R/W R/W R/W R/W R/W : 7 6 5 4 3 2 1 0 : DTME1 DTE1 DTME0 DTE0 DTIE1B DTIE1A DTIE0B DTIE0A Initial value : R/W DMABCRL Bit Initial value : R/W : 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W DMABCR is a 16-bit readable/writable register that controls the operation of each DMAC channel. DMABCR is initialized to H'0000 by a reset, and in hardware standby mode. Bit 15--Full Address Enable 1 (FAE1): Specifies whether channel 1 is to be used in short address mode or full address mode. In full address mode, channels 1A and 1B are used together as a single channel. Bit 15 FAE1 Description 0 Short address mode 1 Full address mode (Initial value) Bit 14--Full Address Enable 0 (FAE0): Specifies whether channel 0 is to be used in short address mode or full address mode. In full address mode, channels 0A and 0B are used together as a single channel. Bit 14 FAE0 Description 0 Short address mode 1 Full address mode (Initial value) Rev. 4.0, 03/03, page 237 of 1358 Bits 13 and 12--Reserved: Can be read or written to. Only 0 should be written to these bits. Bits 11 and 9--Data Transfer Acknowledge (DTA): These bits enable or disable clearing, when DMA transfer is performed, of the internal interrupt source selected by the data transfer factor setting. When DTE = 1 and DTA = 1, the internal interrupt source selected by the data transfer factor setting is cleared automatically by DMA transfer. When DTE = 1 and DTA = 1, the internal interrupt source selected by the data transfer factor setting does not issue an interrupt request to the CPU or DTC. When DTE = 1 and DTA = 0, the internal interrupt source selected by the data transfer factor setting is not cleared when a transfer is performed, and can issue an interrupt request to the CPU or DTC in parallel. In this case, the interrupt source should be cleared by the CPU or DTC transfer. When DTE = 0, the internal interrupt source selected by the data transfer factor setting issues an interrupt request to the CPU or DTC regardless of the DTA bit setting. The state of the DTME bit does not affect the above operations. Bit 11--Data Transfer Acknowledge 1 (DTA1): Enables or disables clearing, when DMA transfer is performed, of the internal interrupt source selected by the channel 1 data transfer factor setting. Bit 11 DTA1 Description 0 Clearing of selected internal interrupt source at time of DMA transfer is disabled (Initial value) 1 Clearing of selected internal interrupt source at time of DMA transfer is enabled Bit 9--Data Transfer Acknowledge 0 (DTA0): Enables or disables clearing, when DMA transfer is performed, of the internal interrupt source selected by the channel 0 data transfer factor setting. Bit 9 DTA0 Description 0 Clearing of selected internal interrupt source at time of DMA transfer is disabled (Initial value) 1 Clearing of selected internal interrupt source at time of DMA transfer is enabled Rev. 4.0, 03/03, page 238 of 1358 Bits 10 and 8--Reserved: Can be read or written to. Only 0 should be written to these bits. Bits 7 and 5--Data Transfer Master Enable (DTME): Together with the DTE bit, these bits control enabling or disabling of data transfer on the relevant channel. When both the DTME bit and the DTE bit are set to 1, transfer is enabled for the channel. If the relevant channel is in the middle of a burst mode transfer when an NMI interrupt is generated, the DTME bit is cleared, the transfer is interrupted, and bus mastership passes to the CPU. When the DTME bit is subsequently set to 1 again, the interrupted transfer is resumed. In block transfer mode, however, the DTME bit is not cleared by an NMI interrupt, and transfer is not interrupted. The conditions for the DTME bit being cleared to 0 are as follows: * When initialization is performed * When NMI is input in burst mode * When 0 is written to the DTME bit The condition for DTME being set to 1 is as follows: * When 1 is written to DTME after DTME is read as 0 Bit 7--Data Transfer Master Enable 1 (DTME1): Enables or disables data transfer on channel 1. Bit 7 DTME1 Description 0 Data transfer disabled. In burst mode, cleared to 0 by an NMI interrupt 1 Data transfer enabled (Initial value) Bit 5--Data Transfer Master Enable 0 (DTME0): Enables or disables data transfer on channel 0. Bit 5 DTME0 Description 0 Data transfer disabled. In normal mode, cleared to 0 by an NMI interrupt (Initial value) 1 Data transfer enabled Rev. 4.0, 03/03, page 239 of 1358 Bits 6 and 4--Data Transfer Enable (DTE): When DTE = 0, data transfer is disabled and the activation source selected by the data transfer factor setting is ignored. If the activation source is an internal interrupt, an interrupt request is issued to the CPU or DTC. If the DTIE bit is set to 1 when DTE = 0, the DMAC regards this as indicating the end of a transfer, and issues a transfer end interrupt request to the CPU. The conditions for the DTE bit being cleared to 0 are as follows: * When initialization is performed * When the specified number of transfers have been completed * When 0 is written to the DTE bit to forcibly abort the transfer, or for a similar reason When DTE = 1 and DTME = 1, data transfer is enabled and the DMAC waits for a request by the activation source selected by the data transfer factor setting. When a request is issued by the activation source, DMA transfer is executed. The condition for the DTE bit being set to 1 is as follows: * When 1 is written to the DTE bit after the DTE bit is read as 0 Bit 6--Data Transfer Enable 1 (DTE1): Enables or disables data transfer on channel 1. Bit 6 DTE1 Description 0 Data transfer disabled 1 Data transfer enabled (Initial value) Bit 4--Data Transfer Enable 0 (DTE0): Enables or disables data transfer on channel 0. Bit 4 DTE0 Description 0 Data transfer disabled 1 Data transfer enabled (Initial value) Bits 3 and 1--Data Transfer Interrupt Enable B (DTIEB): These bits enable or disable an interrupt to the CPU or DTC when transfer is interrupted. If the DTIEB bit is set to 1 when DTME = 0, the DMAC regards this as indicating a break in the transfer, and issues a transfer break interrupt request to the CPU or DTC. A transfer break interrupt can be canceled either by clearing the DTIEB bit to 0 in the interrupt handling routine, or by performing processing to continue transfer by setting the DTME bit to 1. Rev. 4.0, 03/03, page 240 of 1358 Bit 3--Data Transfer Interrupt Enable 1B (DTIE1B): Enables or disables the channel 1 transfer break interrupt. Bit 3 DTIE1B Description 0 Transfer break interrupt disabled 1 Transfer break interrupt enabled (Initial value) Bit 1--Data Transfer Interrupt Enable 0B (DTIE0B): Enables or disables the channel 0 transfer break interrupt. Bit 1 DTIE0B Description 0 Transfer break interrupt disabled 1 Transfer break interrupt enabled (Initial value) Bits 2 and 0--Data Transfer End Interrupt Enable A (DTIEA): These bits enable or disable an interrupt to the CPU or DTC when transfer ends. If the DTIEA bit is set to 1 when DTE = 0, the DMAC regards this as indicating the end of a transfer, and issues a transfer end interrupt request to the CPU or DTC. A transfer end interrupt can be canceled either by clearing the DTIEA bit to 0 in the interrupt handling routine, or by performing processing to continue transfer by setting the transfer counter and address register again, and then setting the DTE bit to 1. Bit 2--Data Transfer Interrupt Enable 1A (DTIE1A): Enables or disables the channel 1 transfer end interrupt. Bit 2 DTIE1A Description 0 Transfer end interrupt disabled 1 Transfer end interrupt enabled (Initial value) Bit 0--Data Transfer Interrupt Enable 0A (DTIE0A): Enables or disables the channel 0 transfer end interrupt. Bit 0 DTIE0A Description 0 Transfer end interrupt disabled 1 Transfer end interrupt enabled (Initial value) Rev. 4.0, 03/03, page 241 of 1358 7.4 Register Descriptions (3) 7.4.1 DMA Write Enable Register (DMAWER) The DMAC can activate the DTC with a transfer end interrupt, rewrite the channel on which the transfer ended using a DTC chain transfer, and reactivate the DTC. DMAWER applies restrictions so that specific bits of DMACR for the specific channel, and also DMATCR and DMABCR, can be changed to prevent inadvertent rewriting of registers other than those for the channel concerned. The restrictions applied by DMAWER are valid for the DTC. Figure 7-2 shows the transfer areas for activating the DTC with a channel 0A transfer end interrupt, and reactivating channel 0A. The address register and count register area is re-set by the first DTC transfer, then the control register area is re-set by the second DTC chain transfer. When re-setting the control register area, perform masking by setting bits in DMAWER to prevent modification of the contents of the other channels. First transfer area MAR0A IOAR0A ETCR0A MAR0B IOAR0B ETCR0B MAR1A DTC IOAR1A ETCR1A MAR1B IOAR1B ETCR1B Second transfer area using chain transfer DMAWER DMATCR DMACR0A DMACR0B DMACR1A DMACR1B DMABCR Figure 7-2 Areas for Register Re-Setting by DTC (Example: Channel 0A) Rev. 4.0, 03/03, page 242 of 1358 Bit : 7 6 5 4 3 2 1 0 -- -- -- -- WE1B WE1A WE0B WE0A Initial value : 0 0 0 0 0 0 0 0 R/W -- -- -- -- R/W R/W R/W R/W : DMAWER is an 8-bit readable/writable register that controls enabling or disabling of writes to DMACR, DMABCR, and DMATCR by the DTC. DMAWER is initialized to H'00 by a reset, and in hardware standby mode. Bits 7 to 4--Reserved: Read-only bits, always read as 0. Bit 3--Write Enable 1B (WE1B): Enables or disables writes to all bits in DMACR1B, bits 11, 7, and 3 in DMABCR, and bit 5 in DMATCR, by the DTC. Bit 3 WE1B Description 0 Writes to all bits in DMACR1B, bits 11, 7, and 3 in DMABCR, and bit 5 in DMATCR are disabled (Initial value) 1 Writes to all bits in DMACR1B, bits 11, 7, and 3 in DMABCR, and bit 5 in DMATCR are enabled Bit 2--Write Enable 1A (WE1A): Enables or disables writes to all bits in DMACR1A, and bits 10, 6, and 2 in DMABCR, by the DTC. Bit 2 WE1A Description 0 Writes to all bits in DMACR1A, and bits 10, 6, and 2 in DMABCR are disabled (Initial value) 1 Writes to all bits in DMACR1A, and bits 10, 6, and 2 in DMABCR are enabled Bit 1--Write Enable 0B (WE0B): Enables or disables writes to all bits in DMACR0B, bits 9, 5, and 1 in DMABCR, and bit 4 in DMATCR, by the DTC. Bit 1 WE0B Description 0 Writes to all bits in DMACR0B, bits 9, 5, and 1 in DMABCR, and bit 4 in DMATCR are disabled (Initial value) 1 Writes to all bits in DMACR0B, bits 9, 5, and 1 in DMABCR, and bit 4 in DMATCR are enabled Rev. 4.0, 03/03, page 243 of 1358 Bit 0--Write Enable 0A (WE0A): Enables or disables writes to all bits in DMACR0A, and bits 8, 4, and 0 in DMABCR, by the DTC. Bit 0 WE0A Description 0 Writes to all bits in DMACR0A, and bits 8, 4, and 0 in DMABCR are disabled (Initial value) 1 Writes to all bits in DMACR0A, and bits 8, 4, and 0 in DMABCR are enabled Writes by the DTC to bits 15 to 12 (FAE and SAE) in DMABCR are invalid regardless of the DMAWER settings. These bits should be changed, if necessary, by CPU processing. In writes by the DTC to bits 7 to 4 (DTE) in DMABCR, 1 can be written without first reading 0. To reactivate a channel set to full address mode, write 1 to both Write Enable A and Write Enable B for the channel to be reactivated. MAR, IOAR, and ETCR are always write-enabled regardless of the DMAWER settings. When modifying these registers, the channel for which the modification is to be made should be halted. 7.4.2 Bit DMA Terminal Control Register (DMATCR) : 7 6 5 4 3 2 1 0 -- -- TEE1 TEE0 -- -- -- -- Initial value : 0 0 0 0 0 0 0 0 R/W -- -- R/W R/W -- -- -- -- : DMATCR is an 8-bit readable/writable register that controls enabling or disabling of DMAC transfer end pin output. A port can be set for output automatically, and a transfer end signal output, by setting the appropriate bit. DMATCR is initialized to H'00 by a reset, and in hardware standby mode. Bits 7 and 6--Reserved: Read-only bits, always read as 0. Bit 5--Transfer End Enable 1 (TEE1): Enables or disables transfer end pin 1 (TEND1) output. Bit 5 TEE1 Description 0 TEND1 pin output disabled 1 TEND1 pin output enabled Rev. 4.0, 03/03, page 244 of 1358 (Initial value) Bit 4--Transfer End Enable 0 (TEE0): Enables or disables transfer end pin 0 (TEND0) output. Bit 4 TEE0 Description 0 TEND0 pin output disabled 1 TEND0 pin output enabled (Initial value) The TEND pins are assigned only to channel B in short address mode. The transfer end signal indicates the transfer cycle in which the transfer counter reached 0, regardless of the transfer source. An exception is block transfer mode, in which the transfer end signal indicates the transfer cycle in which the block counter reached 0. Bits 3 to 0--Reserved: Read-only bits, always read as 0. 7.4.3 Module Stop Control Register (MSTPCR) MSTPCRH Bit MSTPCRL : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Initial value : 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 R/W : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W MSTPCR is a 16-bit readable/writable register that performs module stop mode control. When the MSTP15 bit in MSTPCR is set to 1, the DMAC operation stops at the end of the bus cycle and a transition is made to module stop mode. For details, see section 21.5, Module Stop Mode. MSTPCR is initialized to H'3FFF by a reset and in hardware standby mode. It is not initialized in software standby mode. Bit 15--Module Stop (MSTP15): Specifies the DMAC module stop mode. Bits 15 MSTP15 Description 0 DMAC module stop mode cleared 1 DMAC module stop mode set (Initial value) Rev. 4.0, 03/03, page 245 of 1358 7.5 Operation 7.5.1 Transfer Modes Table 7-5 lists the DMAC modes. Table 7-5 DMAC Transfer Modes Transfer Mode Transfer Source Remarks Short address mode * TPU channel 0 to 5 compare match/input capture A interrupt * Up to 4 channels can operate independently Dual (1) Sequential address mode mode (2) Idle mode (3) Repeat mode * SCI transmit-dataempty interrupt * SCI receive-data-full interrupt * A/D converter conversion end interrupt * External request * External request applies to channel B only * Single address mode applies to channel B only * Modes (1), (2), and (3) can also be specified for single address mode (4) Single address mode Full address mode (5) Normal mode * External request * Auto-request (6) Block transfer mode * TPU channel 0 to 5 compare match/input capture A interrupt * SCI transmit-dataempty interrupt * SCI receive-data-full interrupt * A/D converter conversion end interrupt * External request Rev. 4.0, 03/03, page 246 of 1358 * Max. 2-channel operation, combining channels A and B * With auto-request, burst mode transfer or cycle steal transfer can be selected Operation in each mode is summarized below. Sequential Mode: In response to a single transfer request, the specified number of transfers are carried out, one byte or one word at a time. An interrupt request can be sent to the CPU or DTC when the specified number of transfers have been completed. One address is specified as 24 bits, and the other as 16 bits. The transfer direction is programmable. Idle Mode: In response to a single transfer request, the specified number of transfers are carried out, one byte or one word at a time. An interrupt request can be sent to the CPU or DTC when the specified number of transfers have been completed. One address is specified as 24 bits, and the other as 16 bits. The transfer source address and transfer destination address are fixed. The transfer direction is programmable. Repeat Mode: In response to a single transfer request, the specified number of transfers are carried out, one byte or one word at a time. When the specified number of transfers have been completed, the addresses and transfer counter are restored to their original settings, and operation is continued. No interrupt request is sent to the CPU or DTC. One address is specified as 24 bits, and the other as 16 bits. The transfer direction is programmable. Single Address Mode: In response to a single transfer request, the specified number of transfers are carried out between external memory and an external device, one byte or one word at a time. Unlike dual address mode, source and destination accesses are performed in parallel. Therefore, either the source or the destination is an external device which can be accessed with a strobe alone, using the DACK pin. One address is specified as 24 bits, and for the other, the pin is set automatically. The transfer direction is programmable. Sequential mode, idle mode, and repeat mode can also be specified for single address mode. Normal Mode * Auto-request By means of register settings only, the DMAC is activated, and transfer continues until the specified number of transfers have been completed. An interrupt request can be sent to the CPU or DTC when transfer is completed. Both addresses are specified as 24 bits. Cycle steal mode The bus is released to another bus master after each byte or word transfer. Burst mode The bus is held and transfer continued until the specified number of transfers have been completed. * External request In response to a single transfer request, the specified number of transfers are carried out, one byte or one word at a time. An interrupt request can be sent to the CPU or DTC when the specified number of transfers have been completed. Both addresses are specified as 24 bits. Rev. 4.0, 03/03, page 247 of 1358 Block Transfer Mode: In response to a single transfer request, a block transfer of the specified block size is carried out. This is repeated the specified number of times, once each time there is a transfer request. At the end of each single block transfer, one address is restored to its original setting. An interrupt request can be sent to the CPU or DTC when the specified number of block transfers have been completed. Both addresses are specified as 24 bits. 7.5.2 Sequential Mode Sequential mode can be specified by clearing the RPE bit in DMACR to 0. In sequential mode, MAR is updated after each byte or word transfer in response to a single transfer request, and this is executed the number of times specified in ETCR. One address is specified by MAR, and the other by IOAR. The transfer direction can be specified by the DTDIR bit in DMACR. Table 7-6 summarizes register functions in sequential mode. Table 7-6 Register Functions in Sequential Mode Function Register DTDIR = 0 DTDIR = 1 Initial Setting 23 0 Source address register MAR 23 15 H'FF Destination Start address of Incremented/ address transfer destination decremented every register or transfer source transfer 0 Destination Source IOAR 15 address register address register 0 Transfer counter ETCR Legend MAR : Memory address register IOAR : I/O address register ETCR : Execute transfer count register DTDIR : Data transfer direction bit Rev. 4.0, 03/03, page 248 of 1358 Operation Start address of Fixed transfer source or transfer destination Number of transfers Decremented every transfer; transfer ends when count reaches H'0000 MAR specifies the start address of the transfer source or transfer destination as 24 bits. MAR is incremented or decremented by 1 or 2 each time a byte or word is transferred. IOAR specifies the lower 16 bits of the other address. The 8 bits above IOAR have a value of H'FF. Figure 7-3 illustrates operation in sequential mode. Address T Transfer IOAR 1 byte or word transfer performed in response to 1 transfer request Address B Legend Address T = L Address B = L + ( 1)DTID * (2DTSZ * (N 1)) Where : L = Value set in MAR N = Value set in ETCR Figure 7-3 Operation in Sequential Mode The number of transfers is specified as 16 bits in ETCR. ETCR is decremented by 1 each time a transfer is executed, and when its value reaches H'0000, the DTE bit is cleared and transfer ends. If the DTIE bit is set to 1 at this time, an interrupt request is sent to the CPU or DTC. The maximum number of transfers, when H'0000 is set in ETCR, is 65,536. Rev. 4.0, 03/03, page 249 of 1358 Transfer requests (activation sources) consist of A/D converter conversion end interrupts, external requests, SCI transmission data empty/reception data full interrupts, and TPU channel 0 to 5 compare match/input capture A interrupts. External requests can be set for channel B only. Figure 7-4 shows an example of the setting procedure for sequential mode. [1] Set each bit in DMABCRH. Clear the FAE bit to 0 to select short address mode. Specify enabling or disabling of internal interrupt clearing with the DTA bit. Sequential mode setting Set DMABCRH [1] [2] Set the transfer source address and transfer destination address in MAR and IOAR. [3] Set the number of transfers in ETCR. Set transfer source and transfer destination addresses [2] Set number of transfers [3] Set DMACR [4] [4] Set each bit in DMACR. Set the transfer data size with the DTSZ bit. Specify whether MAR is to be incremented or decremented with the DTID bit. Clear the RPE bit to 0 to select sequential mode. Specify the transfer direction with the DTDIR bit. Select the activation source with bits DTF3 to DTF0. [5] Read the DTE bit in DMABCRL as 0. Read DMABCRL [5] Set DMABCRL [6] [6] Set each bit in DMABCRL. Specify enabling or disabling of transfer end interrupts with the DTIE bit. Set the DTE bit to 1 to enable transfer. Sequential mode Figure 7-4 Example of Sequential Mode Setting Procedure Rev. 4.0, 03/03, page 250 of 1358 7.5.3 Idle Mode Idle mode can be specified by setting the RPE bit and DTIE bit in DMACR to 1. In idle mode, one byte or word is transferred in response to a single transfer request, and this is executed the number of times specified in ETCR. One address is specified by MAR, and the other by IOAR. The transfer direction can be specified by the DTDIR bit in DMACR. Table 7-7 summarizes register functions in idle mode. Table 7-7 Register Functions in Idle Mode Function Register DTDIR = 0 DTDIR = 1 Initial Setting 23 0 Source address register MAR 23 15 H'FF Destination Start address of Fixed address transfer destination register or transfer source 0 Destination Source IOAR 15 address register address register 0 Transfer counter ETCR Operation Start address of Fixed transfer source or transfer destination Number of transfers Decremented every transfer; transfer ends when count reaches H'0000 Legend MAR : Memory address register IOAR : I/O address register ETCR : Execute transfer count register DTDIR : Data transfer direction bit MAR specifies the start address of the transfer source or transfer destination as 24 bits. MAR is neither incremented nor decremented each time a byte or word is transferred. IOAR specifies the lower 16 bits of the other address. The 8 bits above IOAR have a value of H'FF. Rev. 4.0, 03/03, page 251 of 1358 Figure 7-5 illustrates operation in idle mode. Transfer MAR IOAR 1 byte or word transfer performed in response to 1 transfer request Figure 7-5 Operation in Idle Mode The number of transfers is specified as 16 bits in ETCR. ETCR is decremented by 1 each time a transfer is executed, and when its value reaches H'0000, the DTE bit is cleared and transfer ends. If the DTIE bit is set to 1 at this time, an interrupt request is sent to the CPU or DTC. The maximum number of transfers, when H'0000 is set in ETCR, is 65,536. Transfer requests (activation sources) consist of A/D converter conversion end interrupts, external requests, SCI transmission data empty and reception data full interrupts, and TPU channel 0 to 5 compare match/input capture A interrupts. External requests can be set for channel B only. When the DMAC is used in single address mode, only channel B can be set. Rev. 4.0, 03/03, page 252 of 1358 Figure 7-6 shows an example of the setting procedure for idle mode. [1] Set each bit in DMABCRH. Clear the FAE bit to 0 to select short address mode. Specify enabling or disabling of internal interrupt clearing with the DTA bit. Idle mode setting Set DMABCRH [1] [2] Set the transfer source address and transfer destination address in MAR and IOAR. [3] Set the number of transfers in ETCR. Set transfer source and transfer destination addresses [2] Set number of transfers [3] Set DMACR [4] [4] Set each bit in DMACR. Set the transfer data size with the DTSZ bit. Specify whether MAR is to be incremented or decremented with the DTID bit. Set the RPE bit to 1. Specify the transfer direction with the DTDIR bit. Select the activation source with bits DTF3 to DTF0. [5] Read the DTE bit in DMABCRL as 0. [6] Set each bit in DMABCRL. Set the DTIE bit to 1. Set the DTE bit to 1 to enable transfer. Read DMABCRL [5] Set DMABCRL [6] Idle mode Figure 7-6 Example of Idle Mode Setting Procedure Rev. 4.0, 03/03, page 253 of 1358 7.5.4 Repeat Mode Repeat mode can be specified by setting the RPE bit in DMACR to 1, and clearing the DTIE bit to 0. In repeat mode, MAR is updated after each byte or word transfer in response to a single transfer request, and this is executed the number of times specified in ETCR. On completion of the specified number of transfers, MAR and ETCRL are automatically restored to their original settings and operation continues. One address is specified by MAR, and the other by IOAR. The transfer direction can be specified by the DTDIR bit in DMACR. Table 7-8 summarizes register functions in repeat mode. Table 7-8 Register Functions in Repeat Mode Function Register DTDIR = 0 DTDIR = 1 Initial Setting 23 0 Source address register MAR 23 Destination Start address of Incremented/ address transfer destination decremented every register or transfer source transfer. Initial setting is restored when value reaches H'0000 0 Destination Source 15 H'FF address register IOAR address register 0 Holds number of 7 Start address of Fixed transfer source or transfer destination Number of transfers Fixed transfers ETCRH 7 Operation 0 Transfer counter ETCRL Legend MAR : Memory address register IOAR : I/O address register ETCR : Execute transfer count register DTDIR : Data transfer direction bit Rev. 4.0, 03/03, page 254 of 1358 Number of transfers Decremented every transfer. Loaded with ETCRH value when count reaches H'00 MAR specifies the start address of the transfer source or transfer destination as 24 bits. MAR is incremented or decremented by 1 or 2 each time a byte or word is transferred. IOAR specifies the lower 16 bits of the other address. The 8 bits above IOAR have a value of H'FF. The number of transfers is specified as 8 bits by ETCRH and ETCRL. The maximum number of transfers, when H'00 is set in both ETCRH and ETCRL, is 256. In repeat mode, ETCRL functions as the transfer counter, and ETCRH is used to hold the number of transfers. ETCRL is decremented by 1 each time a transfer is executed, and when its value reaches H'00, it is loaded with the value in ETCRH. At the same time, the value set in MAR is restored in accordance with the values of the DTSZ and DTID bits in DMACR. The MAR restoration operation is as shown below. MAR = MAR - (-1)DTID * 2DTSZ * ETCRH The same value should be set in ETCRH and ETCRL. In repeat mode, operation continues until the DTE bit is cleared. To end the transfer operation, therefore, the DTE bit should be cleared to 0. A transfer end interrupt request is not sent to the CPU or DTC. By setting the DTE bit to 1 again after it has been cleared, the operation can be restarted from the transfer after that terminated when the DTE bit was cleared. Rev. 4.0, 03/03, page 255 of 1358 Figure 7-7 illustrates operation in repeat mode. Transfer Address T IOAR 1 byte or word transfer performed in response to 1 transfer request Legend Address T = L Address B = L + ( 1)DTID * (2DTSZ * (N 1)) Where : L = Value set in MAR N = Value set in ETCR Address B Figure 7-7 Operation in Repeat mode Transfer requests (activation sources) consist of A/D converter conversion end interrupts, external requests, SCI transmission data empty and reception data full interrupts, and TPU channel 0 to 5 compare match/input capture A interrupts. External requests can be set for channel B only. Rev. 4.0, 03/03, page 256 of 1358 Figure 7-8 shows an example of the setting procedure for repeat mode. [1] Set each bit in DMABCRH. Clear the FAE bit to 0 to select short address mode. Specify enabling or disabling of internal interrupt clearing with the DTA bit. Repeat mode setting Set DMABCRH [1] [2] Set the transfer source address and transfer destination address in MAR and IOAR. [3] Set the number of transfers in both ETCRH and ETCRL. Set transfer source and transfer destination addresses [2] Set number of transfers [3] Set DMACR [4] [4] Set each bit in DMACR. Set the transfer data size with the DTSZ bit. Specify whether MAR is to be incremented or decremented with the DTID bit. Set the RPE bit to 1. Specify the transfer direction with the DTDIR bit. Select the activation source with bits DTF3 to DTF0. [5] Read the DTE bit in DMABCRL as 0. Read DMABCRL [5] Set DMABCRL [6] [6] Set each bit in DMABCRL. Clear the DTIE bit to 0. Set the DTE bit to 1 to enable transfer. Repeat mode Figure 7-8 Example of Repeat Mode Setting Procedure Rev. 4.0, 03/03, page 257 of 1358 7.5.5 Single Address Mode Single address mode can only be specified for channel B. This mode can be specified by setting the SAE bit in DMABCR to 1 in short address mode. One address is specified by MAR, and the other is set automatically to the data transfer acknowledge pin (DACK). The transfer direction can be specified by the DTDIR bit in DMACR. Table 7-9 summarizes register functions in single address mode. Table 7-9 Register Functions in Single Address Mode Function Register DTDIR = 0 DTDIR = 1 Initial Setting 23 MAR DACK pin 15 Operation address register * Destination Start address of address transfer destination register or transfer source Write strobe Read strobe 0 Source 0 Transfer counter (Set automatically Strobe for external by SAE bit; IOAR is device invalid) Number of transfers * ETCR Legend MAR : Memory address register IOAR : I/O address register ETCR : Execute transfer register DTDIR : Data transfer direction bit DACK : Data transfer acknowledge Note: * See the operation descriptions in sections 7.5.2, Sequential Mode, 7.5.3, Idle Mode, and 7.5.4, Repeat Mode. MAR specifies the start address of the transfer source or transfer destination as 24 bits. IOAR is invalid; in its place the strobe for external devices (DACK) is output. Rev. 4.0, 03/03, page 258 of 1358 Figure 7-9 illustrates operation in single address mode (when sequential mode is specified). Address T DACK Transfer 1 byte or word transfer performed in response to 1 transfer request Address B Legend Address T = L Address B = L + ( 1)DTID * (2DTSZ * (N 1)) Where : L = Value set in MAR N = Value set in ETCR Figure 7-9 Operation in Single Address Mode (When Sequential Mode is Specified) Rev. 4.0, 03/03, page 259 of 1358 Figure 7-10 shows an example of the setting procedure for single address mode (when sequential mode is specified). Single address mode setting Set DMABCRH Set transfer source and transfer destination addresses [1] [1] Set each bit in DMABCRH. Clear the FAE bit to 0 to select short address mode. Set the SAE bit to 1 to select single address mode. Specify enabling or disabling of internal interrupt clearing with the DTA bit. [2] Set the transfer source address/transfer destination address in MAR. [2] Set number of transfers [3] Set DMACR [4] [3] Set the number of transfers in ETCR. [4] Set each bit in DMACR. Set the transfer data size with the DTSZ bit. Specify whether MAR is to be incremented or decremented with the DTID bit. Clear the RPE bit to 0 to select sequential mode. Specify the transfer direction with the DTDIR bit. Select the activation source with bits DTF3 to DTF0. [5] Read the DTE bit in DMABCRL as 0. Read DMABCRL [5] Set DMABCRL [6] [6] Set each bit in DMABCRL. Specify enabling or disabling of transfer end interrupts with the DTIE bit. Set the DTE bit to 1 to enable transfer. Single address mode Figure 7-10 Example of Single Address Mode Setting Procedure (When Sequential Mode is Specified) Rev. 4.0, 03/03, page 260 of 1358 7.5.6 Normal Mode In normal mode, transfer is performed with channels A and B used in combination. Normal mode can be specified by setting the FAE bit in DMABCR to 1 and clearing the BLKE bit in DMACRA to 0. In normal mode, MAR is updated after each byte or word transfer in response to a single transfer request, and this is executed the number of times specified in ETCRA. The transfer source is specified by MARA, and the transfer destination by MARB. Table 7-10 summarizes register functions in normal mode. Table 7-10 Register Functions in Normal Mode Register Function 23 0 Source address MARA 23 register 0 Destination MARB 15 address register 0 Transfer counter ETCRA Initial Setting Operation Start address of transfer source Incremented/decremented every transfer, or fixed Start address of Incremented/decremented transfer destination every transfer, or fixed Number of transfers Decremented every transfer; transfer ends when count reaches H'0000 Legend MARA : Memory address register A MARB : Memory address register B ETCRA : Execute transfer count register A MARA and MARB specify the start addresses of the transfer source and transfer destination, respectively, as 24 bits. MAR can be incremented or decremented by 1 or 2 each time a byte or word is transferred, or can be fixed. Incrementing, decrementing, or holding a fixed value can be set separately for MARA and MARB. The number of transfers is specified by ETCRA as 16 bits. ETCRA is decremented each time a transfer is performed, and when its value reaches H'0000 the DTE bit is cleared and transfer ends. If the DTIE bit is set to 1 at this time, an interrupt request is sent to the CPU or DTC. The maximum number of transfers, when H'0000 is set in ETCRA, is 65,536. Rev. 4.0, 03/03, page 261 of 1358 Figure 7-11 illustrates operation in normal mode. Transfer Address TA Address BB Address BA Legend Address Address Address Address Where : TA TB BA BB LA LB N Address TB = LA = LB = LA + SAIDE * ( 1)SAID * (2DTSZ * (N 1)) = LB + DAIDE * ( 1)DAID * (2DTSZ * (N 1)) = Value set in MARA = Value set in MARB = Value set in ETCRA Figure 7-11 Operation in Normal Mode Transfer requests (activation sources) are external requests and auto-requests. With auto-request, the DMAC is only activated by register setting, and the specified number of transfers are performed automatically. With auto-request, cycle steal mode or burst mode can be selected. In cycle steal mode, the bus is released to another bus master each time a transfer is performed. In burst mode, the bus is held continuously until transfer ends. Rev. 4.0, 03/03, page 262 of 1358 For setting details, see section 7.3.4, DMA Control Register (DMACR). Figure 7-12 shows an example of the setting procedure for normal mode. [1] Set each bit in DMABCRH. Set the FAE bit to 1 to select full address mode. Specify enabling or disabling of internal interrupt clearing with the DTA bit. Normal mode setting Set DMABCRH [1] [2] Set the transfer source address in MARA, and the transfer destination address in MARB. [3] Set the number of transfers in ETCRA. Set transfer source and transfer destination addresses [2] Set number of transfers [3] Set DMACR [4] [4] Set each bit in DMACRA and DMACRB. Set the transfer data size with the DTSZ bit. Specify whether MARA is to be incremented, decremented, or fixed, with the SAID and SAIDE bits. Clear the BLKE bit to 0 to select normal mode. Specify whether MARB is to be incremented, decremented, or fixed, with the DAID and DAIDE bits. Select the activation source with bits DTF3 to DTF0. [5] Read DTE = 0 and DTME = 0 in DMABCRL. Read DMABCRL [5] Set DMABCRL [6] [6] Set each bit in DMABCRL. Specify enabling or disabling of transfer end interrupts with the DTIE bit. Set both the DTME bit and the DTE bit to 1 to enable transfer. Normal mode Figure 7-12 Example of Normal Mode Setting Procedure Rev. 4.0, 03/03, page 263 of 1358 7.5.7 Block Transfer Mode In block transfer mode, transfer is performed with channels A and B used in combination. Block transfer mode can be specified by setting the FAE bit in DMABCR and the BLKE bit in DMACRA to 1. In block transfer mode, a transfer of the specified block size is carried out in response to a single transfer request, and this is executed the specified number of times. The transfer source is specified by MARA, and the transfer destination by MARB. Either the transfer source or the transfer destination can be selected as a block area (an area composed of a number of bytes or words). Table 7-11 summarizes register functions in block transfer mode. Table 7-11 Register Functions in Block Transfer Mode Register Function 23 0 Source address register MARA 23 0 Destination address register MARB 7 0 Holds block ETCRAH Initial Setting Operation Start address of transfer source Incremented/decremented every transfer, or fixed Start address of Incremented/decremented transfer destination every transfer, or fixed Block size Fixed Block size Decremented every transfer; ETCRH value copied when count reaches H'00 Number of block transfers Decremented every block transfer; transfer ends when count reaches H'0000 size Block size 0 counter 7 ETCRAL 0 Block transfer 15 ETCRB Legend MARA MARB ETCRA ETCRB counter : Memory address register A : Memory address register B : Execute transfer count register A : Execute transfer count register B MARA and MARB specify the start addresses of the transfer source and transfer destination, respectively, as 24 bits. MAR can be incremented or decremented by 1 or 2 each time a byte or word is transferred, or can be fixed. Incrementing, decrementing, or holding a fixed value can be set separately for MARA and MARB. Whether a block is to be designated for MARA or for MARB is specified by the BLKDIR bit in DMACRA. Rev. 4.0, 03/03, page 264 of 1358 To specify the number of transfers, if M is the size of one block (where M = 1 to 256) and N transfers are to be performed (where N = 1 to 65,536), M is set in both ETCRAH and ETCRAL, and N in ETCRB. Figure 7-13 illustrates operation in block transfer mode when MARB is designated as a block area. Address TB Address TA 1st block 2nd block Transfer Block area Address BB Consecutive transfer of M bytes or words is performed in response to one request Nth block Address BA Legend Address Address Address Address Where : TA TB BA BB LA LB N M = LA = LB = LA + SAIDE * ( 1)SAID * (2DTSZ * (M*N 1)) = LB + DAIDE * ( 1)DAID * (2DTSZ * (N 1)) = Value set in MARA = Value set in MARB = Value set in ETCRB = Value set in ETCRAH and ETCRAL Figure 7-13 Operation in Block Transfer Mode (BLKDIR = 0) Rev. 4.0, 03/03, page 265 of 1358 Figure 7-14 illustrates operation in block transfer mode when MARA is designated as a block area. Address TA Address TB Block area Transfer 1st block Consecutive transfer of M bytes or words is performed in response to one request Address BA 2nd block Nth block Address BB Legend Address Address Address Address Where : TA TB BA BB LA LB N M = LA = LB = LA + SAIDE * ( 1)SAID * (2DTSZ * (N 1)) = LB + DAIDE * ( 1)DAID * (2DTSZ * (M*N 1)) = Value set in MARA = Value set in MARB = Value set in ETCRB = Value set in ETCRAH and ETCRAL Figure 7-14 Operation in Block Transfer Mode (BLKDIR = 1) Rev. 4.0, 03/03, page 266 of 1358 ETCRAL is decremented by 1 each time a byte or word transfer is performed. In response to a single transfer request, burst transfer is performed until the value in ETCRAL reaches H'00. ETCRAL is then loaded with the value in ETCRAH. At this time, the value in the MAR register for which a block designation has been given by the BLKDIR bit in DMACRA is restored in accordance with the DTSZ, SAID/DAID, and SAIDE/DAIDE bits in DMACR. ETCRB is decremented by 1 after every block transfer, and when the count reaches H'0000 the DTE bit is cleared and transfer ends. If the DTIE bit is set to 1 at this point, an interrupt request is sent to the CPU or DTC. Figure 7-15 shows the operation flow in block transfer mode. Rev. 4.0, 03/03, page 267 of 1358 Start (DTE = DTME = 1) Transfer request? No Yes Acquire bus Read address specified by MARA MARA=MARA+SAIDE*( 1)SAID*2DTSZ Write to address specified by MARB MARB=MARB+DAIDE*( 1)DAID *2DTSZ ETCRAL=ETCRAL 1 ETCRAL=H'00 No Yes Release bus ETCRAL=ETCRAH BLKDIR=0 No Yes MARB=MARB DAIDE*( 1)DAID*2DTSZ*ETCRAH MARA=MARA SAIDE*( 1)SAID*2DTSZ*ETCRAH ETCRB=ETCRB 1 No ETCRB=H'0000 Yes Clear DTE bit to 0 to end transfer Figure 7-15 Operation Flow in Block Transfer Mode Transfer requests (activation sources) consist of A/D converter conversion end interrupts, external requests, SCI transmission data empty and reception data full interrupts, and TPU channel 0 to 5 compare match/input capture A interrupts. Rev. 4.0, 03/03, page 268 of 1358 For details, see section 7.3.4, DMA Control Register (DMACR). Figure 7-16 shows an example of the setting procedure for block transfer mode. [1] Set each bit in DMABCRH. Set the FAE bit to 1 to select full address mode. Specify enabling or disabling of internal interrupt clearing with the DTA bit. Block transfer mode setting Set DMABCRH Set transfer source and transfer destination addresses [1] [2] Set number of transfers [3] Set DMACR [4] Read DMABCRL [5] Set DMABCRL [6] [2] Set the transfer source address in MARA, and the transfer destination address in MARB. [3] Set the block size in both ETCRAH and ETCRAL. Set the number of transfers in ETCRB. [4] Set each bit in DMACRA and DMACRB. Set the transfer data size with the DTSZ bit. Specify whether MARA is to be incremented, decremented, or fixed, with the SAID and SAIDE bits. Set the BLKE bit to 1 to select block transfer mode. Specify whether the transfer source or the transfer destination is a block area with the BLKDIR bit. Specify whether MARB is to be incremented, decremented, or fixed, with the DAID and DAIDE bits. Select the activation source with bits DTF3 to DTF0. [5] Read DTE = 0 and DTME = 0 in DMABCRL. Block transfer mode [6] Set each bit in DMABCRL. Specify enabling or disabling of transfer end interrupts to the CPU with the DTIE bit. Set both the DTME bit and the DTE bit to 1 to enable transfer. Figure 7-16 Example of Block Transfer Mode Setting Procedure Rev. 4.0, 03/03, page 269 of 1358 7.5.8 DMAC Activation Sources DMAC activation sources consist of internal interrupts, external requests, and auto-requests. The activation sources that can be specified depend on the transfer mode and the channel, as shown in table 7-12. Table 7-12 DMAC Activation Sources Short Address Mode Activation Source Internal Interrupts Channels 0A and 1A Channels 0B and 1B Normal Mode ADI X TXI0 X RXI0 X TXI1 X RXI1 X TGI0A X TGI1A X TGI2A X TGI3A X TGI4A X TGI5A External Requests Full Address Mode X DREQ pin falling edge input X DREQ pin low-level input X Auto-request Block Transfer Mode X X X Legend : Can be specified X : Cannot be specified Activation by Internal Interrupt: An interrupt request selected as a DMAC activation source can be sent simultaneously to the CPU and DTC. For details, see section 5, Interrupt Controller. With activation by an internal interrupt, the DMAC accepts the request independently of the interrupt controller. Consequently, interrupt controller priority settings are irrelevant. If the DMAC is activated by a CPU interrupt source or an interrupt source that is not used as a DTC activation source (DTA = 1), the interrupt source flag is cleared automatically by the DMA transfer. With ADI, TXI, and RXI interrupts, however, the interrupt source flag is not cleared unless the prescribed register is accessed in a DMA transfer. If the same interrupt is used as an activation source for more than one channel, the interrupt request flag is cleared when the highestRev. 4.0, 03/03, page 270 of 1358 priority channel is activated first. Transfer requests for other channels are held pending in the DMAC, and activation is carried out in order of priority. When DTE = 0, such as after completion of a transfer, a request from the selected activation source is not sent to the DMAC, regardless of the DTA bit. In this case, the relevant interrupt request is sent to the CPU or DTC. In case of overlap with a CPU interrupt source or DTC activation source (DTA = 0), the interrupt request flag is not cleared by the DMAC. Activation by External Request: If an external request (DREQ pin) is specified as an activation source, the relevant port should be set to input mode in advance. Level sensing or edge sensing can be used for external requests. External request operation in normal mode (short address mode or full address mode) is described below. When edge sensing is selected, a 1-byte or 1-word transfer is executed each time a high-to-low transition is detected on the DREQ pin. The next transfer may not be performed if the next edge is input before transfer is completed. When level sensing is selected, the DMAC stands by for a transfer request while the DREQ pin is held high. While the DREQ pin is held low, transfers continue in succession, with the bus being released each time a byte or word is transferred. If the DREQ pin goes high in the middle of a transfer, the transfer is interrupted and the DMAC stands by for a transfer request. Activation by Auto-Request: Auto-request activation is performed by register setting only, and transfer continues to the end. With auto-request activation, cycle steal mode or burst mode can be selected. In cycle steal mode, the DMAC releases the bus to another bus master each time a byte or word is transferred. DMA and CPU cycles usually alternate. In burst mode, the DMAC keeps possession of the bus until the end of the transfer, and transfer is performed continuously. Single Address Mode: The DMAC can operate in dual address mode in which read cycles and write cycles are separate cycles, or single address mode in which read and write cycles are executed in parallel. In dual address mode, transfer is performed with the source address and destination address specified separately. Rev. 4.0, 03/03, page 271 of 1358 In single address mode, on the other hand, transfer is performed between external space in which either the transfer source or the transfer destination is specified by an address, and an external device for which selection is performed by means of the DACK strobe, without regard to the address. Figure 7-16 shows the data bus in single address mode. RD HWR, LWR A23 to A0 Address bus External memory (Read) D15 to D0 (high impedance) Data bus Chip (Write) External device DACK Figure 7-17 Data Bus in Single Address Mode When using the DMAC for single address mode reading, transfer is performed from external memory to the external device, and the DACK pin functions as a write strobe for the external device. When using the DMAC for single address mode writing, transfer is performed from the external device to external memory, and the DACK pin functions as a read strobe for the external device. Since there is no directional control for the external device, one or other of the above single directions should be used. Bus cycles in single address mode are in accordance with the settings of the bus controller for the external memory area. On the external device side, DACK is output in synchronization with the address strobe. For details of bus cycles, see section 7.5.11, DMAC Bus Cycles (Single Address Mode). Do not specify internal space for transfer addresses in single address mode. Rev. 4.0, 03/03, page 272 of 1358 7.5.9 Basic DMAC Bus Cycles An example of the basic DMAC bus cycle timing is shown in figure 7-18. In this example, wordsize transfer is performed from 16-bit , 2-state access space to 8-bit, 3-state access space. When the bus is transferred from the CPU to the DMAC, a source address read and destination address write are performed. The bus is not released in response to another bus request, etc., between these read and write operations. As with CPU cycles, DMA cycles conform to the bus controller settings. CPU cycle DMAC cycle (1-word transfer) T1 T2 T1 T2 T3 T1 CPU cycle T2 T3 f Source address Destination address Address bus RD HWR LWR Figure 7-18 Example of DMA Transfer Bus Timing The address is not output to the external address bus in an access to on-chip memory or an internal I/O register. Rev. 4.0, 03/03, page 273 of 1358 7.5.10 DMAC Bus Cycles (Dual Address Mode) Short Address Mode: Figure 7-19 shows a transfer example in which TEND output is enabled and byte-size short address mode transfer (sequential/idle/repeat mode) is performed from external 8-bit, 2-state access space to internal I/O space. DMA read DMA write DMA read DMA write DMA read DMA write DMA dead f Address bus RD HWR LWR TEND Bus release Bus release Bus release Last transfer cycle Bus release Figure 7-19 Example of Short Address Mode Transfer A one-byte or one-word transfer is performed for one transfer request, and after the transfer the bus is released. While the bus is released one or more bus cycles are executed by the CPU or DTC. In the transfer end cycle (the cycle in which the transfer counter reaches 0), a one-state DMA dead cycle is inserted after the DMA write cycle. In repeat mode, when TEND output is enabled, TEND output goes low in the transfer cycle in which the transfer counter reaches 0. Rev. 4.0, 03/03, page 274 of 1358 Full Address Mode (Cycle Steal Mode): Figure 7-20 shows a transfer example in which TEND output is enabled and word-size full address mode transfer (cycle steal mode) is performed from external 16-bit, 2-state access space to external 16-bit, 2-state access space. DMA read DMA write DMA read DMA write DMA read DMA write DMA dead f Address bus RD HWR LWR TEND Bus release Bus release Bus release Last transfer cycle Bus release Figure 7-20 Example of Full Address Mode (Cycle Steal) Transfer A one-byte or one-word transfer is performed, and after the transfer the bus is released. While the bus is released one bus cycle is executed by the CPU or DTC. In the transfer end cycle (the cycle in which the transfer counter reaches 0), a one-state DMA dead cycle is inserted after the DMA write cycle. Rev. 4.0, 03/03, page 275 of 1358 Full Address Mode (Burst Mode): Figure 7-21 shows a transfer example in which TEND output is enabled and word-size full address mode transfer (burst mode) is performed from external 16bit, 2-state access space to external 16-bit, 2-state access space. DMA read DMA write DMA read DMA write DMA read DMA write DMA dead f Address bus RD HWR LWR TEND Last transfer cycle Bus release Bus release Burst transfer Figure 7-21 Example of Full Address Mode (Burst Mode) Transfer In burst mode, one-byte or one-word transfers are executed consecutively until transfer ends. In the transfer end cycle (the cycle in which the transfer counter reaches 0), a one-state DMA dead cycle is inserted after the DMA write cycle. If a request from another higher-priority channel is generated after burst transfer starts, that channel has to wait until the burst transfer ends. If an NMI is generated while a channel designated for burst transfer is in the transfer enabled state, the DTME bit is cleared and the channel is placed in the transfer disabled state. If burst transfer has already been activated inside the DMAC, the bus is released on completion of a one-byte or one-word transfer within the burst transfer, and burst transfer is suspended. If the last transfer cycle of the burst transfer has already been activated inside the DMAC, execution continues to the end of the transfer even if the DTME bit is cleared. Rev. 4.0, 03/03, page 276 of 1358 Full Address Mode (Block Transfer Mode): Figure 7-22 shows a transfer example in which TEND output is enabled and word-size full address mode transfer (block transfer mode) is performed from internal 16-bit, 1-state access space to external 16-bit, 2-state access space. DMA read DMA write DMA read DMA write DMA dead DMA read DMA write DMA read DMA write DMA dead f Address bus RD HWR LWR TEND Bus release Block transfer Bus release Last block transfer Bus release Figure 7-22 Example of Full Address Mode (Block Transfer Mode) Transfer A one-block transfer is performed for one transfer request, and after the transfer the bus is released. While the bus is released, one or more bus cycles are executed by the CPU or DTC. In the transfer end cycle of each block (the cycle in which the transfer counter reaches 0), a onestate DMA dead cycle is inserted after the DMA write cycle. One block is transmitted without interruption. NMI generation does not affect block transfer operation. Rev. 4.0, 03/03, page 277 of 1358 DREQ Pin Falling Edge Activation Timing: Set the DTA bit for the channel for which the DREQ pin is selected to 1. Figure 7-23 shows an example of DREQ pin falling edge activated normal mode transfer. DMA read Bus release DMA write Bus release DMA read DMA write Bus release Transfer source Transfer destination f DREQ Address bus DMA control Channel Transfer source Transfer destination Read Idle Write Read Idle Request clear period Request [1] [2] Idle Request clear period Request Minimum of 2 cycles Write Minimum of 2 cycles [3] [4] [5] Acceptance resumes [6] [7] Acceptance resumes Acceptance after transfer enabling; the DREQ pin low level is sampled on the rising edge of f, and the request is held. [2] [5] The request is cleared at the next bus break, and activation is started in the DMAC. [3] [6] Start of DMA cycle; DREQ pin high level sampling on the rising edge of f starts. [4] [7] When the DREQ pin high level has been sampled, acceptance is resumed after the write cycle is completed. (As in [1], the DREQ pin low level is sampled on the rising edge of f, and the request is held.) [1] Note: In write data buffer mode, bus breaks from [2] to [7] may be hidden, and not visible. Figure 7-23 Example of DREQ Pin Falling Edge Activated Normal Mode Transfer DREQ pin sampling is performed every cycle, with the rising edge of the next cycle after the end of the DMABCR write cycle for setting the transfer enabled state as the starting point. When the DREQ pin low level is sampled while acceptance by means of the DREQ pin is possible, the request is held in the DMAC. Then, when activation is initiated in the DMAC, the request is cleared, and DREQ pin high level sampling for edge detection is started. If DREQ pin high level sampling has been completed by the time the DMA write cycle ends, acceptance resumes after the end of the write cycle, DREQ pin low level sampling is performed again, and this operation is repeated until the transfer ends. Rev. 4.0, 03/03, page 278 of 1358 Figure 7-24 shows an example of DREQ pin falling edge activated block transfer mode transfer. 1 block transfer DMA read Bus release 1 block transfer DMA write DMA Bus dead release DMA read DMA write DMA dead Bus release f DREQ Address bus DMA control Channel Transfer source Idle Read Request Transfer destination Write Dead Request clear period Idle [2] Read Write Transfer destination Dead Idle Request clear period Request Minimum of 2 cycles [1] Transfer source Minimum of 2 cycles [3] [4] [5] [6] [7] Acceptance resumes Acceptance resumes Acceptance after transfer enabling; the DREQ pin low level is sampled on the rising edge of f, and the request is held. [2] [5] The request is cleared at the next bus break, and activation is started in the DMAC. [3] [6] Start of DMA cycle; DREQ pin high level sampling on the rising edge of f starts. [4] [7] When the DREQ pin high level has been sampled, acceptance is resumed after the dead cycle is completed. (As in [1], the DREQ pin low level is sampled on the rising edge of f, and the request is held.) [1] Note: In write data buffer mode, bus breaks from [2] to [7] may be hidden, and not visible. Figure 7-24 Example of DREQ Pin Falling Edge Activated Block Transfer Mode Transfer DREQ pin sampling is performed every cycle, with the rising edge of the next cycle after the end of the DMABCR write cycle for setting the transfer enabled state as the starting point. When the DREQ pin low level is sampled while acceptance by means of the DREQ pin is possible, the request is held in the DMAC. Then, when activation is initiated in the DMAC, the request is cleared, and DREQ pin high level sampling for edge detection is started. If DREQ pin high level sampling has been completed by the time the DMA dead cycle ends, acceptance resumes after the end of the dead cycle, DREQ pin low level sampling is performed again, and this operation is repeated until the transfer ends. Rev. 4.0, 03/03, page 279 of 1358 DREQ Level Activation Timing (Normal Mode): Set the DTA bit for the channel for which the DREQ pin is selected to 1. Figure 7-25 shows an example of DREQ level activated normal mode transfer. DMA read DMA write Transfer source Transfer destination Bus release DMA read DMA write Transfer source Transfer destination Bus release Bus release f DREQ Address bus DMA control Idle Read Channel Request Write Idle Read Request clear period [1] [2] Idle Request clear period Request Minimum of 2 cycles Write Minimum of 2 cycles [3] [4] [5] Acceptance resumes [6] [7] Acceptance resumes Acceptance after transfer enabling; the DREQ pin low level is sampled on the rising edge of f, and the request is held. [2] [5] The request is cleared at the next bus break, and activation is started in the DMAC. [3] [6] The DMA cycle is started. [4] [7] Acceptance is resumed after the write cycle is completed. (As in [1], the DREQ pin low level is sampled on the rising edge of f, and the request is held.) [1] Note: In write data buffer mode, bus breaks from [2] to [7] may be hidden, and not visible. Figure 7-25 Example of DREQ Level Activated Normal Mode Transfer DREQ pin sampling is performed every cycle, with the rising edge of the next cycle after the end of the DMABCR write cycle for setting the transfer enabled state as the starting point. When the DREQ pin low level is sampled while acceptance by means of the DREQ pin is possible, the request is held in the DMAC. Then, when activation is initiated in the DMAC, the request is cleared. After the end of the write cycle, acceptance resumes, DREQ pin low level sampling is performed again, and this operation is repeated until the transfer ends. Rev. 4.0, 03/03, page 280 of 1358 Figure 7-26 shows an example of DREQ level activated block transfer mode transfer. 1 block transfer DMA read Bus release 1 block transfer DMA write DMA Bus dead release DMA read DMA write DMA dead Bus release f DREQ Address bus DMA control Transfer source Read Idle Channel Dead Write Request clear period Request Idle [2] Read Write Transfer destination Dead Idle Request clear period Request Minimum of 2 cycles [1] Transfer source Transfer destination Minimum of 2 cycles [3] [4] [5] [6] [7] Acceptance resumes Acceptance resumes Acceptance after transfer enabling; the DREQ pin low level is sampled on the rising edge of f, and the request is held. [2] [5] The request is cleared at the next bus break, and activation is started in the DMAC. [3] [6] The DMA cycle is started. [4] [7] Acceptance is resumed after the dead cycle is completed. (As in [1], the DREQ pin low level is sampled on the rising edge of f, and the request is held.) [1] Note: In write data buffer mode, bus breaks from [2] to [7] may be hidden, and not visible. Figure 7-26 Example of DREQ Level Activated Block Transfer Mode Transfer DREQ pin sampling is performed every cycle, with the rising edge of the next cycle after the end of the DMABCR write cycle for setting the transfer enabled state as the starting point. When the DREQ pin low level is sampled while acceptance by means of the DREQ pin is possible, the request is held in the DMAC. Then, when activation is initiated in the DMAC, the request is cleared. After the end of the dead cycle, acceptance resumes, DREQ pin low level sampling is performed again, and this operation is repeated until the transfer ends. Rev. 4.0, 03/03, page 281 of 1358 7.5.11 DMAC Bus Cycles (Single Address Mode) Single Address Mode (Read): Figure 7-27 shows a transfer example in which TEND output is enabled and byte-size single address mode transfer (read) is performed from external 8-bit, 2-state access space to an external device. DMA read DMA read DMA read DMA DMA read dead f Address bus RD DACK TEND Bus release Bus release Bus release Bus Last transfer release cycle Bus release Figure 7-27 Example of Single Address Mode (Byte Read) Transfer Rev. 4.0, 03/03, page 282 of 1358 Figure 7-28 shows a transfer example in which TEND output is enabled and word-size single address mode transfer (read) is performed from external 8-bit, 2-state access space to an external device. DMA read DMA read DMA read DMA dead f Address bus RD DACK TEND Bus release Bus release Bus release Last transfer cycle Bus release Figure 7-28 Example of Single Address Mode (Word Read) Transfer A one-byte or one-word transfer is performed for one transfer request, and after the transfer the bus is released. While the bus is released, one or more bus cycles are executed by the CPU or DTC. In the transfer end cycle (the cycle in which the transfer counter reaches 0), a one-state DMA dead cycle is inserted after the DMA write cycle. Rev. 4.0, 03/03, page 283 of 1358 Single Address Mode (Write): Figure 7-29 shows a transfer example in which TEND output is enabled and byte-size single address mode transfer (write) is performed from an external device to external 8-bit, 2-state access space. DMA write DMA write DMA write DMA DMA write dead f Address bus HWR LWR DACK TEND Bus release Bus release Bus release Bus Last transfer release cycle Bus release Figure 7-29 Example of Single Address Mode (Byte Write) Transfer Rev. 4.0, 03/03, page 284 of 1358 Figure 7-30 shows a transfer example in which TEND output is enabled and word-size single address mode transfer (write) is performed from an external device to external 8-bit, 2-state access space. DMA write DMA write DMA write DMA dead f Address bus HWR LWR DACK TEND Bus release Bus release Bus release Last transfer cycle Bus release Figure 7-30 Example of Single Address Mode (Word Write) Transfer A one-byte or one-word transfer is performed for one transfer request, and after the transfer the bus is released. While the bus is released one or more bus cycles are executed by the CPU or DTC. In the transfer end cycle (the cycle in which the transfer counter reaches 0), a one-state DMA dead cycle is inserted after the DMA write cycle. Rev. 4.0, 03/03, page 285 of 1358 DREQ Pin Falling Edge Activation Timing: Set the DTA bit for the channel for which the DREQ pin is selected to 1. Figure 7-31 shows an example of DREQ pin falling edge activated single address mode transfer. Bus release DMA single Bus release DMA single Bus release f DREQ Transfer source/ destination Address bus Transfer source/ destination DACK DMA control Channel Single Idle Request Single Idle Request clear period [1] [2] Request clear period Request Minimum of 2 cycles Idle Minimum of 2 cycles [3] [4] [5] Acceptance resumes [6] [7] Acceptance resumes Acceptance after transfer enabling; the DREQ pin low level is sampled on the rising edge of f, and the request is held. [2] [5] The request is cleared at the next bus break, and activation is started in the DMAC. [3] [6] Start of DMA cycle; DREQ pin high level sampling on the rising edge of f starts. [4] [7] When the DREQ pin high level has been sampled, acceptance is resumed after the single cycle is completed. (As in [1], the DREQ pin low level is sampled on the rising edge of f, and the request is held.) [1] Note: In write data buffer mode, bus breaks from [2] to [7] may be hidden, and not visible. Figure 7-31 Example of DREQ Pin Falling Edge Activated Single Address Mode Transfer DREQ pin sampling is performed every cycle, with the rising edge of the next cycle after the end of the DMABCR write cycle for setting the transfer enabled state as the starting point. When the DREQ pin low level is sampled while acceptance by means of the DREQ pin is possible, the request is held in the DMAC. Then, when activation is initiated in the DMAC, the request is cleared, and DREQ pin high level sampling for edge detection is started. If DREQ pin high level sampling has been completed by the time the DMA single cycle ends, acceptance resumes after the end of the single cycle, DREQ pin low level sampling is performed again, and this operation is repeated until the transfer ends. Rev. 4.0, 03/03, page 286 of 1358 DREQ Pin Low Level Activation Timing: Set the DTA bit for the channel for which the DREQ pin is selected to 1. Figure 7-32 shows an example of DREQ pin low level activated single address mode transfer. Bus release DMA single Bus release Bus release DMA single f DREQ Transfer source/ destination Address bus Transfer source/ destination DACK DMA control Single Idle Channel Idle Single Request clear period Request [1] [2] Request clear period Request Minimum of 2 cycles Idle Minimum of 2 cycles [3] [4] [5] [6] Acceptance resumes [7] Acceptance resumes Acceptance after transfer enabling; the DREQ pin low level is sampled on the rising edge of f, and the request is held. [2] [5] The request is cleared at the next bus break, and activation is started in the DMAC. [3] [6] The DMAC cycle is started. [4] [7] Acceptance is resumed after the single cycle is completed. (As in [1], the DREQ pin low level is sampled on the rising edge of f, and the request is held.) [1] Note: In write data buffer mode, bus breaks from [2] to [7] may be hidden, and not visible. Figure 7-32 Example of DREQ Pin Low Level Activated Single Address Mode Transfer DREQ pin sampling is performed every cycle, with the rising edge of the next cycle after the end of the DMABCR write cycle for setting the transfer enabled state as the starting point. When the DREQ pin low level is sampled while acceptance by means of the DREQ pin is possible, the request is held in the DMAC. Then, when activation is initiated in the DMAC, the request is cleared. After the end of the single cycle, acceptance resumes, DREQ pin low level sampling is performed again, and this operation is repeated until the transfer ends. Rev. 4.0, 03/03, page 287 of 1358 7.5.12 Write Data Buffer Function DMAC internal-to-external dual address transfers and single address transfers can be executed at high speed using the write data buffer function, enabling system throughput to be improved. When the WDBE bit of BCRL in the bus controller is set to 1, enabling the write data buffer function, dual address transfer external write cycles or single address transfers and internal accesses (on-chip memory or internal I/O registers) are executed in parallel. Internal accesses are independent of the bus master, and DMAC dead cycles are regarded as internal accesses. A low level can always be output from the TEND pin if the bus cycle in which a low level is to be output is an external bus cycle. However, a low level is not output from the TEND pin if the bus cycle in which a low level is to be output from the TEND pin is an internal bus cycle, and an external write cycle is executed in parallel with this cycle. Figure 7-33 shows an example of burst mode transfer from on-chip RAM to external memory using the write data buffer function. DMA read DMA write DMA read DMA write DMA read DMA write DMA read DMA write DMA dead f Internal address Internal read signal External address HWR, LWR TEND Figure 7-33 Example of Dual Address Transfer Using Write Data Buffer Function Figure 7-34 shows an example of single address transfer using the write data buffer function. In this example, the CPU program area is in on-chip memory. Rev. 4.0, 03/03, page 288 of 1358 DMA read DMA single CPU read DMA single CPU read f Internal address Internal read signal External address RD DACK Figure 7-34 Example of Single Address Transfer Using Write Data Buffer Function When the write data buffer function is activated, the DMAC recognizes that the bus cycle concerned has ended, and starts the next operation. Therefore, DREQ pin sampling is started one state after the start of the DMA write cycle or single address transfer. 7.5.13 DMAC Multi-Channel Operation The DMAC channel priority order is: channel 0 > channel 1, and channel A > channel B. Table 7-13 summarizes the priority order for DMAC channels. Table 7-13 DMAC Channel Priority Order Short Address Mode Full Address Mode Priority Channel 0A Channel 0 High Channel 0B Channel 1A Channel 1B Channel 1 Low Rev. 4.0, 03/03, page 289 of 1358 If transfer requests are issued simultaneously for more than one channel, or if a transfer request for another channel is issued during a transfer, when the bus is released the DMAC selects the highestpriority channel from among those issuing a request according to the priority order shown in table 7-13. During burst transfer, or when one block is being transferred in block transfer, the channel will not be changed until the end of the transfer. Figure 7-35 shows a transfer example in which transfer requests are issued simultaneously for channels 0A, 0B, and 1. DMA read DMA write DMA read DMA write DMA read DMA DMA write read f Address bus RD HWR LWR DMA control Idle Read Channel 0A Idle Write Read Write Idle Read Write Read Request clear Channel 0B Request hold Selection Channel 1 Request hold Nonselection Bus release Channel 0A transfer Request clear Request hold Bus release Selection Channel 0B transfer Request clear Bus release Channel 1 transfer Figure 7-35 Example of Multi-Channel Transfer 7.5.14 Relation Between the DMAC and External Bus Requests, Refresh Cycles, and the DTC There can be no break between a DMA cycle read and a DMA cycle write. This means that a refresh cycle, external bus release cycle, or DTC cycle is not generated between the external read and external write in a DMA cycle. In the case of successive read and write cycles, such as in burst transfer or block transfer, a refresh or external bus released state may be inserted after a write cycle. Since the DTC has a lower priority than the DMAC, the DTC does not operate until the DMAC releases the bus. Rev. 4.0, 03/03, page 290 of 1358 When DMA cycle reads or writes are accesses to on-chip memory or internal I/O registers, these DMA cycles can be executed at the same time as refresh cycles or external bus release. However, simultaneous operation may not be possible when a write buffer is used. 7.5.15 NMI Interrupts and DMAC When an NMI interrupt is requested, burst mode transfer in full address mode is interrupted. An NMI interrupt does not affect the operation of the DMAC in other modes. In full address mode, transfer is enabled for a channel when both the DTE bit and the DTME bit are set to 1. With burst mode setting, the DTME bit is cleared when an NMI interrupt is requested. If the DTME bit is cleared during burst mode transfer, the DMAC discontinues transfer on completion of the 1-byte or 1-word transfer in progress, then releases the bus, which passes to the CPU. The channel on which transfer was interrupted can be restarted by setting the DTME bit to 1 again. Figure 7-36 shows the procedure for continuing transfer when it has been interrupted by an NMI interrupt on a channel designated for burst mode transfer. Resumption of transfer on interrupted channel DTE= 1 DTME= 0 [1] Check that DTE = 1 and DTME = 0 in DMABCRL. [2] Write 1 to the DTME bit. [1] No Yes Set DTME bit to 1 Transfer continues [2] Transfer ends Figure 7-36 Example of Procedure for Continuing Transfer on Channel Interrupted by NMI Interrupt Rev. 4.0, 03/03, page 291 of 1358 7.5.16 Forced Termination of DMAC Operation If the DTE bit for the channel currently operating is cleared to 0, the DMAC stops on completion of the 1-byte or 1-word transfer in progress. DMAC operation resumes when the DTE bit is set to 1 again. In full address mode, the same applies to the DTME bit. Figure 7-37 shows the procedure for forcibly terminating DMAC operation by software. [1] Forced termination of DMAC Clear DTE bit to 0 Clear the DTE bit in DMABCRL to 0. To prevent interrupt generation after forced termination of DMAC operation, clear the DTIE bit to 0 at the same time. [1] Forced termination Figure 7-37 Example of Procedure for Forcibly Terminating DMAC Operation Rev. 4.0, 03/03, page 292 of 1358 7.5.17 Clearing Full Address Mode Figure 7-38 shows the procedure for releasing and initializing a channel designated for full address mode. After full address mode has been cleared, the channel can be set to another transfer mode using the appropriate setting procedure. Clearing full address mode Stop the channel [1] [1] Clear both the DTE bit and the DTME bit in DMABCRL to 0; or wait until the transfer ends and the DTE bit is cleared to 0, then clear the DTME bit to 0. Also clear the corresponding DTIE bit to 0 at the same time. [2] Clear all bits in DMACRA and DMACRB to 0. [3] Clear the FAE bit in DMABCRH to 0. Initialize DMACR [2] Clear FAE bit to 0 [3] Initialization; operation halted Figure 7-38 Example of Procedure for Clearing Full Address Mode Rev. 4.0, 03/03, page 293 of 1358 7.6 Interrupts The sources of interrupts generated by the DMAC are transfer end and transfer break. Table 7-13 shows the interrupt sources and their priority order. Table 7-13 Interrupt Source Priority Order Interrupt Name Interrupt Source Interrupt Priority Order Short Address Mode Full Address Mode DEND0A Interrupt due to end of transfer on channel 0A Interrupt due to end of transfer on channel 0 DEND0B Interrupt due to end of transfer on channel 0B Interrupt due to break in transfer on channel 0 DEND1A Interrupt due to end of transfer on channel 1A Interrupt due to end of transfer on channel 1 DEND1B Interrupt due to end of transfer on channel 1B Interrupt due to break in transfer on channel 1 High Low Enabling or disabling of each interrupt source is set by means of the DTIE bit for the corresponding channel in DMABCR, and interrupts from each source are sent to the interrupt controller independently. The relative priority of transfer end interrupts on each channel is decided by the interrupt controller, as shown in table 7-13. Figure 7-39 shows a block diagram of a transfer end/transfer break interrupt. An interrupt is always generated when the DTIE bit is set to 1 while the DTE bit is cleared to 0. DTE/ DTME Transfer end/transfer break interrupt DTIE Figure 7-39 Block Diagram of Transfer End/Transfer Break Interrupt In full address mode, a transfer break interrupt is generated when the DTME bit is cleared to 0 while the DTIEB bit is set to 1. In both short address mode and full address mode, DMABCR should be set so as to prevent the occurrence of a combination that constitutes a condition for interrupt generation during setting. Rev. 4.0, 03/03, page 294 of 1358 7.7 Usage Notes DMAC Register Access during Operation: Except for forced termination, the operating (including transfer waiting state) channel setting should not be changed. The operating channel setting should only be changed when transfer is disabled. Also, MAC registers should not be written to in a DMA transfer. DMAC register reads during operation (including the transfer waiting state) are described below. (a) DMAC control starts one cycle before the bus cycle, with output of the internal address. Consequently, MAR is updated in the bus cycle before DMAC transfer. Figure 7-40 shows an example of the update timing for DMAC registers in dual address transfer mode. DMA last transfer cycle DMA transfer cycle DMA read DMA read DMA write DMA write DMA dead f DMA Internal address DMA control DMA register operation Idle [1] Transfer source Transfer destination Read Write [2] Transfer destination Transfer source Read Idle [1] Write [2'] Dead Idle [3] [1] Transfer source address register MAR operation (incremented/decremented/fixed) Transfer counter ETCR operation (decremented) Block size counter ETCR operation (decremented in block transfer mode) [2] Transfer destination address register MAR operation (incremented/decremented/fixed) [2'] Transfer destination address register MAR operation (incremented/decremented/fixed) Block transfer counter ETCR operation (decremented, in last transfer cycle of a block in block transfer mode) [3] Transfer address register MAR restore operation (in block or repeat transfer mode) Transfer counter ETCR restore (in repeat transfer mode) Block size counter ETCR restore (in block transfer mode) Notes: 1. In single address transfer mode, the update timing is the same as [1]. 2. The MAR operation is post-incrementing/decrementing of the DMA internal address value. Figure 7-40 DMAC Register Update Timing Rev. 4.0, 03/03, page 295 of 1358 (b) If a DMAC transfer cycle occurs immediately after a DMAC register read cycle, the DMAC register is read as shown in figure 7-41. DMA transfer cycle CPU longword read MAR upper word read MAR lower word read DMA read DMA write f DMA internal address DMA control DMA register operation Idle [1] Transfe source Transfer destination Read Write Idle [2] Note: The lower word of MAR is the updated value after the operation in [1]. Figure 7-41 Contention between DMAC Register Update and CPU Read Module Stop: When the MSTP15 bit in MSTPCR is set to 1, the DMAC clock stops, and the module stop state is entered. However, 1 cannot be written to the MSTP15 bit if any of the DMAC channels is enabled. This setting should therefore be made when DMAC operation is stopped. When the DMAC clock stops, DMAC register accesses can no longer be made. Since the following DMAC register settings are valid even in the module stop state, they should be invalidated, if necessary, before a module stop. * Transfer end/break interrupt (DTE = 0 and DTIE = 1) * TEND pin enable (TEE = 1) * DACK pin enable (FAE = 0 and SAE = 1) Medium-Speed Mode: When the DTA bit is 0, internal interrupt signals specified as DMAC transfer sources are edge-detected. In medium-speed mode, the DMAC operates on a medium-speed clock, while on-chip supporting modules operate on a high-speed clock. Consequently, if the period in which the relevant interrupt source is cleared by the CPU, DTC, or another DMAC channel, and the next interrupt is generated, is less than one state with respect to the DMAC clock (bus master clock), edge detection may not be possible and the interrupt may be ignored. Also, in medium-speed mode, DREQ pin sampling is performed on the rising edge of the mediumspeed clock. Rev. 4.0, 03/03, page 296 of 1358 Write Data Buffer Function: When the WDBE bit of BCRL in the bus controller is set to 1, enabling the write data buffer function, dual address transfer external write cycles or single address transfers and internal accesses (on-chip memory or internal I/O registers) are executed in parallel. * Write Data Buffer Function and DMAC Register Setting If the setting of a register that controls external accesses is changed during execution of an external access by means of the write data buffer function, the external access may not be performed normally. Registers that control external accesses should only be manipulated when external reads, etc., are used with DMAC operation disabled, and the operation is not performed in parallel with external access. * Write Data Buffer Function and DMAC Operation Timing The DMAC can start its next operation during external access using the write data buffer function. Consequently, the DREQ pin sampling timing, TEND output timing, etc., are different from the case in which the write data buffer function is disabled. Also, internal bus cycles maybe hidden, and not visible. * Write Data Buffer Function and TEND Output A low level is not output at the TEND pin if the bus cycle in which a low level is to be output at the TEND pin is an internal bus cycle, and an external write cycle is executed in parallel with this cycle. Note, for example, that a low level may not be output at the TEND pin if the write data buffer function is used when data transfer is performed between an internal I/O register and on-chip memory. If at least one of the DMAC transfer addresses is an external address, a low level is output at the TEND pin. Figure 7-42 shows an example in which a low level is not output at the TEND pin. Rev. 4.0, 03/03, page 297 of 1358 DMA read DMA write f Internal address Internal read signal Internal write signal External address HWR, LWR TEND Not output External write by CPU, etc. Figure 7-42 Example in Which Low Level is Not Output at TEND Pin Activation by Falling Edge on DREQ Pin: DREQ pin falling edge detection is performed in synchronization with DMAC internal operations. The operation is as follows: [1] Activation request wait state: Waits for detection of a low level on the DREQ pin, and switches to [2]. [2] Transfer wait state: Waits for DMAC data transfer to become possible, and switches to [3]. [3] Activation request disabled state: Waits for detection of a high level on the DREQ pin, and switches to [1]. After DMAC transfer is enabled, a transition is made to [1]. Thus, initial activation after transfer is enabled is performed on detection of a low level. Activation Source Acceptance: At the start of activation source acceptance, a low level is detected in both DREQ pin falling edge sensing and low level sensing. Similarly, in the case of an internal interrupt, the interrupt request is detected. Therefore, a request is accepted from an internal interrupt or DREQ pin low level that occurs before execution of the DMABCRL write to enable transfer. When the DMAC is activated, take any necessary steps to prevent an internal interrupt or DREQ pin low level remaining from the end of the previous transfer, etc. Rev. 4.0, 03/03, page 298 of 1358 Internal Interrupt after End of Transfer: When the DTE bit is cleared to 0 at the end of a transfer or by a forcible termination, the selected internal interrupt request will be sent to the CPU or DTC even if DTA is set to 1. Also, if internal DMAC activation has already been initiated when operation is forcibly terminated, the transfer is executed but flag clearing is not performed for the selected internal interrupt even if DTA is set to 1. An internal interrupt request following the end of transfer or a forcible termination should be handled by the CPU as necessary. Channel Re-Setting: To reactivate a number of channels when multiple channels are enabled, use exclusive handling of transfer end interrupts, and perform DMABCR control bit operations exclusively. Note, in particular, that in cases where multiple interrupts are generated between reading and writing of DMABCR, and a DMABCR operation is performed during new interrupt handling, the DMABCR write data in the original interrupt handling routine will be incorrect, and the write may invalidate the results of the operations by the multiple interrupts. Ensure that overlapping DMABCR operations are not performed by multiple interrupts, and that there is no separation between read and write operations by the use of a bit-manipulation instruction. Also, when the DTE and DTME bits are cleared by the DMAC or are written with 0, they must first be read while cleared to 0 before the CPU can write a 1 to them. Rev. 4.0, 03/03, page 299 of 1358 Rev. 4.0, 03/03, page 300 of 1358 Section 8 Data Transfer Controller 8.1 Overview The chip includes a data transfer controller (DTC). The DTC can be activated for data transfer by an interrupt or software. 8.1.1 Features The features of the DTC are: * Transfer possible over any number of channels Transfer information is stored in memory One activation source can trigger a number of data transfers (chain transfer) Chain transfer execution can be set after data transfer (when counter = 0) * Selection of transfer modes Normal, repeat, and block transfer modes available Incrementing, decrementing, and fixing of source and destination addresses can be selected * Direct specification of 16-Mbyte address space possible 24-bit transfer source and destination addresses can be specified * Transfer can be set in byte or word units * A CPU interrupt can be requested for the interrupt that activated the DTC An interrupt request can be issued to the CPU after one data transfer ends An interrupt request can be issued to the CPU after all the specified data transfers have ended * Activation by software is possible * Module stop mode can be set The initial setting enables DTC registers to be accessed. DTC operation is halted by setting module stop mode Rev. 4.0, 03/03, page 301 of 1358 8.1.2 Block Diagram Figure 8-1 shows a block diagram of the DTC. The DTC's register information is stored in the on-chip RAM*. A 32-bit bus connects the DTC to the on-chip RAM (1 kbyte), enabling 32-bit, 1-state reading and writing of DTC register information. Note: * When the DTC is used, the RAME bit in SYSCR must be set to 1. Internal address bus CPU interrupt request On-chip RAM Register information MRA MRB CRA CRB DAR SAR DTC Control logic DTC activation request DTVECR Interrupt request DTCERA to DTCERF Interrupt controller Internal data bus Legend MRA, MRB CRA, CRB SAR DAR DTCERA to DTCERF DTVECR : DTC mode registers A and B : DTC transfer count registers A and B : DTC source address register : DTC destination address register : DTC enable registers A to F : DTC vector register Figure 8-1 Block Diagram of DTC Rev. 4.0, 03/03, page 302 of 1358 8.1.3 Register Configuration Table 8-1 summarizes the DTC registers. Table 8-1 DTC Registers Name Abbreviation Initial Value 1 Address* *2 Undefined 2 3 --* 3 --* R/W DTC mode register A MRA -- DTC mode register B MRB Undefined DTC source address register SAR --* 2 --* DTC destination address register DAR 2 Undefined DTC transfer count register A CRA --* 2 --* DTC transfer count register B CRB --* Undefined 3 --* 3 --* DTC enable registers DTCER R/W H'00 H'FF30 to H'FF35 DTC vector register DTVECR R/W H'00 H'FF37 Module stop control register MSTPCR R/W H'3FFF H'FF3C 2 Undefined Undefined 3 --* 3 --* Notes: *1 Lower 16 bits of the address. *2 Registers within the DTC cannot be read or written to directly. *3 Register information is located in on-chip RAM addresses H'F800 to H'FBFF. It cannot be located in external space. When the DTC is used, do not clear the RAME bit in SYSCR to 0. Rev. 4.0, 03/03, page 303 of 1358 8.2 Register Descriptions 8.2.1 DTC Mode Register A (MRA) Bit : Initial value : R/W : 7 6 5 4 3 2 1 0 SM1 SM0 DM1 DM0 MD1 MD0 DTS Sz Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined -- -- -- -- -- -- -- -- MRA is an 8-bit register that controls the DTC operating mode. Bits 7 and 6--Source Address Mode 1 and 0 (SM1, SM0): These bits specify whether SAR is to be incremented, decremented, or left fixed after a data transfer. Bit 7 SM1 Bit 6 SM0 Description 0 -- SAR is fixed 1 0 SAR is incremented after a transfer (by +1 when Sz = 0; by +2 when Sz = 1) 1 SAR is decremented after a transfer (by -1 when Sz = 0; by -2 when Sz = 1) Bits 5 and 4--Destination Address Mode 1 and 0 (DM1, DM0): These bits specify whether DAR is to be incremented, decremented, or left fixed after a data transfer. Bit 5 DM1 Bit 4 DM0 Description 0 -- DAR is fixed 1 0 DAR is incremented after a transfer (by +1 when Sz = 0; by +2 when Sz = 1) 1 DAR is decremented after a transfer (by -1 when Sz = 0; by -2 when Sz = 1) Rev. 4.0, 03/03, page 304 of 1358 Bits 3 and 2--DTC Mode (MD1, MD0): These bits specify the DTC transfer mode. Bit 3 MD1 Bit 2 MD0 Description 0 0 Normal mode 1 Repeat mode 0 Block transfer mode 1 -- 1 Bit 1--DTC Transfer Mode Select (DTS): Specifies whether the source side or the destination side is set to be a repeat area or block area, in repeat mode or block transfer mode. Bit 1 DTS Description 0 Destination side is repeat area or block area 1 Source side is repeat area or block area Bit 0--DTC Data Transfer Size (Sz): Specifies the size of data to be transferred. Bit 0 Sz Description 0 Byte-size transfer 1 Word-size transfer 8.2.2 Bit DTC Mode Register B (MRB) : Initial value : R/W : 7 6 5 4 3 2 1 0 CHNE DISEL CHNS -- -- -- -- -- Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined -- -- -- -- -- -- -- -- MRB is an 8-bit register that controls the DTC operating mode. Rev. 4.0, 03/03, page 305 of 1358 Bit 7--DTC Chain Transfer Enable (CHNE): Specifies chain transfer. With chain transfer, a number of data transfers can be performed consecutively in response to a single transfer request. In data transfer with CHNE set to 1, determination of the end of the specified number of transfers, clearing of the interrupt source flag, and clearing of DTCER are not performed. When CHNE is set to 1, the chain transfer condition can be selected with the CHNS bit. Bit 7 CHNE Description 0 End of DTC data transfer (activation waiting state) 1 DTC chain transfer (new register information is read, then data is transferred) Bit 6--DTC Interrupt Select (DISEL): Specifies whether interrupt requests to the CPU are disabled or enabled after a data transfer. Bit 6 DISEL Description 0 After a data transfer ends, the CPU interrupt is disabled unless the transfer counter is 0 (the DTC clears the interrupt source flag of the activating interrupt to 0) 1 After a data transfer ends, the CPU interrupt is enabled (the DTC does not clear the interrupt source flag of the activating interrupt to 0) Bit 5--DTC Chain Transfer Select (CHNS): Specifies the chain transfer condition when CHNE is 1. Bit 7 CHNE Bit 5 CHNS Description 0 - No chain transfer (DTC data transfer end, activation waiting state entered) 1 0 DTC chain transfer 1 1 Chain transfer only when transfer counter = 0 Bits 4 to 0--Reserved: These bits have no effect on DTC operation in the chip and should always be written with 0. Rev. 4.0, 03/03, page 306 of 1358 8.2.3 Bit DTC Source Address Register (SAR) : 23 22 21 20 19 --- 4 3 2 1 0 --- Initial value : R/W : --- Unde- Unde- Unde- Unde- Undefined fined fined fined fined -- -- -- -- -- Unde- Unde- Unde- Unde- Undefined fined fined fined fined --- -- -- -- -- -- SAR is a 24-bit register that designates the source address of data to be transferred by the DTC. For word-size transfer, specify an even source address. 8.2.4 Bit DTC Destination Address Register (DAR) : 23 22 21 20 19 --- 4 3 2 1 0 --- Initial value : R/W : --- Unde- Unde- Unde- Unde- Undefined fined fined fined fined -- -- -- -- -- Unde- Unde- Unde- Unde- Undefined fined fined fined fined --- -- -- -- -- -- DAR is a 24-bit register that designates the destination address of data to be transferred by the DTC. For word-size transfer, specify an even destination address. 8.2.5 Bit DTC Transfer Count Register A (CRA) : Initial value : R/W : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Undefined fined fined fined fined fined fined fined fined fined fined fined fined fined fined fined -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- CRAH CRAL CRA is a 16-bit register that designates the number of times data is to be transferred by the DTC. In normal mode, the entire CRA register functions as a 16-bit transfer counter (1 to 65,536). It is decremented by 1 every time data is transferred, and transfer ends when the count reaches H'0000. In repeat mode or block transfer mode, the CRA register is divided into two parts: the upper 8 bits (CRAH) and the lower 8 bits (CRAL). CRAH holds the number of transfers while CRAL functions as an 8-bit transfer counter (1 to 256). CRAL is decremented by 1 every time data is transferred, and the contents of CRAH are sent when the count reaches H'00. This operation is repeated. Rev. 4.0, 03/03, page 307 of 1358 8.2.6 DTC Transfer Count Register B (CRB) Bit : Initial value : R/W : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Undefined fined fined fined fined fined fined fined fined fined fined fined fined fined fined fined -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- CRB is a 16-bit register that designates the number of times data is to be transferred by the DTC in block transfer mode. It functions as a 16-bit transfer counter (1 to 65,536) that is decremented by 1 every time data is transferred, and transfer ends when the count reaches H'0000. 8.2.7 DTC Enable Registers (DTCER) Bit : Initial value : R/W : 7 6 5 4 3 2 1 0 DTCE7 DTCE6 DTCE5 DTCE4 DTCE3 DTCE2 DTCE1 DTCE0 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W The DTC enable registers comprise six 8-bit readable/writable registers, DTCERA to DTCERF, with bits corresponding to the interrupt sources that can activate the DTC. These bits enable or disable DTC service for the corresponding interrupt sources. The DTC enable registers are initialized to H'00 by a reset and in hardware standby mode. Bit n--DTC Activation Enable (DTCEn) Bit n DTCEn Description 0 DTC activation by this interrupt is disabled (Initial value) [Clearing conditions] 1 * When the DISEL bit is 1 and the data transfer has ended * When the specified number of transfers have ended DTC activation by this interrupt is enabled [Holding condition] When the DISEL bit is 0 and the specified number of transfers have not ended (n = 7 to 0) A DTCE bit can be set for each interrupt source that can activate the DTC. The correspondence between interrupt sources and DTCE bits is shown in table 8-5, together with the vector numbers generated by the interrupt controller. Rev. 4.0, 03/03, page 308 of 1358 For DTCE bit setting, read/write operations must be performed using bit-manipulation instructions such as BSET and BCLR. For the initial setting only, however, when multiple activation sources are set at one time, it is possible to disable interrupts and write after executing a dummy read on the relevant register. 8.2.8 Bit DTC Vector Register (DTVECR) : 7 6 5 4 3 2 1 0 SWDTE DTVEC6 DTVEC5 DTVEC4 DTVEC3 DTVEC2 DTVEC1 DTVEC0 Initial value : R/W : 0 0 0 0 0 0 0 0 R/(W) R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* Note: * Bits DTVEC6 to DTVEC0 can be written to when SWDTE = 0. DTVECR is an 8-bit readable/writable register that enables or disables DTC activation by software, and sets a vector number for the software activation interrupt. DTVECR is initialized to H'00 by a reset and in hardware standby mode. Bit 7--DTC Software Activation Enable (SWDTE): Enables or disables DTC activation by software. Bit 7 SWDTE Description 0 DTC software activation is disabled (Initial value) [Clearing conditions] * When the DISEL bit is 0 and the specified number of transfers have not ended * When 0 is written after a software activation data-transfer-complete interrupt is issued to the CPU 1 DTC software activation is enabled [Holding conditions] * When the DISEL bit is 1 and data transfer has ended * When the specified number of transfers have ended * During data transfer due to software activation Bits 6 to 0--DTC Software Activation Vectors 6 to 0 (DTVEC6 to DTVEC0): These bits specify a vector number for DTC software activation. The vector address is expressed as H'0400 + ((vector number) << 1). <<1 indicates a one-bit leftshift. For example, when DTVEC6 to DTVEC0 = H'10, the vector address is H'0420. Rev. 4.0, 03/03, page 309 of 1358 8.2.9 Module Stop Control Register (MSTPCR) MSTPCRH Bit MSTPCRL : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Initial value : 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 R/W : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W MSTPCR is a 16-bit readable/writable register that performs module stop mode control. When the MSTP14 bit in MSTPCR is set to 1, DTC operation stops at the end of the bus cycle and a transition is made to module stop mode. However, 1 cannot be written in the MSTP14 bit while the DTC is operating. For details, see section 21.5, Module Stop Mode. MSTPCR is initialized to H'3FFF by a reset and in hardware standby mode. It is not initialized in software standby mode. Bit 14--Module Stop (MSTP14): Specifies the DTC module stop mode. Bit 14 MSTP14 Description 0 DTC module stop mode cleared 1 DTC module stop mode set 8.3 Operation 8.3.1 Overview (Initial value) When activated, the DTC reads register information that is already stored in memory and transfers data on the basis of that register information. After the data transfer, it writes updated register information back to memory. Pre-storage of register information in memory makes it possible to transfer data over any required number of channels. Setting the CHNE bit to 1 makes it possible to perform a number of transfers with a single activation. A setting can also be made to have chain transfer performed only when the transfer counter value is 0. This enables DTC re-setting to be performed by the DTC itself. Rev. 4.0, 03/03, page 310 of 1358 Figure 8-2 shows a flowchart of DTC operation, and table 8-2 summarizes the chain transfer conditions (combinations for performing the second and third transfers are omitted). Start Read DTC vector Next transfer Read register information Data transfer Write register information CHNE = 1? Yes No CHNS = 0? Yes Transfer counter = 0 or DISEL = 1? No No Yes Transfer counter = 0? Yes No DISEL = 1? Yes No Clear activation flag Clear DTCER End Interrupt exception handling Figure 8-2 Flowchart of DTC Operation Rev. 4.0, 03/03, page 311 of 1358 Table 8-2 Chain Transfer Conditions 1st Transfer 2nd Transfer CHNE CHNS DISEL CR CHNE CHNS DISEL CR DTC Transfer 0 -- 0 Not 0 -- -- -- -- Ends at 1st transfer 0 -- 0 0 -- -- -- -- Ends at 1st transfer 0 -- 1 -- -- -- -- -- Interrupt request to CPU 1 0 -- -- 0 -- 0 Not 0 Ends at 2nd transfer 0 -- 0 0 Ends at 2nd transfer 0 -- 1 -- Interrupt request to CPU 1 1 0 Not 0 -- -- -- -- Ends at 1st transfer 1 1 -- 0 0 -- 0 Not 0 Ends at 2nd transfer 0 -- 0 0 Ends at 2nd transfer 0 -- 1 -- Interrupt request to CPU -- -- -- -- Ends at 1st transfer 1 1 1 Not 0 Interrupt request to CPU The DTC transfer mode can be normal mode, repeat mode, or block transfer mode. The 24-bit SAR designates the DTC transfer source address and the 24-bit DAR designates the transfer destination address. After each transfer, SAR and DAR are independently incremented, decremented, or left fixed. Table 8-3 outlines the functions of the DTC. Rev. 4.0, 03/03, page 312 of 1358 Table 8-3 DTC Functions Address Registers Transfer Mode Activation Source Transfer Source * Normal mode * IRQ 24 bits One transfer request transfers one byte or one word * TPU TGI Memory addresses are incremented or decremented by 1 or 2 * SCI TXI or RXI Up to 65,536 transfers possible * Repeat mode One transfer request transfers one byte or one word Transfer Destination 24 bits * 8-bit timer CMI * A/D converter ADI * DMAC DEND* * Software Memory addresses are incremented or decremented by 1 or 2 After the specified number of transfers (1 to 256), the initial state resumes and operation continues * Block transfer mode One transfer request transfers a block of the specified size Block size is from 1 to 256 bytes or words Up to 65,536 transfers possible A block area can be designated at either the source or destination Note: * The DMAC is not supported in the H8S/2321. Rev. 4.0, 03/03, page 313 of 1358 8.3.2 Activation Sources The DTC operates when activated by an interrupt or by a write to DTVECR by software. An interrupt request can be directed to the CPU or DTC, as designated by the corresponding DTCER bit. An interrupt becomes a DTC activation source when the corresponding bit is set to 1, and a CPU interrupt source when the bit is cleared to 0. At the end of a data transfer (or the last consecutive transfer in the case of chain transfer), the activation source or corresponding DTCER bit is cleared. Table 8-4 shows activation source and DTCER clearance. The activation source flag, in the case of RXI0, for example, is the RDRF flag of SCI0. Table 8-4 Activation Source and DTCER Clearance When the DISEL Bit Is 0 and the Specified Number of Activation Source Transfers Have Not Ended When the DISEL Bit Is 1, or when the Specified Number of Transfers Have Ended Software activation The SWDTE bit is cleared to 0 * The SWDTE bit remains set to 1 * An interrupt is issued to the CPU Interrupt activation * The corresponding DTCER bit remains set to 1 * The corresponding DTCER bit is cleared to 0 * The activation source flag is cleared to 0 * The activation source flag remains set to 1 * A request is issued to the CPU for the activation source interrupt Figure 8-3 shows a block diagram of activation source control. For details see section 5, Interrupt Controller. Rev. 4.0, 03/03, page 314 of 1358 Source flag clearance Clear control Clear DTCER Clear request On-chip supporting module IRQ interrupt Interrupt request DTVECR Selection circuit Select DTC Interrupt controller CPU Interrupt mask Figure 8-3 Block Diagram of DTC Activation Source Control When an interrupt has been designated a DTC activation source, existing CPU mask level and interrupt controller priorities have no effect. If there is more than one activation source at the same time, the DTC operates in accordance with the default priorities. 8.3.3 DTC Vector Table Figure 8-4 shows the correspondence between DTC vector addresses and register information. Table 8-5 shows the correspondence between activation, vector addresses, and DTCER bits. When the DTC is activated by software, the vector address is obtained from: H'0400 + (DTVECR[6:0] << 1) (where << 1 indicates a 1-bit left shift). For example, if DTVECR is H'10, the vector address is H'0420. The DTC reads the start address of the register information from the vector address set for each activation source, and then reads the register information from that start address. The register information can be placed at predetermined addresses in the on-chip RAM. The start address of the register information should be an integral multiple of four. The configuration of the vector address is a 2-byte unit. These two bytes specify the lower bits of the address in the on-chip RAM. Rev. 4.0, 03/03, page 315 of 1358 Table 8-5 Interrupt Sources, DTC Vector Addresses, and Corresponding DTCEs Interrupt Source Origin of Interrupt Source Vector Number Vector Address Write to DTVECR Software DTVECR IRQ0 External pin 1 DTCE* Priority H'0400+ (DTVECR [6:0]<<1) -- High 16 H'0420 DTCEA7 IRQ1 17 H'0422 DTCEA6 IRQ2 18 H'0424 DTCEA5 IRQ3 19 H'0426 DTCEA4 IRQ4 20 H'0428 DTCEA3 IRQ5 21 H'042A DTCEA2 IRQ6 22 H'042C DTCEA1 IRQ7 23 H'042E DTCEA0 ADI (A/D conversion end) A/D 28 H'0438 DTCEB6 TGI0A (GR0A compare match/ input capture) TPU channel 0 32 H'0440 DTCEB5 TGI0B (GR0B compare match/ input capture) 33 H'0442 DTCEB4 TGI0C (GR0C compare match/ input capture) 34 H'0444 DTCEB3 TGI0D (GR0D compare match/ input capture) 35 H'0446 DTCEB2 40 H'0450 DTCEB1 41 H'0452 DTCEB0 44 H'0458 DTCEC7 45 H'045A DTCEC6 TGI1A (GR1A compare match/ input capture) TPU channel 1 TGI1B (GR1B compare match/ input capture) TGI2A (GR2A compare match/ input capture) TGI2B (GR2B compare match/ input capture) Rev. 4.0, 03/03, page 316 of 1358 TPU channel 2 Low Interrupt Source Origin of Interrupt Source TGI3A (GR3A compare match/ input capture) TPU channel 3 Vector Number Vector Address DTCE* Priority 48 H'0460 DTCEC5 High TGI3B (GR3B compare match/ input capture) 49 H'0462 DTCEC4 TGI3C (GR3C compare match/ input capture) 50 H'0464 DTCEC3 TGI3D (GR3D compare match/ input capture) 51 H'0466 DTCEC2 56 H'0470 DTCEC1 57 H'0472 DTCEC0 72 H'0490 DTCEE7 DMTEND0B (DMAC transfer complete 1 73 H'0492 DTCEE6 DMTEND1A (DMAC transfer complete 2) 74 H'0494 DTCEE5 DMTEND1B (DMAC transfer complete 3) 75 H'0496 DTCEE4 60 H'0478 DTCED5 61 H'047A DTCED4 8-bit timer channel 0 64 H'0480 DTCED3 65 H'0482 DTCED2 8-bit timer channel 1 68 H'0488 DTCED1 69 H'048A DTCED0 2 DMAC* 72 H'0490 DTCEE7 DMTEND0B (DMAC transfer complete 1) 73 H'0492 DTCEE6 DMTEND1A (DMAC transfer complete 2) 74 H'0494 DTCEE5 DMTEND1B (DMAC transfer complete 3) 75 H'0496 DTCEE4 TGI4A (GR4A compare match/ input capture) TPU channel 4 TGI4B (GR4B compare match/ input capture) DMTEND0A (DMAC transfer complete 0) TGI5A (GR5A compare match/ input capture) DMAC TPU channel 5 TGI5B (GR5B compare match/ input capture) CMIA0 CMIB0 CMIA1 CMIB1 DMTEND0A (DMAC transfer complete 0) 1 Low Rev. 4.0, 03/03, page 317 of 1358 Origin of Interrupt Source Interrupt Source RXI0 (receive-data-full 0) TXI0 (transmit-data-empty 0) RXI1 (receive-data-full 1) TXI1 (transmit-data-empty 1) RXI2 (receive-data-full 2) TXI2 (transmit-data-empty 2) Vector Number Vector Address DTCE* Priority SCI channel 0 81 H'04A2 DTCEE3 High 82 H'04A4 DTCEE2 SCI channel 1 85 H'04AA DTCEE1 86 H'04AC DTCEE0 SCI channel 2 89 H'04B2 DTCEF7 90 H'04B4 DTCEF6 1 Low Notes: *1 DTCE bits with no corresponding interrupt are reserved, and should be written with 0. *2 The DMAC is not supported in the H8S/2321. DTC vector address Register information start address Register information Next transfer Figure 8-4 Correspondence between DTC Vector Address and Register Information 8.3.4 Location of Register Information in Address Space Figure 8-5 shows how the register information should be located in the address space. Locate the MRA, SAR, MRB, DAR, CRA, and CRB registers, in that order, from the start address of the register information (contents of the vector address). In the case of chain transfer, register information should be located in consecutive areas. Locate the register information in the on-chip RAM (addresses: H'FFF800 to H'FFFBFF). Rev. 4.0, 03/03, page 318 of 1358 Lower address Register information start address Chain transfer 0 1 2 3 MRA SAR MRB DAR CRA Register information CRB MRA SAR MRB DAR CRA Register information for 2nd transfer in chain transfer CRB 4 bytes Figure 8-5 Location of DTC Register Information in Address Space 8.3.5 Normal Mode In normal mode, one operation transfers one byte or one word of data. From 1 to 65,536 transfers can be specified. Once the specified number of transfers have ended, a CPU interrupt can be requested. Table 8-6 lists the register information in normal mode and figure 8-6 shows the memory map in normal mode. Table 8-6 Register Information in Normal Mode Name Abbreviation Function DTC source address register SAR Designates source address DTC destination address register DAR Designates destination address DTC transfer count register A CRA Designates transfer count DTC transfer count register B CRB Not used Rev. 4.0, 03/03, page 319 of 1358 SAR DAR Transfer Figure 8-6 Memory Map in Normal Mode 8.3.6 Repeat Mode In repeat mode, one operation transfers one byte or one word of data. From 1 to 256 transfers can be specified. Once the specified number of transfers have ended, the initial state of the transfer counter and the address register specified as the repeat area is restored, and transfer is repeated. In repeat mode the transfer counter value does not reach H'00, and therefore CPU interrupts cannot be requested when DISEL = 0. Table 8-7 lists the register information in repeat mode and figure 8-7 shows the memory map in repeat mode. Table 8-7 Register Information in Repeat Mode Name Abbreviation Function DTC source address register SAR Designates source address DTC destination address register DAR Designates destination address DTC transfer count register AH CRAH Holds number of transfers DTC transfer count register AL CRAL Transfer counter DTC transfer count register B CRB Not used Rev. 4.0, 03/03, page 320 of 1358 SAR or DAR DAR or SAR Repeat area Transfer Figure 8-7 Memory Map in Repeat Mode 8.3.7 Block Transfer Mode In block transfer mode, one operation transfers one block of data. Either the transfer source or the transfer destination is designated as a block area. The block size is 1 to 256. When the transfer of one block ends, the initial state of the block size counter and the address register specified as the block area is restored. The other address register is then incremented, decremented, or left fixed. From 1 to 65,536 transfers can be specified. Once the specified number of transfers have ended, a CPU interrupt is requested. Table 8-8 lists the register information in block transfer mode and figure 8-8 shows the memory map in block transfer mode. Table 8-8 Register Information in Block Transfer Mode Name Abbreviation Function DTC source address register SAR Designates transfer source address DTC destination address register DAR Designates destination address DTC transfer count register AH CRAH Holds block size DTC transfer count register AL CRAL Block size counter DTC transfer count register B CRB Transfer counter Rev. 4.0, 03/03, page 321 of 1358 First block SAR or DAR * * * Block area Transfer Nth block Figure 8-8 Memory Map in Block Transfer Mode Rev. 4.0, 03/03, page 322 of 1358 DAR or SAR 8.3.8 Chain Transfer Setting the CHNE bit to 1 enables a number of data transfers to be performed consecutively in response to a single transfer request. It is also possible, by setting both the CHNE bit and CHNS bit to 1, to specify execution of chain transfer only when the transfer counter value is 0. SAR, DAR, CRA, CRB, MRA, and MRB, which define data transfers, can be set independently. Figure 8-9 shows the memory map for chain transfer. Source Destination Register information CHNE = 1 DTC vector address Register information start address Register information CHNE = 0 Source Destination Figure 8-9 Chain Transfer Memory Map In the case of transfer with CHNE set to 1, an interrupt request to the CPU is not generated at the end of the specified number of transfers or by setting of the DISEL bit to 1, and the interrupt source flag for the activation source is not affected. Rev. 4.0, 03/03, page 323 of 1358 8.3.9 Operation Timing Figures 8-10 to 8-12 show examples of DTC operation timing. f DTC activation request DTC request Data transfer Vector read Address Read Write Transfer information read Transfer information write Figure 8-10 DTC Operation Timing (Example in Normal Mode or Repeat Mode) f DTC activation request DTC request Data transfer Vector read Address Read Write Read Write Transfer information read Transfer information write Figure 8-11 DTC Operation Timing (Example of Block Transfer Mode, with Block Size of 2) Rev. 4.0, 03/03, page 324 of 1358 f DTC activation request DTC request Data transfer Data transfer Read Write Read Write Vector read Address Transfer information read Transfer Transfer information information write read Transfer information write Figure 8-12 DTC Operation Timing (Example of Chain Transfer) 8.3.10 Number of DTC Execution States Table 8-9 lists execution phases for a single DTC data transfer, and table 8-10 shows the number of states required for each execution phase. Table 8-9 DTC Execution Phases Mode Vector Read I Register Information Read/Write Data Read J K Data Write L Internal Operations M Normal 1 6 1 1 3 Repeat 1 6 1 1 3 Block transfer 1 6 N N 3 N: Block size (initial setting of CRAH and CRAL) Rev. 4.0, 03/03, page 325 of 1358 Table 8-10 Number of States Required for Each Execution Phase OnChip RAM Access To: OnChip ROM Internal I/O Registers External Devices Bus width 32 16 8 16 8 Access states 1 1 2 2 2 3 Execution phase 16 2 3 Vector read SI -- 1 -- -- 4 6+2m 2 3+m Register information read/write SJ 1 -- -- -- -- -- -- -- Byte data read SK 1 1 2 2 2 3+m 2 3+m Word data read SK 1 1 4 2 4 6+2m 2 3+m Byte data write SL 1 1 2 2 2 3+m 2 3+m Word data write SL 1 1 4 2 4 6+2m 2 3+m Internal operation SM 1 The number of execution states is calculated from the formula below. Note that means the sum of all transfers activated by one activation event (the number in which the CHNE bit is set to 1, plus 1). Number of execution states = I * SI + (J * SJ + K * SK + L * SL) + M * SM For example, when the DTC vector address table is located in on-chip ROM, normal mode is set, and data is transferred from the on-chip ROM to an internal I/O register, the time required for the DTC operation is 13 states. The time from activation to the end of the data write is 10 states. Rev. 4.0, 03/03, page 326 of 1358 8.3.11 Procedures for Using DTC Activation by Interrupt: The procedure for using the DTC with interrupt activation is as follows: [1] Set the MRA, MRB, SAR, DAR, CRA, and CRB register information in the on-chip RAM. [2] Set the start address of the register information in the DTC vector address. [3] Set the corresponding bit in DTCER to 1. [4] Set the enable bits for the interrupt sources to be used as the activation sources to 1. The DTC is activated when an interrupt used as an activation source is generated. [5] After the end of one data transfer, or after the specified number of data transfers have ended, the DTCE bit is cleared to 0 and a CPU interrupt is requested. If the DTC is to continue transferring data, set the DTCE bit to 1. Activation by Software: The procedure for using the DTC with software activation is as follows: [1] Set the MRA, MRB, SAR, DAR, CRA, and CRB register information in the on-chip RAM. [2] Set the start address of the register information in the DTC vector address. [3] Check that the SWDTE bit is 0. [4] Write 1 to the SWDTE bit and the vector number to DTVECR. [5] Check the vector number written to DTVECR. [6] After the end of one data transfer, if the DISEL bit is 0 and a CPU interrupt is not requested, the SWDTE bit is cleared to 0. If the DTC is to continue transferring data, set the SWDTE bit to 1. When the DISEL bit is 1, or after the specified number of data transfers have ended, the SWDTE bit is held at 1 and a CPU interrupt is requested. Rev. 4.0, 03/03, page 327 of 1358 8.3.12 Examples of Use of the DTC Normal Mode: An example is shown in which the DTC is used to receive 128 bytes of data via the SCI. [1] Set MRA to fixed source address (SM1 = SM0 = 0), incrementing destination address (DM1 = 1, DM0 = 0), normal mode (MD1 = MD0 = 0), and byte size (Sz = 0). The DTS bit can have any value. Set MRB for one data transfer by one interrupt (CHNE = 0, DISEL = 0). Set the SCI RDR address in SAR, the start address of the RAM area where the data will be received in DAR, and 128 (H'0080) in CRA. CRB can be set to any value. [2] Set the start address of the register information at the DTC vector address. [3] Set the corresponding bit in DTCER to 1. [4] Set the SCI to the appropriate receive mode. Set the RIE bit in SCR to 1 to enable the reception data full (RXI) interrupt. Since the generation of a receive error during the SCI receive operation will disable subsequent reception, the CPU should be enabled to accept receive error interrupts. [5] Each time reception of one byte of data ends on the SCI, the RDRF flag in SSR is set to 1, an RXI interrupt is generated, and the DTC is activated. The receive data is transferred from RDR to RAM by the DTC. DAR is incremented and CRA is decremented. The RDRF flag is automatically cleared to 0. [6] When CRA becomes 0 after the 128 data transfers have ended, the RDRF flag is held at 1, the DTCE bit is cleared to 0, and an RXI interrupt request is sent to the CPU. The interrupt handling routine should perform wrap-up processing. Rev. 4.0, 03/03, page 328 of 1358 Chain Transfer: An example of DTC chain transfer is shown in which pulse output is performed using the PPG. Chain transfer can be used to perform pulse output data transfer and PPG output trigger cycle updating. Repeat mode transfer to the PPG's NDR is performed in the first half of the chain transfer, and normal mode transfer to the TPU's TGR in the second half. This is because clearing of the activation source and interrupt generation at the end of the specified number of transfers are restricted to the second half of the chain transfer (transfer when CHNE = 0). [1] Perform settings for transfer to the PPG's NDR. Set MRA to source address incrementing (SM1 = 1, SM0 = 0), fixed destination address (DM1 = DM0 = 0), repeat mode (MD1 = 0, MD0 = 1), and word size (Sz = 1). Set the source side as a repeat area (DTS = 1). Set MRB to chain mode (CHNE = 1, DISEL = 0). Set the data table start address in SAR, the NDRH address in DAR, and the data table size in CRAH and CRAL. CRB can be set to any value. [2] Perform settings for transfer to the TPU's TGR. Set MRA to source address incrementing (SM1 = 1, SM0 = 0), fixed destination address (DM1 = DM0 = 0), normal mode (MD1 = MD0 = 0), and word size (Sz = 1). Set the data table start address in SAR, the TGRA address in DAR, and the data table size in CRA. CRB can be set to any value. [3] Locate the TPU transfer register information consecutively after the NDR transfer register information. [4] Set the start address of the NDR transfer register information to the DTC vector address. [5] Set the bit corresponding to TGIA in DTCER to 1. [6] Set TGRA as an output compare register (output disabled) with TIOR, and enable the TGIA interrupt with TIER. [7] Set the initial output value in PODR, and the next output value in NDR. Set bits in DDR and NDER for which output is to be performed to 1. Using PCR, select the TPU compare match to be used as the output trigger. [8] Set the CST bit in TSTR to 1, and start the TCNT count operation. [9] Each time a TGRA compare match occurs, the next output value is transferred to NDR and the set value of the next output trigger period is transferred to TGRA. The activation source TGFA flag is cleared. [10] When the specified number of transfers are completed (the TPU transfer CRA value is 0), the TGFA flag is held at 1, the DTCE bit is cleared to 0, and a TGIA interrupt request is sent to the CPU. Wrap-up processing should be performed in the interrupt handling routine. Rev. 4.0, 03/03, page 329 of 1358 Chain Transfer when Counter = 0: By executing a second data transfer, and performing resetting of the first data transfer, only when the counter value is 0, it is possible to perform 256 or more repeat transfers. An example is shown in which a 128-kbyte input buffer is configured. The input buffer is assumed to have been set to start at lower address H'0000. Figure 8-13 shows the memory map. [1] For the first transfer, set the normal mode for input data. Set fixed transfer source address (G/A, etc.), CRA = H'0000 (64k times), and CHNE = 1, CHNS = 1, and DISEL = 0. [2] Prepare the upper 8-bit addresses of the start addresses for each of the 64k transfer start addresses for the first data transfer in a separate area (in ROM, etc.). For example, if the input buffer comprises H'200000 to H'21FFFF, prepare H'21 and H'20. [3] For the second transfer, set repeat mode (with the source side as the repeat area) for re-setting the transfer destination address for the first data transfer. Use the upper 8 bits of DAR in the first register information area as the transfer destination. Set CHNE = DISEL = 0. If the above input buffer is specified as H'200000 to H'21FFFF, set the transfer counter to 2. [4] Execute the first data transfer 64k times by means of interrupts. When the transfer counter for the first data transfer reaches 0, the second data transfer is started. Set the upper 8 bits of the transfer source address for the first data transfer to H'21. The lower 16 bits of the transfer destination address of the first data transfer and the transfer counter are H'0000. [5] Next, execute the first data transfer the 64k times specified for the first data transfer by means of interrupts. When the transfer counter for the first data transfer reaches 0, the second data transfer is started. Set the upper 8 bits of the transfer source address for the first data transfer to H'20. The lower 16 bits of the transfer destination address of the first data transfer and the transfer counter are H'0000. [6] Steps [4] and [5] are repeated endlessly. As repeat mode is specified for the second data transfer, an interrupt request is not sent to the CPU. Rev. 4.0, 03/03, page 330 of 1358 Input circuit Input buffer First data transfer register information Chain transfer (counter = 0) Second data transfer register information Upper 8 bits of DAR Figure 8-13 Chain Transfer when Counter = 0 Rev. 4.0, 03/03, page 331 of 1358 Software Activation: An example is shown in which the DTC is used to transfer a block of 128 bytes of data by means of software activation. The transfer source address is H'1000 and the destination address is H'2000. The vector number is H'60, so the vector address is H'04C0. [1] Set MRA to incrementing source address (SM1 = 1, SM0 = 0), incrementing destination address (DM1 = 1, DM0 = 0), block transfer mode (MD1 = 1, MD0 = 0), and byte size (Sz = 0). The DTS bit can have any value. Set MRB for one block transfer by one interrupt (CHNE = 0). Set the transfer source address (H'1000) in SAR, the destination address (H'2000) in DAR, and 128 (H'8080) in CRA. Set 1 (H'0001) in CRB. [2] Set the start address of the register information at the DTC vector address (H'04C0). [3] Check that the SWDTE bit in DTVECR is 0. Check that there is currently no transfer activated by software. [4] Write 1 to the SWDTE bit and the vector number (H'60) to DTVECR. The write data is H'E0. [5] Read DTVECR again and check that it is set to the vector number (H'60). If it is not, this indicates that the write failed. This is presumably because an interrupt occurred between steps [3] and [4] and led to a different software activation. To activate this transfer, go back to step [3]. [6] If the write was successful, the DTC is activated and a block of 128 bytes of data is transferred. [7] After the transfer, an SWDTEND interrupt occurs. The interrupt handling routine should clear the SWDTE bit to 0 and perform other wrap-up processing. Rev. 4.0, 03/03, page 332 of 1358 8.4 Interrupts An interrupt request is issued to the CPU when the DTC finishes the specified number of data transfers, or a data transfer for which the DISEL bit was set to 1. In the case of interrupt activation, the interrupt set as the activation source is generated. These interrupts to the CPU are subject to CPU mask level and interrupt controller priority level control. In the case of activation by software, a software activated data transfer end interrupt (SWDTEND) is generated. When the DISEL bit is 1 and one data transfer has ended, or the specified number of transfers have ended, after data transfer ends, the SWDTE bit is held at 1 and an SWDTEND interrupt is generated. The interrupt handling routine should clear the SWDTE bit to 0. When the DTC is activated by software, an SWDTEND interrupt is not generated during a data transfer wait or during data transfer even if the SWDTE bit is set to 1. 8.5 Usage Notes Module Stop: When the MSTP14 bit in MSTPCR is set to 1, the DTC clock stops, and the DTC enters the module stop state. However, 1 cannot be written to the MSTP14 bit while the DTC is operating. On-Chip RAM: The MRA, MRB, SAR, DAR, CRA, and CRB registers are all located in on-chip RAM. When the DTC is used, the RAME bit in SYSCR must not be cleared to 0. DMAC Transfer End Interrupt*: When DTC transfer is activated by a DMAC transfer end interrupt, regardless of the transfer counter and DISEL bit, the DMAC's DTE bit is not subject to DTC control, and the write data has priority. Consequently, an interrupt request may not be sent to the CPU when the DTC transfer counter reaches 0. Note: * The DMAC is not supported in the H8S/2321. DTCE Bit Setting: For DTCE bit setting, read/write operations must be performed using bitmanipulation instructions such as BSET and BCLR. For the initial setting only, however, when multiple activation sources are set at one time, it is possible to disable interrupts and write after executing a dummy read on the relevant register. Chain Transfer: When chain transfer is used, clearing of the activation source or DTCER is performed when the last of the chain of data transfers is executed. SCI and A/D converter interrupt/activation sources, on the other hand, are cleared when the DTC reads or writes to the prescribed register. Rev. 4.0, 03/03, page 333 of 1358 Therefore, when the DTC is activated by an interrupt or activation source, if a read/write of the relevant register is not included in the last chained data transfer, the interrupt or activation source will be retained. Rev. 4.0, 03/03, page 334 of 1358 Section 9 I/O Ports 9.1 Overview The H8S/2329 and H8S/2328 Series have 12 I/O ports (ports 1, 2, 3, 5, 6, and A to G), and one input-only port (port 4). Table 9-1 summarizes the port functions. The pins of each port also have other functions. Each port includes a data direction register (DDR) that controls input/output (not provided for the input-only port), a data register (DR) that stores output data, and a port register (PORT) used to read the pin states. Ports A to E have a built-in MOS pull-up function, and in addition to DR and DDR, have a MOS input pull-up control register (PCR) to control the on/off state of MOS input pull-up. Port 3 and port A include an open drain control register (ODR) that controls the on/off state of the output buffer PMOS. Ports 1 and A to F can drive a single TTL load and 50 pF capacitive load, and ports 2, 3, 5, 6, and G can drive a single TTL load and 30 pF capacitive load. Ports 1, 2, and 5 (only when used for IRQ input), and pins 64 to 67 and A4 to A7, are Schmitttriggered inputs. Rev. 4.0, 03/03, page 335 of 1358 Table 9-1 Port Functions Port Description Port 1 * 8-bit I/O port * Schmitttriggered input Pins P17/PO15/TIOCB2/TCLKD P16/PO14/TIOCA2 P15/PO13/TIOCB1/TCLKC P14/PO12/TIOCA1 Mode 4*1 Mode 5*1 Mode 6 Mode 7 8-bit I/O port also functioning as DMA controller output pins (DACK0 and DACK1)*2, TPU I/O pins (TCLKA, TCLKB, TCLKC, TCLKD, TIOCA0, TIOCB0, TIOCC0, TIOCD0, TIOCA1, TIOCB1, TIOCA2, TIOCB2) and PPG output pins (PO15 to PO8) P13/PO11/TIOCD0/TCLKB P12/PO10/TIOCC0/TCLKA P11/PO9/TIOCB0/DACK1*2 P10/PO8/TIOCA0/DACK0*2 Port 2 * 8-bit I/O port * Schmitttriggered input P27/PO7/TIOCB5/TMO1 P26/PO6/TIOCA5/TMO0 P25/PO5/TIOCB4/TMCI1 P24/PO4/TIOCA4/TMRI1 8-bit I/O port also functioning as TPU I/O pins (TIOCA3, TIOCB3, TIOCC3, TIOCD3, TIOCA4, TIOCB4, TIOCA5, TIOCB5), 8-bit timer (channels 0 and 1) I/O pins (TMRI0, TMCI0, TMO0, TMRI1, TMCI1, TMO1) and PPG output pins (PO7 to PO0) P23/PO3/TIOCD3/TMCI0 P22/PO2/TIOCC3/TMRI0 P21/PO1/TIOCB3 P20/PO0/TIOCA3 Port 3 * 6-bit I/O port P35/SCK1 P34/SCK0 * Open-drain P3 /RxD 3 1 output P32/RxD0 capability 6-bit I/O port also functioning as SCI (channel 0 and 1) I/O pins (TxD0, RxD0, SCK0, TxD1, RxD1, SCK1) P31/TxD1 P30/TxD0 Port 4 * 8-bit input port P47/AN7/DA1 P46/AN6/DA0 P45/AN5 P44/AN4 P43/AN3 P42/AN2 P41/AN1 P40/AN0 Rev. 4.0, 03/03, page 336 of 1358 8-bit input port also functioning as A/D converter analog inputs (AN7 to AN0) and D/A converter analog outputs (DA1 and DA0) Port Description Port 5 * 4-bit I/O port Pins Mode 4*1 Mode 5*1 Mode 6 Mode 7 P53/ADTRG/IRQ7/WAIT/ BREQO I/O port also functioning as A/D converter input pin (ADTRG), and as interrupt input pin (IRQ7) when IRQPAS = 1, WAIT input pin when WAITE = 1, BREQOE = 0, WAITPS = 1, DDR = 0, and WAITE = 0, BREQOE = 1, BREQO output pin when BREQOPS = 1 P52/SCK2/IRQ6 I/O port also functioning as SCI (channel 2) I/O pins (TxD2, RxD2, SCK2), and as interrupt input pins (IRQ4 to IRQ6) when IRQPAS = 1 * Schmitttriggered input (IRQ input only) P51/RxD2/IRQ5 I/O port also functioning as A/D converter input pin (ADTRG), and as interrupt input pin (IRQ7) when IRQPAS = 1 P50/TxD2/IRQ4 Port 6 * 8-bit I/O port P67/IRQ3/CS7 P66/IRQ2/CS6 * SchmittP65/IRQ1 triggered P64/IRQ0 input (P64 to P67) P63/TEND1*2 P62/DREQ1*2 8-bit I/O port also functioning as DMA controller I/O pins (DREQ0, TEND0, DREQ1, TEND1) *2, bus control output pins (CS4 to CS7), and interrupt input pins (IRQ0 to IRQ3) 8-bit I/O port also functioning as interrupt input pins (IRQ0 to IRQ3) When DDR = 0 (after reset): dual function as input ports When DDR = 1 and A23E to and interrupt input pins A21E = 1: address output (IRQ7 to When DDR = 1 and A23E to IRQ4) A21E = 0: DR value output Dual function as I/O ports and interrupt input pins (IRQ7 to IRQ4) P61/TEND0*2/CS5 P60/DREQ0*2/CS4 Port A * 8-bit I/O port PA7/A23/IRQ7 PA6/A22/IRQ6 * Built-in PA5/A21/IRQ5 MOS input pull-up * Open-drain output capability * Schmitttriggered input (PA4 to PA7) PA4/A20/IRQ4 When DDR = 0 (after reset): dual function as input ports and interrupt input pins (IRQ7 to IRQ5) When DDR = I/O port also functioning as address output and interrupt 1 and A23E to A20E = 1: input pin (IRQ4) address output When DDR = 1 and A23E to A20E = 0: DR value output PA3/A19 to PA0/A16 Address output When DDR = I/O ports 0 (after reset): input ports When DDR = 1: address output Rev. 4.0, 03/03, page 337 of 1358 Port Description Port B * 8-bit I/O port Pins PB7/A15 to PB0/A8 Mode 4*1 Mode 5*1 Address output * Built-in MOS input pull-up Port C * 8-bit I/O port Mode 7 When DDR = 1: address output PC7/A7 to PC0/A0 Address output * Built-in MOS input pull-up Port D * 8-bit I/O port Mode 6 When DDR = I/O port 0 (after reset): input port When DDR = I/O port 0 (after reset): input port When DDR = 1: address output PD7/D15 to PD0/D8 Data bus input/output I/O port PE7/D7 to PE0/D0 In 8-bit bus mode: I/O port I/O port * Built-in MOS input pull-up Port E * 8-bit I/O port In 16-bit bus mode: data bus input/output * Built-in MOS input pull-up Port F * 8-bit I/O port PF7/ When DDR = 0: input port When DDR = 1 (after reset): output When DDR = 0 (after reset): input port When DDR = 1: output PF6/AS When ASOD = 1: I/O port When ASOD = 0: AS output PF5/RD RD, HWR output PF4/HWR PF3/LWR When LWROD = 1: I/O port When LWROD = 0: LWR output PF2/LCAS*2/WAIT/BREQO When WAITE = 0 and BREQOE = 0 (after reset): I/O port When WAITE = 1, BREQOE = 0, and WAITPS = 0, DDR = 0: WAIT input When WAITE = 0, BREQOE = 1, and BREQOPS = 0: BREQO output When RMTS2 to RMTS0= B'001 to B'011, and 16-bit access space is set: LCAS output PF1/BACK When BRLE = 0 (after reset): I/O port PF0/BREQ When BRLE = 1: BREQ input, BACK output Rev. 4.0, 03/03, page 338 of 1358 I/O port Port Description Port G * 5-bit I/O port Pins Mode 4*1 Mode 5*1 Mode 6 *3 PG4/CS0 When DDR = 0 : input port When DDR = 1*4: CS0 output PG3/CS1 When DDR = 0 (after reset): input port Mode 7 I/O port When CS167E = 0 and DDR = 1: output port When CS167E = 1 and DDR = 1: CS1 output PG2/CS2 When DDR = 0 (after reset): input port When CS25E = 0 and DDR = 1: output port When CS25E = 1 and DDR = 1: CS2 output PG1/CS3 When DDR = 0 (after reset): input port When CS25E = 0 and DDR = 1: output port When CS25E = 1 and DDR = 1: CS3 output PG0/CAS*2 DRAM space set: CAS output Otherwise (after reset): I/O port Notes: *1 Only modes 4 and 5 are provided in the ROMless version. *2 The DACK1, DACK0, TEND1, DREQ1, TEND0, DREQ0 and LCAS are not supported in the H8S/2321. *3 After a reset in mode 6. *4 After a reset in mode 4 or 5. Rev. 4.0, 03/03, page 339 of 1358 9.2 Port 1 9.2.1 Overview Port 1 is an 8-bit I/O port. Port 1 pins also function as PPG output pins (PO15 to PO8), TPU I/O pins (TCLKA, TCLKB, TCLKC, TCLKD, TIOCA0, TIOCB0, TIOCC0, TIOCD0, TIOCA1, TIOCB1, TIOCA2, and TIOCB2), and DMAC* output pins (DACK0 and DACK1). Port 1 pin functions are the same in all operating modes. Port 1 uses Schmitt-triggered input. Figure 9-1 shows the port 1 pin configuration. Note: * Not supported in the H8S/2321. Port 1 pins P17 (I/O) / PO15 (output) / TIOCB2 (I/O) / TCLKD (input) P16 (I/O) / PO14 (output) / TIOCA2 (I/O) P15 (I/O) / PO13 (output) / TIOCB1 (I/O) / TCLKC (input) Port 1 P14 (I/O) / PO12 (output) / TIOCA1 (I/O) P13 (I/O) / PO11 (output) / TIOCD0 (I/O) / TCLKB (input) P12 (I/O) / PO10 (output) / TIOCC0 (I/O) / TCLKA (input) P11 (I/O) / PO9 (output) / TIOCB0 (I/O) / DACK1* (output) P10 (I/O) / PO8 (output) / TIOCA0 (I/O) / DACK0* (output) Note: * The DACK1 and DACK0 pin functions are not supported in the H8S/2321. Figure 9-1 Port 1 Pin Functions Rev. 4.0, 03/03, page 340 of 1358 9.2.2 Register Configuration Table 9-2 shows the port 1 register configuration. Table 9-2 Port 1 Registers Name Abbreviation R/W Initial Value Address* Port 1 data direction register P1DDR W H'00 H'FEB0 Port 1 data register P1DR R/W H'00 H'FF60 Port 1 register PORT1 R Undefined H'FF50 Note: * Lower 16 bits of the address. Port 1 Data Direction Register (P1DDR) Bit : 7 6 5 4 3 2 1 0 P17DDR P16DDR P15DDR P14DDR P13DDR P12DDR P11DDR P10DDR Initial value : 0 0 0 0 0 0 0 0 R/W W W W W W W W W : P1DDR is an 8-bit write-only register, the individual bits of which specify input or output for the pins of port 1. P1DDR cannot be read; if it is, an undefined value will be read. Setting a P1DDR bit to 1 makes the corresponding port 1 pin an output pin, while clearing the bit to 0 makes the pin an input pin. P1DDR is initialized to H'00 by a reset, and in hardware standby mode. It retains its prior state in software standby mode. Rev. 4.0, 03/03, page 341 of 1358 Port 1 Data Register (P1DR) Bit : Initial value : R/W : 7 6 5 4 3 2 1 0 P17DR P16DR P15DR P14DR P13DR P12DR P11DR P10DR 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W P1DR is an 8-bit readable/writable register that stores output data for the port 1 pins (P17 to P10). P1DR is initialized to H'00 by a reset, and in hardware standby mode. It retains its prior state in software standby mode. Port 1 Register (PORT1) Bit : Initial value : R/W : 7 6 5 4 3 2 1 0 P17 --* P16 --* P15 --* P14 --* P13 --* P12 --* P11 --* P10 --* R R R R R R R R Note: * Determined by state of pins P17 to P10. PORT1 is an 8-bit read-only register that shows the pin states. It cannot be written to. Writing of output data for the port 1 pins (P17 to P10) must always be performed on P1DR. If a port 1 read is performed while P1DDR bits are set to 1, the P1DR values are read. If a port 1 read is performed while P1DDR bits are cleared to 0, the pin states are read. After a reset and in hardware standby mode, PORT1 contents are determined by the pin states, as P1DDR and P1DR are initialized. PORT1 retains its prior state in software standby mode. Rev. 4.0, 03/03, page 342 of 1358 9.2.3 Pin Functions Port 1 pins also function as PPG output pins (PO15 to PO8), TPU I/O pins (TCLKA, TCLKB, TCLKC, TCLKD, TIOCA0, TIOCB0, TIOCC0, TIOCD0, TIOCA1, TIOCB1, TIOCA2, and TIOCB2), and DMAC* output pins (DACK0 and DACK1). Port 1 pin functions are shown in table 9-3. Note: * The DMAC is not supported in the H8S/2321. Table 9-3 Port 1 Pin Functions Pin Selection Method and Pin Functions P17/PO15/ TIOCB2/TCLKD The pin function is switched as shown below according to the combination of the TPU channel 2 setting (by bits MD3 to MD0 in TMDR2, bits IOB3 to IOB0 in TIOR2, and bits CCLR1 and CCLR0 in TCR2), bits TPSC2 to TPSC0 in TCR0 and TCR5, bit NDER15 in NDERH, and bit P17DDR. TPU Channel 2 Setting Table Below (1) Table Below (2) P17DDR -- 0 1 1 NDER15 -- -- 0 1 P17 PO15 Pin function TIOCB2 output P17 input output output 1 TIOCB2 input* 2 TCLKD input* Notes: *1 TIOCB2 input when MD3 to MD0 = B'0000 or B'01xx, and IOB3 = 1. *2 TCLKD input when the setting for either TCR0 or TCR5 is: TPSC2 to TPSC0 = B'111. TCLKD input when channels 2 and 4 are set to phase counting mode. TPU Channel 2 Setting (2) (1) (2) (2) (1) (2) MD3 to MD0 B'0000, B'01xx B'0010 B'0011 IOB3 to IOB0 B'0000 B'0001 to -- B'xx00 Other than B'xx00 B'0100 B'0011 B'1xxx B'0101 to B'0111 CCLR1, -- -- -- -- Other B'10 CCLR0 than B'10 Output -- Output -- -- PWM -- function compare mode 2 output output x: Don't care Rev. 4.0, 03/03, page 343 of 1358 Pin Selection Method and Pin Functions P16/PO14/ TIOCA2 The pin function is switched as shown below according to the combination of the TPU channel 2 setting (by bits MD3 to MD0 in TMDR2, bits IOA3 to IOA0 in TIOR2, and bits CCLR1 and CCLR0 in TCR2), bit NDER14 in NDERH, and bit P16DDR. TPU Channel 2 Setting Table Below (1) Table Below (2) P16DDR -- 0 1 1 NDER14 -- -- 0 1 TIOCA2 output P16 input P16 output PO14 output Pin function 1 TIOCA2 input* TPU Channel 2 Setting MD3 to MD0 IOA3 to IOA0 CCLR1, CCLR0 Output function (2) (1) (2) B'0000, B'01xx B'001x B'0000 B'0001 to B'xx00 B'0100 B'0011 B'1xxx B'0101 to B'0111 -- -- -- -- Output compare output -- (1) (1) (2) B'0011 B'0011 Other than B'xx00 -- Other B'01 than B'01 PWM PWM -- mode 1 mode 2 2 output output* x: Don't care Notes: *1 TIOCA2 input when MD3 to MD0 = B'0000 or B'01xx, and IOA3 = 1. *2 TIOCB2 output is disabled. Rev. 4.0, 03/03, page 344 of 1358 Pin Selection Method and Pin Functions P15/PO13/ TIOCB1/TCLKC The pin function is switched as shown below according to the combination of the TPU channel 1 setting (by bits MD3 to MD0 in TMDR1, bits IOB3 to IOB0 in TIOR1, and bits CCLR1 and CCLR0 in TCR1), bits TPSC2 to TPSC0 in TCR0, TCR2, TCR4, and TCR5, bit NDER13 in NDERH, and bit P15DDR. TPU Channel 1 Setting Table Below (1) Table Below (2) P15DDR -- 0 1 1 NDER13 -- -- 0 1 TIOCB1 output P15 input P15 output PO13 output Pin function 1 TIOCB1 input* 2 TCLKC input* Notes: *1 TIOCB1 input when MD3 to MD0 = B'0000 or B'01xx, and IOB3 to IOB0 = B'10xx. *2 TCLKC input when the setting for either TCR0 or TCR2 is: TPSC2 to TPSC0 = B'110; or when the setting for either TCR4 or TCR5 is TPSC2 to TPSC0 = B'101. TCLKC input when channels 2 and 4 are set to phase counting mode. TPU Channel 1 Setting MD3 to MD0 IOB3 to IOB0 CCLR1, CCLR0 Output function (2) (1) (2) B'0000, B'01xx B'0010 B'0000 B'0001 to -- B'0011 B'0100 B'1xxx B'0101 to B'0111 -- -- -- -- Output compare output -- (2) B'xx00 -- -- (1) (2) B'0011 Other than B'xx00 Other B'10 than B'10 PWM -- mode 2 output x: Don't care Rev. 4.0, 03/03, page 345 of 1358 Pin Selection Method and Pin Functions P14/PO12/ TIOCA1 The pin function is switched as shown below according to the combination of the TPU channel 1 setting (by bits MD3 to MD0 in TMDR1, bits IOA3 to IOA0 in TIOR1, and bits CCLR1 and CCLR0 in TCR1), bit NDER12 in NDERH, and bit P14DDR. TPU Channel 1 Setting Table Below (1) Table Below (2) P14DDR -- 0 1 1 NDER12 -- -- 0 1 TIOCA1 output P14 input P14 output PO12 output Pin function 1 TIOCA1 input* TPU Channel 1 Setting MD3 to MD0 IOA3 to IOA0 CCLR1, CCLR0 Output function (2) (1) (2) B'0000, B'01xx B'001x B'0000 B'0001 to B'xx00 B'0100 B'0011 B'1xxx B'0101 to B'0111 -- -- -- -- Output compare output -- (1) B'0010 Other than B'xx00 (1) (2) B'0011 Other than B'xx00 -- Other B'01 than B'01 PWM PWM -- mode 1 mode 2 2 output output* x: Don't care Notes: *1 TIOCA1 input when MD3 to MD0 = B'0000 or B'01xx, and IOA3 to IOA0 = B'10xx. *2 TIOCB1 output is disabled. Rev. 4.0, 03/03, page 346 of 1358 Pin Selection Method and Pin Functions P13/PO11/ TIOCD0/TCLKB The pin function is switched as shown below according to the combination of the TPU channel 0 setting (by bits MD3 to MD0 in TMDR0, bits IOD3 to IOD0 in TIOR0L, and bits CCLR2 to CCLR0 in TCR0), bits TPSC2 to TPSC0 in TCR0 to TCR2, bit NDER11 in NDERH, and bit P13DDR. TPU Channel 0 Setting Table Below (1) Table Below (2) P13DDR -- 0 1 1 NDER11 -- -- 0 1 TIOCD0 output P13 input P13 output PO11 output Pin function 1 TIOCD0 input* 2 TCLKB input* Notes: *1 TIOCD0 input when MD3 to MD0 = B'0000, and IOD3 to IOD0 = B'10xx. *2 TCLKB input when the setting for TCR0 to TCR2 is: TPSC2 to TPSC0 = B'101. TCLKB input when channels 1 and 5 are set to phase counting mode. TPU Channel 0 Setting MD3 to MD0 IOD3 to IOD0 CCLR2 to CCLR0 Output function (2) (2) B'0000 B'0010 B'0000 B'0001 to -- B'0100 B'0011 B'1xxx B'0101 to B'0111 -- -- -- -- (1) Output compare output -- (2) B'xx00 -- -- (1) (2) B'0011 Other than B'xx00 Other B'110 than B'110 PWM -- mode 2 output x: Don't care Rev. 4.0, 03/03, page 347 of 1358 Pin Selection Method and Pin Functions P12/PO10/ TIOCC0/TCLKA The pin function is switched as shown below according to the combination of the TPU channel 0 setting (by bits MD3 to MD0 in TMDR0, bits IOC3 to IOC0 in TIOR0L, and bits CCLR2 to CCLR0 in TCR0), bits TPSC2 to TPSC0 in TCR0 to TCR5, bit NDER10 in NDERH, and bit P12DDR. TPU Channel 0 Setting Table Below (1) Table Below (2) P12DDR -- 0 1 1 NDER10 -- -- 0 1 TIOCC0 output P12 input P12 output PO10 output Pin function 1 TIOCC0 input* 2 TCLKA input* TPU Channel 0 Setting MD3 to MD0 IOC3 to IOC0 CCLR2 to CCLR0 Output function (2) (1) (2) B'0000 B'001x B'0000 B'0001 to B'xx00 B'0100 B'0011 B'1xxx B'0101 to B'0111 -- -- -- -- Output compare output -- (1) (1) (2) B'0010 B'0011 Other than B'xx00 -- PWM mode 1 3 output* Other B'101 than B'101 PWM -- mode 2 output x: Don't care Notes: *1 TIOCC0 input when MD3 to MD0 = B'0000, and IOC3 to IOC0 = B'10xx. *2 TCLKA input when the setting for TCR0 to TCR5 is: TPSC2 to TPSC0 = B'100. TCLKA input when channels 1 and 5 are set to phase counting mode. *3 TIOCD0 output is disabled. When BFA = 1 or BFB = 1 in TMDR0, output is disabled and setting (2) applies. Rev. 4.0, 03/03, page 348 of 1358 Pin Selection Method and Pin Functions P11/PO9/TIOCB0/ 2 DACK1* The pin function is switched as shown below according to the combination of the TPU channel 0 setting (by bits MD3 to MD0 in TMDR0, bits IOB3 to IOB0 in TIOR0H, and bits CCLR2 to CCLR0 in TCR0), bit NDER9 in NDERH, bit 2 SAE1* in DMABCRH, and bit P11DDR. 2 SAE1* 0 1 TPU Channel 0 Setting Table Below (1) Table Below (2) P11DDR -- 0 1 1 -- NDER9 -- -- 0 1 -- TIOCB0 output P11 input P11 output Pin function PO9 output 1 TIOCB0 input* DACK1* output 2 Notes: *1 TIOCB0 input when MD3 to MD0 = B'0000, and IOB3 to IOB0 = B'10xx. *2 The DMAC and the DACK1 pin function are not supported in the H8S/2321. TPU Channel 0 Setting MD3 to MD0 IOB3 to IOB0 CCLR2 to CCLR0 Output function (2) (2) B'0000 B'0010 B'0000 B'0001 to -- B'0100 B'0011 B'1xxx B'0101 to B'0111 -- -- -- -- (1) Output compare output -- (2) B'xx00 -- -- (1) (2) B'0011 Other than B'xx00 Other B'010 than B'010 PWM -- mode 2 output x: Don't care Rev. 4.0, 03/03, page 349 of 1358 Pin Selection Method and Pin Functions P10/PO8/TIOCA0/ 2 DACK0* The pin function is switched as shown below according to the combination of the TPU channel 0 setting (by bits MD3 to MD0 in TMDR0, bits IOA3 to IOA0 in TIOR0H, and bits CCLR2 to CCLR0 in TCR0), bit NDER8 in NDERH, bit 2 SAE0* in DMABCRH, and bit P10DDR. 2 SAE0* 0 1 TPU Channel 0 Setting Table Below (1) Table Below (2) -- P10DDR -- 0 1 1 -- NDER8 -- -- 0 1 -- TIOCA0 output P10 input P10 output Pin function TPU Channel 0 Setting MD3 to MD0 IOA3 to IOA0 CCLR2 to CCLR0 Output function PO8 output 1 TIOCA0 input* (2) (1) (2) B'0000 B'001x B'0000 B'0001 to B'xx00 B'0100 B'0011 B'1xxx B'0101 to B'0111 -- -- -- -- Output compare output -- DACK0* output (1) (1) (2) B'0010 B'0011 Other than B'xx00 -- PWM mode 1 3 output* Other B'001 than B'001 PWM -- mode 2 output x: Don't care Notes: *1 TIOCA0 input when MD3 to MD0 = B'0000, and IOA3 to IOA0 = B'10xx. *2 The DMAC and the DACK0 pin function are not supported in the H8S/2321. *3 TIOCB0 output is disabled. Rev. 4.0, 03/03, page 350 of 1358 2 9.3 Port 2 9.3.1 Overview Port 2 is an 8-bit I/O port. Port 2 pins also function as PPG output pins (PO7 to PO0), TPU I/O pins (TIOCA3, TIOCB3, TIOCC3, TIOCD3, TIOCA4, TIOCB4, TIOCA5, and TIOCB5) and 8-bit timer I/O pins (TMRI0, TMCI0, TMO0, TMRI1, TMCI1, TMO1). Port 2 pin functions are the same in all operating modes. Port 2 uses Schmitt-triggered input. Figure 9-2 shows the port 2 pin configuration. Port 2 pins P27 (I/O) / PO7 (output) / TIOCB5 (I/O) / TMO1 (output) P26 (I/O) / PO6 (output) / TIOCA5 (I/O) / TMO0 (output) P25 (I/O) / PO5 (output) / TIOCB4 (I/O) / TMCI1 (input) Port 2 P24 (I/O) / PO4 (output) / TIOCA4 (I/O) / TMRI1 (input) P23 (I/O) / PO3 (output) / TIOCD3 (I/O) / TMCI0 (input) P22 (I/O) / PO2 (output) / TIOCC3 (I/O) / TMRI0 (input) P21 (I/O) / PO1 (output) / TIOCB3 (I/O) P20 (I/O) / PO0 (output) / TIOCA3 (I/O) Figure 9-2 Port 2 Pin Functions Rev. 4.0, 03/03, page 351 of 1358 9.3.2 Register Configuration Table 9-4 shows the port 2 register configuration. Table 9-4 Port 2 Registers Name Abbreviation R/W Initial Value Address* Port 2 data direction register P2DDR W H'00 H'FEB1 Port 2 data register P2DR R/W H'00 H'FF61 Port 2 register PORT2 R Undefined H'FF51 Note: * Lower 16 bits of the address. Port 2 Data Direction Register (P2DDR) Bit : 7 6 5 4 3 2 1 0 P27DDR P26DDR P25DDR P24DDR P23DDR P22DDR P21DDR P20DDR Initial value : 0 0 0 0 0 0 0 0 R/W W W W W W W W W : P2DDR is an 8-bit write-only register, the individual bits of which specify input or output for the pins of port 2. P2DDR cannot be read; if it is, an undefined value will be read. Setting a P2DDR bit to 1 makes the corresponding port 2 pin an output pin, while clearing the bit to 0 makes the pin an input pin. P2DDR is initialized to H'00 by a reset, and in hardware standby mode. It retains its prior state in software standby mode. Rev. 4.0, 03/03, page 352 of 1358 Port 2 Data Register (P2DR) Bit : Initial value : R/W : 7 6 5 4 3 2 1 0 P27DR P26DR P25DR P24DR P23DR P22DR P21DR P20DR 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W P2DR is an 8-bit readable/writable register that stores output data for the port 2 pins (P27 to P20). P2DR is initialized to H'00 by a reset, and in hardware standby mode. It retains its prior state in software standby mode. Port 2 Register (PORT2) Bit : Initial value : R/W : 7 6 5 4 3 2 1 0 P27 --* P26 --* P25 --* P24 --* P23 --* P22 --* P21 --* P20 --* R R R R R R R R Note: * Determined by state of pins P27 to P20. PORT2 is an 8-bit read-only register that shows the pin states. It cannot be written to. Writing of output data for the port 2 pins (P27 to P20) must always be performed on P2DR. If a port 2 read is performed while P2DDR bits are set to 1, the P2DR values are read. If a port 2 read is performed while P2DDR bits are cleared to 0, the pin states are read. After a reset and in hardware standby mode, PORT2 contents are determined by the pin states, as P2DDR and P2DR are initialized. PORT2 retains its prior state in software standby mode. Rev. 4.0, 03/03, page 353 of 1358 9.3.3 Pin Functions Port 2 pins also function as PPG output pins (PO7 to PO0) and TPU I/O pins (TIOCA3, TIOCB3, TIOCC3, TIOCD3, TIOCA4, TIOCB4, TIOCA5, and TIOCB5), and 8-bit timer I/O pins (TMRI0, TMCI0, TMO0, TMRI1, TMCI1, and TMO1). Port 2 pin functions are shown in table 9-5. Table 9-5 Port 2 Pin Functions Pin Selection Method and Pin Functions P27/PO7/TIOCB5/ TMO1 The pin function is switched as shown below according to the combination of the TPU channel 5 setting (by bits MD3 to MD0 in TMDR5, bits IOB3 to IOB0 in TIOR5, and bits CCLR1 and CCLR0 in TCR5), bit NDER7 in NDERL, bits OS3 to OS0 in TCSR1, and bit P27DDR. OS3 to OS0 TPU Channel 5 Setting All 0 Table Below (1) Not all 0 Table Below (2) -- P27DDR -- 0 1 1 -- NDER7 -- -- 0 1 -- TIOCB5 output P27 input P27 output Pin function PO7 output TIOCB5 input* TMO1 output Note: * TIOCB5 input when MD3 to MD0 = B'0000 or B'01xx, and IOB3 = 1. TPU Channel 5 Setting MD3 to MD0 IOB3 to IOB0 CCLR1, CCLR0 Output function Rev. 4.0, 03/03, page 354 of 1358 (2) (1) (2) B'0000, B'01xx B'0010 B'0000 B'0001 to -- B'0100 B'0011 B'1xxx B'0101 to B'0111 -- -- -- -- Output compare output -- (2) B'xx00 -- -- (1) (2) B'0011 Other than B'xx00 Other B'10 than B'10 PWM -- mode 2 output x: Don't care Pin Selection Method and Pin Functions P26/PO6/TIOCA5/ TMO0 The pin function is switched as shown below according to the combination of the TPU channel 5 setting (by bits MD3 to MD0 in TMDR5, bits IOA3 to IOA0 in TIOR5, and bits CCLR1 and CCLR0 in TCR5), bit NDER6 in NDERL, bits OS3 to OS0 in TCSR0, and bit P26DDR. OS3 to OS0 TPU Channel 5 Setting All 0 Table Below (1) Not all 0 Table Below (2) -- P26DDR -- 0 1 1 -- NDER6 -- -- 0 1 -- TIOCA5 output P26 input P26 output Pin function TPU Channel 5 Setting MD3 to MD0 IOA3 to IOA0 CCLR1, CCLR0 Output function PO6 output 1 TIOCA5 input* (2) (1) (2) B'0000, B'01xx B'001x B'0000 B'0001 to B'xx00 B'0100 B'0011 B'1xxx B'0101 to B'0111 -- -- -- -- Output compare output -- TMO0 output (1) (1) (2) B'0010 B'0011 Other than B'xx00 -- Other B'01 than B'01 PWM PWM -- mode 1 mode 2 2 output output* x: Don't care Notes: *1 TIOCA5 input when MD3 to MD0 = B'0000 or B'01xx, and IOA3 = 1. *2 TIOCB5 output is disabled. Rev. 4.0, 03/03, page 355 of 1358 Pin Selection Method and Pin Functions P25/PO5/TIOCB4/ TMCI1 This pin is used as the 8-bit timer external clock input pin when an external clock is selected with bits CKS2 to CKS0 in TCR1. The pin function is switched as shown below according to the combination of the TPU channel 4 setting (by bits MD3 to MD0 in TMDR4, bits IOB3 to IOB0 in TIOR4, and bits CCLR1 and CCLR0 in TCR4), bit NDER5 in NDERL, and bit P25DDR. TPU Channel 4 Setting Table Below (1) Table Below (2) P25DDR -- 0 1 1 NDER5 -- -- 0 1 TIOCB4 output P25 input P25 output PO5 output Pin function TIOCB4 input* TMCI1 input Note: * TIOCB4 input when MD3 to MD0 = B'0000 or B'01xx, and IOB3 to IOB0 = B'10xx. TPU Channel 4 Setting MD3 to MD0 IOB3 to IOB0 CCLR1, CCLR0 Output function Rev. 4.0, 03/03, page 356 of 1358 (2) (1) (2) B'0000, B'01xx B'0010 B'0000 B'0001 to -- B'0100 B'0011 B'1xxx B'0101 to B'0111 -- -- -- -- Output compare output -- (2) B'xx00 -- -- (1) (2) B'0011 Other than B'xx00 Other B'10 than B'10 PWM -- mode 2 output x: Don't care Pin Selection Method and Pin Functions P24/PO4/TIOCA4/ TMRI1 This pin is used as the 8-bit timer counter reset pin when bits CCLR1 and CCLR0 in TCR1 are both set to 1. The pin function is switched as shown below according to the combination of the TPU channel 4 setting (by bits MD3 to MD0 in TMDR4, bits IOA3 to IOA0 in TIOR4, and bits CCLR1 and CCLR0 in TCR4), bit NDER4 in NDERL, and bit P24DDR. TPU Channel 4 Setting Table Below (1) Table Below (2) P24DDR -- 0 1 1 NDER4 -- -- 0 1 TIOCA4 output P24 input P24 output PO4 output Pin function 1 TIOCA4 input* TMRI1 input TPU Channel 4 Setting MD3 to MD0 IOA3 to IOA0 CCLR1, CCLR0 Output function (2) (1) (2) B'0000, B'01xx B'001x B'0000 B'0001 to B'xx00 B'0100 B'0011 B'1xxx B'0101 to B'0111 -- -- -- -- Output compare output -- (1) (1) (2) B'0010 B'0011 Other than B'xx00 -- Other B'01 than B'01 PWM PWM -- mode 1 mode 2 2 output output* x: Don't care Notes: *1 TIOCA4 input when MD3 to MD0 = B'0000 or B'01xx, and IOA3 to IOA0 = B'10xx. *2 TIOCB4 output is disabled. Rev. 4.0, 03/03, page 357 of 1358 Pin Selection Method and Pin Functions P23/PO3/TIOCD3/ TMCI0 This pin is used as the 8-bit timer external clock input pin when an external clock is selected with bits CKS2 to CKS0 in TCR0. The pin function is switched as shown below according to the combination of the TPU channel 3 setting (by bits MD3 to MD0 in TMDR3, bits IOD3 to IOD0 in TIOR3L, and bits CCLR2 to CCLR0 in TCR3), bit NDER3 in NDERL, and bit P23DDR. TPU Channel 3 Setting Table Below (1) Table Below (2) P23DDR -- 0 1 1 NDER3 -- -- 0 1 TIOCD3 output P23 input P23 output Pin function PO3 output TIOCD3 input* TMCI0 input Note: * TIOCD3 input when MD3 to MD0 = B'0000, and IOD3 to IOD0 = B'10xx. TPU Channel 3 Setting MD3 to MD0 IOD3 to IOD0 CCLR2 to CCLR0 Output function Rev. 4.0, 03/03, page 358 of 1358 (2) (1) (2) B'0000 B'0010 B'0000 B'0001 to -- B'0100 B'0011 B'1xxx B'0101 to B'0111 -- -- -- -- Output compare output -- (2) B'xx00 -- -- (1) (2) B'0011 Other than B'xx00 Other B'110 than B'110 PWM -- mode 2 output x: Don't care Pin Selection Method and Pin Functions P22/PO2/TIOCC3/ TMRI0 This pin is used as the 8-bit timer counter reset pin when bits CCLR1 and CCLR0 in TCR0 are both set to 1. The pin function is switched as shown below according to the combination of the TPU channel 3 setting (by bits MD3 to MD0 in TMDR3, bits IOC3 to IOC0 in TIOR3L, and bits CCLR2 to CCLR0 in TCR3), bit NDER2 in NDERL, and bit P22DDR. TPU Channel 3 Setting Table Below (1) Table Below (2) P22DDR -- 0 1 1 NDER2 -- -- 0 1 TIOCC3 output P22 input P22 output PO2 output Pin function 1 TIOCC3 input* TMRI0 input TPU Channel 3 Setting MD3 to MD0 IOC3 to IOC0 CCLR2 to CCLR0 Output function (2) (2) B'0000 B'001x B'0000 B'0001 to B'xx00 B'0100 B'0011 B'1xxx B'0101 to B'0111 -- -- -- -- (1) Output compare output -- (1) (1) (2) B'0010 B'0011 Other than B'xx00 -- PWM mode 1 2 output* Other B'101 than B'101 PWM -- mode 2 output x: Don't care Notes: *1 TIOCC3 input when MD3 to MD0 = B'0000, and IOC3 to IOC0 = B'10xx. *2 TIOCD3 output is disabled. When BFA = 1 or BFB = 1 in TMDR3, output is disabled and setting (2) applies. Rev. 4.0, 03/03, page 359 of 1358 Pin Selection Method and Pin Functions P21/PO1/TIOCB3 The pin function is switched as shown below according to the combination of the TPU channel 3 setting (by bits MD3 to MD0 in TMDR3, bits IOB3 to IOB0 in TIOR3H, and bits CCLR2 to CCLR0 in TCR3), bit NDER1 in NDERL, and bit P21DDR. TPU Channel 3 Setting Table Below (1) Table Below (2) P21DDR -- 0 1 1 NDER1 -- -- 0 1 TIOCB3 output P21 input P21 output PO1 output Pin function TIOCB3 input* Note: * TIOCB3 input when MD3 to MD0 = B'0000, and IOB3 to IOB0 = B'10xx. TPU Channel 3 Setting MD3 to MD0 IOB3 to IOB0 CCLR2 to CCLR0 Output function Rev. 4.0, 03/03, page 360 of 1358 (2) (1) (2) B'0000 B'0010 B'0000 B'0001 to -- B'0011 B'0100 B'1xxx B'0101 to B'0111 -- -- -- -- Output compare output -- (2) B'xx00 -- -- (1) (2) B'0011 Other than B'xx00 Other B'010 than B'010 PWM -- mode 2 output x: Don't care Pin Selection Method and Pin Functions P20/PO0/TIOCA3 The pin function is switched as shown below according to the combination of the TPU channel 3 setting (by bits MD3 to MD0 in TMDR3, bits IOA3 to IOA0 in TIOR3H, and bits CCLR2 to CCLR0 in TCR3), bit NDER0 in NDERL, and bit P20DDR. TPU Channel 3 Setting Table Below (1) Table Below (2) P20DDR -- 0 1 1 NDER0 -- -- 0 1 TIOCA3 output P20 input P20 output PO0 output Pin function 1 TIOCA3 input* TPU Channel 3 Setting MD3 to MD0 IOA3 to IOA0 CCLR2 to CCLR0 Output function (2) (1) (2) B'0000 B'001x B'0000 B'0001 to B'xx00 B'0100 B'0011 B'1xxx B'0101 to B'0111 -- -- -- -- Output compare output -- (1) (1) (2) B'0010 B'0011 Other than B'xx00 -- PWM mode 1 2 output* Other B'001 than B'001 PWM -- mode 2 output x: Don't care Notes: *1 TIOCA3 input when MD3 to MD0 = B'0000, and IOA3 to IOA0 = B'10xx. *2 TIOCB3 output is disabled. Rev. 4.0, 03/03, page 361 of 1358 9.4 Port 3 9.4.1 Overview Port 3 is a 6-bit I/O port. Port 3 pins also function as SCI I/O pins (TxD0, RxD0, SCK0, TxD1, RxD1, and SCK1). Port 3 pin functions are the same in all operating modes. Figure 9-3 shows the port 3 pin configuration. Port 3 pins P35 (I/O) / SCK1 (I/O) P34 (I/O) / SCK0 (I/O) P33 (I/O) / RxD1 (input) Port 3 P32 (I/O) / RxD0 (input) P31 (I/O) / TxD1 (output) P30 (I/O) / TxD0 (output) Figure 9-3 Port 3 Pin Functions 9.4.2 Register Configuration Table 9-6 shows the port 3 register configuration. Table 9-6 Port 3 Registers 2 1 Name Abbreviation R/W Initial Value* Address* Port 3 data direction register P3DDR W H'00 H'FEB2 Port 3 data register P3DR R/W H'00 H'FF62 Port 3 register PORT3 R Undefined H'FF52 Port 3 open drain control register P3ODR R/W H'00 H'FF76 Notes: *1 Lower 16 bits of the address. *2 Value of bits 5 to 0. Rev. 4.0, 03/03, page 362 of 1358 Port 3 Data Direction Register (P3DDR) Bit : 7 6 -- -- 5 4 3 2 1 0 P35DDR P34DDR P33DDR P32DDR P31DDR P30DDR Initial value : Undefined Undefined 0 0 0 0 0 0 R/W W W W W W W : -- -- P3DDR is an 8-bit write-only register, the individual bits of which specify input or output for the pins of port 3. Bits 7 and 6 are reserved. P3DDR cannot be read; if it is, an undefined value will be read. Setting a P3DDR bit to 1 makes the corresponding port 3 pin an output pin, while clearing the bit to 0 makes the pin an input pin. P3DDR is initialized to H'00 (bits 5 to 0) by a reset, and in hardware standby mode. It retains its prior state in software standby mode. As the SCI is initialized, the pin states are determined by the P3DDR and P3DR specifications. Port 3 Data Register (P3DR) Bit : 7 6 5 4 3 2 1 0 -- -- P35DR P34DR P33DR P32DR P31DR P30DR 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W Initial value : Undefined Undefined R/W : -- -- P3DR is an 8-bit readable/writable register that stores output data for the port 3 pins (P35 to P30). Bits 7 and 6 are reserved; they return an undefined value if read, and cannot be modified. P3DR is initialized to H'00 (bits 5 to 0) by a reset, and in hardware standby mode. It retains its prior state in software standby mode. Rev. 4.0, 03/03, page 363 of 1358 Port 3 Register (PORT3) Bit : 7 6 5 4 3 2 1 0 -- -- P35 --* P34 --* P33 --* P32 --* P31 --* P30 --* R R R R R R Initial value : Undefined Undefined R/W : -- -- Note: * Determined by state of pins P35 to P30. PORT3 is an 8-bit read-only register that shows the pin states. Writing of output data for the port 3 pins (P35 to P30) must always be performed on P3DR. Bits 7 and 6 are reserved; they return an undefined value if read, and cannot be modified. If a port 3 read is performed while P3DDR bits are set to 1, the P3DR values are read. If a port 3 read is performed while P3DDR bits are cleared to 0, the pin states are read. After a reset and in hardware standby mode, PORT3 contents are determined by the pin states, as P3DDR and P3DR are initialized. PORT3 retains its prior state in software standby mode. Port 3 Open Drain Control Register (P3ODR) Bit : 7 6 -- -- Initial value : Undefined Undefined R/W : -- -- 5 4 3 2 1 0 P35ODR P34ODR P33ODR P32ODR P31ODR P30ODR 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W P3ODR is an 8-bit readable/writable register that controls the PMOS on/off status for each port 3 pin (P35 to P30). Bits 7 and 6 are reserved; they return an undefined value if read, and cannot be modified. Setting a P3ODR bit to 1 makes the corresponding port 3 pin an NMOS open-drain output pin, while clearing the bit to 0 makes the pin a CMOS output pin. P3ODR is initialized to H'00 (bits 5 to 0) by a reset, and in hardware standby mode. It retains its prior state in software standby mode. Rev. 4.0, 03/03, page 364 of 1358 9.4.3 Pin Functions Port 3 pins also function as SCI I/O pins (TxD0, RxD0, SCK0, TxD1, RxD1, and SCK1). Port 3 pin functions are shown in table 9-7. Table 9-7 Port 3 Pin Functions Pin Selection Method and Pin Functions P35/SCK1 The pin function is switched as shown below according to the combination of bit C/A in the SCI1 SMR, bits CKE0 and CKE1 in SCR, and bit P35DDR. CKE1 0 C/A 0 CKE0 P35DDR Pin function 1 1 0 0 1 1 -- -- -- -- -- P35 SCK1 SCK1 output pin* output pin* output pin* P35 input pin -- SCK1 input pin Note: * When P35ODR = 1, the pin becomes an NMOS open-drain output. P34/SCK0 The pin function is switched as shown below according to the combination of bit C/A in the SCI0 SMR, bits CKE0 and CKE1 in SCR, and bit P34DDR. CKE1 0 C/A 0 CKE0 P34DDR Pin function 1 0 0 P34 input pin 1 1 -- 1 -- -- -- -- -- P34 SCK0 SCK0 output pin* output pin* output pin* SCK0 input pin Note: * When P34ODR = 1, the pin becomes an NMOS open-drain output. Rev. 4.0, 03/03, page 365 of 1358 Pin Selection Method and Pin Functions P33/RxD1 The pin function is switched as shown below according to the combination of bit RE in the SCI1 SCR, and bit P33DDR. RE P33DDR Pin function 0 1 0 1 -- P33 input pin P33 output pin* RxD1 input pin Note: * When P33ODR = 1, the pin becomes an NMOS open-drain output. P32/RxD0 The pin function is switched as shown below according to the combination of bit RE in the SCI0 SCR, and bit P32DDR. RE P32DDR Pin function 0 1 0 1 -- P32 input pin P32 output pin* RxD0 input pin Note: * When P32ODR = 1, the pin becomes an NMOS open-drain output. P31/TxD1 The pin function is switched as shown below according to the combination of bit TE in the SCI1 SCR, and bit P31DDR. TE P31DDR Pin function 0 1 0 1 -- P31 input pin P31 output pin* TxD1 output pin Note: * When P31ODR = 1, the pin becomes an NMOS open-drain output. P30/TxD0 The pin function is switched as shown below according to the combination of bit TE in the SCI0 SCR, and bit P30DDR. TE P30DDR Pin function 0 1 0 1 -- P30 input pin P30 output pin* TxD0 output pin Note: * When P30ODR = 1, the pin becomes an NMOS open-drain output. Rev. 4.0, 03/03, page 366 of 1358 9.5 Port 4 9.5.1 Overview Port 4 is an 8-bit input-only port. Port 4 pins also function as A/D converter analog input pins (AN0 to AN7) and D/A converter analog output pins (DA0 and DA1). Port 4 pin functions are the same in all operating modes. Figure 9-4 shows the port 4 pin configuration. Port 4 pins P47 (input) / AN7 (input) / DA1 (output) P46 (input) / AN6 (input) / DA0 (output) P45 (input) / AN5 (input) Port 4 P44 (input) / AN4 (input) P43 (input) / AN3 (input) P42 (input) / AN2 (input) P41 (input) / AN1 (input) P40 (input) / AN0 (input) Figure 9-4 Port 4 Pin Functions Rev. 4.0, 03/03, page 367 of 1358 9.5.2 Register Configuration Table 9-8 shows the port 4 register configuration. Port 4 is an input-only port, and does not have a data direction register or data register. Table 9-8 Port 4 Register Name Abbreviation R/W Initial Value Address* Port 4 register PORT4 R Undefined H'FF53 Note: * Lower 16 bits of the address. Port 4 Register (PORT4): The pin states are always read when a port 4 read is performed. Bit : Initial value : R/W : 7 6 5 4 3 2 1 0 P47 --* P46 --* P45 --* P44 --* P43 --* P42 --* P41 --* P40 --* R R R R R R R R Note: * Determined by state of pins P47 to P40. 9.5.3 Pin Functions Port 4 pins also function as A/D converter analog input pins (AN0 to AN7) and D/A converter analog output pins (DA0 and DA1). Rev. 4.0, 03/03, page 368 of 1358 9.6 Port 5 9.6.1 Overview Port 5 is a 4-bit I/O port. Port 5 pins also function as SCI I/O pins (TxD2, RxD2, and SCK2), the A/D converter input pin (ADTRG), interrupt input pins (IRQ4 to IRQ7), and bus control signal I/O pins (WAIT and BREQO). The pin functions can be switched by means of settings in PFCR2 and SYSCR. IRQ4 to IRQ7 only are Schmitt-triggered inputs. Figure 9-5 shows the port 5 pin configuration. Port 5 pins P53 (I/O) / ADTRG (input) / IRQ7 (input) / WAIT (input) / BREQO (output) Port 5 P52 (I/O) / SCK2 (I/O) / IRQ6 (input) P51 (I/O) / RxD2 (input) / IRQ5 (input) P50 (I/O) / TxD2 (output) /IRQ4 (input) Pin functions in modes 4 to 6 P53 (I/O) / ADTRG (input) / IRQ7 (input) / WAIT (input) / BREQO (output) P52 (I/O) / SCK2 (I/O) / IRQ6 (input) P51 (I/O) / RxD2 (input) / IRQ5 (input) P50 (I/O) / TxD2 (output) / IRQ4 (input) Pin functions in mode 7 P53 (I/O) / ADTRG (input) / IRQ7 (input) P52 (I/O) / SCK2 (I/O) / IRQ6 (input) P51 (I/O) / RxD2 (input) / IRQ5 (input) P50 (I/O) / TxD2 (output) / IRQ4 (input) Figure 9-5 Port 5 Pin Functions Rev. 4.0, 03/03, page 369 of 1358 9.6.2 Register Configuration Table 9-9 shows the port 5 register configuration. Table 9-9 Port 5 Registers 1 Address* Name Abbreviation R/W Initial Value Port 5 data direction register P5DDR W H'FEB4 Port 5 data register P5DR R/W H'0* 2 H'0* Port 5 register PORT5 R Undefined H'FF54 2 H'FF64 Port function control register 2 PFCR2 R/W H'30 H'FFAC System control register SYSCR R/W H'01 H'FF39 Notes: *1 Lower 16 bits of the address. *2 Value of bits 3 to 0. Port 5 Data Direction Register (P5DDR) Bit : 7 6 5 4 -- -- -- -- 3 2 1 0 P53DDR P52DDR P51DDR P50DDR Initial value : Undefined Undefined Undefined Undefined 0 0 0 0 R/W W W W W : -- -- -- -- P5DDR is an 8-bit write-only register, the individual bits of which specify input or output for the pins of port 5. Bits 7 to 4 are reserved. P5DDR cannot be read; if it is, an undefined value will be read. Setting a P5DDR bit to 1 makes the corresponding port 5 pin an output pin, while clearing the bit to 0 makes the pin an input pin. P5DDR is initialized to H'0 (bits 3 to 0) by a reset, and in hardware standby mode. It retains its prior state in software standby mode. As the SCI is initialized, the pin states are determined by the P5DDR and P5DR specifications. Rev. 4.0, 03/03, page 370 of 1358 Port 5 Data Register (P5DR) Bit : 7 6 5 4 3 2 1 0 -- -- -- -- P53DR P52DR P51DR P50DR 0 0 0 0 R/W R/W R/W R/W Initial value : Undefined Undefined Undefined Undefined R/W : -- -- -- -- P5DR is an 8-bit readable/writable register that stores output data for the port 5 pins (P53 to P50). Bits 7 to 4 are reserved; they return an undefined value if read, and cannot be modified. P5DR is initialized to H'0 (bits 3 to 0) by a reset, and in hardware standby mode. It retains its prior state in software standby mode. Port 5 Register (PORT5) Bit : 7 6 5 4 3 2 1 0 -- -- -- -- P53 --* P52 --* P51 --* P50 --* R R R R Initial value : Undefined Undefined Undefined Undefined R/W : -- -- -- -- Note: * Determined by state of pins P53 to P50. PORT5 is an 8-bit read-only register that shows the pin states. It cannot be written to. Writing of output data for the port 5 pins (P53 to P50) must always be performed on P5DR. Bits 7 to 4 are reserved; they return an undefined value if read, and cannot be modified. If a port 5 read is performed while P5DDR bits are set to 1, the P5DR values are read. If a port 5 read is performed while P5DDR bits are cleared to 0, the pin states are read. After a reset and in hardware standby mode, PORT5 contents are determined by the pin states, as P5DDR and P5DR are initialized. PORT5 retains its prior state in software standby mode. Rev. 4.0, 03/03, page 371 of 1358 Port Function Control Register 2 (PFCR2) Bit : 7 6 5 WAITPS BREQOPS CS167E Initial value : R/W : 4 3 2 1 0 CS25E ASOD -- -- -- 0 0 1 1 0 0 0 0 R/W R/W R/W R/W R/W R R R PFCR2 is an 8-bit readable/writable register that performs I/O port control. PFCR2 is initialized to H'30 by a reset, and in hardware standby mode. Bit 7--WAIT Pin Select (WAITPS): Selects the WAIT input pin. Set the WAITPS bit before setting the DDR bit clear to 0 and the WAITE bit in BCRL to 1. Bit 7 WAITPS Description 0 WAIT input is PF2 pin 1 WAIT input is P53 pin (Initial value) Bit 6--BREQO Pin Select (BREQOPS): Selects the BREQO output pin. Set the BREQOPS bit before setting the BREQOE bit in BCRL to 1. Bit 6 BREQOPS Description 0 BREQO output is PF2 pin 1 BREQO output is P53 pin (Initial value) Bit 5--CS167 Enable (CS167E): Enables or disables CS1, CS6, and CS7 output. For details, see section 9.7, Port 6 and section 9.14, Port G. Bit 4--CS25 Enable (CS25E): Enables or disables CS2, CS3, CS4, and CS5 output. For details, see section 9.7, Port 6 and section 9.14, Port G. Bit 3--AS Output Disable (ASOD): Enables or disables AS output. For details, see section 9.13, Port F. Rev. 4.0, 03/03, page 372 of 1358 System Control Register (SYSCR) Bit : Initial value : R/W : 7 6 5 4 3 2 1 0 -- -- INTM1 INTM0 NMIEG 0 0 0 0 0 0 0 1 R/W -- R/W R/W R/W R/W R/W R/W LWROD IRQPAS RAME SYSCR is an 8-bit readable/writable register that selects the interrupt control mode, controls the LWR pin, switches the IRQ4 to IRQ7 input pins, and selects the detected edge for NMI. SYSCR is initialized to H'01 by a reset, and in hardware standby mode. It is not initialized in software standby mode. Bits 5 and 4--Interrupt Control Mode 1 and 0 (INTM1, INTM0): These bits select either of two interrupt control modes for the interrupt controller. For details, see section 5, Interrupt Controller. Bit 3--NMI Edge Select (NMIEG): Selects the input edge for the NMI pin. For details, see section 5, Interrupt Controller. Bit 2--LWR Output Disable (LWROD): Enables or disables LWR output. For details, see section 9.13, Port F. Bit 1--IRQ Port Switching Select (IRQPAS): Selects switching of input pins for IRQ4 to IRQ7. IRQ4 to IRQ7 input is always performed from one of the ports. Bit 1 IRQPAS Description 0 PA4 to PA7 used for IRQ4 to IRQ7 input 1 P50 to P53 used for IRQ4 to IRQ7 input (Initial value) Bit 0--RAM Enable (RAME): Enables or disables on-chip RAM. For details, see section 18, RAM. Rev. 4.0, 03/03, page 373 of 1358 9.6.3 Pin Functions Port 5 pins also function as SCI I/O pins (TxD2, RxD2, and SCK2), the A/D converter input pin (ADTRG), interrupt input pins (IRQ4 to IRQ7), and bus control signal I/O pins (WAIT and BREQO). Port 5 pin functions are shown in table 9-10. Table 9-10 Port 5 Pin Functions Pin Selection Method and Pin Functions P53/ADTRG/ IRQ7/WAIT/ BREQO The pin function is switched as shown below according to the combination of the operating mode, bits TRGS1 and TRGS0 in the A/D control register (ADCR), and bits IRQPAS, WAITE, WAITPS, BREQOE, BREQOPS, and P53DDR. Operating mode Modes 4 to 6 [BREQOE * BREQOPS] [WAITE * WAITPS] P53DDR Pin function Mode 7 0 1 0 1 0 1 0 P53 input pin P53 output pin WAIT input pin 1 -- 0 1 -- -- Setting BREQO Setting prooutput prohibited pin hibited -- 0 1 P53 input pin P53 output pin ADTRG input pin*1 IRQ7 interrupt input pin*2 Notes: *1 ADTRG input when TRGS0 = TRGS1 = 1. *2 IRQ7 input when IRQPAS = 1. P52/SCK2/IRQ6 The pin function is switched as shown below according to the combination of bit C/A in the SCI2 SMR, bits CKE0 and CKE1 in SCR, and bits IRQPAS and P52DDR. CKE1 0 C/A 0 CKE0 P52DDR Pin function 0 1 -- 1 -- -- -- -- 0 1 -- P52 input pin P52 output pin SCK2 output pin SCK2 output pin IRQ6 interrupt input pin* Note: * IRQ6 input when IRQPAS = 1. Rev. 4.0, 03/03, page 374 of 1358 1 SCK2 input pin Pin Selection Method and Pin Functions P51/RxD2/IRQ5 The pin function is switched as shown below according to the combination of bit RE in the SCI2 SCR, and bits IRQPAS and P51DDR. RE P51DDR Pin function 0 1 0 1 -- P51 input pin P51 output pin RxD2 input pin IRQ5 interrupt input pin* Note: * IRQ5 input when IRQPAS = 1. P50/TxD2/IRQ4 The pin function is switched as shown below according to the combination of bit TE in the SCI2 SCR, and bits IRQPAS and P50DDR. TE P50DDR Pin function 0 1 0 1 -- P50 input pin P50 output pin TxD2 output pin IRQ4 interrupt input pin* Note: * IRQ4 input when IRQPAS = 1. Rev. 4.0, 03/03, page 375 of 1358 9.7 Port 6 9.7.1 Overview Port 6 is an 8-bit I/O port. Port 6 pins also function as interrupt input pins (IRQ0 to IRQ3), DMAC* I/O pins (DREQ0, TEND0, DREQ1, and TEND1), and bus control output pins (CS4 to CS7). The functions of pins P65 to P62 are the same in all operating modes, while the functions of pins P67, P66, P61, and P60 change according to the operating mode. Switching of CS4 to CS7 output can be performed by setting PFCR2. Pins P67 to P64 are Schmitt-triggered inputs. Figure 9-6 shows the port 6 pin configuration. Note: * The DMAC is not supported in the H8S/2321. Port 6 Port 6 pins Pin functions in modes 4 to 6 P67 / IRQ3 / CS7 P67 (I/O) / IRQ3 (input) / CS7 (output) P66 / IRQ2 / CS6 P66 (I/O) / IRQ2 (input) / CS6 (output) P65 / IRQ1 P65 (I/O) / IRQ1 (input) P64 / IRQ0 P64 (I/O) / IRQ0 (input) P63 / TEND1 P63 (I/O) / TEND1* (output) P62 / DREQ1 P62 (I/O) / DREQ1* (input) P61 / TEND0 / CS5 P61 (I/O) / TEND0* (output) / CS5 (output) P60 / DREQ0 / CS4 P60 (I/O) / DREQ0* (input) / CS4 (output) Pin functions in mode 7 P67 (I/O) / IRQ3 (input) P66 (I/O) / IRQ2 (input) P65 (I/O) / IRQ1 (input) P64 (I/O) / IRQ0 (input) P63 (I/O) / TEND1* (output) P62 (I/O) / DREQ1* (input) P61 (I/O) / TEND0* (output) P60 (I/O) / DREQ0* (input) Note: * The TEND1, DREQ1, TEND0, and DREQ0 pin functions are not supported in the H8S/2321. Figure 9-6 Port 6 Pin Functions Rev. 4.0, 03/03, page 376 of 1358 9.7.2 Register Configuration Table 9-11 shows the port 6 register configuration. Table 9-11 Port 6 Registers Name Abbreviation R/W Initial Value Address* Port 6 data direction register P6DDR W H'00 H'FEB5 Port 6 data register P6DR R/W H'00 H'FF65 Port 6 register PORT6 R Undefined H'FF55 Port function control register 2 PFCR2 R/W H'30 H'FFAC Note: * Lower 16 bits of the address. Port 6 Data Direction Register (P6DDR) Bit : 7 6 5 4 3 2 1 0 P67DDR P66DDR P65DDR P64DDR P63DDR P62DDR P61DDR P60DDR Initial value : 0 0 0 0 0 0 0 0 R/W W W W W W W W W : P6DDR is an 8-bit write-only register, the individual bits of which specify input or output for the pins of port 6. P6DDR cannot be read; if it is, an undefined value will be read. Setting a P6DDR bit to 1 makes the corresponding port 6 pin an output pin, while clearing the bit to 0 makes the pin an input pin. P6DDR is initialized to H'00 by a reset, and in hardware standby mode. It retains its prior state in software standby mode. Rev. 4.0, 03/03, page 377 of 1358 Port 6 Data Register (P6DR) Bit : Initial value : R/W : 7 6 5 4 3 2 1 0 P67DR P66DR P65DR P64DR P63DR P62DR P61DR P60DR 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W P6DR is an 8-bit readable/writable register that stores output data for the port 6 pins (P67 to P60). P6DR is initialized to H'00 by a reset, and in hardware standby mode. It retains its prior state in software standby mode. Port 6 Register (PORT6) Bit : Initial value : R/W : 7 6 5 4 3 2 1 0 P67 --* P66 --* P65 --* P64 --* P63 --* P62 --* P61 --* P60 --* R R R R R R R R Note: * Determined by state of pins P67 to P60. PORT6 is an 8-bit read-only register that shows the pin states. It cannot be written to. Writing of output data for the port 6 pins (P67 to P60) must always be performed on P6DR. If a port 6 read is performed while P6DDR bits are set to 1, the P6DR values are read. If a port 6 read is performed while P6DDR bits are cleared to 0, the pin states are read. After a reset and in hardware standby mode, PORT6 contents are determined by the pin states, as P6DDR and P6DR are initialized. PORT6 retains its prior state in software standby mode. Rev. 4.0, 03/03, page 378 of 1358 Port Function Control Register 2 (PFCR2) Bit : 7 6 5 WAITPS BREQOPS CS167E Initial value : R/W : 4 3 2 1 0 CS25E ASOD -- -- -- 0 0 1 1 0 0 0 0 R/W R/W R/W R/W R/W R R R PFCR2 is an 8-bit readable/writable register that performs I/O port control. PFCR2 is initialized to H'30 by a reset, and in hardware standby mode. Bit 7--WAIT Pin Select (WAITPS): Selects the WAIT input pin. For details, see section 9.6, Port 5. Bit 6--BREQO Pin Select (BREQOPS): Selects the BREQO output pin. For details, see section 9.6, Port 5. Bit 5--CS167 Enable (CS167E): Enables or disables CS1, CS6, and CS7 output. Clear the DDR bits to 0 before changing the CS167E bit setting. Bit 5 CS167E Description 0 CS1, CS6, and CS7 output disabled (can be used as I/O ports) 1 CS1, CS6, and CS7 output enabled (Initial value) Bit 4--CS25 Enable (CS25E): Enables or disables CS2, CS3, CS4, and CS5 output. Clear the DDR bits to 0 before changing the CS25E bit setting. Bit 4 CS25E Description 0 CS2, CS3, CS4, and CS5 output disabled (can be used as I/O ports) 1 CS2, CS3, CS4, and CS5 output enabled (Initial value) Bit 3--As Output Disable (ASOD): Enables or disables AS output. For details, see section 9.13, Port F. Bits 2 to 0--Reserved: These bits are always read as 0. Rev. 4.0, 03/03, page 379 of 1358 9.7.3 Pin Functions Port 6 pins also function as interrupt input pins (IRQ0 to IRQ3), DMAC I/O pins (DREQ0, TEND0, DREQ1, and TEND1)*, and bus control output pins (CS4 to CS7). Port 6 pin functions are shown in table 9-12. Table 9-12 Port 6 Pin Functions Pin Selection Method and Pin Functions P67/IRQ3/CS7 The pin function is switched as shown below according to the combination of bits P67DDR and CS167E. Mode Modes 4 to 6 P67DDR 0 CS167E -- Pin function Mode 7 1 0 P67 input pin 1 P67 output CS7 output pin pin 0 1 -- -- P67 input pin P67 output pin IRQ3 interrupt input pin P66/IRQ2/CS6 The pin function is switched as shown below according to the combination of bits P66DDR and CS167E. Mode Modes 4 to 6 P66DDR 0 CS167E -- Pin function Mode 7 1 0 P66 input pin 1 P66 output CS6 output pin pin 0 1 -- -- P66 input pin P66 output pin IRQ2 interrupt input pin P65/IRQ1 The pin function is switched as shown below according to bit P65DDR. P65DDR Pin function 0 1 P65 input pin P65 output pin IRQ1 interrupt input pin P64/IRQ0 The pin function is switched as shown below according to bit P64DDR. P64DDR Pin function 0 1 P64 input pin P64 output pin IRQ0 interrupt input pin Rev. 4.0, 03/03, page 380 of 1358 Pin Selection Method and Pin Functions P63/TEND1* The pin function is switched as shown below according to the combination of bit TEE1* in the DMAC DMATCR, and bit P63DDR. TEE1* 0 1 P63DDR Pin function P62/DREQ1* 0 1 -- P63 input pin P63 output pin TEND1 output* The pin function is switched as shown below according to bit P62DDR. P62DDR 0 Pin function 1 P62 input pin P62 output pin DREQ1 input* P61/TEND0*/CS5 The pin function is switched as shown below according to the combination of bit TEE0* in the DMAC DMATCR, and bits P61DDR and CS25E. Mode Modes 4 to 6 TEE0* P60/DREQ0*/CS4 0 P61DDR 0 CS25E -- 0 P61 input pin P61 output pin Pin function Mode 7 1 1 1 0 1 -- 0 1 -- -- -- -- -- CS5 TEND0 output output* pin P61 TEND0 output output* pin P61 input pin The pin function is switched as shown below according to the combination of bits P60DDR and CS25E. Mode P60DDR CS25E Pin function Modes 4 to 6 0 -- P60 input pin Mode 7 1 0 0 1 P60 output CS4 output pin pin 1 -- -- P60 input pin P60 output pin DREQ0 input* Note: * The DMAC and the TEND1, DREQ1, TEND0, and DREQ0 pin functions are not supported in the H8S/2321. Rev. 4.0, 03/03, page 381 of 1358 9.8 Port A 9.8.1 Overview Port A is an 8-bit I/O port. Port A pins also function as address bus outputs and interrupt input pins (IRQ4 to IRQ7). The pin functions change according to the operating mode. IRQ4 to IRQ7 input can be switched to P50 to P53 by setting the IRQPAS bit in SYSCR to 1. The address output or port output function can be selected by means of bits A23E to A20E in PFCR1. Port A has a built-in MOS input pull-up function that can be controlled by software. Pins PA7 to PA4 are Schmitt-triggered inputs. Figure 9-7 shows the port A pin configuration. Port A Port A pins Pin functions in modes 4 and 5 PA7 / A23 / IRQ7 PA7 (I/O) / A23 (output) / IRQ7 (input) PA6 / A22 / IRQ6 PA6 (I/O) / A22 (output) / IRQ6 (input) PA5 / A21 / IRQ5 PA5 (I/O) / A21 (output) / IRQ5 (input) PA4 / A20 / IRQ4 PA4 (output) / A20 (output) PA3 / A19 A19 (output) PA2 / A18 A18 (output) PA1 / A17 A17 (output) PA0 / A16 A16 (output) Pin functions in mode 6 Pin functions in mode 7 PA7 (I/O) / A23 (output) / IRQ7 (input) PA7 (I/O) / IRQ7 (input) PA6 (I/O) / A22 (output) / IRQ6 (input) PA6 (I/O) / IRQ6 (input) PA5 (I/O) / A21 (output) / IRQ5 (input) PA5 (I/O) / IRQ5 (input) PA4 (I/O) / A20 (output) / IRQ4 (input) PA4 (I/O) / IRQ4 (input) PA3 (input) / A19 (output) PA3 (I/O) PA2 (input) / A18 (output) PA2 (I/O) PA1 (input) / A17 (output) PA1 (I/O) PA0 (input) / A16 (output) PA0 (I/O) Figure 9-7 Port A Pin Functions Rev. 4.0, 03/03, page 382 of 1358 9.8.2 Register Configuration Table 9-13 shows the port A register configuration. Table 9-13 Port A Registers Name Abbreviation R/W Initial Value Address* Port A data direction register PADDR W H'00 H'FEB9 Port A data register PADR R/W H'00 H'FF69 Port A register PORTA R Undefined H'FF59 Port A MOS pull-up control register PAPCR R/W H'00 H'FF70 Port A open drain control register PAODR R/W H'00 H'FF77 Port function control register 1 PFCR1 R/W H'0F H'FF45 System control register SYSCR R/W H'01 H'FF39 Note: * Lower 16 bits of the address. Port A Data Direction Register (PADDR) Bit : 7 6 5 4 3 2 1 0 PA7DDR PA6DDR PA5DDR PA4DDR PA3DDR PA2DDR PA1DDR PA0DDR Initial value : 0 0 0 0 0 0 0 0 R/W W W W W W W W W : PADDR is an 8-bit write-only register, the individual bits of which specify input or output for the pins of port A. PADDR cannot be read; if it is, an undefined value will be read. PADDR is initialized to H'00 by a reset, and in hardware standby mode. It retains its prior state in software standby mode. The OPE bit in SBYCR is used to select whether the address output pins retain their output state or become high-impedance when a transition is made to software standby mode. Rev. 4.0, 03/03, page 383 of 1358 Port A Data Register (PADR) Bit : Initial value : R/W : 7 6 5 4 3 2 1 0 PA7DR PA6DR PA5DR PA4DR PA3DR PA2DR PA1DR PA0DR 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W PADR is an 8-bit readable/writable register that stores output data for the port A pins (PA7 to PA0). PADR is initialized to H'00 by a reset, and in hardware standby mode. It retains its prior state in software standby mode. Port A Register (PORTA) Bit : Initial value : R/W : 7 6 5 4 3 2 1 0 PA7 --* PA6 --* PA5 --* PA4 --* PA3 --* PA2 --* PA1 --* PA0 --* R R R R R R R R Note: * Determined by state of pins PA7 to PA0. PORTA is an 8-bit read-only register that shows the pin states. It cannot be written to. Writing of output data for the port A pins (PA7 to PA0) must always be performed on PADR. If a port A read is performed while PADDR bits are set to 1, the PADR values are read. If a port A read is performed while PADDR bits are cleared to 0, the pin states are read. After a reset and in hardware standby mode, PORTA contents are determined by the pin states, as PADDR and PADR are initialized. PORTA retains its prior state in software standby mode. Rev. 4.0, 03/03, page 384 of 1358 Port A MOS Pull-Up Control Register (PAPCR) Bit : 7 6 5 4 3 2 1 0 PA7PCR PA6PCR PA5PCR PA4PCR PA3PCR PA2PCR PA1PCR PA0PCR Initial value : R/W : 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W PAPCR is an 8-bit readable/writable register that controls the MOS input pull-up function incorporated into port A on an individual bit basis. All the bits are valid in modes 6 and 7, and bits 7 to 5 are valid in modes 4 and 5. When a PADDR bit is cleared to 0 (input port setting), setting the corresponding PAPCR bit to 1 turns on the MOS input pull-up for the corresponding pin. PAPCR is initialized to H'00 by a reset, and in hardware standby mode. It retains its prior state in software standby mode. Port A Open Drain Control Register (PAODR) Bit : 7 6 5 4 3 2 1 0 PA7ODR PA6ODR PA5ODR PA4ODR PA3ODR PA2ODR PA1ODR PA0ODR Initial value : R/W : 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W PAODR is an 8-bit readable/writable register that controls whether PMOS is on or off for each port A pin (PA7 to PA0). PAODR is valid only in mode 7. Do not set PAODR bits to 1 in modes 4 to 6. Setting a PAODR bit to 1 makes the corresponding port A pin an NMOS open-drain output, while clearing the bit to 0 makes the pin a CMOS output. PAODR is initialized to H'00 by a reset, and in hardware standby mode. It retains its prior state in software standby mode. Rev. 4.0, 03/03, page 385 of 1358 Port Function Control Register 1 (PFCR1) Bit : Initial value : R/W : 7 6 5 4 3 2 1 0 -- -- -- -- A23E A22E A21E A20E 0 0 0 0 1 1 1 1 R/W R/W R/W R/W R/W R/W R/W R/W PFCR1 is an 8-bit readable/writable register that performs I/O port control. PFCR1 is initialized to H'0F by a reset, and in hardware standby mode. Bits 7 to 4--Reserved: Only 0 should be written to these bits. Bit 3--Address 23 Enable (A23E): Enables or disables address output 23 (A23). This bit is valid in modes 4 to 6. Bit 3 A23E Description 0 DR is output when PA7DDR = 1 1 A23 is output when PA7DDR = 1 (Initial value) Bit 2--Address 22 Enable (A22E): Enables or disables address output 22 (A22). This bit is valid in modes 4 to 6. Bit 2 A22E Description 0 DR is output when PA6DDR = 1 1 A22 is output when PA6DDR = 1 (Initial value) Bit 1--Address 21 Enable (A21E): Enables or disables address output 21 (A21). This bit is valid in modes 4 to 6. Bit 1 A21E Description 0 DR is output when PA5DDR = 1 1 A21 is output when PA5DDR = 1 Rev. 4.0, 03/03, page 386 of 1358 (Initial value) Bit 0--Address 20 Enable (A20E): Enables or disables address output 20 (A20). This bit is valid in modes 4 to 6. Bit 0 A20E Description 0 DR is output when PA4DDR = 1 1 A20 is output when PA4DDR = 1 (Initial value) System Control Register (SYSCR) Bit : 7 6 5 4 3 -- -- INTM1 INTM0 NMIEG 0 0 0 0 0 0 0 1 R/W -- R/W R/W R/W R/W R/W R/W Initial value : R/W : 2 1 0 LWROD IRQPAS RAME Bit 7--Reserved: Only 0 should be written to this bit. Bit 6--Reserved: This bit is always read as 0, and cannot be modified. Bits 5 and 4--Interrupt Control Mode 1 and 0 (INTM1, INTM0): These bits select either of two interrupt control modes for the interrupt controller. For details of the interrupt control modes, see section 5.4.1, Interrupt Control Modes and Interrupt Operation. Bit 5 INTM1 Bit 4 INTM0 Interrupt Control Mode Description 0 0 0 Interrupt control by I bit 1 -- Setting prohibited 0 2 Interrupt control by bits I2 to I0 1 -- Setting prohibited 1 (Initial value) Bit 3--NMI Edge Select (NMIEG): Selects the input edge for the NMI pin. Bit 3 NMIEG Description 0 Interrupt requested at falling edge of NMI input 1 Interrupt requested at rising edge of NMI input (Initial value) Rev. 4.0, 03/03, page 387 of 1358 Bit 2--LWR Output Disable (LWROD): Enables or disables LWR output. Bit 2 LWROD Description 0 PF3 is designated as LWR output pin 1 PF3 is designated as I/O port, and does not function as LWR output pin (Initial value) Bit 1--IRQ Port Switching Select (IRQPAS): Selects switching of input pins for IRQ4 to IRQ7. IRQ4 to IRQ7 input is always performed from one of the ports. Bit 1 IRQPAS Description 0 PA4 to PA7 used for IRQ4 to IRQ7 input 1 P50 to P53 used for IRQ4 to IRQ7 input (Initial value) Bit 0--RAM Enable (RAME): Enables or disables on-chip RAM. The RAME bit is initialized when the reset state is released. It is not initialized in software standby mode. Bit 0 RAME Description 0 On-chip RAM disabled 1 On-chip RAM enabled 9.8.3 (Initial value) Pin Functions Port A pins function as address outputs, interrupt input pins (IRQ4 to IRQ7), and I/O ports. Port A pin functions are shown in table 9-14. Rev. 4.0, 03/03, page 388 of 1358 Table 9-14 Port A Pin Functions Pin Selection Method and Pin Functions PA7/A23/IRQ7 The pin function is switched as shown below according to the combination of the operating mode and bits A23E and PA7DDR. Operating mode Modes 4 to 6 A23E PA7DDR Pin function 0 0 Mode 7 1 1 0 -- 1 0 1 PA7 PA7 A23 PA7 PA7 input pin output pin input pin output pin input pin PA7 output 2 pin* IRQ7 interrupt input pin* 1 Notes: *1 IRQ7 input when IRQPAS = 0. *2 NMOS open-drain output when PA7ODR = 1. PA6/A22/IRQ6 The pin function is switched as shown below according to the combination of the operating mode and bits A22E and PA6DDR. Operating mode Modes 4 to 6 A22E PA6DDR Pin function 0 0 Mode 7 1 1 0 -- 1 0 1 PA6 PA6 A22 PA6 PA6 input pin output pin input pin output pin input pin PA6 output 2 pin* IRQ6 interrupt input pin* 1 Notes: *1 IRQ6 input when IRQPAS = 0. *2 NMOS open-drain output when PA6ODR = 1. PA5/A21/IRQ5 The pin function is switched as shown below according to the combination of the operating mode and bits A21E and PA5DDR. Operating mode Modes 4 to 6 A21E PA5DDR Pin function 0 0 Mode 7 1 1 0 -- 1 0 PA5 PA5 A21 PA5 PA5 input pin output pin input pin output pin input pin 1 PA5 output 2 pin* IRQ5 interrupt input pin* 1 Notes: *1 IRQ5 input when IRQPAS = 0. *2 NMOS open-drain output when PA5ODR = 1. Rev. 4.0, 03/03, page 389 of 1358 Pin Selection Method and Pin Functions PA4/A20/IRQ4 The pin function is switched as shown below according to the combination of the operating mode and bits A20E and PA4DDR. Operating mode Modes 4 and 5 A20E PA4DDR 0 0 Mode 6 1 1 Mode 7 0 -- 0 1 1 -- 0 1 0 1 Pin function Setting PA4 A20 PA4 PA4 PA4 A20 PA4 PA4 pro- output output input output input output input output 2 pin pin pin pin pin pin pin* hibited pin 1 IRQ4 interrupt input pin* Notes: *1 IRQ4 input when IRQPAS = 0. Note that in this state in modes 4 and 5, although the pin designation is output-only, IRQ4 input is also performed. *2 NMOS open-drain output when PA4ODR = 1. PA3/A19 PA2/A18 PA1/A17 PA0/A16 The pin function is switched as shown below according to the combination of the operating mode and bit PAnDDR. Operating mode 1 PAnDDR* Modes 4 and 5 -- Pin function Am output 1 pin* Mode 6 Mode 7 0 1 0 1 PAn 1 input pin* Am output 1 pin* PAn 1 input pin* PAn output 1 2 pin* * Notes: *1 n = 0 to 3, m = 16 to 19 *2 PAn output is NMOS open-drain output when PAnODR = 1. Rev. 4.0, 03/03, page 390 of 1358 9.8.4 MOS Input Pull-Up Function Port A has a built-in MOS input pull-up function that can be controlled by software. This MOS input pull-up function can be used by pins PA7 to PA5 in modes 4 and 5, and by all pins in modes 6 and 7. MOS input pull-up can be specified as on or off on an individual bit basis. When a PADDR bit is cleared to 0, setting the corresponding PAPCR bit to 1 turns on the MOS input pull-up for that pin. The MOS input pull-up function is in the off state after a reset, and in hardware standby mode. The prior state is retained in software standby mode. Table 9-15 summarizes the MOS input pull-up states. Table 9-15 MOS Input Pull-Up States (Port A) Modes Reset Hardware Standby Mode Software Standby Mode In Other Operations Off Off On/off On/off 6, 7 PA7 to PA0 4, 5 PA7 to PA5 On/off On/off PA4 to PA0 Off Off Legend Off: MOS input pull-up is always off. On/off: On when PADDR = 0 and PAPCR = 1; otherwise off. Rev. 4.0, 03/03, page 391 of 1358 9.9 Port B 9.9.1 Overview Port B is an 8-bit I/O port. Port B has an address bus output function, and the pin functions change according to the operating mode. Port B has a built-in MOS input pull-up function that can be controlled by software. Figure 9-8 shows the port B pin configuration. Port B Port B pins Pin functions in modes 4 and 5 PB7 / A15 A15 (output) PB6 / A14 A14 (output) PB5 / A13 A13 (output) PB4 / A12 A12 (output) PB3 / A11 A11 (output) PB2 / A10 A10 (output) PB1 / A9 A9 (output) PB0 / A8 A8 (output) Pin functions in mode 6 Pin functions in mode 7 PB7 (input) / A15 (output) PB7 (I/O) PB6 (input) / A14 (output) PB6 (I/O) PB5 (input) / A13 (output) PB5 (I/O) PB4 (input) / A12 (output) PB4 (I/O) PB3 (input) / A11 (output) PB3 (I/O) PB2 (input) / A10 (output) PB2 (I/O) PB1 (input) / A9 (output) PB1 (I/O) PB0 (input) / A8 (output) PB0 (I/O) Figure 9-8 Port B Pin Functions Rev. 4.0, 03/03, page 392 of 1358 9.9.2 Register Configuration Table 9-16 shows the port B register configuration. Table 9-16 Port B Registers Name Abbreviation R/W Initial Value Address* Port B data direction register PBDDR W H'00 H'FEBA Port B data register PBDR R/W H'00 H'FF6A Port B register PORTB R Undefined H'FF5A Port B MOS pull-up control register PBPCR R/W H'00 H'FF71 Note: * Lower 16 bits of the address. Port B Data Direction Register (PBDDR) Bit : 7 6 5 4 3 2 1 0 PB7DDR PB6DDR PB5DDR PB4DDR PB3DDR PB2DDR PB1DDR PB0DDR Initial value : 0 0 0 0 0 0 0 0 R/W W W W W W W W W : PBDDR is an 8-bit write-only register, the individual bits of which specify input or output for the pins of port B. PBDDR cannot be read; if it is, an undefined value will be read. PBDDR is initialized to H'00 by a reset, and in hardware standby mode. It retains its prior state in software standby mode. The OPE bit in SBYCR is used to select whether the address output pins retain their output state or become high-impedance when a transition is made to software standby mode. * Modes 4 and 5 The corresponding port B pins are address outputs irrespective of the value of the PBDDR bits. * Mode 6 Setting a PBDDR bit to 1 makes the corresponding port B pin an address output, while clearing the bit to 0 makes the pin an input port. * Mode 7 Setting a PBDDR bit to 1 makes the corresponding port B pin an output port, while clearing the bit to 0 makes the pin an input port. Rev. 4.0, 03/03, page 393 of 1358 Port B Data Register (PBDR) Bit : Initial value : R/W : 7 6 5 4 3 2 1 0 PB7DR PB6DR PB5DR PB4DR PB3DR PB2DR PB1DR PB0DR 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W PBDR is an 8-bit readable/writable register that stores output data for the port B pins (PB7 to PB0). PBDR is initialized to H'00 by a reset, and in hardware standby mode. It retains its prior state in software standby mode. Port B Register (PORTB) Bit : Initial value : R/W : 7 6 5 4 3 2 1 0 PB7 --* PB6 --* PB5 --* PB4 --* PB3 --* PB2 --* PB1 --* PB0 --* R R R R R R R R Note: * Determined by state of pins PB7 to PB0. PORTB is an 8-bit read-only register that shows the pin states. It cannot be written to. Writing of output data for the port B pins (PB7 to PB0) must always be performed on PBDR. If a port B read is performed while PBDDR bits are set to 1, the PBDR values are read. If a port B read is performed while PBDDR bits are cleared to 0, the pin states are read. After a reset and in hardware standby mode, PORTB contents are determined by the pin states, as PBDDR and PBDR are initialized. PORTB retains its prior state in software standby mode. Rev. 4.0, 03/03, page 394 of 1358 Port B MOS Pull-Up Control Register (PBPCR) Bit : 7 6 5 4 3 2 1 0 PB7PCR PB6PCR PB5PCR PB4PCR PB3PCR PB2PCR PB1PCR PB0PCR Initial value : R/W : 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W PBPCR is an 8-bit readable/writable register that controls the MOS input pull-up function incorporated into port B on an individual bit basis. When a PBDDR bit is cleared to 0 (input port setting) in mode 6 or 7, setting the corresponding PBPCR bit to 1 turns on the MOS input pull-up for the corresponding pin. PBPCR is initialized to H'00 by a reset, and in hardware standby mode. It retains its prior state in software standby mode. 9.9.3 Pin Functions Modes 4 and 5: In modes 4 and 5, port B pins are automatically designated as address outputs. Port B pin functions in modes 4 and 5 are shown in figure 9-9. A15 (output) A14 (output) A13 (output) Port B A12 (output) A11 (output) A10 (output) A9 (output) A8 (output) Figure 9-9 Port B Pin Functions (Modes 4 and 5) Rev. 4.0, 03/03, page 395 of 1358 Mode 6: In mode 6, port B pins function as address outputs or input ports. Input or output can be specified on an individual bit basis. Setting a PBDDR bit to 1 makes the corresponding port B pin an address output, while clearing the bit to 0 makes the pin an input port. Port B pin functions in mode 6 are shown in figure 9-10. Port B When PBDDR = 1 When PBDDR = 0 A15 (output) PB7 (input) A14 (output) PB6 (input) A13 (output) PB5 (input) A12 (output) PB4 (input) A11 (output) PB3 (input) A10 (output) PB2 (input) A9 (output) PB1 (input) A8 (output) PB0 (input) Figure 9-10 Port B Pin Functions (Mode 6) Mode 7: In mode 7, port B pins function as I/O ports. Input or output can be specified for each pin on an individual bit basis. Setting a PBDDR bit to 1 makes the corresponding port B pin an output port, while clearing the bit to 0 makes the pin an input port. Port B pin functions in mode 7 are shown in figure 9-11. Port B When PBDDR = 1 When PBDDR = 0 A15 (output) PB7 (input) A14 (output) PB6 (input) A13 (output) PB5 (input) A12 (output) PB4 (input) A11 (output) PB3 (input) A10 (output) PB2 (input) A9 (output) PB1 (input) A8 (output) PB0 (input) Figure 9-11 Port B Pin Functions (Mode 7) Rev. 4.0, 03/03, page 396 of 1358 9.9.4 MOS Input Pull-Up Function Port B has a built-in MOS input pull-up function that can be controlled by software. This MOS input pull-up function can be used in modes 6 and 7, and can be specified as on or off on an individual bit basis. When a PBDDR bit is cleared to 0 in mode 6 or 7, setting the corresponding PBPCR bit to 1 turns on the MOS input pull-up for that pin. The MOS input pull-up function is in the off state after a reset, and in hardware standby mode. The prior state is retained in software standby mode. Table 9-17 summarizes the MOS input pull-up states. Table 9-17 MOS Input Pull-Up States (Port B) Modes Reset Hardware Standby Mode Software Standby Mode In Other Operations 4, 5 Off Off Off Off On/off On/off 6, 7 Legend Off: MOS input pull-up is always off. On/off: On when PBDDR = 0 and PBPCR = 1; otherwise off. Rev. 4.0, 03/03, page 397 of 1358 9.10 Port C 9.10.1 Overview Port C is an 8-bit I/O port. Port C has an address bus output function, and the pin functions change according to the operating mode. Port C has a built-in MOS input pull-up function that can be controlled by software. Figure 9-12 shows the port C pin configuration. Port C Port C pins Pin functions in modes 4 and 5 PC7 / A7 A7 (output) PC6 / A6 A6 (output) PC5 / A5 A5 (output) PC4 / A4 A4 (output) PC3 / A3 A3 (output) PC2 / A2 A2 (output) PC1 / A1 A1 (output) PC0 / A0 A0 (output) Pin functions in mode 6 Pin functions in mode 7 PC7 (input) / A7 (output) PC7 (I/O) PC6 (input) / A6 (output) PC6 (I/O) PC5 (input) / A5 (output) PC5 (I/O) PC4 (input) / A4 (output) PC4 (I/O) PC3 (input) / A3 (output) PC3 (I/O) PC2 (input) / A2 (output) PC2 (I/O) PC1 (input) / A1 (output) PC1 (I/O) PC0 (input) / A0 (output) PC0 (I/O) Figure 9-12 Port C Pin Functions Rev. 4.0, 03/03, page 398 of 1358 9.10.2 Register Configuration Table 9-18 shows the port C register configuration. Table 9-18 Port C Registers Name Abbreviation R/W Initial Value Address* Port C data direction register PCDDR W H'00 H'FEBB Port C data register PCDR R/W H'00 H'FF6B Port C register PORTC R Undefined H'FF5B Port C MOS pull-up control register PCPCR R/W H'00 H'FF72 Note: * Lower 16 bits of the address. Port C Data Direction Register (PCDDR) Bit : 7 6 5 4 3 2 1 0 PC7DDR PC6DDR PC5DDR PC4DDR PC3DDR PC2DDR PC1DDR PC0DDR Initial value : 0 0 0 0 0 0 0 0 R/W W W W W W W W W : PCDDR is an 8-bit write-only register, the individual bits of which specify input or output for the pins of port C. PCDDR cannot be read; if it is, an undefined value will be read. PCDDR is initialized to H'00 by a reset, and in hardware standby mode. It retains its prior state in software standby mode. The OPE bit in SBYCR is used to select whether the address output pins retain their output state or become high-impedance when a transition is made to software standby mode. * Modes 4 and 5 The corresponding port C pins are address outputs irrespective of the value of the PCDDR bits. * Mode 6 Setting a PCDDR bit to 1 makes the corresponding port C pin an address output, while clearing the bit to 0 makes the pin an input port. * Mode 7 Setting a PCDDR bit to 1 makes the corresponding port C pin an output port, while clearing the bit to 0 makes the pin an input port. Rev. 4.0, 03/03, page 399 of 1358 Port C Data Register (PCDR) Bit : Initial value : R/W : 7 6 5 4 3 2 1 0 PC7DR PC6DR PC5DR PC4DR PC3DR PC2DR PC1DR PC0DR 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W PCDR is an 8-bit readable/writable register that stores output data for the port C pins (PC7 to PC0). PCDR is initialized to H'00 by a reset, and in hardware standby mode. It retains its prior state in software standby mode. Port C Register (PORTC) Bit : Initial value : R/W : 7 6 5 4 3 2 1 0 PC7 --* PC6 --* PC5 --* PC4 --* PC3 --* PC2 --* PC1 --* PC0 --* R R R R R R R R Note: * Determined by state of pins PC7 to PC0. PORTC is an 8-bit read-only register that shows the pin states. It cannot be written to. Writing of output data for the port C pins (PC7 to PC0) must always be performed on PCDR. If a port C read is performed while PCDDR bits are set to 1, the PCDR values are read. If a port C read is performed while PCDDR bits are cleared to 0, the pin states are read. After a reset and in hardware standby mode, PORTC contents are determined by the pin states, as PCDDR and PCDR are initialized. PORTC retains its prior state in software standby mode. Rev. 4.0, 03/03, page 400 of 1358 Port C MOS Pull-Up Control Register (PCPCR) Bit : 7 6 5 4 3 2 1 0 PC7PCR PC6PCR PC5PCR PC4PCR PC3PCR PC2PCR PC1PCR PC0PCR Initial value : R/W : 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W PCPCR is an 8-bit readable/writable register that controls the MOS input pull-up function incorporated into port C on an individual bit basis. When a PCDDR bit is cleared to 0 (input port setting) in mode 6 or 7, setting the corresponding PCPCR bit to 1 turns on the MOS input pull-up for the corresponding pin. PCPCR is initialized to H'00 by a reset, and in hardware standby mode. It retains its prior state in software standby mode. 9.10.3 Pin Functions Modes 4 and 5: In modes 4 and 5, port C pins are automatically designated as address outputs. Port C pin functions in modes 4 and 5 are shown in figure 9-13. A7 (output) A6 (output) A5 (output) Port C A4 (output) A3 (output) A2 (output) A1 (output) A0 (output) Figure 9-13 Port C Pin Functions (Modes 4 and 5) Rev. 4.0, 03/03, page 401 of 1358 Mode 6: In mode 6, port C pins function as address outputs or input ports. Input or output can be specified on an individual bit basis. Setting a PCDDR bit to 1 makes the corresponding port C pin an address output, while clearing the bit to 0 makes the pin an input port. Port C pin functions in mode 6 are shown in figure 9-14. Port C When PCDDR = 1 When PCDDR = 0 A7 (output) PC7 (input) A6 (output) PC6 (input) A5 (output) PC5 (input) A4 (output) PC4 (input) A3 (output) PC3 (input) A2 (output) PC2 (input) A1 (output) PC1 (input) A0 (output) PC0 (input) Figure 9-14 Port C Pin Functions (Mode 6) Mode 7: In mode 7, port C pins function as I/O ports. Input or output can be specified for each pin on an individual bit basis. Setting a PCDDR bit to 1 makes the corresponding port C pin an output port, while clearing the bit to 0 makes the pin an input port. Port C pin functions in mode 7 are shown in figure 9-15. PC7 (I/O) PC6 (I/O) PC5 (I/O) Port C PC4 (I/O) PC3 (I/O) PC2 (I/O) PC1 (I/O) PC0 (I/O) Figure 9-15 Port C Pin Functions (Mode 7) Rev. 4.0, 03/03, page 402 of 1358 9.10.4 MOS Input Pull-Up Function Port C has a built-in MOS input pull-up function that can be controlled by software. This MOS input pull-up function can be used in modes 6 and 7, and can be specified as on or off on an individual bit basis. When a PCDDR bit is cleared to 0 in mode 6 or 7, setting the corresponding PCPCR bit to 1 turns on the MOS input pull-up for that pin. The MOS input pull-up function is in the off state after a reset, and in hardware standby mode. The prior state is retained in software standby mode. Table 9-19 summarizes the MOS input pull-up states. Table 9-19 MOS Input Pull-Up States (Port C) Modes Reset Hardware Standby Mode Software Standby Mode In Other Operations 4, 5 Off Off Off Off On/off On/off 6, 7 Legend Off: MOS input pull-up is always off. On/off: On when PCDDR = 0 and PCPCR = 1; otherwise off. Rev. 4.0, 03/03, page 403 of 1358 9.11 Port D 9.11.1 Overview Port D is an 8-bit I/O port. Port D has a data bus I/O function, and the pin functions change according to the operating mode. Port D has a built-in MOS input pull-up function that can be controlled by software. Figure 9-16 shows the port D pin configuration. Port D Port D pins Pin functions in modes 4 to 6 PD7 / D15 D15 (I/O) PD6 / D14 D14 (I/O) PD5 / D13 D13 (I/O) PD4 / D12 D12 (I/O) PD3 / D11 D11 (I/O) PD2 / D10 D10 (I/O) PD1 / D9 D9 (I/O) PD0 / D8 D8 (I/O) Pin functions in mode 7 PD7 (I/O) PD6 (I/O) PD5 (I/O) PD4 (I/O) PD3 (I/O) PD2 (I/O) PD1 (I/O) PD0 (I/O) Figure 9-16 Port D Pin Functions Rev. 4.0, 03/03, page 404 of 1358 9.11.2 Register Configuration Table 9-20 shows the port D register configuration. Table 9-20 Port D Registers Name Abbreviation R/W Initial Value Address* Port D data direction register PDDDR W H'00 H'FEBC Port D data register PDDR R/W H'00 H'FF6C Port D register PORTD R Undefined H'FF5C Port D MOS pull-up control register PDPCR R/W H'00 H'FF73 Note: * Lower 16 bits of the address. Port D Data Direction Register (PDDDR) Bit : 7 6 5 4 3 2 1 0 PD7DDR PD6DDR PD5DDR PD4DDR PD3DDR PD2DDR PD1DDR PD0DDR Initial value : 0 0 0 0 0 0 0 0 R/W W W W W W W W W : PDDDR is an 8-bit write-only register, the individual bits of which specify input or output for the pins of port D. PDDDR cannot be read; if it is, an undefined value will be read. PDDDR is initialized to H'00 by a reset, and in hardware standby mode. It retains its prior state in software standby mode. * Modes 4 to 6 The input/output direction specification by PDDDR is ignored, and port D is automatically designated for data I/O. * Mode 7 Setting a PDDDR bit to 1 makes the corresponding port D pin an output port, while clearing the bit to 0 makes the pin an input port. Rev. 4.0, 03/03, page 405 of 1358 Port D Data Register (PDDR) Bit : Initial value : R/W : 7 6 5 4 3 2 1 0 PD7DR PD6DR PD5DR PD4DR PD3DR PD2DR PD1DR PD0DR 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W PDDR is an 8-bit readable/writable register that stores output data for the port D pins (PD7 to PD0). PDDR is initialized to H'00 by a reset, and in hardware standby mode. It retains its prior state in software standby mode. Port D Register (PORTD) Bit : Initial value : R/W : 7 6 5 4 3 2 1 0 PD7 --* PD6 --* PD5 --* PD4 --* PD3 --* PD2 --* PD1 --* PD0 --* R R R R R R R R Note: * Determined by state of pins PD7 to PD0. PORTD is an 8-bit read-only register that shows the pin states. It cannot be written to. Writing of output data for the port D pins (PD7 to PD0) must always be performed on PDDR. If a port D read is performed while PDDDR bits are set to 1, the PDDR values are read. If a port D read is performed while PDDDR bits are cleared to 0, the pin states are read. After a reset and in hardware standby mode, PORTD contents are determined by the pin states, as PDDDR and PDDR are initialized. PORTD retains its prior state in software standby mode. Rev. 4.0, 03/03, page 406 of 1358 Port D MOS Pull-Up Control Register (PDPCR) Bit : 7 6 5 4 3 2 1 0 PD7PCR PD6PCR PD5PCR PD4PCR PD3PCR PD2PCR PD1PCR PD0PCR Initial value : R/W : 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W PDPCR is an 8-bit readable/writable register that controls the MOS input pull-up function incorporated into port D on an individual bit basis. When a PDDDR bit is cleared to 0 (input port setting) in mode 7, setting the corresponding PDPCR bit to 1 turns on the MOS input pull-up for the corresponding pin. PDPCR is initialized to H'00 by a reset, and in hardware standby mode. It retains its prior state in software standby mode. 9.11.3 Pin Functions Modes 4 to 6: In modes 4 to 6, port D pins are automatically designated as data I/O pins. Port D pin functions in modes 4 to 6 are shown in figure 9-17. D15 (I/O) D14 (I/O) D13 (I/O) Port D D12 (I/O) D11 (I/O) D10 (I/O) D9 (I/O) D8 (I/O) Figure 9-17 Port D Pin Functions (Modes 4 to 6) Rev. 4.0, 03/03, page 407 of 1358 Mode 7: In mode 7, port D pins function as I/O ports. Input or output can be specified for each pin on an individual bit basis. Setting a PDDDR bit to 1 makes the corresponding port D pin an output port, while clearing the bit to 0 makes the pin an input port. Port D pin functions in mode 7 are shown in figure 9-18. PD7 (I/O) PD6 (I/O) PD5 (I/O) Port D PD4 (I/O) PD3 (I/O) PD2 (I/O) PD1 (I/O) PD0 (I/O) Figure 9-18 Port D Pin Functions (Mode 7) 9.11.4 MOS Input Pull-Up Function Port D has a built-in MOS input pull-up function that can be controlled by software. This MOS input pull-up function can be used in mode 7, and can be specified as on or off on an individual bit basis. When a PDDDR bit is cleared to 0 in mode 7, setting the corresponding PDPCR bit to 1 turns on the MOS input pull-up for that pin. The MOS input pull-up function is in the off state after a reset, and in hardware standby mode. The prior state is retained in software standby mode. Table 9-21 summarizes the MOS input pull-up states. Table 9-21 MOS Input Pull-Up States (Port D) Modes Reset Hardware Standby Mode Software Standby Mode In Other Operations 4 to 6 Off Off Off Off On/off On/off 7 Legend Off: MOS input pull-up is always off. On/off: On when PDDDR = 0 and PDPCR = 1; otherwise off. Rev. 4.0, 03/03, page 408 of 1358 9.12 Port E 9.12.1 Overview Port E is an 8-bit I/O port. Port E has a data bus I/O function, and the pin functions change according to the operating mode and whether 8-bit or 16-bit bus mode is selected. Port E has a built-in MOS input pull-up function that can be controlled by software. Figure 9-19 shows the port E pin configuration. Port E Port E pins Pin functions in modes 4 to 6 PE7 / D7 PE7 (I/O) / D7 (I/O) PE6 / D6 PE6 (I/O) / D6 (I/O) PE5 / D5 PE5 (I/O) / D5 (I/O) PE4 / D4 PE4 (I/O) / D4 (I/O) PE3 / D3 PE3 (I/O) / D3 (I/O) PE2 / D2 PE2 (I/O) / D2 (I/O) PE1 / D1 PE1 (I/O) / D1 (I/O) PE0 / D0 PE0 (I/O) / D0 (I/O) Pin functions in mode 7 PE7 (I/O) PE6 (I/O) PE5 (I/O) PE4 (I/O) PE3 (I/O) PE2 (I/O) PE1 (I/O) PE0 (I/O) Figure 9-19 Port E Pin Functions Rev. 4.0, 03/03, page 409 of 1358 9.12.2 Register Configuration Table 9-22 shows the port E register configuration. Table 9-22 Port E Registers Name Abbreviation R/W Initial Value Address* Port E data direction register PEDDR W H'00 H'FEBD Port E data register PEDR R/W H'00 H'FF6D Port E register PORTE R Undefined H'FF5D Port E MOS pull-up control register PEPCR R/W H'00 H'FF74 Note: * Lower 16 bits of the address. Port E Data Direction Register (PEDDR) Bit : 7 6 5 4 3 2 1 0 PE7DDR PE6DDR PE5DDR PE4DDR PE3DDR PE2DDR PE1DDR PE0DDR Initial value : 0 0 0 0 0 0 0 0 R/W W W W W W W W W : PEDDR is an 8-bit write-only register, the individual bits of which specify input or output for the pins of port E. PEDDR cannot be read; if it is, an undefined value will be read. PEDDR is initialized to H'00 by a reset, and in hardware standby mode. It retains its prior state in software standby mode. * Modes 4 to 6 When 8-bit bus mode has been selected, port E pins function as I/O ports. Setting a PEDDR bit to 1 makes the corresponding port E pin an output port, while clearing the bit to 0 makes the pin an input port. When 16-bit bus mode has been selected, the input/output direction specification by PEDDR is ignored, and port E is designated for data I/O. For details of 8-bit and 16-bit bus modes, see section 6, Bus Controller. * Mode 7 Setting a PEDDR bit to 1 makes the corresponding port E pin an output port, while clearing the bit to 0 makes the pin an input port. Rev. 4.0, 03/03, page 410 of 1358 Port E Data Register (PEDR) Bit : Initial value : R/W : 7 6 5 4 3 2 1 0 PE7DR PE6DR PE5DR PE4DR PE3DR PE2DR PE1DR PE0DR 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W PEDR is an 8-bit readable/writable register that stores output data for the port E pins (PE7 to PE0). PEDR is initialized to H'00 by a reset, and in hardware standby mode. It retains its prior state in software standby mode. Port E Register (PORTE) Bit : Initial value : R/W : 7 6 5 4 3 2 1 0 PE7 --* PE6 --* PE5 --* PE4 --* PE3 --* PE2 --* PE1 --* PE0 --* R R R R R R R R Note: * Determined by state of pins PE7 to PE0. PORTE is an 8-bit read-only register that shows the pin states. It cannot be written to. Writing of output data for the port E pins (PE7 to PE0) must always be performed on PEDR. If a port E read is performed while PEDDR bits are set to 1, the PEDR values are read. If a port E read is performed while PEDDR bits are cleared to 0, the pin states are read. After a reset and in hardware standby mode, PORTE contents are determined by the pin states, as PEDDR and PEDR are initialized. PORTE retains its prior state in software standby mode. Rev. 4.0, 03/03, page 411 of 1358 Port E MOS Pull-Up Control Register (PEPCR) Bit : 7 6 5 4 3 2 1 0 PE7PCR PE6PCR PE5PCR PE4PCR PE3PCR PE2PCR PE1PCR PE0PCR Initial value : R/W : 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W PEPCR is an 8-bit readable/writable register that controls the MOS input pull-up function incorporated into port E on an individual bit basis. When a PEDDR bit is cleared to 0 (input port setting) in mode 4, 5, or 6 with 8-bit bus mode selected, or in mode 7, setting the corresponding PEPCR bit to 1 turns on the MOS input pull-up for the corresponding pin. PEPCR is initialized to H'00 by a reset, and in hardware standby mode. It retains its prior state in software standby mode. 9.12.3 Pin Functions Modes 4 to 6: In modes 4 to 6, when 8-bit access is designated and 8-bit bus mode is selected, port E pins are automatically designated as I/O ports. Setting a PEDDR bit to 1 makes the corresponding port E pin an output port, while clearing the bit to 0 makes the pin an input port. When 16-bit bus mode is selected, the input/output direction specification by PEDDR is ignored, and port E is designated for data I/O. Port E pin functions in modes 4 to 6 are shown in figure 9-20. Port E 8-bit bus mode 16-bit bus mode PE7 (I/O) D7 (I/O) PE6 (I/O) D6 (I/O) PE5 (I/O) D5 (I/O) PE4 (I/O) D4 (I/O) PE3 (I/O) D3 (I/O) PE2 (I/O) D2 (I/O) PE1 (I/O) D1 (I/O) PE0 (I/O) D0 (I/O) Figure 9-20 Port E Pin Functions (Modes 4 to 6) Rev. 4.0, 03/03, page 412 of 1358 Mode 7: In mode 7, port E pins function as I/O ports. Input or output can be specified for each pin on a bit-by-bit basis. Setting a PEDDR bit to 1 makes the corresponding port E pin an output port, while clearing the bit to 0 makes the pin an input port. Port E pin functions in mode 7 are shown in figure 9-21. PE7 (I/O) PE6 (I/O) PE5 (I/O) Port E PE4 (I/O) PE3 (I/O) PE2 (I/O) PE1 (I/O) PE0 (I/O) Figure 9-21 Port E Pin Functions (Mode 7) Rev. 4.0, 03/03, page 413 of 1358 9.12.4 MOS Input Pull-Up Function Port E has a built-in MOS input pull-up function that can be controlled by software. This MOS input pull-up function can be used in modes 4 to 6 when 8-bit bus mode is selected, or in mode 7, and can be specified as on or off on an individual bit basis. When a PEDDR bit is cleared to 0 in mode 4, 5, or 6 when 8-bit bus mode is selected, or in mode 7, setting the corresponding PEPCR bit to 1 turns on the MOS input pull-up for that pin. The MOS input pull-up function is in the off state after a reset, and in hardware standby mode. The prior state is retained in software standby mode. Table 9-23 summarizes the MOS input pull-up states. Table 9-23 MOS Input Pull-Up States (Port E) Modes Reset Hardware Standby Mode Software Standby Mode In Other Operations 7 Off Off On/off On/off Off Off 4 to 6 8-bit bus 16-bit bus Legend Off: MOS input pull-up is always off. On/off: On when PEDDR = 0 and PEPCR = 1; otherwise off. Rev. 4.0, 03/03, page 414 of 1358 9.13 Port F 9.13.1 Overview Port F is an 8-bit I/O port. Port F pins also function as bus control signal input/output pins (AS, RD, HWR, LWR, LCAS*, WAIT, BREQO, BREQ, and BACK) and the system clock () output pin. The AS, LWR, and BREQO output pins can be switched by means of settings in PFCR2 and SYSCR. Figure 9-22 shows the port F pin configuration. Note: * LCAS is not supported in the H8S/2321. Port F Port F pins Pin functions in modes 4 to 6 PF7 / f PF7 (input) / f (output) PF6 / AS PF6 (I/O) / AS (output) PF5 / RD RD (output) PF4 / HWR HWR (output) PF3 / LWR PF3 (I/O) / LWR (output) PF2 / LCAS * / WAIT / BREQO PF2 (I/O) / LCAS * (output) / WAIT (input) / BREQO (output) PF1 / BACK PF1 (I/O) / BACK (output) PF0 / BREQ PF0 (I/O) / BREQ (input) Pin functions in mode 7 PF7 (input) / f (output) PF6 (I/O) PF5 (I/O) PF4 (I/O) PF3 (I/O) PF2 (I/O) PF1 (I/O) PF0 (I/O) Note: * LCAS is not supported in the H8S/2321. Figure 9-22 Port F Pin Functions Rev. 4.0, 03/03, page 415 of 1358 9.13.2 Register Configuration Table 9-24 shows the port F register configuration. Table 9-24 Port F Registers 1 Address* Name Abbreviation R/W Initial Value Port F data direction register PFDDR W H'80/H'00* H'FEBE Port F data register PFDR R/W H'00 H'FF6E Port F register PORTF R Undefined H'FF5E Port function control register 2 PFCR2 R/W H'30 H'FFAC System control register SYSCR R/W H'01 H'FF39 2 Notes: *1 Lower 16 bits of the address. *2 Initial value depends on the mode. Port F Data Direction Register (PFDDR) Bit : 7 6 5 4 3 2 1 0 PF7DDR PF6DDR PF5DDR PF4DDR PF3DDR PF2DDR PF1DDR PF0DDR Modes 4 to 6 Initial value : 1 0 0 0 0 0 0 0 R/W W W W W W W W W : Mode 7 Initial value : 0 0 0 0 0 0 0 0 R/W W W W W W W W W : PFDDR is an 8-bit write-only register, the individual bits of which specify input or output for the pins of port F. PFDDR cannot be read; if it is, an undefined value will be read. PFDDR is initialized by a reset, and in hardware standby mode, to H'80 in modes 4 to 6, and to H'00 in mode 7. It retains its prior state in software standby mode. The OPE bit in SBYCR is used to select whether the bus control output pins retain their output state or become high-impedance when a transition is made to software standby mode. Rev. 4.0, 03/03, page 416 of 1358 Port F Data Register (PFDR) Bit : Initial value : R/W : 7 6 5 4 3 2 1 0 PF7DR PF6DR PF5DR PF4DR PF3DR PF2DR PF1DR PF0DR 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W PFDR is an 8-bit readable/writable register that stores output data for the port F pins (PF7 to PF0). PFDR is initialized to H'00 by a reset, and in hardware standby mode. It retains its prior state in software standby mode. Port F Register (PORTF) Bit : Initial value : R/W : 7 6 5 4 3 2 1 0 PF7 --* PF6 --* PF5 --* PF4 --* PF3 --* PF2 --* PF1 --* PF0 --* R R R R R R R R Note: * Determined by state of pins PF7 to PF0. PORTF is an 8-bit read-only register that shows the pin states. It cannot be written to. Writing of output data for the port F pins (PF7 to PF0) must always be performed on PFDR. If a port F read is performed while PFDDR bits are set to 1, the PFDR values are read. If a port F read is performed while PFDDR bits are cleared to 0, the pin states are read. After a reset and in hardware standby mode, PORTF contents are determined by the pin states, as PFDDR and PFDR are initialized. PORTF retains its prior state in software standby mode. Rev. 4.0, 03/03, page 417 of 1358 Port Function Control Register 2 (PFCR2) Bit : Initial value : R/W : 7 6 5 4 3 2 1 0 WAITPS BREQOPS CS167E CS25E ASOD -- -- -- 0 0 1 1 0 0 0 0 R/W R/W R/W R/W R/W R R R PFCR2 is an 8-bit readable/writable register that performs I/O port control. PFCR2 is initialized to H'30 by a reset, and in hardware standby mode. Bit 7--WAIT Pin Select (WAITPS): Selects the WAIT input pin. Set the WAITPS bit before setting the DDR bit clear to 0 and the WAITE bit in BCRL to 1. Bit 7 WAITPS Description 0 WAIT input is pin PF2 1 WAIT input is pin P53 (Initial value) Bit 6--BREQO Pin Select (BREQOPS): Selects the BREQO output pin. Set the BREQOPS bit before setting the BREQOE bit in BCRL to 1. Bit 6 BREQOPS Description 0 BREQO output is pin PF2 1 BREQO output is pin P53 (Initial value) Bit 5--CS167 Enable (CS167E): Enables or disables CS1, CS6, and CS7 output. For details, see section 9.7, Port 6 and section 9.14, Port G. Bit 4--CS25 Enable (CS25E): Enables or disables CS2, CS3, CS4, and CS5 output. For details, see section 9.7, Port 6 and section 9.14, Port G. Bit 3--AS Output Disable (ASOD): Enables or disables AS output. This bit is valid in modes 4 to 6. Bit 3 ASOD Description 0 PF6 is used as AS output pin 1 PF6 is designated as I/O port, and does not function as AS output pin Bits 2 to 0--Reserved: These bits are always read as 0. Rev. 4.0, 03/03, page 418 of 1358 (Initial value) System Control Register (SYSCR) Bit : Initial value : R/W : 7 6 5 4 3 2 1 0 -- -- INTM1 INTM0 NMIEG 0 0 0 0 0 0 0 1 R/W -- R/W R/W R/W R/W R/W R/W LWROE IRQPAS RAME SYSCR is an 8-bit readable/writable register that selects the interrupt control mode, controls the LWR pin, switches the IRQ4 to IRQ7 input pins, and selects the detected edge for NMI. SYSCR is initialized to H'01 by a reset, and in hardware standby mode. It is not initialized in software standby mode. Bits 5 and 4--Interrupt Control Mode 1 and 0 (INTM1, INTM0): These bits select either of two interrupt control modes for the interrupt controller. For details, see section 5, Interrupt Controller. Bit 3--NMI Edge Select (NMIEG): Selects the input edge for the NMI pin. For details, see section 5, Interrupt Controller. Bit 2--LWR Output Disable (LWROD): Enables or disables LWR output. This bit is valid in modes 4 to 6. Bit 2 LWROD Description 0 PF3 is designated as LWR output pin 1 PF3 is designated as I/O port, and does not function as LWR output pin (Initial value) Bit 1--IRQ Port Switching Select (IRQPAS): Selects switching of input pins for IRQ4 to IRQ7. For details, see section 9.6, Port 5. Bit 0--RAM Enable (RAME): Enables or disables on-chip RAM. For details, see section 18, RAM. Rev. 4.0, 03/03, page 419 of 1358 9.13.3 Pin Functions Port F pins also function as bus control signal input/output pins (AS, RD, HWR, LWR, LCAS*, WAIT, BREQO, BREQ, and BACK) and the system clock () output pin. The pin functions differ between modes 4 to 6, and mode 7. Port F pin functions are shown in table 9-25. Note: * The LCAS is not supported in the H8S/2321. Table 9-25 Port F Pin Functions Pin Selection Method and Pin Functions PF7/ The pin function is switched as shown below according to bit PF7DDR. PF7DDR Pin function PF6/AS 0 1 PF7 input pin output pin The pin function is switched as shown below according to the operating mode, bit PF6DDR, and bit ASOD in PFCR2. Operating Mode ASOD PF6DDR Pin function PF5/RD 0 Mode 7 1 -- -- 0 1 0 1 AS output pin PF6 input pin PF6 output pin PF6 input pin PF6 output pin The pin function is switched as shown below according to the operating mode and bit PF5DDR. Operating Mode Modes 4 to 6 PF5DDR -- 0 1 RD output pin PF5 input pin PF5 output pin Pin function PF4/HWR Modes 4 to 6 Mode 7 The pin function is switched as shown below according to the operating mode and bit PF4DDR. Operating Mode Modes 4 to 6 PF4DDR -- 0 1 HWR output pin PF4 input pin PF4 output pin Pin function Rev. 4.0, 03/03, page 420 of 1358 Mode 7 Pin Selection Method and Pin Functions PF3/LWR The pin function is switched as shown below according to the operating mode, bit PF3DDR, and bit LWROD in SYSCR. Operating Mode Modes 4 to 6 LWROD 0 PF3DDR Pin function Mode 7 1 -- -- 0 1 0 1 LWR output pin PF3 input pin PF3 output pin PF3 input pin PF3 output pin 2 PF2/LCAS* /WAIT/ The pin function is switched as shown below according to the combination of 2 BREQO the operating mode, and bits RMTS2 to RMTS0* , BREQOE, WAITE, ABW5 to ABW2, BREQOPS, WAITPS, and PF2DDR. Operating Mode Modes 4 to 6 [DRAM space 2 setting]* * [16-bit access setting] 0 0 [BREQOE * BREQOPS] Pin function 1 0 [WAITE * WAITPS] PF2DDR Mode 7 1 0 1 0 PF2 input pin PF2 output pin WAIT input 1 pin* 1 1 -- -- -- -- 0 1 -- -- -- -- 0 1 LCAS output 2 pin* PF2 input pin PF2 output pin Setting BREQO Setting prooutput prohibited pin hibited Notes: *1 When DRAM space is designated for 8-bit access and PF2 is used as the WAIT input, this pin can be used for WAIT input when all areas selected as DRAM space are 8-bit space and normal space other than DRAM space is 16-bit space. *2 The DRAM interface and LCAS are not supported in the H8S/2321. PF1/BACK The pin function is switched as shown below according to the combination of the operating mode, and bits BRLE and PF1DDR. Operating Mode Modes 4 to 6 BRLE PF1DDR Pin function 0 Mode 7 1 -- 0 1 -- 0 1 PF1 input pin PF1 output pin BACK output pin PF1 input pin PF1 output pin Rev. 4.0, 03/03, page 421 of 1358 Pin Selection Method and Pin Functions PF0/BREQ The pin function is switched as shown below according to the combination of the operating mode, and bits BRLE and PF0DDR. Operating Mode Modes 4 to 6 BRLE 0 PF0DDR Pin function 9.14 Port G 9.14.1 Overview Mode 7 1 -- 0 1 -- 0 1 PF0 input pin PF0 output pin BREQ input pin PF0 input pin PF0 output pin Port G is a 5-bit I/O port. Port G pins also function as bus control signal output pins (CS0 to CS3, and CAS*). Enabling or disabling of CS1 to CS3 output can be changed by a setting in PFCR2. Figure 9-23 shows the port G pin configuration. Note: * CAS is not supported in the H8S/2321. Port G Port G pins Pin functions in modes 4 to 6 Pin functions in mode 7 PG4 / CS0 PG4 (input) / CS0 (output) PG4 (I/O) PG3 / CS1 PG3 (I/O) / CS1 (output) PG3 (I/O) PG2 / CS2 PG2 (I/O) / CS2 (output) PG2 (I/O) PG1 / CS3 PG1 (I/O) / CS3 (output) PG1 (I/O) PG0 / CAS * PG0 (I/O) / CAS * (output) PG0 (I/O) Note: * CAS is not supported in the H8S/2321. Figure 9-23 Port G Pin Functions Rev. 4.0, 03/03, page 422 of 1358 9.14.2 Register Configuration Table 9-26 shows the port G register configuration. Table 9-26 Port G Registers 2 1 Name Abbreviation R/W Initial Value* Address* Port G data direction register PGDDR W H'10/H'00* H'FEBF Port G data register PGDR R/W H'00 H'FF6F Port G register PORTG R Undefined H'FF5F Port function register 2 PFCR2 R/W H'30 H'FFAC 3 Notes: *1 Lower 16 bits of the address. *2 Value of bits 4 to 0. *3 Initial value depends on the mode. Port G Data Direction Register (PGDDR) Bit : 7 6 5 -- -- -- 4 3 2 1 0 PG4DDR PG3DDR PG2DDR PG1DDR PG0DDR Modes 4 and 5 Initial value : Undefined Undefined Undefined 1 0 0 0 0 R/W W W W W W Initial value : Undefined Undefined Undefined 0 0 0 0 0 R/W W W W W W : -- -- -- Modes 6 and 7 : -- -- -- PGDDR is an 8-bit write-only register, the individual bits of which specify input or output for the pins of port G. PGDDR cannot be read, and bits 7 to 5 are reserved. If PGDDR is read, an undefined value will be read. The PG4DDR bit is initialized by a reset, and in hardware standby mode, to 1 in modes 4 and 5, and to 0 in modes 6 and 7. PGDDR retains its prior state in software standby mode. The OPE bit in SBYCR is used to select whether the bus control output pins retain their output state or become high-impedance when a transition is made to software standby mode. Rev. 4.0, 03/03, page 423 of 1358 Port G Data Register (PGDR) Bit : 7 6 5 4 3 2 1 0 -- -- -- PG4DR PG3DR PG2DR PG1DR PG0DR 0 0 0 0 0 R/W R/W R/W R/W R/W Initial value : Undefined Undefined Undefined R/W : -- -- -- PGDR is an 8-bit readable/writable register that stores output data for the port G pins (PG4 to PG0). Bits 7 to 5 are reserved; they return an undefined value if read, and cannot be modified. PGDR is initialized to H'00 (bits 4 to 0) by a reset, and in hardware standby mode. It retains its prior state in software standby mode. Port G Register (PORTG) Bit : 7 6 5 4 3 2 1 0 -- -- -- PG4 --* PG3 --* PG2 --* PG1 --* PG0 --* R R R R R Initial value : Undefined Undefined Undefined R/W : -- -- -- Note: * Determined by state of pins PG4 to PG0. PORTG is an 8-bit read-only register that shows the pin states. It cannot be written to. Writing of output data for the port G pins (PG4 to PG0) must always be performed on PGDR. Bits 7 to 5 are reserved; they return an undefined value if read, and cannot be modified. If a port G read is performed while PGDDR bits are set to 1, the PGDR values are read. If a port G read is performed while PGDDR bits are cleared to 0, the pin states are read. After a reset and in hardware standby mode, PORTG contents are determined by the pin states, as PGDDR and PGDR are initialized. PORTG retains its prior state in software standby mode. Rev. 4.0, 03/03, page 424 of 1358 Port Function Control Register 2 (PFCR2) Bit : Initial value : R/W : 7 6 5 4 3 2 1 0 WAITPS BREQOPS CS167E CS25E ASOD -- -- -- 0 0 1 1 0 0 0 0 R/W R/W R/W R/W R/W R R R PFCR2 is an 8-bit readable/writable register that performs I/O port control. PFCR2 is initialized to H'30 by a reset, and in hardware standby mode. Bit 7--WAIT Pin Select (WAITPS): Selects the WAIT input pin. For details, see section 9.6, Port 5. Bit 6--BREQO Pin Select (BREQOPS): Selects the BREQO output pin. For details, see section 9.6, Port 5. Bit 5--CS167 Enable (CS167E): Enables or disables CS1, CS6, and CS7 output. Change the CS167E setting only when the DDR bits are cleared to 0. Bit 5 CS167E Description 0 CS1, CS6, and CS7 output disabled (can be used as I/O ports) 1 CS1, CS6, and CS7 output enabled (Initial value) Bit 4--CS25 Enable (CS25E): Enables or disables CS2, CS3, CS4, and CS5 output. Change the CS25E setting only when the DDR bits are cleared to 0. Bit 4 CS25E Description 0 CS2, CS3, CS4, and CS5 output disabled (can be used as I/O ports) 1 CS2, CS3, CS4, and CS5 output enabled (Initial value) Bit 3--AS Output Disable (ASOD): Enables or disables AS output. For details, see section 9.13, Port F. Bits 2 to 0--Reserved: These bits are always read as 0. Rev. 4.0, 03/03, page 425 of 1358 9.14.3 Pin Functions Port G pins also function as bus control signal output pins (CS0 to CS3, and CAS*). The pin functions are different in mode 7, and modes 4 to 6. Port G pin functions are shown in table 9-27. Note: * The CAS is not supported in the H8S/2321. Table 9-27 Port G Pin Functions Pin Selection Method and Pin Functions PG4/CS0 The pin function is switched as shown below according to the operating mode and bit PG4DDR. Operating Mode Modes 4 to 6 PG4DDR Pin function PG3/CS1 0 1 0 1 PG4 input pin CS0 output pin PG4 input pin PG4 output pin The pin function is switched as shown below according to the operating mode and bits PG3DDR and CS167E. Operating Mode Modes 4 to 6 PG3DDR 0 CS167E -- Pin function PG2/CS2 Mode 7 Mode 7 1 0 1 0 1 -- -- PG3 input PG3 output CS1 output PG3 input PG3 output pin pin pin pin pin The pin function is switched as shown below according to the operating mode and bits PG2DDR and CS25E. Operating Mode Modes 4 to 6 PG2DDR 0 CS25E -- Pin function Rev. 4.0, 03/03, page 426 of 1358 Mode 7 1 0 1 0 1 -- -- PG2 input PG2 output CS2 output PG2 input PG2 output pin pin pin pin pin Pin Selection Method and Pin Functions PG1/CS3 The pin function is switched as shown below according to the operating mode and bits PG1DDR and CS25E. Operating Mode PG1DDR 0 CS25E -- Pin function PG0/CAS* Modes 4 to 6 Mode 7 1 0 1 0 1 -- -- PG1 input PG1 output CS3 output PG1 input PG1 output pin pin pin pin pin The pin function is switched as shown below according to the combination of the operating mode and bits RMTS2 to RMTS0* and PG0DDR. Operating Mode Modes 4 to 6 Mode 7 RMTS2 to RMTS0* B'000, B'100 to B'111 PG0DDR 0 1 -- 0 1 PG0 input pin PG0 output pin CAS output pin* PG0 input pin PG0 output pin Pin function B'001 to B'011 -- Note: * The DRAM interface and CAS are not supported in the H8S/2321. Rev. 4.0, 03/03, page 427 of 1358 Rev. 4.0, 03/03, page 428 of 1358 Section 10 16-Bit Timer Pulse Unit (TPU) 10.1 Overview The chip has an on-chip 16-bit timer pulse unit (TPU) that comprises six 16-bit timer channels. 10.1.1 Features * Maximum 16-pulse input/output A total of 16 timer general registers (TGRs) are provided (four each for channels 0 and 3, and two each for channels 1, 2, 4, and 5), each of which can be set independently as an output compare/input capture register TGRC and TGRD for channels 0 and 3 can also be used as buffer registers * Selection of 8 counter input clocks for each channel * The following operations can be set for each channel: Waveform output at compare match: Selection of 0, 1, or toggle output Input capture function: Selection of rising edge, falling edge, or both edge detection Counter clear operation: Counter clearing possible by compare match or input capture Synchronous operation: Multiple timer counters (TCNT) can be written to simultaneously Simultaneous clearing by compare match and input capture possible Register simultaneous input/output possible by counter synchronous operation PWM mode: Any PWM output duty can be set Maximum of 15-phase PWM output possible by combination with synchronous operation * Buffer operation settable for channels 0 and 3 Input capture register double-buffering possible Automatic rewriting of output compare register possible * Phase counting mode settable independently for each of channels 1, 2, 4, and 5 Two-phase encoder pulse up/down-count possible * Cascaded operation Channel 2 (channel 5) input clock operates as 32-bit counter by setting channel 1 (channel 4) overflow/underflow * Fast access via internal 16-bit bus Fast access is possible via a 16-bit bus interface Rev. 4.0, 03/03, page 429 of 1358 * 26 interrupt sources For channels 0 and 3, four compare match/input capture dual-function interrupts and one overflow interrupt can be requested independently For channels 1, 2, 4, and 5, two compare match/input capture dual-function interrupts, one overflow interrupt, and one underflow interrupt can be requested independently * Automatic transfer of register data Block transfer, 1-word data transfer, and 1-byte data transfer possible by data transfer controller (DTC) or DMA controller (DMAC)* activation * Programmable pulse generator (PPG) output trigger can be generated Channel 0 to 3 compare match/input capture signals can be used as PPG output trigger * A/D converter conversion start trigger can be generated Channel 0 to 5 compare match A/input capture A signals can be used as A/D converter conversion start trigger * Module stop mode can be set As the initial setting, TPU operation is halted. Register access is enabled by exiting module stop mode Note: * The DMAC is not supported in the H8S/2321. Rev. 4.0, 03/03, page 430 of 1358 Table 10-1 lists the functions of the TPU. Table 10-1 TPU Functions Item Channel 0 Channel 1 Channel 2 Channel 3 Channel 4 Channel 5 Count clock /1 /4 /16 /64 TCLKA TCLKB TCLKC TCLKD /1 /4 /16 /64 /256 TCLKA TCLKB /1 /4 /16 /64 /1024 TCLKA TCLKB TCLKC /1 /4 /16 /64 /256 /1024 /4096 TCLKA /1 /4 /16 /64 /1024 TCLKA TCLKC /1 /4 /16 /64 /256 TCLKA TCLKC TCLKD General registers TGR0A TGR0B TGR1A TGR1B TGR2A TGR2B TGR3A TGR3B TGR4A TGR4B TGR5A TGR5B General registers/ buffer registers TGR0C TGR0D -- -- TGR3C TGR3D -- -- I/O pins TIOCA0 TIOCB0 TIOCC0 TIOCD0 TIOCA1 TIOCB1 TIOCA2 TIOCB2 TIOCA3 TIOCB3 TIOCC3 TIOCD3 TIOCA4 TIOCB4 TIOCA5 TIOCB5 Counter clear function TGR compare match or input capture TGR compare match or input capture TGR compare match or input capture TGR compare match or input capture TGR compare match or input capture TGR compare match or input capture -- -- Compare 0 output match 1 output output Toggle output Input capture function Synchronous operation PWM mode Phase counting mode Buffer operation -- -- -- -- Rev. 4.0, 03/03, page 431 of 1358 Item Channel 1 Channel 2 Channel 3 Channel 4 Channel 5 TGR0A DMAC* activation compare match or input capture Channel 0 TGR1A compare match or input capture TGR2A compare match or input capture TGR3A compare match or input capture TGR4A compare match or input capture TGR5A compare match or input capture DTC TGR activation compare match or input capture TGR compare match or input capture TGR compare match or input capture TGR compare match or input capture TGR compare match or input capture TGR compare match or input capture A/D conversion start trigger TGR0A compare match or input capture TGR1A compare match or input capture TGR2A compare match or input capture TGR3A compare match or input capture TGR4A compare match or input capture TGR5A compare match or input capture PPG trigger TGR0A/ TGR0B compare match or input capture TGR1A/ TGR1B compare match or input capture TGR2A/ TGR2B compare match or input capture TGR3A/ -- TGR3B compare match or input capture -- Interrupt sources 5 sources 4 sources 4 sources 5 sources 4 sources 4 sources * Compare * Compare * Compare * Compare * Compare * Compare match or match or match or match or match or match or input input input input input input capture 0A capture 1A capture 2A capture 3A capture 4A capture 5A * Compare * Compare * Compare * Compare * Compare * Compare match or match or match or match or match or match or input input input input input input capture 0B capture 1B capture 2B capture 3B capture 4B capture 5B * Compare * Overflow match or * Underflow input capture 0C * Overflow * Underflow * Compare * Overflow match or * Underflow input capture 3C * Compare match or input capture 0D * Compare match or input capture 3D * Overflow * Overflow Legend : Possible -- : Not possible Note: * The DMAC is not supported in the H8S/2321. Rev. 4.0, 03/03, page 432 of 1358 * Overflow * Underflow 10.1.2 Block Diagram TGRD TGRB TGRC TGRB Interrupt request signals Channel 3: TGI3A TGI3B TGI3C TGI3D TCI3V Channel 4: TGI4A TGI4B TCI4V TCI4U Channel 5: TGI5A TGI5B TCI5V TCI5U Internal data bus A/D conversion start request signal TGRD PPG output trigger signal TGRC TGRB TGRB TGRB TCNT TCNT TGRA TCNT TGRA Bus interface TGRB TCNT TCNT TGRA TCNT Module data bus TGRA TSR TSR TGRA TSR TSR TIER TIER TIER TGRA TSR TIER TIER TIER TSTR TSYR TIORH TIORL TIOR TIOR TSR TMDR TIORH TIORL TIOR TIOR TCR TMDR Channel 4 TCR TMDR Channel 5 TCR Common Control logic TMDR Channel 0 TCR TMDR Channel 1 TCR TMDR Channel 2 TCR Input/output pins TIOCA0 Channel 0: TIOCB0 TIOCC0 TIOCD0 TIOCA1 Channel 1: TIOCB1 TIOCA2 Channel 2: TIOCB2 Control logic for channels 3 to 5 Clock input Internal clock: f/1 f/4 f/16 f/64 f/256 f/1024 f/4096 External clock: TCLKA TCLKB TCLKC TCLKD Control logic for channels 0 to 2 Input/output pins TIOCA3 Channel 3: TIOCB3 TIOCC3 TIOCD3 TIOCA4 Channel 4: TIOCB4 TIOCA5 Channel 5: TIOCB5 Channel 3 Figure 10-1 shows a block diagram of the TPU. Interrupt request signals Channel 0: TGI0A TGI0B TGI0C TGI0D TCI0V Channel 1: TGI1A TGI1B TCI1V TCI1U Channel 2: TGI2A TGI2B TCI2V TCI2U Figure 10-1 Block Diagram of TPU Rev. 4.0, 03/03, page 433 of 1358 10.1.3 Pin Configuration Table 10-2 summarizes the TPU pins. Table 10-2 TPU Pins Channel Name Symbol I/O Function All Clock input A TCLKA Input External clock A input pin (Channel 1 and 5 phase counting mode A phase input) Clock input B TCLKB Input External clock B input pin (Channel 1 and 5 phase counting mode B phase input) Clock input C TCLKC Input External clock C input pin (Channel 2 and 4 phase counting mode A phase input) Clock input D TCLKD Input External clock D input pin (Channel 2 and 4 phase counting mode B phase input) Input capture/out TIOCA0 compare match A0 I/O TGR0A input capture input/output compare output/PWM output pin Input capture/out TIOCB0 compare match B0 I/O TGR0B input capture input/output compare output/PWM output pin Input capture/out TIOCC0 compare match C0 I/O TGR0C input capture input/output compare output/PWM output pin Input capture/out TIOCD0 compare match D0 I/O TGR0D input capture input/output compare output/PWM output pin Input capture/out TIOCA1 compare match A1 I/O TGR1A input capture input/output compare output/PWM output pin Input capture/out TIOCB1 compare match B1 I/O TGR1B input capture input/output compare output/PWM output pin Input capture/out TIOCA2 compare match A2 I/O TGR2A input capture input/output compare output/PWM output pin Input capture/out TIOCB2 compare match B2 I/O TGR2B input capture input/output compare output/PWM output pin 0 1 2 Rev. 4.0, 03/03, page 434 of 1358 Channel Name Symbol I/O Function 3 Input capture/out TIOCA3 compare match A3 I/O TGR3A input capture input/output compare output/PWM output pin Input capture/out TIOCB3 compare match B3 I/O TGR3B input capture input/output compare output/PWM output pin Input capture/out TIOCC3 compare match C3 I/O TGR3C input capture input/output compare output/PWM output pin Input capture/out TIOCD3 compare match D3 I/O TGR3D input capture input/output compare output/PWM output pin Input capture/out TIOCA4 compare match A4 I/O TGR4A input capture input/output compare output/PWM output pin Input capture/out TIOCB4 compare match B4 I/O TGR4B input capture input/output compare output/PWM output pin Input capture/out TIOCA5 compare match A5 I/O TGR5A input capture input/output compare output/PWM output pin Input capture/out TIOCB5 compare match B5 I/O TGR5B input capture input/output compare output/PWM output pin 4 5 Rev. 4.0, 03/03, page 435 of 1358 10.1.4 Register Configuration Table 10-3 summarizes the TPU registers. Table 10-3 TPU Registers Channel Name 0 Abbreviation 1 Address* TCR0 R/W H'00 H'FFD0 Timer mode register 0 TMDR0 R/W H'C0 H'FFD1 Timer I/O control register 0H TIOR0H R/W H'00 H'FFD2 Timer I/O control register 0L TIOR0L R/W H'00 H'FFD3 H'FFD4 Timer status register 0 TSR0 H'40 2 * R/(W) H'C0 Timer counter 0 TCNT0 R/W H'0000 H'FFD6 Timer general register 0A TGR0A R/W H'FFFF H'FFD8 Timer general register 0B TGR0B R/W H'FFFF H'FFDA Timer general register 0C TGR0C R/W H'FFFF H'FFDC Timer general register 0D TGR0D R/W H'FFFF H'FFDE R/W H'FFD5 Timer control register 1 TCR1 R/W H'00 H'FFE0 Timer mode register 1 TMDR1 R/W H'C0 H'FFE1 Timer I/O control register 1 TIOR1 R/W H'00 H'FFE2 Timer interrupt enable register 1 TIER1 R/W H'40 2 * R/(W) H'C0 H'FFE4 Timer status register 1 2 Initial Value Timer control register 0 Timer interrupt enable register 0 TIER0 1 R/W TSR1 H'FFE5 Timer counter 1 TCNT1 R/W H'0000 H'FFE6 Timer general register 1A TGR1A R/W H'FFFF H'FFE8 Timer general register 1B TGR1B R/W H'FFFF H'FFEA Timer control register 2 TCR2 R/W H'00 H'FFF0 Timer mode register 2 TMDR2 R/W H'C0 H'FFF1 Timer I/O control register 2 TIOR2 R/W H'00 H'FFF2 Timer interrupt enable register 2 TIER2 R/W H'40 H'FFF4 H'C0 H'FFF5 *2 Timer status register 2 TSR2 R/(W) Timer counter 2 TCNT2 R/W H'0000 H'FFF6 Timer general register 2A TGR2A R/W H'FFFF H'FFF8 Timer general register 2B TGR2B R/W H'FFFF H'FFFA Rev. 4.0, 03/03, page 436 of 1358 1 Channel Name Abbreviation R/W Initial Value Address* 3 Timer control register 3 TCR3 R/W H'00 H'FE80 Timer mode register 3 TMDR3 R/W H'C0 H'FE81 Timer I/O control register 3H TIOR3H R/W H'00 H'FE82 Timer I/O control register 3L TIOR3L R/W H'00 H'FE83 H'FE84 H'FE86 Timer interrupt enable register 3 TIER3 4 5 All R/W Timer status register 3 TSR3 H'40 2 * R/(W) H'C0 Timer counter 3 TCNT3 R/W Timer general register 3A TGR3A R/W H'FFFF H'FE88 Timer general register 3B TGR3B R/W H'FFFF H'FE8A Timer general register 3C TGR3C R/W H'FFFF H'FE8C Timer general register 3D TGR3D R/W H'FFFF H'FE8E Timer control register 4 TCR4 R/W H'00 H'FE90 H'0000 H'FE85 Timer mode register 4 TMDR4 R/W H'C0 H'FE91 Timer I/O control register 4 TIOR4 R/W H'00 H'FE92 Timer interrupt enable register 4 TIER4 R/W H'40 H'FE94 H'C0 H'FE95 H'0000 H'FE96 *2 Timer status register 4 TSR4 R/(W) Timer counter 4 TCNT4 R/W Timer general register 4A TGR4A R/W H'FFFF H'FE98 Timer general register 4B TGR4B R/W H'FFFF H'FE9A Timer control register 5 TCR5 R/W H'00 H'FEA0 Timer mode register 5 TMDR5 R/W H'C0 H'FEA1 Timer I/O control register 5 TIOR5 R/W H'00 H'FEA2 Timer interrupt enable register 5 TIER5 R/W H'FEA4 Timer status register 5 TSR5 H'40 2 * R/(W) H'C0 Timer counter 5 TCNT5 R/W H'0000 H'FEA6 Timer general register 5A TGR5A R/W H'FFFF H'FEA8 Timer general register 5B TGR5B R/W H'FFFF H'FEAA Timer start register TSTR R/W H'00 H'FFC0 H'FEA5 Timer synchro register TSYR R/W H'00 H'FFC1 Module stop control register MSTPCR R/W H'3FFF H'FF3C Notes: *1 Lower 16 bits of the address. *2 Can only be written with 0 for flag clearing. Rev. 4.0, 03/03, page 437 of 1358 10.2 Register Descriptions 10.2.1 Timer Control Registers (TCR) Channel 0: TCR0 Channel 3: TCR3 Bit : 7 6 5 4 3 2 1 0 CCLR2 CCLR1 CCLR0 CKEG1 CKEG0 TPSC2 TPSC1 TPSC0 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W 7 6 5 4 3 2 1 0 Initial value : R/W : Channel 1: TCR1 Channel 2: TCR2 Channel 4: TCR4 Channel 5: TCR5 Bit : -- CCLR1 CCLR0 CKEG1 CKEG0 TPSC2 TPSC1 TPSC0 Initial value : 0 0 0 0 0 0 0 0 R/W -- R/W R/W R/W R/W R/W R/W R/W : The TCR registers are 8-bit registers that control the TCNT channels. The TPU has six TCR registers, one for each of channels 0 to 5. The TCR registers are initialized to H'00 by a reset and in hardware standby mode. TCR register settings should be made only when TCNT operation is stopped. Rev. 4.0, 03/03, page 438 of 1358 Bits 7 to 5--Counter Clear 2 to 0 (CCLR2 to CCLR0): These bits select the TCNT counter clearing source. Channel Bit 7 CCLR2 Bit 6 CCLR1 0, 3 0 0 1 1 0 1 Bit 5 CCLR0 Description 0 TCNT clearing disabled 1 TCNT cleared by TGRA compare match/input capture (Initial value) 0 TCNT cleared by TGRB compare match/input capture 1 TCNT cleared by counter clearing for another channel performing synchronous clearing/ 1 synchronous operation * 0 TCNT clearing disabled 1 TCNT cleared by TGRC compare match/input 2 capture * 0 TCNT cleared by TGRD compare match/input 2 capture * 1 TCNT cleared by counter clearing for another channel performing synchronous clearing/ 1 synchronous operation * Channel Bit 7 Bit 6 3 Reserved* CCLR1 Bit 5 CCLR0 Description 1, 2, 4, 5 0 0 TCNT clearing disabled 1 TCNT cleared by TGRA compare match/input capture 0 TCNT cleared by TGRB compare match/input capture 1 TCNT cleared by counter clearing for another channel performing synchronous clearing/ 1 synchronous operation * 0 1 (Initial value) Notes: *1 Synchronous operation setting is performed by setting the SYNC bit in TSYR to 1. *2 When TGRC or TGRD is used as a buffer register, TCNT is not cleared because the buffer register setting has priority, and compare match/input capture does not occur. *3 Bit 7 is reserved in channels 1, 2, 4, and 5. It is always read as 0 and cannot be modified. Rev. 4.0, 03/03, page 439 of 1358 Bits 4 and 3--Clock Edge 1 and 0 (CKEG1, CKEG0): These bits select the input clock edge. When the input clock is counted using both edges, the input clock period is halved (e.g. /4 both edges = /2 rising edge). If phase counting mode is used on channels 1, 2, 4, and 5, this setting is ignored and the phase counting mode setting has priority. Bit 4 CKEG1 Bit 3 CKEG0 Description 0 0 Count at rising edge 1 Count at falling edge -- Count at both edges 1 (Initial value) Note: Internal clock edge selection is valid when the input clock is /4 or slower. This setting is ignored if the input clock is /1, or when overflow/underflow of another channel is selected. Bits 2 to 0--Time Prescaler 2 to 0 (TPSC2 to TPSC0): These bits select the TCNT counter clock. The clock source can be selected independently for each channel. Table 10-4 shows the clock sources that can be set for each channel. Table 10-4 TPU Clock Sources Internal Clock Overflow/ Underflow on Another External Clock Channel /1 /4 /16 /64 /256 /1024 /4096 TCLKA TCLKB TCLKC TCLKD Channel 0 o o o o o o 1 o o o o o o 2 o o o o o o 3 o o o o 4 o o o o 5 o o o o o o o o o o Legend o: Setting Blank: No setting Rev. 4.0, 03/03, page 440 of 1358 o o o o o o o o o o o o Channel Bit 2 TPSC2 Bit 1 TPSC1 0 0 0 1 1 0 1 Bit 0 TPSC0 Description 0 Internal clock: counts on /1 1 Internal clock: counts on /4 0 Internal clock: counts on /16 1 Internal clock: counts on /64 0 External clock: counts on TCLKA pin input 1 External clock: counts on TCLKB pin input 0 External clock: counts on TCLKC pin input 1 External clock: counts on TCLKD pin input (Initial value) Channel Bit 2 TPSC2 Bit 1 TPSC1 Bit 0 TPSC0 Description 1 0 0 0 Internal clock: counts on /1 1 Internal clock: counts on /4 0 Internal clock: counts on /16 1 Internal clock: counts on /64 0 External clock: counts on TCLKA pin input 1 External clock: counts on TCLKB pin input 0 Internal clock: counts on /256 1 Counts on TCNT2 overflow/underflow 1 1 0 1 (Initial value) Note: This setting is ignored when channel 1 is in phase counting mode. Channel Bit 2 TPSC2 Bit 1 TPSC1 Bit 0 TPSC0 Description 2 0 0 0 Internal clock: counts on /1 1 Internal clock: counts on /4 0 Internal clock: counts on /16 1 Internal clock: counts on /64 0 External clock: counts on TCLKA pin input 1 External clock: counts on TCLKB pin input 0 External clock: counts on TCLKC pin input 1 Internal clock: counts on /1024 1 1 0 1 (Initial value) Note: This setting is ignored when channel 2 is in phase counting mode. Rev. 4.0, 03/03, page 441 of 1358 Channel Bit 2 TPSC2 Bit 1 TPSC1 3 0 0 1 1 0 1 Bit 0 TPSC0 Description 0 Internal clock: counts on /1 1 Internal clock: counts on /4 0 Internal clock: counts on /16 1 Internal clock: counts on /64 0 External clock: counts on TCLKA pin input 1 Internal clock: counts on /1024 0 Internal clock: counts on /256 1 Internal clock: counts on /4096 (Initial value) Channel Bit 2 TPSC2 Bit 1 TPSC1 Bit 0 TPSC0 Description 4 0 0 0 Internal clock: counts on /1 1 Internal clock: counts on /4 0 Internal clock: counts on /16 1 Internal clock: counts on /64 0 External clock: counts on TCLKA pin input 1 External clock: counts on TCLKC pin input 0 Internal clock: counts on /1024 1 Counts on TCNT5 overflow/underflow 1 1 0 1 (Initial value) Note: This setting is ignored when channel 4 is in phase counting mode. Channel Bit 2 TPSC2 Bit 1 TPSC1 Bit 0 TPSC0 Description 5 0 0 0 Internal clock: counts on /1 1 Internal clock: counts on /4 0 Internal clock: counts on /16 1 Internal clock: counts on /64 0 External clock: counts on TCLKA pin input 1 External clock: counts on TCLKC pin input 0 Internal clock: counts on /256 1 External clock: counts on TCLKD pin input 1 1 0 1 Note: This setting is ignored when channel 5 is in phase counting mode. Rev. 4.0, 03/03, page 442 of 1358 (Initial value) 10.2.2 Timer Mode Registers (TMDR) Channel 0: TMDR0 Channel 3: TMDR3 Bit : 7 6 5 4 3 2 1 0 -- -- BFB BFA MD3 MD2 MD1 MD0 Initial value : 1 1 0 0 0 0 0 0 R/W -- -- R/W R/W R/W R/W R/W R/W 7 6 5 4 3 2 1 0 -- -- -- -- MD3 MD2 MD1 MD0 : Channel 1: TMDR1 Channel 2: TMDR2 Channel 4: TMDR4 Channel 5: TMDR5 Bit : Initial value : 1 1 0 0 0 0 0 0 R/W -- -- -- -- R/W R/W R/W R/W : The TMDR registers are 8-bit readable/writable registers that are used to set the operating mode for each channel. The TPU has six TMDR registers, one for each channel. The TMDR registers are initialized to H'C0 by a reset and in hardware standby mode. TMDR register settings should be made only when TCNT operation is stopped. Bits 7 and 6--Reserved: These bits cannot be modified and are always read as 1. Bit 5--Buffer Operation B (BFB): Specifies whether TGRB is to operate in the normal way, or TGRB and TGRD are to be used together for buffer operation. When TGRD is used as a buffer register, TGRD input capture/output compare is not generated. In channels 1, 2, 4, and 5, which have no TGRD, bit 5 is reserved. It is always read as 0 and cannot be modified. Bit 5 BFB Description 0 TGRB operates normally 1 TGRB and TGRD used together for buffer operation (Initial value) Rev. 4.0, 03/03, page 443 of 1358 Bit 4--Buffer Operation A (BFA): Specifies whether TGRA is to operate in the normal way, or TGRA and TGRC are to be used together for buffer operation. When TGRC is used as a buffer register, TGRC input capture/output compare is not generated. In channels 1, 2, 4, and 5, which have no TGRC, bit 4 is reserved. It is always read as 0 and cannot be modified. Bit 4 BFA Description 0 TGRA operates normally 1 TGRA and TGRC used together for buffer operation (Initial value) Bits 3 to 0--Modes 3 to 0 (MD3 to MD0): These bits are used to set the timer operating mode. Bit 3 1 MD3* Bit 2 2 MD2* Bit 1 MD1 Bit 0 MD0 Description 0 0 0 0 Normal operation 1 Reserved 1 0 PWM mode 1 1 PWM mode 2 0 Phase counting mode 1 1 Phase counting mode 2 0 Phase counting mode 3 1 Phase counting mode 4 * -- 1 0 1 1 * * (Initial value) *: Don't care Notes: *1 MD3 is a reserved bit. In a write, it should always be written with 0. *2 Phase counting mode cannot be set for channels 0 and 3. For these channels, 0 should always be written to MD2. Rev. 4.0, 03/03, page 444 of 1358 10.2.3 Timer I/O Control Registers (TIOR) Channel 0: TIOR0H Channel 1: TIOR1 Channel 2: TIOR2 Channel 3: TIOR3H Channel 4: TIOR4 Channel 5: TIOR5 Bit : Initial value : R/W : 7 6 5 4 3 2 1 0 IOB3 IOB2 IOB1 IOB0 IOA3 IOA2 IOA1 IOA0 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W 7 6 5 4 3 2 1 0 IOD3 IOD2 IOD1 IOD0 IOC3 IOC2 IOC1 IOC0 Channel 0: TIOR0L Channel 3: TIOR3L Bit : Initial value : R/W : 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W Note: When TGRC or TGRD is designated for buffer operation, this setting is invalid and the register operates as a buffer register. The TIOR registers are 8-bit registers that control the TGR registers. The TPU has eight TIOR registers, two each for channels 0 and 3, and one each for channels 1, 2, 4, and 5. The TIOR registers are initialized to H'00 by a reset and in hardware standby mode. Care is required since TIOR is affected by the TMDR setting. The initial output specified by TIOR is valid when the counter is stopped (the CST bit in TSTR is cleared to 0). Note also that, in PWM mode 2, the output at the point at which the counter is cleared to 0 is specified. Rev. 4.0, 03/03, page 445 of 1358 Bits 7 to 4-- I/O Control B3 to B0 (IOB3 to IOB0) I/O Control D3 to D0 (IOD3 to IOD0): Bits IOB3 to IOB0 specify the function of TGRB. Bits IOD3 to IOD0 specify the function of TGRD. Channel Bit 7 Bit 6 Bit 5 Bit 4 IOB3 IOB2 IOB1 IOB0 0 0 0 0 0 1 0 1 Description TGR0B Output disabled is output Initial output is 0 compare output register 0 1 0 Output disabled 1 Initial output is 1 output 0 1 1 0 0 0 1 1 Note: 1 * * * 0 output at compare match 1 output at compare match Toggle output at compare match 1 1 (Initial value) 0 output at compare match 1 output at compare match Toggle output at compare match TGR0B is Capture input Input capture at rising edge source is input Input capture at falling edge TIOCB0 pin capture Input capture at both edges register Capture input Input capture at TCNT1 1 source is channel count-up/count-down* 1/count clock *: Don't care *1 When bits TPSC2 to TPSC0 in TCR1 are set to B'000 and /1 is used as the TCNT1 count clock, this setting is invalid and input capture is not generated. Rev. 4.0, 03/03, page 446 of 1358 Channel Bit 7 Bit 6 Bit 5 Bit 4 IOD3 IOD2 IOD1 IOD0 0 0 0 0 0 1 1 0 Description TGR0D Output disabled is output Initial output is 0 compare output register*2 0 1 0 Output disabled 1 Initial output is 1 output 0 1 1 0 0 0 1 1 1 * * * 1 output at compare match Toggle output at compare match 1 1 (Initial value) 0 output at compare match 0 output at compare match 1 output at compare match Toggle output at compare match Input capture at rising edge TGR0D is Capture input source is input Input capture at falling edge TIOCD0 pin capture 2 Input capture at both edges register* Capture input Input capture at TCNT1 1 source is channel count-up/count-down* 1/count clock *: Don't care Notes: *1 When bits TPSC2 to TPSC0 in TCR1 are set to B'000 and /1 is used as the TCNT1 count clock, this setting is invalid and input capture is not generated. *2 When the BFB bit in TMDR0 is set to 1 and TGR0D is used as a buffer register, this setting is invalid and input capture/output compare is not generated. Rev. 4.0, 03/03, page 447 of 1358 Channel Bit 7 Bit 6 Bit 5 Bit 4 IOB3 IOB2 IOB1 IOB0 1 0 0 0 0 1 1 0 Description TGR1B Output disabled is output Initial output is 0 compare output register 0 1 0 Output disabled 1 Initial output is 1 output 0 1 1 0 0 0 1 1 1 * * * 1 output at compare match Toggle output at compare match 1 1 (Initial value) 0 output at compare match 0 output at compare match 1 output at compare match Toggle output at compare match TGR1B is Capture input source is input TIOCB1 pin capture register Capture input source is TGR0C compare match/ input capture Input capture at rising edge Input capture at falling edge Input capture at both edges Input capture at generation of TGR0C compare match/input capture *: Don't care Channel Bit 7 Bit 6 Bit 5 Bit 4 IOB3 IOB2 IOB1 IOB0 2 0 0 0 0 1 1 0 Description TGR2B Output disabled is output Initial output is 0 compare output register 0 1 0 Output disabled 1 Initial output is 1 output 0 1 1 * 0 0 1 1 * 1 output at compare match Toggle output at compare match 1 1 (Initial value) 0 output at compare match 0 output at compare match 1 output at compare match Toggle output at compare match TGR2B is Capture input input source is capture TIOCB2 pin register Input capture at rising edge Input capture at falling edge Input capture at both edges *: Don't care Rev. 4.0, 03/03, page 448 of 1358 Channel Bit 7 Bit 6 Bit 5 Bit 4 IOB3 IOB2 IOB1 IOB0 3 0 0 0 0 1 1 0 Description TGR3B Output disabled is output Initial output is 0 compare output register 0 1 0 Output disabled 1 Initial output is 1 output 0 1 1 0 0 0 1 1 Note: 1 * * * 1 output at compare match Toggle output at compare match 1 1 (Initial value) 0 output at compare match 0 output at compare match 1 output at compare match Toggle output at compare match Input capture at rising edge TGR3B is Capture input source is input Input capture at falling edge TIOCB3 pin capture Input capture at both edges register Capture input Input capture at TCNT4 1 source is channel count-up/count-down* 4/count clock *: Don't care *1 When bits TPSC2 to TPSC0 in TCR4 are set to B'000 and /1 is used as the TCNT4 count clock, this setting is invalid and input capture is not generated. Rev. 4.0, 03/03, page 449 of 1358 Channel Bit 7 Bit 6 Bit 5 Bit 4 IOD3 IOD2 IOD1 IOD0 3 0 0 0 0 1 1 0 Description TGR3D Output disabled is output Initial output is 0 compare output register*2 0 1 0 Output disabled 1 Initial output is 1 output 0 1 1 0 0 0 1 1 1 * * * 1 output at compare match Toggle output at compare match 1 1 (Initial value) 0 output at compare match 0 output at compare match 1 output at compare match Toggle output at compare match Input capture at rising edge TGR3D is Capture input source is input Input capture at falling edge TIOCD3 pin capture 2 Input capture at both edges register* Capture input Input capture at TCNT4 1 source is channel count-up/count-down* 4/count clock *: Don't care Notes: *1 When bits TPSC2 to TPSC0 in TCR4 are set to B'000 and /1 is used as the TCNT4 count clock, this setting is invalid and input capture is not generated. *2 When the BFB bit in TMDR3 is set to 1 and TGR3D is used as a buffer register, this setting is invalid and input capture/output compare is not generated. Rev. 4.0, 03/03, page 450 of 1358 Channel Bit 7 Bit 6 Bit 5 Bit 4 IOB3 IOB2 IOB1 IOB0 4 0 0 0 0 1 1 0 Description TGR4B Output disabled is output Initial output is 0 compare output register 0 1 0 Output disabled 1 Initial output is 1 output 0 1 1 0 0 0 1 1 1 * * * 1 output at compare match Toggle output at compare match 1 1 (Initial value) 0 output at compare match 0 output at compare match 1 output at compare match Toggle output at compare match TGR4B is Capture input source is input TIOCB4 pin capture register Capture input source is TGR3C compare match/ input capture Input capture at rising edge Input capture at falling edge Input capture at both edges Input capture at generation of TGR3C compare match/ input capture *: Don't care Channel Bit 7 Bit 6 Bit 5 Bit 4 IOB3 IOB2 IOB1 IOB0 5 0 0 0 0 1 1 0 Description TGR5B Output disabled is output Initial output is 0 compare output register 0 1 0 Output disabled 1 Initial output is 1 output 0 1 1 * 0 0 1 1 * 0 output at compare match 1 output at compare match Toggle output at compare match 1 1 (Initial value) 0 output at compare match 1 output at compare match Toggle output at compare match TGR5B is input capture register Capture input source is TIOCB5 pin Input capture at rising edge Input capture at falling edge Input capture at both edges *: Don't care Rev. 4.0, 03/03, page 451 of 1358 Bits 3 to 0-- I/O Control A3 to A0 (IOA3 to IOA0) I/O Control C3 to C0 (IOC3 to IOC0): IOA3 to IOA0 specify the function of TGRA. IOC3 to IOC0 specify the function of TGRC. Channel Bit 3 Bit 2 Bit 1 Bit 0 IOA3 IOA2 IOA1 IOA0 0 0 0 0 0 1 0 1 Description TGR0A Output disabled is output Initial output is 0 compare output register 0 1 0 Output disabled 1 Initial output is 1 output 0 1 1 0 0 0 1 1 1 * * * 0 output at compare match 1 output at compare match Toggle output at compare match 1 1 (Initial value) 0 output at compare match 1 output at compare match Toggle output at compare match TGR0A is input capture register Capture input source is TIOCA0 pin Input capture at rising edge Input capture at falling edge Input capture at both edges Capture input Input capture at TCNT1 source is channel count-up/count-down 1/ count clock *: Don't care Rev. 4.0, 03/03, page 452 of 1358 Channel Bit 3 Bit 2 Bit 1 Bit 0 IOC3 IOC2 IOC1 IOC0 0 0 0 0 0 1 1 0 Description TGR0C Output disabled is output Initial output is 0 compare output register*1 0 1 0 Output disabled 1 Initial output is 1 output 0 1 1 0 0 0 1 1 Note: 1 * * * 1 output at compare match Toggle output at compare match 1 1 (Initial value) 0 output at compare match 0 output at compare match 1 output at compare match Toggle output at compare match TGR0C is Capture input source is input capture TIOCC0 pin 1 register* Input capture at rising edge Input capture at falling edge Input capture at both edges Capture input Input capture at TCNT1 source is channel count-up/count-down 1/count clock *: Don't care *1 When the BFA bit in TMDR0 is set to 1 and TGR0C is used as a buffer register, this setting is invalid and input capture/output compare is not generated. Rev. 4.0, 03/03, page 453 of 1358 Channel Bit 3 Bit 2 Bit 1 Bit 0 IOA3 IOA2 IOA1 IOA0 1 0 0 0 0 1 1 0 Description TGR1A Output disabled is output Initial output is 0 compare output register 0 1 0 Output disabled 1 Initial output is 1 output 0 1 1 0 0 0 1 1 1 * * * 1 output at compare match Toggle output at compare match 1 1 (Initial value) 0 output at compare match 0 output at compare match 1 output at compare match Toggle output at compare match TGR1A is Capture input source is input capture TIOCA1 pin register Capture input source is TGR0A compare match/ input capture Input capture at rising edge Input capture at falling edge Input capture at both edges Input capture at generation of channel 0/TGR0A compare match/input capture *: Don't care Channel Bit 3 Bit 2 Bit 1 Bit 0 IOA3 IOA2 IOA1 IOA0 2 0 0 0 0 1 1 0 Description TGR2A Output disabled is output Initial output is 0 compare output register 0 1 0 Output disabled 1 Initial output is 1 output 0 1 1 * 0 0 1 1 * 1 output at compare match Toggle output at compare match 1 1 (Initial value) 0 output at compare match 0 output at compare match 1 output at compare match Toggle output at compare match TGR2A is Capture input input source is capture TIOCA2 pin register Input capture at rising edge Input capture at falling edge Input capture at both edges *: Don't care Rev. 4.0, 03/03, page 454 of 1358 Channel Bit 3 Bit 2 Bit 1 Bit 0 IOA3 IOA2 IOA1 IOA0 3 0 0 0 0 1 1 0 Description TGR3A Output disabled is output Initial output is 0 compare output register 0 1 0 Output disabled 1 Initial output is 1 output 0 1 1 0 0 0 1 1 1 * * * 1 output at compare match Toggle output at compare match 1 1 (Initial value) 0 output at compare match 0 output at compare match 1 output at compare match Toggle output at compare match Input capture at rising edge TGR3A is Capture input source is input Input capture at falling edge capture TIOCA3 pin Input capture at both edges register Capture input Input capture at TCNT4 source is channel count-up/count-down 4/count clock *: Don't care Rev. 4.0, 03/03, page 455 of 1358 Channel Bit 3 Bit 2 Bit 1 Bit 0 IOC3 IOC2 IOC1 IOC0 3 0 0 0 0 1 1 0 Description TGR3C Output disabled is output Initial output is 0 compare output register*1 0 1 0 Output disabled 1 Initial output is 1 output 0 1 1 0 0 0 1 1 Note: 1 * * * 1 output at compare match Toggle output at compare match 1 1 (Initial value) 0 output at compare match 0 output at compare match 1 output at compare match Toggle output at compare match TGR3C is Capture input source is input capture TIOCC3 pin 1 register* Input capture at rising edge Input capture at falling edge Input capture at both edges Capture input Input capture at TCNT4 source is channel count-up/count-down 4/count clock *: Don't care *1 When the BFA bit in TMDR3 is set to 1 and TGR3C is used as a buffer register, this setting is invalid and input capture/output compare is not generated. Rev. 4.0, 03/03, page 456 of 1358 Channel Bit 3 Bit 2 Bit 1 Bit 0 IOA3 IOA2 IOA1 IOA0 4 0 0 0 0 1 1 0 Description TGR4A Output disabled is output Initial output is 0 compare output register 0 1 0 Output disabled 1 Initial output is 1 output 0 1 1 0 0 0 1 1 1 * * * 1 output at compare match Toggle output at compare match 1 1 (Initial value) 0 output at compare match 0 output at compare match 1 output at compare match Toggle output at compare match TGR4A is Capture input source is input capture TIOCA4 pin register Capture input source is TGR3A compare match/ input capture Input capture at rising edge Input capture at falling edge Input capture at both edges Input capture at generation of TGR3A compare match/input capture *: Don't care Channel Bit 3 Bit 2 Bit 1 Bit 0 IOA3 IOA2 IOA1 IOA0 5 0 0 0 0 1 1 0 Description TGR5A Output disabled is output Initial output is 0 compare output register 0 1 0 Output disabled 1 Initial output is 1 output 0 1 1 * 0 0 1 1 * 0 output at compare match 1 output at compare match Toggle output at compare match 1 1 (Initial value) 0 output at compare match 1 output at compare match Toggle output at compare match TGR4A is Capture input input source is capture TIOCA4 pin register Input capture at rising edge Input capture at falling edge Input capture at both edges *: Don't care Rev. 4.0, 03/03, page 457 of 1358 10.2.4 Timer Interrupt Enable Registers (TIER) Channel 0: TIER0 Channel 3: TIER3 Bit : Initial value : R/W : 7 6 5 4 3 2 1 0 TTGE -- -- TCIEV TGIED TGIEC TGIEB TGIEA 0 1 0 0 0 0 0 0 R/W -- -- R/W R/W R/W R/W R/W Channel 1: TIER1 Channel 2: TIER2 Channel 4: TIER4 Channel 5: TIER5 Bit : Initial value : R/W : 7 6 5 4 3 2 1 0 TTGE -- TCIEU TCIEV -- -- TGIEB TGIEA 0 1 0 0 0 0 0 0 R/W -- R/W R/W -- -- R/W R/W The TIER registers are 8-bit registers that control enabling or disabling of interrupt requests for each channel. The TPU has six TIER registers, one for each channel. The TIER registers are initialized to H'40 by a reset and in hardware standby mode. Bit 7--A/D Conversion Start Request Enable (TTGE): Enables or disables generation of A/D conversion start requests by TGRA input capture/compare match. Bit 7 TTGE Description 0 A/D conversion start request generation disabled 1 A/D conversion start request generation enabled Bit 6--Reserved: This bit cannot be modified and is always read as 1. Rev. 4.0, 03/03, page 458 of 1358 (Initial value) Bit 5--Underflow Interrupt Enable (TCIEU): Enables or disables interrupt requests (TCIU) by the TCFU bit when the TCFU bit in TSR is set to 1 in channels 1 and 2. In channels 0 and 3, bit 5 is reserved. It is always read as 0 and cannot be modified. Bit 5 TCIEU Description 0 Interrupt requests (TCIU) by TCFU disabled 1 Interrupt requests (TCIU) by TCFU enabled (Initial value) Bit 4--Overflow Interrupt Enable (TCIEV): Enables or disables interrupt requests (TCIV) by the TCFV bit when the TCFV bit in TSR is set to 1. Bit 4 TCIEV Description 0 Interrupt requests (TCIV) by TCFV disabled 1 Interrupt requests (TCIV) by TCFV enabled (Initial value) Bit 3--TGR Interrupt Enable D (TGIED): Enables or disables interrupt requests (TGID) by the TGFD bit when the TGFD bit in TSR is set to 1 in channels 0 and 3. In channels 1, 2, 4, and 5, bit 3 is reserved. It is always read as 0 and cannot be modified. Bit 3 TGIED Description 0 Interrupt requests (TGID) by TGFD disabled 1 Interrupt requests (TGID) by TGFD enabled (Initial value) Bit 2--TGR Interrupt Enable C (TGIEC): Enables or disables interrupt requests (TGIC) by the TGFC bit when the TGFC bit in TSR is set to 1 in channels 0 and 3. In channels 1, 2, 4, and 5, bit 2 is reserved. It is always read as 0 and cannot be modified. Bit 2 TGIEC Description 0 Interrupt requests (TGIC) by TGFC disabled 1 Interrupt requests (TGIC) by TGFC enabled (Initial value) Rev. 4.0, 03/03, page 459 of 1358 Bit 1--TGR Interrupt Enable B (TGIEB): Enables or disables interrupt requests (TGIB) by the TGFB bit when the TGFB bit in TSR is set to 1. Bit 1 TGIEB Description 0 Interrupt requests (TGIB) by TGFB disabled 1 Interrupt requests (TGIB) by TGFB enabled (Initial value) Bit 0--TGR Interrupt Enable A (TGIEA): Enables or disables interrupt requests (TGIA) by the TGFA bit when the TGFA bit in TSR is set to 1. Bit 0 TGIEA Description 0 Interrupt requests (TGIA) by TGFA disabled 1 Interrupt requests (TGIA) by TGFA enabled 10.2.5 (Initial value) Timer Status Registers (TSR) Channel 0: TSR0 Channel 3: TSR3 Bit : 7 6 5 4 3 2 1 0 -- -- -- TCFV TGFD TGFC TGFB TGFA 1 1 0 0 0 0 0 0 -- R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* Initial value : R/W : -- -- Note: * Only 0 can be written, to clear the flag. Channel 1: TSR1 Channel 2: TSR2 Channel 4: TSR4 Channel 5: TSR5 Bit : 7 6 5 4 3 2 1 0 TCFD -- TCFU TCFV -- -- TGFB TGFA Initial value : 1 1 0 0 0 0 0 0 R/W R -- R/(W)* R/(W)* -- -- R/(W)* R/(W)* : Note: * Only 0 can be written, to clear the flag. Rev. 4.0, 03/03, page 460 of 1358 The TSR registers are 8-bit registers that indicate the status of each channel. The TPU has six TSR registers, one for each channel. The TSR registers are initialized to H'C0 by a reset and in hardware standby mode. Bit 7--Count Direction Flag (TCFD): Status flag that shows the direction in which TCNT counts in channels 1, 2, 4, and 5. In channels 0 and 3, bit 7 is reserved. It is always read as 1 and cannot be modified. Bit 7 TCFD Description 0 TCNT counts down 1 TCNT counts up (Initial value) Bit 6--Reserved: This bit cannot be modified and is always read as 1. Bit 5--Underflow Flag (TCFU): Status flag that indicates that TCNT underflow has occurred when channels 1, 2, 4, and 5 are set to phase counting mode. In channels 0 and 3, bit 5 is reserved. It is always read as 0 and cannot be modified. Bit 5 TCFU Description 0 [Clearing condition] When 0 is written to TCFU after reading TCFU = 1 (Initial value) 1 [Setting condition] When the TCNT value underflows (changes from H'0000 to H'FFFF) Bit 4--Overflow Flag (TCFV): Status flag that indicates that TCNT overflow has occurred. Bit 4 TCFV Description 0 [Clearing condition] (Initial value) When 0 is written to TCFV after reading TCFV = 1 1 [Setting condition] When the TCNT value overflows (changes from H'FFFF to H'0000 ) Rev. 4.0, 03/03, page 461 of 1358 Bit 3--Input Capture/Output Compare Flag D (TGFD): Status flag that indicates the occurrence of TGRD input capture or compare match in channels 0 and 3. In channels 1, 2, 4, and 5, bit 3 is reserved. It is always read as 0 and cannot be modified. Bit 3 TGFD Description 0 [Clearing conditions] (Initial value) * When DTC is activated by TGID interrupt while DISEL bit of MRB in DTC is 0 * When 0 is written to TGFD after reading TGFD = 1 1 [Setting conditions] * When TCNT = TGRD while TGRD is functioning as output compare register * When TCNT value is transferred to TGRD by input capture signal while TGRD is functioning as input capture register Bit 2--Input Capture/Output Compare Flag C (TGFC): Status flag that indicates the occurrence of TGRC input capture or compare match in channels 0 and 3. In channels 1, 2, 4, and 5, bit 2 is reserved. It is always read as 0 and cannot be modified. Bit 2 TGFC Description 0 [Clearing conditions] (Initial value) * When DTC is activated by TGIC interrupt while DISEL bit of MRB in DTC is 0 * When 0 is written to TGFC after reading TGFC = 1 1 [Setting conditions] * When TCNT = TGRC while TGRC is functioning as output compare register * When TCNT value is transferred to TGRC by input capture signal while TGRC is functioning as input capture register Rev. 4.0, 03/03, page 462 of 1358 Bit 1--Input Capture/Output Compare Flag B (TGFB): Status flag that indicates the occurrence of TGRB input capture or compare match. Bit 1 TGFB Description 0 [Clearing conditions] (Initial value) * When DTC is activated by TGIB interrupt while DISEL bit of MRB in DTC is 0 * When 0 is written to TGFB after reading TGFB = 1 1 [Setting conditions] * When TCNT = TGRB while TGRB is functioning as output compare register * When TCNT value is transferred to TGRB by input capture signal while TGRB is functioning as input capture register Bit 0--Input Capture/Output Compare Flag A (TGFA): Status flag that indicates the occurrence of TGRA input capture or compare match. Bit 0 TGFA Description 0 [Clearing conditions] (Initial value) * When DTC is activated by TGIA interrupt while DISEL bit of MRB in DTC is 0 * When DMAC* is activated by TGIA interrupt while DTA bit of DMABCR in DMAC* is 1 * When 0 is written to TGFA after reading TGFA = 1 1 [Setting conditions] * When TCNT = TGRA while TGRA is functioning as output compare register * When TCNT value is transferred to TGRA by input capture signal while TGRA is functioning as input capture register Note: * The DMAC is not supported in the H8S/2321. Rev. 4.0, 03/03, page 463 of 1358 10.2.6 Timer Counters (TCNT) Channel 0: TCNT0 (up-counter) Channel 1: TCNT1 (up/down-counter*) Channel 2: TCNT2 (up/down-counter*) Channel 3: TCNT3 (up-counter) Channel 4: TCNT4 (up/down-counter*) Channel 5: TCNT5 (up/down-counter*) Bit : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Initial value : 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R/W : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Note: * These counters can be used as up/down-counters only in phase counting mode or when counting overflow/underflow on another channel. In other cases they function as upcounters. The TCNT registers are 16-bit counters. The TPU has six TCNT counters, one for each channel. The TCNT counters are initialized to H'0000 by a reset and in hardware standby mode. The TCNT counters cannot be accessed in 8-bit units; they must always be accessed as a 16-bit unit. 10.2.7 Bit Timer General Registers (TGR) : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Initial value : 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 R/W : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W The TGR registers are 16-bit registers with a dual function as output compare and input capture registers. The TPU has 16 TGR registers, four each for channels 0 and 3 and two each for channels 1, 2, 4, and 5. TGRC and TGRD for channels 0 and 3 can also be designated for operation as buffer registers*. The TGR registers are initialized to H'FFFF by a reset and in hardware standby mode. The TGR registers cannot be accessed in 8-bit units; they must always be accessed as a 16-bit unit. Note: * TGR buffer register combinations are TGRA--TGRC and TGRB--TGRD. Rev. 4.0, 03/03, page 464 of 1358 10.2.8 Bit Timer Start Register (TSTR) : 7 6 5 4 3 2 1 0 -- -- CST5 CST4 CST3 CST2 CST1 CST0 Initial value : 0 0 0 0 0 0 0 0 R/W -- -- R/W R/W R/W R/W R/W R/W : TSTR is an 8-bit readable/writable register that selects operation/stoppage for channels 0 to 5. TSTR is initialized to H'00 by a reset, and in hardware standby mode. When setting the operating mode in TMDR or setting the count clock in TCR, first stop the TCNT counter. Bits 7 and 6--Reserved: Must always be written with 0. Bits 5 to 0--Counter Start 5 to 0 (CST5 to CST0): These bits select operation or stoppage for TCNT. Bit n CSTn Description 0 TCNTn count operation is stopped 1 TCNTn performs count operation (Initial value) n = 5 to 0 Note: If 0 is written to the CST bit during operation with the TIOC pin designated for output, the counter stops but the TIOC pin output compare output level is retained. If TIOR is written to when the CST bit is cleared to 0, the pin output level will be changed to the set initial output value. 10.2.9 Bit Timer Synchro Register (TSYR) : 7 6 5 4 3 2 1 0 -- -- SYNC5 SYNC4 SYNC3 SYNC2 SYNC1 SYNC0 Initial value : 0 0 0 0 0 0 0 0 R/W -- -- R/W R/W R/W R/W R/W R/W : TSYR is an 8-bit readable/writable register that selects independent operation or synchronous operation for the channel 0 to 4 TCNT counters. A channel performs synchronous operation when the corresponding bit in TSYR is set to 1. TSYR is initialized to H'00 by a reset and in hardware standby mode. Bits 7 and 6--Reserved: Must always be written with 0. Rev. 4.0, 03/03, page 465 of 1358 Bits 5 to 0--Timer Synchro 5 to 0 (SYNC5 to SYNC0): These bits select whether operation is independent of or synchronized with other channels. When synchronous operation is selected, synchronous presetting of multiple channels*1, and synchronous clearing through counter clearing on another channel*2 are possible. Bit n SYNCn Description 0 TCNTn operates independently (TCNT presetting/clearing is unrelated to other channels) (Initial value) 1 TCNTn performs synchronous operation TCNT synchronous presetting/synchronous clearing is possible n = 5 to 0 Notes: *1 To set synchronous operation, the SYNC bits for at least two channels must be set to 1. *2 To set synchronous clearing, in addition to the SYNC bit , the TCNT clearing source must also be set by means of bits CCLR2 to CCLR0 in TCR. 10.2.10 Module Stop Control Register (MSTPCR) MSTPCRH Bit MSTPCRL : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Initial value : 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 R/W : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W MSTPCR is a 16-bit readable/writable register that performs module stop mode control. When the MSTP13 bit in MSTPCR is set to 1, TPU operation stops at the end of the bus cycle and a transition is made to module stop mode. Registers cannot be read or written to in module stop mode. For details, see section 21.5, Module Stop Mode. MSTPCR is initialized to H'3FFF by a reset and in hardware standby mode. It is not initialized in software standby mode. Bit 13--Module Stop (MSTP13): Specifies the TPU module stop mode. Bit 13 MSTP13 Description 0 TPU module stop mode cleared 1 TPU module stop mode set Rev. 4.0, 03/03, page 466 of 1358 (Initial value) 10.3 Interface to Bus Master 10.3.1 16-Bit Registers TCNT and TGR are 16-bit registers. As the data bus to the bus master is 16 bits wide, these registers can be read and written to in 16-bit units. These registers cannot be read or written to in 8-bit units; 16-bit access must always be used. An example of 16-bit register access operation is shown in figure 10-2. Internal data bus H Bus master L Module data bus Bus interface TCNTH TCNTL Figure 10-2 16-Bit Register Access Operation [Bus Master TCNT (16 Bits)] 10.3.2 8-Bit Registers Registers other than TCNT and TGR are 8-bit. As the data bus to the CPU is 16 bits wide, these registers can be read and written to in 16-bit units. They can also be read and written to in 8-bit units. Rev. 4.0, 03/03, page 467 of 1358 Examples of 8-bit register access operation are shown in figures 10-3 to 10-5. Internal data bus H Bus master L Module data bus Bus interface TCR Figure 10-3 8-Bit Register Access Operation [Bus Master TCR (Upper 8 Bits)] Internal data bus H Bus master L Module data bus Bus interface TMDR Figure 10-4 8-Bit Register Access Operation [Bus Master TMDR (Lower 8 Bits)] Internal data bus H Bus master L Module data bus Bus interface TCR TMDR Figure 10-5 8-Bit Register Access Operation [Bus Master TCR and TMDR (16 Bits)] Rev. 4.0, 03/03, page 468 of 1358 10.4 Operation 10.4.1 Overview Operation in each mode is outlined below. Normal Operation: Each channel has a TCNT and TGR register. TCNT performs up-counting, and is also capable of free-running operation, synchronous counting, and external event counting. Each TGR can be used as an input capture register or output compare register. Synchronous Operation: When synchronous operation is designated for a channel, TCNT for that channel performs synchronous presetting. That is, when TCNT for a channel designated for synchronous operation is rewritten, the TCNT counters for the other channels are also rewritten at the same time. Synchronous clearing of the TCNT counters is also possible by setting the timer synchronization bits in TSYR for channels designated for synchronous operation. Buffer Operation * When TGR is an output compare register When a compare match occurs, the value in the buffer register for the relevant channel is transferred to TGR. * When TGR is an input capture register When input capture occurs, the value in TCNT is transferred to TGR and the value previously held in TGR is transferred to the buffer register. Cascaded Operation: The channel 1 counter (TCNT1) and channel 2 counter (TCNT2), or the channel 4 counter (TCNT4) and channel 5 counter (TCNT5), can be connected together to operate as a 32-bit counter. PWM Mode: In this mode, a PWM waveform is output. The output level can be set by means of TIOR. A PWM waveform with a duty of between 0% and 100% can be output, according to the setting of each TGR register. Phase Counting Mode: In this mode, TCNT is incremented or decremented by detecting the phases of two clocks input from the external clock input pins in channels 1, 2, 4, and 5. When phase counting mode is set, the corresponding TCLK pin functions as the clock pin, and TCNT performs up/down-counting. This can be used for two-phase encoder pulse input. Rev. 4.0, 03/03, page 469 of 1358 10.4.2 Basic Functions Counter Operation: When one of bits CST0 to CST5 is set to 1 in TSTR, the TCNT counter for the corresponding channel starts counting. TCNT can operate as a free-running counter, periodic counter, and so on. * Example of count operation setting procedure Figure 10-6 shows an example of the count operation setting procedure. [1] Select the counter clock with bits TPSC2 to TPSC0 in TCR. At the same time, select the input clock edge with bits CKEG1 and CKEG0 in TCR. Operation selection Select counter clock [1] Periodic counter Select counter clearing source [2] Select output compare register [3] Set period [4] Start count [5] <Periodic counter> [2] For periodic counter operation, select the TGR to be used as the TCNT clearing source with bits CCLR2 to CCLR0 in TCR. Free-running counter [3] Designate the TGR selected in [2] as an output compare register by means of TIOR. [4] Set the periodic counter cycle in the TGR selected in [2]. Start count <Free-running counter> [5] [5] Set the CST bit in TSTR to 1 to start the counter operation. Figure 10-6 Example of Counter Operation Setting Procedure Rev. 4.0, 03/03, page 470 of 1358 * Free-running count operation and periodic count operation Immediately after a reset, the TPU's TCNT counters are all designated as free-running counters. When the relevant bit in TSTR is set to 1 the corresponding TCNT counter starts upcount operation as a free-running counter. When TCNT overflows (from H'FFFF to H'0000), the TCFV bit in TSR is set to 1. If the value of the corresponding TCIEV bit in TIER is 1 at this point, the TPU requests an interrupt. After overflow, TCNT starts counting up again from H'0000. Figure 10-7 illustrates free-running counter operation. TCNT value H'FFFF H'0000 Time CST bit TCFV Figure 10-7 Free-Running Counter Operation When compare match is selected as the TCNT clearing source, the TCNT counter for the relevant channel performs periodic count operation. The TGR register for setting the period is designated as an output compare register, and counter clearing by compare match is selected by means of bits CCLR2 to CCLR0 in TCR. After the settings have been made, TCNT starts upcount operation as a periodic counter when the corresponding bit in TSTR is set to 1. When the count value matches the value in TGR, the TGF bit in TSR is set to 1 and TCNT is cleared to H'0000. If the value of the corresponding TGIE bit in TIER is 1 at this point, the TPU requests an interrupt. After a compare match, TCNT starts counting up again from H'0000. Figure 10-8 illustrates periodic counter operation. Rev. 4.0, 03/03, page 471 of 1358 Counter cleared by TGR compare match TCNT value TGR H'0000 Time CST bit Flag cleared by software or DTC/DMAC* activation TGF Note: * The DMAC is not supported in the H8S/2321. Figure 10-8 Periodic Counter Operation Waveform Output by Compare Match: The TPU can perform 0, 1, or toggle output from the corresponding output pin using compare match. * Example of setting procedure for waveform output by compare match Figure 10-9 shows an example of the setting procedure for waveform output by compare match Output selection Select waveform output mode [1] [1] Select initial value 0 output or 1 output, and compare match output value 0 output, 1 output, or toggle output, by means of TIOR. The set initial value is output at the TIOC pin until the first compare match occurs. [2] Set the timing for compare match generation in TGR. Set output timing [2] Start count [3] [3] Set the CST bit in TSTR to 1 to start the count operation. <Waveform output> Figure 10-9 Example of Setting Procedure for Waveform Output by Compare Match Rev. 4.0, 03/03, page 472 of 1358 * Examples of waveform output operation Figure 10-10 shows an example of 0 output/1 output. In this example TCNT has been designated as a free-running counter, and settings have been made so that 1 is output by compare match A, and 0 is output by compare match B. When the set level and the pin level coincide, the pin level does not change. TCNT value H'FFFF TGRA TGRB Time H'0000 No change No change 1 output TIOCA TIOCB No change No change 0 output Figure 10-10 Example of 0 Output/1 Output Operation Figure 10-11 shows an example of toggle output. In this example TCNT has been designated as a periodic counter (with counter clearing performed by compare match B), and settings have been made so that output is toggled by both compare match A and compare match B. TCNT value Counter cleared by TGRB compare match H'FFFF TGRB TGRA Time H'0000 Toggle output TIOCB Toggle output TIOCA Figure 10-11 Example of Toggle Output Operation Rev. 4.0, 03/03, page 473 of 1358 Input Capture Function: The TCNT value can be transferred to TGR on detection of the TIOC pin input edge. Rising edge, falling edge, or both edges can be selected as the detected edge. For channels 0, 1, 3, and 4, it is also possible to specify another channel's counter input clock or compare match signal as the input capture source. Note: When another channel's counter input clock is used as the input capture input for channels 0 and 3, /1 should not be selected as the counter input clock used for input capture input. Input capture will not be generated if /1 is selected. * Example of input capture operation setting procedure Figure 10-12 shows an example of the input capture operation setting procedure. [1] Designate TGR as an input capture register by means of TIOR, and select the input capture source and input signal edge (rising edge, falling edge, or both edges). Input selection Select input capture input [1] Start count [2] [2] Set the CST bit in TSTR to 1 to start the count operation. <Input capture operation> Figure 10-12 Example of Input Capture Operation Setting Procedure Rev. 4.0, 03/03, page 474 of 1358 * Example of input capture operation Figure 10-13 shows an example of input capture operation. In this example both rising and falling edges have been selected as the TIOCA pin input capture input edge, falling edge has been selected as the TIOCB pin input capture input edge, and counter clearing by TGRB input capture has been designated for TCNT. Counter cleared by TIOCB input (falling edge) TCNT value H'0180 H'0160 H'0010 H'0005 Time H'0000 TIOCA TGRA H'0005 H'0160 H'0010 TIOCB TGRB H'0180 Figure 10-13 Example of Input Capture Operation Rev. 4.0, 03/03, page 475 of 1358 10.4.3 Synchronous Operation In synchronous operation, the values in a number of TCNT counters can be rewritten simultaneously (synchronous presetting). Also, a number of TCNT counters can be cleared simultaneously by making the appropriate setting in TCR (synchronous clearing). Synchronous operation enables TGR to be incremented with respect to a single time base. Channels 0 to 5 can all be designated for synchronous operation. Example of Synchronous Operation Setting Procedure: Figure 10-14 shows an example of the synchronous operation setting procedure. Synchronous operation selection Set synchronous operation [1] Synchronous presetting Set TCNT Synchronous clearing [2] Clearing source generation channel? No Yes <Synchronous presetting> Select counter clearing source [3] Set synchronous counter clearing [4] Start count [5] Start count [5] <Counter clearing> <Synchronous clearing> [1] Set to 1 the SYNC bits in TSYR corresponding to the channels to be designated for synchronous operation. [2] When the TCNT counter of any of the channels designated for synchronous operation is written to, the same value is simultaneously written to the other TCNT counters. [3] Use bits CCLR2 to CCLR0 in TCR to specify TCNT clearing by input capture/output compare, etc. [4] Use bits CCLR2 to CCLR0 in TCR to designate synchronous clearing for the counter clearing source. [5] Set to 1 the CST bits in TSTR for the relevant channels, to start the count operation. Figure 10-14 Example of Synchronous Operation Setting Procedure Rev. 4.0, 03/03, page 476 of 1358 Example of Synchronous Operation: Figure 10-15 shows an example of synchronous operation. In this example, synchronous operation and PWM mode 1 have been designated for channels 0 to 2, TGR0B compare match has been set as the channel 0 counter clearing source, and synchronous clearing has been set for the channel 1 and 2 counter clearing source. Three-phase PWM waveforms are output from pins TIOC0A, TIOC1A, and TIOC2A. At this time, synchronous presetting, and synchronous clearing by TGR0B compare match, is performed for channel 0 to 2 TCNT counters, and the data set in TGR0B is used as the PWM cycle. For details of PWM modes, see section 10.4.6, PWM Modes. Synchronous clearing by TGR0B compare match TCNT0 to TCNT2 values TGR0B TGR1B TGR0A TGR2B TGR1A TGR2A Time H'0000 TIOC0A TIOC1A TIOC2A Figure 10-15 Example of Synchronous Operation Rev. 4.0, 03/03, page 477 of 1358 10.4.4 Buffer Operation Buffer operation, provided for channels 0 and 3, enables TGRC and TGRD to be used as buffer registers. Buffer operation differs depending on whether TGR has been designated as an input capture register or as a compare match register. Table 10-5 shows the register combinations used in buffer operation. Table 10-5 Register Combinations in Buffer Operation Channel Timer General Register Buffer Register 0 TGR0A TGR0C TGR0B TGR0D TGR3A TGR3C TGR3B TGR3D 3 * When TGR is an output compare register When a compare match occurs, the value in the buffer register for the corresponding channel is transferred to the timer general register. This operation is illustrated in figure 10-16. Compare match signal Timer general register Buffer register Comparator Figure 10-16 Compare Match Buffer Operation Rev. 4.0, 03/03, page 478 of 1358 TCNT * When TGR is an input capture register When input capture occurs, the value in TCNT is transferred to TGR and the value previously held in the timer general register is transferred to the buffer register. This operation is illustrated in figure 10-17. Input capture signal Timer general register Buffer register TCNT Figure 10-17 Input Capture Buffer Operation Example of Buffer Operation Setting Procedure: Figure 10-18 shows an example of the buffer operation setting procedure. [1] Designate TGR as an input capture register or output compare register by means of TIOR. Buffer operation [1] [2] Designate TGR for buffer operation with bits BFA and BFB in TMDR. Set buffer operation [2] [3] Set the CST bit in TSTR to 1 to start the count operation. Start count [3] Select TGR function <Buffer operation> Figure 10-18 Example of Buffer Operation Setting Procedure Rev. 4.0, 03/03, page 479 of 1358 Examples of Buffer Operation * When TGR is an output compare register Figure 10-19 shows an operation example in which PWM mode 1 has been designated for channel 0, and buffer operation has been designated for TGRA and TGRC. The settings used in this example are TCNT clearing by compare match B, 1 output at compare match A, and 0 output at compare match B. As buffer operation has been set, when compare match A occurs the output changes and the value in buffer register TGRC is simultaneously transferred to timer general register TGRA. This operation is repeated each time compare match A occurs. For details of PWM modes, see section 10.4.6, PWM Modes. TCNT value TGR0B H'0520 H'0450 H'0200 TGR0A Time H'0000 H'0450 TGR0C H'0200 H'0520 Transfer TGR0A H'0200 H'0450 TIOCA Figure 10-19 Example of Buffer Operation (1) Rev. 4.0, 03/03, page 480 of 1358 * When TGR is an input capture register Figure 10-20 shows an operation example in which TGRA has been designated as an input capture register, and buffer operation has been designated for TGRA and TGRC. Counter clearing by TGRA input capture has been set for TCNT, and both rising and falling edges have been selected as the TIOCA pin input capture input edge. As buffer operation has been set, when the TCNT value is stored in TGRA upon occurrence of input capture A, the value previously stored in TGRA is simultaneously transferred to TGRC. TCNT value H'0F07 H'09FB H'0532 H'0000 Time TIOCA TGRA TGRC H'0532 H'0F07 H'09FB H'0532 H'0F07 Figure 10-20 Example of Buffer Operation (2) Rev. 4.0, 03/03, page 481 of 1358 10.4.5 Cascaded Operation In cascaded operation, two 16-bit counters for different channels are used together as a 32-bit counter. This function works by counting the channel 1 (channel 4) counter clock upon overflow/underflow of TCNT2 (TCNT5) as set in bits TPSC2 to TPSC0 in TCR. Underflow occurs only when the lower 16-bit TCNT is in phase-counting mode. Table 10-6 shows the register combinations used in cascaded operation. Note: When phase counting mode is set for channel 1 or 4, the counter clock setting is invalid and the counter operates independently in phase counting mode. Table 10-6 Cascaded Combinations Combination Upper 16 Bits Lower 16 Bits Channels 1 and 2 TCNT1 TCNT2 Channels 4 and 5 TCNT4 TCNT5 Example of Cascaded Operation Setting Procedure: Figure 10-21 shows an example of the setting procedure for cascaded operation. [1] Set bits TPSC2 to TPSC0 in the channel 1 (channel 4) TCR to B'111 to select TCNT2 (TCNT5) overflow/underflow counting. Cascaded operation Set cascading [1] Start count [2] [2] Set the CST bit in TSTR for the upper and lower channel to 1 to start the count operation. <Cascaded operation> Figure 10-21 Cascaded Operation Setting Procedure Rev. 4.0, 03/03, page 482 of 1358 Examples of Cascaded Operation: Figure 10-22 illustrates the operation when counting upon TCNT2 overflow/underflow has been set for TCNT1, TGR1A, and TGR2A have been designated as input capture registers, and TIOC pin rising edge has been selected. When a rising edge is input to the TIOCA1 and TIOCA2 pins simultaneously, the upper 16 bits of the 32-bit data are transferred to TGR1A, and the lower 16 bits to TGR2A. TCNT1 clock TCNT1 H'03A1 H'03A2 TCNT2 clock TCNT2 H'FFFF H'0000 H'0001 TIOCA1, TIOCA2 TGR1A H'03A2 TGR2A H'0000 Figure 10-22 Example of Cascaded Operation (1) Figure 10-23 illustrates the operation when counting upon TCNT2 overflow/underflow has been set for TCNT1, and phase counting mode has been designated for channel 2. TCNT1 is incremented by TCNT2 overflow and decremented by TCNT2 underflow. TCLKC TCLKD TCNT2 TCNT1 FFFD FFFE 0000 FFFF 0000 0001 0002 0001 0001 0000 FFFF 0000 Figure 10-23 Example of Cascaded Operation (2) Rev. 4.0, 03/03, page 483 of 1358 10.4.6 PWM Modes In PWM mode, PWM waveforms are output from the output pins. 0, 1, or toggle output can be selected as the output level in response to compare match of each TGR. Designating TGR compare match as the counter clearing source enables the period to be set in that register. All channels can be designated for PWM mode independently. Synchronous operation is also possible. There are two PWM modes, as described below. * PWM mode 1 PWM output is generated from the TIOCA and TIOCC pins by pairing TGRA with TGRB and TGRC with TGRD. The output specified by bits IOA3 to IOA0 and IOC3 to IOC0 in TIOR is output from the TIOCA and TIOCC pins at compare matches A and C, and the output specified by bits IOB3 to IOB0 and IOD3 to IOD0 in TIOR is output at compare matches B and D. The initial output value is the value set in TGRA or TGRC. If the set values of paired TGRs are identical, the output value does not change when a compare match occurs. In PWM mode 1, a maximum 8-phase PWM output is possible. * PWM mode 2 PWM output is generated using one TGR as the period register and the others as duty registers. The output specified in TIOR is performed by means of compare matches. Upon counter clearing by a synchronization register compare match, the output value of each pin is the initial value set in TIOR. If the set values of the period and duty registers are identical, the output value does not change when a compare match occurs. In PWM mode 2, a maximum 15-phase PWM output is possible by combined use with synchronous operation. The correspondence between PWM output pins and registers is shown in table 10-7. Rev. 4.0, 03/03, page 484 of 1358 Table 10-7 PWM Output Registers and Output Pins Output Pins Channel Registers PWM Mode 1 PWM Mode 2 0 TGR0A TIOCA0 TIOCA0 TGR0B TGR0C TIOCB0 TIOCC0 TGR0D 1 TGR1A TIOCD0 TIOCA1 TGR1B 2 TGR2A TGR3A TIOCA2 TIOCA3 TGR4A 5 TGR5A TIOCC3 TIOCC3 TIOCD3 TIOCA4 TGR4B TGR5B TIOCA3 TIOCB3 TGR3D 4 TIOCA2 TIOCB2 TGR3B TGR3C TIOCA1 TIOCB1 TGR2B 3 TIOCC0 TIOCA4 TIOCB4 TIOCA5 TIOCA5 TIOCB5 Note: In PWM mode 2, PWM output is not possible for the TGR register in which the period is set. Rev. 4.0, 03/03, page 485 of 1358 Example of PWM Mode Setting Procedure: Figure 10-24 shows an example of the PWM mode setting procedure. PWM mode Select counter clock [1] [1] Select the counter clock with bits TPSC2 to TPSC0 in TCR. At the same time, select the input clock edge with bits CKEG1 and CKEG0 in TCR. [2] Use bits CCLR2 to CCLR0 in TCR to select the TGR to be used as the TCNT clearing source. Select counter clearing source Select waveform output level Set TGR [2] [3] [4] [3] Use TIOR to designate the TGR as an output compare register, and select the initial value and output value. [4] Set the period in the TGR selected in [2], and set the duty in the other TGR. [5] Select the PWM mode with bits MD3 to MD0 in TMDR. Set PWM mode [5] Start count [6] [6] Set the CST bit in TSTR to 1 to start the count operation. <PWM mode> Figure 10-24 Example of PWM Mode Setting Procedure Examples of PWM Mode Operation: Figure 10-25 shows an example of PWM mode 1 operation. In this example, TGRA compare match is set as the TCNT clearing source, 0 is set for the TGRA initial output value and output value, and 1 is set as the TGRB output value. In this case, the value set in TGRA is used as the period, and the value set in TGRB as the duty. Rev. 4.0, 03/03, page 486 of 1358 TCNT value TGRA Counter cleared by TGRA compare match TGRB H'0000 Time TIOCA Figure 10-25 Example of PWM Mode Operation (1) Figure 10-26 shows an example of PWM mode 2 operation. In this example, synchronous operation is designated for channels 0 and 1, TGR1B compare match is set as the TCNT clearing source, and 0 is set for the initial output value and 1 for the output value of the other TGR registers (TGR0A to TGR0D, TGR1A), to output a 5-phase PWM waveform. In this case, the value set in TGR1B is used as the period, and the values set in the other TGR registers as the duty. TCNT value Counter cleared by TGR1B compare match TGR1B TGR1A TGR0D TGR0C TGR0B TGR0A H'0000 Time TIOCA0 TIOCB0 TIOCC0 TIOCD0 TIOCA1 Figure 10-26 Example of PWM Mode Operation (2) Rev. 4.0, 03/03, page 487 of 1358 Figure 10-27 shows examples of PWM waveform output with 0% duty and 100% duty in PWM mode. TCNT value TGRB rewritten TGRA TGRB TGRB rewritten TGRB rewritten H'0000 Time 0% duty TIOCA Output does not change when period register and duty register compare matches occur simultaneously TCNT value TGRA TGRB rewritten TGRB rewritten TGRB rewritten TGRB H'0000 Time 100% duty TIOCA Output does not change when period register and duty register compare matches occur simultaneously TCNT value TGRA TGRB rewritten TGRB rewritten TGRB TGRB rewritten Time H'0000 100% duty TIOCA 0% duty Figure 10-27 Examples of PWM Mode Operation (3) Rev. 4.0, 03/03, page 488 of 1358 10.4.7 Phase Counting Mode In phase counting mode, the phase difference between two external clock inputs is detected and TCNT is incremented/decremented accordingly. This mode can be set for channels 1, 2, 4, and 5. When phase counting mode is set, an external clock is selected as the counter input clock and TCNT operates as an up/down-counter regardless of the setting of bits TPSC2 to TPSC0 and bits CKEG1 and CKEG0 in TCR. However, the functions of bits CCLR1 and CCLR0 in TCR, and of TIOR, TIER, and TGR are valid, and input capture/compare match and interrupt functions can be used. When overflow occurs while TCNT is counting up, the TCFV flag in TSR is set; when underflow occurs while TCNT is counting down, the TCFU flag is set. The TCFD bit in TSR is the count direction flag. Reading the TCFD flag provides an indication of whether TCNT is counting up or down. Table 10-8 shows the correspondence between external clock pins and channels. Table 10-8 Phase Counting Mode Clock Input Pins External Clock Pins Channels A-Phase B-Phase When channel 1 or 5 is set to phase counting mode TCLKA TCLKB When channel 2 or 4 is set to phase counting mode TCLKC TCLKD Example of Phase Counting Mode Setting Procedure: Figure 10-28 shows an example of the phase counting mode setting procedure. [1] Select phase counting mode with bits MD3 to MD0 in TMDR. Phase counting mode Select phase counting mode [1] Start count [2] [2] Set the CST bit in TSTR to 1 to start the count operation. <Phase counting mode> Figure 10-28 Example of Phase Counting Mode Setting Procedure Rev. 4.0, 03/03, page 489 of 1358 Examples of Phase Counting Mode Operation: In phase counting mode, TCNT counts up or down according to the phase difference between two external clocks. There are four modes, according to the count conditions. * Phase counting mode 1 Figure 10-29 shows an example of phase counting mode 1 operation, and table 10-9 summarizes the TCNT up/down-count conditions. TCLKA (channels 1 and 5) TCLKC (channels 2 and 4) TCLKB (channels 1 and 5) TCLKD (channels 2 and 4) TCNT value Up-count Down-count Time Figure 10-29 Example of Phase Counting Mode 1 Operation Table 10-9 Up/Down-Count Conditions in Phase Counting Mode 1 TCLKA (Channels 1 and 5) TCLKC (Channels 2 and 4) TCLKB (Channels 1 and 5) TCLKD (Channels 2 and 4) Operation Up-count High level Low level Low level High level High level Down-count Low level High level Low level Legend : Rising edge : Falling edge Rev. 4.0, 03/03, page 490 of 1358 * Phase counting mode 2 Figure 10-30 shows an example of phase counting mode 2 operation, and table 10-10 summarizes the TCNT up/down-count conditions. TCLKA (channels 1 and 5) TCLKC (channels 2 and 4) TCLKB (channels 1 and 5) TCLKD (channels 2 and 4) TCNT value Up-count Down-count Time Figure 10-30 Example of Phase Counting Mode 2 Operation Table 10-10 Up/Down-Count Conditions in Phase Counting Mode 2 TCLKA (Channels 1 and 5) TCLKC (Channels 2 and 4) TCLKB (Channels 1 and 5) TCLKD (Channels 2 and 4) Operation High level Don't care Low level Don't care Low level Don't care High level Up-count High level Don't care Low level Don't care High level Don't care Low level Down-count Legend : Rising edge : Falling edge Rev. 4.0, 03/03, page 491 of 1358 * Phase counting mode 3 Figure 10-31 shows an example of phase counting mode 3 operation, and table 10-11 summarizes the TCNT up/down-count conditions. TCLKA (channels 1 and 5) TCLKC (channels 2 and 4) TCLKB (channels 1 and 5) TCLKD (channels 2 and 4) TCNT value Up-count Down-count Time Figure 10-31 Example of Phase Counting Mode 3 Operation Table 10-11 Up/Down-Count Conditions in Phase Counting Mode 3 TCLKA (Channels 1 and 5) TCLKC (Channels 2 and 4) TCLKB (Channels 1 and 5) TCLKD (Channels 2 and 4) Operation High level Don't care Low level Don't care Low level High level Don't care Up-count High level Down-count Low level Don't care Legend : Rising edge : Falling edge Rev. 4.0, 03/03, page 492 of 1358 High level Don't care Low level Don't care * Phase counting mode 4 Figure 10-32 shows an example of phase counting mode 4 operation, and table 10-12 summarizes the TCNT up/down-count conditions. TCLKA (channels 1 and 5) TCLKC (channels 2 and 4) TCLKB (channels 1 and 5) TCLKD (channels 2 and 4) TCNT value Down-count Up-count Time Figure 10-32 Example of Phase Counting Mode 4 Operation Table 10-12 Up/Down-Count Conditions in Phase Counting Mode 4 TCLKA (Channels 1 and 5) TCLKC (Channels 2 and 4) TCLKB (Channels 1 and 5) TCLKD (Channels 2 and 4) Operation Up-count High level Low level Low level Don't care High level High level Down-count Low level High level Don't care Low level Legend : Rising edge : Falling edge Rev. 4.0, 03/03, page 493 of 1358 Phase Counting Mode Application Example: Figure 10-33 shows an example in which phase counting mode is designated for channel 1, and channel 1 is coupled with channel 0 to input servo motor 2-phase encoder pulses in order to detect the position or speed. Channel 1 is set to phase counting mode 1, and the encoder pulse A-phase and B-phase are input to TCLKA and TCLKB. Channel 0 operates with TCNT counter clearing by TGR0C compare match; TGR0A and TGR0C are used for the compare match function, and are set with the speed control period and position control period. TGR0B is used for input capture, with TGR0B and TGR0D operating in buffer mode. The channel 1 counter input clock is designated as the TGR0B input capture source, and detection of the pulse width of 2-phase encoder 4-multiplication pulses is performed. TGR1A and TGR1B for channel 1 are designated for input capture, channel 0 TGR0A and TGR0C compare matches are selected as the input capture source, and store the up/down-counter values for the control periods. This procedure enables accurate position/speed detection to be achieved. Rev. 4.0, 03/03, page 494 of 1358 Channel 1 TCLKA TCLKB Edge detection circuit TCNT1 TGR1A (speed period capture) TGR1B (position period capture) TCNT0 + TGR0A (speed control period) + TGR0C (position control period) TGR0B (pulse width capture) TGR0D (buffer operation) Channel 0 Figure 10-33 Phase Counting Mode Application Example Rev. 4.0, 03/03, page 495 of 1358 10.5 Interrupts 10.5.1 Interrupt Sources and Priorities There are three kinds of TPU interrupt source: TGR input capture/compare match, TCNT overflow, and TCNT underflow. Each interrupt source has its own status flag and enable/disable bit, allowing generation of interrupt request signals to be enabled or disabled individually. When an interrupt request is generated, the corresponding status flag in TSR is set to 1. If the corresponding enable/disable bit in TIER is set to 1 at this time, an interrupt is requested. The interrupt request is cleared by clearing the status flag to 0. Relative channel priorities can be changed by the interrupt controller, but the priority order within a channel is fixed. For details, see section 5, Interrupt Controller. Table 10-13 lists the TPU interrupt sources. Rev. 4.0, 03/03, page 496 of 1358 Table 10-13 TPU Interrupts DMAC* Activation DTC Activation Channel Interrupt Source Description 0 TGI0A TGR0A input capture/compare match Possible TGI0B TGR0B input capture/compare match Not possible Possible TGI0C TGR0C input capture/compare match Not possible Possible TGI0D TGR0D input capture/compare match Not possible Possible TCI0V TCNT0 overflow TGI1A TGR1A input capture/compare match Possible TGI1B TGR1B input capture/compare match Not possible Possible TCI1V TCNT1 overflow Not possible Not possible TCI1U TCNT1 underflow Not possible Not possible TGI2A TGR2A input capture/compare match Possible TGI2B TGR2B input capture/compare match Not possible Possible TCI2V TCNT2 overflow Not possible Not possible TCI2U TCNT2 underflow Not possible Not possible TGI3A TGR3A input capture/compare match Possible TGI3B TGR3B input capture/compare match Not possible Possible TGI3C TGR3C input capture/compare match Not possible Possible TGI3D TGR3D input capture/compare match Not possible Possible 1 2 3 4 5 Possible Priority High Not possible Not possible Possible Possible Possible TCI3V TCNT3 overflow TGI4A TGR4A input capture/compare match Possible Not possible Not possible TGI4B TGR4B input capture/compare match Not possible Possible TCI4V TCNT4 overflow Not possible Not possible TCI4U TCNT4 underflow Not possible Not possible TGI5A TGR5A input capture/compare match Possible TGI5B TGR5B input capture/compare match Not possible Possible TCI5V TCNT5 overflow Not possible Not possible TCI5U TCNT5 underflow Not possible Not possible Possible Possible Low Notes: This table shows the initial state immediately after a reset. The relative channel priorities can be changed by the interrupt controller. * The DMAC is not supported in the H8S/2321. Rev. 4.0, 03/03, page 497 of 1358 Input Capture/Compare Match Interrupt: An interrupt is requested if the TGIE bit in TIER is set to 1 when the TGF flag in TSR is set to 1 by the occurrence of a TGR input capture/compare match on a particular channel. The interrupt request is cleared by clearing the TGF flag to 0. The TPU has 16 input capture/compare match interrupts, four each for channels 0 and 3, and two each for channels 1, 2, 4, and 5. Overflow Interrupt: An interrupt is requested if the TCIEV bit in TIER is set to 1 when the TCFV flag in TSR is set to 1 by the occurrence of TCNT overflow on a channel. The interrupt request is cleared by clearing the TCFV flag to 0. The TPU has six overflow interrupts, one for each channel. Underflow Interrupt: An interrupt is requested if the TCIEU bit in TIER is set to 1 when the TCFU flag in TSR is set to 1 by the occurrence of TCNT underflow on a channel. The interrupt request is cleared by clearing the TCFU flag to 0. The TPU has four underflow interrupts, one each for channels 1, 2, 4, and 5. 10.5.2 DTC/DMAC* Activation DTC Activation: The DTC can be activated by the TGR input capture/compare match interrupt for a channel. For details, see section 8, Data Transfer Controller. A total of 16 TPU input capture/compare match interrupts can be used as DTC activation sources, four each for channels 0 and 3, and two each for channels 1, 2, 4, and 5. DMAC* Activation: The DMAC can be activated by the TGRA input capture/compare match interrupt for a channel. For details, see section 7, DMA Controller. In the TPU, a total of six TGRA input capture/compare match interrupts can be used as DMAC activation sources, one for each channel. Note: * The DMAC is not supported in the H8S/2321. 10.5.3 A/D Converter Activation The A/D converter can be activated by the TGRA input capture/compare match for a channel. If the TTGE bit in TIER is set to 1 when the TGFA flag in TSR is set to 1 by the occurrence of a TGRA input capture/compare match on a particular channel, a request to start A/D conversion is sent to the A/D converter. If the TPU conversion start trigger has been selected on the A/D converter side at this time, A/D conversion is started. In the TPU, a total of six TGRA input capture/compare match interrupts can be used as A/D converter conversion start sources, one for each channel. Rev. 4.0, 03/03, page 498 of 1358 10.6 Operation Timing 10.6.1 Input/Output Timing TCNT Count Timing: Figure 10-34 shows TCNT count timing in internal clock operation, and figure 10-35 shows TCNT count timing in external clock operation. f Internal clock Rising edge Falling edge TCNT input clock TCNT N1 N N+1 N+2 Figure 10-34 Count Timing in Internal Clock Operation f External clock Falling edge Rising edge Falling edge TCNT input clock TCNT N1 N N+1 N+2 Figure 10-35 Count Timing in External Clock Operation Rev. 4.0, 03/03, page 499 of 1358 Output Compare Output Timing: A compare match signal is generated in the final state in which TCNT and TGR match (the point at which the count value matched by TCNT is updated). When a compare match signal is generated, the output value set in TIOR is output at the output compare output pin. After a match between TCNT and TGR, the compare match signal is not generated until the TCNT input clock is generated. Figure 10-36 shows output compare output timing. f TCNT input clock N TCNT N+1 N TGR Compare match signal TIOC pin Figure 10-36 Output Compare Output Timing Input Capture Signal Timing: Figure 10-37 shows input capture signal timing. f Input capture input Input capture signal TCNT N N+1 N+2 N TGR Figure 10-37 Input Capture Input Signal Timing Rev. 4.0, 03/03, page 500 of 1358 N+2 Timing for Counter Clearing by Compare Match/Input Capture: Figure 10-38 shows the timing when counter clearing by compare match occurrence is specified, and figure 10-39 shows the timing when counter clearing by input capture occurrence is specified. f Compare match signal Counter clear signal TCNT N TGR N H'0000 Figure 10-38 Counter Clear Timing (Compare Match) f Input capture signal Counter clear signal TCNT TGR N H'0000 N Figure 10-39 Counter Clear Timing (Input Capture) Rev. 4.0, 03/03, page 501 of 1358 Buffer Operation Timing: Figures 10-40 and 10-41 show the timing in buffer operation. f TCNT n n+1 Compare match signal TGRA, TGRB n TGRC, TGRD N N Figure 10-40 Buffer Operation Timing (Compare Match) f Input capture signal TCNT N TGRA, TGRB n TGRC, TGRD N+1 N N+1 n N Figure 10-41 Buffer Operation Timing (Input Capture) Rev. 4.0, 03/03, page 502 of 1358 10.6.2 Interrupt Signal Timing TGF Flag Setting Timing in Case of Compare Match: Figure 10-42 shows the timing for setting of the TGF flag in TSR by compare match occurrence, and TGI interrupt request signal timing. f TCNT input clock TCNT N TGR N N+1 Compare match signal TGF flag TGI interrupt Figure 10-42 TGI Interrupt Timing (Compare Match) Rev. 4.0, 03/03, page 503 of 1358 TGF Flag Setting Timing in Case of Input Capture: Figure 10-43 shows the timing for setting of the TGF flag in TSR by input capture occurrence, and TGI interrupt request signal timing. f Input capture signal TCNT N TGR N TGF flag TGI interrupt Figure 10-43 TGI Interrupt Timing (Input Capture) Rev. 4.0, 03/03, page 504 of 1358 TCFV Flag/TCFU Flag Setting Timing: Figure 10-44 shows the timing for setting of the TCFV flag in TSR by overflow occurrence, and TCIV interrupt request signal timing. Figure 10-45 shows the timing for setting of the TCFU flag in TSR by underflow occurrence, and TCIU interrupt request signal timing. f TCNT input clock TCNT (overflow) H'FFFF H'0000 Overflow signal TCFV flag TCIV interrupt Figure 10-44 TCIV Interrupt Setting Timing f TCNT input clock TCNT (underflow) H'0000 H'FFFF Underflow signal TCFU flag TCIU interrupt Figure 10-45 TCIU Interrupt Setting Timing Rev. 4.0, 03/03, page 505 of 1358 Status Flag Clearing Timing: After a status flag is read as 1 by the CPU, it is cleared by writing 0 to it. When the DTC or DMAC* is activated, the flag is cleared automatically. Figure 10-46 shows the timing for status flag clearing by the CPU, and figure 10-47 shows the timing for status flag clearing by the DTC or DMAC*. Note: * The DMAC is not supported in the H8S/2321. TSR write cycle T1 T2 f TSR address Address Write signal Status flag Interrupt request signal Figure 10-46 Timing for Status Flag Clearing by CPU DTC/DMAC* read cycle T1 T2 DTC/DMAC* write cycle T1 T2 f Address Source address Destination address Status flag Interrupt request signal Note: * The DMAC is not supported in the H8S/2321. Figure 10-47 Timing for Status Flag Clearing by DTC/DMAC Activation Rev. 4.0, 03/03, page 506 of 1358 10.7 Usage Notes Note that the kinds of operation and contention described below can occur during TPU operation. Input Clock Restrictions: The input clock pulse width must be at least 1.5 states in the case of single-edge detection, and at least 2.5 states in the case of both-edge detection. The TPU will not operate properly with a narrower pulse width. In phase counting mode, the phase difference and overlap between the two input clocks must be at least 1.5 states, and the pulse width must be at least 2.5 states. Figure 10-48 shows the input clock conditions in phase counting mode. Overlap Phase Phase differdifference Overlap ence Pulse width Pulse width TCLKA (TCLKC) TCLKB (TCLKD) Pulse width Pulse width Notes: Phase difference and overlap : 1.5 states or more : 2.5 states or more Pulse width Figure 10-48 Phase Difference, Overlap, and Pulse Width in Phase Counting Mode Caution on Period Setting: When counter clearing by compare match is set, TCNT is cleared in the final state in which it matches the TGR value (the point at which the count value matched by TCNT is updated). Consequently, the actual counter frequency is given by the following formula: f= (N + 1) Where f : Counter frequency : Operating frequency N : TGR set value Rev. 4.0, 03/03, page 507 of 1358 Contention between TCNT Write and Clear Operations: If the counter clear signal is generated in the T2 state of a TCNT write cycle, TCNT clearing takes precedence and the TCNT write is not performed. Figure 10-49 shows the timing in this case. TCNT write cycle T2 T1 f TCNT address Address Write signal Counter clear signal N TCNT H'0000 Figure 10-49 Contention between TCNT Write and Clear Operations Rev. 4.0, 03/03, page 508 of 1358 Contention between TCNT Write and Increment Operations: If incrementing occurs in the T2 state of a TCNT write cycle, the TCNT write takes precedence and TCNT is not incremented. Figure 10-50 shows the timing in this case. TCNT write cycle T1 T2 f TCNT address Address Write signal TCNT input clock TCNT N M TCNT write data Figure 10-50 Contention between TCNT Write and Increment Operations Rev. 4.0, 03/03, page 509 of 1358 Contention between TGR Write and Compare Match: If a compare match occurs in the T2 state of a TGR write cycle, the TGR write takes precedence and the compare match signal is inhibited. A compare match does not occur even if the same value as before is written. Figure 10-51 shows the timing in this case. TGR write cycle T2 T1 f TGR address Address Write signal Compare match signal Inhibited TCNT N N+1 TGR N M TGR write data Figure 10-51 Contention between TGR Write and Compare Match Rev. 4.0, 03/03, page 510 of 1358 Contention between Buffer Register Write and Compare Match: If a compare match occurs in the T2 state of a TGR write cycle, the data transferred to TGR by the buffer operation will be the data prior to the write. Figure 10-52 shows the timing in this case. TGR write cycle T2 T1 f Buffer register address Address Write signal Compare match signal Buffer register write data Buffer register TGR N M N Figure 10-52 Contention between Buffer Register Write and Compare Match Rev. 4.0, 03/03, page 511 of 1358 Contention between TGR Read and Input Capture: If the input capture signal is generated in the T1 state of a TGR read cycle, the data that is read will be the data after input capture transfer. Figure 10-53 shows the timing in this case. TGR read cycle T1 T2 f TGR address Address Read signal Input capture signal TGR X M M Internal data bus Figure 10-53 Contention between TGR Read and Input Capture Rev. 4.0, 03/03, page 512 of 1358 Contention between TGR Write and Input Capture: If the input capture signal is generated in the T2 state of a TGR write cycle, the input capture operation takes precedence and the write to TGR is not performed. Figure 10-54 shows the timing in this case. TGR write cycle T1 T2 f TGR address Address Write signal Input capture signal TCNT TGR M M Figure 10-54 Contention between TGR Write and Input Capture Rev. 4.0, 03/03, page 513 of 1358 Contention between Buffer Register Write and Input Capture: If the input capture signal is generated in the T2 state of a buffer write cycle, the buffer operation takes precedence and the write to the buffer register is not performed. Figure 10-55 shows the timing in this case. Buffer register write cycle T1 T2 f Buffer register address Address Write signal Input capture signal TCNT TGR Buffer register N M N M Figure 10-55 Contention between Buffer Register Write and Input Capture Rev. 4.0, 03/03, page 514 of 1358 Contention between Overflow/Underflow and Counter Clearing: If overflow/underflow and counter clearing occur simultaneously, the TCFV/TCFU flag in TSR is not set and TCNT clearing takes precedence. Figure 10-56 shows the operation timing when a TGR compare match is specified as the clearing source, and H'FFFF is set in TGR. f TCNT input clock TCNT H'FFFF H'0000 Counter clear signal TGF Inhibited TCFV Figure 10-56 Contention between Overflow and Counter Clearing Rev. 4.0, 03/03, page 515 of 1358 Contention between TCNT Write and Overflow/Underflow: If there is an up-count or downcount in the T2 state of a TCNT write cycle, and overflow/underflow occurs, the TCNT write takes precedence and the TCFV/TCFU flag in TSR is not set. Figure 10-57 shows the operation timing when there is contention between TCNT write and overflow. TCNT write cycle T1 T2 f TCNT address Address Write signal TCNT TCNT write data H'FFFF M TCFV flag Figure 10-57 Contention between TCNT Write and Overflow Multiplexing of I/O Pins: In the chip, the TCLKA input pin is multiplexed with the TIOCC0 I/O pin, the TCLKB input pin with the TIOCD0 I/O pin, the TCLKC input pin with the TIOCB1 I/O pin, and the TCLKD input pin with the TIOCB2 I/O pin. When an external clock is input, compare match output should not be performed from a multiplexed pin. Interrupts and Module Stop Mode: If module stop mode is entered when an interrupt has been requested, it will not be possible to clear the CPU interrupt source or the DMAC* or DTC activation source. Interrupts should therefore be disabled before entering module stop mode. Note: * The DMAC is not supported in the H8S/2321. Rev. 4.0, 03/03, page 516 of 1358 Section 11 Programmable Pulse Generator (PPG) 11.1 Overview The chip has a built-in programmable pulse generator (PPG) that provides pulse outputs by using the 16-bit timer-pulse unit (TPU) as a time base. The PPG pulse outputs are divided into 4-bit groups (group 3 to group 0) that can operate both simultaneously and independently. 11.1.1 Features PPG features are listed below. * 16-bit output data Maximum 16-bit data can be output, and output can be enabled on a bit-by-bit basis * Four output groups Output trigger signals can be selected in 4-bit groups to provide up to four different 4-bit outputs * Selectable output trigger signals Output trigger signals can be selected for each group from the compare match signals of four TPU channels * Non-overlap mode A non-overlap margin can be provided between pulse outputs * Can operate together with the data transfer controller (DTC) and DMA controller (DMAC)* The compare match signals selected as output trigger signals can activate the DTC or DMAC for sequential output of data without CPU intervention Note: * The DMAC is not supported in the H8S/2321. * Inverted output can be set Inverted data can be output for each group * Module stop mode can be set As the initial setting, PPG operation is halted. Register access is enabled by exiting module stop mode Rev. 4.0, 03/03, page 517 of 1358 11.1.2 Block Diagram Figure 11-1 shows a block diagram of the PPG. Compare match signals Control logic PO15 PO14 PO13 PO12 PO11 PO10 PO9 PO8 PO7 PO6 PO5 PO4 PO3 PO2 PO1 PO0 Legend PMR PCR NDERH NDERL NDRH NDRL PODRH PODRL NDERH NDERL PMR PCR Pulse output pins, group 3 PODRH NDRH PODRL NDRL Pulse output pins, group 2 Pulse output pins, group 1 Pulse output pins, group 0 : PPG output mode register : PPG output control register : Next data enable register H : Next data enable register L : Next data register H : Next data register L : Output data register H : Output data register L Figure 11-1 Block Diagram of PPG Rev. 4.0, 03/03, page 518 of 1358 Internal data bus 11.1.3 Pin Configuration Table 11-1 summarizes the PPG pins. Table 11-1 PPG Pins Name Symbol I/O Function Group 0 pulse output Pulse output 0 PO0 Output Pulse output 1 PO1 Output Pulse output 2 PO2 Output Pulse output 3 PO3 Output Pulse output 4 PO4 Output Pulse output 5 PO5 Output Pulse output 6 PO6 Output Pulse output 7 PO7 Output Pulse output 8 PO8 Output Pulse output 9 PO9 Output Pulse output 10 PO10 Output Pulse output 11 PO11 Output Pulse output 12 PO12 Output Pulse output 13 PO13 Output Pulse output 14 PO14 Output Pulse output 15 PO15 Output Group 1 pulse output Group 2 pulse output Group 3 pulse output Rev. 4.0, 03/03, page 519 of 1358 11.1.4 Registers Table 11-2 summarizes the PPG registers. Table 11-2 PPG Registers Name Abbreviation R/W Initial Value 1 Address* PPG output control register PCR R/W H'FF H'FF46 PPG output mode register PMR R/W H'F0 H'FF47 Next data enable register H NDERH R/W H'00 H'FF48 Next data enable register L NDERL R/W H'00 H'FF49 PODRH 2 R/(W)* H'00 H'FF4A Output data register L PODRL 2 R/(W) * H'00 Next data register H NDRH R/W H'00 Next data register L NDRL R/W H'00 H'FF4B 3 H'FF4C* H'FF4E 3 H'FF4D* H'FF4F Output data register H Port 1 data direction register P1DDR W H'00 H'FEB0 Port 2 data direction register P2DDR W H'00 H'FEB1 Module stop control register MSTPCR R/W H'3FFF H'FF3C Notes: *1 Lower 16 bits of the address. *2 Bits used for pulse output cannot be written to. *3 When the same output trigger is selected for pulse output groups 2 and 3 by the PCR setting, the NDRH address is H'FF4C. When the output triggers are different, the NDRH address is H'FF4E for group 2 and H'FF4C for group 3. Similarly, when the same output trigger is selected for pulse output groups 0 and 1 by the PCR setting, the NDRL address is H'FF4D. When the output triggers are different, the NDRL address is H'FF4F for group 0 and H'FF4D for group 1. Rev. 4.0, 03/03, page 520 of 1358 11.2 Register Descriptions 11.2.1 Next Data Enable Registers H and L (NDERH, NDERL) NDERH Bit : 7 6 5 4 3 2 1 NDER15 NDER14 NDER13 NDER12 NDER11 NDER10 NDER9 Initial value : R/W 0 NDER8 0 0 0 0 0 0 0 0 : R/W R/W R/W R/W R/W R/W R/W R/W : 7 6 5 4 3 2 1 0 NDER7 NDER6 NDER5 NDER4 NDER3 NDER2 NDER1 NDER0 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W NDERL Bit Initial value : R/W : NDERH and NDERL are 8-bit readable/writable registers that enable or disable pulse output on a bit-by-bit basis. If a bit is enabled for pulse output by NDERH or NDERL, the NDR value is automatically transferred to the corresponding PODR bit when the TPU compare match event specified by PCR occurs, updating the output value. If pulse output is disabled, the bit value is not transferred from NDR to PODR and the output value does not change. NDERH and NDERL are each initialized to H'00 by a reset and in hardware standby mode. They are not initialized in software standby mode. NDERH Bits 7 to 0--Next Data Enable 15 to 8 (NDER15 to NDER8): These bits enable or disable pulse output on a bit-by-bit basis. Bits 7 to 0 NDER15 to NDER8 Description 0 Pulse outputs PO15 to PO8 are disabled (NDR15 to NDR8 are not transferred to POD15 to POD8) (Initial value) 1 Pulse outputs PO15 to PO8 are enabled (NDR15 to NDR8 are transferred to POD15 to POD8) Rev. 4.0, 03/03, page 521 of 1358 NDERL Bits 7 to 0--Next Data Enable 7 to 0 (NDER7 to NDER0): These bits enable or disable pulse output on a bit-by-bit basis. Bits 7 to 0 NDER7 to NDER0 Description 0 Pulse outputs PO7 to PO0 are disabled (NDR7 to NDR0 are not transferred to POD7 to POD0) (Initial value) 1 Pulse outputs PO7 to PO0 are enabled (NDR7 to NDR0 are transferred to POD7 to POD0) 11.2.2 Output Data Registers H and L (PODRH, PODRL) PODRH Bit : 7 6 5 4 3 2 1 0 POD15 POD14 POD13 POD12 POD11 POD10 POD9 POD8 0 0 0 0 0 0 0 0 : R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* : 7 6 5 4 3 2 1 0 POD7 POD6 POD5 POD4 POD3 POD2 POD1 POD0 0 0 0 0 0 0 0 0 R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* Initial value : R/W PODRL Bit Initial value : R/W : Note: * A bit that has been set for pulse output by NDER is read-only. PODRH and PODRL are 8-bit readable/writable registers that store output data for use in pulse output. Rev. 4.0, 03/03, page 522 of 1358 11.2.3 Next Data Registers H and L (NDRH, NDRL) NDRH and NDRL are 8-bit readable/writable registers that store the next data for pulse output. During pulse output, the contents of NDRH and NDRL are transferred to the corresponding bits in PODRH and PODRL when the TPU compare match event specified by PCR occurs. The NDRH and NDRL addresses differ depending on whether pulse output groups have the same output trigger or different output triggers. For details see section 11.2.4, Notes on NDR Access. NDRH and NDRL are each initialized to H'00 by a reset and in hardware standby mode. They are not initialized in software standby mode. 11.2.4 Notes on NDR Access The NDRH and NDRL addresses differ depending on whether pulse output groups have the same output trigger or different output triggers. Same Trigger for Pulse Output Groups: If pulse output groups 2 and 3 are triggered by the same compare match event, the NDRH address is H'FF4C. The upper 4 bits belong to group 3 and the lower 4 bits to group 2. Address H'FF4E consists entirely of reserved bits that cannot be modified and are always read as 1. Address H'FF4C Bit : 7 6 5 4 3 2 1 0 NDR15 NDR14 NDR13 NDR12 NDR11 NDR10 NDR9 NDR8 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W 7 6 5 4 3 2 1 0 -- -- -- -- -- -- -- -- Initial value : R/W : Address H'FF4E Bit : Initial value : 1 1 1 1 1 1 1 1 R/W -- -- -- -- -- -- -- -- : If pulse output groups 0 and 1 are triggered by the same compare match event, the NDRL address is H'FF4D. The upper 4 bits belong to group 1 and the lower 4 bits to group 0. Address H'FF4F consists entirely of reserved bits that cannot be modified and are always read as 1. Rev. 4.0, 03/03, page 523 of 1358 Address H'FF4D Bit : 7 6 5 4 3 2 1 0 NDR7 NDR6 NDR5 NDR4 NDR3 NDR2 NDR1 NDR0 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W 7 6 5 4 3 2 1 0 -- -- -- -- -- -- -- -- Initial value : 1 1 1 1 1 1 1 1 R/W -- -- -- -- -- -- -- -- Initial value : R/W : Address H'FF4F Bit : : Different Triggers for Pulse Output Groups: If pulse output groups 2 and 3 are triggered by different compare match events, the address of the upper 4 bits in NDRH (group 3) is H'FF4C and the address of the lower 4 bits (group 2) is H'FF4E. Bits 3 to 0 of address H'FF4C and bits 7 to 4 of address H'FF4E are reserved bits that cannot be modified and are always read as 1. Address H'FF4C Bit : 7 6 5 4 3 2 1 0 NDR15 NDR14 NDR13 NDR12 -- -- -- -- 0 0 0 0 1 1 1 1 R/W R/W R/W R/W -- -- -- -- 7 6 5 4 3 2 1 0 -- -- -- -- NDR11 NDR10 NDR9 NDR8 Initial value : R/W : Address H'FF4E Bit : Initial value : 1 1 1 1 0 0 0 0 R/W -- -- -- -- R/W R/W R/W R/W : If pulse output groups 0 and 1 are triggered by different compare match event, the address of the upper 4 bits in NDRL (group 1) is H'FF4D and the address of the lower 4 bits (group 0) is H'FF4F. Bits 3 to 0 of address H'FF4D and bits 7 to 4 of address H'FF4F are reserved bits that cannot be modified and are always read as 1. Rev. 4.0, 03/03, page 524 of 1358 Address H'FF4D Bit : 7 6 5 4 3 2 1 0 NDR7 NDR6 NDR5 NDR4 -- -- -- -- 0 0 0 0 1 1 1 1 R/W R/W R/W R/W -- -- -- -- 7 6 5 4 3 2 1 0 -- -- -- -- NDR3 NDR2 NDR1 NDR0 Initial value : 1 1 1 1 0 0 0 0 R/W -- -- -- -- R/W R/W R/W R/W 4 3 2 1 0 Initial value : R/W : Address H'FF4F Bit 11.2.5 Bit : : PPG Output Control Register (PCR) : 7 6 5 G3CMS1 G3CMS0 G2CMS1 G2CMS0 G1CMS1 G1CMS0 G0CMS1 G0CMS0 Initial value : R/W : 1 1 1 1 1 1 1 1 R/W R/W R/W R/W R/W R/W R/W R/W PCR is an 8-bit readable/writable register that selects output trigger signals for PPG outputs on a group-by-group basis. PCR is initialized to H'FF by a reset and in hardware standby mode. It is not initialized in software standby mode. Bits 7 and 6--Group 3 Compare Match Select 1 and 0 (G3CMS1, G3CMS0): These bits select the compare match that triggers pulse output group 3 (pins PO15 to PO12). Description Bit 7 G3CMS1 Bit 6 G3CMS0 Output Trigger for Pulse Output Group 3 0 0 Compare match in TPU channel 0 1 Compare match in TPU channel 1 0 Compare match in TPU channel 2 1 Compare match in TPU channel 3 1 (Initial value) Rev. 4.0, 03/03, page 525 of 1358 Bits 5 and 4--Group 2 Compare Match Select 1 and 0 (G2CMS1, G2CMS0): These bits select the compare match that triggers pulse output group 2 (pins PO11 to PO8). Description Bit 5 G2CMS1 0 1 Bit 4 G2CMS0 Output Trigger for Pulse Output Group 2 0 Compare match in TPU channel 0 1 Compare match in TPU channel 1 0 Compare match in TPU channel 2 1 Compare match in TPU channel 3 (Initial value) Bits 3 and 2--Group 1 Compare Match Select 1 and 0 (G1CMS1, G1CMS0): These bits select the compare match that triggers pulse output group 1 (pins PO7 to PO4). Description Bit 3 G1CMS1 Bit 2 G1CMS0 Output Trigger for Pulse Output Group 1 0 0 Compare match in TPU channel 0 1 Compare match in TPU channel 1 0 Compare match in TPU channel 2 1 Compare match in TPU channel 3 1 (Initial value) Bits 1 and 0--Group 0 Compare Match Select 1 and 0 (G0CMS1, G0CMS0): These bits select the compare match that triggers pulse output group 0 (pins PO3 to PO0). Description Bit 1 G0CMS1 Bit 0 G0CMS0 Output Trigger for Pulse Output Group 0 0 0 Compare match in TPU channel 0 1 Compare match in TPU channel 1 1 0 Compare match in TPU channel 2 1 Compare match in TPU channel 3 Rev. 4.0, 03/03, page 526 of 1358 (Initial value) 11.2.6 Bit PPG Output Mode Register (PMR) : Initial value : R/W : 7 6 5 4 3 2 1 0 G3INV G2INV G1INV G0INV G3NOV G2NOV G1NOV G0NOV 1 1 1 1 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W PMR is an 8-bit readable/writable register that selects pulse output inversion and non-overlapping operation for each group. The output trigger period of a non-overlapping operation PPG output waveform is set in TGRB and the non-overlap margin is set in TGRA. The output values change at compare match A and B. For details, see section 11.3.4, Non-Overlapping Pulse Output. PMR is initialized to H'F0 by a reset and in hardware standby mode. It is not initialized in software standby mode. Bit 7--Group 3 Inversion (G3INV): Selects direct output or inverted output for pulse output group 3 (pins PO15 to PO12). Bit 7 G3INV Description 0 Inverted output for pulse output group 3 (low-level output at pin for a 1 in PODRH) 1 Direct output for pulse output group 3 (high-level output at pin for a 1 in PODRH) (Initial value) Bit 6--Group 2 Inversion (G2INV): Selects direct output or inverted output for pulse output group 2 (pins PO11 to PO8). Bit 6 G2INV Description 0 Inverted output for pulse output group 2 (low-level output at pin for a 1 in PODRH) 1 Direct output for pulse output group 2 (high-level output at pin for a 1 in PODRH) (Initial value) Rev. 4.0, 03/03, page 527 of 1358 Bit 5--Group 1 Inversion (G1INV): Selects direct output or inverted output for pulse output group 1 (pins PO7 to PO4). Bit 5 G1INV Description 0 Inverted output for pulse output group 1 (low-level output at pin for a 1 in PODRL) 1 Direct output for pulse output group 1 (high-level output at pin for a 1 in PODRL) (Initial value) Bit 4--Group 0 Inversion (G0INV): Selects direct output or inverted output for pulse output group 0 (pins PO3 to PO0). Bit 4 G0INV Description 0 Inverted output for pulse output group 0 (low-level output at pin for a 1 in PODRL) 1 Direct output for pulse output group 0 (high-level output at pin for a 1 in PODRL) (Initial value) Bit 3--Group 3 Non-Overlap (G3NOV): Selects normal or non-overlapping operation for pulse output group 3 (pins PO15 to PO12). Bit 3 G3NOV Description 0 Normal operation in pulse output group 3 (output values updated at compare match A in the selected TPU channel) (Initial value) 1 Non-overlapping operation in pulse output group 3 (independent 1 and 0 output at compare match A or B in the selected TPU channel) Bit 2--Group 2 Non-Overlap (G2NOV): Selects normal or non-overlapping operation for pulse output group 2 (pins PO11 to PO8). Bit 2 G2NOV Description 0 Normal operation in pulse output group 2 (output values updated at compare match A in the selected TPU channel) (Initial value) 1 Non-overlapping operation in pulse output group 2 (independent 1 and 0 output at compare match A or B in the selected TPU channel) Rev. 4.0, 03/03, page 528 of 1358 Bit 1--Group 1 Non-Overlap (G1NOV): Selects normal or non-overlapping operation for pulse output group 1 (pins PO7 to PO4). Bit 1 G1NOV Description 0 Normal operation in pulse output group 1 (output values updated at compare match A in the selected TPU channel) (Initial value) 1 Non-overlapping operation in pulse output group 1 (independent 1 and 0 output at compare match A or B in the selected TPU channel) Bit 0--Group 0 Non-Overlap (G0NOV): Selects normal or non-overlapping operation for pulse output group 0 (pins PO3 to PO0). Bit 0 G0NOV Description 0 Normal operation in pulse output group 0 (output values updated at compare match A in the selected TPU channel) (Initial value) 1 Non-overlapping operation in pulse output group 0 (independent 1 and 0 output at compare match A or B in the selected TPU channel) 11.2.7 Bit Port 1 Data Direction Register (P1DDR) : 7 6 5 4 3 2 1 0 P17DDR P16DDR P15DDR P14DDR P13DDR P12DDR P11DDR P10DDR Initial value : 0 0 0 0 0 0 0 0 R/W W W W W W W W W : P1DDR is an 8-bit write-only register, the individual bits of which specify input or output for the pins of port 1. Port 1 is multiplexed with pins PO15 to PO8. Bits corresponding to pins used for PPG output must be set to 1. For further information about P1DDR, see section 9, I/O Port. Rev. 4.0, 03/03, page 529 of 1358 11.2.8 Bit Port 2 Data Direction Register (P2DDR) : 7 6 5 4 3 2 1 0 P27DDR P26DDR P25DDR P24DDR P23DDR P22DDR P21DDR P20DDR Initial value : 0 0 0 0 0 0 0 0 R/W W W W W W W W W : P2DDR is an 8-bit write-only register, the individual bits of which specify input or output for the pins of port 2. Port 2 is multiplexed with pins PO7 to PO0. Bits corresponding to pins used for PPG output must be set to 1. For further information about P2DDR, see section 9, I/O Port. 11.2.9 Module Stop Control Register (MSTPCR) MSTPCRH Bit MSTPCRL : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Initial value : 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 R/W : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W MSTPCR is a 16-bit readable/writable register that performs module stop mode control. When the MSTP11 bit in MSTPCR is set to 1, PPG operation stops at the end of the bus cycle and a transition is made to module stop mode. Registers cannot be read or written to in module stop mode. For details, see section 21.5, Module Stop Mode. MSTPCR is initialized to H'3FFF by a reset and in hardware standby mode. It is not initialized in software standby mode. Bit 11--Module Stop (MSTP11): Specifies the PPG module stop mode. Bit 11 MSTP11 Description 0 PPG module stop mode cleared 1 PPG module stop mode set Rev. 4.0, 03/03, page 530 of 1358 (Initial value) 11.3 Operation 11.3.1 Overview PPG pulse output is enabled when the corresponding bits in P1DDR, P2DDR, and NDER are set to 1. In this state the corresponding PODR contents are output. When the compare match event specified by PCR occurs, the corresponding NDR bit contents are transferred to PODR to update the output values. Figure 11-2 illustrates the PPG output operation and table 11-3 summarizes the PPG operating conditions. DDR NDER Q Q Output trigger signal C Q PODR D Q NDR D Internal data bus Pulse output pin Normal output/inverted output Figure 11-2 PPG Output Operation Table 11-3 PPG Operating Conditions NDER DDR Pin Function 0 0 Generic input port 1 Generic output port 0 Generic input port (but the PODR bit is a read-only bit, and when compare match occurs, the NDR bit value is transferred to the PODR bit) 1 PPG pulse output 1 Sequential output of data of up to 16 bits is possible by writing new output data to NDR before the next compare match. For details of non-overlapping operation, see section 11.3.4, NonOverlapping Pulse Output. Rev. 4.0, 03/03, page 531 of 1358 11.3.2 Output Timing If pulse output is enabled, NDR contents are transferred to PODR and output when the specified compare match event occurs. Figure 11-3 shows the timing of these operations for the case of normal output in groups 2 and 3, triggered by compare match A. f N TCNT TGRA N+1 N Compare match A signal n NDRH PODRH PO8 to PO15 m n m n Figure 11-3 Timing of Transfer and Output of NDR Contents (Example) Rev. 4.0, 03/03, page 532 of 1358 11.3.3 Normal Pulse Output Sample Setup Procedure for Normal Pulse Output: Figure 11-4 shows a sample procedure for setting up normal pulse output. Normal PPG output Select TGR functions [1] Set TGRA value [2] Set counting operation [3] Select interrupt request [4] Set initial output data [5] Enable pulse output [6] Select output trigger [7] [1] Set TIOR to make TGRA an output compare register (with output disabled). [2] Set the PPG output trigger period. TPU setup Port and PPG setup TPU setup Set next pulse output data [8] Start count [9] Compare match? No [3] Select the counter clock source with bits TPSC2 to TPSC0 in TCR. Select the counter clear source with bits CCLR1 and CCLR0. [4] Enable the TGIA interrupt in TIER. The DTC or DMAC* can also be set up to transfer data to NDR. [5] Set the initial output values in PODR. [6] Set the DDR and NDER bits for the pins to be used for pulse output to 1. [7] Select the TPU compare match event to be used as the output trigger in PCR. [8] Set the next pulse output values in NDR. Yes Set next pulse output data [10] [9] Set the CST bit in TSTR to 1 to start the TCNT counter. [10] At each TGIA interrupt, set the next output values in NDR. Note:* The DMAC is not supported in the H8S/2321. Figure 11-4 Setup Procedure for Normal Pulse Output (Example) Rev. 4.0, 03/03, page 533 of 1358 Example of Normal Pulse Output (Example of Five-Phase Pulse Output): Figure 11-5 shows an example in which pulse output is used for cyclic five-phase pulse output. TCNT value Compare match TCNT TGRA H'0000 Time 80 NDRH PODRH 00 C0 80 40 C0 60 40 20 60 30 20 10 30 18 10 08 18 88 08 80 88 C0 80 40 C0 PO15 PO14 PO13 PO12 PO11 Figure 11-5 Normal Pulse Output Example (Five-Phase Pulse Output) [1] Set up the TPU channel to be used as the output trigger channel so that TGRA is an output compare register and the counter will be cleared by compare match A. Set the trigger period in TGRA and set the TGIEA bit in TIER to 1 to enable the compare match A (TGIA) interrupt. [2] Write H'F8 in P1DDR and NDERH, and set the G3CMS1, G3CMS0, G2CMS1, and G2CMS0 bits in PCR to select compare match in the TPU channel set up in the previous step to be the output trigger. Write output data H'80 in NDRH. [3] The timer counter in the TPU channel starts. When compare match A occurs, the NDRH contents are transferred to PODRH and output. The TGIA interrupt handling routine writes the next output data (H'C0) in NDRH. [4] Five-phase overlapping pulse output (one or two phases active at a time) can be obtained subsequently by writing H'40, H'60, H'20, H'30. H'10, H'18, H'08, H'88... at successive TGIA interrupts. If the DTC or DMAC* is set for activation by this interrupt, pulse output can be obtained without imposing a load on the CPU. Note: * The DMAC is not supported in the H8S/2321. Rev. 4.0, 03/03, page 534 of 1358 11.3.4 Non-Overlapping Pulse Output Sample Setup Procedure for Non-Overlapping Pulse Output: Figure 11-6 shows a sample procedure for setting up non-overlapping pulse output. [1] Set TIOR to make TGRA and TGRB an output compare registers (with output disabled). Non-overlapping PPG output Select TGR functions [1] Set TGR values [2] Set counting operation [3] Select interrupt request [4] Set initial output data [5] TPU setup PPG setup TPU setup Enable pulse output [6] Select output trigger [7] Set non-overlapping groups [8] Set next pulse output data [9] Start count [10] Compare match? No [3] Select the counter clock source with bits TPSC2 to TPSC0 in TCR. Select the counter clear source with bits CCLR1 and CCLR0. [4] Enable the TGIA interrupt in TIER. The DTC or DMAC* can also be set up to transfer data to NDR. [5] Set the initial output values in PODR. [6] Set the DDR and NDER bits for the pins to be used for pulse output to 1. [7] Select the TPU compare match event to be used as the pulse output trigger in PCR. [8] In PMR, select the groups that will operate in non-overlap mode. Yes Set next pulse output data [2] Set the pulse output trigger period in TGRB and the non-overlap margin in TGRA. [11] [9] Set the next pulse output values in NDR. [10] Set the CST bit in TSTR to 1 to start the TCNT counter. [11] At each TGIA interrupt, set the next output values in NDR. Note:* The DMAC is not supported in the H8S/2321. Figure 11-6 Setup Procedure for Non-Overlapping Pulse Output (Example) Rev. 4.0, 03/03, page 535 of 1358 Example of Non-Overlapping Pulse Output (Example of Four-Phase Complementary NonOverlapping Output): Figure 11-7 shows an example in which pulse output is used for four-phase complementary non-overlapping pulse output. TCNT value TGRB TCNT TGRA H'0000 NDRH PODRH Time 95 00 65 95 59 05 65 56 41 59 95 50 56 65 14 95 05 65 Non-overlap margin PO15 PO14 PO13 PO12 PO11 PO10 PO9 PO8 Figure 11-7 Non-Overlapping Pulse Output Example (Four-Phase Complementary) Rev. 4.0, 03/03, page 536 of 1358 [1] Set up the TPU channel to be used as the output trigger channel so that TGRA and TGRB are output compare registers. Set the trigger period in TGRB and the non-overlap margin in TGRA, and set the counter to be cleared by compare match B. Set the TGIEA bit in TIER to 1 to enable the TGIA interrupt. [2] Write H'FF in P1DDR and NDERH, and set the G3CMS1, G3CMS0, G2CMS1, and G2CMS0 bits in PCR to select compare match in the TPU channel set up in the previous step to be the output trigger. Set the G3NOV and G2NOV bits in PMR to 1 to select non-overlapping output. Write output data H'95 in NDRH. [3] The timer counter in the TPU channel starts. When a compare match with TGRB occurs, outputs change from 1 to 0. When a compare match with TGRA occurs, outputs change from 0 to 1 (the change from 0 to 1 is delayed by the value set in TGRA). The TGIA interrupt handling routine writes the next output data (H'65) in NDRH. [4] Four-phase complementary non-overlapping pulse output can be obtained subsequently by writing H'59, H'56, H'95... at successive TGIA interrupts. If the DTC or DMAC* is set for activation by this interrupt, pulse output can be obtained without imposing a load on the CPU. Note: * The DMAC is not supported in the H8S/2321. Rev. 4.0, 03/03, page 537 of 1358 11.3.5 Inverted Pulse Output If the G3INV, G2INV, G1INV, and G0INV bits in PMR are cleared to 0, values that are the inverse of the PODR contents can be output. Figure 11-8 shows the outputs when G3INV and G2INV are cleared to 0, in addition to the settings of figure 11-7. TCNT value TGRB TCNT TGRA H'0000 NDRH PODRL Time 95 00 65 95 59 05 65 56 41 59 95 50 56 65 14 95 05 PO15 PO14 PO13 PO12 PO11 PO10 PO9 PO8 Figure 11-8 Inverted Pulse Output (Example) Rev. 4.0, 03/03, page 538 of 1358 65 11.3.6 Pulse Output Triggered by Input Capture Pulse output can be triggered by TPU input capture as well as by compare match. If TGRA functions as an input capture register in the TPU channel selected by PCR, pulse output will be triggered by the input capture signal. Figure 11-9 shows the timing of this output. f TIOC pin Input capture signal NDR N PODR M PO M N N Figure 11-9 Pulse Output Triggered by Input Capture (Example) Rev. 4.0, 03/03, page 539 of 1358 11.4 Usage Notes 11.4.1 Operation of Pulse Output Pins Pins PO0 to PO15 are also used for other supporting functions such as the TPU. When output by another supporting function is enabled, the corresponding pins cannot be used for pulse output. Note, however, that data transfer from NDR bits to PODR bits takes place, regardless of the usage of the pins. Pin functions should be changed only under conditions in which the output trigger event will not occur. 11.4.2 Note on Non-Overlapping Output During non-overlapping operation, the transfer of NDR bit values to PODR bits takes place as follows. * NDR bits are always transferred to PODR bits at compare match A. * At compare match B, NDR bits are transferred only if their value is 0. Bits are not transferred if their value is 1. Figure 11-10 illustrates the non-overlapping pulse output operation. DDR NDER Q Compare match A Compare match B C Q PODR D Pulse output pin Q NDR D Normal output/inverted output Figure 11-10 Non-Overlapping Pulse Output Rev. 4.0, 03/03, page 540 of 1358 Internal data bus Therefore, 0 data can be transferred ahead of 1 data by making compare match B occur before compare match A. The NDR contents should not be altered during the interval from compare match B to compare match A (the non-overlap margin). This can be accomplished by having the TGIA interrupt handling routine write the next data in NDR, or by having the TGIA interrupt activate the DTC or DMAC*. Note, however, that the next data must be written before the next compare match B occurs. Figure 11-11 shows the timing of this operation. Note: * The DMAC is not supported in the H8S/2321. Compare match A Compare match B Write to NDR Write to NDR NDR PODR 0 output 0/1 output Write to NDR Do not write here to NDR here 0 output 0/1 output Do not write to NDR here Write to NDR here Figure 11-11 Non-Overlapping Operation and NDR Write Timing Rev. 4.0, 03/03, page 541 of 1358 Rev. 4.0, 03/03, page 542 of 1358 Section 12 8-Bit Timers 12.1 Overview The chip includes an 8-bit timer module with two channels (TMR0 and TMR1). Each channel has an 8-bit counter (TCNT) and two time constant registers (TCORA and TCORB) that are constantly compared with the TCNT value to detect compare match events. The 8-bit timer module can thus be used for a variety of functions, including pulse output with an arbitrary duty cycle. 12.1.1 Features The features of the 8-bit timer module are listed below. * Seleyction of four clock sources The counters can be driven by one of three internal clock signals (/8, /64, or /8192) or an external clock input (enabling use as an external event counter) * Seleyction of three ways to clear the counters The counters can be cleared on compare match A or B, or by an external reset signal * Timyer output control by a combination of two compare match signals The timer output signal in each channel is controlled by a combination of two independent compare match signals, enabling the timer to generate output waveforms with an arbitrary duty cycle or PWM output * Provision for cascading of two channels Operation as a 16-bit timer is possible, using channel 0 for the upper 8 bits and channel 1 for the lower 8 bits (16-bit count mode) Channel 1 can be used to count channel 0 compare matches (compare match count mode) * Three independent interrupts Compare match A and B and overflow interrupts can be requested independently * A/D converter conversion start trigger can be generated Channel 0 compare match A signal can be used as an A/D converter conversion start trigger * Module stop mode can be set As the initial setting, 8-bit timer operation is halted. Register access is enabled by exiting module stop mode Rev. 4.0, 03/03, page 543 of 1358 12.1.2 Block Diagram Figure 12-1 shows a block diagram of the 8-bit timer module. External clock source TMCI0 TMCI1 Internal clock sources f/8 f/64 f/8192 Clock 1 Clock 0 Clock select TCORA0 Compare match A1 Compare match A0 Comparator A0 Overflow 1 Overflow 0 TMO0 TMRI0 TCNT0 TCORA1 Comparator A1 TCNT1 Clear 1 TMO1 TMRI1 Control logic Compare match B1 Compare match B0 Comparator B0 A/D conversion start request signal Comparator B1 TCORB0 TCORB1 TCSR0 TCSR1 TCR0 TCR1 CMIA0 CMIB0 OVI0 CMIA1 CMIB1 OVI1 Interrupt signals Figure 12-1 Block Diagram of 8-Bit Timer Module Rev. 4.0, 03/03, page 544 of 1358 Internal bus Clear 0 12.1.3 Pin Configuration Table 12-1 summarizes the input and output pins of the 8-bit timer module. Table 12-1 Input and Output Pins of 8-Bit Timer Channel Name Symbol I/O Function 0 Timer output pin 0 TMO0 Output Outputs at compare match Timer clock input pin 0 TMCI0 Input Inputs external clock for counter Timer reset input pin 0 TMRI0 Input Inputs external reset to counter 1 12.1.4 Timer output pin 1 TMO1 Output Outputs at compare match Timer clock input pin 1 TMCI1 Input Inputs external clock for counter Timer reset input pin 1 TMRI1 Input Inputs external reset to counter Register Configuration Table 12-2 summarizes the registers of the 8-bit timer module. Table 12-2 8-Bit Timer Registers Channel Name Abbreviation R/W 0 Timer control register 0 TCR0 R/W 1 All *2 1 Initial value Address* H'00 H'FFB0 H'00 H'FFB2 Timer control/status register 0 TCSR0 R/(W) Time constant register A0 TCORA0 R/W H'FF H'FFB4 Time constant register B0 TCORB0 R/W H'FF H'FFB6 Timer counter 0 TCNT0 R/W H'00 H'FFB8 Timer control register 1 TCR1 H'00 H'FFB1 Timer control/status register 1 TCSR1 R/(W)* R/W H'10 H'FFB3 Time constant register A1 TCORA1 R/W H'FF H'FFB5 Time constant register B1 TCORB1 R/W H'FF H'FFB7 Timer counter 1 TCNT1 R/W H'00 H'FFB9 Module stop control register MSTPCR R/W H'3FFF H'FF3C 2 Notes: *1 Lower 16 bits of the address *2 Only 0 can be written to bits 7 to 5, to clear these flags. Each pair of registers for channel 0 and channel 1 is a 16-bit register with the upper 8 bits for channel 0 and the lower 8 bits for channel 1, so they can be accessed together by a word transfer instruction. Rev. 4.0, 03/03, page 545 of 1358 12.2 Register Descriptions 12.2.1 Timer Counters 0 and 1 (TCNT0, TCNT1) TCNT0 Bit TCNT1 : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Initial value : 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R/W : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W TCNT0 and TCNT1 are 8-bit readable/writable up-counters that increment on pulses generated from an internal or external clock source. This clock source is selected by clock select bits CKS2 to CKS0 in TCR. The CPU can read or write to TCNT0 and TCNT1 at all times. TCNT0 and TCNT1 comprise a single 16-bit register, so they can be accessed together by a word transfer instruction. TCNT0 and TCNT1 can be cleared by an external reset input or by a compare match signal. Which signal is to be used for clearing is selected by clock clear bits CCLR1 and CCLR0 in TCR. When a timer counter overflows from H'FF to H'00, OVF in TCSR is set to 1. TCNT0 and TCNT1 are each initialized to H'00 by a reset and in hardware standby mode. 12.2.2 Time Constant Registers A0 and A1 (TCORA0, TCORA1) TCORA0 Bit TCORA1 : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Initial value : 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 R/W : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W TCORA0 and TCORA1 are 8-bit readable/writable registers. TCORA0 and TCORA1 comprise a single 16-bit register so they can be accessed together by a word transfer instruction. TCORA is continually compared with the value in TCNT. When a match is detected, the corresponding CMFA flag in TCSR is set. Note, however, that comparison is disabled during the T2 state of a TCOR write cycle. The timer output can be freely controlled by these compare match signals and the settings of bits OS1 and OS0 in TCSR. Rev. 4.0, 03/03, page 546 of 1358 TCORA0 and TCORA1 are each initialized to H'FF by a reset and in hardware standby mode. 12.2.3 Time Constant Registers B0 and B1 (TCORB0, TCORB1) TCORB0 Bit TCORB1 : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Initial value : 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 R/W : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W TCORB0 and TCORB1 are 8-bit readable/writable registers. TCORB0 and TCORB1 comprise a single 16-bit register so they can be accessed together by a word transfer instruction. TCORB is continually compared with the value in TCNT. When a match is detected, the corresponding CMFB flag in TCSR is set. Note, however, that comparison is disabled during the T2 state of a TCOR write cycle. The timer output can be freely controlled by these compare match signals and the settings of output select bits OS3 and OS2 in TCSR. TCORB0 and TCORB1 are each initialized to H'FF by a reset and in hardware standby mode. 12.2.4 Bit Time Control Registers 0 and 1 (TCR0, TCR1) : Initial value : R/W : 7 6 5 4 3 2 1 0 CMIEB CMIEA OVIE CCLR1 CCLR0 CKS2 CKS1 CKS0 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W TCR0 and TCR1 are 8-bit readable/writable registers that select the clock source and the time at which TCNT is cleared, and enable interrupts. TCR0 and TCR1 are each initialized to H'00 by a reset and in hardware standby mode. For details of this timing, see section 12.3, Operation. Rev. 4.0, 03/03, page 547 of 1358 Bit 7--Compare Match Interrupt Enable B (CMIEB): Selects whether CMFB interrupt requests (CMIB) are enabled or disabled when the CMFB flag in TCSR is set to 1. Bit 7 CMIEB Description 0 CMFB interrupt requests (CMIB) are disabled 1 CMFB interrupt requests (CMIB) are enabled (Initial value) Bit 6--Compare Match Interrupt Enable A (CMIEA): Selects whether CMFA interrupt requests (CMIA) are enabled or disabled when the CMFA flag in TCSR is set to 1. Bit 6 CMIEA Description 0 CMFA interrupt requests (CMIA) are disabled 1 CMFA interrupt requests (CMIA) are enabled (Initial value) Bit 5--Timer Overflow Interrupt Enable (OVIE): Selects whether OVF interrupt requests (OVI) are enabled or disabled when the OVF flag in TCSR is set to 1. Bit 5 OVIE Description 0 OVF interrupt requests (OVI) are disabled 1 OVF interrupt requests (OVI) are enabled (Initial value) Bits 4 and 3--Counter Clear 1 and 0 (CCLR1 and CCLR0): These bits select the method by which TCNT is cleared: by compare match A or B, or by an external reset input. Bit 4 CCLR1 Bit 3 CCLR0 Description 0 0 Clearing is disabled 1 Clear by compare match A 0 Clear by compare match B 1 Clear by rising edge of external reset input 1 (Initial value) Bits 2 to 0--Clock Select 2 to 0 (CKS2 to CKS0): These bits select whether the clock input to TCNT is an internal or external clock. Three internal clocks can be selected, all divided from the system clock (): /8, /64, and /8192. The falling edge of the selected internal clock triggers the count. When use of an external clock is selected, three types of count can be selected: at the rising edge, the falling edge, and both rising and falling edges. Rev. 4.0, 03/03, page 548 of 1358 Some functions differ between channel 0 and channel 1. Bit 2 CKS2 Bit 1 CKS1 Bit 0 CKS0 Description 0 0 0 Clock input disabled 1 Internal clock, counted at falling edge of /8 0 Internal clock, counted at falling edge of /64 1 Internal clock, counted at falling edge of /8192 For channel 0: count at TCNT1 overflow signal* 1 1 0 0 (Initial value) For channel 1: count at TCNT0 compare match A* 1 1 External clock, counted at rising edge 0 External clock, counted at falling edge 1 External clock, counted at both rising and falling edges Note: * If the count input of channel 0 is the TCNT1 overflow signal and that of channel 1 is the TCNT0 compare match signal, no incrementing clock is generated. Do not use this setting. 12.2.5 Timer Control/Status Registers 0 and 1 (TCSR0, TCSR1) TCSR0 Bit : 7 6 5 4 3 2 1 0 CMFB CMFA OVF ADTE OS3 OS2 OS1 OS0 0 0 0 0 0 0 0 0 : R/(W)* R/(W)* R/(W)* R/W R/W R/W R/W R/W : 7 6 5 4 3 2 1 0 CMFB CMFA OVF -- OS3 OS2 OS1 OS0 Initial value : R/W TCSR1 Bit Initial value : R/W : 0 0 0 1 0 0 0 0 R/(W)* R/(W)* R/(W)* -- R/W R/W R/W R/W Note: * Only 0 can be written to bits 7 to 5, to clear these flags. TCSR0 and TCSR1 are 8-bit registers that display compare match and overflow statuses, and control compare match output. TCSR0 is initialized to H'00, and TCSR1 to H'10, by a reset and in hardware standby mode. Rev. 4.0, 03/03, page 549 of 1358 Bit 7--Compare Match Flag B (CMFB): Status flag indicating whether the values of TCNT and TCORB match. Bit 7 CMFB Description 0 [Clearing conditions] 1 (Initial value) * Cleared by reading CMFB when CMFB = 1, then writing 0 to CMFB * When DTC is activated by CMIB interrupt while DISEL bit of MRB in DTC is 0 [Setting condition] Set when TCNT matches TCORB Bit 6--Compare Match Flag A (CMFA): Status flag indicating whether the values of TCNT and TCORA match. Bit 6 CMFA Description 0 [Clearing conditions] 1 (Initial value) * Cleared by reading CMFA when CMFA = 1, then writing 0 to CMFA * When DTC is activated by CMIA interrupt while DISEL bit of MRB in DTC is 0 [Setting condition] Set when TCNT matches TCORA Bit 5--Timer Overflow Flag (OVF): Status flag indicating that TCNT has overflowed (changed from H'FF to H'00). Bit 5 OVF Description 0 [Clearing condition] Cleared by reading OVF when OVF = 1, then writing 0 to OVF 1 [Setting condition] Set when TCNT overflows from H'FF to H'00 Rev. 4.0, 03/03, page 550 of 1358 (Initial value) Bit 4--A/D Trigger Enable (ADTE) (TCSR0 Only): Selects enabling or disabling of A/D converter start requests by compare match A. In TCSR1, this bit is reserved: it is always read as 1 and cannot be modified. Bit 4 ADTE Description 0 A/D converter start requests by compare match A are disabled 1 A/D converter start requests by compare match A are enabled (Initial value) Bits 3 to 0--Output Select 3 to 0 (OS3 to OS0): These bits specify how the timer output level is to be changed by a compare match of TCOR and TCNT. Bits OS3 and OS2 select the effect of compare match B on the output level, bits OS1 and OS0 select the effect of compare match A on the output level, and both of them can be controlled independently. Note, however, that priorities are set such that: toggle output > 1 output > 0 output. If compare matches occur simultaneously, the output changes according to the compare match with the higher priority. Timer output is disabled when bits OS3 to OS0 are all 0. After a reset, the timer output is 0 until the first compare match event occurs. Bit 3 OS3 Bit 2 OS2 Description 0 0 No change when compare match B occurs 1 0 is output when compare match B occurs 0 1 is output when compare match B occurs 1 Output is inverted when compare match B occurs (toggle output) Bit 1 OS1 Bit 0 OS0 Description 0 0 No change when compare match A occurs 1 0 is output when compare match A occurs 0 1 is output when compare match A occurs 1 Output is inverted when compare match A occurs (toggle output) 1 1 (Initial value) (Initial value) Rev. 4.0, 03/03, page 551 of 1358 12.2.6 Module Stop Control Register (MSTPCR) MSTPCRH Bit MSTPCRL : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Initial value : 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 R/W : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W MSTPCR is a 16-bit readable/writable register that performs module stop mode control. When the MSTP12 bit in MSTPCR is set to 1, the 8-bit timer operation stops at the end of the bus cycle and a transition is made to module stop mode. Registers cannot be read or written to in module stop mode. For details, see section 21.5, Module Stop Mode. MSTPCR is initialized to H'3FFF by a reset and in hardware standby mode. It is not initialized in software standby mode. Bit 12--Module Stop (MSTP12): Specifies the 8-bit timer module stop mode. Bit 12 MSTP12 Description 0 8-bit timer module stop mode cleared 1 8-bit timer module stop mode set Rev. 4.0, 03/03, page 552 of 1358 (Initial value) 12.3 Operation 12.3.1 TCNT Incrementation Timing TCNT is incremented by input clock pulses (either internal or external). Internal Clock: Three different internal clock signals (/8, /64, or /8192) divided from the system clock () can be selected, by setting bits CKS2 to CKS0 in TCR. Figure 12-2 shows the count timing. f Internal clock Clock input to TCNT TCNT N1 N N+1 Figure 12-2 Count Timing for Internal Clock Input External Clock: Three incrementation methods can be selected by setting bits CKS2 to CKS0 in TCR: at the rising edge, the falling edge, and both rising and falling edges. Note that the external clock pulse width must be at least 1.5 states for incrementation at a single edge, and at least 2.5 states for incrementation at both edges. The counter will not increment correctly if the pulse width is less than these values. Figure 12-3 shows the timing of incrementation at both edges of an external clock signal. Rev. 4.0, 03/03, page 553 of 1358 f External clock input pin Clock input to TCNT N1 TCNT N N+1 Figure 12-3 Count Timing for External Clock Input 12.3.2 Compare Match Timing Setting of Compare Match Flags A and B (CMFA, CMFB): The CMFA and CMFB flags in TCSR are set to 1 by a compare match signal generated when the TCOR and TCNT values match. The compare match signal is generated at the last state in which the match is true, just before the timer counter is updated. Therefore, when TCOR and TCNT match, the compare match signal is not generated until the next incrementation clock input. Figure 12-4 shows this timing. f TCNT N TCOR N Compare match signal CMF Figure 12-4 Timing of CMF Setting Rev. 4.0, 03/03, page 554 of 1358 N+1 Timer Output Timing: When compare match A or B occurs, the timer output changes as specified by bits OS3 to OS0 in TCSR. Depending on these bits, the output can remain the same, change to 0, change to 1, or toggle. Figure 12-5 shows the timing when the output is set to toggle at compare match A. f Compare match A signal Timer output pin Figure 12-5 Timing of Timer Output Timing of Compare Match Clear: The timer counter is cleared when compare match A or B occurs, depending on the setting of the CCLR1 and CCLR0 bits in TCR. Figure 12-6 shows the timing of this operation. f Compare match signal TCNT N H'00 Figure 12-6 Timing of Compare Match Clear Rev. 4.0, 03/03, page 555 of 1358 12.3.3 Timing of TCNT External Reset TCNT is cleared at the rising edge of an external reset input, depending on the settings of the CCLR1 and CCLR0 bits in TCR. The clear pulse width must be at least 1.5 states. Figure 12-7 shows the timing of this operation. f External reset input pin Clear signal TCNT N1 N H'00 Figure 12-7 Timing of Clearance by External Reset 12.3.4 Timing of Overflow Flag (OVF) Setting The OVF in TCSR is set to 1 when TCNT overflows (changes from H'FF to H'00). Figure 12-8 shows the timing of this operation. f TCNT H'FF H'00 Overflow signal OVF Figure 12-8 Timing of OVF Setting Rev. 4.0, 03/03, page 556 of 1358 12.3.5 Operation with Cascaded Connection If bits CKS2 to CKS0 in either TCR0 or TCR1 are set to B'100, the 8-bit timers of the two channels are cascaded. With this configuration, a single 16-bit timer could be used (16-bit counter mode) or compare matches of the 8-bit channel 0 could be counted by the timer of channel 1 (compare match counter mode). In this case, the timer operates as below. 16-Bit Counter Mode: When bits CKS2 to CKS0 in TCR0 are set to B'100, the timer functions as a single 16-bit timer with channel 0 occupying the upper 8 bits and channel 1 occupying the lower 8 bits. * Setting of compare match flags The CMF flag in TCSR0 is set to 1 when a 16-bit compare match event occurs. The CMF flag in TCSR1 is set to 1 when a lower 8-bit compare match event occurs. * Counter clear specification If the CCLR1 and CCLR0 bits in TCR0 have been set for counter clear at compare match, the 16-bit counter (TCNT0 and TCNT1 together) is cleared when a 16-bit compare match event occurs. The 16-bit counter (TCNT0 and TCNT1 together) is cleared even if counter clear by the TMRI0 pin has also been set. The settings of the CCLR1 and CCLR0 bits in TCR1 are ignored. The lower 8 bits cannot be cleared independently. * Pin output Control of output from the TMO0 pin by bits OS3 to OS0 in TCSR0 is in accordance with the 16-bit compare match conditions. Control of output from the TMO1 pin by bits OS3 to OS0 in TCSR1 is in accordance with the lower 8-bit compare match conditions. Compare Match Counter Mode: When bits CKS2 to CKS0 in TCR1 are B'100, TCNT1 counts compare match A's for channel 0. Channels 0 and 1 are controlled independently. Conditions such as setting of the CMF flag, generation of interrupts, output from the TMO pin, and counter clear are in accordance with the settings for each channel. Usage Note: If the 16-bit counter mode and compare match counter mode are set simultaneously, the input clock pulses for TCNT0 and TCNT1 are not generated and thus the counters will stop operating. Software should therefore avoid using both these modes. Rev. 4.0, 03/03, page 557 of 1358 12.4 Interrupts 12.4.1 Interrupt Sources and DTC Activation There are three 8-bit timer interrupt sources: CMIA, CMIB, and OVI. Their relative priorities are shown in table 12-3. Each interrupt source is set as enabled or disabled by the corresponding interrupt enable bit in TCR, and independent interrupt requests are sent for each to the interrupt controller. It is also possible to activate the DTC by means of CMIA and CMIB interrupts. Table 12-3 8-Bit Timer Interrupt Sources Channel 0 1 Interrupt Source Description DTC Activation Priority High CMIA0 Interrupt by CMFA Possible CMIB0 Interrupt by CMFB Possible OVI0 Interrupt by OVF Not possible CMIA1 Interrupt by CMFA Possible CMIB1 Interrupt by CMFB Possible OVI1 Interrupt by OVF Not possible Low Note: This table shows the initial state immediately after a reset. The relative channel priorities can be changed by the interrupt controller. 12.4.2 A/D Converter Activation The A/D converter can be activated only by channel 0 compare match A. If the ADTE bit in TCSR0 is set to 1 when the CMFA flag is set to 1 by the occurrence of channel 0 compare match A, a request to start A/D conversion is sent to the A/D converter. If the 8-bit timer conversion start trigger has been selected on the A/D converter side at this time, A/D conversion is started. Rev. 4.0, 03/03, page 558 of 1358 12.5 Sample Application In the example below, the 8-bit timer is used to generate a pulse output with a selected duty cycle, as shown in figure 12-9. The control bits are set as follows: [1] In TCR, bit CCLR1 is cleared to 0 and bit CCLR0 is set to 1 so that the timer counter is cleared when its value matches the constant in TCORA. [2] In TCSR, bits OS3 to OS0 are set to B'0110, causing the output to change to 1 at a TCORA compare match and to 0 at a TCORB compare match. With these settings, the 8-bit timer provides output of pulses at a rate determined by TCORA with a pulse width determined by TCORB. No software intervention is required. TCNT H'FF Counter clear TCORA TCORB H'00 TMO Figure 12-9 Example of Pulse Output Rev. 4.0, 03/03, page 559 of 1358 12.6 Usage Notes Note that the following kinds of contention can occur in the 8-bit timer module. 12.6.1 Contention between TCNT Write and Clear If a timer counter clock pulse is generated during the T2 state of a TCNT write cycle, the clear takes priority, so that the counter is cleared and the write is not performed. Figure 12-10 shows this operation. TCNT write cycle by CPU T1 T2 f Address TCNT address Internal write signal Counter clear signal TCNT N H'00 Figure 12-10 Contention between TCNT Write and Clear Rev. 4.0, 03/03, page 560 of 1358 12.6.2 Contention between TCNT Write and Increment If a timer counter clock pulse is generated during the T2 state of a TCNT write cycle, the write takes priority and the counter is not incremented. Figure 12-11 shows this operation. TCNT write cycle by CPU T1 T2 f TCNT address Address Internal write signal TCNT input clock TCNT N M Counter write data Figure 12-11 Contention between TCNT Write and Increment Rev. 4.0, 03/03, page 561 of 1358 12.6.3 Contention between TCOR Write and Compare Match During the T2 state of a TCOR write cycle, the TCOR write has priority and the compare match signal is inhibited even if a compare match event occurs. Figure 12-12 shows this operation. TCOR write cycle by CPU T1 T2 f Address TCOR address Internal write signal TCNT N N+1 TCOR N M TCOR write data Compare match signal Inhibited Figure 12-12 Contention between TCOR Write and Compare Match Rev. 4.0, 03/03, page 562 of 1358 12.6.4 Contention between Compare Matches A and B If compare match events A and B occur at the same time, the 8-bit timer operates in accordance with the priorities for the output statuses set for compare match A and compare match B, as shown in table 12-4. Table 12-4 Timer Output Priorities Output Setting Priority Toggle output High 1 output 0 output No change 12.6.5 Low Switching of Internal Clocks and TCNT Operation TCNT may increment erroneously when the internal clock is switched over. Table 12-5 shows the relationship between the timing at which the internal clock is switched (by writing to the CKS1 and CKS0 bits) and the TCNT operation. When the TCNT clock is generated from an internal clock, the falling edge of the internal clock pulse is detected. If clock switching causes a change from high to low level, as shown in case 3 in table 12-5, a TCNT clock pulse is generated on the assumption that the switchover is a falling edge. This increments TCNT. The erroneous incrementation can also happen when switching between internal and external clocks. Rev. 4.0, 03/03, page 563 of 1358 Table 12-5 Switching of Internal Clock and TCNT Operation No. 1 Timing of Switchover by Means of CKS1 and CKS0 Bits TCNT Clock Operation Switching from 1 low to low* Clock before switchover Clock after switchover TCNT clock TCNT N N+1 CKS bit write 2 Switching from 2 low to high* Clock before switchover Clock after switchover TCNT clock TCNT N N+1 N+2 CKS bit write 3 Switching from 3 high to low* Clock before switchover Clock after switchover *4 TCNT clock TCNT N N+1 CKS bit write Rev. 4.0, 03/03, page 564 of 1358 N+2 No. 4 Timing of Switchover by Means of CKS1 and CKS0 Bits TCNT Clock Operation Switching from high to high Clock before switchover Clock after switchover TCNT clock TCNT N N+1 N+2 CKS bit write Notes: *1 *2 *3 *4 12.6.6 Includes switching from low to stop, and from stop to low. Includes switching from stop to high. Includes switching from high to stop. Generated on the assumption that the switchover is a falling edge; TCNT is incremented. Interrupts and Module Stop Mode If module stop mode is entered when an interrupt has been requested, it will not be possible to clear the CPU interrupt source or the DMAC* or DTC activation source. Interrupts should therefore be disabled before entering module stop mode. Note: * The DMAC is not supported in the H8S/2321. Rev. 4.0, 03/03, page 565 of 1358 Rev. 4.0, 03/03, page 566 of 1358 Section 13 Watchdog Timer 13.1 Overview The chip has a single-channel on-chip watchdog timer (WDT) for monitoring system operation. The WDT outputs an overflow signal (WDTOVF)* if a system crash prevents the CPU from writing to the timer counter, allowing it to overflow. At the same time, the WDT can also generate an internal reset signal for the chip. When this watchdog function is not needed, the WDT can be used as an interval timer. In interval timer operation, an interval timer interrupt is generated each time the counter overflows. 13.1.1 Features WDT features are listed below. * Switchable between watchdog timer mode and interval timer mode * WDTOVF output when in watchdog timer mode* If the counter overflows, the WDT outputs WDTOVF*. It is possible to select whether or not the entire chip is reset at the same time * Interrupt generation when in interval timer mode If the counter overflows, the WDT generates an interval timer interrupt * Choice of eight counter clock sources Note: * The WDTOVF pin function cannot be used in the F-ZTAT versions. Rev. 4.0, 03/03, page 567 of 1358 13.1.2 Block Diagram Figure 13-1 shows a block diagram of the WDT. WOVI (interrupt request signal) WDTOVF*1 Internal reset signal*2 Clock Clock select Reset control RSTCSR TCNT f/2 f/64 f/128 f/512 f/2048 f/8192 f/32768 f/131072 Internal clock sources TSCR Module bus Bus interface WDT Legend : Timer control/status register TCSR : Timer counter TCNT RSTCSR : Reset control/status register Notes: *1 The WDTOVF pin function cannot be used in the F-ZTAT versions. *2 Internal reset signal generation is specified by means of a register setting. Figure 13-1 Block Diagram of WDT Rev. 4.0, 03/03, page 568 of 1358 Internal bus Overflow Interrupt control 13.1.3 Pin Configuration Table 13-1 describes the WDT output pin. Table 13-1 WDT Pin Name Symbol Watchdog timer overflow WDTOVF* Output I/O Function Outputs counter overflow signal in watchdog timer mode Note: * The WDTOVF pin function cannot be used in the F-ZTAT versions. 13.1.4 Register Configuration The WDT has three registers, as summarized in table 13-2. These registers control clock selection, WDT mode switching, and the reset signal. Table 13-2 WDT Registers 1 Address* Name Abbreviation Initial Value 2 Write* Read H'18 H'FFBC H'FFBC H'00 3 * R/(W) H'1F H'FFBC H'FFBD H'FFBE H'FFBF R/W Timer control/status register TCSR R/(W) Timer counter TCNT R/W Reset control/status register RSTCSR *3 Notes: *1 Lower 16 bits of the address. *2 For details of write operations, see section 13.2.4, Notes on Register Access. *3 Only a write of 0 is permitted to bit 7, to clear the flag. Rev. 4.0, 03/03, page 569 of 1358 13.2 Register Descriptions 13.2.1 Timer Counter (TCNT) Bit : 7 6 5 4 3 2 1 0 Initial value : 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W R/W : TCNT is an 8-bit readable/writable*1 up-counter. When the TME bit is set to 1 in TCSR, TCNT starts counting pulses generated from the internal clock source selected by bits CKS2 to CKS0 in TCSR. When the count overflows (changes from H'FF to H'00), either the watchdog timer overflow signal (WDTOVF)*2 or an interval timer interrupt (WOVI) is generated, depending on the mode selected by the WT/IT bit in TCSR. TCNT is initialized to H'00 by a reset, in hardware standby mode, or when the TME bit is cleared to 0. It is not initialized in software standby mode. Notes: *1 TCNT is write-protected by a password to prevent accidental overwriting. For details see section 13.2.4, Notes on Register Access. *2 The WDTOVF pin function cannot be used in the F-ZTAT versions. 13.2.2 Bit Timer Control/Status Register (TCSR) : Initial value : R/W : 7 6 5 4 3 2 1 0 OVF WT/IT TME -- -- CKS2 CKS1 CKS0 0 0 0 1 1 0 0 0 R/(W)* R/W R/W -- -- R/W R/W R/W Note: * Only 0 can be written, to clear the flag. TCSR is an 8-bit readable/writable* register. Its functions include selecting the clock source to be input to TCNT, and the timer mode. TCR is initialized to H'18 by a reset and in hardware standby mode. It is not initialized in software standby mode. Note: * TCSR is write-protected by a password to prevent accidental overwriting. For details see section 13.2.4, Notes on Register Access. Rev. 4.0, 03/03, page 570 of 1358 Bit 7--Overflow Flag (OVF): Indicates that TCNT has overflowed from H'FF to H'00, when in interval timer mode. This flag cannot be set during watchdog timer operation. Bit 7 OVF 0 Description [Clearing condition] (Initial value) Cleared by reading TCSR when OVF = 1*, then writing 0 to OVF 1 [Setting condition] Set when TCNT overflows (changes from H'FF to H'00) in interval timer mode Note: * When OVF is polled and the interval timer interrupt is disabled, OVF = 1 must be read at least twice. Bit 6--Timer Mode Select (WT/IT IT): IT Selects whether the WDT is used as a watchdog timer or interval timer. If used as an interval timer, the WDT generates an interval timer interrupt request (WOVI) when TCNT overflows. If used as a watchdog timer, the WDT generates the WDTOVF signal*1 when TCNT overflows. Bit 6 WT/IT IT 0 1 Description Interval timer: Sends the CPU an interval timer interrupt request (WOVI) when TCNT overflows (Initial value) 1 2 Watchdog timer: Generates the WDTOVF signal* when TCNT overflows* Notes: *1 The WDTOVF pin function cannot be used in the F-ZTAT versions. *2 For details of the case where TCNT overflows in watchdog timer mode, see section 13.2.3, Reset Control/Status Register (RSTCSR). Bit 5--Timer Enable (TME): Selects whether TCNT runs or is halted. Bit 5 TME Description 0 TCNT is initialized to H'00 and halted 1 TCNT counts (Initial value) Bits 4 and 3--Reserved: These bits cannot be modified and are always read as 1. Rev. 4.0, 03/03, page 571 of 1358 Bits 2 to 0--Clock Select 2 to 0 (CKS2 to CKS0): These bits select one of eight internal clock sources, obtained by dividing the system clock (), for input to TCNT. Description Bit 2 CKS2 Bit 1 CKS1 Bit 0 CKS0 Clock Overflow Period (when = 20 MHz)* 0 0 0 /2 (Initial value) 25.6 s 1 /64 819.2 s 0 /128 1.6 ms 1 /512 6.6 ms 0 0 /2048 26.2 ms 1 /8192 104.9 ms 1 0 /32768 419.4 ms 1 /131072 1.68 s 1 1 Note: * The overflow period is the time from when TCNT starts counting up from H'00 until overflow occurs. 13.2.3 Bit Reset Control/Status Register (RSTCSR) : Initial value : R/W : 7 6 5 4 3 2 1 0 WOVF RSTE -- -- -- -- -- -- 0 0 0 1 1 1 1 1 R/(W)* R/W R/W -- -- -- -- -- Note: * Only 0 can be written, to clear the flag. RSTCSR is an 8-bit readable/writable* register that controls the generation of the internal reset signal when TCNT overflows, and selects the type of internal reset signal. RSTCSR is initialized to H'1F by a reset signal from the RES pin, but not by the WDT internal reset signal caused by overflows. Note: * RSTCSR is write-protected by a password to prevent accidental overwriting. For details see section 13.2.4, Notes on Register Access. Rev. 4.0, 03/03, page 572 of 1358 Bit 7--Watchdog Timer Overflow Flag (WOVF): Indicates that TCNT has overflowed (changed from H'FF to H'00) during watchdog timer operation. This bit is not set in interval timer mode. Bit 7 WOVF Description 0 [Clearing condition] (Initial value) Cleared by reading RSTCSR when WOVF = 1, then writing 0 to WOVF 1 [Setting condition] Set when TCNT overflows (changes from H'FF to H'00) during watchdog timer operation Bit 6--Reset Enable (RSTE): Specifies whether or not a reset signal is generated in the chip if TCNT overflows during watchdog timer operation. Bit 6 RSTE Description 0 Reset signal is not generated if TCNT overflows* 1 Reset signal is generated if TCNT overflows (Initial value) Note: * The modules within the chip are not reset, but TCNT and TCSR within the WDT are reset. Bit 5--Reserved: This bit should be written with 0. Bits 4 to 0--Reserved: These bits cannot be modified and are always read as 1. 13.2.4 Notes on Register Access The watchdog timer's TCNT, TCSR, and RSTCSR registers differ from other registers in being more difficult to write to. The procedures for writing to and reading these registers are given below. Writing to TCNT and TCSR: These registers must be written to by a word transfer instruction. They cannot be written to with byte instructions. Figure 13-2 shows the format of data written to TCNT and TCSR. TCNT and TCSR both have the same write address. For a write to TCNT, the upper byte of the written word must contain H'5A and the lower byte must contain the write data. For a write to TCSR, the upper byte of the written word must contain H'A5 and the lower byte must contain the write data. This transfers the write data from the lower byte to TCNT or TCSR. Rev. 4.0, 03/03, page 573 of 1358 TCNT write 15 8 7 H'5A Address: H'FFBC 0 Write data TCSR write 15 8 7 H'A5 Address: H'FFBC 0 Write data Figure 13-2 Writing to TCNT and TCSR Writing to RSTCSR: RSTCSR must be written to by a word transfer instruction to address H'FFBE. It cannot be written to with byte instructions. Figure 13-3 shows the format of data written to RSTCSR. The method of writing 0 to the WOVF bit differs from that for writing to the RSTE bit. To write 0 to the WOVF bit, the write data must have H'A5 in the upper byte and H'00 in the lower byte. This clears the WOVF bit to 0, but has no effect on the RSTE bit. To write to the RSTE bit, the upper byte must contain H'5A and the lower byte must contain the write data. This writes the value in bit 6 of the lower byte into the RSTE bit, but has no effect on the WOVF bit. Writing 0 to WOVF bit 15 8 7 H'A5 Address: H'FFBE 0 H'00 Writing to RSTE bit 15 8 7 H'5A Address: H'FFBE 0 Write data Figure 13-3 Writing to RSTCSR Reading TCNT, TCSR, and RSTCSR: These registers are read in the same way as other registers. The read addresses are H'FFBC for TCSR, H'FFBD for TCNT, and H'FFBF for RSTCSR. Rev. 4.0, 03/03, page 574 of 1358 13.3 Operation 13.3.1 Operation in Watchdog Timer Mode To use the WDT as a watchdog timer, set the WT/IT and TME bits to 1. Software must prevent TCNT overflows by rewriting the TCNT value (normally be writing H'00) before overflow occurs. This ensures that TCNT does not overflow while the system is operating normally. If TCNT overflows without being rewritten because of a system crash or other error, the WDTOVF signal* is output. This is shown in figure 13-4. This WDTOVF signal* can be used to reset the system. The WDTOVF signal* is output for 132 states when RSTE = 1, and for 130 states when RSTE = 0. If TCNT overflows when 1 is set in the RSTE bit in RSTCSR, a signal that resets the chip internally is generated at the same time as the WDTOVF signal*. The internal reset signal is output for 518 states. If a reset caused by a signal input to the RES pin occurs at the same time as a reset caused by a WDT overflow, the RES pin reset has priority and the WOVF bit in RSTCSR is cleared to 0. Note: * The WDTOVF pin function cannot be used in the F-ZTAT versions. Rev. 4.0, 03/03, page 575 of 1358 TCNT count Overflow H'FF Time H'00 WT/IT=1 TME=1 H'00 written to TCNT WOVF=1 WDTOVF and internal reset are generated *3 WT/IT=1 TME=1 WDTOVF signal*3 132 states*2 Internal reset signal*1 518 states Legend WT/IT : Timer mode select bit TME : Timer enable bit Notes: *1 The internal reset signal is generated only if the RSTE bit is set to 1. *2 130 states when the RSTE bit is cleared to 0. *3 The WDTOVF pin function cannot be used in the F-ZTAT versions. Figure 13-4 Operation in Watchdog Timer Mode Rev. 4.0, 03/03, page 576 of 1358 H'00 written to TCNT 13.3.2 Operation in Interval Timer Mode To use the WDT as an interval timer, clear the WT/IT bit in TCSR to 0 and set the TME bit to 1. An interval timer interrupt (WOVI) is generated each time TCNT overflows, provided that the WDT is operating as an interval timer, as shown in figure 13-5. This function can be used to generate interrupt requests at regular intervals. TCNT count Overflow H'FF Overflow Overflow Overflow Time H'00 WT/IT=0 TME=1 WOVI WOVI WOVI WOVI Legend WOVI: Interval timer interrupt request generation Figure 13-5 Operation in Interval Timer Mode 13.3.3 Timing of Overflow Flag (OVF) Setting The OVF flag is set to 1 if TCNT overflows during interval timer operation. At the same time, an interval timer interrupt (WOVI) is requested. This timing is shown in figure 13-6. f TCNT H'FF H'00 Overflow signal (internal signal) OVF Figure 13-6 Timing of OVF Setting Rev. 4.0, 03/03, page 577 of 1358 13.3.4 Timing of Watchdog Timer Overflow Flag (WOVF) Setting The WOVF flag is set to 1 if TCNT overflows during watchdog timer operation. At the same time, the WDTOVF signal* goes low. If TCNT overflows while the RSTE bit in RSTCSR is set to 1, an internal reset signal is generated for the entire chip. Figure 13-7 shows the timing in this case. Note: * The WDTOVF pin function cannot be used in the F-ZTAT versions. f TCNT H'FF H'00 Overflow signal (internal signal) WOVF 132 states WDTOVF signal* Internal reset signal 518 states Note: * The WDTOVF pin function cannot be used in the F-ZTAT versions. Figure 13-7 Timing of WOVF Setting 13.4 Interrupts During interval timer mode operation, an overflow generates an interval timer interrupt (WOVI). The interval timer interrupt is requested whenever the OVF flag is set to 1 in TCSR. 13.5 Usage Notes 13.5.1 Contention between Timer Counter (TCNT) Write and Increment If a timer counter clock pulse is generated during the T2 state of a TCNT write cycle, the write takes priority and the timer counter is not incremented. Figure 13-8 shows this operation. Rev. 4.0, 03/03, page 578 of 1358 TCNT write cycle T1 T2 f Address Internal write signal TCNT input clock TCNT N M Counter write data Figure 13-8 Contention between TCNT Write and Increment 13.5.2 Changing Value of CKS2 to CKS0 If bits CKS2 to CKS0 in TCSR are written to while the WDT is operating, errors may occur in the incrementation. Software must stop the watchdog timer (by clearing the TME bit to 0) before changing the value of bits CKS2 to CKS0. 13.5.3 Switching between Watchdog Timer Mode and Interval Timer Mode If the mode is switched from watchdog timer to interval timer, or vice versa, while the WDT is operating, errors may occur in the incrementation. Software must stop the watchdog timer (by clearing the TME bit to 0) before switching the mode. Rev. 4.0, 03/03, page 579 of 1358 13.5.4 System Reset by WDTOVF Signal* If the WDTOVF output signal* is input to the RES pin of the chip, the chip will not be initialized correctly. Make sure that the WDTOVF signal* is not input logically to the RES pin. To reset the entire system by means of the WDTOVF signal*, use the circuit shown in figure 13-9. Note: * The WDTOVF pin function cannot be used in the F-ZTAT versions. Chip Reset input Reset signal to entire system RES WDTOVF* Note: * The WDTOVF pin function cannot be used in the F-ZTAT versions. Figure 13-9 Circuit for System Reset by WDTOVF Signal (Example) 13.5.5 Internal Reset in Watchdog Timer Mode The chip is not reset internally if TCNT overflows while the RSTE bit is cleared to 0 during watchdog timer operation, but TCNT and TSCR of the WDT are reset. TCNT, TCSR, and RSTCR cannot be written to while the WDTOVF signal* is low. Also note that a read of the WOVF flag is not recognized during this period. To clear the WOVF flag, therefore, read RSTCSR after the WDTOVF signal* goes high, then write 0 to the WOVF flag. Note: * The WDTOVF pin function cannot be used in the F-ZTAT versions. Rev. 4.0, 03/03, page 580 of 1358 Section 14 Serial Communication Interface (SCI) 14.1 Overview The chip is equipped with a serial communication interface (SCI) that can handle both asynchronous and synchronous serial communication. A function is also provided for serial communication between processors (multiprocessor communication function). 14.1.1 Features SCI features are listed below. * Choice of asynchronous or synchronous serial communication mode Asynchronous mode Serial data communication executed using an asynchronous system in which synchronization is achieved character by character Serial data communication can be carried out with standard asynchronous communication chips such as a Universal Asynchronous Receiver/Transmitter (UART) or Asynchronous Communication Interface Adapter (ACIA) A multiprocessor communication function is provided that enables serial data communication with a number of processors Choice of 12 serial data transfer formats Data length : 7 or 8 bits Stop bit length : 1 or 2 bits Parity : Even, odd, or none Multiprocessor bit : 1 or 0 Receive error detection : Parity, overrun, and framing errors Break detection : Break can be detected by reading the RxD pin level directly in case of a framing error Synchronous mode Serial data communication synchronized with a clock Serial data communication can be carried out with other chips that have a synchronous communication function One serial data transfer format Data length Receive error detection : 8 bits : Overrun errors detected Rev. 4.0, 03/03, page 581 of 1358 * Full-duplex communication capability The transmitter and receiver are mutually independent, enabling transmission and reception to be executed simultaneously Double-buffering is used in both the transmitter and the receiver, enabling continuous transmission and continuous reception of serial data * Choice of LSB-first or MSB-first transfer Can be selected regardless of the communication mode*1 (except in the case of asynchronous mode 7-bit data) * Built-in baud rate generator allows any bit rate to be selected * Choice of serial clock source: internal clock from baud rate generator or external clock from SCK pin * Four interrupt sources Four interrupt sources--transmit-data-empty, transmit-end, receive-data-full, and receive error--that can issue requests independently The transmit-data-empty and receive-data-full interrupts can activate the DMA controller (DMAC)*2 or data transfer controller (DTC) to execute data transfer * Module stop mode can be set As the initial setting, SCI operation is halted. Register access is enabled by exiting module stop mode Notes: *1 Descriptions in this section refer to LSB-first transfer. *2 The DMAC is not supported in the H8S/2321. Rev. 4.0, 03/03, page 582 of 1358 14.1.2 Block Diagram Bus interface Figure 14-1 shows a block diagram of the SCI. Module data bus RDR RxD TxD RSR TDR SCMR SSR SCR SMR TSR BRR f Baud rate generator Transmission/ reception control Parity generation Parity check SCK Internal data bus f/4 f/16 f/64 Clock External clock TEI TXI RXI ERI Legend SCMR : Smart card mode register RSR : Receive shift register RDR : Receive data register TSR : Transmit shift register TDR : Transmit data register SMR : Serial mode register SCR : Serial control register SSR : Serial status register BRR : Bit rate register Figure 14-1 Block Diagram of SCI Rev. 4.0, 03/03, page 583 of 1358 14.1.3 Pin Configuration Table 14-1 shows the serial pins for each SCI channel. Table 14-1 SCI Pins Channel Pin Name Symbol I/O Function 0 Serial clock pin 0 SCK0 I/O SCI0 clock input/output Receive data pin 0 RxD0 Input SCI0 receive data input Transmit data pin 0 TxD0 Output SCI0 transmit data output Serial clock pin 1 SCK1 I/O SCI1 clock input/output Receive data pin 1 RxD1 Input SCI1 receive data input Transmit data pin 1 TxD1 Output SCI1 transmit data output Serial clock pin 2 SCK2 I/O SCI2 clock input/output Receive data pin 2 RxD2 Input SCI2 receive data input Transmit data pin 2 TxD2 Output SCI2 transmit data output 1 2 Rev. 4.0, 03/03, page 584 of 1358 14.1.4 Register Configuration The SCI has the internal registers shown in table 14-2. These registers are used to specify asynchronous mode or synchronous mode, the data format, and the bit rate, and to control the transmitter/receiver. Table 14-2 SCI Registers Channel Name Abbreviation R/W Initial Value 1 Address* 0 Serial mode register 0 SMR0 R/W H'00 H'FF78 Bit rate register 0 BRR0 R/W H'FF H'FF79 Serial control register 0 SCR0 R/W H'00 H'FF7A Transmit data register 0 TDR0 R/W H'FF H'FF7B SSR0 2 R/(W)* H'84 H'FF7C Serial status register 0 1 2 All Receive data register 0 RDR0 R H'00 H'FF7D Smart card mode register 0 SCMR0 R/W H'F2 H'FF7E Serial mode register 1 SMR1 R/W H'00 H'FF80 Bit rate register 1 BRR1 R/W H'FF H'FF81 Serial control register 1 SCR1 R/W H'00 H'FF82 Transmit data register 1 TDR1 R/W H'FF H'FF83 Serial status register 1 SSR1 2 R/(W)* H'84 H'FF84 Receive data register 1 RDR1 R H'00 H'FF85 Smart card mode register 1 SCMR1 R/W H'F2 H'FF86 Serial mode register 2 SMR2 R/W H'00 H'FF88 Bit rate register 2 BRR2 R/W H'FF H'FF89 Serial control register 2 SCR2 R/W H'00 H'FF8A Transmit data register 2 TDR2 R/W H'FF H'FF8B Serial status register 2 SSR2 R/(W)* H'84 H'FF8C Receive data register 2 RDR2 R H'00 H'FF8D Smart card mode register 2 SCMR2 R/W H'F2 H'FF8E Module stop control register MSTPCR R/W H'3FFF H'FF3C 2 Notes: *1 Lower 16 bits of the address. *2 Can only be written with 0 for flag clearing. Rev. 4.0, 03/03, page 585 of 1358 14.2 Register Descriptions 14.2.1 Receive Shift Register (RSR) Bit : 7 6 5 4 3 2 1 0 R/W : -- -- -- -- -- -- -- -- RSR is a register used to receive serial data. The SCI sets serial data input from the RxD pin in RSR in the order received, starting with the LSB (bit 0), and converts it to parallel data. When one byte of data has been received, it is transferred to RDR automatically. RSR cannot be directly read or written to by the CPU. 14.2.2 Bit Receive Data Register (RDR) : 7 6 5 4 3 2 1 0 Initial value : 0 0 0 0 0 0 0 0 R/W R R R R R R R R : RDR is a register that stores received serial data. When the SCI has received one byte of serial data, it transfers the received serial data from RSR to RDR where it is stored, and completes the receive operation. After this, RSR is receive-enabled. Since RSR and RDR function as a double buffer in this way, continuous receive operations can be performed. RDR is a read-only register, and cannot be written to by the CPU. RDR is initialized to H'00 by a reset, and in standby mode or module stop mode. Rev. 4.0, 03/03, page 586 of 1358 14.2.3 Transmit Shift Register (TSR) Bit : 7 6 5 4 3 2 1 0 R/W : -- -- -- -- -- -- -- -- TSR is a register used to transmit serial data. To perform serial data transmission, the SCI first transfers transmit data from TDR to TSR, then sends the data to the TxD pin starting with the LSB (bit 0). When transmission of one byte is completed, the next transmit data is transferred from TDR to TSR, and transmission started, automatically. However, data transfer from TDR to TSR is not performed if the TDRE bit in SSR is set to 1. TSR cannot be directly read or written to by the CPU. 14.2.4 Bit Transmit Data Register (TDR) : 7 6 5 4 3 2 1 0 Initial value : 1 1 1 1 1 1 1 1 R/W R/W R/W R/W R/W R/W R/W R/W R/W : TDR is an 8-bit register that stores data for serial transmission. When the SCI detects that TSR is empty, it transfers the transmit data written in TDR to TSR and starts serial transmission. Continuous serial transmission can be carried out by writing the next transmit data to TDR during serial transmission of the data in TSR. TDR can be read or written to by the CPU at all times. TDR is initialized to H'FF by a reset, and in standby mode or module stop mode. Rev. 4.0, 03/03, page 587 of 1358 14.2.5 Bit Serial Mode Register (SMR) : Initial value : R/W : 7 6 5 4 3 2 1 0 C/A CHR PE O/E STOP MP CKS1 CKS0 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W SMR is an 8-bit register used to set the SCI's serial transfer format and select the baud rate generator clock source. SMR can be read or written to by the CPU at all times. SMR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode and module stop mode it retains its previous state. Bit 7--Communication Mode (C/A A): Selects asynchronous mode or synchronous mode as the SCI operating mode. Bit 7 C/A A Description 0 Asynchronous mode 1 Synchronous mode (Initial value) Bit 6--Character Length (CHR): Selects 7 or 8 bits as the data length in asynchronous mode. In synchronous mode, a fixed data length of 8 bits is used regardless of the CHR setting. Bit 6 CHR Description 0 8-bit data 1 7-bit data* (Initial value) Note: * When 7-bit data is selected, the MSB (bit 7) of TDR is not transmitted, and it is not possible to choose between LSB-first or MSB-first transfer. Rev. 4.0, 03/03, page 588 of 1358 Bit 5--Parity Enable (PE): In asynchronous mode, selects whether or not parity bit addition is performed in transmission, and parity bit checking in reception. In synchronous mode and with a multiprocessor format, parity bit addition and checking is not performed, regardless of the PE bit setting. Bit 5 PE 0 1 Description Parity bit addition and checking disabled Parity bit addition and checking enabled* (Initial value) Note:* When the PE bit is set to 1, the parity (even or odd) specified by the O/E bit is added to transmit data before transmission. In reception, the parity bit is checked for the parity (even or odd) specified by the O/E bit. Bit 4--Parity Mode (O/E E): Selects either even or odd parity for use in parity addition and checking. The O/E bit setting is only valid when the PE bit is set to 1, enabling parity bit addition and checking, in asynchronous mode. The O/E bit setting is invalid in synchronous mode, and when parity addition and checking is disabled in asynchronous mode. Bit 4 O/E E 0 1 Description 1 Even parity* 2 Odd parity* (Initial value) Notes: *1 When even parity is set, parity bit addition is performed in transmission so that the total number of 1 bits in the transmit character plus the parity bit is even. In reception, a check is performed to see if the total number of 1 bits in the receive character plus the parity bit is even. *2 When odd parity is set, parity bit addition is performed in transmission so that the total number of 1 bits in the transmit character plus the parity bit is odd. In reception, a check is performed to see if the total number of 1 bits in the receive character plus the parity bit is odd. Rev. 4.0, 03/03, page 589 of 1358 Bit 3--Stop Bit Length (STOP): Selects 1 or 2 bits as the stop bit length in asynchronous mode. The STOP bits setting is only valid in asynchronous mode. If synchronous mode is set the STOP bit setting is invalid since stop bits are not added. Bit 3 STOP Description 0 1 stop bit: In transmission, a single 1-bit (stop bit) is added to the end of a transmit character before it is sent. (Initial value) 1 2 stop bits: In transmission, two 1-bits (stop bits) are added to the end of a transmit character before it is sent. In reception, only the first stop bit is checked, regardless of the STOP bit setting. If the second stop bit is 1, it is treated as a stop bit; if it is 0, it is treated as the start bit of the next transmit character. Bit 2--Multiprocessor Mode (MP): Selects multiprocessor format. When multiprocessor format is selected, the PE bit and O/E bit parity settings are invalid. The MP bit setting is only valid in asynchronous mode; it is invalid in synchronous mode. For details of the multiprocessor communication function, see section 14.3.3, Multiprocessor Communication Function. Bit 2 MP Description 0 Multiprocessor function disabled 1 Multiprocessor format selected Rev. 4.0, 03/03, page 590 of 1358 (Initial value) Bits 1 and 0--Clock Select 1 and 0 (CKS1, CKS0): These bits select the clock source for the baud rate generator. The clock source can be selected from , /4, /16, and /64, according to the setting of bits CKS1 and CKS0. For the relation between the clock source, the bit rate register setting, and the baud rate, see section 14.2.8, Bit Rate Register (BRR). Bit 1 CKS1 Bit 0 CKS0 Description 0 0 clock 1 /4 clock 0 /16 clock 1 /64 clock 1 14.2.6 Bit Serial Control Register (SCR) : Initial value : R/W (Initial value) : 7 6 5 4 3 2 1 0 TIE RIE TE RE MPIE TEIE CKE1 CKE0 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W SCR is a register that performs enabling or disabling of SCI transfer operations, serial clock output in asynchronous mode, and interrupt requests, and selection of the serial clock source. SCR can be read or written to by the CPU at all times. SCR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode and module stop mode it retains its previous state. Bit 7--Transmit Interrupt Enable (TIE): Enables or disables transmit-data-empty interrupt (TXI) request generation when serial transmit data is transferred from TDR to TSR and the TDRE flag in SSR is set to 1. Bit 7 TIE Description 0 Transmit-data-empty interrupt (TXI) requests disabled* 1 Transmit-data-empty interrupt (TXI) requests enabled (Initial value) Note:* TXI interrupt request cancellation can be performed by reading 1 from the TDRE flag, then clearing it to 0, or by clearing the TIE bit to 0. Rev. 4.0, 03/03, page 591 of 1358 Bit 6--Receive Interrupt Enable (RIE): Enables or disables receive-data-full interrupt (RXI) request and receive-error interrupt (ERI) request generation when serial receive data is transferred from RSR to RDR and the RDRF flag in SSR is set to 1. Bit 6 RIE Description 0 Receive-data-full interrupt (RXI) request and receive-error interrupt (ERI) request disabled* (Initial value) 1 Receive-data-full interrupt (RXI) request and receive-error interrupt (ERI) request enabled Note:* RXI and ERI interrupt request cancellation can be performed by reading 1 from the RDRF flag, or the FER, PER, or ORER flag, then clearing the flag to 0, or by clearing the RIE bit to 0. Bit 5--Transmit Enable (TE): Enables or disables the start of serial transmission by the SCI. Bit 5 TE 0 1 Description 1 Transmission disabled* 2 Transmission enabled* (Initial value) Notes: *1 The TDRE flag in SSR is fixed at 1. *2 In this state, serial transmission is started when transmit data is written to TDR and the TDRE flag in SSR is cleared to 0. SMR setting must be performed to decide the transfer format before setting the TE bit to 1. Bit 4--Receive Enable (RE): Enables or disables the start of serial reception by the SCI. Bit 4 RE 0 1 Description 1 Reception disabled* 2 Reception enabled* (Initial value) Notes: *1 Clearing the RE bit to 0 does not affect the RDRF, FER, PER, and ORER flags, which retain their states. *2 Serial reception is started in this state when a start bit is detected in asynchronous mode or serial clock input is detected in synchronous mode. SMR setting must be performed to decide the transfer format before setting the RE bit to 1. Rev. 4.0, 03/03, page 592 of 1358 Bit 3--Multiprocessor Interrupt Enable (MPIE): Enables or disables multiprocessor interrupts. The MPIE bit setting is only valid in asynchronous mode when the MP bit in SMR is set to 1. The MPIE bit setting is invalid in synchronous mode or when the MP bit is cleared to 0. Bit 3 MPIE Description 0 Multiprocessor interrupts disabled (normal reception performed) (Initial value) [Clearing conditions] * When the MPIE bit is cleared to 0 1 * When data with MPB = 1 is received Multiprocessor interrupts enabled* Receive-data-full interrupt (RXI) requests, receive-error interrupt (ERI) requests, and setting of the RDRF, FER, and ORER flags in SSR are disabled until data with the multiprocessor bit set to 1 is received. Note: * When receive data including MPB = 0 is received, receive data transfer from RSR to RDR, receive error detection, and setting of the RDRF, FER, and ORER flags in SSR, is not performed. When receive data including MPB = 1 is received, the MPB bit in SSR is set to 1, the MPIE bit is cleared to 0 automatically, and generation of RXI and ERI interrupts (when the TIE and RIE bits in SCR are set to 1) and FER and ORER flag setting is enabled. Bit 2--Transmit End Interrupt Enable (TEIE): Enables or disables transmit-end interrupt (TEI) request generation when there is no valid transmit data in TDR in MSB data transmission. Bit 2 TEIE 0 1 Description Transmit end interrupt (TEI) request disabled* Transmit end interrupt (TEI) request enabled* (Initial value) Note: * TEI cancellation can be performed by reading 1 from the TDRE flag in SSR, then clearing it to 0 and clearing the TEND flag to 0, or by clearing the TEIE bit to 0. Rev. 4.0, 03/03, page 593 of 1358 Bits 1 and 0--Clock Enable 1 and 0 (CKE1, CKE0): These bits are used to select the SCI clock source and enable or disable clock output from the SCK pin. The combination of the CKE1 and CKE0 bits determines whether the SCK pin functions as an I/O port, the serial clock output pin, or the serial clock input pin. The setting of the CKE0 bit, however, is only valid for internal clock operation (CKE1 = 0) in asynchronous mode. The CKE0 bit setting is invalid in synchronous mode, and in the case of external clock operation (CKE1 = 1). Set CKE1 and CKE0 before determining the SCI operating mode with SMR. For details of clock source selection, see table 14-9 in section 14.3, Operation. Bit 1 CKE1 Bit 0 CKE0 Description 0 0 Asynchronous mode Internal clock/SCK pin functions as I/O port* Synchronous mode Internal clock/SCK pin functions as serial clock output Asynchronous mode Internal clock/SCK pin functions as clock output* Synchronous mode Internal clock/SCK pin functions as serial clock output Asynchronous mode External clock/SCK pin functions as clock input* Synchronous mode External clock/SCK pin functions as serial clock input 3 External clock/SCK pin functions as clock input* 1 1 0 1 1 2 3 Asynchronous mode Synchronous mode External clock/SCK pin functions as serial clock input Notes: *1 Initial value *2 Outputs a clock of the same frequency as the bit rate. *3 Inputs a clock with a frequency 16 times the bit rate. 14.2.7 Bit Serial Status Register (SSR) : Initial value : R/W : 7 6 5 4 3 2 1 0 TDRE RDRF ORER FER PER TEND MPB MPBT 1 0 0 0 0 1 0 0 R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R R R/W Note: * Only 0 can be written, to clear the flag. Rev. 4.0, 03/03, page 594 of 1358 SSR is an 8-bit register containing status flags that indicate the operating status of the SCI, and multiprocessor bits. SSR can be read or written to by the CPU at all times. However, 1 cannot be written to flags TDRE, RDRF, ORER, PER, and FER. Also note that in order to clear these flags they must be read as 1 beforehand. The TEND flag and MPB flag are read-only flags and cannot be modified. SSR is initialized to H'84 by a reset, and in standby mode or module stop mode. Bit 7--Transmit Data Register Empty (TDRE): Indicates that data has been transferred from TDR to TSR and the next serial data can be written to TDR. Bit 7 TDRE Description 0 [Clearing conditions] * When 0 is written to TDRE after reading TDRE = 1 * When the DMAC* or DTC is activated by a TXI interrupt and writes data to TDR 1 [Setting conditions] * When the TE bit in SCR is 0 (Initial value) * When data is transferred from TDR to TSR and data can be written to TDR Note: * The DMAC is not supported in the H8S/2321. Bit 6--Receive Data Register Full (RDRF): Indicates that the received data is stored in RDR. Bit 6 RDRF 0 1 Description [Clearing conditions] (Initial value) * When 0 is written to RDRF after reading RDRF = 1 * When the DMAC* or DTC is activated by an RXI interrupt and reads data from RDR [Setting condition] When serial reception ends normally and receive data is transferred from RSR to RDR Notes: RDR and the RDRF flag are not affected and retain their previous values when an error is detected during reception or when the RE bit in SCR is cleared to 0. If reception of the next data is completed while the RDRF flag is still set to 1, an overrun error will occur and the receive data will be lost. * The DMAC is not supported in the H8S/2321. Rev. 4.0, 03/03, page 595 of 1358 Bit 5--Overrun Error (ORER): Indicates that an overrun error occurred during reception, causing abnormal termination. Bit 5 ORER Description 0 [Clearing condition] 1 (Initial value)* When 0 is written to ORER after reading ORER = 1 1 [Setting condition] 2 When the next serial reception is completed while RDRF = 1* Notes: *1 The ORER flag is not affected and retains its previous state when the RE bit in SCR is cleared to 0. *2 The receive data prior to the overrun error is retained in RDR, and the data received subsequently is lost. Also, subsequent serial reception cannot be continued while the ORER flag is set to 1. In synchronous mode, serial transmission cannot be continued, either. Bit 4--Framing Error (FER): Indicates that a framing error occurred during reception in asynchronous mode, causing abnormal termination. Bit 4 FER Description 0 [Clearing condition] 1 (Initial value)* When 0 is written to FER after reading FER = 1 1 [Setting condition] When the SCI checks the stop bit at the end of the receive data when reception ends, 2 and the stop bit is 0 * Notes: *1 The FER flag is not affected and retains its previous state when the RE bit in SCR is cleared to 0. *2 In 2-stop-bit mode, only the first stop bit is checked for a value of 0; the second stop bit is not checked. If a framing error occurs, the receive data is transferred to RDR but the RDRF flag is not set. Also, subsequent serial reception cannot be continued while the FER flag is set to 1. In synchronous mode, serial transmission cannot be continued, either. Rev. 4.0, 03/03, page 596 of 1358 Bit 3--Parity Error (PER): Indicates that a parity error occurred during reception using parity addition in asynchronous mode, causing abnormal termination. Bit 3 PER Description 0 [Clearing condition] 1 (Initial value)* When 0 is written to PER after reading PER = 1 1 [Setting condition] When, in reception, the number of 1 bits in the receive data plus the parity bit does not 2 match the parity setting (even or odd) specified by the O/E bit in SMR* Notes: *1 The PER flag is not affected and retains its previous state when the RE bit in SCR is cleared to 0. *2 If a parity error occurs, the receive data is transferred to RDR but the RDRF flag is not set. Also, subsequent serial reception cannot be continued while the PER flag is set to 1. In synchronous mode, serial transmission cannot be continued, either. Bit 2--Transmit End (TEND): Indicates that there is no valid data in TDR when the last bit of the transmit character is sent, and transmission has been ended. The TEND flag is read-only and cannot be modified. Bit 2 TEND Description 0 [Clearing conditions] * When 0 is written to TDRE after reading TDRE = 1 * When the DMAC* or DTC is activated by a TXI interrupt and writes data to TDR 1 [Setting conditions] (Initial value) * When the TE bit in SCR is 0 * When TDRE = 1 at transmission of the last bit of a 1-byte serial transmit character Note: * The DMAC is not supported in the H8S/2321. Bit 1--Multiprocessor Bit (MPB): When reception is performed using multiprocessor format in asynchronous mode, MPB stores the multiprocessor bit in the receive data. MPB is a read-only bit, and cannot be modified. Rev. 4.0, 03/03, page 597 of 1358 Bit 1 MPB Description [Clearing condition] (Initial value)* When data with a 0 multiprocessor bit is received 1 [Setting condition] When data with a 1 multiprocessor bit is received Note: * Retains its previous state when the RE bit in SCR is cleared to 0 with multiprocessor format. 0 Bit 0--Multiprocessor Bit Transfer (MPBT): When transmission is performed using multiprocessor format in asynchronous mode, MPBT stores the multiprocessor bit to be added to the transmit data. The MPBT bit setting is invalid when multiprocessor format is not used, when not transmitting, and in synchronous mode. Bit 0 MPBT Description 0 Data with a 0 multiprocessor bit is transmitted 1 Data with a 1 multiprocessor bit is transmitted 14.2.8 Bit (Initial value) Bit Rate Register (BRR) : 7 6 5 4 3 2 1 0 Initial value : 1 1 1 1 1 1 1 1 R/W R/W R/W R/W R/W R/W R/W R/W R/W : BRR is an 8-bit register that sets the serial transfer bit rate in accordance with the baud rate generator operating clock selected by bits CKS1 and CKS0 in SMR. BRR can be read or written to by the CPU at all times. BRR is initialized to H'FF by a reset and in hardware standby mode. In software standby mode and module stop mode it retains its previous state. As baud rate generator control is performed independently for each channel, different values can be set for each channel. Table 14-3 shows sample BRR settings in asynchronous mode, and table 14-4 shows sample BRR settings in synchronous mode. Rev. 4.0, 03/03, page 598 of 1358 Table 14-3 BRR Settings for Various Bit Rates (Asynchronous Mode) = 2 MHz = 2.097152 MHz Bit Rate (bits/s) n N Error (%) n N Error (%) 110 1 141 0.03 1 148 150 1 103 0.16 1 300 0 207 0.16 600 0 103 1200 0 2400 4800 = 2.4576 MHz = 3 MHz N Error (%) -0.04 1 174 108 0.21 1 0 217 0.21 0.16 0 108 0.21 51 0.16 0 54 -0.70 0 0 25 0.16 0 26 1.14 0 31 0.00 0 38 0.16 0 12 0.16 0 13 -2.48 0 15 0.00 0 19 -2.34 9600 0 6 -- 0 6 -2.48 0 7 0.00 0 9 -2.34 19200 0 2 -- 0 2 -- 0 3 0.00 0 4 -2.34 31250 0 1 0.00 0 1 -- 0 1 -- 0 2 0.00 38400 0 1 -- 0 1 -- 0 1 0.00 -- -- -- = 3.6864 MHz N Error (%) -0.26 1 212 0.03 127 0.00 1 155 0.16 0 255 0.00 1 77 0.16 0 127 0.00 0 155 0.16 63 0.00 0 77 0.16 n = 4 MHz n = 4.9152 MHz = 5 MHz Bit Rate (bits/s) n N Error (%) n N Error (%) n N Error (%) n N Error (%) 110 2 64 0.70 2 70 0.03 2 86 0.31 2 88 -0.25 150 1 191 0.00 1 207 0.16 1 255 0.00 2 64 0.16 300 1 95 0.00 1 103 0.16 1 127 0.00 1 129 0.16 600 0 191 0.00 0 207 0.16 0 255 0.00 1 64 0.16 1200 0 95 0.00 0 103 0.16 0 127 0.00 0 129 0.16 2400 0 47 0.00 0 51 0.16 0 63 0.00 0 64 0.16 4800 0 23 0.00 0 25 0.16 0 31 0.00 0 32 -1.36 9600 0 11 0.00 0 12 0.16 0 15 0.00 0 15 1.73 19200 0 5 0.00 0 6 -- 0 7 0.00 0 7 1.73 31250 -- -- -- 0 3 0.00 0 4 -1.70 0 4 0.00 38400 0 2 0.00 0 2 -- 0 3 0.00 3 1.73 0 Rev. 4.0, 03/03, page 599 of 1358 = 6 MHz Bit Rate (bits/s) n N Error (%) 110 2 106 150 2 300 = 6.144 MHz = 7.3728 MHz = 8 MHz N Error (%) n N Error (%) -0.44 2 108 0.08 2 130 77 0.16 2 79 0.00 2 1 155 0.16 1 159 0.00 1 600 1 77 0.16 1 79 0.00 1 95 0.00 1 103 0.16 1200 0 155 0.16 0 159 0.00 0 191 0.00 0 207 0.16 2400 0 77 0.16 0 79 0.00 0 95 0.00 0 103 0.16 4800 0 38 0.16 0 39 0.00 0 47 0.00 0 51 0.16 9600 0 19 -2.34 0 19 0.00 0 23 0.00 0 25 0.16 19200 0 9 -2.34 0 9 0.00 0 11 0.00 0 12 0.16 31250 0 5 0.00 0 5 2.40 -- -- -- 0 7 0.00 38400 0 4 -2.34 0 4 0.00 0 5 0.00 -- -- -- n = 9.8304 MHz Bit Rate (bits/s) n N Error (%) 110 2 174 150 2 300 = 10 MHz N Error (%) -0.26 2 177 127 0.00 2 1 255 0.00 600 1 127 1200 0 255 2400 0 4800 N Error (%) -0.07 2 141 0.03 95 0.00 2 103 0.16 191 0.00 1 207 0.16 n = 12 MHz = 12.288 MHz N Error (%) n N Error (%) -0.25 2 212 0.03 2 217 0.08 129 0.16 2 155 0.16 2 159 0.00 2 64 0.16 2 77 0.16 2 79 0.00 0.00 1 129 0.16 1 155 0.16 1 159 0.00 0.00 1 64 0.16 1 77 0.16 1 79 0.00 127 0.00 0 129 0.16 0 155 0.16 0 159 0.00 0 63 0.00 0 64 0.16 0 77 0.16 0 79 0.00 9600 0 31 0.00 0 32 -1.36 0 38 0.16 0 39 0.00 19200 0 15 0.00 0 15 1.73 0 19 -2.34 0 19 0.00 31250 0 9 -1.70 0 9 0.00 0 11 0.00 11 2.40 38400 0 7 0.00 7 1.73 0 9 -2.34 0 9 0.00 Rev. 4.0, 03/03, page 600 of 1358 n 0 n 0 = 14 MHz Bit Rate (bits/s) n N Error (%) 110 2 248 150 2 300 = 14.7456 MHz = 16 MHz = 17.2032 MHz N Error (%) n N Error (%) n N Error (%) -0.17 3 64 0.70 3 70 0.03 3 75 0.48 181 0.16 2 191 0.00 2 207 0.16 2 223 0.00 2 90 0.16 2 95 0.00 2 103 0.16 2 111 0.00 600 1 181 0.16 1 191 0.00 1 207 0.16 1 223 0.00 1200 1 90 0.16 1 95 0.00 1 103 0.16 1 111 0.00 2400 0 181 0.16 0 191 0.00 0 207 0.16 0 223 0.00 4800 0 90 0.16 0 95 0.00 0 103 0.16 0 111 0.00 9600 0 45 -0.93 0 47 0.00 0 51 0.16 0 55 0.00 19200 0 22 -0.93 0 23 0.00 0 25 0.16 0 27 0.00 31250 0 13 0.00 0 14 -1.70 0 15 0.00 0 16 1.20 38400 0 10 -- 0 11 0.00 12 0.16 0 13 0.00 n = 18 MHz Bit Rate (bits/s) n N Error (%) 110 3 79 150 2 300 0 = 19.6608 MHz = 20 MHz N Error (%) n N Error (%) -0.12 3 86 0.31 3 88 233 0.16 2 255 0.00 3 2 116 0.16 2 127 0.00 600 1 233 0.16 1 255 1200 1 116 0.16 1 127 2400 0 233 0.16 0 4800 0 116 0.16 0 9600 0 58 19200 0 31250 38400 = 25 MHz N Error (%) -0.25 3 110 -0.02 64 0.16 3 80 -0.47 2 129 0.16 2 162 0.15 0.00 2 64 0.16 2 80 -0.47 0.00 1 129 0.16 1 162 0.15 255 0.00 1 64 0.16 1 80 -0.47 127 0.00 0 129 0.16 0 162 0.15 -0.69 0 63 0.00 0 64 0.16 0 80 -0.47 28 1.02 0 31 0.00 0 32 -1.36 0 40 -0.76 0 17 0.00 0 19 -1.70 0 19 0.00 0 24 1.00 0 14 -2.34 0 15 0.00 15 1.73 0 19 1.73 n 0 n Rev. 4.0, 03/03, page 601 of 1358 Table 14-4 BRR Settings for Various Bit Rates (Synchronous Mode) Bit Rate = 2 MHz (bits/s) n N 110 3 70 250 2 500 1 1k = 4 MHz = 8 MHz = 10 MHz = 16 MHz n N n N n N n N 124 2 249 3 124 -- -- 3 249 249 2 124 2 249 -- -- 3 1 124 1 249 2 124 -- -- 2.5 k 0 199 1 99 1 199 1 5k 0 99 0 199 1 99 10 k 0 49 0 99 0 25 k 0 19 0 39 0 50 k 0 9 0 19 100 k 0 4 0 250 k 0 1 500 k 0 0* 1M = 25 MHz n N 124 -- -- 2 249 -- 249 2 99 1 124 1 199 199 0 249 1 99 1 124 1 155 79 0 99 0 159 0 199 0 249 0 39 0 49 0 79 0 99 0 124 9 0 19 0 24 0 39 0 49 0 62 0 3 0 7 0 9 0 15 0 19 0 24 0 1 0 3 0 4 0 0* 0 1 2.5 M 0 5M Note: Blank -- * = 20 MHz 0* n N -- 3 97 2 124 2 155 1 249 2 77 0 7 0 9 -- -- 0 3 0 4 -- -- 0 1 -- -- 0 0* -- -- As far as possible, the setting should be made so that the error is no more than 1%. : Cannot be set. : Can be set, but there will be a degree of error. : Continuous transfer is not possible. Rev. 4.0, 03/03, page 602 of 1358 The BRR setting is found from the following formulas. Asynchronous mode: N= 64 x 2 2n-1 xB x 106 - 1 Synchronous mode: N= Where B: N: : n: 8x2 2n-1 xB x 106 - 1 Bit rate (bits/s) BRR setting for baud rate generator (0 N 255) Operating frequency (MHz) Baud rate generator input clock (n = 0 to 3) (See the table below for the relation between n and the clock.) SMR Setting n Clock CKS1 CKS0 0 0 0 1 /4 0 1 2 /16 1 0 3 /64 1 1 The bit rate error in asynchronous mode is found from the following formula: Error (%) = { x 106 (N + 1) x B x 64 x 22n-1 - 1} x 100 Rev. 4.0, 03/03, page 603 of 1358 Table 14-5 shows the maximum bit rate for each frequency in asynchronous mode. Tables 14-6 and 14-7 show the maximum bit rates with external clock input. Table 14-5 Maximum Bit Rate for Each Frequency (Asynchronous Mode) (MHz) Maximum Bit Rate (bits/s) n N 2 62500 0 0 2.097152 65536 0 0 2.4576 76800 0 0 3 93750 0 0 3.6864 115200 0 0 4 125000 0 0 4.9152 153600 0 0 5 156250 0 0 6 187500 0 0 6.144 192000 0 0 7.3728 230400 0 0 8 250000 0 0 9.8304 307200 0 0 10 312500 0 0 12 375000 0 0 12.288 384000 0 0 14 437500 0 0 14.7456 460800 0 0 16 500000 0 0 17.2032 537600 0 0 18 562500 0 0 19.6608 614400 0 0 20 625000 0 0 25 781250 0 0 Rev. 4.0, 03/03, page 604 of 1358 Table 14-6 Maximum Bit Rate with External Clock Input (Asynchronous Mode) (MHz) External Input Clock (MHz) Maximum Bit Rate (bits/s) 2 0.5000 31250 2.097152 0.5243 32768 2.4576 0.6144 38400 3 0.7500 46875 3.6864 0.9216 57600 4 1.0000 62500 4.9152 1.2288 76800 5 1.2500 78125 6 1.5000 93750 6.144 1.5360 96000 7.3728 1.8432 115200 8 2.0000 125000 9.8304 2.4576 153600 10 2.5000 156250 12 3.0000 187500 12.288 3.0720 192000 14 3.5000 218750 14.7456 3.6864 230400 16 4.0000 250000 17.2032 4.3008 268800 18 4.5000 281250 19.6608 4.9152 307200 20 5.0000 312500 25 6.2500 390625 Rev. 4.0, 03/03, page 605 of 1358 Table 14-7 Maximum Bit Rate with External Clock Input (Synchronous Mode) (MHz) External Input Clock (MHz) Maximum Bit Rate (bits/s) 2 0.3333 333333.3 4 0.6667 666666.7 6 1.0000 1000000.0 8 1.3333 1333333.3 10 1.6667 1666666.7 12 2.0000 2000000.0 14 2.3333 2333333.3 16 2.6667 2666666.7 18 3.0000 3000000.0 20 3.3333 3333333.3 25 4.1667 4166666.7 14.2.9 Bit Smart Card Mode Register (SCMR) : 7 6 5 4 3 2 1 0 -- -- -- -- SDIR SINV -- SMIF Initial value : 1 1 1 1 0 0 1 0 R/W -- -- -- -- R/W R/W -- R/W : SCMR selects LSB-first or MSB-first transfer by means of bit SDIR. Except in the case of asynchronous mode 7-bit data, LSB-first or MSB-first transfer can be selected regardless of the serial communication mode. The descriptions in this chapter refer to LSB-first transfer. For details of the other bits in SCMR, see section 15.2.1, Smart Card Mode Register (SCMR). SCMR is initialized to H'F2 by a reset and in hardware standby mode. In software standby mode and module stop mode it retains its previous state. Bits 7 to 4--Reserved: These bits cannot be modified and are always read as 1. Rev. 4.0, 03/03, page 606 of 1358 Bit 3--Smart Card Data Transfer Direction (SDIR): Selects the serial/parallel conversion format. This bit is valid when 8-bit data is used as the transmit/receive format. Bit 3 SDIR Description 0 TDR contents are transmitted LSB-first (Initial value) Receive data is stored in RDR LSB-first 1 TDR contents are transmitted MSB-first Receive data is stored in RDR MSB-first Bit 2--Smart Card Data Invert (SINV): Specifies inversion of the data logic level. The SINV bit does not affect the logic level of the parity bit(s): parity bit inversion requires inversion of the O/E bit in SMR. Bit 2 SINV Description 0 TDR contents are transmitted without modification (Initial value) Receive data is stored in RDR without modification 1 TDR contents are inverted before being transmitted Receive data is stored in RDR in inverted form Bit 1--Reserved: This bit cannot be modified and is always read as 1. Bit 0--Smart Card Interface Mode Select (SMIF): When the smart card interface operates as a normal SCI, 0 should be written to this bit. Bit 0 SMIF Description 0 Operates as normal SCI (smart card interface function disabled) 1 Smart card interface function enabled (Initial value) Rev. 4.0, 03/03, page 607 of 1358 14.2.10 Module Stop Control Register (MSTPCR) MSTPCRH Bit MSTPCRL : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Initial value : 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 R/W : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W MSTPCR is a 16-bit readable/writable register that performs module stop mode control. When the corresponding bit of bits MSTP7 to MSTP5 is set to 1, SCI operation stops at the end of the bus cycle and a transition is made to module stop mode. Registers cannot be read or written to in module stop mode. For details, see section 21.5, Module Stop Mode. MSTPCR is initialized to H'3FFF by a reset and in hardware standby mode. It is not initialized in software standby mode. Bit 7--Module Stop (MSTP7): Specifies the SCI channel 2 module stop mode. Bit 7 MSTP7 Description 0 SCI channel 2 module stop mode cleared 1 SCI channel 2 module stop mode set (Initial value) Bit 6--Module Stop (MSTP6): Specifies the SCI channel 1 module stop mode. Bit 6 MSTP6 Description 0 SCI channel 1 module stop mode cleared 1 SCI channel 1 module stop mode set (Initial value) Bit 5--Module Stop (MSTP5): Specifies the SCI channel 0 module stop mode. Bit 5 MSTP5 Description 0 SCI channel 0 module stop mode cleared 1 SCI channel 0 module stop mode set Rev. 4.0, 03/03, page 608 of 1358 (Initial value) 14.3 Operation 14.3.1 Overview The SCI can carry out serial communication in two modes: asynchronous mode in which synchronization is achieved character by character, and synchronous mode in which synchronization is achieved with clock pulses. Selection of asynchronous or synchronous mode and the transmission format is made using SMR as shown in table 14-8. The SCI clock is determined by a combination of the C/A bit in SMR and the CKE1 and CKE0 bits in SCR, as shown in table 14-9. Asynchronous Mode * Data length: Choice of 7 or 8 bits * Choice of parity addition, multiprocessor bit addition, and addition of 1 or 2 stop bits (the combination of these parameters determines the transfer format and character length) * Detection of framing, parity, and overrun errors, and breaks, during reception * Choice of internal or external clock as SCI clock source When internal clock is selected: The SCI operates on the baud rate generator clock and a clock with the same frequency as the bit rate can be output When external clock is selected: A clock with a frequency of 16 times the bit rate must be input (the built-in baud rate generator is not used) Synchronous Mode * Transfer format: Fixed 8-bit data * Detection of overrun errors during reception * Choice of internal or external clock as SCI clock source When internal clock is selected: The SCI operates on the baud rate generator clock and a serial clock is output off-chip When external clock is selected: The built-in baud rate generator is not used, and the SCI operates on the input serial clock Rev. 4.0, 03/03, page 609 of 1358 Table 14-8 SMR Settings and Serial Transfer Format Selection SCI Transfer Format SMR Settings Mode Data Length Multiprocessor Bit Parity Bit Stop Bit Length 0 Asynchronous 8-bit data No No 1 bit 1 mode Bit 7 Bit 6 Bit 2 Bit 5 Bit 3 C/A A CHR MP PE STOP 0 0 0 0 1 0 0 0 2 bits Yes 1 bit No 1 bit 1 1 2 bits 7-bit data 1 1 2 bits 0 Yes 1 0 1 1 1 -- -- 1 bit 2 bits -- 0 Asynchronous -- 1 -- 0 mode (multiprocessor format) -- 1 -- -- 8-bit data Yes No 1 bit 2 bits 7-bit data 1 bit 2 bits Synchronous mode 8-bit data No None Table 14-9 SMR and SCR Settings and SCI Clock Source Selection SMR SCR Setting SCI Transmit/Receive Clock Bit 7 Bit 1 Bit 0 C/A A CKE1 CKE0 Mode 0 0 0 Asynchronous mode 1 1 0 Clock Source SCK Pin Function Internal SCI does not use SCK pin Outputs clock with same frequency as bit rate External Inputs clock with frequency of 16 times the bit rate Internal Outputs serial clock External Inputs serial clock 1 1 0 0 1 1 Synchronous mode 0 1 Rev. 4.0, 03/03, page 610 of 1358 14.3.2 Operation in Asynchronous Mode In asynchronous mode, characters are sent or received, each preceded by a start bit indicating the start of communication and one or two stop bits indicating the end of communication. Serial communication is thus carried out with synchronization established on a character-by-character basis. Inside the SCI, the transmitter and receiver are independent units, enabling full-duplex communication. Both the transmitter and the receiver also have a double-buffered structure, so that data can be read or written during transmission or reception, enabling continuous data transfer. Figure 14-2 shows the general format for asynchronous serial communication. In asynchronous serial communication, the communication line is usually held in the mark state (high level). The SCI monitors the communication line, and when it goes to the space state (low level), recognizes a start bit and starts serial communication. One serial communication character consists of a start bit (low level), followed by data (in LSBfirst order), a parity bit (high or low level), and finally one or two stop bits (high level). In asynchronous mode, the SCI performs synchronization at the falling edge of the start bit in reception. The SCI samples the data on the 8th pulse of a clock with a frequency of 16 times the length of one bit, so that the transfer data is latched at the center of each bit. Idle state (mark state) 1 Serial data LSB 0 D0 1 MSB D1 D2 D3 D4 D5 Start bit Transmit/receive data 1 bit 7 or 8 bits D6 D7 0/1 1 1 Parity Stop bit(s) bit 1 bit, or none 1 or 2 bits One unit of transfer data (character or frame) Figure 14-2 Data Format in Asynchronous Communication (Example with 8-Bit Data, Parity, Two Stop Bits) Data Transfer Format: Table 14-10 shows the data transfer formats that can be used in asynchronous mode. Any of 12 transfer formats can be selected according to the SMR setting. Rev. 4.0, 03/03, page 611 of 1358 Table 14-10 Serial Transfer Formats (Asynchronous Mode) SMR Settings Serial Transfer Format and Frame Length CHR PE MP STOP 1 0 0 0 0 S 8-bit data STOP 0 0 0 1 S 8-bit data STOP STOP 0 1 0 0 S 8-bit data P STOP 0 1 0 1 S 8-bit data P STOP STOP 1 0 0 0 S 7-bit data STOP 1 0 0 1 S 7-bit data STOP STOP 1 1 0 0 S 7-bit data P STOP 1 1 0 1 S 7-bit data P STOP STOP 0 3/4 1 0 S 8-bit data MPB STOP 0 3/4 1 1 S 8-bit data MPB STOP STOP 1 3/4 1 0 S 7-bit data MPB STOP 1 3/4 1 1 S 7-bit data MPB STOP STOP Legend S : Start bit STOP : Stop bit P : Parity bit MPB : Multiprocessor bit Rev. 4.0, 03/03, page 612 of 1358 2 3 4 5 6 7 8 9 10 11 12 Clock: Either an internal clock generated by the built-in baud rate generator or an external clock input at the SCK pin can be selected as the SCI's serial clock, according to the setting of the C/A bit in SMR and the CKE1 and CKE0 bits in SCR. For details of SCI clock source selection, see table 14-9. When an external clock is input at the SCK pin, the clock frequency should be 16 times the bit rate used. When the SCI is operated on an internal clock, the clock can be output from the SCK pin. The frequency of the clock output in this case is equal to the bit rate, and the phase is such that the rising edge of the clock is at the center of each transmit data bit, as shown in figure 14-3. 0 D0 D1 D2 D3 D4 D5 D6 D7 0/1 1 1 1 frame Figure 14-3 Relation between Output Clock and Transfer Data Phase (Asynchronous Mode) Data Transfer Operations * SCI initialization (asynchronous mode) Before transmitting or receiving data, first clear the TE and RE bits in SCR to 0, then initialize the SCI as described below. When the operating mode, transfer format, etc., is changed, the TE and RE bits must be cleared to 0 before making the change using the following procedure. When the TE bit is cleared to 0, the TDRE flag is set to 1 and TSR is initialized. Note that clearing the RE bit to 0 does not change the contents of the RDRF, PER, FER, and ORER flags, or the contents of RDR. When an external clock is used the clock should not be stopped during operation, including initialization, since operation will be unreliable in this case. Rev. 4.0, 03/03, page 613 of 1358 Figure 14-4 shows a sample SCI initialization flowchart. [1] Set the clock selection in SCR. Be sure to clear bits RIE, TIE, TEIE, and MPIE, and bits TE and RE, to 0. Start of initialization Clear TE and RE bits in SCR to 0 Set CKE1 and CKE0 bits in SCR (TE, RE bits 0) Set data transfer format in SMR and SCMR Set value in BRR [1] [2] [3] When the clock is selected in asynchronous mode, it is output immediately after SCR settings are made. [2] Set the data transfer format in SMR and SCMR. [3] Write a value corresponding to the bit rate to BRR. (Not necessary if an external clock is used.) Wait No 1-bit interval elapsed? Yes Set TE or RE bit in SCR to 1, and set RIE, TIE, TEIE, and MPIE bits as necessary [4] Wait at least one bit interval, then set the TE bit or RE bit in SCR to 1. Also set the RIE, TIE, TEIE, and MPIE bits as necessary. Setting the TE or RE bit enables the TxD or RxD pin to be used. [4] <Initialization completed> Figure 14-4 Sample SCI Initialization Flowchart Rev. 4.0, 03/03, page 614 of 1358 * Serial data transmission (asynchronous mode) Figure 14-5 shows a sample flowchart for serial transmission. The following procedure should be used for serial data transmission. Initialization [1] Start of transmission Read TDRE flag in SSR [2] [2] SCI status check and transmit data write: Read SSR and check that the TDRE flag is set to 1, then write transmit data to TDR and clear the TDRE flag to 0. No TDRE = 1? Yes Write transmit data to TDR and clear TDRE flag in SSR to 0 No All data transmitted? Yes [3] Read TEND flag in SSR No TEND = 1? Yes No Break output? Yes [1] SCI initialization: The TxD pin is automatically designated as the transmit data output pin. After the TE bit is set to 1, a frame of 1s is output, and transmission is enabled. [4] [3] Serial transmission continuation procedure: To continue serial transmission, read 1 from the TDRE flag to confirm that writing is possible, then write data to TDR, and then clear the TDRE flag to 0. Checking and clearing of the TDRE flag is automatic when the DMAC* or DTC is activated by a transmit-dataempty interrupt (TXI) request, and data is written to TDR. [4] Break output at the end of serial transmission: To output a break in serial transmission, set DDR for the port corresponding to the TxD pin to 1, clear DR to 0, then clear the TE bit in SCR to 0. Clear DR to 0 and set DDR to 1 Clear TE bit in SCR to 0 <End> Note: * The DMAC is not supported in the H8S/2321. Figure 14-5 Sample Serial Transmission Flowchart Rev. 4.0, 03/03, page 615 of 1358 In serial transmission, the SCI operates as described below. [1] The SCI monitors the TDRE flag in SSR, and if is 0, recognizes that data has been written to TDR, and transfers the data from TDR to TSR. [2] After transferring data from TDR to TSR, the SCI sets the TDRE flag to 1 and starts transmission. If the TIE bit is set to 1 at this time, a transmit-data-empty interrupt (TXI) is generated. The serial transmit data is sent from the TxD pin in the following order. [a] Start bit: One 0-bit is output. [b] Transmit data: 8-bit or 7-bit data is output in LSB-first order. [c] Parity bit or multiprocessor bit: One parity bit (even or odd parity), or one multiprocessor bit is output. A format in which neither a parity bit nor a multiprocessor bit is output can also be selected. [d] Stop bit(s): One or two 1-bits (stop bits) are output. [e] Mark state: 1 is output continuously until the start bit that starts the next transmission is sent. [3] The SCI checks the TDRE flag at the timing for sending the stop bit. If the TDRE flag is cleared to 0, the data is transferred from TDR to TSR, the stop bit is sent, and then serial transmission of the next frame is started. If the TDRE flag is set to 1, the TEND flag in SSR is set to 1, the stop bit is sent, and then the mark state is entered in which 1 is output continuously. If the TEIE bit in SCR is set to 1 at this time, a TEI interrupt request is generated. Rev. 4.0, 03/03, page 616 of 1358 Figure 14-6 shows an example of the operation for transmission in asynchronous mode. 1 Start bit 0 Data D0 D1 Parity Stop Start bit bit bit D7 0/1 1 0 Data D0 D1 Parity Stop bit bit D7 0/1 1 1 Idle state (mark state) TDRE TEND TXI interrupt Data written to TDR and TXI interrupt request generated TDRE flag cleared to 0 in request generated TXI interrupt handling routine TEI interrupt request generated 1 frame Figure 14-6 Example of Transmit Operation in Asynchronous Mode (Example with 8-Bit Data, Parity, One Stop Bit) Rev. 4.0, 03/03, page 617 of 1358 * Serial data reception (asynchronous mode) Figure 14-7 shows a sample flowchart for serial reception. The following procedure should be used for serial data reception. Initialization [1] Start of reception [1] SCI initialization: The RxD pin is automatically designated as the receive data input pin. [2] [3] Receive error handling and break detection: Read ORER, PER, and If a receive error occurs, read the [2] FER flags in SSR ORER, PER, and FER flags in SSR to identify the error. After performing the appropriate error Yes processing, ensure that the PER U FER U ORER = 1? ORER, PER, and FER flags are [3] all cleared to 0. Reception cannot No Error handling be resumed if any of these flags (Continued on next page) are set to 1. In the case of a framing error, a break can be detected by reading the value of [4] Read RDRF flag in SSR the input port corresponding to the RxD pin. No RDRF = 1? [4] SCI status check and receive data read : Read SSR and check that RDRF = 1, then read the receive data in RDR and clear the RDRF flag to 0. Transition of the RDRF flag from 0 to 1 can also be identified by an RXI interrupt. Yes Read receive data in RDR, and clear RDRF flag in SSR to 0 No All data received? [5] Yes Clear RE bit in SCR to 0 <End> Note: * The DMAC is not supported in the H8S/2321. [5] Serial reception continuation procedure: To continue serial reception, before the stop bit for the current frame is received, read the RDRF flag, read RDR, and clear the RDRF flag to 0. The RDRF flag is cleared automatically when the DMAC* or DTC is activated by an RXI interrupt and the RDR value is read. Figure 14-7 Sample Serial Reception Flowchart Rev. 4.0, 03/03, page 618 of 1358 [3] Error handling No ORER = 1? Yes Overrun error handling No FER = 1? Yes No Break? Yes Framing error handling Clear RE bit in SCR to 0 No PER = 1? Yes Parity error handling Clear ORER, PER, and FER flags in SSR to 0 <End> Figure 14-7 Sample Serial Reception Flowchart (cont) Rev. 4.0, 03/03, page 619 of 1358 In serial reception, the SCI operates as described below. [1] The SCI monitors the communication line, and if a 0 stop bit is detected, performs internal synchronization and starts reception. [2] The received data is stored in RSR in LSB-to-MSB order. [3] The parity bit and stop bit are received. After receiving these bits, the SCI carries out the following checks. [a] Parity check: The SCI checks whether the number of 1 bits in the receive data agrees with the parity (even or odd) set in the O/E bit in SMR. [b] Stop bit check: The SCI checks whether the stop bit is 1. If there are two stop bits, only the first is checked. [c] Status check: The SCI checks whether the RDRF flag is 0, indicating that the receive data can be transferred from RSR to RDR. If all the above checks are passed, the RDRF flag is set to 1, and the receive data is stored in RDR. If a receive error* is detected in the error check, the operation is as shown in table 14-11. Note: * Subsequent receive operations cannot be performed when a receive error has occurred. Also note that the RDRF flag is not set to 1 in reception, and so the error flags must be cleared to 0. [4] If the RIE bit in SCR is set to 1 when the RDRF flag changes to 1, a receive-data-full interrupt (RXI) request is generated. Also, if the RIE bit in SCR is set to 1 when the ORER, PER, or FER flag changes to 1, a receive-error interrupt (ERI) request is generated. Rev. 4.0, 03/03, page 620 of 1358 Table 14-11 Receive Error Conditions Receive Error Abbreviation Condition Data Transfer Overrun error ORER When the next data reception is Receive data is not completed while the RDRF flag transferred from RSR to in SSR is set to 1 RDR Framing error FER When the stop bit is 0 Parity error PER When the received data differs Receive data is transferred from the parity (even or odd) set from RSR to RDR in SMR Receive data is transferred from RSR to RDR Figure 14-8 shows an example of the operation for reception in asynchronous mode. 1 Start bit 0 Data D0 D1 Parity Stop Start bit bit bit D7 0/1 1 0 Data D0 D1 Parity Stop bit bit D7 0/1 0 1 Idle state (mark state) RDRF FER RXI interrupt request generated RDR data read and RDRF flag cleared to 0 in RXI interrupt handling routine ERI interrupt request generated by framing error 1 frame Figure 14-8 Example of SCI Receive Operation (Example with 8-Bit Data, Parity, One Stop Bit) Rev. 4.0, 03/03, page 621 of 1358 14.3.3 Multiprocessor Communication Function The multiprocessor communication function performs serial communication using the multiprocessor format, in which a multiprocessor bit is added to the transfer data, in asynchronous mode. Use of this function enables data transfer to be performed among a number of processors sharing a single serial communication line. When multiprocessor communication is carried out, each receiving station is addressed by a unique ID code. The serial communication cycle consists of two component cycles: an ID transmission cycle which specifies the receiving station, and a data transmission cycle. The multiprocessor bit is used to differentiate between the ID transmission cycle and the data transmission cycle. The transmitting station first sends the ID of the receiving station with which it wants to perform serial communication as data with a 1 multiprocessor bit added. It then sends transmit data as data with a 0 multiprocessor bit added. The receiving station skips the data until data with a 1 multiprocessor bit is sent. When data with a 1 multiprocessor bit is received, the receiving station compares that data with its own ID. The station whose ID matches then receives the data sent next. Stations whose ID does not match continue to skip the data until data with a 1 multiprocessor bit is again received. In this way, data communication is carried out among a number of processors. Figure 14-9 shows an example of inter-processor communication using the multiprocessor format. Data Transfer Formats: There are four data transfer formats. When the multiprocessor format is specified, the parity bit specification is invalid. For details, see table 14-10. Clock: See section 14.3.2, Operation in Asynchronous Mode. Rev. 4.0, 03/03, page 622 of 1358 Transmitting station Serial communication line Receiving station A Receiving station B Receiving station C Receiving station D (ID= 01) (ID= 02) (ID= 03) (ID= 04) Serial data H'01 H'AA (MPB= 1) ID transmission cycle= receiving station specification (MPB= 0) Data transmission cycle= Data transmission to receiving station specified by ID Legend MPB: Multiprocessor bit Figure 14-9 Example of Inter-Processor Communication Using Multiprocessor Format (Transmission of Data H'AA to Receiving Station A) Data Transfer Operations * Multiprocessor serial data transmission Figure 14-10 shows a sample flowchart for multiprocessor serial data transmission. The following procedure should be used for multiprocessor serial data transmission. Rev. 4.0, 03/03, page 623 of 1358 [1] [1] SCI initialization: Initialization The TxD pin is automatically designated as the transmit data output pin. After the TE bit is set to 1, a frame of 1s is output, and transmission is enabled. Start of transmission Read TDRE flag in SSR [2] No TDRE = 1? Yes Write transmit data to TDR and set MPBT bit in SSR Clear TDRE flag to 0 No All data transmitted? Yes Read TEND flag in SSR No TEND = 1? Yes No Break output? [2] SCI status check and transmit data write: Read SSR and check that the TDRE flag is set to 1, then write transmit data to TDR. Set the MPBT bit in SSR to 0 or 1. Finally, clear the TDRE flag to 0. [3] Serial transmission continuation procedure: To continue serial transmission, be sure to read 1 from the TDRE flag to confirm that writing is [3] possible, then write data to TDR, and then clear the TDRE flag to 0. Checking and clearing of the TDRE flag is automatic when the DMAC* or DTC is activated by a transmit-data-empty interrupt (TXI) request, and data is written to TDR. [4] Break output at the end of serial transmission: To output a break in serial transmission, set the port DDR to [4] 1, clear DR to 0, then clear the TE bit in SCR to 0. Yes Clear DR to 0 and set DDR to 1 Clear TE bit in SCR to 0 <End> Note: * The DMAC is not supported in the H8S/2321. Figure 14-10 Sample Multiprocessor Serial Transmission Flowchart Rev. 4.0, 03/03, page 624 of 1358 In serial transmission, the SCI operates as described below. [1] The SCI monitors the TDRE flag in SSR, and if is 0, recognizes that data has been written to TDR, and transfers the data from TDR to TSR. [2] After transferring data from TDR to TSR, the SCI sets the TDRE flag to 1 and starts transmission. If the TIE bit is set to 1 at this time, a transmit-data-empty interrupt (TXI) is generated. The serial transmit data is sent from the TxD pin in the following order. [a] Start bit: One 0-bit is output. [b] Transmit data: 8-bit or 7-bit data is output in LSB-first order. [c] Multiprocessor bit One multiprocessor bit (MPBT value) is output. [d] Stop bit(s): One or two 1-bits (stop bits) are output. [e] Mark state: 1 is output continuously until the start bit that starts the next transmission is sent. [3] The SCI checks the TDRE flag at the timing for sending the stop bit. If the TDRE flag is cleared to 0, data is transferred from TDR to TSR, the stop bit is sent, and then serial transmission of the next frame is started. If the TDRE flag is set to 1, the TEND flag in SSR is set to 1, the stop bit is sent, and then the mark state is entered in which 1 is output continuously. If the TEIE bit in SCR is set to 1 at this time, a transmit-end interrupt (TEI) request is generated. Rev. 4.0, 03/03, page 625 of 1358 Figure 14-11 shows an example of SCI operation for transmission using the multiprocessor format. 1 Start bit 0 MultiprocesStop sor bit bit Data D0 D1 D7 0/1 1 Start bit 0 Multiproces- Stop 1 sor bit bit Data D0 D1 D7 0/1 1 Idle state (mark state) TDRE TEND TXI interrupt request generated Data written to TDR and TDRE flag cleared to 0 in TXI interrupt handling routine TXI interrupt request generated TEI interrupt request generated 1 frame Figure 14-11 Example of SCI Transmit Operation (Example with 8-Bit Data, Multiprocessor Bit, One Stop Bit) * Multiprocessor serial data reception Figure 14-12 shows a sample flowchart for multiprocessor serial reception. The following procedure should be used for multiprocessor serial data reception. Rev. 4.0, 03/03, page 626 of 1358 Initialization [1] [1] SCI initialization: The RxD pin is automatically designated as the receive data input pin. [2] [2] ID reception cycle: Set the MPIE bit in SCR to 1. Start of reception Read MPIE bit in SCR Read ORER and FER flags in SSR FER U ORER = 1? [3] SCI status check, ID reception and comparison: Read SSR and check that the RDRF flag is set to 1, then read the receive data in RDR and compare it with this station s ID. If the data is not this station s ID, set the MPIE bit to 1 again, and clear the RDRF flag to 0. If the data is this station s ID, clear the RDRF flag to 0. Yes No Read RDRF flag in SSR [3] No RDRF = 1? Yes [4] SCI status check and data reception: Read SSR and check that the RDRF flag is set to 1, then read the data in RDR. Read receive data in RDR No This station's ID? Yes [5] Receive error handling and break detection: If a receive error occurs, read the ORER and FER flags in SSR to identify the error. After performing the appropriate error handling, ensure that the ORER and FER flags are both cleared to 0. Reception cannot be resumed if either of these flags is set to 1. In the case of a framing error, a break can be detected by reading the RxD pin value. Read ORER and FER flags in SSR FER U ORER = 1? Yes No Read RDRF flag in SSR [4] No RDRF = 1? Yes Read receive data in RDR No All data received? [5] Error handling Yes Clear RE bit in SCR to 0 (Continued on next page) <End> Figure 14-12 Sample Multiprocessor Serial Reception Flowchart Rev. 4.0, 03/03, page 627 of 1358 [5] Error handling No ORER = 1? Yes Overrun error handling No FER = 1? Yes Yes Break? No Framing error handling Clear RE bit in SCR to 0 Clear ORER, PER, and FER flags in SSR to 0 <End> Figure 14-12 Sample Multiprocessor Serial Reception Flowchart (cont) Rev. 4.0, 03/03, page 628 of 1358 Figure 14-13 shows an example of SCI operation for multiprocessor format reception. 1 Start bit 0 Data (ID1) MPB D0 D1 D7 1 Stop bit Start bit 1 0 Data (Data1) MPB D0 D1 D7 0 Stop bit 1 1 Idle state (mark state) MPIE RDRF RDR value ID1 RXI interrupt request (multiprocessor interrupt) generated MPIE = 0 If not this station's ID, RXI interrupt request is MPIE bit is set to 1 not generated, and RDR again retains its state RDR data read and RDRF flag cleared to 0 in RXI interrupt handling routine (a) Data does not match station's ID 1 Start bit 0 Data (ID2) MPB D0 D1 D7 1 Stop bit Start bit 1 0 Data (Data2) MPB D0 D1 D7 0 Stop bit 1 1 Idle state (mark state) MPIE RDRF RDR value ID1 MPIE = 0 ID2 RXI interrupt request (multiprocessor interrupt) generated RDR data read and RDRF flag cleared to 0 in RXI interrupt handling routine Matches this station's ID, so reception continues, and data is received in RXI interrupt handling routine Data2 MPIE bit set to 1 again (b) Data matches station's ID Figure 14-13 Example of SCI Receive Operation (Example with 8-Bit Data, Multiprocessor Bit, One Stop Bit) Rev. 4.0, 03/03, page 629 of 1358 14.3.4 Operation in Synchronous Mode In synchronous mode, data is transmitted or received in synchronization with clock pulses, making it suitable for high-speed serial communication. Inside the SCI, the transmitter and receiver are independent units, enabling full-duplex communication by use of a common clock. Both the transmitter and the receiver also have a double-buffered structure, so that data can be read or written during transmission or reception, enabling continuous data transfer. Figure 14-14 shows the general format for synchronous serial communication. One unit of transfer data (character or frame) * * Serial clock LSB Serial data Bit 0 MSB Bit 1 Bit 2 Bit 3 Bit 4 Bit 5 Bit 6 Bit 7 Don't care Don't care Note: * High except in continuous transfer Figure 14-14 Data Format in Synchronous Communication In synchronous serial communication, data on the communication line is output from one falling edge of the serial clock to the next. Data confirmation is guaranteed at the rising edge of the serial clock. In synchronous serial communication, one character consists of data output starting with the LSB and ending with the MSB. After the MSB is output, the communication line holds the MSB state. In synchronous mode, the SCI receives data in synchronization with the rising edge of the serial clock. Data Transfer Format: A fixed 8-bit data format is used. No parity or multiprocessor bits are added. Rev. 4.0, 03/03, page 630 of 1358 Clock: Either an internal clock generated by the built-in baud rate generator or an external serial clock input at the SCK pin can be selected, according to the setting of the C/A bit in SMR and the CKE1 and CKE0 bits in SCR. For details of SCI clock source selection, see table 14-9. When the SCI is operated on an internal clock, the serial clock is output from the SCK pin. Eight serial clock pulses are output in the transfer of one character, and when no transfer is performed the clock is fixed high. When only receive operations are performed, however, the serial clock is output until an overrun error occurs or the RE bit is cleared to 0. To perform receive operations in units of one character, an external clock should be selected as the clock source. Rev. 4.0, 03/03, page 631 of 1358 Data Transfer Operations * SCI initialization (synchronous mode) Before transmitting or receiving data, first clear the TE and RE bits in SCR to 0, then initialize the SCI as described below. When the operating mode, transfer format, etc., is changed, the TE and RE bits must be cleared to 0 before making the change using the following procedure. When the TE bit is cleared to 0, the TDRE flag is set to 1 and TSR is initialized. Note that clearing the RE bit to 0 does not change the contents of the RDRF, PER, FER, and ORER flags, or the contents of RDR. Figure 14-15 shows a sample SCI initialization flowchart. [1] Set the clock selection in SCR. Be sure to clear bits RIE, TIE, TEIE, and MPIE, TE and RE, to 0. Start of initialization Clear TE and RE bits in SCR to 0 [2] Set the data transfer format in SMR and SCMR. Set CKE1 and CKE0 bits in SCR (TE, RE bits 0) [1] Set data transfer format in SMR and SCMR [2] Set value in BRR [3] Wait [3] Write a value corresponding to the bit rate to BRR. (Not necessary if an external clock is used.) [4] Wait at least one bit interval, then set the TE bit or RE bit in SCR to 1. Also set the RIE, TIE, TEIE, and MPIE bits as necessary. Setting the TE or RE bit enables the TxD or RxD pin to be used. No 1-bit interval elapsed? Yes Set TE or RE bit in SCR to 1, and set RIE, TIE, TEIE, and MPIE bits as necessary [4] <Transfer start> Note: In simultaneous transmit and receive operations, the TE and RE bits should both be cleared to 0 or set to 1 simultaneously. Figure 14-15 Sample SCI Initialization Flowchart Rev. 4.0, 03/03, page 632 of 1358 * Serial data transmission (synchronous mode) Figure 14-16 shows a sample flowchart for serial transmission. The following procedure should be used for serial data transmission. [1] Initialization Start of transmission Read TDRE flag in SSR [2] No TDRE = 1? Yes Write transmit data to TDR and clear TDRE flag in SSR to 0 No All data transmitted? [3] Yes Read TEND flag in SSR [1] SCI initialization: The TxD pin is automatically designated as the transmit data output pin. [2] SCI status check and transmit data write: Read SSR and check that the TDRE flag is set to 1, then write transmit data to TDR and clear the TDRE flag to 0. [3] Serial transmission continuation procedure: To continue serial transmission, be sure to read 1 from the TDRE flag to confirm that writing is possible, then write data to TDR, and then clear the TDRE flag to 0. Checking and clearing of the TDRE flag is automatic when the DMAC* or DTC is activated by a transmit-dataempty interrupt (TXI) request and data is written to TDR. No TEND = 1? Yes Clear TE bit in SCR to 0 <End> Note: * The DMAC is not supported in the H8S/2321. Figure 14-16 Sample Serial Transmission Flowchart Rev. 4.0, 03/03, page 633 of 1358 In serial transmission, the SCI operates as described below. [1] The SCI monitors the TDRE flag in SSR, and if is 0, recognizes that data has been written to TDR, and transfers the data from TDR to TSR. [2] After transferring data from TDR to TSR, the SCI sets the TDRE flag to 1 and starts transmission. If the TIE bit is set to 1 at this time, a transmit-data-empty interrupt (TXI) is generated. When clock output mode has been set, the SCI outputs 8 serial clock pulses. When use of an external clock has been specified, data is output synchronized with the input clock. The serial transmit data is sent from the TxD pin starting with the LSB (bit 0) and ending with the MSB (bit 7). [3] The SCI checks the TDRE flag at the timing for sending the MSB (bit 7). If the TDRE flag is cleared to 0, data is transferred from TDR to TSR, and serial transmission of the next frame is started. If the TDRE flag is set to 1, the TEND flag in SSR is set to 1, the MSB (bit 7) is sent, and the TxD pin maintains its state. If the TEIE bit in SCR is set to 1 at this time, a TEI interrupt request is generated. [4] After completion of serial transmission, the SCK pin is fixed. Figure 14-17 shows an example of SCI operation in transmission. Rev. 4.0, 03/03, page 634 of 1358 Transfer direction Serial clock Serial data Bit 7 Bit 0 Bit 7 Bit 0 Bit 1 Bit 6 Bit 7 TDRE TEND TXI interrupt request generated TXI interrupt Data written to TDR request generated and TDRE flag cleared to 0 in TXI interrupt handling routine TEI interrupt request generated 1 frame Figure 14-17 Example of SCI Transmit Operation * Serial data reception (synchronous mode) Figure 14-18 shows a sample flowchart for serial reception. The following procedure should be used for serial data reception. When changing the operating mode from asynchronous to synchronous, be sure to check that the ORER, PER, and FER flags are all cleared to 0. The RDRF flag will not be set if the FER or PER flag is set to 1, and neither transmit nor receive operations will be possible. Rev. 4.0, 03/03, page 635 of 1358 [1] Initialization Start of reception [2] Read ORER flag in SSR Yes ORER = 1? [3] No Error processing (Continued below) Read RDRF flag in SSR [4] No RDRF = 1? Yes Read receive data in RDR, and clear RDRF flag in SSR to 0 No All data received? [5] Yes Clear RE bit in SCR to 0 <End> [3] [1] SCI initialization: The RxD pin is automatically designated as the receive data input pin. [2] [3] Receive error handling: If a receive error occurs, read the ORER flag in SSR , and after performing the appropriate error handling, clear the ORER flag to 0. Transfer cannot be resumed if the ORER flag is set to 1. [4] SCI status check and receive data read: Read SSR and check that the RDRF flag is set to 1, then read the receive data in RDR and clear the RDRF flag to 0. Transition of the RDRF flag from 0 to 1 can also be identified by an RXI interrupt. [5] Serial reception continuation procedure: To continue serial reception, before the MSB (bit 7) of the current frame is received, finish reading the RDRF flag, reading RDR, and clearing the RDRF flag to 0. The RDRF flag is cleared automatically when the DMAC* or DTC is activated by a receive-data-full interrupt (RXI) request and the RDR value is read. Error handling Overrun error handling Clear ORER flag in SSR to 0 <End> Note: * The DMAC is not supported in the H8S/2321. Figure 14-18 Sample Serial Reception Flowchart Rev. 4.0, 03/03, page 636 of 1358 In serial reception, the SCI operates as described below. [1] The SCI performs internal initialization in synchronization with serial clock input or output. [2] The received data is stored in RSR in LSB-to-MSB order. After reception, the SCI checks whether the RDRF flag is 0 and the receive data can be transferred from RSR to RDR. If this check is passed, the RDRF flag is set to 1, and the receive data is stored in RDR. If a receive error is detected in the error check, the operation is as shown in table 14-11. Neither transmit nor receive operations can be performed subsequently when a receive error has been found in the error check. [3] If the RIE bit in SCR is set to 1 when the RDRF flag changes to 1, a receive-data-full interrupt (RXI) request is generated. Also, if the RIE bit in SCR is set to 1 when the ORER flag changes to 1, a receive-error interrupt (ERI) request is generated. Figure 14-19 shows an example of SCI operation in reception. Serial clock Serial data Bit 7 Bit 0 Bit 7 Bit 0 Bit 1 Bit 6 Bit 7 RDRF ORER RXI interrupt request generated RDR data read and RDRF flag cleared to 0 in RXI interrupt handling routine RXI interrupt request generated ERI interrupt request generated by overrun error 1 frame Figure 14-19 Example of SCI Receive Operation * Simultaneous serial data transmission and reception (synchronous mode) Figure 14-20 shows a sample flowchart for simultaneous serial transmit and receive operations. The following procedure should be used for simultaneous serial data transmit and receive operations. Rev. 4.0, 03/03, page 637 of 1358 Initialization [1] SCI initialization: [1] The TxD pin is designated as the transmit data output pin, and the RxD pin is designated as the receive data input pin, enabling simultaneous transmit and receive operations. Start of transmission/reception Read TDRE flag in SSR [2] [2] SCI status check and transmit data write: Read SSR and check that the TDRE flag is set to 1, then write transmit data to TDR and clear the TDRE flag to 0. Transition of the TDRE flag from 0 to 1 can also be identified by a TXI interrupt. No TDRE = 1? Yes Write transmit data to TDR and clear TDRE flag in SSR to 0 [3] Receive error handling: If a receive error occurs, read the ORER flag in SSR, and after performing the appropriate error handling, clear the ORER flag to 0. Transmission/reception cannot be resumed if the ORER flag is set to 1. Read ORER flag in SSR ORER = 1? No Read RDRF flag in SSR Yes [3] Error handling [4] SCI status check and receive data read: Read SSR and check that the RDRF flag is set to 1, then read the receive data in RDR and clear the RDRF flag to 0. Transition of the RDRF flag from 0 to 1 can also be identified by an RXI interrupt. [4] No RDRF = 1? [5] Serial transmission/reception Yes Read receive data in RDR, and clear RDRF flag in SSR to 0 No All data received? [5] Yes Clear TE and RE bits in SCR to 0 <End> Notes: When switching from transmit or receive operation to simultaneous transmit and receive operations, first clear the TE and RE bits to 0, then set both these bits to 1 simultaneously. * The DMAC is not supported in the H8S/2321. continuation procedure: To continue serial transmission/ reception, before the MSB (bit 7) of the current frame is received, finish reading the RDRF flag, reading RDR, and clearing the RDRF flag to 0. Also, before the MSB (bit 7) of the current frame is transmitted, read 1 from the TDRE flag to confirm that writing is possible. Then write data to TDR and clear the TDRE flag to 0. Checking and clearing of the TDRE flag is automatic when the DMAC* or DTC is activated by a transmitdata-empty interrupt (TXI) request and data is written to TDR. Also, the RDRF flag is cleared automatically when the DMAC* or DTC is activated by a receive-data-full interrupt (RXI) request and the RDR value is read. Figure 14-20 Sample Flowchart of Simultaneous Serial Transmit and Receive Operations Rev. 4.0, 03/03, page 638 of 1358 14.4 SCI Interrupts The SCI has four interrupt sources: the transmit-end interrupt (TEI) request, receive-error interrupt (ERI) request, receive-data-full interrupt (RXI) request, and transmit-data-empty interrupt (TXI) request. Table 14-12 shows the interrupt sources and their relative priorities. Individual interrupt sources can be enabled or disabled with the TIE, RIE, and TEIE bits in the SCR. Each kind of interrupt request is sent to the interrupt controller independently. When the TDRE flag in SSR is set to 1, a TXI interrupt request is generated. When the TEND flag in SSR is set to 1, a TEI interrupt request is generated. A TXI interrupt can activate the DMAC* or DTC to perform data transfer. The TDRE flag is cleared to 0 automatically when data transfer is performed by the DMAC* or DTC. The DMAC* and DTC cannot be activated by a TEI interrupt request. When the RDRF flag in SSR is set to 1, an RXI interrupt request is generated. When the ORER, PER, or FER flag in SSR is set to 1, an ERI interrupt request is generated. An RXI interrupt can activate the DMAC* or DTC to perform data transfer. The RDRF flag is cleared to 0 automatically when data transfer is performed by the DMAC* or DTC. The DMAC* and DTC cannot be activated by an ERI interrupt request. Also note that the DMAC* cannot be activated by an SCI channel 2 interrupt. Note: * The DMAC is not supported in the H8S/2321. Rev. 4.0, 03/03, page 639 of 1358 Table 14-12 SCI Interrupt Sources Channel Interrupt Source Description DTC Activation 2 DMAC* Activation 0 ERI Interrupt due to receive error (ORER, FER, or PER) Not possible Not possible RXI Interrupt due to receive data full state (RDRF) Possible Possible TXI Interrupt due to transmit data empty state (TDRE) Possible Possible TEI Interrupt due to transmission end (TEND) Not possible Not possible ERI Interrupt due to receive error (ORER, FER, or PER) Not possible Not possible RXI Interrupt due to receive data full state (RDRF) Possible Possible TXI Interrupt due to transmit data empty state (TDRE) Possible Possible TEI Interrupt due to transmission end (TEND) Not possible Not possible ERI Interrupt due to receive error (ORER, FER, or PER) Not possible Not possible RXI Interrupt due to receive data full state (RDRF) Possible Not possible TXI Interrupt due to transmit data empty state (TDRE) Possible Not possible TEI Interrupt due to transmission end (TEND) Not possible Not possible 1 2 1 Priority* High Low Notes: *1 This table shows the initial state immediate after a reset. Relative priorities among channels can be changed by the interrupt controller. *2 The DMAC is not supported in the H8S/2321. A TEI interrupt is requested when the TEND flag is set to 1 while the TEIE bit is set to 1. The TEND flag is cleared at the same time as the TDRE flag. Consequently, if a TEI interrupt and a TXI interrupt are requested simultaneously, the TXI interrupt may be accepted first, with the result that the TDRE and TEND flags are cleared. Note that the TEI interrupt will not be accepted in this case. Rev. 4.0, 03/03, page 640 of 1358 14.5 Usage Notes The following points should be noted when using the SCI. Relation between Writes to TDR and the TDRE Flag: The TDRE flag in SSR is a status flag that indicates that transmit data has been transferred from TDR to TSR. When the SCI transfers data from TDR to TSR, the TDRE flag is set to 1. Data can be written to TDR regardless of the state of the TDRE flag. However, if new data is written to TDR when the TDRE flag is cleared to 0, the data stored in TDR will be lost since it has not yet been transferred to TSR. It is therefore essential to check that the TDRE flag is set to 1 before writing transmit data to TDR. Operation when Multiple Receive Errors Occur Simultaneously: If a number of receive errors occur at the same time, the state of the status flags in SSR is as shown in table 14-13. If there is an overrun error, data is not transferred from RSR to RDR, and the receive data is lost. Table 14-13 State of SSR Status Flags and Transfer of Receive Data SSR Status Flags RDRF ORER FER PER Receive Data Transfer from RSR to RDR Receive Error Status 1 1 0 0 X Overrun error 0 0 1 0 Framing error 0 0 0 1 Parity error 1 1 1 0 X 1 1 0 1 X 0 0 1 1 1 1 1 1 Notes: Overrun error + framing error Overrun error + parity error Framing error + parity error X Overrun error + framing error + parity error : Receive data is transferred from RSR to RDR. X: Receive data is not transferred from RSR to RDR. Rev. 4.0, 03/03, page 641 of 1358 Break Detection and Processing (Asynchronous Mode Only): When framing error (FER) detection is performed, a break can be detected by reading the RxD pin value directly. In a break, the input from the RxD pin becomes all 0s, and so the FER flag is set, and the parity error flag (PER) may also be set. Note that, since the SCI continues the receive operation after receiving a break, even if the FER flag is cleared to 0, it will be set to 1 again. Sending a Break (Asynchronous Mode Only): The TxD pin has a dual function as an I/O port whose direction (input or output) is determined by DR and DDR. This can be used to send a break. Between serial transmission initialization and setting of the TE bit to 1, the mark state is replaced by the value of DR (the pin does not function as the TxD pin until the TE bit is set to 1). Therefore, DDR and DR for the port corresponding to the TxD pin should first be set to 1. To send a break during serial transmission, first clear DR to 0, then clear the TE bit to 0. When the TE bit is cleared to 0, the transmitter is initialized regardless of the current transmission state, the TxD pin becomes an I/O port, and 0 is output from the TxD pin. Receive Error Flags and Transmit Operations (Synchronous Mode Only): Transmission cannot be started when a receive error flag (ORER, PER, or FER) is set to 1, even if the TDRE flag is cleared to 0. Be sure to clear the receive error flags to 0 before starting transmission. Note also that receive error flags cannot be cleared to 0 even if the RE bit is cleared to 0. Receive Data Sampling Timing and Receive Margin in Asynchronous Mode: In asynchronous mode, the SCI operates on a base clock with a frequency of 16 times the transfer rate. In reception, the SCI samples the falling edge of the start bit using the base clock, and performs internal synchronization. Receive data is latched internally at the rising edge of the 8th pulse of the base clock. This is illustrated in figure 14-21. Rev. 4.0, 03/03, page 642 of 1358 16 clocks 8 clocks 0 7 15 0 7 15 0 Internal base clock Receive data (RxD) Start bit D0 D1 Synchronization sampling timing Data sampling timing Figure 14-21 Receive Data Sampling Timing in Asynchronous Mode Thus the receive margin in asynchronous mode is given by formula (1) below. 1 M = | (0.5 - 2N ) - (L - 0.5) F - | D - 0.5 | N (1 + F) | x 100% ... Formula (1) Where M N D L F : Receive margin (%) : Ratio of bit rate to clock (N = 16) : Clock duty (D = 0 to 1.0) : Frame length (L = 9 to 12) : Absolute value of clock rate deviation Assuming values of F = 0 and D = 0.5 in formula (1), a receive margin of 46.875% is given by formula (2) below. When D = 0.5 and F = 0, M = (0.5 - = 46.875% 1 2 x 16 ) x 100% ... Formula (2) However, this is a theoretical value, and a margin of 20% to 30% should be allowed in system design. Rev. 4.0, 03/03, page 643 of 1358 Restrictions on Use of DMAC* or DTC * When an external clock source is used as the serial clock, the transmit clock should not be input until at least 5 clock cycles after TDR is updated by the DMAC* or DTC. Misoperation may occur if the transmit clock is input within 4 clocks after TDR is updated. (Figure 14-22) * When RDR is read by the DMAC* or DTC, be sure to set the activation source to the relevant SCI receive-data-full interrupt (RXI). Note: * The DMAC is not supported in the H8S/2321. SCK t TDRE LSB Serial data D0 D1 D2 D3 D4 D5 D6 D7 Note: When operating on an external clock, set t > 4 clocks. Figure 14-22 Example of Synchronous Transmission Using DTC Operation in Case of Mode Transition * Transmission Operation should be stopped (by clearing TE, TIE, and TEIE to 0) before making a module stop mode or software standby mode transition. TSR, TDR, and SSR are reset. The output pin states in module stop mode or software standby mode depend on the port settings, and becomes high-level output after the relevant mode is cleared. If a transition is made during transmission, the data being transmitted will be undefined. When transmitting without changing the transmit mode after the relevant mode is cleared, transmission can be started by setting TE to 1 again, and performing the following sequence: SSR read TDR write TDRE clearance. To transmit with a different transmit mode after clearing the relevant mode, the procedure must be started again from initialization. Figure 14-23 shows a sample flowchart for mode transition during transmission. Port pin states are shown in figures 14-24 and 14-25. Operation should also be stopped (by clearing TE, TIE, and TEIE to 0) before making a transition from transmission by DTC transfer to module stop mode or software standby mode transition. To perform transmission with the DTC after the relevant mode is cleared, setting TE and TIE to 1 will set the TXI flag and start DTC transmission. Rev. 4.0, 03/03, page 644 of 1358 * Reception Receive operation should be stopped (by clearing RE to 0) before making a module stop mode or software standby mode transition. RSR, RDR, and SSR are reset. If a transition is made without stopping operation, the data being received will be invalid. To continue receiving without changing the reception mode after the relevant mode is cleared, set RE to 1 before starting reception. To receive with a different receive mode, the procedure must be started again from initialization. Figure 14-26 shows a sample flowchart for mode transition during reception. <Transmission> All data transmitted? No [1] [1] Data being transmitted is interrupted. After exiting software standby mode, etc., normal CPU transmission is possible by setting TE to 1, reading SSR, writing TDR, and clearing TDRE to 0, but note that if the DTC has been activated, the remaining data in DTCRAM will be transmitted when TE and TIE are set to 1. [2] If TIE and TEIE are set to 1, clear them to 0 in the same way. [3] Includes module stop mode. Yes Read TEND flag in SSR TEND = 1? No Yes TE = 0 [2] Transition to software standby mode, etc. [3] Exit from software standby mode, etc. Change operating mode? No Yes Initialization TE = 1 <Start of transmission> Figure 14-23 Sample Flowchart for Mode Transition during Transmission Rev. 4.0, 03/03, page 645 of 1358 End of transmission Start of transmission Transition to software standby Exit from software standby TE bit Port input/output SCK output pin TxD output pin Port input/output High output Port Start Stop Port input/output Port SCI TxD output High output SCI TxD output Figure 14-24 Asynchronous Transmission Using Internal Clock Start of transmission End of transmission Transition to software standby Exit from software standby TE bit Port input/output SCK output pin TxD output pin Port input/output Last TxD bit held Marking output Port SCI TxD output Port input/output Port Note: * Initialized by software standby. Figure 14-25 Synchronous Transmission Using Internal Clock Rev. 4.0, 03/03, page 646 of 1358 High output* SCI TxD output <Reception> Read RDRF flag in SSR RDRF = 1? No [1] [1] Receive data being received becomes invalid. [2] [2] Includes module stop mode. Yes Read receive data in RDR RE = 0 Transition to software standby mode, etc. Exit from software standby mode, etc. Change operating mode? No Yes Initialization RE = 1 <Start of reception> Figure 14-26 Sample Flowchart for Mode Transition during Reception Rev. 4.0, 03/03, page 647 of 1358 Rev. 4.0, 03/03, page 648 of 1358 Section 15 Smart Card Interface 15.1 Overview The SCI supports an IC card (smart card) interface conforming to ISO/IEC 7816-3 (identification card) as a serial communication interface extension function. Switching between the normal serial communication interface and the smart card interface is carried out by means of a register setting. 15.1.1 Features Features of the smart card interface supported by the chip is as follows. * Asynchronous mode Data length: 8 bits Parity bit generation and checking Transmission of error signal (parity error) in receive mode Error signal detection and automatic data retransmission in transmit mode Direct convention and inverse convention both supported * Built-in baud rate generator allows any bit rate to be selected * Three interrupt sources Three interrupt sources (transmit-data-empty, receive-data-full, and transmit/receive-error) that can issue requests independently The transmit-data-empty and receive-data-full interrupts can activate the DMA controller (DMAC)* or data transfer controller (DTC) to execute data transfer Note: * The DMAC is not supported in the H8S/2321. Rev. 4.0, 03/03, page 649 of 1358 15.1.2 Block Diagram Bus interface Figure 15-1 shows a block diagram of the smart card interface. Module data bus RDR RxD TxD RSR TDR SCMR SSR SCR SMR TSR BRR f Baud rate generator Transmission/ reception control Parity generation f/4 f/16 f/64 Clock Parity check SCK Legend SCMR : Smart card mode register RSR : Receive shift register RDR : Receive data register TSR : Transmit shift register TDR : Transmit data register SMR : Serial mode register SCR : Serial control register SSR : Serial status register BRR : Bit rate register TXI RXI ERI Figure 15-1 Block Diagram of Smart Card Interface Rev. 4.0, 03/03, page 650 of 1358 Internal data bus 15.1.3 Pin Configuration Table 15-1 shows the smart card interface pin configuration. Table 15-1 Smart Card Interface Pins Channel Pin Name Symbol I/O Function 0 Serial clock pin 0 SCK0 I/O SCI0 clock input/output Receive data pin 0 RxD0 Input SCI0 receive data input Transmit data pin 0 TxD0 Output SCI0 transmit data output Serial clock pin 1 SCK1 I/O SCI1 clock input/output Receive data pin 1 RxD1 Input SCI1 receive data input 1 2 Transmit data pin 1 TxD1 Output SCI1 transmit data output Serial clock pin 2 SCK2 I/O SCI2 clock input/output Receive data pin 2 RxD2 Input SCI2 receive data input Transmit data pin 2 TxD2 Output SCI2 transmit data output Rev. 4.0, 03/03, page 651 of 1358 15.1.4 Register Configuration Table 15-2 shows the registers used by the smart card interface. Details of SMR, BRR, SCR, TDR, RDR, and MSTPCR are the same as for the normal SCI function: see the register descriptions in section 14, Serial Communication Interface (SCI). Table 15-2 Smart Card Interface Registers Channel Name Abbreviation R/W Initial Value 1 Address* 0 Serial mode register 0 SMR0 R/W H'00 H'FF78 Bit rate register 0 BRR0 R/W H'FF H'FF79 Serial control register 0 SCR0 R/W H'00 H'FF7A 1 2 All Transmit data register 0 TDR0 R/W H'FF H'FF7B Serial status register 0 SSR0 R/(W)* H'84 H'FF7C Receive data register 0 RDR0 R H'00 H'FF7D Smart card mode register 0 SCMR0 R/W H'F2 H'FF7E Serial mode register 1 SMR1 R/W H'00 H'FF80 2 Bit rate register 1 BRR1 R/W H'FF H'FF81 Serial control register 1 SCR1 R/W H'00 H'FF82 Transmit data register 1 TDR1 R/W H'FF83 Serial status register 1 SSR1 H'FF 2 * R/(W) H'84 Receive data register 1 RDR1 R H'00 H'FF85 Smart card mode register 1 SCMR1 R/W H'F2 H'FF86 Serial mode register 2 SMR2 R/W H'00 H'FF88 Bit rate register 2 BRR2 R/W H'FF H'FF89 Serial control register 2 SCR2 R/W H'00 H'FF8A Transmit data register 2 TDR2 R/W H'FF8B Serial status register 2 SSR2 H'FF 2 * R/(W) H'84 Receive data register 2 RDR2 R H'00 H'FF8D Smart card mode register 2 SCMR2 R/W H'F2 H'FF8E R/W H'3FFF H'FF3C Module stop control register MSTPCR Notes: *1 Lower 16 bits of the address. *2 Can only be written with 0 for flag clearing. Rev. 4.0, 03/03, page 652 of 1358 H'FF84 H'FF8C 15.2 Register Descriptions Registers added with the smart card interface and bits for which the function changes are described here. 15.2.1 Bit Smart Card Mode Register (SCMR) : 7 6 5 4 3 2 1 0 -- -- -- -- SDIR SINV -- SMIF Initial value : 1 1 1 1 0 0 1 0 R/W -- -- -- -- R/W R/W -- R/W : SCMR is an 8-bit readable/writable register that selects the smart card interface function. SCMR is initialized to H'F2 by a reset and in hardware standby mode. In software standby mode and module stop mode it retains its previous state. Bits 7 to 4--Reserved: These bits cannot be modified and are always read as 1. Bit 3--Smart Card Data Transfer Direction (SDIR): Selects the serial/parallel conversion format. Bit 3 SDIR Description 0 TDR contents are transmitted LSB-first (Initial value) Receive data is stored in RDR LSB-first 1 TDR contents are transmitted MSB-first Receive data is stored in RDR MSB-first Bit 2--Smart Card Data Invert (SINV): Specifies inversion of the data logic level. This function is used together with the SDIR bit for communication with an inverse convention card. The SINV bit does not affect the logic level of the parity bit. For parity-related setting procedures, see section 15.3.4, Register Settings. Bit 2 SINV Description 0 TDR contents are transmitted as they are (Initial value) Receive data is stored as it is in RDR 1 TDR contents are inverted before being transmitted Receive data is stored in inverted form in RDR Rev. 4.0, 03/03, page 653 of 1358 Bit 1--Reserved: Read-only bit, always read as 1. Bit 0--Smart Card Interface Mode Select (SMIF): Enables or disables the smart card interface function. Bit 0 SMIF Description 0 Smart card interface function is disabled 1 Smart card interface function is enabled 15.2.2 Bit Serial Status Register (SSR) : Initial value : R/W (Initial value) : 7 6 5 4 3 2 1 0 TDRE RDRF ORER ERS PER TEND MPB MPBT 1 0 0 0 0 1 0 0 R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R R R/W Note: * Only 0 can be written to bits 7 to 3, to clear these flags. Bit 4 of SSR has a different function in smart card interface mode. Coupled with this, the setting conditions for bit 2, TEND, are also different. Bits 7 to 5--Operate in the same way as for the normal SCI. For details, see section 14.2.7, Serial Status Register (SSR). Bit 4--Error Signal Status (ERS): In smart card interface mode, bit 4 indicates the status of the error signal sent back from the receiving end in transmission. Framing errors are not detected in smart card interface mode. Bit 4 ERS Description 0 Indicates data received normally with no error signal [Clearing conditions] (Initial value) * Upon reset, and in standby mode or module stop mode * When 0 is written to ERS after reading ERS = 1 1 Indicates an error signal was sent showing detection of a parity error at the receiving side [Setting condition] When the low level of the error signal is sampled Note: Clearing the TE bit in SCR to 0 does not affect the ERS flag, which retains its previous state. Rev. 4.0, 03/03, page 654 of 1358 Bits 3 to 0--Operate in the same way as for the normal SCI. For details, see section 14.2.7, Serial Status Register (SSR). However, the setting conditions for the TEND bit, are as shown below. Bit 2 TEND Description 0 Indicates transfer in progress [Clearing conditions] * When 0 is written to TDRE after reading TDRE = 1 * When the DMAC* or DTC is activated by a TXI interrupt and writes data to TDR 1 Indicates transfer complete [Setting conditions] (Initial value) * Upon reset, and in standby mode or module stop mode * When the TE bit in SCR is 0 and the ERS bit is also 0 * When TDRE = 1 and ERS = 0 (normal transmission) 2.5 etu after transmission of a 1-byte serial character when GM = 0 and BLK = 0 * When TDRE = 1 and ERS = 0 (normal transmission) 1.5 etu after transmission of a 1-byte serial character when GM = 0 and BLK = 1 * When TDRE = 1 and ERS = 0 (normal transmission) 1.0 etu after transmission of a 1-byte serial character when GM = 1 and BLK = 0 * When TDRE = 1 and ERS = 0 (normal transmission) 1.0 etu after transmission of a 1-byte serial character when GM = 1 and BLK = 1 Notes: etu: Elementary time unit (time for transfer of 1 bit) * The DMAC is not supported in the H8S/2321. 15.2.3 Bit Serial Mode Register (SMR) : Initial value : R/W : 7 6 5 4 3 2 1 0 GM BLK PE* O/E BCP1 BCP0 CKS1 CKS0 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W Note: * The DMAC is not supported in the H8S/2321. The function of bits 7, 6, 3, and 2 of SMR changes in smart card interface mode. Bit 7--GSM Mode (GM): Sets the smart card interface function to GSM mode. This bit is cleared to 0 when the normal smart card interface is used. In GSM mode, this bit is set to 1, the timing of setting of the TEND flag that indicates transmission completion is advanced, and clock output control mode addition is performed. The contents of the clock output control mode addition are specified by bits 1 and 0 of the serial control register (SCR). Rev. 4.0, 03/03, page 655 of 1358 Bit 7 GM Description 0 Normal smart card interface mode operation (Initial value) * TEND flag generation 12.5 etu (11.5 etu in block transfer mode) after beginning of start bit * Clock output on/off control only 1 GSM mode smart card interface mode operation * TEND flag generation 11.0 etu after beginning of start bit * High/low fixing control possible in addition to clock output on/off control (set by SCR) Note: etu: Elementary time unit (time for transfer of 1 bit) Bit 6--Block Transfer Mode (BLK): Selects block transfer mode. Bit 6 BLK Description 0 Normal smart card interface mode operation (Initial value) * Error signal transmission/detection and automatic data retransmission performed * TXI interrupt generated by TEND flag * TEND flag set 12.5 etu after start of transmission (11.0 etu in GSM mode) 1 Block transfer mode operation * Error signal transmission/detection and automatic data retransmission not performed * TXI interrupt generated by TDRE flag * TEND flag set 11.5 etu after start of transmission (11.0 etu in GSM mode) Note: etu: Elementary time unit (time for transfer of 1 bit) Bits 3 and 2--Base Clock Pulse 1 and 2 (BCP1, BCP0): These bits specify the number of base clock periods in a 1-bit transfer interval on the smart card interface. Bit 3 BCP1 Bit 2 BCP0 Description 0 0 32 clock periods 1 64 clock periods 0 372 clock periods 1 256 clock periods 1 (Initial value) Bits 5, 4, 1, and 0--Operate in the same way as for the normal SCI. For details, see section 14.2.5, Serial Mode Register (SMR). Rev. 4.0, 03/03, page 656 of 1358 15.2.4 Bit Serial Control Register (SCR) : Initial value : R/W : 7 6 5 4 3 2 1 0 TIE RIE TE RE MPIE TEIE CKE1 CKE0 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W In smart card interface mode, the function of bits 1 and 0 of SCR changes when bit 7 of the serial mode register (SMR) is set to 1. Bits 7 to 2--Operate in the same way as for the normal SCI. For details, see section 14.2.6, Serial Control Register (SCR). Bits 1 and 0--Clock Enable 1 and 0 (CKE1, CKE0): These bits are used to select the SCI clock source and enable or disable clock output from the SCK pin. In smart card interface mode, in addition to the normal switching between clock output enabling and disabling, the clock output can be specified as being fixed high or low. SCMR SMR SCR Setting SMIF GM CKE1 CKE0 SCK Pin Function 0 See the SCI specification 1 0 1 0 0 0 Operates as port I/O pin 0 1 Outputs clock as SCK output pin 1 1 0 0 Operates as SCK output pin, with output fixed low 1 1 0 1 Outputs clock as SCK output pin 1 1 1 0 Operates as SCK output pin, with output fixed high 1 1 1 1 Outputs clock as SCK output pin Rev. 4.0, 03/03, page 657 of 1358 15.3 Operation 15.3.1 Overview The main functions of the smart card interface are as follows. * One frame consists of 8-bit data plus a parity bit. * In transmission, a guard time of at least 2 etu (1 etu in block transfer mode) (elementary time unit: the time for transfer of 1 bit) is left between the end of the parity bit and the start of the next frame. * If a parity error is detected during reception, a low error signal level is output for one etu period, 10.5 etu after the start bit. (This does not apply to block transfer mode.) * If the error signal is sampled during transmission, the same data is transmitted automatically after the elapse of 2 etu or longer. (This does not apply to block transfer mode.) * Only asynchronous communication is supported; there is no synchronous communication function. 15.3.2 Pin Connections Figure 15-2 shows a schematic diagram of smart card interface related pin connections. In communication with an IC card, since both transmission and reception are carried out on a single data communication line, the chip's TxD pin and RxD pin should both be connected to the line, as shown in the figure. The data communication line should be pulled up to the VCC power supply with a resistor. When the clock generated on the smart card interface is used by an IC card, the SCK pin output is input to the CLK pin of the IC card. No connection is needed if the IC card uses an internal clock. Chip port output is used as the reset signal. Other pins must normally be connected to the power supply or ground. Rev. 4.0, 03/03, page 658 of 1358 VCC TxD I/O RxD SCK Rx (port) Chip Data line Clock line Reset line CLK RST IC card Connected equipment Figure 15-2 Schematic Diagram of Smart Card Interface Pin Connections Note: If an IC card is not connected, and the TE and RE bits are both set to 1, closed transmission/reception is possible, enabling self-diagnosis to be carried out. Rev. 4.0, 03/03, page 659 of 1358 15.3.3 Data Format Normal Transfer Mode: Figure 15-3 shows the smart card interface data format in the normal transfer mode. In reception in this mode, a parity check is carried out on each frame. If an error is detected an error signal is sent back to the transmitting end, and retransmission of the data is requested. If an error signal is sampled during transmission, the same data is retransmitted. When there is no parity error Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp D7 Dp Transmitting station output When a parity error occurs Ds D0 D1 D2 D3 D4 D5 D6 DE Transmitting station output Legend Ds D0 to D7 Dp DE : Start bit : Data bits : Parity bit : Error signal Figure 15-3 Smart Card Interface Data Format Rev. 4.0, 03/03, page 660 of 1358 Receiving station output The operation sequence is as follows. [1] When the data line is not in use it is in the high-impedance state, and is fixed high with a pullup resistor. [2] The transmitting station starts transfer of one frame of data. The data frame starts with a start bit (Ds, low-level), followed by 8 data bits (D0 to D7) and a parity bit (Dp). [3] With the smart card interface, the data line then returns to the high-impedance state. The data line is pulled high with a pull-up resistor. [4] The receiving station carries out a parity check. If there is no parity error and the data is received normally, the receiving station waits for reception of the next data. If a parity error occurs, however, the receiving station outputs an error signal (DE, low-level) to request retransmission of the data. After outputting the error signal for the prescribed length of time, the receiving station places the signal line in the high-impedance state again. The signal line is pulled high again by a pull-up resistor. [5] If the transmitting station does not receive an error signal, it proceeds to transmit the next data frame. If it does receive an error signal, however, it returns to step [2] and retransmits the data in which the error occurred. Block Transfer Mode: The operation sequence in block transfer mode is as follows. [1] When the data line is not in use it is in the high-impedance state, and is fixed high with a pullup resistor. [2] The transmitting station starts transfer of one frame of data. The data frame starts with a start bit (Ds, low-level), followed by 8 data bits (D0 to D7) and a parity bit (Dp). [3] With the smart card interface, the data line then returns to the high-impedance state. The data line is pulled high with a pull-up resistor. [4] The receiving station carries out a parity check, but does not output an error signal even if an error has occurred. Since subsequent receive operations cannot be carried out if an error occurs, the error flag must be cleared to 0 before the parity bit for the next frame is received. [5] The transmitting station proceeds to transmit the next data frame. Rev. 4.0, 03/03, page 661 of 1358 15.3.4 Register Settings Table 15-3 shows a bit map of the registers used by the smart card interface. Bits indicated as 0 or 1 must be set to the value shown. The setting of other bits is described below. Table 15-3 Smart Card Interface Register Settings Bit Register Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 SMR GM BLK 1 O/E BCP1 BCP0 CKS1 CKS0 BRR BRR7 BRR6 BRR5 BRR4 BRR3 BRR2 BRR0 SCR TIE RIE TE RE 0 0 BRR1 CKE1* TDR TDR7 TDR6 TDR5 TDR4 TDR3 TDR2 TDR1 TDR0 SSR TDRE RDRF ORER ERS PER TEND 0 0 RDR RDR7 RDR6 RDR5 RDR4 RDR3 RDR2 RDR1 RDR0 SCMR -- -- -- -- SDIR SINV -- SMIF CKE0 Notes: -- : Unused bit. * The CKE1 bit must be cleared to 0 when the GM bit in SMR is cleared to 0. SMR Settings: The GM bit is cleared to 0 in normal smart card interface mode, and set to 1 in GSM mode. The O/E bit is cleared to 0 if the IC card is of the direct convention type, and set to 1 if of the inverse convention type. Bits CKS1 and CKS0 select the clock source of the built-in baud rate generator, and bits BCP1 and BCP0 select the number of base clock cycles during transfer of one bit. For details, see section 15.3.5, Clock. The BLK bit is cleared to 0 when using the normal smart card interface mode, and set to 1 when using block transfer mode. BRR Setting: BRR is used to set the bit rate. See section 15.3.5, Clock, for the method of calculating the value to be set. SCR Settings: The function of the TIE, RIE, TE, and RE bits is the same as for the normal SCI. For details, see section 14, Serial Communication Interface (SCI). Bits CKE1 and CKE0 specify the clock output. When the GM bit in SMR is cleared to 0, set these bits to B'00 if a clock is not to be output, or to B'01 if a clock is to be output. When the GM bit in SMR is set to 1, clock output is performed. The clock output can also be fixed high or low. Rev. 4.0, 03/03, page 662 of 1358 Smart Card Mode Register (SCMR) Settings: The SDIR bit is cleared to 0 if the IC card is of the direct convention type, and set to 1 if of the inverse convention type. The SINV bit is cleared to 0 if the IC card is of the direct convention type, and set to 1 if of the inverse convention type. The SMIF bit is set to 1 when the smart card interface is used. Examples of register settings and the waveform of the start character are shown below for the two types of IC card (direct convention and inverse convention). * Direct convention (SDIR = SINV = O/E = 0) (Z) A Z Z A Z Z Z A A Z Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp (Z) State With the direct convention type, the logic 1 level corresponds to state Z and the logic 0 level to state A, and transfer is performed in LSB-first order. The start character data above is H'3B. The parity bit is 1 since even parity is stipulated for the smart card. * Inverse convention (SDIR = SINV = O/E = 1) (Z) A Z Z A A A A A A Z Ds D7 D6 D5 D4 D3 D2 D1 D0 Dp (Z) State With the inverse convention type, the logic 1 level corresponds to state A and the logic 0 level to state Z, and transfer is performed in MSB-first order. The start character data above is H'3F. The parity bit is 0, corresponding to state Z, since even parity is stipulated for the smart card. With the chip, inversion specified by the SINV bit applies only to the data bits, D7 to D0. For parity bit inversion, the O/E bit in SMR should be set to odd parity mode (the same applies to both transmission and reception). Rev. 4.0, 03/03, page 663 of 1358 15.3.5 Clock Only an internal clock generated by the built-in baud rate generator can be used as the transmit/receive clock for the smart card interface. The bit rate is set with BRR and the CKS1, CKS0, BCP1, and BCP0 bits in SMR. The formula for calculating the bit rate is as shown below. Table 15-5 shows some sample bit rates. If clock output is selected by setting CKE0 to 1, the clock is output from the SCK pin. The clock frequency is determined by the bit rate and the setting of bits BCP1 and BCP0. B= Sx2 2n+1 x (N + 1) x 106 Where: N = Value set in BRR (0 N 255) B = Bit rate (bits/s) = Operating frequency (MHz) n = See table 15-4 S = Number of internal clock cycles in 1-bit period set by bits BCP1 and BCP0 Table 15-4 Correspondence between n and CKS1, CKS0 n CKS1 0 0 0 1 2 CKS0 1 1 0 3 1 Table 15-5 Examples of Bit Rate B (bits/s) for Various BRR Settings (When n = 0 and S = 372) (MHz) N 10.00 10.714 13.00 14.285 16.00 18.00 20.00 25.00 0 13441 14400 17473 19200 21505 24194 26882 33602 1 6720 7200 8737 9600 10753 12097 13441 16801 2 4480 4800 5824 6400 7168 8065 8961 11201 Note: Bit rates are rounded to the nearest whole number. Rev. 4.0, 03/03, page 664 of 1358 The method of calculating the value to be set in the bit rate register (BRR) from the operating frequency and bit rate, on the other hand, is shown below. N is an integer, 0 N 255, and the smaller error is specified. N= Sx2 2n+1 xB x 106 - 1 Table 15-6 Examples of BRR Settings for Bit Rate B (bits/s) (When n = 0 and S = 372) (MHz) 7.1424 10.00 10.7136 13.00 14.2848 16.00 18.00 20.00 25.00 Bits/s N Error N Error N Error N Error N Error N Error N Error N Error N Error 9600 0 0.00 30 25 8.99 0.00 12.01 2 15.99 2 6.60 12.49 1 1 1 1 1 3 Table 15-7 Maximum Bit Rate at Various Frequencies (Smart Card Interface Mode) (When S = 372) (MHz) Maximum Bit Rate (bits/s) N n 7.1424 9600 0 0 10.00 13441 0 0 10.7136 14400 0 0 13.00 17473 0 0 14.2848 19200 0 0 16.00 21505 0 0 18.00 24194 0 0 20.00 26882 0 0 25.00 33602 0 0 The bit rate error is given by the following formula: Error (%) = ( Sx2 2n+1 x B x (N + 1) x 106 - 1) x 100 Rev. 4.0, 03/03, page 665 of 1358 15.3.6 Data Transfer Operations Initialization: Before transmitting or receiving data, initialize the SCI as described below. Initialization is also necessary when switching from transmit mode to receive mode, or vice versa. [1] Clear the TE and RE bits in SCR to 0. [2] Clear the error flags ERS, PER, and ORER in SSR to 0. [3] Set the GM, BLK, O/E, BCP1, BCP0, CKS1, and CKS0 bits in SMR, and set the PE bit to 1. [4] Set the SMIF, SDIR, and SINV bits in SCMR. When the SMIF bit is set to 1, the TxD and RxD pins are both switched from ports to SCI pins, and are placed in the high-impedance state. [5] Set the value corresponding to the bit rate in BRR. [6] Set the CKE1 and CKE0 bits in SCR. Clear the TIE, RIE, TE, RE, MPIE, and TEIE bits to 0. If the CKE0 bit is set to 1, the clock is output from the SCK pin. [7] Wait at least one bit interval, then set the TIE, RIE, TE, and RE bits in SCR. Do not set the TE bit and RE bit at the same time, except for self-diagnosis. Rev. 4.0, 03/03, page 666 of 1358 Serial Data Transmission (Except Block Transfer Mode): As data transmission in smart card mode involves error signal sampling and retransmission processing, the processing procedure is different from that for the normal SCI. Figure 15-4 shows a flowchart for transmitting, and figure 15-5 shows the relation between a transmit operation and the internal registers. [1] Perform smart card interface mode initialization as described above in Initialization. [2] Check that the ERS error flag in SSR is cleared to 0. [3] Repeat steps [2] and [3] until it can be confirmed that the TEND flag in SSR is set to 1. [4] Write the transmit data to TDR, clear the TDRE flag to 0, and perform the transmit operation. The TEND flag is cleared to 0. [5] When transmitting data continuously, go back to step [2]. [6] To end transmission, clear the TE bit to 0. With the above processing, interrupt handling or data transfer by the DMAC* or DTC is possible. If transmission ends and the TEND flag is set to 1 while the TIE bit is set to 1 and interrupt requests are enabled, a transmit-data-empty interrupt (TXI) request will be generated. If an error occurs in transmission and the ERS flag is set to 1 while the RIE bit is set to 1 and interrupt requests are enabled, a transmit/receive-error interrupt (ERI) request will be generated. The timing for setting the TEND flag depends on the value of the GM bit in SMR. The TEND flag setting timing is shown in figure 15-6. If the DMAC* or DTC is activated by a TXI request, the number of bytes set in the DMAC* or DTC can be transmitted automatically, including automatic retransmission. For details, see Interrupt Operations and Data Transfer Operation by DMAC* or DTC below. Notes: For details of operation in block transfer mode, see section 14.3.2, Operation in Asynchronous Mode. * The DMAC is not supported in the H8S/2321. Rev. 4.0, 03/03, page 667 of 1358 Start Initialization Start of transmission ERS = 0? No Yes Error handling No TEND = 1? Yes Write data to TDR, and clear TDRE flag in SSR to 0 No All data transmitted? Yes No ERS = 0? Yes Error handling No TEND = 1? Yes Clear TE bit to 0 End Figure 15-4 Sample Transmission Flowchart Rev. 4.0, 03/03, page 668 of 1358 TDR (1) Data write Data 1 (2) Transfer from TDR to TSR Data 1 (3) Serial data output Data 1 TSR (shift register) Data 1 ; Data remains in TDR Data 1 I/O signal line output In case of normal transmission: TEND flag is set In case of transmit error: ERS flag is set Steps (2) and (3) above are repeated until the TEND flag is set Note: When the ERS flag is set, it should be cleared until transfer of the last bit (D7 in LSB-first transmission, D0 in MSB-first transmission) of the next transfer data to be transmitted has been completed. Figure 15-5 Relation Between Transmit Operation and Internal Registers I/O data Ds TXI (TEND interrupt) When GM = 0 When GM = 1 Legend Ds D0 to D7 Dp DE D0 D1 D2 D3 D4 D5 D6 D7 Dp DE Guard time 12.5 etu 11.0 etu : Start bit : Data bits : Parity bit : Error signal Note: etu: Elementary time unit (time for transfer of 1 bit) Figure 15-6 TEND Flag Generation Timing in Transmission Rev. 4.0, 03/03, page 669 of 1358 Serial Data Reception (Except Block Transfer Mode): Data reception in smart card mode uses the same processing procedure as for the normal SCI. Figure 15-7 shows an example of the transmission processing flow. [1] Perform smart card interface mode initialization as described above in Initialization. [2] Check that the ORER flag and PER flag in SSR are cleared to 0. If either is set, perform the appropriate receive error handling, then clear both the ORER and the PER flag to 0. [3] Repeat steps [2] and [3] until it can be confirmed that the RDRF flag is set to 1. [4] Read the receive data from RDR. [5] When receiving data continuously, clear the RDRF flag to 0 and go back to step [2]. [6] To end reception, clear the RE bit to 0. Start Initialization Start of reception ORER = 0 and PER = 0? No Yes Error handling No RDRF = 1? Yes Read RDR and clear RDRF flag in SSR to 0 No All data received? Yes Clear RE bit to 0 Figure 15-7 Sample Reception Flowchart Rev. 4.0, 03/03, page 670 of 1358 With the above processing, interrupt handling or data transfer by the DMAC* or DTC is possible. If reception ends and the RDRF flag is set to 1 while the RIE bit is set to 1 and interrupt requests are enabled, a receive data full interrupt (RXI) request will be generated. If an error occurs in reception and either the ORER flag or the PER flag is set to 1, a transmit/receive-error interrupt (ERI) request will be generated. If the DMAC* or DTC is activated by an RXI request, the receive data in which the error occurred is skipped, and only the number of bytes of receive data set in the DMAC* or DTC are transferred. For details, see Interrupt Operation and Data Transfer Operation by DMAC* or DTC below. If a parity error occurs during reception and the PER is set to 1, the received data is still transferred to RDR, and therefore this data can be read. Notes: For details of operation in block transfer mode, see section 14.3.2, Operation in Asynchronous Mode. * The DMAC is not supported in the H8S/2321. Mode Switching Operation: When switching from receive mode to transmit mode, first confirm that the receive operation has been completed, then start from initialization, clearing RE bit to 0 and setting TE bit to 1. The RDRF flag or the PER and ORER flags can be used to check that the receive operation has been completed. When switching from transmit mode to receive mode, first confirm that the transmit operation has been completed, then start from initialization, clearing TE bit to 0 and setting RE bit to 1. The TEND flag can be used to check that the transmit operation has been completed. Fixing Clock Output: When the GSM bit in SMR is set to 1, the clock output can be fixed with bits CKE1 and CKE0 in SCR. At this time, the minimum clock pulse width can be made the specified width. Figure 15-8 shows the timing for fixing the clock output. In this example, GSM is set to 1, CKE1 is cleared to 0, and the CKE0 bit is controlled. Specified pulse width Specified pulse width SCK SCR write (CKE0 = 0) SCR write (CKE0 = 1) Figure 15-8 Timing for Fixing Clock Output Rev. 4.0, 03/03, page 671 of 1358 Interrupt Operation (Except Block Transfer Mode): There are three interrupt sources in smart card interface mode: transmit-data-empty interrupt (TXI) requests, transmit/receive-error interrupt (ERI) requests, and receive-data-full interrupt (RXI) requests. The transmit-end interrupt (TEI) request is not used in this mode. When the TEND flag in SSR is set to 1, a TXI interrupt request is generated. When the RDRF flag in SSR is set to 1, an RXI interrupt request is generated. When any of flags ORER, PER, and ERS in SSR is set to 1, an ERI interrupt request is generated. The relationship between the operating states and interrupt sources is shown in table 15-8. Note: For details of operation in block transfer mode, see section 14.4, SCI Interrupts. Table 15-8 Smart Card Mode Operating States and Interrupt Sources DMAC* Activation Possible Operating State Flag Enable Bit Interrupt DTC Source Activation Transmit Mode Normal operation TEND TIE TXI Possible Error ERS RIE ERI Not possible Not possible Normal operation RDRF RIE RXI Possible Error PER, ORER RIE ERI Not possible Not possible Receive Mode Possible Note: * The DMAC is not supported in the H8S/2321. Data Transfer Operation by DMAC* or DTC: In smart card mode, as with the normal SCI, transfer can be carried out using the DMAC* or DTC. In a transmit operation, the TDRE flag is also set to 1 at the same time as the TEND flag in SSR, and a TXI interrupt is generated. If the TXI request is designated beforehand as a DMAC* or DTC activation source, the DMAC* or DTC will be activated by the TXI request, and transfer of the transmit data will be carried out. The TDRE and TEND flags are automatically cleared to 0 when data transfer is performed by the DMAC* or DTC. In the event of an error, the SCI retransmits the same data automatically. The TEND flag remains cleared to 0 during this time, and the DMAC* is not activated. Thus, the number of bytes specified by the SCI and DMAC* are transmitted automatically even in retransmission following an error. However, the ERS flag is not cleared automatically when an error occurs, and so the RIE bit should be set to 1 beforehand so that an ERI request will be generated in the event of an error, and the ERS flag will be cleared. When performing transfer using the DMAC* or DTC, it is essential to set and enable the DMAC* or DTC before carrying out SCI setting. For details of the DMAC* and DTC setting procedures, see section 7, DMA Controller*, and section 8, Data Transfer Controller. Rev. 4.0, 03/03, page 672 of 1358 In a receive operation, an RXI interrupt request is generated when the RDRF flag in SSR is set to 1. If the RXI request is designated beforehand as a DMAC* or DTC activation source, the DMAC* or DTC will be activated by the RXI request, and transfer of the receive data will be carried out. The RDRF flag is cleared to 0 automatically when data transfer is performed by the DMAC* or DTC. If an error occurs, an error flag is set but the RDRF flag is not. Consequently, the DMAC* or DTC is not activated, but instead, an ERI interrupt request is sent to the CPU. Therefore, the error flag should be cleared. Notes: For details of operation in block transfer mode, see section 14.4, SCI Interrupts. * The DMAC is not supported in the H8S/2321. 15.3.7 Operation in GSM Mode Switching the Mode: When switching between smart card interface mode and software standby mode, the following switching procedure should be followed in order to maintain the clock duty. * When changing from smart card interface mode to software standby mode [1] Set the data register (DR) and data direction register (DDR) corresponding to the SCK pin to the value for the fixed output state in software standby mode. [2] Write 0 to the TE bit and RE bit in the serial control register (SCR) to halt the transmit/receive operation. At the same time, set the CKE1 bit to the value for the fixed output state in software standby mode. [3] Write 0 to the CKE0 bit in SCR to halt the clock. [4] Wait for one serial clock period. During this interval, clock output is fixed at the specified level, with the duty preserved. [5] Write H'00 to SMR and SCMR. [6] Make the transition to the software standby state. * When returning to smart card interface mode from software standby mode [7] Exit the software standby state. [8] Set the CKE1 bit in SCR to the value for the fixed output state (current SCK pin state) when software standby mode is initiated. [9] Set smart card interface mode and output the clock. Signal generation is started with the normal duty. Rev. 4.0, 03/03, page 673 of 1358 Normal operation [1] [2] [3] Software standby [4] [5] [6] Normal operation [7] [8] [9] Figure 15-9 Clock Halt and Restart Procedure Powering On: To secure the clock duty from power-on, the following switching procedure should be followed. [1] The initial state is port input and high impedance. Use a pull-up resistor or pull-down resistor to fix the potential. [2] Fix the SCK pin to the specified output level with the CKE1 bit in SCR. [3] Set SMR and SCMR, and switch to smart card mode operation. [4] Set the CKE0 bit in SCR to 1 to start clock output. 15.3.8 Operation in Block Transfer Mode Operation in block transfer mode is the same as in SCI asynchronous mode, except for the following points. For details, see section 14.3.2, Operation in Asynchronous Mode. Data Format: The data format is 8 bits with parity. There is no stop bit, but there is a guard time of 2 or more bits (1 or more bits in reception). Also, except during transmission (with start bit, data bits, and parity bit), the transmission pins go to the high-impedance state, so the signal lines must be fixed high with a pull-up resistor. Transmit/Receive Clock: Only an internal clock generated by the built-in baud rate generator can be used as the transmit/receive clock. The number of basic clock periods in a 1-bit transfer interval can be set to 32, 64, 372, or 256 with bits BCP1 and BCP0. For details, see section 15.3.5, Clock. ERS (FER) Flag: As with the normal smart card interface, the ERS flag indicates the error signal status, but since error signal transmission and reception is not performed, this flag is always cleared to 0. Rev. 4.0, 03/03, page 674 of 1358 15.4 Usage Notes The following points should be noted when using the SCI as a smart card interface. Receive Data Sampling Timing and Receive Margin in Smart Card Interface Mode: In smart card interface mode, the SCI operates on a base clock with a frequency of 32, 64, 372, or 256 times the transfer rate (determined by bits BCP1 and BCP0). In reception, the SCI samples the falling edge of the start bit using the base clock, and performs internal synchronization. Receive data is latched internally at the rising edge of the 16th, 32nd, 186th, or 128th pulse of the base clock. Use of a 372-times clock is illustrated in figure 15-10. 372 clocks 186 clocks 0 185 185 371 0 371 0 Internal base clock Receive data (RxD) Start bit D0 D1 Synchronization sampling timing Data sampling timing Figure 15-10 Receive Data Sampling Timing in Smart Card Mode (When Using 372-Times Clock) Rev. 4.0, 03/03, page 675 of 1358 Thus the receive margin in asynchronous mode is given by the following formula. M = (0.5 - Where M: N: D: L: F: 1 2N ) - (L - 0.5) F - D - 0.5 N (1 + F) x 100% Receive margin (%) Ratio of bit rate to clock (N = 32, 64, 372, 256) Clock duty (D = 0 to 1.0) Frame length (L = 10) Absolute value of clock frequency deviation Assuming values of F = 0, D = 0.5, and N=372 in the above formula, the receive margin formula is as follows. When D = 0.5 and F = 0, M = (0.5 - 1/2 x 372) x 100% = 49.866% Retransfer Operations (Except Block Transfer Mode): Retransfer operations are performed by the SCI in receive mode and transmit mode as described below. * Retransfer operation when SCI is in receive mode Figure 15-11 illustrates the retransfer operation when the SCI is in receive mode. [1] If an error is found when the received parity bit is checked, the PER bit in SSR is automatically set to 1. If the RIE bit in SCR is enabled at this time, an ERI interrupt request is generated. The PER bit in SSR should be kept cleared to 0 until the next parity bit is sampled. [2] The RDRF bit in SSR is not set for a frame in which an error has occurred. [3] If no error is found when the received parity bit is checked, the PER bit in SSR is not set. [4] If no error is found when the received parity bit is checked, the receive operation is judged to have been completed normally, and the RDRF flag in SSR is automatically set to 1. If the RIE bit in SCR is enabled at this time, an RXI interrupt request is generated. If DMAC* or DTC data transfer by an RXI source is enabled, the contents of RDR can be read automatically. When the RDR data is read by the DMAC* or DTC, the RDRF flag is automatically cleared to 0. [5] When a normal frame is received, the pin retains the high-impedance state at the timing for error signal transmission. Note: * The DMAC is not supported in the H8S/2321. Rev. 4.0, 03/03, page 676 of 1358 nth transfer frame Transfer frame n+1 Retransferred frame Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp DE (DE) Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp Ds D0 D1 D2 D3 D4 RDRF [2] [4] [1] [3] PER Figure 15-11 Retransfer Operation in SCI Receive Mode * Retransfer operation when SCI is in transmit mode Figure 15-12 illustrates the retransfer operation when the SCI is in transmit mode. [6] If an error signal is sent back from the receiving end after transmission of one frame is completed, the ERS bit in SSR is set to 1. If the RIE bit in SCR is enabled at this time, an ERI interrupt request is generated. The ERS bit in SSR should be kept cleared to 0 until the next parity bit is sampled. [7] The TEND bit in SSR is not set for a frame for which an error signal indicating an abnormality is received. [8] If an error signal is not sent back from the receiving end, the ERS bit in SSR is not set. [9] If an error signal is not sent back from the receiving end, transmission of one frame, including a retransfer, is judged to have been completed, and the TEND bit in SSR is set to 1. If the TIE bit in SCR is enabled at this time, a TXI interrupt request is generated. If data transfer by the DMAC* or DTC by means of the TXI source is enabled, the next data can be written to TDR automatically. When data is written to TDR by the DMAC* or DTC, the TDRE bit is automatically cleared to 0. Note: * The DMAC is not supported in the H8S/2321. Rev. 4.0, 03/03, page 677 of 1358 nth transfer frame Transfer frame n+1 Retransferred frame Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp DE Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp (DE) Ds D0 D1 D2 D3 D4 TDRE Transfer to TSR from TDR Transfer to TSR from TDR Transfer to TSR from TDR TEND [7] [9] FER/ERS [6] [8] Figure 15-12 Retransfer Operation in SCI Transmit Mode Rev. 4.0, 03/03, page 678 of 1358 Section 16 A/D Converter (8 Analog Input Channel Version) 16.1 Overview The chip incorporates a successive-approximations type 10-bit A/D converter that allows up to eight analog input channels to be selected. 16.1.1 Features A/D converter features are listed below * 10-bit resolution * Eight input channels * Settable analog conversion voltage range Conversion of analog voltages with the reference voltage pin (Vref) as the analog reference voltage * High-speed conversion Minimum conversion time: 6.7 s per channel (at 20 MHz operation) * Choice of single mode or scan mode Single mode: Single-channel A/D conversion Scan mode: Continuous A/D conversion on 1 to 4 channels * Four data registers Conversion results are held in a 16-bit data register for each channel * Sample and hold function * Three kinds of conversion start Choice of software or timer conversion start trigger (TPU or 8-bit timer), or ADTRG pin * A/D conversion end interrupt generation A/D conversion end interrupt (ADI) request can be generated at the end of A/D conversion The DMA controller (DMAC)* or data transfer controller (DTC) can be activated for data transfer by an interrupt Note: * The DMAC is not supported in the H8S/2321. Rev. 4.0, 03/03, page 679 of 1358 * Module stop mode can be set As the initial setting, A/D converter operation is halted. Register access is enabled by exiting module stop mode. 16.1.2 Block Diagram Figure 16-1 shows a block diagram of the A/D converter. Module data bus Vref 10-bit D/A converter AVSS Bus interface A D D R A A D D R B A D D R C A D D R D A D C S R A D C R + - Multiplexer AN0 AN1 AN2 AN3 AN4 AN5 AN6 AN7 Successive approximations register AVCC Internal data bus Comparator Control circuit Sample-andhold circuit ADI interrupt signal ADTRG Conversion start trigger from 8-bit timer or TPU ADCR : A/D control register ADCSR : A/D control/status register ADDRA : A/D data register A ADDRB : A/D data register B ADDRC : A/D data register C ADDRD : A/D data register D Figure 16-1 Block Diagram of A/D Converter Rev. 4.0, 03/03, page 680 of 1358 16.1.3 Pin Configuration Table 16-1 summarizes the input pins used by the A/D converter. The AVCC and AVSS pins are the power supply pins for the analog block in the A/D converter. The Vref pin is the A/D conversion reference voltage pin. The eight analog input pins are divided into two groups: group 0 (AN0 to AN3), and group 1 (AN4 to AN7). Table 16-1 A/D Converter Pins Pin Name Symbol I/O Function Analog power supply pin AVCC Input Analog block power supply Analog ground pin AVSS Input Analog block ground and A/D conversion reference voltage Reference voltage pin Vref Input A/D conversion reference voltage Analog input pin 0 AN0 Input Group 0 analog inputs Analog input pin 1 AN1 Input Analog input pin 2 AN2 Input Analog input pin 3 AN3 Input Analog input pin 4 AN4 Input Analog input pin 5 AN5 Input Analog input pin 6 AN6 Input Analog input pin 7 AN7 Input A/D external trigger input pin ADTRG Input Group 1 analog inputs External trigger input for starting A/D conversion Rev. 4.0, 03/03, page 681 of 1358 16.1.4 Register Configuration Table 16-2 summarizes the registers of the A/D converter. Table 16-2 A/D Converter Registers Name Abbreviation R/W Initial Value 1 Address* A/D data register AH ADDRAH R H'00 H'FF90 A/D data register AL ADDRAL R H'00 H'FF91 A/D data register BH ADDRBH R H'00 H'FF92 A/D data register BL ADDRBL R H'00 H'FF93 A/D data register CH ADDRCH R H'00 H'FF94 A/D data register CL ADDRCL R H'00 H'FF95 A/D data register DH ADDRDH R H'00 H'FF96 A/D data register DL ADDRDL R H'00 H'FF97 A/D control/status register ADCSR 2 R/(W)* H'00 H'FF98 A/D control register ADCR R/W H'3F H'FF99 Module stop control register MSTPCR R/W H'3FFF H'FF3C Notes: *1 Lower 16 bits of the address. *2 Bit 7 can only be written with 0 for flag clearing. Rev. 4.0, 03/03, page 682 of 1358 16.2 Register Descriptions 16.2.1 A/D Data Registers A to D (ADDRA to ADDRD) Bit : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 AD1 AD0 -- -- -- -- -- -- Initial value : 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R/W R R R R R R R R R R R R R R R R : There are four 16-bit read-only ADDR registers, ADDRA to ADDRD, used to store the results of A/D conversion. The 10-bit data resulting from A/D conversion is transferred to the ADDR register for the selected channel and stored there. The upper 8 bits of the converted data are transferred to the upper byte (bits 15 to 8) of ADDR, and the lower 2 bits are transferred to the lower byte (bits 7 and 6) and stored. Bits 5 to 0 are always read as 0. The correspondence between the analog input channels and ADDR registers is shown in table 16-3. The ADDR registers can always be read by the CPU. The upper byte can be read directly, but for the lower byte, data transfer is performed via a temporary register (TEMP). For details, see section 16.3, Interface to Bus Master. The ADDR registers are initialized to H'0000 by a reset, and in standby mode or module stop mode. Table 16-3 Analog Input Channels and Corresponding ADDR Registers Analog Input Channel Group 0 Group 1 A/D Data Register AN0 AN4 ADDRA AN1 AN5 ADDRB AN2 AN6 ADDRC AN3 AN7 ADDRD Rev. 4.0, 03/03, page 683 of 1358 16.2.2 Bit A/D Control/Status Register (ADCSR) : Initial value : R/W : 7 6 5 4 3 2 1 0 ADF ADIE ADST SCAN CKS CH2 CH1 CH0 0 0 0 0 0 0 0 0 R/(W)* R/W R/W R/W R/W R/W R/W R/W Note: * Only 0 can be written to bit 7, to clear this flag. ADCSR is an 8-bit readable/writable register that controls A/D conversion operations and shows the status of the operation. ADCSR is initialized to H'00 by a reset, and in standby mode or module stop mode. Bit 7--A/D End Flag (ADF): Status flag that indicates the end of A/D conversion. Bit 7 ADF Description 0 [Clearing conditions] (Initial value) * When 0 is written to the ADF flag after reading ADF = 1 * When the DMAC* or DTC is activated by an ADI interrupt and ADDR is read 1 [Setting conditions] * Single mode: When A/D conversion ends * Scan mode: When A/D conversion ends on all specified channels Note: * The DMAC is not supported in the H8S/2321. Bit 6--A/D Interrupt Enable (ADIE): Selects enabling or disabling of interrupt (ADI) requests at the end of A/D conversion. Bit 6 ADIE Description 0 A/D conversion end interrupt (ADI) request disabled 1 A/D conversion end interrupt (ADI) request enabled Rev. 4.0, 03/03, page 684 of 1358 (Initial value) Bit 5--A/D Start (ADST): Selects starting or stopping of A/D conversion. Holds a value of 1 during A/D conversion. The ADST bit can be set to 1 by software, a timer conversion start trigger, or the A/D external trigger input pin (ADTRG). Bit 5 ADST Description 0 A/D conversion stopped 1 * Single mode: A/D conversion is started. Cleared to 0 automatically when conversion on the specified channel ends * Scan mode: (Initial value) A/D conversion is started. Conversion continues sequentially on the selected channels until ADST is cleared to 0 by software, a reset, or a transition to standby mode or module stop mode Bit 4--Scan Mode (SCAN): Selects single mode or scan mode as the A/D conversion operating mode. See section 16.4, Operation, for details of single mode and scan mode operation. Only set the SCAN bit while conversion is stopped (ADST = 0). Bit 4 SCAN Description 0 Single mode 1 Scan mode (Initial value) Bit 3--Clock Select (CKS): Used together with the CKS1 bit in ADCR to set the A/D conversion time. Only change the conversion time while conversion is stopped (ADST = 0). ADCR3 CKS1 Bit 3 CKS Description 0 0 Conversion time = 530 states (max.) 1 Conversion time = 68 states (max.) 0 Conversion time = 266 states (max.) 1 Conversion time = 134 states (max.) 1 (Initial value) Bits 2 to 0--Channel Select 2 to 0 (CH2 to CH0): These bits are used together with the SCAN bit to select the analog input channels. Only set the input channel(s) while conversion is stopped (ADST = 0). Rev. 4.0, 03/03, page 685 of 1358 Group Selection Channel Selection CH2 CH1 0 0 CH0 1 1 0 1 16.2.3 Description Single Mode (SCAN = 0) Scan Mode (SCAN = 1) 0 AN0 (Initial value) AN0 1 AN1 AN0, AN1 0 AN2 AN0 to AN2 1 AN3 AN0 to AN3 0 AN4 AN4 1 AN5 AN4, AN5 0 AN6 AN4 to AN6 1 AN7 AN4 to AN7 A/D Control Register (ADCR) Bit : 7 6 5 4 3 2 1 0 TRGS1 TRGS0 -- -- CKS1 CH3 -- -- 0 0 1 1 1 1 1 1 R/W R/W -- -- R/W R/W -- -- Initial value : R/W : ADCR is an 8-bit readable/writable register that enables or disables external triggering of A/D conversion operations. ADCR is initialized to H'3F by a reset, and in standby mode or module stop mode. Bits 7 and 6--Timer Trigger Select 1 and 0 (TRGS1, TRGS0): These bits select enabling or disabling of the start of A/D conversion by a trigger signal. Only set bits TRGS1 and TRGS0 while conversion is stopped (ADST = 0). Bit 7 TRGS1 Bit 6 TRGS0 Description 0 0 A/D conversion start by external trigger is disabled 1 A/D conversion start by external trigger (TPU) is enabled 0 A/D conversion start by external trigger (8-bit timer) is enabled 1 A/D conversion start by external trigger pin (ADTRG) is enabled 1 Rev. 4.0, 03/03, page 686 of 1358 (Initial value) Bits 5, 4, 1, and 0--Reserved: These bits cannot be modified and are always read as 1. Bit 3--Clock Select 1 (CKS1): Used together with the CKS bit in ADCSR to set the A/D conversion time. See the description of the CKS bit for details. Bit 2--Channel Select 3 (CH3): Reserved. A value of 1 must be written to this bit. 16.2.4 Module Stop Control Register (MSTPCR) MSTPCRH Bit MSTPCRL : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Initial value : 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 R/W : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W MSTPCR is a 16-bit readable/writable register that performs module stop mode control. When the MSTP9 bit in MSTPCR is set to 1, A/D converter operation stops at the end of the bus cycle and a transition is made to module stop mode. Registers cannot be read or written to in module stop mode. For details, see section 21.5, Module Stop Mode. MSTPCR is initialized to H'3FFF by a reset and in hardware standby mode. It is not initialized in software standby mode. Bit 9--Module Stop (MSTP9): Specifies the A/D converter module stop mode. Bit 9 MSTP9 Description 0 A/D converter module stop mode cleared 1 A/D converter module stop mode set (Initial value) Rev. 4.0, 03/03, page 687 of 1358 16.3 Interface to Bus Master ADDRA to ADDRD are 16-bit registers, and the data bus to the bus master is 8 bits wide. Therefore, in accesses by the bus master, the upper byte is accessed directly, but the lower byte is accessed via a temporary register (TEMP). A data read from ADDR is performed as follows. When the upper byte is read, the upper byte value is transferred to the CPU and the lower byte value is transferred to TEMP. Next, when the lower byte is read, the TEMP contents are transferred to the CPU. When reading ADDR, always read the upper byte before the lower byte. It is possible to read only the upper byte, but if only the lower byte is read, incorrect data may be obtained. Figure 16-2 shows the data flow for ADDR access. Upper byte read Bus master (H'AA) Module data bus Bus interface TEMP (H'40) ADDRnH (H'AA) ADDRnL (H'40) (n = A to D) Lower byte read Bus master (H'40) Module data bus Bus interface TEMP (H'40) ADDRnH (H'AA) ADDRnL (H'40) (n = A to D) Figure 16-2 ADDR Access Operation (Reading H'AA40) Rev. 4.0, 03/03, page 688 of 1358 16.4 Operation The A/D converter operates by successive approximations with 10-bit resolution. It has two operating modes: single mode and scan mode. 16.4.1 Single Mode (SCAN = 0) Single mode is selected when A/D conversion is to be performed on a single channel only. A/D conversion is started when the ADST bit is set to 1 by software or by external trigger input. The ADST bit remains set to 1 during A/D conversion, and is automatically cleared to 0 when conversion ends. On completion of conversion, the ADF flag is set to 1. If the ADIE bit is set to 1 at this time, an ADI interrupt request is generated. The ADF flag is cleared by writing 0 to it after reading ADCSR. When the operating mode or analog input channel must be changed during analog conversion, to prevent incorrect operation, first clear the ADST bit to 0 in ADCSR to halt A/D conversion. After making the necessary changes, set the ADST bit to 1 to start A/D conversion again. The ADST bit can be set at the same time as the operating mode or input channel is changed. Typical operations when channel 1 (AN1) is selected in single mode are described next. Figure 16-3 shows a timing diagram for this example. [1] Single mode is selected (SCAN = 0), input channel AN1 is selected (CH2 = 0, CH1 = 0, CH0 = 1), the A/D interrupt is enabled (ADIE = 1), and A/D conversion is started (ADST = 1). [2] When A/D conversion is completed, the result is transferred to ADDRB. At the same time the ADF flag is set to 1, the ADST bit is cleared to 0, and the A/D converter becomes idle. [3] Since ADF = 1 and ADIE = 1, an ADI interrupt is requested. [4] The A/D interrupt handling routine starts. [5] The routine reads ADCSR, then writes 0 to the ADF flag. [6] The routine reads and processes the conversion result (ADDRB). [7] Execution of the A/D interrupt handling routine ends. After that, if the ADST bit is set to 1, A/D conversion starts again and steps [2] to [7] are repeated. Rev. 4.0, 03/03, page 689 of 1358 Set* ADIE ADST A/D conversion starts Set* Set* Clear* Clear* ADF State of channel 0 (AN0) Idle State of channel 1 (AN1) Idle State of channel 2 (AN2) Idle State of channel 3 (AN3) Idle A/D conversion 1 Idle A/D conversion 2 Idle ADDRA ADDRB Read conversion result A/D conversion result 1 Read conversion result A/D conversion result 2 ADDRC ADDRD Note: * Vertical arrows ( ) indicate instructions executed by software. Figure 16-3 Example of A/D Converter Operation (Single Mode, Channel 1 Selected) Rev. 4.0, 03/03, page 690 of 1358 16.4.2 Scan Mode (SCAN = 1) Scan mode is useful for monitoring analog inputs in a group of one or more channels. When the ADST bit is set to 1 by software, or by timer or external trigger input, A/D conversion starts on the first channel in the group (AN0). When two or more channels are selected, after conversion of the first channel ends, conversion of the second channel (AN1) starts immediately. A/D conversion continues cyclically on the selected channels until the ADST bit is cleared to 0. The conversion results are transferred for storage into the ADDR registers corresponding to the channels. When the operating mode or analog input channel must be changed during analog conversion, to prevent incorrect operation, first clear the ADST bit to 0 in ADCSR to halt A/D conversion. After making the necessary changes, set the ADST bit to 1 to start A/D conversion again. The ADST bit can be set at the same time as the operating mode or input channel is changed. Typical operations when three channels (AN0 to AN2) are selected in scan mode are described next. Figure 16-4 shows a timing diagram for this example. [1] Scan mode is selected (SCAN = 1), scan group 0 is selected (CH2 = 0), analog input channels AN0 to AN2 are selected (CH1 = 1, CH0 = 0), and A/D conversion is started (ADST = 1) [2] When A/D conversion of the first channel (AN0) is completed, the result is transferred to ADDRA. Next, conversion of the second channel (AN1) starts automatically. [3] Conversion proceeds in the same way through the third channel (AN2). [4] When conversion of all the selected channels (AN0 to AN2) is completed, the ADF flag is set to 1 and conversion of the first channel (AN0) starts again. If the ADIE bit is set to 1 at this time, an ADI interrupt is requested after A/D conversion ends. [5] Steps [2] to [4] are repeated as long as the ADST bit remains set to 1. When the ADST bit is cleared to 0, A/D conversion stops. After that, if the ADST bit is set to 1, A/D conversion starts again from the first channel (AN0). Rev. 4.0, 03/03, page 691 of 1358 Continuous A/D conversion Clear*1 Set*1 ADST Clear*1 ADF State of channel 0 (AN0) State of channel 1 (AN1) State of channel 2 (AN2) A/D conversion time Idle Idle A/D conversion 1 Idle Idle A/D conversion 2 Idle Idle A/D conversion 4 A/D conversion 5 *2 Idle A/D conversion 3 State of channel 3 (AN3) Idle Idle Transfer A/D conversion result 1 ADDRA ADDRB A/D conversion result 4 A/D conversion result 2 ADDRC A/D conversion result 3 ADDRD Notes: *1 Vertical arrows ( ) indicate instructions executed by software. *2 Data currently being converted is ignored. Figure 16-4 Example of A/D Converter Operation (Scan Mode, Channels AN0 to AN2 Selected) Rev. 4.0, 03/03, page 692 of 1358 16.4.3 Input Sampling and A/D Conversion Time The A/D converter has a built-in sample-and-hold circuit. The A/D converter samples the analog input at a time tD after the ADST bit is set to 1, then starts conversion. Figure 16-5 shows the A/D conversion timing. Table 16-4 indicates the A/D conversion time. As indicated in figure 16-5, the A/D conversion time includes tD and the input sampling time. The length of tD varies depending on the timing of the write access to ADCSR. The total conversion time therefore varies within the ranges indicated in table 16-4. In scan mode, the values given in table 16-4 apply to the first conversion time. In the second and subsequent conversions the conversion time is as shown in table 16-5. (1) f Address bus (2) Write signal Input sampling timing ADF tD t SPL t CONV Legend (1) : (2) : : tD : tSPL tCONV : ADCSR write cycle ADCSR address A/D conversion start delay Input sampling time A/D conversion time Figure 16-5 A/D Conversion Timing Rev. 4.0, 03/03, page 693 of 1358 Table 16-4 A/D Conversion Time (Single Mode) CKS1 = 0 CKS1 = 1 CKS = 0 CKS = 1 CKS = 0 CKS = 1 Item Symbol Min Typ Max Min Typ Max Min Typ Max Min Typ Max A/D conversion start delay tD 18 -- 4 -- 5 10 -- 17 6 -- 9 Input sampling time tSPL -- 127 -- -- 15 -- -- 63 -- -- 31 -- A/D conversion time tCONV 515 -- 67 -- 68 259 -- 266 131 -- 33 530 134 Note: Values in the table are the number of states. Table 16-5 A/D Conversion Time (Scan Mode) CKS1 CKS Conversion Time (States) 0 0 512 (Fixed) 1 64 (Fixed) 1 16.4.4 0 256 (Fixed) 1 128 (Fixed) External Trigger Input Timing A/D conversion can be externally triggered. When the TRGS1 and TRGS0 bits are set to B'11 in ADCR, external trigger input is enabled at the ADTRG pin. A falling edge at the ADTRG pin sets the ADST bit to 1 in ADCSR, starting A/D conversion. Other operations, in both single and scan modes, are the same as when the ADST bit has been set to 1 by software. Figure 16-6 shows the timing. Rev. 4.0, 03/03, page 694 of 1358 f ADTRG Internal trigger signal ADST A/D conversion Figure 16-6 External Trigger Input Timing 16.5 Interrupts The A/D converter generates an A/D conversion end interrupt (ADI) at the end of A/D conversion. ADI interrupt requests can be enabled or disabled by means of the ADIE bit in ADCSR. The DTC or DMAC* can be activated by an ADI interrupt. Having the converted data read by the DTC or DMAC* in response to an ADI interrupt enables continuous conversion to be achieved without imposing a load on software. The A/D converter interrupt source is shown in table 16-6. Note: * The DMAC is not supported in the H8S/2321. Table 16-6 A/D Converter Interrupt Source Interrupt Source Description DTC Activation DMAC Activation* ADI Interrupt due to end of conversion Possible Possible Note: * The DMAC is not supported in the H8S/2321. Rev. 4.0, 03/03, page 695 of 1358 16.6 Usage Notes The following points should be noted when using the A/D converter. Setting Range of Analog Power Supply and Other Pins 1. Analog input voltage range The voltage applied to analog input pins ANn during A/D conversion should be in the range AVSS ANn Vref. 2. Relation between AVCC, AVSS and VCC, VSS As the relationship between AVCC, AVSS and VCC, VSS, set AVSS = VSS. If the A/D converter is not used, the AVCC and AVSS pins must not be left open. 3. Vref input range The analog reference voltage input at the Vref pin should be set in the range Vref AVCC. The Vref pin should be set as Vref = VCC when the A/D converter is not used. Do not leave the Vref pin open. If conditions 1, 2, and 3 above are not met, the reliability of the device may be adversely affected. Notes on Board Design: In board design, digital circuitry and analog circuitry should be as mutually isolated as possible, and layout in which digital circuit signal lines and analog circuit signal lines cross or are in close proximity should be avoided as far as possible. Failure to do so may result in incorrect operation of the analog circuitry due to inductance, adversely affecting A/D conversion values. Also, digital circuitry must be isolated from the analog input signals (AN0 to AN7), analog reference power supply (Vref), and analog power supply (AVCC) by the analog ground (AVSS). Also, the analog ground (AVSS) should be connected at one point to a stable digital ground (VSS) on the board. Notes on Noise Countermeasures: A protection circuit connected to prevent damage due to an abnormal voltage such as an excessive surge at the analog input pins (AN0 to AN7) and analog reference power supply (Vref) should be connected between AVCC and AVSS as shown in figure 16-7. Also, the bypass capacitors connected to AVCC and Vref and the filter capacitor connected to AN0 to AN7 must be connected to AVSS. If a filter capacitor is connected as shown in figure 16-7, the input currents at the analog input pins (AN0 to AN7) are averaged, and so an error may arise. Also, when A/D conversion is performed frequently, as in scan mode, if the current charged and discharged by the capacitance of the sample-and-hold circuit in the A/D converter exceeds the current input via the input impedance Rev. 4.0, 03/03, page 696 of 1358 (Rin), an error will arise in the analog input pin voltage. Careful consideration is therefore required when deciding the circuit constants. AVCC Vref 100 W Rin* 2 *1 AN0 to AN7 *1 0.1 mF Notes: AVSS Values are reference values. *1 10 mF 0.01 mF *2 Rin: Input impedance Figure 16-7 Example of Analog Input Protection Circuit A/D Conversion Precision Definitions: The chip's A/D conversion precision definitions are given below. * Resolution The number of A/D converter digital output codes * Offset error The deviation of the analog input voltage value from the ideal A/D conversion characteristic when the digital output changes from the minimum voltage value B'0000000000 to B'0000000001 (see figure 16-9). * Full-scale error The deviation of the analog input voltage value from the ideal A/D conversion characteristic when the digital output changes from B'1111111110 to B'1111111111 (see figure 16-9). Rev. 4.0, 03/03, page 697 of 1358 * Quantization error The deviation inherent in the A/D converter, given by 1/2 LSB (see figure 16-8). * Nonlinearity error The error with respect to the ideal A/D conversion characteristic between the zero voltage and the full-scale voltage. Does not include the offset error, full-scale error, or quantization error. * Absolute precision The deviation between the digital value and the analog input value. Includes the offset error, full-scale error, quantization error, and nonlinearity error. Digital output Ideal A/D conversion characteristic 111 110 101 100 011 Quantization error 010 001 000 1 2 1024 1024 1022 1023 1024 1024 FS Analog input voltage Figure 16-8 A/D Conversion Precision Definitions (1) Rev. 4.0, 03/03, page 698 of 1358 Full-scale error Digital output Ideal A/D conversion characteristic Nonlinearity error Actual A/D conversion characteristic FS Offset error Analog input voltage Figure 16-9 A/D Conversion Precision Definitions (2) Permissible Signal Source Impedance: The chip's analog input is designed so that conversion precision is guaranteed for an input signal for which the signal source impedance is 5 k or less. This specification is provided to enable the A/D converter's sample-and-hold circuit input capacitance to be charged within the sampling time; if the sensor output impedance exceeds 5 k, charging may be insufficient and it may not be possible to guarantee the A/D conversion precision. If a large capacitance is provided externally, the input load will essentially comprise only the internal input resistance of 10 k, and the signal source impedance is ignored. However, since a low-pass filter effect is obtained in this case, it may not be possible to follow an analog signal with a large differential coefficient (e.g., 5 mV/s or greater). When converting a high-speed analog signal, a low-impedance buffer should be inserted. Influences on Absolute Precision: Adding capacitance results in coupling with GND, and therefore noise in GND may adversely affect absolute precision. Be sure to make the connection to an electrically stable GND such as AVSS. Rev. 4.0, 03/03, page 699 of 1358 Care is also required to insure that filter circuits do not communicate with digital signals on the mounting board, so acting as antennas. Chip Sensor output impedance Max. 5 kW A/D converter equivalent circuit 10 kW Sensor input Low-pass filter C to 0.1 F Cin = 15 pF Note: Values are reference values. Figure 16-10 Example of Analog Input Circuit Rev. 4.0, 03/03, page 700 of 1358 20 pF Section 17 D/A Converter 17.1 Overview The chip includes an 8-bit resolution D/A converter with from two analog signal output channels. 17.1.1 Features D/A converter features are listed below. * 8-bit resolution * Two output channels * Maximum conversion time of 10 s (with 20 pF load) * Output voltage of 0 V to Vref * D/A output hold function in software standby mode * Module stop mode can be set As the initial setting, D/A converter operation is halted. Register access is enabled by exiting module stop mode. Rev. 4.0, 03/03, page 701 of 1358 17.1.2 Block Diagram Bus interface Figure 17-1 shows a block diagram of the D/A converter. Module data bus Vref DACR 8-bit D/A converter DADR1 DA1 DADR0 AVCC DA0 AVSS Control circuit Legend DACR: D/A control register DADR0, 1: D/A data registers 0, 1 Figure 17-1 Block Diagram of D/A Converter Rev. 4.0, 03/03, page 702 of 1358 Internal data bus 17.1.3 Pin Configuration Table 17-1 summarizes the input and output pins of the D/A converter. Table 17-1 Pin Configuration Pin Name Symbol I/O Function Analog power pin AVCC Input Analog power source Analog ground pin AVSS Input Analog ground and reference voltage Analog output pin 0 DA0 Output Channel 0 analog output Analog output pin 1 DA1 Output Channel 1 analog output Reference voltage pin Vref Input Analog reference voltage 17.1.4 Register Configuration Table 17-2 summarizes the registers of the D/A converter. Table 17-2 D/A Converter Registers Channels 0, 1 Common Name Abbreviation R/W Initial Value Address* D/A data register 0 DADR0 R/W H'00 H'FFA4 D/A data register 1 DADR1 R/W H'00 H'FFA5 D/A control register 01 DACR01 R/W H'1F H'FFA6 Module stop control register MSTPCR R/W H'3FFF H'FF3C Note: * Lower 16 bits of the address. Rev. 4.0, 03/03, page 703 of 1358 17.2 Register Descriptions 17.2.1 D/A Data Registers 0, 1 (DADR0, DADR1) Bit : Initial value : R/W : 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W DADR0, DADR1 are 8-bit readable/writable registers that store data for conversion. Whenever output is enabled, the values in DADR0 and DADR1 are converted and output from the analog output pins. DADR0 and DADR1 are each initialized to H'00 by a reset and in hardware standby mode. 17.2.2 Bit D/A Control Registers 01 (DACR01) : Initial value : R/W : 7 6 5 4 3 2 1 0 DAOE1 DAOE0 DAE -- -- -- -- -- 0 0 0 1 1 1 1 1 R/W R/W R/W -- -- -- -- -- DACR01 is a 8-bit readable/writable register that controls the operation of the D/A converter. DACR01 is initialized to H'1F by a reset and in hardware standby mode. Bit 7--D/A Output Enable 1 (DAOE1): Controls D/A conversion and analog output. Bit 7 DAOE1 Description 0 Analog output DA1 is disabled 1 Channel 1 D/A conversion is enabled; analog output DA1 is enabled (Initial value) Bit 6--D/A Output Enable 0 (DAOE0): Controls D/A conversion and analog output. Bit 6 DAOE0 Description 0 Analog output DA0 is disabled 1 Channel 0 D/A conversion is enabled; analog output DA0 is enabled Rev. 4.0, 03/03, page 704 of 1358 (Initial value) Bit 5--D/A Enable (DAE): Used together with the DAOE0 and DAOE1 bits to control D/A conversion. When the DAE bit is cleared to 0, channel 0 and 1 D/A conversions are controlled independently. When the DAE bit is set to 1, channel 0 and 1 D/A conversions are controlled together. Output of conversion results is always controlled independently by the DAOE0 and DAOE1 bits. Bit 7 DAOE1 Bit 6 DAOE0 Bit 5 DAE Description 0 0 * Channel 0 and 1 D/A conversions disabled 1 0 Channel 0 D/A conversion enabled Channel 1 D/A conversion disabled 1 Channel 0 and 1 D/A conversions enabled 0 Channel 0 D/A conversion disabled Channel 1 D/A conversion enabled 1 Channel 0 and 1 D/A conversions enabled * Channel 0 and 1 D/A conversions enabled 1 0 1 *: Don't care If the chip enters software standby mode when D/A conversion is enabled, the D/A output is held and the analog power current is the same as during D/A conversion. When it is necessary to reduce the analog power current in software standby mode, clear both the DAOE0 and DAOE1 bits to 0 to disable D/A output. Bits 4 to 0--Reserved: These bits cannot be modified and are always read as 1. 17.2.3 Module Stop Control Register (MSTPCR) MSTPCRH Bit MSTPCRL : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Initial value : 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 R/W : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W MSTPCR is a 16-bit readable/writable register that performs module stop mode control. When the MSTP10 bit in MSTPCR is set to 1, D/A converter operation stops at the end of the bus cycle and a transition is made to module stop mode. Registers cannot be read or written to in module stop mode. For details, see section 21.5, Module Stop Mode. Rev. 4.0, 03/03, page 705 of 1358 MSTPCR is initialized to H'3FFF by a reset and in hardware standby mode. It is not initialized in software standby mode. Bit 10--Module Stop (MSTP10): Specifies the D/A converter channel 0 and 1module stop mode. Bit 10 MSTP10 Description 0 D/A converter module stop mode cleared 1 D/A converter module stop mode set 17.3 (Initial value) Operation The D/A converter includes D/A conversion circuits for two channels, each of which can operate independently. D/A conversion is performed continuously while enabled by DACR. If either DADR0 or DADR1 is written to, the new data is immediately converted. The conversion result is output by setting the corresponding DAOE0 or DAOE1 bit to 1. The operation example described in this section concerns D/A conversion on channel 0. Figure 17-2 shows the timing of this operation. [1] Write the conversion data to DADR0. [2] Set the DAOE0 bit in DACR01 to 1. D/A conversion is started and the DA0 pin becomes an output pin. The conversion result is output after the conversion time has elapsed. The output value is expressed by the following formula: DADR contents Vref 256 The conversion results are output continuously until DADR0 is written to again or the DAOE0 bit is cleared to 0. [3] If DADR0 is written to again, the new data is immediately converted. The new conversion result is output after the conversion time has elapsed. [4] If the DAOE0 bit is cleared to 0, the DA0 pin becomes an input pin. Rev. 4.0, 03/03, page 706 of 1358 DADR0 write cycle DADR0 write cycle DACR01 write cycle DACR01 write cycle f Address DADR0 Conversion data 1 Conversion data 2 DAOE0 DA0 Conversion result 2 Conversion result 1 High-impedance state tDCONV tDCONV Legend tDCONV: D/A conversion time Figure 17-2 Example of D/A Converter Operation Rev. 4.0, 03/03, page 707 of 1358 Rev. 4.0, 03/03, page 708 of 1358 Section 18 RAM 18.1 Overview The H8S/2329 and H8S/2324S have 32 kbytes of on-chip high-speed static RAM, the H8S/2326C has 16 kbytes, the H8S/2328, H8S/2327, H8S/2326, H8S/2323, and H8S/2322R have 8 kbytes, and the H8S/2321 and H8S/2320 have 4 kbytes. The RAM is connected to the CPU by a 16-bit data bus, enabling one-state access by the CPU to both byte data and word data. This makes it possible to perform fast word data transfer. The on-chip RAM can be enabled or disabled by means of the RAM enable bit (RAME) in the system control register (SYSCR). 18.1.1 Block Diagram Figure 18-1 shows a block diagram of 32 kbytes of on-chip RAM. Internal data bus (upper 8 bits) Internal data bus (lower 8 bits) H'FF7C00 H'FF7C01 H'FF7C02 H'FF7C03 H'FF7C04 H'FF7C05 H'FFFBFE H'FFFBFF Figure 18-1 Block Diagram of RAM (32 kbytes) Rev. 4.0, 03/03, page 709 of 1358 18.1.2 Register Configuration The on-chip RAM is controlled by SYSCR. Table 18-1 shows the address and initial value of SYSCR. Table 18-1 RAM Register Name Abbreviation R/W Initial Value Address* System control register SYSCR R/W H'01 H'FF39 Note: * Lower 16 bits of the address. 18.2 Register Descriptions 18.2.1 System Control Register (SYSCR) Bit : Initial value : R/W : 7 6 5 4 3 2 1 0 -- -- INTM1 INTM0 NMIEG 0 0 0 0 0 0 0 1 R/W -- R/W R/W R/W R/W R/W R/W LWROD IRQPAS RAME The on-chip RAM is enabled or disabled by the RAME bit in SYSCR. For details of other bits in SYSCR, see section 5.2.1, System Control Register (SYSCR). Bit 0--RAM Enable (RAME): Enables or disables the on-chip RAM. The RAME bit is initialized when the reset state is released. It is not initialized in software standby mode. Bit 0 RAME Description 0 On-chip RAM is disabled 1 On-chip RAM is enabled Rev. 4.0, 03/03, page 710 of 1358 (Initial value) 18.3 Operation When the RAME bit is set to 1, accesses to addresses H'FFDC00 to H'FFFBFF are directed to the on-chip RAM. When the RAME bit is cleared to 0, the off-chip address space is accessed. Since the on-chip RAM is connected to the CPU by an internal 16-bit data bus, it can be written to and read in byte or word units. Each type of access can be performed in one state. Even addresses use the upper 8 bits, and odd addresses use the lower 8 bits. Word data must start at an even address. Note: The amount of on-chip RAM differs depending on the product. Refer to section 3.5, Memory Map in Each Operation Mode, for details. 18.4 Usage Note DTC register information can be located in addresses H'FFF800 to H'FFFBFF. When the DTC is used, the RAME bit must not be cleared to 0. Rev. 4.0, 03/03, page 711 of 1358 Rev. 4.0, 03/03, page 712 of 1358 Section 19 ROM 19.1 Overview The Series has 512, 384, or 256 kbytes of on-chip flash memory, or 256, 128, or 32 kbytes of onchip mask ROM. The ROM is connected to the bus master via a 16-bit data bus, enabling both byte and word data to be accessed in one state. Instruction fetching is thus speeded up, and processing speed increased. The on-chip ROM is enabled and disabled by means of the mode pins (MD2 to MD0) and the EAE bit in BCRL. The flash memory version of the chip can be erased and programmed with a PROM programmer, as well as on-board. 19.1.1 Block Diagram Figure 19-1 shows a block diagram of 256 kbytes of on-chip ROM. Internal data bus (upper 8 bits) Internal data bus (lower 8 bits) H'000000 H'000001 H'000002 H'000003 H'03FFFE H'03FFFF Figure 19-1 Block Diagram of ROM (256 kbytes) Rev. 4.0, 03/03, page 713 of 1358 19.1.2 Register Configuration The operating mode of the chip is controlled by the mode pins and the BCRL register. The ROMrelated registers are shown in table 19-1. Table 19-1 ROM Registers Register Name Abbreviation R/W Initial Value Address* Mode control register MDCR R/W Undefined H'FF3B Bus controller register BCRL R/W Undefined H'FED5 Note: * Lower 16 bits of the address. 19.2 Register Descriptions 19.2.1 Mode Control Register (MDCR) Bit : 7 6 5 4 3 2 1 0 -- -- -- -- -- Initial value : 1 0 0 0 0 MDS2 --* MDS1 --* MDS0 --* R/W -- -- -- -- -- R R R : Note: * Determined by pins MD2 to MD0. MDCR is an 8-bit read-only register used to monitor the current operating mode of the chip. Bit 7--Reserved: This bit cannot be modified and is always read as 1. Bits 6 to 3--Reserved: These bits cannot be modified and are always read as 0. Bits 2 to 0--Mode Select 2 to 0 (MDS2 to MDS0): These bits indicate the input levels at pins MD2 to MD0 (the current operating mode). Bits MDS2 to MDS0 correspond to pins MD2 to MD0. MDS2 to MDS0 are read-only bits, and cannot be modified. The mode pin (MD2 to MD0) input levels are latched into these bits when MDCR is read. These latches are canceled by a reset. Rev. 4.0, 03/03, page 714 of 1358 19.2.2 Bit Bus Control Register L (BCRL) : Initial value : R/W : 7 6 5 4 3 2 1 0 BRLE BREQOE EAE -- DDS -- WDBE WAITE 0 0 1 1 1 1 0 0 R/W R/W R/W R/W R/W R/W R/W R/W Enabling or disabling of part of the on-chip ROM area in the chip can be selected by means of the EAE bit in BCRL. For details of the other bits in BCRL, see section 6.2.5, Bus Control Register L (BCRL). Bit 5--External Address Enable (EAE): Selects whether addresses H'010000 to H'03FFFF*2 are to be internal addresses or external addresses. Description Bit 5 0 1 H8S/2329, H8S/2328, H8S/2326, H8S/2326C H8S/2327 H8S/2323 1 Addresses H'010000 to Reserved area* H'01FFFF are on-chip ROM or address H'020000 to H'03FFFF are reserved 1 area* 2 Addresses H'010000 to H'03FFFF* are external addresses in external expanded 1 (Initial value) mode or reserved area* in single-chip mode On-chip ROM Notes: *1 Do not access a reserved area. *2 Addresses H'010000 to H'05FFFF in the H8S/2329. Addresses H'010000 to H'07FFFF in the H8S/2326 and H8S/2326C. 19.3 Operation The on-chip ROM is connected to the CPU by a 16-bit data bus, and both byte and word data can be accessed in one state. Even addresses are connected to the upper 8 bits, and odd addresses to the lower 8 bits. Word data must start at an even address. The on-chip ROM is enabled and disabled by setting the mode pins (MD2 to MD0) and the EAE bit in BCRL. These settings are shown in tables 19-2 and 19-3. Rev. 4.0, 03/03, page 715 of 1358 Table 19-2 Operating Modes and ROM (H8S/2328 F-ZTAT, H8S/2326 F-ZTAT) Mode Pins BCRL Mode Operating Mode FWE MD2 MD1 MD0 EAE On-Chip ROM 1 -- 0 0 0 1 -- -- 1 0 -- Disabled 0 Enabled 1 5 (256 kbytes)* * 1 Enabled (64 kbytes) 0 Enabled 1 5 (256 kbytes) * * 1 Enabled (64 kbytes) -- -- 0 Enabled 2 5 (256 kbytes) * * 1 Enabled (64 kbytes) 0 Enabled 2 5 (256 kbytes) * * 1 Enabled (64 kbytes) -- -- 0 Enabled 1 5 (256 kbytes) * * 1 Enabled (64 kbytes) 0 Enabled 1 5 (256 kbytes) * * 1 Enabled (64 kbytes) 2 3 1 4 Advanced expanded mode with on-chip ROM disabled 5 Advanced expanded mode with on-chip ROM disabled 6 Advanced expanded mode with on-chip ROM enabled 7 8 1 0 1 1 Advanced single-chip mode -- 11 12 1 0 0 15 0 1 Boot mode (advanced expanded mode with on-chip 3 ROM enabled)* 1 Boot mode (advanced 4 single-chip mode) * -- 0 1 1 0 0 1 0 13 14 0 1 9 10 0 1 User program mode (advanced expanded mode 3 with on-chip ROM enabled)* User program mode (advanced single-chip 4 mode)* 1 Notes: *1 Note that in modes 6, 7, 14, and 15, the on-chip ROM that can be used after a reset is the 64-kbyte area from H'000000 to H'00FFFF. *2 Note that in the mode 10 and mode 11 boot modes, the on-chip ROM that can be used immediately after all flash memory is erased by the boot program is the 64-kbyte area from H'000000 to H'00FFFF. Rev. 4.0, 03/03, page 716 of 1358 *3 Apart from the fact that flash memory can be erased and programmed, operation is the same as in advanced expanded mode with on-chip ROM enabled. *4 Apart from the fact that flash memory can be erased and programmed, operation is the same as in advanced single-chip mode. *5 The capacity of on-chip ROM in the H8S/2328 F-ZTAT is 256 kbytes. The capacity of on-chip ROM in the H8S/2326 F-ZTAT is 512 kbytes. Table 19-3 Operating Modes and ROM (H8S/2329 F-ZTAT, H8S/2326C F-ZTAT, and Mask ROM Version) Mode Pins BCRL Mode Operating Mode MD2 MD1 MD0 EAE On-Chip ROM 3 1* -- 0 0 1 -- -- 1 0 -- Disabled 0 1 2 Enabled (256 kbytes)* * 1 Enabled (64 kbytes) 0 1 2 Enabled (256 kbytes)* * 1 Enabled (64 kbytes) 4 2* 4 3* 1 4 Advanced expanded mode with on-chip ROM disabled 5 Advanced expanded mode with on-chip ROM disabled 6 Advanced expanded mode with on-chip ROM enabled 7 Advanced single-chip mode 1 0 0 1 1 0 1 Notes: *1 Note that in modes 6 and 7, the on-chip ROM that can be used after a reset is the 64kbyte area from H'000000 to H'00FFFF. *2 The amount of on-chip RAM differs depending on the product. Refer to section 3.5, Memory Map in Each Operation Mode, for details. *3 User boot mode in the H8S/2326C F-ZTAT. See table 19-73 in section 19.33, OnBoard Programming Modes, for information on H8S/2326C F-ZTAT user boot modes. *4 Boot mode in the H8S/2329 F-ZTAT, H8S/2326C F-ZTAT. See table 19-9 in section 19.6, On-Board Programming Modes, for information on H8S/2329 F-ZTAT user boot modes. See table 19-9 in section 19.6, On-Board Programming Modes, for information on H8S/2329 F-ZTAT user program modes. See table 19-73 in section 19.33, On-Board Programming Modes, for information on H8S/2326C F-ZTAT user program modes. See table 19-73 in section 19.33, On-Board Programming Modes, for information on H8S/2326C F-ZTAT user boot modes. Rev. 4.0, 03/03, page 717 of 1358 19.4 Overview of Flash Memory (H8S/2329 F-ZTAT) 19.4.1 Features The H8S/2329 F-ZTAT has 384 kbytes of on-chip flash memory. The features of the flash memory are summarized below. * Four flash memory operating modes Program mode Erase mode Program-verify mode Erase-verify mode * Programming/erase methods The flash memory is programmed 128 bytes at a time. Erasing is performed by block erase (in single-block units). To erase the entire flash memory, the individual blocks must be erased sequentially. Block erasing can be performed as required on 4-kbyte, 32-kbyte, and 64-kbyte blocks. * Programming/erase times The flash memory programming time is 10.0 ms (typ.) for simultaneous 128-byte programming, equivalent to 78 s (typ.) per byte, and the erase time is 50 ms (typ.). * Reprogramming capability The flash memory can be reprogrammed up to 100 times. * On-board programming modes There are two modes in which flash memory can be programmed/erased/verified on-board: Boot mode User program mode * Automatic bit rate adjustment With data transfer in boot mode, the bit rate of the chip can be automatically adjusted to match the transfer bit rate of the host. * Flash memory emulation by RAM Part of the RAM area can be overlapped onto flash memory, to emulate flash memory updates in real time. * Protect modes There are three protect modes, hardware, software, and error protect, which allow protected status to be designated for flash memory program/erase/verify operations. Rev. 4.0, 03/03, page 718 of 1358 * PROM mode Flash memory can be programmed/erased in PROM mode, using a PROM programmer, as well as in on-board programming mode. 19.4.2 Overview Block Diagram Internal address bus Module bus Internal data bus (16 bits) FLMCR1 FLMCR2 Bus interface/controller EBR1 Operating mode Mode pins EBR2 RAMER SYSCR2 Flash memory (384 kbytes) Legend FLMCR1: FLMCR2: EBR1: EBR2: RAMER: SYSCR2: Flash memory control register 1 Flash memory control register 2 Erase block register 1 Erase block register 2 RAM emulation register System control register 2 Figure 19-2 Block Diagram of Flash Memory Rev. 4.0, 03/03, page 719 of 1358 19.4.3 Flash Memory Operating Modes Mode Transitions: When the mode pins are set in the reset state and a reset-start is executed, the chip enters one of the operating modes shown in figure 19-3. In user mode, flash memory can be read but not programmed or erased. Flash memory can be programmed and erased in boot mode, user program mode, and PROM mode. MD1 = 1, MD2 = 1 RES = 0 User mode (on-chip ROM enabled) SWE = 1 Reset state RES = 0 RES = 0 SWE = 0 MD1 = 1, MD2 = 0 * RES = 0 PROM mode User program mode Boot mode On-board programming mode Notes: Only make a transition between user mode and user program mode when the CPU is not accessing the flash memory. * MD0 = 0, MD1 = 0, MD2 = 0, P66 = 1, P65 = 0, P64 = 0 Figure 19-3 Flash Memory Mode Transitions Rev. 4.0, 03/03, page 720 of 1358 19.4.4 On-Board Programming Modes * Boot mode 1. Initial state The old program version or data remains written in the flash memory. The user should prepare the programming control program and new application program beforehand in the host. 2. Programming control program transfer When boot mode is entered, the boot program in the chip (originally incorporated in the chip) is started and the programming control program in the host is transferred to RAM via SCI communication. The boot program required for flash memory erasing is automatically transferred to the RAM boot program area. Host Host Programming control program New application program New application program Chip Chip SCI Boot program Flash memory SCI Boot program Flash memory RAM RAM Boot program area Application program (old version) Application program (old version) 3. Flash memory initialization The erase program in the boot program area (in RAM) is executed, and the flash memory is initialized (to H'FF). In boot mode, entire flash memory erasure is performed, without regard to blocks. Host Programming control program 4. Writing new application program The programming control program transferred from the host to RAM is executed, and the new application program in the host is written into the flash memory. Host New application program Chip Chip SCI Boot program Flash memory Flash memory RAM Boot program area Flash memory prewrite-erase Programming control program SCI Boot program RAM Boot program area New application program Programming control program Program execution state Figure 19-4 Boot Mode Rev. 4.0, 03/03, page 721 of 1358 * User program mode 1. Initial state (1) The program that will transfer the programming/erase control program to on-chip RAM should be written into the flash memory by the user beforehand. (2) The programming/erase control program should be prepared in the host or in the flash memory. 2. Programming/erase control program transfer Executes the transfer program in the flash memory, and transfers the programming/erase control program to RAM. Host Host Programming/ erase control program New application program New application program Chip Chip SCI Boot program Flash memory SCI Boot program Flash memory RAM Transfer program RAM Transfer program Programming/ erase control program Application program (old version) Application program (old version) 3. Flash memory initialization The programming/erase program in RAM is executed, and the flash memory is initialized (to H'FF). Erasing can be performed in block units, but not in byte units. 4. Writing new application program Next, the new application program in the host is written into the erased flash memory blocks. Do not write to unerased blocks. Host Host New application program Chip Chip SCI Boot program Flash memory RAM SCI Boot program Flash memory RAM Transfer program Transfer program Programming/ erase control program Flash memory erase Programming/ erase control program New application program Program execution state Figure 19-5 User Program Mode (Example) Rev. 4.0, 03/03, page 722 of 1358 19.4.5 Flash Memory Emulation in RAM Reading Overlap RAM Data in User Mode and User Program Mode: Emulation should be performed in user mode or user program mode. When the emulation block set in RAMER is accessed while the emulation function is being executed, data written in the overlap RAM is read. SCI Flash memory RAM Emulation block Overlap RAM (emulation is performed on data written in RAM) Application program Execution state Figure 19-6 Reading Overlap RAM Data in User Mode and User Program Mode Rev. 4.0, 03/03, page 723 of 1358 Writing Overlap RAM Data in User Program Mode: When overlap RAM data is confirmed, the RAMS bit is cleared, RAM overlap is released, and writes should actually be performed to the flash memory. When the programming control program is transferred to RAM, ensure that the transfer destination and the overlap RAM do not overlap, as this will cause data in the overlap RAM to be rewritten. SCI Flash memory RAM Programming data Overlap RAM (programming data) Programming control program Execution state Application program Figure 19-7 Writing Overlap RAM Data in User Program Mode 19.4.6 Differences between Boot Mode and User Program Mode Table 19-4 Differences between Boot Mode and User Program Mode Boot Mode User Program Mode Entire memory erase Yes Yes Block erase No Yes Programming control program* Program/program-verify Erase/erase-verify/program/ program-verify/emulation Note: * To be provided by the user, in accordance with the recommended algorithm. Rev. 4.0, 03/03, page 724 of 1358 19.4.7 Block Configuration The flash memory is divided into five 64-kbyte blocks, one 32-kbyte block, and eight 4-kbyte blocks. Address H'00000 4 kbytes 8 32 kbytes 64 kbytes 384 kbytes 64 kbytes 64 kbytes 64 kbytes 64 kbytes Address H'5FFFF Figure 19-8 Flash Memory Block Configuration Rev. 4.0, 03/03, page 725 of 1358 19.4.8 Pin Configuration The flash memory is controlled by means of the pins shown in table 19-5. Table 19-5 Flash Memory Pins Pin Name Abbreviation I/O Function Reset RES Input Reset Mode 2 MD2 Input Sets MCU operating mode Mode 1 MD1 Input Sets MCU operating mode Mode 0 MD0 Input Sets MCU operating mode Port 64 P64 Input Sets MCU operating mode in PROM mode Port 65 P65 Input Sets MCU operating mode in PROM mode Port 66 P66 Input Sets MCU operating mode in PROM mode Transmit data TxD1 Output Serial transmit data output Receive data RxD1 Input Serial receive data input Rev. 4.0, 03/03, page 726 of 1358 19.4.9 Register Configuration The registers used to control the on-chip flash memory when enabled are shown in table 19-6. In order to access the FLMCR1, FLMCR2, EBR1, and EBR2 registers, the FLSHE bit must be set to 1 in SYSCR2 (except RAMER). Table 19-6 Flash Memory Registers Register Name Abbreviation R/W *5 Flash memory control register 1 FLMCR1 Flash memory control register 2 Erase block register 1 FLMCR2* 5 EBR1* Erase block register 2 EBR2* System control register 2 RAM emulation register 5 R/W Initial Value 1 Address* *3 H'80 H'FFC8 3 H'00 H'FFC9* 2 H'FFCA* R/W * 3 R/W * *2 2 4 R/W * H'00* 4 H'00* SYSCR2* R/W H'00 H'FF42 RAMER R/W H'00 H'FEDB 5 3 6 2 H'FFCB* Notes: *1 Lower 16 bits of the address. *2 Flash memory. Registers selection is performed by the FLSHE bit in system control register 2 (SYSCR2). *3 In modes in which the on-chip flash memory is disabled, a read will return H'00, and writes are invalid. *4 If a high level is input and the SWE bit in FLMCR1 is not set, these registers are initialized to H'00. *5 FLMCR1, FLMCR2, EBR1, and EBR2 are 8-bit registers. Only byte accesses are valid for these registers, the access requiring 2 states. *6 The SYSCR2 register can only be used in the F-ZTAT version. In the mask ROM version this register will return an undefined value if read, and cannot be modified. Rev. 4.0, 03/03, page 727 of 1358 19.5 Register Descriptions 19.5.1 Flash Memory Control Register 1 (FLMCR1) Bit : 7 6 5 4 3 2 1 0 FWE SWE ESU PSU EV PV E P Initial value : 1 0 0 0 0 0 0 0 R/W R R/W R/W R/W R/W R/W R/W R/W : FLMCR1 is an 8-bit register used for flash memory operating mode control. Program-verify mode or erase-verify mode is entered by setting SWE to 1, then setting the EV or PV bit. Program mode is entered by setting SWE to 1, then setting the PSU bit, and finally setting the P bit. Erase mode is entered by setting SWE to 1, then setting the ESU bit, and finally setting the E bit. FLMCR1 is initialized to H'80 by a reset, and in hardware standby mode and software standby mode. When onchip flash memory is disabled, a read will return H'00, and writes are invalid. Writing to bits ESU, PSU, EV, and PV in FLMCR1 is enabled only when SWE = 1; writing to the E bit is enabled only when SWE = 1, and ESU = 1; and writing to the P bit is enabled only when SWE = 1, and PSU = 1. Bit 7--Flash Write Enable Bit (FWE): Sets hardware protection against flash memory programming/erasing. These bits cannot be modified and are always read as 1 in this model. Bit 6--Software Write Enable Bit (SWE): Enables or disables flash memory programming and erasing. This bit should be set when setting bits 5 to 0 in FLMCR1, EBR1 bits 7 to 0, and EBR2 bits 5 to 0. When SWE = 1, the flash memory can only be read in program-verify or erase-verify mode. Bit 6 SWE Description 0 Writes disabled 1 Writes enabled Rev. 4.0, 03/03, page 728 of 1358 (Initial value) Bit 5--Erase Setup Bit (ESU): Prepares for a transition to erase mode. Do not set the SWE, PSU, EV, PV, E, or P bit at the same time. Bit 5 ESU Description 0 Erase setup cleared 1 Erase setup (Initial value) [Setting condition] When SWE = 1 Bit 4--Program Setup Bit (PSU): Prepares for a transition to program mode. Do not set the SWE, ESU, EV, PV, E, or P bit at the same time. Bit 4 PSU Description 0 Program setup cleared 1 Program setup (Initial value) [Setting condition] When SWE = 1 Bit 3--Erase-Verify (EV): Selects erase-verify mode transition or clearing. Do not set the SWE, ESU, PSU, PV, E, or P bit at the same time. Bit 3 EV Description 0 Erase-verify mode cleared 1 Transition to erase-verify mode (Initial value) [Setting condition] When SWE = 1 Bit 2--Program-Verify (PV): Selects program-verify mode transition or clearing. Do not set the SWE, ESU, PSU, EV, E, or P bit at the same time. Bit 2 PV Description 0 Program-verify mode cleared 1 Transition to program-verify mode (Initial value) [Setting condition] When SWE = 1 Rev. 4.0, 03/03, page 729 of 1358 Bit 1--Erase (E): Selects erase mode transition or clearing. Do not set the SWE, ESU, PSU, EV, PV, or P bit at the same time. Bit 1 E Description 0 Erase mode cleared 1 Transition to erase mode (Initial value) [Setting condition] When SWE = 1, and ESU = 1 Bit 0--Program (P): Selects program mode transition or clearing. Do not set the SWE, PSU, ESU, EV, PV, or E bit at the same time. Bit 0 P Description 0 Program mode cleared 1 Transition to program mode [Setting condition] When SWE = 1, and PSU = 1 Rev. 4.0, 03/03, page 730 of 1358 (Initial value) 19.5.2 Bit Flash Memory Control Register 2 (FLMCR2) : 7 6 5 4 3 2 1 0 FLER -- -- -- -- -- -- -- Initial value : 0 0 0 0 0 0 0 0 R/W R -- -- -- -- -- -- -- : FLMCR2 is an 8-bit register that controls the flash memory operating modes. FLMCR2 is initialized to H'00 by a reset, and in hardware standby mode and software standby mode. When on-chip flash memory is disabled, a read will return H'00 and writes are invalid. Bit 7--Flash Memory Error (FLER): Indicates that an error has occurred during an operation on flash memory (programming or erasing). When FLER is set to 1, flash memory goes to the errorprotection state. Bit 7 FLER Description 0 Flash memory is operating normally (Initial value) Flash memory program/erase protection (error protection) is disabled [Clearing condition] Reset or hardware standby mode 1 An error has occurred during flash memory programming/erasing Flash memory program/erase protection (error protection) is enabled [Setting condition] See section 19.8.3, Error Protection Bits 6 to 0--Reserved: These bits cannot be modified and are always read as 0. Rev. 4.0, 03/03, page 731 of 1358 19.5.3 Bit Erase Block Register 1 (EBR1) : EBR1 Initial value : R/W : 7 6 5 4 3 2 1 0 EB7 EB6 EB5 EB4 EB3 EB2 EB1 EB0 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W EBR1 is an 8-bit register that specifies the flash memory erase area block by block. EBR1 is initialized to H'00 by a reset, in hardware standby mode and software standby mode, and the SWE bit in FLMCR1 is not set. When a bit in EBR1 is set, the corresponding block can be erased. Other blocks are erase-protected. Set only one bit in EBR1 and EBR2 together (setting more than one bit will automatically clear all EBR1 and EBR2 bits to 0). When on-chip flash memory is disabled, a read will return H'00 and writes are invalid. The flash memory block configuration is shown in table 19-7. 19.5.4 Bit Erase Block Registers 2 (EBR2) : 7 6 5 4 3 2 1 0 EBR2 -- -- EB13 EB12 EB11 EB10 EB9 EB8 Initial value : 0 0 0 0 0 0 0 0 R/W -- -- R/W R/W R/W R/W R/W R/W : EBR2 is an 8-bit register that specifies the flash memory erase area block by block. EBR2 is initialized to H'00 by a reset, in hardware standby mode and software standby mode, and the SWE bit in FLMCR1 is not set. When a bit in EBR2 is set, the corresponding block can be erased. Other blocks are erase-protected. Set only one bit in EBR2 and EBR1 together (setting more than one bit will automatically clear all EBR1 and EBR2 bits to 0). Bits 7 and 6 are reserved: they are always read as 0 and cannot be modified. When on-chip flash memory is disabled, a read will return H'00, and writes are invalid. The flash memory block configuration is shown in table 19-7. Rev. 4.0, 03/03, page 732 of 1358 Table 19-7 Flash Memory Erase Blocks Block (Size) Address EB0 (4 kbytes) H'000000 to H'000FFF EB1 (4 kbytes) H'001000 to H'001FFF EB2 (4 kbytes) H'002000 to H'002FFF EB3 (4 kbytes) H'003000 to H'003FFF EB4 (4 kbytes) H'004000 to H'004FFF EB5 (4 kbytes) H'005000 to H'005FFF EB6 (4 kbytes) H'006000 to H'006FFF EB7 (4 kbytes) H'007000 to H'007FFF EB8 (32 kbytes) H'008000 to H'00FFFF EB9 (64 kbytes) H'010000 to H'01FFFF EB10 (64 kbytes) H'020000 to H'02FFFF EB11 (64 kbytes) H'030000 to H'03FFFF EB12 (64 kbytes) H'040000 to H'04FFFF EB13 (64 kbytes) H'050000 to H'05FFFF 19.5.5 Bit System Control Register 2 (SYSCR2) : 7 6 5 4 3 2 1 0 -- -- -- -- FLSHE -- -- -- Initial value : 0 0 0 0 0 0 0 0 R/W -- -- -- -- R/W -- -- R/W : SYSCR2 is an 8-bit readable/writable register that performs on-chip flash memory control. SYSCR2 is initialized to H'00 by a reset and in hardware standby mode. SYSCR2 can only be used in the F-ZTAT version. In the mask ROM version this register will return an undefined value if read, and cannot be modified. Bits 7 to 4--Reserved: These bits cannot be modified and are always read as 0. Rev. 4.0, 03/03, page 733 of 1358 Bit 3--Flash Memory Control Register Enable (FLSHE): Controls CPU access to the flash memory control registers (FLMCR1, FLMCR2, EBR1, and EBR2). Writing 1 to the FLSHE bit enables the flash memory control registers to be read and written to. Clearing FLSHE to 0 designates these registers as unselected (the register contents are retained). Bit 3 FLSHE Description 0 Flash control registers are not selected for addresses H'FFFFC8 to H'FFFFCB (Initial value) 1 Flash control registers are selected for addresses H'FFFFC8 to H'FFFFCB Bits 2 and 1--Reserved: These bits cannot be modified and are always read as 0. Bit 0--Reserved: This bit should not be written with 0. 19.5.6 Bit RAM Emulation Register (RAMER) : 7 6 5 4 3 2 1 0 -- -- -- -- RAMS RAM2 RAM1 RAM0 Initial value : 0 0 0 0 0 0 0 0 R/W -- -- -- -- R/W R/W R/W R/W : RAMER specifies the area of flash memory to be overlapped with part of RAM when emulating real-time flash memory programming. RAMER is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in software standby mode. RAMER settings should be made in user mode or user program mode. Flash memory area divisions are shown in table 19-8. To ensure correct operation of the emulation function, the ROM for which RAM emulation is performed should not be accessed immediately after this register has been modified. Normal execution of an access immediately after register modification is not guaranteed. Bits 7 to 4--Reserved: These bits cannot be modified and are always read as 0. Rev. 4.0, 03/03, page 734 of 1358 Bit 3--RAM Select (RAMS): Specifies selection or non-selection of flash memory emulation in RAM. When RAMS = 1, all flash memory blocks are program/erase-protected. Bit 3 RAMS 0 Description Emulation not selected (Initial value) Program/erase-protection of all flash memory blocks is disabled 1 Emulation selected Program/erase-protection of all flash memory blocks is enabled Bits 2 to 0--Flash Memory Area Selection (RAM2 to RAM0): These bits are used together with bit 3 to select the flash memory area to be overlapped with RAM. (See table 19-8.) Table 19-8 Flash Memory Area Divisions RAM Area Block Name RAMS RAM2 RAM1 RAM0 H'FFDC00 to H'FFEBFF RAM area, 4 kbytes 0 * * * H'000000 to H'000FFF EB0 (4 kbytes) 1 0 0 0 H'001000 to H'001FFF EB1 (4 kbytes) 1 0 0 1 H'002000 to H'002FFF EB2 (4 kbytes) 1 0 1 0 H'003000 to H'003FFF EB3 (4 kbytes) 1 0 1 1 H'004000 to H'004FFF EB4 (4 kbytes) 1 1 0 0 H'005000 to H'005FFF EB5 (4 kbytes) 1 1 0 1 H'006000 to H'006FFF EB6 (4 kbytes) 1 1 1 0 H'007000 to H'007FFF EB7 (4 kbytes) 1 1 1 1 *: Don't care Rev. 4.0, 03/03, page 735 of 1358 19.6 On-Board Programming Modes When pins are set to on-board programming mode, program/erase/verify operations can be performed on the on-chip flash memory. There are two on-board programming modes: boot mode and user program mode. The pin settings for transition to each of these modes are shown in table 19-9. For a diagram of the transitions to the various flash memory modes, see figure 19-3. Table 19-9 Setting On-Board Programming Modes Mode Pins MCU Mode CPU Operating Mode MD2 MD1 MD0 Boot mode Advanced expanded mode with on-chip ROM enabled 0 1 0 Advanced single-chip mode User program mode* Advanced expanded mode with on-chip ROM enabled Advanced single-chip mode 1 1 1 0 1 Note: * Normally, user mode should be used. Set the SWE bit to 1 to make a transition to user program mode before performing a program/erase/verify operation. 19.6.1 Boot Mode When boot mode is used, the flash memory programming control program must be prepared in the host beforehand. The channel 1 SCI to be used is set to asynchronous mode. When a reset-start is executed after the H8S/2329 F-ZTAT chip's pins have been set to boot mode, the boot program built into the chip is started and the programming control program prepared in the host is serially transmitted to the chip via the SCI. In the chip, the programming control program received via the SCI is written into the programming control program area in on-chip RAM. After the transfer is completed, control branches to the start address of the programming control program area and the programming control program execution state is entered (flash memory programming is performed). The transferred programming control program must therefore include coding that follows the programming algorithm given later. The system configuration in boot mode is shown in figure 19-9, and the boot program mode execution procedure in figure 19-10. Rev. 4.0, 03/03, page 736 of 1358 Chip Flash memory Host Write data reception Verify data transmission RxD1 SCI1 On-chip RAM TxD1 Figure 19-9 System Configuration in Boot Mode Rev. 4.0, 03/03, page 737 of 1358 Start Set pins to boot mode and execute reset-start Host transfers data (H'00) continuously at prescribed bit rate Chip measures low period of H'00 data transmitted by host Chip calculates bit rate and sets value in bit rate register After bit rate adjustment, chip transmits one H'00 data byte to host to indicate end of adjustment Host confirms normal reception of bit rate adjustment end indication (H'00), and transmits one H'55 data byte After receiving H'55, chip transmits one H'AA data byte to host Host transmits number of programming control program bytes (N), upper byte followed by lower byte Chip transmits received number of bytes to host as verify data (echo-back) n=1 Host transmits programming control program sequentially in byte units Chip transmits received programming control program to host as verify data (echo-back) n+1 (R)n Transfer received programming control program to on-chip RAM No n = N? Yes End of transmission Check flash memory data, and if data has already been written, erase all blocks After confirming that all flash memory data has been erased, chip transmits one H'AA data byte to host Execute programming control program transferred to on-chip RAM Note: If a memory cell does not operate normally and cannot be erased, one H'FF byte is transmitted as an erase error, and the erase operation and subsequent operations are halted. Figure 19-10 Boot Mode Execution Procedure Rev. 4.0, 03/03, page 738 of 1358 Automatic SCI Bit Rate Adjustment: When boot mode is initiated, the H8S/2329 F-ZTAT chip measures the low period of the asynchronous SCI communication data (H'00) transmitted continuously from the host. The SCI transmit/receive format should be set as follows: 8-bit data, 1 stop bit, no parity. The chip calculates the bit rate of the transmission from the host from the measured low period, and transmits one H'00 byte to the host to indicate the end of bit rate adjustment. The host should confirm that this adjustment end indication (H'00) has been received normally, and transmit one H'55 byte to the chip. If reception cannot be performed normally, initiate boot mode again (reset), and repeat the above operations. Depending on the host's transmission bit rate and the chip's system clock frequency, there will be a discrepancy between the bit rates of the host and the chip. To ensure correct SCI operation, the host's transfer bit rate should be set to 9,600 or 19,200 bps. Table 19-10 shows typical host transfer bit rates and system clock frequencies for which automatic adjustment of the MCU's bit rate is possible. The boot program should be executed within this system clock range. Start bit D0 D1 D2 D3 D4 D5 D6 D7 Low period (9 bits) measured (H'00 data) Stop bit High period (1 or more bits) Figure 19-11 Automatic SCI Bit Rate Adjustment Table 19-10 System Clock Frequencies for which Automatic Adjustment of H8S/2329 F-ZTAT Bit Rate is Possible Host Bit Rate System Clock Frequency for which Automatic Adjustment of H8S/2329 F-ZTAT Bit Rate is Possible 19,200 bps 16 MHz to 25 MHz 9,600 bps 8 MHz to 25 MHz Rev. 4.0, 03/03, page 739 of 1358 On-Chip RAM Area Divisions in Boot Mode: In boot mode, the 2-kbyte area from H'FF7C00 to H'FF83FF is reserved for use by the boot program, as shown in figure 19-12. The area to which the programming control program is transferred is H'FF8400 to H'FFFBFF. The boot program area can be used when the programming control program transferred into RAM enters the execution state. A stack area should be set up as required. H'FF7C00 H'FF83FF Boot program area* (2 kbytes) Programming control program area (30 kbytes) H'FFFBFF Note: * The boot program area cannot be used until a transition is made to the execution state for the programming control program transferred to RAM. Note that the boot program remains stored in this area after a branch is made to the programming control program. Figure 19-12 RAM Areas in Boot Mode Notes on Use of Boot Mode * When the chip comes out of reset in boot mode, it measures the low-level period of the input at the SCI's RxD1 pin. The reset should end with RxD1 high. After the reset ends, it takes approximately 100 states before the chip is ready to measure the low-level period of the RxD1 pin. * In boot mode, if any data has been programmed into the flash memory (if all data is not 1), all flash memory blocks are erased. Boot mode is for use when user program mode is unavailable, such as the first time on-board programming is performed, or if the program activated in user program mode is accidentally erased. * Interrupts cannot be used while the flash memory is being programmed or erased. * The RxD1 and TxD1 pins should be pulled up on the board. Rev. 4.0, 03/03, page 740 of 1358 * Before branching to the programming control program (RAM area H'FF8400 to H'FFFBFF), the chip terminates transmit and receive operations by the on-chip SCI (channel 1) (by clearing the RE and TE bits in SCR to 0), but the adjusted bit rate value remains set in BRR. The transmit data output pin, TxD1, goes to the high-level output state (P31DDR = 1, P31DR = 1). * The contents of the CPU's internal general registers are undefined at this time, so these registers must be initialized immediately after branching to the programming control program. In particular, since the stack pointer (SP) is used implicitly in subroutine calls, etc., a stack area must be specified for use by the programming control program. * Initial settings must also be made for the other on-chip registers. * Boot mode can be entered by making the pin settings shown in table 19-9 and executing a resetstart. * Boot mode can be cleared by driving the reset pin low, waiting at least 20 states, then setting the mode pins, and executing reset release*1. Boot mode can also be cleared by a WDT overflow reset. * Do not change the mode pin input levels in boot mode. * If the mode pin input levels are changed (for example, from low to high) during a reset, the state of ports with multiplexed address functions and bus control output pins (AS, RD, HWR) will change according to the change in the microcomputer's operating mode*2. Therefore, care must be taken to make pin settings to prevent these pins from becoming output signal pins during a reset, or to prevent collision with signals outside the microcomputer. Notes: *1 Mode pins input must satisfy the mode programming setup time (tMDS = 200 ns) with respect to the reset release timing. *2 See section 9, I/O Ports. 19.6.2 User Program Mode When set to user program mode, the chip can program and erase its flash memory by executing a user program/erase control program. Therefore, on-board reprogramming of the on-chip flash memory can be carried out by providing on-board means supply of programming data, and storing a program/erase control program in part of the program area if necessary. To select user program mode, select a mode that enables the on-chip flash memory (mode 6 or 7). In this mode, on-chip supporting modules other than flash memory operate as they normally would in modes 6 and 7. The flash memory itself cannot be read while the SWE bit is set to 1 to perform programming or erasing, so the control program that performs programming and erasing should be run in on-chip Rev. 4.0, 03/03, page 741 of 1358 RAM or external memory. When the program is located in external memory, an instruction for programming the flash memory and the following instruction should be located in on-chip RAM. Figure 19-13 shows the procedure for executing the program/erase control program when transferred to on-chip RAM. Write the transfer program (and the program/erase control program if necessary) beforehand MD2, MD1, MD0 = 110, 111 Reset-start Transfer program/erase control program to RAM Branch to program/erase control program in RAM area Execute program/erase control program (flash memory rewriting) Branch to flash memory application program Note: The watchdog timer should be activated to prevent overprogramming or overerasing due to program runaway, etc. Figure 19-13 User Program Mode Execution Procedure Rev. 4.0, 03/03, page 742 of 1358 19.7 Programming/Erasing Flash Memory In the on-board programming modes, flash memory programming and erasing is performed by software, using the CPU. There are four flash memory operating modes: program mode, erase mode, program-verify mode, and erase-verify mode. Transitions to these modes can be made by setting the PSU, ESU, P, E, PV, and EV bits in FLMCR1. The flash memory cannot be read while being programmed or erased. Therefore, the program that controls flash memory programming/erasing (the programming control program) should be located and executed in on-chip RAM or external memory. When the program is located in external memory, an instruction for programming the flash memory and the following instruction should be located in on-chip RAM. The DMAC or DTC should not be activated before or after the instruction for programming the flash memory is executed. Notes: 1. Operation is not guaranteed if setting/resetting of the SWE, ESU, PSU, EV, PV, E, and P bits in FLMCR1 is executed by a program in flash memory. 2. Perform programming in the erased state. Do not perform additional programming on previously programmed addresses. 19.7.1 Program Mode Follow the procedure shown in the program/program-verify flowchart in figure 19-14 to write data or programs to flash memory. Performing program operations according to this flowchart will enable data or programs to be written to flash memory without subjecting the device to voltage stress or sacrificing program data reliability. Programming should be carried out 128 bytes at a time. For the wait times (x, y, z1, z2, z3 , , , , , and ) after bits are set or cleared in flash memory control register 1 (FLMCR1) and the maximum number of programming operations (N), see section 22.2.6, Flash Memory Characteristics. Following the elapse of (x) s or more after the SWE bit is set to 1 in flash memory control register 1 (FLMCR1), 128-byte program data is stored in the program data area and reprogram data area, and the 128-byte data in the reprogram data area is written consecutively to the write addresses. The lower 8 bits of the first address written to must be H'00 or H'80. 128 consecutive byte data transfers are performed. The program address and program data are latched in the flash memory. A 128-byte data transfer must be performed even if writing fewer than 128 bytes; in this case, H'FF data must be written to the extra addresses. Next, the watchdog timer is set to prevent overprogramming in the event of program runaway, etc. Set a value greater than (y + z2 + + ) s as the WDT overflow period. After this, preparation for program mode (program setup) is carried out by setting the PSU bit in FLMCR1, and after the elapse of (y) s or more, the operating mode is switched to program mode by setting the P bit in FLMCR1. The time during which the P bit is set is the flash memory programming time. Set the programming time according to the table in the programming flowchart. Rev. 4.0, 03/03, page 743 of 1358 19.7.2 Program-Verify Mode In program-verify mode, the data written in program mode is read to check whether it has been correctly written in the flash memory. After the elapse of a given programming time, the programming mode is exited (the P bit in FLMCR1 is cleared to 0, then the PSU bit is cleared to 0 at least () s later). Next, the watchdog timer is cleared after the elapse of () s or more, and the operating mode is switched to programverify mode by setting the PV bit in FLMCR1. Before reading in program-verify mode, a dummy write of H'FF data should be made to the addresses to be read. The dummy write should be executed after the elapse of () s or more. When the flash memory is read in this state (verify data is read in 16-bit units), the data at the latched address is read. Wait at least () s after the dummy write before performing this read operation. Next, the originally written data is compared with the verify data, and reprogram data is computed (see figure 19-14) and transferred to the reprogram data area. After 128 bytes of data have been verified, exit program-verify mode in FLMCR1 to 0, and wait again for at least () s. If reprogramming is necessary, set program mode again, and repeat the program/program-verify sequence as before. However, ensure that the program/program-verify sequence is not repeated more than (N) times on the same bits. Rev. 4.0, 03/03, page 744 of 1358 Start of programming Write pulse application subroutine Sub-routine write pulse Start Enable WDT Set SWE bit in FLMCR1 Set PSU bit in FLMCR1 Wait (y) ms *6 Perform programming in the erased state. Do not perform additional programming on previously programmed addresses. Wait (x) ms *6 Store 128-byte program data in program data area and reprogram data area *4 Set P bit in FLMCR1 n=1 Wait (z1) ms or (z2) ms or (z3) ms *5 *6 m=0 Clear P bit in FLMCR1 Wait (a) ms Write 128-byte data in RAM reprogram *1 data area consecutively to flash memory *6 Sub-routine-call Clear PSU bit in FLMCR1 Wait (b) ms Write pulse (z1) ms or (z2) ms *6 Disable WDT See Note *7 for pulse width *6 Set PV bit in FLMCR1 End sub Wait (g) ms *6 H'FF dummy write to verify address *6 Note *7: Write Pulse Width Number of Writes (n) Write Time (z) ms 1 z1 2 z1 3 z1 4 z1 5 z1 6 z1 7 z2 8 z2 9 z2 10 z2 11 z2 12 z2 13 z2 . . . . . . 998 z2 999 z2 1000 z2 Increment address Wait (e) ms *6 Read verify data *2 nn+1 NG Read data = verify data? OK m=1 NG 6n? OK Additional program data computation Note: Use a (z3) s write pulse for additional programming. Transfer additional program data to additional program data area *4 Reprogram data computation *3 Transfer reprogram data to reprogram data area *4 NG RAM Program data area (128 bytes) 128-byte data verification completed? OK Clear PV bit in FLMCR1 Wait (h) ms *6 Reprogram data area (128 bytes) 6n? Additional program data area (128 bytes) OK Sequentially write 128-byte data in additional program data area in RAM to flash memory NG Write Pulse (z3 s additional write pulse) *1 *6 *6 NG m = 0? n N? Clear SWE bit in FLMCR1 Wait (q) ms End of programming NG OK OK Clear SWE bit in FLMCR1 *6 Wait (q) ms *6 Programming failure Notes: *1 Data transfer is performed by byte transfer. The lower 8 bits of the first address written to must be H'00 or H'80. A 128-byte data transfer must be performed even if writing fewer than 128 bytes; in this case, H'FF data must be written to the extra addresses. *2 Verify data is read in 16-bit (W) units. *3 Even bits for which programming has been completed in the 128-byte programming loop will be subjected to additional programming if they fail the subsequent verify operation. *4 A 128-byte area for storing program data, a 128-byte area for storing reprogram data, and a 128-byte area for storing additional program data should be provided in RAM. The contents of the reprogram data and additional program data areas are modified as programming proceeds. *5 A write pulse of (z1) or (z2) ms should be applied according to the progress of programming. See Note 7 for the pulse widths. When the additional program data is programmed, a write pulse of (z3) ms should be applied. Reprogram data X' stands for reprogram data to which a write pulse has been applied. *6 For the values of x, y, z1, z2, z3, a, b, g, e, h, q, and N, see section 22.2.6, Flash Memory Characteristics. Program Data Operation Chart Original Data (D) 0 1 Verify Data (V) 0 1 0 1 Reprogram Data (X) 1 0 1 Comments Programming completed Programming incomplete; reprogram Still in erased state; no action Additional Program Data Operation Chart Reprogram Data (X') 0 1 Verify Data (V) 0 1 0 1 Additional Program Data (Y) Comments 0 Additional programming executed Additional programming not executed 1 Additional programming not executed Additional programming not executed Figure 19-14 Program/Program-Verify Flowchart Rev. 4.0, 03/03, page 745 of 1358 19.7.3 Erase Mode Flash memory erasing should be performed block by block following the procedure shown in the erase/erase-verify flowchart (single-block erase) shown in figure 19-15. For the wait times (x, y, z, , , , , , ) after bits are set or cleared in flash memory control register 1 (FLMCR1) and the maximum number of programming operations (N), see section 22.2.6, Flash Memory Characteristics. To perform data or program erasure, make a 1 bit setting for the flash memory area to be erased in erase block register 1 or 2 (EBR1 or EBR2) at least (x) s after setting the SWE bit to 1 in flash memory control register 1 (FLMCR1). Next, the watchdog timer is set to prevent overerasing in the event of program runaway, etc. Set a value greater than (y + z + + ) ms as the WDT overflow period. After this, preparation for erase mode (erase setup) is carried out by setting the ESU bit in FLMCR1, and after the elapse of (y) s or more, the operating mode is switched to erase mode by setting the E bit in FLMCR1. The time during which the E bit is set is the flash memory erase time. Ensure that the erase time does not exceed (z) ms. Note: With flash memory erasing, prewriting (setting all data in the memory to be erased to 0) is not necessary before starting the erase procedure. 19.7.4 Erase-Verify Mode In erase-verify mode, data is read after memory has been erased to check whether it has been correctly erased. After the elapse of the erase time, erase mode is exited (the E bit in FLMCR1 is cleared to 0, then the ESU bit in FLMCR1 is cleared to 0 at least () s later), the watchdog timer is cleared after the elapse of () s or more, and the operating mode is switched to erase-verify mode by setting the EV bit in FLMCR1. Before reading in erase-verify mode, a dummy write of H'FF data should be made to the addresses to be read. The dummy write should be executed after the elapse of () s or more. When the flash memory is read in this state (verify data is read in 16-bit units), the data at the latched address is read. Wait at least () s after the dummy write before performing this read operation. If the read data has been erased (all 1), a dummy write is performed to the next address, and erase-verify is performed. If the read data has not been erased, set erase mode again, and repeat the erase/erase-verify sequence in the same way. However, ensure that the erase/erase-verify sequence is not repeated more than (N) times. When verification is completed, exit erase-verify mode, and wait for at least () s. If erasure has been completed on all the erase blocks, clear the SWE bit in FLMCR1 to 0 and wait for at least () s. If there are any unerased blocks, make a 1 bit setting for the flash memory area to be erased, and repeat the erase/erase-verify sequence in the same way. Rev. 4.0, 03/03, page 746 of 1358 Start *1 Set SWE bit in FLMCR1 Wait (x) ms *2 n=1 Set EBR1, EBR2 *4 Enable WDT Set ESU bit in FLMCR1 Wait (y) ms *2 Start of erase Set E bit in FLMCR1 Wait (z) ms *2 Clear E bit in FLMCR1 nn+1 Halt erase Wait (a) ms *2 Clear ESU bit in FLMCR1 Wait (b) ms *2 Disable WDT Set EV bit in FLMCR1 Wait (g) ms *2 Set block start address to verify address H'FF dummy write to verify address Wait (e) ms *2 Read verify data Increment address Verify data = all 1? *3 NG OK NG Last address of block? OK Clear EV bit in FLMCR1 Clear EV bit in FLMCR1 Wait (h) ms Wait (h) ms *2 *2 NG Notes: *1 *2 *3 *4 *5 *5 End of erasing of all erase blocks? OK *2 n N? Clear SWE bit in FLMCR1 OK Clear SWE bit in FLMCR1 Wait (q) ms Wait (q) ms End of erasing Erase failure NG Prewriting (setting erase block data to all 0) is not necessary. The values of x, y, z, a, b, g, e, h, q, and N are shown in the section 22.2.6, Flash Memory Characteristics. Verify data is read in 16-bit (W) units. Set only one bit in EBR1or EBR2. More than one bit cannot be set. Erasing is performed in block units. To erase a number of blocks, the individual blocks must be erased sequentially. Figure 19-15 Erase/Erase-Verify Flowchart Rev. 4.0, 03/03, page 747 of 1358 19.8 Flash Memory Protection There are three kinds of flash memory program/erase protection: hardware protection, software protection, and error protection. 19.8.1 Hardware Protection Hardware protection refers to a state in which programming/erasing of flash memory is forcibly disabled or aborted. Settings in flash memory control registers 1 and 2 (FLMCR1, FLMCR2) and erase block registers 1 and 2 (EBR1, EBR2) are reset (see table 19-11). Table 19-11 Hardware Protection Functions Item Description Program Erase Reset/standby protection * In a reset (including a WDT overflow reset) and in standby mode, FLMCR1, FLMCR2, EBR1, and EBR2 are initialized, and the program/erase-protected state is entered. Yes Yes * In a reset via the RES pin, the reset state is not entered unless the RES pin is held low until oscillation stabilizes after powering on. In the case of a reset during operation, hold the RES pin low for the RES pulse width specified in section 22.2.3, AC Characteristics. 19.8.2 Software Protection Software protection can be implemented by setting the SWE bit in flash memory control register 1 (FLMCR1), erase block registers 1 and 2 (EBR1, EBR2), and the RAMS bit in the RAM emulation register (RAMER). When software protection is in effect, setting the P or E bit in FLMCR1 does not cause a transition to program mode or erase mode (see table 19-12). Rev. 4.0, 03/03, page 748 of 1358 Table 19-12 Software Protection Functions Item Description Program Erase SWE bit protection * Clearing the SWE bit to 0 in FLMCR1 sets the program/erase-protected state for all blocks. Yes Yes -- Yes * (Execute in on-chip RAM or external memory.) Block specification protection * Erase protection can be set for individual blocks by settings in erase block registers 1 and 2 (EBR1, EBR2). * Setting EBR1 and EBR2 to H'00 places all blocks in the erase-protected state. Emulation protection * Setting the RAMS bit to 1 in the RAM Yes emulation register (RAMER) places all blocks in the program/erase-protected state. 19.8.3 Yes Error Protection In error protection, an error is detected when MCU runaway occurs during flash memory programming/erasing, or operation is not performed in accordance with the program/erase algorithm, and the program/erase operation is aborted. Aborting the program/erase operation prevents damage to the flash memory due to overprogramming or overerasing. If the MCU malfunctions during flash memory programming/erasing, the FLER bit is set to 1 in FLMCR2 and the error protection state is entered. The FLMCR1, FLMCR2, EBR1, and EBR2 settings are retained, but program mode or erase mode is aborted at the point at which the error occurred. Program mode or erase mode cannot be re-entered by re-setting the P or E bit. However, PV and EV bit setting is enabled, and a transition can be made to verify mode. FLER bit setting conditions are as follows: * When flash memory is read during programming/erasing (including a vector read or instruction fetch) * Immediately after exception handling (excluding a reset) during programming/erasing * When a SLEEP instruction (including software standby) is executed during programming/erasing * When the CPU loses the bus during programming/erasing Rev. 4.0, 03/03, page 749 of 1358 Error protection is released only by a reset and in hardware standby mode. Figure 19-16 shows the flash memory state transition diagram. Normal operating mode Program mode Erase mode Reset or hardware standby (hardware protection) RES = 0 or STBY = 0 RD VF PR ER RD VF PR ER FLER = 0 Error occurrence (software standby) Error occurrence Software standby mode Error protection mode RD VF PR ER FLER = 1 FLER = 0 RES = 0 or STBY = 0 Software standby mode release RES = 0 or STBY = 0 FLMCR1, FLMCR2, EBR1, EBR2 initialization state Error protection mode (software standby) RD VF PR ER FLER = 1 FLMCR1, FLMCR2 (except FLER bit), EBR1, EBR2 initialization state Legend: RD: Memory read possible VF: Verify-read possible PR: Programming possible ER: Erasing possible RD: VF: PR: ER: Memory read not possible Verify-read not possible Programming not possible Erasing not possible Figure 19-16 Flash Memory State Transitions Rev. 4.0, 03/03, page 750 of 1358 19.9 Flash Memory Emulation in RAM 19.9.1 Emulation in RAM Making a setting in the RAM emulation register (RAMER) enables part of RAM to be overlapped onto the flash memory area so that data to be written to flash memory can be emulated in RAM in real time. After the RAMER setting has been made, accesses can be made from the flash memory area or the RAM area overlapping flash memory. Emulation can be performed in user mode and user program mode. Figure 19-17 shows an example of emulation of real-time flash memory programming. Start of emulation program Set RAMER Write tuning data to overlap RAM Execute application program No Tuning OK? Yes Clear RAMER Write to flash memory emulation block End of emulation program Figure 19-17 Flowchart for Flash Memory Emulation in RAM Rev. 4.0, 03/03, page 751 of 1358 19.9.2 RAM Overlap An example in which flash memory block area EB1 is overlapped is shown below. This area can be accessed from both the RAM area and flash memory area H'00000 EB0 H'01000 EB1 H'02000 EB2 H'03000 EB3 H'04000 EB4 H'05000 EB5 H'06000 EB6 H'07000 EB7 H'08000 H'FFDC00 H'FFEBFF Flash memory EB8 to EB13 On-chip RAM H'FFFBFF H'5FFFF Figure 19-18 Example of RAM Overlap Operation Example in which Flash Memory Block Area EB1 is Overlapped 1. Set bits RAMS, RAM2, RAM1, and RAM0 in RAMER to 1, 0, 0, 1, to overlap part of RAM onto the area (EB1) for which real-time programming is required. 2. Real-time programming is performed using the overlapping RAM. 3. After the program data has been confirmed, the RAMS bit is cleared, releasing RAM overlap. 4. The data written in the overlapping RAM is written into the flash memory space (EB1). Notes: 1. When the RAMS bit is set to 1, program/erase protection is enabled for all blocks regardless of the value of RAM2, RAM1, and RAM0 (emulation protection). In this state, setting the P or E bit in flash memory control register 1 (FLMCR1) will not cause a transition to program mode or erase mode. When actually programming a flash memory area, the RAMS bit should be cleared to 0. Rev. 4.0, 03/03, page 752 of 1358 2. A RAM area cannot be erased by execution of software in accordance with the erase algorithm while flash memory emulation in RAM is being used. 3. Block area EB0 includes the vector table. When performing RAM emulation, the vector table is needed by the overlap RAM. 19.10 Interrupt Handling when Programming/Erasing Flash Memory All interrupts, including NMI input, are disabled when flash memory is being programmed or erased (when the P or E bit is set in FLMCR1), and while the boot program is executing in boot mode*1, to give priority to the program or erase operation. There are three reasons for this: 1. Interrupt during programming or erasing might cause a violation of the programming or erasing algorithm, with the result that normal operation could not be assured. 2. In the interrupt exception handling sequence during programming or erasing, the vector would not be read correctly*2, possibly resulting in MCU runaway. 3. If an interrupt occurred during boot program execution, it would not be possible to execute the normal boot mode sequence. For these reasons, in on-board programming mode alone there are conditions for disabling interrupts, as an exception to the general rule. However, this provision does not guarantee normal erasing and programming or MCU operation. All interrupt requests, including NMI, must therefore be restricted inside and outside the MCU when programming or erasing flash memory. The NMI interrupt is also disabled in the error-protection state while the P or E bit remains set in FLMCR1. Notes: *1 Interrupt requests must be disabled inside and outside the MCU until the programming control program has completed programming. *2 The vector may not be read correctly in this case for the following two reasons: * If flash memory is read while being programmed or erased (while the P or E bit is set in FLMCR1), correct read data will not be obtained (undetermined values will be returned). * If the interrupt entry in the vector table has not been programmed yet, interrupt exception handling will not be executed correctly. Rev. 4.0, 03/03, page 753 of 1358 19.11 Flash Memory PROM Mode 19.11.1 PROM Mode Setting Programs and data can be written and erased in PROM mode as well as in the on-board programming modes. In PROM mode, the on-chip ROM can be freely programmed using a PROM programmer that supports the Hitachi microcomputer device type with 512-kbyte on-chip flash memory (FZTAT512V3A). Flash memory read mode, auto-program mode, auto-erase mode, and status read mode are supported with this device type. In auto-program mode, auto-erase mode, and status read mode, a status polling procedure is used, and in status read mode, detailed internal signals are output after execution of an auto-program or auto-erase operation. Table 19-13 shows PROM mode pin settings. Table 19-13 PROM Mode Pin Settings Pin Names Settings/External Circuit Connection Mode pins: MD2, MD1, MD0 Low-level input Mode setting pins: P66, P65, P64 High-level input to P66, low-level input to P65 and P64 STBY pin High-level input (do not select hardware standby mode) RES pin Reset circuit XTAL, EXTAL pins Oscillator circuit Other pins requiring setting: P32, P25 High-level input to P32, low-level input to P25 19.11.2 Socket Adapters and Memory Map In PROM mode, a socket adapter is connected to the chip as shown in figure 19-20. Figure 19-19 shows the on-chip ROM memory map and figure 19-20 shows the socket adapter pin assignments. MCU mode address PROM mode address H'00000000 H'00000 On-chip ROM space (384 kbytes) H'0005FFFF H'5FFFF Figure 19-19 Memory Map in PROM Mode Rev. 4.0, 03/03, page 754 of 1358 H8S/2329 F-ZTAT Socket Adapter (40-Pin Conversion) HN27C4096HG (40 Pins) TFP-120 FP-128B Pin Name Pin No. Pin Name 2 6 A0 21 A0 3 7 A1 22 A1 4 8 A2 23 A2 5 9 A3 24 A3 7 11 A4 25 A4 8 12 A5 26 A5 9 13 A6 27 A6 10 14 A7 28 A7 11 15 A8 29 A8 12 16 A9 31 A9 13 17 A10 32 A10 14 18 A11 33 A11 16 20 A12 34 A12 17 21 A13 35 A13 18 22 A14 36 A14 19 23 A15 37 A15 20 24 A16 38 A16 21 25 A17 39 A17 22 26 A18 10 A18 43 49 D8 19 I/O0 44 50 D9 18 I/O1 45 51 D10 17 I/O2 46 52 D11 16 I/O3 48 54 D12 15 I/O4 49 55 D13 14 I/O5 50 56 D14 13 I/O6 51 57 D15 12 76 69 77 67 75 CE OE WE I/O7 68 72 80 EMLE*3 1, 30, 33, 52, 55,74, 5, 34, 39, 58, 61, 82, 75, 76, 81, 93, 94 83, 84, 89, 103, 104 6, 15, 24, 31, 32, 38, 3, 10, 19, 28, 35, 36, 47, 59, 66, 79, 103, 37, 38, 44, 53, 65, 104, 113, 114, 115 67, 68, 74, 87, 99, 100, 113, 114, 123, 124, 125 81 73 VSS 77 85 XTAL 78 86 EXTAL Other pins 20 VCC RES NC (OPEN) 3 CE OE WE 2 *1 Reset circuit Oscillation circuit *2 4 FWE 1, 40 VCC 11, 30 VSS 5, 6, 7 NC 8 A20 9 Legend EMLE: I/O7 to I/O0: A18 to A0: CE: OE: WE: A19 Emulation enable Data input/output Address input Chip enable Output enable Write enable Notes: *1 A reset oscillation stabilization time (tosc1) of at least 10 ms is required. *2 A 12 MHz crystal resonator should be used. *3 As the FWE pin becomes VCC in the H8S/2329 F-ZTAT, the EMLE pin is ignored in PROM mode. This figure shows pin assignments, and does not show the entire socket adapter circuit. Figure 19-20 H8S/2329 F-ZTAT Socket Adapter Pin Assignments Rev. 4.0, 03/03, page 755 of 1358 19.11.3 PROM Mode Operation Table 19-14 shows how the different operating modes are set when using PROM mode, and table 19-15 lists the commands used in PROM mode. Details of each mode are given below. Memory Read Mode: Memory read mode supports byte reads. Auto-Program Mode: Auto-program mode supports programming of 128 bytes at a time. Status polling is used to confirm the end of auto-programming. Auto-Erase Mode: Auto-erase mode supports automatic erasing of the entire flash memory. Status polling is used to confirm the end of auto-erasing. Status Read Mode: Status polling is used for auto-programming and auto-erasing, and normal termination can be confirmed by reading the I/O6 signal. In status read mode, error information is output if an error occurs. Table 19-14 Settings for Each Operating Mode in PROM Mode Pin Names Mode CE OE WE I/O7 to I/O0 A18 to A0 Read L L H Data output Ain Output disable L H H Hi-Z X Command write 1 Chip disable* L H L Data input Ain* H X X Hi-Z X Legend: H: High level L: Low level Hi-Z: High impedance X: Don't care Notes: *1 Chip disable is not a standby state; internally, it is an operation state. *2 Ain indicates that there is also address input in auto-program mode. Rev. 4.0, 03/03, page 756 of 1358 2 Table 19-15 PROM Mode Commands 1st Cycle 2nd Cycle Command Name Number of Cycles Mode Address Data Mode Address Data Memory read mode 1+n Write X H'00 Read RA Dout Auto-program mode 129 Write X H'40 Write PA Din Auto-erase mode 2 Write X H'20 Write X H'20 Status read mode 2 Write X H'71 Write X H'71 Legend: RA: Read address PA: Program address Notes: 1. In auto-program mode, 129 cycles are required for command writing by a simultaneous 128-byte write. 2. In memory read mode, the number of cycles depends on the number of address write cycles (n). 19.11.4 Memory Read Mode * After the end of an auto-program, auto-erase, or status read operation, the command wait state is entered. To read memory contents, a transition must be made to memory read mode by means of a command write before the read is executed. * Command writes can be performed in memory read mode, just as in the command wait state. * Once memory read mode has been entered, consecutive reads can be performed. * After power-on, memory read mode is entered. Table 19-16 AC Characteristics in Memory Read Mode (Conditions: VCC = 3.3 V 0.3 V, VSS = 0 V, Ta = 25C 5C) Item Symbol Min Max Unit Command write cycle tnxtc CE hold time tceh 20 -- s 0 -- ns CE setup time tces 0 -- ns Data hold time tdh 50 -- ns Data setup time tds 50 -- ns Write pulse width twep 70 -- ns WE rise time tr -- 30 ns WE fall time tf -- 30 ns Rev. 4.0, 03/03, page 757 of 1358 Memory read mode Command write A18 to A0 Address stable CE OE WE twep tceh tnxtc tces tf tr Data Data H'00 tdh tds Note: Data is latched at the rising edge of WE. Figure 19-21 Memory Read Mode Timing Waveforms after Command Write Table 19-17 AC Characteristics when Entering Another Mode from Memory Read Mode (Conditions: VCC = 3.3 V 0.3 V, VSS = 0 V, Ta = 25C 5C) Item Symbol Min Max Unit Command write cycle tnxtc 20 -- s CE hold time tceh 0 -- ns CE setup time tces 0 -- ns Data hold time tdh 50 -- ns Data setup time tds 50 -- ns Write pulse width twep 70 -- ns WE rise time tr -- 30 ns WE fall time tf -- 30 ns Rev. 4.0, 03/03, page 758 of 1358 Other mode command write Memory read mode A18 to A0 Address stable tces tnxtc tceh CE OE tf twep tr WE tds tdh I/O7 to I/O0 Note: Do not enable WE and OE at the same time. Figure 19-22 Timing Waveforms when Entering Another Mode from Memory Read Mode Table 19-18 AC Characteristics in Memory Read Mode (Conditions: VCC = 3.3 V 0.3 V, VSS = 0 V, Ta = 25C 5C) Item Symbol Min Max Unit Access time tacc -- 20 s CE output delay time tce -- 150 ns OE output delay time toe -- 150 ns Output disable delay time tdf -- 100 ns Data output hold time toh 5 -- ns A18 to A0 Address stable CE VIL OE VIL WE VIH tacc Address stable toh tacc toh I/O7 to I/O0 Figure 19-23 Timing Waveforms for CE/OE CE OE Enable State Read Rev. 4.0, 03/03, page 759 of 1358 Address stable A18 to A0 Address stable tce tce CE WE toe toe OE VIH tacc tacc toh tdf toh tdf I/O7 to I/O0 Figure 19-24 Timing Waveforms for CE/OE CE OE Clocked Read 19.11.5 Auto-Program Mode * In auto-program mode, 128 bytes are programmed simultaneously. For this purpose, 128 consecutive byte data transfers should be performed. * A 128-byte data transfer must be performed even if writing fewer than 128 bytes; in this case, H'FF data must be written to the extra addresses. * The lower 7 bits of the transfer address must be held low. If an invalid address is input, memory programming will be started but a programming error will occur. * Memory address transfer is executed in the second cycle (figure 19-25). Do not perform transfer later than the second cycle. * Do not perform a command write during a programming operation. * Perform one auto-programming operation for a 128-byte block for each address. One or more additional programming operations cannot be carried out on address blocks that have already been programmed. * Confirm normal end of auto-programming by checking I/O6. Alternatively, status read mode can also be used for this purpose (the I/O7 status polling pin is used to identify the end of an autoprogram operation). * Status polling I/O6 and I/O7 information is retained until the next command write. As long as the next command write has not been performed, reading is possible by enabling CE and OE. Rev. 4.0, 03/03, page 760 of 1358 AC Characteristics Table 19-19 AC Characteristics in Auto-Program Mode (Conditions: VCC = 3.3 V 0.3 V, VSS = 0 V, Ta = 25C 5C) Item Symbol Min Max Unit Command write cycle tnxtc 20 -- s CE hold time tceh 0 -- ns CE setup time tces 0 -- ns Data hold time tdh 50 -- ns Data setup time tds 50 -- ns Write pulse width twep 70 -- ns Status polling start time twsts 1 -- ms Status polling access time tspa -- 150 ns Address setup time tas 0 -- ns Address hold time tah 60 -- ns Memory write time twrite 1 3000 ms WE rise time tr -- 30 ns WE fall time tf -- 30 ns Address stable A18 to A0 tceh tnxtc tces tnxtc CE OE tf twep tas tr WE tah twsts tspa Data transfer 1 byte to 128 bytes tds tdh twrite I/O7 Programming operation end identification signal I/O6 Programming normal end identification signal I/O5 to I/O0 H'00 H'40 Figure 19-25 Auto-Program Mode Timing Waveforms Rev. 4.0, 03/03, page 761 of 1358 19.11.6 Auto-Erase Mode * Auto-erase mode supports only total memory erasing. * Do not perform a command write during auto-erasing. * Confirm normal end of auto-erasing by checking I/O6. Alternatively, status read mode can also be used for this purpose (the I/O7 status polling pin is used to identify the end of an auto-erase operation). * Status polling I/O6 and I/O7 pin information is retained until the next command write. As long as the next command write has not been performed, reading is possible by enabling CE and OE. AC Characteristics Table 19-20 AC Characteristics in Auto-Erase Mode (Conditions: VCC = 3.3 V 0.3 V, VSS = 0 V, Ta = 25C 5C) Item Symbol Min Command write cycle tnxtc 20 -- s CE hold time tceh 0 -- ns CE setup time tces 0 -- ns Data hold time tdh 50 -- ns Data setup time tds 50 -- ns Write pulse width twep 70 -- ns Status polling start time tests 1 -- ms Status polling access time tspa -- 150 ns Memory erase time terase 100 40000 ms WE rise time tr -- 30 ns WE fall time tf -- 30 ns Rev. 4.0, 03/03, page 762 of 1358 Max Unit A18 to A0 tnxtc tceh tnxtc tces CE OE tf WE twep tests tr tds tspa terase tdh I/O7 Erase end identification signal I/O6 Erase normal end confirmation signal H'20 I/O5 to I/O0 H'00 H'20 Figure 19-26 Auto-Erase Mode Timing Waveforms 19.11.7 Status Read Mode * Status read mode is used to identify what type of abnormal end has occurred. Use this mode when an abnormal end occurs in auto-program mode or auto-erase mode. * The return code is retained until a command write for other than status read mode is performed. Table 19-21 AC Characteristics in Status Read Mode (Conditions: VCC = 3.3 V 0.3 V, VSS = 0 V, Ta = 25C 5C) Item Symbol Min Max Unit Command write cycle tnxtc 20 -- s CE hold time tceh 0 -- ns CE setup time tces 0 -- ns Data hold time tdh 50 -- ns Data setup time tds 50 -- ns Write pulse width twep 70 -- ns OE output delay time toe -- 150 ns Disable delay time tdf -- 100 ns CE output delay time tce -- 150 ns WE rise time tr -- 30 ns WE fall time tf -- 30 ns Rev. 4.0, 03/03, page 763 of 1358 A18 to A0 tceh tnxtc tces tces CE tceh tnxtc tnxtc tce OE tf WE twep tr tdh tds twep tf tds H'71 I/O7 to I/O0 toe tr tdf tdh H'71 Note: I/O3 and I/O2 are undefined. Figure 19-27 Status Read Mode Timing Waveforms Table 19-22 Status Read Mode Return Commands Pin Name I/O7 Attribute I/O6 Normal Command end error identification Initial value 0 0 Indications Normal end: 0 Command error: 1 Abnormal end: 1 I/O5 I/O4 I/O3 I/O2 I/O1 Programming error Erase error -- -- ProgramEffective ming or address erase count error exceeded 0 0 0 0 0 -- Count Effective exceeded: 1 address Otherwise: 0 error: 1 Erase -- Programerror: 1 ming Otherwise: 0 Otherwise: 0 error: 1 Otherwise: 0 I/O0 0 Otherwise: 0 Note: I/O3 and I/O2 are undefined. 19.11.8 Status Polling * The I/O7 status polling flag indicates the operating status in auto-program or auto-erase mode. * The I/O6 status polling flag indicates a normal or abnormal end in auto-program or auto-erase mode. Table 19-23 Status Polling Output Truth Table Pin Names Internal Operation in Progress Abnormal End -- Normal End I/O7 0 1 0 1 I/O6 0 0 1 1 I/O0 to I/O5 0 0 0 0 Rev. 4.0, 03/03, page 764 of 1358 19.11.9 PROM Mode Transition Time Commands cannot be accepted during the oscillation stabilization period or the PROM mode setup period. After the PROM mode setup time, a transition is made to memory read mode. Table 19-24 Command Wait State Transition Time Specifications Item Symbol Min Max Unit Standby release (oscillation stabilization time) tosc1 30 -- ms PROM mode setup time tbmv 10 -- ms VCC hold time tdwn 0 -- ms tosc1 tbmv Memory read mode Command wait state Auto-program mode Auto-erase mode Command wait state Normal/ abnormal end identification tdwn VCC RES Command acceptance Figure 19-28 Oscillation Stabilization Time, PROM Mode Setup Time, and Power Supply Fall Sequence 19.11.10 Notes on Memory Programming * When programming addresses which have previously been programmed, carry out auto-erasing before auto-programming. * When performing programming using PROM mode on a chip that has been programmed/erased in an on-board programming mode, auto-erasing is recommended before carrying out autoprogramming. Notes: 1. The flash memory is initially in the erased state when the device is shipped by Hitachi. For other chips for which the erasure history is unknown, it is recommended that autoerasing be executed to check and supplement the initialization (erase) level. 2. Auto-programming should be performed once only on the same address block. Additional programming cannot be carried out on address blocks that have already been programmed. Rev. 4.0, 03/03, page 765 of 1358 19.12 Flash Memory Programming and Erasing Precautions Precautions concerning the use of on-board programming mode, the RAM emulation function, and PROM mode are summarized below. Use the specified voltages and timing for programming and erasing: Applied voltages in excess of the rating can permanently damage the device. Use a PROM programmer that supports the Hitachi microcomputer device type with 512-kbyte on-chip flash memory (FZTAT512V3A). Do not select the HN27C4096 setting for the PROM programmer, and only use the specified socket adapter. Failure to observe these points may result in damage to the device. Powering on and off: When applying or disconnecting VCC power, fix the RES pin low and place the flash memory in the hardware protection state. The power-on and power-off timing requirements should also be satisfied in the event of a power failure and subsequent recovery. Use the recommended algorithm when programming and erasing flash memory: The recommended algorithm enables programming and erasing to be carried out without subjecting the device to voltage stress or sacrificing program data reliability. When setting the P or E bit in FLMCR1, the watchdog timer should be set beforehand as a precaution against program runaway, etc. Do not set or clear the SWE bit during execution of a program in flash memory: Wait for at least 100 s after clearing the SWE bit before executing a program or reading data in flash memory. When the SWE bit is set, data in flash memory can be rewritten, but when SWE = 1, flash memory can only be read in program-verify or erase-verify mode. Access flash memory only for verify operations (verification during programming/erasing). Also, do not clear the SWE bit during programming, erasing, or verifying. Similarly, when using the RAM emulation function the SWE bit must be cleared before executing a program or reading data in flash memory. However, the RAM area overlapping flash memory space can be read and written to regardless of whether the SWE bit is set or cleared. Do not use interrupts while flash memory is being programmed or erased: When flash memory is programmed or erased, all interrupt requests, including NMI, should be disabled to give priority to program/erase operations. Do not perform additional programming. Erase the memory before reprogramming: In onboard programming, perform only one programming operation on a 128-byte programming unit block. In PROM mode, too, perform only one programming operation on a 128-byte programming unit block. Programming should be carried out with the entire programming unit block erased. Rev. 4.0, 03/03, page 766 of 1358 Before programming, check that the chip is correctly mounted in the PROM programmer: Overcurrent damage to the device can result if the index marks on the PROM programmer socket, socket adapter, and chip are not correctly aligned. Do not touch the socket adapter or chip during programming: Touching either of these can cause contact faults and write errors. Rev. 4.0, 03/03, page 767 of 1358 19.13 Overview of Flash Memory (H8S/2328 F-ZTAT) 19.13.1 Features The H8S/2328 F-ZTAT has 256 kbytes of on-chip flash memory. The features of the flash memory are summarized below. * Four flash memory operating modes Program mode Erase mode Program-verify mode Erase-verify mode * Programming/erase methods The flash memory is programmed 128 bytes at a time. Erasing is performed by block erase (in single-block units). To erase the entire flash memory, the individual blocks must be erased sequentially. Block erasing can be performed as required on 4-kbyte, 32-kbyte, and 64-kbyte blocks. * Programming/erase times The flash memory programming time is 10.0 ms (typ.) for simultaneous 128-byte programming, equivalent to 78 s (typ.) per byte, and the erase time is 50 ms (typ.). * Reprogramming capability The flash memory can be reprogrammed up to 100 times. * On-board programming modes There are two modes in which flash memory can be programmed/erased/verified on-board: Boot mode User program mode * Automatic bit rate adjustment With data transfer in boot mode, the bit rate of the chip can be automatically adjusted to match the transfer bit rate of the host. * Flash memory emulation by RAM Part of the RAM area can be overlapped onto flash memory, to emulate flash memory updates in real time. Rev. 4.0, 03/03, page 768 of 1358 * Protect modes There are three protect modes, hardware, software, and error protect, which allow protected status to be designated for flash memory program/erase/verify operations. * PROM mode Flash memory can be programmed/erased in PROM mode, using a PROM programmer, as well as in on-board programming mode. 19.13.2 Overview Block Diagram Internal address bus Module bus Internal data bus (16 bits) FLMCR1 FLMCR2 Bus interface/controller EBR1 Operating mode FWE pin Mode pins EBR2 RAMER SYSCR2 Flash memory (256 kbytes) Legend FLMCR1: FLMCR2: EBR1: EBR2: RAMER: SYSCR2: Flash memory control register 1 Flash memory control register 2 Erase block register 1 Erase block register 2 RAM emulation register System control register 2 Figure 19-29 Block Diagram of Flash Memory Rev. 4.0, 03/03, page 769 of 1358 19.13.3 Flash Memory Operating Modes Mode Transitions: When the mode pins and the FWE pin are set in the reset state and a reset-start is executed, the chip enters one of the operating modes shown in figure 19-30. In user mode, flash memory can be read but not programmed or erased. Flash memory can be programmed and erased in boot mode, user program mode, and PROM mode. MD1 = 1, MD2 = 1, FWE = 0 RES = 0 User mode (on-chip ROM enabled) FWE = 1, SWE = 1 Reset state RES = 0 RES = 0 FWE = 0 or SWE = 0 FWE = 1, MD1 = 1, MD2 = 0 * RES = 0 PROM mode User program mode Boot mode On-board programming mode Notes: Only make a transition between user mode and user program mode when the CPU is not accessing the flash memory. * MD0 = 0, MD1 = 0, MD2 = 0, P66 = 1, P65 = 0, P64 = 0 Figure 19-30 Flash Memory Mode Transitions Rev. 4.0, 03/03, page 770 of 1358 19.13.4 On-Board Programming Modes * Boot mode 1. Initial state The old program version or data remains written in the flash memory. The user should prepare the programming control program and new application program beforehand in the host. 2. Programming control program transfer When boot mode is entered, the boot program in the chip (originally incorporated in the chip) is started and the programming control program in the host is transferred to RAM via SCI communication. The boot program required for flash memory erasing is automatically transferred to the RAM boot program area. Host Host Programming control program New application program New application program Chip Chip SCI Boot program Flash memory SCI Boot program Flash memory RAM RAM Boot program area Application program (old version) Application program (old version) 3. Flash memory initialization The erase program in the boot program area (in RAM) is executed, and the flash memory is initialized (to H'FF). In boot mode, entire flash memory erasure is performed, without regard to blocks. Host Programming control program 4. Writing new application program The programming control program transferred from the host to RAM is executed, and the new application program in the host is written into the flash memory. Host New application program Chip Chip SCI Boot program Flash memory Flash memory RAM Boot program area Flash memory prewrite-erase Programming control program SCI Boot program RAM Boot program area New application program Programming control program Program execution state Figure 19-31 Boot Mode Rev. 4.0, 03/03, page 771 of 1358 * User program mode 1. Initial state (1) The FWE assessment program that confirms that the FWE pin has been driven high, and (2) the program that will transfer the programming/ erase control program to on-chip RAM should be written into the flash memory by the user beforehand. (3) The programming/erase control program should be prepared in the host or in the flash memory. 2. Programming/erase control program transfer When the FWE pin is driven high, user software confirms this fact, executes the transfer program in the flash memory, and transfers the programming/erase control program to RAM. Host Host Programming/ erase control program New application program New application program Chip Chip SCI Boot program Flash memory SCI Boot program RAM Flash memory RAM FWE assessment program FWE assessment program Transfer program Transfer program Programming/ erase control program Application program (old version) Application program (old version) 3. Flash memory initialization The programming/erase program in RAM is executed, and the flash memory is initialized (to H'FF). Erasing can be performed in block units, but not in byte units. 4. Writing new application program Next, the new application program in the host is written into the erased flash memory blocks. Do not write to unerased blocks. Host Host New application program Chip Chip SCI Boot program Flash memory RAM FWE assessment program SCI Boot program Flash memory RAM FWE assessment program Transfer program Transfer program Programming/ erase control program Flash memory erase Programming/ erase control program New application program Program execution state Figure 19-32 User Program Mode (Example) Rev. 4.0, 03/03, page 772 of 1358 19.13.5 Flash Memory Emulation in RAM Reading Overlap RAM Data in User Mode and User Program Mode: Emulation should be performed in user mode or user program mode. When the emulation block set in RAMER is accessed while the emulation function is being executed, data written in the overlap RAM is read. SCI Flash memory RAM Emulation block Overlap RAM (emulation is performed on data written in RAM) Application program Execution state Figure 19-33 Reading Overlap RAM Data in User Mode and User Program Mode Rev. 4.0, 03/03, page 773 of 1358 Writing Overlap RAM Data in User Program Mode: When overlap RAM data is confirmed, the RAMS bit is cleared, RAM overlap is released, and writes should actually be performed to the flash memory. When the programming control program is transferred to RAM, ensure that the transfer destination and the overlap RAM do not overlap, as this will cause data in the overlap RAM to be rewritten. SCI Flash memory RAM Programming data Overlap RAM (programming data) Programming control program Execution state Application program Figure 19-34 Writing Overlap RAM Data in User Program Mode 19.13.6 Differences between Boot Mode and User Program Mode Table 19-25 Differnces between Boot Mode and User Program Mode Boot Mode User Program Mode Entire memory erase Yes Yes Block erase No Yes Programming control program* Program/program-verify Erase/erase-verify/program/ program-verify/emulation Note: * To be provided by the user, in accordance with the recommended algorithm. Rev. 4.0, 03/03, page 774 of 1358 19.13.7 Block Configuration On-chip 256-kbyte flash memory is divided into three 64-kbyte blocks, one 32-kbyte block, and eight 4-kbyte blocks. Address H'00000 4 kbytes 8 32 kbytes 256 kbytes 64 kbytes 64 kbytes 64 kbytes Address H'3FFFF Figure 19-35 Flash Memory Block Configuration Rev. 4.0, 03/03, page 775 of 1358 19.13.8 Pin Configuration The flash memory is controlled by means of the pins shown in tables 19-26. Table 19-26 Flash Memory Pins Pin Name Abbreviation I/O Function Reset RES Input Reset Flash write enable FWE Input Flash program/erase protection by hardware Mode 2 MD2 Input Sets MCU operating mode Mode 1 MD1 Input Sets MCU operating mode Mode 0 MD0 Input Sets MCU operating mode Port 64 P64 Input Sets MCU operating mode in PROM mode Port 65 P65 Input Sets MCU operating mode in PROM mode Port 66 P66 Input Sets MCU operating mode in PROM mode Transmit data TxD1 Output Serial transmit data output Receive data RxD1 Input Serial receive data input Rev. 4.0, 03/03, page 776 of 1358 19.13.9 Register Configuration The registers used to control the on-chip flash memory when enabled are shown in table 19-27. In order to access the FLMCR1, FLMCR2, EBR1, and EBR2 registers, the FLSHE bit must be set to 1 in SYSCR2 (except RAMER). Table 19-27 Flash Memory Registers Register Name Abbreviation R/W *6 Flash memory control register 1 FLMCR1 Flash memory control register 2 Erase block register 1 FLMCR2* 6 EBR1* Erase block register 2 EBR2* System control register 2 RAM emulation register 6 R/W Initial Value *3 3 R/W * 3 R/W * H'00/H'80 *4 1 Address* H'FFC8 *2 2 H'00 5 H'FFC9* 2 H'FFCA* R/W * H'00* 5 H'00* SYSCR2* R/W H'00 H'FF42 RAMER R/W H'00 H'FEDB 6 3 7 2 H'FFCB* Notes: *1 Lower 16 bits of the address. *2 Flash memory. Registers selection is performed by the FLSHE bit in system control register 2 (SYSCR2). *3 In modes in which the on-chip flash memory is disabled, a read will return H'00, and writes are invalid. Writes are also disabled when the FWE bit is cleared to 0 in FLMCR1. *4 When a high level is input to the FWE pin, the initial value is H'80. *5 When a low level is input to the FWE pin, or if a high level is input and the SWE bit in FLMCR1 is not set, these registers are initialized to H'00. *6 FLMCR1, FLMCR2, EBR1, and EBR2 are 8-bit registers. Only byte accesses are valid for these registers, the access requiring 2 states. *7 The SYSCR2 register can only be used in the F-ZTAT version. In the mask ROM version this register will return an undefined value if read, and cannot be modified. Rev. 4.0, 03/03, page 777 of 1358 19.14 Register Descriptions 19.14.1 Flash Memory Control Register 1 (FLMCR1) Bit : Initial value : R/W : 7 6 5 4 3 2 1 0 FWE SWE ESU PSU EV PV E P 1/0 0 0 0 0 0 0 0 R R/W R/W R/W R/W R/W R/W R/W FLMCR1 is an 8-bit register used for flash memory operating mode control. Program-verify mode or erase-verify mode is entered by setting SWE to 1 when FWE = 1, then setting the EV or PV bit. Program mode is entered by setting SWE to 1 when FWE = 1, then setting the PSU bit, and finally setting the P bit. Erase mode is entered by setting SWE to 1 when FWE = 1, then setting the ESU bit, and finally setting the E bit. FLMCR1 is initialized by a reset, and in hardware standby mode and software standby mode. Its initial value is H'80 when a high level is input to the FWE pin, and H'00 when a low level is input. When on-chip flash memory is disabled, a read will return H'00, and writes are invalid. Writes to the SWE bit in FLMCR1 are enabled only when FWE = 1; writes to bits ESU, PSU, EV, and PV only when FWE = 1 and SWE = 1; writes to the E bit only when FWE = 1, SWE = 1, and ESU = 1; and writes to the P bit only when FWE = 1, SWE = 1, and PSU = 1. Bit 7--Flash Write Enable Bit (FWE): Sets hardware protection against flash memory programming/erasing. Bit 7 FWE Description 0 When a low level is input to the FWE pin (hardware-protected state) 1 When a high level is input to the FWE pin Bit 6--Software Write Enable Bit (SWE): Enables or disables flash memory programming and erasing. This bit should be set when setting bits 5 to 0 in FLMCR1, EBR1 bits 7 to 0, and EBR2 bits 3 to 0. When SWE = 1, the flash memory can only be read in program-verify or erase-verify mode. Rev. 4.0, 03/03, page 778 of 1358 Bit 6 SWE Description 0 Writes disabled 1 Writes enabled (Initial value) [Setting condition] When FWE = 1 Bit 5--Erase Setup Bit (ESU): Prepares for a transition to erase mode. Do not set the SWE, PSU, EV, PV, E, or P bit at the same time. Bit 5 ESU Description 0 Erase setup cleared 1 Erase setup (Initial value) [Setting condition] When FWE = 1 and SWE = 1 Bit 4--Program Setup Bit (PSU): Prepares for a transition to program mode. Do not set the SWE, ESU, EV, PV, E, or P bit at the same time. Bit 4 PSU Description 0 Program setup cleared 1 Program setup (Initial value) [Setting condition] When FWE = 1 and SWE = 1 Bit 3--Erase-Verify (EV): Selects erase-verify mode transition or clearing. Do not set the SWE, ESU, PSU, PV, E, or P bit at the same time. Bit 3 EV Description 0 Erase-verify mode cleared 1 Transition to erase-verify mode (Initial value) [Setting condition] When FWE = 1 and SWE = 1 Rev. 4.0, 03/03, page 779 of 1358 Bit 2--Program-Verify (PV): Selects program-verify mode transition or clearing. Do not set the SWE, ESU, PSU, EV, E, or P bit at the same time. Bit 2 PV Description 0 Program-verify mode cleared 1 Transition to program-verify mode (Initial value) [Setting condition] When FWE = 1 and SWE = 1 Bit 1--Erase (E): Selects erase mode transition or clearing. Do not set the SWE, ESU, PSU, EV, PV, or P bit at the same time. Bit 1 E Description 0 Erase mode cleared 1 Transition to erase mode (Initial value) [Setting condition] When FWE = 1, SWE = 1, and ESU = 1 Bit 0--Program (P): Selects program mode transition or clearing. Do not set the SWE, PSU, ESU, EV, PV, or E bit at the same time. Bit 0 P Description 0 Program mode cleared 1 Transition to program mode [Setting condition] When FWE = 1, SWE = 1, and PSU = 1 Rev. 4.0, 03/03, page 780 of 1358 (Initial value) 19.14.2 Flash Memory Control Register 2 (FLMCR2) Bit : 7 6 5 4 3 2 1 0 FLER -- -- -- -- -- -- -- Initial value : 0 0 0 0 0 0 0 0 R/W R -- -- -- -- -- -- -- : FLMCR2 is an 8-bit register that controls the flash memory operating modes. FLMCR2 is initialized to H'00 by a reset, and in hardware standby mode and software standby mode. When on-chip flash memory is disabled, a read will return H'00 and writes are invalid. Bit 7--Flash Memory Error (FLER): Indicates that an error has occurred during an operation on flash memory (programming or erasing). When FLER is set to 1, flash memory goes to the errorprotection state. Bit 7 FLER 0 Description Flash memory is operating normally (Initial value) Flash memory program/erase protection (error protection) is disabled [Clearing condition] Reset or hardware standby mode 1 An error has occurred during flash memory programming/erasing Flash memory program/erase protection (error protection) is enabled [Setting condition] See section 19.17.3, Error Protection Bits 6 to 0--Reserved: These bits cannot be modified and are always read as 0. Rev. 4.0, 03/03, page 781 of 1358 19.14.3 Erase Block Register 1 (EBR1) Bit : EBR1 Initial value : R/W : 7 6 5 4 3 2 1 0 EB7 EB6 EB5 EB4 EB3 EB2 EB1 EB0 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W EBR1 is an 8-bit register that specifies the flash memory erase area block by block. EBR1 is initialized to H'00 by a reset, in hardware standby mode and software standby mode, when a low level is input to the FWE pin, and when a high level is input to the FWE pin and the SWE bit in FLMCR1 is not set. When a bit in EBR1 is set, the corresponding block can be erased. Other blocks are erase-protected. Set only one bit in EBR1 and EBR2 together (setting more than one bit will automatically clear all EBR1 and EBR2 bits to 0). When on-chip flash memory is disabled, a read will return H'00 and writes are invalid. The flash memory block configuration is shown in table 19-28. 19.14.4 Erase Block Registers 2 (EBR2) Bit : 7 6 5 4 3 2 1 0 EBR2 -- -- -- -- EB11 EB10 EB9 EB8 Initial value : 0 0 0 0 0 0 0 0 R/W -- -- -- -- R/W R/W R/W R/W : EBR2 is an 8-bit register that specifies the flash memory erase area block by block. EBR2 is initialized to H'00 by a reset, in hardware standby mode and software standby mode, when a low level is input to the FWE pin, and when a high level is input to the FWE pin and the SWE bit in FLMCR1 is not set. When a bit in EBR2 is set, the corresponding block can be erased. Other blocks are erase-protected. Set only one bit in EBR2 and EBR1 together (setting more than one bit will automatically clear all EBR1 and EBR2 bits to 0). Bits 7 to 4 are reserved: they are always read as 0 and cannot be modified. When on-chip flash memory is disabled, a read will return H'00, and writes are invalid. The flash memory block configuration is shown in table 19-28. Rev. 4.0, 03/03, page 782 of 1358 Table 19-28 Flash Memory Erase Blocks Block (Size) Address EB0 (4 kbytes) H'000000 to H'000FFF EB1 (4 kbytes) H'001000 to H'001FFF EB2 (4 kbytes) H'002000 to H'002FFF EB3 (4 kbytes) H'003000 to H'003FFF EB4 (4 kbytes) H'004000 to H'004FFF EB5 (4 kbytes) H'005000 to H'005FFF EB6 (4 kbytes) H'006000 to H'006FFF EB7 (4 kbytes) H'007000 to H'007FFF EB8 (32 kbytes) H'008000 to H'00FFFF EB9 (64 kbytes) H'010000 to H'01FFFF EB10 (64 kbytes) H'020000 to H'02FFFF EB11 (64 kbytes) H'030000 to H'03FFFF 19.14.5 System Control Register 2 (SYSCR2) Bit : 7 6 5 4 3 2 1 0 -- -- -- -- FLSHE -- -- -- Initial value : 0 0 0 0 0 0 0 0 R/W -- -- -- -- R/W -- -- -- : SYSCR2 is an 8-bit readable/writable register that performs on-chip flash memory control. SYSCR2 is initialized to H'00 by a reset and in hardware standby mode. SYSCR2 can only be used in the F-ZTAT versions. In the mask ROM versions this register will return an undefined value if read, and cannot be modified. Bits 7 to 4--Reserved: These bits cannot be modified and are always read as 0. Rev. 4.0, 03/03, page 783 of 1358 Bit 3--Flash Memory Control Register Enable (FLSHE): Controls CPU access to the flash memory control registers (FLMCR1, FLMCR2, EBR1, and EBR2). Writing 1 to the FLSHE bit enables the flash memory control registers to be read and written to. Clearing FLSHE to 0 designates these registers as unselected (the register contents are retained). Bit 3 FLSHE Description 0 Flash control registers are not selected for addresses H'FFFFC8 to H'FFFFCB (Initial value) 1 Flash control registers are selected for addresses H'FFFFC8 to H'FFFFCB Bits 2 to 0--Reserved: These bits cannot be modified and are always read as 0. 19.14.6 RAM Emulation Register (RAMER) Bit : 7 6 5 4 3 2 1 0 -- -- -- -- RAMS RAM2 RAM1 RAM0 Initial value : 0 0 0 0 0 0 0 0 R/W -- -- -- -- R/W R/W R/W R/W : RAMER specifies the area of flash memory to be overlapped with part of RAM when emulating real-time flash memory programming. RAMER is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in software standby mode. RAMER settings should be made in user mode or user program mode. Flash memory area divisions are shown in table 19-29. To ensure correct operation of the emulation function, the ROM for which RAM emulation is performed should not be accessed immediately after this register has been modified. Normal execution of an access immediately after register modification is not guaranteed. Bits 7 to 4--Reserved: These bits cannot be modified and are always read as 0. Bit 3--RAM Select (RAMS): Specifies selection or non-selection of flash memory emulation in RAM. When RAMS = 1, all flash memory blocks are program/erase-protected. Bit 3 RAMS Description 0 Emulation not selected Program/erase-protection of all flash memory blocks is disabled 1 Emulation selected Program/erase-protection of all flash memory blocks is enabled Rev. 4.0, 03/03, page 784 of 1358 (Initial value) Bits 2 to 0--Flash Memory Area Selection (RAM2 to RAM0): These bits are used together with bit 3 to select the flash memory area to be overlapped with RAM (see table 19-29). Table 19-29 Flash Memory Area Divisions RAM Area Block Name RAMS RAM2 RAM1 RAM0 H'FFDC00 to H'FFEBFF RAM area, 4 kbytes 0 * * * H'000000 to H'000FFF EB0 (4 kbytes) 1 0 0 0 H'001000 to H'001FFF EB1 (4 kbytes) 1 0 0 1 H'002000 to H'002FFF EB2 (4 kbytes) 1 0 1 0 H'003000 to H'003FFF EB3 (4 kbytes) 1 0 1 1 H'004000 to H'004FFF EB4 (4 kbytes) 1 1 0 0 H'005000 to H'005FFF EB5 (4 kbytes) 1 1 0 1 H'006000 to H'006FFF EB6 (4 kbytes) 1 1 1 0 H'007000 to H'007FFF EB7 (4 kbytes) 1 1 1 1 *: Don't care 19.15 On-Board Programming Modes When pins are set to on-board programming mode, program/erase/verify operations can be performed on the on-chip flash memory. There are two on-board programming modes: boot mode and user program mode. The pin settings for transition to each of these modes are shown in table 19-30. For a diagram of the transitions to the various flash memory modes, see figure 19-31. Table 19-30 Setting On-Board Programming Modes Mode Pins MCU Mode CPU Operating Mode FWE MD2 MD1 MD0 Boot mode Advanced expanded mode with on-chip ROM enabled 1 0 1 0 Advanced single-chip mode User program mode* Advanced expanded mode with on-chip ROM enabled Advanced single-chip mode 1 1 1 1 0 1 Note: * Normally, user mode should be used. Set the FWE pin to 1 to make a transition to user program mode before performing a program/erase/verify operation. Rev. 4.0, 03/03, page 785 of 1358 19.15.1 Boot Mode When boot mode is used, the flash memory programming control program must be prepared in the host beforehand. The channel 1 SCI to be used is set to asynchronous mode. When a reset-start is executed after the H8S/2328 F-ZTAT chip's pins have been set to boot mode, the boot program built into the chip is started and the programming control program prepared in the host is serially transmitted to the chip via the SCI. In the chip, the programming control program received via the SCI is written into the programming control program area in on-chip RAM. After the transfer is completed, control branches to the start address of the programming control program area and the programming control program execution state is entered (flash memory programming is performed). The transferred programming control program must therefore include coding that follows the programming algorithm given later. The system configuration in boot mode is shown in figure 19-36, and the boot program mode execution procedure in figure 19-37. Chip Flash memory Host Write data reception Verify data transmission RxD1 SCI1 TxD1 Figure 19-36 System Configuration in Boot Mode Rev. 4.0, 03/03, page 786 of 1358 On-chip RAM Start Set pins to boot mode and execute reset-start Host transfers data (H'00) continuously at prescribed bit rate Chip measures low period of H'00 data transmitted by host Chip calculates bit rate and sets value in bit rate register After bit rate adjustment, chip transmits one H'00 data byte to host to indicate end of adjustment Host confirms normal reception of bit rate adjustment end indication (H'00), and transmits one H'55 data byte After receiving H'55, chip transmits one H'AA data byte to host Host transmits number of programming control program bytes (N), upper byte followed by lower byte Chip transmits received number of bytes to host as verify data (echo-back) n=1 Host transmits programming control program sequentially in byte units Chip transmits received programming control program to host as verify data (echo-back) n+1 (R)n Transfer received programming control program to on-chip RAM No n = N? Yes End of transmission Check flash memory data, and if data has already been written, erase all blocks After confirming that all flash memory data has been erased, chip transmits one H'AA data byte to host Execute programming control program transferred to on-chip RAM Note: If a memory cell does not operate normally and cannot be erased, one H'FF byte is transmitted as an erase error, and the erase operation and subsequent operations are halted. Figure 19-37 Boot Mode Execution Procedure Rev. 4.0, 03/03, page 787 of 1358 Automatic SCI Bit Rate Adjustment: When boot mode is initiated, the H8S/2328 F-ZTAT chip measures the low period of the asynchronous SCI communication data (H'00) transmitted continuously from the host. The SCI transmit/receive format should be set as follows: 8-bit data, 1 stop bit, no parity. The chip calculates the bit rate of the transmission from the host from the measured low period, and transmits one H'00 byte to the host to indicate the end of bit rate adjustment. The host should confirm that this adjustment end indication (H'00) has been received normally, and transmit one H'55 byte to the chip. If reception cannot be performed normally, initiate boot mode again (reset), and repeat the above operations. Depending on the host's transmission bit rate and the chip's system clock frequency, there will be a discrepancy between the bit rates of the host and the chip. To ensure correct SCI operation, the host's transfer bit rate should be set to 9,600 or 19,200 bps. Table 19-31 shows typical host transfer bit rates and system clock frequencies for which automatic adjustment of the MCU's bit rate is possible. The boot program should be executed within this system clock range. Start bit D0 D1 D2 D3 D4 D5 D6 D7 Low period (9 bits) measured (H'00 data) Stop bit High period (1 or more bits) Figure 19-38 Automatic SCI Bit Rate Adjustment Table 19-31 System Clock Frequencies for which Automatic Adjustment of H8S/2328 F-ZTAT Bit Rate is Possible Host Bit Rate System Clock Frequencies for which Automatic Adjustment of H8S/2328 F-ZTAT Bit Rate is Possible 19,200 bps 16 MHz to 25 MHz 9,600 bps 8 MHz to 25 MHz Rev. 4.0, 03/03, page 788 of 1358 On-Chip RAM Area Divisions in Boot Mode: In boot mode, the 2-kbyte area from H'FFDC00 to H'FFE3FF is reserved for use by the boot program, as shown in figure 19-39. The area to which the programming control program is transferred is H'FFE400 to H'FFFBFF. The boot program area can be used when the programming control program transferred into RAM enters the execution state. A stack area should be set up as required. H'FFDC00 H'FFE3FF Boot program area* (2 kbytes) Programming control program area (6 kbytes) H'FFFBFF Note: * The boot program area cannot be used until a transition is made to the execution state for the programming control program transferred to RAM. Note that the boot program remains stored in this area after a branch is made to the programming control program. Figure 19-39 RAM Areas in Boot Mode Notes on Use of Boot Mode * When the chip comes out of reset in boot mode, it measures the low-level period of the input at the SCI's RxD1 pin. The reset should end with RxD1 high. After the reset ends, it takes approximately 100 states before the chip is ready to measure the low-level period of the RxD1 pin. * In boot mode, if any data has been programmed into the flash memory (if all data is not 1), all flash memory blocks are erased. Boot mode is for use when user program mode is unavailable, such as the first time on-board programming is performed, or if the program activated in user program mode is accidentally erased. * Interrupts cannot be used while the flash memory is being programmed or erased. * The RxD1 and TxD1 pins should be pulled up on the board. Rev. 4.0, 03/03, page 789 of 1358 * Before branching to the programming control program (RAM area H'FFE400 to H'FFFBFF), the chip terminates transmit and receive operations by the on-chip SCI (channel 1) (by clearing the RE and TE bits in SCR to 0), but the adjusted bit rate value remains set in BRR. The transmit data output pin, TxD1, goes to the high-level output state (P31DDR = 1, P31DR = 1). * The contents of the CPU's internal general registers are undefined at this time, so these registers must be initialized immediately after branching to the programming control program. In particular, since the stack pointer (SP) is used implicitly in subroutine calls, etc., a stack area must be specified for use by the programming control program. * Initial settings must also be made for the other on-chip registers. * Boot mode can be entered by making the pin settings shown in table 19-30 and executing a reset-start. * Boot mode can be cleared by driving the reset pin low, waiting at least 20 states, then setting the FWE pin and mode pins, and executing reset release*1. Boot mode can also be cleared by a WDT overflow reset. * Do not change the mode pin input levels in boot mode, and do not drive the FWE pin low while the boot program is being executed or while flash memory is being programmed or erased*2. * If the mode pin input levels are changed (for example, from low to high) during a reset, the state of ports with multiplexed address functions and bus control output pins (AS, RD, HWR) will change according to the change in the microcomputer's operating mode*3. Therefore, care must be taken to make pin settings to prevent these pins from becoming output signal pins during a reset, or to prevent collision with signals outside the microcomputer. Notes: *1 Mode pins and FWE pin input must satisfy the mode programming setup time (tMDS = 200 ns) with respect to the reset release timing, as shown in figures 19-56 to 19-58. *2 For further information on FWE application and disconnection, see section 19.21, Flash Memory Programming and Erasing Precautions. *3 See section 9, I/O Ports. 19.15.2 User Program Mode When set to user program mode, the chip can program and erase its flash memory by executing a user program/erase control program. Therefore, on-board reprogramming of the on-chip flash memory can be carried out by providing on-board means of FWE control and supply of programming data, and storing a program/erase control program in part of the program area as necessary. Rev. 4.0, 03/03, page 790 of 1358 To select user program mode, select a mode that enables the on-chip flash memory (mode 6 or 7), and apply a high level to the FWE pin. In this mode, on-chip supporting modules other than flash memory operate as they normally would in modes 6 and 7. The flash memory itself cannot be read while the SWE bit is set to 1 to perform programming or erasing, so the control program that performs programming and erasing should be run in on-chip RAM or external memory. When the program is located in external memory, an instruction for programming the flash memory and the following instruction should be located in on-chip RAM. Figure 19-40 shows the procedure for executing the program/erase control program when transferred to on-chip RAM. Write the FWE assessment program and transfer program (and the program/erase control program if necessary) beforehand MD2, MD1, MD0 = 110, 111 Reset-start Transfer program/erase control program to RAM Branch to program/erase control program in RAM area FWE = high* Execute program/erase control program (flash memory rewriting) Clear FWE* Branch to flash memory application program Notes: Do not apply a constant high level to the FWE pin. Apply a high level to the FWE pin only when the flash memory is programmed or erased. Also, while a high level is applied to the FWE pin, the watchdog timer should be activated to prevent overprogramming or overerasing due to program runaway, etc. * For further information on FWE application and disconnection, see section 19.21, Flash Memory Programming and Erasing Precautions. Figure 19-40 User Program Mode Execution Procedure Rev. 4.0, 03/03, page 791 of 1358 19.16 Programming/Erasing Flash Memory In the on-board programming modes, flash memory programming and erasing is performed by software, using the CPU. There are four flash memory operating modes: program mode, erase mode, program-verify mode, and erase-verify mode. Transition to these modes can be made for the on-chip ROM area by setting the PSU, ESU, P, E, PV, and EV bits in FLMCR1. The flash memory cannot be read while being programmed or erased. Therefore, the program that controls flash memory programming/erasing (the programming control program) should be located and executed in on-chip RAM or external memory. When the program is located in external memory, an instruction for programming the flash memory and the following instruction should be located in on-chip RAM. The DMAC or DTC should not be activated before or after the instruction for programming the flash memory is executed. Notes: 1. Operation is not guaranteed if setting/resetting of the SWE, ESU, PSU, EV, PV, E, and P bits in FLMCR1 is executed by a program in flash memory. 2. When programming or erasing, set FWE to 1 (programming/erasing will not be executed if FWE = 0). 3. Perform programming in the erased state. Do not perform additional programming on previously programmed addresses. 19.16.1 Program Mode Follow the procedure shown in the program/program-verify flowchart in figure 19-42 to write data or programs to flash memory. Performing program operations according to this flowchart will enable data or programs to be written to flash memory without subjecting the device to voltage stress or sacrificing program data reliability. Programming should be carried out 128 bytes at a time. For the wait times (x, y, z1, z2, z3, , , , , , ) after bits are set or cleared in flash memory control register 1 (FLMCR1) and the maximum number of programming operations (N), see section 22.2.6, Flash Memory Characteristics. Following the elapse of (x) s or more after the SWE bit is set to 1 in flash memory control register 1 (FLMCR1), 128-byte program data is stored in the program data area and reprogram data area, and the 128-byte data in the reprogram data area is written consecutively to the write addresses. The lower 8 bits of the first address written to must be H'00 or H'80. 128 consecutive byte data transfers are performed. The program address and program data are latched in the flash memory. A 128-byte data transfer must be performed even if writing fewer than 128 bytes; in this case, H'FF data must be written to the extra addresses. Next, the watchdog timer is set to prevent overprogramming in the event of program runaway, etc. Set a value greater than (y + z2 + + ) s as the WDT overflow period. After this, preparation for program mode (program setup) is carried out by setting the PSU bit in FLMCR1, and after the Rev. 4.0, 03/03, page 792 of 1358 elapse of (y) s or more, the operating mode is switched to program mode by setting the P bit in FLMCR1. The time during which the P bit is set is the flash memory programming time. Set the programming time according to the table in the programming flowchart. 19.16.2 Program-Verify Mode In program-verify mode, the data written in program mode is read to check whether it has been correctly written in the flash memory. After the elapse of a given programming time, the programming mode is exited (the P bit in FLMCR1 is cleared to 0, then the PSU bit is cleared to 0 at least () s later). Next, the watchdog timer is cleared after the elapse of () s or more, and the operating mode is switched to programverify mode by setting the PV bit in FLMCR1. Before reading in program-verify mode, a dummy write of H'FF data should be made to the addresses to be read. The dummy write should be executed after the elapse of () s or more. When the flash memory is read in this state (verify data is read in 16-bit units), the data at the latched address is read. Wait at least () s after the dummy write before performing this read operation. Next, the originally written data is compared with the verify data, and reprogram data is computed (see figure 19-41) and transferred to the reprogram data area. After 128 bytes of data have been verified, exit program-verify mode, wait for at least () s, then clear the SWE bit in FLMCR1 to 0, and wait again for at least () s. If reprogramming is necessary, set program mode again, and repeat the program/program-verify sequence as before. However, ensure that the program/program-verify sequence is not repeated more than (N) times on the same bits. Rev. 4.0, 03/03, page 793 of 1358 Start of programming Write pulse application subroutine Sub-routine write pulse Start Enable WDT Set SWE bit in FLMCR1 Set PSU bit in FLMCR1 Wait (y) ms *6 Perform programming in the erased state. Do not perform additional programming on previously programmed addresses. Wait (x) ms *6 Store 128-byte program data in program data area and reprogram data area *4 Set P bit in FLMCR1 n=1 Wait (z1) ms or (z2) ms or (z3) ms *5 *6 m=0 Clear P bit in FLMCR1 Wait (a) ms Write 128-byte data in RAM reprogram *1 data area consecutively to flash memory *6 Sub-routine-call Clear PSU bit in FLMCR1 Wait (b) ms Write pulse (z1) ms or (z2) ms *6 Disable WDT See Note *7 for pulse width *6 Set PV bit in FLMCR1 End sub Wait (g) ms *6 H'FF dummy write to verify address Note *7: Write Pulse Width *6 Write Time (z) ms Number of Writes (n) z1 1 z1 2 z1 3 z1 4 z1 5 z1 6 z2 7 z2 8 z2 9 z2 10 z2 11 z2 12 z2 13 . . . . . . z2 998 z2 999 z2 1000 Increment address Wait (e) ms *6 Read verify data *2 nn+1 NG Read data = verify data? OK m=1 NG 6n? OK Additional program data computation Note: Use a (z3) s write pulse for additional programming. Transfer additional program data to additional program data area *4 Reprogram data computation *3 Transfer reprogram data to reprogram data area *4 NG RAM Program data area (128 bytes) 128-byte data verification completed? OK Clear PV bit in FLMCR1 Wait (h) ms *6 Reprogram data area (128 bytes) 6n? Additional program data area (128 bytes) OK Sequentially write 128-byte data in additional program data area in RAM to flash memory NG Write Pulse (z3) s additional write pulse *1 *6 *6 NG m = 0? n N? Clear SWE bit in FLMCR1 Wait (q) ms End of programming NG OK OK Clear SWE bit in FLMCR1 *6 Wait (q) ms *6 Programming failure Notes: *1 Data transfer is performed by byte transfer. The lower 8 bits of the first address written to must be H'00 or H'80. A 128-byte data transfer must be performed even if writing fewer than 128 bytes; in this case, H'FF data must be written to the extra addresses. *2 Verify data is read in 16-bit (W) units. *3 Even bits for which programming has been completed in the 128-byte programming loop will be subjected to additional programming if they fail the subsequent verify operation. *4 A 128-byte area for storing program data, a 128-byte area for storing reprogram data, and a 128-byte area for storing additional program data should be provided in RAM. The contents of the reprogram data and additional program data areas are modified as programming proceeds. *5 A write pulse of (z1) or (z2) ms should be applied according to the progress of programming. See Note 7 for the pulse widths. When the additional program data is programmed, a write pulse of (z3) ms should be applied. Reprogram data X' stands for reprogram data to which a write pulse has been applied. *6 For the values of x, y, z1, z2, z3, a, b, g, e, h, q, and N, see section 22.2.6, Flash Memory Characteristics. Program Data Operation Chart Original Data (D) 0 1 Verify Data (V) 0 1 0 1 Reprogram Data (X) 1 0 1 Comments Programming completed Programming incomplete; reprogram Still in erased state; no action Additional Program Data Operation Chart Reprogram Data (X') 0 1 Verify Data (V) 0 1 0 1 Additional Program Data (Y) Comments 0 Additional programming executed Additional programming not executed 1 Additional programming not executed Additional programming not executed Figure 19-41 Program/Program-Verify Flowchart Rev. 4.0, 03/03, page 794 of 1358 19.16.3 Erase Mode Flash memory erasing should be performed block by block following the procedure shown in the erase/erase-verify flowchart (single-block erase) shown in figure 19-43. For the wait times (x, y, z, , , , , , ) after bits are set or cleared in flash memory control register 1 (FLMCR1) and the maximum number of programming operations (N), see section 22.2.6, Flash Memory Characteristics. To perform data or program erasure, make a 1 bit setting for the flash memory area to be erased in erase block register 1 or 2 (EBR1 or EBR2) at least (x) s after setting the SWE bit to 1 in flash memory control register 1 (FLMCR1). Next, the watchdog timer is set to prevent overerasing in the event of program runaway, etc. Set a value greater than (y + z + + ) ms as the WDT overflow period. After this, preparation for erase mode (erase setup) is carried out by setting the ESU bit in FLMCR1, and after the elapse of (y) s or more, the operating mode is switched to erase mode by setting the E bit in FLMCR1. The time during which the E bit is set is the flash memory erase time. Ensure that the erase time does not exceed (z) ms. Note: With flash memory erasing, prewriting (setting all data in the memory to be erased to 0) is not necessary before starting the erase procedure. 19.16.4 Erase-Verify Mode In erase-verify mode, data is read after memory has been erased to check whether it has been correctly erased. After the elapse of the erase time, erase mode is exited (the E bit in FLMCR1 is cleared to 0, then the ESU bit in FLMCR1 is cleared to 0 at least () s later), the watchdog timer is cleared after the elapse of () s or more, and the operating mode is switched to erase-verify mode by setting the EV bit in FLMCR1. Before reading in erase-verify mode, a dummy write of H'FF data should be made to the addresses to be read. The dummy write should be executed after the elapse of () s or more. When the flash memory is read in this state (verify data is read in 16-bit units), the data at the latched address is read. Wait at least () s after the dummy write before performing this read operation. If the read data has been erased (all 1), a dummy write is performed to the next address, and erase-verify is performed. If the read data has not been erased, set erase mode again, and repeat the erase/erase-verify sequence in the same way. However, ensure that the erase/erase-verify sequence is not repeated more than (N) times. When verification is completed, exit erase-verify mode, and wait for at least () s. If erasure has been completed on all the erase blocks, clear the SWE bit in FLMCR1 to 0 and wait for at least () s. If there are any unerased blocks, make a 1 bit setting for the flash memory area to be erased, and repeat the erase/erase-verify sequence in the same way. Rev. 4.0, 03/03, page 795 of 1358 Start *1 Set SWE bit in FLMCR1 Wait (x) ms *2 n=1 Set EBR1, EBR2 *4 Enable WDT Set ESU bit in FLMCR1 Wait (y) ms *2 Start of erase Set E bit in FLMCR1 Wait (z) ms *2 Clear E bit in FLMCR1 nn+1 Halt erase Wait (a) ms *2 Clear ESU bit in FLMCR1 Wait (b) ms *2 Disable WDT Set EV bit in FLMCR1 Wait (g) ms *2 Set block start address to verify address H'FF dummy write to verify address Wait (e) ms *2 Read verify data Increment address Verify data = all 1? *3 NG OK NG Last address of block? OK Clear EV bit in FLMCR1 Clear EV bit in FLMCR1 Wait (h) ms Wait (h) ms *2 *2 NG Notes: *1 *2 *3 *4 *5 *5 End of erasing of all erase blocks? OK *2 n N? Clear SWE bit in FLMCR1 OK Clear SWE bit in FLMCR1 Wait (q) ms Wait (q) ms End of erasing Erase failure NG Prewriting (setting erase block data to all 0) is not necessary. The values of x, y, z, a, b, g, e, h, q, and N are shown in the section 22.2.6, Flash Memory Characteristics. Verify data is read in 16-bit (W) units. Set only one bit in EBR1or EBR2. More than one bit cannot be set. Erasing is performed in block units. To erase a number of blocks, the individual blocks must be erased sequentially. Figure 19-42 Erase/Erase-Verify Flowchart Rev. 4.0, 03/03, page 796 of 1358 19.17 Flash Memory Protection There are three kinds of flash memory program/erase protection: hardware protection, software protection, and error protection. 19.17.1 Hardware Protection Hardware protection refers to a state in which programming/erasing of flash memory is forcibly disabled or aborted. Settings in flash memory control registers 1 and 2 (FLMCR1, FLMCR2) and erase block registers 1 and 2 (EBR1, EBR2) are reset (see table 19-10). Table 19-32 Hardware Protection Functions Item Description Program Erase FWE pin protection * When a low level is input to the FWE pin, FLMCR1, FLMCR2, EBR1, and EBR2 are initialized, and the program/erase-protected state is entered. Yes Yes Reset/standby protection * In a reset (including a WDT overflow reset) and in standby mode, FLMCR1, FLMCR2, EBR1, and EBR2 are initialized, and the program/erase-protected state is entered. Yes Yes * In a reset via the RES pin, the reset state is not entered unless the RES pin is held low until oscillation stabilizes after powering on. In the case of a reset during operation, hold the RES pin low for the RES pulse width specified in section 22.2.3, AC Characteristics. 19.17.2 Software Protection Software protection can be implemented by setting the SWE bit in flash memory control register 1 (FLMCR1), erase block registers 1 and 2 (EBR1, EBR2), and the RAMS bit in the RAM emulation register (RAMER). When software protection is in effect, setting the P or E bit in FLMCR1 does not cause a transition to program mode or erase mode (see table 19-33). Rev. 4.0, 03/03, page 797 of 1358 Table 19-33 Software Protection Functions Item Description Program Erase SWE bit protection * Clearing the SWE bit to 0 in FLMCR1 sets the program/erase-protected state for all blocks Yes Yes -- Yes * (Execute in on-chip RAM or external memory.) Block specification protection * Erase protection can be set for individual blocks by settings in erase block registers 1 and 2 (EBR1, EBR2). * Setting EBR1 and EBR2 to H'00 places all blocks in the erase-protected state. Emulation protection * Setting the RAMS bit to 1 in the RAM Yes emulation register (RAMER) places all blocks in the program/erase-protected state. Yes 19.17.3 Error Protection In error protection, an error is detected when MCU runaway occurs during flash memory programming/erasing, or operation is not performed in accordance with the program/erase algorithm, and the program/erase operation is aborted. Aborting the program/erase operation prevents damage to the flash memory due to overprogramming or overerasing. If the MCU malfunctions during flash memory programming/erasing, the FLER bit is set to 1 in FLMCR2 and the error protection state is entered. The FLMCR1, FLMCR2, EBR1, and EBR2 settings are retained, but program mode or erase mode is aborted at the point at which the error occurred. Program mode or erase mode cannot be re-entered by re-setting the P or E bit. However, PV and EV bit setting is enabled, and a transition can be made to verify mode. FLER bit setting conditions are as follows: * When flash memory is read during programming/erasing (including a vector read or instruction fetch) * Immediately after exception handling (excluding a reset) during programming/erasing * When a SLEEP instruction (including software standby) is executed during programming/erasing * When the CPU loses the bus during programming/erasing Rev. 4.0, 03/03, page 798 of 1358 Error protection is released only by a reset and in hardware standby mode. Figure 19-43 shows the flash memory state transition diagram. Normal operating mode Program mode Erase mode Reset or hardware standby (hardware protection) RES = 0 or STBY = 0 RD VF PR ER RD VF PR ER FLER = 0 Error occurrence (software standby) Error occurrence Error protection mode RD VF PR ER FLER = 1 FLER = 0 RES = 0 or STBY = 0 Software standby mode Software standby mode release RES = 0 or STBY = 0 FLMCR1, FLMCR2, EBR1, EBR2 initialization state Error protection mode (software standby) RD VF PR ER FLER = 1 FLMCR1, FLMCR2 (except FLER bit), EBR1, EBR2 initialization state Legend: RD: Memory read possible VF: Verify-read possible PR: Programming possible ER: Erasing possible RD: VF: PR: ER: Memory read not possible Verify-read not possible Programming not possible Erasing not possible Figure 19-43 Flash Memory State Transitions Rev. 4.0, 03/03, page 799 of 1358 19.18 Flash Memory Emulation in RAM 19.18.1 Emulation in RAM Making a setting in the RAM emulation register (RAMER) enables part of RAM to be overlapped onto the flash memory area so that data to be written to flash memory can be emulated in RAM in real time. After the RAMER setting has been made, accesses can be made from the flash memory area or the RAM area overlapping flash memory. Emulation can be performed in user mode and user program mode. Figure 19-44 shows an example of emulation of real-time flash memory programming. Start of emulation program Set RAMER Write tuning data to overlap RAM Execute application program No Tuning OK? Yes Clear RAMER Write to flash memory emulation block End of emulation program Figure 19-44 Flowchart for Flash Memory Emulation in RAM Rev. 4.0, 03/03, page 800 of 1358 19.18.2 RAM Overlap An example in which flash memory block area EB1 is overlapped is shown below. This area can be accessed from both the RAM area and flash memory area H'00000 EB0 H'01000 EB1 H'02000 EB2 H'03000 EB3 H'04000 EB4 H'05000 EB5 H'06000 EB6 H'07000 EB7 H'08000 H'FFDC00 H'FFEBFF Flash memory EB8 to EB11 On-chip RAM H'FFFBFF H'3FFFF Figure 19-45 Example of RAM Overlap Operation Example in which Flash Memory Block Area EB1 is Overlapped 1. Set bits RAMS, RAM2, RAM1, and RAM0 in RAMER to 1, 0, 0, 1, to overlap part of RAM onto the area (EB1) for which real-time programming is required. 2. Real-time programming is performed using the overlapping RAM. 3. After the program data has been confirmed, the RAMS bit is cleared, releasing RAM overlap. 4. The data written in the overlapping RAM is written into the flash memory space (EB1). Notes: 1. When the RAMS bit is set to 1, program/erase protection is enabled for all blocks regardless of the value of RAM2, RAM1, and RAM0 (emulation protection). In this state, setting the P or E bit in flash memory control register 1 (FLMCR1) will not cause a transition to program mode or erase mode. When actually programming a flash memory area, the RAMS bit should be cleared to 0. 2. A RAM area cannot be erased by execution of software in accordance with the erase algorithm while flash memory emulation in RAM is being used. Rev. 4.0, 03/03, page 801 of 1358 3. Block area EB0 includes the vector table. When performing RAM emulation, the vector table is needed by the overlap RAM. 19.19 Interrupt Handling when Programming/Erasing Flash Memory All interrupts, including NMI input, are disabled when flash memory is being programmed or erased (when the P or E bit is set in FLMCR1), and while the boot program is executing in boot mode*1, to give priority to the program or erase operation. There are three reasons for this: 1. Interrupt during programming or erasing might cause a violation of the programming or erasing algorithm, with the result that normal operation could not be assured. 2. In the interrupt exception handling sequence during programming or erasing, the vector would not be read correctly*2, possibly resulting in MCU runaway. 3. If an interrupt occurred during boot program execution, it would not be possible to execute the normal boot mode sequence. For these reasons, in on-board programming mode alone there are conditions for disabling interrupts, as an exception to the general rule. However, this provision does not guarantee normal erasing and programming or MCU operation. All interrupt requests, including NMI, must therefore be restricted inside and outside the MCU when programming or erasing flash memory. The NMI interrupt is also disabled in the error-protection state while the P or E bit remains set in FLMCR1. Notes: *1 Interrupt requests must be disabled inside and outside the MCU until the programming control program has completed programming. *2 The vector may not be read correctly in this case for the following two reasons: * If flash memory is read while being programmed or erased (while the P or E bit is set in FLMCR1), correct read data will not be obtained (undetermined values will be returned). * If the interrupt entry in the vector table has not been programmed yet, interrupt exception handling will not be executed correctly. Rev. 4.0, 03/03, page 802 of 1358 19.20 Flash Memory PROM Mode 19.20.1 PROM Mode Setting Programs and data can be written and erased in PROM mode as well as in the on-board programming modes. In PROM mode, the on-chip ROM can be freely programmed using a PROM programmer that supports the Hitachi microcomputer device type with 256-kbyte on-chip flash memory (FZTAT256V3A). Flash memory read mode, auto-program mode, auto-erase mode, and status read mode are supported with this device type. In auto-program mode, auto-erase mode, and status read mode, a status polling procedure is used, and in status read mode, detailed internal signals are output after execution of an auto-program or auto-erase operation. Table 19-34 shows PROM mode pin settings. Table 19-34 PROM Mode Pin Settings Pin Names Settings/External Circuit Connection Mode pins: MD2, MD1, MD0 Low-level input Mode setting pins: P66, P65, P64 High-level input to P66, low-level input to P65 and P64 FWE pin High-level input (in auto-program and auto-erase modes) STBY pin High-level input (do not select hardware standby mode) RES pin Reset circuit XTAL, EXTAL pins Oscillator circuit Other pins requiring setting: P32, P25 High-level input to P32, low-level input to P25 Rev. 4.0, 03/03, page 803 of 1358 19.20.2 Socket Adapters and Memory Map In PROM mode, a socket adapter is connected to the chip as shown in figure 19-47. Figure 19-46 shows the on-chip ROM memory map and figure 19-47 shows the socket adapter pin assignments. MCU mode address PROM mode address H'00000000 H'00000 On-chip ROM space 256 kbytes H'0003FFFF H'3FFFF Figure 19-46 Memory Map in PROM Mode Rev. 4.0, 03/03, page 804 of 1358 H8S/2328 F-ZTAT Socket Adapter (40-Pin Conversion) HN27C4096HG (40 Pins) TFP-120 FP-128B Pin Name Pin No. Pin Name 2 6 A0 21 A0 3 7 A1 22 A1 4 8 A2 23 A2 5 9 A3 24 A3 7 11 A4 25 A4 8 12 A5 26 A5 9 13 A6 27 A6 10 14 A7 28 A7 11 15 A8 29 A8 12 16 A9 31 A9 13 17 A10 32 A10 14 18 A11 33 A11 16 20 A12 34 A12 17 21 A13 35 A13 18 22 A14 36 A14 19 23 A15 37 A15 20 24 A16 38 A16 21 25 A17 39 A17 22 26 A18 10 A18 43 49 D8 19 I/O0 44 50 D9 18 I/O1 45 51 D10 17 I/O2 46 52 D11 16 I/O3 48 54 D12 15 I/O4 49 55 D13 14 I/O5 50 56 D14 13 I/O6 51 57 D15 12 76 69 77 67 75 CE OE WE I/O7 68 72 80 FWE 1, 30, 33, 52, 55,74, 5, 34, 39, 58, 61, 82, 75, 76, 81, 93, 94 83, 84, 89, 103, 104 6, 15, 24, 31, 32, 38, 3, 10, 19, 28, 35, 36, 47, 59, 66, 79, 103, 37, 38, 44, 53, 65, 104, 113, 114, 115 67, 68, 74, 87, 99, 100, 113, 114, 123, 124, 125 81 73 VCC 3 CE OE WE 2 20 4 FWE 1, 40 VCC 11, 30 VSS 5, 6, 7 NC 8 A20 VSS 9 Legend *1 FWE: Reset circuit RES I/O7 to I/O0: 85 77 XTAL A18 to A0: *2 Oscillation circuit CE: 86 78 EXTAL OE: Other pins NC (OPEN) WE: Notes: This figure shows pin assignments, and does not show the entire socket adapter circuit. *1 A reset oscillation stabilization time (tosc1) of at least 10 ms is required. *2 A 12 MHz crystal resonator should be used. A19 Flash write enable Data input/output Address input Chip enable Output enable Write enable Figure 19-47 H8S/2328 F-ZTAT Socket Adapter Pin Assignments Rev. 4.0, 03/03, page 805 of 1358 19.20.3 PROM Mode Operation Table 19-35 shows how the different operating modes are set when using PROM mode, and table 19-36 lists the commands used in PROM mode. Details of each mode are given below. Memory Read Mode: Memory read mode supports byte reads. Auto-Program Mode: Auto-program mode supports programming of 128 bytes at a time. Status polling is used to confirm the end of auto-programming. Auto-Erase Mode: Auto-erase mode supports automatic erasing of the entire flash memory. Status polling is used to confirm the end of auto-erasing. Status Read Mode: Status polling is used for auto-programming and auto-erasing, and normal termination can be confirmed by reading the I/O6 signal. In status read mode, error information is output if an error occurs. Table 19-35 Settings for Each Operating Mode in PROM Mode Pin Names Mode FWE CE OE WE I/O7 to I/O0 A18 to A0 Read H or L L L H Data output Ain Output disable H or L L H H Hi-Z X Command write 1 Chip disable* 3 H or L* L H L Data input Ain* H or L H X X Hi-Z X 2 Legend: H: High level L: Low level Hi-Z: High impedance X: Don't care Notes: *1 Chip disable is not a standby state; internally, it is an operation state. *2 Ain indicates that there is also address input in auto-program mode. *3 For command writes when making a transition to auto-program or auto-erase mode, input a high level to the FWE pin. Rev. 4.0, 03/03, page 806 of 1358 Table 19-36 PROM Mode Commands 1st Cycle 2nd Cycle Command Name Number of Cycles Mode Address Data Mode Address Data Memory read mode 1+n Write X H'00 Read RA Dout Auto-program mode 129 Write X H'40 Write PA Din Auto-erase mode 2 Write X H'20 Write X H'20 Status read mode 2 Write X H'71 Write X H'71 Legend: RA: Read address PA: Program address Notes: 1. In auto-program mode, 129 cycles are required for command writing by a simultaneous 128-byte write. 2. In memory read mode, the number of cycles depends on the number of address write cycles (n). 19.20.4 Memory Read Mode * After the end of an auto-program, auto-erase, or status read operation, the command wait state is entered. To read memory contents, a transition must be made to memory read mode by means of a command write before the read is executed. * Command writes can be performed in memory read mode, just as in the command wait state. * Once memory read mode has been entered, consecutive reads can be performed. * After power-on, memory read mode is entered. Table 19-37 AC Characteristics in Memory Read Mode (Conditions: VCC = 3.3 V 0.3 V, VSS = 0 V, Ta = 25C 5C) Item Symbol Min Max Unit Command write cycle tnxtc 20 -- s CE hold time tceh 0 -- ns CE setup time tces 0 -- ns Data hold time tdh 50 -- ns Data setup time tds 50 -- ns Write pulse width twep 70 -- ns WE rise time tr -- 30 ns WE fall time tf -- 30 ns Rev. 4.0, 03/03, page 807 of 1358 Memory read mode Command write A18 to A0 Address stable CE OE WE twep tceh tnxtc tces tf tr Data Data H'00 tdh tds Note: Data is latched at the rising edge of WE. Figure 19-48 Memory Read Mode Timing Waveforms after Command Write Table 19-38 AC Characteristics when Entering Another Mode from Memory Read Mode (Conditions: VCC = 3.3 V 0.3 V, VSS = 0 V, Ta = 25C 5C) Item Symbol Min Max Unit Command write cycle tnxtc 20 -- s CE hold time tceh 0 -- ns CE setup time tces 0 -- ns Data hold time tdh 50 -- ns Data setup time tds 50 -- ns Write pulse width twep 70 -- ns WE rise time tr -- 30 ns WE fall time tf -- 30 ns Rev. 4.0, 03/03, page 808 of 1358 Other mode command write Memory read mode A18 to A0 Address stable tces tnxtc tceh CE OE tf twep tr WE tds tdh I/O7 to I/O0 Note: Do not enable WE and OE at the same time. Figure 19-49 Timing Waveforms when Entering Another Mode from Memory Read Mode Table 19-39 AC Characteristics in Memory Read Mode (Conditions: VCC = 3.3 V 0.3 V, VSS = 0 V, Ta = 25C 5C) Item Symbol Min Max Unit Access time tacc -- 20 s CE output delay time tce -- 150 ns OE output delay time toe -- 150 ns Output disable delay time tdf -- 100 ns Data output hold time toh 5 -- ns A18 to A0 Address stable CE VIL OE VIL WE VIH tacc Address stable toh tacc toh I/O7 to I/O0 Figure 19-50 Timing Waveforms for CE/OE CE OE Enable State Read Rev. 4.0, 03/03, page 809 of 1358 Address stable A18 to A0 Address stable tce tce CE WE toe toe OE VIH tacc tacc toh tdf toh tdf I/O7 to I/O0 Figure 19-51 Timing Waveforms for CE/OE CE OE Clocked Read 19.20.5 Auto-Program Mode * In auto-program mode, 128 bytes are programmed simultaneously. For this purpose, 128 consecutive byte data transfers should be performed. * A 128-byte data transfer must be performed even if writing fewer than 128 bytes; in this case, H'FF data must be written to the extra addresses. * The lower 7 bits of the transfer address must be held low. If an invalid address is input, memory programming will be started but a programming error will occur. * Memory address transfer is executed in the second cycle (figure 19-52). Do not perform transfer later than the second cycle. * Do not perform a command write during a programming operation. * Perform one auto-programming operation for a 128-byte block for each address. One or more additional programming operations cannot be carried out on address blocks that have already been programmed. * Confirm normal end of auto-programming by checking I/O6. Alternatively, status read mode can also be used for this purpose (the I/O7 status polling pin is used to identify the end of an autoprogram operation). * Status polling I/O6 and I/O7 information is retained until the next command write. As long as the next command write has not been performed, reading is possible by enabling CE and OE. Rev. 4.0, 03/03, page 810 of 1358 AC Characteristics Table 19-40 AC Characteristics in Auto-Program Mode (Conditions: VCC = 3.3 V 0.3 V, VSS = 0 V, Ta = 25C 5C) Item Symbol Min Max Unit Command write cycle tnxtc 20 -- s CE hold time tceh 0 -- ns CE setup time tces 0 -- ns Data hold time tdh 50 -- ns Data setup time tds 50 -- ns Write pulse width twep 70 -- ns Status polling start time twsts 1 -- ms Status polling access time tspa -- 150 ns Address setup time tas 0 -- ns Address hold time tah 60 -- ns Memory write time twrite 1 3000 ms WE rise time tr -- 30 ns WE fall time tf -- 30 ns Write setup time tpns 100 -- ns Write end setup time tpnh 100 -- ns FWE tpnh Address stable A18 to A0 tpns tces tceh tnxtc tnxtc CE OE tf twep tas tr WE tah twsts tspa Data transfer 1 byte to 128 bytes tds tdh twrite I/O7 Programming operation end identification signal I/O6 Programming normal end identification signal I/O5 to I/O0 H'00 H'40 Figure 19-52 Auto-Program Mode Timing Waveforms Rev. 4.0, 03/03, page 811 of 1358 19.20.6 Auto-Erase Mode * Auto-erase mode supports only total memory erasing. * Do not perform a command write during auto-erasing. * Confirm normal end of auto-erasing by checking I/O6. Alternatively, status read mode can also be used for this purpose (the I/O7 status polling pin is used to identify the end of an auto-erase operation). * Status polling I/O6 and I/O7 pin information is retained until the next command write. As long as the next command write has not been performed, reading is possible by enabling CE and OE. AC Characteristics Table 19-41 AC Characteristics in Auto-Erase Mode (Conditions: VCC = 3.3 V 0.3 V, VSS = 0 V, Ta = 25C 5C) Item Symbol Min Max Unit Command write cycle tnxtc 20 -- s CE hold time tceh 0 -- ns CE setup time tces 0 -- ns Data hold time tdh 50 -- ns Data setup time tds 50 -- ns Write pulse width twep 70 -- ns Status polling start time tests 1 -- ms Status polling access time tspa -- 150 ns Memory erase time terase 100 40000 ms WE rise time tr -- 30 ns WE fall time tf -- 30 ns Erase setup time tens 100 -- ns Erase end setup time tenh 100 -- ns Rev. 4.0, 03/03, page 812 of 1358 tenh FWE A18 to A0 tens tces tnxtc tceh tnxtc CE OE tf WE twep tests tr tds tspa terase tdh I/O7 Erase end identification signal I/O6 Erase normal end confirmation signal H'20 I/O5 to I/O0 H'00 H'20 Figure 19-53 Auto-Erase Mode Timing Waveforms 19.20.7 Status Read Mode * Status read mode is used to identify what type of abnormal end has occurred. Use this mode when an abnormal end occurs in auto-program mode or auto-erase mode. * The return code is retained until a command write for other than status read mode is performed. Table 19-42 AC Characteristics in Status Read Mode (Conditions: VCC = 3.3 V 0.3 V, VSS = 0 V, Ta = 25C 5C) Item Symbol Min Max Unit Command write cycle tnxtc 20 -- s CE hold time tceh 0 -- ns CE setup time tces 0 -- ns Data hold time tdh 50 -- ns Data setup time tds 50 -- ns Write pulse width twep 70 -- ns OE output delay time toe -- 150 ns Disable delay time tdf -- 100 ns CE output delay time tce -- 150 ns WE rise time tr -- 30 ns WE fall time tf -- 30 ns Rev. 4.0, 03/03, page 813 of 1358 A18 to A0 tceh tnxtc tces tces CE tceh tnxtc tnxtc tce OE tf WE twep tr tf tdh tds twep tds H'71 I/O7 to I/O0 toe tr tdf tdh H'71 Note: I/O3 and I/O2 are undefined. Figure 19-54 Status Read Mode Timing Waveforms Table 19-43 Status Read Mode Return Commands Pin Name I/O7 Attribute I/O6 Normal Command end error identification Initial value 0 0 Indications Normal end: 0 Command error: 1 Abnormal end: 1 I/O5 I/O4 I/O3 I/O2 I/O1 Programming error Erase error -- -- ProgramEffective ming or address erase count error exceeded 0 0 0 0 0 -- Count Effective exceeded: 1 address Otherwise: 0 error: 1 Erase -- Programerror: 1 ming Otherwise: 0 Otherwise: 0 error: 1 Otherwise: 0 I/O0 0 Otherwise: 0 Note: I/O3 and I/O2 are undefined. 19.20.8 Status Polling * The I/O7 status polling flag indicates the operating status in auto-program or auto-erase mode. * The I/O6 status polling flag indicates a normal or abnormal end in auto-program or auto-erase mode. Table 19-44 Status Polling Output Truth Table Pin Names Internal Operation in Progress Abnormal End -- Normal End I/O7 0 1 0 1 I/O6 0 0 1 1 I/O0 to I/O5 0 0 0 0 Rev. 4.0, 03/03, page 814 of 1358 19.20.9 PROM Mode Transition Time Commands cannot be accepted during the oscillation stabilization period or the PROM mode setup period. After the PROM mode setup time, a transition is made to memory read mode. Table 19-45 Command Wait State Transition Time Specifications Item Symbol Min Max Unit Standby release (oscillation stabilization time) tosc1 30 -- ms PROM mode setup time tbmv 10 -- ms VCC hold time tdwn 0 -- ms Memory read mode tosc1 tbmv Command wait state Auto-program mode Auto-erase mode Command wait state Normal/ abnormal end identification tdwn VCC RES FWE Note: Except in auto-program mode and auto-erase mode, drive the FWE input pin low. Figure 19-55 Oscillation Stabilization Time, PROM Mode Setup Time, and Power Supply Fall Sequence 19.20.10 Notes on Memory Programming * When programming addresses which have previously been programmed, carry out auto-erasing before auto-programming. * When performing programming using PROM mode on a chip that has been programmed/erased in an on-board programming mode, auto-erasing is recommended before carrying out autoprogramming. Notes: 1. The flash memory is initially in the erased state when the device is shipped by Hitachi. For other chips for which the erasure history is unknown, it is recommended that autoerasing be executed to check and supplement the initialization (erase) level. 2. Auto-programming should be performed once only on the same address block. Additional programming cannot be carried out on address blocks that have already been programmed. Rev. 4.0, 03/03, page 815 of 1358 19.21 Flash Memory Programming and Erasing Precautions Precautions concerning the use of on-board programming mode, the RAM emulation function, and PROM mode are summarized below. Use the specified voltages and timing for programming and erasing: Applied voltages in excess of the rating can permanently damage the device. Use a PROM programmer that supports the Hitachi microcomputer device type with 256-kbyte on-chip flash memory (FZTAT256V3A). Do not select the HN27C4096 setting for the PROM programmer, and only use the specified socket adapter. Failure to observe these points may result in damage to the device. Powering on and off (see figures 19-56 to 19-58): Do not apply a high level to the FWE pin until VCC has stabilized. Also, drive the FWE pin low before turning off VCC. When applying or disconnecting VCC power, fix the FWE pin low and place the flash memory in the hardware protection state. The power-on and power-off timing requirements should also be satisfied in the event of a power failure and subsequent recovery. FWE application/disconnection (see figures 19-56 to 19-58): FWE application should be carried out when MCU operation is in a stable condition. If MCU operation is not stable, fix the FWE pin low and set the protection state. The following points must be observed concerning FWE application and disconnection to prevent unintentional programming or erasing of flash memory: * Apply FWE when the VCC voltage has stabilized within its rated voltage range. * Apply FWE when oscillation has stabilized (after the elapse of the oscillation stabilization time). * In boot mode, apply and disconnect FWE during a reset. * In user program mode, FWE can be switched between high and low level regardless of the reset state. FWE input can also be switched during execution of a program in flash memory. * Do not apply FWE if program runaway has occurred. * Disconnect FWE only when the SWE, ESU, PSU, EV, PV, P, and E bits in FLMCR1 are cleared. Make sure that the SWE, ESU, PSU, EV, PV, P, and E bits are not set by mistake when applying or disconnecting FWE. Rev. 4.0, 03/03, page 816 of 1358 Do not apply a constant high level to the FWE pin: Apply a high level to the FWE pin only when programming or erasing flash memory. A system configuration in which a high level is constantly applied to the FWE pin should be avoided. Also, while a high level is applied to the FWE pin, the watchdog timer should be activated to prevent overprogramming or overerasing due to program runaway, etc. Use the recommended algorithm when programming and erasing flash memory: The recommended algorithm enables programming and erasing to be carried out without subjecting the device to voltage stress or sacrificing program data reliability. When setting the P or E bit in FLMCR1, the watchdog timer should be set beforehand as a precaution against program runaway, etc. Do not set or clear the SWE bit during execution of a program in flash memory: Wait for at least 100 s after clearing the SWE bit before executing a program or reading data in flash memory. When the SWE bit is set, data in flash memory can be rewritten, but when SWE = 1, flash memory can only be read in program-verify or erase-verify mode. Access flash memory only for verify operations (verification during programming/erasing). Also, do not clear the SWE bit during programming, erasing, or verifying. Similarly, when using the RAM emulation function while a high level is being input to the FWE pin, the SWE bit must be cleared before executing a program or reading data in flash memory. However, the RAM area overlapping flash memory space can be read and written to regardless of whether the SWE bit is set or cleared. Do not use interrupts while flash memory is being programmed or erased: All interrupt requests, including NMI, should be disabled during FWE application to give priority to program/erase operations. Do not perform additional programming. Erase the memory before reprogramming: In onboard programming, perform only one programming operation on a 128-byte programming unit block. In PROM mode, too, perform only one programming operation on a 128-byte programming unit block. Programming should be carried out with the entire programming unit block erased. Before programming, check that the chip is correctly mounted in the PROM programmer: Overcurrent damage to the device can result if the index marks on the PROM programmer socket, socket adapter, and chip are not correctly aligned. Do not touch the socket adapter or chip during programming: Touching either of these can cause contact faults and write errors. Rev. 4.0, 03/03, page 817 of 1358 Wait time: x Programming/ erasing possible Wait time: 100 ms f Min 0 ms tOSC1 VCC tMDS*3 FWE Min 0 ms MD2 to MD0*1 tMDS*3 RES SWE set SWE cleared SWE bit Period during which flash memory access is prohibited (x: Wait time after setting SWE bit)*2 Period during which flash memory can be programmed (Execution of program in flash memory prohibited, and data reads other than verify operations prohibited) Notes: *1 Except when switching modes, the level of the mode pins (MD2 to MD0) must be fixed until power-off by pulling the pins up or down. *2 See section 22.2.6, Flash Memory Characteristics. *3 Mode programming setup time tMDS (min) = 200 ns Figure 19-56 Power-On/Off Timing (Boot Mode) Rev. 4.0, 03/03, page 818 of 1358 Wait time: x Programming/ erasing possible Wait time: 100 ms f Min 0 ms tOSC1 VCC FWE MD2 to MD0*1 tMDS*3 RES SWE set SWE bit SWE cleared Period during which flash memory access is prohibited (x: Wait time after setting SWE bit)*2 Period during which flash memory can be programmed (Execution of program in flash memory prohibited, and data reads other than verify operations prohibited) Notes: *1 Except when switching modes, the level of the mode pins (MD2 to MD0) must be fixed until power-off by pulling the pins up or down. *2 See section 22.2.6, Flash Memory Characteristics. *3 Mode programming setup time tMDS (min) = 200 ns Figure 19-57 Power-On/Off Timing (User Program Mode) Rev. 4.0, 03/03, page 819 of 1358 Wait time: 100 ms Wait time: x Programming/erasing possible Wait time: 100 ms Wait time: x Programming/erasing possible Wait time: 100 ms Wait time: x Programming/erasing possible Wait time: 100 ms Wait time: x Programming/erasing possible f tOSC1 VCC Min 0 ms FWE tMDS tMDS*2 MD2 to MD0 tMDS tRESW RES SWE bit SWE set Mode change*1 SWE cleared Boot mode Mode User change*1 mode User program mode User mode User program mode Period during which flash memory access is prohibited (x: Wait time after setting SWE bit)*3 Period during which flash memory can be programmed (Execution of program in flash memory prohibited, and data reads other than verify operations prohibited) Notes: *1 When entering boot mode or making a transition from boot mode to another mode, mode switching must be carried out by means of RES input. The state of ports with multiplexed address functions and bus control output pins (AS, RD, WR) will change during this switchover interval (the interval during which the RES pin input is low), and therefore these pins should not be used as output signals during this time. *2 When making a transition from boot mode to another mode, a mode programming setup time tMDS (min) of 200 ns is necessary with respect to RES clearance timing. *3 See section 22.2.6, Flash Memory Characteristics. Figure 19-58 Mode Transition Timing (Example: Boot Mode User Mode User Program Mode) Rev. 4.0, 03/03, page 820 of 1358 19.22 Overview of Flash Memory (H8S/2326 F-ZTAT) 19.22.1 Features The H8S/2326 F-ZTAT has 512 kbytes of on-chip flash memory. The features of the flash memory are summarized below. * Four flash memory operating modes Program mode Erase mode Program-verify mode Erase-verify mode * Programming/erase methods The flash memory is programmed 128 bytes at a time. Erasing is performed by block erase (in single-block units). To erase the entire flash memory, the individual blocks must be erased sequentially. Block erasing can be performed as required on 4-kbyte, 32-kbyte, and 64-kbyte blocks. * Programming/erase times The flash memory programming time is 10.0 ms (typ.) for simultaneous 128-byte programming, equivalent to 78 s (typ.) per byte, and the erase time is 50 ms (typ.). * Reprogramming capability The flash memory can be reprogrammed up to 100 times. * On-board programming modes There are two modes in which flash memory can be programmed/erased/verified on-board: Boot mode User program mode * Automatic bit rate adjustment With data transfer in boot mode, the bit rate of the chip can be automatically adjusted to match the transfer bit rate of the host. * Flash memory emulation by RAM Part of the RAM area can be overlapped onto flash memory, to emulate flash memory updates in real time. Rev. 4.0, 03/03, page 821 of 1358 * Protect modes There are three protect modes, hardware, software, and error protect, which allow protected status to be designated for flash memory program/erase/verify operations. * PROM mode Flash memory can be programmed/erased in PROM mode, using a PROM programmer, as well as in on-board programming mode. 19.22.2 Overview Block Diagram Internal address bus Module bus Internal data bus (16 bits) FLMCR1 FLMCR2 Bus interface/controller EBR1 Operating mode EBR2 RAMER SYSCR2 Flash memory (512 kbytes) Legend FLMCR1: FLMCR2: EBR1: EBR2: RAMER: SYSCR2: Flash memory control register 1 Flash memory control register 2 Erase block register 1 Erase block register 2 RAM emulation register System control register 2 Figure 19-59 Block Diagram of Flash Memory Rev. 4.0, 03/03, page 822 of 1358 FWE pin Mode pins 19.22.3 Flash Memory Operating Modes Mode Transitions: When the mode pins and the FWE pin are set in the reset state and a reset-start is executed, the chip enters one of the operating modes shown in figure 19-60. In user mode, flash memory can be read but not programmed or erased. Flash memory can be programmed and erased in boot mode, user program mode, and PROM mode. MD1 = 1, MD2 = 1, FWE = 0 RES = 0 User mode (on-chip ROM enabled) FWE = 1, SWE = 1 Reset state RES = 0 RES = 0 FWE = 0 or SWE = 0 FWE = 1, MD1 = 1, MD2 = 0 * RES = 0 PROM mode User program mode Boot mode On-board programming mode Notes: Only make a transition between user mode and user program mode when the CPU is not accessing the flash memory. * MD0 = 0, MD1 = 0, MD2 = 0, P66 = 1, P65 = 0, P64 = 0 Figure 19-60 Flash Memory Mode Transitions Rev. 4.0, 03/03, page 823 of 1358 19.22.4 On-Board Programming Modes * Boot mode 1. Initial state The old program version or data remains written in the flash memory. The user should prepare the programming control program and new application program beforehand in the host. 2. Programming control program transfer When boot mode is entered, the boot program in the chip (originally incorporated in the chip) is started and the programming control program in the host is transferred to RAM via SCI communication. The boot program required for flash memory erasing is automatically transferred to the RAM boot program area. Host Host Programming control program New application program New application program Chip Chip SCI Boot program Flash memory SCI Boot program Flash memory RAM RAM Boot program area Application program (old version) Application program (old version) 3. Flash memory initialization The erase program in the boot program area (in RAM) is executed, and the flash memory is initialized (to H'FF). In boot mode, entire flash memory erasure is performed, without regard to blocks. Host Programming control program 4. Writing new application program The programming control program transferred from the host to RAM is executed, and the new application program in the host is written into the flash memory. Host New application program Chip Chip SCI Boot program Flash memory Flash memory RAM Boot program area Flash memory prewrite-erase Programming control program SCI Boot program RAM Boot program area New application program Programming control program Program execution state Figure 19-61 Boot Mode Rev. 4.0, 03/03, page 824 of 1358 * User program mode 1. Initial state (1) The FWE assessment program that confirms that the FWE pin has been driven high, and (2) the program that will transfer the programming/ erase control program to on-chip RAM should be written into the flash memory by the user beforehand. (3) The programming/erase control program should be prepared in the host or in the flash memory. 2. Programming/erase control program transfer When the FWE pin is driven high, user software confirms this fact, executes the transfer program in the flash memory, and transfers the programming/erase control program to RAM. Host Host Programming/ erase control program New application program New application program Chip Chip SCI Boot program Flash memory SCI Boot program RAM Flash memory RAM FWE assessment program FWE assessment program Transfer program Transfer program Programming/ erase control program Application program (old version) Application program (old version) 3. Flash memory initialization The programming/erase program in RAM is executed, and the flash memory is initialized (to H'FF). Erasing can be performed in block units, but not in byte units. 4. Writing new application program Next, the new application program in the host is written into the erased flash memory blocks. Do not write to unerased blocks. Host Host New application program Chip Chip SCI Boot program Flash memory RAM FWE assessment program Flash memory RAM FWE assessment program Transfer program Transfer program Programming/ erase control program Flash memory erase SCI Boot program Programming/ erase control program New application program Program execution state Figure 19-62 User Program Mode (Example) Rev. 4.0, 03/03, page 825 of 1358 19.22.5 Flash Memory Emulation in RAM Reading Overlap RAM Data in User Mode and User Program Mode: Emulation should be performed in user mode or user program mode. When the emulation block set in RAMER is accessed while the emulation function is being executed, data written in the overlap RAM is read. SCI Flash memory RAM Emulation block Overlap RAM (emulation is performed on data written in RAM) Application program Execution state Figure 19-63 Reading Overlap RAM Data in User Mode and User Program Mode Rev. 4.0, 03/03, page 826 of 1358 Writing Overlap RAM Data in User Program Mode: When overlap RAM data is confirmed, the RAMS bit is cleared, RAM overlap is released, and writes should actually be performed to the flash memory. When the programming control program is transferred to RAM, ensure that the transfer destination and the overlap RAM do not overlap, as this will cause data in the overlap RAM to be rewritten. SCI Flash memory RAM Programming data Overlap RAM (programming data) Programming control program Execution state Application program Figure 19-64 Writing Overlap RAM Data in User Program Mode 19.22.6 Differences between Boot Mode and User Program Mode Table 19-46 Differnces between Boot Mode and User Program Mode Boot Mode User Program Mode Entire memory erase Yes Yes Block erase No Yes Programming control program* Program/program-verify Erase/erase-verify/program/ program-verify/emulation Note: * To be provided by the user, in accordance with the recommended algorithm. Rev. 4.0, 03/03, page 827 of 1358 19.22.7 Block Configuration On-chip 512-kbyte flash memory is divided into seven 64-kbyte blocks, one 32-kbyte block, and eight 4-kbyte blocks. Address H'000000 4 kbytes 8 32 kbytes 64 kbytes 512 kbytes 64 kbytes 64 kbytes 64 kbytes 64 kbytes 64 kbytes 64 kbytes Address H'07FFFF Figure 19-65 Flash Memory Block Configuration Rev. 4.0, 03/03, page 828 of 1358 19.22.8 Pin Configuration The flash memory is controlled by means of the pins shown in tables 19-47. Table 19-47 Flash Memory Pins Pin Name Abbreviation I/O Function Reset RES Input Reset Flash write enable FWE Input Flash program/erase protection by hardware Mode 2 MD2 Input Sets MCU operating mode Mode 1 MD1 Input Sets MCU operating mode Mode 0 MD0 Input Sets MCU operating mode Port 64 P64 Input Sets MCU operating mode in PROM mode Port 65 P65 Input Sets MCU operating mode in PROM mode Port 66 P66 Input Sets MCU operating mode in PROM mode Transmit data TxD1 Output Serial transmit data output Receive data RxD1 Input Serial receive data input Rev. 4.0, 03/03, page 829 of 1358 19.22.9 Register Configuration The registers used to control the on-chip flash memory when enabled are shown in table 19-48. In order to access the FLMCR1, FLMCR2, EBR1, and EBR2 registers, the FLSHE bit must be set to 1 in SYSCR2 (except RAMER). Table 19-48 Flash Memory Registers Register Name Abbreviation R/W *6 Flash memory control register 1 FLMCR1 Flash memory control register 2 Erase block register 1 FLMCR2* 6 EBR1* Erase block register 2 EBR2* System control register 2 RAM emulation register 6 R/W Initial Value *3 3 R/W * 3 R/W * H'00/H'80 H'00 1 Address* *2 H'FFC8 2 H'FFC9* R/W * H'00* 5 H'00* 2 H'FFCA* 2 H'FFCB* SYSCR2* R/W H'00 H'FF42 RAMER R/W H'00 H'FEDB 6 3 7 5 *4 Notes: *1 Lower 16 bits of the address. *2 Flash memory. Registers selection is performed by the FLSHE bit in system control register 2 (SYSCR2). *3 In modes in which the on-chip flash memory is disabled, a read will return H'00, and writes are invalid. Writes are also disabled when the FWE bit is cleared to 0 in FLMCR1. *4 When a high level is input to the FWE pin, the initial value is H'80. *5 When a low level is input to the FWE pin, or if a high level is input and the SWE1 bit in FLMCR1 is not set, bits EB11 to EB0 are initialized to 0, and if the SWE2 bit is not set, bits EB15 to EB12 are initialized to 0. *6 FLMCR1, FLMCR2, EBR1, and EBR2 are 8-bit registers. Only byte accesses are valid for these registers, the access requiring 2 states. *7 The SYSCR2 register can only be used in the F-ZTAT versions. In the mask ROM versions this register will return an undefined value if read, and cannot be modified. Rev. 4.0, 03/03, page 830 of 1358 19.23 Register Descriptions 19.23.1 Flash Memory Control Register 1 (FLMCR1) Bit : Initial value : R/W : 7 6 5 4 3 2 1 0 FWE SWE1 ESU1 PSU1 EV1 PV1 E1 P1 1/0 0 0 0 0 0 0 0 R R/W R/W R/W R/W R/W R/W R/W FLMCR1 is an 8-bit register used for flash memory operating mode control. Program-verify mode or erase-verify mode for addresses H'000000 to H'03FFFF is entered by setting SWE1 to 1 when FWE = 1, then setting the EV1 or PV1 bit. Program mode for addresses H'000000 to H'03FFFF is entered by setting SWE1 to 1 when FWE = 1, then setting the PSU1 bit, and finally setting the P1 bit. Erase mode for addresses H'000000 to H'03FFFF is entered by setting SWE1 to 1 when FWE = 1, then setting the ESU1 bit, and finally setting the E1 bit. FLMCR1 is initialized by a reset, and in hardware standby mode and software standby mode. The initial value is H'80 when a high level is input to the FWE pin, and H'00 when a low level is input. When on-chip flash memory is disabled, a read will return H'00, and writes are invalid. Writes to the SWE1 bit in FLMCR1 are valid only when FWE = 1; writes to the ESU1, PSU1, EV1, and PV1 bits only when FWE = 1 and SWE1 = 1; writes to the E1 bit only when FWE = 1, SWE1 = 1, and ESU1 = 1; and writes to the P1 bit only when FWE = 1, SWE1 = 1, and PSU1 = 1. Bit 7--Flash Write Enable Bit (FWE): Sets hardware protection against flash memory programming/erasing. Bit 7 FWE Description 0 When a low level is input to the FWE pin (hardware-protected state) 1 When a high level is input to the FWE pin Bit 6--Software Write Enable Bit 1 (SWE1): Enables or disables flash memory programming and erasing for addresses H'000000 to H'03FFFF. This bit should be set when setting bits 5 to 0 in FLMCR1, EBR1 bits 7 to 0, and EBR2 bits 3 to 0. When SWE1 = 1, the flash memory can only be read in program-verify or erase-verify mode. Rev. 4.0, 03/03, page 831 of 1358 Bit 6 SWE1 Description 0 Writes disabled 1 Writes enabled (Initial value) [Setting condition] When FWE = 1 Bit 5--Erase Setup Bit 1 (ESU1): Prepares for a transition to erase mode for addresses H'000000 to H'03FFFF. Do not set the SWE1, PSU1, EV1, PV1, E1, or P1 bit at the same time. Bit 5 ESU1 Description 0 Erase setup cleared 1 Erase setup (Initial value) [Setting condition] When FWE = 1, SWE1 = 1 Bit 4--Program Setup Bit 1 (PSU1): Prepares for a transition to program mode for addresses H'000000 to H'03FFFF. Do not set the SWE1, ESU1, EV1, PV1, E1, or P1 bit at the same time. Bit 4 PSU1 Description 0 Program setup cleared 1 Program setup (Initial value) [Setting condition] When FWE = 1, SWE1 = 1 Bit 3--Erase-Verify 1 (EV1): Selects erase-verify mode transition or clearing for addresses H'000000 to H'03FFFF. Do not set the SWE1, ESU1, PSU1, PV1, E1, or P1 bit at the same time. Bit 3 EV1 Description 0 Erase-verify mode cleared 1 Transition to erase-verify mode [Setting condition] When FWE = 1, SWE1 = 1 Rev. 4.0, 03/03, page 832 of 1358 (Initial value) Bit 2--Program-Verify 1 (PV1): Selects program-verify mode transition or clearing for addresses H'000000 to H'03FFFF. Do not set the SWE1, ESU1, PSU1, EV1, E1, or P1 bit at the same time. Bit 2 PV1 Description 0 Program-verify mode cleared 1 Transition to program-verify mode (Initial value) [Setting condition] When FWE = 1, SWE1 = 1 Bit 1--Erase 1 (E1): Selects erase mode transition or clearing for addresses H'000000 to H'03FFFF. Do not set the SWE1, ESU1, PSU1, EV1, PV1, or P1 bit at the same time. Bit 1 E1 Description 0 Erase mode cleared 1 Transition to erase mode (Initial value) [Setting condition] When FWE = 1, SWE1 = 1, and ESU1 = 1 Bit 0--Program 1 (P1): Selects program mode transition or clearing for addresses H'000000 to H'03FFFF. Do not set the SWE1, PSU1, ESU1, EV1, PV1, or E1 bit at the same time. Bit 0 P1 Description 0 Program mode cleared 1 Transition to program mode (Initial value) [Setting condition] When FWE = 1, SWE1 = 1, and PSU1 = 1 Rev. 4.0, 03/03, page 833 of 1358 19.23.2 Flash Memory Control Register 2 (FLMCR2) Bit : 7 6 5 4 3 2 1 0 FLER SWE2 ESU2 PSU2 EV2 PV2 E2 P2 Initial value : 0 0 0 0 0 0 0 0 R/W R R/W R/W R/W R/W R/W R/W R/W : FLMCR2 is an 8-bit register used for flash memory operating mode control. Program-verify mode or erase-verify mode for addresses H'040000 to H'07FFFF is entered by setting SWE2 to 1 when FWE = 1, then setting the EV2 or PV2 bit. Program mode for addresses H'040000 to H'07FFFF is entered by setting SWE2 to 1 when FWE = 1, then setting the PSU2 bit, and finally setting the P2 bit. Erase mode for addresses H'040000 to H'07FFFF is entered by setting SWE2 to 1 when FWE = 1, then setting the ESU2 bit, and finally setting the E2 bit. FLMCR2 is initialized to H'00 by a reset, and in hardware standby mode and software standby mode. When on-chip flash memory is disabled, a read will return H'00, and writes are invalid. Writes to the SWE2 bit in FLMCR2 are valid only when FWE = 1; writes to the ESU2, PSU2, EV2, and PV2 bits only when FWE = 1 and SWE2 = 1; writes to the E2 bit only when FWE = 1, SWE2 = 1, and ESU2 = 1; and writes to the P2 bit only when FWE = 1, SWE2 = 1, and PSU2 = 1. Bit 7--Flash Memory Error (FLER): Indicates that an error has occurred during an operation on flash memory (programming or erasing). When FLER is set to 1, flash memory goes to the errorprotection state. Bit 7 FLER Description 0 Flash memory is operating normally (Initial value) Flash memory program/erase protection (error protection) is disabled [Clearing condition] Reset or hardware standby mode 1 An error has occurred during flash memory programming/erasing Flash memory program/erase protection (error protection) is enabled [Setting condition] See section 19.26.3, Error Protection Bit 6--Software Write Enable Bit 2 (SWE2): Enables or disables flash memory programming and erasing for addresses H'040000 to H'07FFFF. This bit should be set when setting bits 5 to 0 in FLMCR2, and EBR2 bits 7 to 4. When SWE2 = 1, the flash memory can only be read in program-verify or erase-verify mode. Rev. 4.0, 03/03, page 834 of 1358 Bit 6 SWE2 Description 0 Writes disabled 1 Writes enabled (Initial value) [Setting condition] When FWE = 1 Bit 5--Erase Setup Bit 2 (ESU2): Prepares for a transition to erase mode for addresses H'040000 to H'07FFFF. Do not set the SWE2, PSU2, EV2, PV2, E2, or P2 bit at the same time. Bit 5 ESU2 Description 0 Erase setup cleared 1 Erase setup (Initial value) [Setting condition] When FWE = 1, SWE2 = 1 Bit 4--Program Setup Bit 2 (PSU2): Prepares for a transition to program mode for addresses H'040000 to H'07FFFF. Do not set the SWE2, ESU2, EV2, PV2, E2, or P2 bit at the same time. Bit 4 PSU2 Description 0 Program setup cleared 1 Program setup (Initial value) [Setting condition] When FWE = 1, SWE2 = 1 Bit 3--Erase-Verify 2 (EV2): Selects erase-verify mode transition or clearing for addresses H'040000 to H'07FFFF. Do not set the SWE2, ESU2, PSU2, PV2, E2, or P2 bit at the same time. Bit 3 EV2 Description 0 Erase-verify mode cleared 1 Transition to erase-verify mode (Initial value) [Setting condition] When FWE = 1, SWE2 = 1 Rev. 4.0, 03/03, page 835 of 1358 Bit 2--Program-Verify 2 (PV2): Selects program-verify mode transition or clearing for addresses H'040000 to H'07FFFF. Do not set the SWE2, ESU2, PSU2, EV2, E2, or P2 bit at the same time. Bit 2 PV2 Description 0 Program-verify mode cleared 1 Transition to program-verify mode (Initial value) [Setting condition] When FWE = 1, SWE2 = 1 Bit 1--Erase 2 (E2): Selects erase mode transition or clearing for addresses H'040000 to H'07FFFF. Do not set the SWE2, ESU2, PSU2, EV2, PV2, or P2 bit at the same time. Bit 1 E2 Description 0 Erase mode cleared 1 Transition to erase mode (Initial value) [Setting condition] When FWE = 1, SWE2 = 1, and ESU2 = 1 Bit 0--Program 2 (P2): Selects program mode transition or clearing for H'040000 to H'07FFFF. Do not set the SWE2, PSU2, ESU2, EV2, PV2, or E2 bit at the same time. Bit 0 P2 Description 0 Program mode cleared 1 Transition to program mode [Setting condition] When FWE = 1, SWE2 = 1, and PSU2 = 1 Rev. 4.0, 03/03, page 836 of 1358 (Initial value) 19.23.3 Erase Block Register 1 (EBR1) Bit : EBR1 Initial value : R/W : 7 6 5 4 3 2 1 0 EB7 EB6 EB5 EB4 EB3 EB2 EB1 EB0 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W EBR1 is an 8-bit register that specifies the flash memory erase area block by block. EBR1 is initialized to H'00 by a reset, in hardware standby mode and software standby mode, when a low level is being input to the FWE pin, and when the SWE1 bit in FLMCR1 is not set when a high level is being input to the FWE pin. When a bit in EBR1 is set, the corresponding block can be erased. Other blocks are erase-protected. Set only one bit in EBR1 and EBR2 together (setting more than one bit will automatically clear all EBR1 and EBR2 bits to 0). When on-chip flash memory is disabled, a read will return H'00 and writes are invalid. The flash memory block configuration is shown in table 19-49 Rev. 4.0, 03/03, page 837 of 1358 19.23.4 Erase Block Registers 2 (EBR2) Bit : EBR2 Initial value : R/W : 7 6 5 4 3 2 1 0 EB15 EB14 EB13 EB12 EB11 EB10 EB9 EB8 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W EBR2 is an 8-bit register that specifies the flash memory erase area block by block. Bits 3 to 0 in EBR2 are initialized to H'00 by a reset, in hardware standby mode and software standby mode, when a low level is being input to the FWE pin, and when the SWE1 bit in FLMCR1 is not set when a high level is being input to the FWE pin. Bits 7 to 4 are initialized to 0 when a low level is input to the FWE pin, and when a high level is input to the FWE pin and the SWE2 bit in FLMCR2 is not set. When a bit in EBR2 is set, the corresponding block can be erased. Other blocks are erase-protected. Set only one bit in EBR2 and EBR1 together (setting more than one bit will automatically clear all EBR1 and EBR2 bits to 0). When on-chip flash memory is disabled, a read will return H'00, and writes are invalid. The flash memory block configuration is shown in table 19-49. Table 19-49 Flash Memory Erase Blocks Block (Size) Address EB0 (4 kbytes) H'000000 to H'000FFF EB1 (4 kbytes) H'001000 to H'001FFF EB2 (4 kbytes) H'002000 to H'002FFF EB3 (4 kbytes) H'003000 to H'003FFF EB4 (4 kbytes) H'004000 to H'004FFF EB5 (4 kbytes) H'005000 to H'005FFF EB6 (4 kbytes) H'006000 to H'006FFF EB7 (4 kbytes) H'007000 to H'007FFF EB8 (32 kbytes) H'008000 to H'00FFFF EB9 (64 kbytes) H'010000 to H'01FFFF EB10 (64 kbytes) H'020000 to H'02FFFF EB11 (64 kbytes) H'030000 to H'03FFFF EB12 (64 kbytes) H'040000 to H'04FFFF EB13 (64 kbytes) H'050000 to H'05FFFF EB14 (64 kbytes) H'060000 to H'06FFFF EB15 (64 kbytes) H'070000 to H'07FFFF Rev. 4.0, 03/03, page 838 of 1358 19.23.5 System Control Register 2 (SYSCR2) Bit : 7 6 5 4 3 2 1 0 -- -- -- -- FLSHE -- -- -- Initial value : 0 0 0 0 0 0 0 0 R/W -- -- -- -- R/W -- -- -- : SYSCR2 is an 8-bit readable/writable register that performs on-chip flash memory control. SYSCR2 is initialized to H'00 by a reset and in hardware standby mode. SYSCR2 can only be used in the F-ZTAT versions. In the mask ROM versions this register will return an undefined value if read, and cannot be modified. Bits 7 to 4--Reserved: These bits cannot be modified and are always read as 0. Bit 3--Flash Memory Control Register Enable (FLSHE): Controls CPU access to the flash memory control registers (FLMCR1, FLMCR2, EBR1, and EBR2). Writing 1 to the FLSHE bit enables the flash memory control registers to be read and written to. Clearing FLSHE to 0 designates these registers as unselected (the register contents are retained). Bit 3 FLSHE Description 0 Flash control registers are not selected for addresses H'FFFFC8 to H'FFFFCB (Initial value) 1 Flash control registers are selected for addresses H'FFFFC8 to H'FFFFCB Bits 2 to 0--Reserved: These bits cannot be modified and are always read as 0. 19.23.6 RAM Emulation Register (RAMER) Bit : 7 6 5 4 3 2 1 0 -- -- -- -- RAMS RAM2 RAM1 RAM0 Initial value : 0 0 0 0 0 0 0 0 R/W -- -- -- -- R/W R/W R/W R/W : RAMER specifies the area of flash memory to be overlapped with part of RAM when emulating real-time flash memory programming. RAMER is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in software standby mode. RAMER settings should be made in user mode or user program mode. Rev. 4.0, 03/03, page 839 of 1358 Flash memory area divisions are shown in table 19-50. To ensure correct operation of the emulation function, the ROM for which RAM emulation is performed should not be accessed immediately after this register has been modified. Normal execution of an access immediately after register modification is not guaranteed. Bits 7 to 4--Reserved: These bits cannot be modified and are always read as 0. Bit 3--RAM Select (RAMS): Specifies selection or non-selection of flash memory emulation in RAM. When RAMS = 1, all flash memory blocks are program/erase-protected. Bit 3 RAMS Description 0 Emulation not selected (Initial value) Program/erase-protection of all flash memory blocks is disabled 1 Emulation selected Program/erase-protection of all flash memory blocks is enabled Bits 2 to 0--Flash Memory Area Selection (RAM2 to RAM0): These bits are used together with bit 3 to select the flash memory area to be overlapped with RAM (see table 19-50). Table 19-50 Flash Memory Area Divisions RAM Area Block Name RAMS RAM2 RAM1 RAM0 H'FFDC00 to H'FFEBFF RAM area, 4 kbytes 0 * * * H'000000 to H'000FFF EB0 (4 kbytes) 1 0 0 0 H'001000 to H'001FFF EB1 (4 kbytes) 1 0 0 1 H'002000 to H'002FFF EB2 (4 kbytes) 1 0 1 0 H'003000 to H'003FFF EB3 (4 kbytes) 1 0 1 1 H'004000 to H'004FFF EB4 (4 kbytes) 1 1 0 0 H'005000 to H'005FFF EB5 (4 kbytes) 1 1 0 1 H'006000 to H'006FFF EB6 (4 kbytes) 1 1 1 0 H'007000 to H'007FFF EB7 (4 kbytes) 1 1 1 1 *: Don't care Rev. 4.0, 03/03, page 840 of 1358 19.24 On-Board Programming Modes When pins are set to on-board programming mode, program/erase/verify operations can be performed on the on-chip flash memory. There are two on-board programming modes: boot mode and user program mode. The pin settings for transition to each of these modes are shown in table 19-51. For a diagram of the transitions to the various flash memory modes, see figure 19-59. Table 19-51 Setting On-Board Programming Modes Mode Pins MCU Mode CPU Operating Mode FWE MD2 MD1 MD0 Boot mode Advanced expanded mode with on-chip ROM enabled 1 0 1 0 Advanced single-chip mode User program mode* Advanced expanded mode with on-chip ROM enabled Advanced single-chip mode 1 1 1 1 0 1 Note: * Normally, user mode should be used. Set the FWE pin to 1 to make a transition to user program mode before performing a program/erase/verify operation. 19.24.1 Boot Mode When boot mode is used, the flash memory programming control program must be prepared in the host beforehand. The channel 1 SCI to be used is set to asynchronous mode. When a reset-start is executed after the H8S/2326 F-ZTAT chip's pins have been set to boot mode, the boot program built into the chip is started and the programming control program prepared in the host is serially transmitted to the chip via the SCI. In the chip, the programming control program received via the SCI is written into the programming control program area in on-chip RAM. After the transfer is completed, control branches to the start address of the programming control program area and the programming control program execution state is entered (flash memory programming is performed). The transferred programming control program must therefore include coding that follows the programming algorithm given later. The system configuration in boot mode is shown in figure 19-66, and the boot program mode execution procedure in figure 19-67. Rev. 4.0, 03/03, page 841 of 1358 Chip Flash memory Host Write data reception Verify data transmission RxD1 SCI1 TxD1 Figure 19-66 System Configuration in Boot Mode Rev. 4.0, 03/03, page 842 of 1358 On-chip RAM Start Set pins to boot mode and execute reset-start Host transfers data (H'00) continuously at prescribed bit rate Chip measures low period of H'00 data transmitted by host Chip calculates bit rate and sets value in bit rate register After bit rate adjustment, chip transmits one H'00 data byte to host to indicate end of adjustment Host confirms normal reception of bit rate adjustment end indication (H'00), and transmits one H'55 data byte After receiving H'55, chip transmits one H'AA data byte to host Host transmits number of programming control program bytes (N), upper byte followed by lower byte Chip transmits received number of bytes to host as verify data (echo-back) n=1 Host transmits programming control program sequentially in byte units Chip transmits received programming control program to host as verify data (echo-back) n+1 (R)n Transfer received programming control program to on-chip RAM No n = N? Yes End of transmission Check flash memory data, and if data has already been written, erase all blocks After confirming that all flash memory data has been erased, chip transmits one H'AA data byte to host Execute programming control program transferred to on-chip RAM Note: If a memory cell does not operate normally and cannot be erased, one H'FF byte is transmitted as an erase error, and the erase operation and subsequent operations are halted. Figure 19-67 Boot Mode Execution Procedure Rev. 4.0, 03/03, page 843 of 1358 Automatic SCI Bit Rate Adjustment: When boot mode is initiated, the H8S/2326 F-ZTAT chip measures the low period of the asynchronous SCI communication data (H'00) transmitted continuously from the host. The SCI transmit/receive format should be set as follows: 8-bit data, 1 stop bit, no parity. The chip calculates the bit rate of the transmission from the host from the measured low period, and transmits one H'00 byte to the host to indicate the end of bit rate adjustment. The host should confirm that this adjustment end indication (H'00) has been received normally, and transmit one H'55 byte to the chip. If reception cannot be performed normally, initiate boot mode again (reset), and repeat the above operations. Depending on the host's transmission bit rate and the chip's system clock frequency, there will be a discrepancy between the bit rates of the host and the chip. To ensure correct SCI operation, the host's transfer bit rate should be set to 9,600 or 19,200 bps. Table 19-52 shows typical host transfer bit rates and system clock frequencies for which automatic adjustment of the MCU's bit rate is possible. The boot program should be executed within this system clock range. Start bit D0 D1 D2 D3 D4 D5 D6 D7 Low period (9 bits) measured (H'00 data) Stop bit High period (1 or more bits) Figure 19-68 Automatic SCI Bit Rate Adjustment Table 19-52 System Clock Frequencies for which Automatic Adjustment of H8S/2326 F-ZTAT Bit Rate is Possible Host Bit Rate System Clock Frequency for which Automatic Adjustment of H8S/2326 F-ZTAT Bit Rate is Possible 19,200 bps 16 MHz to 25 MHz 9,600 bps 8 MHz to 25 MHz Rev. 4.0, 03/03, page 844 of 1358 On-Chip RAM Area Divisions in Boot Mode: In boot mode, the 2-kbyte area from H'FFDC00 to H'FFE3FF is reserved for use by the boot program, as shown in figure 19-69. The area to which the programming control program is transferred is H'FFE400 to H'FFFBFF. The boot program area can be used when the programming control program transferred into RAM enters the execution state. A stack area should be set up as required. H'FFDC00 H'FFE3FF Boot program area* (2 kbytes) Programming control program area (6 kbytes) H'FFFBFF Note: * The boot program area cannot be used until a transition is made to the execution state for the programming control program transferred to RAM. Note that the boot program remains stored in this area after a branch is made to the programming control program. Figure 19-69 RAM Areas in Boot Mode Notes on Use of Boot Mode * When the chip comes out of reset in boot mode, it measures the low-level period of the input at the SCI's RxD1 pin. The reset should end with RxD1 high. After the reset ends, it takes approximately 100 states before the chip is ready to measure the low-level period of the RxD1 pin. * In boot mode, if any data has been programmed into the flash memory (if all data is not 1), all flash memory blocks are erased. Boot mode is for use when user program mode is unavailable, such as the first time on-board programming is performed, or if the program activated in user program mode is accidentally erased. * Interrupts cannot be used while the flash memory is being programmed or erased. * The RxD1 and TxD1 pins should be pulled up on the board. Rev. 4.0, 03/03, page 845 of 1358 * Before branching to the programming control program (RAM area H'FFE400 to H'FFFBFF), the chip terminates transmit and receive operations by the on-chip SCI (channel 1) (by clearing the RE and TE bits in SCR to 0), but the adjusted bit rate value remains set in BRR. The transmit data output pin, TxD1, goes to the high-level output state (P31DDR = 1, P31DR = 1). The contents of the CPU's internal general registers are undefined at this time, so these registers must be initialized immediately after branching to the programming control program. In particular, since the stack pointer (SP) is used implicitly in subroutine calls, etc., a stack area must be specified for use by the programming control program. Initial settings must also be made for the other on-chip registers. * Boot mode can be entered by making the pin settings shown in table 19-51 and executing a reset-start. Boot mode can be cleared by driving the reset pin low, waiting at least 20 states, then setting the mode pins, and executing reset release*1. Boot mode can also be cleared by a WDT overflow reset. Do not change the mode pin input levels in boot mode. Do not make the FWE pin low level while a boot program is executing, or while programming or erasing flash memory*2. * If the mode pin input levels are changed (for example, from low to high) during a reset, the state of ports with multiplexed address functions and bus control output pins (AS, RD, HWR) will change according to the change in the microcomputer's operating mode*3. Therefore, care must be taken to make pin settings to prevent these pins from becoming output signal pins during a reset, or to prevent collision with signals outside the microcomputer. Notes: *1 Input to the mode pins and FWE pin must satisfy the mode programming setup time (tMDS = 200 ns) requirement with regard to the reset release timing, as shown in figures 19-86 to 19-88. *2 Refer to section 19.30, Programming/Erasing Flash Memory, for precautions regarding applying signals to and releasing the FWE pin. *3 See section 9, I/O Ports. 19.24.2 User Program Mode When set to user program mode, the chip can program and erase its flash memory by executing a user program/erase control program. Therefore, on-board programming of the on-chip flash memory can be carried out by providing ahead of time an on-board FWE control means to supply programming data, and storing a program/erase control program in part of the program area if necessary. To select user program mode, select a mode that enables the on-chip flash memory (mode 6 or 7) and apply a high level to the FWE pin. In this mode, on-chip supporting modules other than flash memory operate as they normally would in modes 6 and 7. Rev. 4.0, 03/03, page 846 of 1358 While the SWE1 bit is set to 1 to perform programming or erasing for the addresses H'000000 to H'03FFFF, this address area cannot be read. While the SWE2 bit is set to 1 to perform programming or erasing for the addresses H'040000 to H'07FFFF, this address area cannot be read. The control program that performs programming and erasing should be run in on-chip RAM or flash memory except for the above address areas. When the program is located in external memory, an instruction for programming the flash memory and the following instruction should be located in on-chip RAM. Figure 19-70 shows the procedure for executing the program/erase control program when transferred to on-chip RAM. Write FWE assessment program and transfer program (and programming/erase control program if necessary) beforehand MD2, MD1, MD0 = 101 or 111 Reset start Transfer programming/erase control program to RAM Branch to programming/erase control program in RAM area FWE = high* Execute programming/erase control program (flash memory rewriting) Clear FWE* Branch to application program in flash memory Notes: Do not apply a constant high level to the FWE pin. A high level should be applied to the FWE pin only when programming or erasing flash memory. Also, while a high level is applied to the FWE pin, the watchdog timer should be activated to prevent overprogramming or overerasing due to program runaway, etc. * For further information on FWE application and disconnection, see section 19.30, Flash Memory Programming/Erasing Precautions. Figure 19-70 Example of User Program Mode Execution Procedure Rev. 4.0, 03/03, page 847 of 1358 19.25 Programming/Erasing Flash Memory In the on-board programming modes, flash memory programming and erasing is performed by software, using the CPU. There are four flash memory operating modes: program mode, erase mode, program-verify mode, and erase-verify mode. Transition to these modes can be made for addresses H'000000 to H'03FFFF by setting the PSU1, ESU1, P1, E1, PV1, and EV1 bits in FLMCR1, and for addresses H'040000 to H'07FFFF by setting the PSU2, ESU2, P2, E2, PV2, and EV2 bits in FLMCR2. The flash memory cannot be read while being programmed or erased. Therefore, the program that controls flash memory programming/erasing (the programming control program) should be located and executed in on-chip RAM, external memory, or flash memory except for the above address areas. When the program is located in external memory, an instruction for programming the flash memory and the following instruction should be located in on-chip RAM. The DMAC or DTC should not be activated before or after the instruction for programming the flash memory is executed. Notes: 1. Operation is not guaranteed if setting/resetting of the SWE1, ESU1, PSU1, EV1, PV1, E1, and P1 bits in FLMCR1 or setting/resetting of the SWE2, ESU2, PSU2, EV2, PV2, E2, and P2 bits in FLMCR2 is executed by a program in flash memory. 2. When programming or erasing, set FWE to 1 (programming/erasing is not performed when FWE = 0). 3. Perform programming in the erased state. Do not perform additional programming on previously programmed addresses. 4. Do not program addresses H'000000 to H'03FFFF and H'040000 to H'07FFFF simultaneously. Operation is not guaranteed when programming is performed simultaneously. 19.25.1 Program Mode (n = 1 for addresses H'000000 to H'03FFFF and n = 2 for addresses H'040000 to H'07FFFF) Follow the procedure shown in the program/program-verify flowchart in figure 19-70 to write data or programs to flash memory. Performing program operations according to this flowchart will enable data or programs to be written to flash memory without subjecting the device to voltage stress or sacrificing program data reliability. Programming should be carried out 128 bytes at a time. For the wait times (x, y, z1, z2, z3 , , , , , and ) after bits are set or cleared in flash memory control register n (FLMCRn) and the maximum number of programming operations (N), see section 22.2.6, Flash Memory Characteristics. Following the elapse of (x) s or more after the SWEn bit is set to 1 in flash memory control register n (FLMCRn), 128-byte program data is stored in the program data area and reprogram data area, and the 128-byte data in the reprogram data area is written consecutively to the write Rev. 4.0, 03/03, page 848 of 1358 addresses. The lower 8 bits of the first address written to must be H'00 or H'80. 128 consecutive byte data transfers are performed. The program address and program data are latched in the flash memory. A 128-byte data transfer must be performed even if writing fewer than 128 bytes; in this case, H'FF data must be written to the extra addresses. Next, the watchdog timer is set to prevent overprogramming in the event of program runaway, etc. Set a value greater than (y + z2 + + ) s as the WDT overflow period. After this, preparation for program mode (program setup) is carried out by setting the PSUn bit in FLMCRn, and after the elapse of (y) s or more, the operating mode is switched to program mode by setting the Pn bit in FLMCRn. The time during which the Pn bit is set is the flash memory programming time. Set the programming time according to the table in the programming flowchart. 19.25.2 Program-Verify Mode (n = 1 for addresses H'000000 to H'03FFFF and n = 2 for addresses H'040000 to H'07FFFF) In program-verify mode, the data written in program mode is read to check whether it has been correctly written in the flash memory. After the elapse of a given programming time, the programming mode is exited (the Pn bit in FLMCRn is cleared to 0, then the PSUn bit is cleared to 0 at least () s later). Next, the watchdog timer is cleared after the elapse of () s or more, and the operating mode is switched to programverify mode by setting the PVn bit in FLMCRn. Before reading in program-verify mode, a dummy write of H'FF data should be made to the addresses to be read. The dummy write should be executed after the elapse of () s or more. When the flash memory is read in this state (verify data is read in 16-bit units), the data at the latched address is read. Wait at least () s after the dummy write before performing this read operation. Next, the originally written data is compared with the verify data, and reprogram data is computed (see figure 19-70) and transferred to the reprogram data area. After 128 bytes of data have been verified, exit program-verify mode and wait for at least () s, then clear the SWEn bit in FLMCRn to 0, and wait again for at least () s. If reprogramming is necessary, set program mode again, and repeat the program/program-verify sequence as before. However, ensure that the program/program-verify sequence is not repeated more than (N) times on the same bits. Rev. 4.0, 03/03, page 849 of 1358 Start of programming Write pulse application subroutine Sub-routine write pulse Start Enable WDT Set SWE1 (2) bit in FLMCR1 (2) Set PSU1 (2) bit in FLMCR1 (2) Wait (y) ms *6 Perform programming in the erased state. Do not perform additional programming on previously programmed addresses. Wait (x) ms *6 Store 128-byte program data in program data area and reprogram data area *4 Set P1 (2) bit in FLMCR1 (2) n=1 Wait (z1) ms or (z2) ms or (z3) ms *5 *6 m=0 Clear P1 (2) bit in FLMCR1 (2) Wait (a) ms Write 128-byte data in RAM reprogram *1 data area consecutively to flash memory *6 Sub-routine-call Clear PSU1 (2) bit in FLMCR1 (2) Wait (b) ms Write pulse (z1) ms or (z2) ms *6 Disable WDT See Note *7 for pulse width *6 Set PV1 (2) bit in FLMCR1 (2) End sub Wait (g) ms *6 H'FF dummy write to verify address *6 Note *7: Write Pulse Width Write Time (z) ms Number of Writes (n) z1 1 z1 2 z1 3 z1 4 z1 5 z1 6 z2 7 z2 8 z2 9 z2 10 z2 11 z2 12 z2 13 . . . . . . z2 998 z2 999 z2 1000 Increment address Wait (e) ms *6 Read verify data *2 nn+1 NG Read data = verify data? OK m=1 NG 6n? OK Additional program data computation Note: Use a (z3) s write pulse for additional programming. Transfer additional program data to additional program data area *4 Reprogram data computation *3 Transfer reprogram data to reprogram data area *4 NG RAM Program data area (128 bytes) 128-byte data verification completed? OK Clear PV1 (2) bit in FLMCR1 (2) Wait (h) ms *6 Reprogram data area (128 bytes) 6n? Additional program data area (128 bytes) OK Sequentially write 128-byte data in additional program data area in RAM to flash memory NG Write Pulse (z3) s additional write pulse *1 *6 *6 m = 0? NG n N? Clear SWE1 (2) bit in FLMCR1 (2) Wait (q) ms End of programming NG OK OK Clear SWE1 (2) bit in FLMCR1 (2) *6 Wait (q) ms *6 Programming failure Notes: *1 Data transfer is performed by byte transfer. The lower 8 bits of the first address written to must be H'00 or H'80. A 128-byte data transfer must be performed even if writing fewer than 128 bytes; in this case, H'FF data must be written to the extra addresses. *2 Verify data is read in 16-bit (W) units. *3 Even bits for which programming has been completed in the 128-byte programming loop will be subjected to additional programming if they fail the subsequent verify operation. *4 A 128-byte area for storing program data, a 128-byte area for storing reprogram data, and a 128-byte area for storing additional program data should be provided in RAM. The contents of the reprogram data and additional program data areas are modified as programming proceeds. *5 A write pulse of (z1) or (z2) ms should be applied according to the progress of programming. See Note 7 for the pulse widths. When the additional program data is programmed, a write pulse of (z3) ms should be applied. Reprogram data X' stands for reprogram data to which a write pulse has been applied. *6 For the values of x, y, z1, z2, z3, a, b, g, e, h, q, and N, see section 22.2.6, Flash Memory Characteristics. Program Data Operation Chart Original Data (D) 0 1 Verify Data (V) 0 1 0 1 Reprogram Data (X) 1 0 1 Comments Programming completed Programming incomplete; reprogram Still in erased state; no action Additional Program Data Operation Chart Reprogram Data (X') 0 1 Verify Data (V) 0 1 0 1 Additional Program Data (Y) Comments 0 Additional programming executed Additional programming not executed 1 Additional programming not executed Additional programming not executed Figure 19-71 Program/Program-Verify Flowchart Rev. 4.0, 03/03, page 850 of 1358 19.25.3 Erase Mode (n = 1 for addresses H'000000 to H'03FFFF and n = 2 for addresses H'040000 to H'07FFFF) Flash memory erasing should be performed block by block following the procedure shown in the erase/erase-verify flowchart (single-block erase) shown in figure 19-71. For the wait times (x, y, z, , , , , , ) after bits are set or cleared in flash memory control register n (FLMCRn) and the maximum number of programming operations (N), see section 22.2.6, Flash Memory Characteristics. To perform data or program erasure, make a 1 bit setting for the flash memory area to be erased in erase block register 1 or 2 (EBR1 or EBR2) at least (x) s after setting the SWEn bit to 1 in flash memory control register n (FLMCRn). Next, the watchdog timer is set to prevent overerasing in the event of program runaway, etc. Set a value greater than (y + z + + ) ms as the WDT overflow period. After this, preparation for erase mode (erase setup) is carried out by setting the ESUn bit in FLMCRn, and after the elapse of (y) s or more, the operating mode is switched to erase mode by setting the En bit in FLMCRn. The time during which the En bit is set is the flash memory erase time. Ensure that the erase time does not exceed (z) ms. Note: With flash memory erasing, prewriting (setting all data in the memory to be erased to 0) is not necessary before starting the erase procedure. 19.25.4 Erase-Verify Mode (n = 1 for addresses H'000000 to H'03FFFF and n = 2 for addresses H'040000 to H'07FFFF) In erase-verify mode, data is read after memory has been erased to check whether it has been correctly erased. After the elapse of the erase time, erase mode is exited (the En bit in FLMCRn is cleared to 0, then the ESUn bit in FLMCRn is cleared to 0 at least () s later), the watchdog timer is cleared after the elapse of () s or more, and the operating mode is switched to erase-verify mode by setting the EVn bit in FLMCRn. Before reading in erase-verify mode, a dummy write of H'FF data should be made to the addresses to be read. The dummy write should be executed after the elapse of () s or more. When the flash memory is read in this state (verify data is read in 16-bit units), the data at the latched address is read. Wait at least () s after the dummy write before performing this read operation. If the read data has been erased (all 1), a dummy write is performed to the next address, and erase-verify is performed. If the read data has not been erased, set erase mode again, and repeat the erase/erase-verify sequence in the same way. However, ensure that the erase/erase-verify sequence is not repeated more than (N) times. When verification is completed, exit erase-verify mode, and wait for at least () s. If erasure has been completed on all the erase blocks, clear the SWEn bit in FLMCRn to 0 and wait for at least () s. If there are any unerased blocks, make a 1 bit setting for the flash memory area to be erased, and repeat the erase/erase-verify sequence in the same way. Rev. 4.0, 03/03, page 851 of 1358 Start *1 Set SWE1 (2) bit in FLMCR1 (2) Wait (x) ms *2 n=1 Set EBR1, EBR2 *4 Enable WDT Set ESU1 (2) bit in FLMCR1 (2) Wait (y) ms *2 Start of erase Set E1 (2) bit in FLMCR1 (2) Wait (z) ms *2 Clear E1 (2) bit in FLMCR1(2) nn+1 Halt erase Wait (a) ms *2 Clear ESU1 (2) bit in FLMCR1 (2) Wait (b) ms *2 Disable WDT Set EV1 (2) bit in FLMCR1 (2) Wait (g) ms *2 Set block start address to verify address H'FF dummy write to verify address Wait (e) ms *2 Read verify data Increment address Verify data = all 1? *3 NG OK NG Last address of block? OK Clear EV1 (2) bit in FLMCR1 (2) Clear EV1 (2) bit in FLMCR1 (2) Wait (h) ms Wait (h) ms *2 *2 NG Notes: *1 *2 *3 *4 *5 *5 End of erasing of all erase blocks? OK *2 n N? NG Clear SWE1 (2) bit in FLMCR1 (2) OK Clear SWE1 (2) bit in FLMCR1 (2) Wait (q) ms Wait (q) ms End of erasing Erase failure Prewriting (setting erase block data to all 0) is not necessary. The values of x, y, z, a, b, g, e, h, q, and N are shown in the section 22.2.6, Flash Memory Characteristics. Verify data is read in 16-bit (W) units. Set only one bit in EBR1or EBR2. More than one bit cannot be set. Erasing is performed in block units. To erase a number of blocks, the individual blocks must be erased sequentially. Figure 19-72 Erase/Erase-Verify Flowchart Rev. 4.0, 03/03, page 852 of 1358 19.26 Flash Memory Protection There are three kinds of flash memory program/erase protection: hardware protection, software protection, and error protection. 19.26.1 Hardware Protection Hardware protection refers to a state in which programming/erasing of flash memory is forcibly disabled or aborted. Settings in flash memory control registers 1 and 2 (FLMCR1, FLMCR2) and erase block registers 1 and 2 (EBR1, EBR2) are reset (see table 19-53). Table 19-53 Hardware Protection Functions Item Description Program Erase FWE pin protection * When a low level is input to the FWE pin, FLMCR1, FLMCR2, EBR1, and EBR2 are initialized and the program/erase protected state is entered. Yes Yes Reset/standby protection * In a reset (including a WDT overflow reset) and in standby mode, FLMCR1, FLMCR2, EBR1, and EBR2 are initialized, and the program/erase-protected state is entered. Yes Yes * In a reset via the RES pin, the reset state is not entered unless the RES pin is held low until oscillation stabilizes after powering on. In the case of a reset during operation, hold the RES pin low for the RES pulse width specified in section 22.2.3, AC Characteristics. 19.26.2 Software Protection Software protection can be implemented by setting the SWE1 bit in flash memory control register 1 (FLMCR1), SWE2 bit in FLMCR2 erase block registers 1 and 2 (EBR1, EBR2), and the RAMS bit in the RAM emulation register (RAMER). When software protection is in effect, setting the P1 or E1 bit in FLMCR1, or the P2 or E2 bit in FLMCR2 does not cause a transition to program mode or erase mode (see table 19-54). Rev. 4.0, 03/03, page 853 of 1358 Table 19-54 Software Protection Functions Item Description Program Erase SWE bit protection * Clearing the SWE1 bit to 0 in FLMCR1 sets the program/erase-protected state for area H'000000 to H'03FFFF (Execute in on-chip RAM, external memory, or addresses H'040000 to H'07FFFF) Yes Yes -- Yes * Clearing the SWE2 bit to 0 in FLMCR2 sets the program/erase-protected state for area H'040000 to H'07FFFF (Execute in on-chip RAM, external memory, or addresses H'000000 to H'03FFFF) Block specification protection * Erase protection can be set for individual blocks by settings in erase block registers 1 and 2 (EBR1, EBR2). * Setting EBR1 and EBR2 to H'00 places all blocks in the erase-protected state. Emulation protection * Setting the RAMS bit to 1 in the RAM Yes emulation register (RAMER) places all blocks in the program/erase-protected state. Yes 19.26.3 Error Protection In error protection, an error is detected when MCU runaway occurs during flash memory programming/erasing, or operation is not performed in accordance with the program/erase algorithm, and the program/erase operation is aborted. Aborting the program/erase operation prevents damage to the flash memory due to overprogramming or overerasing. If the MCU malfunctions during flash memory programming/erasing, the FLER bit is set to 1 in FLMCR2 and the error protection state is entered. The FLMCR1, FLMCR2, EBR1, and EBR2 settings are retained, but program mode or erase mode is aborted at the point at which the error occurred. Program mode or erase mode cannot be re-entered by re-setting the P1, P2, E1, or E2 bit. However, PV1, PV2, EV1, and EV2 bit setting is enabled, and a transition can be made to verify mode. Rev. 4.0, 03/03, page 854 of 1358 FLER bit setting conditions are as follows: * When flash memory is read during programming/erasing (including a vector read or instruction fetch) * Immediately after exception handling (excluding a reset) during programming/erasing * When a SLEEP instruction (including software standby) is executed during programming/erasing * When the CPU loses the bus during programming/erasing Error protection is released only by a reset and in hardware standby mode. Figure 19-73 shows the flash memory state transition diagram. Normal operating mode Program mode Erase mode Reset or hardware standby (hardware protection) RES = 0 or STBY = 0 RD VF PR ER RD VF PR ER FLER = 0 Error occurrence (software standby) Error occurrence Error protection mode RD VF PR ER FLER = 1 FLER = 0 RES = 0 or STBY = 0 Software standby mode Software standby mode release RES = 0 or STBY = 0 FLMCR1, FLMCR2, EBR1, EBR2 initialization state Error protection mode (software standby) RD VF PR ER FLER = 1 FLMCR1, FLMCR2 (except FLER bit), EBR1, EBR2 initialization state Legend: RD: Memory read possible VF: Verify-read possible PR: Programming possible ER: Erasing possible RD: VF: PR: ER: Memory read not possible Verify-read not possible Programming not possible Erasing not possible Figure 19-73 Flash Memory State Transitions Rev. 4.0, 03/03, page 855 of 1358 19.27 Flash Memory Emulation in RAM 19.27.1 Emulation in RAM Making a setting in the RAM emulation register (RAMER) enables part of RAM to be overlapped onto the flash memory area so that data to be written to flash memory can be emulated in RAM in real time. After the RAMER setting has been made, accesses can be made from the flash memory area or the RAM area overlapping flash memory. Emulation can be performed in user mode and user program mode. Figure 19-74 shows an example of emulation of real-time flash memory programming. Start of emulation program Set RAMER Write tuning data to overlap RAM Execute application program No Tuning OK? Yes Clear RAMER Write to flash memory emulation block End of emulation program Figure 19-74 Flowchart for Flash Memory Emulation in RAM Rev. 4.0, 03/03, page 856 of 1358 19.27.2 RAM Overlap An example in which flash memory block area EB1 is overlapped is shown below. This area can be accessed from both the RAM area and flash memory area H'000000 EB0 H'001000 EB1 H'002000 EB2 H'030000 EB3 H'004000 EB4 H'005000 EB5 H'006000 EB6 H'007000 EB7 H'008000 H'FFDC00 H'FFEBFF Flash memory EB8 to EB15 On-chip RAM H'FFFBFF H'07FFFF Figure 19-75 Example of RAM Overlap Operation Example in which Flash Memory Block Area EB1 is Overlapped 1. Set bits RAMS, RAM2, RAM1, and RAM0 in RAMER to 1, 0, 0, 1, to overlap part of RAM onto the area (EB1) for which real-time programming is required. 2. Real-time programming is performed using the overlapping RAM. 3. After the program data has been confirmed, the RAMS bit is cleared, releasing RAM overlap. 4. The data written in the overlapping RAM is written into the flash memory space (EB1). Notes: 1. When the RAMS bit is set to 1, program/erase protection is enabled for all blocks regardless of the value of RAM2, RAM1, and RAM0 (emulation protection). In this state, setting the P1 or E1 bit in flash memory control register 1 (FLMCR1), or setting the P2 or E2 bit in FLMCR2 will not cause a transition to program mode or erase mode. When actually programming a flash memory area, the RAMS bit should be cleared to 0. Rev. 4.0, 03/03, page 857 of 1358 2. A RAM area cannot be erased by execution of software in accordance with the erase algorithm while flash memory emulation in RAM is being used. 3. Block area EB0 includes the vector table. When performing RAM emulation, the vector table is needed by the overlap RAM. 19.28 Interrupt Handling when Programming/Erasing Flash Memory All interrupts, including NMI input, are disabled when flash memory is being programmed or erased (when the P1 or E1 bit is set in FLMCR1, or the P2 or E2 bit is set in FLMCR2), and while the boot program is executing in boot mode*1, to give priority to the program or erase operation. There are three reasons for this: 1. Interrupt during programming or erasing might cause a violation of the programming or erasing algorithm, with the result that normal operation could not be assured. 2. In the interrupt exception handling sequence during programming or erasing, the vector would not be read correctly*2, possibly resulting in MCU runaway. 3. If an interrupt occurred during boot program execution, it would not be possible to execute the normal boot mode sequence. For these reasons, in on-board programming mode alone there are conditions for disabling interrupts, as an exception to the general rule. However, this provision does not guarantee normal erasing and programming or MCU operation. All requests, including NMI, must therefore be restricted inside and outside the MCU when programming or erasing flash memory. The NMI interrupt is also disabled in the error-protection state while the P1 or E1 bit remains set in FLMCR1, or the P2 or E2 bit remains set in FLMCR2. Notes: *1 Interrupt requests must be disabled inside and outside the MCU until the programming control program has completed programming. *2 The vector may not be read correctly in this case for the following two reasons: * If flash memory is read while being programmed or erased (while the P1 or E1 bit is set in FLMCR1, or the P2 or E2 bit is set in FLMCR2.), correct read data will not be obtained (undetermined values will be returned). * If the interrupt entry in the vector table has not been programmed yet, interrupt exception handling will not be executed correctly. Rev. 4.0, 03/03, page 858 of 1358 19.29 Flash Memory PROM Mode 19.29.1 PROM Mode Setting Programs and data can be written and erased in PROM mode as well as in the on-board programming modes. In PROM mode, the on-chip ROM can be freely programmed using a PROM programmer that supports the Hitachi microcomputer device type with 512-kbyte on-chip flash memory (FZTAT512V3A). Flash memory read mode, auto-program mode, auto-erase mode, and status read mode are supported with this device type. In auto-program mode, auto-erase mode, and status read mode, a status polling procedure is used, and in status read mode, detailed internal signals are output after execution of an auto-program or auto-erase operation. Table 19-55 shows PROM mode pin settings. Table 19-55 PROM Mode Pin Settings Pin Names Settings/External Circuit Connection Mode pins: MD2, MD1, MD0 Low-level input Mode setting pins: P66, P65, P64 High-level input to P66, low-level input to P65 and P64 FWE pin High-level input (in auto-program and auto-erase modes) STBY pin High-level input (do not select hardware standby mode) RES pin Reset circuit XTAL, EXTAL pins Oscillator circuit Other pins requiring setting: P32, P25 High-level input to P32, low-level input to P25 Rev. 4.0, 03/03, page 859 of 1358 19.29.2 Socket Adapters and Memory Map In PROM mode, a socket adapter is connected to the chip as shown in figure 19-77. Figure 19-76 shows the on-chip ROM memory map and figure 19-77 shows the socket adapter pin assignments. MCU mode address PROM mode address H'00000000 H'00000 On-chip ROM space 512 kbytes H'0007FFFF H'7FFFF Figure 19-76 Memory Map in PROM Mode Rev. 4.0, 03/03, page 860 of 1358 H8S/2326 F-ZTAT Socket Adapter (40-Pin Conversion) HN27C4096HG (40 Pins) TFP-120 FP-128B Pin Name Pin No. Pin Name 2 6 A0 21 A0 3 7 A1 22 A1 4 8 A2 23 A2 5 9 A3 24 A3 7 11 A4 25 A4 8 12 A5 26 A5 9 13 A6 27 A6 10 14 A7 28 A7 11 15 A8 29 A8 12 16 A9 31 A9 13 17 A10 32 A10 14 18 A11 33 A11 16 20 A12 34 A12 17 21 A13 35 A13 18 22 A14 36 A14 19 23 A15 37 A15 20 24 A16 38 A16 21 25 A17 39 A17 22 26 A18 10 A18 43 49 D8 19 I/O0 44 50 D9 18 I/O1 45 51 D10 17 I/O2 46 52 D11 16 I/O3 48 54 D12 15 I/O4 49 55 D13 14 I/O5 50 56 D14 13 I/O6 51 57 D15 12 76 69 77 67 75 CE OE WE I/O7 68 72 80 FWE 1, 30, 33, 52, 55,74, 5, 34, 39, 58, 61, 82, 75, 76, 81, 93, 94 83, 84, 89, 103, 104 6, 15, 24, 31, 32, 38, 3, 10, 19, 28, 35, 36, 47, 59, 66, 79, 103, 37, 38, 44, 53, 65, 104, 113, 114, 115 67, 68, 74, 87, 99, 100, 113, 114, 123, 124, 125 81 73 VCC 3 CE OE WE 2 20 4 FWE 1, 40 VCC 11, 30 VSS 5, 6, 7 NC 8 A20 VSS 9 Legend *1 FWE: Reset circuit RES I/O7 to I/O0: 85 77 XTAL A18 to A0: *2 Oscillation circuit CE: 86 78 EXTAL OE: Other pins NC (OPEN) WE: Notes: This figure shows pin assignments, and does not show the entire socket adapter circuit. *1 A reset oscillation stabilization time (tosc1) of at least 10 ms is required. *2 A 12 MHz crystal resonator should be used. A19 Flash write enable Data input/output Address input Chip enable Output enable Write enable Figure 19-77 H8S/2326 F-ZTAT Socket Adapter Pin Assignments Rev. 4.0, 03/03, page 861 of 1358 19.29.3 PROM Mode Operation Table 19-56 shows how the different operating modes are set when using PROM mode, and table 19-57 lists the commands used in PROM mode. Details of each mode are given below. Memory Read Mode: Memory read mode supports byte reads. Auto-Program Mode: Auto-program mode supports programming of 128 bytes at a time. Status polling is used to confirm the end of auto-programming. Auto-Erase Mode: Auto-erase mode supports automatic erasing of the entire flash memory. Status polling is used to confirm the end of auto-erasing. Status Read Mode: Status polling is used for auto-programming and auto-erasing, and normal termination can be confirmed by reading the I/O6 signal. In status read mode, error information is output if an error occurs. Table 19-56 Settings for Each Operating Mode in PROM Mode Pin Names Mode FWE CE OE WE I/O7 to I/O0 A18 to A0 Read H or L L L H Data output Ain Output disable H or L L H H Hi-Z X Command write 1 Chip disable* 3 H or L* L H L Data input Ain* H or L H X X Hi-Z X 2 Legend: H: High level L: Low level Hi-Z: High impedance X: Don't care Notes: *1 Chip disable is not a standby state; internally, it is an operation state. *2 Ain indicates that there is also address input in auto-program mode. *3 For command writes when making a transition to auto-program or auto-erase mode, input a high level to the FWE pin. Rev. 4.0, 03/03, page 862 of 1358 Table 19-57 PROM Mode Commands 1st Cycle 2nd Cycle Command Name Number of Cycles Mode Address Data Mode Address Data Memory read mode 1+n Write X H'00 Read RA Dout Auto-program mode 129 Write X H'40 Write PA Din Auto-erase mode 2 Write X H'20 Write X H'20 Status read mode 2 Write X H'71 Write X H'71 Legend: RA: Read address PA: Program address Notes: 1. In auto-program mode, 129 cycles are required for command writing by a simultaneous 128-byte write. 2. In memory read mode, the number of cycles depends on the number of address write cycles (n). 19.29.4 Memory Read Mode * After the end of an auto-program, auto-erase, or status read operation, the command wait state is entered. To read memory contents, a transition must be made to memory read mode by means of a command write before the read is executed. * Command writes can be performed in memory read mode, just as in the command wait state. * Once memory read mode has been entered, consecutive reads can be performed. * After power-on, memory read mode is entered. Table 19-58 AC Characteristics in Memory Read Mode (Conditions: VCC = 3.3 V 0.3 V, VSS = 0 V, Ta = 25C 5C) Item Symbol Min Max Unit Command write cycle tnxtc 20 -- s CE hold time tceh 0 -- ns CE setup time tces 0 -- ns Data hold time tdh 50 -- ns Data setup time tds 50 -- ns Write pulse width twep 70 -- ns WE rise time tr -- 30 ns WE fall time tf -- 30 ns Rev. 4.0, 03/03, page 863 of 1358 Memory read mode Command write A18 to A0 Address stable CE OE WE twep tceh tnxtc tces tf tr Data Data H'00 tdh tds Note: Data is latched at the rising edge of WE. Figure 19-78 Memory Read Mode Timing Waveforms after Command Write Table 19-59 AC Characteristics when Entering Another Mode from Memory Read Mode (Conditions: VCC = 3.3 V 0.3 V, VSS = 0 V, Ta = 25C 5C) Item Symbol Min Max Unit Command write cycle tnxtc 20 -- s CE hold time tceh 0 -- ns CE setup time tces 0 -- ns Data hold time tdh 50 -- ns Data setup time tds 50 -- ns Write pulse width twep 70 -- ns WE rise time tr -- 30 ns WE fall time tf -- 30 ns Rev. 4.0, 03/03, page 864 of 1358 Other mode command write Memory read mode A18 to A0 Address stable tces tnxtc tceh CE OE tf twep tr WE tds tdh I/O7 to I/O0 Note: Do not enable WE and OE at the same time. Figure 19-79 Timing Waveforms when Entering Another Mode from Memory Read Mode Table 19-60 AC Characteristics in Memory Read Mode (Conditions: VCC = 3.3 V 0.3 V, VSS = 0 V, Ta = 25C 5C) Item Symbol Min Max Unit Access time tacc -- 20 s CE output delay time tce -- 150 ns OE output delay time toe -- 150 ns Output disable delay time tdf -- 100 ns Data output hold time toh 5 -- ns A18 to A0 Address stable CE VIL OE VIL WE VIH tacc Address stable toh tacc toh I/O7 to I/O0 Figure 19-80 Timing Waveforms for CE/OE CE OE Enable State Read Rev. 4.0, 03/03, page 865 of 1358 Address stable A18 to A0 Address stable tce tce CE WE toe toe OE VIH tacc tacc toh tdf toh tdf I/O7 to I/O0 Figure 19-81 Timing Waveforms for CE/OE CE OE Clocked Read 19.29.5 Auto-Program Mode * In auto-program mode, 128 bytes are programmed simultaneously. For this purpose, 128 consecutive byte data transfers should be performed. * A 128-byte data transfer must be performed even if writing fewer than 128 bytes; in this case, H'FF data must be written to the extra addresses. * The lower 7 bits of the transfer address must be held low. If an invalid address is input, memory programming will be started but a programming error will occur. * Memory address transfer is executed in the second cycle (figure 19-82). Do not perform transfer later than the second cycle. * Do not perform a command write during a programming operation. * Perform one auto-programming operation for a 128-byte block for each address. One or more additional programming operations cannot be carried out on address blocks that have already been programmed. * Confirm normal end of auto-programming by checking I/O6. Alternatively, status read mode can also be used for this purpose (the I/O7 status polling pin is used to identify the end of an autoprogram operation). * Status polling I/O6 and I/O7 information is retained until the next command write. As long as the next command write has not been performed, reading is possible by enabling CE and OE. Rev. 4.0, 03/03, page 866 of 1358 AC Characteristics Table 19-61 AC Characteristics in Auto-Program Mode (Conditions: VCC = 3.3 V 0.3 V, VSS = 0 V, Ta = 25C 5C) Item Symbol Min Max Unit Command write cycle tnxtc 20 -- s CE hold time tceh 0 -- ns CE setup time tces 0 -- ns Data hold time tdh 50 -- ns Data setup time tds 50 -- ns Write pulse width twep 70 -- ns Status polling start time twsts 1 -- ms Status polling access time tspa -- 150 ns Address setup time tas 0 -- ns Address hold time tah 60 -- ns Memory write time twrite 1 3000 ms WE rise time tr -- 30 ns WE fall time tf -- 30 ns Write setup time tpns 100 -- ns Write end setup time tpnh 100 -- ns FWE tpnh Address stable A18 to A0 tpns tces tceh tnxtc tnxtc CE OE tf twep tas tr WE tah twsts tspa Data transfer 1 byte to 128 bytes tds tdh twrite I/O7 Programming operation end identification signal I/O6 Programming normal end identification signal I/O5 to I/O0 H'00 H'40 Figure 19-82 Auto-Program Mode Timing Waveforms Rev. 4.0, 03/03, page 867 of 1358 19.29.6 Auto-Erase Mode * Auto-erase mode supports only total memory erasing. * Do not perform a command write during auto-erasing. * Confirm normal end of auto-erasing by checking I/O6. Alternatively, status read mode can also be used for this purpose (the I/O7 status polling pin is used to identify the end of an auto-erase operation). * Status polling I/O6 and I/O7 pin information is retained until the next command write. As long as the next command write has not been performed, reading is possible by enabling CE and OE. AC Characteristics Table 19-62 AC Characteristics in Auto-Erase Mode (Conditions: VCC = 3.3 V 0.3 V, VSS = 0 V, Ta = 25C 5C) Item Symbol Min Max Unit Command write cycle tnxtc 20 -- s CE hold time tceh 0 -- ns CE setup time tces 0 -- ns Data hold time tdh 50 -- ns Data setup time tds 50 -- ns Write pulse width twep 70 -- ns Status polling start time tests 1 -- ms Status polling access time tspa -- 150 ns Memory erase time terase 100 40000 ms WE rise time tr -- 30 ns WE fall time tf -- 30 ns Erase setup time tens 100 -- ns Erase end setup time tenh 100 -- ns Rev. 4.0, 03/03, page 868 of 1358 tenh FWE A18 to A0 tens tces tnxtc tceh tnxtc CE OE tf WE twep tests tr tds tspa terase tdh I/O7 Erase end identification signal I/O6 Erase normal end confirmation signal H'20 I/O5 to I/O0 H'00 H'20 Figure 19-83 Auto-Erase Mode Timing Waveforms 19.29.7 Status Read Mode * Status read mode is used to identify what type of abnormal end has occurred. Use this mode when an abnormal end occurs in auto-program mode or auto-erase mode. * The return code is retained until a command write for other than status read mode is performed. Table 19-63 AC Characteristics in Status Read Mode (Conditions: VCC = 3.3 V 0.3 V, VSS = 0 V, Ta = 25C 5C) Item Symbol Min Max Unit Command write cycle tnxtc 20 -- s CE hold time tceh 0 -- ns CE setup time tces 0 -- ns Data hold time tdh 50 -- ns Data setup time tds 50 -- ns Write pulse width twep 70 -- ns OE output delay time toe -- 150 ns Disable delay time tdf -- 100 ns CE output delay time tce -- 150 ns WE rise time tr -- 30 ns WE fall time tf -- 30 ns Rev. 4.0, 03/03, page 869 of 1358 A18 to A0 tceh tnxtc tces tces CE tceh tnxtc tnxtc tce OE tf WE twep tr tdh tds twep tf tds H'71 I/O7 to I/O0 toe tr tdf tdh H'71 Note: I/O3 and I/O2 are undefined. Figure 19-84 Status Read Mode Timing Waveforms Table 19-64 Status Read Mode Return Commands Pin Name I/O7 Attribute I/O6 Normal Command end error identification Initial value 0 0 Indications Normal end: 0 Command error: 1 Abnormal end: 1 I/O5 I/O4 I/O3 I/O2 I/O1 Programming error Erase error -- -- ProgramEffective ming or address erase count error exceeded 0 0 0 0 0 -- Count Effective exceeded: 1 address Otherwise: 0 error: 1 Erase -- Programerror: 1 ming Otherwise: 0 Otherwise: 0 error: 1 Otherwise: 0 I/O0 0 Otherwise: 0 Note: I/O3 and I/O2 are undefined. 19.29.8 Status Polling * The I/O7 status polling flag indicates the operating status in auto-program or auto-erase mode. * The I/O6 status polling flag indicates a normal or abnormal end in auto-program or auto-erase mode. Table 19-65 Status Polling Output Truth Table Pin Names Internal Operation in Progress Abnormal End -- Normal End I/O7 0 1 0 1 I/O6 0 0 1 1 I/O0 to I/O5 0 0 0 0 Rev. 4.0, 03/03, page 870 of 1358 19.29.9 PROM Mode Transition Time Commands cannot be accepted during the oscillation stabilization period or the PROM mode setup period. After the PROM mode setup time, a transition is made to memory read mode. Table 19-66 Command Wait State Transition Time Specifications Item Symbol Min Max Unit Standby release (oscillation stabilization time) tosc1 30 -- ms PROM mode setup time tbmv 10 -- ms VCC hold time tdwn 0 -- ms Memory read mode tosc1 tbmv Command wait state Auto-program mode Auto-erase mode Command wait state Normal/ abnormal end identification tdwn VCC RES FWE Note: Except in auto-program mode and auto-erase mode, drive the FWE input pin low. Figure 19-85 Oscillation Stabilization Time, PROM Mode Setup Time, and Power Supply Fall Sequence 19.29.10 Notes on Memory Programming * When programming addresses which have previously been programmed, carry out auto-erasing before auto-programming. * When performing programming using PROM mode on a chip that has been programmed/erased in an on-board programming mode, auto-erasing is recommended before carrying out autoprogramming. Notes: 1. The flash memory is initially in the erased state when the device is shipped by Hitachi. For other chips for which the erasure history is unknown, it is recommended that autoerasing be executed to check and supplement the initialization (erase) level. 2. Auto-programming should be performed once only on the same address block. Additional programming cannot be carried out on address blocks that have already been programmed. Rev. 4.0, 03/03, page 871 of 1358 19.30 Flash Memory Programming and Erasing Precautions Precautions concerning the use of on-board programming mode, the RAM emulation function, and PROM mode are summarized below. Use the specified voltages and timing for programming and erasing: Applied voltages in excess of the rating can permanently damage the device. Use a PROM programmer that supports the Hitachi microcomputer device type with 512-kbyte on-chip flash memory (FZTAT512V3A). Do not select the HN27C4096 setting for the PROM programmer, and only use the specified socket adapter. Failure to observe these points may result in damage to the device. Powering on and off (see figures 19-86 to 19-88): Do not apply a high level to the FWE pin until VCC has stabilized. Also, drive the FWE pin low before turning off VCC. When applying or disconnecting VCC power, fix the FWE pin low and place the flash memory in the hardware protection state. The power-on and power-off timing requirements should also be satisfied in the event of a power failure and subsequent recovery. FWE application/disconnection (see figures 19-86 to 19-88): FWE application should be carried out when MCU operation is in a stable condition. If MCU operation is not stable, fix the FWE pin low and set the protection state. The following points must be observed concerning FWE application and disconnection to prevent unintentional programming or erasing of flash memory: * Apply FWE when the VCC voltage has stabilized within its rated voltage range. * Apply FWE when oscillation has stabilized (after the elapse of the oscillation stabilization time). * In boot mode, apply and disconnect FWE during a reset. * In user program mode, FWE can be switched between high and low level regardless of the reset state. FWE input can also be switched during execution of a program in flash memory. * Do not apply FWE if program runaway has occurred. * Disconnect FWE only when the SWE1, ESU1, PSU1, EV1, PV1, P1, and E1 bits in FLMCR1, and SWE2, ESU2, PSU2, EV2, PV2, P2, and E2 bits in FLMCR2 are cleared. Make sure that the SWE1, ESU1, PSU1, EV1, PV1, P1, E1, and SWE2, ESU2, PSU2, EV2, PV2, P2, and E2 bits are not set by mistake when applying or disconnecting FWE. Rev. 4.0, 03/03, page 872 of 1358 Do not apply a constant high level to the FWE pin: Apply a high level to the FWE pin only when programming or erasing flash memory. A system configuration in which a high level is constantly applied to the FWE pin should be avoided. Also, while a high level is applied to the FWE pin, the watchdog timer should be activated to prevent overprogramming or overerasing due to program runaway, etc. Use the recommended algorithm when programming and erasing flash memory: The recommended algorithm enables programming and erasing to be carried out without subjecting the device to voltage stress or sacrificing program data reliability. When setting the P1 or E1 bit in FLMCR1 or the P2 or E2 bit in FLMCR2, the watchdog timer should be set beforehand as a precaution against program runaway, etc. Notes on setting/clearing of bits SWE1 and SWE2: Do not set or clear the SWE1 bit or SWE2 bit during execution of a program in flash memory. Wait for at least 100 s after clearing the SWE1 bit or SWE2 bit before executing a program or reading data in flash memory. When the SWE1 bit or SWE2 bit is set, data in flash memory can be rewritten, but flash memory addresses H'000000 to H'03FFFF can only be read in program-verify or erase-verify mode when SWE1 = 1, and flash memory addresses H'040000 to H'07FFFF can only be read in program-verify or erase-verify mode when SWE2 = 1. Access the relevant address area in flash memory only for verify operations (verification during programming/erasing). Also, do not clear the SWE1 bit or SWE2 bit during programming, erasing, or verifying. Similarly, when using the RAM emulation function while a high level is being input to the FWE pin, the SWE1 bit must be cleared before executing a program or reading data in flash memory. However, the RAM area overlapping flash memory space can be read and written to regardless of whether the SWE1 bit is set or cleared. Do not use interrupts while flash memory is being programmed or erased: All interrupt requests, including NMI, should be disabled during FWE application to give priority to program/erase operations. Do not perform additional programming. Erase the memory before reprogramming: In onboard programming, perform only one programming operation on a 128-byte programming unit block. In PROM mode, too, perform only one programming operation on a 128-byte programming unit block. Programming should be carried out with the entire programming unit block erased. Before programming, check that the chip is correctly mounted in the PROM programmer: Overcurrent damage to the device can result if the index marks on the PROM programmer socket, socket adapter, and chip are not correctly aligned. Do not touch the socket adapter or chip during programming: Touching either of these can cause contact faults and write errors. Rev. 4.0, 03/03, page 873 of 1358 Wait time: x Programming/ erasing possible Wait time: 100 ms f Min 0 ms tOSC1 VCC tMDS*3 FWE Min 0 ms MD2 to MD0*1 tMDS*3 RES SWE set SWE cleared SWE bit Period during which flash memory access is prohibited (x: Wait time after setting SWE bit)*2 Period during which flash memory can be programmed (Execution of program in flash memory prohibited, and data reads other than verify operations prohibited) Notes: *1 Except when switching modes, the level of the mode pins (MD2 to MD0) must be fixed until power-off by pulling the pins up or down. *2 See section 22.2.6, Flash Memory Characteristics. *3 Mode programming setup time tMDS (min) = 200 ns Figure 19-86 Power-On/Off Timing (Boot Mode) Rev. 4.0, 03/03, page 874 of 1358 Wait time: x Programming/ erasing possible Wait time: 100 ms f Min 0 ms tOSC1 VCC FWE MD2 to MD0*1 tMDS*3 RES SWE set SWE cleared SWE bit Period during which flash memory access is prohibited (x: Wait time after setting SWE bit)*2 Period during which flash memory can be programmed (Execution of program in flash memory prohibited, and data reads other than verify operations prohibited) Notes: *1 Except when switching modes, the level of the mode pins (MD2 to MD0) must be fixed until power-off by pulling the pins up or down. *2 See section 22.2.6, Flash Memory Characteristics. *3 Mode programming setup time tMDS (min) = 200 ns Figure 19-87 Power-On/Off Timing (User Program Mode) Rev. 4.0, 03/03, page 875 of 1358 Wait time: 100 ms Wait time: x Programming/erasing possible Wait time: 100 ms Wait time: x Programming/erasing possible Wait time: 100 ms Wait time: x Programming/erasing possible Wait time: 100 ms Wait time: x Programming/erasing possible f tOSC1 VCC Min 0 ms FWE tMDS tMDS*2 MD2 to MD0 tMDS tRESW RES SWE bit SWE set Mode change*1 SWE cleared Boot mode Mode User change*1 mode User program mode User mode User program mode Period during which flash memory access is prohibited (x: Wait time after setting SWE bit)*3 Period during which flash memory can be programmed (Execution of program in flash memory prohibited, and data reads other than verify operations prohibited) Notes: *1 When entering boot mode or making a transition from boot mode to another mode, mode switching must be carried out by means of RES input. The state of ports with multiplexed address functions and bus control output pins (AS, RD, WR) will change during this switchover interval (the interval during which the RES pin input is low), and therefore these pins should not be used as output signals during this time. *2 When making a transition from boot mode to another mode, a mode programming setup time tMDS (min) of 200 ns is necessary with respect to RES clearance timing. *3 See section 22.2.6, Flash Memory Characteristics. Figure 19-88 Mode Transition Timing (Example: Boot Mode User Mode User Program Mode) Rev. 4.0, 03/03, page 876 of 1358 19.31 Overview of Flash Memory (H8S/2326C F-ZTAT) 19.31.1 Features This LSI has an on-chip 512-kbyte flash memory. The flash memory has the following features. * Two flash-memory MATs according to LSI initiation mode The on-chip flash memory has two memory spaces in the same address space (hereafter referred to as memory MATs). The mode setting in the initiation determines which memory MAT is initiated first. The MAT can be switched by using the bank-switching method after initiation. The user memory MAT is initiated at a power-on reset in user mode: 512 kbytes The user boot memory MAT is initiated at a power-on reset in user boot mode:8 kbytes * On-board programming modes Boot mode This mode is a program mode that uses an on-chip SCI interface. The user MAT and user boot MAT can be programmed. This mode can automatically adjust the bit rate between host and this LSI. User program mode The user MAT can be programmed by using the optional interface. User boot mode The user boot program of the optional interface can be made and the user MAT can be programmed. * PROM mode This mode uses the PROM programmer. The user MAT and user boot MAT can be programmed. * Programming/erasing interface by the download of on-chip program This LSI has a dedicated programming/erasing program. After downloading this program to the on-chip RAM, programming/erasing can be performed by setting the argument parameter. * Emulation function of flash memory by using the on-chip RAM As flash memory is overlapped with part of the on-chip RAM, the flash memory programming can be emulated in real time. * Protection modes There are two protection modes: software protection by the register setting and hardware protection by reset/hardware standby. The protection state for flash memory programming/erasing can be set. When abnormalities, such as runaway of programming/erasing are detected, these modes enter the error protection state and the programming/erasing processing is suspended. Rev. 4.0, 03/03, page 877 of 1358 * Programming/erasing time The flash memory programming time is TBD ms (typ) in 128-byte simultaneous programming and TBD s per byte. The erasing time is TBD ms (typ) per block. * Number of programming The number of flash memory programming can be up to 100 times. Rev. 4.0, 03/03, page 878 of 1358 19.31.2 Overview (1) Block Diagram Internal address bus Internal data bus (16 bits) FCCS FPCS Module bus FECS FKEY Memory MAT unit Control unit FMATS User MAT: 512 kbytes User boot MAT: 8 kbytes FTDAR RAMER Flash memory Mode pin Legend FCCS: FPCS: FECS: FKEY: FMATS: FTDAR: RAMER: Operating mode Flash code control and status register Flash program code select register Flash erase code select register Flash key code register Flash MAT select register Flash transfer destination address register RAM emulation register Note: To read from or write to any of the registers above except RAMER, the FLSHE bit in system control register 2 (SYSCR2) must be set to 1. Figure 19-89 Block Diagram of Flash Memory Rev. 4.0, 03/03, page 879 of 1358 19.31.3 Operating Mode of Flash Memory When each mode pin is set in the reset state and reset start is performed, the microcomputer enters each operating mode as shown in figure 19-90. For the setting of each mode pin, see table 19-73. * Flash memory cannot be read, programmed, or erased in ROM invalid mode. * Flash memory can be read in user mode, but cannot be programmed or erased. * Flash memory can be read, programmed, or erased on the board only in user program mode, user boot mode, and boot mode. * Flash memory can be read, programmed, or erased by means of the PROM programmer in PROM mode. RES=0 RES=0 ROM invalid mode ROM invalid mode setting =0 =0 RE Bo ot S=0 mo 0 U RES d mo S= es PROM mode PROM mode setting RE r se g in ett ot ng bo tti er se Us ode m S RE Reset state de se ttin g FLSHE=0 User mode FLSHE=1 User program mode User boot mode RAM emulation is enabled On-board programming mode Figure 19-90 Mode Transition of Flash Memory Rev. 4.0, 03/03, page 880 of 1358 Boot mode 19.31.4 Mode Comparison The comparison table of programming and erasing related items about boot mode, user program mode, user boot mode, and PROM mode is shown in table 19-67. Table 19-67 Comparison of Programming Modes Boot mode User program mode User boot mode PROM mode Programming/ Erasing Environment On-board programming On-board programming On-board programming On-board programming Programming/ Erasing Enable MAT User MAT User boot MAT User MAT User MAT User MAT User boot MAT All Erasure (Automatic) *1 Block Division Erasure (Automatic) x Program Data Transfer From host via SCI From optional device via RAM From optional device via RAM Via PROM programmer RAM Emulation x x x Embedded program storage MAT User MAT 2 User boot MAT* -- FLSHE bit setting change Mode setting change and reset -- Reset Initiation MAT Transition to User Mode setting Mode change and reset Notes: *1 All-erasure is performed. After that, the specified block can be erased. *2 Initiation starts from the embedded program storage MAT. After checking the flashmemory related registers, initiation starts from the reset vector of the user MAT. * The user boot MAT can be programmed or erased only in boot mode and PROM mode. * The user MAT and user boot MAT are erased in boot mode. Then, the user MAT and user boot MAT can be programmed by means of the command method. However, the contents of the MAT cannot be read until this state. Only user boot MAT is programmed and the user MAT is programmed in user boot mode or only user MAT is programmed because user boot mode is not used. * The boot operation of the optional interface can be performed by the mode pin setting different from user program mode in user boot mode. Rev. 4.0, 03/03, page 881 of 1358 19.31.5 Flash MAT Configuration This LSI's flash memory is configured by the 512-kbyte user MAT and 8-kbyte user boot MAT. The start address is allocated to the same address in the user MAT and user boot MAT. Therefore, when the program execution or data access is performed between two MATs, the MAT must be switched by using FMATS. The user MAT or user boot MAT can be read in all modes if it is in ROM valid mode. However, the user boot MAT can be programmed only in boot mode and PROM mode. <User MAT> <User Boot MAT> Address H'000000 Address H'000000 8 kbytes Address H'001FFF 512 kbytes Address H'07FFFF Figure 19-91 Flash Memory Configuration The user MAT and user boot MAT have different memory sizes. Do not access a user boot MAT that is 8 kbytes or more. When a user boot MAT exceeding 8 kbytes is read from, an undefined value is read. 19.31.6 Block Division The user MAT is divided into 64 kbytes (seven blocks), 32 kbytes (one block), and 4 kbytes (eight blocks) as shown in figure 19-92. The user MAT can be erased in this divided-block units and the erase-block number of EB0 to EB15 is specified when erasing. The RAM emulation can be performed in the eight blocks of 4 kbytes. Rev. 4.0, 03/03, page 882 of 1358 <User MAT> Address H'000000 4 kbytes 8 Erase block EB0 to * 512 kbytes EB7 Address H'07FFFF 32 kbytes EB8 64 kbytes EB9 64 kbytes EB10 64 kbytes EB11 64 kbytes EB12 64 kbytes EB13 64 kbytes EB14 64 kbytes EB15 Note: * The RAM emulation can be performed in the eight blocks of 4 kbytes. Figure 19-92 Block Division of User MAT 19.31.7 Programming/Erasing Interface Programming/erasing is executed by downloading the on-chip program to the on-chip RAM and specifying the program address/data and erase block by using the interface register/parameter. The procedure program is made by the user in user program mode and user boot mode. The overview of the procedure is as follows. For details, see section 19.33.2, User Program Mode. Rev. 4.0, 03/03, page 883 of 1358 Start user procedure program for programming/erasing Select on-chip program to be downloaded and set download destination Download on-chip program by setting FKEY and the SCO bits Initialization execution (download program execution) Programming (in 128-byte units) or erasing (in one-block units) (download program execution) No Programming/erasing completed? Yes End user procedure program Figure 19-93 Overview of User Procedure Program 1. Selection of on-chip program to be downloaded and setting of download destination This LSI has programming/erasing programs and they can be downloaded to the on-chip RAM. The on-chip program to be downloaded is selected by setting the corresponding bits in the programming/erasing interface register. The download destination can be specified by FTDAR. 2. Download of on-chip program The on-chip program is automatically downloaded by setting the SCO bit in the flash key code register (FKEY) and the flash code control and status register (FCCS), which are programming/erasing interface registers. The user MAT is replaced to the embedded program storage area when downloading. Since the flash memory cannot be read when programming/erasing, the procedure program, which is working from download to completion of programming/erasing, must be executed in a space other than the flash memory to be programmed/erased (for example, on-chip RAM). Since the result of download is returned to the programming/erasing interface parameters, whether the normal download is executed or not can be confirmed. Rev. 4.0, 03/03, page 884 of 1358 3. Initialization of programming/erasing The operating frequency is set before execution of programming/erasing. This setting is performed by using the programming/erasing interface parameters. 4. Programming/erasing execution To program or erase, the FLSHE bit in system control register 2 (SYSCR2) must be set to 1 and the user program mode must be entered. The program data/programming destination address is specified in 128-byte units when programming. The block to be erased is specified in erase-block units when erasing. These specifications are set by using the programming/erasing interface parameters and the onchip program is initiated. The on-chip program is executed by using the JSR or BSR instruction to perform the subroutine call of the specified address in the on-chip RAM. The execution result is returned to the programming/erasing interface parameters. The area to be programmed must be erased in advance when programming flash memory. All interrupts are prohibited during programming and erasing. Interrupts must not occur in the user system. 5. When programming/erasing is executed consecutively When the processing is not ended by the 128-byte programming or one-block erasure, the program address/data and erase-block number must be updated and consecutive programming/erasing is required. Since the downloaded on-chip program is left in the on-chip RAM after the processing, download and initialization are not required when the same processing is executed consecutively. Rev. 4.0, 03/03, page 885 of 1358 19.31.8 Pin Configuration Flash memory is controlled by the pin as shown in table 19-68. Table 19-68 Pin Configuration Pin Name Abbreviation Input/Output Function Reset RES Input Reset Mode 2 MD2 Input Sets operating mode of this LSI Mode 1 MD1 Input Sets operating mode of this LSI Mode 0 MD0 Input Sets operating mode of this LSI Port 66 P66 Input Sets operating mode of this LSI (used in PROM mode) Port 65 P65 Input Sets operating mode of this LSI (used in PROM mode) Port 64 P64 Input Sets operating mode of this LSI (used in PROM mode) Transmit data TxD1 Output Serial transmit data output Receive data RxD1 Input Serial receive data input Note: For the pin configuration in PROM mode, see section 19.37, PROM Mode. 19.31.9 Register Configuration (1) Registers The registers/parameters which control flash memory when the on-chip flash memory is valid are shown in table 19-69. To access any of the flash memory control registers except RAMER, the FLSHE bit in SYSCR2 must be set to 1 in a mode in which flash memory is enabled. There are several operating modes for accessing flash memory, for example, read mode/program mode. There are two memory MATs: user MAT and user boot MAT. The dedicated registers/parameters are allocated for each operating mode and MAT selection. The correspondence of operating modes and registers/parameters for use is shown in table 19-70. Rev. 4.0, 03/03, page 886 of 1358 Table 19-69 (1) Register Configuration Name Abbreviation R/W Flash code control status register FCCS R, W Flash program code select register FPCS R/W *1 Initial Value Address H'00 H'80 H'FFC4 H'00 H'FFC5 Flash erase code select register FECS R/W H'00 H'FFC6 Flash key code register FKEY R/W H'00 H'FFC8 Flash MAT select register FMATS R/W H'00* 2 H'AA* H'FFC9 Flash transfer destination address register FTDAR R/W H'00 H'FFCA System control register 2 SYSCR2 * R/W H'00 H'FF42 RAM emulation register RAMER R/W H'00 H'FEDB 3 2 Notes: *1 The bits except the SCO bit are read-only bits. The SCO bit is a programming-only bit. (The value which can be read is always 0.) *2 The initial value at initiation in user mode or user program mode is H'00. The initial value at initiation in user boot mode is H'AA. *3 The SYSCR2 register can only be used in the F-ZTAT version. Table 19-69 (2) Parameter Configuration Name Abbreviation R/W Initial Value Address Download pass/fail result DPFR R/W Undefined On-chip RAM* Flash pass/fail result FPFR R/W Undefined R0L of CPU Flash multipurpose address area FMPAR R/W Undefined ER1 of CPU Flash multipurpose data destination area FMPDR R/W Undefined ER0 of CPU Flash erase block select FEBS R/W Undefined ER0 of CPU Flash program and erase frequency control FPEFEQ R/W Undefined ER0 of CPU Note: * One byte of the start address in the on-chip RAM area specified by FTDAR is valid. Rev. 4.0, 03/03, page 887 of 1358 Table 19-70 Register/Parameter and Target Mode Initialization Programming Erasure Read RAM Emulation FCCS -- -- -- -- -- FPCS -- -- -- -- -- PECS -- -- -- -- -- FKEY -- Download Programming/ erasing interface registers FMATS Programming/ erasing interface parameter RAM emulation -- -- *1 -- *1 FPFR FPEFEQ -- -- -- *2 -- -- -- -- -- -- FMPAR -- -- -- -- -- FMPDR -- -- -- -- -- FEBS -- -- -- -- -- RAMER -- -- -- -- -- Notes: *1 The setting is required when programming or erasing user MAT in user boot mode. *2 The setting may be required according to the combination of initiation mode and read target MAT. 19.32 Register Description of Flash Memory 19.32.1 Programming/Erasing Interface Register The programming/erasing interface registers are as described below. They are all 8-bit registers that can be accessed in byte. Except for the FLER bit in FCCS, these registers are initialized at a power-on reset, in hardware standby mode, or in software standby mode. The FLER bit is not initialized in software standby mode. (1) Flash Code Control and Status Register (FCCS) FCCS is configured by bits which request the error occurrence during programming or erasing flash memory and the download of on-chip program. Bit : 7 6 5 4 3 2 1 0 -- -- -- FLER -- -- -- SCO Initial value : 1 0 0 0 0 0 0 0 R/W R R R R R R R (R)/W : Bit 7--Reserved: This bit is always read as 1. The write value should always be 1. Rev. 4.0, 03/03, page 888 of 1358 Bits 6 and 5--Reserved: These bits are always read as 0. The write value should always be 0. Bit 4--Flash Memory Error (FLER): Indicates an error occurs during programming and erasing flash memory. When FLER is set to 1, flash memory enters the error protection state. This bit is initialized at a power-on reset or in hardware standby mode. When FLER is set to 1, high voltage is applied to the internal flash memory. To reduce the damage to flash memory, the reset must be released after the reset period of 100 s which is longer than normal. Bit 4 FLER Description 0 Flash memory operates normally (Initial value) Programming/erasing protection for flash memory (error protection) is invalid. [Clearing condition] At a power-on reset or in hardware standby mode 1 Indicates an error occurs during programming/erasing flash memory. Programming/erasing protection for flash memory (error protection) is valid. [Setting condition] See section 19.34.3, Error Protection. Bits 3 to 1--Reserved: These bits are always read as 0. The write value should always be 0. Bit 0--Source Program Copy Operation (SCO): Requests the on-chip programming/erasing program to be downloaded to the on-chip RAM. When this bit is set to 1, the on-chip program which is selected by FPCS/FECS is automatically downloaded in the on-chip RAM area specified by FTDAR. In order to set this bit to 1, RAM emulation state must be canceled, H'A5 must be written to FKEY, and this operation must be in the on-chip RAM. Four NOP instructions must be executed immediately after setting this bit to 1. Since this bit is cleared to 0 when download is completed, this bit cannot be read as 1. All interrupts are prohibited during programming and erasing. Interrupts must not occur in the user system. Rev. 4.0, 03/03, page 889 of 1358 Bit 0 SCO Description 0 Download of the on-chip programming/erasing program to the on-chip RAM is not executed (Initial value) [Clear condition] When download is completed 1 Request that the on-chip programming/erasing program is downloaded to the onchip RAM is occurred [Set conditions] When all of the following conditions are satisfied and 1 is written to this bit * FKEY is written to H'A5 * During execution in the on-chip RAM * Not in RAM emulation mode (RAMS in RAMER = 0) (2) Flash Program Code Select Register (FPCS) FPCS selects the on-chip programming program to be downloaded. Bit : 7 6 5 4 3 2 1 0 -- -- -- -- -- -- -- PPVS Initial value : 0 0 0 0 0 0 0 0 R/W R R R R R R R R/W : Bits 7 to 1--Reserved: These bits are always read as 0. The write value should always be 0. Bit 0--Program Pulse Verify (PPVS): Selects the programming program. Bit 0 PPVS Description 0 On-chip programming program is not selected [Clear condition] When transfer is completed 1 On-chip programming program is selected Rev. 4.0, 03/03, page 890 of 1358 (Initial value) (3) Flash Erase Code Select Register (FECS) FECS selects download of the on-chip erasing program. Bit : 7 6 5 4 3 2 1 0 -- -- -- -- -- -- -- EPVB Initial value : 0 0 0 0 0 0 0 0 R/W R R R R R R R R/W : Bits 7 to 1--Reserved: These bits are always read as 0. The write value should always be 0. Bit 0--Erase Pulse Verify Block (EPVB): Selects the erasing program. Bit 0 EPVB Description 0 On-chip erasing program is not selected (Initial value) [Clear condition] When transfer is completed 1 On-chip erasing program is selected (4) Flash Key Code Register (FKEY) FKEY is a register for software protection that enables download of on-chip program and programming/erasing of flash memory. Before setting the SCO bit to 1 in order to download onchip program or executing the downloaded programming/erasing program, these processing cannot be executed if the key code is not written. Bit : Initial value : R/W : 7 6 5 4 3 2 1 0 K7 K6 K5 K4 K3 K2 K1 K0 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W Bits 7 to 0--Key Code (K7 to K0): Only when H'A5 is written, writing to the SCO bit is valid. When the value other than H'A5 is written to FKEY, 1 cannot be written to the SCO bit. Therefore downloading to the on-chip RAM cannot be executed. Only when H'5A is written, programming/erasing can be executed. Even if the on-chip programming/erasing program is executed, flash memory cannot be programmed or erased when the value other than H'5A is written to FKEY. Rev. 4.0, 03/03, page 891 of 1358 Bits 7 to 0 K7 to K0 Description H'A5 Writing to the SCO bit is enabled (The SCO bit cannot be set by the value other than H'A5.) H'5A Programming/erasing is enabled (The value other than H'5A is in software protection state.) H'00 Initial value (5) Flash MAT Select Register (FMATS) FMATS specifies whether user MAT or user boot MAT is selected. Bit 7 6 5 4 3 2 1 0 MS7 MS6 MS5 MS4 MS3 MS2 MS1 MS0 Initial value : 0 0 0 0 0 0 0 0 (When not in user boot mode) Initial value : 1 (When in user boot mode) R/W : : R/W 0 1 0 1 0 1 0 R/W R/W R/W R/W R/W R/W R/W Bits 7 to 0--MAT Select (MS7 to MS0): These bits are in user-MAT selection state when the value other than H'AA is written and in user-boot-MAT selection state when H'AA is written. The MAT is switched by writing the value in FMATS. When the MAT is switched, follow section 19.36, Switching between User MAT and User Boot MAT. (The user boot MAT cannot be programmed in user programming mode if user boot MAT is selected by FMATS. The user boot MAT must be programmed in boot mode or in PROM mode.) Bits 7 to 0 MS7 to MS0 Description H'AA The user boot MAT is selected (in user-MAT selection state when the value of these bits are other than H'AA) Initial value when these bits are initiated in user boot mode. H'00 Initial value when these bits are initiated in a mode except for user boot mode (in user-MAT selection state) [Programmable condition] These bits are in the execution state in the on-chip RAM. Rev. 4.0, 03/03, page 892 of 1358 (6) Flash Transfer Destination Address Register (FTDAR) FTDAR specifies the on-chip RAM address to which the on-chip program is downloaded. Make settings for FTDAR before writing 1 to the SCO bit in FCCS. The initial value is H'00 which points to the start address (H'FFBC00) in on-chip RAM. Bit : Initial value : R/W : 7 6 5 4 3 2 1 0 TDER TDA6 TDA5 TDA4 TDA3 TDA2 TDA1 TDA0 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W Bit 7--Transfer Destination Address Setting Error: This bit is set to 1 when there is an error in the download start address set by bits 6 to 0 (TDA6 to TDA0). Whether the address setting is erroneous or not is judged by checking whether the setting of TDA6 to TDA0 is between the range of H'00 and H'03 after setting the SCO bit in FCCS to 1 and performing download. Before setting the SCO bit to 1 be sure to set the FTDAR value between H'00 to H'03 as well as clearing this bit to 0. Bit 7 TDER Description(Return Value after Download) 0 Setting of TDA6 to TDA0 is normal 1 Setting of TDER and TDA4 to TDA0 is H'04 to H'FF and download has been aborted (Initial value) Bits 6 to 0--Transfer Destination Address (TDA6 to TDA0): These bits specify the download start address. A value from H'00 to H'03 can be set to specify the download start address in onchip RAM in 4-kbyte units. A value from H'04 to H'7F cannot be set. If such a value is set, the TDER bit (bit 7) in this register is set to 1 to prevent download from being executed. Bits 6 to 0 TDA6 to TDA0 Description H'00 Download start address is set to H'FFBC00 H'01 Download start address is set to H'FFCC00 H'02 Download start address is set to H'FFDC00 H'03 Download start address is set to H'FFEC00 H'04 to H'7F Setting prohibited. If this value is set, the TDER bit (bit 7) is set to 1 to abort the download processing. (Initial value) Rev. 4.0, 03/03, page 893 of 1358 19.32.2 Programming/Erasing Interface Parameter The programming/erasing interface parameter specifies the operating frequency, storage place for program data, programming destination address, and erase block and exchanges the processing result for the downloaded on-chip program. This parameter uses the general registers of the CPU (ER0 and ER1) or the on-chip RAM area. The initial value is undefined at a power-on reset or in hardware standby mode. When download, initialization, or on-chip program is executed, registers of the CPU except for R0L are stored. The return value of the processing result is written in R0L. Since the stack area is used for storing the registers except for R0L, the stack area must be saved at the processing start. (A maximum size of a stack area to be used is 128 bytes.) The programming/erasing interface parameter is used in the following four items. (1) Download control (2) Initialization before programming or erasing (3) Programming (4) Erasing These items use different parameters. The correspondence table is shown in table 19-71. Here the FPFR parameter returns the results of initialization processing, programming processing, or erasing processing, but the meaning of the bits differs depending on the type of processing. For details, refer to the FPFR descriptions for the individual processes. Rev. 4.0, 03/03, page 894 of 1358 Table 19-71 Usable Parameters and Target Modes Name of Parameter Abbreviation Download pass/ fail result DPFR Flash pass/fail result FPFR Download Initialization Programming Erasure R/W Initial Value Allocation -- -- -- R/W Undefined On-chip RAM* R/W Undefined R0L of CPU -- R/W Undefined ER0 of CPU -- FPEFEQ Flash programming/ erasing frequency control -- Flash multipurpose address area FMPAR -- -- -- R/W Undefined ER1 of CPU Flash multipurpose data destination area FMPDR -- -- -- R/W Undefined ER0 of CPU Flash erase block select FEBS -- -- R/W Undefined ER0 of CPU -- -- Note: * One byte of start address of download destination specified by FTDAR (1) Download Control The on-chip program is automatically downloaded by setting the SCO bit to 1. The on-chip RAM area to be downloaded is the area as much as 4 kbytes starting from the start address specified by FTDAR. For the address map of the on-chip RAM, see figure 19-98. The download control is set by using the programming/erasing interface register. The return value is given by the DPFR parameter. (a) Download pass/fail result parameter (DPFR: one byte of start address of on-chip RAM specified by FTDAR) This parameter indicates the return value of the download result. The value of this parameter can be used to determine if downloading is executed or not. Since the confirmation whether the SCO bit is set to 1 is difficult, the certain determination must be performed by setting one byte of the start address of the on-chip RAM area specified by FTDAR to a value other than the return value of download (for example, H'FF) before the download start (before setting the SCO bit to 1). Refer to item [e] in the User Program Mode Programming Procedure portion of section 19.33.2 for information on the method for checking the download result. Rev. 4.0, 03/03, page 895 of 1358 Bit : 7 6 5 4 3 2 1 0 0 0 0 0 0 SS FK SF Initial value : -- -- -- -- -- -- -- -- R/W -- -- -- -- -- R/W R/W R/W : Bits 7 to 3--Reserved: Return 0. Bit 2--Source Select Error Detect (SS): The on-chip program which can be downloaded can be specified only one type. When more than two types of the program are selected, the program is not selected, or the program is selected without mapping, error is occurred. Bit 2 SS Description 0 Download program can be selected normally 1 Download error is occurred (Multi-selection or program which is not mapped is selected) Bit 1--Flash Key Register Error Detect (FK): Returns the check result whether the value of FKEY is set to H'A5. Bit 1 FK Description 0 FKEY setting is normal (FKEY = H'A5) 1 Setting value of FKEY becomes error (FKEY = value other than H'A5) Bit 0--Success/Fail (SF): Returns the result whether download is ended normally or not. The judgement result whether program that is downloaded to the on-chip RAM is read back and then transferred to the on-chip RAM is returned. Bit 0 SF Description 0 Downloading on-chip program is ended normally (no error) 1 Downloading on-chip program is ended abnormally (error occurs) Rev. 4.0, 03/03, page 896 of 1358 (2) Programming/Erasing Initialization The on-chip programming/erasing program to be downloaded includes the initialization program. The specified period pulse must be applied when programming or erasing. The specified pulse width is made by the method in which wait loop is configured by the CPU instruction. The operating frequency of the CPU must be set. The initial program is set as a parameter of the programming/erasing program which has downloaded these settings. (a) Flash programming/erasing frequency parameter (FPEFEQ: general register ER0 of CPU) This parameter sets the operating frequency of the CPU. The operating frequency range of this LSI is 2 MHz to 25 MHz. Bit : 31 0 0 0 0 0 0 0 0 Initial value : -- -- -- -- -- -- -- -- R/W : -- -- -- -- -- -- -- -- Bit : 23 22 21 20 19 18 17 16 0 0 0 0 0 0 0 0 Initial value : -- -- -- -- -- -- -- -- R/W : -- -- -- -- -- -- -- -- Bit : 15 14 13 12 11 10 9 8 F15 F14 F13 F12 F11 F10 F9 F8 -- -- -- -- -- -- -- -- Initial value : 30 29 28 27 26 25 24 R/W : R/W R/W R/W R/W R/W R/W R/W R/W Bit : 7 6 5 4 3 2 1 0 F7 F6 F5 F4 F3 F2 F1 F0 -- -- -- -- -- -- -- -- R/W R/W R/W R/W R/W R/W R/W R/W Initial value : R/W : Bits 31 to 16--Unused: Only 0 may be written to these bits. Rev. 4.0, 03/03, page 897 of 1358 Bits 15 to 0--Frequency Set (F15 to F0): Set the operating frequency of the CPU. The setting value must be calculated as the following methods. 1. The operating frequency which is shown in MHz units must be rounded in a number to three decimal places and be shown in a number of two decimal places. 2. The centuplicated value is converted to the binary digit and is written to the FPEFEQ parameter (general register ER0). For example, when the operating frequency of the CPU is 25.000 MHz, the value is as follows. * The number to three decimal places of 25.000 is rounded and the value is thus 25.00. * The formula that 25.00 x 100 = 2500 is converted to the binary digit and b'0000,1001,1100,0100 (H'09C4) is set to ER0. (b) Flash pass/fail parameter (FPFR: general register R0L of CPU) This is the return value indicating the initialization result. Bit : 7 6 5 4 3 2 1 0 0 0 0 0 0 BR FQ SF Initial value : -- -- -- -- -- -- -- -- R/W -- -- -- -- -- -- R/W R/W : Bits 7 to 3--Reserved: Return 0. Bit 1--Frequency Error Detect (FQ): Returns the check result whether the specified operating frequency of the CPU is in the range of the supported operating frequency. Bit 1 FQ Description 0 Setting of operating frequency is normal 1 Setting of operating frequency is abnormal Bit 0--Success/Fail (SF): Indicates whether initialization is completed normally. Bit 0 SF Description 0 Initialization is ended normally (no error) 1 Initialization is ended abnormally (error occurs) Rev. 4.0, 03/03, page 898 of 1358 (3) Programming Execution When flash memory is programmed, the programming destination address on the user MAT must be passed to the programming program in which the program data is downloaded. 1. The start address of the programming destination on the user MAT is set in general register ER1 of the CPU. This parameter is called FMPAR (flash multipurpose address area parameter). Since the program data is always in 128-byte units, the lower eight bits (MOA7 to MOA0) must be H'00 or H'80 as the boundary of the programming start address on the user MAT. 2. The program data for the user MAT must be prepared in the consecutive area. The program data must be in the consecutive space which can be accessed by using the MOV.B instruction of the CPU and is not the flash memory space. When data to be programmed does not satisfy 128 bytes, the 128-byte program data must be prepared by embedding the dummy code (H'FF). The start address of the area in which the prepared program data is stored must be set in general register ER0. This parameter is called FMPDR (flash multipurpose data destination area parameter). For details on the programming procedure, see section 19.33.2, User Program Mode. Rev. 4.0, 03/03, page 899 of 1358 (a) Flash multipurpose address area parameter (FMPAR: general register ER1 of CPU) This parameter indicates the start address of the programming destination on the user MAT. When an address in an area other than the flash memory space is set, an error occurs. The start address of the programming destination must be at the 128-byte boundary. If this boundary condition is not satisfied, an error occurs. The error occurrence is indicated by the WA bit (bit 1) in FPFR. FMPAR Bit : Initial value : R/W : Bit : Initial value : 31 30 29 28 27 26 25 24 MOA31 MOA30 MOA29 MOA28 MOA27 MOA26 MOA25 MOA24 -- -- -- -- -- -- -- -- R/W R/W R/W R/W R/W R/W R/W R/W 23 22 21 20 19 18 17 16 MOA23 MOA22 MOA21 MOA20 MOA19 MOA18 MOA17 MOA16 -- -- -- -- -- -- -- -- R/W : R/W R/W R/W R/W R/W R/W R/W R/W Bit : 15 14 13 12 11 10 9 8 MOA15 MOA14 MOA13 MOA12 MOA11 MOA10 MOA9 MOA8 -- -- -- -- -- -- -- -- Initial value : R/W : R/W R/W R/W R/W R/W R/W R/W R/W Bit : 7 6 5 4 3 2 1 0 MOA7 MOA6 MOA5 MOA4 MOA3 MOA2 MOA1 MOA0 -- -- -- -- -- -- -- -- R/W R/W R/W R/W R/W R/W R/W R/W Initial value : R/W : Bits 31 to 0--MOA31 to MOA0: Store the start address of the programming destination on the user MAT. The consecutive 128-byte programming is executed starting from the specified start address of the user MAT. Therefore, the specified programming start address becomes a 128-byte boundary and MOA6 to MOA0 are always 0. Rev. 4.0, 03/03, page 900 of 1358 (b) Flash multipurpose data destination parameter (FMPDR: general register ER0 of CPU): This parameter indicates the start address in the area which stores the data to be programmed in the user MAT. When the storage destination of the program data is in flash memory, an error occurs. The error occurrence is indicated by the WD bit (bit 2) in FPFR. FMPDR Bit : Initial value : 31 30 29 28 27 26 25 24 MOD31 MOD30 MOD29 MOD28 MOD27 MOD26 MOD25 MOD24 -- -- -- -- -- -- -- -- R/W : R/W R/W R/W R/W R/W R/W R/W R/W Bit : 23 22 21 20 19 18 17 16 MOD23 MOD22 MOD21 MOD20 MOD19 MOD18 MOD17 MOD16 Initial value : -- -- -- -- -- -- -- -- R/W : R/W R/W R/W R/W R/W R/W R/W R/W Bit : 15 14 13 12 11 10 9 8 MOD15 MOD14 MOD13 MOD12 MOD11 MOD10 MOD9 MOD8 Initial value : -- -- -- -- -- -- -- -- R/W : R/W R/W R/W R/W R/W R/W R/W R/W Bit : 7 6 5 4 3 2 1 0 MOD7 MOD6 MOD5 MOD4 MOD3 MOD2 MOD1 MOD0 -- -- -- -- -- -- -- -- R/W R/W R/W R/W R/W R/W R/W R/W Initial value : R/W : Bits 31 to 0--MOD31 to MOD0: Store the start address of the area which stores the program data for the user MAT. The consecutive 128-byte data is programmed to the user MAT starting from the specified start address. Rev. 4.0, 03/03, page 901 of 1358 (c) Flash pass/fail parameter (FPFR: general register R0L of CPU) An explanation of FPFR as the return value indicating the programming result is provided here. Bit : 7 6 5 4 3 2 1 0 0 MD EE FK 0 WD WA SF Initial value : -- -- -- -- -- -- -- -- R/W -- R/W R/W R/W -- R/W R/W R/W : Bit 7--Reserved: Returns 0. Bit 6--Programming Mode Related Setting Error Detect (MD): Returns the check result of whether the error protection state has been entered. If the error protection state has been entered, 1 is written to this bit. This state can be confirmed by checking bit 4, FLER, in the FCCS register. For conditions to enter the error protection state, see section 19.34.3, Error Protection. Bit 6 MD Description 0 FLER setting is normal (FLER = 0) 1 FLER = 1, and programming cannot be performed Bit 5--Programming Execution Error Detect (EE): 1 is returned to this bit when the specified data could not be written because the user MAT was not erased. If this bit is set to 1, there is a high possibility that the user MAT is partially rewritten. In this case, after removing the error factor, erase the user MAT. If FMATS is set to H'AA and the user boot MAT is selected, an error occurs when programming is performed. In this case, both the user MAT and user boot MAT are not rewritten. Programming of the user boot MAT should be performed in the boot mode or PROM mode. Bit 5 EE Description 0 Programming has ended normally 1 Programming has ended abnormally (programming result is not guaranteed) Rev. 4.0, 03/03, page 902 of 1358 Bit 4--Flash Key Register Error Detect (FK): Returns the check result of the value of FKEY before the start of the programming processing. Bit 4 FK Description 0 FKEY setting is normal (FKEY = H'5A) 1 FKEY setting is error (FKEY = value other than H'5A) Bit 3--Reserved: Returns 0. Bit 2--Write Data Address Detect (WD): When flash memory area is specified as the start address of the storage destination of the program data, an error occurs. Bit 2 WD Description 0 Setting of write data address is normal 1 Setting of write data address is abnormal Bit 1--Write Address Error Detect (WA): When the following area is specified as the start address of the programming destination, an error occurs. 1. If the start address is outside the flash memory area 2. If the specified address is not a 128-byte boundary (A6 to A0 are not 0) Bit 1 WA Description 0 Setting of programming destination address is normal 1 Setting of programming destination address is abnormal Bit 0--Success/Fail (SF): Indicates whether the program processing is ended normally or not. Bit 0 SF Description 0 Programming is ended normally (no error) 1 Programming is ended abnormally (error occurs) Rev. 4.0, 03/03, page 903 of 1358 (4) Erasure Execution When flash memory is erased, the erase-block number on the user MAT must be passed to the erasing program which is downloaded. This is set to the FEBS parameter (general register ER0). One block is specified from the block number 0 to 15. For details on the erasing processing procedure, see section 19.33.2, User Program Mode. (a) Flash erase block select parameter (FEBS: general register ER0 of CPU) This parameter specifies the erase-block number. The several block numbers cannot be specified. Bit : Initial value : 31 30 29 28 27 26 25 24 0 0 0 0 0 0 0 0 -- -- -- -- -- -- -- -- R/W : R/W R/W R/W R/W R/W R/W R/W R/W Bit : 23 22 21 20 19 18 17 16 0 0 0 0 0 0 0 0 Initial value : -- -- -- -- -- -- -- -- R/W : R/W R/W R/W R/W R/W R/W R/W R/W Bit : 15 14 13 12 11 10 9 8 0 0 0 0 0 0 0 0 Initial value : -- -- -- -- -- -- -- -- R/W : R/W R/W R/W R/W R/W R/W R/W R/W Bit : 7 6 5 4 3 2 1 0 EB7 EB6 EB5 EB4 EB3 EB2 EB1 EB0 -- -- -- -- -- -- -- -- R/W R/W R/W R/W R/W R/W R/W R/W Initial value : R/W : Bits 31 to 8--Reserved: Only 0 may be written to these bits. Bits 7 to 0--Erase Block (EB7 to EB0): Set the erase-block number in the range from 0 to 15. 0 corresponds to the EB0 block and 15 corresponds to the EB15 block. An error occurs when the number other than 0 to 15 is set. Rev. 4.0, 03/03, page 904 of 1358 (b) Flash pass/fail parameter (FPFR: general register R0L of CPU) An explanation of FPFR as the return value indicating the erase result is provided here. Bit : 7 6 5 4 3 2 1 0 0 MD EE FK EB 0 0 SF Initial value : -- -- -- -- -- -- -- -- R/W -- R/W R/W R/W R/W -- -- R/W : Bit 7--Reserved: Returns 0. Bit 6--Erasure Mode Related Setting Error Detect (MD): Returns the check result of whether the error protection state has been entered. If the error protection state has been entered, 1 is written to this bit. This state can be confirmed by checking bit 4, FLER, in the FCCS register. For conditions to enter the error protection state, see section 19.34.3, Error Protection. Bit 6 MD Description 0 FLER settings are normal (FLER = 0) 1 FLER = 1, and erasure cannot be performed Bit 5--Erasure Execution Error Detect (EE): 1 is returned to this bit when the user MAT could not be erased. If this bit is set to 1, there is a high possibility that the user MAT is partially erased. In this case, after removing the error factor, erase the user MAT. If FMATS is set to H'AA and the user boot MAT is selected, an error occurs when erasure is performed. In this case, both the user MAT and user boot MAT are not erased. Erasing of the user boot MAT should be performed in the boot mode or PROM mode. Bit 5 EE Description 0 Erasure has ended normally 1 Erasure has ended abnormally (erasure result is not guaranteed) Rev. 4.0, 03/03, page 905 of 1358 Bit 4--Flash Key Register Error Detect (FK): Returns the check result of FKEY value before start of the erasing processing. Bit 4 FK Description 0 FKEY setting is normal (FKEY = H'5A) 1 FKEY setting is error (FKEY = value other than H'5A) Bit 3--Erase Block Select Error Detect (EB): Returns the check result whether the specified erase-block number is in the block range of the user MAT. Bit 3 EB Description 0 Setting of erase-block number is normal 1 Setting of erase-block number is abnormal Bits 2 to 1--Reserved: Return 0. Bit 0--Success/Fail (SF): Indicates whether the erasing processing is ended normally or not. Bit 0 SF Description 0 Erasure is ended normally (no error) 1 Erasure is ended abnormally (error occurs) 19.32.3 System Control Register 2 (SYSCR2) Bit : 7 6 5 4 3 2 1 0 -- -- -- -- FLSHE -- -- -- Initial value : 0 0 0 0 0 0 0 0 R/W -- -- -- -- R/W -- -- R/W : SYSCR2 is an 8-bit readable/writable register that performs on-chip flash memory control. SYSCR2 is initialized to H'00 by a reset and in hardware standby mode. SYSCR2 can only be used in the F-ZTAT versions. In the mask ROM versions this register will return an undefined value if read, and cannot be modified. Bits 7 to 4--Reserved: These bits cannot be modified and are always read as 0. Rev. 4.0, 03/03, page 906 of 1358 Bit 3--Flash Memory Control Register Enable (FLSHE): Controls CPU access to the flash memory control registers (FCCS, EPCS, FECS, FKEY, FMATS, and FTDAR). Writing 1 to the FLSHE bit enables the flash memory control registers to be read and written to. Clearing FLSHE to 0 designates these registers as unselected (the register contents are retained). Bit 3 FLSHE Description 0 Flash control registers are not selected for addresses H'FFFFC4 to H'FFFFCF (Initial value) 1 Flash control registers are selected for addresses H'FFFFC4 to H'FFFFCF Bits 2 and 1--Reserved: These bits cannot be modified and are always read as 0. Bit 0--Reserved: This bit should be written with 0. 19.32.4 RAM Emulation Register (RAMER) Bit : 7 6 5 4 3 2 1 0 -- -- -- -- RAMS RAM2 RAM1 RAM0 Initial value : 0 0 0 0 0 0 0 0 R/W -- -- -- -- R/W R/W R/W R/W : RAMER specifies the area of flash memory to be overlapped with part of RAM when emulating real-time flash memory programming. RAMER is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in software standby mode. RAMER settings should be made in user mode or user program mode. Flash memory area divisions are shown in table 19-72. To ensure correct operation of the emulation function, the ROM for which RAM emulation is performed should not be accessed immediately after this register has been modified. Normal execution of an access immediately after register modification is not guaranteed. Bits 7 to 4--Reserved: These bits cannot be modified and are always read as 0. Rev. 4.0, 03/03, page 907 of 1358 Bit 3--RAM Select (RAMS): Specifies selection or non-selection of flash memory emulation in RAM. When RAMS = 1, all flash memory blocks are program/erase-protected. Bit 3 RAMS Description 0 Emulation not selected (Initial value) Program/erase-protection of all flash memory blocks is disabled 1 Emulation selected Program/erase-protection of all flash memory blocks is enabled Bits 2 to 0--Flash Memory Area Selection (RAM2 to RAM0): These bits are used together with bit 3 to select the flash memory area to be overlapped with RAM (see table 19-72). Table 19-72 Flash Memory Area Divisions RAM Area Block Name RAMS RAM2 RAM1 RAM0 H'FFDC00 to H'FFEBFF RAM area, 4 kbytes 0 * * * H'000000 to H'000FFF EB0 (4 kbytes) 1 0 0 0 H'001000 to H'001FFF EB1 (4 kbytes) 1 0 0 1 H'002000 to H'002FFF EB2 (4 kbytes) 1 0 1 0 H'003000 to H'003FFF EB3 (4 kbytes) 1 0 1 1 H'004000 to H'004FFF EB4 (4 kbytes) 1 1 0 0 H'005000 to H'005FFF EB5 (4 kbytes) 1 1 0 1 H'006000 to H'006FFF EB6 (4 kbytes) 1 1 1 0 H'007000 to H'007FFF EB7 (4 kbytes) 1 1 1 1 *: Don't care Rev. 4.0, 03/03, page 908 of 1358 19.33 On-Board Programming Mode When the pin is set in on-board programming mode and the reset start is executed, the on-board programming state that can program/erase the on-chip flash memory is entered. On-board programming mode has three operating modes: user programming mode, user boot mode, and boot mode. Table 19-73 lists the pin setting for entering each mode. For details on the state transition of each mode for flash memory, see figure 19-90 Table 19-73 Setting On-Board Programming Modes Mode Pins MCU Mode CPU Operating Modes/Description MD2 MD1 MD0 User boot mode Advanced single-chip mode 0 0 1 Boot mode Advanced expanded mode with on-chip ROM enabled 0 1 0 1 1 0 Advanced single-chip mode User program mode* Advanced expanded mode with on-chip ROM enabled Advanced single-chip mode 1 1 Note: * Normally, user mode should be used. Set the FLSHE bit to 1 to make a transition to user program mode before performing a program/verify operation. Rev. 4.0, 03/03, page 909 of 1358 19.33.1 Boot Mode Boot mode executes programming/erasing user MAT and user boot MAT by means of the control command and program data transmitted from the host using the on-chip SCI. The tool for transmitting the control command and program data must be prepared in the host. The SCI communication mode is set to asynchronous mode. When reset start is executed after this LSI's pin is set in boot mode, the boot program in the microcomputer is initiated. After the SCI bit rate is automatically adjusted, the communication with the host is executed by means of the control command method. The system configuration diagram in boot mode is shown in figure 19-94. For details on the pin setting in boot mode, see table 19-73. The NMI and other interrupts are ignored in boot mode. Make sure the NMI and other interrupts do not occur in the user system. This LSI Host Boot Control command, program data programming tool and program data Reply response Control command, analysis execution software (on-chip) Flash memory RxD1 On-chip SCI1 TxD1 On-chip RAM Figure 19-94 System Configuration in Boot Mode Rev. 4.0, 03/03, page 910 of 1358 SCI Interface Setting by Host: When boot mode is initiated, this LSI measures the low period of asynchronous SCI-communication data (H'00), which is transmitted consecutively by the host. The SCI transmit/receive format is set to 8-bit data, 1 stop bit, and no parity. This LSI calculates the bit rate of transmission by the host by means of the measured low period and transmits the bit adjustment end sign (1 byte of H'00) to the host. The host must confirm that this bit adjustment end sign (H'00) has been received normally and transmits 1 byte of H'55 to this LSI. When reception is not executed normally, boot mode is initiated again (reset) and the operation described above must be executed. The bit rate between the host and this LSI is not matched by the bit rate of transmission by the host and system clock frequency of this LSI. To operate the SCI normally, the transfer bit rate of the host must be set to 9,600 bps or 19,200 bps. The system clock frequency which can automatically adjust the transfer bit rate of the host and the bit rate of this LSI is shown in table 19-74. Boot mode must be initiated in the range of this system clock. Start bit D0 D1 D2 D3 D4 D5 D6 Measure low period (9 bits) (data is H'00) D7 Stop bit High period of at least 1 bit Figure 19-95 Automatic Adjustment Operation of SCI Bit Rate Table 19-74 System Clock Frequency that Can Automatically Adjust Bit Rate of This LSI Bit Rate of Host System Clock Frequency Which can Automatically Adjust Bit Rrate of This LSI 9,600 bps 8 MHz to 25 MHz 19,200 bps 16 MHz to 25 MHz Rev. 4.0, 03/03, page 911 of 1358 State Transition: The overview of the state transition after boot mode is initiated is shown in figure 19-96. For details on boot mode, refer to section 19.38.1, Serial Communications Interface Specification for Boot Mode. 1. Bit rate adjustment After boot mode is initiated, the bit rate of the SCI interface is adjusted with that of the host. 2. Waiting for inquiry set command For inquiries about user-MAT size and configuration, MAT start address, and support state, the required information is transmitted to the host. 3. Automatic erasure of all user MAT and user boot MAT After inquiries have finished, all user MAT and user boot MAT are automatically erased. 4. Waiting for programming/erasing command * When the program preparation notice is received, the state for waiting program data is entered. The programming start address and program data must be transmitted following the programming command. When programming is finished, the programming start address must be set to H'FFFFFFFF and transmitted. Then the state for waiting program data is returned to the state of programming/erasing command wait. * When the erasure preparation notice is received, the state for waiting erase-block data is entered. The erase-block number must be transmitted following the erasing command. When the erasure is finished, the erase-block number must be set to H'FF and transmitted. Then the state for waiting erase-block data is returned to the state for waiting programming/erasing command. The erasure must be executed when reset start is not executed and the specified block is programmed after programming is executed in boot mode. When programming can be executed by only one operation, all blocks are erased before the state for waiting programming/erasing/other command is entered. The erasing operation is not required. * There are many commands other than programming/erasing. Examples are sum check, blank check (erasure check), and memory read of the user MAT/user boot MAT and acquisition of current status information. Note that memory read of the user MAT/user boot MAT can only read the program data after all user MAT/user boot MAT has automatically been erased. Rev. 4.0, 03/03, page 912 of 1358 (Bit rate adjustment) H'00 to H'00 reception Boot mode initiation (reset by boot mode) H'00 transmission (adjustment completed) Bit rate adjustment H'55 [2] rece ption Inquiry command reception Wait for inquiry setting command Inquiry command response [3] [4] [1] Processing of inquiry setting command All user MAT and user boot MAT erasure Wait for programming/erasing command Read/check command reception Processing of read/check command Command response (Erasure command reception) (Erasure end) (Erase-block specification) (Program end) (Program command reception) Wait for erase-block data (Program data transmission) Wait for program data Figure 19-96 Overview of Boot Mode State Transition 19.33.2 User Program Mode The user MAT can be programmed/erased in user program mode. (The user boot MAT cannot be programmed/erased.) Programming/erasing is executed by downloading the program in the microcomputer. The programming/erasing overview flow is shown in figure 19-97. High voltage is applied to internal flash memory during the programming/erasing processing. Therefore, transition to reset or hardware standby must not be executed. Doing so may cause Rev. 4.0, 03/03, page 913 of 1358 damage or destroy flash memory. If reset is executed accidentally, reset must be released after the reset input period, which is longer than normal 100 s. For information on the programming procedure refer to "Programming Procedure in User Program Mode", and for information on the erasing procedure refer to "Erasing Procedure in User Program Mode", below. For the overview of a processing that repeats erasing and programming by downloading the programming program and the erasing program in separate on-chip ROM areas using FTDAR, see "Erasing and Programming Procedure in User Program Mode" which appears later in this section. Programming/erasing start When programming, program data is prepared Programming/erasing procedure program is transferred to the on-chip RAM and executed Programming/erasing end 1. RAM emulation mode must be canceled in advance. Download cannot be executed in emulation mode. 2. When the program data is made by means of emulation, use the FTDAR register to change the download destination. Note that the download area and the emulation area will overlap if FTDAR is in its initial status (H'02). 3. Programming/erasing is executed only in the on-chip RAM. However, if program data is in a consecutive area and can be accessed by the MOV.B instruction of the CPU like SRAM/ROM, the program data can be in an external space. 4. After programming/erasing is finished, the FWE pin must be protected. Figure 19-97 Programming/Erasing Overview Flow On-chip RAM Address Map when Programming/Erasing is Executed: Parts of the procedure program that are made by the user, like download request, programming/erasing procedure, and judgement of the result, must be executed in the on-chip RAM. The on-chip program that is to be downloaded is all in the on-chip RAM. Note that area in the on-chip RAM must be controlled so that these parts do not overlap. Figure 19-98 shows the program area to be downloaded. Rev. 4.0, 03/03, page 914 of 1358 <On-chip RAM> Area that can be used by user DPFR (Return value: 1 byte) Address RAMTOP(H'FFBC00) FTDAR setting System use area (15 bytes) Area to be downloaded (Size: 4 kbytes) Unusable area in programming/erasing processing period Programming/erasing entry FTDAR setting+16 Initialization process entry FTDAR setting+32 Initialization + programming program or Initialization + erasing program Area that can be used by user RAM emulation area or area that can be used by user Area that can be used by user FTDAR setting+4000 H'FFDC00 H'FFEC00 RAMEND(H'FFFBFF) Figure 19-98 RAM Map when Programming/Erasing is Executed Programming Procedure in User Program Mode: The procedures for download, initialization, and programming are shown in figure 19-99. Rev. 4.0, 03/03, page 915 of 1358 1 Select on-chip program to be downloaded and set download destination by FTDAR (a) Disable interrupts and bus master operation other than CPU (i) Set FKEY to H'A5 (b) Set FKEY to H'5A (j) Set SCO to 1 and execute download (c) Set parameter to ER0 and ER1 (FMPAR and FMPDR) (k) Clear FKEY to 0 (d) Programming JSR FTDAR setting+16 (l) (e) DFPR=0? Initialization Yes No (f) Initialization JSR FTDAR setting+32 (g) Yes FPFR=0? Download error processing Set the FPEFEQ and FUBRA parameters FPFR=0? Programming Download Start programming procedure program (h) Yes No Required data programming is completed? Initialization error processing Clear FKEY and programming error processing (n) Yes Clear FKEY to 0 No 1 (m) No (o) End programming procedure program Figure 19-99 Programming Procedure The procedure program must be executed in an area other than the flash memory to be programmed. Especially the part where the SCO bit in FCCS is set to 1 for downloading must be executed in the on-chip RAM. The area that can be executed in the steps of the user procedure program (on-chip RAM, user MAT, and external space) is shown in section 19.38.3, Procedure Program and Storable Area for Programming Data. The following description assumes the area to be programmed on the user MAT is erased and program data is prepared in the consecutive area. When erasing is not executed, erasing is executed before writing. 128-byte programming is performed in one program processing. When more than 128-byte programming is performed, programming destination address/program data parameter is updated in 128-byte units and programming is repeated. When less than 128-byte programming is performed, data must total 128 bytes by adding the invalid data. If the invalid data to be added is H'FF, the program processing period can be shorted. Rev. 4.0, 03/03, page 916 of 1358 (a) Select the on-chip program to be downloaded and the download destination. When the PPVS bit of FPCS is set to 1, the programming program is selected. Several programming/erasing programs cannot be selected at one time. If several programs are set, download is not performed and a download error is returned to the source select error detect (SS) bit in the DPFR parameter. Specify the start address of the download destination by FTDAR. (b) Program H'A5 in FKEY If H'A5 is not written to FKEY for protection, 1 cannot be written to the SCO bit for download request. (c) 1 is written to the SCO bit of FCCS and then download is executed. To write 1 to the SCO bit, the following conditions must be satisfied. * RAM emulation mode is canceled. * H'A5 is written to FKEY. * The SCO bit writing is executed in the on-chip RAM. When the SCO bit is set to 1, download is started automatically. When the SCO bit is returned to the user procedure program, the SCO is cleared to 0. Therefore, the SCO bit cannot be confirmed to be 1 in the user procedure program. The download result can be confirmed only by the return value of the DPFR parameter. Before the SCO bit is set to 1, incorrect judgement must be prevented by setting the DPFR parameter, that is one byte of the start address of the on-chip RAM area specified by FTDAR, to a value other than the return value (H'FF). When download is executed, particular interrupt processing, which is accompanied by the bank switch as described below, is performed as an internal microcomputer processing. Four NOP instructions are executed immediately after the instructions that set the SCO bit to 1. * The user-MAT space is switched to the on-chip program storage area. * After the selection condition of the download program and the address set in FTDAR are checked, the transfer processing is executed starting from the on-chip RAM address specified by FTDAR. * The SCO bits in FPCS, FECS, and FCCS are cleared to 0. * The return value is set to the DPFR parameter. * After the on-chip program storage area is returned to the user-MAT space, the user procedure program is returned. In the download processing, the values are stored in general registers than CPU. No interrupts are accepted during download processing. However, interrupt requests are held, so when processing returns to the user procedure program and interrupts are generated. When the level-detection interrupt requests are to be held, interrupts must be put until the download is ended. Rev. 4.0, 03/03, page 917 of 1358 When hardware standby mode is entered during download processing, the normal download cannot be guaranteed in the on-chip RAM. Therefore, download must be executed again. Since a stack area of a maximum 128 bytes is used, the area must be saved before setting the SCO bit to 1. If flash memory is accessed by the DMAC, DTC or BREQ during downloading, the operation cannot be guaranteed. Therefore, access by the DMAC, DTC or BREQ must not be executed. (d) FKEY is cleared to H'00 for protection. (e) The value of the DPFR parameter must be checked and the download result must be confirmed. A recommended procedure for confirming the download result is shown below. * Check the value of the DPFR parameter (one byte of start address of the download destination specified by FTDAR). If the value is H'00, download has been performed normally. If the value is not H'00, the source that caused download to fail can be investigated by the description below. * If the value of the DPFR parameter is the same as before downloading (e.g. H'FF), the address setting of the download destination in FTDAR may be abnormal. In this case, confirm the setting of the TDER bit (bit 7) in FTDAR. * If the value of the DPFR parameter is different from before downloading, check the SS bit (bit 2) and the FK bit (bit 1) in the DPFR parameter to ensure that the download program selection and FKEY register setting were normal, respectively. (f) The operating frequency is set to the FPEFEQ parameter for initialization. * The current frequency of the CPU clock is set to the FPEFEQ parameter (general register: ER0). The settable range of the FPEFEQ parameter is 2 MHz to 25 MHz. When the frequency is set out of this range, an error is returned to the FPFR parameter of the initialization program and initialization is not performed. For details on the frequency setting, see the description in 19.32.2 (a) Flash programming/erasing frequency parameter (FPEFEQ: general register ER0 of CPU). Rev. 4.0, 03/03, page 918 of 1358 (g) Initialization When a programming program is downloaded, the initialization program is also downloaded to the on-chip RAM. There is an entry point of the initialization program in the area from (download start address set by FTDAR) + 32 bytes. The subroutine is called and initialization is executed by using the following steps. MOV.L #DLTOP+32,ER2 ; Set entry address to ER2 JSR ; Call initialization routine @ER2 NOP * The general registers other than R0L are saved in the initialization program. * R0L is a return value of the FPFR parameter. * Since the stack area is used in the initialization program, a stack area of a maximum 128 bytes must be saved in RAM. * Interrupts can be accepted during the execution of the initialization program. The program storage area and stack area in the on-chip RAM and register values must not be destroyed. (h) The return value in the initialization program, FPFR (general register R0L) is judged. (i) All interrupts and the use of a bus master other than the CPU are prohibited. The specified voltage is applied for the specified time when programming or erasing. If interrupts occur or the bus mastership is moved to other than the CPU during this time, more than the specified voltage will be applied and flash memory may be damaged. Therefore, interrupts, movement of bus mastership to DMAC, DTC or BREQ, and movement to DRAM refresh other than the CPU are prohibited. The interrupt processing prohibition is set up by setting the bit 7 (I) in the condition code register (CCR) of the CPU to b'1. Then interrupts other than NMI are held and are not executed. The NMI interrupts must not occur in the user system. The interrupts that are held must be processed in executed after all program processing. When the bus mastership is moved to DMAC, DTC or BREQ or DRAM refresh except for the CPU, the error protection state is entered. Therefore, reservation of bus mastership by DMAC, DTC or BREQ is prohibited. (j) FKEY must be set to H'5A and the user MAT must be prepared for programming. Rev. 4.0, 03/03, page 919 of 1358 (k) The parameter which is required for programming is set. The start address of the programming destination of the user MAT (FMPAR) is set to general register ER1. The start address of the program data storage area (FMPDR) is set to general register ER0. * Example of the FMPAR setting FMPAR specifies the programming destination address. When an address other than one in the user MAT area is specified, even if the programming program is executed, programming is not executed and an error is returned to the return value parameter FPFR. Since the unit is 128 bytes, the lower eight bits (A7 to A0) must be in the 128-byte boundary of H'00 or H'80. * Example of the FMPDR setting When the storage destination of the program data is flash memory, even if the program execution routine is executed, programming is not executed and an error is returned to the FPFR parameter. In this case, the program data must be transferred to the on-chip RAM and then programming must be executed. (l) Programming There is an entry point of the programming program in the area from (download start address set by FTDAR) + 16 bytes of on-chip RAM. The subroutine is called and programming is executed by using the following steps. MOV.L #DLTOP+16,ER2 ; Set entry address to ER2 JSR ; Call programming routine @ER2 NOP -- The general registers other than R0L are saved in the programming program. -- R0 is a return value of the FPFR parameter. -- Since the stack area is used in the programming program, a stack area of a maximum 128 bytes must be reserved in RAM (m) The return value in the programming program, FPFR (general register R0L) is judged. (n) Determine whether programming of the necessary data has finished. If more than 128 bytes of data are to be programmed, specify FMPAR and FMPDR in 128byte units, and repeat steps (l) to (o). Increment the programming destination address by 128 bytes and update the programming data pointer correctly. If an address which has already been programmed is written to again, not only will a programming error occur, but also flash memory will be damaged. Rev. 4.0, 03/03, page 920 of 1358 (o) After programming finishes, clear FKEY and specify software protection. If this LSI is restarted by a power-on reset immediately after user MAT programming has finished, secure a reset period (period of RES = 0) that is at least as long as normal 100 s. Erasing Procedure in User Program Mode: The procedures for download, initialization, and erasing are shown in figure 19-100. 1 Start erasing procedure program Select on-chip program to be downloaded and set download destination by FTDAR Disable interrupts and bus master operation other than CPU (a) Set FKEY to H'5A Set SCO to 1 and execute download Erasing Download Set FKEY to H'A5 Clear FKEY to 0 DPFR = 0? Yes (b) Erasing JSR FTDAR setting+16 (c) (d) FPFR=0 ? No Yes Download error processing Set the FPEFEQ and FUBRA parameters Initialization Set FEBS parameter No No Clear FKEY and erasing error processing Required block erasing is completed? Initialization JSR FTDAR setting+32 (e) Yes Clear FKEY to 0 (f) FPFR=0 ? No Yes Initialization error processing End erasing procedure program 1 Figure 19-100 Erasing Procedure The procedure program must be executed in an area other than the user MAT to be erased. Especially the part where the SCO bit in FCCS is set to 1 for downloading must be executed in onchip RAM. The area that can be executed in the steps of the user procedure program (on-chip RAM, user MAT, and external space) is shown in section 19.38.3, Procedure Program and Storable Area for Programming Data. For the downloaded on-chip program area, refer to the RAM map for programming/erasing in figure 19-98, RAM Map when Programming/Erasing is Executed. Rev. 4.0, 03/03, page 921 of 1358 A single divided block is erased by one erasing processing. For block divisions, refer to figure 1991, Block Division of User MAT. To erase two or more blocks, update the erase block number and perform the erasing processing for each block. (a) Select the on-chip program to be downloaded Set the EPVB bit in FECS to 1. Several programming/erasing programs cannot be selected at one time. If several programs are set, download is not performed and a download error is returned to the source select error detect (SS) bit in the DPFR parameter. The procedures to be carried out after setting FKEY, e.g. download and initialization, are the same as those in the programming procedure. For details, refer to Programming Procedure in User Program Mode in section 19.33.2. (b) Set the FEBS parameter necessary for erasure Set the erase block number of the user MAT in the flash erase block select parameter FEBS (general register ER0). If a value other than an erase block number of the user MAT is set, no block is erased even though the erasing program is executed, and an error is returned to the return value parameter FPFR. (c) Erasure Similar to as in programming, there is an entry point of the erasing program in the area from (download start address set by FTDAR) + 16 bytes of on-chip RAM. The subroutine is called and erasing is executed by using the following steps. MOV.L #DLTOP+16,ER2 ; Set entry address to ER2 JSR ; Call erasing routine @ER2 NOP -- The general registers other than R0L are saved in the erasing program. -- R0 is a return value of the FPFR parameter. -- Since the stack area is used in the erasing program, a stack area of a maximum 128 bytes must be reserved in RAM (d) The return value in the erasing program, FPFR (general register R0L) is judged. (e) Determine whether erasure of the necessary blocks has finished. If more than one block is to be erased, update the FEBS parameter and repeat steps (b) to (e). Blocks that have already been erased can be erased again. (f) After erasure finishes, clear FKEY and specify software protection. If this LSI is restarted by a power-on reset immediately after user MAT erasure has finished, secure a reset period (period of RES = 0) that is at least as long as normal 100 s. Rev. 4.0, 03/03, page 922 of 1358 (4) Erasing and Programming Procedure in User Program Mode By changing the on-chip RAM address of the download destination in FTDAR, the erasing program and programming program can be downloaded to separate on-chip RAM areas. Figure 19-101 shows an example of repetitively executing RAM emulation, erasing, and programming. 1 Set FTDAR to H'00 (Specify H'FFBC00 as download destination) Download erasing program Initialize erasing program Set FTDAR to H'01 (Specify H'FFCC00 as download destination) Download programming program Emulation/Erasing/Programming Programming program download Erasing program download Start procedure program Enter RAM emulation mode and tune data in on-chip RAM Cancel RAM emulation mode Erase relevant block (execute erasing program) Set FMPDR to H'FFDC00 to program relevant block (execute programming program) Confirm operation End ? Initialize programming program No Yes 1 End procedure program Figure 19-101 Sample Procedure of Repeating RAM Emulation, Erasing, and Programming (Overview) In the above example, the erasing program and programming program are downloaded to areas excluding the 4 kbytes (H'FFDC00 to H'FFEC00) from H'FFDC00. Download and initialization are performed only once at the beginning. Rev. 4.0, 03/03, page 923 of 1358 In this kind of operation, note the following: * Be careful not to damage on-chip RAM with overlapped settings. In addition to the RAM emulation area, erasing program area, and programming program area, areas for the user procedure programs, work area, and stack area are reserved in on-chip RAM. Do not make settings that will overwrite data in these areas. * Be sure to initialize both the erasing program and programming program. Initialization by setting the FPEFEQ parameter must be performed for both the erasing program and the programming program. Initialization must be executed for both entry addresses: (download start address for erasing program) + 32 bytes (H'FFBC20 in this example) and (download start address for programming program) + 32 bytes (H'FFCC20 in this example). 19.33.3 User Boot Mode This LSI has user boot mode which is initiated with different mode pin settings than those in user program mode or boot mode. User boot mode is a user-arbitrary boot mode, unlike boot mode that uses the on-chip SCI. Only the user MAT can be programmed/erased in user boot mode. Programming/erasing of the user boot MAT is only enabled in boot mode or PROM mode. User Boot Mode Initiation: For the mode pin settings to start up user boot mode, see table 19-73. When the reset start is executed in user boot mode, the built-in check routine runs. The user MAT and user boot MAT states are checked by this check routine. While the check routine is running, NMI and all other interrupts cannot be accepted. Next, processing starts from the execution start address of the reset vector in the user boot MAT. At this point, H'AA is set to the flash MAT select register FMATS because the execution MAT is the user boot MAT. User MAT Programming in User Boot Mode: For programming the user MAT in user boot mode, additional processings made by setting FMATS are required: switching from user-bootMAT selection state to user-MAT selection state, and switching back to user-boot-MAT selection state after programming completes. Figure 19-102 shows the procedure for programming the user MAT in user boot mode. Rev. 4.0, 03/03, page 924 of 1358 1 Start programming procedure program Select on-chip program to be downloaded and set download destination by FTDAR Set FMATS to value other than H'AA to select user MAT Yes No Download error processing Set the FPEFEQ and FUBRA parameters Initialization JSR FTDAR setting+32 FPFR=0 ? Set parameter to ER0 and ER1 (FMPAR and FMPDR) Programming JSR FTDAR setting+16 Programming Clear FKEY to 0 User-MAT selection state Download Set FKEY to H'5A Set SCO to 1 and execute download DPFR=0 ? Initialization User-boot-MAT selection state Set FKEY to H'A5 MAT switchover FPFR=0 ? No Yes Clear FKEY and programming error processing* No Required data programming is completed? Yes No Clear FKEY to 0 Yes Initialization error processing Set FMATS to H'AA to select user boot MAT Disable interrupts and bus master operation other than CPU 1 User-boot-MAT selection state MAT switchover End programming procedure program Note: * The MAT must be switched by FMATS to perform the programming error processing in the user boot MAT. Figure 19-102 Procedure for Programming User MAT in User Boot Mode The difference between the programming procedures in user program mode and user boot mode is whether the MAT is switched or not as shown in figure 19-102. In user boot mode, the user boot MAT can be seen in the flash memory space with the user MAT hidden in the background. The user MAT and user boot MAT are switched only while the user MAT is being programmed. Because the user boot MAT is hidden while the user MAT is being programmed, the procedure program must be located in an area other than flash memory. After programming finishes, switch the MATs again to return to the first state. MAT switchover is enabled by writing a specific value to FMATS. However note that while the MATs are being switched, the LSI is in an unstable state, e.g. access to a MAT is not allowed until MAT switching is completely finished, and if an interrupt occurs, from which MAT the interrupt vector is read from is undetermined. Perform MAT switching in accordance with the description in section 19.36, Switching between User MAT and User Boot MAT. Except for MAT switching, the programming procedure is the same as that in user program mode. Rev. 4.0, 03/03, page 925 of 1358 The area that can be executed in the steps of the user procedure program (on-chip RAM, user MAT, and external space) is shown in section 19.38.3, Procedure Program and Storable Area for Programming Data. User MAT Erasing in User Boot Mode: For erasing the user MAT in user boot mode, additional processings made by setting FMATS are required: switching from user-boot-MAT selection state to user-MAT selection state, and switching back to user-boot-MAT selection state after erasing completes. Figure 19-103 shows the procedure for erasing the user MAT in user boot mode. 1 Start erasing procedure program Set FMATS to value other than H'AA to select user MAT MAT switchover Set FKEY to H'5A Clear FKEY to 0 DPFR=0 ? Yes No Download error processing Set the FPEFEQ parameter Initialization JSR FTDAR setting+32 FPFR=0 ? Set FEBS parameter Programming JSR FTDAR setting+16 Erasing Set SCO to 1 and execute download User-MAT selection state Download Set FKEY to H'A5 and set download destination by FTDAR Initialization User-boot-MAT selection state Select on-chip program to be downloaded FPFR=0 ? No No Yes Clear FKEY and erasing error processing Required block erasing is completed? Yes No Clear FKEY to 0 Yes Initialization error processing Set FMATS to H'AA to select user boot MAT Disable interrupts and bus master operation other than CPU 1 User-boot-MAT selection state MAT switchover End erasing procedure program Note: The MAT must be switched by FMATS to perform the erasing error processing in the user boot MAT. Figure 19-103 Procedure for Erasing User MAT in User Boot Mode The difference between the erasing procedures in user program mode and user boot mode depends on whether the MAT is switched or not as shown in figure 19-103. MAT switching is enabled by writing a specific value to FMATS. However note that while the MATs are being switched, the LSI is in an unstable state, e.g. access to a MAT is not allowed until Rev. 4.0, 03/03, page 926 of 1358 MAT switching is completed finished, and if an interrupt occurs, from which MAT the interrupt vector is read from is undetermined. Perform MAT switching in accordance with the description in section 19.36, Switching between User MAT and User Boot MAT. Except for MAT switching, the erasing procedure is the same as that in user program mode. The area that can be executed in the steps of the user procedure program (on-chip RAM, user MAT, and external space) is shown in section 19.38.3, Procedure Program and Storable Area for Programming Data. 19.34 Protection There are two kinds of flash memory program/erase protection: hardware and software protection. 19.34.1 Hardware Protection Programming and erasing of flash memory is forcibly disabled or suspended by hardware protection. In this state, the downloading of an on-chip program and initialization of the flash memory are possible. However, an activated program for programming or erasure cannot program or erase locations in a user MAT, and the error in programming/erasing is reported in the parameter FPFR. Rev. 4.0, 03/03, page 927 of 1358 Table 19-75 Hardware Protection Function to be Protected Item Description Reset/standby protection * A power-on reset (including a poweron reset by the WDT) and entry to standby mode reinitialize the program/erase interface register and the device enters a program/eraseprotected state. * Resetting by means of the RES pin after power is initially supplied will not make the device enter the reset state unless the RES pin is held low until oscillation has stabilized. In the case of a reset during operation, hold the RES pin low for the RES pulse width that is specified in the section on AC characteristics section. If the device is reset during programming or erasure, data values in the flash memory are not guaranteed. In this case, after keeping the RES pin low for at least 100 s, execute erasure and then execute programming again. Download Program/Erase 19.34.2 Software Protection Software protection is set up in any of three ways: by disabling the downloading of on-chip programs for programming and erasing, by means of a key code, and by the RAM-emulation register. Rev. 4.0, 03/03, page 928 of 1358 Table 19-76 Software Protection Function to be Protected Item Description Protection by the SCO bit * Clearing the SCO bit in the FCCS register makes the device enter a program/erase-protected state, and this disables the downloading of the programming/erasing programs. Protection by the FKEY register * Downloading and programming/erasing are disabled unless the required key code is written in the FKEY register. Different key codes are used for downloading and for programming/erasing. Emulation protection * Download Program/Erase Setting the RAMS bit in the RAM emulation register (RAMER) makes the device enter a program/eraseprotected state. 19.34.3 Error Protection Error protection is a mechanism for aborting programming or erasure when an error occurs, in the form of the microcomputer entering runaway during programming/erasing of the flash memory or operations that are not according to the established procedures for programming/erasing. Aborting programming or erasure in such cases prevents damage to the flash memory due to excessive programming or erasing. If the microcomputer malfunctions during programming/erasing of the flash memory, the FLER bit in the FCCS register is set to 1 and the device enters the error-protection state, and this aborts the programming or erasure. The FLER bit is set in the following conditions: (1) When an interrupt, such as NMI, has occurred during programming/erasing (2) When the relevant block area of flash memory is read during programming/erasing (including a vector read or an instruction fetch) (3) When a SLEEP instruction (including software standby mode) is executed during programming/erasing (4) When a bus master other than the CPU, such as DMAC, DTC or BREQ, has obtained the bus right during programming/erasing Rev. 4.0, 03/03, page 929 of 1358 Error protection is cancelled only by a power-on reset or by hardware-standby mode. Note that the reset should only be released after providing a reset input over a period longer than the normal 100 s period. Since high voltages are applied during programming/erasing of the flash memory, some voltage may remain after the error-protection state has been entered. For this reason, it is necessary to reduce the risk of damage to the flash memory by extending the reset period so that the charge is released. The state-transition diagram in figure 19-104 shows transitions to and from the error-protection state. Program mode Erase mode Read disabled Programming/erasing enabled FLER=0 RES = 0 or STBY = 0 Err or Error occurrence occ r 0o = RES TBY=0 S ur oft rence wa re sta (S nd Error protection mode Read enabled Programming/erasing disabled FLER=1 by Reset or standby (Hardware protection) Read disabled Programming/erasing disabled FLER=0 RES=0 or STBY=0 Program/erase interface register is in its initial state. ) Software-standby mode Error-protection mode (Software standby) Read disabled Cancel programming/erasing disabled software-standby mode FLER=1 Program/erase interface register is in its initial state. Figure 19-104 Transitions to and from the Error-Protection State Rev. 4.0, 03/03, page 930 of 1358 19.35 Flash Memory Emulation in RAM To provide real-time emulation in RAM of data that is to be written to the flash memory, a part of the RAM can be overlaid on an area of flash memory (user MAT) that has been specified by the RAM emulation register (RAMER). After the RAMER setting is made, the RAM is accessible in both the user MAT area and as the RAM area that has been overlaid on the user MAT area. Such emulation is possible in both user mode and user-program mode. Figure 19-105 shows an example of the emulation of realtime programming of the user MAT area. Start of emulation program Set RAMER Write the data for tuning to the overlaid RAM area Execute application program No Tuning OK? Yes Cancel RAMCR setting Program the user MAT with the emulated block End of emulation program Figure 19-105 Emulation of Flash Memory in RAM Rev. 4.0, 03/03, page 931 of 1358 This area is accessible as both a RAM area and as a flash memory area. H'00000 H'01000 H'02000 EB0 EB1 EB2 H'03000 EB3 H'04000 EB4 H'05000 EB5 H'06000 EB6 H'07000 H'FFBC00 EB7 H'FFDC00 H'FFEBFF H'08000 Flash memory (user MAT) On-chip RAM EB8 to EB15 H'7FFFF H'FFFBFF Figure 19-106 Example of a RAM-Overlap Operation Figure 19-106 shows an example of an overlap on block area EB0 of the flash memory. Emulation is possible for a single area selected from among the eight areas, from EB0 to EB7, of user MAT bank 0. The area is selected by the setting of the RAM2 to RAM0 bits in the RAMER register. (1) To overlap a part of the RAM on area EB0, to allow realtime programming of the data for this area, set the RAMER register's RAMS bit to 1, and each of the RAM2 to RAM0 bits to 0. (2) Realtime programming is carried out using the overlaid area of RAM. In programming or erasing the user MAT, it is necessary to run a program that implements a series of procedural steps, including the downloading of a on-chip program. In this process, set the download area with FTDAR so that the overlaid RAM area and the area where the on-chip program is to be downloaded do not overlap. An FTDAR setting of H'02 will cause part of the tuned data area to overlap with part of the download area. When using the initial setting of FTDAR, the data that is to be programmed must be saved beforehand in an area that is not used by the system. Figure 19-107 shows an example of programming of the data, after emulation has been completed, to the EB0 area in the user MAT. Rev. 4.0, 03/03, page 932 of 1358 H'00000 H'01000 H'02000 EB0 EB1 EB2 H'03000 EB3 H'04000 EB4 H'05000 EB5 H'06000 EB6 H'07000 EB7 H'08000 (1) Cancel the emulation mode. (2) Transfer the user-created program/ erase-procedure program. (3) Download the on-chip programming/erasing programs, avoiding the tuning <illegible> data area set in FTDAR. (4) Execute programming after erasing, as necessary. H'FFBC00 Download area Flash memory (user MAT) EB8 to EB15 Area for the programming-procedure program H'FFCC00 H'FFEBFF Copy of the tuned data H'FFEFFF On-chip RAM H'FFFBFF H'7FFFF Figure 19-107 Programming of the Data After Tuning (1) After the data to be programmed has fixed values, clear the RAMS bit to 0 to cancel the overlap of RAM. (2) Transfer the user programming/erasing procedure program to RAM. (3) Run the programming/erasing procedure program in RAM and download the on-chip programming/erasing program. Specify the download start address with FTDAR so that the tuned data area does not overlap with the download area. (4) When the EB0 area of the user MAT has not been erased, the programming program will be downloaded after erasure. Set the parameters FMPAR and FMPDR so that the tuned data is designated, and execute programming. Note: Setting the RAMS bit to 1 puts all the blocks in the flash MAT into a program/eraseprotected state regardless of the values of the RAM2 to RAM0 bits (emulation protection). In this state, downloading of the on-chip programs is also disabled, so clear the RAMS bit before actual programming or erasure. Rev. 4.0, 03/03, page 933 of 1358 19.36 Switching between User MAT and User Boot MAT It is possible to alternate between the user MAT and user boot MAT. However, the following procedure is required because these MATs are allocated to address 0. (Switching to the user boot MAT disables programming and erasing. Programming of the user boot MAT should take place in boot mode or PROM mode.) (1) MAT switching by the FMATS register should always be executed from the on-chip RAM. (2) To ensure that the MAT that has been switched to is accessible, execute 4 NOP instructions in the on-chip RAM immediately before or after writing to the FMATS register of the on-chip RAM (this prevents access to the flash memory during MAT switching). (3) If an interrupt has occurred during switching, there is no guarantee of which memory MAT is being accessed. Always mask the maskable interrupts before switching between MATs. In addition, configure the system so that NMI interrupts do not occur during MAT switching. (4) After the MATs have been switched, take care because the interrupt vector table will also have been switched. If the same interrupt processing is to be executed before and after MAT switching, carry out such procedures as the following: * Provide the same interrupt-processing routine and interrupt vector for both MATs. * Transfer the interrupt-processing routines to the on-chip RAM, and set the interrupt vector in the same on-chip RAM for each memory MAT. (5) Memory sizes of the user MAT and user boot MAT are different. When accessing the user boot MAT, do not access addresses above the top of its 8-kbyte memory space. If access goes beyond the 8-kbyte space, the values read are undefined. Rev. 4.0, 03/03, page 934 of 1358 <User MAT> <On-chip RAM> <User boot MAT> Procedure for switching to the user boot MAT Procedure for switching to the user MAT Procedure for switching to the user boot MAT (1) Mask interrupts (2) Write H'AA to the FMATS register. (3) Execute 4 NOP instructions before accessing the user boot MAT. Procedure for switching to the user MAT (1) Mask interrupts (2) Write a value other than H'AA to the FMATS register. (3) Execute 4 NOP instructions before or after accessing the user MAT. Figure 19-108 Switching between the User MAT and User Boot MAT 19.36.1 Usage Notes 1. Download time of on-chip program The programming program that includes the initialization routine and the erasing program that includes the initialization routine are each 2 kbytes or less. Accordingly, when the CPU clock frequency is 25 MHz, the download for each program takes approximately TBD s at maximum. 2. Write to flash-memory related registers by DMAC or DTC While an instruction in on-chip RAM is being executed, the DMAC or DTC can write to the SCO bit in FCCS that is used for a download request or FMATS that is used for MAT switching. Make sure that these registers are not accidentally written to, otherwise an on-chip program may be downloaded and damage RAM or a MAT switchover may occur and the CPU get out of control. Do not use DMAC or DTC to program FLASH related registers. 3. Compatibility with programming/erasing program of conventional F-ZTAT H8S microcomputer A programming/erasing program for flash memory used in the conventional F-ZTAT H8S microcomputer which does not support download of the on-chip program by a SCO transfer request cannot run in this LSI. Be sure to download the on-chip program to execute programming/erasing of flash memory in this LSI. Rev. 4.0, 03/03, page 935 of 1358 4. Monitoring runaway by WDT Unlike the conventional F-ZTAT H8S microcomputer, no countermeasures are available for a runaway by WDT during programming/erasing by the downloaded on-chip program. Prepare countermeasures (e.g. use of the periodic timer interrupts) for WDT while taking the programming/erasing time into consideration as required. 19.37 PROM Mode Along with its on-board programming mode, this LSI also has a PROM mode as a further mode for the writing and erasing of programs and data. In the PROM mode, a general-purpose PROM programmer can freely be used to write programs to the on-chip ROM. Program/erase is possible on the user MAT and user boot MAT. The PROM programmer must support Hitachi microcomputers with 512-kbyte flash memory units as a device type. A status-polling system is adopted for operation in automatic program, automatic erase, and status-read modes. In the status-read mode, details of the system's internal signals are output after execution of automatic programming or automatic erasure. In the PROM mode, provide a 12-MHz input-clock signal. Table 19-77 Pins in PROM Mode Pin Names Settings/External Circuit Connection Mode pins: MD2, MD1, MD0 Low level input to MD2, MD1, and MD0 Mode setting pins: P66, P65, P64 High level input to P66, low level input to P65 and P64 STBY pin High-level input (do not select hardware standby mode) RES pin Reset circuit XTAL, EXTAL pins Oscillator circuit Other pins requiring setting: P32, P25 High-level input to P32, low-level input to P25 19.37.1 Pin Arrangement of the Socket Adapter Attach the socket adapter to the LSI in the way shown in figure 19-110. This allows conversion to 40 pins. Figure 19-109 shows the memory mapping of the on-chip ROM, and figure 19-110 shows the arrangement of the socket adapter's pins. Rev. 4.0, 03/03, page 936 of 1358 Address in MCU mode H'000000 Address in PROM mode Address in MCU mode H'00000 H'000000 Address in PROM mode H'00000 On-chip ROM space (user boot MAT) 8 kB H'001FFF H'01FFF On-chip ROM space (user MAT) 512 kB H'07FFFF H'7FFFF Figure 19-109 Mapping of On-Chip Flash Memory Rev. 4.0, 03/03, page 937 of 1358 H8S/2326C F-ZTAT HN27C4096HG (40 pins) Socket Adapter (40-Pin Conversion) TFP-120 TFP-128B Pin No. Pin Name 2 6 A0 21 A0 3 7 A1 22 A1 4 8 A2 23 A2 5 9 A3 24 A3 7 11 A4 25 A4 8 12 A5 26 A5 9 13 A6 27 A6 10 14 A7 28 A7 11 15 A8 29 A8 12 16 A9 31 A9 13 17 A10 32 A10 14 18 A11 33 A11 16 20 A12 34 A12 17 21 A13 35 A13 18 22 A14 36 A14 19 23 A15 37 A15 20 24 A16 38 A16 21 25 A17 39 A17 22 26 A18 10 A18 43 49 D8 19 I/O0 44 50 D9 18 I/O1 45 51 D10 17 I/O2 46 52 D11 16 I/O3 48 54 D12 15 I/O4 49 55 D13 14 I/O5 50 56 D14 13 I/O6 51 57 D15 12 I/O7 68 76 69 77 67 75 CE OE WE 72 80 VCL*3 1, 30, 33, 52, 55, 74, 75, 76, 81, 93, 94 6, 15, 24, 31, 32, 38, 47, 59, 66, 79, 103, 104, 113, 114, 115 73 5, 34, 39, 58, 61, 82, 83, 84, 89, 103, 104 3, 10, 19, 28, 35, 36, 37, 38, 44, 53, 65, 67, 68, 74, 87, 99, 100, 113, 114, 123, 124, 125 81 77 78 Pin Name 20 Capacitor VCC VSS *1 RES Reset circuit 85 XTAL 86 EXTAL Oscillator circuit Other NC(OPEN) 3 CE OE WE 2 *2 4 FWE 1, 40 VCC 11, 30 VSS 5, 6, 7 NC 8 A20 9 A19 Legend I/O7 to 0 : Data I/O A20 to 0 : Address input CE : Chip enable OE : Output enable WE : Write enable Notes: This drawing indicates pin correspondences and does not show the entire circuitry of the socket adapter. *1 A reset oscillation stabilization time (tOSC1) of at least 10 ms is required. *2 A 12 MHz crystal resonator should be used. *3 Connect the VCL pin to VSS with a 0.1 mF (provisional) capacitor. Figure 19-110 Pin Arrangement of the Socket Adapter Rev. 4.0, 03/03, page 938 of 1358 19.37.2 PROM Mode Operation Table 19-78 shows the settings for the operating modes of PROM mode, and table 19-79 lists the commands used in PROM mode. The following sections provide detailed information on each mode. * Memory-read mode: This mode supports reading, in units of bytes, from the user MAT or user boot MAT. * Auto-program mode: This mode supports the simultaneous programming of the user MAT and user boot MAT in 128-byte units. Status polling is used to confirm the end of automatic programming. * Auto-erase mode: This mode only supports the automatic erasing of the entire user MAT or user boot MAT. Status polling is used to confirm the end of automatic erasing. * Status-read mode: Status polling is used with automatic programming and automatic erasure. Normal completion can be detected by reading the signal on the I/O6 pin. In status-read mode, error information is output when an error has occurred. Table 19-78 Settings for Each Operating Mode of PROM Mode Pin Name Mode CE OE WE I/O7 to 0 A18 to 0 Read L L H Data output Ain Output disable L H H Hi-Z X Command write 1 Chip disable* L H L Data input Ain* H X X Hi-Z X 2 Legend: H: High level L: Low level Hi-Z: High impedance X: Don't care Notes: *1 The chip-disable mode is not a standby state; internally, it is an operational state. *2 Ain indicates that there is also an address input in auto-program mode. Rev. 4.0, 03/03, page 939 of 1358 Table 19-79 Commands in PROM Mode Memory Number MAT to be of Cycles Accessed Mode Address Data Mode Address Data Memory-read mode 1+n User MAT Write X H'00 Read RA Dout User boot MAT Write X H'05 Auto-program mode 129 User MAT Write X H'40 Write WA Din User boot MAT Write X H'45 Auto-erase mode 2 User MAT Write X H'20 Write X H'20 User boot MAT Write X H'25 Status-read mode 2 Common to Write both MATs X H'71 Command 1st Cycle 2nd Cycle H'25 Write X H'71 Notes: 1. In auto-program mode, 129 cycles are required in command writing because of the simultaneous 128-byte write. 2. In memory read mode, the number of cycles varies with the number of address writing cycles (n). 19.37.3 Memory-Read Mode (1) On completion of an automatic program, automatic erase, or status read, the LSI enters a command waiting state. So, to read the contents of memory after these operations, issue the command to change the mode to the memory-read mode before reading from the memory. (2) In memory-read mode, the writing of commands is possible in the same way as in the command-write state. (3) After entering memory-read mode, continuous reading is possible. (4) After power has first been supplied, the LSI enters the memory-read mode. For the AC characteristics in memory read mode, see section 19.38.2, AC Characteristics and Timing in PROM Mode. 19.37.4 Auto-Program Mode (1) In auto-program mode, programming is in 128-byte units. That is, 128 bytes of data are transferred in succession. (2) Even in the programming of less than 128 bytes, 128 bytes of data must be transferred. H'FF should be written to those addresses that are unnecessarily written to. (3) Set the low seven bits of the address to be transferred to low level. Inputting an invalid address will result in a programming error, although processing will proceed to the memoryprogramming operation. Rev. 4.0, 03/03, page 940 of 1358 (4) The memory address is transferred in the 2nd cycle. Do not transfer addresses in the 3rd or later cycles. (5) Do not issue commands while programming is in progress. (6) When programming, execute automatic programming once for each 128-byte block of addresses. Programming the block at an address where programming has already been performed is not possible. (7) To confirm the end of automatic programming, check the signal on the I/O6 pin. Confirmation in the status-read mode is also possible (status polling of the I/O7 pin is used to check the end status of automatic programming). (8) Status-polling information on the I/O6 and I/O7 pins is retained until the next command is written. As long as no command is written, the information is made readable by setting CE and OE for enabling. For the AC characteristics in auto-program mode, see section 19.38.2, AC Characteristics and Timing in PROM Mode. 19.37.5 Auto-Erase Mode (1) Auto-erase mode only supports erasing of the entire memory. (2) Do not perform command writing during auto erasing is in progress. (3) To confirm the end of automatic erasing, check the signal on the I/O6 pin. Confirmation in the status-read mode is also possible (status polling of the I/O7 pin is used to check the end status of automatic erasure). (4) Status polling information on the I/O6 and I/O7 pins is retained until the next command writing. As long as no command is written, the information is made readable by setting CE and OE for enabling. For the AC characteristics in auto-erase mode, see section 19.38.2, AC Characteristics and Timing in PROM Mode. 19.37.6 Status-Read Mode (1) Status-read mode is used to determine the type of an abnormal termination. Use this mode when automatic programming or automatic erasure ends abnormally. (2) The return code is retained until writing of a command that selects a mode other than statusread mode. Table 19-80 lists the return codes of status-read mode. For the AC characteristics in status-read mode, see section 19.38.2, AC Characteristics and Timing in PROM Mode. Rev. 4.0, 03/03, page 941 of 1358 Table 19-80 Return Codes of Status-Read Mode Pin Name I/O7 I/O6 Attribute Normal end Command indicator error I/O5 I/O4 Programming error I/O3 I/O2 I/O1 I/O0 Erase error -- -- Programming Invalid or erase count address exceeded error Initial value 0 0 0 0 0 0 0 0 Indication Normal end: 0 Command error: 1 Programming error: 1 Erase error:1 -- -- Count exceeded: 1 Abnormal end: 1 Otherwise: 0 Otherwise: 0 Otherwise: 0 Invalid address error: 1 Otherwise: 0 Otherwise: 0 Note: I/O3 and I/O2 are undefined pins. 19.37.7 Status Polling (1) The I/O7 status-polling output is a flag that indicates the operating status in auto-program or auto-erase mode. (2) The I/O6 status-polling output is a flag that indicates normal/abnormal end of auto-program or auto-erase mode. Table 19-81 Truth Table of Status-Polling Output Pin Name In Progress Abnormal End -- Normal End I/O7 0 1 0 1 I/O6 0 0 1 1 I/O0 to I/O5 0 0 0 0 19.37.8 Time Taken in Transition to PROM Mode Until oscillation has stabilized and while PROM mode is being set up, the LSI is unable to accept commands. After the PROM-mode setup time has elapsed, the LSI enters memory-read mode. See section 19.38.2, AC Characteristics and Timing in PROM Mode. 19.37.9 Notes on Using PROM Mode (1) When programming addresses which have previously been programmed, apply auto-erasing before auto-programming (figure 19-83). (2) When using PROM mode to program a chip that has been programmed/erased in an on-board programming mode, auto-erasing before auto-programming is recommended. Rev. 4.0, 03/03, page 942 of 1358 (3) Do not take the chip out of the PROM programmer or reset the chip during programming or erasure. Flash memory is susceptible to permanent damage since a high voltage is being applied during the programming/erasing. When the reset signal is accidentally input to the chip, the period in the reset state until the reset signal is released should be longer than the normal 100 s. (4) The flash memory is initially in the erased state when the device is shipped by Hitachi. For other chips for which the history of erasure is unknown, auto-erasing as a check and supplement for the initialization (erase) level is recommended. (5) This LSI does not support modes such as the product identification mode of general purpose EPROM. Therefore, the device name is not automatically set in the PROM programmer. (6) For further information on the writer programmer and its software version, please refer to the instruction manual for the socket adapter. Rev. 4.0, 03/03, page 943 of 1358 19.38 Further Information 19.38.1 Serial Communication Interface Specification for Boot Mode Initiating boot mode enables the boot program to communicate with the host by using the internal SCI. The serial communication interface specification is shown below. Status The boot program has three states. (1) Bit-Rate-Adjustment State In this state, the boot program adjusts the bit rate to communicate with the host. Initiating boot mode enables starting of the boot program and entry to the bit-rate-adjustment state. The program receives the command from the host to adjust the bit rate. After adjusting the bit rate, the program enters the inquiry/selection state. (2) Inquiry/Selection State In this state, the boot program responds to inquiry commands from the host. The device name, clock mode, and bit rate are selected. After selection of these settings, the program is made to enter the programming/erasing state by the command for a transition to the programming/erasing state. The program transfers the libraries required for erasure to the RAM and erases the user MATs and user boot MATs before the transition. (3) Programming/erasing state Programming and erasure by the boot program take place in this state. The boot program is made to transfer the programming/erasing programs to the RAM by commands from the host. Sum checks and blank checks are executed by sending these commands from the host. These boot program states are shown in figure 19-111. Rev. 4.0, 03/03, page 944 of 1358 Reset Bit-Rate-Adjustment State Inquiry/Selection wait Inquiry Selection Operations for Inquiry Transition to Programming/erasing Operations for Selection Operations for Erasing User MATs and User Boot MATs Programming/erasing selection wait Programming Erasing Operations for Programming Checking Operations for Erasing Operations for Checking Figure 19-111 Boot Program States Bit-Rate-Adjustment State The bit rate is calculated by measuring the period of transfer of a low-level byte (H'00) from the host. The bit rate can be changed by the command for a new bit rate selection. After the bit rate has been adjusted, the boot program enters the inquiry and selection state. The bit-rate-adjustment sequence is shown in figure 19-112. Rev. 4.0, 03/03, page 945 of 1358 Host Boot Program H'00 (30 times maximum) Measuring the 1-Bit Length H'00 (Completion of Adjustment) H'55 H'E6 (Response to Boot) H'FF (Error) Figure 19-112 Bit-Rate-Adjustment Sequence Communications Protocol After adjustment of the bit rate, the protocol for communications between the host and the boot program is as shown below. (1) One-byte commands and one-byte responses These commands and responses are comprised of a single byte. These are consists of the inquiries and the ACK for successful completion. (2) n-byte commands or n-byte responses These commands and responses are comprised of n bytes of data. These are selections and responses to inquiries. The amount of programming data is not included under this heading because it is determined in another command. (3) Error response The error response is a response to inquiries. It consists of an error response and an error code and comes two bytes. (4) Programming of n bytes The size is not specified in commands. The size of n is indicated in response to the programming unit inquiry. (5) Memory read response This response consists of four bytes of data. Rev. 4.0, 03/03, page 946 of 1358 One-Byte Command or One-Byte Response Command or Response n-Byte Command or n-Byte Response Data Size Checksum Command or Response Error Response Error Code Error Response 128-Byte Programming Address Data (n bytes) Checksum Command Memory Read Response Size Data Checksum Response Figure 19-113 Communication Protocol Format * Command (1 byte): Commands including inquiries, selection, programming, erasing, and checking * Response (1 byte): Response to an inquiry * Size (1 byte): The amount of data for transmission excluding the command, amount of data, and checksum * Checksum (1 byte): The checksum is calculated so that the total of all values from the command byte to the SUM byte becomes H'00. * Data (n bytes): Detailed data of a command or response * Error Response (1 byte): Error response to a command * Error Code (1 byte): Type of the error * Address (4 bytes): Address for programming * Data (n bytes): Data to be programmed (the size is indicated in the response to the programming unit inquiry.) * Size (4 bytes): Four-byte response to a memory read Rev. 4.0, 03/03, page 947 of 1358 Inquiry and Selection States The boot program returns information from the flash memory in response to the host's inquiry commands and sets the device code, clock mode, and bit rate in response to the host's selection command. Inquiry and selection commands are listed below. Table 19-82 Inquiry and Selection Commands Command Command Name Description H'20 Supported Device Inquiry Inquiry regarding device codes and product names of F-ZTAT H'10 Device Selection Selection of device code H'21 Clock Mode Inquiry Inquiry regarding numbers of clock modes and values of each mode H'11 Clock Mode Selection Indication of the selected clock mode H'22 Multiplication Ratio Inquiry Inquiry regarding the number of frequencymultiplied clock types, the number of multiplication ratios, and the values of each multiple H'23 Operating Clock Frequency Inquiry Inquiry regarding the maximum and minimum values of the main clock and peripheral clocks H'24 User Boot MAT Information Inquiry Inquiry regarding the number of user boot MATs and the start and last addresses of each MAT H'25 User MAT Information Inquiry Inquiry regarding the a number of user MATs and the start and last addresses of each MAT H'26 Block for Erasing Information Inquiry Inquiry regarding the number of blocks and the start and last addresses of each block H'27 Programming Unit Inquiry Inquiry regarding the unit of programming data H'3F New Bit Rate Selection Selection of new bit rate H'40 Transition to Programming/erasing State Erasing of user MAT and user boot MAT, and entry to programming/erasing state H'4F Boot Program Status Inquiry Inquiry into the operated status of the boot program The selection commands, which are device selection (H'10), clock mode selection (H'11), and new bit rate selection (H'3F), should be sent from the host in that order. These commands will certainly be needed. When two or more selection commands are sent at once, the last command will be valid. All of these commands, except for the boot program status inquiry command (H'4F), will be valid until the boot program receives the programming/erasing transition (H'40). The host can choose Rev. 4.0, 03/03, page 948 of 1358 the needed commands out of the commands and inquiries listed above. The boot program status inquiry command (H'4F) is valid after the boot program has received the programming/erasing transition command (H'40). (1) Supported device inquiry The boot program will return the device codes of supported devices and the product code of the F-ZTAT in response to the supported device inquiry. Command H'20 * Command, H'20, (1 byte): Inquiry regarding supported devices Response H'30 Size A number of characters Device code A number of devices Product name *** SUM * Response, H'30, (1 byte): Response to the supported device inquiry * Size (1 byte): Number of bytes to be transmitted, excluding the command, amount of data, and checksum, that is, the amount of data contributes by the product names, the number of devices, characters, and device codes * A number of devices (1 byte): The number of device types supported by the boot program * A number of characters (1 byte): The number of characters in the device codes and boot program's name * Device code (4 bytes): Code of the supporting product * Product name (n bytes): Type name of the boot program in ASCII-coded characters * SUM (1 byte): Checksum The checksum is calculated so that the total number of all values from the command byte to the SUM byte becomes H'00. (2) Device Selection The boot program will set the supported device to the specified device code. The program will return the selected device code in response to the inquiry after this setting has been made. Command H'10 Size Device code SUM * Command, H'10, (1 byte): Device selection * Size (1 byte): Amount of device-code data This is fixed to 2 * Device code (4 bytes): Device code returned in response to the supported device inquiry (ASCII-code) * SUM (1 byte): Checksum Rev. 4.0, 03/03, page 949 of 1358 Response H'06 * Response, H'06, (1 byte): Response to the device selection command ACK will be returned when the device code matches. Error response H'90 ERROR * Error response, H'90, (1 byte): Error response to the device selection command * Error: (1 byte): Error code H'11: Sum check error H'21: Device code error, that is, the device code does not match (3) Clock Mode Inquiry The boot program will return the supported clock modes in response to the clock mode inquiry. Command H'21 * Command, H'21, (1 byte): Inquiry regarding clock mode Response H'31 Size A number of modes Mode *** SUM * Response, H'31, (1 byte): Response to the clock-mode inquiry * Size (1 byte): Amount of data that represents the number of modes and modes * A number of clock modes (1 byte): The number of supported clock modes H'00 indicates no clock mode or the device allows to read the clock mode. * Mode (1 byte): Values of the supported clock modes (i.e. H'01 means clock mode 1.) * SUM (1 byte): Checksum (4) Clock Mode Selection The boot program will set the specified clock mode. The program will return the selected clockmode information after this setting has been made. The clock-mode selection command should be sent after the device-selection commands. Command H'11 Size Mode SUM * Command, H'11, (1 byte): Selection of clock mode * Size (1 byte): Amount of data that represents the modes * Mode (1 byte): A clock mode returned in reply to the supported clock mode inquiry. * SUM (1 byte): Checksum Response H'06 * Response, H'06, (1 byte): Response to the clock mode selection command ACK will be returned when the clock mode matches. Rev. 4.0, 03/03, page 950 of 1358 Error Response H'91 ERROR * Error response, H'91, (1 byte): Error response to the clock mode selection command * ERROR, (1 byte) : Error code H'11: Checksum error H'22: Clock mode error, that is, the clock mode does not match. Even when the clock mode value is H'00 or H'01 for clock mode inquiry, clock mode selection is performed for each value. (5) Multiplication Ratio-Inquiry The boot program will return the supported multiplication and division ratios. Command H'22 * Command, H'22, (1 byte): Inquiry regarding multiplication ratio Response H'32 Size The Num ber of Clock The number of multiplication ratios Multiplication ratio *** *** SUM * Response, H'32, (1 byte): Response to the multiplication ratio inquiry * Size (1 byte): The amount of data that represents the clock sources, the number of multiplication ratios, and the multiplication ratios * A number of types (1 byte): The number of supported multiplied clock types (e.g. when there are two multiplied clock types, which are the main and peripheral clocks, the number of types will be H'02.) * A number of multiplication ratios (1 byte): The number of multiplication ratios for each type (e.g. the number of multiplication ratios to which the main clock can be set and the peripheral clock can be set.) * Multiplication ratio (1 byte) Multiplication ratio: The value of the multiplication ratio (e.g. when the clockfrequency multiplier is four, the value of multiplication ratio will be H'04.) Division ratio: The inverse of the division ratio, i.e. a negative number (e.g. when the clock is divided by two, the value of division ratio will be H'FE. H'FE = D'-2) The number of multiplication ratios returned is the same as the number of multiplication ratios and as many groups of data are returned as there are types. * SUM (1 byte): Checksum Rev. 4.0, 03/03, page 951 of 1358 (6) Operating Clock Frequency Inquiry The boot program will return the number of operating clock frequencies, and the maximum and minimum values. Command H'23 * Command, H'23, (1 byte): Inquiry regarding operating clock frequencies Response H'33 Size The minimum value of operating clock frequency A number of operating clock frequencies The maximum value of operating clock frequency *** SUM * Response, H'33, (1 byte): Response to operating clock frequency inquiry * Size (1 byte): The number of bytes that represents the minimum values, maximum values, and the number of types. * A number of types (1 byte): The number of supported operating clock frequency types (e.g. when there are two operating clock frequency types, which are the main and peripheral clocks, the number of types will be H'02.) * Minimum value of operating clock frequency (2 bytes): The minimum value of the multiplied or divided clock frequency. The minimum and maximum values represent the values in MHz, valid to the hundredths place of MHz, and multiplied by 100. (e.g. when the value is 20.00 MHz, it will be D'2000 and H'07D0.) * Maximum value (2 bytes) : Maximum value among the multiplied or divided clock frequencies. There are as many pairs of minimum and maximum values as there are operating clock frequencies. * SUM (1 byte): Checksum (7) User Boot MAT Information Inquiry The boot program will return the number of user boot MATs and their addresses. Command H'24 * Command, H'24, (1 byte): Inquiry regarding user boot MAT information Rev. 4.0, 03/03, page 952 of 1358 Response H'34 Size A Number of Areas Area-Start Address Area-Last Address *** SUM * Response, H'34, (1 byte): Response to user boot MAT information inquiry * Size (1 byte): The number of bytes that represents the number of areas, area-start addresses, and area-last address * A Number of Areas (1 byte): The number of non-consecutive user boot MAT areas When user boot MAT areas are consecutive, the number of areas returned is H'01. * Area-Start Address (1 byte): Start address of the area * Area-Last Address (1 byte): Last address of the area There are as many groups of data representing the start and last addresses as there are areas. * SUM (1 byte): Checksum (8) User MAT Information Inquiry The boot program will return the number of user MATs and their addresses. Command H'25 * Command, H'25, (1 byte): Inquiry regarding user MAT information Response H'35 Size A Number of Areas Area-Start Address Area-Last Address *** SUM * Response, H'35, (1 byte): Response to the user MAT information inquiry * Size (1 byte): The number of bytes that represents the number of areas, area-start address and area-last address * A Number of Areas (1 byte): The number of non-consecutive user MAT areas When the user MAT areas are consecutive, the number of areas is H'01. * Area-Start Address (4 byte): Start address of the area * Area-Last Address (4 byte): Last address of the area There are as many groups of data representing the start and last addresses as there are areas. * SUM (1 byte): Checksum Rev. 4.0, 03/03, page 953 of 1358 (9) Erased Block Information Inquiry The boot program will return the number of erased blocks and their addresses. Command H'26 * Command, H'26, (1 byte): Inquiry regarding erased block information Response H'36 Size A number of blocks Block Start Address Block Last Address *** SUM * Response, H'36, (1 byte): Response to the number of erased blocks and addresses * Size (1 byte): The number of bytes that represents the number of blocks, block-start addresses, and block-last addresses. * A number of blocks (1 byte): Number of erased blocks in flash memory * Block Start Address (4 bytes) : Start address of a block * Block Last Address (4 bytes) : Last address of a block There are as many groups of data representing the start and last addresses as there are blocks. * SUM: Checksum (10) Programming Unit Inquiry The boot program will return the programming unit used to program data. Command H'27 * Command, H'27, (1 byte): Inquiry regarding programming unit Response H'37 Size Programming unit SUM * Response, H'37, (1 byte): Response to programming unit inquiry * Size (1 byte): The number of bytes that indicate the programming unit, which is fixed to 2 * Programming unit (2 bytes): A unit for programming This is the unit for reception of programming. * SUM (1 byte): Checksum Rev. 4.0, 03/03, page 954 of 1358 (11) New Bit-Rate Selection The boot program will set a new bit rate and return the new bit rate. This selection should be sent after sending the clock mode selection command. Command H'3F Size Bit rate Input frequency Number of multiplication ratios Multiplication ratio 1 Multiplication ratio 2 SUM * Command, H'3F, (1 byte): Selection of new bit rate * Size (1 byte): The number of bytes that represents the bit rate, input frequency, number of multiplication ratios, and multiplication ratio * Bit rate (2 bytes): New bit rate One hundredth of the value (e.g. when the value is 19200 bps, the bit rate is H'00C0, which is D'192.) * Input frequency (2 bytes): Frequency of the clock input to the boot program This is valid to the hundredths place and represents the value in MHz multiplied by 100. (e.g. when the value is 20.00 MHz, the input frequency is H'07D0 (= D'2000).) * Number of multiplication ratios (1 byte): The number of multiplication ratios to which the device can be set. Normally the value is two: main operating frequency and peripheral module operating frequency. * Multiplication ratio 1 (1 byte): The value of multiplication or division ratios for the main operating frequency Multiplication ratio (1 byte): The value of the multiplication ratio (e.g. when the clock frequency is multiplied by four, the multiplication ratio will be H'04. With this LSI it should be set to H'01.) Division ratio: The inverse of the division ratio, as a negative number (e.g. when the clock frequency is divided by two, the value of division ratio will be H'FE. H'FE = D'-2. With this LSI it should be set to H'01.) * Multiplication ratio 2 (1 byte): The value of multiplication or division ratios for the peripheral frequency Multiplication ratio (1 byte): The value of the multiplication ratio (e.g. when the clock frequency is multiplied by four, the multiplication ratio will be H'04. With this LSI it should be set to H'01.) Division ratio: The inverse of the division ratio, as a negative number (e.g. when the clock is divided by two, the value of division ratio will be H'FE. H'FE = D'-2. With this LSI it should be set to H'01.) * SUM (1 byte): Checksum Rev. 4.0, 03/03, page 955 of 1358 Response H'06 * Response, H'06, (1 byte): Response to selection of a new bit rate When it is possible to set the bit rate, the response will be ACK. Error Response H'BF ERROR * Error response, H'BF, (1 byte): Error response to selection of new bit rate * ERROR: (1 byte): Error code H'11: Sum checking error H'24: Bit-rate selection error The rate is not available. H'25: Error in input frequency This input frequency is not within the specified range. H'26: Multiplication-ratio error* The ratio does not match an available ratio. H'27: Operating frequency error* The frequency is not within the specified range. Note: * This error does not occur with this LSI. Received Data Check The methods for checking of received data are listed below. (1) Input frequency The received value of the input frequency is checked to ensure that it is within the range of minimum to maximum frequencies which matches the clock modes of the specified device. When the value is out of this range, an input-frequency error is generated. (2) Multiplication ratio The received value of the multiplication ratio or division ratio is checked to ensure that it matches the clock modes of the specified device. When the value is out of this range, an input-frequency error is generated. (3) Operating frequency error Operating frequency is calculated from the received value of the input frequency and the multiplication or division ratio. The input frequency is input to the LSI and the LSI is operated at the operating frequency. The expression is given below. Operating frequency = Input frequency x Multiplication ratio , or Operating frequency = Input frequency / Division ratio Rev. 4.0, 03/03, page 956 of 1358 The calculated operating frequency should be checked to ensure that it is within the range of minimum to maximum frequencies which are available with the clock modes of the specified device. When it is out of this range, an operating frequency error is generated. (4) Bit rate Peripheral operating clock (), bit rate (B), clock select (CKS) in the serial mode register (SMR). The error as calculated by the method below is checked to ensure that it is less than 4%. When it is 4% or more, a bit-rate selection error is generated. Error (%) = {[ * 106 (N+1) * B * 64 * 2(2*n 1) ] 1} * 100 When the new bit rate is selectable, the rate will be set in the register after sending ACK in response. The host will send an ACK with the new bit rate for confirmation and the boot program will response with that rate. Confirmation H'06 * Confirmation, H'06, (1 byte): Confirmation of a new bit rate Response H'06 * Response, H'06, (1 byte): Response to confirmation of a new bit rate The sequence of new bit-rate selection is shown in figure 19-114. Boot program Host Setting a new bit rate Waiting for one-bit period at the specified bit rate H'06 (ACK) Setting a new bit rate Setting a new bit rate H'06 (ACK) with the new bit rate H'06 (ACK) with the new bit rate Figure 19-114 New Bit-Rate Selection Sequence Rev. 4.0, 03/03, page 957 of 1358 Transition to Programming/Erasing State The boot program will transfer the erasing program, and erase the user MATs and user boot MATs in that order. On completion of this erasure, ACK will be returned and will enter the programming/erasing state. The host should select the device code, clock mode, and new bit rate with device selection, clockmode selection, and new bit-rate selection commands, and then send the command for the transition to programming/erasing state. These procedure should be carried out before sending of the programming selection command or program data. Command H'40 * Command, H'40, (1 byte): Transition to programming/erasing state Response H'06 * Response, H'06, (1 byte): Response to transition to programming/erasing state The boot program will send ACK when the user MAT and user boot MAT have been erased by the transferred erasing program. Error Response H'C0 H'51 * Error response, H'C0, (1 byte): Error response for user boot MAT blank check * Error code, H'51, (1 byte): Erasing error An error occurred and erasure was not completed. Command Error A command error will occur when a command is undefined, the order of commands is incorrect, or a command is unacceptable. Issuing a clock-mode selection command before a device selection or an inquiry command after the transition to programming/erasing state command, are examples. Error Response H'80 H'xx * Error response, H'80, (1 byte): Command error * Command, H'xx, (1 byte): Received command Rev. 4.0, 03/03, page 958 of 1358 Command Order The order for commands in the inquiry selection state is shown below. (1) A supported device inquiry (H'20) should be made to inquire about the supported devices. (2) The device should be selected from among those described by the returned information and set with a device-selection (H'10) command. (3) A clock-mode inquiry (H'21) should be made to inquire about the supported clock modes. (4) The clock mode should be selected from among those described by the returned information and set. (5) After selection of the device and clock mode, inquiries for other required information should be made, such as the multiplication-ratio inquiry (H'22) or operating frequency inquiry (H'23). (6) A new bit rate should be selected with the new bit-rate selection (H'3F) command, according to the returned information on multiplication ratios and operating frequencies. (7) After selection of the device and clock mode, the information of the user boot MAT and user MAT should be made to inquire about the user boot MATs information inquiry (H'24), user MATs information inquiry (H'25), erased block information inquiry (H'26), programming unit inquiry (H'27). (8) After making inquiries and selecting a new bit rate, issue the transition to programming/erasing state (H'40) command. The boot program will then enter the programming/erasing state. Programming/erasing State A programming selection command makes the boot program select the programming method, an n-byte programming command makes it program the memory with data, and an erasing selection command and block erasing command make it erase the block. The programming/erasing commands are listed below. Rev. 4.0, 03/03, page 959 of 1358 Table 19-83 Programming/erasing Command Command Command Name Description H'42 User boot MAT programming selection Transfers the user boot MAT programming program H'43 User MAT programming selection Transfers the user MAT programming program H'50 128-byte programming Programs 128 bytes of data H'48 Erasing selection Transfers the erasing program H'58 Block erasing Erases a block of data H'52 Memory read Reads the contents of memory H'4A User boot MAT sum check Checks the checksum of the user boot MAT H'4B User MAT sum check Checks the checksum of the user MAT H'4C User boot MAT blank check Checks whether the contents of the user boot MAT are blank H'4D User MAT blank check Checks whether the contents of the user MAT are blank H'4F Boot program status inquiry Inquires into the boot program's status (1) Programming Programming is executed by a programming-selection command and an 128-byte programming command. Firstly, the host should send the programming-selection command and select the programming method and programming MATs. There are two programming selection commands, and selection is according to the area and method for programming. * User boot MAT programming selection * User MAT programming selection After issuing the programming selection command, the host should send the 128-byte programming command. The 128-byte programming command that follows the selection command represents the data programmed according to the method specified by the selection command. When more than 128-byte data is programmed, 128-byte commands should repeatedly be executed. Sending an 128-byte programming command with H'FFFFFFFF as the address will stop the programming. On completion of programming, the boot program will wait for selection of programming or erasing. Where the sequence of programming operations that is executed includes programming with another method or of another MAT, the procedure must be repeated from the programming selection command. Rev. 4.0, 03/03, page 960 of 1358 The sequence for programming-selection and 128-byte programming commands is shown in figure 19-115. Host Boot program Programming selection (H'42, H'43, H'44) Transfer of the programming program ACK 128-byte programming (address, data) Repeat Programming ACK 128-byte programming (H'FFFFFFFF) ACK Figure 19-115 Programming Sequence (2) User boot MAT programming selection The boot program will transfer a programming program. The data is programmed to the user boot MATs by the transferred programming program. Command H'42 * Command, H'42, (1 byte): User boot-program programming selection Response H'06 * Response, H'06, (1 byte): Response to user boot-program programming selection When the programming program has been transferred, the boot program will return ACK. Error Response H'C2 ERROR * Error response: H'C2 (1 byte): Error response to user boot MAT programming selection * ERROR: (1 byte): Error code H'54: Selection processing error (transfer error occurs and processing is not completed) Rev. 4.0, 03/03, page 961 of 1358 (3) User MAT programming selection. The boot program will transfer a programming program. The data is programmed to the user MATs by the transferred programming program. Command H'43 * Command, H'43, (1 byte): User-program programming selection Response H'06 * Response, H'06, (1 byte): Response to user-program programming selection When the programming program has been transferred, the boot program will return ACK. Error Response H'C3 ERROR * Error response: H'C3 (1 byte): Error response to user MAT programming selection * ERROR: (1 byte): Error code H'54: Selection processing error (transfer error occurs and processing is not completed) (4) 128-byte programming The boot program will use the programming program transferred by the programming selection to program the user boot MATs or user MATs. Command H'50 Address Data *** *** SUM * Command, H'50, (1 byte): 128-byte programming * Programming Address (4 bytes): Start address for programming Multiple of the size specified in response to the programming unit inquiry (i.e. H'00, H'01, H'00, H'00: H'01000000) * Programming Data (128 bytes): Data to be programmed The size is specified in the response to the programming unit inquiry. * SUM (1 byte): Checksum Response H'06 * Response, H'06, (1 byte): Response to 128-byte programming On completion of programming, the boot program will return ACK. Rev. 4.0, 03/03, page 962 of 1358 Error Response H'D0 ERROR * Error response, H'D0, (1 byte): Error response for 128-byte programming * ERROR: (1 byte): Error code H'11: Checksum Error H'28: Address error The address is not within the specified range. H'53: Programming error A programming error has occurred and programming cannot be continued. The specified address should match the unit for programming of data. For example, when the programming is in 128-byte units, the lower byte of the address should be H'00 or H'80. When there are less than 128 bytes of data to be programmed, the host should fill the rest with H'FF. Sending the 128-byte programming command with the address of H'FFFFFFFF will stop the programming operation. The boot program will interpret this as the end of the programming and wait for selection of programming or erasing. Command H'50 Address SUM * Command, H'50, (1 byte): 128-byte programming * Programming Address (4 bytes): End code is H'FF, H'FF, H'FF, H'FF. * SUM (1 byte): Checksum Response H'06 * Response: H'06 (1 byte): Response to 128-byte programming On completion of programming, the boot program will return ACK. Error Response H'D0 ERROR * Error Response, H'D0, (1 byte): Error response for 128-byte programming ERROR: (1 byte): Error code H'11: Checksum error H'53: Programming error An error has occurred in programming and programming cannot be continued. Rev. 4.0, 03/03, page 963 of 1358 Erasure Erasure is performed with the erasure selection and block erasure command. Firstly, erasure is selected by the erasure selection command and the boot program then erases the specified block. The command should be repeatedly executed if two or more blocks are to be erased. Sending a block-erasure command from the host with the block number H'FF will stop the erasure operating. On completion of erasing, the boot program will wait for selection of programming or erasing. The sequences of the issuing of erasure selection commands and the erasure of data are shown in figure 19-116. Host Boot Program Preparation for Erasure (H'48) Transfer of Erasure Program ACK Erasure (Erased Block Number) Repeat Erasure ACK Erasure (H'FF) ACK Figure 19-116 Erasure Sequence (1) Erasure Selection The boot program will transfer the erasure program. User MAT data is erased by the transferred erasure program. Command H'48 * Command, H'48, (1 byte): Erasure selection Response H'06 * Response, H'06, (1 byte): Response for erasure selection After the erasure program has been transferred, the boot program will return ACK. Rev. 4.0, 03/03, page 964 of 1358 Error Response H'C8 ERROR * Error response: H'C8 (1 byte): Error response to erasing selection * ERROR: (1 byte): Error code H'54: Selection processing error (transfer error occurs and processing is not completed) (2) Block Erasure The boot program will erase the contents of the specified block. Command H'58 Size Block Number SUM * Command, H'58, (1 byte): Erasure * Size (1 byte): The number of bytes that represents the erasure block number This is fixed to 1. * Block Number (1 byte): Number of the block to be erased * SUM (1 byte): Checksum Response H'06 * Response, H'06, (1 byte): Response to Erasure After erasure has been completed, the boot program will return ACK. Error Response H'D8 ERROR * Error Response, H'D8, (1 byte): Error code * ERROR: (1 byte): Error code H'11: Sum check error H'29: Block number error Block number is incorrect. H'51: Erasure error An error has occurred during erasure. On receiving block number H'FF, the boot program will stop erasure and wait for a selection command. Command H'58 Size Block Number SUM * Command, H'58, (1 byte): Erasure * Size, (1 byte): The number of bytes that represents the block number This is fixed to 1. * Block Number (1 byte): H'FF Stop code for erasure * SUM (1 byte): Checksum Rev. 4.0, 03/03, page 965 of 1358 Response H'06 * Response, H'06, (1 byte): Response to end of erasure (ACK) When erasure is to be performed after the block number H'FF has been sent, the procedure should be executed from the erasure selection command. Memory Read The boot program will return the data in the specified address. Command H'52 Size Area Read address Read size SUM * Command: H'52 (1 byte): Memory read * Size (1 byte): Amount of data that represents the area, read address, and read size (fixed at 9) * Area (1 byte) H'00: User boot MAT H'01: User MAT An address error occurs when the area setting is incorrect. * Read address (4 bytes): Start address to be read from * Read size (4 bytes): Size of data to be read * SUM (1 byte): Checksum Response H'52 Read size Data *** SUM * Response: H'52 (1 byte): Response to memory read * Read size (4 bytes): Size of data to be read * Data (n bytes): Data for the read size from the read address * SUM (1 byte): Checksum Error Response H'D2 ERROR * Error response: H'D2 (1 byte): Error response to memory read * ERROR: (1 byte): Error code H'11: Sum check error H'2A: Address error The read address is not in the MAT. H'2B: Size error The read size exceeds the MAT. Rev. 4.0, 03/03, page 966 of 1358 User-Boot Program Sum check The boot program will return the byte-by-byte total of the contents of the bytes of the user-boot program. Command H'4A * Command, H'4A, (1 byte): Sum check for user-boot program Response H'5A Size Checksum of user boot program SUM * Response, H'5A, (1 byte): Response to the sum check of user-boot program * Size (1 byte): The number of bytes that represents the checksum This is fixed to 4. * Checksum of user boot program (4 bytes): Checksum of user boot MATs The total of the data is obtained in byte units. * SUM (1 byte): Sum check for data being transmitted User-Program Sum check The boot program will return the byte-by-byte total of the contents of the bytes of the user program. Command H'4B * Command, H'4B, (1 byte): Sum check for user program Response H'5B Size Checksum of user program SUM * Response, H'5B, (1 byte): Response to the sum check of the user program * Size (1 byte): The number of bytes that represents the checksum This is fixed to 4. * Checksum of user boot program (4 bytes): Checksum of user MATs The total of the data is obtained in byte units. * SUM (1 byte): Sum check for data being transmitted User Boot MAT Blank check The boot program will check whether or not all user boot MATs are blank and return the result. Command H'4C * Command, H'4C, (1 byte): Blank check for user boot MAT Response H'06 * Response, H'06, (1 byte): Response to the blank check of user boot MAT If all user MATs are blank (H'FF), the boot program will return ACK. Rev. 4.0, 03/03, page 967 of 1358 Error Response H'CC H'52 * Error Response, H'CC, (1 byte): Response to blank check for user boot MAT * Error Code, H'52, (1 byte): Erasure has not been completed. User MAT Blank Check The boot program will check whether or not all user MATs are blank and return the result. Command H'4D * Command, H'4D, (1 byte): Blank check for user MATs Response H'06 * Response, H'06, (1 byte): Response to the blank check for user boot MATs If the contents of all user MATs are blank (H'FF), the boot program will return ACK. Error Response H'CD H'52 * Error Response, H'CD, (1 byte) : Error response to the blank check of user MATs. * Error code H'52 (1 byte): Erasure has not been completed. Boot Program State Inquiry The boot program will return indications of its present state and error condition. This inquiry can be made in the inquiry/selection state or the programming/erasing state. Command H'4F * Command, H'4F, (1 byte): Inquiry regarding boot program's state Response H'5F Size STATUS ERROR SUM * Response, H'5F, (1 byte): Response to boot program state inquiry * Size (1 byte): The number of bytes that represents the STATUS and ERROR. This is fixed to 2. * STATUS (1 byte): State of the boot program For details, see table 19-84. * ERROR (1 byte): Error state ERROR = 0 indicates normal operation. ERROR = 1 indicates error has occurred For details, see table 19-85. * SUM (1 byte): Checksum Rev. 4.0, 03/03, page 968 of 1358 Table 19-84 Status Code Code Description H'11 Device Selection Wait H'12 Clock Mode Selection Wait H'13 Bit Rate Selection Wait H'IF Programming/Erasing State Transition Wait (Bit rate selection is completed) H'31 Programming State for Erasure H'3F Programming/Erasing Selection Wait (Erasure is completed) H'4F Programming Data Receive Wait (Programming is completed) H'5F Erasure Block Specification Wait (Erasure is completed) Table 19-85 Error Code Code Description H'00 No Error H'11 Sum Check Error H'12 Program Size Error H'21 Device Code Mismatch Error H'22 Clock Mode Mismatch Error H'24 Bit Rate Selection Error H'25 Input Frequency Error H'26 Multiplication Ratio Error H'27 Operating Frequency Error H'29 Block Number Error H'2A Address Error H'2B Data Length Error H'51 Erasure Error H'52 Erasure Incompletion Error H'53 Programming Error H'54 Selection Error H'80 Command Error H'FF Bit-Rate-Adjustment Confirmation Error Rev. 4.0, 03/03, page 969 of 1358 19.38.2 AC Characteristics and Timing in PROM Mode Table 19-86 AC Characteristics in Memory Read Mode Condition: VCC = 3.3 V 0.3 V, VSS = 0 V, Ta = 25uC 5uC Code Symbol Min Max Unit Command write cycle tnxtc 20 -- s CE hold time tceh 0 -- ns CE setup time tces 0 -- ns Data hold time tdh 50 -- ns Data setup time tds 50 -- ns Programming pulse width twep 70 -- ns WE rise time tr -- 30 ns WE fall time tf -- 30 ns Command write Memory read mode Address stable A18-0 tces tceh tnxtc CE OE twep tf tr WE tds tdh I/O7 to I/O0 Note : Data is latched at the rising edge of WE. Figure 19-117 Memory Read Timing after Command Write Rev. 4.0, 03/03, page 970 of 1358 Table 19-87 AC Characteristics in Transition from Memory Read Mode to Others Condition: VCC = 3.3 V 0.3 V, VSS = 0 V, Ta = 25uC 5uC Code Symbol Min Max Unit Command write cycle tnxtc 20 -- s CE hold time tceh 0 -- ns CE setup time tces 0 -- ns Data hold time tdh 50 -- ns Data setup time tds 50 -- ns Programming pulse width twep 70 -- ns WE rise time tr -- 30 ns WE fall time tf -- 30 ns Other Mode Command Write Memory Read Mode A18-0 Address Stable tnxtc tces tceh CE OE tf twep tr WE tds tdh I/O7 to I/O0 Note : WE and OE should not be enabled simultaneously. Figure 19-118 Timing at Transition from Memory Read Mode to Other Modes Rev. 4.0, 03/03, page 971 of 1358 Table 19-88 AC Characteristics Memory Read Mode Condition: VCC = 3.3 V 0.3 V, VSS = 0 V, Ta = 25uC 5uC Code Symbol Min Max Unit Access time tacc -- 20 s CE output delay time tce -- 150 ns OE output delay time toe -- 150 ns Output disable delay time tdf -- 100 ns Data output hold time toh 5 -- ns Address Stable A18-0 CE VIL OE VIL WE VIH Address Stable tacc tacc toh toh I/O7 to I/O0 Figure 19-119 CE/OE CE OE Enable State Read Address Stable A18-0 Address Stable tce tce CE WE toe toe OE VIH tacc tacc toh tdf I/O7 to I/O0 Figure 19-120 CE/OE CE OE Clock Read Rev. 4.0, 03/03, page 972 of 1358 toh tdf Table 19-89 AC Characteristics Auto-Write Mode Condition: VCC = 3.3 V 0.3 V, VSS = 0 V, Ta = 25uC 5uC Code Symbol Min Max Unit Command write cycle tnxtc 20 -- s CE hold time tceh 0 -- ns CE setup time tces 0 -- ns Data hold time tdh 50 -- ns Data setup time tds 50 -- ns Programming pulse width twep 70 -- ns Status polling start time twsts 1 -- ms Status polling access time tspa -- 150 ns Address setup time tas 0 -- ns Address hold time tah 60 -- ns Memory programming time twrite 1 3000 ms WE rise time tr -- 30 ns WE fall time tf -- 30 ns Address stable A18 to A0 tceh tnxtc tces tnxtc CE OE tf twep tas tr WE tah tspa twsts Data transfer 1 byte to 128 bytes tds tdh twrite I/O7 Programming operation end identification signal I/O6 Programming normal end identification signal I/O5 to I/O0 H'00 H'40 Figure 19-121 Timing in Auto-Write Mode Rev. 4.0, 03/03, page 973 of 1358 Table 19-90 AC Characteristics Auto-Erase Mode Condition: VCC = 3.3 V 0.3 V, VSS = 0 V, Ta = 25uC 5uC Code Symbol Min Max Unit Command write cycle tnxtc 20 -- s CE hold time tceh 0 -- ns CE setup time tces 0 -- ns Data hold time tdh 50 -- ns Data setup time tds 50 -- ns Programming pulse width twep 70 -- ns Status polling start time tests 1 -- ms Status polling access time tspa -- 150 ns Memory erase time terase 100 40000 ms WE rise time tr -- 30 ns WE fall time tf -- 30 ns A18 to A0 tens tces tnxtc tceh tnxtc CE OE WE tf twep tests tr tds terase tdh I/O7 Erase end identification signal I/O6 I/O5 to I/O0 tspa Erase normal and confirmation signal H'20 H'20 H'00 Figure 19-122 Timing in Auto-Erase Mode Rev. 4.0, 03/03, page 974 of 1358 Table 19-91 AC Characteristics Status Read Mode Condition: VCC = 3.3 V 0.3 V, VSS = 0 V, Ta = 25uC 5uC Code Symbol Min Max Unit Command write cycle tnxtc 20 s CE hold time tceh 0 ns CE setup time tces 0 ns Data hold time tdh 50 ns Data setup time tds 50 ns Programming pulse width twep 70 ns OE output delay time toe 150 ns Disable delay time tdf 100 ns CE output delay time tce 150 ns WE rise time tr 30 ns WE fall time tf 30 ns A18 to A0 tces tnxtc tceh tces tnxtc tceh tnxtc CE tce OE WE tf twep tr tds I/O7 to I/O0 tf tdh twep tds H'71 toe tr tdf tdh H'71 Note: I/O3 and I/O2 are undefined. Figure 19-123 Timing in Status Read Mode Table 19-92 Stipulated Transition Times to Command Wait State Condition: VCC = 3.3 V 0.3 V, VSS = 0 V, Ta = 25uC 5uC Code Symbol Min Max Unit Standby release (oscillation settling time) tosc1 30 ms PROM mode setup time tbmv 10 ms VCC hold time tdwn 0 ms Rev. 4.0, 03/03, page 975 of 1358 tosc1 tbmv Memory read mode Command wait state Auto-program mode Auto-erase mode Command wait state Normal/abnormal end identification t dwn VCC RES Command acceptance Figure 19-124 Oscillation Stabilization Time, PROM Mode Setup Time, and Power-Down Sequence 19.38.3 Procedure Program and Storable Area for Programming Data In the descriptions in the previous section, the programming/erasing procedure programs and storable areas for program data are assumed to be in the on-chip RAM. However, the program and the data can be stored in and executed from other areas, such as part of flash memory which is not to be programmed or erased, or somewhere in the external address space. Conditions that Apply to Programming/Erasing (1) The on-chip programming/erasing program is downloaded from the address set by FTDAR in on-chip RAM, therefore, this area is not available for use. (2) The on-chip programming/erasing program will use the 128 bytes as a stack. So, make sure that this area is secured. (3) Since download by setting the SCO bit to 1 will cause the MATs to be switched, it should be executed in on-chip RAM. (4) The flash memory is accessible until the start of programming or erasing, that is, until the result of downloading has been judged. When in a mode in which the external address space is not accessible, such as single-chip mode, the required procedure programs should be transferred to the on-chip RAM before programming/erasing of the flash memory starts. (5) The flash memory is not accessible during programming/erasing operations, therefore, the operation program is downloaded to the on-chip RAM to be executed. The NMI-handling vector and programs such as that which activate the operation program should thus be stored in on-chip memory other than flash memory or the external address space. (6) After programming/erasing, the flash memory should be inhibited until FKEY is cleared. The reset state (RES = 0) must be in place for more than 100 s when the LSI mode is changed to reset on completion of a programming/erasing operation. Transitions to the reset state, and hardware standby mode are inhibited during programming/erasing. When the reset signal is accidentally input to the chip, a longer period in the reset state than usual (100 s) is needed before the reset signal is released. (7) Switching of the MATs by FMATS should be needed when programming/erasing of the user boot MAT is operated in user-boot mode. The program which switches the MATs should be Rev. 4.0, 03/03, page 976 of 1358 executed from the on-chip RAM. See section 19.27, Switching between User MAT and User Boot MAT. Please make sure you know which MAT is selected when switching between them. (8) When the data storable area indicated by programming parameter FMPDR is within the flash memory area, an error will occur even when the data stored is normal. Therefore, the data should be transferred to the on-chip RAM to place the address that FMPDR indicates in an area other than the flash memory. In consideration of these conditions, there are three factors; operating mode, the bank structure of the user MAT, and operations. The areas in which the programming data can be stored for execution are shown in table 19-26. Table 19-93 Executable MAT Initiated Mode Operation User Program Mode User Boot Mode* Programming Table 19-94 (1) Table 19-94 (3) Erasing Table 19-94 (2) Table 19-94 (4) Note: * Programming/Erasing is possible to user MATs. Rev. 4.0, 03/03, page 977 of 1358 Table 19-94 (1) Useable Area for Programming in User Program Mode Storable/Executable Area Item On-chip RAM Programming Procedure Storage Area for Program Data User MAT Selected MAT External Space (Expanded Mode) x* User MAT Embedded Program Storage Area -- -- Operation for Selection of On-chip Program to be Downloaded Operation for Writing H'A5 to Key Register Execution of Writing SC0 = 1 to FCCS (Download) x x x x Operation for Key Register Clear Judgement of Download Result Operation for Download Error Operation for Settings of Initial Parameter Execution of Initialization Judgement of Initialization Result Operation for Initialization Error Operation for Inhibit of Interrupt Operation for Writing H'5A to Key Register Operation for Settings of Program Parameter x Execution of Programming x Judgement of Program Result x Operation for Program Error x Operation for Key Register Clear x x Note: * Transferring the data to the on-chip RAM enables this area to be used. Rev. 4.0, 03/03, page 978 of 1358 Table 19-94 (2) Useable Area for Erasure in User Program Mode Storable/Executable Area Item On-chip RAM Selected MAT User MAT External Space (Expanded Mode) x x x x User MAT Embedded Program Storage Area Erasing Procedure Operation for Selection of On-chip Program to be Downloaded Operation for Writing H'A5 to Key Register Execution of Writing SC0 = 1 to FCCS (Download) Operation for Key Register Clear Judgement of Download Result Operation for Download Error Operation for Settings of Default Parameter Execution of Initialization Judgement of Initialization Result Operation for Initialization Error Operation for Inhibit of Interrupt Operation for Writing H'5A to Key Register Operation for Settings of Erasure Parameter x Execution of Erasure x Judgement of Erasure Result x Operation for Erasure Error x Operation for Key Register Clear x x Rev. 4.0, 03/03, page 979 of 1358 Table 19-94 (3) Useable Area for Programming in User Boot Mode Storable/Executable Area User Boot MAT x*1 External Space (Expanded Mode) x x x x Switching MATs by FMATS x x Operation for Writing H'5A to Key Register x Operation for Settings of Program Parameter x Execution of Programming x Judgement of Program Result x Operation for Program Error x*2 Item On-chip RAM Programming procedure Storage Area for Program Data Selected MAT User MAT User Boot MAT Embedded Program Storage Area -- -- -- Operation for Selection of On-chip Program to be Downloaded Operation for Writing H'A5 to Key Register Execution of Writing SC0 = 1 to FCCS (Download) Operation for Key Register Clear Judgement of Download Result Operation for Download Error Operation for Settings of Default Parameter Execution of Initialization Judgement of Initialization Result Operation for Initialization Error Operation for Interrupt Inhibit Operation for Key Register Clear x Switching MATs by FMATS x Notes: x x *1 Transferring the data to the on-chip RAM enables this area to be used. *2 Switching FMATS by a program in the on-chip RAM enables this area to be used. Rev. 4.0, 03/03, page 980 of 1358 Table 19-94 (4) Useable Area for Erasure in User Boot Mode Storable/Executable Area User Boot MAT External Space (Expanded Mode) x x x x Switching MATs by FMATS x x Operation for Writing H'5A to Key Register x Operation for Settings of Erasure Parameter x Execution of Erasure x x Erasing Procedure Item On-chip RAM Selected MAT User MAT User Boot MAT Embedded Program Storage Area Operation for Selection of On-chip Program to be Downloaded Operation for Writing H'A5 to Key Register Execution of Writing SC0 = 1 to FCCS (Download) Operation for Key Register Clear Judgement of Download Result Operation for Download Error Operation for Settings of Default Parameter Execution of Initialization Judgement of Initialization Result Operation for Initialization Error Operation for Interrupt Inhibit Judgement of Erasure Result Operation for Erasure Error x* Operation for Key Register Clear x Switching MATs by FMATS x x x Note: * Switching FMATS by a program in the on-chip RAM enables this area to be used. Rev. 4.0, 03/03, page 981 of 1358 Rev. 4.0, 03/03, page 982 of 1358 Section 20 Clock Pulse Generator 20.1 Overview The chip has an on-chip clock pulse generator (CPG) that generates the system clock (), the bus master clock, and internal clocks. The clock pulse generator consists of an oscillator circuit, a duty adjustment circuit, a mediumspeed clock divider, and a bus master clock selection circuit. In the chip, the CPG has a medium-speed mode in which the bus master runs on a medium-speed clock and the other supporting modules run on the high-speed clock, and a function that allows the medium-speed mode to be disabled and the clock division ratio to be changed for the entire chip. A clock from /2 to /32 can be selected. 20.1.1 Block Diagram Figure 20-1 shows a block diagram of the clock pulse generator. SCKCR SCK2 to SCK0 DIV EXTAL Oscillator XTAL Duty adjustment circuit Mediumspeed clock divider System clock to pin f/2 to f/32 Bus master clock selection circuit Internal clock to supporting modules Bus master clock to CPU, DTC, and DMAC* Note: * The DMAC is not supported in the H8S/2321. Figure 20-1 Block Diagram of Clock Pulse Generator Rev. 4.0, 03/03, page 983 of 1358 20.1.2 Register Configuration The clock pulse generator is controlled by SCKCR. Table 20-1 shows the register configuration. Table 20-1 Clock Pulse Generator Register Name Abbreviation R/W Initial Value Address* System clock control register SCKCR R/W H'00 H'FF3A Note: * Lower 16 bits of the address. 20.2 Register Descriptions 20.2.1 System Clock Control Register (SCKCR) Bit : Initial value : R/W : 7 6 5 4 3 2 1 0 PSTOP -- DIV -- -- SCK2 SCK1 SCK0 0 0 0 0 0 0 0 0 R/W R/W R/W -- -- R/W R/W R/W SCKCR is an 8-bit readable/writable register that controls clock output, the medium-speed mode in which the bus master runs on a medium-speed clock and the other supporting modules run on the high-speed clock, and a function that allows the medium-speed mode to be disabled and the clock division ratio to be changed for the entire chip. SCKCR is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in software standby mode. Bit 7-- Clock Output Disable (PSTOP): Controls output. Description Bit 7 PSTOP Normal Operation Sleep Mode Software Standby Mode Hardware Standby Mode 0 output (Initial value) output Fixed high High impedance 1 Fixed high Fixed high Fixed high High impedance Bit 6--Reserved: This bit can be read or written to, but only 0 should be written. Bit 5--Division Ratio Select (DIV): When the DIV bit is set to 1, the medium-speed mode is disabled and a clock obtained using the division ratio set with bits SCK2 to SCK0 is supplied to the entire chip. In this way, the current dissipation within the chip is reduced in proportion to the division ratio. As the frequency of changes, the following points must be noted. Rev. 4.0, 03/03, page 984 of 1358 * The division ratio set with bits SCK2 to SCK0 should be selected so as to fall within the guaranteed operation range of clock cycle time tcyc given in the AC timing table in the Electrical Characteristics section. Ensure that min = 2 MHz, and the condition < 2 MHz does not arise. * All internal modules basically operate on . Note, therefore, that time processing involving the timers, the SCI, etc., will change when the division ratio changes. The wait time when software standby is cleared will also change in line with a change in the division ratio. * The division ratio can be changed while the chip is operating. The clock output from the pin will also change when the division ratio is changed. The frequency of the clock output from the pin in this case will be as follows: = EXTAL x n Where: EXTAL: Crystal resonator or external clock frequency Division ratio (n = /2, /4, or /8) n: * Do not set the DIV bit and bits SCK2 to SCK0 simultaneously. First set the DIV bit, then bits SCK2 to SCK0. Bit 5 DIV Description 0 When bits SCK2 to SCK0 are set to other than high-speed mode, medium-speed mode is set (Initial value) 1 When bits SCK2 to SCK0 are set to other than high-speed mode, a divided clock is supplied to the entire chip Bits 4 and 3--Reserved: These bits cannot be modified and are always read as 0. Bits 2 to 0--System Clock Select 2 to 0 (SCK2 to SCK0): When the DIV bit is cleared to 0, these bits select the medium-speed mode; when the DIV bit is set to 1, they select the division ratio of the clock supplied to the entire chip. Description Bit 2 SCK2 Bit 1 SCK1 Bit 0 SCK0 0 0 0 Bus master is in high-speed Bus master is in high-speed mode (Initial value) mode (Initial value) 1 Medium-speed clock is /2 Clock supplied to entire chip is /2 0 Medium-speed clock is /4 Clock supplied to entire chip is /4 1 Medium-speed clock is /8 Clock supplied to entire chip is /8 0 Medium-speed clock is /16 -- 1 Medium-speed clock is /32 -- -- -- -- 1 1 0 1 DIV = 0 DIV = 1 Rev. 4.0, 03/03, page 985 of 1358 20.3 Oscillator Clock pulses can be supplied by connecting a crystal resonator, or by input of an external clock. 20.3.1 Connecting a Crystal Resonator Circuit Configuration: A crystal resonator can be connected as shown in the example in figure 20-2. Select the damping resistance Rd according to table 20-2. An AT-cut parallel-resonance crystal should be used. CL1 EXTAL XTAL CL2 Rd CL1 = CL2 = 10 to 22 pF Figure 20-2 Connection of Crystal Resonator (Example) Table 20-2 Damping Resistance Value Frequency (MHz) 2 4 8 12 16 20 25 Rd () 6.8 k 500 200 0 0 0 0 Crystal Resonator: Figure 20-3 shows the equivalent circuit of the crystal resonator. Use a crystal resonator that has the characteristics shown in table 20-3 and the same resonance frequency as the system clock (). CL L Rs XTAL EXTAL C0 AT-cut parallel-resonance type Figure 20-3 Crystal Resonator Equivalent Circuit Rev. 4.0, 03/03, page 986 of 1358 Table 20-3 Crystal Resonator Characteristics Frequency (MHz) 2 4 8 12 16 20 25 RS max () 500 120 80 60 50 40 40 C0 max (pF) 7 7 7 7 7 7 7 Notes on Board Design: When a crystal resonator is connected, the following points should be noted: Other signal lines should be routed away from the oscillator circuit to prevent induction from interfering with correct oscillation. See figure 20-4. When designing the board, place the crystal resonator and its load capacitors as close as possible to the XTAL and EXTAL pins. Avoid Signal A Signal B Chip CL2 XTAL EXTAL CL1 Figure 20-4 Example of Incorrect Board Design Rev. 4.0, 03/03, page 987 of 1358 20.3.2 External Clock Input Circuit Configuration: An external clock signal can be input as shown in the examples in figure 20-5. If the XTAL pin is left open, make sure that stray capacitance is no more than 10 pF. In example (b), make sure that the external clock is held high in standby mode. EXTAL External clock input XTAL Open (a) XTAL pin left open EXTAL External clock input XTAL (b) Complementary clock input at XTAL pin Figure 20-5 External Clock Input (Examples) External Clock: The external clock signal should have the same frequency as the system clock (). Table 20-4 and figure 20-6 show the input conditions for the external clock. Rev. 4.0, 03/03, page 988 of 1358 Table 20-4 External Clock Input Conditions VCC = 2.7 V to 3.6 V VCC = 3.0 V to 3.6 V Item Symbol Min Max Min Max Unit Test Conditions External clock input low pulse width tEXL 20 -- 10 -- ns Figure 20-6 External clock input high pulse width tEXH 20 -- 10 -- ns External clock rise time tEXr -- 5 -- 5 ns External clock fall time tEXf -- 5 -- 5 ns Clock low pulse width level tCL 0.4 0.6 0.4 0.6 tcyc 5 MHz 80 -- 80 -- ns < 5 MHz Clock high pulse width level tCH 0.4 0.6 0.4 0.6 tcyc 5 MHz 80 -- 80 -- ns < 5 MHz EXTAL XTAL Figure 22-2 External clock input Open (a) XTAL pin left open EXTAL External clock input XTAL (b) Complementary clock input at XTAL pin Figure 20-6 External Clock Input Timing Rev. 4.0, 03/03, page 989 of 1358 20.4 Duty Adjustment Circuit When the oscillator frequency is 5 MHz or higher, the duty adjustment circuit adjusts the duty cycle of the clock signal from the oscillator to generate the system clock (). 20.5 Medium-Speed Clock Divider The medium-speed clock divider divides the system clock to generate /2, /4, /8, /16, and /32. 20.6 Bus Master Clock Selection Circuit The bus master clock selection circuit selects the system clock () or one of the medium-speed clocks (/2, /4, /8, /16, or /32) to be supplied to the bus master, according to the settings of the SCK2 to SCK0 bits in SCKCR. Rev. 4.0, 03/03, page 990 of 1358 Section 21 Power-Down Modes 21.1 Overview In addition to the normal program execution state, the chip has five power-down modes in which operation of the CPU and oscillator is halted and power dissipation is reduced. Low-power operation can be achieved by individually controlling the CPU, on-chip supporting modules, and so on. The chip operating modes are as follows: 1. High-speed mode 2. Medium-speed mode 3. Sleep mode 4. Module stop mode 5. Software standby mode 6. Hardware standby mode Of these, 2 to 6 are power-down modes. Sleep mode is a CPU mode, medium-speed mode is a CPU and bus master mode, and module stop mode is an on-chip supporting module mode (including bus masters other than the CPU). A combination of these modes can be set. After a reset, the chip is in high-speed mode. Table 21-1 shows the conditions for transition to the various modes, the status of the CPU, on-chip supporting modules, etc., and the method of clearing each mode. Rev. 4.0, 03/03, page 991 of 1358 Table 21-1 Operating Modes CPU Operating Mode Transition Clearing Condition Condition High speed mode Control register Functions High speed MediumControl speed mode register Functions Sleep mode Instruction Module stop mode Control register Software standby mode Instruction Hardware standby mode Pin Interrupt External interrupt Oscillator Modules Registers Function Registers I/O Ports High speed Function High speed Medium Function speed High/ Function medium 1 speed * High speed Functions Halted Retained High speed Function High speed Functions Function High/ medium speed Halted Retained/ 2 reset * Retained Halted Halted Retained Halted Retained/ 2 reset * Retained Halted Halted Undefined Halted Reset High impedance Notes: *1 The bus master operates on the medium-speed clock, and other on-chip supporting modules on the high-speed clock. *2 Some SCI registers and the A/D converter are reset, and other on-chip supporting modules retain their states. 21.1.1 Register Configuration Power-down modes are controlled by the SBYCR, SCKCR, and MSTPCR registers. Table 21-2 summarizes these registers. Table 21-2 Power-Down Mode Registers Name Abbreviation R/W Initial Value Address* Standby control register SBYCR R/W H'08 H'FF38 System clock control register SCKCR R/W H'00 H'FF3A Module stop control register H MSTPCRH R/W H'3F H'FF3C Module stop control register L MSTPCRL R/W H'FF H'FF3D Note: * Lower 16 bits of the address. Rev. 4.0, 03/03, page 992 of 1358 21.2 Register Descriptions 21.2.1 Standby Control Register (SBYCR) Bit : Initial value : R/W : 7 6 5 4 3 2 1 0 SSBY STS2 STS1 STS0 OPE -- -- IRQ37S 0 0 0 0 1 0 0 0 R/W R/W R/W R/W R/W -- -- R/W SBYCR is an 8-bit readable/writable register that performs software standby mode control. SBYCR is initialized to H'08 by a reset and in hardware standby mode. It is not initialized in software standby mode. Bit 7--Software Standby (SSBY): Specifies a transition to software standby mode. Remains set to 1 when software standby mode is released by an external interrupt, and a transition is made to normal operation. The SSBY bit should be cleared by writing 0 to it. Bit 7 SSBY Description 0 Transition to sleep mode after execution of SLEEP instruction 1 Transition to software standby mode after execution of SLEEP instruction (Initial value) Bits 6 to 4--Standby Timer Select 2 to 0 (STS2 to STS0): These bits select the time the MCU waits for the clock to stabilize when software standby mode is cleared by an external interrupt. With crystal oscillation, refer to table 21-4 and make a selection according to the operating frequency so that the standby time is at least 8 ms (the oscillation stabilization time). With an external clock, any selection can be made*. Note: * Except in the F-ZTAT versions. Rev. 4.0, 03/03, page 993 of 1358 Bit 6 STS2 Bit 5 STS1 Bit 4 STS0 Description 0 0 0 Standby time = 8192 states 1 Standby time = 16384 states 0 Standby time = 32768 states 1 Standby time = 65536 states 0 Standby time = 131072 states 1 Standby time = 262144 states 0 Reserved 1 Standby time = 16 states* 1 1 0 1 (Initial value) Note: * Not available in the F-ZTAT versions. Bit 3--Output Port Enable (OPE): Specifies whether the output of the address bus and bus control signals (CS0 to CS7, AS, RD, HWR, LWR, CAS) is retained or set to the high-impedance state in software standby mode. Bit 3 OPE Description 0 In software standby mode, address bus and bus control signals are high-impedance 1 In software standby mode, address bus and bus control signals retain output state (Initial value) Bits 2 and 1--Reserved: These bits cannot be modified and are always read as 0. Bit 0--IRQ37 Software Standby Clear Select (IRQ37S): Specifies whether inputs IRQ3 to IRQ7 can be used as software standby mode clearing sources in addition to the usual sources, NMI and IRQ0 to IRQ2 inputs. Bit 0 IRQ37S Description 0 Inputs IRQ3 to IRQ7 cannot be used as software standby mode clearing sources (Initial value) 1 Inputs IRQ3 to IRQ7 can be used as software standby mode clearing sources Rev. 4.0, 03/03, page 994 of 1358 21.2.2 Bit System Clock Control Register (SCKCR) : Initial value : R/W : 7 6 5 4 3 2 1 0 PSTOP -- DIV -- -- SCK2 SCK1 SCK0 0 0 0 0 0 0 0 0 R/W R/W R/W -- -- R/W R/W R/W SCKCR is an 8-bit readable/writable register that controls clock output, the medium-speed mode in which the bus master runs on a medium-speed clock and the other supporting modules run on the high-speed clock, and a function that allows the medium-speed mode to be disabled and the clock division ratio to be changed for the entire chip. SCKCR is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in software standby mode. Bit 7-- Clock Output Disable (PSTOP): Controls output. Description Bit 7 PSTOP Normal Operating Mode Sleep Mode Software Standby Mode Hardware Standby Mode 0 output (Initial value) output Fixed high High impedance 1 Fixed high Fixed high Fixed high High impedance Bit 6--Reserved: This bit can be read or written to, but only 0 should be written. Bit 5--Division Ratio Select (DIV): When the DIV bit is set to 1, the medium-speed mode is disabled and a clock obtained using the division ratio set with bits SCK2 to SCK0 is supplied to the entire chip. In this way, the current dissipation within the chip is reduced in proportion to the division ratio. As the frequency of changes, the following points must be noted. * The division ratio set with bits SCK2 to SCK0 should be selected so as to fall within the guaranteed operation range of clock cycle time tcyc given in the AC timing table in the Electrical Characteristics section. Ensure that min = 2 MHz, and the condition < 2 MHz does not arise. * All internal modules basically operate on . Note, therefore, that time processing involving the timers, the SCI, etc., will change when the division ratio changes. The wait time when software standby is cleared will also change in line with a change in the division ratio. Rev. 4.0, 03/03, page 995 of 1358 * The division ratio can be changed while the chip is operating. The clock output from the pin will also change when the division ratio is changed. The frequency of the clock output from the pin in this case will be as follows: = EXTAL x n Where: EXTAL: Crystal resonator or external clock frequency Division ratio (n = /2, /4, or /8) n: * Do not set the DIV bit and bits SCK2 to SCK0 simultaneously. First set the DIV bit, then bits SCK2 to SCK0. Bit 5 DIV Description 0 When bits SCK2 to SCK0 are set to other than high-speed mode, medium-speed mode is set (Initial value) 1 When bits SCK2 to SCK0 are set to other than high-speed mode, a divided clock is supplied to the entire chip Bits 4 and 3--Reserved: These bits cannot be modified and are always read as 0. Bits 2 to 0--System Clock Select 2 to 0 (SCK2 to SCK0): When the DIV bit is cleared to 0, these bits select the bus master clock; when the DIV bit is set to 1, they select the division ratio of the clock supplied to the entire chip. Bit 2 SCK2 Bit 1 SCK1 Bit 0 SCK0 0 0 DIV = 0 DIV = 1 0 Bus master is in high-speed mode (Initial value) Bus master is in high-speed mode (Initial value) 1 Medium-speed clock is /2 Clock supplied to entire chip is /2 0 Medium-speed clock is /4 Clock supplied to entire chip is /4 1 Medium-speed clock is /8 Clock supplied to entire chip is /8 0 0 Medium-speed clock is /16 -- 1 Medium-speed clock is /32 -- 1 -- -- -- 1 1 Description Rev. 4.0, 03/03, page 996 of 1358 21.2.3 Module Stop Control Register (MSTPCR) MSTPCRH Bit MSTPCRL : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Initial value : 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 R/W : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W MSTPCR is a 16-bit readable/writable register that performs module stop mode control. MSTPCR is initialized to H'3FFF by a reset and in hardware standby mode. It is not initialized in software standby mode. Bits 15 to 0--Module Stop (MSTP15 to MSTP0): These bits specify module stop mode. See table 21-3 for the method of selecting on-chip supporting modules. Bits 15 to 0 MSTP15 to MSTP0 Description 0 Module stop mode cleared 1 Module stop mode set Rev. 4.0, 03/03, page 997 of 1358 21.3 Medium-Speed Mode When the SCK2 to SCK0 bits in SCKCR are set to 1, the operating mode changes to mediumspeed mode as soon as the current bus cycle ends. In medium-speed mode, the CPU operates on the operating clock (/2, /4, /8, /16, or /32) specified by the SCK2 to SCK0 bits. The bus masters other than the CPU (the DMAC* and DTC) also operate in medium-speed mode. On-chip supporting modules other than the bus masters always operate on the high-speed clock (). In medium-speed mode, a bus access is executed in the specified number of states with respect to the bus master operating clock. For example, if /4 is selected as the operating clock, on-chip memory is accessed in 4 states, and internal I/O registers in 8 states. Medium-speed mode is cleared by clearing all of bits SCK2 to SCK0 to 0. A transition is made to high-speed mode and medium-speed mode is cleared at the end of the current bus cycle. If a SLEEP instruction is executed when the SSBY bit in SBYCR is cleared to 0, a transition is made to sleep mode. When sleep mode is cleared by an interrupt, medium-speed mode is restored. If a SLEEP instruction is executed when the SSBY bit in SBYCR is set to 1, a transition is made to software standby mode. When software standby mode is cleared by an external interrupt, mediumspeed mode is restored. When the RES pin is driven low, a transition is made to the reset state, and medium-speed mode is cleared. The same applies in the case of a reset caused by overflow of the watchdog timer. When the STBY pin is driven low, a transition is made to hardware standby mode. Figure 21-1 shows the timing for transition to and clearance of medium-speed mode. Note: * The DMAC is not supported in the H8S/2321. Medium-speed mode f, supporting module clock Bus master clock Internal address bus SCKCR SCKCR Internal write signal Figure 21-1 Medium-Speed Mode Transition and Clearance Timing Rev. 4.0, 03/03, page 998 of 1358 21.4 Sleep Mode If a SLEEP instruction is executed when the SSBY bit in SBYCR is cleared to 0, the CPU enters sleep mode. In sleep mode, CPU operation stops but the contents of the CPU's internal registers are retained. Other supporting modules do not stop. Sleep mode is cleared by a reset or any interrupt, and the CPU returns to the normal program execution state via the exception handling state. Sleep mode is not cleared if interrupts are disabled, or if interrupts other than NMI are masked by the CPU. When the STBY pin is driven low, a transition is made to hardware standby mode. 21.5 Module Stop Mode 21.5.1 Module Stop Mode Module stop mode can be set for individual on-chip supporting modules. When the corresponding MSTP bit in MSTPCR is set to 1, module operation stops at the end of the bus cycle and a transition is made to module stop mode. The CPU continues operating independently. Table 21-3 shows MSTP bits and the corresponding on-chip supporting modules. When the corresponding MSTP bit is cleared to 0, module stop mode is cleared and the module starts operating at the end of the bus cycle. In module stop mode, the internal states of modules other than the SCI and A/D converter are retained. After reset clearance, all modules other than DMAC* and DTC are in module stop mode. When an on-chip supporting module is in module stop mode, read/write access to its registers is disabled. Do not make a transition to sleep mode with MSTPCR set to H'FFFF or H'EFFF, as this will halt operation of the bus controller. Note: * The DMAC is not supported in the H8S/2321. Rev. 4.0, 03/03, page 999 of 1358 Table 21-3 MSTP Bits and Corresponding On-Chip Supporting Modules Register Bit Module MSTPCRH MSTP15 DMA controller (DMAC)* MSTP14 Data transfer controller (DTC) MSTP13 16-bit timer-pulse unit (TPU) MSTPCRL MSTP12 8-bit timer module MSTP11 Programmable pulse generator (PPG) MSTP10 D/A converter (channels 0 and 1) MSTP9 A/D converter MSTP8 -- MSTP7 Serial communication interface (SCI) channel 2 MSTP6 Serial communication interface (SCI) channel 1 MSTP5 Serial communication interface (SCI) channel 0 MSTP4 -- MSTP3 -- MSTP2 -- MSTP1 -- MSTP0 -- Notes: Bits 8 and 4 to 0 can be read or written to, but do not affect operation. * The DMAC is not supported in the H8S/2321. 21.5.2 Usage Notes DMAC*/DTC Module Stop: Depending on the operating status of the DMAC* or DTC, the MSTP15 and MSTP14 bits may not be set to 1. Setting of the DMAC* or DTC module stop mode should be carried out only when the respective module is not activated. For details, refer to section 7, DMA Controller, and section 8, Data Transfer Controller. On-Chip Supporting Module Interrupts: Relevant interrupt operations cannot be performed in module stop mode. Consequently, if module stop mode is entered when an interrupt has been requested, it will not be possible to clear the CPU interrupt source or the DMAC* or DTC activation source. Interrupts should therefore be disabled before entering module stop mode. Writing to MSTPCR: MSTPCR should only be written to by the CPU. Note: * The DMAC is not supported in the H8S/2321. Rev. 4.0, 03/03, page 1000 of 1358 21.6 Software Standby Mode 21.6.1 Software Standby Mode If a SLEEP instruction is executed when the SSBY bit in SBYCR is set to 1, software standby mode is entered. In this mode, the CPU, on-chip supporting modules, and oscillator all stop. However, the contents of the CPU's internal registers, RAM data, and the states of on-chip supporting modules other than the SCI and A/D converter, and I/O ports, are retained. Whether the address bus and bus control signals are placed in the high-impedance state or retain the output state can be specified by the OPE bit in SBYCR. See Appendix D, Pin States, for details. In this mode the oscillator stops, and therefore power dissipation is significantly reduced. 21.6.2 Clearing Software Standby Mode Software standby mode is cleared by an external interrupt (NMI pin, or pins IRQ0 to IRQ7*), or by means of the RES pin or STBY pin. Clearing with an Interrupt: When an NMI or IRQ0 to IRQ7* interrupt request signal is input, clock oscillation starts, and after the elapse of the time set in bits STS2 to STS0 in SYSCR, stable clocks are supplied to the entire chip, software standby mode is cleared, and interrupt exception handling is started. When clearing software standby mode with an IRQ0 to IRQ7* interrupt, set the corresponding enable bit to 1 and ensure that no interrupt with a higher priority than interrupts IRQ0 to IRQ7* is generated. Software standby mode cannot be cleared if the interrupt has been masked on the CPU side or has been designated as a DTC activation source. Note: * Setting the IRQ37S bit to 1 enables IRQ3 to IRQ7 to be used as software standby mode clearing sources. Clearing with the RES Pin: When the RES pin is driven low, clock oscillation is started. At the same time as clock oscillation starts, clocks are supplied to the entire chip. Note that the RES pin must be held low until clock oscillation stabilizes. When the RES pin goes high, the CPU begins reset exception handling. Clearing with the STBY Pin: When the STBY pin is driven low, a transition is made to hardware standby mode. Rev. 4.0, 03/03, page 1001 of 1358 21.6.3 Setting Oscillation Stabilization Time after Clearing Software Standby Mode Bits STS2 to STS0 in SBYCR should be set as described below. Using a Crystal Oscillator: Set bits STS2 to STS0 so that the standby time is at least 8 ms (the oscillation stabilization time). Table 21-4 shows the standby times for different operating frequencies and settings of bits STS2 to STS0. Table 21-4 Oscillation Stabilization Time Settings 25 20 16 12 10 8 6 4 2 STS2 STS1 STS0 Standby Time MHz MHz MHz MHz MHz MHz MHz MHz MHz Unit 0 ms 0 1 1 0 1 0 8192 states 0.32 0.41 0.51 0.68 0.8 1.0 1.3 2.0 1 16384 states 0.65 0.82 1.0 1.3 1.6 2.0 2.7 4.1 0 32768 states 1.3 1.6 2.0 2.7 3.3 4.1 5.5 1 65536 states 2.6 3.3 4.1 5.5 6.6 0 131072 states 5.2 6.6 1 262144 states 10.4 13.1 16.4 21.8 26.2 32.8 43.6 65.6 131.2 0 Reserved -- -- -- -- -- -- -- -- -- -- 1 16 states 0.6 0.8 1.0 1.3 1.6 2.0 2.7 4.0 8.0 s 8.2 8.2 4.1 8.2 8.2 16.4 10.9 16.4 32.8 10.9 13.1 16.4 21.8 32.8 65.5 : Recommended time setting Using an External Clock: Any value can be set. Normally, use of the minimum time is recommended.* Note: * The 16-state standby time cannot be used in the F-ZTAT versions; a standby time of 8192 states or longer should be used. 21.6.4 Software Standby Mode Application Example Figure 21-2 shows an example in which a transition is made to software standby mode at the falling edge on the NMI pin, and software standby mode is cleared at the rising edge on the NMI pin. In this example, an NMI interrupt is accepted with the NMIEG bit in SYSCR cleared to 0 (falling edge specification), then the NMIEG bit is set to 1 (rising edge specification), the SSBY bit is set to 1, and a SLEEP instruction is executed, causing a transition to software standby mode. Software standby mode is then cleared at the rising edge on the NMI pin. Rev. 4.0, 03/03, page 1002 of 1358 Oscillator f NMI NMIEG SSBY NMI exception handling NMIEG=1 SSBY=1 Software standby mode (power-down mode) Oscillation stabilization time tOSC2 NMI exception handling SLEEP instruction Figure 21-2 Software Standby Mode Application Example 21.6.5 Usage Notes I/O Port Status: In software standby mode, I/O port states are retained. If the OPE bit is set to 1, the address bus and bus control signal output is also retained. Therefore, there is no reduction in current dissipation for the output current when a high-level signal is output. Current Dissipation during Oscillation Stabilization Wait Period: Current dissipation increases during the oscillation stabilization wait period. Write Data Buffer Function: The write data buffer function and software standby mode cannot be used at the same time. When the write data buffer function is used, the WDBE bit in BCRL should be cleared to 0 to cancel the write data buffer function before entering software standby mode. Also check that external writes have finished, by reading external addresses, etc., before executing a SLEEP instruction to enter software standby mode. See section 6.9, Write Data Buffer Function, for details of the write data buffer function. Rev. 4.0, 03/03, page 1003 of 1358 21.7 Hardware Standby Mode 21.7.1 Hardware Standby Mode When the STBY pin is driven low, a transition is made to hardware standby mode from any mode. In hardware standby mode, all functions enter the reset state and stop operation, resulting in a significant reduction in power dissipation. As long as the prescribed voltage is supplied, on-chip RAM data is retained. I/O ports are set to the high-impedance state. In order to retain on-chip RAM data, the RAME bit in SYSCR should be cleared to 0 before driving the STBY pin low. Do not change the state of the mode pins (MD2 to MD0) while the chip is in hardware standby mode. Hardware standby mode is cleared by means of the STBY pin and the RES pin. When the STBY pin is driven high while the RES pin is low, the reset state is set and clock oscillation is started. Ensure that the RES pin is held low until the clock oscillator stabilizes (at least 8 ms--the oscillation stabilization time--when using a crystal oscillator). When the RES pin is subsequently driven high, a transition is made to the program execution state via the reset exception handling state. 21.7.2 Hardware Standby Mode Timing Figure 21-3 shows an example of hardware standby mode timing. When the STBY pin is driven low after the RES pin has been driven low, a transition is made to hardware standby mode. Hardware standby mode is cleared by driving the STBY pin high, waiting for the oscillation stabilization time, then changing the RES pin from low to high. Rev. 4.0, 03/03, page 1004 of 1358 Oscillator RES STBY Oscillation stabilization time Reset exception handling Figure 21-3 Hardware Standby Mode Timing 21.8 Clock Output Disabling Function Output of the clock can be controlled by means of the PSTOP bit in SCKCR, and DDR for the corresponding port. When the PSTOP bit is set to 1, the clock stops at the end of the bus cycle, and output goes high. clock output is enabled when the PSTOP bit is cleared to 0. When DDR for the corresponding port is cleared to 0, clock output is disabled and input port mode is set. Table 21-5 shows the state of the pin in each processing state. Table 21-5 Pin State in Each Processing State DDR 0 1 PSTOP -- 0 Hardware standby mode High impedance 1 Software standby mode High impedance Fixed high Sleep mode High impedance output Fixed high Normal operating state High impedance output Fixed high Rev. 4.0, 03/03, page 1005 of 1358 Rev. 4.0, 03/03, page 1006 of 1358 Section 22 Electrical Characteristics 22.1 Electrical Characteristics of Mask ROM Version (H8S/2328, H8S/2327, H8S/2323) and ROMless Version (H8S/2324S, H8S/2322R, H8S/2321, H8S/2320) 22.1.1 Absolute Maximum Ratings Table 22.1 lists the absolute maximum ratings. Table 22-1 Absolute Maximum Ratings Item Symbol Value Unit Power supply voltage VCC -0.3 to +4.6 V Input voltage (except port 4) Vin -0.3 to VCC +0.3 V Input voltage (port 4) Vin -0.3 to AVCC +0.3 V Reference power supply voltage Vref -0.3 to AVCC +0.3 V Analog power supply voltage AVCC -0.3 to +4.6 V Analog input voltage VAN -0.3 to AVCC +0.3 V Operating temperature Topr Regular specifications: -20 to +75 C Wide-range specifications: -40 to +85 C -55 to +125 C Storage temperature Tstg Caution: Permanent damage to the chip may result if absolute maximum ratings are exceeded. Rev. 4.0, 03/03, page 1007 of 1358 22.1.2 DC Characteristics Table 22-2 DC Characteristics (H8S/2328, H8S/2327, H8S/2323) Conditions: VCC = 2.7 V to 3.6 V, AVCC = 2.7 V to 3.6 V, Vref = 2.7 V to AVCC, VSS = AVSS = 0 V*1, Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (widerange specifications) Item Symbol Schmitt Ports 1, 2, trigger input P6 to P6 4 7 voltage PA4 to PA7 VT - VT + VT + Min Typ Max Unit VCC x 0.2 -- -- V -- -- Test Conditions VCC x 0.7 V VCC x 0.07 -- -- V VCC x 0.9 -- VCC + 0.3 V EXTAL VCC x 0.7 -- VCC + 0.3 V Ports 3, 5, B to G, P60 to P63, PA0 to PA3 2.2 -- VCC + 0.3 V 2.2 -- AVCC + 0.3 V -0.3 -- VCC x 0.1 V -0.3 -- VCC x 0.2 V VCC - 0.5 -- -- V IOH = -200 A VCC - 1.0 -- -- V IOH = -1 mA - VT - Port 5 (when using IRQ) Input high voltage RES, STBY, NMI, MD2 to MD0 VIH Port 4 Input low voltage RES, STBY, MD2 to MD0 VIL NMI, EXTAL, Ports 3 to 5, B to G, P60 to P63, PA0 to PA3 Output high All output pins voltage VOH Output low voltage All output pins VOL -- -- 0.4 V IOL = 1.6 mA Input leakage current RES | Iin | -- -- 10.0 A STBY, NMI, MD2 to MD0 -- -- 1.0 A Vin = 0.5 V to VCC - 0.5 V Port 4 -- -- 1.0 A Vin = 0.5 V to AVCC - 0.5 V -- -- 1.0 A Vin = 0.5 V to VCC - 0.5 V Three-state Ports 1, 2, 3, 5, 6, | ITSI | leakage A to G current (off state) Rev. 4.0, 03/03, page 1008 of 1358 Test Conditions Item Symbol Min Typ Max Unit Input pull-up Ports A to E MOS current -Ip 10 -- 300 A VCC = 2.7 V to 3.6 V, Vin = 0 V Input RES capacitance NMI Cin -- -- 30 pF Vin = 0 V -- -- 30 pF f = 1 MHz -- -- 15 pF Ta = 25C -- 40 (3.0 V) 80 mA f = 20 MHz -- 55 (3.3 V) 100 mA f = 25 MHz -- 32 (3.0 V) 64 mA f = 20 MHz -- 44 (3.3 V) 80 mA f = 25 MHz -- 0.01 10 A Ta 50C -- -- 80 A 50C < Ta -- 0.2 (3.0 V) 2.0 mA -- 0.01 5.0 A -- 1.4 (3.0 V) 3.0 mA -- 0.01 5.0 A 2.0 -- -- V All input pins except RES and NMI Current Normal operation 4 ICC* 2 dissipation* Sleep mode Standby mode *3 Analog power supply voltage During A/D and D/A conversion Reference power supply voltage During A/D and D/A conversion AICC Idle AICC Idle RAM standby voltage VRAM Notes: *1 If the A/D and D/A converters are not used, do not leave the AVCC, Vref, and AVSS pins open. Connect the AVCC and Vref pins to VCC, and the AVSS pin to VSS. *2 Current dissipation values are for VIH min = VCC - 0.5 V and VIL max = 0.5 V with all output pins unloaded and all MOS input pull-ups in the off state. *3 The values are for VRAM VCC < 2.7 V, VIH min = VCC x 0.9, and VIL max = 0.3 V. *4 ICC depends on VCC and f as follows: ICC max = 1.0 (mA) + 1.10 (mA/(MHz x V)) x VCC x f (normal operation) ICC max = 1.0 (mA) + 0.88 (mA/(MHz x V)) x VCC x f (sleep mode) Rev. 4.0, 03/03, page 1009 of 1358 Table 22-3 DC Characteristics (H8S/2324S, H8S/2322R, H8S/2321, H8S/2320) Conditions: VCC = 2.7 V to 3.6 V, AVCC = 2.7 V to 3.6 V, Vref = 2.7 V to AVCC, VSS = AVSS = 0 V*1, Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (widerange specifications) Item Symbol Min Typ Max Unit Schmitt Ports 1, 2, trigger input P6 to P6 4 7 voltage PA4 to PA7 VT - VT VCC x 0.2 -- -- V + -- -- VCC x 0.7 V Test Conditions VCC x 0.06 -- -- VCC x 0.9 -- VCC + 0.3 V EXTAL VCC x 0.7 -- VCC + 0.3 V Ports 3, 5, B to G, P60 to P63, PA0 to PA3 2.2 -- VCC + 0.3 V Port 4 2.2 -- AVCC + 0.3 -0.3 -- VCC x 0.1 V -0.3 -- VCC x 0.2 V VCC - 0.5 -- -- V IOH = -200 A VCC - 1.0 -- -- V IOH = -1 mA + VT - VT - V Port 5 (when using IRQ) Input high voltage Input low voltage RES, STBY, NMI, MD2 to MD0 RES, STBY, MD2 to MD0 VIH VIL NMI, EXTAL, Ports 3 to 5, B to G, P60 to P63, PA0 to PA3 Output high All output pins VOH voltage V Output low voltage All output pins VOL -- -- 0.4 V IOL = 1.6 mA Input leakage current RES | Iin | -- -- 10.0 A STBY, NMI, MD2 to MD0 -- -- 1.0 A Vin = 0.5 V to VCC - 0.5 V Port 4 -- -- 1.0 A Vin = 0.5 V to AVCC - 0.5 V -- -- 1.0 A Vin = 0.5 V to VCC - 0.5 V Three-state Ports 1, 2, 3, 5, 6, | ITSI | leakage A to G current (off state) Rev. 4.0, 03/03, page 1010 of 1358 Test Conditions Item Symbol Min Typ Max Unit Input pull-up Ports A to E MOS current -Ip 10 -- 300 A VCC = 2.7 V to 3.6 V, Vin = 0 V Input RES capacitance NMI Cin -- -- 30 pF Vin = 0 V -- -- 30 pF f = 1 MHz -- -- 15 pF Ta = 25C -- 30 (3.0 V) 66 mA f = 20 MHz -- 42 (3.3 V) 82 mA f = 25 MHz -- 22 (3.0 V) 51 mA f = 20 MHz -- 31 (3.3 V) 64 mA f = 25 MHz -- 0.01 10 A Ta 50C -- -- 80 A 50C < Ta -- 0.2 (3.0 V) 2.0 mA -- 0.01 5.0 A -- 1.4 (3.0 V) 3.0 mA -- 0.01 5.0 A 2.0 -- -- V All input pins except RES and NMI Current Normal operation 4 ICC* 2 dissipation* Sleep mode Standby mode *3 Analog power supply voltage During A/D and D/A conversion Reference power supply voltage During A/D and D/A conversion AICC Idle AICC Idle RAM standby voltage VRAM Notes: *1 If the A/D and D/A converters are not used, do not leave the AVCC, Vref, and AVSS pins open. Connect the AVCC and Vref pins to VCC, and the AVSS pin to VSS. *2 Current dissipation values are for VIH min = VCC - 0.2 V and VIL max = 0.2 V with all output pins unloaded and all MOS input pull-ups in the off state. *3 The values are for VRAM VCC < 2.7 V, VIH min = VCC x 0.9, and VIL max = 0.3 V. *4 ICC depends on VCC and f as follows: ICC max = 1.0 (mA) + 0.90 (mA/(MHz x V)) x VCC x f (normal operation) ICC max = 1.0 (mA) + 0.70 (mA/(MHz x V)) x VCC x f (sleep mode) Rev. 4.0, 03/03, page 1011 of 1358 Table 22-4 Permissible Output Currents Conditions: VCC = 2.7 V to 3.6 V, AVCC = 2.7 V to 3.6 V, Vref = 2.7 V to AVCC, VSS = AVSS = 0 V, Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications) Item Symbol Min Typ Max Unit Permissible output low current (per pin) All output pins IOL -- -- 2.0 mA Permissible output low current (total) Total of all output pins lOL -- -- 80 mA Permissible output high current (per pin) All output pins -IOH -- -- 2.0 mA Permissible output high current (total) Total of all output pins -IOH -- -- 40 mA Note: To protect chip reliability, do not exceed the output current values in table 22-4. 22.1.3 AC Characteristics 3V RL Chip output pin C RH C = 50 pF: ports 1, A to F C = 30 pF: ports 2, 3, 5, 6, G RL = 2.4 kW RH = 12 kW Input/output timing measurement level: 1.5 V (VCC = 2.7 V to 3.6 V) Figure 22-1 Output Load Circuit Rev. 4.0, 03/03, page 1012 of 1358 (1) Clock Timing Table 22-5 Clock Timing Condition A: VCC = 2.7 V to 3.6 V, AVCC = 2.7 V to 3.6 V, Vref = 2.7 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 20 MHz, Ta = -20C to 75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition B: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 25 MHz, Ta = -20C to 75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition A Condition B Item Symbol Min Max Min Max Unit Test Conditions Clock cycle time tcyc 50 500 40 500 ns Figure 22-2 Clock pulse high width tCH 20 -- 15 -- ns Clock pulse low width tCL 20 -- 15 -- ns Clock rise time tCr -- 5 -- 5 ns Clock fall time tCf -- 5 -- 5 ns Reset oscillation stabilization time (crystal) tOSC1 10 -- 10 -- ms Software standby oscillation stabilization time (crystal) tOSC2 10 -- 10 -- ms External clock output stabilization delay time tDEXT 500 -- 500 -- s Figure 22-3 Figure 22-3 Rev. 4.0, 03/03, page 1013 of 1358 tcyc tCH tCf f tCL tCr Figure 22-2 System Clock Timing EXTAL tDEXT tDEXT VCC STBY NMI tOSC1 RES f Figure 22-3 Oscillation Stabilization Timing Rev. 4.0, 03/03, page 1014 of 1358 tOSC1 (2) Control Signal Timing Table 22-6 Control Signal Timing Condition A: VCC = 2.7 V to 3.6 V, AVCC = 2.7 V to 3.6 V, Vref = 2.7 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 20 MHz, Ta = -20C to 75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition B: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 25 MHz, Ta = -20C to 75C (regular specifications), Ta = - 40C to 85C (wide-range specifications) Condition A Condition B Item Symbol Min Max Min Max Unit Test Conditions RES setup time tRESS 200 -- 200 -- ns Figure 22-4 RES pulse width tRESW 20 -- 20 -- tcyc NMI setup time tNMIS 150 -- 150 -- ns NMI hold time tNMIH 10 -- 10 -- NMI pulse width (in recovery from software standby mode) tNMIW 200 -- 200 -- IRQ setup time tIRQS 150 -- 150 -- IRQ hold time tIRQH 10 -- 10 -- IRQ pulse width (in recovery from software standby mode) tIRQW 200 -- 200 -- Figure 22-5 ns Rev. 4.0, 03/03, page 1015 of 1358 f tRESS tRESS RES tRESW Figure 22-4 Reset Input Timing f tNMIS tNMIH NMI tNMIW IRQ tIRQW tIRQS tIRQH IRQ edge input tIRQS IRQ level input Figure 22-5 Interrupt Input Timing Rev. 4.0, 03/03, page 1016 of 1358 (3) Bus Timing Table 22-7 Bus Timing Condition A: VCC = 2.7 V to 3.6 V, AVCC = 2.7 V to 3.6 V, Vref = 2.7 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 20 MHz, Ta = -20C to 75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition B: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 25 MHz, Ta = -20C to 75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition A Condition B Item Symbol Min Max Min Max Unit Test Conditions Address delay time tAD -- 20 -- 20 ns Address setup time tAS 0.5 x tcyc - 15 -- 0.5 x tcyc - 15 -- ns Figures 22-6 to 22-13 Address hold time tAH 0.5 x tcyc - 10 -- 0.5 x tcyc - 8 -- ns Precharge time* tPCH 1.5 x tcyc- 20 -- 1.5 x tcyc- 15 -- ns CS delay time 1 CS delay time 2* tCSD1 -- 20 -- 15 ns tCSD2 -- 20 -- 15 ns CS delay time 3* tCSD3 -- 25 -- 20 ns AS delay time tASD -- 20 -- 15 ns RD delay time 1 tRSD1 -- 20 -- 15 ns RD delay time 2 CAS delay time* tRSD2 -- 20 -- 15 ns tCASD -- 20 -- 15 ns Read data setup time tRDS 15 -- 15 -- ns Read data hold time tRDH 0 -- 0 -- ns Read data access time 1 tACC1 -- 1.0 x tcyc - 25 -- 1.0 x tcyc - 20 ns Read data access time 2 tACC2 -- 1.5 x tcyc - 25 -- 1.5 x tcyc - 20 ns Read data access time 3 tACC3 -- 2.0 x tcyc - 25 -- 2.0 x tcyc - 20 ns Read data access time 4 tACC4 -- 2.5 x tcyc - 25 -- 2.5 x tcyc - 20 ns Read data access time 5 tACC5 -- 3.0 x tcyc - 25 -- 3.0 x tcyc - 20 ns Read data access time 6* tACC6 -- 1.0 x tcyc - 25 -- 1.0 x tcyc - 20 ns Rev. 4.0, 03/03, page 1017 of 1358 Condition A Condition B Item Symbol Min Max Min WR delay time 1 tWRD1 -- 20 -- WR delay time 2 tWRD2 -- 20 -- WR pulse width 1 tWSW1 1.0 x tcyc - 20 -- 1.0 x tcyc - 15 -- ns WR pulse width 2 tWSW2 1.5 x tcyc - 20 -- 1.5 x tcyc - 15 -- ns Write data delay time tWDD -- 30 -- 20 ns Write data setup time tWDS 0.5 x tcyc - 20 -- 0.5 x tcyc - 15 -- ns Write data hold time tWDH 0.5 x tcyc - 10 -- 0.5 x tcyc - 8 -- ns WR setup time* tWCS 0.5 x tcyc - 10 -- 0.5 x tcyc - 10 -- ns WR hold time* tWCH 0.5 x tcyc - 10 -- 0.5 x tcyc - 10 -- ns CAS setup time* tCSR 0.5 x tcyc - 10 -- 0.5 x tcyc - 8 -- ns Figure 22-10 WAIT setup time tWTS 30 -- 25 -- ns Figure 22-8 WAIT hold time tWTH 5 -- 5 -- ns BREQ setup time tBRQS 30 -- 30 -- ns BACK delay time tBACD -- 15 -- 15 ns Bus floating time tBZD -- 50 -- 40 ns BREQO delay time tBRQOD -- 30 -- 25 ns Note: * The DRAM interface is not supported in the H8S/2321. Rev. 4.0, 03/03, page 1018 of 1358 Max Unit Test Conditions 15 ns 15 ns Figures 22-6 to 22-13 Figure 22-14 Figure 22-15 T1 T2 f tAD A23 to A0 tCSD1 tAS tAH CS7 to CS0 tASD tASD AS tRSD1 tACC2 tRSD2 RD (read) tACC3 tAS tRDS tRDH D15 to D0 (read) tWRD2 HWR, LWR (write) tWRD2 tAS tWDD tWSW1 tAH tWDH D15 to D0 (write) Figure 22-6 Basic Bus Timing (2-State Access) Rev. 4.0, 03/03, page 1019 of 1358 T1 T2 T3 f tAD A23 to A0 tCSD1 tAH tAS CS7 to CS0 tASD tASD AS tRSD1 RD (read) tACC4 tRSD2 tAS tRDS tRDH tACC5 D15 to D0 (read) tWRD1 tWRD2 HWR, LWR (write) tWDD tWDS tWSW2 D15 to D0 (write) Figure 22-7 Basic Bus Timing (3-State Access) Rev. 4.0, 03/03, page 1020 of 1358 tAH tWDH T1 T2 Tw T3 tWTS tWTH tWTS tWTH f A23 to A0 CS7 to CS0 AS RD (read) D15 to D0 (read) HWR, LWR (write) D15 to D0 (write) WAIT Figure 22-8 Basic Bus Timing (3-State Access, 1 Wait) Rev. 4.0, 03/03, page 1021 of 1358 Tp Tr Tc1 Tc2 f tAD tAD A23 to A0 tAS tAH tPCH tCSD3 tACC4 CS5 to CS2 (RAS) tCSD2 tCASD tCASD tACC6 CAS tRDS tRDH tACC3 D15 to D0 (read) tWRD2 tWRD2 HWR, (WE) (write) tWDD tWCS tWDS tWCH tWDH D15 to D0 (write) Figure 22-9 DRAM Bus Timing (Not Supported in the H8S/2321) Rev. 4.0, 03/03, page 1022 of 1358 TRp TRr TRc1 TRc2 f tCSD2 CS5 to CS2 (RAS) tCSD1 tCSR tCASD tCASD CAS Figure 22-10 CAS-Before-RAS Refresh Timing (Not Supported in the H8S/2321) TRp TRr TRc TRc f tCSD2 tCSD2 CS5 to CS2 (RAS) tCASD tCASD CAS Figure 22-11 Self-Refresh Timing (Not Supported in the H8S/2321) Rev. 4.0, 03/03, page 1023 of 1358 T1 T2 or T3 T1 T2 f tAD A23 to A0 tAH tAS CS0 tASD tASD AS tRSD2 RD (read) tACC3 D15 to D0 (read) Figure 22-12 Burst ROM Access Timing (2-State Access) Rev. 4.0, 03/03, page 1024 of 1358 tRDS tRDH T1 T2 or T3 T1 f tAD A23 to A0 CS0 AS tRSD2 RD (read) tACC1 tRDS tRDH D15 to D0 (read) Figure 22-13 Burst ROM Access Timing (1-State Access) Rev. 4.0, 03/03, page 1025 of 1358 f tBRQS tBRQS BREQ tBACD tBACD BACK tBZD A23 to A0, CS7 to CS0, AS, RD, HWR, LWR, tBZD CAS Figure 22-14 External Bus Release Timing f tBRQOD tBRQOD BREQO Figure 22-15 External Bus Request Output Timing Rev. 4.0, 03/03, page 1026 of 1358 (4) DMAC Timing Note: The DMAC is not supported in the H8S/2321. Table 22-8 DMAC Timing Condition A: VCC = 2.7 V to 3.6 V, AVCC = 2.7 V to 3.6 V, Vref = 2.7 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 20 MHz, Ta = -20C to 75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition B: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 25 MHz, Ta = -20C to 75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition A Condition B Item Symbol Min Max Min Max Unit Test Conditions DREQ setup time tDRQS 30 -- 25 -- ns Figure 22-19 DREQ hold time tDRQH 10 -- 10 -- TEND delay time tTED -- 20 -- 18 DACK delay time 1 tDACD1 -- 20 -- 18 ns DACK delay time 2 tDACD2 -- 20 -- 18 Figures 22-16 and 22-17 Figure 22-18 Rev. 4.0, 03/03, page 1027 of 1358 T1 T2 f A23 to A0 CS7 to CS0 AS RD (read) D15 to D0 (read) HWR, LWR (write) D15 to D0 (write) tDACD1 tDACD2 DACK0, DACK1 Figure 22-16 DMAC Single Address Transfer Timing (2-State Access) Rev. 4.0, 03/03, page 1028 of 1358 T1 T2 T3 f A23 to A0 CS7 to CS0 AS RD (read) D15 to D0 (read) HWR, LWR (write) D15 to D0 (write) tDACD1 tDACD2 DACK0, DACK1 Figure 22-17 DMAC Single Address Transfer Timing (3-State Access) Rev. 4.0, 03/03, page 1029 of 1358 T1 T2 or T3 f tTED tTED TEND0, TEND1 Figure 22-18 DMAC TEND Output Timing f tDRQS tDRQH DREQ0, DREQ1 Figure 22-19 DMAC DREQ Input Timing Rev. 4.0, 03/03, page 1030 of 1358 (5) Timing of On-Chip Supporting Modules Table 22-9 Timing of On-Chip Supporting Modules Condition A: VCC = 2.7 V to 3.6 V, AVCC = 2.7 V to 3.6 V, Vref = 2.7 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 20 MHz, Ta = -20C to 75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition B: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 25 MHz, Ta = -20C to 75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition A Item Condition B Test Symbol Min Max Min Max Unit Conditions Output data delay time tPWD -- 50 -- 40 ns Figure 22-20 Input data setup time tPRS 30 -- 25 -- Input data hold time tPRH 30 -- 25 -- PPG Pulse output delay time tPOD -- 50 -- 40 ns Figure 22-21 TPU Timer output delay time tTOCD -- 50 -- 40 ns Figure 22-22 Timer input setup time tTICS 30 -- 25 -- Timer clock input setup time tTCKS 30 -- 25 -- ns Figure 22-23 Timer clock pulse width Single-edge specification tTCKWH 1.5 -- 1.5 -- tcyc Both-edge specification tTCKWL 2.5 -- 2.5 -- tTMOD -- 50 -- 40 ns Figure 22-24 Timer reset input setup time tTMRS 30 -- 25 -- ns Figure 22-26 Timer clock input setup time tTMCS 30 -- 25 -- ns Figure 22-25 Timer clock pulse width Single-edge specification tTMCWH 1.5 -- 1.5 -- tcyc Both-edge specification tTMCWL 2.5 -- 2.5 -- tWOVD -- 50 -- 40 I/O ports 8-bit timer Timer output delay time WDT Overflow output delay time ns Figure 22-27 Rev. 4.0, 03/03, page 1031 of 1358 Condition A Item SCI A/D converter Input clock Asynchronous cycle Synchronous Condition B Test Symbol Min Max Min Max Unit Conditions tScyc 4 -- 4 -- tcyc Figure 22-28 6 -- 6 -- Input clock pulse width tSCKW 0.4 0.6 0.4 0.6 tScyc Input clock rise time tSCKr -- 1.5 -- 1.5 tcyc Input clock fall time tSCKf -- 1.5 -- 1.5 Transmit data delay time tTXD -- 50 -- 40 ns Receive data setup time (synchronous) tRXS 50 -- 40 -- ns Receive data hold time (synchronous) tRXH 50 -- 40 -- ns Trigger input setup time tTRGS 30 -- 30 -- ns T1 T2 f tPRS tPRH Ports 1 to 6, A to G (read) tPWD Ports 1, 2, 3, 5, 6, A to G (write) Figure 22-20 I/O Port Input/Output Timing f tPOD PO15 to PO0 Figure 22-21 PPG Output Timing Rev. 4.0, 03/03, page 1032 of 1358 Figure 22-29 Figure 22-30 f tTOCD Output compare output* tTICS Input capture input* Note: * TIOCA0 to TIOCA5, TIOCB0 to TIOCB5, TIOCC0, TIOCC3, TIOCD0, TIOCD3 Figure 22-22 TPU Input/Output Timing f tTCKS tTCKS TCLKA to TCLKD tTCKWL tTCKWH Figure 22-23 TPU Clock Input Timing f tTMOD TMO0, TMO1 Figure 22-24 8-Bit Timer Output Timing Rev. 4.0, 03/03, page 1033 of 1358 f tTMCS tTMCS TMCI0, TMCI1 tTMCWL tTMCWH Figure 22-25 8-Bit Timer Clock Input Timing f tTMRS TMRI0, TMRI1 Figure 22-26 8-Bit Timer Reset Input Timing f tWOVD tWOVD WDTOVF Figure 22-27 WDT Output Timing tSCKW tSCKr tSCKf SCK0 to SCK2 tScyc Figure 22-28 SCK Clock Input Timing Rev. 4.0, 03/03, page 1034 of 1358 SCK0 to SCK2 tTXD TxD0 to TxD2 (transmit data) tRXS tRXH RxD0 to RxD2 (receive data) Figure 22-29 SCI Input/Output Timing (Synchronous Mode) f tTRGS ADTRG Figure 22-30 A/D Converter External Trigger Input Timing Rev. 4.0, 03/03, page 1035 of 1358 22.1.4 A/D Conversion Characteristics Table 22-10 A/D Conversion Characteristics Condition A: VCC = 2.7 V to 3.6 V, AVCC = 2.7 V to 3.6 V, Vref = 2.7 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 20 MHz, Ta = -20C to 75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition B: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 25 MHz, Ta = -20C to 75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition A Condition B Item Min Typ Max Min Typ Max Unit Resolution 10 10 10 10 10 10 Bits Conversion time 6.7 -- -- 10.6 -- -- s Analog input capacitance -- -- 20 -- -- 20 pF Permissible signal source impedance -- -- 5 -- -- 5 k Nonlinearity error -- -- 5.5 -- -- 5.5 LSB Offset error -- -- 5.5 -- -- 5.5 LSB Full-scale error -- -- 5.5 -- -- 5.5 LSB Quantization error -- -- 0.5 -- -- 0.5 LSB Absolute accuracy -- -- 6.0 -- -- 6.0 LSB Rev. 4.0, 03/03, page 1036 of 1358 22.1.5 D/A Conversion Characteristics Table 22-11 D/A Conversion Characteristics Condition A: VCC = 2.7 V to 3.6 V, AVCC = 2.7 V to 3.6 V, Vref = 2.7 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 20 MHz, Ta = -20C to 75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition B: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 25 MHz, Ta = -20C to 75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition A Condition B Test Conditions Item Min Typ Max Min Typ Max Unit Resolution 8 8 8 8 8 8 Bits Conversion time -- -- 10 -- -- 10 s 20 pF capacitive load Absolute accuracy -- 2.0 3.0 -- 2.0 3.0 LSB 2 M resistive load -- -- 2.0 -- -- 2.0 LSB 4 M resistive load Rev. 4.0, 03/03, page 1037 of 1358 22.2 Electrical Characteristics of F-ZTAT (H8S/2329 F-ZTAT, H8S/2329B F-ZTAT, H8S/2329E F-ZTAT, H8S/2328 F-ZTAT, H8S/2328B F-ZTAT, H8S/2326 F-ZTAT) 22.2.1 Absolute Maximum Ratings Table 22-12 Absolute Maximum Ratings Item Symbol Value Unit Power supply voltage 2 3 Input voltage (FWE* , EMLE* ) VCC -0.3 to +4.3 V Vin -0.3 to VCC +0.3 V Input voltage (except port 4) Vin -0.3 to VCC +0.3 V Input voltage (port 4) Vin -0.3 to AVCC +0.3 V Reference power supply voltage Vref -0.3 to AVCC +0.3 V Analog power supply voltage AVCC -0.3 to +4.3 V Analog input voltage VAN -0.3 to AVCC +0.3 V Operating temperature Topr Regular specifications: -20 to +75* 1 Wide-range specifications: -40 to +85 Storage temperature Tstg -55 to +125 C *1 C C Caution: Permanent damage to the chip may result if absolute maximum ratings are exceeded. Notes: *1 The operating temperature ranges for flash memory programming/erasing are as follows: Ta = 0C to +75C (regular specifications), Ta = 0C to +85C (wide-range specifications). *2 The FWE pin applies to the H8S/2328 F-ZTAT, H8S/2328B F-ZTAT, and H8S/2326 F-ZTAT. *3 The EMLE pin applies to the H8S/2329 F-ZTAT, H8S/2329B F-ZTAT, and H8S/2329E F-ZTAT. Rev. 4.0, 03/03, page 1038 of 1358 22.2.2 DC Characteristics Table 22-13 DC Characteristics Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V*1, Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (widerange specifications) Item Symbol Schmitt Ports 1, 2, trigger input P6 to P6 4 7 voltage PA4 to PA7 VT - VT + VT + Max Test Unit Conditions VCC x 0.2 -- -- V -- VCC x 0.7 V Min Typ -- VCC x 0.07 -- -- VIH RES, STBY, NMI, 2 MD2 to MD0,, FWE* , 3 EMLE* VCC x 0.9 -- VCC + 0.3 V EXTAL VCC x 0.7 -- VCC + 0.3 V Ports 3, 5, B to G, P60 to P63, PA0 to PA3 2.2 -- VCC + 0.3 V Port 4 2.2 -- AVCC + 03 V VIL RES, STBY, 2 MD2 to MD0, FWE* , 3 EMLE* -0.3 -- VCC x 0.1 V NMI, EXTAL, Ports 3 to 5, B to G, P60 to P63, PA0 to PA3 -0.3 -- VCC x 0.2 V - VT - V Port 5 (when using IRQ) Input high voltage Input low voltage Output high All output pins VOH voltage VCC - 0.5 -- -- V IOH = -200 A VCC - 1.0 -- -- V IOH = -1 mA Output low voltage All output pins VOL -- -- 0.4 V IOL = 1.6 mA Input leakage current RES | Iin | -- -- 10.0 A STBY, NMI, 2 MD2 to MD0, FWE* , 3 * EMLE -- -- 1.0 A Vin = 0.5 V to VCC - 0.5 V Port 4 -- -- 1.0 A Vin = 0.5 V to AVCC - 0.5 V Rev. 4.0, 03/03, page 1039 of 1358 Min Typ Max Test Unit Conditions Three-state Ports 1, 2, 3, 5, 6, | ITSI | leakage A to G current (off state) -- -- 1.0 A Vin = 0.5 V to VCC - 0.5 V Input pull-up Ports A to E MOS current -Ip 10 -- 300 A VCC = 3.0 V to 3.6 V, Vin = 0 V Input RES capacitance NMI Cin -- -- 30 pF Vin = 0 V -- -- 30 pF f = 1 MHz -- -- 15 pF Ta = 25C -- 55 (3.3 V) 100 mA f = 25 MHz -- 44 (3.3 V) 80 mA -- 0.01 10 A Ta 50C -- -- 80 A 50C < Ta -- 0.2 (3.0 V) 2.0 mA -- 0.01 5.0 A -- 1.4 (3.0 V) 3.0 mA -- 0.01 5.0 A 2.0 -- -- V Item Symbol All input pins except RES and NMI Current Normal operation dissipation*4 Sleep mode 5 Standby mode* Analog power supply voltage During A/D and D/A conversion Reference power supply voltage During A/D and D/A conversion 6 ICC* AICC Idle AICC Idle RAM standby voltage VRAM Notes: *1 If the A/D and D/A converters are not used, do not leave the AVCC, Vref, and AVSS pins open. Connect the AVCC and Vref pins to VCC, and the AVSS pin to VSS. *2 The FWE pin applies to the H8S/2328 F-ZTAT, H8S/2328B F-ZTAT, and H8S/2326 F-ZTAT. *3 The EMLE pin applies to the H8S/2329 F-ZTAT and H8S/2329B F-ZTAT, and H8S/2329E F-ZTAT. *4 Current dissipation values are for VIH min = VCC - 0.2 V and VIL max = 0.2 V with all output pins unloaded and all MOS input pull-ups in the off state. *5 The values are for VRAM VCC < 3.0 V, VIH min = VCC x 0.9, and VIL max = 0.3 V. *6 ICC depends on VCC and f as follows: ICC max = 1.0 (mA) + 1.10 (mA/(MHz x V)) x VCC x f (normal operation) ICC max = 1.0 (mA) + 0.88 (mA/(MHz x V)) x VCC x f (sleep mode) Rev. 4.0, 03/03, page 1040 of 1358 Table 22-14 Permissible Output Currents Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V, Ta = -20 to +75C (regular specifications), Ta = -40 to +85C (wide-range specifications) Item Symbol Min Typ Max Unit Permissible output low All output pins current (per pin) IOL -- -- 2.0 mA Permissible output low Total of all output current (total) pins IOL -- -- 80 mA Permissible output high current (per pin) All output pins -IOH -- -- 2.0 mA Permissible output high current (total) Total of all output pins -IOH -- -- 40 mA Note: To protect chip reliability, do not exceed the output current values in table 22-14. Rev. 4.0, 03/03, page 1041 of 1358 22.2.3 AC Characteristics (1) Clock Timing Table 22-15 Clock Timing Condition B: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 25 MHz, Ta = -20C to 75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition B Item Symbol Min Max Unit Test Conditions Clock cycle time tcyc 40 500 ns Figure 22-2 Clock pulse high width tCH 15 -- ns Clock pulse low width tCL 15 -- ns Clock rise time tCr -- 5 ns Clock fall time tCf -- 5 ns Reset oscillation stabilization time (crystal) tOSC1 10 -- ms Software standby oscillation stabilization time (crystal) tOSC2 10 -- ms External clock output stabilization delay time tDEXT 500 -- s Rev. 4.0, 03/03, page 1042 of 1358 Figure 22-3 Figure 22-3 (2) Control Signal Timing Table 22-16 Control Signal Timing Condition B: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 25 MHz, Ta = -20C to 75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition B Item Symbol Min Max Unit Test Conditions RES setup time tRESS 200 -- ns Figure 22-4 RES pulse width tRESW 20 -- tcyc NMI setup time tNMIS 150 -- ns NMI hold time tNMIH 10 -- NMI pulse width (in recovery from software standby mode) tNMIW 200 -- IRQ setup time tIRQS 150 -- IRQ hold time tIRQH 10 -- IRQ pulse width (in recovery from software standby mode) tIRQW 200 -- Figure 22-5 ns Rev. 4.0, 03/03, page 1043 of 1358 (3) Bus Timing Table 22-17 Bus Timing Condition B: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 25 MHz, Ta = -20C to 75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition B Item Symbol Min Address delay time tAD Address setup time tAS Address hold time tAH 0.5 x tcyc - 8 -- ns Precharge time tPCH 1.5 x tcyc- 15 -- ns CS delay time 1 tCSD1 -- 15 ns CS delay time 2 tCSD2 -- 15 ns CS delay time 3 tCSD3 -- 20 ns AS delay time tASD -- 15 ns RD delay time 1 tRSD1 -- 15 ns RD delay time 2 tRSD2 -- 15 ns CAS delay time tCASD -- 15 ns Read data setup time tRDS 15 -- ns Read data hold time tRDH 0 -- ns Read data access time 1 tACC1 -- 1.0 x tcyc - 20 ns Read data access time 2 tACC2 -- 1.5 x tcyc - 20 ns Read data access time 3 tACC3 -- 2.0 x tcyc - 20 ns Read data access time 4 tACC4 -- 2.5 x tcyc - 20 ns Read data access time 5 tACC5 -- 3.0 x tcyc - 20 ns Read data access time 6 tACC6 -- 1.0 x tcyc - 20 ns WR delay time 1 tWRD1 -- 15 ns WR delay time 2 tWRD2 -- 15 ns WR pulse width 1 tWSW1 1.0 x tcyc - 15 -- ns WR pulse width 2 tWSW2 1.5 x tcyc - 15 -- ns Write data delay time tWDD -- 20 ns Write data setup time tWDS 0.5 x tcyc - 15 -- ns Write data hold time tWDH 0.5 x tcyc - 8 -- ns WR setup time tWCS 0.5 x tcyc - 10 -- ns WR hold time tWCH 0.5 x tcyc - 10 -- ns Rev. 4.0, 03/03, page 1044 of 1358 Max Unit Test Conditions -- 20 ns Figures 22-6 to 22-13 0.5 x tcyc - 15 -- ns Condition B Item Symbol Min Max Unit Test Conditions CAS setup time tCSR 0.5 x tcyc - 8 -- ns Figure 22-10 WAIT setup time tWTS 25 -- ns Figure 22-8 WAIT hold time tWTH 5 -- ns BREQ setup time tBRQS 30 -- ns BACK delay time tBACD -- 15 ns Bus floating time tBZD -- 40 ns BREQO delay time tBRQOD -- 25 ns Figure 22-14 Figure 22-15 Rev. 4.0, 03/03, page 1045 of 1358 (4) DMAC Timing Table 22-18 DMAC Timing Condition B: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 2.7 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 25 MHz, Ta = -20C to 75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition B Item Symbol Min Max Unit Test Conditions DREQ setup time tDRQS 25 -- ns Figure 22-19 DREQ hold time tDRQH 10 -- TEND delay time tTED -- 18 DACK delay time 1 tDACD1 -- 18 DACK delay time 2 tDACD2 -- 18 Rev. 4.0, 03/03, page 1046 of 1358 Figure 22-18 ns Figures 22-16 and 22-17 (5) Timing of On-Chip Supporting Modules Table 22-19 Timing of On-Chip Supporting Modules Condition B: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 25 MHz, Ta = -20C to 75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition B Item I/O ports Symbol Min Max Unit Test Conditions ns Figure 22-20 Output data delay time tPWD -- 40 Input data setup time tPRS 25 -- Input data hold time tPRH 25 -- PPG Pulse output delay time tPOD -- 40 ns Figure 22-21 TPU Timer output delay time tTOCD -- 40 ns Figure 22-22 Timer input setup time tTICS 25 -- Timer clock input setup time tTCKS 25 -- ns Figure 22-23 Timer clock pulse width Single-edge specification tTCKWH 1.5 -- tcyc Both-edge specification tTCKWL 2.5 -- Timer output delay time tTMOD -- 40 ns Figure 22-24 Timer reset input setup time tTMRS 25 -- ns Figure 22-26 Timer clock input setup time tTMCS 25 -- ns Figure 22-25 Timer clock pulse width Single-edge specification tTMCWH 1.5 -- tcyc Both-edge specification tTMCWL 2.5 -- Asynchronous tScyc 4 -- 8-bit timer SCI Input clock cycle Synchronous 6 -- tSCKW 0.4 0.6 tScyc Input clock rise time tSCKr -- 1.5 tcyc Input clock fall time tSCKf -- 1.5 Transmit data delay time tTXD -- 40 ns Receive data setup time (synchronous) tRXS 40 -- ns Receive data hold time (synchronous) tRXH 40 -- ns Trigger input setup time tTRGS 30 -- ns Input clock pulse width A/D converter tcyc Figure 22-28 Figure 22-29 Figure 22-30 Rev. 4.0, 03/03, page 1047 of 1358 22.2.4 A/D Conversion Characteristics Table 22-20 A/D Conversion Characteristics Condition B: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 25 MHz, Ta = -20C to 75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition B Item Min Typ Max Unit Resolution 10 10 10 Bits Conversion time 10.6 -- -- s Analog input capacitance -- -- 20 pF Permissible signal source impedance -- -- 5 k Nonlinearity error -- -- 5.5 LSB Offset error -- -- 5.5 LSB Full-scale error -- -- 5.5 LSB Quantization error -- -- 0.5 LSB Absolute accuracy -- -- 6.0 LSB Rev. 4.0, 03/03, page 1048 of 1358 22.2.5 D/A Conversion Characteristics Table 22-21 D/A Conversion Characteristics Condition B: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 25 MHz, Ta = -20C to 75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition B Item Min Typ Max Unit Test Conditions Resolution 8 8 8 Bits Conversion time -- -- 10 s 20 pF capacitive load Absolute accuracy -- 2.0 3.0 LSB 2 M resistive load -- -- 2.0 LSB 4 M resistive load Rev. 4.0, 03/03, page 1049 of 1358 22.2.6 Flash Memory Characteristics Table 22-22 Flash Memory Characteristics Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V, Ta = 0C to +75C (program/erase operating temperature range: regular specifications), Ta = 0C to +85C (program/erase operating temperature range: wide-range specifications) Test Conditions Item Symbol Min Typ Max Unit 1 2 4 Programming time* * * tP -- 10 200 ms/ 128 bytes 1 3 6 Erase time* * * tE -- 50 1000 ms/block Rewrite times NWEC -- -- 100 Times x 1 -- -- s y 50 -- -- s (z1) -- -- 30 s 1n6 (z2) -- -- 200 s 7 n 1000 (z3) -- -- 10 s Wait time for additional writing 5 -- -- s 5 -- -- s 4 -- -- s 2 -- -- s 2 -- -- s Wait time after SWE bit clearing* 100 -- -- 1 4 Maximum number of writes* * N -- -- Wait time after SWE bit setting* x 1 -- -- s *1 Wait time after ESU bit setting y 100 -- -- s 1 6 Wait time after E bit setting* * z -- -- 10 ms Wait time after E bit clearing* 10 -- -- s 1 Wait time after ESU bit clearing* 1 Wait time after EV bit setting* 1 Wait time after H'FF dummy write* 1 Wait time after EV bit clearing* 1 Wait time after SWE bit clearing* 1 6 Maximum number of erases* * 10 -- -- s 20 -- -- s 2 -- -- s 4 -- -- s 100 -- -- s N -- -- 100 Times 1 Programming Wait time after SWE bit setting* 1 Wait time after PSU bit setting* 1 4 Wait time after P bit setting* * z 1 Wait time after P bit clearing* 1 Wait time after PSU bit clearing* 1 Wait time after PV bit setting* 1 Wait time after H'FF dummy write* 1 Wait time after PV bit clearing* 1 Erasing 1 1 Rev. 4.0, 03/03, page 1050 of 1358 s 1000*5 Times Wait time for erase time Notes: *1 Follow the program/erase algorithms when making the time settings. *2 Programming time per 128 bytes. (In the H8S/2329 and H8S/2328, indicates the total time during which the P bit is set in flash memory control register 1 (FLMCR1). In the H8S/2326, indicates the total time during which the P1 bit and P2 bit in flash memory control registers 1 and 2 (FLMCR1, FLMCR2) are set. Does not include the programverify time.) *3 Time to erase one block. (In the H8S/2329 and H8S/2328, indicates the time during which the E bit is set in FLMCR1. In the H8S/2326, indicates the total time during which the E1 bit in FLMCR1 and the E2 bit in FLMCR are set. Does not include the eraseverify time.) *4 Maximum programming time N tP(max) = S wait time after P bit setting (z) i=1 *5 The maximum number of writes (N) should be set as shown below according to the actual set value of z so as not to exceed the maximum programming time (tP(max)). The wait time after P bit setting (z) should be changed as follows according to the number of writes (n). Number of writes (n) 1n6 z = 30 s 7 n 1000 z = 200 s 1n6 z = 10 s: For additional writing *6 For the maximum erase time (tE(max)), the following relationship applies between the wait time after E bit setting (z) and the maximum number of erases (N): tE(max) = Wait time after E bit setting (z) x maximum number of erases (N) Rev. 4.0, 03/03, page 1051 of 1358 22.3 Electrical Characteristics of the H8S/2326C F-ZTAT (In Planning) 22.3.1 Absolute Maximum Ratings Preliminary Table 22-23 Absolute Maximum Ratings Item Symbol Value Power supply voltage 1 VCC* Unit -0.3 to +4.3 V Input voltage (except port 4) Vin -0.3 to VCC +0.3 V Input voltage (port 4) Vin -0.3 to AVCC +0.3 V Reference power supply voltage Vref -0.3 to AVCC +0.3 V Analog power supply voltage AVCC -0.3 to +4.3 V Analog input voltage VAN -0.3 to AVCC +0.3 Operating temperature Topr Regular specifications: -20 to +75* V 2 C 2 Wide-range specifications: -40 to +85* C Storage temperature Tstg -55 to +125 C Caution: Permanent damage to the chip may result if absolute maximum ratings are exceeded. Notes: *1 Do not apply the power supply voltage to the VCL pin. Doing do could permanently damage the LSI. An external capacitor should be connected between this pin and GND. *2 The operating temperature ranges for flash memory programming/erasing are as follows: Ta = 0C to +75C (regular specifications), Ta = 0C to +85C (wide-range specifications). Rev. 4.0, 03/03, page 1052 of 1358 22.3.2 DC Characteristics Preliminary Table 22-24 DC Characteristics Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V*1, Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (widerange specifications) Item Symbol Schmitt Ports 1, 2, trigger input P6 to P6 4 7 voltage PA4 to PA7 VT - VT + VT + Max Test Unit Conditions VCC x 0.2 -- -- V -- VCC x 0.7 V Min Typ -- VCC x 0.07 -- -- VCC x 0.9 -- VCC + 0.3 V EXTAL VCC x 0.7 -- VCC + 0.3 V Ports 3, 5, B to G, P60 to P63, PA0 to PA3 2.2 -- VCC + 0.3 V 2.2 -- AVCC + 03 V -0.3 -- VCC x 0.1 V -0.3 -- VCC x 0.2 V - VT - V Port 5 (when using IRQ) Input high voltage RES, STBY, NMI, MD2 to MD0 VIH Port 4 Input low voltage RES, STBY, MD2 to MD0 VIL NMI, EXTAL, Ports 3 to 5, B to G, P60 to P63, PA0 to PA3 Output high All output pins VOH voltage VCC - 0.5 -- -- V IOH = -200 A VCC - 1.0 -- -- V IOH = -1 mA Output low voltage All output pins VOL -- -- 0.4 V IOL = 1.6 mA Input leakage current RES | Iin | -- -- 10.0 A STBY, NMI, MD2 to MD0 -- -- 1.0 A Vin = 0.5 V to VCC - 0.5 V Port 4 -- -- 1.0 A Vin = 0.5 V to AVCC - 0.5 V Rev. 4.0, 03/03, page 1053 of 1358 Min Typ Max Test Unit Conditions Three-state Ports 1, 2, 3, 5, 6, | ITSI | leakage A to G current (off state) -- -- 1.0 A Vin = 0.5 V to VCC - 0.5 V Input pull-up Ports A to E MOS current -Ip 10 -- 300 A VCC = 3.0 V to 3.6 V, Vin = 0 V Input RES capacitance NMI Cin -- -- 30 pF Vin = 0 V -- -- 30 pF f = 1 MHz -- -- 15 pF Ta = 25C -- TBD (3.3 V) TBD mA f = 25 MHz -- TBD (3.3 V) TBD mA -- TBD TBD A Ta 50C -- -- TBD A 50C < Ta -- TBD (3.0 V) TBD mA -- TBD TBD A -- TBD (3.0 V) TBD mA -- TBD TBD A TBD -- -- V Item Symbol All input pins except RES and NMI Current Normal operation dissipation*4 Sleep mode 5 Standby mode* Analog power supply voltage During A/D and D/A conversion Reference power supply voltage During A/D and D/A conversion 6 ICC* AICC Idle AICC Idle RAM standby voltage VRAM Notes: *1 If the A/D and D/A converters are not used, do not leave the AVCC, Vref, and AVSS pins open. Connect the AVCC and Vref pins to VCC, and the AVSS pin to VSS. *2 Current dissipation values are for VIH min = VCC - 0.2 V and VIL max = 0.2 V with all output pins unloaded and all MOS input pull-ups in the off state. *3 The values are for VRAM VCC < 3.0 V, VIH min = VCC x 0.9, and VIL max = 0.3 V. *4 ICC depends on VCC and f as follows: ICC max = TBD (mA) + TBD (mA/(MHz x V)) x VCC x f (normal operation) ICC max = TBD (mA) + TBD (mA/(MHz x V)) x VCC x f (sleep mode) Rev. 4.0, 03/03, page 1054 of 1358 Preliminary Table 22-25 Permissible Output Currents Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V, Ta = -20 to +75C (regular specifications), Ta = -40 to +85C (wide-range specifications) Item Symbol Min Typ Max Unit Permissible output low All output pins current (per pin) IOL -- -- 2.0 mA Permissible output low Total of all output current (total) pins IOL -- -- 80 mA Permissible output high current (per pin) All output pins -IOH -- -- 2.0 mA Permissible output high current (total) Total of all output pins -IOH -- -- 40 mA Note: To protect chip reliability, do not exceed the output current values in table 22-25. Rev. 4.0, 03/03, page 1055 of 1358 22.3.3 AC Characteristics (1) Clock Timing Preliminary Table 22-26 Clock Timing Condition B: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 25 MHz, Ta = -20C to 75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition B Item Symbol Min Max Unit Clock cycle time tcyc 40 500 ns Clock pulse high width tCH 15 -- ns Clock pulse low width tCL 15 -- ns Clock rise time tCr -- 5 ns Clock fall time tCf -- 5 ns Reset oscillation stabilization time (crystal) tOSC1 10 -- ms Software standby oscillation stabilization time (crystal) tOSC2 10 -- ms External clock output stabilization delay time tDEXT 500 -- s Rev. 4.0, 03/03, page 1056 of 1358 Test Conditions Figure 22-2 Figure 22-3 Figure 22-3 (2) Control Signal Timing Preliminary Table 22-27 Control Signal Timing Condition B: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 25 MHz, Ta = -20C to 75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition B Symbol Min Max Unit Test Conditions RES setup time tRESS 200 -- ns Figure 22-4 RES pulse width tRESW 20 -- tcyc NMI setup time tNMIS 150 -- ns NMI hold time tNMIH 10 -- NMI pulse width (in recovery from software standby mode) tNMIW 200 -- IRQ setup time tIRQS 150 -- IRQ hold time tIRQH 10 -- IRQ pulse width (in recovery from software standby mode) tIRQW 200 -- Item Figure 22-5 ns Rev. 4.0, 03/03, page 1057 of 1358 (3) Bus Timing Preliminary Table 22-28 Bus Timing Condition B: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 25 MHz, Ta = -20C to 75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition B Item Symbol Min Address delay time tAD Address setup time tAS Address hold time tAH 0.5 x tcyc - 8 -- ns Precharge time tPCH 1.5 x tcyc- 15 -- ns CS delay time 1 tCSD1 -- 15 ns CS delay time 2 tCSD2 -- 15 ns CS delay time 3 tCSD3 -- 20 ns AS delay time tASD -- 15 ns RD delay time 1 tRSD1 -- 15 ns RD delay time 2 tRSD2 -- 15 ns CAS delay time tCASD -- 15 ns Read data setup time tRDS 15 -- ns Read data hold time tRDH 0 -- ns Read data access time 1 tACC1 -- 1.0 x tcyc - 20 ns Read data access time 2 tACC2 -- 1.5 x tcyc - 20 ns Read data access time 3 tACC3 -- 2.0 x tcyc - 20 ns Read data access time 4 tACC4 -- 2.5 x tcyc - 20 ns Read data access time 5 tACC5 -- 3.0 x tcyc - 20 ns Read data access time 6 tACC6 -- 1.0 x tcyc - 20 ns WR delay time 1 tWRD1 -- 15 ns WR delay time 2 tWRD2 -- 15 ns WR pulse width 1 tWSW1 1.0 x tcyc - 15 -- ns WR pulse width 2 tWSW2 1.5 x tcyc - 15 -- ns Write data delay time tWDD -- 20 ns Write data setup time tWDS 0.5 x tcyc - 15 -- ns Write data hold time tWDH 0.5 x tcyc - 8 -- ns WR setup time tWCS 0.5 x tcyc - 10 -- ns WR hold time tWCH 0.5 x tcyc - 10 -- ns Rev. 4.0, 03/03, page 1058 of 1358 Max Unit Test Conditions -- 20 ns Figures 22-6 to 22-13 0.5 x tcyc - 15 -- ns Condition B Item Symbol Min Max Unit Test Conditions CAS setup time tCSR 0.5 x tcyc - 8 -- ns Figure 22-10 WAIT setup time tWTS 25 -- ns Figure 22-8 WAIT hold time tWTH 5 -- ns BREQ setup time tBRQS 30 -- ns BACK delay time tBACD -- 15 ns Bus floating time tBZD -- 40 ns BREQO delay time tBRQOD -- 25 ns Figure 22-14 Figure 22-15 Rev. 4.0, 03/03, page 1059 of 1358 (4) DMAC Timing Preliminary Table 22-29 DMAC Timing Condition B: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 2.7 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 25 MHz, Ta = -20C to 75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition B Item Symbol Min Max Unit Test Conditions DREQ setup time tDRQS 25 -- ns Figure 22-19 DREQ hold time tDRQH 10 -- TEND delay time tTED -- 18 DACK delay time 1 tDACD1 -- 18 DACK delay time 2 tDACD2 -- 18 Rev. 4.0, 03/03, page 1060 of 1358 Figure 22-18 ns Figures 22-16 and 22-17 (5) Timing of On-Chip Supporting Modules Preliminary Table 22-30 Timing of On-Chip Supporting Modules Condition B: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 25 MHz, Ta = -20C to 75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition B Item I/O ports Symbol Min Max Unit Test Conditions ns Figure 22-20 Output data delay time tPWD -- 40 Input data setup time tPRS 25 -- Input data hold time tPRH 25 -- PPG Pulse output delay time tPOD -- 40 ns Figure 22-21 TPU Timer output delay time tTOCD -- 40 ns Figure 22-22 Timer input setup time tTICS 25 -- Timer clock input setup time tTCKS 25 -- ns Figure 22-23 Timer clock pulse width Single-edge specification tTCKWH 1.5 -- tcyc Both-edge specification tTCKWL 2.5 -- Timer output delay time tTMOD -- 40 ns Figure 22-24 Timer reset input setup time tTMRS 25 -- ns Figure 22-26 Timer clock input setup time tTMCS 25 -- ns Figure 22-25 Timer clock pulse width Single-edge specification tTMCWH 1.5 -- tcyc Both-edge specification tTMCWL 2.5 -- Asynchronous tScyc 4 -- 8-bit timer SCI Input clock cycle Synchronous 6 -- tSCKW 0.4 0.6 tScyc Input clock rise time tSCKr -- 1.5 tcyc Input clock fall time tSCKf -- 1.5 Transmit data delay time tTXD -- 40 ns Receive data setup time (synchronous) tRXS 40 -- ns Receive data hold time (synchronous) tRXH 40 -- ns Trigger input setup time tTRGS 30 -- ns Input clock pulse width A/D converter tcyc Figure 22-28 Figure 22-29 Figure 22-30 Rev. 4.0, 03/03, page 1061 of 1358 22.3.4 A/D Conversion Characteristics Preliminary Table 22-31 A/D Conversion Characteristics Condition B: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 25 MHz, Ta = -20C to 75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition B Item Min Typ Max Unit Resolution 10 10 10 Bits Conversion time 10.6 -- -- s Analog input capacitance -- -- 20 pF Permissible signal source impedance -- -- 5 k Nonlinearity error -- -- 5.5 LSB Offset error -- -- 5.5 LSB Full-scale error -- -- 5.5 LSB Quantization error -- -- 0.5 LSB Absolute accuracy -- -- 6.0 LSB Rev. 4.0, 03/03, page 1062 of 1358 22.3.5 D/A Conversion Characteristics Preliminary Table 22-32 D/A Conversion Characteristics Condition B: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 25 MHz, Ta = -20C to 75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition B Item Min Typ Max Resolution 8 8 8 Bits Conversion time -- -- 10 s 20 pF capacitive load Absolute accuracy -- 2.0 3.0 LSB 2 M resistive load -- -- 2.0 LSB 4 M resistive load 22.3.6 Unit Test Conditions Flash Memory Characteristics Table 22-33 Flash Memory Characteristics -- Preliminary -- Condition B: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS = 0 V, Ta = 0C to +75C (program/erase operating temperature range: regular specifications), Ta = 0C to +85C (program/erase operating temperature range: wide-range specifications) Item Symbol Min Typ Max Unit Programming time*1 *2 Erase time*1 *3 *6 tP -- TBD TBD ms/128 bytes tE -- TBD TBD ms/4 k block -- TBD TBD ms/32 k block -- TBD TBD ms/64 k block Test Conditions Programming time (total)*1 *2 tP -- TBD TBD s/512 kbytes Ta = 25C when all cleared to 0 Erase time (total)*1 *2 tE -- TBD TBD s/512 kbytes Ta = 25C Programming and erase time (total)*1 *2 tPE -- TBD TBD s/512 kbytes Number of overwrites NWEC Data retention time tDRP 100*3 10*4 Times Years Notes: *1 The exact programming and erase times depend on the characteristics of the data. *2 Programming and erase times do not include data transfer time. *3 This is the minimum number of rewrites after which all characteristics are guaranteed. (The guaranteed range is 1 to minimum.) *4 This is the data retention characteristic when the number of rewrites is within the specification range, including minimum values. Rev. 4.0, 03/03, page 1063 of 1358 22.3.7 Usage Note (internal voltage step down for the H8S/2326C F-ZTAT) The H8S/2326C F-ZTAT has an on-chip voltage step down circuit that automatically lowers the power supply voltage, inside the microcomputer, to an adequate level. A capacitor (0.1 F) should be connected between the internal voltage step down circuit pin (VCL pin) and the VSS pin to stabilize the internal voltage. Figure 22.31 shows how to connect the capacitor. Do not connect the VCC power supply to the VCL pin. Doing so could permanently damage the LSI. (Connect the VCC power-supply to the VCC pin, in the usual way.) External capacitor to stabilize the power supply VCL 0.1 mF VSS Do not connect the VCC power-supply to the VCL pin. Doing so could permanently damage the LSI. (Connect the VCC power-supply to the VCC pin, in the usual way.) Use a multilayer ceramic capacitor (0.1 mF), and place it near the pins. Figure 22.31 VCL Capacitor Connection Method 22.4 Usage Note Although both the F-ZTAT and mask ROM versions fully meet the electrical specifications listed in this manual, there may be differences in the actual values of the electrical characteristics, operating margins, noise margins, and so forth, due to differences in the fabrication process, the on-chip ROM, and the layout patterns. If the F-ZTAT version is used to carry out system evaluation and testing, therefore, when switching to the mask ROM version the same evaluation and testing procedures should also be conducted on this version. Rev. 4.0, 03/03, page 1064 of 1358 Appendix A Instruction Set A.1 Instruction List Operand Notation Rd Rs Rn ERn MAC (EAd) (EAs) EXR CCR N Z V C PC SP #IMM disp + - x / 1 General register (destination)* 1 General register (source)* 1 General register* General register (32-bit register) 2 Multiply-and-accumulate register (32-bit register)* Destination operand Source operand Extended control register Condition-code register N (negative) flag in CCR Z (zero) flag in CCR V (overflow) flag in CCR C (carry) flag in CCR Program counter Stack pointer Immediate data Displacement Add Subtract Multiply Divide Logical AND Logical OR Logical exclusive OR Transfer from the operand on the left to the operand on the right, or transition from the state on the left to the state on the right Logical NOT (logical complement) ( ) < > Contents of operand :8/:16/:24/:32 8-, 16-, 24-, or 32-bit length Notes: *1 General registers include 8-bit registers (R0H to R7H, R0L to R7L), 16-bit registers (R0 to R7, E0 to E7), and 32-bit registers (ER0 to ER7). *2 The MAC register cannot be used in the H8S/2329 and H8S/2328 Series. Rev. 4.0, 03/03, page 1065 of 1358 Condition Code Notation Symbol Changes according to the result of the instruction * Undetermined (no guaranteed value) 0 Always cleared to 0 1 Always set to 1 -- Not affected by execution of the instruction Rev. 4.0, 03/03, page 1066 of 1358 Rev. 4.0, 03/03, page 1067 of 1358 MOV B B B B W 4 W W MOV.B Rs,@-ERd MOV.B Rs,@aa:8 MOV.B Rs,@aa:16 MOV.B Rs,@aa:32 MOV.W #xx:16,Rd MOV.W Rs,Rd MOV.W @ERs,Rd B B MOV.B Rs,@ERd MOV.B Rs,@(d:32,ERd) B MOV.B @aa:32,Rd B B MOV.B @aa:16,Rd MOV.B Rs,@(d:16,ERd) B B MOV.B @(d:32,ERs),Rd B B MOV.B @(d:16,ERs),Rd MOV.B @aa:8,Rd B MOV.B @ERs,Rd MOV.B @ERs+,Rd B MOV.B Rs,Rd Operand Size B 2 #xx MOV.B #xx:8,Rd Mnemonic Rn 2 2 @ERn 2 2 2 @(d,ERn) 8 4 8 4 @ ERn/@ERn+ 2 2 6 4 2 6 4 2 @aa Addressing Mode/ Instruction Length (Bytes) @(d,PC) (1) Data Transfer Instructions @@aa Table A-1 Instruction Set @aa:8 Rd8 @ERs Rd8,ERs32+1 ERs32 (R) (R) (R) @aa:16(R)Rd8 @aa:32(R)Rd8 Rs8(R)@ERd Rs8(R)@(d:16,ERd) Rs8(R)@(d:32,ERd) ERd32-1(R)ERd32,Rs8(R)@ERd Rs8(R)@aa:8 Rs8(R)@aa:16 Rs8(R)@aa:32 #xx:16(R)Rd16 Rs16(R)Rd16 @ERs(R)Rd16 @(d:32,ERs) Rd8 @(d:16,ERs) Rd8 (R) (R) Operation (R) Rs8(R)Rd8 @ERs(R)Rd8 #xx:8 Rd8 1 1 2 0 0 0 4 2 0 0 4 2 1 2 0 0 0 0 2 3 0 0 5 3 0 0 3 3 0 0 2 3 5 0 0 0 3 Advanced I H N Z V C 0 No. of States*1 Condition Code Rev. 4.0, 03/03, page 1068 of 1358 MOV L 6 L L L L L L L MOV.L ERs,ERd MOV.L @ERs,ERd MOV.L @(d:16,ERs),ERd MOV.L @(d:32,ERs),ERd MOV.L @ERs+,ERd MOV.L @aa:16,ERd MOV.L @aa:32,ERd W MOV.W Rs,@(d:32,ERd) MOV.L #xx:32,ERd W MOV.W Rs,@(d:16,ERd) W W MOV.W Rs,@ERd MOV.W Rs,@aa:32 W MOV.W @aa:32,Rd W W MOV.W @aa:16,Rd W W MOV.W @ERs+,Rd MOV.W Rs,@aa:16 W #xx MOV.W Rs,@-ERd W MOV.W @(d:32,ERs),Rd Operand Size MOV.W @(d:16,ERs),Rd Mnemonic Rn 2 @ERn 4 2 @(d,ERn) 10 6 8 4 8 4 @ ERn/@ERn+ 4 2 2 @aa 8 6 6 4 6 4 @@aa @(d,PC) Addressing Mode/ Instruction Length (Bytes) (R) (R) @aa:16 Rd16 @ERs Rd16,ERs32+2 ERs32 (R) (R) (R) @aa:32(R)Rd16 Rs16(R)@ERd Rs16(R)@(d:16,ERd) Rs16(R)@(d:32,ERd) ERd32-2(R)ERd32,Rs16(R)@ERd Rs16(R)@aa:16 Rs16(R)@aa:32 #xx:32(R)ERd32 ERs32(R)ERd32 @ERs(R)ERd32 @(d:16,ERs)(R)ERd32 @(d:32,ERs)(R)ERd32 @ERs(R)ERd32,ERs32+4(R)@ERs32 @aa:16(R)ERd32 @aa:32(R)ERd32 @(d:32,ERs) Rd16 @(d:16,ERs) Rd16 Operation 3 5 5 6 0 7 0 0 5 0 0 1 4 3 0 0 4 0 0 3 5 0 3 3 0 0 2 0 0 4 0 3 3 0 0 0 5 Advanced I H N Z V C 0 No. of States*1 Condition Code Rev. 4.0, 03/03, page 1069 of 1358 #xx 4 MOVFPE @aa:16,Rd MOVTPE Rs,@aa:16 MOVFPE MOVTPE STM (ERm-ERn),@-SP STM @ ERn/@ERn+ 2 (R) Repeated for each register saved (SP-4 SP,ERn32 @SP) (R) Repeated for each register restored 3 5 0 0 7/9/11 [1] 7/9/11 [1] 3 5 0 6 0 0 5 5 0 7 0 0 4 5 0 Advanced 0 I H N Z V C [2] 4 4 4 2 4 Operation (R) ERs32(R)@(d:16,ERd) ERs32(R)@(d:32,ERd) ERd32-4(R)ERd32,ERs32(R)@ERd ERs32(R)@aa:16 ERs32(R)@aa:32 @SP(R)Rn16,SP+2(R)SP @SP(R)ERn32,SP+4(R)SP SP-2(R)SP,Rn16(R)@SP SP-4(R)SP,ERn32(R)@SP (@SP(R)ERn32,SP+4(R)SP) ERs32 @ERd No. of States*1 Condition Code [2] 8 6 @aa Cannot be used in the chip 4 @(d,PC) Cannot be used in the chip L L L LDM @SP+,(ERm-ERn) W PUSH.L ERn L PUSH.W Rn W L MOV.L ERs,@aa:32 POP.L ERn L MOV.L ERs,@aa:16 POP.W Rn L MOV.L ERs,@-ERd 10 Rn MOV.L ERs,@(d:32,ERd) L MOV.L ERs,@ERd @ERn 6 L Mnemonic @(d,ERn) MOV.L ERs,@(d:16,ERd) L Operand Size LDM PUSH POP MOV @@aa Addressing Mode/ Instruction Length (Bytes) L 6 L ADD.L #xx:32,ERd ADD.L ERs,ERd B W 4 SUB.B Rs,Rd SUB.W #xx:16,Rd L INC.L #2,ERd SUB L INC.L #1,ERd B W INC.W #2,Rd DAA Rd W INC.W #1,Rd L ADDS #4,ERd B L ADDS #2,ERd INC.B Rd L ADDS #1,ERd B W ADD.W Rs,Rd ADDX Rs,Rd W 4 ADD.W #xx:16,Rd B 2 B ADDX #xx:8,Rd B 2 ADD.B Rs,Rd Operand Size ADD.B #xx:8,Rd #xx DAA INC ADDS ADDX ADD Mnemonic Rn 2 2 2 2 2 2 2 2 2 2 2 2 2 2 @(d,PC) @aa @ ERn/@ERn+ @(d,ERn) @ERn Addressing Mode/ Instruction Length (Bytes) @@aa (2) Arithmetic Instructions (R) (R) Rd16+#xx:16 Rd16 (R) Rd16+Rs16(R)Rd16 ERd32+#xx:32(R)ERd32 ERd32+ERs32(R)ERd32 Rd8+#xx:8+C(R)Rd8 Rd8+Rs8+C(R)Rd8 ERd32+1(R)ERd32 ERd32+2(R)ERd32 ERd32+4(R)ERd32 Rd8+1(R)Rd8 Rd16+1(R)Rd16 Rd16+2(R)Rd16 ERd32+1(R)ERd32 ERd32+2(R)ERd32 Rd8 decimal adjust(R)Rd8 Rd8-Rs8(R)Rd8 Rd16-#xx:16(R)Rd16 Rd8+#xx:8 Rd8 I H N Z V C Rd8+Rs8 Rd8 Operation Condition Code [3] [3] [4] [3] 1 * 1 1 1 1 1 1 1 1 1 2 * [5] [5] 1 1 3 1 2 1 1 Advanced No. of States*1 1 [4] Rev. 4.0, 03/03, page 1070 of 1358 Rev. 4.0, 03/03, page 1071 of 1358 W L L DEC.W #2,Rd DEC.L #1,ERd DEC.L #2,ERd B W MULXS.W Rs,ERd MULXU.W Rs,ERd MULXS.B Rs,Rd W MULXU.B Rs,Rd MULXU MULXS B DAS Rd B W DEC.W #1,Rd L SUBS #4,ERd B L SUBS #2,ERd DEC.B Rd L B SUBS #1,ERd B 2 L SUB.L ERs,ERd SUBX Rs,Rd L 6 SUB.L #xx:32,ERd SUBX #xx:8,Rd W #xx SUB.W Rs,Rd Mnemonic Operand Size DAS DEC SUBS SUBX SUB Rn 4 4 2 2 2 2 2 2 2 2 2 2 2 2 2 2 (R) Operation (signed multiplication) Rd16 Rs16 ERd32 Rd8 Rs8 Rd16 (signed multiplication) (R) (R) (unsigned multiplication) ERd32-#xx:32 ERd32 (R) ERd32-ERs32(R)ERd32 Rd8-#xx:8-C(R)Rd8 Rd8-Rs8-C(R)Rd8 ERd32-1(R)ERd32 ERd32-2(R)ERd32 ERd32-4(R)ERd32 Rd8-1(R)Rd8 Rd16-1(R)Rd16 Rd16-2(R)Rd16 ERd32-1(R)ERd32 ERd32-2(R)ERd32 Rd8 decimal adjust(R)Rd8 Rd8Rs8(R)Rd16 (unsigned multiplication) Rd16Rs16(R)ERd32 Rd16-Rs16 Rd16 I H N Z V C Condition Code [3] [4] * [5] [5] * 21 13 20 12 1 1 1 1 1 1 1 1 1 1 1 3 1 Advanced No. of States*1 1 [4] @@aa @(d,PC) @aa @ ERn/@ERn+ @(d,ERn) @ERn Addressing Mode/ Instruction Length (Bytes) EXTU NEG CMP DIVXS DIVXU B W 4 W L 6 L CMP.B Rs,Rd CMP.W #xx:16,Rd CMP.W Rs,Rd CMP.L #xx:32,ERd CMP.L ERs,ERd W L EXTU.W Rd EXTU.L ERd L B 2 CMP.B #xx:8,Rd NEG.L ERd W DIVXS.W Rs,ERd W B DIVXS.B Rs,Rd NEG.W Rd W DIVXU.W Rs,ERd B B DIVXU.B Rs,Rd NEG.B Rd Operand Size Mnemonic Rn 2 2 2 2 2 2 2 2 4 4 2 2 ERd32 Rs16(R)ERd32 (Ed: remainder, Rd8-Rs8 [8] [7] [8] [7] Rd8-#xx:8 Rd: quotient) (signed division) ERd32 Rs16(R)ERd32 (Ed: remainder, RdL: quotient) (signed division) Rd16 Rs8(R)Rd16 (RdH: remainder, Rd: quotient) (unsigned division) [6] [7] [6] [7] Rd16 Rs8(R)Rd16 (RdH: remainder, RdL: quotient) (unsigned division) I H N Z V C Operation Condition Code [3] [3] [4] [4] Rd16-#xx:16 Rd16-Rs16 ERd32-#xx:32 ERd32-ERs32 0-Rd8(R)Rd8 0 0(R)(<bits 31 to 16> of ERd32) 0 0 1 1 1 0 0-ERd32(R)ERd32 0(R)(<bits 15 to 8> of Rd16) 1 1 1 3 1 2 1 1 21 13 20 12 Advanced No. of States*1 0-Rd16(R)Rd16 @@aa @(d,PC) @aa @ ERn/@ERn+ @(d,ERn) @ERn #xx Addressing Mode/ Instruction Length (Bytes) Rev. 4.0, 03/03, page 1072 of 1358 Rev. 4.0, 03/03, page 1073 of 1358 MAC @ERn+, @ERm+ CLRMAC LDMAC ERs,MACH MAC CLRMAC LDMAC STMAC MACL,ERd STMAC MACH,ERd LDMAC ERs,MACL B TAS @ERd*3 TAS STMAC L EXTS.L ERd Rn 2 2 @ERn 4 @(d,PC) @aa @ ERn/@ERn+ @(d,ERn) #xx Cannot be used in the chip W Operand Size EXTS.W Rd EXTS Mnemonic @@aa Addressing Mode/ Instruction Length (Bytes) (<bit 7> of @ERd) @ERd-0(R)CCR set, (1)(R) (<bits 31 to 16> of ERd32) (<bit 15> of ERd32)(R) (<bits 15 to 8> of Rd16) (<bit 7> of Rd16)(R) Operation No. of States*1 Advanced Condition Code I H N Z V C 1 0 0 [2] 4 1 0 Rev. 4.0, 03/03, page 1074 of 1358 NOT XOR OR AND W 4 W L 6 L AND.W #xx:16,Rd AND.W Rs,Rd AND.L #xx:32,ERd AND.L ERs,ERd B L NOT.L ERd L XOR.L ERs,ERd W L 6 XOR.L #xx:32,ERd NOT.W Rd W XOR.W Rs,Rd NOT.B Rd W 4 XOR.W #xx:16,Rd OR.L ERs,ERd B L OR.L #xx:32,ERd XOR.B Rs,Rd L 6 OR.W Rs,Rd B 2 W OR.W #xx:16,Rd XOR.B #xx:8,Rd B W 4 OR.B Rs,Rd B 2 B OR.B #xx:8,Rd B 2 Operand Size AND.B Rs,Rd #xx AND.B #xx:8,Rd Mnemonic Rn 2 2 2 4 2 2 4 2 2 4 2 2 @(d,PC) @aa @ ERn/@ERn+ @(d,ERn) @ERn Addressing Mode/ Instruction Length (Bytes) @@aa (3) Logical Instructions U (R) U (R) Rd16U#xx:16(R)Rd16 Rd16URs16(R)Rd16 ERd32U#xx:32(R)ERd32 ERd32UERs32(R)ERd32 Rd8U#xx:8(R)Rd8 Rd8URs8(R)Rd8 Rd16U#xx:16(R)Rd16 Rd16URs16(R)Rd16 ERd32U#xx:32(R)ERd32 ERd32UERs32(R)ERd32 Rd8A#xx:8(R)Rd8 Rd8ARs8(R)Rd8 Rd16A#xx:16(R)Rd16 Rd16ARs16(R)Rd16 ERd32A#xx:32(R)ERd32 ERd32AERs32(R)ERd32 Rd8(R)Rd8 Rd16(R)Rd16 ERd32(R)ERd32 Rd8 Rs8 Rd8 Rd8 #xx:8 Rd8 Operation 2 1 1 1 0 0 0 0 1 3 0 0 1 2 0 0 2 1 0 3 0 0 2 1 0 1 0 0 2 1 0 0 1 3 0 2 0 0 1 0 1 Advanced I H N Z V C 0 No. of States*1 Condition Code Rev. 4.0, 03/03, page 1075 of 1358 SHLL SHAR SHAL B W W L L SHLL.W Rd SHLL.W #2,Rd SHLL.L ERd SHLL.L #2,ERd L SHAR.L #2,ERd SHLL.B #2,Rd L SHAR.L ERd B W SHAR.W #2,Rd SHLL.B Rd W SHAR.W Rd L SHAL.L #2,ERd B L SHAL.L ERd B W SHAL.W #2,Rd SHAR.B #2,Rd W SHAL.W Rd SHAR.B Rd B B SHAL.B #2,Rd Operand Size SHAL.B Rd Mnemonic 2 Rn 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 @(d,PC) @aa @ ERn/@ERn+ @(d,ERn) @ERn #xx Addressing Mode/ Instruction Length (Bytes) @@aa (4) Shift Instructions C C MSB MSB MSB Operation LSB LSB LSB C 0 0 I H N Z V C Condition Code 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Advanced No. of States*1 1 Rev. 4.0, 03/03, page 1076 of 1358 ROTXR ROTXL SHLR W L L SHLR.W #2,Rd SHLR.L ERd SHLR.L #2,ERd W W L L ROTXR.W Rd ROTXR.W #2,Rd ROTXR.L ERd ROTXR.L #2,ERd ROTXL.L #2,ERd B L ROTXL.L ERd ROTXR.B #2,Rd L ROTXL.W #2,Rd B W ROTXL.W Rd ROTXR.B Rd B W ROTXL.B #2,Rd B W SHLR.W Rd ROTXL.B Rd B B SHLR.B #2,Rd Operand Size SHLR.B Rd Mnemonic 2 Rn 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 @@aa @(d,PC) @aa @ ERn/@ERn+ @(d,ERn) @ERn #xx Addressing Mode/ Instruction Length (Bytes) 0 MSB MSB C MSB C LSB LSB LSB Operation C I H N Z V C Condition Code 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Advanced No. of States*1 Rev. 4.0, 03/03, page 1077 of 1358 ROTR ROTL W W L L ROTL.W Rd ROTL.W #2,Rd ROTL.L ERd ROTL.L #2,ERd B W W L L ROTR.B #2,Rd ROTR.W Rd ROTR.W #2,Rd ROTR.L ERd ROTR.L #2,ERd B B ROTR.B Rd B ROTL.B #2,Rd Operand Size ROTL.B Rd Mnemonic Rn 2 2 2 2 2 2 2 2 2 2 2 2 @@aa @(d,PC) @aa @ ERn/@ERn+ @(d,ERn) @ERn #xx Addressing Mode/ Instruction Length (Bytes) 1 MSB MSB C C LSB LSB Operation I H N Z V C Condition Code 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 Advanced No. of States*1 Rev. 4.0, 03/03, page 1078 of 1358 BCLR BSET B B B B B B B BCLR #xx:3,@aa:8 BCLR #xx:3,@aa:16 BCLR #xx:3,@aa:32 BCLR Rn,Rd BCLR Rn,@ERd BCLR Rn,@aa:8 BCLR Rn,@aa:16 B BSET Rn,@aa:32 B B BSET Rn,@aa:16 BCLR #xx:3,@ERd B BSET Rn,@aa:8 B B BSET Rn,@ERd BCLR #xx:3,Rd B B BSET #xx:3,@aa:16 B B BSET #xx:3,@aa:8 BSET Rn,Rd B BSET #xx:3,@aa:32 B BSET #xx:3,@ERd Operand Size BSET #xx:3,Rd Mnemonic Rn 2 2 2 2 @ERn 4 4 4 4 6 4 8 6 4 8 6 4 8 6 4 @aa @ ERn/@ERn+ @(d,ERn) #xx Addressing Mode/ Instruction Length (Bytes) @(d,PC) (5) Bit-Manipulation Instructions @@aa (#xx:3 of @ERd) 1 (#xx:3 of @aa:8)1 (#xx:3 of @aa:16)1 (#xx:3 of @aa:32)1 (Rn8 of Rd8)1 (Rn8 of @ERd)1 (Rn8 of @aa:8)1 (Rn8 of @aa:16)1 (Rn8 of @aa:32)1 (#xx:3 of Rd8)0 (#xx:3 of @ERd)0 (#xx:3 of @aa:8)0 (#xx:3 of @aa:16)0 (#xx:3 of @aa:32)0 (Rn8 of Rd8)0 (Rn8 of @ERd)0 (Rn8 of @aa:8)0 (Rn8 of @aa:16)0 (#xx:3 of Rd8) 1 Operation I H N Z V C Condition Code 5 4 4 1 6 5 4 4 1 6 5 4 4 1 6 5 4 4 1 Advanced No. of States*1 Rev. 4.0, 03/03, page 1079 of 1358 B B B BNOT Rn,Rd BNOT Rn,@ERd BNOT Rn,@aa:8 BTST B BNOT #xx:3,@aa:32 B B B BTST #xx:3,@ERd BTST #xx:3,@aa:8 BTST #xx:3,@aa:16 B BTST #xx:3,Rd B B BNOT #xx:3,@aa:16 BNOT Rn,@aa:32 B BNOT #xx:3,@aa:8 B B BNOT #xx:3,@ERd BNOT Rn,@aa:16 B BNOT #xx:3,Rd B BNOT Mnemonic BCLR Rn,@aa:32 Operand Size BCLR Rn 2 2 2 @ERn 4 4 4 @aa 6 4 8 6 4 8 6 4 8 @@aa @(d,PC) @ ERn/@ERn+ @(d,ERn) #xx Addressing Mode/ Instruction Length (Bytes) (#xx:3 of @ERd) Z (R) (#xx:3 of @aa:8)(R)Z (#xx:3 of @aa:16)(R)Z (#xx:3 of Rd8) Z (R) [ (Rn8 of @aa:32)] (Rn8 of @aa:32) [ (Rn8 of @aa:16)] (Rn8 of Rd8) [ (Rn8 of Rd8)] (Rn8 of @ERd)[ (Rn8 of @ERd)] (Rn8 of @aa:8)[ (Rn8 of @aa:8)] (Rn8 of @aa:16) [ (#xx:3 of @aa:32)] (#xx:3 of @aa:32) [ (#xx:3 of @aa:16)] (#xx:3 of @aa:16) [ (#xx:3 of @aa:8)] (#xx:3 of @aa:8) [ (#xx:3 of @ERd)] 4 3 3 1 6 5 4 4 1 6 5 4 1 4 (#xx:3 of @ERd) Advanced 6 I H N Z V C (#xx:3 of Rd8) [ (#xx:3 of Rd8)] No. of States*1 (Rn8 of @aa:32) 0 Operation Condition Code Rev. 4.0, 03/03, page 1080 of 1358 BST BILD BLD BTST B B BST #xx:3,@aa:8 B BILD #xx:3,@aa:32 B B BILD #xx:3,@aa:16 BST #xx:3,@ERd B BILD #xx:3,@aa:8 BST #xx:3,Rd B BILD #xx:3,@ERd B BLD #xx:3,@aa:32 B B BILD #xx:3,Rd B BLD #xx:3,@aa:16 BTST Rn,@aa:32 BLD #xx:3,@aa:8 B BTST Rn,@aa:16 B B BTST Rn,@aa:8 BLD #xx:3,@ERd B BTST Rn,@ERd B B BTST Rn,Rd BLD #xx:3,Rd B B BTST #xx:3,@aa:32 Operand Size Mnemonic Rn 2 2 2 2 @ERn 4 4 4 4 @aa 4 8 6 4 8 6 4 8 6 4 8 (R) (Rn8 of @aa:8) Z (Rn8 of @ERd) Z (R) (R) (Rn8 of @aa:16)(R)Z (Rn8 of @aa:32)(R)Z (#xx:3 of Rd8)(R)C (#xx:3 of @ERd)(R)C (#xx:3 of @aa:8)(R)C (#xx:3 of @aa:16)(R)C (#xx:3 of @aa:32)(R)C (#xx:3 of Rd8)(R)C (#xx:3 of @ERd)(R)C (#xx:3 of @aa:8)(R)C (#xx:3 of @aa:16)(R)C (#xx:3 of @aa:32)(R)C C(R)(#xx:3 of Rd8) C(R)(#xx:3 of @ERd) C(R)(#xx:3 of @aa:8) (Rn8 of Rd8) Z (R) (#xx:3 of @aa:32) Z Operation I H N Z V C Condition Code @@aa @(d,PC) @ ERn/@ERn+ @(d,ERn) #xx Addressing Mode/ Instruction Length (Bytes) 4 4 1 5 4 3 3 1 5 4 3 3 1 5 4 3 3 1 5 Advanced No. of States*1 Rev. 4.0, 03/03, page 1081 of 1358 BOR BIAND BAND BIST BST B B BAND #xx:3,@aa:16 BAND #xx:3,@aa:32 B B BIAND #xx:3,@aa:32 BOR #xx:3,@ERd B BIAND #xx:3,@aa:16 BOR #xx:3,Rd B B BIAND #xx:3,@aa:8 B BIAND #xx:3,@ERd B B BAND #xx:3,@aa:8 BIAND #xx:3,Rd B BIST #xx:3,@aa:32 BAND #xx:3,@ERd B BIST #xx:3,@aa:16 B B BIST #xx:3,@aa:8 BAND #xx:3,Rd B B BIST #xx:3,@ERd B B BIST #xx:3,Rd B BST #xx:3,@aa:32 Operand Size BST #xx:3,@aa:16 Mnemonic Rn 2 2 2 2 @ERn 4 4 4 4 @aa 8 6 4 8 6 4 8 6 4 8 6 @@aa @(d,PC) @ ERn/@ERn+ @(d,ERn) #xx Addressing Mode/ Instruction Length (Bytes) (R) (R) C(R)(#xx:3 of Rd8) C(R)(#xx:3 of @ERd) C(R)(#xx:3 of @aa:8) C(R)(#xx:3 of @aa:16) C(R)(#xx:3 of @aa:32) CU(#xx:3 of Rd8)(R)C CU(#xx:3 of @ERd)(R)C CU(#xx:3 of @aa:8)(R)C CU(#xx:3 of @aa:16)(R)C CU(#xx:3 of @aa:32)(R)C CU[ (#xx:3 of Rd8)](R)C CU[ (#xx:3 of @ERd)](R)C CU[ (#xx:3 of @aa:8)](R)C CU[ (#xx:3 of @aa:16)](R)C CU[ (#xx:3 of @aa:32)](R)C CU(#xx:3 of Rd8)(R)C CU(#xx:3 of @ERd)(R)C C (#xx:3 of @aa:32) C (#xx:3 of @aa:16) Operation I H N Z V C Condition Code 3 1 5 4 3 3 1 5 4 3 3 1 6 5 4 4 1 6 5 Advanced No. of States*1 Rev. 4.0, 03/03, page 1082 of 1358 BIXOR BXOR BIOR BOR B BOR #xx:3,@aa:32 B B B B BIXOR #xx:3,@aa:8 BIXOR #xx:3,@aa:16 BIXOR #xx:3,@aa:32 B BXOR #xx:3,@aa:32 BIXOR #xx:3,@ERd B BXOR #xx:3,@aa:16 B B BXOR #xx:3,@aa:8 BIXOR #xx:3,Rd B BIOR #xx:3,@aa:32 B B BIOR #xx:3,@aa:16 BXOR #xx:3,@ERd B BIOR #xx:3,@aa:8 BXOR #xx:3,Rd B B BIOR #xx:3,@ERd B B BIOR #xx:3,Rd B BOR #xx:3,@aa:16 Operand Size BOR #xx:3,@aa:8 Mnemonic Rn 2 2 2 @ERn 4 4 4 @aa 8 6 4 8 6 4 8 6 4 8 6 4 @@aa @(d,PC) @ ERn/@ERn+ @(d,ERn) #xx Addressing Mode/ Instruction Length (Bytes) U (R) U (R) CU(#xx:3 of @aa:32)(R)C CU[ (#xx:3 of Rd8)](R)C CU[ (#xx:3 of @ERd)](R)C CU[ (#xx:3 of @aa:8)](R)C CU[ (#xx:3 of @aa:16)](R)C CU[ (#xx:3 of @aa:32)](R)C CA(#xx:3 of Rd8)(R)C CA(#xx:3 of @ERd)(R)C CA(#xx:3 of @aa:8)(R)C CA(#xx:3 of @aa:16)(R)C CA(#xx:3 of @aa:32)(R)C CA[ (#xx:3 of Rd8)](R)C CA[ (#xx:3 of @ERd)](R)C CA[ (#xx:3 of @aa:8)](R)C CA[ (#xx:3 of @aa:16)](R)C CA[ (#xx:3 of @aa:32)](R)C C (#xx:3 of @aa:16) C C (#xx:3 of @aa:8) C Operation I H N Z V C Condition Code 5 4 3 3 1 5 4 3 3 1 5 4 3 3 1 5 4 3 Advanced No. of States*1 Rev. 4.0, 03/03, page 1083 of 1358 Bcc 2 4 2 4 2 4 BEQ d:8 BEQ d:16 BVC d:8 BVC d:16 4 BCS d:16(BLO d:16) BNE d:16 2 BCS d:8(BLO d:8) BNE d:8 2 BLS d:16 4 4 BLS d:8 BCC d:16(BHS d:16) 2 BHI d:16 BCC d:B(BHS d:8) 2 4 BHI d:8 4 BRN d:16(BF d:16) Operand Size 2 #xx BRN d:8(BF d:8) Rn 4 @ERn 2 @(d,ERn) BRA d:16(BT d:16) @ ERn/@ERn+ BRA d:8(BT d:8) Mnemonic @aa Addressing Mode/ Instruction Length (Bytes) @(d,PC) (6) Branch Instructions @@aa Branching Condition else next; PC PC+d V=0 Z=1 Z=0 C=1 C=0 U C Z=1 U C Z=0 Never if condition is true then Always Operation I H N Z V C Condition Code 3 2 3 2 3 2 3 2 3 2 3 2 3 2 3 2 3 2 Advanced No. of States*1 Rev. 4.0, 03/03, page 1084 of 1358 Bcc 2 2 4 2 4 BGT d:8 BGT d:16 BLE d:8 BLE d:16 BGE d:16 4 4 BGE d:8 BLT d:16 2 BMI d:16 BLT d:8 2 4 BMI d:8 4 Operand Size BPL d:16 #xx 2 Rn BPL d:8 @ERn 2 @(d,ERn) 4 @ ERn/@ERn+ BVS d:16 @aa BVS d:8 Mnemonic @(d,PC) Addressing Mode/ Instruction Length (Bytes) @@aa Operation ZU(NAV)=1 ZU(NAV)=0 NAV=1 NAV=0 N=1 N=0 V=1 Branching Condition I H N Z V C Condition Code 3 2 3 2 3 2 3 2 3 2 3 2 3 2 Advanced No. of States*1 Rev. 4.0, 03/03, page 1085 of 1358 RTS JSR BSR JMP Mnemonic @ERn Rn #xx Operand Size 4 4 RTS JSR @@aa:8 JSR @aa:24 JSR @ERn 4 @(d,ERn) 2 @ ERn/@ERn+ BSR d:16 2 2 @aa BSR d:8 JMP @@aa:8 JMP @aa:24 JMP @ERn @(d,PC) 2 2 2 Addressing Mode/ Instruction Length (Bytes) @@aa Operation PCaa:24 PC@aa:8 PC(R)@-SP,PCPC+d:8 PC(R)@-SP,PCPC+d:16 PC(R)@-SP,PCERn PC(R)@-SP,PCaa:24 PC(R)@-SP,PC@aa:8 PC@SP+ PC ERn I H N Z V C Condition Code 5 6 5 4 5 4 5 3 2 Advanced No. of States*1 W W W W LDC @aa:16,EXR LDC @aa:32,CCR LDC @aa:32,EXR W LDC @(d:32,ERs),CCR LDC @aa:16,CCR W LDC @(d:16,ERs),EXR W W LDC @(d:16,ERs),CCR LDC @ERs+,EXR W LDC @ERs,EXR W W LDC @ERs,CCR W B LDC Rs,EXR LDC @ERs+,CCR B LDC Rs,CCR LDC @(d:32,ERs),EXR B 2 B 4 LDC Operand Size LDC #xx:8,EXR SLEEP SLEEP #xx LDC #xx:8,CCR RTE RTE Mnemonic TRAPA #xx:2 TRAPA Rn 2 2 @ERn 4 4 @(d,ERn) 10 10 6 6 @ ERn/@ERn+ 4 4 @aa 8 8 6 6 @(d,PC) Addressing Mode/ Instruction Length (Bytes) @@aa (7) System Control Instructions Operation (R) (R) EXR(R)@-SP,<vector>(R)PC EXR@SP+,CCR@SP+, PC@SP+ #xx:8 CCR (R) #xx:8(R)EXR Rs8(R)CCR Rs8(R)EXR @ERs(R)CCR @ERs(R)EXR @(d:16,ERs)(R)CCR @(d:16,ERs)(R)EXR @(d:32,ERs)(R)CCR @(d:32,ERs)(R)EXR @ERs(R)CCR,ERs32+2(R)ERs32 @ERs(R)EXR,ERs32+2(R)ERs32 @aa:16(R)CCR @aa:16(R)EXR @aa:32(R)CCR @aa:32(R)EXR Transition to power-down state PC @-SP,CCR @-SP, 1 I H N Z V C Condition Code Rev. 4.0, 03/03, page 1086 of 1358 5 5 4 4 4 4 6 6 4 4 3 3 1 1 2 1 2 5 [9] 8 [9] Advanced No. of States*1 Rev. 4.0, 03/03, page 1087 of 1358 NOP XORC ORC ANDC STC W W W W W STC CCR,@-ERd STC EXR,@-ERd STC CCR,@aa:16 STC EXR,@aa:16 STC CCR,@aa:32 B 4 B 2 B 4 ORC #xx:8,CCR ORC #xx:8,EXR XORC #xx:8,CCR XORC #xx:8,EXR NOP B 4 B 2 ANDC #xx:8,EXR B 2 W STC EXR,@(d:32,ERd) ANDC #xx:8,CCR W STC CCR,@(d:32,ERd) W W STC EXR,@(d:16,ERd) #xx STC EXR,@aa:32 W W W STC CCR,@ERd STC CCR,@(d:16,ERd) B STC EXR,Rd STC EXR,@ERd B Mnemonic Operand Size STC CCR,Rd Rn 2 2 @ERn 4 4 @(d,ERn) 10 10 6 6 @ ERn/@ERn+ 4 4 @aa 8 8 6 6 @@aa @(d,PC) 2 Addressing Mode/ Instruction Length (Bytes) Operation (R) EXR(R)Rd8 CCR(R)@ERd EXR(R)@ERd CCR(R)@(d:16,ERd) EXR(R)@(d:16,ERd) CCR(R)@(d:32,ERd) EXR(R)@(d:32,ERd) ERd32-2(R)ERd32,CCR(R)@ERd ERd32-2(R)ERd32,EXR(R)@ERd CCR(R)@aa:16 EXR(R)@aa:16 CCR(R)@aa:32 EXR(R)@aa:32 CCRU#xx:8(R)CCR EXRU#xx:8(R)EXR CCRU#xx:8(R)CCR EXRU#xx:8(R)EXR CCRA#xx:8(R)CCR EXRA#xx:8(R)EXR PCPC+2 CCR Rd8 I H N Z V C Condition Code 1 2 1 2 1 2 1 5 5 4 4 4 4 6 6 4 4 3 3 1 1 Advanced No. of States*1 Rev. 4.0, 03/03, page 1088 of 1358 Notes: *1 *2 *3 [1] [2] [3] [4] [5] [6] [7] [8] [9] EEPMOV Rn #xx Operand Size Operation (R) I H N Z V C Condition Code 4+2n *2 4+2n *2 Advanced No. of States*1 The number of states is the number of states required for execution when the instruction and its operands are located in on-chip memory. n is the initial value of R4L or R4. Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction. Seven states for saving or restoring two registers, nine states for three registers, or eleven states for four registers. Cannot be used in the chip. Set to 1 when a carry or borrow occurs at bit 11; otherwise cleared to 0. Set to 1 when a carry or borrow occurs at bit 27; otherwise cleared to 0. Retains its previous value when the result is zero; otherwise cleared to 0. Set to 1 when the divisor is negative; otherwise cleared to 0. Set to 1 when the divisor is zero; otherwise cleared to 0. Set to 1 when the quotient is negative; otherwise cleared to 0. One additional state is required for execution when EXR is valid. (R) (R) (R) (R) (R) (R) (R) 4 if R4 0 Repeat @ER5 @ER6 ER5+1 ER5 ER6+1 ER6 R4-1 R4 Until R4=0 else next; @ERn EEPMOV.W @(d,ERn) 4 if R4L 0 Repeat @ER5 @ER6 ER5+1 ER5 ER6+1 ER6 R4L-1 R4L Until R4L=0 else next; @ ERn/@ERn+ EEPMOV.B Mnemonic @aa Addressing Mode/ Instruction Length (Bytes) @(d,PC) (8) Block Transfer Instructions @@aa A.2 Instruction Codes Table A-2 shows the instruction codes. Rev. 4.0, 03/03, page 1089 of 1358 Rev. 4.0, 03/03, page 1090 of 1358 Bcc BAND ANDC AND ADDX ADDS ADD Instruction 0 0 0 9 L L L B ADDS #1,ERd ADDS #2,ERd ADDS #4,ERd ADDX #xx:8,Rd ADDX Rs,Rd 1 8 5 BRN d:16 (BF d:16) 1 0 8 4 B BAND #xx:3,@aa:32 5 6 B BAND #xx:3,@aa:16 disp disp abs 0 erd C E 0 IMM 6 IMM 0 0 0 0 0 rd 1 0 0 erd rd rd rd rd 0 erd 0 erd 0 erd IMM 4 BRN d:8 (BF d:8) 7 B BAND #xx:3,@aa:8 rd rd rd 0 erd IMM 1 BRA d:16 (BT d:16) 7 B BAND #xx:3,@ERd 1 0 7 B BAND #xx:3,Rd 6 F A 6 rs 6 4 0 B ANDC #xx:8,EXR 6 9 BRA d:8 (BT d:8) 0 B ANDC #xx:8,CCR rs 6 3 0 L AND.L ERs,ERd E rd A 7 L AND.L #xx:32,ERd 9 B rs 8 B rd 0 B 6 6 W AND.W Rs,Rd 1 A 1 7 AND.W #xx:16,Rd rs 9 IMM 1 ers 0 erd 1 9 A rs 8 rd 2nd byte A 1 B W AND.B Rs,Rd 0 0 L ADD.L ERs,ERd E 7 L ADD.L #xx:32,ERd B 0 W ADD.W Rs,Rd B 7 ADD.W #xx:16,Rd AND.B #xx:8,Rd 0 B W ADD.B Rs,Rd 8 1st byte B Size ADD.B #xx:8,Rd Mnemonic Table A-2 Instruction Codes 6 6 7 6 6 7 0 6 3rd byte IMM IMM disp disp abs 0 IMM 0 IMM IMM 0 0 abs 0 ers 0 erd IMM IMM 4th byte 7 6 0 IMM 0 6th byte Instruction Format 5th byte 7 6 7th byte 0 IMM 0 8th byte 9th byte 10th byte Rev. 4.0, 03/03, page 1091 of 1358 Bcc Instruction 4 BMI d:8 5 5 BPL d:16 BLE d:16 4 BPL d:8 4 5 BVS d:16 5 4 BVS d:8 BLE d:8 5 BVC d:16 BGT d:16 4 BVC d:8 4 5 BEQ d:16 5 4 BEQ d:8 BGT d:8 5 BNE d:16 BLT d:16 4 BNE d:8 4 5 BCS d:16 (BLO d:16) 5 4 BCS d:8 (BLO d:8) BLT d:8 5 BCC d:16 (BHS d:16) BGE d:16 4 BCC d:8 (BHS d:8) 4 5 BLS d:16 5 4 BLS d:8 BGE d:8 5 BMI d:16 4 8 F 8 E 8 D 8 C 8 B 8 A 8 9 8 8 8 7 8 6 8 5 8 4 8 3 8 2 1st byte BHI d:16 Size BHI d:8 Mnemonic F E D C B A 9 8 7 6 5 4 3 2 disp disp disp disp disp disp disp disp disp disp disp disp disp disp 0 0 0 0 0 0 0 0 0 0 0 0 0 0 2nd byte 3rd byte disp disp disp disp disp disp disp disp disp disp disp disp disp disp 4th byte 6th byte Instruction Format 5th byte 7th byte 8th byte 9th byte 10th byte Rev. 4.0, 03/03, page 1092 of 1358 BIOR BILD BIAND BCLR Instruction B B B B B B B B B B B B B B B B B B B B B B B B B BCLR #xx:3,@ERd BCLR #xx:3,@aa:8 BCLR #xx:3,@aa:16 BCLR #xx:3,@aa:32 BCLR Rn,Rd BCLR Rn,@ERd BCLR Rn,@aa:8 BCLR Rn,@aa:16 BCLR Rn,@aa:32 BIAND #xx:3,Rd BIAND #xx:3,@ERd BIAND #xx:3,@aa:8 BIAND #xx:3,@aa:16 BIAND #xx:3,@aa:32 BILD #xx:3,Rd BILD #xx:3,@ERd BILD #xx:3,@aa:8 BILD #xx:3,@aa:16 BILD #xx:3,@aa:32 BIOR #xx:3,Rd BIOR #xx:3,@ERd BIOR #xx:3,@aa:8 BIOR #xx:3,@aa:16 BIOR #xx:3,@aa:32 Size BCLR #xx:3,Rd Mnemonic 6 6 7 7 7 6 6 7 7 7 6 6 7 7 7 6 6 7 7 6 6 6 0 erd D 0 erd C 0 erd C 0 erd C 0 0 1 3 A 0 A abs 1 IMM 4 E 0 3 A rd 0 1 0 A abs 1 IMM 7 E 0 3 A rd 0 1 0 A abs 1 IMM 6 E 8 3 A rd 8 1 A 0 rd rn 2 abs 8 3 A F 8 1 0 A abs 0 erd D 7 7 F rd 0 IMM 2 7 2nd byte 1st byte 0 IMM 2 1 IMM 6 1 IMM 7 7 1 IMM 4 7 abs 1 IMM 4 7 abs 1 IMM 7 7 abs 1 IMM 6 7 0 0 0 0 0 0 0 rn 2 7 0 rn 2 6 0 0 6 abs abs 0 IMM 2 7 4th byte 7 3rd byte abs abs abs abs abs 7 7 7 6 7 4 7 6 2 2 1 IMM 1 IMM 1 IMM rn 0 IMM 0 0 0 0 0 6th byte Instruction Format 5th byte 7 7 7 6 7 4 7 6 2 2 7th byte 1 IMM 1 IMM 1 IMM rn 0 IMM 0 0 0 0 0 8th byte 9th byte 10th byte Rev. 4.0, 03/03, page 1093 of 1358 BNOT BLD BIXOR BIST Instruction 8 0 0 0 0 3 1 IMM 0 erd 1 3 0 IMM 0 erd 1 3 0 IMM 0 erd A 5 C E A A 7 C E A A 1 D F A 6 7 7 7 6 6 7 7 7 6 6 7 7 7 6 B B B B B B B B B B B B B B B BIST #xx:3,@aa:32 BIXOR #xx:3,Rd BIXOR #xx:3,@ERd BIXOR #xx:3,@aa:8 BIXOR #xx:3,@aa:16 BIXOR #xx:3,@aa:32 BLD #xx:3,Rd BLD #xx:3,@ERd BLD #xx:3,@aa:8 BLD #xx:3,@aa:16 BLD #xx:3,@aa:32 BNOT #xx:3,Rd BNOT #xx:3,@ERd BNOT #xx:3,@aa:8 BNOT #xx:3,@aa:16 8 8 0 erd 1 3 D F A A 7 7 6 6 B B B B BNOT Rn,@ERd BNOT Rn,@aa:8 BNOT Rn,@aa:16 BNOT Rn,@aa:32 0 rd rn 1 6 B BNOT Rn,Rd abs 8 3 A 6 8 0 rd 0 rd 0 B abs abs abs rd BNOT #xx:3,@aa:32 1 8 1 A 6 B BIST #xx:3,@aa:16 0 F 7 B BIST #xx:3,@aa:8 abs 0 erd 7 B rd 1 IMM 7 D 6 B 2nd byte 1st byte BIST #xx:3,@ERd Size BIST #xx:3,Rd Mnemonic 1 IMM 7 1 IMM 5 7 0 IMM 7 7 0 IMM 1 7 rn rn 1 1 6 6 abs abs 0 IMM 1 7 abs 0 IMM 7 7 abs 1 IMM 5 7 abs 1 IMM 7 6 0 0 0 0 0 0 0 0 0 0 4th byte 6 3rd byte abs abs abs abs abs 6 7 7 7 6 1 1 7 5 7 rn 0 IMM 0 IMM 1 IMM 1 IMM 0 0 0 0 0 6th byte Instruction Format 5th byte 6 7 7 7 6 1 1 7 5 7 7th byte rn 0 IMM 0 IMM 1 IMM 1 IMM 0 0 0 0 0 8th byte 9th byte 10th byte Rev. 4.0, 03/03, page 1094 of 1358 BTST BST BSR BSET BOR Instruction 0 8 8 rd 8 8 8 8 0 0 rd 3 0 IMM 0 erd 1 3 rn 0 erd 1 3 0 0 IMM 0 erd 1 3 0 IMM 0 erd 1 3 rn 0 erd A 0 D F A A 0 D F A A 5 C 7 D F A A 3 C E A A 3 C 6 7 7 7 6 6 6 7 7 6 6 5 5 6 7 7 6 6 7 7 7 6 6 6 7 BSR d:8 BSR d:16 B B B B B B B B BTST #xx:3,Rd BTST #xx:3,@ERd BTST #xx:3,@aa:8 BTST #xx:3,@aa:16 BTST #xx:3,@aa:32 BTST Rn,Rd BTST Rn,@ERd B BSET Rn,@aa:32 BST #xx:3,@aa:32 B BSET Rn,@aa:16 B B BSET Rn,@aa:8 BST #xx:3,@aa:16 B BSET Rn,@ERd B B BSET Rn,Rd B B BSET #xx:3,@aa:32 BST #xx:3,@aa:8 B BSET #xx:3,@aa:16 BST #xx:3,@ERd B BSET #xx:3,@aa:8 B B BSET #xx:3,@ERd BST #xx:3,Rd B BSET #xx:3,Rd B BOR #xx:3,@aa:32 0 1 A 6 B BOR #xx:3,@aa:16 abs abs disp abs abs 0 0 rd 0 rd 0 0 0 rd 0 E abs 0 erd C 7 B BOR #xx:3,@aa:8 7 B BOR #xx:3,@ERd rd 0 IMM 4 7 B BOR #xx:3,Rd 2nd byte Size 1st byte Mnemonic 0 IMM 4 0 IMM 0 7 0 IMM 7 6 6 3 rn 0 IMM 3 7 abs 0 IMM 3 7 abs 0 IMM 7 6 0 0 0 0 0 0 rn 0 disp 0 rn 0 6 0 0 0 0 6 abs abs 0 IMM 0 7 abs 0 IMM 4 7 4th byte 7 3rd byte abs abs abs abs abs 7 6 6 7 7 3 7 0 0 4 0 IMM 0 IMM rn 0 IMM 0 IMM 0 0 0 0 0 6th byte Instruction Format 5th byte 7 6 6 7 7 3 7 0 0 4 7th byte 0 IMM 0 IMM rn 0 IMM 0 IMM 0 0 0 0 0 8th byte 9th byte 10th byte Rev. 4.0, 03/03, page 1095 of 1358 6 6 7 7 7 6 6 B B B B B B B BTST Rn,@aa:32 BXOR #xx:3,Rd BXOR #xx:3,@ERd BXOR #xx:3,@aa:8 BXOR #xx:3,@aa:16 BXOR #xx:3,@aa:32 5 5 B W DIVXU.B Rs,Rd DIVXU.W Rs,ERd 7 0 W DIVXS.W Rs,ERd 7 0 EEPMOV.W 1 L B DEC.L #2,ERd DIVXS.B Rs,Rd 1 L DEC.L #1,ERd EEPMOV EEPMOV.B DIVXU DIVXS 1 W DEC.W #2,Rd 1 W DEC.W #1,Rd 1 B 1 0 B B 1 L CMP.L ERs,ERd DEC.B Rd 7 L CMP.L #xx:32,ERd DEC 1 W CMP.W Rs,Rd DAS Rd 7 W CMP.W #xx:16,Rd DAA Rd 1 B CMP.B Rs,Rd DAS A B CMP.B #xx:8,Rd DAA CMP A A E C 5 A A E 0 rd 0 3 0 IMM 0 erd 0 0 1 3 abs 0 1 abs 2nd byte rd rd 0 erd rs 2 F F 8 8 9 9 5 5 C 4 5 D B B 1 rd 0 0 erd 0 D rs rs 3 5 0 erd F D rs rd 0 erd rs 1 5 rd rd 5 0 erd rd 0 IMM abs 7 rd 0 IMM 0 0 abs D rd 0 1 ers 0 erd rd 2 IMM rs 0 IMM 5 7 abs 0 IMM 5 7 rn 0 abs 3 6 4th byte 3rd byte 3 1 1 B B B B A F F F A D 9 C rd Cannot be used in the chip 7 B 1st byte BTST Rn,@aa:16 Size BTST Rn,@aa:8 Mnemonic CLRMAC CLRMAC BXOR BTST Instruction 7 6 5 3 0 IMM rn 0 0 6th byte Instruction Format 5th byte 7 6 5 3 7th byte 0 IMM rn 0 0 8th byte 9th byte 10th byte Rev. 4.0, 03/03, page 1096 of 1358 LDC JSR JMP INC EXTU EXTS Instruction abs IMM B D E F 5 5 5 5 JMP @@aa:8 JSR @ERn JSR @aa:24 JSR @@aa:8 0 ers 0 ers 0 ers 0 ers 0 ers 0 ers 0 ers 0 ers 0 0 9 9 F F 8 8 D D B B 6 6 6 6 7 7 6 6 6 6 rs 0 1 0 1 0 1 0 1 0 1 1 4 4 4 4 4 4 4 4 4 4 3 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 W W W W W W W W W LDC @ERs,EXR LDC @(d:16,ERs),CCR LDC @(d:16,ERs),EXR LDC @(d:32,ERs),CCR LDC @(d:32,ERs),EXR LDC @ERs+,CCR LDC @ERs+,EXR LDC @aa:16,CCR LDC @aa:16,EXR IMM 0 7 B 0 W 3 0 B LDC Rs,CCR B abs abs 0 B 0 0 0 6 0 disp 6 0 disp 0 2 2 0 0 6th byte Instruction Format 5th byte 0 0 0 4th byte LDC @ERs,CCR 0 1 0 B abs abs 3rd byte LDC Rs,EXR 1 rs 4 7 0 B LDC #xx:8,EXR 0 0 LDC #xx:8,CCR 0 ern abs A 5 JMP @aa:24 0 erd F 0 ern 9 L INC.L #2,ERd B 7 B 0 L INC.L #1,ERd 5 rd 0 erd D B 0 W INC.W #2,Rd 0 rd 5 B 0 JMP @ERn rd 0 A 0 B W 7 7 1 L EXTU.L ERd INC.W #1,Rd rd 0 erd 5 7 1 INC.B Rd 0 erd F 7 1 L W EXTS.L ERd EXTU.W Rd rd D 7 1 2nd byte 1st byte W Size EXTS.W Rd Mnemonic 7th byte 8th byte disp disp 9th byte 10th byte Rev. 4.0, 03/03, page 1097 of 1358 B B B W W W W W MOV.B Rs,@aa:8 MOV.B Rs,@aa :16 MOV.B Rs,@aa:32 MOV.W #xx:16,Rd MOV.W Rs,Rd MOV.W @ERs,Rd MOV.W @(d:16,ERs),Rd MOV.W @(d:32,ERs),Rd B MOV.B @aa:32,Rd B B MOV.B @aa:16,Rd MOV.B Rs,@-ERd B MOV.B @aa:8,Rd B B MOV.B @ERs+,Rd B B MOV.B @(d:32,ERs),Rd MOV.B Rs,@(d:32,ERd) B MOV.B @(d:16,ERs),Rd MOV.B Rs,@(d:16,ERd) B MOV.B @ERs,Rd B B MOV.B Rs,Rd MOV.B Rs,@ERd B MOV.B #xx:8,Rd MOV L MAC @ERn+,@ERm+ LDMAC ERs,MACL 7 6 6 0 7 6 6 3 6 7 6 6 6 6 2 6 7 6 6 0 F 0 ers 0 ers 8 C 0 erd 1 erd 8 C 0 ers 0 ers F 8 0 rd rd rd rs 0 ers rd 0 9 9 rs A A D rs 8 rs 0 rs rs A abs 1 erd E rs 1 erd rd 2 A 8 rd 0 rd 0 rd rd rd A abs 0 ers E rd 0 ers 8 IMM rs C rd Cannot be used in the chip 0 0 6 6 6 B A A disp disp IMM abs disp abs 2 A 2 rd rs rd abs abs 0 ern+3 L 7 D 6 0 3 LDMAC ERs,MACH 0 ern+2 7 D 6 0 2 1 L 1 L LDM.L @SP+, (ERn-ERn+3) 7 6 0 1 1 LDM.L @SP+, (ERn-ERn+2) 0 0 ern+1 2 B D 6 1 4 1 L 0 0 W LDC @aa:32,EXR LDM.L @SP+, (ERn-ERn+1) 0 2 B 6 0 4 1 4th byte 3rd byte 2nd byte 1st byte 0 Size W LDC @aa:32,CCR Mnemonic MAC LDMAC LDM LDC Instruction 6th byte Instruction Format 5th byte disp disp disp abs abs 7th byte 8th byte 9th byte 10th byte Rev. 4.0, 03/03, page 1098 of 1358 W W W W W W L L L L L L L L L L L L L L MOV.W Rs,@ERd MOV.W Rs,@(d:16,ERd) MOV.W Rs,@(d:32,ERd) MOV.W Rs,@-ERd MOV.W Rs,@aa:16 MOV.W Rs,@aa:32 MOV.L #xx:32,Rd MOV.L ERs,ERd MOV.L @ERs,ERd MOV.L @(d:16,ERs),ERd MOV.L @(d:32,ERs),ERd MOV.L @ERs+,ERd MOV.L @aa:16 ,ERd MOV.L @aa:32 ,ERd MOV.L ERs,@ERd MOV.L ERs,@(d:16,ERd) MOV.L ERs,@(d:32,ERd)*1 MOV.L ERs,@-ERd MOV.L ERs,@aa:16 MOV.L ERs,@aa:32 MULXU MULXS B W B W MULXS.B Rs,Rd MULXS.W Rs,ERd MULXU.B Rs,Rd MULXU.W Rs,ERd B W MOV.W @aa:32,Rd MOVTPE MOVTPE Rs,@aa:16 W MOV.W @aa:16,Rd B W Size MOV.W @ERs+,Rd Mnemonic MOVFPE MOVFPE @aa:16,Rd MOV Instruction 0 ers 0 erd 0 ers 0 erd 0 ers 0 ers 0 erd 0 2 1 erd 0 ers 1 erd 0 ers 9 F 8 D B B 9 F 6 6 7 6 6 6 6 6 rs 0 erd 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 B A F 1 1 1 1 1 1 1 1 7 0 0 0 0 0 0 0 0 0 8 A B B 6 6 0 0 0 0 1 1 0 0 rs rs 0 2 5 5 0 0 rd 0 erd C C rs rs 1 1 0 2 0 0 5 5 Cannot be used in the chip 1 erd 0 ers D 6 0 0 1 0 0 erd rd 0 ers 0 ers 0 erd 8 7 0 0 1 0 0 erd 0 erd 0 IMM 0 1 ers 0 erd abs abs rs 8 A B 6 rs 6 A rs 1 erd D 6 0 rs disp 0 erd 8 7 B 1 erd F 6 6 1 erd 9 6 abs rd 2 B 6 rs rd 0 B 6 abs rd 0 ers D 4th byte 6 3rd byte 2nd byte 1st byte 6 6 B B abs disp abs disp A 2 disp abs 0 ers abs 0 erd 6th byte Instruction Format 5th byte 7th byte 8th byte disp disp 9th byte 10th byte Rev. 4.0, 03/03, page 1099 of 1358 0 0 6 B B W ORC #xx:8,CCR ORC #xx:8,EXR POP.W Rn POP.L ERn ROTL PUSH POP ORC 1 1 1 1 1 B W W L L ROTL.B #2, Rd ROTL.W Rd ROTL.W #2, Rd ROTL.L ERd ROTL.L #2, ERd 1 B ROTL.B Rd 0 0 L OR.L ERs,ERd L 7 L OR.L #xx:32,ERd PUSH.L ERn 6 W OR.W Rs,Rd 6 7 W OR.W #xx:16,Rd 0 1 B OR.B Rs,Rd L C B OR.B #xx:8,Rd W 1 L NOT.L ERd PUSH.W Rn 1 W NOT.W Rd OR 1 0 B NOT.B Rd 1 L NEG.L ERd NOP 1 NOT 1 B W 2 2 2 2 2 2 1 D 1 D 1 4 1 A 4 9 4 rd 7 7 7 rd 0 erd 1 3 rd rd 0 erd 0 4 rs 4 F rd 0 erd 0 erd B F rd 9 D rd C 0 rd 0 8 0 rn 0 7 F 1 rn 4 IMM rd rs IMM 0 rd 0 0 0 rd 0 erd B 7 7 rd 8 2nd byte 9 7 1st byte NEG.W Rd Size NEG.B Rd Mnemonic NOP NEG Instruction 6 6 0 6 D D 4 4 3rd byte IMM F 7 0 ern 0 ern IMM 0 ers 0 erd IMM 4th byte 6th byte Instruction Format 5th byte 7th byte 8th byte 9th byte 10th byte Rev. 4.0, 03/03, page 1100 of 1358 rd rd rd 0 erd 0 erd C 9 D B F 0 0 0 0 0 1 1 1 1 1 B W W L L SHAL.B #2, Rd SHAL.W Rd SHAL.W #2, Rd SHAL.L ERd SHAL.L #2, ERd 0 rd 8 0 4 5 1 7 6 5 B 0 7 3 1 L ROTXR.L #2, ERd SHAL.B Rd 0 erd 3 3 1 L ROTXR.L ERd SHAL rd 0 erd 5 3 1 W ROTXR.W #2, Rd 7 rd 1 3 1 W ROTXR.W Rd RTS rd 4 3 1 B ROTXR.B #2, Rd RTS rd 0 RTE 0 erd 7 3 ROTXL.L #2, ERd 2 3 2 1 L ROTXL.L ERd 1 rd 0 erd 5 2 1 W ROTXL.W #2, Rd 1 rd 1 2 1 W ROTXL.W Rd L rd 4 2 1 B ROTXL.B #2, Rd B rd 0 2 ROTXR.B Rd 0 erd F 3 1 ROTR.L #2, ERd 1 B 3 1 L ROTR.L ERd L rd 0 erd D 3 1 W ROTR.W #2, Rd B rd 9 3 1 ROTR.W Rd ROTXL.B Rd rd C 3 1 B W ROTR.B #2, Rd rd 8 3 1 2nd byte 1st byte B Size ROTR.B Rd Mnemonic RTE ROTXR ROTXL ROTR Instruction 3rd byte 4th byte 6th byte Instruction Format 5th byte 7th byte 8th byte 9th byte 10th byte Rev. 4.0, 03/03, page 1101 of 1358 STC SLEEP SHLR SHLL SHAR Instruction 1 1 1 1 W W L L SHLR.W Rd SHLR.W #2, Rd SHLR.L ERd SHLR.L #2, ERd 0 0 0 0 0 0 0 0 0 B W W STC.W EXR,@ERd STC.W EXR,@(d:16,ERd) W STC.W CCR,@(d:32,ERd) W STC.W EXR,@(d:32,ERd) W W STC.W CCR,@ERd STC.W CCR,@(d:16,ERd) W W STC.B EXR,Rd STC.W CCR,@-ERd STC.W EXR,@-ERd 0 B STC.B CCR,Rd 0 1 B SHLR.B #2, Rd SLEEP 1 SHLL.L #2, ERd 1 1 L SHLL.L ERd L 1 W SHLL.W #2, Rd B 1 W SHLL.W Rd SHLR.B Rd 1 B SHLL.B #2, Rd SHAR.L #2, ERd 1 1 L SHAR.L ERd 1 1 W SHAR.W #2, Rd L 1 W SHAR.W Rd B 1 B SHLL.B Rd 1 B 6 7 7 6 6 1 0 1 0 1 4 4 4 4 4 1 1 1 1 1 1 6 8 1 0 7 1 4 0 3 1 1 0 erd 5 1 6 rd 0 erd 1 1 6 rd 4 1 1 rd 0 0 0 rd 7 0 4 0 erd 3 0 1 rd 0 erd 5 0 rd rd 1 0 4 rd 4 0 1 rd 0 1 1 0 erd F 1 2 rd 0 erd B 1 rd rd D 1 0 rd 9 1 D D 8 8 F F 9 9 3rd byte 2 rd 8 C 1 2nd byte 1st byte SHAR.B #2, Rd Size SHAR.B Rd Mnemonic 1 erd 1 erd 0 erd 0 erd 1 erd 1 erd 1 erd 1 erd 0 0 0 0 0 0 0 0 4th byte 6 6 B B disp disp A A 0 0 6th byte Instruction Format 5th byte 7th byte 8th byte disp disp 9th byte 10th byte Rev. 4.0, 03/03, page 1102 of 1358 D 1 7 6 7 0 B B W W L L XOR.W #xx:16,Rd XOR.W Rs,Rd XOR.L #xx:32,ERd XOR.L ERs,ERd 5 0 XOR.B Rs,Rd 1 XOR.B #xx:8,Rd B B SUBX #xx:8,Rd XOR 1 L SUBS #4,ERd TRAPA #x:2 1 L SUBS #2,ERd TRAPA 1 L SUBS #1,ERd B 1 L SUB.L ERs,ERd B 7 L SUB.L #xx:32,ERd TAS @ERd*2 1 W SUB.W Rs,Rd SUBX Rs,Rd 7 L STMAC MACL,ERd 1 Cannot be used in the chip L STMAC MACH,ERd W 0 L STM.L (ERn-ERn+3), @-SP SUB.W #xx:16,Rd 0 L STM.L (ERn-ERn+2), @-SP B 0 L STM.L(ERn-ERn+1), @-SP SUB.B Rs,Rd 0 W 1 A 5 9 5 rd 7 1 E rd B B B A A 9 9 8 1 1 1 1 0 erd rd rd rd 0 0 0 1 0 F 5 rs 5 rs rd rd rd 0 0 rd 0 0 erd IMM 00 IMM E 0 erd 0 erd 0 erd IMM rs 9 8 0 1 ers 0 erd 3 rs 3 rs 3 2 1 4 4 1 STC.W EXR,@aa:32 1 4 0 W 1 0 W 0 STC.W CCR,@aa:32 4 STC.W EXR,@aa:16 1 2nd byte 0 1st byte W Size STC.W CCR,@aa:16 Mnemonic TAS SUBX SUBS SUB STMAC STM STC Instruction 6 7 6 6 6 6 6 6 6 5 B D D D B B B B 3rd byte C IMM IMM 0 ern 0 ern 0 ern 0 0 0 0 0 ers 0 erd IMM 0 erd IMM F F F A A 8 8 4th byte abs abs 6th byte Instruction Format 5th byte abs abs 7th byte 8th byte 9th byte 10th byte Rev. 4.0, 03/03, page 1103 of 1358 B B XORC #xx:8,EXR Size XORC #xx:8,CCR Mnemonic 0 0 1 5 1st byte 4 IMM 1 2nd byte 0 5 3rd byte IMM 4th byte 6th byte Instruction Format 5th byte ER0 ER1 000 001 ER7 General Register Register Field Address Register 32-Bit Register 111 7th byte 8th byte 9th byte 10th byte R7 E0 E1 E7 1111 R0 R1 General Register 0111 1000 1001 0000 0001 Register Field 16-Bit Register 1111 0111 1000 1001 0000 0001 Register Field R7L R7H R0L R1L R0H R1H General Register 8-Bit Register Immediate data (2, 3, 8, 16, or 32 bits) Absolute address (8, 16, 24, or 32 bits) Displacement (8, 16, or 32 bits) Register field (4 bits specifying an 8-bit or 16-bit register. The symbols rs, rd, and rn correspond to operand symbols Rs, Rd,and Rn.) Register field (3 bits specifying an address register or 32-bit register. The symbols ers, erd, ern, and erm correspond to operand symbols ERs, ERd, ERn, and ERm.) The register fields specify general registers as follows. Legend IMM: abs: disp: rs, rd, rn: ers, erd, ern, erm: Notes: *1 Bit 7 of the 4th byte of the MOV.L ERs, @(d:32,ERd) instruction can be either 1 or 0. *2 Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction. XORC Instruction Rev. 4.0, 03/03, page 1104 of 1358 AL 2 BH 3 BL 2nd byte XOR BSR BCS AND RTE BNE BST TRAPA BEQ SUB ADD MOV OR XOR AND MOV C D E F CMP SUBX B BVS 9 Table A.3(2) MOV Table A.3(2) A Note: * Cannot be used in the chip. 8 BVC MOV.B Table A.3(2) LDC 7 BIST BXOR BAND BOR BLD BIXOR BIAND BIOR BILD OR RTS BCC AND ANDC 6 ADDX BTST DIVXU BLS XOR XORC 5 9 BCLR MULXU BHI OR ORC 4 B BMI Table A.3(2) Table A.3(2) Table A.3(2) Table A.3(2) EEPMOV JMP BPL Table A.3(2) Table A.3(2) A Instruction when most significant bit of BH is 1. Instruction when most significant bit of BH is 0. ADD BNOT DIVXU BRN LDC Table STC * * A.3(2) STMAC LDMAC Table Table Table A.3(2) A.3(2) A.3(2) 1 AH 1st byte 8 7 BSET MULXU 5 6 BRA 4 3 2 NOP Table A.3(2) 0 1 AL 0 AH Instruction code Table A-3 Operation Code Map (1) BSR BGE C CMP BLT JSR BGT SUBX ADDX E Table A.3(3) MOV MOV D F BLE Table A.3(2) Table A.3(2) A.3 Operation Code Map Table A-3 shows the operation code map. Rev. 4.0, 03/03, page 1105 of 1358 DAS BRA MOV MOV MOV 58 6A 79 7A ADD CMP CMP MOV ADD BHI BRN BCC ROTXR ROTXL SHLR SHLL STC 4 LDC SUB SUB OR OR Table * A.3(4) MOVFPE BLS NOT STM 3 BL 2nd byte BH Table A.3(4) 2 Note: * Cannot be used in the chip. SUBS 1F NOT 17 DEC ROTXR 13 1B ROTXL 12 1A SHLR 11 DAA 0F SHLL ADDS 0B 1 LDM AL 1st byte AH 10 INC 0A 0 MOV BH 01 AH AL Instruction code Table A-3 Operation Code Map (2) XOR XOR BCS DEC EXTU INC 5 AND AND BNE MAC* 6 BEQ DEC EXTU ROTXR ROTXL SHLR SHLL INC 7 MOV BVC 9 BVS SUBS NEG ROTR ROTL SHAR SHAL ADDS SLEEP 8 MOV BPL CLRMAC * A BMI NEG B C BGE MOVTPE* CMP SUB ROTR ROTL SHAR SHAL MOV ADD Table A.3(3) D BLT DEC EXTS INC Table A.3(3) BGT TAS E F BLE DEC EXTS ROTR ROTL SHAR SHAL INC Table A.3(3) Rev. 4.0, 03/03, page 1106 of 1358 *1 *1 CL *2 *2 BSET BSET BSET BSET MULXS 0 BNOT BNOT BNOT BNOT DIVXS 1 AL 1st byte AH BCLR BCLR BCLR BCLR MULXS 2 3 BTST BTST BTST BTST XOR 5 AND 6 DL 4th byte DH 7 BXOR BAND BLD BOR BIXOR BIAND BILD BIOR BST BIST BOR BXOR BAND BLD BIOR BIXOR BIAND BILD BST BIST OR 4 CL 3rd byte CH DIVXS BL 2nd byte BH Notes: *1 r is the register specification field. *2 aa is the absolute address specification. 7Faa7 *2 7Faa6 *2 7Eaa7 7Eaa6 7Dr07 *1 7Dr06 *1 7Cr07 7Cr06 01F06 01D05 01C05 AH AL BH BL CH Instruction code Table A-3 Operation Code Map (3) 8 9 A B C D E F Instruction when most significant bit of DH is 0. Instruction when most significant bit of DH is 1. Rev. 4.0, 03/03, page 1107 of 1358 BSET 0 AH BNOT 1 AL 1st byte BNOT 1 0 BSET AL AH 1st byte BCLR 2 BH 3 3 6 DL 7 EH EL 5th byte 5 DH 6 DL 4th byte 7 EH EL 5th byte BOR BXOR BAND BLD BIOR BIXOR BIAND BILD BST BIST 4 CL 3rd byte CH BTST BL 5 DH 4th byte BOR BXOR BAND BLD BIOR BIXOR BIAND BILD BST BIST 4 CL 3rd byte CH BTST BL 2nd byte BCLR 2 BH 2nd byte Note: * aa is the absolute address specification. 6A38aaaaaaaa7* 6A38aaaaaaaa6* 6A30aaaaaaaa7* 6A30aaaaaaaa6* AHALBHBL ... FHFLGH GL Instruction code 6A18aaaa7* 6A18aaaa6* 6A10aaaa7* 6A10aaaa6* AHALBHBLCHCLDHDLEH EL Instruction code Table A-3 Operation Code Map (4) 8 8 9 FL FH 9 FL 6th byte FH 6th byte A B HH HL 8th byte C D E F B C D E F Instruction when most significant bit of HH is 0. Instruction when most significant bit of HH is 1. GL 7th byte GH A Instruction when most significant bit of FH is 0. Instruction when most significant bit of FH is 1. A.4 Number of States Required for Instruction Execution The tables in this section can be used to calculate the number of states required for instruction execution by the CPU. Table A-5 indicates the number of instruction fetch, data read/write, and other cycles occurring in each instruction. Table A-4 indicates the number of states required for each cycle. The number of states required for execution of an instruction can be calculated from these two tables as follows: Execution states = I x SI + J x SJ + K x SK + L x SL + M x SM + N x SN Examples: Advanced mode, program code and stack located in external memory, on-chip supporting modules accessed in two states with 8-bit bus width, external devices accessed in three states with one wait state and 16-bit bus width. 1. BSET #0, @FFFFC7:8 From table A-5: I = L = 2, J = K = M = N = 0 From table A-4: SI = 4, SL = 2 Number of states required for execution = 2 x 4 + 2 x 2 = 12 2. JSR @@30 From table A-5: I = J = K = 2, L = M = N = 0 From table A-4: SI = SJ = SK = 4 Number of states required for execution = 2 x 4 + 2 x 4 + 2 x 4 = 24 Rev. 4.0, 03/03, page 1108 of 1358 Table A-4 Number of States per Cycle Access Conditions External Device On-Chip Supporting Module Cycle Instruction fetch SI 8-Bit Bus 16-Bit Bus On-Chip 8-Bit Memory Bus 16-Bit Bus 2-State 3-State 2-State 3-State Access Access Access Access 1 2 4 6 + 2m 4 2 3+m 1 1 Branch address read SJ Stack operation SK Byte data access SL 2 2 3+m Word data access SM 4 4 6 + 2m Internal operation SN 1 1 1 1 1 Legend m: Number of wait states inserted into external device access Rev. 4.0, 03/03, page 1109 of 1358 Table A-5 Number of Cycles in Instruction Execution Branch Instruction Address Fetch Read Byte Stack Data Operation Access Word Data Access Internal Operation K M N Instruction Mnemonic I ADD ADD.B #xx:8,Rd 1 ADDS ADDX AND ANDC BAND Bcc ADD.B Rs,Rd 1 ADD.W #xx:16,Rd 2 ADD.W Rs,Rd 1 ADD.L #xx:32,ERd 3 ADD.L ERs,ERd 1 ADDS #1/2/4,ERd 1 ADDX #xx:8,Rd 1 ADDX Rs,Rd 1 AND.B #xx:8,Rd 1 AND.B Rs,Rd 1 AND.W #xx:16,Rd 2 AND.W Rs,Rd 1 AND.L #xx:32,ERd 3 AND.L ERs,ERd 2 ANDC #xx:8,CCR 1 ANDC #xx:8,EXR 2 J L BAND #xx:3,Rd 1 BAND #xx:3,@ERd 2 1 BAND #xx:3,@aa:8 2 1 BAND #xx:3,@aa:16 3 1 BAND #xx:3,@aa:32 4 1 BRA d:8 (BT d:8) 2 BRN d:8 (BF d:8) 2 BHI d:8 2 BLS d:8 2 BCC d:8 (BHS d:8) 2 BCS d:8 (BLO d:8) 2 BNE d:8 2 BEQ d:8 2 BVC d:8 2 BVS d:8 2 BPL d:8 2 Rev. 4.0, 03/03, page 1110 of 1358 Branch Instruction Address Fetch Read Byte Stack Data Operation Access Word Data Access Internal Operation K M N Instruction Mnemonic I Bcc BMI d:8 2 BGE d:8 2 BCLR BLT d:8 2 BGT d:8 2 BLE d:8 2 BRA d:16 (BT d:16) 2 J L 1 BRN d:16 (BF d:16) 2 1 BHI d:16 2 1 BLS d:16 2 1 BCC d:16 (BHS d:16) 2 1 BCS d:16 (BLO d:16) 2 1 BNE d:16 2 1 BEQ d:16 2 1 BVC d:16 2 1 BVS d:16 2 1 BPL d:16 2 1 BMI d:16 2 1 BGE d:16 2 1 BLT d:16 2 1 BGT d:16 2 1 BLE d:16 2 1 BCLR #xx:3,Rd 1 BCLR #xx:3,@ERd 2 2 BCLR #xx:3,@aa:8 2 2 BCLR #xx:3,@aa:16 3 2 BCLR #xx:3,@aa:32 4 2 BCLR Rn,Rd 1 BCLR Rn,@ERd 2 2 BCLR Rn,@aa:8 2 2 BCLR Rn,@aa:16 3 2 BCLR Rn,@aa:32 4 2 Rev. 4.0, 03/03, page 1111 of 1358 Branch Instruction Address Fetch Read Byte Stack Data Operation Access Word Data Access Internal Operation K M N Instruction Mnemonic I BIAND BIAND #xx:3,Rd 1 BILD BIOR BIST BIXOR BLD J L BIAND #xx:3,@ERd 2 1 BIAND #xx:3,@aa:8 2 1 BIAND #xx:3,@aa:16 3 1 BIAND #xx:3,@aa:32 4 1 BILD #xx:3,Rd 1 BILD #xx:3,@ERd 2 1 BILD #xx:3,@aa:8 2 1 BILD #xx:3,@aa:16 3 1 BILD #xx:3,@aa:32 4 1 BIOR #xx:8,Rd 1 BIOR #xx:8,@ERd 2 1 BIOR #xx:8,@aa:8 2 1 BIOR #xx:8,@aa:16 3 1 1 BIOR #xx:8,@aa:32 4 BIST #xx:3,Rd 1 BIST #xx:3,@ERd 2 2 BIST #xx:3,@aa:8 2 2 BIST #xx:3,@aa:16 3 2 BIST #xx:3,@aa:32 4 2 BIXOR #xx:3,Rd 1 BIXOR #xx:3,@ERd 2 1 BIXOR #xx:3,@aa:8 2 1 BIXOR #xx:3,@aa:16 3 1 BIXOR #xx:3,@aa:32 4 1 BLD #xx:3,Rd 1 BLD #xx:3,@ERd 2 1 BLD #xx:3,@aa:8 2 1 BLD #xx:3,@aa:16 3 1 BLD #xx:3,@aa:32 4 1 Rev. 4.0, 03/03, page 1112 of 1358 Branch Instruction Address Fetch Read Byte Stack Data Operation Access Word Data Access Internal Operation K M N Instruction Mnemonic I BNOT BNOT #xx:3,Rd 1 BOR BSET J L BNOT #xx:3,@ERd 2 2 BNOT #xx:3,@aa:8 2 2 BNOT #xx:3,@aa:16 3 2 BNOT #xx:3,@aa:32 4 2 BNOT Rn,Rd 1 BNOT Rn,@ERd 2 2 BNOT Rn,@aa:8 2 2 BNOT Rn,@aa:16 3 2 BNOT Rn,@aa:32 4 2 BOR #xx:3,Rd 1 BOR #xx:3,@ERd 2 1 BOR #xx:3,@aa:8 2 1 BOR #xx:3,@aa:16 3 1 1 BOR #xx:3,@aa:32 4 BSET #xx:3,Rd 1 BSET #xx:3,@ERd 2 2 BSET #xx:3,@aa:8 2 2 BSET #xx:3,@aa:16 3 2 BSET #xx:3,@aa:32 4 2 BSET Rn,Rd 1 BSET Rn,@ERd 2 2 BSET Rn,@aa:8 2 2 BSET Rn,@aa:16 3 2 BSET Rn,@aa:32 4 BSR BSR d:8 Advanced 2 2 2 BSR d:16 Advanced 2 2 BST BST #xx:3,Rd 1 1 BST #xx:3,@ERd 2 2 BST #xx:3,@aa:8 2 2 BST #xx:3,@aa:16 3 2 BST #xx:3,@aa:32 4 2 Rev. 4.0, 03/03, page 1113 of 1358 Branch Instruction Address Fetch Read Byte Stack Data Operation Access Word Data Access Internal Operation K M N Instruction Mnemonic I BTST BTST #xx:3,Rd 1 BXOR J BTST #xx:3,@ERd 2 1 BTST #xx:3,@aa:8 2 1 BTST #xx:3,@aa:16 3 1 BTST #xx:3,@aa:32 4 1 BTST Rn,Rd 1 BTST Rn,@ERd 2 1 BTST Rn,@aa:8 2 1 BTST Rn,@aa:16 3 1 BTST Rn,@aa:32 4 1 BXOR #xx:3,Rd 1 BXOR #xx:3,@ERd 2 2 1 BXOR #xx:3,@aa:16 3 1 1 BXOR #xx:3,@aa:32 4 CLRMAC Cannot be used in the chip CMP CMP.B #xx:8,Rd 1 CMP.B Rs,Rd 1 CMP.W #xx:16,Rd 2 CMP.W Rs,Rd 1 CMP.L #xx:32,ERd 3 CMP.L ERs,ERd 1 DAA DAA Rd 1 DAS DAS Rd 1 DEC DEC.B Rd 1 DEC.W #1/2,Rd 1 DEC.L #1/2,ERd 1 DIVXU 1 BXOR #xx:3,@aa:8 CLRMAC DIVXS L DIVXS.B Rs,Rd 2 11 DIVXS.W Rs,ERd 2 19 DIVXU.B Rs,Rd 1 11 DIVXU.W Rs,ERd 1 19 Rev. 4.0, 03/03, page 1114 of 1358 Instruction EEPMOV Mnemonic Branch Instruction Address Fetch Read Byte Stack Data Operation Access Word Data Access Internal Operation I K M N J L *2 EEPMOV.B 2 2n+2 EEPMOV.W 2 2n+2* EXTS EXTS.W Rd 1 EXTS.L ERd 1 EXTU EXTU.W Rd 1 EXTU.L ERd 1 INC.B Rd 1 INC JMP JSR LDC INC.W #1/2,Rd 1 INC.L #1/2,ERd 1 JMP @ERn 2 JMP @aa:24 2 JMP @@aa:8 Advanced 2 JSR @ERn Advanced 2 JSR @aa:24 Advanced 2 JSR @@aa:8 Advanced 2 2 1 2 1 2 2 2 1 2 LDC #xx:8,CCR 1 LDC #xx:8,EXR 2 LDC Rs,CCR 1 LDC Rs,EXR 1 LDC @ERs,CCR 2 1 LDC @ERs,EXR 2 1 LDC @(d:16,ERs),CCR 3 1 LDC @(d:16,ERs),EXR 3 1 LDC @(d:32,ERs),CCR 5 1 LDC @(d:32,ERs),EXR 5 1 LDC @ERs+,CCR 2 1 1 LDC @ERs+,EXR 2 1 1 LDC @aa:16,CCR 3 1 LDC @aa:16,EXR 3 1 LDC @aa:32,CCR 4 1 LDC @aa:32,EXR 4 1 Rev. 4.0, 03/03, page 1115 of 1358 Branch Instruction Address Fetch Read Byte Stack Data Operation Access Word Data Access Internal Operation K M N Instruction Mnemonic I J L LDM LDM.L @SP+, (ERn-ERn+1) 2 4 1 LDM.L @SP+, (ERn-ERn+2) 2 6 1 LDM.L @SP+, (ERn-ERn+3) 2 8 1 LDMAC LDMAC ERs,MACH Cannot be used in the chip MAC MAC @ERn+,@ERm+ Cannot be used in the chip MOV.B #xx:8,Rd 1 MOV.B Rs,Rd 1 LDMAC ERs,MACL MOV MOV.B @ERs,Rd 1 1 MOV.B @(d:16,ERs),Rd 2 1 MOV.B @(d:32,ERs),Rd 4 1 MOV.B @ERs+,Rd 1 1 MOV.B @aa:8,Rd 1 1 MOV.B @aa:16,Rd 2 1 MOV.B @aa:32,Rd 3 1 MOV.B Rs,@ERd 1 1 MOV.B Rs,@(d:16,ERd) 2 1 MOV.B Rs,@(d:32,ERd) 4 1 MOV.B Rs,@-ERd 1 1 MOV.B Rs,@aa:8 1 1 MOV.B Rs,@aa:16 2 1 MOV.B Rs,@aa:32 3 1 MOV.W #xx:16,Rd 2 1 1 MOV.W Rs,Rd 1 MOV.W @ERs,Rd 1 1 MOV.W @(d:16,ERs),Rd 2 1 MOV.W @(d:32,ERs),Rd 4 1 MOV.W @ERs+,Rd 1 1 MOV.W @aa:16,Rd 2 1 MOV.W @aa:32,Rd 3 1 MOV.W Rs,@ERd 1 1 Rev. 4.0, 03/03, page 1116 of 1358 1 Branch Instruction Address Fetch Read Byte Stack Data Operation Access Word Data Access Internal Operation K M N Instruction Mnemonic I MOV MOV.W Rs,@(d:16,ERd) 2 1 MOV.W Rs,@(d:32,ERd) 4 1 MOV.W Rs,@-ERd 1 1 MOV.W Rs,@aa:16 2 1 MOV.W Rs,@aa:32 3 1 MOV.L #xx:32,ERd 3 MOV.L ERs,ERd 1 MOV.L @ERs,ERd 2 2 MOV.L @(d:16,ERs),ERd 3 2 MOV.L @(d:32,ERs),ERd 5 2 MOVFPE J L MOV.L @ERs+,ERd 2 2 MOV.L @aa:16,ERd 3 2 MOV.L @aa:32,ERd 4 2 MOV.L ERs,@ERd 2 2 MOV.L ERs,@(d:16,ERd) 3 2 MOV.L ERs,@(d:32,ERd) 5 2 MOV.L ERs,@-ERd 2 2 MOV.L ERs,@aa:16 3 2 MOV.L ERs,@aa:32 4 2 MOVFPE @:aa:16,Rd Can not be used in the chip 1 1 1 MOVTPE MOVTPE Rs,@:aa:16 MULXS MULXS.B Rs,Rd 2 11 MULXS.W Rs,ERd 2 19 MULXU MULXU.B Rs,Rd 1 11 MULXU.W Rs,ERd 1 19 NEG.B Rd 1 NEG.W Rd 1 NEG.L ERd 1 NOP NOP 1 NOT NOT.B Rd 1 NOT.W Rd 1 NOT.L ERd 1 NEG Rev. 4.0, 03/03, page 1117 of 1358 Branch Instruction Address Fetch Read Byte Stack Data Operation Access Word Data Access Internal Operation K M N Instruction Mnemonic I OR OR.B #xx:8,Rd 1 ORC POP OR.B Rs,Rd 1 OR.W #xx:16,Rd 2 OR.W Rs,Rd 1 OR.L #xx:32,ERd 3 OR.L ERs,ERd 2 ORC #xx:8,CCR 1 ORC #xx:8,EXR 2 J L POP.W Rn 1 1 1 POP.L ERn 2 2 1 PUSH PUSH.W Rn 1 1 1 PUSH.L ERn 2 2 1 ROTL ROTL.B Rd 1 ROTL.B #2,Rd 1 ROTR ROTXL ROTL.W Rd 1 ROTL.W #2,Rd 1 ROTL.L ERd 1 ROTL.L #2,ERd 1 ROTR.B Rd 1 ROTR.B #2,Rd 1 ROTR.W Rd 1 ROTR.W #2,Rd 1 ROTR.L ERd 1 ROTR.L #2,ERd 1 ROTXL.B Rd 1 ROTXL.B #2,Rd 1 ROTXL.W Rd 1 ROTXL.W #2,Rd 1 ROTXL.L ERd 1 ROTXL.L #2,ERd 1 Rev. 4.0, 03/03, page 1118 of 1358 Branch Instruction Address Fetch Read Byte Stack Data Operation Access Word Data Access Internal Operation K M N Instruction Mnemonic I ROTXR ROTXR.B Rd 1 ROTXR.B #2,Rd 1 ROTXR.W Rd 1 ROTXR.W #2,Rd 1 J L ROTXR.L ERd 1 ROTXR.L #2,ERd 1 RTE RTE 2 2/3* 1 RTS RTS 2 2 1 SHAL SHAL.B Rd 1 SHAL.B #2,Rd 1 SHAL.W Rd 1 SHAL.W #2,Rd 1 SHAR SHLL SHLR SLEEP Advanced SHAL.L ERd 1 SHAL.L #2,ERd 1 SHAR.B Rd 1 SHAR.B #2,Rd 1 SHAR.W Rd 1 SHAR.W #2,Rd 1 SHAR.L ERd 1 SHAR.L #2,ERd 1 SHLL.B Rd 1 SHLL.B #2,Rd 1 SHLL.W Rd 1 SHLL.W #2,Rd 1 SHLL.L ERd 1 SHLL.L #2,ERd 1 SHLR.B Rd 1 SHLR.B #2,Rd 1 SHLR.W Rd 1 SHLR.W #2,Rd 1 SHLR.L ERd 1 SHLR.L #2,ERd 1 SLEEP 1 1 1 Rev. 4.0, 03/03, page 1119 of 1358 Branch Instruction Address Fetch Read Byte Stack Data Operation Access Word Data Access Internal Operation K M N Instruction Mnemonic I STC STC.B CCR,Rd 1 STM STMAC J L STC.B EXR,Rd 1 STC.W CCR,@ERd 2 1 STC.W EXR,@ERd 2 1 STC.W CCR,@(d:16,ERd) 3 1 STC.W EXR,@(d:16,ERd) 3 1 STC.W CCR,@(d:32,ERd) 5 1 STC.W EXR,@(d:32,ERd) 5 1 STC.W CCR,@-ERd 2 1 1 STC.W EXR,@-ERd 2 1 1 STC.W CCR,@aa:16 3 1 STC.W EXR,@aa:16 3 1 STC.W CCR,@aa:32 4 1 STC.W EXR,@aa:32 4 1 STM.L (ERn-ERn+1), @-SP 2 4 1 STM.L (ERn-ERn+2), @-SP 2 6 1 STM.L (ERn-ERn+3), @-SP 2 8 1 STMAC MACH,ERd Cannot be used in the chip STMAC MACL,ERd SUB SUBS SUBX SUB.B Rs,Rd 1 SUB.W #xx:16,Rd 2 SUB.W Rs,Rd 1 SUB.L #xx:32,ERd 3 SUB.L ERs,ERd 1 SUBS #1/2/4,ERd 1 SUBX #xx:8,Rd 1 SUBX Rs,Rd 1 3 TAS TAS @ERd* 2 TRAPA TRAPA #x:2 Advanced 2 Rev. 4.0, 03/03, page 1120 of 1358 2 2 1 2/3* 2 Branch Instruction Address Fetch Read Byte Stack Data Operation Access Word Data Access Internal Operation K M N Instruction Mnemonic I XOR XOR.B #xx:8,Rd 1 XORC XOR.B Rs,Rd 1 XOR.W #xx:16,Rd 2 XOR.W Rs,Rd 1 XOR.L #xx:32,ERd 3 XOR.L ERs,ERd 2 XORC #xx:8,CCR 1 XORC #xx:8,EXR 2 J L Notes: *1 2 when EXR is invalid, 3 when EXR is valid. *2 When n bytes of data are transferred. *3 Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction. Rev. 4.0, 03/03, page 1121 of 1358 A.5 Bus States during Instruction Execution Table A-6 indicates the types of cycles that occur during instruction execution by the CPU. See table A-4 for the number of states per cycle. How to Read the Table: Order of execution Instruction JMP@aa:24 1 R:W 2nd 2 Internal operation, 1 state 3 4 5 6 7 R:W EA End of instruction Read effective address (word-size read) No read or write Read 2nd word of current instruction (word-size read) Legend R:B Byte-size read R:W Word-size read W:B Byte-size write W:W Word-size write :M Transfer of the bus is not performed immediately after this cycle 2nd Address of 2nd word (3rd and 4th bytes) 3rd Address of 3rd word (5th and 6th bytes) 4th Address of 4th word (7th and 8th bytes) 5th Address of 5th word (9th and 10th bytes) NEXT Address of next instruction EA Effective address VEC Vector address Rev. 4.0, 03/03, page 1122 of 1358 8 Figure A-1 shows timing waveforms for the address bus and the RD, HWR, and LWR signals during execution of the above instruction with an 8-bit bus, using three-state access with no wait states. f Address bus RD HWR, LWR High R:W 2nd Fetching 3rd byte of instruction Fetching 4th byte of instruction Internal operation R:W EA Fetching 1st byte of instruction at jump address Fetching 2nd byte of instruction at jump address Figure A-1 Address Bus, RD, RD HWR, HWR and LWR Timing (8-Bit Bus, Three-State Access, No Wait States) Rev. 4.0, 03/03, page 1123 of 1358 Rev. 4.0, 03/03, page 1124 of 1358 Instruction ADD.B #xx:8,Rd ADD.B Rs,Rd ADD.W #xx:16,Rd ADD.W Rs,Rd ADD.L #xx:32,ERd ADD.L ERs,ERd ADDS #1/2/4,ERd ADDX #xx:8,Rd ADDX Rs,Rd AND.B #xx:8,Rd AND.B Rs,Rd AND.W #xx:16,Rd AND.W Rs,Rd AND.L #xx:32,ERd AND.L ERs,ERd ANDC #xx:8,CCR ANDC #xx:8,EXR BAND #xx:3,Rd BAND #xx:3,@ERd BAND #xx:3,@aa:8 BAND #xx:3,@aa:16 BAND #xx:3,@aa:32 BRA d:8 (BT d:8) BRN d:8 (BF d:8) BHI d:8 BLS d:8 BCC d:8 (BHS d:8) BCS d:8 (BLO d:8) BNE d:8 BEQ d:8 BVC d:8 BVS d:8 BPL d:8 BMI d:8 BGE d:8 BLT d:8 BGT d:8 1 R:W NEXT R:W NEXT R:W 2nd R:W NEXT R:W 2nd R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W 2nd R:W NEXT R:W 2nd R:W 2nd R:W NEXT R:W 2nd R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:B EA R:B EA R:W 3rd R:W 3rd R:W EA R:W EA R:W EA R:W EA R:W EA R:W EA R:W EA R:W EA R:W EA R:W EA R:W EA R:W EA R:W EA R:W EA R:W EA R:W NEXT R:W 3rd R:W NEXT R:W NEXT R:W 3rd R:W NEXT 2 Table A-6 Instruction Execution Cycles 4 5 R:W:M NEXT R:W:M NEXT R:B EA R:W:M NEXT R:W 4th R:B EA R:W:M NEXT R:W NEXT R:W NEXT 3 6 7 8 9 Rev. 4.0, 03/03, page 1125 of 1358 R:W 2nd R:W 2nd BPL d:16 BMI d:16 R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:W 2nd BVS d:16 BCLR #xx:3,Rd BCLR #xx:3,@ERd BCLR #xx:3,@aa:8 BCLR #xx:3,@aa:16 R:W 2nd BVC d:16 R:W 2nd R:W 2nd BEQ d:16 BLE d:16 R:W 2nd BNE d:16 R:W 2nd R:W 2nd BCS d:16 (BLO d:16) BGT d:16 R:W 2nd BCC d:16 (BHS d:16) R:W 2nd R:W 2nd BLS d:16 BLT d:16 R:W 2nd BHI d:16 R:W 2nd R:W 2nd BRN d:16 (BF d:16) BGE d:16 1 R:W NEXT R:W 2nd Instruction BLE d:8 BRA d:16 (BT d:16) R:B:M EA R:B:M EA R:W 3rd 2 R:W EA Internal operation, 1 state Internal operation, 1 state Internal operation, 1 state Internal operation, 1 state Internal operation, 1 state Internal operation, 1 state Internal operation, 1 state Internal operation, 1 state Internal operation, 1 state Internal operation, 1 state Internal operation, 1 state Internal operation, 1 state Internal operation, 1 state Internal operation, 1 state Internal operation, 1 state Internal operation, 1 state 4 5 R:W:M NEXT W:B EA R:W:M NEXT W:B EA R:B:M EA R:W:M NEXT W:B EA R:W EA R:W EA R:W EA R:W EA R:W EA R:W EA R:W EA R:W EA R:W EA R:W EA R:W EA R:W EA R:W EA R:W EA R:W EA R:W EA 3 6 7 8 9 Rev. 4.0, 03/03, page 1126 of 1358 Instruction BCLR #xx:3,@aa:32 BCLR Rn,Rd BCLR Rn,@ERd BCLR Rn,@aa:8 BCLR Rn,@aa:16 BCLR Rn,@aa:32 BIAND #xx:3,Rd BIAND #xx:3,@ERd BIAND #xx:3,@aa:8 BIAND #xx:3,@aa:16 BIAND #xx:3,@aa:32 BILD #xx:3,Rd BILD #xx:3,@ERd BILD #xx:3,@aa:8 BILD #xx:3,@aa:16 BILD #xx:3,@aa:32 BIOR #xx:3,Rd BIOR #xx:3,@ERd BIOR #xx:3,@aa:8 BIOR #xx:3,@aa:16 BIOR #xx:3,@aa:32 BIST #xx:3,Rd BIST #xx:3,@ERd BIST #xx:3,@aa:8 BIST #xx:3,@aa:16 BIST #xx:3,@aa:32 BIXOR #xx:3,Rd BIXOR #xx:3,@ERd BIXOR #xx:3,@aa:8 BIXOR #xx:3,@aa:16 BIXOR #xx:3,@aa:32 BLD #xx:3,Rd BLD #xx:3,@ERd BLD #xx:3,@aa:8 BLD #xx:3,@aa:16 BLD #xx:3,@aa:32 BNOT #xx:3,Rd 1 R:W 2nd R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W NEXT R:W:M NEXT R:W:M NEXT R:B EA R:W:M NEXT R:W 4th R:B EA R:W:M NEXT R:W:M NEXT R:W:M NEXT R:B EA R:W:M NEXT R:W 4th R:B EA R:W:M NEXT R:W:M NEXT R:W:M NEXT R:B EA R:W:M NEXT R:W 4th R:B EA R:W:M NEXT R:W:M NEXT R:W:M NEXT R:B:M EA R:W 4th R:W:M NEXT R:W:M NEXT R:B EA R:W:M NEXT R:W 4th R:B EA R:W:M NEXT R:W:M NEXT R:W:M NEXT R:B EA R:W:M NEXT R:W 4th R:B EA R:W:M NEXT R:B EA R:B EA R:W 3rd R:W 3rd R:B EA R:B EA R:W 3rd R:W 3rd R:B EA R:B EA R:W 3rd R:W 3rd R:B:M EA R:B:M EA R:W 3rd R:W 3rd R:B EA R:B EA R:W 3rd R:W 3rd R:B EA R:B EA R:W 3rd R:W 3rd W:B EA W:B EA R:W:M NEXT W:B EA R:B:M EA R:W:M NEXT W:B EA W:B EA W:B EA R:W:M NEXT W:B EA R:B:M EA R:W:M NEXT W:B EA R:W:M NEXT R:W:M NEXT R:B:M EA R:W 4th 5 6 R:W:M NEXT W:B EA R:B:M EA R:B:M EA R:W 3rd R:W 3rd 4 R:B:M EA 3 R:W 4th 2 R:W 3rd 7 8 9 Rev. 4.0, 03/03, page 1127 of 1358 1 R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W NEXT R:W 2nd R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W NEXT R:W 2nd Instruction BNOT #xx:3,@ERd BNOT #xx:3,@aa:8 BNOT #xx:3,@aa:16 BNOT #xx:3,@aa:32 BNOT Rn,Rd BNOT Rn,@ERd BNOT Rn,@aa:8 BNOT Rn,@aa:16 BNOT Rn,@aa:32 BOR #xx:3,Rd BOR #xx:3,@ERd BOR #xx:3,@aa:8 BOR #xx:3,@aa:16 BOR #xx:3,@aa:32 BSET #xx:3,Rd BSET #xx:3,@ERd BSET #xx:3,@aa:8 BSET #xx:3,@aa:16 BSET #xx:3,@aa:32 BSET Rn,Rd BSET Rn,@ERd BSET Rn,@aa:8 BSET Rn,@aa:16 BSET Rn,@aa:32 Advanced BSR d:8 Advanced BSR d:16 BST #xx:3,Rd BST #xx:3,@ERd BST #xx:3,@aa:8 BST #xx:3,@aa:16 BST #xx:3,@aa:32 BTST #xx:3,Rd BTST #xx:3,@ERd R:W:M NEXT R:B EA R:W:M NEXT R:W:M NEXT R:B:M EA R:W 4th W:W:M stack (H) R:W EA R:B:M EA R:B:M EA R:W 3rd R:W 3rd R:W EA Internal operation, 1 state R:W:M NEXT R:W:M NEXT R:B:M EA R:W 4th R:W:M NEXT R:W:M NEXT R:B:M EA R:W 4th R:B:M EA R:B:M EA R:W 3rd R:W 3rd R:B:M EA R:B:M EA R:W 3rd R:W 3rd R:W:M NEXT R:W:M NEXT R:B EA R:W:M NEXT R:W 4th R:B EA R:W:M NEXT R:B EA R:B EA R:W 3rd R:W 3rd W:B EA W:B EA R:W:M NEXT W:B EA R:B:M EA R:W:M NEXT W:B EA W:B EA W:B EA R:W:M NEXT W:B EA R:B:M EA R:W:M NEXT W:B EA W:W stack (L) W:W:M stack (H) W:W stack (L) W:B EA W:B EA R:W:M NEXT W:B EA R:B:M EA R:W:M NEXT W:B EA W:B EA W:B EA R:W:M NEXT W:B EA R:B:M EA R:W:M NEXT W:B EA R:W:M NEXT R:W:M NEXT R:B:M EA R:W 4th R:B:M EA R:B:M EA R:W 3rd R:W 3rd 4 5 6 W:B EA W:B EA R:W:M NEXT W:B EA R:B:M EA R:W:M NEXT W:B EA 3 R:W:M NEXT R:W:M NEXT R:B:M EA R:W 4th 2 R:B:M EA R:B:M EA R:W 3rd R:W 3rd 7 8 9 Rev. 4.0, 03/03, page 1128 of 1358 R:W NEXT R:W NEXT R:W 2nd R:W NEXT R:W 2nd R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W 2nd R:W 2nd R:W NEXT R:W NEXT R:W 2nd R:W 2nd R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT CMP.B #xx:8,Rd CMP.B Rs,Rd CMP.W #xx:16,Rd CMP.W Rs,Rd CMP.L #xx:32,ERd CMP.L ERs,ERd DAA Rd DAS Rd DEC.B Rd DEC.W #1/2,Rd DEC.L #1/2,ERd DIVXS.B Rs,Rd DIVXS.W Rs,ERd DIVXU.B Rs,Rd DIVXU.W Rs,ERd EEPMOV.B EEPMOV.W EXTS.W Rd EXTS.L ERd EXTU.W Rd EXTU.L ERd INC.B Rd R:W NEXT (R) R:W:M NEXT R:W:M NEXT R:B EA R:W:M NEXT R:W 4th R:B EA R:W:M NEXT R:W:M NEXT R:W:M NEXT R:B EA R:W:M NEXT R:W 4th R:B EA R:W:M NEXT 3 4 5 R:W:M NEXT R:B EA R:W:M NEXT R:W 4th R:B EA R:W:M NEXT R:W NEXT Internal operation, 11 states R:W NEXT Internal operation, 19 states Internal operation, 11 states Internal operation, 19 states R:B EAd*1 R:B EAs*2 W:B EAd*2 R:B EAs*1 R:B EAd*1 R:B EAs*2 W:B EAd*2 R:B EAs*1 Repeated n times*2 R:W 3rd R:W NEXT 1 2 R:W 2nd R:B EA R:W 2nd R:W 3rd R:W 2nd R:W 3rd R:W NEXT R:W 2nd R:B EA R:W 2nd R:B EA R:W 2nd R:W 3rd R:W 2nd R:W 3rd R:W NEXT R:W 2nd R:B EA R:W 2nd R:B EA R:W 2nd R:W 3rd R:W 2nd R:W 3rd Cannot be used in the chip Instruction BTST #xx:3,@aa:8 BTST #xx:3,@aa:16 BTST #xx:3,@aa:32 BTST Rn,Rd BTST Rn,@ERd BTST Rn,@aa:8 BTST Rn,@aa:16 BTST Rn,@aa:32 BXOR #xx:3,Rd BXOR #xx:3,@ERd BXOR #xx:3,@aa:8 BXOR #xx:3,@aa:16 BXOR #xx:3,@aa:32 CLRMAC R:W NEXT R:W NEXT 6 7 8 9 Rev. 4.0, 03/03, page 1129 of 1358 1 R:W NEXT R:W NEXT R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W 2nd LDC @ERs+,EXR LDC @aa:16,CCR LDC @aa:16,EXR LDC @aa:32,CCR LDC @aa:32,EXR LDM.L @SP+, (ERn ERn+1) R:W NEXT R:W NEXT R:W 2nd R:W NEXT R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W 2nd Advanced R:W NEXT Advanced R:W 2nd JSR @@aa:8 Advanced LDC #xx:8,CCR LDC #xx:8,EXR LDC Rs,CCR LDC Rs,EXR LDC @ERs,CCR LDC @ERs,EXR LDC @(d:16,ERs),CCR LDC @(d:16,ERs),EXR LDC @(d:32,ERs),CCR LDC @(d:32,ERs),EXR LDC @ERs+,CCR JSR @ERn JSR @aa:24 JMP @@aa:8 Advanced R:W NEXT Instruction INC.W #1/2,Rd INC.L #1/2,ERd JMP @ERn JMP @aa:24 3 4 5 R:W EA R:W EA R:W NEXT R:W NEXT R:W 4th R:W 4th Internal operation, 1 state R:W NEXT Internal operation, 1 state R:W 3rd R:W NEXT R:W 3rd R:W NEXT R:W 3rd R:W 4th R:W 3rd R:W 4th R:W:M NEXT Internal operation, 1 state R:W NEXT R:W NEXT R:W 3rd R:W 3rd R:W 3rd R:W 3rd R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W EA R:W EA R:W NEXT R:W EA R:W NEXT R:W EA R:W:M stack (H)*3 R:W stack (L)*3 R:W EA R:W EA R:W EA R:W 5th R:W 5th R:W EA Internal operation, R:W EA 1 state R:W EA W:W:M stack (H) W:W stack (L) Internal operation, R:W EA W:W:M stack (H) W:W stack (L) 1 state R:W:M aa:8 R:W aa:8 W:W:M stack (H) W:W stack (L) R:W EA Internal operation, R:W EA 1 state R:W:M aa:8 R:W aa:8 2 R:W EA R:W EA R:W EA 6 7 8 9 Rev. 4.0, 03/03, page 1130 of 1358 R:W NEXT R:W NEXT R:W NEXT R:W 2nd R:W 2nd R:W NEXT R:W NEXT R:W 2nd R:W 2nd R:W NEXT R:W 2nd R:W 2nd R:W NEXT R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:W NEXT R:W NEXT R:W 2nd R:W 2nd R:W NEXT R:W 2nd R:W 2nd R:W NEXT MAC @ERn+,@ERm+ MOV.B #xx:8,Rd MOV.B Rs,Rd MOV.B @ERs,Rd MOV.B @(d:16,ERs),Rd MOV.B @(d:32,ERs),Rd MOV.B @ERs+,Rd MOV.B @aa:8,Rd MOV.B @aa:16,Rd MOV.B @aa:32,Rd MOV.B Rs,@ERd MOV.B Rs,@(d:16,ERd) MOV.B Rs,@(d:32,ERd) MOV.B Rs,@ ERd MOV.B Rs,@aa:8 MOV.B Rs,@aa:16 MOV.B Rs,@aa:32 MOV.W #xx:16,Rd MOV.W Rs,Rd MOV.W @ERs,Rd MOV.W @(d:16,ERs),Rd MOV.W @(d:32,ERs),Rd MOV.W @ERs+, Rd MOV.W @aa:16,Rd MOV.W @aa:32,Rd MOV.W Rs,@ERd LDMAC ERs,MACL Cannot be used in the chip LDMAC ERs,MACH R:W EA R:W NEXT R:W 3rd Internal operation, 1 state R:W NEXT R:W 3rd W:W EA R:B EA R:W NEXT R:W 3rd Internal operation, 1 state R:B EA R:W NEXT R:W 3rd W:B EA R:W NEXT R:W 3rd Internal operation, 1 state W:B EA R:W NEXT R:W 3rd R:W NEXT R:W NEXT R:W 2nd LDM.L @SP+,(ERn ERn+3) 2 R:W NEXT 1 R:W 2nd Instruction LDM.L @SP+,(ERn ERn+2) R:W EA R:W NEXT R:W EA R:W 4th R:W EA W:B EA R:W NEXT W:B EA R:W 4th W:B EA R:B EA R:W NEXT R:B EA R:W 4th R:B EA R:B EA R:W NEXT W:B EA R:W NEXT R:B EA R:W NEXT R:W EA W:B EA R:B EA 3 4 5 Internal operation, R:W:M stack (H)*3 R:W stack (L)*3 1 state Internal operation, R:W:M stack (H)*3 R:W stack (L)*3 1 state 6 7 8 9 Rev. 4.0, 03/03, page 1131 of 1358 MOV.L ERs,@aa:16 MOV.L ERs,@aa:32 MOVFPE @aa:16,Rd MOVTPE Rs,@aa:16 MULXS.B Rs,Rd MULXS.W Rs,ERd MULXU.B Rs,Rd MULXU.W Rs,ERd NEG.B Rd NEG.W Rd NEG.L ERd NOP NOT.B Rd NOT.W Rd NOT.L ERd OR.B #xx:8,Rd OR.B Rs,Rd MOV.L @aa:16,ERd MOV.L @aa:32,ERd MOV.L ERs,@ERd MOV.L ERs,@(d:16,ERd) MOV.L ERs,@(d:32,ERd) MOV.L ERs,@ ERd R:W 2nd R:W 2nd R:W 2nd R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:W 2nd MOV.W Rs,@aa:16 MOV.W Rs,@aa:32 MOV.L #xx:32,ERd MOV.L ERs,ERd MOV.L @ERs,ERd MOV.L @(d:16,ERs),ERd MOV.L @(d:32,ERs),ERd MOV.L @ERs+,ERd R:W 2nd R:W 2nd R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT W:W EA R:W NEXT R:W NEXT 3 W:W EA R:E 4th W:W EA W:W:M EA R:W NEXT R:W:M EA R:W NEXT W:W EA+2 W:W:M EA R:W 5th W:W:M EA R:W EA+2 R:W:M EA R:W 5th R:W:M EA W:W EA R:W NEXT 4 R:W NEXT Internal operation, 11 states R:W NEXT Internal operation, 19 states Internal operation, 11 states Internal operation, 19 states R:W:M NEXT R:W:M 3rd R:W:M 3rd R:W:M NEXT 2 R:W NEXT R:W 3rd Internal operation, 1 state R:W NEXT R:W 3rd R:W 3rd R:W:M EA R:W NEXT R:W:M 4th Internal operation, 1 state R:W 2nd R:W:M 3rd R:W NEXT R:W 2nd R:W:M 3rd R:W 4th R:W 2nd R:W:M NEXT W:W:M EA R:W 2nd R:W:M 3rd R:W NEXT R:W 2nd R:W:M 3rd R:W:M 4th R:W 2nd R:W:M NEXT Internal operation, 1 state R:W 2nd R:W:M 3rd R:W NEXT R:W 2nd R:W:M 3rd R:W 4th Cannot be used in the chip 1 R:W 2nd R:W 2nd R:W NEXT Instruction MOV.W Rs,@(d:16,ERd) MOV.W Rs,@(d:32,ERd) MOV.W Rs,@ ERd W:W EA+2 W:W:M EA W:W EA+2 R:W NEXT W:W EA+2 R:W EA+2 R:W:M EA R:W EA+2 R:W NEXT R:W EA+2 W:W EA 5 W:W EA+2 W:W:M EA R:W EA+2 R:W:M EA 6 W:W EA+2 R:W EA+2 7 8 9 Rev. 4.0, 03/03, page 1132 of 1358 1 R:W 2nd R:W NEXT R:W 2nd R:W 2nd R:W NEXT R:W 2nd R:W NEXT R:W 2nd R:W NEXT R:W 2nd R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT Instruction OR.W #xx:16,Rd OR.W Rs,Rd OR.L #xx:32,ERd OR.L ERs,ERd ORC #xx:8,CCR ORC #xx:8,EXR POP.W Rn POP.L ERn PUSH.W Rn PUSH.L ERn ROTL.B Rd ROTL.B #2,Rd ROTL.W Rd ROTL.W #2,Rd ROTL.L ERd ROTL.L #2,ERd ROTR.B Rd ROTR.B #2,Rd ROTR.W Rd ROTR.W #2,Rd ROTR.L ERd ROTR.L #2,ERd ROTXL.B Rd ROTXL.B #2,Rd ROTXL.W Rd ROTXL.W #2,Rd ROTXL.L ERd ROTXL.L #2,ERd ROTXR.B Rd ROTXR.B #2,Rd ROTXR.W Rd ROTXR.W #2,Rd ROTXR.L ERd R:W NEXT R:W 3rd R:W NEXT 4 R:W NEXT Internal operation, R:W EA 1 state R:W:M NEXT Internal operation, R:W:M EA 1 state Internal operation, W:W EA 1 state R:W:M NEXT Internal operation, W:W:M EA 1 state 3 2 R:W NEXT W:W EA+2 R:W EA+2 5 6 7 8 9 Rev. 4.0, 03/03, page 1133 of 1358 R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:W NEXT R:W NEXT R:W 3rd Internal operation:M W:W EA W:W EA R:W NEXT R:W:M stack (H) R:W stack (L) Advanced R:W NEXT SHAL.B Rd SHAL.B #2,Rd SHAL.W Rd SHAL.W #2,Rd SHAL.L ERd SHAL.L #2,ERd SHAR.B Rd SHAR.B #2,Rd SHAR.W Rd SHAR.W #2,Rd SHAR.L ERd SHAR.L #2,ERd SHLL.B Rd SHLL.B #2,Rd SHLL.W Rd SHLL.W #2,Rd SHLL.L ERd SHLL.L #2,ERd SHLR.B Rd SHLR.B #2,Rd SHLR.W Rd SHLR.W #2,Rd SHLR.L ERd SHLR.L #2,ERd SLEEP STC CCR,Rd STC EXR,Rd STC CCR,@ERd STC EXR,@ERd STC CCR,@(d:16,ERd) RTS 3 R:W stack (EXR) R:W stack (H) 2 1 R:W NEXT R:W NEXT Instruction ROTXR.L #2,ERd RTE 5 6 W:W EA R:W stack (L) Internal operation, R:W*4 1 state Internal operation, R:W*4 1 state 4 7 8 9 Rev. 4.0, 03/03, page 1134 of 1358 R:W NEXT R:W 2nd R:W NEXT R:W 2nd R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W 2nd R:W NEXT R:W NEXT R:W NEXT R:W 2nd R:W NEXT R:W 2nd XOR.B #xx8,Rd XOR.B Rs,Rd XOR.W #xx:16,Rd XOR.W Rs,Rd XOR.L #xx:32,ERd R:W NEXT R:W 3rd R:W NEXT R:W NEXT R:W NEXT R:B:M EA Internal operation, W:W stack (L) 1 state R:W 3rd R:W NEXT 2 R:W 3rd R:W 3rd R:W 3rd R:W NEXT 3 R:W NEXT R:W 4th R:W 4th Internal operation, 1 state R:W 2nd R:W NEXT Internal operation, 1 state R:W 2nd R:W 3rd R:W NEXT R:W 2nd R:W 3rd R:W NEXT R:W 2nd R:W 3rd R:W 4th R:W 2nd R:W 3rd R:W 4th R:W 2nd R:W:M NEXT Internal operation, 1 state R:W 2nd R:W:M NEXT Internal operation, 1 state R:W 2nd R:W:M NEXT Internal operation, 1 state Cannot be used in the chip 1 R:W 2nd R:W 2nd R:W 2nd R:W 2nd STMAC MACH,ERd STMAC MACL,ERd SUB.B Rs,Rd SUB.W #xx:16,Rd SUB.W Rs,Rd SUB.L #xx:32,ERd SUB.L ERs,ERd SUBS #1/2/4,ERd SUBX #xx:8,Rd SUBX Rs,Rd TAS @ERd*8 TRAPA #x:2 Advanced STM.L(ERn ERn+3),@ SP STM.L(ERn ERn+2),@ SP STC CCR,@aa:16 STC EXR,@aa:16 STC CCR,@aa:32 STC EXR,@aa:32 STM.L(ERn ERn+1),@ SP STC EXR,@ ERd Instruction STC EXR,@(d:16,ERd) STC CCR,@(d:32,ERd) STC EXR,@(d:32,ERd) STC CCR,@ ERd R:W NEXT R:W NEXT 5 W:B EA W:W stack (H) W:W EA W:W EA 6 W:W stack (EXR) R:W:M VEC W:W:M stack (H)*3 W:W stack (L)*3 W:W:M stack (H)*3 W:W stack (L)*3 W:W EA W:W EA R:W NEXT W:W EA R:W NEXT W:W EA W:W:M stack (H)*3 W:W stack (L)*3 W:W EA 4 W:W EA R:W 5th R:W 5th W:W EA R:W VEC+2 7 9 Internal operation, R:W*7 1 state 8 Rev. 4.0, 03/03, page 1135 of 1358 R:W*6 1 R:W 2nd R:W NEXT R:W 2nd R:W VEC 3 4 Internal operation, R:W*5 1 state Internal operation, W:W stack (L) W:W stack (H) 1 state R:W NEXT R:W VEC+2 2 R:W NEXT W:W stack (EXR) 5 R:W:M VEC 6 R:W VEC+2 7 9 Internal operation, R:W*7 1 state 8 Notes: *1 EAs is the contents of ER5. EAd is the contents of ER6. *2 EAs is the contents of ER5. EAd is the contents of ER6. Both registers are incremented by 1 after execution of the instruction. n is the initial value of R4L or R4. If n = 0, these bus cycles are not executed. *3 Repeated two times to save or restore two registers, three times for three registers, or four times for four registers. *4 Start address after return. *5 Start address of the program. *6 Prefetch address, equal to two plus the PC value pushed onto the stack. In recovery from sleep mode or software standby mode the read operation is replaced by an internal operation. *7 Start address of the interrupt handling routine. *8 Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction. Instruction XOR.L ERs,ERd XORC #xx:8,CCR XORC #xx:8,EXR Advanced Reset exception handling Interrupt exception Advanced handling A.6 Condition Code Modification This section indicates the effect of each CPU instruction on the condition code. The notation used in the table is defined below. 31 for longword operands m= 15 for word operands 7 for byte operands Si The i-th bit of the source operand Di The i-th bit of the destination operand Ri The i-th bit of the result Dn The specified bit in the destination operand -- Not affected Modified according to the result of the instruction (see definition) 0 Always cleared to 0 1 Always set to 1 * Undetermined (no guaranteed value) Z' Z flag before instruction execution C' C flag before instruction execution Rev. 4.0, 03/03, page 1136 of 1358 Table A-7 Instruction Condition Code Modification H N Z V C Definition H = Sm-4 * Dm-4 + Dm-4 * Rm-4 + Sm-4 * Rm-4 ADD N = Rm Z = Rm * Rm-1 * ...... * R0 V = Sm * Dm * Rm + Sm * Dm * Rm C = Sm * Dm + Dm * Rm + Sm * Rm ADDS -- -- -- -- -- H = Sm-4 * Dm-4 + Dm-4 * Rm-4 + Sm-4 * Rm-4 ADDX N = Rm Z = Z' * Rm * ...... * R0 V = Sm * Dm * Rm + Sm * Dm * Rm C = Sm * Dm + Dm * Rm + Sm * Rm AND -- 0 -- N = Rm Z = Rm * Rm-1 * ...... * R0 ANDC Stores the corresponding bits of the result. No flags change when the operand is EXR. BAND -- -- -- -- C = C' * Dn Bcc -- -- -- -- -- BCLR -- -- -- -- -- BIAND -- -- -- -- C = C' * Dn BILD -- -- -- -- C = Dn BIOR -- -- -- -- C = C' + Dn BIST -- -- -- -- -- BIXOR -- -- -- -- C = C' * Dn + C' * Dn BLD -- -- -- -- C = Dn BNOT -- -- -- -- -- BOR -- -- -- -- BSET -- -- -- -- -- BSR -- -- -- -- -- BST -- -- -- -- -- BTST -- -- BXOR -- -- -- -- CLRMAC -- -- C = C' + Dn Z = Dn C = C' * Dn + C' * Dn Cannot be used in the chip Rev. 4.0, 03/03, page 1137 of 1358 Instruction H N Z V C Definition H = Sm-4 * Dm-4 + Dm-4 * Rm-4 + Sm-4 * Rm-4 CMP N = Rm Z = Rm * Rm-1 * ...... * R0 V = Sm * Dm * Rm + Sm * Dm * Rm C = Sm * Dm + Dm * Rm + Sm * Rm DAA * N = Rm * Z = Rm * Rm-1 * ...... * R0 C: decimal arithmetic carry DAS * N = Rm * Z = Rm * Rm-1 * ...... * R0 C: decimal arithmetic borrow DEC -- -- N = Rm Z = Rm * Rm-1 * ...... * R0 V = Dm * Rm DIVXS -- -- -- N = Sm * Dm + Sm * Dm Z = Sm * Sm-1 * ...... * S0 DIVXU -- -- -- N = Sm Z = Sm * Sm-1 * ...... * S0 EEPMOV -- -- -- -- -- EXTS -- EXTU -- 0 INC -- 0 0 -- N = Rm -- Z = Rm * Rm-1 * ...... * R0 Z = Rm * Rm-1 * ...... * R0 -- N = Rm Z = Rm * Rm-1 * ...... * R0 V = Dm * Rm JMP -- -- -- -- -- JSR -- -- -- -- -- LDC Stores the corresponding bits of the result. No flags change when the operand is EXR. LDM -- -- -- -- -- LDMAC MAC Rev. 4.0, 03/03, page 1138 of 1358 Cannot be used in the chip Instruction H MOV -- N Z V C Definition 0 -- N = Rm Z = Rm * Rm-1 * ...... * R0 MOVFPE Cannot be used in the chip MOVTPE MULXS -- -- -- N = R2m Z = R2m * R2m-1 * ...... * R0 MULXU -- -- -- -- -- NEG H = Dm-4 + Rm-4 N = Rm Z = Rm * Rm-1 * ...... * R0 V = Dm * Rm C = Dm + Rm NOP -- -- -- -- -- NOT -- 0 -- N = Rm Z = Rm * Rm-1 * ...... * R0 OR -- 0 -- N = Rm Z = Rm * Rm-1 * ...... * R0 ORC Stores the corresponding bits of the result. No flags change when the operand is EXR. POP -- 0 -- N = Rm Z = Rm * Rm-1 * ...... * R0 PUSH -- 0 -- N = Rm Z = Rm * Rm-1 * ...... * R0 ROTL -- 0 N = Rm Z = Rm * Rm-1 * ...... * R0 C = Dm (1-bit shift) or C = Dm-1 (2-bit shift) ROTR -- 0 N = Rm Z = Rm * Rm-1 * ...... * R0 C = D0 (1-bit shift) or C = D1 (2-bit shift) Rev. 4.0, 03/03, page 1139 of 1358 Instruction H ROTXL -- N Z V C 0 Definition N = Rm Z = Rm * Rm-1 * ...... * R0 C = Dm (1-bit shift) or C = Dm-1 (2-bit shift) ROTXR -- 0 N = Rm Z = Rm * Rm-1 * ...... * R0 C = D0 (1-bit shift) or C = D1 (2-bit shift) RTE Stores the corresponding bits of the result. RTS -- -- -- -- -- SHAL -- N = Rm Z = Rm * Rm-1 * ...... * R0 V = Dm * Dm-1 + Dm * Dm-1 (1-bit shift) V = Dm * Dm-1 * Dm-2 * Dm * Dm-1 * Dm-2 (2-bit shift) C = Dm (1-bit shift) or C = Dm-1 (2-bit shift) SHAR -- 0 N = Rm Z = Rm * Rm-1 * ...... * R0 C = D0 (1-bit shift) or C = D1 (2-bit shift) SHLL -- 0 N = Rm Z = Rm * Rm-1 * ...... * R0 C = Dm (1-bit shift) or C = Dm-1 (2-bit shift) SHLR -- 0 0 N = Rm Z = Rm * Rm-1 * ...... * R0 C = D0 (1-bit shift) or C = D1 (2-bit shift) SLEEP -- -- -- -- -- STC -- -- -- -- -- STM -- -- -- -- -- STMAC Rev. 4.0, 03/03, page 1140 of 1358 Cannot be used in the chip Instruction H N Z V C Definition H = Sm-4 * Dm-4 + Dm-4 * Rm-4 + Sm-4 * Rm-4 SUB N = Rm Z = Rm * Rm-1 * ...... * R0 V = Sm * Dm * Rm + Sm * Dm * Rm C = Sm * Dm + Dm * Rm + Sm * Rm SUBS -- -- -- -- -- H = Sm-4 * Dm-4 + Dm-4 * Rm-4 + Sm-4 * Rm-4 SUBX N = Rm Z = Z' * Rm * ...... * R0 V = Sm * Dm * Rm + Sm * Dm * Rm C = Sm * Dm + Dm * Rm + Sm * Rm TAS -- 0 -- N = Dm Z = Dm * Dm-1 * ...... * D0 TRAPA -- -- -- -- -- XOR -- 0 -- N = Rm Z = Rm * Rm-1 * ...... * R0 XORC Stores the corresponding bits of the result. No flags change when the operand is EXR. Rev. 4.0, 03/03, page 1141 of 1358 Appendix B Internal I/O Registers B.1 List of Registers (Address Order) Data Bus Width Register Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module Name H'F800 MRA SM1 SM0 DM1 DM0 MD1 MD0 DTS Sz DTC to SAR 16/32* bits CHNE DISEL CHNS -- -- -- -- -- TPU3 16 bits 1 H'FBFF MRB DAR CRA CRB H'FE80 TCR3 CCLR2 CCLR1 CCLR0 CKEG1 CKEG0 TPSC2 TPSC1 TPSC0 H'FE81 TMDR3 -- -- BFB BFA MD3 MD2 MD1 MD0 H'FE82 TIOR3H IOB3 IOB2 IOB1 IOB0 IOA3 IOA2 IOA1 IOA0 H'FE83 TIOR3L IOD3 IOD2 IOD1 IOD0 IOC3 IOC2 IOC1 IOC0 H'FE84 TIER3 TTGE -- -- TCIEV TGIED TGIEC TGIEB TGIEA H'FE85 TSR3 -- -- -- TCFV TGFD TGFC TGFB TGFA H'FE86 TCNT3 H'FE87 H'FE88 TGR3A H'FE89 H'FE8A TGR3B H'FE8B H'FE8C TGR3C H'FE8D H'FE8E TGR3D H'FE8F Rev. 4.0, 03/03, page 1142 of 1358 Bit 0 Module Name Data Bus Width TPSC0 TPU4 16 bits TPU5 16 bits Register Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 H'FE90 TCR4 -- CCLR1 CCLR0 CKEG1 CKEG0 TPSC2 TPSC1 H'FE91 TMDR4 -- -- -- -- MD3 MD2 MD1 MD0 H'FE92 TIOR4 IOB3 IOB2 IOB1 IOB0 IOA3 IOA2 IOA1 IOA0 H'FE94 TIER4 TTGE -- TCIEU TCIEV -- -- TGIEB TGIEA H'FE95 TSR4 TCFD -- TCFU TCFV -- -- TGFB TGFA H'FE96 TCNT4 H'FE97 H'FE98 TGR4A H'FE99 H'FE9A TGR4B H'FE9B H'FEA0 TCR5 -- CCLR1 CCLR0 CKEG1 CKEG0 TPSC2 TPSC1 TPSC0 H'FEA1 TMDR5 -- -- -- -- MD3 MD2 MD1 MD0 H'FEA2 TIOR5 IOB3 IOB2 IOB1 IOB0 IOA3 IOA2 IOA1 IOA0 H'FEA4 TIER5 TTGE -- TCIEU TCIEV -- -- TGIEB TGIEA H'FEA5 TSR5 TCFD -- TCFU TCFV -- -- TGFB TGFA H'FEA6 TCNT5 H'FEA7 H'FEA8 TGR5A H'FEA9 H'FEAA TGR5B H'FEAB H'FEB0 P1DDR P17DDR P16DDR P15DDR P14DDR P13DDR P12DDR P11DDR P10DDR Ports H'FEB1 P2DDR P27DDR P26DDR P25DDR P24DDR P23DDR P22DDR P21DDR P20DDR H'FEB2 P3DDR -- -- P35DDR P34DDR P33DDR P32DDR P31DDR P30DDR H'FEB4 P5DDR -- -- -- H'FEB5 P6DDR P67DDR P66DDR P65DDR P64DDR P63DDR P62DDR P61DDR P60DDR H'FEB9 -- P53DDR P52DDR P51DDR P50DDR PADDR PA7DDR PA6DDR PA5DDR PA4DDR PA3DDR PA2DDR PA1DDR PA0DDR H'FEBA PBDDR PB7DDR PB6DDR PB5DDR PB4DDR PB3DDR PB2DDR PB1DDR PB0DDR H'FEBB PCDDR PC7DDR PC6DDR PC5DDR PC4DDR PC3DDR PC2DDR PC1DDR PC0DDR H'FEBC PDDDR PD7DDR PD6DDR PD5DDR PD4DDR PD3DDR PD2DDR PD1DDR PD0DDR H'FEBD PEDDR PE7DDR PE6DDR PE5DDR PE4DDR PE3DDR PE2DDR PE1DDR PE0DDR H'FEBE PFDDR PF7DDR PF6DDR PF5DDR PF4DDR PF3DDR PF2DDR PF1DDR PF0DDR H'FEBF PGDDR -- -- -- 8 bits PG4DDR PG3DDR PG2DDR PG1DDR PG0DDR Rev. 4.0, 03/03, page 1143 of 1358 Register Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 H'FEC4 IPRA -- IPR6 IPR5 IPR4 -- IPR2 IPR1 IPR0 H'FEC5 IPRB -- IPR6 IPR5 IPR4 -- IPR2 IPR1 IPR0 H'FEC6 IPRC -- IPR6 IPR5 IPR4 -- IPR2 IPR1 IPR0 H'FEC7 IPRD -- IPR6 IPR5 IPR4 -- IPR2 IPR1 IPR0 H'FEC8 IPRE -- IPR6 IPR5 I PR4 -- IPR2 IPR1 IPR0 H'FEC9 IPRF -- IPR6 IPR5 IPR4 -- IPR2 IPR1 IPR0 H'FECA IPRG -- IPR6 IPR5 IPR4 -- IPR2 IPR1 IPR0 H'FECB IPRH -- IPR6 IPR5 IPR4 -- IPR2 IPR1 IPR0 H'FECC IPRI -- IPR6 IPR5 IPR4 -- IPR2 IPR1 IPR0 H'FECD IPRJ -- IPR6 IPR5 IPR4 -- IPR2 IPR1 IPR0 H'FECE IPRK -- IPR6 IPR5 IPR4 -- IPR2 IPR1 IPR0 H'FED0 ABWCR ABW7 ABW6 ABW5 ABW4 ABW3 ABW2 ABW1 ABW0 H'FED1 ASTCR AST7 AST6 AST5 AST4 AST3 AST2 AST1 AST0 H'FED2 WCRH W71 W70 W61 W60 W51 W50 W41 W40 H'FED3 WCRL W31 W30 W21 W20 W11 W10 W01 H'FED4 BCRH ICIS1 ICIS0 BRSTRM BRSTS1 BRSTS0 RMTS2* RMTS1* RMTS0* 2 *2 *2 Interrupt controller 8 bits Bus controller 8 bits 2 BRLE BREQOE EAE -- DDS -- WDBE H'FED6 MCR*3 TPC BE RCDM -- MXC1 MXC0 RLW1 RLW0 RMODE CMF CMIE CKS2 CKS1 CKS0 3 Data Bus Width W00 2 H'FED5 BCRL H'FED7 DRAMCR* RFSHE RCW Module Name WAITE H'FED8 RTCNT*3 H'FED9 RTCOR H'FEDB RAMER*4 -- -- -- -- RAMS RAM2 RAM1 RAM0 Flash memory 8 bits H'FEE0 -- -- -- -- -- -- -- -- DMAC*5 16 bits -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- MAR0AH H'FEE1 H'FEE2 MAR0AL H'FEE3 H'FEE4 IOAR0A H'FEE5 H'FEE6 ETCR0A H'FEE7 H'FEE8 MAR0BH H'FEE9 H'FEEA MAR0BL H'FEEB H'FEEC IOAR0B H'FEED H'FEEE ETCR0B H'FEEF H'FEF0 MAR1AH H'FEF1 H'FEF2 MAR1AL H'FEF3 Rev. 4.0, 03/03, page 1144 of 1358 Register Address Name H'FEF4 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Data Bus Width Module Name 5 DMAC* IOAR1A 16 bits H'FEF5 H'FEF6 ETCR1A H'FEF7 H'FEF8 MAR1BH -- -- -- -- -- -- -- -- H'FF00 DMAWER -- -- -- -- WE1B WE1A WE0B WE0A H'FF01 DMATCR -- TEE1 TEE0 -- -- -- -- H'FF02 DMACR0A DTSZ DTID RPE DTDIR DTF3 DTF2 DTF1 DTF0 Short address mode DTSZ SAID SAIDE BLKDIR BLKE -- -- -- Full address mode DMACR0B DTSZ DTID RPE DTDIR DTF3 DTF2 DTF1 DTF0 Short address mode DAID DAIDE -- DTF3 DTF2 DTF1 DTF0 Full address mode DMACR1A DTSZ DTID RPE DTDIR DTF3 DTF2 DTF1 DTF0 Short address mode DTSZ SAID SAIDE BLKDIR BLKE -- -- -- Full address mode DMACR1B DTSZ DTID RPE DTDIR DTF3 DTF2 DTF1 DTF0 Short address mode DAID DAIDE -- DTF3 DTF2 DTF1 DTF0 Full address mode DMABCRH FAE1 FAE0 SAE1 SAE0 DTA1B DTA1A DTA0B DTA0A Short address mode FAE1 FAE0 -- -- DTA1 -- DTA0 -- Full address mode DTE1A DTE0B DTE0A DTIE1B DTIE1A DTIE0B DTIE0A Short address mode DTE1 DTME0 DTE0 DTIE1B DTIE1A DTIE0B DTIE0A Full address mode H'FEF9 H'FEFA MAR1BL H'FEFB H'FEFC IOAR1B H'FEFD H'FEFE ETCR1B H'FEFF H'FF03 -- -- H'FF04 H'FF05 -- H'FF06 H'FF07 DMABCRL DTE1B DTME1 8 bits 16 bits Rev. 4.0, 03/03, page 1145 of 1358 Address H'FF2C ISCRH H'FF2D ISCRL IRQ7SCB IRQ7SCA IRQ6SCB IRQ6SCA IRQ5SCB IRQ5SCA IRQ4SCB IRQ4SCA Interrupt IRQ3SCB IRQ3SCA IRQ2SCB IRQ2SCA IRQ1SCB IRQ1SCA IRQ0SCB IRQ0SCA controller H'FF2E IER IRQ7E IRQ6E IRQ5E IRQ4E IRQ3E IRQ2E IRQ1E IRQ0E H'FF2F ISR IRQ7F IRQ6F IRQ5F IRQ4F IRQ3F IRQ2F IRQ1F IRQ0F H'FF30 to H'FF35 DTCER DTCE7 DTCE6 DTCE5 DTCE4 DTCE3 DTCE2 DTCE1 DTCE0 H'FF37 DTVECR SWDTE DTVEC6 DTVEC5 DTVEC4 DTVEC3 DTVEC2 DTVEC1 DTVEC0 H'FF38 SBYCR SSBY -- H'FF39 SYSCR -- -- INTM1 INTM0 NMIEG LWROD IRQPAS RAME MCU 8 bits H'FF3A SCKCR PSTOP -- DIV -- -- SCK2 SCK1 SCK0 Clock pulse generator 8 bits H'FF3B MDCR -- -- -- -- -- MDS2 MDS1 MDS0 MCU 8 bits H'FF3C MSTPCRH MSTP15 MSTP14 MSTP13 MSTP12 MSTP11 MSTP10 MSTP9 MSTP8 H'FF3D MSTPCRL MSTP6 MSTP5 MSTP4 MSTP3 MSTP2 MSTP1 MSTP0 Power-down 8 bits mode H'FF42 SYSCR2*4 -- -- -- -- FLSHE -- -- -- MCU 8 bits H'FF44 Reserved -- -- -- -- -- -- -- -- Reserved -- HFF45 PFCR1 -- -- -- -- A23E A22E A21E A20E Port 8 bits H'FF46 PCR G3CMS1 G3CMS0 G2CMS1 G2CMS0 G1CMS1 G1CMS0 G0CMS1 G0CMS0 PPG 8 bits H'FF47 PMR G3INV G1NOV G0NOV H'FF48 NDERH NDER15 NDER14 NDER13 NDER12 NDER11 NDER10 NDER9 NDER8 NDER0 Bit 7 MSTP7 Bit 6 STS2 G2INV Bit 5 STS1 G1INV Bit 4 STS0 G0INV Bit 3 OPE G3NOV Bit 2 G2NOV Bit 1 -- Bit 0 IRQ37S H'FF49 NDERL NDER7 NDER6 NDER5 NDER4 NDER3 NDER2 NDER1 H'FF4A PODRH POD15 POD14 POD13 POD12 POD11 POD10 POD9 POD8 H'FF4B PODRL POD7 POD6 POD5 POD4 POD3 POD2 POD1 POD0 H'FF4C* 6 NDRH NDR15 NDR14 NDR13 NDR12 NDR11 NDR10 NDR9 NDR8 H'FF4D*6 H'FF4E*6 6 H'FF4F* NDRL NDR7 NDR6 NDR5 NDR4 NDR3 NDR2 NDR1 NDR0 NDRH -- -- -- -- NDR11 NDR10 NDR9 NDR8 NDRL -- -- -- -- NDR3 NDR2 NDR1 NDR0 H'FF50 PORT1 P17 P16 P15 P14 P13 P12 P11 P10 H'FF51 PORT2 P27 P26 P25 P24 P23 P22 P21 P20 H'FF52 PORT3 -- -- P35 P34 P33 P32 P31 P30 H'FF53 PORT4 P47 P46 P45 P44 P43 P42 P41 P40 H'FF54 PORT5 -- -- -- -- P53 P52 P51 P50 H'FF55 PORT6 P67 P66 P65 P64 P63 P62 P61 P60 H'FF59 PORTA PA7 PA6 PA5 PA4 PA3 PA2 PA1 PA0 H'FF5A PORTB PB7 PB6 PB5 PB4 PB3 PB2 PB1 PB0 H'FF5B PORTC PC7 PC6 PC5 PC4 PC3 PC2 PC1 PC0 PD0 H'FF5C PORTD PD7 PD6 PD5 PD4 PD3 PD2 PD1 H'FF5D PORTE PE7 PE6 PE5 PE4 PE3 PE2 PE1 PE0 H'FF5E PORTF PF7 PF6 PF5 PF4 PF3 PF2 PF1 PF0 H'FF5F PORTG -- -- -- PG4 PG3 PG2 PG1 PG0 Rev. 4.0, 03/03, page 1146 of 1358 Module Name Data Bus Width Register Name DTC 8 bits 8 bits Power-down 8 bits mode Ports 8 bits Bit 0 Module Name Data Bus Width P10DR Ports 8 bits SCI0, smart card interface 0 8 bits SCI1, smart card interface 1 8 bits Register Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 H'FF60 P1DR P17DR P16DR P15D R P14DR P13DR P12DR P11DR H'FF61 P2DR P27DR P26DR P25DR P24DR P23DR P22DR P21DR P20DR H'FF62 P3DR -- -- P35DR P34DR P33DR P32DR P31DR P30DR H'FF64 P5DR -- -- -- -- P53DR P52DR P51DR P50DR H'FF65 P6DR P67DR P66DR P65DR P64DR P63DR P62DR P61DR P60DR H'FF69 PADR PA7DR PA6DR PA5DR PA4DR PA3DR PA2DR PA1DR PA0DR H'FF6A PBDR PB7DR PB6DR PB5DR PB4DR PB3DR PB2DR PB1DR PB0DR H'FF6B PCDR PC7DR PC6DR PC5DR PC4DR PC3DR PC2DR PC1DR PC0DR H'FF6C PDDR PD7DR PD6DR PD5DR PD4DR PD3DR PD2DR PD1DR PD0DR H'FF6D PEDR PE7DR PE6DR PE5DR PE4DR PE3DR PE2DR PE1DR PE0DR H'FF6E PFDR PF7DR PF6DR PF5DR PF4DR PF3DR PF2DR PF1DR PF0DR H'FF6F PGDR -- -- -- PG4DR PG3DR PG2DR PG1DR PG0DR H'FF70 PAPCR PA7PCR PA6PCR PA5PCR PA4PCR PA3PCR PA2PCR PA1PCR PA0PCR H'FF71 PBPCR PB7PCR PB6PCR PB5PCR PB4PCR PB3PCR PB2PCR PB1PCR PB0PCR H'FF72 PCPCR PC7PCR PC6PCR PC5PCR PC4PCR PC3PCR PC2PCR PC1PCR PC0PCR H'FF73 PDPCR PD7PCR PD6PCR PD5PCR PD4PCR PD3PCR PD2PCR PD1PCR PD0PCR H'FF74 PEPCR PE7PCR PE6PCR PE5PCR PE4PCR PE3PCR PE2PCR PE1PCR PE0PCR H'FF76 P3ODR -- H'FF77 PAODR PA7ODR PA6ODR PA5ODR PA4ODR PA3ODR PA2ODR PA1ODR PA0ODR H'FF78 SMR0 C/A/ GM*7 CHR/ BLK*8 PE O/E STOP/ BCP1*9 MP/ CKS1 BCP0*10 CKS0 H'FF79 BRR0 TIE RIE TE RE MPIE TEIE CKE1 CKE0 TDRE RDRF ORER FER/ ERS*11 PER TEND MPB MPBT -- SMIF H'FF7A SCR0 H'FF7B TDR0 H'FF7C SSR0 -- P35ODR P34ODR P33ODR P32ODR P31ODR P30ODR H'FF7D RDR0 H'FF7E SCMR0 -- -- -- -- SDIR SINV H'FF80 SMR1 C/A/ GM*7 CHR/ BLK*8 PE O/E STOP/ BCP1*9 MP/ CKS1 BCP0*10 CKS0 H'FF81 BRR1 TIE RIE TE RE MPIE TEIE CKE1 CKE0 TDRE RDRF ORER FER/ 11 ERS* PER TEND MPB MPBT -- -- -- -- SDIR SINV -- SMIF H'FF82 SCR1 H'FF83 TDR1 H'FF84 SSR1 H'FF85 RDR1 H'FF86 SCMR1 Rev. 4.0, 03/03, page 1147 of 1358 Register Address Name H'FF88 SMR2 H'FF89 BRR2 H'FF8A SCR2 H'FF8B TDR2 H'FF8C SSR2 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 C/A/ 7 GM* CHR/ 8 BLK* PE O/E STOP/ 9 BCP1* MP/ CKS1 10 BCP0* Bit 1 Bit 0 CKS0 TIE RIE TE RE MPIE TEIE CKE1 CKE0 TDRE RDRF ORER FER/ ERS*11 PER TEND MPB MPBT H'FF8D RDR2 H'FF8E SCMR2 -- -- -- -- SDIR SINV -- SMIF H'FF90 ADDRAH AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 H'FF91 ADDRAL AD1 AD0 -- -- -- -- -- -- AD2 H'FF92 ADDRBH AD9 AD8 AD7 AD6 AD5 AD4 AD3 H'FF93 ADDRBL AD1 AD0 -- -- -- -- -- -- H'FF94 ADDRCH AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 H'FF95 ADDRCL AD1 AD0 -- -- -- -- -- -- AD2 H'FF96 ADDRDH AD9 AD8 AD7 AD6 AD5 AD4 AD3 H'FF97 ADDRDL AD1 AD0 -- -- -- -- -- -- H'FF98 ADCSR ADF ADIE ADST SCAN CKS CH2 CH1 CH0 H'FF99 ADCR TRGS1 TRGS0 -- -- CKS1 CH3 -- -- H'FFA4 DADR0 H'FFA5 DADR1 H'FFA6 DACR01 DAOE0 SCI2, smart card interface 2 8 bits A/D converter 8 bits D/A converter 8 bits -- -- -- -- WAITPS BREQOPS CS167E CS25E ASOD -- -- -- Ports 8 bits H'FFB0 CMIEB CCLR1 CCLR0 CKS2 CKS1 CKS0 8-bit timer channel 0, 1 16 bits WDT 16 bits CMIEA DAE Data Bus Width H'FFAC PFCR2 TCR0 DAOE1 Module Name OVIE -- H'FFB1 TCR1 CMIEB CMIEA OVIE CCLR1 CCLR0 CKS2 CKS1 CKS0 H'FFB2 TCSR0 CMFB CMFA OVF ADTE OS3 OS2 OS1 OS0 H'FFB3 TCSR1 CMFB CMFA OVF -- OS3 OS2 OS1 OS0 H'FFB4 TCORA0 H'FFB5 TCORA1 H'FFB6 TCORB0 H'FFB7 TCORB1 H'FFB8 TCNT0 H'FFB9 TCNT1 OVF WT/IT TME -- -- CKS2 CKS1 CKS0 WOVF RSTE -- -- -- -- -- -- H'FFBC TCSR (read) H'FFBD TCNT (read) H'FFBF (read) RSTCSR Rev. 4.0, 03/03, page 1148 of 1358 Bit 0 Module Name Data Bus Width CST0 TPU 16 bits Address Register Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 H'FFC0 TSTR -- -- CST5 CST4 CST3 CST2 CST1 H'FFC1 TSYR -- -- SYNC5 SYNC4 SYNC3 SYNC2 SYNC1 SYNC0 12 FLMCR1 FWE SWE ESU PSU EV PV E P 12 FLMCR2 FLER -- -- -- -- -- -- -- H'FFCA* 12 EBR1 EB7 EB6 EB5 EB4 EB3 EB2 EB1 EB0 H'FFCB*12 13 H'FFC8* 13 * H'FFC9 13 * H'FFCA 13 H'FFCB* 14 H'FFC8* 14 H'FFC9* 14 H'FFCA* H'FFCB*14 15 H'FFC4* 15 H'FFC5* H'FFC6*15 H'FFC7*15 15 H'FFC8* H'FFC9*15 H'FFCA*15 H'FFCB*15 H'FFCC*15 H'FFCD*15 15 H'FFCE* 15 * H'FFCF EBR2 -- -- -- -- EB11 EB10 EB9 EB8 FLMCR1 FWE SWE ESU PSU EV PV E P FLMCR2 FLER -- -- -- -- -- -- -- H'FFC8* H'FFC9* EBR1 EB7 EB6 EB5 EB4 EB3 EB2 EB1 EB0 EBR2 -- -- EB13 EB12 EB11 EB10 EB9 EB8 FLMCR1 FWE SWE1 ESU1 PSU1 EV1 PV1 E1 P1 FLMCR2 FLER SWE2 ESU2 PSU2 EV2 PV2 E2 P2 EBR1 EB7 EB6 EB5 EB4 EB3 EB2 EB1 EB0 EBR2 EB15 EB14 EB13 EB12 EB11 EB10 EB9 EB8 FCCS -- -- -- -- -- -- -- -- FPCS -- -- -- -- -- -- -- -- FECS -- -- -- -- -- -- -- -- Reserved -- -- -- -- -- -- -- -- FKEY K7 K6 K5 K4 K3 K3 K1 K0 FMATS MS7 MS6 MS5 MS4 MS3 MS2 MS1 MS0 FTDAR TDER Reserved -- Reserved TDA6 TDA5 TDA4 TDA3 TDA2 TDA1 TDA0 -- -- -- -- -- -- -- Flash memory 8 bits (H8S/2328 F-ZTAT) Flash memory 8 bits (H8S/2329 F-ZTAT) Flash memory 8 bits (H8S/2326 F-ZTAT) Flash memory 8 bits (H8S/2326C F-ZTAT) 16 bits Reserved Reserved Reserved Rev. 4.0, 03/03, page 1149 of 1358 Bit 0 Module Name Data Bus Width TPSC0 TPU0 16 bits TPU1 16 bits TPU2 16 bits Register Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 H'FFD0 TCR0 CCLR2 CCLR1 CCLR0 CKEG1 CKEG0 TPSC2 TPSC1 H'FFD1 TMDR0 -- -- BFB BFA MD3 MD2 MD1 MD0 H'FFD2 TIOR0H IOB3 IOB2 IOB1 IOB0 IOA3 IOA2 IOA1 IOA0 H'FFD3 TIOR0L IOD3 IOD2 IOD1 IOD0 IOC3 IOC2 IOC1 IOC0 H'FFD4 TIER0 TTGE -- -- TCIEV TGIED TGIEC TGIEB TGIEA H'FFD5 TSR0 -- -- -- TCFV TGFD TGFC TGFB TGFA H'FFD6 TCNT0 H'FFD7 H'FFD8 TGR0A H'FFD9 H'FFDA TGR0B H'FFDB H'FFDC TGR0C H'FFDD H'FFDE TGR0D H'FFDF H'FFE0 TCR1 -- CCLR1 CCLR0 CKEG1 CKEG0 TPSC2 TPSC1 TPSC0 H'FFE1 TMDR1 -- -- -- -- MD3 MD2 MD1 MD0 H'FFE2 TIOR1 IOB3 IOB2 IOB1 IOB0 IOA3 IOA2 IOA1 IOA0 H'FFE4 TIER1 TTGE -- TCIEU TCIEV -- -- TGIEB TGIEA H'FFE5 TSR1 TCFD -- TCFU TCFV -- -- TGFB TGFA H'FFE6 TCNT1 H'FFE7 H'FFE8 TGR1A H'FFE9 H'FFEA TGR1B H'FFEB H'FFF0 TCR2 -- CCLR1 CCLR0 CKEG1 CKEG0 TPSC2 TPSC1 TPSC0 H'FFF1 TMDR2 -- -- -- -- MD3 MD2 MD1 MD0 H'FFF2 TIOR2 IOB3 IOB2 IOB1 IOB0 IOA3 IOA2 IOA1 IOA0 H'FFF4 TIER2 TTGE -- TCIEU TCIEV -- -- TGIEB TGIEA H'FFF5 TSR2 TCFD -- TCFU TCFV -- -- TGFB TGFA H'FFF6 TCNT2 H'FFF7 H'FFF8 TGR2A H'FFF9 H'FFFA TGR2B H'FFFB Notes: *1 *2 *3 *4 Located in on-chip RAM. The bus width is 32 bits when the DTC accesses this area as register information, and 16 bits otherwise. Reserved bit in the H8S/2321. Reserved in the H8S/2321. Valid only in F-ZTAT versions. Rev. 4.0, 03/03, page 1150 of 1358 *5 *6 *7 *8 *9 *10 *11 *12 *13 *14 *15 The DMAC is not supported in the H8S/2321. If the pulse output group 2 and pulse output group 3 output triggers are the same according to the PCR setting, the NDRH address will be H'FF4C, and if different, the address of NDRH for group 2 will be H'FF4E, and that for group 3 will be H'FF4C. Similarly, if the pulse output group 0 and pulse output group 1 output triggers are the same according to the PCR setting, the NDRL address will be H'FF4D, and if different, the address of NDRL for group 0 will be H'FF4F, and that for group 1 will be H'FF4D. Functions as C/A for SCI use, and as GM for smart card interface use. Functions as CHR for SCI use, and as BLK for smart card interface use. Functions as STOP for SCI use, and as BCP1 for smart card interface use. Functions as MP for SCI use, and as BCP0 for smart card interface use. Functions as FER for SCI use, and as ERS for smart card interface use. Applies to the H8S/2328 F-ZTAT. Applies to the H8S/2329 F-ZTAT. Applies to the H8S/2326 F-ZTAT. Applies to the H8S/2326C F-ZTAT. Rev. 4.0, 03/03, page 1151 of 1358 B.2 List of Registers (By Module) Module Register Abbreviation R/W 1 Initial Value Address* Interrupt controller System control register SYSCR R/W H'01 H'FF39 IRQ sense control register H ISCRH R/W H'00 H'FF2C IRQ sense control register L ISCRL R/W H'00 H'FF2D IRQ enable register IER ISR R/W H'00 2 R/(W)* H'00 H'FF2E IRQ status register Interrupt priority register A IPRA R/W H'77 H'FEC4 Interrupt priority register B IPRB R/W H'77 H'FEC5 Interrupt priority register C IPRC R/W H'77 H'FEC6 Bus controller H'FF2F Interrupt priority register D IPRD R/W H'77 H'FEC7 Interrupt priority register E IPRE R/W H'77 H'FEC8 Interrupt priority register F IPRF R/W H'77 H'FEC9 Interrupt priority register G IPRG R/W H'77 H'FECA Interrupt priority register H IPRH R/W H'77 H'FECB Interrupt priority register I IPRI R/W H'77 H'FECC Interrupt priority register J IPRJ R/W H'77 H'FECD Interrupt priority register K IPRK R/W H'77 H'FECE *5 Bus width control register ABWCR R/W H'FF/H'00 Access state control register ASTCR R/W H'FF H'FED1 Wait control register H WCRH R/W H'FF H'FED2 Wait control register L WCRL R/W H'FF H'FED3 Bus control register H BCRH R/W H'D0 H'FED4 Bus control register L BCRL 6 MCR* R/W H'3C H'FED5 R/W H'00 H'FED6 R/W H'00 H'FED7 Refresh timer counter 6 DRAMCR* 6 RTCNT* R/W H'00 H'FED8 Refresh time constant register 6 RTCOR* R/W H'FF H'FED9 Memory control register DRAM control register Rev. 4.0, 03/03, page 1152 of 1358 H'FED0 Module Register Abbreviation R/W DTC DTC mode register A MRA DTC mode register B DMAC0 7 DMAC1* 3 1 Initial Value Address* 4 Undefined MRB --* 3 --* DTC source address register SAR 3 --* Undefined DTC destination address register DAR 3 Undefined DTC transfer count register A CRA --* 3 --* DTC transfer count register B CRB --* 3 Undefined DTC enable register DTCER R/W H'00 H'FF30 to H'FF35 DTC vector register DTVECR R/W H'00 H'FF37 Module stop control register MSTPCR R/W H'3FFF H'FF3C Memory address register 0A MAR0A R/W Undefined H'FEE0 I/O address register 0A IOAR0A R/W Undefined H'FEE4 Undefined Undefined --* 4 --* 4 --* 4 --* 4 --* 4 --* Transfer count register 0A ETCR0A R/W Undefined H'FEE6 Memory address register 0B MAR0B R/W Undefined H'FEE8 I/O address register 0B IOAR0B R/W Undefined H'FEEC Transfer count register 0B ETCR0B R/W Undefined H'FEEE Memory address register 1A MAR1A R/W Undefined H'FEF0 I/O address register 1A IOAR1A R/W Undefined H'FEF4 Transfer count register 1A ETCR1A R/W Undefined H'FEF6 Memory address register 1B MAR1B R/W Undefined H'FEF8 I/O address register 1B IOAR1B R/W Undefined H'FEFC Transfer count register 1B ETCR1B R/W Undefined H'FEFE Both DMAC DMA write enable register 7 channels* DMA terminal control register DMAWER R/W H'00 H'FF00 DMATCR R/W H'00 H'FF01 DMA control register 0A DMACR0A R/W H'00 H'FF02 DMA control register 0B DMACR0B R/W H'00 H'FF03 DMA control register 1A DMACR1A R/W H'00 H'FF04 DMA control register 1B DMACR1B R/W H'00 H'FF05 DMA band control register DMABCR R/W H'0000 H'FF06 Module stop control register MSTPCR R/W H'3FFF H'FF3C Rev. 4.0, 03/03, page 1153 of 1358 Module Register Abbreviation R/W 1 Initial Value Address* TPU0 Timer control register 0 TCR0 R/W H'00 H'FFD0 Timer mode register 0 TMDR0 R/W H'C0 H'FFD1 TPU1 TPU2 Timer I/O control register 0H TIOR0H R/W H'00 H'FFD2 Timer I/O control register 0L TIOR0L R/W H'00 H'FFD3 Timer interrupt enable register 0 TIER0 R/W H'FFD4 Timer status register 0 TSR0 H'40 2 * R/(W) H'C0 Timer counter 0 TCNT0 R/W H'0000 H'FFD6 Timer general register 0A TGR0A R/W H'FFFF H'FFD8 Timer general register 0B TGR0B R/W H'FFFF H'FFDA Timer general register 0C TGR0C R/W H'FFFF H'FFDC Timer general register 0D TGR0D R/W H'FFFF H'FFDE Timer control register 1 TCR1 R/W H'00 H'FFE0 H'FFD5 Timer mode register 1 TMDR1 R/W H'C0 H'FFE1 Timer I/O control register 1 TIOR1 R/W H'00 H'FFE2 Timer interrupt enable register 1 TIER1 R/W H'40 H'FFE4 H'C0 H'FFE5 *2 Timer status register 1 TSR1 R/(W) Timer counter 1 TCNT1 R/W H'0000 H'FFE6 Timer general register 1A TGR1A R/W H'FFFF H'FFE8 Timer general register 1B TGR1B R/W H'FFFF H'FFEA Timer control register 2 TCR2 R/W H'00 H'FFF0 Timer mode register 2 TMDR2 R/W H'C0 H'FFF1 Timer I/O control register 2 TIOR2 R/W H'00 H'FFF2 Timer interrupt enable register 2 TIER2 R/W H'FFF4 Timer status register 2 TSR2 H'40 2 * R/(W) H'C0 Timer counter 2 TCNT2 R/W H'0000 H'FFF6 Timer general register 2A TGR2A R/W H'FFFF H'FFF8 Timer general register 2B TGR2B R/W H'FFFF H'FFFA Rev. 4.0, 03/03, page 1154 of 1358 H'FFF5 Module Register Abbreviation R/W 1 Initial Value Address* TPU3 Timer control register 3 TCR3 R/W H'00 H'FE80 Timer mode register 3 TMDR3 R/W H'C0 H'FE81 TPU4 TPU5 ALL TPU channels Timer I/O control register 3H TIOR3H R/W H'00 H'FE82 Timer I/O control register 3L TIOR3L R/W H'00 H'FE83 Timer interrupt enable register 3 TIER3 R/W H'FE84 Timer status register 3 TSR3 H'40 2 * R/(W) H'C0 Timer counter 3 TCNT3 R/W H'0000 H'FE86 Timer general register 3A TGR3A R/W H'FFFF H'FE88 Timer general register 3B TGR3B R/W H'FFFF H'FE8A Timer general register 3C TGR3C R/W H'FFFF H'FE8C Timer general register 3D TGR3D R/W H'FFFF H'FE8E Timer control register 4 TCR4 R/W H'00 H'FE90 H'FE85 Timer mode register 4 TMDR4 R/W H'C0 H'FE91 Timer I/O control register 4 TIOR4 R/W H'00 H'FE92 Timer interrupt enable register 4 TIER4 R/W H'40 H'FE94 H'C0 H'FE95 *2 Timer status register 4 TSR4 R/(W) Timer counter 4 TCNT4 R/W H'0000 H'FE96 Timer general register 4A TGR4A R/W H'FFFF H'FE98 Timer general register 4B TGR4B R/W H'FFFF H'FE9A Timer control register 5 TCR5 R/W H'00 H'FEA0 Timer mode register 5 TMDR5 R/W H'C0 H'FEA1 Timer I/O control register 5 TIOR5 R/W H'00 H'FEA2 Timer interrupt enable register 5 TIER5 R/W H'FEA4 Timer status register 5 TSR5 H'40 2 * R/(W) H'C0 Timer counter 5 TCNT5 R/W H'0000 H'FEA6 Timer general register 5A TGR5A R/W H'FFFF H'FEA8 Timer general register 5B TGR5B R/W H'FFFF H'FEAA Timer start register TSTR R/W H'00 H'FFC0 H'FEA5 Timer syncro register TSYR R/W H'00 H'FFC1 Module stop control register MSTPCR R/W H'3FFF H'FF3C Rev. 4.0, 03/03, page 1155 of 1358 Module Register Abbreviation R/W 1 Initial Value Address* PPG PPG output control register PCR R/W H'FF H'FF46 PPG output mode register PMR R/W H'F0 H'FF47 Next data enable register H NDERH R/W H'00 H'FF48 Next data enable register L NDERL R/W H'00 H'FF49 H'FF4A 9 H'FF4C* H'FF4E 9 H'FF4D* H'FF4F 8-bit timer 0 8-bit timer 1 Both 8-bit timer channels R/(W) *8 Output data register H PODRH Output data register L PODRL H'00 8 * R/(W) H'00 Next data register H NDRH R/W H'00 Next data register L NDRL R/W H'00 Port 1 data direction register P1DDR W H'00 H'FEB0 Port 2 data direction register P2DDR W H'00 H'FEB1 Module stop control register MSTPCR R/W H'3FFF H'FF3C Timer control register 0 TCR0 R/W H'00 H'FFB0 Timer control/status register 0 TCSR0 R/(W)* H'00 H'FFB2 Timer constant register A0 TCORA0 R/W H'FF H'FFB4 Timer constant register B0 TCORB0 R/W H'FF H'FFB6 Timer counter 0 TCNT0 R/W H'00 H'FFB8 Timer control register 1 TCR1 R/W H'00 H'FFB1 H'10 H'FFB3 10 *10 H'FF4B Timer control/status register 1 TCSR1 R/(W) Timer constant register A1 TCORA1 R/W H'FF H'FFB5 Timer constant register B1 TCORB1 R/W H'FF H'FFB7 Timer counter 1 TCNT1 R/W H'00 H'FFB9 Module stop control register MSTPCR R/W H'3FFF H'FF3C Rev. 4.0, 03/03, page 1156 of 1358 Module Register Abbreviation R/W WDT Timer control/status register TCSR 1 Initial Value Address* 12 R/(W)* H'18 H'FFBC: 11 Write* H'FFBC: Read Timer counter TCNT R/W H'00 H'FFBC: 8 Write* H'FFBD: Read Reset control/status register RSTCSR 12 R/(W)* H'1F H'FFBE: 11 Write* H'FFBF: Read SCI0 SCI1 SCI2 All SCI channels Serial mode register 0 SMR0 R/W H'00 H'FF78 Bit rate register 0 BRR0 R/W H'FF H'FF79 Serial control register 0 SCR0 R/W H'00 H'FF7A Transmit data register 0 TDR0 R/W H'FF H'FF7B Serial status register 0 SSR0 R/(W)* H'84 H'FF7C Receive data register 0 RDR0 R H'00 H'FF7D Smart card mode register 0 SCMR0 R/W H'F2 H'FF7E Serial mode register 1 SMR1 R/W H'00 H'FF80 2 Bit rate register 1 BRR1 R/W H'FF H'FF81 Serial control register 1 SCR1 R/W H'00 H'FF82 Transmit data register 1 TDR1 R/W H'FF H'FF83 H'84 H'FF84 H'00 H'FF85 *2 Serial status register 1 SSR1 R/(W) Receive data register 1 RDR1 R Smart card mode register 1 SCMR1 R/W H'F2 H'FF86 Serial mode register 2 SMR2 R/W H'00 H'FF88 Bit rate register 2 BRR2 R/W H'FF H'FF89 Serial control register 2 SCR2 R/W H'00 H'FF8A Transmit data register 2 TDR2 R/W H'FF8B Serial status register 2 SSR2 H'FF 2 * R/(W) H'84 H'FF8C Receive data register 2 RDR2 R H'00 H'FF8D Smart card mode register 2 SCMR2 R/W H'F2 H'FF8E Module stop control register MSTPCR R/W H'3FFF H'FF3C Rev. 4.0, 03/03, page 1157 of 1358 Module Register Abbreviation R/W 1 Initial Value Address* SMCI0 Serial mode register 0 SMR0 R/W H'00 H'FF78 Bit rate register 0 BRR0 R/W H'FF H'FF79 Serial control register 0 SCR0 R/W H'00 H'FF7A Transmit data register 0 TDR0 R/W H'FF H'FF7B Serial status register 0 SSR0 R/(W)* H'84 H'FF7C Receive data register 0 RDR0 R H'00 H'FF7D Smart card mode register SCMR0 R/W H'F2 H'FF7E SMCI1 SMCI2 2 Serial mode register 1 SMR1 R/W H'00 H'FF80 Bit rate register 1 BRR1 R/W H'FF H'FF81 Serial control register 1 SCR1 R/W H'00 H'FF82 Transmit data register 1 TDR1 R/W H'FF83 Serial status register 1 SSR1 H'FF 2 * R/(W) H'84 H'FF84 Receive data register 1 RDR1 R H'00 H'FF85 Smart card mode register 1 SCMR1 R/W H'F2 H'FF86 Serial mode register 2 SMR2 R/W H'00 H'FF88 Bit rate register 2 BRR2 R/W H'FF H'FF89 Serial control register 2 SCR2 R/W H'00 H'FF8A Transmit data register 2 TDR2 R/W H'FF H'FF8B Serial status register 2 SSR2 R/(W)* H'84 H'FF8C Receive data register 2 RDR2 R H'00 H'FF8D Smart card mode register 2 SCMR2 R/W H'00 H'FF8E All SMCI channels Module stop control register MSTPCR R/W H'3FFF H'FF3C ADC A/D data register AH ADDRAH R H'00 H'FF90 A/D data register AL ADDRAL R H'00 H'FF91 A/D data register BH ADDRBH R H'00 H'FF92 A/D data register BL ADDRBL R H'00 H'FF93 A/D data register CH ADDRCH R H'00 H'FF94 A/D data register CL ADDRCL R H'00 H'FF95 A/D data register DH ADDRDH R H'00 H'FF96 A/D data register DL ADDRDL R H'FF97 A/D control/status register ADCSR H'00 12 * R/(W) H'00 A/D control register ADCR R/W H'3F H'FF99 Module stop control register MSTPCR R/W H'3FFF H'FF3C Rev. 4.0, 03/03, page 1158 of 1358 2 H'FF98 Module Register Abbreviation R/W 1 Initial Value Address* DAC D/A data register 0 DADR0 R/W H'00 H'FFA4 D/A data register 1 DADR1 R/W H'00 H'FFA5 D/A control register 01 DACR01 R/W H'1F H'FFA6 Module stop control register MSTPCR R/W H'3FFF H'FF3C On-chip RAM System control register SYSCR R/W H'01 H'FF39 Flash memory Flash memory control register 1 FLMCR1* 17 FLMCR2* Flash memory control register 2 Erase block register 1 17 17 EBR1* 17 EBR2* 14 15 R/W * H'00/H'80* 14 R/W * H'00 14 16 R/W * H'00* 14 16 13 H'FFC8* 13 H'FFC9* 13 H'FFCA* 13 H'FFCB* R/W * H'00* R/W H'80 R/W H'00 R/W H'00 20 FKEY* 20 FMATS* R/W 21 H'00/H'AA* R/W H'00 Flash transfer destination address register 20 FTDAR* R/W H'00 RAM emulation register 24 RAMER* 18 SYSCR2* R/W H'00 H'FEDB R/W H'00 H'FF42 Clock pulse System clock control register generator SCKCR R/W H'00 H'FF3A Powerdown mode Standby control register SBYCR R/W H'08 H'FF38 System clock control register SCKCR R/W H'00 H'FF3A Module stop control register H MSTPCRH R/W H'3F H'FF3C Module stop control register L MSTPCRL R/W H'FF H'FF3D Port 1 data direction register P1DDR W H'00 H'FEB0 Port 1 data register P1DR R/W H'00 H'FF60 Erase block register 2 20 FCCS* 20 Flash program code select register FPCS* 20 Flash erase code select register FECS* Flash code control status register Flash key code register Flash MAT select register System control register 2 Port 1 Port 2 13 H'FFC4* 13 H'FFC5* 13 H'FFC6* 13 H'FFC8* 13 H'FFC9* 13 H'FFCA* Port 1 register PORT1 R Undefined H'FF50 Port 2 data direction register P2DDR W H'00 H'FEB1 Port 2 data register P2DR R/W H'00 H'FF61 Port 2 register PORT2 R Undefined H'FF51 Rev. 4.0, 03/03, page 1159 of 1358 Module Register Abbreviation R/W 1 Initial Value Address* Port 3 Port 3 data direction register P3DDR W H'00 H'FEB2 Port 3 data register P3DR R/W H'00 H'FF62 Port 3 register PORT3 R Undefined H'FF52 Port 3 open drain control register P3ODR R/W H'00 H'FF76 Port 4 Port 4 register PORT4 R H'FF53 Port 5 Port 5 data direction register P5DDR W Undefined 19 H'0* R/W 19 H'0* H'FF64 Port 5 data register Port 6 Port A Port B Port C Port D P5DR H'FEB4 Port 5 register PORT5 R Undefined H'FF54 Port function control register 2 PFCR2 R/W H'30 H'FFAC System control register SYSCR R/W H'01 H'FF39 Port 6 data direction register P6DDR W H'00 H'FEB5 Port 6 data register P6DR R/W H'00 H'FF65 Port 6 register PORT6 R Undefined H'FF55 Port function control register 2 PFCR2 R/W H'30 H'FFAC Port A data direction register PADDR W H'00 H'FEB9 Port A data register PADR R/W H'00 H'FF69 Port A register PORTA R Undefined H'FF59 Port A MOS pull-up control register PAPCR R/W H'00 H'FF70 Port A open drain control register PAODR R/W H'00 H'FF77 Port function control register 1 PFCR1 R/W H'0F H'FF45 Port B data direction register PBDDR W H'00 H'FEBA Port B data register PBDR R/W H'00 H'FF6A Port B register PORTB R Undefined H'FF5A Port B MOS pull-up control register PBPCR R/W H'00 H'FF71 Port C data direction register PCDDR W H'00 H'FEBB Port C data register PCDR R/W H'00 H'FF6B Port C register PORTC R Undefined H'FF5B Port C MOS pull-up control register PCPCR R/W H'00 H'FF72 Port D data direction register PDDDR W H'00 H'FEBC Port D data register PDDR R/W H'00 H'FF6C Port D register PORTD R Undefined H'FF5C R/W H'00 H'FF73 Port D MOS pull-up control register PDPCR Rev. 4.0, 03/03, page 1160 of 1358 Module Register Abbreviation R/W 1 Initial Value Address* Port E Port E data direction register PEDDR W H'00 H'FEBD Port E data register PEDR R/W H'00 H'FF6D Port E register PORTE Port F Port G Notes: *1 *2 *3 *4 *5 *6 *7 *8 *9 *10 *11 *12 *13 *14 *15 R Undefined H'FF5D Port E MOS pull-up control register PEPCR R/W H'00 H'FF74 Port F data direction register PFDDR W H'80/H'00* H'FEBE Port F data register PFDR R/W H'00 H'FF6E Port F register PORTF R Undefined H'FF5E 22 Port function control register 2 PFCR2 R/W H'30 H'FFAC System control register SYSCR R/W H'01 H'FF39 Port G data direction register PGDDR W H'10/H'00 *22 *23 H'FEBF Port G data register PGDR R/W H'00* 23 Port G register PORTG R H'FF6F 23 * Undefined H'FF5F Port function control register 2 PFCR2 R/W H'30 H'FFAC Lower 16 bits of the address. Only 0 can be written for flag clearing. Registers in the DTC cannot be read or written to directly. Located as register information in on-chip RAM addresses H'EBC0 to H'EFBF. Cannot be located in external memory space. Do not clear the RAME bit in SYSCR to 0 when using the DTC. Determined by the MCU operating mode. Reserved in the H8S/2321. The DMAC is not supported in the H8S/2321. Bits used for pulse output cannot be written to. If the pulse output group 2 and pulse output group 3 output triggers are the same according to the PCR setting, the NDRH address will be H'FF4C, and if different, the address of NDRH for group 2 will be H'FF4E, and that for group 3 will be H'FF4C. Similarly, if the pulse output group 0 and pulse output group 1 output triggers are the same according to the PCR setting, the NDRL address will be H'FF4D, and if different, the address of NDRL for group 0 will be H'FF4F, and that for group 1 will be H'FF4D. Only 0 can be written to bits 7 to 5, to clear the flags. For information on writing, see section 13.2.4, Notes on Register Access. Only 0 can be written to bit 7, to clear the flag. Flash memory registers selection is performed by means of the FLSHE bit in system control register 2 (SYSCR2). In modes in which the on-chip flash memory is disabled, a read will return H'00, and writes are invalid. Writes are also disabled when the FWE bit in FLMCR1 is cleared to 0 (except in the H8S/2329 F-ZTAT). In the H8S/2328 F-ZTAT and H8S/2326 F-ZTAT, the initial value when a high level is input to the FWE is H'80. The initial value in the H8S/2329 F-ZTAT is H'80. Rev. 4.0, 03/03, page 1161 of 1358 *16 In the H8S/2328 F-ZTAT, this register is initialized to H'00 when a low level is input to the FWE pin, or when a high level is input to the FWE pin when the SWE bit in FLMCR1 is not set. In the H8S/2329 F-ZTAT, this register is initialized to H'00 when the SWE bit in FLMCR1 is not set. In the H8S/2326 F-ZTAT, bits EB11 to EB0 are initialized to 0 when a low level is input to the FWE pin, or a high level is input and the SWE1 bit in FLMCR1 is not set. Bits EB15 to EB12 are initialized to 0 when a low level is input to the FWE pin, or a high level is input and the SWE2 bit is not set. *17 FLMCR1, FLMCR2, EBR1, and EBR2 are 8-bit registers. Only byte access can be used on these registers, with the access requiring two states. (Applies to the H8S/2329 F-ZTAT, H8S/2328 F-ZTAT, and H8S/2326 F-ZTAT.) *18 The SYSCR2 register can only be used in the F-ZTAT versions. In the mask ROM versions this register will return an undefined value if read, and cannot be written to. *19 Value of bits 3 to 0. *20 Applies to the H8S/2326C F-ZTAT only. Can be accessed when on-chip flash memory is valid. *21 In user mode or user program mode, the initial value when wake up is H'00. In user boot mode, the initial value when wake up is H'AA. *22 The initial value depends on the mode. *23 Value of bits 4 to 0. *24 Valid only in the F-ZTAT versions. Rev. 4.0, 03/03, page 1162 of 1358 B.3 Functions MRA--DTC Mode Register A Bit DTC 7 6 5 4 3 2 1 0 SM1 SM0 DM1 DM0 MD1 MD0 DTS Sz : Initial value : H'F800--H'FBFF Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Read/Write : DTC Data Transfer Size 0 Byte-size transfer 1 Word-size transfer DTC Transfer Mode Select 0 Destination side is repeat area or block area 1 Source side is repeat area or block area DTC Mode 0 1 0 Normal mode 1 Repeat mode 0 Block transfer mode 1 Destination Address Mode 0 1 DAR is fixed 0 DAR is incremented after a transfer (by +1 when Sz = 0; by +2 when Sz = 1) 1 DAR is decremented after a transfer (by 1 when Sz = 0; by 2 when Sz = 1) Source Address Mode 0 1 SAR is fixed 0 SAR is incremented after a transfer (by +1 when Sz = 0; by +2 when Sz = 1) 1 SAR is decremented after a transfer (by 1 when Sz = 0; by 2 when Sz = 1) Rev. 4.0, 03/03, page 1163 of 1358 MRB--DTC Mode Register B Bit : Initial value : H'F800--H'FBFF 7 6 5 CHNE DISEL CHNS 4 3 DTC 2 1 0 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Read/Write : Reserved Only 0 should be written to these bits DTC Chain Transfer Select DTC Interrupt Select 0 After DTC data transfer ends, the CPU interrupt is disabled unless the transfer counter is 0 1 After DTC data transfer ends, the CPU interrupt is enabled DTC Chain Transfer Enable CHNE CHNS Description No chain transfer. (At end of DTC data transfer, DTC waits for activation) 0 1 0 Chain transfer every time 1 1 Chain transfer only when transfer counter = 0 SAR--DTC Source Address Register Bit : 23 22 21 20 19 H'F800--H'FBFF --- 4 DTC 3 2 1 0 --Initial value : Unde- Unde- Unde- Unde- Undefined fined fined fined fined Read/Write : --- Unde- Unde- Unde- Unde- Undefined fined fined fined fined --Specifies DTC transfer data source address DAR--DTC Destination Address Register Bit : 23 22 21 20 19 H'F800--H'FBFF --- 4 DTC 3 2 1 0 --Initial value : Unde- Unde- Unde- Unde- Undefined fined fined fined fined Read/Write : --- Unde- Unde- Unde- Unde- Undefined fined fined fined fined --Specifies DTC transfer data destination address Rev. 4.0, 03/03, page 1164 of 1358 CRA--DTC Transfer Count Register A Bit 15 : Initial value : 14 13 12 11 H'F800--H'FBFF 10 9 8 7 6 5 4 DTC 3 2 1 0 Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Undefined fined fined fined fined fined fined fined fined fined fined fined fined fined fined fined Read/Write : CRAH CRAL Specifies the number of DTC data transfers CRB--DTC Transfer Count Register B Bit : Initial value : 15 14 13 12 11 H'F800--H'FBFF 10 9 8 7 6 5 4 DTC 3 2 1 0 Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Undefined fined fined fined fined fined fined fined fined fined fined fined fined fined fined fined Read/Write : Specifies the number of DTC block data transfers Rev. 4.0, 03/03, page 1165 of 1358 TCR3--Timer Control Register 3 Bit : 7 6 5 CCLR2 CCLR1 CCLR0 H'FE80 4 3 CKEG1 CKEG0 TPU3 2 1 0 TPSC2 TPSC1 TPSC0 Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Timer Prescaler 0 0 1 1 0 1 0 Internal clock: counts on f/1 1 Internal clock: counts on f/4 0 Internal clock: counts on f/16 1 Internal clock: counts on f/64 0 External clock: counts on TCLKA pin input 1 Internal clock: counts on f/1024 0 Internal clock: counts on f/256 1 Internal clock: counts on f/4096 Clock Edge 0 0 Count at rising edge 1 Count at falling edge 1 Count at both edges Counter Clear 0 0 1 1 0 1 0 TCNT clearing disabled 1 TCNT cleared by TGRA compare match/input capture 0 TCNT cleared by TGRB compare match/input capture 1 TCNT cleared by counter clearing for another channel performing synchronous clearing/synchronous operation *1 0 TCNT clearing disabled 1 TCNT cleared by TGRC compare match/input capture *2 0 TCNT cleared by TGRD compare match/input capture *2 1 TCNT cleared by counter clearing for another channel performing synchronous clearing/synchronous operation *1 Notes: *1 Synchronous operation setting is performed by setting the SYNC bit in TSYR to 1. *2 When TGRC or TGRD is used as a buffer register, TCNT is not cleared because the buffer register setting has priority, and compare match/input capture does not occur. Rev. 4.0, 03/03, page 1166 of 1358 TMDR3--Timer Mode Register 3 : 7 6 Initial value : 1 1 Bit Read/Write : H'FE81 TPU3 5 4 3 2 1 0 BFB BFA MD3 MD2 MD1 MD0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W Mode 0 0 0 1 1 0 1 1 * * 0 Normal operation 1 Reserved 0 PWM mode 1 1 PWM mode 2 0 Phase counting mode 1 1 Phase counting mode 2 0 Phase counting mode 3 1 Phase counting mode 4 * * : Don t care Notes: *1 MD3 is a reserved bit. In a write, it should always be written with 0. *2 Phase counting mode cannot be set for channels 0 and 3. In this case, 0 should always be written to MD2. Buffer Operation A 0 TGRA operates normally 1 TGRA and TGRC used together for buffer operation Buffer Operation B 0 TGRB operates normally 1 TGRB and TGRD used together for buffer operation Rev. 4.0, 03/03, page 1167 of 1358 TIOR3H--Timer I/O Control Register 3H H'FE82 TPU3 7 6 5 4 3 2 1 0 Initial value : IOB3 IOB2 IOB1 IOB0 IOA3 IOA2 IOA1 IOA0 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Bit : TGR3A I/O Control 0 0 0 0 1 1 0 TGR3A Output disabled is output compare Initial output is register 0 output 1 1 0 1 Toggle output at compare match 0 Output disabled 1 Initial output is 1 output 0 1 1 0 0 0 1 1 1 * * * 0 output at compare match 1 output at compare match 0 output at compare match 1 output at compare match Toggle output at compare match TGR3A is input capture register Capture input source is TIOCA3 pin Input capture at rising edge Input capture at falling edge Input capture at both edges Capture input Input capture at TCNT4 count-up/ source is channel count-down 4/count clock * : Don t care TGR3B I/O Control 0 0 0 0 1 1 0 TGR3B Output disabled is output compare Initial output is register 0 output 1 1 0 1 Toggle output at compare match 0 Output disabled 1 Initial output is 1 output 0 1 1 0 0 0 1 1 1 * * * 0 output at compare match 1 output at compare match 0 output at compare match 1 output at compare match Toggle output at compare match TGR3B is input capture register Capture input source is TIOCB3 pin Input capture at rising edge Capture input source is channel 4/count clock Input capture at TCNT4 count-up/ count-down*1 Input capture at falling edge Input capture at both edges * : Don t care Note: *1 When bits TPSC2 to TPSC0 in TCR4 are set to B'000, and f/1 is used as the TCNT4 count clock, this setting is invalid and input capture does not occur. Rev. 4.0, 03/03, page 1168 of 1358 TIOR3L--Timer I/O Control Register 3L Bit : H'FE83 TPU3 7 6 5 4 3 2 1 0 IOD3 IOD2 IOD1 IOD0 IOC3 IOC2 IOC1 IOC0 Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W TGR3C I/O Control 0 0 0 1 1 0 1 1 0 1 0 TGR3C Output disabled is output 1 compare Initial output is 1 0 output 0 register* 1 output at compare match 1 Toggle output at compare match 0 Output disabled 1 Initial output is 1 output 0 0 output at compare match 0 output at compare match 1 output at compare match 1 Toggle output at compare match Input capture at rising edge 1 0 TGR3C Capture input is input source is 1 capture TIOCC pin 3 1 * register* * * 0 Input capture at falling edge Input capture at both edges Capture input Input capture at TCNT4 count-up/ source is channel count-down 4/count clock * : Don t care Note: *1 When the BFA bit in TMDR3 is set to 1 and TGR3C is used as a buffer register, this setting is invalid and input capture/output compare does not occur. TGR3D I/O Control 0 0 0 0 1 1 0 1 1 0 1 TGR3D Output disabled is output Initial output is 0 0 output at compare match compare output register 1 output at compare match *2 Toggle output at compare match 0 Output disabled 1 Initial output is 1 output 0 1 1 0 0 0 1 1 1 * * * 0 output at compare match 1 output at compare match Toggle output at compare match TGR3D is input capture register *2 Capture input source is TIOCD3 pin Input capture at rising edge Input capture at falling edge Input capture at both edges Capture input source is channel 4/count clock Input capture at TCNT4 count-up/ count-down*1 * : Don t care Notes: *1 When bits TPSC2 to TPSC0 in TCR4 are set to B'000 and f/1 is used as the TCNT4 count clock, this setting is invalid and input capture does not occur. *2 When the BFB bit in TMDR3 is set to 1 and TGR3D is used as a buffer register, this setting is invalid and input capture/output compare does not occur. Note: When TGRC or TGRD is designated for buffer operation, this setting is invalid and the register operates as a buffer register. Rev. 4.0, 03/03, page 1169 of 1358 TIER3--Timer Interrupt Enable Register 3 Bit : 7 6 5 TTGE Initial value : 0 Read/Write : R/W 1 0 H'FE84 TPU3 4 3 2 1 0 TCIEV TGIED TGIEC TGIEB TGIEA 0 0 0 0 0 R/W R/W R/W R/W R/W TGR Interrupt Enable A 0 Interrupt request (TGIA) by TGFA bit disabled 1 Interrupt request (TGIA) by TGFA bit enabled TGR Interrupt Enable B 0 Interrupt request (TGIB) by TGFB bit disabled 1 Interrupt request (TGIB) by TGFB bit enabled TGR Interrupt Enable C 0 Interrupt request (TGIC) by TGFC bit disabled 1 Interrupt request (TGIC) by TGFC bit enabled TGR Interrupt Enable D 0 Interrupt request (TGID) by TGFD bit disabled 1 Interrupt request (TGID) by TGFD bit enabled Overflow Interrupt Enable 0 Interrupt request (TCIV) by TCFV disabled 1 Interrupt request (TCIV) by TCFV enabled A/D Conversion Start Request Enable 0 A/D conversion start request generation disabled 1 A/D conversion start request generation enabled Rev. 4.0, 03/03, page 1170 of 1358 TSR3--Timer Status Register 3 Bit : Initial value : Read/Write : 7 1 6 1 5 0 H'FE85 TPU3 4 3 2 1 0 TCFV TGFD TGFC TGFB TGFA 0 0 0 0 0 R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* Input Capture/Output Compare Flag A 0 [Clearing conditions] When DTC is activated by TGIA interrupt while DISEL bit of MRB in DTC is 0 When DMAC is activated by TGIA interrupt while DTA bit of DMABCR in DMAC*1 is 1 When 0 is written to TGFA after reading TGFA = 1 1 [Setting conditions] When TCNT=TGRA while TGRA is functioning as output compare register When TCNT value is transferred to TGRA by input capture signal while TGRA is functioning as input capture register Note: *1 The DMAC is not supported in the H8S/2321. Input Capture/Output Compare Flag B 0 [Clearing conditions] When DTC is activated by TGIB interrupt while DISEL bit of MRB in DTC is 0 When 0 is written to TGFB after reading TGFB = 1 1 [Setting conditions] When TCNT = TGRB while TGRB is functioning as output compare register When TCNT value is transferred to TGRB by input capture signal while TGRB is functioning as input capture register Input Capture/Output Compare Flag C 0 [Clearing conditions] When DTC is activated by TGIC interrupt while DISEL bit of MRB in DTC is 0 When 0 is written to TGFC after reading TGFC = 1 1 [Setting conditions] When TCNT = TGRC while TGRC is functioning as output compare register When TCNT value is transferred to TGRC by input capture signal while TGRC is functioning as input capture register Input Capture/Output Compare Flag D 0 [Clearing conditions] When DTC is activated by TGID interrupt while DISEL bit of MRB in DTC is 0 When 0 is written to TGFD after reading TGFD = 1 1 [Setting conditions] When TCNT = TGRD while TGRD is functioning as output compare register When TCNT value is transferred to TGRD by input capture signal while TGRD is functioning as input capture register Overflow Flag 0 [Clearing condition] When 0 is written to TCFV after reading TCFV = 1 1 [Setting condition] When the TCNT value overflows (changes from H'FFFF to H'0000 ) Note: * Can only be written with 0 for flag clearing. Rev. 4.0, 03/03, page 1171 of 1358 TCNT3--Timer Counter 3 Bit : Initial value : Read/Write : H'FE86 TPU3 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Up-counter TGR3A--Timer General Register 3A TGR3B--Timer General Register 3B TGR3C--Timer General Register 3C TGR3D--Timer General Register 3D Bit : Initial value : Read/Write : H'FE88 H'FE8A H'FE8C H'FE8E TPU3 TPU3 TPU3 TPU3 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Rev. 4.0, 03/03, page 1172 of 1358 TCR4--Timer Control Register 4 Bit : Initial value : 7 0 Read/Write : H'FE90 TPU4 6 5 4 3 2 1 0 CCLR1 CCLR0 CKEG1 CKEG0 TPSC2 TPSC1 TPSC0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W Timer Prescaler 0 0 1 1 0 1 0 Internal clock: counts on f/1 1 Internal clock: counts on f/4 0 Internal clock: counts on f/16 1 Internal clock: counts on f/64 0 External clock: counts on TCLKA pin input 1 External clock: counts on TCLKC pin input 0 Internal clock: counts on f/1024 1 Counts on TCNT5 overflow/underflow Note: This setting is ignored when channel 4 is in phase counting mode. Clock Edge 0 1 Counter Clear 0 1 0 Count at rising edge 1 Count at falling edge Count at both edges Note: This setting is ignored when channel 4 is in phase counting mode. 0 TCNT clearing disabled 1 TCNT cleared by TGRA compare match/input capture 0 TCNT cleared by TGRB compare match/input capture 1 TCNT cleared by counter clearing for another channel performing synchronous clearing/synchronous operation* Note: * Synchronous operation setting is performed by setting the SYNC bit in TSYR to 1. Rev. 4.0, 03/03, page 1173 of 1358 TMDR4--Timer Mode Register 4 Bit : Initial value : 7 1 6 1 Read/Write : H'FE91 5 0 4 0 TPU4 3 2 1 0 MD3 MD2 MD1 MD0 0 0 0 0 R/W R/W R/W R/W Mode 0 0 0 1 1 0 1 1 * * 0 Normal operation 1 Reserved 0 PWM mode 1 1 PWM mode 2 0 Phase counting mode 1 1 Phase counting mode 2 0 Phase counting mode 3 1 Phase counting mode 4 * * : Don t care Note: MD3 is a reserved bit. In a write, it should always be written with 0. Rev. 4.0, 03/03, page 1174 of 1358 TIOR4--Timer I/O Control Register 4 Bit H'FE92 TPU4 7 6 5 4 3 2 1 0 IOB3 IOB2 IOB1 IOB0 IOA3 IOA2 IOA1 IOA0 : Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W TGR4A I/O Control 0 0 0 1 1 0 1 0 TGR4A Output disabled is output 1 compare Initial output is 0 output 0 register 0 output at compare match 1 Toggle output at compare match 0 Output disabled 1 Initial output is 1 output 0 1 1 0 0 0 1 1 1 * * * 1 output at compare match 0 output at compare match 1 output at compare match Toggle output at compare match TGR4A is input capture register Capture input source is TIOCA4 pin Input capture at rising edge Input capture at falling edge Input capture at both edges Capture input Input capture at generation of source is TGR3A TGR3A compare match/input compare match/ capture input capture * : Don t care TGR4B I/O Control 0 0 0 1 1 0 1 0 TGR4B Output disabled is output 1 compare Initial output is 0 output 0 register 0 output at compare match 1 Toggle output at compare match 0 Output disabled 1 Initial output is 1 output 0 1 1 0 0 0 1 1 1 * * * 1 output at compare match 0 output at compare match 1 output at compare match Toggle output at compare match TGR4B is input capture register Capture input source is TIOCB4 pin Input capture at rising edge Input capture at falling edge Input capture at both edges Capture input Input capture at generation of source is TGR3C TGR3C compare match/input compare match/ capture input capture * : Don t care Rev. 4.0, 03/03, page 1175 of 1358 TIER4--Timer Interrupt Enable Register 4 Bit : 7 6 TTGE Initial value : 0 Read/Write : R/W 1 5 4 TCIEU TCIEV H'FE94 3 0 0 R/W R/W 0 2 0 TPU4 1 0 TGIEB TGIEA 0 0 R/W R/W TGR Interrupt Enable A 0 Interrupt request (TGIA) by TGFA bit disabled 1 Interrupt request (TGIA) by TGFA bit enabled TGR Interrupt Enable B 0 Interrupt request (TGIB) by TGFB bit disabled 1 Interrupt request (TGIB) by TGFB bit enabled Overflow Interrupt Enable 0 Interrupt request (TCIV) by TCFV disabled 1 Interrupt request (TCIV) by TCFV enabled Underflow Interrupt Enable 0 Interrupt request (TCIU) by TCFU disabled 1 Interrupt request (TCIU) by TCFU enabled A/D Conversion Start Request Enable 0 A/D conversion start request generation disabled 1 A/D conversion start request generation enabled Rev. 4.0, 03/03, page 1176 of 1358 TSR4--Timer Status Register 4 Bit : 7 6 TCFD Initial value : 1 Read/Write : R 1 H'FE95 5 4 TCFU TCFV 3 0 0 R/(W)* R/(W)* 0 2 0 TPU4 1 0 TGFB TGFA 0 0 R/(W)* R/(W)* Input Capture/Output Compare Flag A 0 [Clearing conditions] When DTC is activated by TGIA interrupt while DISEL bit of MRB in DTC is 0 When DMAC is activated by TGIA interrupt while DTA bit of DMABCR in DMAC*1 is 1 When 0 is written to TGFA after reading TGFA = 1 1 [Setting conditions] When TCNT = TGRA while TGRA is functioning as output compare register When TCNT value is transferred to TGRA by input capture signal while TGRA is functioning as input capture register Note: *1 The DMAC is not supported in the H8S/2321. Input Capture/Output Compare Flag B 0 [Clearing conditions] When DTC is activated by TGIB interrupt while DISEL bit of MRB in DTC is 0 When 0 is written to TGFB after reading TGFB = 1 1 [Setting conditions] When TCNT = TGRB while TGRB is functioning as output compare register When TCNT value is transferred to TGRB by input capture signal while TGRB is functioning as input capture register Overflow Flag 0 [Clearing condition] When 0 is written to TCFV after reading TCFV = 1 1 [Setting condition] When the TCNT value overflows (changes from H'FFFF to H'0000) Underflow Flag 0 [Clearing condition] When 0 is written to TCFU after reading TCFU = 1 1 [Setting condition] When the TCNT value underflows (changes from H'0000 to H'FFFF) Count Direction Flag 0 TCNT counts down 1 TCNT counts up Note: * Can only be written with 0 for flag clearing. Rev. 4.0, 03/03, page 1177 of 1358 TCNT4--Timer Counter 4 Bit : Initial value : Read/Write : H'FE96 TPU4 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Up/down-counter* Note: * This timer counter can be used as an up/down-counter only in phase counting mode or when performing overflow/underflow counting on another channel. In other cases it functions as an up-counter. TGR4A--Timer General Register 4A TGR4B--Timer General Register 4B Bit H'FE98 H'FE9A TPU4 TPU4 : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Initial value : 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Rev. 4.0, 03/03, page 1178 of 1358 TCR5--Timer Control Register 5 Bit : Initial value : 7 0 Read/Write : H'FEA0 6 5 CCLR1 CCLR0 4 3 0 0 0 R/W R/W R/W TPU5 2 1 0 TPSC2 TPSC1 TPSC0 0 0 0 0 R/W R/W R/W R/W CKEG1 CKEG0 Time Prescaler 0 0 1 1 0 1 0 Internal clock: counts on f/1 1 Internal clock: counts on f/4 0 Internal clock: counts on f/16 1 Internal clock: counts on f/64 0 External clock: counts on TCLKA pin input 1 External clock: counts on TCLKC pin input 0 Internal clock: counts on f/256 1 External clock: counts on TCLKD pin input Note: This setting is ignored when channel 5 is in phase counting mode. Clock Edge 0 0 Count at rising edge 1 Count at falling edge 1 Count at both edges Note: This setting is ignored when channel 5 is in phase counting mode. Counter Clear 0 1 0 TCNT clearing disabled 1 TCNT cleared by TGRA compare match/input capture 0 TCNT cleared by TGRB compare match/input capture 1 TCNT cleared by counter clearing for another channel performing synchronous clearing/synchronous operation* Note: * Synchronous operation setting is performed by setting the SYNC bit in TSYR to 1. Rev. 4.0, 03/03, page 1179 of 1358 TMDR5--Timer Mode Register 5 H'FEA1 : 7 6 5 4 Initial value : 1 1 0 0 Bit Read/Write : TPU5 3 2 1 0 MD3 MD2 MD1 MD0 0 0 0 0 R/W R/W R/W R/W Mode 0 0 0 1 1 0 1 1 * * 0 Normal operation 1 Reserved 0 PWM mode 1 1 PWM mode 2 0 Phase counting mode 1 1 Phase counting mode 2 0 Phase counting mode 3 1 Phase counting mode 4 * * : Don t care Note: MD3 is a reserved bit. In a write, it should always be written with 0. Rev. 4.0, 03/03, page 1180 of 1358 TIOR5--Timer I/O Control Register 5 Bit H'FEA2 TPU5 7 6 5 4 3 2 1 0 IOB3 IOB2 IOB1 IOB0 IOA3 IOA2 IOA1 IOA0 : Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W TGR5A I/O Control 0 0 0 1 1 0 1 0 TGR5A Output disabled is output 1 compare Initial output is 0 output 0 register 1 output at compare match 1 Toggle output at compare match 0 Output disabled 1 Initial output is 1 output 0 1 1 * 0 1 0 TGR5A is input 1 capture * register 0 output at compare match 0 output at compare match 1 output at compare match Toggle output at compare match Input capture at rising edge Capture input source is TIOCA5 Input capture at falling edge pin Input capture at both edges * : Don t care TGR5B I/O Control 0 0 0 0 1 1 0 TGR5B Output disabled is output compare Initial output is 0 register output Toggle output at compare match 1 1 0 1 0 Output disabled 1 Initial output is 1 output 0 1 1 * 0 0 1 1 * 0 output at compare match 1 output at compare match 0 output at compare match 1 output at compare match Toggle output at compare match TGR5B is input capture register Capture input Input capture at rising edge source is TIOCB5 Input capture at falling edge pin Input capture at both edges * : Don t care Rev. 4.0, 03/03, page 1181 of 1358 TIER5--Timer Interrupt Enable Register 5 Bit : 7 6 TTGE Initial value : 0 Read/Write : R/W 1 5 4 TCIEU TCIEV H'FEA4 3 0 0 0 R/W R/W 2 0 TPU5 1 0 TGIEB TGIEA 0 0 R/W R/W TGR Interrupt Enable A 0 Interrupt request (TGIA) by TGFA bit disabled 1 Interrupt request (TGIA) by TGFA bit enabled TGR Interrupt Enable B 0 Interrupt request (TGIB) by TGFB bit disabled 1 Interrupt request (TGIB) by TGFB bit enabled Overflow Interrupt Enable 0 Interrupt request (TCIV) by TCFV disabled 1 Interrupt request (TCIV) by TCFV enabled Underflow Interrupt Enable 0 Interrupt request (TCIU) by TCFU disabled 1 Interrupt request (TCIU) by TCFU enabled A/D Conversion Start Request Enable 0 A/D conversion start request generation disabled 1 A/D conversion start request generation enabled Rev. 4.0, 03/03, page 1182 of 1358 TSR5--Timer Status Register 5 Bit : 7 6 TCFD Initial value : 1 Read/Write : R 1 H'FEA5 5 4 TCFU TCFV 3 0 0 R/(W)* R/(W)* 0 2 0 1 0 TGFB TGFA 0 0 R/(W)* R/(W)* TPU5 Input Capture/Output Compare Flag A 0 [Clearing conditions] When DTC is activated by TGIA interrupt while DISEL bit of MRB in DTC is 0 When DMAC is activated by TGIA interrupt while DTA bit of DMABCR in DMAC*1 is 1 When 0 is written to TGFA after reading TGFA = 1 1 [Setting conditions] When TCNT = TGRA while TGRA is functioning as output compare register When TCNT value is transferred to TGRA by input capture signal while TGRA is functioning as input capture register Note: *1 The DMAC is not supported in the H8S/2321. Input Capture/Output Compare Flag B 0 [Clearing conditions] When DTC is activated by TGIB interrupt while DISEL bit of MRB in DTC is 0 When 0 is written to TGFB after reading TGFB = 1 1 [Setting conditions] When TCNT = TGRB while TGRB is functioning as output compare register When TCNT value is transferred to TGRB by input capture signal while TGRB is functioning as input capture register Overflow Flag 0 [Clearing condition] When 0 is written to TCFV after reading TCFV = 1 1 [Setting condition] When the TCNT value overflows (changes from H'FFFF to H'0000 ) Underflow Flag 0 [Clearing condition] When 0 is written to TCFU after reading TCFU = 1 1 [Setting condition] When the TCNT value underflows (changes from H'0000 to H'FFFF) Count Direction Flag 0 TCNT counts down 1 TCNT counts up Note: * Can only be written with 0 for flag clearing. Rev. 4.0, 03/03, page 1183 of 1358 TCNT5--Timer Counter 5 H'FEA6 TPU5 : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Initial value : 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Bit Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Up/down-counter* Note: * This timer counter can be used as an up/down-counter only in phase counting mode or when performing overflow/underflow counting on another channel. In other cases it functions as an up-counter. TGR5A--Timer General Register 5A TGR5B--Timer General Register 5B Bit H'FEA8 H'FEAA TPU5 TPU5 : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Initial value : 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W P1DDR--Port 1 Data Direction Register Bit : 7 6 5 H'FEB0 4 3 Port 1 2 1 0 P17DDR P16DDR P15DDR P14DDR P13DDR P12DDR P11DDR P10DDR Initial value : 0 0 0 0 0 0 0 0 Read/Write : W W W W W W W W Specify input or output for individual port 1 pins Rev. 4.0, 03/03, page 1184 of 1358 P2DDR--Port 2 Data Direction Register Bit : 7 6 H'FEB1 5 4 Port 2 3 2 1 0 P27DDR P26DDR P25DDR P24DDR P23DDR P22DDR P21DDR P20DDR Initial value : 0 0 0 0 0 0 0 0 Read/Write : W W W W W W W W Specify input or output for individual port 2 pins P3DDR--Port 3 Data Direction Register Bit : 7 6 H'FEB2 5 4 Port 3 3 2 0 1 P35DDR P34DDR P33DDR P32DDR P31DDR P30DDR Initial value : Undefined Undefined Read/Write : 0 0 0 0 0 0 W W W W W W Specify input or output for individual port 3 pins P5DDR--Port 5 Data Direction Register Bit : 7 6 5 H'FEB4 4 3 Port 5 2 1 0 P53DDR P52DDR P51DDR P50DDR Initial value : Undefined Undefined Undefined Undefined 0 0 0 0 Read/Write : W W W W Specify input or output for individual port 5 pins Rev. 4.0, 03/03, page 1185 of 1358 P6DDR--Port 6 Data Direction Register Bit : 7 6 5 H'FEB5 4 3 Port 6 2 0 1 P67DDR P66DDR P65DDR P64DDR P63DDR P62DDR P61DDR P60DDR Initial value : 0 0 0 0 0 0 0 0 Read/Write : W W W W W W W W Specify input or output for individual port 6 pins PADDR--Port A Data Direction Register Bit : 7 6 5 H'FEB9 4 Port A 3 2 0 1 PA7DDR PA6DDR PA5DDR PA4DDR PA3DDR PA2DDR PA1DDR PA0DDR Initial value : 0 0 0 0 0 0 0 0 Read/Write : W W W W W W W W Specify input or output for individual port A pins PBDDR--Port B Data Direction Register Bit : 7 6 5 H'FEBA 4 3 Port B 2 1 0 PB7DDR PB6DDR PB5DDR PB4DDR PB3DDR PB2DDR PB1DDR PB0DDR Initial value : 0 0 0 0 0 0 0 0 Read/Write : W W W W W W W W Specify input or output for individual port B pins Rev. 4.0, 03/03, page 1186 of 1358 PCDDR--Port C Data Direction Register Bit : 7 6 H'FEBB 5 4 3 Port C 2 1 0 PC7DDR PC6DDR PC5DDR PC4DDR PC3DDR PC2DDR PC1DDR PC0DDR Initial value : 0 0 0 0 0 0 0 0 Read/Write : W W W W W W W W Specify input or output for individual port C pins PDDDR--Port D Data Direction Register Bit 7 : 6 5 H'FEBC 4 3 Port D 2 1 0 PD7DDR PD6DDR PD5DDR PD4DDR PD3DDR PD2DDR PD1DDR PD0DDR Initial value : 0 0 0 0 0 0 0 0 Read/Write : W W W W W W W W Specify input or output for individual port D pins PEDDR--Port E Data Direction Register Bit : 7 6 5 H'FEBD 4 3 Port E 2 1 0 PE7DDR PE6DDR PE5DDR PE4DDR PE3DDR PE2DDR PE1DDR PE0DDR Initial value : 0 0 0 0 0 0 0 0 Read/Write : W W W W W W W W Specify input or output for individual port E pins Rev. 4.0, 03/03, page 1187 of 1358 PFDDR--Port F Data Direction Register Bit : 7 5 6 H'FEBE 4 3 Port F 2 1 0 PF7DDR PF6DDR PF5DDR PF4DDR PF3DDR PF2DDR PF1DDR PF0DDR Modes 4 to 6 Initial value : 1 0 0 0 0 0 0 0 Read/Write : W W W W W W W W Initial value : 0 0 0 0 0 0 0 0 Read/Write : W W W W W W W W Mode 7 Specify input or output for individual port F pins PGDDR--Port G Data Direction Register Bit : 7 6 5 H'FEBF 4 3 Port G 2 1 0 PG4DDR PG3DDR PG2DDR PG1DDR PG0DDR Modes 4 and 5 Initial value : Undefined Undefined Undefined 1 0 0 0 0 Read/Write : W W W W W Modes 6 and 7 Initial value : Undefined Undefined Undefined 0 0 0 0 0 Read/Write : W W W W W Specify input or output for individual port G pins Rev. 4.0, 03/03, page 1188 of 1358 IPRA IPRB IPRC IPRD IPRE IPRF IPRG IPRH IPRI IPRJ IPRK Bit -- -- -- -- -- -- -- -- -- -- -- Interrupt Priority Register A Interrupt Priority Register B Interrupt Priority Register C Interrupt Priority Register D Interrupt Priority Register E Interrupt Priority Register F Interrupt Priority Register G Interrupt Priority Register H Interrupt Priority Register I Interrupt Priority Register J Interrupt Priority Register K : Initial value : 7 0 Read/Write : H'FEC4 H'FEC5 H'FEC6 H'FEC7 H'FEC8 H'FEC9 H'FECA H'FECB H'FECC H'FECD H'FECE 6 5 4 IPR6 IPR5 IPR4 1 1 1 R/W R/W R/W Interrupt Controller Interrupt Controller Interrupt Controller Interrupt Controller Interrupt Controller Interrupt Controller Interrupt Controller Interrupt Controller Interrupt Controller Interrupt Controller Interrupt Controller 3 2 1 0 IPR2 IPR1 IPR0 0 1 1 1 R/W R/W R/W Set priority (levels 7 to 0) for interrupt sources Correspondence between Interrupt Sources and IPR Settings Bits Register 6 to 4 2 to 0 IPRA IRQ0 IRQ1 IPRB IRQ2 IRQ4 IRQ3 IRQ5 IRQ6 DTC IPRC IRQ7 IPRD IPRE WDT *1 Refresh timer*2 A/D converter IPRF TPU channel 0 TPU channel 1 IPRG TPU channel 2 TPU channel 3 IPRH TPU channel 4 TPU channel 5 IPRI 8-bit timer channel 0 8-bit timer channel 1 IPRJ DMAC*2 SCI channel 0 IPRK SCI channel 1 SCI channel 2 Notes: *1 Reserved bits. *2 Reserved bit in the H8S/2321. Rev. 4.0, 03/03, page 1189 of 1358 ABWCR--Bus Width Control Register Bit : H'FED0 Bus Controller 7 6 5 4 3 2 1 0 ABW7 ABW6 ABW5 ABW4 ABW3 ABW2 ABW1 ABW0 Modes 5 to 7 Initial value : 1 1 1 1 1 1 1 1 R/W R/W R/W R/W R/W R/W R/W R/W Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W R/W : Mode 4 Area 7 to 0 Bus Width Control 0 Area n is designated for 16-bit access 1 Area n is designated for 8-bit access (n = 7 to 0) ASTCR--Access State Control Register Bit : H'FED1 Bus Controller 7 6 5 4 3 2 1 0 AST7 AST6 AST5 AST4 AST3 AST2 AST1 AST0 Initial value : 1 1 1 1 1 1 1 1 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Area 7 to 0 Access State Control 0 Area n is designated for 2-state access Wait state insertion in area n external space is disabled 1 Area n is designated for 3-state access Wait state insertion in area n external space is enabled (n = 7 to 0) Rev. 4.0, 03/03, page 1190 of 1358 WCRH--Wait Control Register H Bit : H'FED2 Bus Controller 7 6 5 4 3 2 1 0 W71 W70 W61 W60 W51 W50 W41 W40 Initial value : 1 1 1 1 1 1 1 1 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Area 4 Wait Control 0 1 0 Program wait not inserted 1 1 program wait state inserted 0 2 program wait states inserted 1 3 program wait states inserted Area 5 Wait Control 0 1 0 Program wait not inserted 1 1 program wait state inserted 0 2 program wait states inserted 1 3 program wait states inserted Area 6 Wait Control 0 1 0 Program wait not inserted 1 1 program wait state inserted 0 2 program wait states inserted 1 3 program wait states inserted Area 7 Wait Control 0 1 0 Program wait not inserted 1 1 program wait state inserted 0 2 program wait states inserted 1 3 program wait states inserted Rev. 4.0, 03/03, page 1191 of 1358 WCRL--Wait Control Register L H'FED3 Bus Controller 7 6 5 4 3 2 1 0 W31 W30 W21 W20 W11 W10 W01 W00 Initial value : 1 1 1 1 1 1 1 1 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Bit : Area 0 Wait Control 0 1 0 Program wait not inserted 1 1 program wait state inserted 0 2 program wait states inserted 1 3 program wait states inserted Area 1 Wait Control 0 1 0 Program wait not inserted 1 1 program wait state inserted 0 2 program wait states inserted 1 3 program wait states inserted Area 2 Wait Control 0 1 0 Program wait not inserted 1 1 program wait state inserted 0 2 program wait states inserted 1 3 program wait states inserted Area 3 Wait Control 0 1 0 Program wait not inserted 1 1 program wait state inserted 0 2 program wait states inserted 1 3 program wait states inserted Rev. 4.0, 03/03, page 1192 of 1358 BCRH--Bus Control Register H Bit : 7 6 H'FED4 5 4 3 Bus Controller 2 0 1 ICIS1 ICIS0 Initial value : 1 1 0 1 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W BRSTRM BRSTS1 BRSTS0 RMTS2 RMTS1 RMTS0 RAM Type Select RMTS2 RMTS1 RMTS0 Area 5 Area 4 Area 3 Area 2 0 0 Normal space 0 1 0 DRAM space Normal space 1 Normal space DRAM space DRAM space 1 1 Notes: 1. When areas selected in DRAM space are all 8-bit space, the PF2 pin can be used as an I/O port, BREQO, or WAIT. When PF2 is used as the WAIT pin in the H8S/2323, normal space other than DRAM space should be designated as 16-bit-bus space. RAS down mode cannot be used when this setting is made. Sample settings are shown below. RMTS2 RMTS1 RMTS0 Area 5 Area 4 Area 3 0 0 1 1 0 1 Area 2 Normal space 0 Normal space DRAM space (16-bit bus) (8-bit bus) Normal space DRAM space (16-bit bus) (8-bit bus) DRAM space (8-bit bus) 2. In the H8S/2321 these bits are reserved and should only be written with 0. Burst Cycle Select 0 0 Max. 4 words in burst access 1 Max. 8 words in burst access Burst Cycle Select 1 0 Burst cycle comprises 1 state 1 Burst cycle comprises 2 states Area 0 Burst ROM Enable 0 Basic bus interface 1 Burst ROM interface Idle Cycle Insert 0 0 Idle cycle not inserted in case of successive external read and external write cycles 1 Idle cycle inserted in case of successive external read and external write cycles Idle Cycle Insert 1 0 Idle cycle not inserted in case of successive external read cycles in different areas 1 Idle cycle inserted in case of successive external read cycles in different areas Rev. 4.0, 03/03, page 1193 of 1358 BCRL--Bus Control Register L Bit : H'FED5 7 6 5 4 3 Bus Controller 1 0 WDBE WAITE 2 BRLE BREQOE EAE Initial value : 0 0 1 1 1 1 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W DDS WAIT Pin Enable 0 Wait input by WAIT pin* disabled 1 Wait input by WAIT pin* enabled Note: * The WAIT input pin can be switched between PF2 and P53 by means of WAITPS. Write Data Buffer Enable 0 Write data buffer function not used 1 Write data buffer function used Reserved Only 1 should be written to this bit DACK Timing Select 0 When DMAC single address transfer is performed in DRAM space, full access is always executed. DACK signal goes low from Tr or T1 cycle 1 Burst access is possible when DMAC single address transfer is performed in DRAM space. DACK signal goes low from Tc1 or T2 cycle Note: In the H8S/2321 this bit is reserved and should only be written with 1. Reserved Only 1 should be written to this bit External Addresses H'010000 to H'03FFFF Enable 0 In the H8S/2329, H8S/2328, H8S/2326, and H8S/2326C, addresses H'010000 to H'03FFFF*2 are on-chip ROM In the H8S/2327, addresses H'010000 to H'01FFFF are on-chip ROM, and addresses H'020000 to H'03FFFF are a reserved area*1 In the H8S/2323, addresses H'010000 to H'03FFFF are a reserved area*1 1 Addresses H'010000 to H'03FFFF*2 are external addresses in external expanded mode or reserved area*2 in single-chip mode Notes: *1 Do not access a reserved area. *2 Address H'010000 to H'03FFFF in the H8S/2328. Address H'010000 to H'05FFFF in the H8S/2329. Address H'010000 to H'07FFFF in the H8S/2326 and H8S/2326C. BREQO Pin Enable 0 BREQO output disabled 1 BREQO* output enabled Note: * The BREQO output pin can be switched between PF2 and P53 by means of BREQOPS. Bus Release Enable External bus release disabled 0 1 External bus release enabled Rev. 4.0, 03/03, page 1194 of 1358 MCR--Memory Control Register (Not supported in H8S/2321) Bit 7 6 5 TPC BE RCDM : H'FED6 4 Bus Controller 3 2 1 0 MXC1 MXC0 RLW1 RLW0 Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Refresh Cycle Wait Control 0 1 0 No wait state inserted 1 1 wait state inserted 0 2 wait states inserted 1 3 wait states inserted Multiplex Shift Count 0 1 0 8-bit shift 1 9-bit shift 0 10-bit shift 1 Reserved RAS Down Mode 0 RAS up mode selected for DRAM interface 1 RAS down mode selected for DRAM interface Burst Access Enable 0 Burst disabled (always full access) 1 For DRAM space access, access in fast page mode TP Cycle Control 0 1-state precharge cycle is inserted 1 2-state precharge cycle is inserted Rev. 4.0, 03/03, page 1195 of 1358 DRAMCR--DRAM Control Register (Not supported in H8S/2321) Bit : H'FED7 Bus Controller 7 6 5 4 3 2 1 0 RFSHE RCW RMODE CMF CMIE CKS2 CKS1 CKS0 Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Refresh Counter Clock Select 0 0 1 1 0 1 0 Count operation disabled 1 Count uses f/2 0 Count uses f/8 1 Count uses f/32 0 Count uses f/128 1 Count uses f/512 0 Count uses f/2048 1 Count uses f/4096 Compare Match Interrupt Enable 0 Interrupt request (CMI) by CMF flag disabled 1 Interrupt request (CMI) by CMF flag enabled Compare Match Flag 0 1 [Clearing condition] When 0 is written to CMF after reading CMF = 1 [Setting condition] When RTCNT = RTCOR Refresh Mode 0 Self-refreshing is not performed in software standby mode 1 Self-refreshing is performed in software standby mode RAS-CAS Wait 0 Wait state insertion in CAS-before-RAS refreshing disabled RAS falls in Tr cycle 1 One wait state inserted in CAS-before-RAS refreshing RAS falls in Tc1 cycle Refresh Control 0 Refresh control is not performed 1 Refresh control is performed Rev. 4.0, 03/03, page 1196 of 1358 RTCNT--Refresh Timer Counter (Not supported in H8S/2321) Bit H'FED8 Bus Controller : 7 6 5 4 3 2 1 0 Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Internal clock count value RTCOR--Refresh Time Constant Register (Not supported in H8S/2321) Bit H'FED9 Bus Controller : 7 6 5 4 3 2 1 0 Initial value : 1 1 1 1 1 1 1 1 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Sets the period for compare match operations with RTCNT Rev. 4.0, 03/03, page 1197 of 1358 RAMER--RAM Emulation Register (Valid only in F-ZTAT version) Bit H'FEDB : 7 6 5 4 Initial value : 0 0 0 0 Read/Write : Bus Controller 3 2 1 0 RAMS RAM2 RAM1 RAM0 0 0 0 0 R/W R/W R/W R/W RAM Select, Flash Memory Area Select RAMS RAM2 RAM1 RAM0 0 1 * 0 * 0 1 1 0 1 RAM Area Block Name * H'FFDC00 to H'FFEBFF RAM area, 4 kbytes 0 H'000000 to H'000FFF EB0 (4 kbytes) 1 H'001000 to H'001FFF EB1 (4 kbytes) 0 H'002000 to H'002FFF EB2 (4 kbytes) 1 H'003000 to H'003FFF EB3 (4 kbytes) 0 H'004000 to H'004FFF EB4 (4 kbytes) 1 H'005000 to H'005FFF EB5 (4 kbytes) 0 H'006000 to H'006FFF EB6 (4 kbytes) 1 H'007000 to H'007FFF EB7 (4 kbytes) *: Don't care Rev. 4.0, 03/03, page 1198 of 1358 MAR0AH--Memory Address Register 0AH (Not supported in H8S/2321) MAR0AL--Memory Address Register 0AL (Not supported in H8S/2321) Bit : MAR0AH : Initial value : : MAR0AL : Initial value : DMAC H'FEE2 DMAC 31 30 29 28 27 26 25 24 23 22 21 20 19 18 0 0 0 0 0 0 0 0 * * * * * * 17 16 * * R/W R/W R/W R/W R/W R/W R/W R/W Read/Write : Bit H'FEE0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 * * * * * * * * * * * * * * * * Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W * : Undefined In short address mode: Specifies transfer source/transfer destination address In full address mode: Specifies transfer source address IOAR0A--I/O Address Register 0A (Not supported in H8S/2321) Bit : IOAR0A : Initial value : Read/Write : H'FEE4 DMAC 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 * * * * * * * * * * * * * * * * R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W * : Undefined In short address mode: Specifies transfer source/transfer destination address In full address mode: Not used Rev. 4.0, 03/03, page 1199 of 1358 ETCR0A--Transfer Count Register 0A (Not supported in H8S/2321) Bit : ETCR0A : Initial value : H'FEE6 DMAC 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 * * * * * * * * * * * * * * * * Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Sequential mode Idle mode Normal mode Repeat mode Transfer counter Transfer number storage register Transfer counter Block size storage register Block size counter Block transfer mode * : Undefined MAR0BH--Memory Address Register 0BH (Not supported in H8S/2321) MAR0BL--Memory Address Register 0BL (Not supported in H8S/2321) Bit : MAR0BH : Initial value : : MAR0BL : Initial value : DMAC H'FEEA DMAC 31 30 29 28 27 26 25 24 23 22 21 20 19 18 0 0 0 0 0 0 0 0 * * * * * * Read/Write : Bit H'FEE8 17 16 * * R/W R/W R/W R/W R/W R/W R/W R/W 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 * * * * * * * * * * * * * * * * Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W * : Undefined In short address mode: Specifies transfer source/transfer destination address In full address mode: Specifies transfer destination address Rev. 4.0, 03/03, page 1200 of 1358 IOAR0B--I/O Address Register 0B (Not supported in H8S/2321) Bit : IOAR0B : Initial value : H'FEEC DMAC 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 * * * * * * * * * * * * * * * * Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W * : Undefined In short address mode: Specifies transfer source/transfer destination address In full address mode: Not used ETCR0B--Transfer Count Register 0B (Not supported in H8S/2321) Bit : ETCR0B : Initial value : H'FEEE DMAC 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 * * * * * * * * * * * * * * * * Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Sequential mode and idle mode Transfer counter Repeat mode Transfer number storage register Block transfer mode Transfer counter Block transfer counter * : Undefined Note: Not used in normal mode. Rev. 4.0, 03/03, page 1201 of 1358 MAR1AH--Memory Address Register 1AH (Not supported in H8S/2321) MAR1AL--Memory Address Register 1AL (Not supported in H8S/2321) Bit : MAR1AH : Initial value : : MAR1AL : Initial value : DMAC H'FEF2 DMAC 31 30 29 28 27 26 25 24 0 0 0 0 0 0 0 0 Read/Write : Bit H'FEF0 23 22 21 20 19 18 * * * * * * 17 16 * * R/W R/W R/W R/W R/W R/W R/W R/W 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 * * * * * * * * * * * * * * * * Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W * : Undefined In short address mode: Specifies transfer source/transfer destination address In full address mode: Specifies transfer source address IOAR1A--I/O Address Register 1A (Not supported in H8S/2321) Bit : IOAR1A : Initial value : H'FEF4 DMAC 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 * * * * * * * * * * * * * * * * Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W * : Undefined In short address mode: Specifies transfer source/transfer destination address In full address mode: Not used Rev. 4.0, 03/03, page 1202 of 1358 ETCR1A--Transfer Count Register 1A (Not supported in H8S/2321) Bit : ETCR1A : Initial value : H'FEF6 DMAC 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 * * * * * * * * * * * * * * * * Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Sequential mode Idle mode Normal mode Transfer counter Repeat mode Transfer number storage register Transfer counter Block size storage register Block size counter Block transfer mode * : Undefined MAR1BH--Memory Address Register 1BH (Not supported in H8S/2321) MAR1BL--Memory Address Register 1BL (Not supported in H8S/2321) Bit : MAR1BH : Initial value : : MAR1BL : Initial value : DMAC H'FEFA DMAC 31 30 29 28 27 26 25 24 23 22 21 20 19 18 0 0 0 0 0 0 0 0 * * * * * * Read/Write : Bit H'FEF8 17 16 * * R/W R/W R/W R/W R/W R/W R/W R/W 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 * * * * * * * * * * * * * * * * Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W * : Undefined In short address mode: Specifies transfer source/transfer destination address In full address mode: Specifies transfer destination address Rev. 4.0, 03/03, page 1203 of 1358 IOAR1B--I/O Address Register 1B (Not supported in H8S/2321) Bit : IOAR1B : Initial value : H'FEFC DMAC 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 * * * * * * * * * * * * * * * * Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W * : Undefined In short address mode: Specifies transfer source/transfer destination address In full address mode: Not used ETCR1B--Transfer Count Register 1B (Not supported in H8S/2321) Bit : ETCR1B : Initial value : Read/Write : H'FEFE DMAC 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 * * * * * * * * * * * * * * * * R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Sequential mode and idle mode Transfer counter Repeat mode Transfer number storage register Transfer counter Block transfer mode Block transfer counter * : Undefined Note: Not used in normal mode. Rev. 4.0, 03/03, page 1204 of 1358 DMAWER--DMA Write Enable Register (Not supported in H8S/2321) Bit : 7 6 5 H'FF00 4 DMAWER : Initial value : 0 0 0 0 Read/Write : DMAC 3 2 1 0 WE1B WE1A WE0B WE0A 0 0 0 0 R/W R/W R/W R/W Write Enable 0A 0 Writes to all bits in DMACR0A, and bits 8, 4, and 0 in DMABCR are disabled 1 Writes to all bits in DMACR0A, and bits 8, 4, and 0 in DMABCR are enabled Write Enable 0B 0 Writes to all bits in DMACR0B, bits 9, 5, and 1 in DMABCR, and bit 4 in DMATCR are disabled 1 Writes to all bits in DMACR0B, bits 9, 5, and 1 in DMABCR, and bit 4 in DMATCR are enabled Write Enable 1A 0 Writes to all bits in DMACR1A, and bits 10, 6, and 2 in DMABCR are disabled 1 Writes to all bits in DMACR1A, and bits 10, 6, and 2 in DMABCR are enabled Write Enable 1B 0 Writes to all bits in DMACR1B, bits 11, 7, and 3 in DMABCR, and bit 5 in DMATCR are disabled 1 Writes to all bits in DMACR1B, bits 11, 7, and 3 in DMABCR, and bit 5 in DMATCR are enabled Rev. 4.0, 03/03, page 1205 of 1358 DMATCR--DMA Terminal Control Register (Not supported in H8S/2321) Bit : DMATCR : Initial value : 7 0 6 0 Read/Write : H'FF01 5 4 TEE1 TEE0 0 0 R/W R/W DMAC 3 2 1 0 0 0 0 0 Transfer End Enable 0 0 1 TEND0 pin output disabled TEND0 pin output enabled Transfer End Enable 1 0 1 Rev. 4.0, 03/03, page 1206 of 1358 TEND1 pin output disabled TEND1 pin output enabled DMACR0A--DMA Control Register 0A (Not supported in H8S/2321) DMACR0B--DMA Control Register 0B (Not supported in H8S/2321) DMACR1A--DMA Control Register 1A (Not supported in H8S/2321) DMACR1B--DMA Control Register 1B (Not supported in H8S/2321) H'FF02 DMAC H'FF03 DMAC H'FF04 DMAC H'FF05 DMAC Full address mode Bit : 15 14 13 12 11 DMACRA : 10 9 8 DTSZ SAID SAIDE BLKDIR BLKE Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Reserved Only 0 should be written to these bits Block Direction/Block Enable 0 1 0 Transfer in normal mode 1 Transfer in block transfer mode, destination side is block area 0 Transfer in normal mode 1 Transfer in block transfer mode, source side is block area Source Address Increment/Decrement 0 1 0 MARA is fixed 1 MARA is incremented after a data transfer 0 MARA is fixed 1 MARA is decremented after a data transfer Data Transfer Size 0 Byte-size transfer 1 Word-size transfer Rev. 4.0, 03/03, page 1207 of 1358 Full address mode (cont) Bit : DMACRB : 7 6 5 DAID DAIDE 4 3 2 1 0 DTF3 DTF2 DTF1 DTF0 Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Reserved Only 0 should be written to this bit Reserved Only 0 should be written to this bit Data Transfer Factor DTF DTF DTF DTF 3 2 1 0 0 0 0 0 1 1 0 1 1 0 0 1 1 0 1 Block Transfer Mode 1 Activated by A/D converter conversion end interrupt 0 Activated by DREQ pin falling edge input Activated by DREQ pin falling edge input 1 Activated by DREQ pin low-level input 0 Activated by SCI channel 0 transmission data-empty interrupt 1 Activated by SCI channel 0 reception data-full interrupt 0 Activated by SCI channel 1 transmission data-empty interrupt Auto-request (cycle steal) 1 Activated by SCI channel 1 reception data-full interrupt Auto-request (burst) 0 Activated by TPU channel 0 compare match/input capture A interrupt 1 Activated by TPU channel 1 compare match/input capture A interrupt 0 Activated by TPU channel 2 compare match/input capture A interrupt 1 Activated by TPU channel 3 compare match/input capture A interrupt 0 Activated by TPU channel 4 compare match/input capture A interrupt 1 Activated by TPU channel 5 compare match/input capture A interrupt 0 1 Destination Address Increment/Decrement 0 1 0 MARB is fixed 1 MARB is incremented after a data transfer 0 MARB is fixed 1 MARB is decremented after a data transfer Rev. 4.0, 03/03, page 1208 of 1358 Normal Mode Activated by DREQ pin low-level input Short address mode Bit : 7 6 5 4 3 2 1 0 DMACR : DTSZ DTID RPE DTDIR DTF3 DTF2 DTF1 DTF0 Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Data Transfer Factor Data Transfer Direction 0 1 DTF DTF DTF DTF 3 2 1 0 0 0 0 0 1 Dual address mode: Transfer with MAR as source address and IOAR as destination address Single address mode: Transfer with MAR as source address and DACK pin as write strobe 1 Dual address mode: Transfer with IOAR as source address and MAR as destination address Single address mode: Transfer with DACK pin as read strobe and MAR as destination address 1 1 Repeat Enable 0 Transfer in sequential mode 1 Transfer in repeat mode or idle mode Data Transfer Increment/Decrement 0 MAR is incremented after a data transfer 1 MAR is decremented after a data transfer 1 0 Byte-size transfer 1 Word-size transfer 0 1 Data Transfer Size 0 0 1 0 1 Channel A Channel B Activated by A/D converter conversion end interrupt 0 Activated by DREQ pin falling edge input 1 Activated by DREQ pin low-level input 0 Activated by SCI channel 0 transmission data-empty interrupt 1 Activated by SCI channel 0 reception data-full interrupt 0 Activated by SCI channel 1 transmission data-empty interrupt 1 Activated by SCI channel 1 reception data-full interrupt 0 Activated by TPU channel 0 compare match/input capture A interrupt 1 Activated by TPU channel 1 compare match/input capture A interrupt 0 Activated by TPU channel 2 compare match/input capture A interrupt 1 Activated by TPU channel 3 compare match/input capture A interrupt 0 Activated by TPU channel 4 compare match/input capture A interrupt 1 Activated by TPU channel 5 compare match/input capture A interrupt 0 1 Rev. 4.0, 03/03, page 1209 of 1358 DMABCRH -- DMA Band Control Register (Not supported in H8S/2321) DMABCRL -- DMA Band Control Register (Not supported in H8S/2321) H'FF06 DMAC H'FF07 DMAC Full address mode Bit : DMABCRH : 15 14 FAE1 FAE0 13 12 11 10 DTA1 9 8 DTA0 Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Reserved Only 0 should be written to this bit Channel 0 Data Transfer Acknowledge 0 Clearing of selected internal interrupt source at time of DMA transfer is disabled 1 Clearing of selected internal interrupt source at time of DMA transfer is enabled Reserved Only 0 should be written to this bit Channel 1 Data Transfer Acknowledge 0 Clearing of selected internal interrupt source at time of DMA transfer is disabled 1 Clearing of selected internal interrupt source at time of DMA transfer is enabled Reserved Only 0 should be written to these bits Channel 0 Full Address Enable 0 Short address mode 1 Full address mode Channel 1 Full Address Enable 0 Short address mode 1 Full address mode (Continued on next page) Rev. 4.0, 03/03, page 1210 of 1358 Full address mode (cont) Bit : DMABCRL : 7 6 5 4 DTME1 DTE1 DTME0 DTE0 3 2 0 1 DTIE1B DTIE1A DTIE0B DTIE0A Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Channel 0 Data Transfer Interrupt Enable A 0 Transfer end interrupt disabled 1 Transfer end interrupt enabled Channel 0 Data Transfer Interrupt Enable B 0 Transfer suspended interrupt disabled 1 Transfer suspended interrupt enabled Channel 1 Data Transfer Interrupt Enable A 0 Transfer end interrupt disabled 1 Transfer end interrupt enabled Channel 1 Data Transfer Interrupt Enable B 0 Transfer suspended interrupt disabled 1 Transfer suspended interrupt enabled Channel 0 Data Transfer Enable 0 Data transfer disabled 1 Data transfer enabled Channel 0 Data Transfer Master Enable 0 Data transfer disabled. In burst mode, cleared to 0 by an NMI interrupt 1 Data transfer enabled Channel 1 Data Transfer Enable 0 Data transfer disabled 1 Data transfer enabled Channel 1 Data Transfer Master Enable 0 Data transfer disabled. In burst mode, cleared to 0 by an NMI interrupt 1 Data transfer enabled (Continued on next page) Rev. 4.0, 03/03, page 1211 of 1358 Short address mode Bit : DMABCRH : 15 14 13 12 11 10 9 8 FAE1 FAE0 SAE1 SAE0 DTA1B DTA1A DTA0B DTA0A Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Channel 0A Data Transfer Acknowledge 0 Clearing of selected internal interrupt source at time of DMA transfer is disabled 1 Clearing of selected internal interrupt source at time of DMA transfer is enabled Channel 0B Data Transfer Acknowledge 0 Clearing of selected internal interrupt source at time of DMA transfer is disabled 1 Clearing of selected internal interrupt source at time of DMA transfer is enabled Channel 1A Data Transfer Acknowledge 0 Clearing of selected internal interrupt source at time of DMA transfer is disabled 1 Clearing of selected internal interrupt source at time of DMA transfer is enabled Channel 1B Data Transfer Acknowledge 0 Clearing of selected internal interrupt source at time of DMA transfer is disabled 1 Clearing of selected internal interrupt source at time of DMA transfer is enabled Channel 0B Single Address Enable 0 Transfer in dual address mode 1 Transfer in single address mode Channel 1B Single Address Enable 0 Transfer in dual address mode 1 Transfer in single address mode Channel 0 Full Address Enable 0 Short address mode 1 Full address mode Channel 1 Full Address Enable 0 Short address mode 1 Full address mode (Continued on next page) Rev. 4.0, 03/03, page 1212 of 1358 Short address mode (cont) Bit : DMABCRL : 7 6 5 4 DTE1B DTE1A DTE0B DTE0A 3 2 DTIE1B DTIE1A 0 1 DTIE0B DTIE0A Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Channel 0A Data Transfer Interrupt Enable 0 Transfer end interrupt disabled 1 Transfer end interrupt enabled Channel 0B Data Transfer Interrupt Enable 0 Transfer end interrupt disabled 1 Transfer end interrupt enabled Channel 1A Data Transfer Interrupt Enable 0 Transfer end interrupt disabled 1 Transfer end interrupt enabled Channel 1B Data Transfer Interrupt Enable 0 Transfer end interrupt disabled 1 Transfer end interrupt enabled Channel 0A Data Transfer Enable 0 Data transfer disabled 1 Data transfer enabled Channel 0B Data Transfer Enable 0 Data transfer disabled 1 Data transfer enabled Channel 1A Data Transfer Enable 0 Data transfer disabled 1 Data transfer enabled Channel 1B Data Transfer Enable 0 Data transfer disabled 1 Data transfer enabled Rev. 4.0, 03/03, page 1213 of 1358 ISCRH -- IRQ Sense Control Register H ISCRL -- IRQ Sense Control Register L H'FF2C H'FF2D Interrupt Controller Interrupt Controller ISCRH Bit : 15 14 13 12 11 10 9 8 IRQ7SCB IRQ7SCA IRQ6SCB IRQ6SCA IRQ5SCB IRQ5SCA IRQ4SCB IRQ4SCA Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W 1 0 IRQ7 to IRQ4 Sense Control ISCRL Bit : 7 6 5 4 3 2 IRQ3SCB IRQ3SCA IRQ2SCB IRQ2SCA IRQ1SCB IRQ1SCA IRQ0SCB IRQ0SCA Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W IRQ3 to IRQ0 Sense Control IRQnSCB IRQnSCA 0 1 Interrupt Request Generation 0 IRQn input low level 1 Falling edge of IRQn input 0 Rising edge of IRQn input 1 Both falling and rising edges of IRQn input (n = 7 to 0) Rev. 4.0, 03/03, page 1214 of 1358 IER--IRQ Enable Register Bit : H'FF2E Interrupt Controller 7 6 5 4 3 2 1 0 IRQ7E IRQ6E IRQ5E IRQ4E IRQ3E IRQ2E IRQ1E IRQ0E Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W IRQn Enable 0 IRQn interrupt disabled 1 IRQn interrupt enabled (n = 7 to 0) ISR--IRQ Status Register H'FF2F Interrupt Controller 7 6 5 4 3 2 1 0 IRQ7F IRQ6F IRQ5F IRQ4F IRQ3F IRQ2F IRQ1F IRQ0F Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* Bit : Indicate the status of IRQ7 to IRQ0 interrupt requests Note: * Can only be written with 0 for flag clearing. Rev. 4.0, 03/03, page 1215 of 1358 DTCERA to DTCERF--DTC Enable Registers Bit : H'FF30 to H'FF35 DTC 7 6 5 4 3 2 1 0 DTCE7 DTCE6 DTCE5 DTCE4 DTCE3 DTCE2 DTCE1 DTCE0 Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W DTC Activation Enable 0 DTC activation by this interrupt is disabled [Clearing conditions] When the DISEL bit is 1 and data transfer has ended When the specified number of transfers have ended 1 DTC activation by this interrupt is enabled [Holding condition] When the DISEL bit is 0 and the specified number of transfers have not ended Correspondence between Interrupt Sources and DTCER Bits Register 7 6 5 4 3 2 1 0 DTCERA IRQ0 IRQ1 IRQ2 IRQ3 IRQ4 IRQ5 IRQ6 IRQ7 DTCERB -- ADI TGI0A TGI0B TGI0C TGI0D TGI1A TGI1B DTCERC TGI2A TGI2B TGI3A TGI3B TGI3C TGI3D TGI4A TGI4B DTCERD -- -- TGI5A TGI5B CMIA0 CMIB0 CMIA1 CMIB1 DTCERE DMTEND0A DMTEND0B DMTEND1A DMTEND1B RXI0 TXI0 RXI1 TXI1 DTCERF RXI2 TXI2 -- -- -- -- -- -- Note: For DTCE bit setting, read/write operations must be performed using bit-manipulation instructions such as BSET and BCLR. For the initial setting only, however, when multiple activation sources are set at one time, it is possible to disable interrupts and write after executing a dummy read on the relevant register. Rev. 4.0, 03/03, page 1216 of 1358 DTVECR--DTC Vector Register Bit : 7 6 H'FF37 5 4 DTC 3 2 1 0 SWDTE DTVEC6 DTVEC5 DTVEC4 DTVEC3 DTVEC2 DTVEC1 DTVEC0 Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* Sets vector number for DTC software activation DTC Software Activation Enable 0 DTC software activation is disabled [Clearing conditions] When the DISEL bit is 0 and the specified number of transfers have not ended When SWDTEND is requested to the CPU, then 0 is written to the SWDTE bit 1 DTC software activation is enabled [Holding conditions] When the DISEL bit is 1 and data transfer has ended When the specified number of transfers have ended During data transfer due to software activation Note: * DTVEC6 to DTVEC 0 bits can be written to when SWDTE = 0. Rev. 4.0, 03/03, page 1217 of 1358 SBYCR--Standby Control Register Bit : H'FF38 7 6 5 4 3 SSBY STS2 STS1 STS0 OPE Initial value : 0 0 0 0 1 Read/Write : R/W R/W R/W R/W R/W Power-Down State 2 0 1 IRQ37S 0 0 0 R/W IRQ37 Software Standby Clear Select 0 IRQ3 to IRQ7 cannot be used as software standby mode clearing sources 1 IRQ3 to IRQ7 can be used as software standby mode clearing sources Output Port Enable 0 In software standby mode, address bus and bus control signals are high-impedance 1 In software standby mode, address bus and bus control signals retain output state Standby Timer Select 0 0 1 1 0 1 0 Standby time = 8192 states 1 Standby time = 16384 states 0 Standby time = 32768 states 1 Standby time = 65536 states 0 Standby time = 131072 states 1 Standby time = 262144 states 0 Reserved 1 Standby time = 16 states Software Standby 0 Transition to sleep mode after execution of SLEEP instruction 1 Transition to software standby mode after execution of SLEEP instruction Rev. 4.0, 03/03, page 1218 of 1358 SYSCR--System Control Register Bit : 7 Initial value : 0 Read/Write : R/W H'FF39 4 INTM0 1 2 3 5 INTM1 6 MCU NMIEG LWROD IRQPAS 0 RAME 0 0 0 0 0 1 R/W R/W R/W R/W R/W R/W 0 RAM Enable 0 On-chip RAM disabled 1 On-chip RAM enabled IRQ Port Switching Select LWR 0 IRQ4 to IRQ7 can be input from PA4 to PA7 1 IRQ4 Note: IRQ4 to IRQ7 can be input from P50 to P53 to IRQ7 input is always performed from only one of the ports. Output Disable 0 PF3 is designated as LWR output pin 1 PF3 is designated as I/O port, and does not function as LWR output pin NMI Input Edge Select 0 Falling edge 1 Rising edge Interrupt Control Mode Selection 0 1 0 Interrupt control mode 0 1 Setting prohibited 0 Interrupt control mode 2 1 Setting prohibited Reserved Only 0 should be written to this bit Rev. 4.0, 03/03, page 1219 of 1358 SCKCR--System Clock Control Register Bit : 7 6 5 PSTOP H'FF3A 4 3 0 0 DIV Initial value : 0 0 0 Read/Write : R/W R/W R/W Clock Pulse Generator 2 1 0 SCK2 SCK1 SCK0 0 0 0 R/W R/W R/W Division Ratio Select Reserved Only 0 should be written to this bit System Clock Select SCK2 SCK1 SCK0 0 0 1 1 0 DIV = 0 DIV = 1 0 Bus master is in high-speed mode Bus master is in high-speed mode 1 Medium-speed clock is f/2 Clock supplied to entire chip is f/2 0 Medium-speed clock is f/4 Clock supplied to entire chip is f/4 1 Medium-speed clock is f/8 Clock supplied to entire chip is f/8 0 Medium-speed clock is f/16 1 Medium-speed clock is f/32 1 f Clock Output Control PSTOP Normal Operation Sleep Mode Software Standby Mode Hardware Standby Mode 0 f output f output Fixed high High impedance 1 Fixed high Fixed high Fixed high High impedance Rev. 4.0, 03/03, page 1220 of 1358 MDCR--Mode Control Register Bit : 7 Initial value : H'FF3B 6 1 5 0 4 0 MCU 3 0 2 1 0 MDS2 MDS1 MDS0 0 Read/Write : * * * R R R Current mode pin operating mode Note: * Determined by pins MD2 to MD0 MSTPCRH -- Module Stop Control Register H MSTPCRL -- Module Stop Control Register L H'FF3C H'FF3D Power-Down State Power-Down State MSTPCRH Bit MSTPCRL : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Initial value : 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Specifies module stop mode 0 Module stop mode cleared 1 Module stop mode set MSTP Bits and On-Chip Supporting Modules Register Bits Module DMAC* MSTP15 DTC MSTP14 TPU MSTP13 8-bit timer MSTP12 PPG MSTP11 D/A MSTP10 A/D MSTP9 MSTP8 SCI2 MSTP7 MSTPCRL SCI1 MSTP6 SCI0 MSTP5 MSTP4 MSTP3 MSTP2 MSTP1 MSTP0 Note: * Reserved bit in the H8S/2321. MSTPCRH Rev. 4.0, 03/03, page 1221 of 1358 SYSCR2--System Control Register 2 Bit H'FF42 : 7 6 5 4 Initial value : 0 0 0 0 MCU (Valid only in F-ZTAT versions) 3 2 1 0 0 0 0 FLSHE Read/Write : 0 R/W (R/W) In the H8S/2329 and H8S/2326C only this bit is R/W, and should only be written with 0 Flash Memory Control Register Enable 0 H8S/2329 F-ZTAT, H8S/2328 F-ZTAT, and H8S/2326 F-ZTAT * Flash control registers are not selected for addresses H'FFFFC8 to H'FFFFCB H8S/2326C F-ZTAT * Flash control registers are not selected for addresses H'FFFFC4 to H'FFFFCF 1 H8S/2329 F-ZTAT, H8S/2328 F-ZTAT, and H8S/2326 F-ZTAT * Flash control registers are not selected for addresses H'FFFFC8 to H'FFFFCB H8S/2326C F-ZTAT * Flash control registers are not selected for addresses H'FFFFC4 to H'FFFFCF Reserved Register Bit H'FF44 : 7 6 5 4 3 2 1 0 Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W Reserved Only 0 should be written to these bits Rev. 4.0, 03/03, page 1222 of 1358 PFCR1--Port Function Control Register 1 Bit : 7 6 H'FF45 5 4 3 2 1 0 A23E A22E A21E A20E Initial value : 0 0 0 0 1 1 1 1 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Address 20 Output Enable* 0 PA4DR is output when PA4DDR = 1 1 A20 is output when PA4DDR = 1 Address 21 Output Enable* 0 PA5DR is output when PA5DDR = 1 1 A21 is output when PA5DDR = 1 Address 22 Output Enable* 0 PA6DR is output when PA6DDR = 1 1 A22 is output when PA6DDR = 1 Address 23 Output Enable* 0 PA7DR is output when PA7DDR = 1 1 A23 is output when PA7DDR = 1 Note: * Valid only in modes 4 to 6. Reserved Only 0 should be written to these bits Rev. 4.0, 03/03, page 1223 of 1358 PCR--PPG Output Control Register Bit : 7 6 5 H'FF46 4 3 PPG 2 1 0 G3CMS1 G3CMS0 G2CMS1 G2CMS0 G1CMS1 G1CMS0 G0CMS1 G0CMS0 Initial value : 1 1 1 1 1 1 1 1 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Output Trigger for Pulse Output Group 0 0 1 0 Compare match in TPU channel 0 1 Compare match in TPU channel 1 0 Compare match in TPU channel 2 1 Compare match in TPU channel 3 Output Trigger for Pulse Output Group 1 0 1 0 Compare match in TPU channel 0 1 Compare match in TPU channel 1 0 Compare match in TPU channel 2 1 Compare match in TPU channel 3 Output Trigger for Pulse Output Group 2 0 1 0 Compare match in TPU channel 0 1 Compare match in TPU channel 1 0 Compare match in TPU channel 2 1 Compare match in TPU channel 3 Output Trigger for Pulse Output Group 3 0 1 0 Compare match in TPU channel 0 1 Compare match in TPU channel 1 0 Compare match in TPU channel 2 1 Compare match in TPU channel 3 Rev. 4.0, 03/03, page 1224 of 1358 PMR--PPG Output Mode Register Bit : H'FF47 PPG 7 6 5 4 G3INV G2INV G1INV G0INV Initial value : 1 1 1 1 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W 3 2 G3NOV G2NOV 1 0 G1NOV G0NOV Pulse Output Group n Normal/Non-Overlap Operation Select 0 Normal operation in pulse output group n (output values updated at compare match A in the selected TPU channel) 1 Non-overlapping operation in pulse output group n (independent 1 and 0 output at compare match A or B in the selected TPU channel) (n = 3 to 0) Pulse Output Group n Direct/Inverse Output 0 Inverse output for pulse output group n (low-level output at pin for a 1 in PODRH) 1 Direct output for pulse output group n (high-level output at pin for a 1 in PODRH) (n = 3 to 0) Rev. 4.0, 03/03, page 1225 of 1358 NDERH -- Next Data Enable Register H NDERL -- Next Data Enable Register L H'FF48 H'FF49 PPG PPG NDERH Bit : 7 6 5 4 3 2 1 0 NDER15 NDER14 NDER13 NDER12 NDER11 NDER10 NDER9 NDER8 Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W 1 0 Pulse Output Enable/Disable 0 Pulse outputs PO15 to PO8 are disabled 1 Pulse outputs PO15 to PO8 are enabled NDERL Bit : 7 NDER7 6 5 NDER6 NDER5 4 3 NDER4 NDER3 2 NDER2 NDER1 NDER0 Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Pulse Output Enable/Disable 0 Pulse outputs PO7 to PO0 are disabled 1 Pulse outputs PO7 to PO0 are enabled Rev. 4.0, 03/03, page 1226 of 1358 PODRH -- Output Data Register H PODRL -- Output Data Register L H'FF4A H'FF4B PPG PPG PODRH Bit : 7 6 5 4 3 2 1 0 POD15 POD14 POD13 POD12 POD11 POD10 POD9 POD8 Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* Stores output data for use in pulse output PODRL Bit : 7 6 5 4 3 2 1 0 POD7 POD6 POD5 POD4 POD3 POD2 POD1 POD0 Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* Stores output data for use in pulse output Note: * A bit that has been set for pulse output by NDER is read-only. Rev. 4.0, 03/03, page 1227 of 1358 NDRH--Next Data Register H H'FF4C (FF4E) PPG (1) When pulse output group output triggers are the same (a) Address: H'FF4C Bit : 7 6 5 4 3 2 1 0 NDR15 NDR14 NDR13 NDR12 NDR11 NDR10 NDR9 NDR8 Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Stores the next data for pulse output groups 3 and 2 (b) Address: H'FF4E Bit : 7 6 5 4 3 2 1 0 Initial value : 1 1 1 1 1 1 1 1 3 2 1 0 1 1 1 1 Read/Write : (2) When pulse output group output triggers are different (a) Address: H'FF4C Bit : 7 6 5 4 NDR15 NDR14 NDR13 NDR12 Initial value : 0 0 0 0 Read/Write : R/W R/W R/W R/W Stores the next data for pulse output group 3 (b) Address: H'FF4E Bit : Initial value : 7 1 6 1 Read/Write : 5 1 4 1 3 2 1 0 NDR11 NDR10 NDR9 NDR8 0 0 0 0 R/W R/W R/W R/W Stores the next data for pulse output group 2 Rev. 4.0, 03/03, page 1228 of 1358 NDRL--Next Data Register L H'FF4D (FF4F) PPG (1) When pulse output group output triggers are the same (a) Address: H'FF4D Bit : 7 6 5 4 3 2 1 0 NDR7 NDR6 NDR5 NDR4 NDR3 NDR2 NDR1 NDR0 Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Stores the next data for pulse output groups 1 and 0 (b) Address: H'FF4F Bit : 7 6 5 4 3 2 1 0 Initial value : 1 1 1 1 1 1 1 1 3 2 1 0 1 1 1 1 3 2 1 0 NDR3 NDR2 NDR1 NDR0 Read/Write : (2) When pulse output group output triggers are different (a) Address: H'FF4D Bit : 7 6 5 4 NDR7 NDR6 NDR5 NDR4 Initial value : 0 0 0 0 Read/Write : R/W R/W R/W R/W Stores the next data for pulse output group 1 (b) Address: H'FF4F Bit : Initial value : Read/Write : 7 1 6 1 5 1 4 1 0 0 0 0 R/W R/W R/W R/W Stores the next data for pulse output group 0 Rev. 4.0, 03/03, page 1229 of 1358 PORT1--Port 1 Register Bit : H'FF50 Port 1 7 6 5 4 3 2 1 0 P17 P16 P15 P14 P13 P12 P11 P10 Initial value : * * * * * * * * Read/Write : R R R R R R R R State of port 1 pins Note: * Determined by the state of pins P17 to P10. PORT2--Port 2 Register Bit : H'FF51 Port 2 7 6 5 4 3 2 1 0 P27 P26 P25 P24 P23 P22 P21 P20 Initial value : * * * * * * * * Read/Write : R R R R R R R R State of port 2 pins Note: * Determined by the state of pins P27 to P20. PORT3--Port 3 Register Bit : 7 H'FF52 6 Port 3 5 4 3 2 1 0 P35 P34 P33 P32 P31 P30 Initial value : Undefined Undefined * * * * * * Read/Write : R R R R R R State of port 3 pins Note: * Determined by the state of pins P35 to P30. Rev. 4.0, 03/03, page 1230 of 1358 PORT4--Port 4 Register Bit : H'FF53 Port 4 7 6 5 4 3 2 1 0 P47 P46 P45 P44 P43 P42 P41 P40 Initial value : * * * * * * * * Read/Write : R R R R R R R R State of port 4 pins Note: * Determined by the state of pins P47 to P40. PORT5--Port 5 Register Bit H'FF54 : 7 6 5 4 Initial value : * * * * Read/Write : R R R R Port 5 3 2 1 0 P53 P52 P51 P50 * * * * R R R R State of port 5 pins Note: * Determined by the state of pins P53 to P50. PORT6--Port 6 Register Bit : H'FF55 Port 6 7 6 5 4 3 2 1 0 P67 P66 P65 P64 P63 P62 P61 P60 Initial value : * * * * * * * * Read/Write : R R R R R R R R State of port 6 pins Note: * Determined by the state of pins P67 to P60. Rev. 4.0, 03/03, page 1231 of 1358 PORTA--Port A Register Bit : H'FF59 Port A 7 6 5 4 3 2 1 0 PA7 PA6 PA5 PA4 PA3 PA2 PA1 PA0 Initial value : * * * * * * * * Read/Write : R R R R R R R R State of port A pins Note: * Determined by the state of pins PA7 to PA0. PORTB--Port B Register Bit : H'FF5A Port B 7 6 5 4 3 2 1 0 PB7 PB6 PB5 PB4 PB3 PB2 PB1 PB0 Initial value : * * * * * * * * Read/Write : R R R R R R R R State of port B pins Note: * Determined by the state of pins PB7 to PB0. PORTC--Port C Register Bit : H'FF5B Port C 7 6 5 4 3 2 1 0 PC7 PC6 PC5 PC4 PC3 PC2 PC1 PC0 Initial value : * * * * * * * * Read/Write : R R R R R R R R State of port C pins Note: * Determined by the state of pins PC7 to PC0. Rev. 4.0, 03/03, page 1232 of 1358 PORTD--Port D Register Bit : H'FF5C Port D 7 6 5 4 3 2 1 0 PD7 PD6 PD5 PD4 PD3 PD2 PD1 PD0 Initial value : * * * * * * * * Read/Write : R R R R R R R R State of port D pins Note: * Determined by the state of pins PD7 to PD0. PORTE--Port E Register Bit : H'FF5D Port E 7 6 5 4 3 2 1 0 PE7 PE6 PE5 PE4 PE3 PE2 PE1 PE0 Initial value : * * * * * * * * Read/Write : R R R R R R R R State of port E pins Note: * Determined by the state of pins PE7 to PE0. PORTF--Port F Register Bit : H'FF5E Port F 7 6 5 4 3 2 1 0 PF7 PF6 PF5 PF4 PF3 PF2 PF1 PF0 Initial value : * * * * * * * * Read/Write : R R R R R R R R State of port F pins Note: * Determined by the state of pins PF7 to PF0. Rev. 4.0, 03/03, page 1233 of 1358 PORTG--Port G Register Bit : H'FF5F 7 6 5 Port G 4 3 2 1 0 PG4 PG3 PG2 PG1 PG0 Initial value : Undefined Undefined Undefined * * * * * Read/Write : R R R R R State of port G pins Note: * Determined by the state of pins PG4 to PG0. P1DR--Port 1 Data Register Bit : H'FF60 Port 1 7 6 5 4 3 2 1 0 P17DR P16DR P15DR P14DR P13DR P12DR P11DR P10DR Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Stores output data for port 1 pins (P17 to P10) P2DR--Port 2 Data Register Bit : H'FF61 Port 2 7 6 5 4 3 2 1 0 P27DR P26DR P25DR P24DR P23DR P22DR P21DR P20DR Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Stores output data for port 2 pins (P27 to P20) Rev. 4.0, 03/03, page 1234 of 1358 P3DR--Port 3 Data Register Bit : 7 H'FF62 6 Initial value : Undefined Undefined Read/Write : Port 3 5 4 3 2 1 0 P35DR P34DR P33DR P32DR P31DR P30DR 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W Stores output data for port 3 pins (P35 to P30) P5DR--Port 5 Data Register Bit : 7 H'FF64 6 5 4 Initial value : Undefined Undefined Undefined Undefined Read/Write : Port 5 3 2 1 0 P53DR P52DR P51DR P50DR 0 0 0 0 R/W R/W R/W R/W Stores output data for port 5 pins (P53 to P50) P6DR--Port 6 Data Register Bit : H'FF65 Port 6 7 6 5 4 3 2 1 0 P67DR P66DR P65DR P64DR P63DR P62DR P61DR P60DR Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Stores output data for port 6 pins (P67 to P60) Rev. 4.0, 03/03, page 1235 of 1358 PADR--Port A Data Register Bit : H'FF69 Port A 7 6 5 4 3 2 1 0 PA7DR PA6DR PA5DR PA4DR PA3DR PA2DR PA1DR PA0DR Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Stores output data for port A pins (PA7 to PA0) PBDR--Port B Data Register Bit : H'FF6A Port B 7 6 5 4 3 2 1 0 PB7DR PB6DR PB5DR PB4DR PB3DR PB2DR PB1DR PB0DR Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Stores output data for port B pins (PB7 to PB0) PCDR--Port C Data Register Bit : H'FF6B Port C 7 6 5 4 3 2 1 0 PC7DR PC6DR PC5DR PC4DR PC3DR PC2DR PC1DR PC0DR Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Stores output data for port C pins (PC7 to PC0) Rev. 4.0, 03/03, page 1236 of 1358 PDDR--Port D Data Register Bit : H'FF6C Port D 7 6 5 4 3 2 1 0 PD7DR PD6DR PD5DR PD4DR PD3DR PD2DR PD1DR PD0DR Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Stores output data for port D pins (PD7 to PD0) PEDR--Port E Data Register Bit : H'FF6D Port E 7 6 5 4 3 2 1 0 PE7DR PE6DR PE5DR PE4DR PE3DR PE2DR PE1DR PE0DR Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Stores output data for port E pins (PE7 to PE0) PFDR--Port F Data Register Bit : H'FF6E Port F 7 6 5 4 3 2 1 0 PF7DR PF6DR PF5DR PF4DR PF3DR PF2DR PF1DR PF0DR Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Stores output data for port F pins (PF7 to PF0) Rev. 4.0, 03/03, page 1237 of 1358 PGDR--Port G Data Register Bit : 7 6 H'FF6F 5 4 Port G 3 2 PG4DR PG3DR PG2DR Initial value : Undefined Undefined Undefined Read/Write : 0 1 PG1DR PG0DR 0 0 0 0 0 R/W R/W R/W R/W R/W Stores output data for port G pins (PG4 to PG0) PAPCR--Port A MOS Pull-Up Control Register Bit : 7 6 5 4 H'FF70 3 Port A 2 1 0 PA7PCR PA6PCR PA5PCR PA4PCR PA3PCR PA2PCR PA1PCR PA0PCR Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Controls the MOS input pull-up function incorporated into port A on a bit-by-bit basis PBPCR--Port B MOS Pull-Up Control Register Bit : 7 6 5 4 H'FF71 3 Port B 2 1 0 PB7PCR PB6PCR PB5PCR PB4PCR PB3PCR PB2PCR PB1PCR PB0PCR Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Controls the MOS input pull-up function incorporated into port B on a bit-by-bit basis Rev. 4.0, 03/03, page 1238 of 1358 PCPCR--Port C MOS Pull-Up Control Register Bit : 7 6 5 H'FF72 4 Port C 3 2 0 1 PC7PCR PC6PCR PC5PCR PC4PCR PC3PCR PC2PCR PC1PCR PC0PCR Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Controls the MOS input pull-up function incorporated into port C on a bit-by-bit basis PDPCR--Port D MOS Pull-Up Control Register Bit : 7 6 5 4 H'FF73 3 Port D 2 1 0 PD7PCR PD6PCR PD5PCR PD4PCR PD3PCR PD2PCR PD1PCR PD0PCR Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Controls the MOS input pull-up function incorporated into port D on a bit-by-bit basis PEPCR--Port E MOS Pull-Up Control Register Bit : 7 6 5 4 H'FF74 3 Port E 2 1 0 PE7PCR PE6PCR PE5PCR PE4PCR PE3PCR PE2PCR PE1PCR PE0PCR Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Controls the MOS input pull-up function incorporated into port E on a bit-by-bit basis Rev. 4.0, 03/03, page 1239 of 1358 P3ODR--Port 3 Open Drain Control Register Bit : 7 6 H'FF76 5 4 3 Port 3 2 1 0 P35ODR P34ODR P33ODR P32ODR P31ODR P30ODR Initial value : Undefined Undefined Read/Write : 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W Controls the PMOS on/off status for each port 3 pin (P35 to P30) PAODR--Port A Open Drain Control Register Bit : 7 6 5 H'FF77 4 3 Port A 2 1 0 PA7ODR PA6ODR PA5ODR PA4ODR PA3ODR PA2ODR PA1ODR PA0ODR Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Controls the PMOS on/off status for each port A pin (PA7 to PA0) Rev. 4.0, 03/03, page 1240 of 1358 SMR0--Serial Mode Register 0 Bit : H'FF78 SCI0 7 6 5 4 3 2 1 0 C/A CHR PE O/E STOP MP CKS1 CKS0 Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Clock Select 0 1 0 f clock 1 f/4 clock 0 f/16 clock 1 f/64 clock Multiprocessor Mode 0 Multiprocessor function disabled 1 Multiprocessor format selected Stop Bit Length 0 1 stop bit 1 2 stop bits Parity Mode 0 Even parity 1 Odd parity Parity Enable 0 Parity bit addition and checking disabled 1 Parity bit addition and checking enabled Character Length 0 8-bit data 1 7-bit data* Note: * When 7-bit data is selected, the MSB (bit 7) of TDR is not transmitted. Asynchronous Mode/Synchronous Mode Select 0 Asynchronous mode 1 Synchronous mode Rev. 4.0, 03/03, page 1241 of 1358 SMR0--Serial Mode Register 0 Bit : H'FF78 Smart Card Interface 0 7 6 5 4 3 2 1 0 GM BLK PE O/E BCP1 BCP0 CKS1 CKS0 Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Clock Select 0 1 0 f clock 1 f/4 clock 0 f/16 clock 1 f/64 clock Base Clock Pulse BCP1 BCP0 0 1 Base Clock Pulse 0 32 clocks 1 64 clocks 0 372 clocks 1 256 clocks Parity Mode 0 Even parity 1 Odd parity Parity Enable (Set to 1 when using the smart card interface) 0 Setting prohibited 1 Parity bit addition and checking enabled Block Transfer Mode Select GSM Mode 0 Normal smart card interface mode 1 Block transfer mode 0 Normal smart card interface mode operation TEND flag generated 12.5 etu (11.5 etu in block transfer mode) after beginning of start bit Clock output on/off control only 1 GSM mode smart card interface mode operation TEND flag generated 11.0 etu after beginning of start bit Fixed high/low-level control possible (set in SCR) in addition to clock output on/off control Note: etu: Elementary Time Unit (time for transfer of 1 bit) Rev. 4.0, 03/03, page 1242 of 1358 BRR0--Bit Rate Register 0 Bit H'FF79 SCI0, Smart Card Interface 0 : 7 6 5 4 3 2 1 0 Initial value : 1 1 1 1 1 1 1 1 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Sets the serial transfer bit rate Note: For details, see section 14.2.8, Bit Rate Register (BRR). Rev. 4.0, 03/03, page 1243 of 1358 SCR0--Serial Control Register 0 Bit : H'FF7A SCI0 7 6 5 4 3 2 1 0 TIE RIE TE RE MPIE TEIE CKE1 CKE0 Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Clock Enable 0 0 1 1 0 1 Asynchronous mode Internal clock/SCK pin functions as I/O port Synchronous mode Asynchronous mode Synchronous mode Internal clock/SCK pin functions as serial clock output Internal clock/SCK pin functions as clock output*1 Internal clock/SCK pin functions as serial clock output Asynchronous mode External clock/SCK pin functions as clock input*2 Synchronous mode Asynchronous mode Synchronous mode External clock/SCK pin functions as serial clock input External clock/SCK pin functions as clock input*2 External clock/SCK pin functions as serial clock input Notes: *1 Outputs a clock of the same frequency as the bit rate. *2 Inputs a clock with a frequency 16 times the bit rate. Transmit End Interrupt Enable 0 Transmit-end interrupt (TEI) request disabled 1 Transmit-end interrupt (TEI) request enabled Multiprocessor Interrupt Enable 0 Multiprocessor interrupts disabled [Clearing conditions] When the MPIE bit is cleared to 0 When data with MPB = 1 is received 1 Multiprocessor interrupts enabled Receive-data-full interrupt (RXI) requests, receive error interrupt (ERI) requests, and setting of the RDRF, FER, and ORER flags in SSR are disabled until data with the multiprocessor bit set to 1 is received Receive Enable 0 Reception disabled 1 Reception enabled Transmit Enable 0 Transmission disabled 1 Transmission enabled Receive Interrupt Enable 0 Receive-data-full interrupt (RXI) request and receive-error interrupt (ERI) request disabled 1 Receive-data-full interrupt (RXI) request and receive-error interrupt (ERI) request enabled Transmit Interrupt Enable 0 Transmit-data-empty interrupt (TXI) request disabled 1 Transmit-data-empty interrupt (TXI) request enabled Rev. 4.0, 03/03, page 1244 of 1358 SCR0--Serial Control Register 0 Bit : H'FF7A Smart Card Interface 0 7 6 5 4 3 2 1 0 TIE RIE TE RE MPIE TEIE CKE1 CKE0 Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Clock Enable SCMR SMR SMIF GM SCR setting CKE1 0 CKE0 SCK pin function See SCI specification 1 0 0 0 Operates as port I/O pin 1 0 0 1 Clock output as SCK output pin 1 1 0 0 Fixed-low output as SCK output pin 1 1 0 1 Clock output as SCK output pin 1 1 1 0 Fixed-high output as SCK output pin 1 1 1 1 Clock output as SCK output pin Transmit End Interrupt Enable 0 Transmit-end interrupt (TEI) request disabled 1 Transmit-end interrupt (TEI) request enabled Multiprocessor Interrupt Enable 0 Multiprocessor interrupts disabled [Clearing conditions] When the MPIE bit is cleared to 0 When data with MPB = 1 is received 1 Multiprocessor interrupts enabled Receive-data-full interrupt (RXI) requests, receive error interrupt (ERI) requests, and setting of the RDRF, FER, and ORER flags in SSR are disabled until data with the multiprocessor bit set to 1 is received Receive Enable 0 Reception disabled 1 Reception enabled Transmit Enable 0 Transmission disabled 1 Transmission enabled Receive Interrupt Enable 0 Receive-data-full interrupt (RXI) request and receive-error interrupt (ERI) request disabled 1 Receive-data-full interrupt (RXI) request and receive-error interrupt (ERI) request enabled Transmit Interrupt Enable 0 Transmit-data-empty interrupt (TXI) request disabled 1 Transmit-data-empty interrupt (TXI) request enabled Rev. 4.0, 03/03, page 1245 of 1358 TDR0--Transmit Data Register 0 Bit H'FF7B SCI0, Smart Card Interface 0 : 7 6 5 4 3 2 1 0 Initial value : 1 1 1 1 1 1 1 1 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Stores data for serial transmission Rev. 4.0, 03/03, page 1246 of 1358 SSR0--Serial Status Register 0 Bit : H'FF7C 7 6 5 4 3 2 1 0 TDRE RDRF ORER FER PER TEND MPB MPBT Initial value : 1 0 0 0 0 1 0 0 Read/Write : R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R R R/W SCI0 Multiprocessor Bit Transfer 0 Data with a 0 multiprocessor bit is transmitted 1 Data with a 1 multiprocessor bit is transmitted Multiprocessor Bit 0 [Clearing condition] When data with a 0 multiprocessor bit is received 1 [Setting condition] When data with a 1 multiprocessor bit is received Transmit End 0 [Clearing conditions] When 0 is written to TDRE after reading TDRE = 1 When the DMAC*1 or DTC is activated by a TXI interrupt and writes data to TDR 1 [Setting conditions] When the TE bit in SCR is 0 When TDRE = 1 at transmission of the last bit of a 1-byte serial transmit character Note: *1 The DMAC is not supported in the H8S/2321. Parity Error 0 [Clearing condition] When 0 is written to PER after reading PER = 1 1 [Setting condition] When, in reception, the number of 1 bits in the receive data plus the parity bit does not match the parity setting (even or odd) specified by the O/E bit in SMR Framing Error 0 [Clearing condition] When 0 is written to FER after reading FER = 1 1 [Setting condition] When the SCI checks the stop bit at the end of the receive data when reception ends, and the stop bit is 0 Overrun Error 0 [Clearing condition] When 0 is written to ORER after reading ORER = 1 1 [Setting condition] When the next serial reception is completed while RDRF = 1 Receive Data Register Full 0 [Clearing conditions] When 0 is written to RDRF after reading RDRF = 1 When the DMAC*1 or DTC is activated by an RXI interrupt and reads data from RDR 1 [Setting condition] When serial reception ends normally and receive data is transferred from RSR to RDR Note: *1 The DMAC is not supported in the H8S/2321. Transmit Data Register Empty 0 [Clearing conditions] When 0 is written to TDRE after reading TDRE = 1 When the DMAC*1 or DTC is activated by a TXI interrupt and writes data to TDR 1 [Setting conditions] When the TE bit in SCR is 0 When data is transferred from TDR to TSR and data can be written to TDR Note: *1 The DMAC is not supported in the H8S/2321. Note: * Can only be written with 0 for flag clearing. Rev. 4.0, 03/03, page 1247 of 1358 SSR0--Serial Status Register 0 Bit : H'FF7C 7 6 5 4 3 2 1 0 TDRE RDRF ORER ERS PER TEND MPB MPBT Initial value : 1 0 0 0 0 1 0 0 Read/Write : R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R R R/W Smart Card Interface 0 Multiprocessor Bit Transfer 0 Data with a 0 multiprocessor bit is transmitted 1 Data with a 1 multiprocessor bit is transmitted Multiprocessor Bit 0 [Clearing condition] When data with a 0 multiprocessor bit is received 1 [Setting condition] When data with a 1 multiprocessor bit is received Transmit End 0 Transmission in progress [Clearing conditions] When 0 is written to TDRE after reading TDRE = 1 When the DMAC*1 or DTC is activated by a TXI interrupt and writes data to TDR 1 Transmission has ended [Setting conditions] On reset, or in standby mode or module stop mode When the TE bit in SCR is 0 and the ERS bit is 0 When TDRE = 1 and ERS = 0 (normal transmission) 2.5 etu after transmission of a 1-byte serial character when GM = 0 and BLK = 0 When TDRE = 1 and ERS = 0 (normal transmission) 1.5 etu after transmission of a 1-byte serial character when GM = 0 and BLK = 1 When TDRE = 1 and ERS = 0 (normal transmission) 1.0 etu after transmission of a 1-byte serial character when GM = 1 and BLK = 0 When TDRE = 1 and ERS = 0 (normal transmission) 1.0 etu after transmission of a 1-byte serial character when GM = 1 and BLK = 1 Note: etu: Elementary Time Unit (time for transfer of 1 bit) *1 The DMAC is not supported in the H8S/2321. Parity Error 0 [Clearing condition] When 0 is written to PER after reading PER = 1 1 [Setting condition] When, in reception, the number of 1 bits in the receive data plus the parity bit does not match the parity setting (even or odd) specified by the O/E bit in SMR Error Signal Status 0 1 Data has been received normally, and there is no error signal [Clearing conditions] On reset, or in standby mode or module stop mode When 0 is written to ERS after reading ERS = 1 Error signal indicating detection of parity error has been sent by receiving device [Setting condition] When the error signal is sampled at the low level Note: Clearing the TE bit in SCR to 0 does not affect the ERS flag, which retains its prior state. Overrun Error 0 [Clearing condition] When 0 is written to ORER after reading ORER = 1 1 [Setting condition] When the next serial reception is completed while RDRF = 1 Receive Data Register Full 0 [Clearing conditions] When 0 is written to RDRF after reading RDRF = 1 When the DMAC*1 or DTC is activated by an RXI interrupt and reads data from RDR 1 [Setting condition] When serial reception ends normally and receive data is transferred from RSR to RDR Note: *1 The DMAC is not supported in the H8S/2321. Transmit Data Register Empty 0 [Clearing conditions] When 0 is written to TDRE after reading TDRE = 1 When the DMAC*1 or DTC is activated by a TXI interrupt and writes data to TDR 1 [Setting conditions] When the TE bit in SCR is 0 When data is transferred from TDR to TSR and data can be written to TDR Note: *1 The DMAC is not supported in the H8S/2321. Note: * Can only be written with 0 for flag clearing. Rev. 4.0, 03/03, page 1248 of 1358 RDR0--Receive Data Register 0 Bit : 7 H'FF7D 6 5 4 SCI0, Smart Card Interface 0 3 2 1 0 Initial value : 0 0 0 0 0 0 0 0 Read/Write : R R R R R R R R Stores received serial data SCMR0--Smart Card Mode Register 0 Bit : Initial value : 7 1 6 1 5 1 H'FF7E 4 1 Read/Write : 3 2 SDIR SINV 0 0 R/W R/W SCI0, Smart Card Interface 0 1 0 SMIF 1 0 R/W Smart Card Interface Mode Select 0 Smart card interface function is disabled 1 Smart card interface function is enabled Smart Card Data Invert 0 TDR contents are transmitted as they are Receive data is stored in RDR as it is 1 TDR contents are inverted before being transmitted Receive data is stored in RDR in inverted form Smart Card Data Direction 0 TDR contents are transmitted LSB-first Receive data is stored in RDR LSB-first 1 TDR contents are transmitted MSB-first Receive data is stored in RDR MSB-first Rev. 4.0, 03/03, page 1249 of 1358 SMR1--Serial Mode Register 1 Bit : H'FF80 SCI1 7 6 5 4 3 2 1 0 C/A CHR PE O/E STOP MP CKS1 CKS0 Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Clock Select 0 1 0 f clock 1 f/4 clock 0 f/16 clock 1 f/64 clock Multiprocessor Mode 0 Multiprocessor function disabled 1 Multiprocessor format selected Stop Bit Length 0 1 stop bit 1 2 stop bits Parity Mode 0 Even parity 1 Odd parity Parity Enable 0 Parity bit addition and checking disabled 1 Parity bit addition and checking enabled Character Length 0 8-bit data 1 7-bit data* Note: * When 7-bit data is selected, the MSB (bit 7) of TDR is not transmitted. Asynchronous Mode/Synchronous Mode Select 0 Asynchronous mode 1 Synchronous mode Rev. 4.0, 03/03, page 1250 of 1358 SMR1--Serial Mode Register 1 Bit : H'FF80 Smart Card Interface 1 7 6 5 4 3 2 1 0 GM BLK PE O/E BCP1 BCP0 CKS1 CKS0 Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Clock Select 0 1 0 f clock 1 f/4 clock 0 f/16 clock 1 f/64 clock Base Clock Pulse BCP1 BCP0 0 1 Base Clock Pulse 0 32 clocks 1 64 clocks 0 372 clocks 1 256 clocks Parity Mode (Set to 1 when using the smart card interface) 0 Even parity 1 Odd parity Parity Enable 0 Setting prohibited 1 Parity bit addition and checking enabled Block Transfer Mode Select 0 Normal smart card interface mode 1 Block transfer mode GSM Mode 0 Normal smart card interface mode operation TEND flag generated 12.5 etu (11.5 etu in block transfer mode) after beginning of start bit Clock output on/off control only 1 GSM mode smart card interface mode operation TEND flag generated 11.0 etu after beginning of start bit Fixed high/low-level control possible (set in SCR) in addition to clock output on/off control Note: etu: Elementary Time Unit (time for transfer of 1 bit) Rev. 4.0, 03/03, page 1251 of 1358 BRR1--Bit Rate Register 1 Bit H'FF81 SCI1, Smart Card Interface 1 : 7 6 5 4 3 2 1 0 Initial value : 1 1 1 1 1 1 1 1 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Sets the serial transfer bit rate Note: For details, see section 14.2.8, Bit Rate Register (BRR). Rev. 4.0, 03/03, page 1252 of 1358 SCR1--Serial Control Register 1 Bit : H'FF82 SCI1 7 6 5 4 3 2 1 0 TIE RIE TE RE MPIE TEIE CKE1 CKE0 Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Clock Enable 0 1 0 Asynchronous mode Synchronous mode Internal clock/SCK pin functions as I/O port Internal clock/SCK pin functions as serial clock output 1 Asynchronous mode Synchronous mode Internal clock/SCK pin functions as clock output*1 0 1 Asynchronous mode Synchronous mode Asynchronous mode Synchronous mode Internal clock/SCK pin functions as serial clock output External clock/SCK pin functions as clock input*2 External clock/SCK pin functions as serial clock input External clock/SCK pin functions as clock input*2 External clock/SCK pin functions as serial clock input Notes: *1 Outputs a clock of the same frequency as the bit rate. *2 Inputs a clock with a frequency 16 times the bit rate. Transmit End Interrupt Enable 0 Transmit-end interrupt (TEI) request disabled 1 Transmit-end interrupt (TEI) request enabled Multiprocessor Interrupt Enable 0 1 Multiprocessor interrupts disabled [Clearing conditions] When the MPIE bit is cleared to 0 When data with MPB = 1 is received Multiprocessor interrupts enabled Receive-data-full interrupt (RXI) requests, receive error interrupt (ERI) requests, and setting of the RDRF, FER, and ORER flags in SSR are disabled until data with the multiprocessor bit set to 1 is received Receive Enable 0 Reception disabled 1 Reception enabled Transmit Enable 0 Transmission disabled 1 Transmission enabled Receive Interrupt Enable 0 Receive-data-full interrupt (RXI) request and receive-error interrupt (ERI) request disabled 1 Receive-data-full interrupt (RXI) request and receive-error interrupt (ERI) request enabled Transmit Interrupt Enable 0 Transmit-data-empty interrupt (TXI) request disabled 1 Transmit-data-empty interrupt (TXI) request enabled Rev. 4.0, 03/03, page 1253 of 1358 SCR1--Serial Control Register 1 Bit : H'FF82 Smart Card Interface 1 7 6 5 4 3 2 1 0 TIE RIE TE RE MPIE TEIE CKE1 CKE0 Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Clock Enable SCMR SMR SMIF GM SCR setting CKE1 0 CKE0 SCK pin function See SCI specification 1 0 0 0 Operates as port I/O pin 1 0 0 1 Clock output as SCK output pin 1 1 0 0 Fixed-low output as SCK output pin 1 1 0 1 Clock output as SCK output pin 1 1 1 0 Fixed-high output as SCK output pin 1 1 1 1 Clock output as SCK output pin Transmit End Interrupt Enable 0 Transmit-end interrupt (TEI) request disabled 1 Transmit-end interrupt (TEI) request enabled Multiprocessor Interrupt Enable 0 Multiprocessor interrupts disabled [Clearing conditions] When the MPIE bit is cleared to 0 When data with MPB = 1 is received 1 Multiprocessor interrupts enabled Receive-data-full interrupt (RXI) requests, receive error interrupt (ERI) requests, and setting of the RDRF, FER, and ORER flags in SSR are disabled until data with the multiprocessor bit set to 1 is received Receive Enable 0 Reception disabled 1 Reception enabled Transmit Enable 0 Transmission disabled 1 Transmission enabled Receive Interrupt Enable 0 Receive-data-full interrupt (RXI) request and receive-error interrupt (ERI) request disabled 1 Receive-data-full interrupt (RXI) request and receive-error interrupt (ERI) request enabled Transmit Interrupt Enable 0 Transmit-data-empty interrupt (TXI) request disabled 1 Transmit-data-empty interrupt (TXI) request enabled Rev. 4.0, 03/03, page 1254 of 1358 TDR1--Transmit Data Register 1 Bit H'FF83 SCI1, Smart Card Interface 1 : 7 6 5 4 3 2 1 0 Initial value : 1 1 1 1 1 1 1 1 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Stores data for serial transmission Rev. 4.0, 03/03, page 1255 of 1358 SSR1--Serial Status Register 1 Bit : H'FF84 7 6 5 4 3 2 1 0 TDRE RDRF ORER FER PER TEND MPB MPBT Initial value : 1 0 0 0 0 1 0 0 Read/Write : R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R R R/W SCI1 Multiprocessor Bit Transfer 0 Data with a 0 multiprocessor bit is transmitted 1 Data with a 1 multiprocessor bit is transmitted Multiprocessor Bit 0 [Clearing condition] When data with a 0 multiprocessor bit is received 1 [Setting condition] When data with a 1 multiprocessor bit is received Transmit End 0 [Clearing conditions] When 0 is written to TDRE after reading TDRE = 1 When the DMAC*1 or DTC is activated by a TXI interrupt and writes data to TDR 1 [Setting conditions] When the TE bit in SCR is 0 When TDRE = 1 at transmission of the last bit of a 1-byte serial transmit character Note: *1 The DMAC is not supported in the H8S/2321. Parity Error 0 [Clearing condition] When 0 is written to PER after reading PER = 1 1 [Setting condition] When, in reception, the number of 1 bits in the receive data plus the parity bit does not match the parity setting (even or odd) specified by the O/E bit in SMR Framing Error 0 [Clearing condition] When 0 is written to FER after reading FER = 1 1 [Setting condition] When the SCI checks the stop bit at the end of the receive data when reception ends, and the stop bit is 0 Overrun Error 0 [Clearing condition] When 0 is written to ORER after reading ORER = 1 1 [Setting condition] When the next serial reception is completed while RDRF = 1 Receive Data Register Full 0 [Clearing conditions] When 0 is written to RDRF after reading RDRF = 1 When the DMAC*1 or DTC is activated by an RXI interrupt and reads data from RDR 1 [Setting condition] When serial reception ends normally and receive data is transferred from RSR to RDR Note: *1 The DMAC is not supported in the H8S/2321. Transmit Data Register Empty 0 [Clearing conditions] When 0 is written to TDRE after reading TDRE = 1 When the DMAC*1 or DTC is activated by a TXI interrupt and writes data to TDR 1 [Setting conditions] When the TE bit in SCR is 0 When data is transferred from TDR to TSR and data can be written to TDR Note: *1 The DMAC is not supported in the H8S/2321. Note: * Can only be written with 0 for flag clearing. Rev. 4.0, 03/03, page 1256 of 1358 SSR1--Serial Status Register 1 Bit : H'FF84 7 6 5 4 3 2 1 0 TDRE RDRF ORER ERS PER TEND MPB MPBT Initial value : 1 0 0 0 0 1 0 0 Read/Write : R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R R R/W Smart Card Interface 1 Multiprocessor Bit Transfer 0 Data with a 0 multiprocessor bit is transmitted 1 Data with a 1 multiprocessor bit is transmitted Multiprocessor Bit 0 [Clearing condition] When data with a 0 multiprocessor bit is received 1 [Setting condition] When data with a 1 multiprocessor bit is received Transmit End 0 Transmission in progress [Clearing conditions] When 0 is written to TDRE after reading TDRE = 1 When the DMAC*1 or DTC is activated by a TXI interrupt and writes data to TDR 1 Transmission has ended [Setting conditions] On reset, or in standby mode or module stop mode When the TE bit in SCR is 0 and the ERS bit is 0 When TDRE = 1 and ERS = 0 (normal transmission) 2.5 etu after transmission of a 1-byte serial character when GM = 0 and BLK = 0 When TDRE = 1 and ERS = 0 (normal transmission) 1.5 etu after transmission of a 1-byte serial character when GM = 0 and BLK = 1 When TDRE = 1 and ERS = 0 (normal transmission) 1.0 etu after transmission of a 1-byte serial character when GM = 1 and BLK = 0 When TDRE = 1 and ERS = 0 (normal transmission) 1.0 etu after transmission of a 1-byte serial character when GM = 1 and BLK = 1 Notes: etu: Elementary Time Unit (time for transfer of 1 bit) *1 The DMAC is not supported in the H8S/2321. Parity Error 0 [Clearing condition] When 0 is written to PER after reading PER = 1 1 [Setting condition] When, in reception, the number of 1 bits in the receive data plus the parity bit does not match the parity setting (even or odd) specified by the O/E bit in SMR Error Signal Status 0 Data has been received normally, and there is no error signal [Clearing conditions] On reset, or in standby mode or module stop mode When 0 is written to ERS after reading ERS =1 1 Error signal indicating detection of parity error has been sent by receiving device [Setting condition] When the error signal is sampled at the low level Note: Clearing the TE bit in SCR to 0 does not affect the ERS flag, which retains its prior state. Overrun Error 0 [Clearing condition] When 0 is written to ORER after reading ORER = 1 1 [Setting condition] When the next serial reception is completed while RDRF = 1 Receive Data Register Full 0 [Clearing conditions] When 0 is written to RDRF after reading RDRF = 1 When the DMAC*1 or DTC is activated by an RXI interrupt and reads data from RDR 1 [Setting condition] When serial reception ends normally and receive data is transferred from RSR to RDR Note: *1 The DMAC is not supported in the H8S/2321. Transmit Data Register Empty 0 [Clearing conditions] When 0 is written to TDRE after reading TDRE = 1 When the DMAC*1 or DTC is activated by a TXI interrupt and writes data to TDR 1 [Setting conditions] When the TE bit in SCR is 0 When data is transferred from TDR to TSR and data can be written to TDR Note: *1 The DMAC is not supported in the H8S/2321. Note: * Can only be written with 0 for flag clearing. Rev. 4.0, 03/03, page 1257 of 1358 RDR1--Receive Data Register 1 Bit H'FF85 SCI1, Smart Card Interface 1 : 7 6 5 4 3 2 1 0 Initial value : 0 0 0 0 0 0 0 0 Read/Write : R R R R R R R R Stores received serial data SCMR1--Smart Card Mode Register 1 Bit : Initial value : 7 1 6 1 5 1 H'FF86 4 1 Read/Write : 3 2 SDIR SINV 0 0 R/W R/W SCI1, Smart Card Interface 1 1 0 SMIF 1 0 R/W Smart Card Interface Mode Select 0 Smart card interface function is disabled 1 Smart card interface function is enabled Smart Card Data Invert 0 TDR contents are transmitted as they are Receive data is stored in RDR as it is 1 TDR contents are inverted before being transmitted Receive data is stored in RDR in inverted form Smart Card Data Direction Rev. 4.0, 03/03, page 1258 of 1358 0 TDR contents are transmitted LSB-first Receive data is stored in RDR LSB-first 1 TDR contents are transmitted MSB-first Receive data is stored in RDR MSB-first SMR2--Serial Mode Register 2 Bit : H'FF88 SCI2 7 6 5 4 3 2 1 0 C/A CHR PE O/E STOP MP CKS1 CKS0 Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Clock Select 0 1 0 f clock 1 f/4 clock 0 f/16 clock 1 f/64 clock Multiprocessor Mode 0 Multiprocessor function disabled 1 Multiprocessor format selected Stop Bit Length 0 1 stop bit 1 2 stop bits Parity Mode 0 Even parity 1 Odd parity Parity Enable 0 Parity bit addition and checking disabled 1 Parity bit addition and checking enabled Character Length 0 8-bit data 1 7-bit data* Note: * When 7-bit data is selected, the MSB (bit 7) of TDR is not transmitted. Asynchronous Mode/Synchronous Mode Select 0 Asynchronous mode 1 Synchronous mode Rev. 4.0, 03/03, page 1259 of 1358 SMR2--Serial Mode Register 2 Bit : H'FF88 Smart Card Interface 2 7 6 5 4 3 2 1 0 GM BLK PE O/E BCP1 BCP0 CKS1 CKS0 Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Clock Select 0 1 0 f clock 1 f/4 clock 0 f/16 clock 1 f/64 clock Base Clock Pulse BCP1 BCP0 0 1 Base Clock Pulse 0 32 clocks 1 64 clocks 0 372 clocks 1 256 clocks Parity Mode (Set to 1 when using the smart card interface) 0 Even parity 1 Odd parity Parity Enable 0 Setting prohibited 1 Parity bit addition and checking enabled Block Transfer Mode Select 0 Normal smart card interface mode 1 Block transfer mode GSM Mode 0 Normal smart card interface mode operation TEND flag generated 12.5 etu (11.5 etu in block transfer mode) after beginning of start bit Clock output on/off control only 1 GSM mode smart card interface mode operation TEND flag generated 11.0 etu after beginning of start bit Fixed high/low-level control possible (set in SCR) in addition to clock output on/off control Note: etu: Elementary Time Unit (time for transfer of 1 bit) Rev. 4.0, 03/03, page 1260 of 1358 BRR2--Bit Rate Register 2 Bit H'FF89 SCI2, Smart Card Interface 2 : 7 6 5 4 3 2 1 0 Initial value : 1 1 1 1 1 1 1 1 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Sets the serial transfer bit rate Note: For details, see section 14.2.8, Bit Rate Register (BRR). Rev. 4.0, 03/03, page 1261 of 1358 SCR2--Serial Control Register 2 Bit : H'FF8A SCI2 7 6 5 4 3 2 1 0 TIE RIE TE RE MPIE TEIE CKE1 CKE0 Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Clock Enable 0 1 0 Asynchronous mode Synchronous mode Internal clock/SCK pin functions as I/O port Internal clock/SCK pin functions as serial clock output 1 Asynchronous mode Synchronous mode Internal clock/SCK pin functions as clock output*1 0 1 Asynchronous mode Synchronous mode Asynchronous mode Synchronous mode Internal clock/SCK pin functions as serial clock output External clock/SCK pin functions as clock input*2 External clock/SCK pin functions as serial clock input External clock/SCK pin functions as clock input*2 External clock/SCK pin functions as serial clock input Notes: *1 Outputs a clock of the same frequency as the bit rate. *2 Inputs a clock with a frequency 16 times the bit rate. Transmit End Interrupt Enable 0 Transmit-end interrupt (TEI) request disabled 1 Transmit-end interrupt (TEI) request enabled Multiprocessor Interrupt Enable 0 1 Multiprocessor interrupts disabled [Clearing conditions] When the MPIE bit is cleared to 0 When data with MPB = 1 is received Multiprocessor interrupts enabled Receive-data-full interrupt (RXI) requests, receive error interrupt (ERI) requests, and setting of the RDRF, FER, and ORER flags in SSR are disabled until data with the multiprocessor bit set to 1 is received Receive Enable 0 Reception disabled 1 Reception enabled Transmit Enable 0 Transmission disabled 1 Transmission enabled Receive Interrupt Enable 0 Receive-data-full interrupt (RXI) request and receive-error interrupt (ERI) request disabled 1 Receive-data-full interrupt (RXI) request and receive-error interrupt (ERI) request enabled Transmit Interrupt Enable 0 Transmit-data-empty interrupt (TXI) request disabled 1 Transmit-data-empty interrupt (TXI) request enabled Rev. 4.0, 03/03, page 1262 of 1358 SCR2--Serial Control Register 2 Bit : H'FF8A Smart Card Interface 2 7 6 5 4 3 2 1 0 TIE RIE TE RE MPIE TEIE CKE1 CKE0 Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Clock Enable SCMR SMR SMIF GM SCR setting CKE1 0 CKE0 SCK pin function See SCI specification 1 0 0 0 Operates as port I/O pin 1 0 0 1 Clock output as SCK output pin 1 1 0 0 Fixed-low output as SCK output pin 1 1 0 1 Clock output as SCK output pin 1 1 1 0 Fixed-high output as SCK output pin 1 1 1 1 Clock output as SCK output pin Transmit End Interrupt Enable 0 Transmit-end interrupt (TEI) request disabled 1 Transmit-end interrupt (TEI) request enabled Multiprocessor Interrupt Enable 0 Multiprocessor interrupts disabled [Clearing conditions] When the MPIE bit is cleared to 0 When data with MPB = 1 is received 1 Multiprocessor interrupts enabled Receive-data-full interrupt (RXI) requests, receive error interrupt (ERI) requests, and setting of the RDRF, FER, and ORER flags in SSR are disabled until data with the multiprocessor bit set to 1 is received Receive Enable 0 Reception disabled 1 Reception enabled Transmit Enable 0 Transmission disabled 1 Transmission enabled Receive Interrupt Enable 0 Receive-data-full interrupt (RXI) request and receive-error interrupt (ERI) request disabled 1 Receive-data-full interrupt (RXI) request and receive-error interrupt (ERI) request enabled Transmit Interrupt Enable 0 Transmit-data-empty interrupt (TXI) request disabled 1 Transmit-data-empty interrupt (TXI) request enabled Rev. 4.0, 03/03, page 1263 of 1358 TDR2--Transmit Data Register 2 Bit H'FF8B SCI2, Smart Card Interface 2 : 7 6 5 4 3 2 1 0 Initial value : 1 1 1 1 1 1 1 1 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Stores data for serial transmission Rev. 4.0, 03/03, page 1264 of 1358 SSR2--Serial Status Register 2 Bit : H'FF8C 7 6 5 4 3 2 1 0 TDRE RDRF ORER FER PER TEND MPB MPBT Initial value : 1 0 0 0 0 1 0 0 Read/Write : R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R R R/W SCI2 Multiprocessor Bit Transfer 0 Data with a 0 multiprocessor bit is transmitted 1 Data with a 1 multiprocessor bit is transmitted Multiprocessor Bit 0 [Clearing condition] When data with a 0 multiprocessor bit is received 1 [Setting condition] When data with a 1 multiprocessor bit is received Transmit End 0 [Clearing conditions] When 0 is written to TDRE after reading TDRE = 1 When the DMAC*1 or DTC is activated by a TXI interrupt and writes data to TDR 1 [Setting conditions] When the TE bit in SCR is 0 When TDRE = 1 at transmission of the last bit of a 1-byte serial transmit character Note: *1 The DMAC is not supported in the H8S/2321. Parity Error 0 [Clearing condition] When 0 is written to PER after reading PER = 1 1 [Setting condition] When, in reception, the number of 1 bits in the receive data plus the parity bit does not match the parity setting (even or odd) specified by the O/E bit in SMR Framing Error 0 [Clearing condition] When 0 is written to FER after reading FER = 1 1 [Setting condition] When the SCI checks the stop bit at the end of the receive data when reception ends, and the stop bit is 0 Overrun Error 0 [Clearing condition] When 0 is written to ORER after reading ORER = 1 1 [Setting condition] When the next serial reception is completed while RDRF = 1 Receive Data Register Full 0 [Clearing conditions] When 0 is written to RDRF after reading RDRF = 1 When the DMAC*1 or DTC is activated by an RXI interrupt and reads data from RDR 1 [Setting condition] When serial reception ends normally and receive data is transferred from RSR to RDR Note: *1 The DMAC is not supported in the H8S/2321. Transmit Data Register Empty 0 [Clearing conditions] When 0 is written to TDRE after reading TDRE = 1 When the DMAC*1 or DTC is activated by a TXI interrupt and writes data to TDR 1 [Setting conditions] When the TE bit in SCR is 0 When data is transferred from TDR to TSR and data can be written to TDR Note: *1 The DMAC is not supported in the H8S/2321. Note: * Can only be written with 0 for flag clearing. Rev. 4.0, 03/03, page 1265 of 1358 SSR2--Serial Status Register 2 Bit : H'FF8C 7 6 5 4 3 2 1 0 TDRE RDRF ORER ERS PER TEND MPB MPBT Initial value : 1 0 0 0 0 1 0 0 Read/Write : R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R R R/W Smart Card Interface 2 Multiprocessor Bit Transfer 0 Data with a 0 multiprocessor bit is transmitted 1 Data with a 1 multiprocessor bit is transmitted Multiprocessor Bit 0 [Clearing condition] When data with a 0 multiprocessor bit is received 1 [Setting condition] When data with a 1 multiprocessor bit is received Transmit End 0 Transmission in progress [Clearing conditions] When 0 is written to TDRE after reading TDRE = 1 When the DMAC*1 or DTC is activated by a TXI interrupt and writes data to TDR 1 Transmission has ended [Setting conditions] On reset, or in standby mode or module stop mode When the TE bit in SCR is 0 and the ERS bit is 0 When TDRE = 1 and ERS = 0 (normal transmission) 2.5 etu after transmission of a 1-byte serial character when GM = 0 and BLK = 0 When TDRE = 1 and ERS = 0 (normal transmission) 1.5 etu after transmission of a 1-byte serial character when GM = 0 and BLK = 1 When TDRE = 1 and ERS = 0 (normal transmission) 1.0 etu after transmission of a 1-byte serial character when GM = 1 and BLK = 0 When TDRE = 1 and ERS = 0 (normal transmission) 1.0 etu after transmission of a 1-byte serial character when GM = 1 and BLK = 1 Notes: etu: Elementary Time Unit (time for transfer of 1 bit) *1 The DMAC is not supported in the H8S/2321. Parity Error 0 [Clearing condition] When 0 is written to PER after reading PER = 1 1 [Setting condition] When, in reception, the number of 1 bits in the receive data plus the parity bit does not match the parity setting (even or odd) specified by the O/E bit in SMR Error Signal Status 0 Data has been received normally, and there is no error signal [Clearing conditions] On reset, or in standby mode or module stop mode When 0 is written to ERS after reading ERS =1 1 Error signal indicating detection of parity error has been sent by receiving device [Setting condition] When the error signal is sampled at the low level Note: Clearing the TE bit in SCR to 0 does not affect the ERS flag, which retains its prior state. Overrun Error 0 [Clearing condition] When 0 is written to ORER after reading ORER = 1 1 [Setting condition] When the next serial reception is completed while RDRF = 1 Receive Data Register Full 0 [Clearing conditions] When 0 is written to RDRF after reading RDRF = 1 When the DMAC*1 or DTC is activated by an RXI interrupt and reads data from RDR 1 [Setting condition] When serial reception ends normally and receive data is transferred from RSR to RDR Note: *1 The DMAC is not supported in the H8S/2321. Transmit Data Register Empty 0 [Clearing conditions] When 0 is written to TDRE after reading TDRE = 1 When the DMAC*1 or DTC is activated by a TXI interrupt and writes data to TDR 1 [Setting conditions] When the TE bit in SCR is 0 When data is transferred from TDR to TSR and data can be written to TDR Note: *1 The DMAC is not supported in the H8S/2321. Note: * Can only be written with 0 for flag clearing. Rev. 4.0, 03/03, page 1266 of 1358 RDR2--Receive Data Register 2 Bit H'FF8D SCI2, Smart Card Interface 2 : 7 6 5 4 3 2 1 0 Initial value : 0 0 0 0 0 0 0 0 Read/Write : R R R R R R R R Stores received serial data SCMR2--Smart Card Mode Register 2 Bit : Initial value : 7 1 6 1 5 1 H'FF8E SCI2, Smart Card Interface 2 4 1 Read/Write : 3 2 SDIR SINV 1 0 0 R/W R/W 0 SMIF 1 0 R/W Smart Card Interface Mode Select 0 Smart card interface function is disabled 1 Smart card interface function is enabled Smart Card Data Invert 0 TDR contents are transmitted as they are Receive data is stored in RDR as it is 1 TDR contents are inverted before being transmitted Receive data is stored in RDR in inverted form Smart Card Data Direction 0 TDR contents are transmitted LSB-first Receive data is stored in RDR LSB-first 1 TDR contents are transmitted MSB-first Receive data is stored in RDR MSB-first Rev. 4.0, 03/03, page 1267 of 1358 ADDRAH ADDRAL ADDRBH ADDRBL ADDRCH ADDRCL ADDRDH ADDRDL -- -- -- -- -- -- -- -- Bit : A/D Data Register AH A/D Data Register AL A/D Data Register BH A/D Data Register BL A/D Data Register CH A/D Data Register CL A/D Data Register DH A/D Data Register DL 15 14 13 12 11 H'FF90 H'FF91 H'FF92 H'FF93 H'FF94 H'FF95 H'FF96 H'FF97 10 9 8 7 6 A/D Converter A/D Converter A/D Converter A/D Converter A/D Converter A/D Converter A/D Converter A/D Converter 5 4 3 2 1 0 AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 AD1 AD0 Initial value : 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Read/Write : R R R R R R R R R R R R R R R R Stores the results of A/D conversion Analog Input Channel A/D Data Register Group 0 Group 1 AN0 AN4 ADDRA AN1 AN5 ADDRB AN2 AN6 ADDRC AN3 AN7 ADDRD Rev. 4.0, 03/03, page 1268 of 1358 ADCSR--A/D Control/Status Register Bit : Initial value : Read/Write : H'FF98 A/D Converter 7 6 5 4 3 2 1 0 ADF ADIE ADST SCAN CKS CH2 CH1 CH0 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W *1 R/(W) Channel Select Note: These bits select the analog input channels. Ensure that conversion is halted (ADST = 0) before making a channel selection. Group Selection Channel Selection CH2 CH1 CH0 0 0 0 1 0 1 0 1 0 1 1 1 0 1 Single Mode Scan Mode (SCAN = 0) (SCAN = 1) AN0 (Initial value) AN1 AN2 AN3 AN4 AN5 AN6 AN7 AN0 AN0, AN1 AN0 to AN2 AN0 to AN3 AN4 AN4, AN5 AN4 to AN6 AN4 to AN7 Clock Select Note: CKS is used in combination with bit 3 (CKS1) of ADCR. See ADCR A/D Control Register H'FF99 A/D Converter. Scan Mode 0 Single mode 1 Scan mode A/D Start 0 1 A/D conversion stopped Single mode: A/D conversion is started. Cleared to 0 automatically when conversion ends Scan mode: A/D conversion is started. Conversion continues sequentially on the selected channels until ADST is cleared to 0 by software, a reset, or transition to standby mode or module stop mode A/D Interrupt Enable A/D End Flag 0 A/D conversion end interrupt request disabled 1 A/D conversion end interrupt request enabled 0 [Clearing conditions] When 0 is written to the ADF flag after reading ADF = 1 When the DMAC*2 or DTC is activated by an ADI interrupt, and ADDR is read 1 [Setting conditions] Single mode: When A/D conversion ends Scan mode: When A/D conversion ends on all specified channels Notes: *1 Can only be written with 0 for flag clearing. *2 The DMAC is not supported in the H8S/2321. Rev. 4.0, 03/03, page 1269 of 1358 ADCR--A/D Control Register Bit : H'FF99 7 6 TRGS1 TRGS0 Initial value : 0 0 Read/Write : R/W R/W 5 1 4 1 A/D Converter 3 2 CKS1 CH3 1 1 R/W R/W 1 0 1 1 Channel Select Reserved Only 1 should be written to this bit Clock Select Bit 3 ADCSR Bit 3 CKS1 CKS 0 0 Conversion time = 530 states (max) 1 Conversion time = 68 states (max) 0 Conversion time = 266 states (max) 1 Conversion time = 134 states (max) 1 Description (Initial value) Timer Trigger Select Description TRGS1 TRGS1 0 1 0 A/D conversion start by external trigger is disabled 1 A/D conversion start by external trigger (TPU) is enabled 0 A/D conversion start by external trigger (8-bit timer) is enabled 1 A/D conversion start by external trigger pin (ADTRG) is enabled Rev. 4.0, 03/03, page 1270 of 1358 DADR0--D/A Data Register 0 DADR1--D/A Data Register 1 Bit H'FFA4 H'FFA5 D/A Converter D/A Converter : 7 6 5 4 3 2 1 0 Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Stores data for D/A conversion Rev. 4.0, 03/03, page 1271 of 1358 DACR01--D/A Control Register 01 Bit : H'FFA6 7 6 5 DAOE1 DAOE0 DAE Initial value : 0 0 0 Read/Write : R/W R/W R/W D/A Converter 4 3 2 1 0 1 1 1 1 1 D/A Output Enable 0 0 Analog output DA0 is disabled 1 Channel 0 D/A conversion is enabled Analog output DA0 is enabled D/A Output Enable 1 0 Analog output DA1 is disabled 1 Channel 1 D/A conversion is enabled Analog output DA1 is enabled D/A Conversion Control DAOE1 DAOE0 DAE Description 0 0 * Channel 0 and 1 D/A conversion disabled 1 0 Channel 0 D/A conversion enabled Channel 1 D/A conversion disabled 1 0 1 Channel 0 and 1 D/A conversion enabled 0 Channel 0 D/A conversion disabled Channel 1 D/A conversion enabled 1 1 Channel 0 and 1 D/A conversion enabled * Channel 0 and 1 D/A conversion enabled * : Don t care Rev. 4.0, 03/03, page 1272 of 1358 PFCR2--Port Function Control Register 2 Bit : 7 H'FFAC 5 6 4 3 WAITPS BREQOPS CS167E CS25E Initial value : 0 0 1 1 Read/Write : R/W R/W R/W R/W Ports 2 1 0 0 0 0 R R R ASOD R/W AS Output Disable 0 1 PF6 is designated as AS output pin PF6 is designated as I/O port, and does not function as AS output pin Note: This bit is valid in modes 4 to 6. CS25 Enable 0 CS2, CS3, CS4, and CS5 output disabled (can be used as I/O ports) 1 CS2, CS3, CS4, and CS5 output enabled Note: Clear the DDR bits to 0 before changing the CS25E setting. CS167 Enable 0 CS1, CS6, and CS7 output disabled (can be used as I/O ports) 1 CS1, CS6, and CS7 output enabled Note: Clear the DDR bits to 0 before changing the CS167E setting. BREQO Pin Select 0 1 BREQO output is PF2 pin BREQO output is P53 pin Note: Set BREQOPS before setting the BREQOE bit in BCRL to 1. WAIT Pin Select 0 1 WAIT input is PF2 pin WAIT input is P53 pin Note: Set WAITPS before setting the WAITE bit in BCRL to 1. Rev. 4.0, 03/03, page 1273 of 1358 TCR0--Time Control Register 0 TCR1--Time Control Register 1 Bit : H'FFB0 H'FFB1 8-Bit Timer Channel 0 8-Bit Timer Channel 1 7 6 5 4 3 2 1 0 CMIEB CMIEA OVIE CCLR1 CCLR0 CKS2 CKS1 CKS0 Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Clock Select 0 0 1 1 0 1 0 Clock input disabled 1 Internal clock: counted at falling edge of /8 0 Internal clock: counted at falling edge of /64 1 Internal clock: counted at falling edge of /8192 0 For channel 0: Count at TCNT1 overflow signal* For channel 1: Count at TCNT0 compare match A* 1 External clock: counted at rising edge 0 External clock: counted at falling edge 1 External clock: counted at both rising and falling edges Note: * If the count input of channel 0 is the TCNT1 overflow signal and that of channel 1 is the TCNT0 compare match signal, no incrementing clock is generated. Do not use this setting. Counter Clear 0 1 0 Clear is disabled 1 Clear by compare match A 0 Clear by compare match B 1 Clear by rising edge of external reset input Timer Overflow Interrupt Enable 0 OVF interrupt requests (OVI) are disabled 1 OVF interrupt requests (OVI) are enabled Compare Match Interrupt Enable A 0 CMFA interrupt requests (CMIA) are disabled 1 CMFA interrupt requests (CMIA) are enabled Compare Match Interrupt Enable B 0 CMFB interrupt requests (CMIB) are disabled 1 CMFB interrupt requests (CMIB) are enabled Rev. 4.0, 03/03, page 1274 of 1358 TCSR0--Timer Control/Status Register 0 TCSR1--Timer Control/Status Register 1 TCSR0 Bit : H'FFB2 H'FFB3 8-Bit Timer Channel 0 8-Bit Timer Channel 1 7 6 5 4 3 2 1 0 CMFB CMFA OVF ADTE OS3 OS2 OS1 OS0 Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/(W)* R/(W)* R/(W)* R/W R/W R/W R/W R/W 4 TCSR1 Bit : 7 6 5 CMFB CMFA OVF Initial value : 0 0 0 Read/Write : R/(W)* R/(W)* R/(W)* 1 3 2 1 0 OS3 OS2 OS1 OS0 0 0 0 0 R/W R/W R/W R/W Output Select 0 0 1 1 0 1 No change when compare match A occurs 0 is output when compare match A occurs 1 is output when compare match A occurs Output is inverted when compare match A occurs (toggle output) Output Select 0 1 0 No change when compare match B occurs 1 0 is output when compare match B occurs 0 1 is output when compare match B occurs 1 Output is inverted when compare match B occurs (toggle output) A/D Trigger Enable (TCSR0 only) 0 A/D converter start requests by compare match A are disabled 1 A/D converter start requests by compare match A are enabled Timer Overflow Flag 0 [Clearing condition] When 0 is written to OVF after reading OVF = 1 1 [Setting condition] When TCNT overflows (changes from H'FF to H'00) Compare Match Flag A 0 [Clearing conditions] When 0 is written to CMFA after reading CMFA = 1 When the DTC is activated by a CMIA interrupt, while the DISEL bit of MRB in DTC is 0 1 [Setting condition] When TCNT matches TCORA Compare Match Flag B 0 [Clearing conditions] When 0 is written to CMFB after reading CMFB = 1 When the DTC is activated by a CMIB interrupt, while the DISEL bit of MRB in DTC is 0 1 [Setting condition] When TCNT matches TCORB Note: * Only 0 can be written to bits 7 to 5, to clear these flags. Rev. 4.0, 03/03, page 1275 of 1358 TCORA0--Time Constant Register A0 TCORA1--Time Constant Register A1 H'FFB4 H'FFB5 8-Bit Timer Channel 0 8-Bit Timer Channel 1 TCORA0 Bit TCORA1 : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Initial value : 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W TCORB0--Time Constant Register B0 TCORB1--Time Constant Register B1 H'FFB6 H'FFB7 8-Bit Timer Channel 0 8-Bit Timer Channel 1 TCORB0 Bit TCORB1 : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Initial value : 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W TCNT0--Timer Counter 0 TCNT1--Timer Counter 1 H'FFB8 H'FFB9 8-Bit Timer Channel 0 8-Bit Timer Channel 1 TCNT0 Bit : Initial value : Read/Write : TCNT1 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Rev. 4.0, 03/03, page 1276 of 1358 TCSR--Timer Control/Status Register Bit : Initial value : Read/Write*1 : 7 6 5 OVF WT/IT TME 0 0 0 R/(W)*2 R/W R/W H'FFBC (W), H'FFBC (R) 4 3 1 WDT 2 1 0 CKS2 CKS1 CKS0 0 0 0 R/W R/W R/W 1 Clock Select CKS2 CKS1 CKS0 0 0 1 1 0 1 Clock Overflow period* (when f = 20 MHz) 0 f/2 (Initial value) 25.6 s 1 f/64 819.2 s 0 f/128 1.6 ms 1 f/512 6.6 ms 0 f/2048 26.2 ms 1 f/8192 104.9 ms 0 f/32768 419.4 ms 1 f/131072 1.68 s Note: * The overflow period is the time from when TCNT starts counting up from H'00 until overflow occurs. Timer Enable 0 TCNT is initialized to H'00 and halted 1 TCNT counts Timer Mode Select 0 1 Interval timer mode: Sends the CPU an interval timer interrupt request (WOVI) when TCNT overflows Watchdog timer mode: Generates the WDTOVF signal*1 when TCNT overflows*2 Notes: *1 The WDTOVF pin function is not available in the F-ZTAT versions. *2 For details of the case where TCNT overflows in watchdog timer mode, see section 13.2.3, Reset Control/Status Register (RSTCSR). Overflow Flag 0 [Clearing condition] When 0 is written to OVF after reading OVF = 1 1 [Setting condition] When TCNT overflows from H'FF to H'00 in interval timer mode Notes: *1 The method for writing to TCSR is different from that for general registers to prevent accidental overwriting. For details, see section 13.2.4, Notes on Register Access. *2 Can only be written with 0 for flag clearing. Rev. 4.0, 03/03, page 1277 of 1358 TCNT--Timer Counter Bit H'FFBC (W), H'FFBD (R) WDT : 7 6 5 4 3 2 1 0 Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W RSTCSR--Reset Control/Status Register Bit : 7 6 WOVF RSTE Initial value : 0 Read/Write : R/(W)* H'FFBE (W), H'FFBF (R) WDT 5 4 3 2 1 0 0 0 1 1 1 1 1 R/W R/W Reserved This bit should be written with 0 Reset Enable 0 Reset signal is not generated if TCNT overflows* 1 Reset signal is generated if TCNT overflows Note: * The modules in the H8S/2329 and H8S/2328 Series are not reset, but TCNT and TCSR in WDT are reset. Watchdog Timer Overflow Flag 0 [Clearing condition] When 0 is written to WOVF after reading RSTCSR when WOVF = 1 1 [Setting condition] When TCNT overflows (changes from H'FF to H'00) during watchdog timer operation Note: * Can only be written with 0 for flag clearing. The method for writing to RSTCSR is different from that for general registers to prevent accidental overwriting. For details, see section 13.2.4, Notes on Register Access. Rev. 4.0, 03/03, page 1278 of 1358 TSTR--Timer Start Register Bit : 7 6 Initial value : 0 0 Read/Write : H'FFC0 TPU 5 4 3 2 1 0 CST5 CST4 CST3 CST2 CST1 CST0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W Counter Start 0 TCNTn count operation is stopped 1 TCNTn performs count operation (n = 5 to 0) Note: If 0 is written to the CST bit during operation with the TIOC pin designated for output, the counter stops but the TIOC pin output compare output level is retained. If TIOR is written to when the CST bit is cleared to 0, the pin output level will be changed to the set initial output value. TSYR--Timer Synchro Register Bit : Initial value : Read/Write : 7 0 6 0 H'FFC1 TPU 5 4 3 2 1 0 SYNC5 SYNC4 SYNC3 SYNC2 SYNC1 SYNC0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W Timer Synchronization 0 TCNTn operates independently (TCNT presetting/ clearing is unrelated to other channels) 1 TCNTn performs synchronous operation TCNT synchronous presetting/synchronous clearing is possible (n = 5 to 0) Notes: 1. To set synchronous operation, the SYNC bits for at least two channels must be set to 1. 2. To set synchronous clearing, in addition to the SYNC bit , the TCNT clearing source must also be set by means of bits CCLR2 to CCLR0 in TCR. Rev. 4.0, 03/03, page 1279 of 1358 FLMCR1--Flash Memory Control Register 1 H'FFC8 (H8S/2329 F-ZTAT, H8S/2328 F-ZTAT) Flash Memory 7 6 5 4 3 2 1 0 FWE SWE ESU PSU EV PV E P Initial value : * 0 0 0 0 0 0 0 Read/Write : R R/W R/W R/W R/W R/W R/W R/W Bit : Program 0 Program mode cleared 1 Transition to program mode [Setting condition] When FWE = 1, SWE = 1, and PSU = 1 Erase 0 Erase mode cleared 1 Transition to erase mode [Setting condition] When FWE = 1, SWE = 1, and ESU = 1 Program-Verify 0 Program-verify mode cleared 1 Transition to program-verify mode [Setting condition] When FWE = 1 and SWE = 1 Erase-Verify 0 Erase-verify mode cleared 1 Transition to erase-verify mode [Setting condition] When FWE = 1 and SWE = 1 Program Setup Software Write Enable 0 Program setup cleared 1 Program setup [Setting condition] When FWE = 1 and SWE = 1 Erase Setup 0 Writes disabled 0 Erase setup cleared 1 Writes enabled [Setting condition] When FWE = 1 1 Erase setup [Setting condition] When FWE = 1 and SWE = 1 Flash Write Enable 0 When a low level is input to the FWE pin (hardware-protected state) 1 When a high level is input to the FWE pin Note: * Determined by the state of the FWE pin (H8S/2328 F-ZTAT). The FWE bit is fixed high in the H8S/2329 F-ZTAT. Rev. 4.0, 03/03, page 1280 of 1358 FLMCR1--Flash Memory Control Register 1 (H8S/2326 F-ZTAT) Bit : Initial value : R/W : H'FFC8 Flash Memory 7 6 5 4 3 2 1 0 FWE SWE1 ESU1 PSU1 EV1 PV1 E1 P1 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W *1 R Program 1*2 0 1 Program mode cleared Transition to program mode [Setting condition] When FWE = 1, SWE1 = 1, and PSU1 = 1 Erase 1*2 0 Erase mode cleared 1 Transition to erase mode [Setting condition] When FWE = 1, SWE1 = 1, and ESU1 = 1 Program-Verify 1*2 0 Program-verify mode cleared 1 Transition to program-verify mode [Setting condition] When FWE = 1 and SWE1 = 1 Erase-Verify 1*2 0 Erase-verify mode cleared 1 Transition to erase-verify mode [Setting condition] When FWE = 1 and SWE1 = 1 Program Setup 1*2 0 Program setup cleared 1 Program setup [Setting condition] When FWE = 1 and SWE1 = 1 Erase Setup 1*2 0 Erase setup cleared 1 Erase setup [Setting condition] When FWE = 1 and SWE1 = 1 Software Write Enable 1*2 0 Writes disabled 1 Writes enabled [Setting condition] When FWE = 1 Flash Write Enable 0 When a low level is input to the FWE pin (hardware-protected state) 1 When a high level is input to the FWE pin Notes: *1 Determined by the state of the FWE pin. *2 Applicable addresses are H'000000 to H'03FFFF. Rev. 4.0, 03/03, page 1281 of 1358 FLMCR2--Flash Memory Control Register 2 H'FFC9 (H8S/2329 F-ZTAT, H8S/2328 F-ZTAT) Bit : 7 Flash Memory 6 5 4 3 2 1 0 0 0 0 0 0 0 0 FLER Initial value : 0 Read/Write : R Flash Memory Error 0 Flash memory is operating normally Flash memory program/erase protection (error protection) is disabled [Clearing condition] Reset or hardware standby mode 1 An error has occurred during flash memory programming/erasing Flash memory program/erase protection (error protection) is enabled [Setting condition] See section 19.8.3, Error Protection. (H8S/2329 F-ZTAT) See section 19.17.3, Error Protection. (H8S/2328 F-ZTAT) Rev. 4.0, 03/03, page 1282 of 1358 FLMCR2--Flash Memory Control Register 2 (H8S/2326 F-ZTAT) Bit : H'FFC9 Flash Memory 7 6 5 4 3 2 1 0 FLER SWE2 ESU2 PSU2 EV2 PV2 E2 P2 Initial value : 0 0 0 0 0 0 0 0 R/W R R/W R/W R/W R/W R/W R/W R/W : Program 2* 0 1 Program mode cleared Transition to program mode [Setting condition] When FWE = 1, SWE2 = 1, and PSU2 = 2 Erase 2* 0 Erase mode cleared 1 Transition to erase mode [Setting condition] When FWE = 1, SWE2 = 1, and ESU2 = 1 Program-Verify 2* 0 Program-verify mode cleared 1 Transition to program-verify mode [Setting condition] When FWE = 1 and SWE2 = 1 Erase-Verify 2* 0 Erase-verify mode cleared 1 Transition to erase-verify mode [Setting condition] When FWE = 1 and SWE2 = 1 Program Setup 2* 0 Program setup cleared 1 Program setup [Setting condition] When FWE = 1 and SWE2 = 1 Erase Setup 2* 0 Erase setup cleared 1 Erase setup [Setting condition] When FWE = 1 and SWE2 = 1 Software Write Enable 2* 0 Writes disabled 1 Writes enabled [Setting condition] When FWE = 1 Flash Memory Error 0 Flash memory is operating normally Flash memory program/erase protection (error protection) disabled [Clearing condition] Reset or hardware standby mode 1 An error occurred during flash memory programming/erasing Flash memory program/erase protection (error protection) enabled [Setting condition] See section 19.26.3, Error Protection Note: * Applicable addresses are H'040000 to H'07FFFF. Rev. 4.0, 03/03, page 1283 of 1358 EBR1--Erase Block Register 1 (H8S/2329 F-ZTAT, H8S/2328 F-ZTAT) EBR2--Erase Block Register 2 (H8S/2329 F-ZTAT, H8S/2328 F-ZTAT) Bit : EBR1 H'FFCA Flash Memory H'FFCB Flash Memory 7 6 5 4 3 2 1 0 EB7 EB6 EB5 EB4 EB3 EB2 EB1 EB0 Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W 7 6 Bit : EBR2 Initial value : 0 0 Read/Write : 5 4 3 2 1 0 EB13* EB12* EB11 EB10 EB9 EB8 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W Note: * Valid only in the H8S/2329 F-ZTAT. Rev. 4.0, 03/03, page 1284 of 1358 EBR1--Erase Block Register 1 (H8S/2326 F-ZTAT) EBR2--Erase Block Register 2 (H8S/2326 F-ZTAT) Bit : EBR1 H'FFCA Flash Memory H'FFCB Flash Memory 7 6 5 4 3 2 1 0 EB7 EB6 EB5 EB4 EB3 EB2 EB1 EB0 Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W 7 6 5 4 3 2 1 0 EB15 EB14 EB13 EB12 EB11 EB10 EB9 EB8 Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Bit : EBR2 Rev. 4.0, 03/03, page 1285 of 1358 FCCS--Flash Code Control Status Register Bit : 7 6 5 4 H'FFC4 FLASH (Valid only in the H8S/2326C F-ZTAT) 3 2 1 0 3/4 3/4 3/4 FLER 3/4 3/4 3/4 SCO Initial value : 1 0 0 0 0 0 0 0 Read/Write : R R R R R R R (R)/W Source Program Copy Operation 0 Download of the on-chip programming/ erasing program to the on-chip RAM is not executed [Clearing condition] When download is completed 1 Request that the on-chip programming/ erasing program is downloaded to the on-chip RAM is occurred [Setting conditions] When all of the following conditions are satisfied and 1 is written to this bit * FKEY is written to H'A5 * During execution in the on-chip RAM * Not in RAM emulation mode (RAMS in RAMER = 0) Reserved bits These bits are always read as 0. The write value should always be 0. Flash Memory Error 0 Flash memory operates normally Programming/erasing protection for flash memory (error protection) is invalid. [Clearing condition] At a power-on reset or in hardware standby mode 1 Indicates an error occurs during programming/erasing flash memory. Programming/erasing protection for flash memory (error protection) is valid. [Setting condition] See section 19.34.3, Error Protection Reserved bits These bits are always read as 0. The write value should always be 0. Reserved bit This bit is always read as 1. The write value should always be 1. Rev. 4.0, 03/03, page 1286 of 1358 FPCS--Flash Program Code Select Register Bit : 7 6 5 4 H'FFC5 FLASH (Valid only in the H8S/2326C F-ZTAT) 3 2 1 0 3/4 3/4 3/4 3/4 3/4 3/4 3/4 PPVS Initial value : 0 0 0 0 0 0 0 0 Read/Write : R R R R R R R R/W Program Pulse Verify 0 On-chip programming program is not selected [Clearing condition] When transfer is completed 1 On-chip programming program is selected Reserved bits These bits are always read as 0. The write value should always be 0. FECS--Flash Erase Code Select Register Bit : 7 3/4 6 3/4 5 3/4 4 3/4 H'FFC6 FLASH (Valid only in the H8S/2326C F-ZTAT) 3 3/4 2 1 3/4 3/4 0 EPVB Initial value : 0 0 0 0 0 0 0 0 Read/Write : R R R R R R R R/W Erase Pulse Verify Block 0 On-chip erasing program is not selected [Clearing condition] When transfer is completed 1 On-chip erasing program is selected Reserved bits These bits are always read as 0. The write value should always be 0. Rev. 4.0, 03/03, page 1287 of 1358 FKEY--Flash Key Code Register Bit : H'FFC8 FLASH (Valid only in the H8S/2326C F-ZTAT) 7 6 5 4 3 2 1 0 K7 K6 K5 K4 K3 K2 K1 K0 Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Key Code H'A5 Writing to the SCO bit is enabled (The SCO bit cannot be set by the value other than H'A5.) H'5A Programming/erasing is enabled (The value other than H'5A is in software protection state.) H'00 Initial value FMATS--Flash MAT Select Register Bit : H'FFC9 FLASH (Valid only in the H8S/2326C F-ZTAT) 7 6 5 4 3 2 1 0 MS7 MS6 MS5 MS4 MS3 MS2 MS1 MS0 Initial value : 0 0 0 0 0 0 0 0 (When not in user boot mode) Initial value : 1 0 1 0 1 0 1 0 (When in user boot mode) Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W MAT Select H'AA The user boot MAT is selected (in user-MAT selection state when the value of these bits are other than H'AA) Initial value when these bits are initiated in user boot mode. H'00 Initial value when these bits are initiated in a mode except for user boot mode (in user-MAT selection state) [Programmable condition] These bits are in the execution state in the on-chip RAM. Rev. 4.0, 03/03, page 1288 of 1358 FTDAR--Flash Transfer Destination Address Register H'FFCA FLASH (Valid only in the H8S/2326C F-ZTAT) Bit : 7 6 5 4 3 2 1 0 TDER TDA6 TDA5 TDA4 TDA3 TDA2 TDA1 TDA0 Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W Transfer Destination Address TDA6 to TDA0 Description H'00 Download start address is set to H'FFBC00 H'01 Download start address is set to H'FFCC00 H'02 Download start address is set to H'FFDC00 H'03 Download start address is set to H'FFEC00 H'04 to H'7F Setting prohibited. If this value is set, the TDER bit (bit 7) is set to 1 to abort the download processing. Transfer Destination Address Setting Error 0 Setting of TDA6 to TDA0 is normal 1 Setting of TDER and TDA4 to TDA0 is H'04 to H'FF and download has been aborted Rev. 4.0, 03/03, page 1289 of 1358 TCR0--Timer Control Register 0 Bit : 7 6 5 H'FFD0 4 3 TPU0 2 1 0 TPSC0 CCLR2 CCLR1 CCLR0 TPSC2 TPSC1 Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W CKEG1 CKEG0 Time Prescaler 0 0 1 1 0 1 0 Internal clock: counts on f/1 1 Internal clock: counts on f/4 0 Internal clock: counts on f/16 1 Internal clock: counts on f/64 0 External clock: counts on TCLKA pin input 1 External clock: counts on TCLKB pin input 0 External clock: counts on TCLKC pin input 1 External clock: counts on TCLKD pin input Clock Edge 0 0 Count at rising edge 1 Count at falling edge 1 Count at both edges Counter Clear 0 0 1 1 0 1 0 TCNT clearing disabled 1 TCNT cleared by TGRA compare match/input capture 0 TCNT cleared by TGRB compare match/input capture 1 TCNT cleared by counter clearing for another channel performing synchronous clearing/synchronous operation*1 0 TCNT clearing disabled 1 TCNT cleared by TGRC compare match/input capture*2 0 TCNT cleared by TGRD compare match/input capture*2 1 TCNT cleared by counter clearing for another channel performing synchronous clearing/synchronous operation*1 Notes: *1 Synchronous operation setting is performed by setting the SYNC bit in TSYR to 1. *2 When TGRC or TGRD is used as a buffer register, TCNT is not cleared because the buffer register setting has priority, and compare match/input capture does not occur. Rev. 4.0, 03/03, page 1290 of 1358 TMDR0--Timer Mode Register 0 Bit : Initial value : Read/Write : 7 1 6 1 H'FFD1 TPU0 5 4 3 2 1 0 BFB BFA MD3 MD2 MD1 MD0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W Mode 0 0 0 1 1 0 1 1 * * 0 Normal operation 1 Reserved 0 PWM mode 1 1 PWM mode 2 0 Phase counting mode 1 1 Phase counting mode 2 0 Phase counting mode 3 1 Phase counting mode 4 * * : Don t care Notes: *1 MD3 is a reserved bit. In a write, it should always be written with 0. *2 Phase counting mode cannot be set for channels 0 and 3. In this case, 0 should always be written to MD2. TGRA Buffer Operation 0 TGRA operates normally 1 TGRA and TGRC used together for buffer operation TGRB Buffer Operation 0 TGRB operates normally 1 TGRB and TGRD used together for buffer operation Rev. 4.0, 03/03, page 1291 of 1358 TIOR0H--Timer I/O Control Register 0H Bit : H'FFD2 TPU0 7 6 5 4 3 2 1 0 IOB3 IOB2 IOB1 IOB0 IOA3 IOA2 IOA1 IOA0 Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W TGR0A I/O Control 0 0 0 1 1 0 1 0 TGR0A Output disabled is output 1 compare Initial output is 0 output 0 register 0 output at compare match 1 Toggle output at compare match 0 Output disabled 1 Initial output is 1 output 0 1 1 0 1 0 0 0 0 1 1 0 0 1 Toggle output at compare match Capture input source is TIOCA0 pin 1 * * Capture input Input capture at TCNT1 count-up/ source is channel count-down 1/count clock 0 0 Output disabled 1 Initial output is 0 output 0 0 1 1 1 * * * Input capture at rising edge Input capture at falling edge Input capture at both edges 0 output at compare match 1 output at compare match Toggle output at compare match 0 1 1 1 output at compare match * : Don t care TGR0B Output disabled is output compare Initial output is register 0 output 1 1 0 output at compare match 0 TGR0A is input 1 capture * register TGR0B I/O Control 0 1 output at compare match 0 output at compare match 1 output at compare match Toggle output at compare match TGR0B is input capture register Capture input source is TIOCB0 pin Input capture at rising edge Input capture at falling edge Input capture at both edges Capture input Input capture at TCNT1 count-up/ source is channel count-down*1 1/count clock * : Don t care Note: *1 When bits TPSC2 to TPSC0 in TCR1 are set to B'000, and f/1 is used as the TCNT1 count clock, this setting is invalid and input capture does not occur. Rev. 4.0, 03/03, page 1292 of 1358 TIOR0L--Timer I/O Control Register 0L Bit H'FFD3 TPU0 : 7 6 5 4 3 2 1 0 : IOD3 IOD2 IOD1 IOD0 IOC3 IOC2 IOC1 IOC0 Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W TGR0C I/O Control 0 0 0 0 1 1 0 TGR0C Output disabled is output compare Initial output is register 0 output 1 1 0 1 0 0 Output disabled 1 Initial output is 1 output 0 0 1 1 1 * * * 1 output at compare match Toggle output at compare match 0 1 1 0 output at compare match 0 output at compare match 1 output at compare match Toggle output at compare match TGR0C is input capture register Capture input source is TIOCC0 pin Input capture at rising edge Input capture at falling edge Input capture at both edges Capture input Input capture at TCNT1 count-up/ source is channel count-down 1/count clock * : Don t care Note: When the BFA bit in TMDR0 is set to 1 and TGR0C is used as a buffer register, this setting is invalid and input capture/output compare does not occur. TGR0D I/O Control 0 0 0 0 1 1 0 TGR0D Output disabled is output compare Initial output is register 0 output *2 1 1 0 1 0 0 Output disabled 1 Initial output is 1 output 0 0 1 1 1 * * * 1 output at compare match Toggle output at compare match 0 1 1 0 output at compare match 0 output at compare match 1 output at compare match Toggle output at compare match TGR0D is input capture register Capture input source is TIOCD0 pin Input capture at rising edge Capture input source is channel 1/count clock Input capture at TCNT1 count-up/ count-down*1 Input capture at falling edge Input capture at both edges *2 * : Don t care Notes: *1 When bits TPSC2 to TPSC0 in TCR1 are set to B'000, and f/1 is used as the TCNT1 count clock, this setting is invalid and input capture does not occur. *2 When the BFB bit in TMDR0 is set to 1 and TGR0D is used as a buffer register, this setting is invalid and input capture/output compare does not occur. Note: When TGRC or TGRD is designated for buffer operation, this setting is invalid and the register operates as a buffer register. Rev. 4.0, 03/03, page 1293 of 1358 TIER0--Timer Interrupt Enable Register 0 Bit : 7 6 5 TTGE Initial value : 0 Read/Write : R/W 1 0 H'FFD4 TPU0 4 3 2 1 0 TCIEV TGIED TGIEC TGIEB TGIEA 0 0 0 0 0 R/W R/W R/W R/W R/W TGR Interrupt Enable A 0 Interrupt request (TGIA) by TGFA bit disabled 1 Interrupt request (TGIA) by TGFA bit enabled TGR Interrupt Enable B 0 Interrupt request (TGIB) by TGFB bit disabled 1 Interrupt request (TGIB) by TGFB bit enabled TGR Interrupt Enable C 0 Interrupt request (TGIC) by TGFC bit disabled 1 Interrupt request (TGIC) by TGFC bit enabled TGR Interrupt Enable D 0 Interrupt request (TGID) by TGFD bit disabled 1 Interrupt request (TGID) by TGFD bit enabled Overflow Interrupt Enable 0 Interrupt request (TCIV) by TCFV disabled 1 Interrupt request (TCIV) by TCFV enabled A/D Conversion Start Request Enable 0 A/D conversion start request generation disabled 1 A/D conversion start request generation enabled Rev. 4.0, 03/03, page 1294 of 1358 TSR0--Timer Status Register 0 Bit : Initial value : Read/Write : 7 1 6 1 5 0 H'FFD5 4 3 2 1 0 TCFV TGFD TGFC TGFB TGFA 0 R/(W)* 0 R/(W)* 0 R/(W)* 0 R/(W)* 0 R/(W)* TPU0 Input Capture/Output Compare Flag A 0 [Clearing conditions] When DTC is activated by TGIA interrupt while DISEL bit of MRB in DTC is 0 When DMAC*1 is activated by TGIA interrupt while DTA bit of DMABCR in DMAC*1 is 1 When 0 is written to TGFA after reading TGFA = 1 1 [Setting conditions] When TCNT = TGRA while TGRA is functioning as output compare register When TCNT value is transferred to TGRA by input capture signal while TGRA is functioning as input capture register Note: *1 The DMAC is not supported in the H8S/2321. Input Capture/Output Compare Flag B 0 [Clearing conditions] When DTC is activated by TGIB interrupt while DISEL bit of MRB in DTC is 0 When 0 is written to TGFB after reading TGFB = 1 1 [Setting conditions] When TCNT = TGRB while TGRB is functioning as output compare register When TCNT value is transferred to TGRB by input capture signal while TGRB is functioning as input capture register Input Capture/Output Compare Flag C 0 [Clearing conditions] When DTC is activated by TGIC interrupt while DISEL bit of MRB in DTC is 0 When 0 is written to TGFC after reading TGFC = 1 1 [Setting conditions] When TCNT = TGRC while TGRC is functioning as output compare register When TCNT value is transferred to TGRC by input capture signal while TGRC is functioning as input capture register Input Capture/Output Compare Flag D 0 [Clearing conditions] When DTC is activated by TGID interrupt while DISEL bit of MRB in DTC is 0 When 0 is written to TGFD after reading TGFD = 1 1 [Setting conditions] When TCNT = TGRD while TGRD is functioning as output compare register When TCNT value is transferred to TGRD by input capture signal while TGRD is functioning as input capture register Overflow Flag 0 [Clearing condition] When 0 is written to TCFV after reading TCFV = 1 1 [Setting condition] When the TCNT value overflows (changes from H'FFFF to H'0000 ) Note: * Can only be written with 0 for flag clearing. Rev. 4.0, 03/03, page 1295 of 1358 TCNT0--Timer Counter 0 Bit H'FFD6 TPU0 : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Initial value : 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Up/down-counter* Note: * This timer counter can be used as an up/down-counter only in phase counting mode or when performing overflow/underflow counting on another channel. In other cases it functions as an up-counter. TGR0A--Timer General Register 0A TGR0B--Timer General Register 0B TGR0C--Timer General Register 0C TGR0D--Timer General Register 0D Bit H'FFD8 H'FFDA H'FFDC H'FFDE TPU0 TPU0 TPU0 TPU0 : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Initial value : 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Rev. 4.0, 03/03, page 1296 of 1358 TCR1--Timer Control Register 1 Bit : 7 Initial value : 0 Read/Write : H'FFE0 6 5 CCLR1 CCLR0 0 0 0 0 R/W R/W R/W R/W 4 3 CKEG1 CKEG0 TPU1 2 1 0 TPSC2 TPSC1 TPSC0 0 0 0 R/W R/W R/W Time Prescaler 0 0 1 1 0 1 0 Internal clock: counts on f/1 1 Internal clock: counts on f/4 0 Internal clock: counts on f/16 1 Internal clock: counts on f/64 0 External clock: counts on TCLKA pin input 1 External clock: counts on TCLKB pin input 0 Internal clock: counts on f/256 1 Counts on TCNT2 overflow/underflow Note: This setting is ignored when channel 1 is in phase counting mode. Clock Edge* 0 1 0 Count at rising edge 1 Count at falling edge Count at both edges Note: This setting is ignored when channel 1 is in phase counting mode. Counter Clear 0 1 0 TCNT clearing disabled 1 TCNT cleared by TGRA compare match/input capture 0 TCNT cleared by TGRB compare match/input capture 1 TCNT cleared by counter clearing for another channel performing synchronous clearing/synchronous operation* Note: * Synchronous operation setting is performed by setting the SYNC bit in TSYR to 1. Rev. 4.0, 03/03, page 1297 of 1358 TMDR1--Timer Mode Register 1 Bit H'FFE1 : 7 6 5 4 Initial value : 1 1 0 0 Read/Write : TPU1 3 2 1 0 MD3 MD2 MD1 MD0 0 0 0 0 R/W R/W R/W R/W Mode 0 0 0 1 1 0 1 1 * * 0 Normal operation 1 Reserved 0 PWM mode 1 1 PWM mode 2 0 Phase counting mode 1 1 Phase counting mode 2 0 Phase counting mode 3 1 Phase counting mode 4 * * : Don t care Note: MD3 is a reserved bit. In a write, it should always be written with 0. Rev. 4.0, 03/03, page 1298 of 1358 TIOR1--Timer I/O Control Register 1 Bit : H'FFE2 TPU1 7 6 5 4 3 2 1 0 IOB3 IOB2 IOB1 IOB0 IOA3 IOA2 IOA1 IOA0 Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W TGR1A I/O Control 0 0 0 0 1 1 0 TGR1A Output disabled is output compare Initial output is register 0 output 1 1 0 1 0 0 Output disabled 1 Initial output is 1 output 0 0 1 1 1 * * * 1 output at compare match Toggle output at compare match 0 1 1 0 output at compare match 0 output at compare match 1 output at compare match Toggle output at compare match TGR1A is input capture register Capture input source is TIOCA1 pin Input capture at rising edge Input capture at falling edge Input capture at both edges Capture input Input capture at generation of source is TGR0A channel 0/TGR0A compare match/ compare match/ input capture input capture * : Don t care TGR1B I/O Control 0 0 0 0 1 1 0 TGR1B Output disabled is output compare Initial output is register 0 output 1 1 0 1 0 0 Output disabled 1 Initial output is 1 output 0 0 1 1 1 * * * 1 output at compare match Toggle output at compare match 0 1 1 0 output at compare match 0 output at compare match 1 output at compare match Toggle output at compare match TGR1B is input capture register Capture input source is TIOCB1 pin Input capture at rising edge Input capture at falling edge Input capture at both edges Capture input Input capture at generation of source is TGR0C TGR0C compare match/input compare match/ capture input capture * : Don t care Rev. 4.0, 03/03, page 1299 of 1358 TIER1--Timer Interrupt Enable Register 1 Bit : 7 6 TTGE Initial value : 0 Read/Write : R/W 1 5 4 TCIEU TCIEV H'FFE4 3 0 0 R/W R/W 0 2 0 TPU1 1 0 TGIEB TGIEA 0 0 R/W R/W TGR Interrupt Enable A 0 Interrupt request (TGIA) by TGFA bit disabled 1 Interrupt request (TGIA) by TGFA bit enabled TGR Interrupt Enable B 0 Interrupt request (TGIB) by TGFB bit disabled 1 Interrupt request (TGIB) by TGFB bit enabled Overflow Interrupt Enable 0 Interrupt request (TCIV) by TCFV disabled 1 Interrupt request (TCIV) by TCFV enabled Underflow Interrupt Enable 0 Interrupt request (TCIU) by TCFU disabled 1 Interrupt request (TCIU) by TCFU enabled A/D Conversion Start Request Enable 0 A/D conversion start request generation disabled 1 A/D conversion start request generation enabled Rev. 4.0, 03/03, page 1300 of 1358 TSR1--Timer Status Register 1 Bit : 7 6 TCFD Initial value : Read/Write : 1 R 1 H'FFE5 5 4 TCFU TCFV 3 0 0 R/(W)* R/(W)* 0 2 0 1 0 TGFB TGFA 0 0 R/(W)* R/(W)* TPU1 Input Capture/Output Compare Flag A 0 [Clearing conditions] When DTC is activated by TGIA interrupt while DISEL bit of MRB in DTC is 0 When DMAC*1 is activated by TGIA interrupt while DTA bit of DMABCR in DMAC*1 is 1 When 0 is written to TGFA after reading TGFA = 1 1 [Setting conditions] When TCNT = TGRA while TGRA is functioning as output compare register When TCNT value is transferred to TGRA by input capture signal while TGRA is functioning as input capture register Note: *1 The DMAC is not supported in the H8S/2321. Input Capture/Output Compare Flag B 0 [Clearing conditions] When DTC is activated by TGIB interrupt while DISEL bit of MRB in DTC is 0 When 0 is written to TGFB after reading TGFB = 1 1 [Setting conditions] When TCNT = TGRB while TGRB is functioning as output compare register When TCNT value is transferred to TGRB by input capture signal while TGRB is functioning as input capture register Overflow Flag 0 [Clearing condition] When 0 is written to TCFV after reading TCFV = 1 1 [Setting condition] When the TCNT value overflows (changes from H'FFFF to H'0000 ) Underflow Flag 0 [Clearing condition] When 0 is written to TCFU after reading TCFU = 1 1 [Setting condition] When the TCNT value underflows (changes from H'0000 to H'FFFF) Count Direction Flag 0 TCNT counts down 1 TCNT counts up Note: * Can only be written with 0 for flag clearing. Rev. 4.0, 03/03, page 1301 of 1358 TCNT1--Timer Counter 1 Bit H'FFE6 TPU1 : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Initial value : 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Up/down-counter* Note: * This timer counter can be used as an up/down-counter only in phase counting mode or when performing overflow/underflow counting on another channel. In other cases it functions as an up-counter. TGR1A--Timer General Register 1A TGR1B--Timer General Register 1B Bit H'FFE8 H'FFEA TPU1 TPU1 : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Initial value : 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Rev. 4.0, 03/03, page 1302 of 1358 TCR2--Timer Control Register 2 Bit : Initial value : 7 6 5 CCLR1 CCLR0 0 Read/Write : H'FFF0 4 3 CKEG1 CKEG0 TPU2 2 1 0 TPSC2 TPSC1 TPSC0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W Time Prescaler 0 0 1 1 0 1 0 Internal clock: counts on f/1 1 Internal clock: counts on f/4 0 Internal clock: counts on f/16 1 Internal clock: counts on f/64 0 External clock: counts on TCLKA pin input 1 External clock: counts on TCLKB pin input 0 External clock: counts on TCLKC pin input 1 Internal clock: counts on f/1024 Note: This setting is ignored when channel 2 is in phase counting mode. Clock Edge 0 1 0 Count at rising edge 1 Count at falling edge Count at both edges Note: This setting is ignored when channel 2 is in phase counting mode. Counter Clear 0 1 0 TCNT clearing disabled 1 TCNT cleared by TGRA compare match/input capture 0 TCNT cleared by TGRB compare match/input capture 1 TCNT cleared by counter clearing for another channel performing synchronous clearing/synchronous operation* Note: * Synchronous operation setting is performed by setting the SYNC bit in TSYR to 1. Rev. 4.0, 03/03, page 1303 of 1358 TMDR2--Timer Mode Register 2 Bit H'FFF1 : 7 6 5 4 Initial value : 1 1 0 0 Read/Write : TPU2 3 2 1 0 MD3 MD2 MD1 MD0 0 0 0 0 R/W R/W R/W R/W Mode 0 0 0 1 1 0 1 1 * * 0 Normal operation 1 Reserved 0 PWM mode 1 1 PWM mode 2 0 Phase counting mode 1 1 Phase counting mode 2 0 Phase counting mode 3 1 Phase counting mode 4 * * : Don t care Note: MD3 is a reserved bit. In a write, it should always be written with 0. Rev. 4.0, 03/03, page 1304 of 1358 TIOR2--Timer I/O Control Register 2 Bit : H'FFF2 TPU2 7 6 5 4 3 2 1 0 IOB3 IOB2 IOB1 IOB0 IOA3 IOA2 IOA1 IOA0 Initial value : 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W TGR2A I/O Control 0 0 0 1 0 TGR2A is output 1 compare 0 register Output disabled Initial output is 0 output 1 1 0 1 Output disabled 1 Initial output is 1 output 1 1 * 0 1 0 TGR2A is input 1 capture * register 1 output at compare match Toggle output at compare match 0 0 0 output at compare match 0 output at compare match 1 output at compare match Toggle output at compare match Capture input source is TIOCA2 pin Input capture at rising edge Input capture at falling edge Input capture at both edges * : Don t care TGR2B I/O Control 0 0 0 0 1 1 0 TGR2B is output compare register Output disabled Initial output is 0 output 1 1 0 1 * 0 Output disabled 1 Initial output is 1 output 0 0 1 1 * 1 output at compare match Toggle output at compare match 0 1 1 0 output at compare match 0 output at compare match 1 output at compare match Toggle output at compare match TGR2B is input capture register Capture input source is TIOCB2 pin Input capture at rising edge Input capture at falling edge Input capture at both edges * : Don t care Rev. 4.0, 03/03, page 1305 of 1358 TIER2--Timer Interrupt Enable Register 2 Bit : 7 6 TTGE Initial value : 0 Read/Write : R/W 1 5 4 TCIEU TCIEV H'FFF4 3 0 0 R/W R/W 0 2 0 TPU2 1 0 TGIEB TGIEA 0 0 R/W R/W TGR Interrupt Enable A 0 Interrupt request (TGIA) by TGFA bit disabled 1 Interrupt request (TGIA) by TGFA bit enabled TGR Interrupt Enable B 0 Interrupt request (TGIB) by TGFB bit disabled 1 Interrupt request (TGIB) by TGFB bit enabled Overflow Interrupt Enable 0 Interrupt request (TCIV) by TCFV disabled 1 Interrupt request (TCIV) by TCFV enabled Underflow Interrupt Enable 0 Interrupt request (TCIU) by TCFU disabled 1 Interrupt request (TCIU) by TCFU enabled A/D Conversion Start Request Enable 0 A/D conversion start request generation disabled 1 A/D conversion start request generation enabled Rev. 4.0, 03/03, page 1306 of 1358 TSR2--Timer Status Register 2 Bit : 7 6 TCFD Initial value : Read/Write : 1 R 1 H'FFF5 5 4 TCFU TCFV 3 0 0 R/(W)* R/(W)* 0 2 0 TPU2 1 0 TGFB TGFA 0 0 R/(W)* R/(W)* Input Capture/Output Compare Flag A 0 [Clearing conditions] When DTC is activated by TGIA interrupt while DISEL bit of MRB in DTC is 0 When DMAC*1 is activated by TGIA interrupt while DTA bit of DMABCR in DMAC*1 is 1 When 0 is written to TGFA after reading TGFA = 1 1 [Setting conditions] When TCNT = TGRA while TGRA is functioning as output compare register When TCNT value is transferred to TGRA by input capture signal while TGRA is functioning as input capture register Note: *1 The DMAC is not supported in the H8S/2321. Input Capture/Output Compare Flag B 0 [Clearing conditions] When DTC is activated by TGIB interrupt while DISEL bit of MRB in DTC is 0 When 0 is written to TGFB after reading TGFB = 1 1 [Setting conditions] When TCNT = TGRB while TGRB is functioning as output compare register When TCNT value is transferred to TGRB by input capture signal while TGRB is functioning as input capture register Overflow Flag 0 [Clearing condition] When 0 is written to TCFV after reading TCFV = 1 1 [Setting condition] When the TCNT value overflows (changes from H'FFFF to H'0000 ) Underflow Flag 0 [Clearing condition] When 0 is written to TCFU after reading TCFU = 1 1 [Setting condition] When the TCNT value underflows (changes from H'0000 to H'FFFF) Count Direction Flag 0 TCNT counts down 1 TCNT counts up Note: * Can only be written with 0 for flag clearing. Rev. 4.0, 03/03, page 1307 of 1358 TCNT2--Timer Counter 2 Bit H'FFF6 TPU2 : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Initial value : 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Up/down-counter* Note: * This timer counter can be used as an up/down-counter only in phase counting mode or when performing overflow/underflow counting on another channel. In other cases it functions as an up-counter. TGR2A--Timer General Register 2A TGR2B--Timer General Register 2B Bit H'FFF8 H'FFFA TPU2 TPU2 : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Initial value : 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Read/Write : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Rev. 4.0, 03/03, page 1308 of 1358 Appendix C I/O Port Block Diagrams C.1 Port 1 R Q D P1nDDR C WDDR1 Reset Internal data bus Reset R Q D P1nDR C P1n WDR1 PPG module Pulse output enable Pulse output DMA controller* DMA transfer acknowledge enable DMA transfer acknowledge TPU module Output compare output/ PWM output enable Output compare output/ PWM output RDR1 RPOR1 Input capture input WDDR1: WDR1: RDR1: RPOR1: Write to P1DDR Write to P1DR Read P1DR Read port 1 n = 0 or 1 Note: * The DMAC is not supported in the H8S/2321. Figure C-1 (a) Port 1 Block Diagram (Pins P10 and P11) Rev. 4.0, 03/03, page 1309 of 1358 R Q D P1nDDR C WDDR1 Reset R Q D P1nDR C P1n WDR1 RDR1 Internal data bus Reset PPG module Pulse output enable Pulse output TPU module Output compare output/ PWM output enable Output compare output/ PWM output RPOR1 Input capture input External clock input WDDR1: WDR1: RDR1: RPOR1: Write to P1DDR Write to P1DR Read P1DR Read port 1 n = 2, 3, 5, 7 Figure C-1 (b) Port 1 Block Diagram (Pins P12, P13, P15, and P17) Rev. 4.0, 03/03, page 1310 of 1358 R Q D P1nDDR C WDDR1 Reset Internal data bus Reset R Q D P1nDR C P1n WDR1 PPG module Pulse output enable Pulse output TPU module Output compare output/ PWM output enable Output compare output/ PWM output RDR1 RPOR1 Input capture input WDDR1: WDR1: RDR1: RPOR1: Write to P1DDR Write to P1DR Read P1DR Read port 1 n = 4 or 6 Figure C-1 (c) Port 1 Block Diagram (Pins P14 and P16) Rev. 4.0, 03/03, page 1311 of 1358 C.2 Port 2 R Q D P2nDDR C WDDR2 Reset R Q D P2nDR C P2n WDR2 Internal data bus Reset PPG module Pulse output enable Pulse output TPU module Output compare output/ PWM output enable Output compare output/ PWM output RDR2 RPOR2 Input capture input WDDR2: WDR2: RDR2: RPOR2: Write to P2DDR Write to P2DR Read P2DR Read port 2 n = 0 or 1 Figure C-2 (a) Port 2 Block Diagram (Pins P20 and P21) Rev. 4.0, 03/03, page 1312 of 1358 R Q D P2nDDR C WDDR2 Reset R Q D P2nDR C P2n WDR2 Internal data bus Reset PPG module Pulse output enable Pulse output TPU module Output compare output/ PWM output enable Output compare output/ PWM output RDR2 RPOR2 Input capture input 8-bit timer module Counter external reset input WDDR2: WDR2: RDR2: RPOR2: Write to P2DDR Write to P2DR Read P2DR Read port 2 n = 2 or 4 Figure C-2 (b) Port 2 Block Diagram (Pins P22 and P24) Rev. 4.0, 03/03, page 1313 of 1358 R Q D P2nDDR C WDDR2 Reset R Q D P2nDR C P2n WDR2 Internal data bus Reset PPG module Pulse output enable Pulse output TPU module Output compare output/ PWM output enable Output compare output/ PWM output RDR2 RPOR2 Input capture input 8-bit timer module Counter external clock inpu WDDR2: WDR2: RDR2: RPOR2: Write to P2DDR Write to P2DR Read P2DR Read port 2 n = 3 or 5 Figure C-2 (c) Port 2 Block Diagram (Pins P23 and P25) Rev. 4.0, 03/03, page 1314 of 1358 R Q D P2nDDR C WDDR2 Reset R Q D P2nDR C P2n WDR2 Internal data bus Reset PPG module Pulse output enable Pulse output 8-bit timer module Compare match output enable Compare match output TPU module Output compare output/ PWM output enable Output compare output/ PWM output RDR2 RPOR2 Input capture input WDDR2: WDR2: RDR2: RPOR2: Write to P2DDR Write to P2DR Read P2DR Read port 2 n = 6 or 7 Figure C-2 (d) Port 2 Block Diagram (Pins P26 and P27) Rev. 4.0, 03/03, page 1315 of 1358 C.3 Port 3 R Q D P3nDDR C WDDR3 *1 Reset R Q D P3nDR C P3n Internal data bus Reset WDR3 Reset *2 R Q D P3nODR C WODR3 RODR3 SCI module Serial transmit enable Serial transmit data RDR3 RPOR3 WDDR3: WDR3: WODR3: RDR3: RPOR3: RODR3: Write to P3DDR Write to P3DR Write to P3ODR Read P3DR Read port 3 Read P3ODR n = 0 or 1 Notes: *1 Output enable signal *2 Open drain control signal Figure C-3 (a) Port 3 Block Diagram (Pins P30 and P31) Rev. 4.0, 03/03, page 1316 of 1358 R Q D P3nDDR C WDDR3 *1 Reset R Q D P3nDR C P3n Internal data bus Reset WDR3 *2 Reset R Q D P3nODR C WODR3 RODR3 RDR3 SCI module Serial receive data enable RPOR3 Serial receive data WDDR3: WDR3: WODR3: RDR3: RPOR3: RODR3: Write to P3DDR Write to P3DR Write to P3ODR Read P3DR Read port 3 Read P3ODR n = 2 or 3 Notes: *1 Output enable signal *2 Open drain control signal Figure C-3 (b) Port 3 Block Diagram (Pins P32 and P33) Rev. 4.0, 03/03, page 1317 of 1358 R Q D P3nDDR C WDDR3 *1 Reset R Q D P3nDR C P3n Internal data bus Reset WDR3 Reset *2 R Q D P3nODR C WODR3 RODR3 SCI module Serial clock output enable Serial clock output RDR3 Serial clock input enable RPOR3 WDDR3: WDR3: WODR3: RDR3: RPOR3: RODR3: Write to P3DDR Write to P3DR Write to P3ODR Read P3DR Read port 3 Read P3ODR Serial clock input n = 4 or 5 Notes: *1 Output enable signal *2 Open drain control signal Figure C-3 (c) Port 3 Block Diagram (Pins P34 and P35) Rev. 4.0, 03/03, page 1318 of 1358 Port 4 RPOR4 P4n Internal data bus C.4 A/D converter module Analog input RPOR4: Read port 4 n = 0 to 5 RPOR4 P4n Internal data bus Figure C-4 (a) Port 4 Block Diagram (Pins P40 to P45) A/D converter module Analog input D/A converter module Output enable Analog output RPOR4: Read port 4 n = 6 or 7 Figure C-4 (b) Port 4 Block Diagram (Pins P46 and P47) Rev. 4.0, 03/03, page 1319 of 1358 C.5 Port 5 R Q D P50DDR C WDDR0 Reset Internal data bus Reset R Q D P50DR C P50 WDR5 SCI module Serial transmit output enable Serial transmit data RDR5 RPOR5 IRQPAS IRQ4 interrupt input WDDR5: WDR5: RDR5: RPOR5: IRQPAS: Write to P5DDR Write to P5DR Read P5DR Read port 5 IRQ port switching select Figure C-5 (a) Port 5 Block Diagram (Pin P50) Rev. 4.0, 03/03, page 1320 of 1358 R Q D P51DDR C WDDR5 Reset Internal data bus Reset R Q D P51DR C P51 WDR5 SCI module Serial receive data enable RDR5 RPOR5 Serial receive data IRQPAS IRQ5 interrupt input WDDR5: WDR5: RDR5: RPOR5: IRQPAS: Write to P5DDR Write to P5DR Read P5DR Read port 5 IRQ port switching select Figure C-5 (b) Port 5 Block Diagram (Pin P51) Rev. 4.0, 03/03, page 1321 of 1358 R Q D P52DDR C WDDR5 Reset R Q D P52DR C P52 WDR5 Internal data bus Reset SCI module Serial clock output enable Serial clock output Serial clock input enable RDR5 RPOR5 Serial clock input IRQPAS IRQ6 interrupt input WDDR5: WDR5: RDR5: RPOR5: IRQPAS: Write to P5DDR Write to P5DR Read P5DR Read port 5 IRQ port switching select Figure C-5 (c) Port 5 Block Diagram (Pin P52) Rev. 4.0, 03/03, page 1322 of 1358 R Q D P53DDR C WDDR5 Reset P53 Modes 4 to 6 Internal data bus Reset Bus controller R Q D P53DR C WDR5 Bus request output enable Bus request output RDR5 BREQOPS RPOR5 A/D converter A/D converter external trigger input IRQPAS IRQ7 interrupt input Modes 4 to 6 WAITPS Wait input pin enable Bus controller Wait input WDDR5: WDR5: RDR5: RPOR5: IRQPAS: WAITPS: BREQOPS: Write to P5DDR Write to P5DR Read P5DR Read port 5 IRQ port switching select Wait pin select BREQO pin select Figure C-5 (d) Port 5 Block Diagram (Pin P53) Rev. 4.0, 03/03, page 1323 of 1358 C.6 Port 6 R Q D P61DDR C WDDR6 Mode 7 P61 Modes 4 to 6 Reset Internal data bus Reset R Q D P61DR C WDR6 CS25E Bus controller Chip select DMA controller* DMA transfer end enable DMA transfer end RDR6 RPOR6 WDDR6: WDR6: RDR6: RPOR6: CS25E: Write to P6DDR Write to P6DR Read P6DR Read port 6 CS25 enable Note: * The DMAC is not supported in the H8S/2321. Figure C-6 (a) Port 6 Block Diagram (Pin P60) Rev. 4.0, 03/03, page 1324 of 1358 R Q D P61DDR C WDDR6 Mode 7 P61 Modes 4 to 6 Reset Internal data bus Reset R Q D P61DR C WDR6 CS25E Bus controller Chip select DMA controller* DMA transfer end enable DMA transfer end RDR6 RPOR6 WDDR6: WDR6: RDR6: RPOR6: CS25E: Write to P6DDR Write to P6DR Read P6DR Read port 6 CS25 enable Note: * The DMAC is not supported in the H8S/2321. Figure C-6 (b) Port 6 Block Diagram (Pin P61) Rev. 4.0, 03/03, page 1325 of 1358 R Q D P62DDR C WDDR6 Reset Internal data bus Reset R Q D P62DR C P62 WDR6 RDR6 RPOR6 DMA controller* DMA request input WDDR6: WDR6: RDR6: RPOR6: Write to P6DDR Write to P6DR Read P6DR Read port 6 Note: * The DMAC is not supported in the H8S/2321. Figure C-6 (c) Port 6 Block Diagram (Pin P62) Rev. 4.0, 03/03, page 1326 of 1358 R Q D P63DDR C WDDR6 Reset R Q D P63DR C P63 Internal data bus Reset WDR6 DMA controller* DMA transfer end enable DMA transfer end RDR6 RPOR6 WDDR6: WDR6: RDR6: RPOR6: Write to P6DDR Write to P6DR Read P6DR Read port 6 Note: * The DMAC is not supported in the H8S/2321. Figure C-6 (d) Port 6 Block Diagram (Pin P63) Rev. 4.0, 03/03, page 1327 of 1358 R Q D P6nDDR C WDDR6 Reset R Q D P6nDR C P6n Internal data bus Reset WDR6 RDR6 RPOR6 IRQm WDDR6: WDR6: RDR6: RPOR6: Write to P6DDR Write to P6DR Read P6DR Read port 6 n = 4 or 5 m = 0 or 1 Figure C-6 (e) Port 6 Block Diagram (Pins P64 and P65) Rev. 4.0, 03/03, page 1328 of 1358 interrupt input R Q D P6nDDR C WDDR6 Mode 7 P6n Modes 4 to 6 Reset R Q D P6nDR C WDR6 Internal data bus Reset Bus controller Chip select RDR6 RPOR6 IRQm interrupt input CS167E WDDR6: WDR6: RDR6: RPOR6: CS167E: Write to P6DDR Write to P6DR Read P6DR Read port 6 CS167 enable n = 6 or 7 m = 2 or 3 Figure C-6 (f) Port 6 Block Diagram (Pins P66 and P67) Rev. 4.0, 03/03, page 1329 of 1358 Port A R Q D PAnPCR C WPCRA RPCRA Reset Modes 4 and 5 R Q D PAnDDR C WDDRA *1 Reset Mode 7 Modes 4 to 6 PAn R Q D PAnDR C WDRA *2 Reset R Q D PAnODR C WODRA RODRA RDRA RPORA WDDRA: WDRA: WODRA: WPCRA: RDRA: RPORA: RODRA: RPCRA: Write to PADDR Write to PADR Write to PAODR Write to PAPCR Read PADR Read port A Read PAODR Read PAPCR n = 0 to 3 Notes: *1 Output enable signal *2 Open drain control signal Figure C-7 (a) Port A Block Diagram (Pins PA0 to PA3) Rev. 4.0, 03/03, page 1330 of 1358 Internal address bus Reset Modes 6 and 7 Internal data bus C.7 Reset WPCRA RPCRA Internal address bus R Q D PA4PCR C Internal data bus Modes 6 and 7 Reset Modes 4 and 5 R Q D PA4DDR C WDDRA A20E *1 Reset Mode 7 Modes 4 to 6 PA4 R Q D PA4DR C WDRA Reset *2 R Q D PA4ODR C WODRA RODRA RDRA RPORA IRQPAS IRQ4 interrupt WDDRA: WDRA: WODRA: WPCRA: RDRA: RPORA: RODRA: RPCRA: A20E: IRQPAS: Write to PADDR Write to PADR Write to PAODR Write to PAPCR Read PADR Read port A Read PAODR Read PAPCR Address 20 enable IRQ port switching select input Notes: *1 Output enable signal *2 Open drain control signal Figure C-7 (b) Port A Block Diagram (Pin PA4) Rev. 4.0, 03/03, page 1331 of 1358 R Q D PAnPCR C WPCRA RPCRA Internal address bus Reset Internal data bus Modes 4 to 7 Reset R Q D PAnDDR C WDDRA *1 Reset Mode 7 PAn Modes 4 to 6 R Q D PAnDR C WDRA Reset *2 Mode 7 AmE R Q D PAnODR C WODRA RODRA RDRA RPORA IRQPAS WDDRA: WDRA: WODRA: WPCRA: RDRA: RPORA: RODRA: RPCRA: AmE: IRQPAS: IRQn Write to PADDR Write to PADR Write to PAODR Write to PAPCR Read PADR Read port A Read PAODR Read PAPCR Address output enable IRQ port switching select n = 5 to 7 m = 21 to 23 input Notes: *1 Output enable signal *2 Open drain control signal Figure C-7 (c) Port A Block Diagram (Pins PA5 to PA7) Rev. 4.0, 03/03, page 1332 of 1358 interrupt Port B R Q D PBnPCR C WPCRB RPCRB Internal address bus Reset Modes 6 and 7 Internal data bus C.8 Modes 4 and 5 Reset R Q D PBnDDR C WDDRB Reset Mode 7 Modes 4 to 6 PBn R Q D PBnDR C WDRB RDRB RPORB WDDRB: WDRB: WPCRB: RDRB: RPORB: RPCRB: Write to PBDDR Write to PBDR Write to PBPCR Read PBDR Read port B Read PBPCR n = 0 to 7 Figure C-8 Port B Block Diagram (Pins PB0 to PB7) Rev. 4.0, 03/03, page 1333 of 1358 Port C R Q D PCnPCR C WPCRC RPCRC Modes 4 and 5 Reset R Q D PCnDDR C WDDRC Reset Mode 7 Modes 4 to 6 PCn R Q D PCnDR C WDRC RDRC RPORC WDDRC: WDRC: WPCRC: RDRC: RPORC: RPCRC: Write to PCDDR Write to PCDR Write to PCPCR Read PCDR Read port C Read PCPCR n = 0 to 7 Figure C-9 Port C Block Diagram (Pins PC0 to PC7) Rev. 4.0, 03/03, page 1334 of 1358 Internal address bus Reset Modes 6 and 7 Internal data bus C.9 Port D R Q D PDnPCR C WPCRD RPCRD Internal lower data bus Reset Internal upper data bus C.10 Mode 7 Reset External address write Modes 4 to 6 Mode 7 Modes 4 to 6 PDn R Q D PDnDDR C WDDRD Reset R Q D PDnDR C WDRD External address upper write RDRD External address lower write RPORD WDDRD: WDRD: WPCRD: RDRD: RPORD: RPCRD: Write to PDDDR Write to PDDR Write to PDPCR Read PDDR Read port D Read PDPCR External address upper read External address lower read n = 0 to 7 Figure C-10 Port D Block Diagram (Pins PD0 to PD7) Rev. 4.0, 03/03, page 1335 of 1358 C.11 Port E WPCRE RPCRE Internal lower data bus R Q D PEnPCR C Internal upper data bus Reset Mode 7 Bus controller 8-bit bus mode Reset External address write Modes 4 to 6 PEn Modes 4 to 6 R Q D PEnDDR C WDDRE Reset R Q D PEnDR C WDRE RDRE RPORE WDDRE: WDRE: WPCRE: RDRE: RPORE: RPCRE: Write to PEDDR Write to PEDR Write to PEPCR Read PEDR Read port E Read PEPCR External address lower read n = 0 to 7 Figure C-11 Port E Block Diagram (Pins PE0 to PE7) Rev. 4.0, 03/03, page 1336 of 1358 Port F Reset R Q D PF0DDR C Internal data bus C.12 WDDRF Bus controller BRLE bit Modes 4 to 6 Reset R Q D PF0DR C PF0 WDRF RDRF RPORF Bus request input WDDRF: WDRF: RDRF: RPORF: Write to PFDDR Write to PFDR Read PFDR Read port F Figure C-12 (a) Port F Block Diagram (Pin PF0) Rev. 4.0, 03/03, page 1337 of 1358 R Q D PF1DDR C WDDRF Reset R Q D PF1DR C PF1 Internal data bus Reset WDRF Modes 4 to 6 Bus controller BRLE bit Bus request acknowledge output RDRF RPORF WDDRF: WDRF: RDRF: RPORF: Write to PFDDR Write to PFDR Read PFDR Read port F Figure C-12 (b) Port F Block Diagram (Pin PF1) Rev. 4.0, 03/03, page 1338 of 1358 R Q D PF2DDR C WDDRF Internal data bus Reset Reset PF2 Modes 4 to 6 R Q D PF2DR C WDRF Bus controller Modes 4 to 6 Bus request output enable Bus request output RDRF RPORF Wait input LCAS output enable* Modes 4 and 6 WDDRF: WDRF: RDRF: RPORF: WAITPS: BREQOPS: LCAS output* Wait enable WAITPS Write to PFDDR Write to PFDR Read PFDR Read port F WAIT pin select BREQO pin select BREQOPS Note: * Not supported in the H8S/2321. Figure C-12 (c) Port F Block Diagram (Pin PF2) Rev. 4.0, 03/03, page 1339 of 1358 Modes 4 to 6 R Q D PF3DDR C WDDRF Mode 7 PF3 Modes 4 to 6 Reset R Q D PF3DR C Internal data bus Reset WDRF Interrupt controller LWROD Bus controller LWR output RDRF RPORF WDDRF: WDRF: RDRF: RPORF: LWROD: Write to PFDDR Write to PFDR Read PFDR Read port F LWR output disable Figure C-12 (d) Port F Block Diagram (Pin PF3) Rev. 4.0, 03/03, page 1340 of 1358 Modes 4 to 6 R Q D PF4DDR C WDDRF Mode 7 PF4 Modes 4 to 6 Reset R Q D PF4DR C Internal data bus Reset WDRF Bus controller HWR output RDRF RPORF WDDRF: WDRF: RDRF: RPORF: Write to PFDDR Write to PFDR Read PFDR Read port F Figure C-12 (e) Port F Block Diagram (Pin PF4) Rev. 4.0, 03/03, page 1341 of 1358 Modes 4 to 6 R Q D PF5DDR C WDDRF Mode 7 PF5 Modes 4 to 6 Reset Internal data bus Reset R Q D PF5DR C WDRF Bus controller RD output RDRF RPORF WDDRF: WDRF: RDRF: RPORF: Write to PFDDR Write to PFDR Read PFDR Read port F Figure C-12 (f) Port F Block Diagram (Pin PF5) Rev. 4.0, 03/03, page 1342 of 1358 Modes 4 to 6 R Q D PF6DDR C WDDRF Mode 7 PF6 Modes 4 to 6 Reset Internal data bus Reset R Q D PF6DR C WDRF Interrupt controller ASOD Bus controller AS output RDRF RPORF WDDRF: WDRF: RDRF: RPORF: ASOD: Write to PFDDR Write to PFDR Read PFDR Read port F AS output disable Figure C-12 (g) Port F Block Diagram (Pin PF6) Rev. 4.0, 03/03, page 1343 of 1358 Modes 4 to 6 Mode 7 S R Q D PF7DDR C WDDRF Reset Internal data bus Reset R Q D PF7DR C PF7 WDRF f RDRF RPORF WDDRF: WDRF: RDRF: RPORF: Write to PFDDR Write to PFDR Read PFDR Read port F Figure C-12 (h) Port F Block Diagram (Pin PF7) Rev. 4.0, 03/03, page 1344 of 1358 Port G Reset R Q D PG0DDR C WDDRG Reset R Q D PG0DR C PG0 Internal data bus C.13 WDRG Modes 4 to 6 Bus controller CAS enable* CAS output* RDRG RPORG WDDRG: WDRG: RDRG: RPORG: Write to PGDDR Write to PGDR Read PGDR Read port G Note: * Not supported in the H8S/2321. Figure C-13 (a) Port G Block Diagram (Pin PG0) Rev. 4.0, 03/03, page 1345 of 1358 R Q D PGnDDR C WDDRG Mode 7 PGn Modes 4 to 6 Reset R Q D PGnDR C Internal data bus Reset Interrupt controller WDRG CS25E Bus controller Chip select RDRG RPORG WDDRG: WDRG: RDRG: RPORG: CS25E: Write to PGDDR Write to PGDR Read PGDR Read port G CS25 enable n = 1 or 2 Figure C-13 (b) Port G Block Diagram (Pins PG1 and PG2) Rev. 4.0, 03/03, page 1346 of 1358 R Q D PG3DDR C WDDRG Mode 7 PG3 Modes 4 to 6 Reset R Q D PG3DR C Internal data bus Reset Interrupt controller WDRG CS167E Bus controller Chip select RDRG RPORG WDDRG: WDRG: RDRG: RPORG: CS167E: Write to PGDDR Write to PGDR Read PGDR Read port G CS167 enable Figure C-13 (c) Port G Block Diagram (Pin PG3) Rev. 4.0, 03/03, page 1347 of 1358 Modes 6 and 7 S R Q D PG4DDR C WDDRG Mode 7 PG4 Modes 4 to 6 Reset Internal data bus Modes 4 and 5 Reset R Q D PG4DR C WDRG Bus controller Chip select RDRG RPORG WDDRG: WDRG: RDRG: RPORG: Write to PGDDR Write to PGDR Read PGDR Read port G Figure C-13 (d) Port G Block Diagram (Pin PG4) Rev. 4.0, 03/03, page 1348 of 1358 Appendix D Pin States D.1 Port States in Each Mode Table D-1 I/O Port States in Each Processing State MCU Port Name Operating Pin Name Mode Reset Hardware Standby Mode Software Standby Mode Bus-Released State Program Execution State Sleep Mode Port 1 Port 2 4 to 7 T T kept kept I/O port 4 to 7 T T kept kept I/O port Port 3 4 to 7 T T kept kept I/O port P47/DA1 4 to 7 T T [DAOE1 = 1] kept kept I/O port kept I/O port [DAOE1 = 0] T P46/DA0 4 to 7 T T [DAOE0 = 1] kept [DAOE0 = 0] T P45 to P40 4 to 7 T T T T Input port P53/WAIT/ BREQO 4 to 6 T T [BREQOE * BREQOPS + WAITE * WAITPS = 0] kept [BREQOE * BREQOPS + WAITE * WAITPS = 0] kept [BREQOE * BREQOPS + WAITE * WAITPS = 0] I/O port [BREQOE * BREQOPS = 1] kept [BREQOE * BREQOPS = 1] BREQO [BREQOE * BREQOPS = 1] BREQO [BREQOE * BREQOPS = 0] and [BREQOE * BREQOPS = 0] and [BREQOE * BREQOPS = 0] and [WAITE * WAITPS * [WAITE * WAITPS * [WAITE * WAITPS * DDR = 1] DDR = 1] DDR = 1] WAIT T T P52 to P50 7 T T kept kept I/O port 4 to 7 T T kept kept I/O port Rev. 4.0, 03/03, page 1349 of 1358 MCU Port Name Operating Pin Name Mode Reset Hardware Standby Mode P67/CS7 T T 4 to 6 P66/CS6 Software Standby Mode Bus-Released State [CS167E = 0] [CS167E = 0], [CS167E * DDR = 1] kept kept [CS167E * DDR = 1] kept [CS167E * DDR * OPE = 1] [CS167E * DDR = 1] T T Program Execution State Sleep Mode [CS167E = 0] I/O port [CS167E * DDR = 1] Input port [CS167E * DDR = 1] CS7 to CS6 [CS167E * DDR * OPE = 1] H 7 T T kept kept I/O port P65 to P62 4 to 7 T T kept kept I/O port P61/CS5 4 to 6 T T [CS25E * DDR * OPE = 1] T [CS25E = 0] kept [CS25E = 0] I/O port P60/CS4 [CS25E * DDR * OPE = 1] H [CS25E * DDR = 1] [CS25E * DDR = 1] Input port kept [CS25E * DDR = 1] [CS25E * DDR = 1] CS5 to CS4 T [CS25E = 0], [ CS25E * DDR = 1] kept PA7/A23 7 T T kept kept I/O port 4 to 6 T T [AnE = 0] kept [AnE = 0] kept [AnE = 0] I/O port [AnE * DDR = 1] T [AnE * DDR = 1] T [AnE * DDR = 1] Input port [AnE * DDR * OPE = 1] T [AnE * DDR = 1] T [AnE * DDR = 1] Address output kept I/O port PA6/A22 PA5/A21 [AnE * DDR * OPE = 1] kept 7 T T Rev. 4.0, 03/03, page 1350 of 1358 kept MCU Port Name Operating Pin Name Mode Reset Hardware Standby Mode PA4/A20 L T 4, 5 Software Standby Mode Bus-Released State Program Execution State Sleep Mode [A20E * DDR = 1] kept [A20E * DDR = 1] kept [A20E * DDR = 1] Output port [A20E * OPE = 1] T [A20E+A20E * DDR [A20E+A20E * DDR = 1] = 1] Address output T [A20E * OPE = 1] kept 6 T T [A20E = 0], [A20E * DDR = 1] kept [A20E * DDR * OPE = 1] T [A20E = 0] kept [A20E = 0] I/O port [A20E * DDR = 1] kept [A20E * DDR = 1] Output port [A20E * DDR = 1] T [A20E * DDR = 1] Address output [A20E * DDR * OPE = 1] kept PA3/A19 7 T T kept kept I/O port 4, 5 L T [OPE = 0] T T Address output T [DDR = 0] Input port PA2/A18 [OPE = 1] kept PA1/A17 PA0/A16 6 T T [DDR * OPE = 0] T [DDR = 1] Address output [DDR * OPE = 1] kept 7 T T kept kept I/O port Rev. 4.0, 03/03, page 1351 of 1358 MCU Port Name Operating Pin Name Mode Reset Hardware Standby Mode Port B L T 4, 5 Software Standby Mode Bus-Released State Program Execution State Sleep Mode [OPE = 0] T T Address output T [DDR = 0] Input port [OPE = 1] kept 6 T T [DDR * OPE = 0] T [DDR = 1] Address output [DDR * OPE = 1] kept Port C 7 T T kept kept I/O port 4, 5 L T [OPE = 0] T T Address output T [DDR = 0] Input port [OPE = 1] kept 6 T T [DDR * OPE = 0] T [DDR * OPE = 1] kept Port D Port E 7 T T kept kept I/O port 4 to 6 T T T T Data bus 7 T T kept kept I/O port 4 to 8-bit 6 bus T T kept kept I/O port 16-bit T bus T T T Data bus T kept kept I/O port T [DDR = 0] Input port [DDR = 0] Input port [DDR = 0] Input port [DDR = 1] H [DDR = 1] Clock output [DDR = 1] Clock output [DDR = 0] Input port [DDR = 0] Input port [DDR = 0] Input port [DDR = 1] H [DDR = 1] Clock output [DDR = 1] Clock output 7 PF7 / [DDR = 1] Address output 4 to 6 7 Clock output T T Rev. 4.0, 03/03, page 1352 of 1358 MCU Port Name Operating Pin Name Mode Reset Hardware Standby Mode PF6/AS H T 4 to 6 Software Standby Mode Bus-Released State Program Execution State Sleep Mode [ASOD = 1] kept [ASOD = 1] kept [ASOD = 1] I/O port [ASOD * OPE = 1] T [ASOD = 0] T [ASOD = 0] AS [ASOD * OPE = 1] H PF5/RD 7 T T kept kept I/O port 4 to 6 H T [OPE = 0] T T RD, HWR PF4/HWR [OPE = 1] H PF3/LWR 7 T T kept kept I/O port 4 to 6 H T [LWROD = 1] kept [LWROD = 1] kept [LWROD = 1] I/O port [LWROD * OPE = 1] [LWROD = 0] T T [LWROD = 0] LWR [LWROD * OPE = 1] H 7 1 PF2/LCAS* / 4 to 6 WAIT/ BREQO T T T kept T 2 2 2 [LCASE* +BREQOE [LCASE* +BREQO [LCASE* +BREQO kept * BREQOPS+ WAITE * WAITPS =0 kept [BREQOE * BREQOPS = 1] and 2 [LCASE* = 0] kept I/O port E * BREQOPS+ WAITE * WAITPS =0 kept E * BREQOPS+ WAITE * WAITPS =0 I/O port [BREQOE * BREQOPS = 1] and 2 [LCASE* = 0] BREQO [BREQOE * BREQOPS = 1] and 2 [LCASE* = 0] BREQO [WAITE * WAITPS * DDR = 1] [WAITE * WAITPS and * DDR = 1] 2 [LCASE* +BREQOE and 2 [LCASE* +BREQO * BREQOPS = 0] T E 2 * BREQOPS = 0] [LCASE* = 1, T OPE = 0] 2 T *2 [LCASE = 1, OPE = 1] H 7 T T kept [WAITE * WAITPS * DDR = 1] and 2 [LCASE* +BREQO E * BREQOPS = 0] WAIT 2 [LCASE* = 1] T [LCASE* = 1] 1 LCAS* kept I/O port Rev. 4.0, 03/03, page 1353 of 1358 MCU Port Name Operating Pin Name Mode Reset Hardware Standby Mode PF1/BACK T T 4 to 6 Software Standby Mode Bus-Released State [BRLE=0] kept L [BRLE=1] BACK PF0/BREQ PG3/CS1 [BRLE = 0] I/O port [BRLE = 1] BACK 7 T T kept kept I/O port 4 to 6 T T [BRLE=0] kept T [BRLE = 0] I/O port [BRLE = 1] BREQ [BRLE=1] T PG4/CS0 Program Execution State Sleep Mode 7 T T kept kept I/O port 4, 5 H T [DDR * OPE = 0] T T [DDR = 0] Input port 6 T [DDR * OPE = 1] H [DDR = 1] CS0 7 T T kept kept I/O port 4 to 6 T T [CS167E = 0] kept [CS167E = 0] kept [CS167E = 0] I/O port [CS167E * DDR = 1] [CS167E = 1] T T [CS167E * DDR = 1] Input port [CS167E * DDR * OPE = 1] T [CS167E * DDR = 1] CS1 [CS167E * DDR * OPE = 1] H PG2/CS2 7 T T kept kept I/O port 4 to 6 T T [CS25E = 0] kept [CS25E = 0] kept [CS25E = 0] I/O port [CS25E * DDR = 1] T [CS25E = 1] T [CS25E * DDR = 1] Input port PG1/CS3 [CS25E * DDR = 1] CS2 to CS3 [CS25E * DDR * OPE = 1] T [CS25E * DDR * OPE = 1] H 7 T T Rev. 4.0, 03/03, page 1354 of 1358 kept kept I/O port MCU Port Name Operating Pin Name Mode 3 PG0/CAS* 4 to 6 Reset Hardware Standby Mode T T Software Standby Mode 4 [DRAME* = 0] kept Bus-Released State T 4 Program Execution State Sleep Mode 4 [DRAME* = 0] Input port 4 [DRAME* * OPE = 1] T [DRAME* = 1] 3 CAS* 4 [DRAME* * OPE = 1] 3 CAS* 7 T T kept kept I/O port Legend H: High level L: Low level T: High impedance kept: Input port becomes high-impedance, output port retains state DDR: Data direction register OPE: Output port enable WAITE: Wait input enable WAITPS: WAIT pin select BRLE: Bus release enable BREQOE: BREQO pin enable BREQOPS: BREQO pin select DRAME: DRAM space setting LCASE: DRAM space setting, 16-bit access setting AnE: Address n enable (n = 23 to 21) A20E: Address 20 enable ASOD: AS output disable CS167E: CS167 enable CS25E: CS25 enable LWROD: LWR output disable Notes: *1 LCAS is not supported in the H8S/2321. *2 As the DRAM interface is not supported in the H8S/2321, LCASE is always 0. *3 CAS is not supported in the H8S/2321. *4 As the DRAM interface is not supported in the H8S/2321, DRAME is always 0. Rev. 4.0, 03/03, page 1355 of 1358 Appendix E Product Lineup Table E-1 H8S/2329 Series, H8S/2328 Series Product Lineup Product Type H8S/2329 F-ZTATTM Model Marking Package (Hitachi Package Code) HD64F2329 HD64F2329VTE 120-pin TQFP (TFP-120) HD64F2329VF 128-pin QFP (FP-128B) 2 * HD64F2329B HD64F2329BVTE 120-pin TFP (TFP-120) HD64F2329BVF *3 H8S/2328 128-pin FP (FP-128B) HD64F2329E HD64F2329EVTE 120-pin TFP (TFP-120) HD64F2329EVF 128-pin FP (FP-128B) Mask ROM version HD6432328 HD6432328TE 120-pin TQFP (TFP-120) HD6432328F 128-pin QFP (FP-128B) F-ZTATTM HD64F2328 HD64F2328VTE 120-pin TQFP (TFP-120) HD64F2328VF 128-pin QFP (FP-128B) 2 HD64F2328B* HD64F2328BVTE 120-pin TFP (TFP-120) H8S/2327 H8S/2326 HD64F2328BVF 128-pin FP (FP-128B) HD6432327TE 120-pin TQFP (TFP-120) HD6432327F 128-pin QFP (FP-128B) Mask ROM version HD6432327 F-ZTATTM HD64F2326 HD64F2326VTE 120-pin TFP (TFP-120) HD64F2326VF 128-pin FP (FP-128B) HD64F2326C HD64F2326CVTE 120-pin TFP (TFP-120) 1 H8S/2326C* F-ZTATTM HD64F2326CVF H8S/2324S ROMless version HD6412324S H8S/2323 Mask ROM version H8S/2322R 128-pin FP (FP-128B) HD6412324SVTE 120-pin TQFP (TFP-120) HD6412324SVF 128-pin QFP (FP-128B) HD6432323 HD6432323TE 120-pin TQFP (TFP-120) HD6432323F 128-pin QFP (FP-128B) ROMless version HD6412322R HD6412322RVTE 120-pin TQFP (TFP-120) H8S/2321 ROMless version H8S/2320 ROMless version HD6412322RVF 128-pin QFP (FP-128B) HD6412321 HD6412321VTE 120-pin TFP (TFP-120) HD6412321VF 128-pin FP (FP-128B) HD6412320 HD6412320VTE 120-pin TQFP (TFP-120) HD6412320VF 128-pin QFP (FP-128B) Notes: *1 In planning *2 Low-cost version *3 The on-chip debug function can be used with the E10-A emulator (E10-A compatible version). However, some function modules and pin functions are unavailable when the on-chip debug function is in use. Refer to figures 1-7 and 1-8. Rev. 4.0, 03/03, page 1356 of 1358 Appendix F Package Dimensions Unit: mm 16.0 - 0.2 14 90 61 60 0.4 16.0 - 0.2 91 120 0.10 *Dimension including the plating thickness Base material dimension 0.10 - 0.10 *0.17 - 0.05 0.15 - 0.04 0.07 M 1.2 1.00 30 1.20 Max 31 1 *0.17 - 0.05 0.15 - 0.04 1.0 0 - 8 0.5 - 0.1 Hitachi Code JEDEC JEITA Mass (reference value) TFP-120 3/4 Conforms 0.5 g Figure F-1 TFP-120 Package Dimensions Rev. 4.0, 03/03, page 1357 of 1358 Unit: mm 22.0 - 0.2 20 65 64 128 39 0.5 103 14 1 0.10 *Dimension including the plating thickness Base material dimension *0.17 - 0.05 0.15 - 0.04 3.15 Max 0.75 2.70 0.10 M 0.5 - 0.2 Hitachi Code JEDEC JEITA Mass (reference value) Figure F-2 FP-128 Package Dimensions Rev. 4.0, 03/03, page 1358 of 1358 1.0 0.75 0 +0.15 0.10 *0.22 - 0.05 0.20 - 0.04 38 0.10 16.0 - 0.2 102 FP-128B Conforms 1.7 g 8 H8S/2329 Series, H8S/2328 Series Hardware Manual Publication Date: 1st Edition, March 1999 4th Edition, March 2003 Published by: Business Operation Division Semiconductor & Integrated Circuits Hitachi, Ltd. Edited by: Technical Documentation Group Hitachi Kodaira Semiconductor Co., Ltd. Copyright (c) Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.