ECXO-2430-20.000M TR RoHS Pb PLEASE NOTE: Due to the inherent proprietary nature of custom part numbers, certain parameters are intentionally excluded from this specification sheet. ECXO-2430 -20.000M TR Series Ecliptek Custom Oscillator Packaging Options Tape & Reel Nominal Frequency 20.000MHz ELECTRICAL SPECIFICATIONS Nominal Frequency 20.000MHz ENVIRONMENTAL & MECHANICAL SPECIFICATIONS Fine Leak Test MIL-STD-883, Method 1014 Condition A Gross Leak Test MIL-STD-883, Method 1014 Condition C Mechanical Shock MIL-STD-202, Method 213 Condition C Resistance to Soldering Heat MIL-STD-202, Method 210 Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 Temperature Cycling MIL-STD-883, Method 1010 Vibration MIL-STD-883, Method 2007 Condition A MECHANICAL DIMENSIONS (all dimensions in millimeters) 7.00 0.10 1.00 0.10 (x5) 0.80 0.10 (x4) 0.40 0.10 5 4 MARKING ORIENTATION 5.00 0.10 2.00 MAX 6 3 2 1 1.27 0.10 (x4) 10 7 8 9 2.54 0.10 (x2) 0.80 0.10 1.00 0.10 (x4) 0.60 0.10 (x6) PIN CONNECTION 1 Do Not Connect 2 Do Not Connect 3 Do Not Connect 4 Ground 5 Output 6 Do Not Connect 7 Do Not Connect 8 Tri-State 9 Supply Voltage 10 Voltage Control LINE MARKING 1 ECXO 2 2430 1.20 0.20 (x4) 1.3 MAX 2.20 0.15 www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/19/2010 | Page 1 of 5 ECXO-2430-20.000M TR Suggested Solder Pad Layout All Dimensions in Millimeters 1.34 1.4(x4) 1.3 1.4 4.6 1.0 1.8 Solder Land (x5) Solder Land (X4) 1.2(x4) All Tolerances are 0.1 www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/19/2010 | Page 2 of 5 ECXO-2430-20.000M TR Tape & Reel Dimensions Quantity Per Reel: 1,000 units 4.0 0.1 2.0 0.1 DIA 1.5 +1.0/-0 0.6 MAX 7.5 0.10 16.0 0.2 A0* 6.75 0.10 8.0 0.1 B0* K0* *Compliant to EIA 481A 1.5 MIN 22.4 MAX DIA 40 MIN Access Hole at Slot Location 360 MAX DIA 50 MIN DIA 20.2 MIN DIA 13.0 0.2 2.5 MIN Width 10.0 MIN Depth Tape slot in Core for Tape Start 16.4 +2.0/-0 www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/19/2010 | Page 3 of 5 ECXO-2430-20.000M TR Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) High Temperature Infrared/Convection TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level 3C/second Maximum 150C 175C 200C 60 - 180 Seconds 3C/second Maximum 217C 60 - 150 Seconds 260C Maximum for 10 Seconds Maximum 250C +0/-5C 20 - 40 seconds 6C/second Maximum 8 minutes Maximum Level 1 www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/19/2010 | Page 4 of 5 ECXO-2430-20.000M TR Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) Low Temperature Infrared/Convection 230C TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level 5C/second Maximum N/A 150C N/A 30 - 60 Seconds 5C/second Maximum 150C 200 Seconds Maximum 230C Maximum 230C Maximum 2 Times 10 seconds Maximum 2 Times 5C/second Maximum N/A Level 1 Low Temperature Manual Soldering 185C Maximum for 10 seconds Maximum, 2 times Maximum. High Temperature Manual Soldering 260C Maximum for 5 seconds Maximum, 2 times Maximum. www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/19/2010 | Page 5 of 5