© Semiconductor Components Industries, LLC, 2011
March, 2011 − Rev. 4
1Publication Order Number:
CM1402/D
CM1402
SIM Card EMI Filter Array
with ESD Protection
Product Description
The CM1402 is an EMI filter array with ESD protection, which
integrates three pi filters (C−R−C) and two additional channels of ESD
protection. The CM1402 has component values of 20 pF − 47 −
20 pF, and 20 pF − 100 − 20 pF. The parts include avalanche−type
ESD diodes on every pin, which provide a very high level of
protection for sensitive electronic components that may be subjected
to electrostatic discharge (ESD). The ESD diodes connected to the
filter ports are designed and characterized to safely dissipate ESD
strikes of ±10 kV, beyond the maximum requirement of the IEC
61000−4−2 international standard. Using the MIL−STD−883 (Method
3015) specification for Human Body Model (HBM) ESD, the pins are
protected for contact discharges at greater than ±25 kV.
The ESD diodes on pins A4 and C4 ports are designed and
characterized to safely dissipate ESD strikes of ±10 kV, well beyond
the maximum requirement of the IEC 61000−4−2 international
standard.
This device is particularly well suited for portable electronics (e.g.
mobile handsets, PDAs, notebook computers) because of its small
package format and easy−to−use pin assignments. In particular, the
CM1402 is ideal for EMI filtering and protecting data lines from ESD
for the SIM card slot in mobile handsets.
The CM1402 incorporates OptiGuardt coating which results in
improved reliability at assembly. The CM1402 is available in a
space−saving, low−profile Chip Scale Package.
Features
•Functionally and Pin−Compatible with CSPEMI400 Device
•OptiGuardt Coated for Improved Reliability at Assembly
•Three Channels of EMI Filtering, Each with ESD Protection
•Two Additional Channels of ESD−Only Protection
•±10 kV ESD Protection (IEC 61000−4−2, Contact Discharge) on
All Pins
•±25 kV ESD Protection (HBM)
•Greater than 30 dB of Attenuation at 1 GHz
•10−Bump, 1.960 mm x 1.330 mm Footprint Chip Scale Package
(CSP)
•Chip Scale Package Features Extremely Low Lead Inductance for
Optimum Filter and ESD Performance
•These Devices are Pb−Free and are RoHS Compliant
Applications
•SIM Card Slot in Mobile Handsets
•I/O Port Protection for Mobile Handsets, Notebook Computers,
PDAs, etc.
•EMI Filtering for Data Ports in Cell Phones, PDAs or Notebook
Computers
MARKING DIAGRAM
Device Package Shipping†
ORDERING INFORMATION
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CSP−10
(Pb−Free)
3500/Tape & ReelCM1402−03CP
CE = CM1402−03CP
M = Date Code
G= Pb−Free Package
(Note: Microdot may be in either location)
WLCSP10
CP SUFFIX
CASE 567BL
CE MG
G
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
CM1402
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2
ELECTRICAL SCHEMATIC
A1
A3
R1
C1 A2
R2
C2
C4A4
C3
R1
R1 = 100
R2 = 47
GND
CC
CC CC
CC
B1,B2
Table 1. PIN DESCRIPTIONS
10−bump CSP Package
Type Pin Description
EMI Filter A1 EMI Filter with ESD Protection for RST
Signal
C1 EMI Filter with ESD Protection for RST
Signal
EMI Filter A2 EMI Filter with ESD Protection for CLK
Signal
C2 EMI Filter with ESD Protection for CLK
Signal
Device
Ground
B1 Device Ground
B2 Device Ground
EMI Filter A3 EMI Filter with ESD Protection for DAT
Signal
C3 EMI Filter with ESD Protection for DAT
Signal
ESD Channel A4 ESD Protection Channel − VCC Supply
ESD Channel C4 ESD Protection Channel
PACKAGE / PINOUT DIAGRAMS
B1
Bottom View
(Bumps Up View)
A4
C4
A1
Top View
(Bumps Down View)
CE
CM1402
CSP Package with OptiGuard coating
Orientation
Marking
+
123
A
B
C
4
Orientation
Marking
A3 A2 A1
C3 C2 C1
B2
SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter Rating Units
Storage Temperature Range –65 to +150 °C
DC Power per Resistor 100 mW
DC Package Power Rating 300 mW
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
CM1402
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Table 3. STANDARD OPERATING CONDITIONS
Parameter Rating Units
Operating Temperature Range –40 to +85 °C
Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Symbol Parameter Conditions Min Typ Max Units
R1Resistance of R180 100 120
R2Resistance of R238 47 56
C Capacitance VIN = 2.5 VDC, 1 MHz, 30 mV ac 16 20 24 pF
VSTANDOFF Stand−off Voltage I = 10 A6.0 V
ILEAK Diode Leakage Current VBIAS = 3.3 V 0.1 1.0 A
VSIG Signal Voltage
Positive Clamp
Negative Clamp
ILOAD = 10 mA
ILOAD = −10 mA
5.6
−1.5
6.8
–0.8
9.0
−0.4
V
VESD In−system ESD Withstand Voltage
a) Human Body Model, MIL−STD−883,
Method 3015
b) Contact Discharge per IEC 61000−4−2
(Notes 2 and 4)
±25
±10
kV
VCL Clamping Voltage during ESD Discharge
MIL−STD−883 (Method 3015), 8 kV
Positive Transients
Negative Transients
(Notes 2, 3 and 4)
+12
−7
V
fC1 Cut−off Frequency
ZSOURCE = 50 , ZLOAD = 50
R = 100 , C = 20 pF
77
MHz
fC2 Cut−off Frequency
ZSOURCE = 50 , ZLOAD = 50
R = 47 , C = 20 pF
85
MHz
1. TA = 25°C unless otherwise specified.
2. ESD applied to input and output pins with respect to GND, one at a time.
3. Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping
voltage is measured at Pin C1.
4. Unused pins are left open.
CM1402
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PERFORMANCE INFORMATION
Typical Filter Performance (nominal conditions unless specified otherwise, 50 W Environment)
Figure 1. A1−C1 EMI Filter Performance
Figure 2. A2−C2 EMI Filter Performance
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PERFORMANCE INFORMATION (Cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise, 50 W Environment)
Figure 3. A3−C3 EMI Filter Performance
Figure 4. Typical Diode Capacitance vs. Input Voltage (normalized to 2.5 VDC)
CM1402
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APPLICATION INFORMATION
The CM1402 provides a bidirectional filter and protector for all the signals and the power line on the SIM (subscriber
identity module) card connector. SIM cards are found in all GSM cellular phones and in some other handheld devices or card
readers. The ESD diodes protect the controller against possible ESD strikes that may occur when the connector pins are
exposed during direct contact, or during insertion of the SIM card into the card slot. The EMI filter suppresses all
high−frequency noise, preventing the unwanted EMI signals from both entering and exiting the main board. The signals that
interface with the SIM card are the Reset, the Clock and the bidirectional data I/O, as shown in Typical Application Diagram
for the SIM Card Interface.
Figure 5. Typical Application Diagram for the SIM Card Interface
Note: One channel of the CM1402 with a zener diode is
not shown on the diagram.
For best filter and ESD performance, both GND bumps (B1, B2) of the CM1402 should be directly connected to the
Ground plane. A small capacitor of about 1 F is required next to the VCC pin of the SIM connector in order to improve
stability of the SIM card supply rail.
For information on the assembly of the CM1402 to the PCB (printed circuit board), please refer to the Chip Scale Package
(CSP) Application Note AP217, or contact factory at 800−282−9855 for technical support.
CM1402
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APPLICATION INFORMATION
Table 5. PRINTED CIRCUIT BOARD RECOMMENDATIONS
Parameter Value
Pad Size on PCB 0.240 mm
Pad Shape Round
Pad Definition Non−Solder Mask defined pads
Solder Mask Opening 0.290 mm Round
Solder Stencil Thickness 0.125 − 0.150 mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300 mm Round
Solder Flux Ratio 50/50 by volume
Solder Paste Type No Clean
Pad Protective Finish OSP (Entek Cu Plus 106A)
Tolerance − Edge To Corner Ball ±50 m
Solder Ball Side Coplanarity ±20 m
Maximum Dwell Time Above Liquidous (183°C) 60 seconds
Maximum Soldering Temperature for Lead−free Devices using a Lead−free Solder Paste 260°C
Non−Solder Mask Defined Pad
0.240 mm DIA.
Solder Stencil Opening
0.300 mm DIA.
Solder Mask Opening
0.290 mm DIA.
Figure 6. Recommended Non−Solder Mask Defined Pad Illustration
Figure 7. Lead−free (SnAgCu) Solder Ball Reflow Profile
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PACKAGE DIMENSIONS
WLCSP10, 1.96x1.33
CASE 567BL−01
ISSUE O
SEATING
PLANE
0.05 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
2X
DIM
A
MIN MAX
0.56
MILLIMETERS
A1
D1.96 BSC
E
b0.29 0.35
eD 0.50 BSC
0.72
ÈÈ
D
E
AB
PIN A1
REFERENCE
eD/2
A0.05 BC
0.03 C
0.05 C
10X b
123
C
B
A
0.05 C
A
A1
A2
C
0.21 0.27
1.33 BSC
eE 0.435 BSC
0.50 0.25
10X
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.25
0.87
0.44
0.05 C
2X TOP VIEW
SIDE VIEW
BOTTOM VIEW
NOTE 3
eE
A2 0.40 REF
RECOMMENDED
A1
PACKAGE
OUTLINE
456
eD
PITCH
0.25
ÉÉÉÉÉÉ
OptiGuard Option
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
CM1402/D
OptiGuardt is a trademark of Semiconductor Components Industries, LLC (SCILLC).
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