SN74ALVCH16373 16-BIT TRANSPARENT D-TYPE LATCH WITH 3-STATE OUTPUTS www.ti.com FEATURES * * * * * * * Member of the Texas Instruments WidebusTM Family Operates From 1.65 V to 3.6 V Max tpd of 3.6 ns at 3.3 V 24-mA Output Drive at 3.3 V Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors Latch-Up Performance Exceeds 250 mA Per JESD 17 ESD Protection Exceeds JESD 22 - 2000-V Human-Body Model (A114-A) - 200-V Machine Model (A115-A) XXXX DESCRIPTION/ORDERING INFORMATION This 16-bit transparent D-type latch is designed for 1.65-V to 3.6-V VCC operation. The SN74ALVCH16373 is particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers. This device can be used as two 8-bit latches or one 16-bit latch. When the latch-enable (LE) input is high, the Q outputs follow the data (D) inputs. When LE is taken low, the Q outputs are latched at the levels set up at the D inputs. SCES020I - JULY 1995 - REVISED NOVEMBER 2005 DGG OR DL PACKAGE (TOP VIEW) 1OE 1Q1 1Q2 GND 1Q3 1Q4 VCC 1Q5 1Q6 GND 1Q7 1Q8 2Q1 2Q2 GND 2Q3 2Q4 VCC 2Q5 2Q6 GND 2Q7 2Q8 2OE 1 48 2 47 3 46 4 45 5 44 6 43 7 42 8 41 9 40 10 39 11 38 12 37 13 36 14 35 15 34 16 33 17 32 18 31 19 30 20 29 21 28 22 27 23 26 24 25 1LE 1D1 1D2 GND 1D3 1D4 VCC 1D5 1D6 GND 1D7 1D8 2D1 2D2 GND 2D3 2D4 VCC 2D5 2D6 GND 2D7 2D8 2LE A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the buslines significantly. The high-impedance state and the increased drive provide the capability to drive bus lines without need for interface or pullup components. OE does not affect internal operations of the latch. Old data can be retained or new data can be entered while the outputs are in the high-impedance state. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Widebus is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 1995-2005, Texas Instruments Incorporated SN74ALVCH16373 16-BIT TRANSPARENT D-TYPE LATCH WITH 3-STATE OUTPUTS www.ti.com SCES020I - JULY 1995 - REVISED NOVEMBER 2005 ORDERING INFORMATION PACKAGE (1) TA FBGA - GRD FBGA - ZRD (Pb-free) ORDERABLE PART NUMBER SN74ALVCH16373GRDR Tape and reel SSOP - DL VH373 SN74ALVCH16373ZRDR Tube TOP-SIDE MARKING SN74ALVCH16373DL SN74ALVCH16373DLR Tape and reel ALVCH16373 74ALVCH16373DLG4 -40C to 85C 74ALVCH16373DLRG4 SN74ALVCH16373DGGR TSSOP - DGG Tape and reel 74ALVCH16373DGGE4 ALVCH16373 74ALVCH16373DGGRG4 VFBGA - GQL VFBGA - ZQL (Pb-free) (1) SN74ALVCH16373KR Tape and reel VH373 74ALVCH16373ZQLR Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. GQL OR ZQL PACKAGE (TOP VIEW) TERMINAL ASSIGNMENTS (1) (56-Ball GQL/ZQL Package) 1 2 3 4 5 6 A B C D E F G H J K 1 2 3 4 5 6 A 1OE NC NC NC NC 1LE B 1Q2 1Q1 GND GND 1D1 1D2 C 1Q4 1Q3 VCC VCC 1D3 1D4 D 1Q6 1Q5 GND GND 1D5 1D6 E 1Q8 1Q7 1D7 1D8 F 2Q1 2Q2 2D2 2D1 G 2Q3 2Q4 GND GND 2D4 2D3 H 2Q5 2Q6 VCC VCC 2D6 2D5 J 2Q7 2Q8 GND GND 2D8 2D7 K 2OE NC NC NC NC 2LE abc (1) abc NC - No internal connection GRD OR ZRD PACKAGE (TOP VIEW) 1 2 3 4 5 6 TERMINAL ASSIGNMENTS (1) (54-Ball GRD/ZRD Package) 1 2 3 4 5 6 A 1Q1 NC 1OE 1LE NC 1D1 B 1Q3 1Q2 NC NC 1D2 1D3 C 1Q5 1Q4 VCC VCC 1D4 1D5 D 1Q7 1Q6 GND GND 1D6 1D7 D E 2Q1 1Q8 GND GND 1D8 2D1 E F 2Q3 2Q2 GND GND 2D2 2D3 G 2Q5 2Q4 VCC VCC 2D4 2D5 H 2Q7 2Q6 NC NC 2D6 2D7 J 2Q8 NC 2OE 2LE NC 2D8 A B C F G H J (1) NC - No internal connection xxxxx 2 SN74ALVCH16373 16-BIT TRANSPARENT D-TYPE LATCH WITH 3-STATE OUTPUTS www.ti.com SCES020I - JULY 1995 - REVISED NOVEMBER 2005 FUNCTION TABLE (EACH 8-BIT SECTION) INPUTS OE LE D OUTPUT Q L H H H L H L L L L X Q0 H X X Z LOGIC DIAGRAM (POSITIVE LOGIC) 1OE 1LE 1D1 1 2OE 48 2LE C1 47 1D 2 1Q1 24 25 C1 2D1 36 To Seven Other Channels 13 1D 2Q1 To Seven Other Channels Pin numbers shown are for the DGG and DL packages. Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) VCC Supply voltage range range (2) (3) VI Input voltage VO Output voltage range (2) (3) IIK Input clamp current VI < 0 IOK Output clamp current VO < 0 IO Continuous output current MIN MAX -0.5 4.6 V -0.5 VCC + 0.5 V -0.5 VCC + 0.5 Continuous current through each VCC or GND JA Tstg (1) (2) (3) (4) Package thermal impedance (4) Storage temperature range V -50 mA -50 mA 50 mA 100 mA DGG package 70 DL package 63 GQL/ZQL package 42 GRD/ZRD package 36 -65 UNIT 150 C/W C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. This value is limited to 4.6 V maximum. The package thermal impedance is calculated in accordance with JESD 51-7. 3 SN74ALVCH16373 16-BIT TRANSPARENT D-TYPE LATCH WITH 3-STATE OUTPUTS www.ti.com SCES020I - JULY 1995 - REVISED NOVEMBER 2005 Recommended Operating Conditions (1) VCC Supply voltage VIH High-level input voltage VCC = 1.65 V to 1.95 V MIN MAX 1.65 3.6 Low-level input voltage VI Input voltage VO Output voltage IOH High-level output current IOL Low-level output current t/v Input transition rise or fall rate TA Operating free-air temperature (1) 4 V 0.65 x VCC VCC = 2.3 V to 2.7 V 1.7 VCC = 2.7 V to 3.6 V 2 V 0.35 x VCC VCC = 1.65 V to 1.95 V VIL UNIT VCC = 2.3 V to 2.7 V 0.7 VCC = 2.7 V to 3.6 V 0.8 V 0 VCC V 0 VCC V VCC = 1.65 V -4 VCC = 2.3 V -12 VCC = 2.7 V -12 VCC = 3 V -24 VCC = 1.65 V 4 VCC = 2.3 V 12 VCC = 2.7 V 12 VCC = 3 V 24 -40 mA mA 10 ns/V 85 C All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. SN74ALVCH16373 16-BIT TRANSPARENT D-TYPE LATCH WITH 3-STATE OUTPUTS www.ti.com SCES020I - JULY 1995 - REVISED NOVEMBER 2005 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOH = -100 A 1.65 V to 3.6 V 1.65 V IOH = -6 mA 2.3 V 2 2.3 V 1.7 2.7 V 2.2 IOH = -12 mA II(hold) V 3V 2.4 3V 2 IOL = 100 A 1.65 V to 3.6 V 0.2 IOL = 4 mA 1.65 V 0.45 IOL = 6 mA 2.3 V 0.4 2.3 V 0.7 2.7 V 0.4 3V 0.55 IOL = 24 mA UNIT 1.2 IOH = -24 mA IOL = 12 mA II MAX VCC - 0.2 IOH = -4 mA VOH VOL MIN TYP (1) VCC V 5 VI = VCC or GND 3.6 V VI = 0.58 V 1.65 V 25 VI = 1.07 V 1.65 V -25 VI = 0.7 V 2.3 V 45 VI = 1.7 V 2.3 V -45 VI = 0.8 V 3V 75 VI = 2 V 3V -75 A A VI = 0 to 3.6 V (2) 3.6 V 500 IOZ VO = VCC or GND 3.6 V 10 A ICC VI = VCC or GND IO = 0 3.6 V 40 A ICC One input at VCC - 0.6 V, Other inputs at VCC or GND 3 V to 3.6 V 750 A Ci Co (1) (2) Control inputs Data inputs Outputs VI = VCC or GND 3.3 V VO = VCC or GND 3.3 V 3 pF 6 7 pF All typical values are at VCC = 3.3 V, TA = 25C. This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to another. Timing Requirements over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) VCC = 1.8 V MIN Pulse duration, LE high or low (1) tsu Setup time, data before LE (1) th Hold time, data after LE (1) tw (1) MAX VCC = 2.5 V 0.2 V MIN 3.3 MAX VCC = 2.7 V MIN MAX VCC = 3.3 V 0.3 V MIN UNIT MAX 3.3 3.3 ns 1 1 1.1 ns 1.5 1.7 1.4 ns This information was not available at the time of publication. 5 SN74ALVCH16373 16-BIT TRANSPARENT D-TYPE LATCH WITH 3-STATE OUTPUTS www.ti.com SCES020I - JULY 1995 - REVISED NOVEMBER 2005 Switching Characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) FROM (INPUT) PARAMETER D tpd LE ten OE tdis (1) VCC = 1.8 V TO (OUTPUT) OE TYP VCC = 2.5 V 0.2 V VCC = 2.7 V MIN MAX (1) 1 (1) 1 Q (1) Q (1) Q MIN VCC = 3.3 V 0.3 V UNIT MAX MIN MAX 4.5 4.3 1.1 3.6 4.9 4.6 1 3.9 1 6 5.7 1 4.7 ns 1.2 5.1 4.5 1.4 4.1 ns ns This information was not available at the time of publication. Operating Characteristics TA = 25C PARAMETER Cpd (1) 6 Power dissipation capacitance Outputs enabled Outputs disabled TEST CONDITIONS CL = 50 pF, This information was not available at the time of publication. f = 10 MHz VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V TYP TYP TYP (1) 19 22 (1) 4 5 UNIT pF SN74ALVCH16373 16-BIT TRANSPARENT D-TYPE LATCH WITH 3-STATE OUTPUTS www.ti.com SCES020I - JULY 1995 - REVISED NOVEMBER 2005 PARAMETER MEASUREMENT INFORMATION VLOAD S1 RL From Output Under Test Open GND CL (see Note A) RL TEST S1 tpd tPLZ/tPZL tPHZ/tPZH Open VLOAD GND LOAD CIRCUIT INPUT VCC 1.8 V 2.5 V 0.2 V 2.7 V 3.3 V 0.3 V VI tr/tf VCC VCC 2.7 V 2.7 V 2 ns 2 ns 2.5 ns 2.5 ns VM VLOAD CL RL V VCC/2 VCC/2 1.5 V 1.5 V 2 x VCC 2 x VCC 6V 6V 30 pF 30 pF 50 pF 50 pF 1 k 500 500 500 0.15 V 0.15 V 0.3 V 0.3 V tw VI Timing Input VM VM VM 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VM VM 0V tPLH Output Control (low-level enabling) tPLZ VLOAD/2 VM tPZH VOH VM VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES VM 0V Output Waveform 1 S1 at VLOAD (see Note B) tPHL VM VI VM tPZL VI Input VOLTAGE WAVEFORMS PULSE DURATION th VI Data Input VM 0V 0V tsu Output VI VM Input Output Waveform 2 S1 at GND (see Note B) VOL + V VOL tPHZ VOH VM VOH - V 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 . D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 7 PACKAGE OPTION ADDENDUM www.ti.com 3-May-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp Samples (Requires Login) 74ALVCH16373DGGRG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ALVCH16373DLG4 ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ALVCH16373DLRG4 ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ALVCH16373GRDR LIFEBUY BGA MICROSTAR JUNIOR GRD 54 1000 TBD 74ALVCH16373GRE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) 74ALVCH16373ZQLR ACTIVE BGA MICROSTAR JUNIOR ZQL 56 1000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM 74ALVCH16373ZRDR ACTIVE BGA MICROSTAR JUNIOR ZRD 54 1000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM SN74ALVCH16373DGGR ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVCH16373DL ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVCH16373DLR ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVCH16373KR LIFEBUY BGA MICROSTAR JUNIOR GQL 56 1000 TBD SNPB (3) Level-1-240C-UNLIM CU NIPDAU Level-1-260C-UNLIM SNPB Level-1-240C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 3-May-2012 TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 74ALVCH16373GRDR BGA MI CROSTA R JUNI OR GRD 54 1000 330.0 16.4 5.8 8.3 1.55 8.0 16.0 Q1 74ALVCH16373ZQLR BGA MI CROSTA R JUNI OR ZQL 56 1000 330.0 16.4 4.8 7.3 1.5 8.0 16.0 Q1 74ALVCH16373ZRDR BGA MI CROSTA R JUNI OR ZRD 54 1000 330.0 16.4 5.8 8.3 1.55 8.0 16.0 Q1 SN74ALVCH16373DGGR TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1 DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1 GQL 56 1000 330.0 16.4 4.8 7.3 1.45 8.0 16.0 Q1 SN74ALVCH16373DLR SN74ALVCH16373KR SSOP BGA MI CROSTA R JUNI OR Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) 74ALVCH16373GRDR BGA MICROSTAR JUNIOR GRD 54 1000 333.2 345.9 28.6 74ALVCH16373ZQLR BGA MICROSTAR JUNIOR ZQL 56 1000 333.2 345.9 28.6 74ALVCH16373ZRDR BGA MICROSTAR JUNIOR ZRD 54 1000 333.2 345.9 28.6 SN74ALVCH16373DGGR TSSOP DGG 48 2000 367.0 367.0 45.0 SN74ALVCH16373DLR SSOP DL 48 1000 367.0 367.0 55.0 SN74ALVCH16373KR BGA MICROSTAR JUNIOR GQL 56 1000 333.2 345.9 28.6 Pack Materials-Page 2 MECHANICAL DATA MSSO001C - JANUARY 1995 - REVISED DECEMBER 2001 DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0.025 (0,635) 0.0135 (0,343) 0.008 (0,203) 48 0.005 (0,13) M 25 0.010 (0,25) 0.005 (0,13) 0.299 (7,59) 0.291 (7,39) 0.420 (10,67) 0.395 (10,03) Gage Plane 0.010 (0,25) 1 0-8 24 0.040 (1,02) A 0.020 (0,51) Seating Plane 0.110 (2,79) MAX 0.004 (0,10) 0.008 (0,20) MIN PINS ** 28 48 56 A MAX 0.380 (9,65) 0.630 (16,00) 0.730 (18,54) A MIN 0.370 (9,40) 0.620 (15,75) 0.720 (18,29) DIM 4040048 / E 12/01 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). Falls within JEDEC MO-118 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MTSS003D - JANUARY 1995 - REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,17 0,50 48 0,08 M 25 6,20 6,00 8,30 7,90 0,15 NOM Gage Plane 1 0,25 24 0- 8 A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 48 56 64 A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 DIM 4040078 / F 12/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold protrusion not to exceed 0,15. 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