TLC7701-Q1, TLC7705-Q1, TLC7733-Q1
MICROPOWER SUPPLY VOLTAGE SUPERVISORS
SGLS208A − OCTOBER 2003 − REVISED MAY 2008
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DQualified for Automotive Applications
DPower-On Reset Generator
DAutomatic Reset Generation After
Voltage Drop
DPrecision Voltage Sensor
DTemperature-Compensated Voltage
Reference
DProgrammable Delay Time by External
Capacitor
DSupply Voltage Range ...2 V to 6 V
DDefined RESET Output from VDD ≥1 V
DPower-Down Control Support for Static
RAM With Battery Backup
DMaximum Supply Current of 16 μA
DPower Saving Totem-Pole Outputs
description
The TLC77xx family of micropower supply voltage supervisors provide reset control, primarily in microcomputer
and microprocessor systems.
During power-on, RESET is asserted when VDD reaches 1 V. After minimum VDD (≥2 V) is established, the
circuit monitors SENSE voltage and keeps the reset outputs active as long as SENSE voltage (VI(SENSE))
remains below the threshold voltage. An internal timer delays return of the output to the inactive state to ensure
proper system reset. The delay time, td, is determined by an external capacitor:
td = 2.1 × 104 × CT
Where
CT is in farads
td is in seconds
Except for the TLC7701, which can be customized with two external resistors, each supervisor has a fixed
SENSE threshold voltage set by an internal voltage divider. When SENSE voltage drops below the threshold
voltage, the outputs become active and stay in that state until SENSE voltage returns above threshold voltage
and the delay time, td, has expired.
In addition to the power-on-reset and undervoltage-supervisor function, the TLC77xx adds power-down control
support for static RAM. When CONTROL is tied to GND, RESET will act as active high. The voltage monitor
contains additional logic intended for control of static memories with battery backup during power failure. By
driving the chip select (CS) of the memory circuit with the RESET output of the TLC77xx and with the CONTROL
driven by the memory bank select signal (CSH1) of the microprocessor (see Figure 10), the memory circuit is
automatically disabled during a power loss. (In this application the TLC77xx power has to be supplied by the
battery.)
Copyright © 2008, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
1
2
3
4
8
7
6
5
CONTROL
RESIN
CT
GND
VDD
SENSE
RESET
RESET
PW PACKAGE
(TOP VIEW)
TLC7701-Q1, TLC7705-Q1, TLC7733-Q1
MICROPOWER SUPPLY VOLTAGE SUPERVISORS
SGLS208A − OCTOBER 2003 − REVISED MAY 2008
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ORDERING INFORMATION†}
TAPACKAGE§ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
TSSOP − PW Tape and reel TLC7701QPWRQ1 7701Q1
−40°C to 125°CTSSOP − PW Tape and reel TLC7705QPWRQ1 7705Q1
TSSOP − PW Tape and reel TLC7733QPWRQ1 7733Q1
†For the most current package and ordering information, see the Package Option Addendum at the end
of this document, or see the TI web site at http://www.ti.com.
‡Package drawings, thermal data, and symbolization are available at http://www.ti.com/packaging.
§The PW package is only available left-end taped and reeled (indicated by the R suffix on the device type;
e.g., TLC7701QPWREP).
FUNCTION TABLE
CONTROL RESIN VI(SENSE)>VIT+ RESET RESET
L L False H L
L L True H L
L H False H L
L H True L§H§
H L False H L
H L True H L
H H False H L
H H True H H§
§RESET and RESET states shown are valid for t > td.
logic symbol
This symbol is in accordance with ANSI/IEEE Std 91−1984 and
IEC Publication 617-12.
6
1
3
2
7
SENSE
≥1
≥1
≥1RESET
5
COMP
S
VIT
S<VIT
Z1
Z2
Z3
RESIN
CT
CONTROL RESET
3
2
1
1
CX
×
TLC7701-Q1, TLC7705-Q1, TLC7733-Q1
MICROPOWER SUPPLY VOLTAGE SUPERVISORS
SGLS208A − OCTOBER 2003 − REVISED MAY 2008
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
functional block diagram
1.1 V
R2‡
R1‡
RESET†
RESET†
VDD
GND
8
6
5
4
RESIN
CONTROL
SENSE
CT
3
1
2
7
1 MΩ
50 μA
†Outputs are totem-pole configuration. External pullup or pulldown resistors are not required.
‡Nominal values:
TLC7701
R1 (Typ) R2 (Typ)
TLC7733 750 k 450 kΩΩ
0∞
TLC7705 910 k 290 kΩΩ
TLC7701-Q1, TLC7705-Q1, TLC7733-Q1
MICROPOWER SUPPLY VOLTAGE SUPERVISORS
SGLS208A − OCTOBER 2003 − REVISED MAY 2008
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
timing diagram
RESET
Output
Output
Undefined
VDD and VI(SENSE)
td
Threshold Voltages
Vres
VIT−
VIT+
ÎÎ
td
t
t
VIT+
absolute maximum ratings over operating free-air temperature (unless otherwise noted)†
Supply voltage, VDD (see Note 1) 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, CONTROL, RESIN, SENSE (see Note 1) −0.3 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum low output current, IOL 10 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum high output current, IOH −10 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0 or VI > VDD) ±10 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, IOK (VO < 0 or VO > VDD) ±10 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous total power dissipation See Dissipation Rating Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating free-air temperature range, TA: TL77xxQ −40°C to 125°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: All voltage values are with respect to GND.
DISSIPATION RATING TABLE
PACKAGE TA ≤ 25°C
POWER RATING
DERATING FACTOR
ABOVE TA = 25°C
TA = 85°C
POWER RATING
TA = 125°C
POWER RATING
PW 525 mW 4.2 mW/°C273 mW 105 mW
recommended operating conditions at specified temperature range
MIN MAX UNIT
Supply voltage, VDD 2 6 V
Input voltage, VI0 VDD V
High-level input voltage at RESIN and CONTROL‡, VIH 0.7×VDD V
Low-level input voltage at RESIN and CONTROL‡, VIL 0.2×VDD V
High-level output current, IOH
V≥27V
−2 mA
Low-level output current, IOL
VDD ≥2.7 V 2 mA
Input transition rise and fall rate at RESIN and CONTROL, Δt/ΔV 100 ns/V
Operating free-air temperature range, TA−40 125 °C
‡To ensure a low supply current, VIL should be kept < 0.3 V and VIH > VDD −0.3 V.
TLC7701-Q1, TLC7705-Q1, TLC7733-Q1
MICROPOWER SUPPLY VOLTAGE SUPERVISORS
SGLS208A − OCTOBER 2003 − REVISED MAY 2008
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics over recommended operating conditions (see Note 2) (unless otherwise
noted)
PARAMETER
TEST CONDITIONS
TLC77xx
UNIT
PARAMETER TEST CONDITIONS MIN TYP†MAX UNIT
VDD = 2 V 1.8
V
High level output voltage
IOH = − 20 μAVDD = 2.7 V 2.5
V
VOH High-level output voltage
IOH
20
μA
VDD = 4.5 V 4.3 V
IOH = − 2 mA VDD = 4.5 V 3.7
VDD = 2 V 0.2
V
Low level output voltage
IOL = 20 μAVDD = 2.7 V 0.2
V
VOL Low-level output voltage
IOL
20
μA
VDD = 4.5 V 0.2 V
IOL = 2 mA VDD = 4.5 V 0.5
TLC7701 1.04 1.1 1.16
VIT −
Negative-going input threshold voltage,
TLC7705 VDD = 2 V to 6 V 4.43 4.5 4.63 V
VIT
−
see
o
e
TLC7733
VDD
2
V
to
6
V
2.855 2.93 3.03
V
TLC7701 30
Vh
y
sHysteresis voltage, SENSE TLC7705 VDD = 2 V to 6 V
70
mV
Vhys
TLC7733
VDD
2
V
to
6
V
70
mV
Vres Power-up reset voltage‡IOL = 20 μA 1 V
RESIN VI = 0 V to VDD 2
I
Input current
CONTROL VI = VDD 7 15
μA
IIInput current SENSE VI = 5 V 5 10 μA
SENSE, TLC7701 only VI = 5 V 2
RESIN = V
DD,
IDD Supply current
RESIN
=
VDD
,
SENSE = VDD ≥ VITmax + 0.2 V 916μA
IDD
Supply
current
CONTROL = 0 V, Outputs open
9
16
μA
IDD(d) Supply current during td
VDD = 5 V,
RESIN = VDD,
CONTROL = 0 V,
VCT = 0 ,
SENSE = VDD,
Outputs open
120 150 μA
CIInput capacitance, SENSE VI = 0 V to VDD 50 pF
†Typical values apply at TA = 25°C.
‡The lowest supply voltage at which RESET becomes active. The symbol Vres is not currently listed within EIA or JEDEC standards for
semiconductor symbology. Rise time of VDD ≥ 15 μs/V.
NOTES: 2. All characteristics are measured with CT = 0.1 μF.
3. To ensure best stability of the threshold voltage, a bypass capacitor (ceramic, 0.1 μF) should be connected near the supply terminals.
TLC7701-Q1, TLC7705-Q1, TLC7733-Q1
MICROPOWER SUPPLY VOLTAGE SUPERVISORS
SGLS208A − OCTOBER 2003 − REVISED MAY 2008
6POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
switching characteristics at VDD = 5 V, RL = 2 kΩ, CL = 50 pF, TA = Full Range (unless otherwise
noted)
MEASURED TLC77xx
PARAMETER FROM
(INPUT)
TO
(OUTPUT)
TEST CONDITIONS MIN TYP MAX UNIT
tdDelay time VI(SENSE) ≥ VIT+
RESET
and
RESET
RESIN = 0.7 × VDD,
CONTROL = 0.2 × VDD,
CT = 100 nF,
TA = Full range,
See timing diagram
1.1 2.1 4.2 ms
tPLH
Propagation delay time,
low-to-high-level output
RESET
V V max 0 2 V
20
tPHL
Propagation delay time,
high-to-low-level output
SENSE
RESET VIH = VIT+max + 0.2 V,
VIL = VIT−min − 0.2 V,
RESIN 07×V
5
s
tPLH
Propagation delay time,
low-to-high-level output
SENSE
RESET
RESIN = 0.7 × VDD,
CONTROL = 0.2 × VDD,
CT NC†
5
μs
tPHL
Propagation delay time,
high-to-low-level output
RESET CT = NC†
20
tPLH
Propagation delay time,
low-to-high-level output
RESET
V07×V
20 μs
tPHL
Propagation delay time,
high-to-low-level output
RESIN
RESET VIH = 0.7 × VDD,
VIL = 0.2 × VDD,
SENSE V max+02V
60
ns
tPLH
Propagation delay time,
low-to-high-level output
RESIN
RESET
SENSE = VIT+max + 0.2 V,
CONTROL = 0.2 × VDD,
CT NC†
65
ns
tPHL
Propagation delay time,
high-to-low-level output
RESET CT = NC†
20 μs
tPLH
Propagation delay time,
low-to-high-level output
CONTROL
RESET
VIH = 0.7 × VDD,
VIL = 0.2 × VDD,
SENSE V max+02V
58 ns
tPHL
Propagation delay time,
high-to-low-level output
CONTROL RESET SENSE = VIT+max + 0.2 V,
RESIN = 0.7 × VDD,
CT = NC†
58 ns
Low-level minimum pulse
duration to switch RESET
SENSE VIH = VIT+max + 0.2 V,
VIL = VIT−min − 0.2 V, 3
s
duration to switch RESET
and RESET RESIN VIL = 0.2 × VDD,
VIH = 0.7 × VDD
1
μs
trRise time RESET
and
10% to 90% 8
ns/V
tfFall time
and
RESET 90% to 10% 4
ns/V
†NC = No capacitor, and includes up to 100-pF probe and jig capacitance.
TLC7701-Q1, TLC7705-Q1, TLC7733-Q1
MICROPOWER SUPPLY VOLTAGE SUPERVISORS
SGLS208A − OCTOBER 2003 − REVISED MAY 2008
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
DUT
RL
(see Note A) CL
(see Note B)
5 V
NOTES: A. For switching characteristics, RL = 2 kΩ.
B. CL = 50 pF includes jig and probe capacitance.
Figure 1. RESET AND RESET Output Configurations
VIT−
tw(L) tw(L)
VIT+max + 200 mV2.7 V
VIT+
VIT−min − 200 mV
(a) RESIN (b) SENSE
0.4 V
1.5 V
tw(L)
0.7 × VDD
0.2 × VDD
0.5 × VDD
M suffixed devices
I, Q, and Y suffixed devices
Figure 2. Input Pulse Definition Waveforms
TLC7701-Q1, TLC7705-Q1, TLC7733-Q1
MICROPOWER SUPPLY VOLTAGE SUPERVISORS
SGLS208A − OCTOBER 2003 − REVISED MAY 2008
8POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
Figure 3
Normalized Input Threshold Voltage −
1.005
−40
1.004
1.003
1.002
1.001
1
0.999
0.998
0.997
−20 0 20 40 60 80 100 120
TA − Temperature − °C
VIT−(TA)/VIT− (25 C)
°
NORMALIZED INPUT THRESHOLD VOLTAGE
vs
TEMPERATURE
Figure 4
10
−0.5
9
8
7
6
5
4
3
2
0.5 1.5 2.5 3.5 4.5 5.5 6.5
VDD − Supply Voltage − V
1
0
−1
RESIN = VDD = −1 V to 6.5 V
SENSE = GND
CONTROL = GND
CT = Open = 100 pF
TA = 25°C
− Supply Current − AμIDD
SUPPLY CURRENT
vs
SUPPLY VOLTAGE
Figure 5
4.5
5
4
3.5
3
2.5
2
1.5
1
0.5
0 −5 −10 −15 −20 −25 −40
IOH − High-Level Output Current − mA
0
−0.5
−1
VDD = 4.5 V
RESIN = 4.5 V
SENSE = 0.5 V
CONTROL = 0 V
CT = Open = 100 pF
− High-Level Output Voltage − VV
OH
5
125°C
85°C
25°C
−40°C
−55°C
0°C
HIGH-LEVEL OUTPUT VOLTAGE
vs
HIGH-LEVEL OUTPUT CURRENT
−30 −35
Figure 6
−5
6
5
4
3
2
0 5 10 15 20 25 30
IOL − Low-Level Output Current − mA
1
0
−1
VDD = 4.5 V
RESIN = 4.5 V
SENSE = 5 V
CONTROL = 0 V
CT = Open = 100 pF
− Low-Level Output Voltage − VV
OL
−40°C
−55°C
125°C
85°C
25°C
0°C
LOW-LEVEL OUTPUT VOLTAGE
vs
LOW-LEVEL OUTPUT CURRENT
TLC7701-Q1, TLC7705-Q1, TLC7733-Q1
MICROPOWER SUPPLY VOLTAGE SUPERVISORS
SGLS208A − OCTOBER 2003 − REVISED MAY 2008
9
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
Figure 7
−1
4
2
0
−2
−4
0 12345 6
VI − Input Voltage at SENSE − V
−6
−8
−10
−55°C
125°C
VDD = 4.5 V
CT = Open = 100 pF
8
6
− Input Current − AμII
−55°C
125°C
INPUT CURRENT
vs
INPUT VOLTAGE AT SENSE
Figure 8
0
7
6
5
4
3
50 100 150 200
Sense Threshold Overdrive − mV
2
1
0
− Minimum Pulse Duration at SENSE − sμtw
MINIMUM PULSE DURATION AT SENSE
vs
SENSE THRESHOLD OVERDRIVE
250 300 350 400
VDD = 2 V
Control = 0.4 V
RESIN = 1.4 V
CT = Open = 100 pF
TLC7701-Q1, TLC7705-Q1, TLC7733-Q1
MICROPOWER SUPPLY VOLTAGE SUPERVISORS
SGLS208A − OCTOBER 2003 − REVISED MAY 2008
10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
TLC77xx
GND
0.1 μF
RESETRESIN
RESETSENSE
CONTROLCT
GND
RESET
VDD
TMS70C20
NC
100 kΩ
RESET
VDD
VDD
0.1 μF
Figure 9. Reset Controller in a Microcomputer System
VDD
GND
RESET
SENSE
CONTROL
CT
RESET
GND
CS
VDD
TLC77xx
RESET
CSH1
ADD0 − 15
GND
R/W
16
8
A0 − A15
D0 − D7DATA0 − 7
R/W
32K 8
CMOS RAM
TMS370
VDD
RESIN
0.1 μF
0.1 μF
0.1 μF
Figure 10. Data Retention During Power Down Using Static CMOS RAMs
PACKAGE OPTION ADDENDUM
www.ti.com 10-Aug-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TLC7701QPWRG4Q1 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7701QPWRQ1 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7705QPWRG4Q1 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7705QPWRQ1 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7733QPWRG4Q1 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7733QPWRQ1 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com 10-Aug-2012
Addendum-Page 2
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TLC7701-Q1, TLC7705-Q1, TLC7733-Q1 :
•Catalog: TLC7701, TLC7705, TLC7733
•Enhanced Product: TLC7701-EP, TLC7705-EP, TLC7733-EP
•Military: TLC7705M, TLC7733M
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
•Enhanced Product - Supports Defense, Aerospace and Medical Applications
•Military - QML certified for Military and Defense Applications
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