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SMT Power Inductor
High Current Molded Power Inductor - PA4341.XXXANLT Series
PRELIMINARY
1
Height: 3.0mm Max
Footprint: 7.4mm x 6.8mm Max
Current Rating: up to 30.0A
Inductance Range: 0.15uH to 22.0uH
Shielded construction and compact design
High current, low DCR, and high efciency
Minimized acoustic noise and minimized leakage ux
Electrical Specifications @ 25°C - Operating Temperature -55°C to +155°C
Part
Number
Inductance
100KHz, 1V
Rated
Current
DC
Resistance Saturation
Current
Max.MAX. TYP.
uH±20% A mΩmΩA
PA4341.151ANLT 0.15* 30.0 2.1 1.7 40.0
PA4341.221ANLT 0.22 23.0 2.5 2.0 34.0
PA4341.331ANLT 0.33 21.0 3.4 2.8 25.0
PA4341.361ANLT 0.36 20.0 3.9 3.3 24.0
PA4341.471ANLT 0.47 18.0 4.0 3.4 20.0
PA4341.561ANLT 0.56 16.5 4.5 3.9 18.0
PA4341.681ANLT 0.68 16.0 5.3 4.7 17.0
PA4341.821ANLT 0.82 14.0 6.0 5.4 16.0
PA4341.102ANLT 1.00 12.0 7.4 6.7 15.0
PA4341.122ANLT 1.20 10.0 9.5 7.7 14.0
PA4341.152ANLT 1.50 10.0 12.1 10.2 14.0
PA4341.222ANLT 2.20 8.0 15.0 13.5 10.0
PA4341.272ANLT 2.70 7.2 20.0 17.3 9.8
PA4341.332ANLT 3.30 6.5 22.0 19.0 9.5
PA4341.472ANLT 4.70 5.5 33.0 28.0 6.5
PA4341.562ANLT 5.60 5.5 42.0 39.0 6.0
PA4341.682ANLT 6.80 4.5 50.0 43.0 6.0
PA4341.822ANLT 8.20 4.5 60.0 54.0 6.0
PA4341.103ANLT 10.0 4.0 68.0 62.0 5.5
PA4341.153ANLT 15.0 3.0 140 110 4.5
PA4341.223ANLT 22.0 2.5 190 150 3.0
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SMT Power Inductor
High Current Molded Power Inductor - PA4341.XXXANLT Series
PRELIMINARY
2
1. Actual temperature of the component during system operation (ambient plus tempera-
ture rise) must be within the standard operating range.
2. The saturation current is the current at which the initial inductance drops approxi-
mately 30% at the stated ambient temperature. This current is determined by placing
the component in the specified ambient environment and applying a short duration
pulse current (to eliminate self-heating eect) to the component.
3.
Please note that the inductance tolerance is
±20% for all parts except PA4341.151NLT(±30%)
4. The rated current is the DC current required to raise the component temperature by
approximately 40�C. Take note that the components’ performanc varies depending on the
system condition. It is suggested that the component be tested at the system level, to
verify the temperature rise of the component during system operation.
5. The part temperature (ambient+temp rise) should not exceed 155�C under worst case
operating conditions. Circuit design, PCB trace size and thickness, airflow and other cool-
ing provisions all aect the part temperature. Part temperature should be verified in the
end application.
Notes:
PA4341.XXXANLT
Mechanical
AC
D
T
A`
E
B
XXXANL
D/C
L
G
H
Final Layout SUGGESTED PAD LAYOUT
Series A A` B C D E T L G H
PA4341.XXXANLT 7.1±0.3 6.4±0.3 6.6±0.2 2.8±0.2 1.6±0.3 3.0±0.2 0~0.15 8.0 3.7 3.4
All Dimensions in mm.
TAPE & REEL INFO
Blank portions
Blank portions Chip cavity
200mm or more 400mm or more
Direction of tape
P
W
K
A
G
0
1
SURFACE MOUNTING TYPE, REEL/TAPE LIST
REEL SIZE (mm) TAPE SIZE (mm) QTY
A G P1W K0PCS/REEL
PA4341.XXXANLT Ø330 16.4+2/-0 12.0±0.1 16±0.3 3.3±0.1 1000
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SMT Power Inductor
High Current Molded Power Inductor - PA4341.XXXANLT Series
PRELIMINARY
3
Typical Performance Curves
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SMT Power Inductor
High Current Molded Power Inductor - PA4341.XXXANLT Series
PRELIMINARY
4
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SMT Power Inductor
High Current Molded Power Inductor - PA4341.XXXANLT Series
PRELIMINARY
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be trademarks or registered trademarks of their respective owners. © Copyright, 2017. Pulse Electronics, Inc. All rights reserved.
SMT Power Inductor
High Current Molded Power Inductor - PA4341.XXXANLT Series
PRELIMINARY
P820.B (11/17)
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