I06-0074
D
D
1
GVJ 2006/06/08
2006/06/22
2006/06/22
1998/12/16
.000±.00X
.00±0.1
1998/12/16
GEORGE.V.JOSEPH
GEORGE.V.JOSEPH
K_V_SIVADAS
GEORGE.V.JOSEPH
0°±1°
6
C-DD-0051
DELTA-D
:SELF EXTINGUISHING BLACK POLYESTER UL CLASS 94V0INSULATORS
2 MIN.MATTE TIN TOP OVER
1.27 MIN.NICKEL UNDER PLATE(ON TERMINATION ZONE)
OR PROTECTIVE METALLIC DEVICE
THE HOUSING WILL WITHSTAND EXPOSURE TO 260-265°C
IF WE USE PROTECTIVE ADHESIVE (type Kapton or Teflon)
TIN LEAD OVER NICKEL
GOLD OVER NICKEL
COPPER ALLOY
300V
1000V
< 5m
< 25m
> 5000M
200 (FLASH Au); 500 (0.76µ Au)
-55°C +125°C
ENVIRONMENTAL CHARACTERISTICS.
MATING/UNMATING CYCLES (MIN)
MECHANICAL CHARACTERISTICS
OPERATING TEMPERATURE RANGE
:
:
INSULATION RESISTANCE
CONTACT RESISTANCE
RATED VOLTAGE
SHELL RESISTANCE
TEST VOLTAGE
MAX.CURRENT RATING
ELECTRICAL DATA
:
:
:
:
:5A
:
FOR LEAD FREE PLATING
TERMINATION ZONE
ACTIVE ZONE
PLATING
CONTACTS
:µ
:
:
:
µ
STEEL TIN/Zinc Cr3 PLATED.
TECHNICAL SPECIFICATIONS
SHELL
MATERIAL
:
5 N Max./ 0.3 N Min.
INSERTION/EXTRACTION FORCE PER CONTACT :
Packaging as per GS-14-920
"This LF product meets European Union Directives and other country
regulations as described in GS-22-008"
The housing will withstand exposure to 260°C peak temperature for 3.5 seconds
in a wave solder application with a 1.6mm minimum thick circuit board.
P-PIN
09,15,25 & 37
TYPE OF TERMINATION
33-ANGLED SPILL
TYPE OF CONTACTS
NO.OF CONTACTS
PITCH 2.84 USA
FOOT PRINT 8.08 USA
Part number & date code printing
SERIES
D I2 5
LEAD FREE
HEIGHT OF TERMINATION
E-3.18 US STANDARD
6->0.76 Au+Sn/SnPb
00->STANDARD
SPECIAL CODE
PLATING
MOUNTING OPTIONS
4->FLASH Au+Sn/SnPb
PA->STANDARD HOLE
µ
PCB DRILLING DETAILS
L
ORDERING INFORMATION
P33E4P A 0 0 F
PDM: Rev:D Released .STATUS: Printed: Jan 18, 2011