<0.4 Ω CMOS 1.8 V to 5.5 V
SPST Switches
Data Sheet ADG801/ADG802
Rev. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
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Tel: 781.329.4700 www.analog.com
Fax: 781.461.3113 ©2002–2012 Analog Devices, Inc. All rights reserved.
FEATURES
0.4 Ω maximum on resistance at 125°C
0.08 Ω maximum on resistance flatness at 125°C
1.8 V to 5.5 V single supply
Automotive temperature range from −40°C to +125°C
400 mA current-carrying capability
Tiny 6-lead SOT-23 and 8-lead MSOP packages
35 ns switching times
Low power consumption
TTL-/CMOS-compatible inputs
Pin compatible with ADG701/ADG702
APPLICATIONS
Power routing
Cellular phones
Modems
PCMCIA cards
Hard drives
Data acquisition systems
Communications systems
Relay replacement
Battery-powered systems
FUNCTIONAL BLOCK DIAGRAM
IN
S
ADG801
D
IN
S
ADG802
D
SWITCHES SHOWN FOR
A LOGIC 1 INPUT
02800-001
Figure 1.
GENERAL DESCRIPTION
The ADG801 and ADG802 are monolithic CMOS, single-pole,
single throw (SPST) switches with on resistance of less than 0.4 Ω.
These switches are designed using an advanced submicron process
that provides extremely low on resistance, high switching speed,
and low leakage currents.
The low on resistance of <0.4 Ω makes these parts ideal for
applications where low on resistance switching is critical.
The ADG801 switch is normally open (NO), while the ADG802
is normally closed (NC). Each switch conducts equally well in
both directions when on.
PRODUCT HIGHLIGHTS
1. Low on resistance (0.25 Ω typical).
2. 1.8 V to 5.5 V single-supply operation.
3. Tiny 6-lead SOT-23 and 8-lead MSOP packages.
4. 400 mA current-carrying capability.
5. Automotive temperature range from −40°C to +125°C.
6. Pin compatible with ADG701 (ADG801) and ADG702
(ADG802).
ADG801/ADG802 Data Sheet
Rev. B | Page 2 of 16
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description......................................................................... 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 5
ESD Caution...................................................................................5
Pin Configurations and Function Descriptions............................6
Typical Performance Characteristics ..............................................7
Terminology .......................................................................................9
Test Circuits..................................................................................... 10
Outline Dimensions ....................................................................... 12
Ordering Guide .......................................................................... 13
REVISION HISTORY
1/12—Rev. A to Rev. B
Deleted 6-Ball WLCSP Package........................................Universal
Added Table Title to Table 3; Renumbered Sequentially ............ 5
Deleted Figure 4; Renumbered Sequentially................................. 6
Changes to Table 5............................................................................ 6
Moved Terminology Section........................................................... 9
Updated Outline Dimensions....................................................... 12
Deleted Figure 23............................................................................ 13
Changes to Ordering Guide .......................................................... 13
3/07—Rev. 0 to Rev. A
Updated Format..................................................................Universal
Added 6-Ball WLCSP Package (Text and Figures) ........Universal
Replaced Typical Performance Characteristics Section .............. 8
Updated Outline Dimensions....................................................... 12
Changes to Ordering Guide .......................................................... 14
5/02—Revision 0: Initial Version
Data Sheet ADG801/ADG802
Rev. B | Page 3 of 16
SPECIFICATIONS
VDD = 5 V ± 10%, GND = 0 V, unless otherwise noted. The automotive temperature range is −40°C to +125°C.
Table 1.
Parameter 25°C −40°C to +85°C −40°C to +125°C1 Unit Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range 0 V to VDD V
On Resistance (RON) 0.25 Ω typ VS = 0 V to VDD, IS = 100 mA; see Figure 13
0.3 0.35 0.4 Ω max VS = 0 V to VDD, IS = 100 mA; see Figure 13
On Resistance Flatness (RFLAT(ON)) 0.05 Ω typ VS = 0 V to VDD, IS = 100 mA
0.07 0.08 Ω max
LEAKAGE CURRENTS VDD = 5.5 V
Source Off Leakage, IS (Off) ±0.01 nA typ VS = 4.5 V/1 V, VD = 1 V/4.5 V; see Figure 14
±0.25 ±3 ±30 nA max VS = 4.5 V/1 V, VD = 1 V/4.5 V; see Figure 14
Drain Off Leakage, ID (Off) ±0.01 nA typ VS = 4.5 V/1 V, VD = 1 V/4.5 V; see Figure 14
±0.25 ±3 ±30 nA max VS = 4.5 V/1 V, VD = 1 V/4.5 V; see Figure 14
Channel On Leakage, ID, IS (On) ±0.01 nA typ VS = VD = 1 V, or 4.5 V; see Figure 15
±0.25 ±3 ±30 nA max VS = VD = 1 V, or 4.5 V; see Figure 15
DIGITAL INPUTS
Input High Voltage, VINH 2.0 V min
Input Low Voltage, VINL 0.8 V max
Input Current
IINL or IINH 0.005 μA typ VIN = VINL or VINH
±0.1 μA max
CIN, Digital Input Capacitance 5 pF typ
DYNAMIC CHARACTERISTICS2
tON 35 ns typ RL = 50 Ω, CL = 35 pF
45 50 55 ns max VS = 3 V; see Figure 16
tOFF 9 ns typ RL = 50 Ω, CL = 35 pF
15 18 21 ns max VS = 3 V; see Figure 16
Charge Injection 50 pC typ VS = 2.5 V, RS = 0 Ω; CL = 1 nF; see Figure 17
Off Isolation −61 dB typ RL = 50 Ω, CL = 5 pF; f = 100 kHz;
see Figure 18
Bandwidth −3 dB 12 MHz typ RL = 50 Ω, CL = 5 pF; see Figure 19
CS (Off) 180 pF typ f = 1 MHz
CD (Off) 180 pF typ f = 1 MHz
CD, CS (On) 420 pF typ f = 1 MHz
POWER REQUIREMENTS VDD = 5.5 V
IDD 0.001 μA typ Digital inputs = 0 V or 5.5 V
1.0 2.0 μA max
1 On resistance parameters tested with IS = 10 mA.
2 Guaranteed by design, not subject to production test.
ADG801/ADG802 Data Sheet
Rev. B | Page 4 of 16
VDD = 2.7 V to 3.6 V, GND = 0 V, unless otherwise noted. The automotive temperature range is −40°C to +125°C.
Table 2.
Parameter 25°C −40°C to +85°C −40°C to +125°C1 Unit Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range 0 V to VDD V
On Resistance (RON) 0.4 Ω typ VS = 0 V to VDD, IS = 100 mA; see Figure 13
0.6 0.65 0.7 Ω max VS = 0 V to VDD, IS = 100 mA; see Figure 13
On Resistance Flatness (RFLAT(ON)) 0.1 0.1 0.1 Ω typ VS = 0 V to VDD, IS = 100 mA
LEAKAGE CURRENTS VDD = 3.6 V
Source Off Leakage, IS (Off) ±0.01 nA typ VS = 3.3 V/1 V, VD = 1 V/3.3 V; see Figure 14
±0.25 ±3 ±30 nA max VS = 3.3 V/1 V, VD = 1 V/3.3 V; see Figure 14
Drain Off Leakage, ID (Off) ±0.01 nA typ VS = 3.3 V/1 V, VD = 1 V/3.3 V; see Figure 14
±0.25 ±3 ±30 nA max VS = 3.3 V/1 V, VD = 1 V/3.3 V; see Figure 14
Channel On Leakage, ID, IS (On) ±0.01 nA typ VS = VD = 1 V, or 3.3 V; see Figure 15
±0.25 ±3 ±30 nA max VS = VD = 1 V, or 3.3 V; see Figure 15
DIGITAL INPUTS
Input High Voltage, VINH 2.0 V min
Input Low Voltage, VINL 0.8 V max
Input Current
IINL or IINH 0.005 μA typ VIN = VINL or VINH
±0.1 μA max
CIN, Digital Input Capacitance 5 pF typ
DYNAMIC CHARACTERISTICS2
tON 40 ns typ RL = 50 Ω, CL = 35 pF
55 60 65 ns max VS = 1.5 V; see Figure 16
tOFF 9 ns typ RL = 50 Ω, CL = 35 pF
15 18 21 ns max VS = 1.5 V; see Figure 16
Charge Injection 10 pC typ VS = 1.5 V, RS = 0 Ω, CL = 1 nF; see Figure 17
Off Isolation −61 dB typ RL = 50 Ω, CL = 5 pF, f = 100 kHz;
see Figure 18
Bandwidth −3 dB 12 MHz typ RL = 50 Ω, CL = 5 pF; see Figure 19
CS (Off) 180 pF typ f = 1 MHz
CD (Off) 180 pF typ f = 1 MHz
CD, CS (On) 420 pF typ f = 1 MHz
POWER REQUIREMENTS VDD = 3.6 V
IDD 0.001 μA typ Digital inputs = 0 V or 3.6 V
1.0 2.0 μA max
1 On resistance parameters tested with IS = 10 mA.
2 Guaranteed by design, not subject to production test.
Data Sheet ADG801/ADG802
Rev. B | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter Rating
VDD to GND −0.3 V to +7 V
Analog Inputs1 −0.3 V to VDD + 0.3 V or
30 mA, whichever occurs first
Digital Inputs1 −0.3 V to VDD + 0.3 V or
30 mA, whichever occurs first
Continuous Current, Pin S or Pin D 400 mA
Peak Current, Pin S or Pin D 800 mA, pulsed at 1 ms,
10% duty cycle max
Operating Temperature Range
Automotive
−40°C to +125°C
Storage Temperature Range −65°C to +150°C
Junction Temperature (TJMAX) 150°C
Package Power Dissipation (TJMAX – TA)/θJA
MSOP
θJA Thermal Impedance 206°C/W
θJC Thermal Impedance 44°C/W
SOT-23 (4-Layer Board)
θJA Thermal Impedance 119°C/W
θJC Thermal Impedance 91.99°C/W
Lead Temperature, Soldering
(10 sec)
300°C
IR Reflow, Peak Temperature
(<20 sec)
235°C
Reflow Soldering (Pb-Free)
Peak Temperature 260(+0/−5)°C
Time at Peak Temperature 10 sec to 40 sec
1 Overvoltages at Pin IN, Pin S, or Pin D are clamped by internal diodes.
Current should be limited to the maximum ratings provided.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Table 4. Truth Table
ADG801 (Pin IN) ADG802 (Pin IN) Switch Condition
0 1 Off
1 0 On
ESD CAUTION
ADG801/ADG802 Data Sheet
Rev. B | Page 6 of 16
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
02800-002
NC = NO CONNECT
D
1
S
2
GND
3
V
DD
6
NC
5
IN
4
ADG801/
ADG802
TOP VIEW
(Not to Scale)
Figure 2. 6-Lead SOT-23
(RJ-6)
02800-003
D
1
NC
2
NC
3
VDD
4
S
8
GND
7
IN
6
NC
5
NC = NO CONNECT
ADG801/
ADG802
TOP VIEW
(Not to Scale)
Figure 3. 8-Lead MSOP
(RM-8)
Table 5. Pin Function Descriptions
Pin Number
SOT-23 MSOP Mnemonic Description
1 1 D Drain Terminal. Can be an input or an output.
2 8 S Source Terminal. Can be an input or an output.
3 7 GND Ground (0 V) Reference.
4 6 IN Logic Control Input.
5
2, 3, 5
NC
No Connect. Do not connect to this pin.
6 4 VDD Most Positive Power Supply Potential.
Data Sheet ADG801/ADG802
Rev. B | Page 7 of 16
TYPICAL PERFORMANCE CHARACTERISTICS
0.45
0
0.40
0.35
0.20
0.05
0.30
0.15
0.25
0.10
0.50
T
A
= 25°C
V
DD
= 2.7V
V
DD
= 3.3V
V
DD
= 5.0V
V
DD
= 4.5V
V
DD
= 5.5V
V
D
(V
S
) (V)
ON RESISTANCE (Ω)
0 1.0 2.0 3.0 4.0 5.0 5.5
V
DD
= 3.0V
02800-004
Figure 4. On Resistance vs. VD (VS)
01.51.00.5
0.45
0
0.40
0.35
0.20
0.05
0.30
0.15
0.25
0.10
0.50
V
D
(V
S
) (V)
ON RESISTANCE (Ω)
2.0 2.5 3.0 3.5 4.0 4.5 5.0
V
DD
= 5V
–40°C +25°C
+85°C
+125°C
02800-005
Figure 5. On Resistance vs. VD (VS) for Different Temperatures
01.51.00.5
0.45
0.40
0.35
0.20
0.05
0.30
0.15
0.25
0.10
0.50
V
D
(V
S
) (V)
ON RESISTANCE (Ω)
2.0 2.5 3.0
V
DD
= 3V
–40°C
+25°C
+125°C +85°C
0
02800-006
Figure 6. On Resistance vs. VD (VS) for Different Temperatures
TEMPERATURE (°C)
CURRENT (nA)
3.5
0
–0.5
4020
3.0
1.5
0
2.5
1.0
2.0
0.5
60 80 100 120
V
DD
= 5V, 3V
I
S
, I
D
(ON)
I
S
(OFF)
I
D
(OFF)
02800-007
Figure 7. Leakage Current vs. Temperature
CHARGE INJECTION (pC)
400
–200
200
–100
100
300
0
V
S
(V)
01.51.00.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
T
A
= 25°C
V
DD
= 5V
V
DD
= 3V
02800-008
Figure 8. Charge Injection vs. Source Voltage
TEMPERATURE (°C)
TIME (ns)
50
–40
0
25
5
15
40
10
35
45
20
30
t
ON
t
OFF
–20 0 20 40 60 80 100 120
V
DD
= 5V
V
DD
= 3V
V
DD
= 3V, 5V
02800-009
Figure 9. tON/tOFF Times vs. Temperature
ADG801/ADG802 Data Sheet
Rev. B | Page 8 of 16
FREQUENCY (MHz)
ATTENU
A
TION (dB)
–
10
–70
–20
–60
–40
–50
–30
T
A
= 25°C
V
DD
= 3V, 5V
0.1 1 10
02800-010
Figure 10. Off Isolation vs. Frequency
FREQUENCY (MHz)
ATTENU
A
TION (dB)
0
–9
–2
–8
–6
–7
–4
–1
–3
–5
110.2 020
TA = 25°C
VDD = 3V, 5V
02800-011
Figure 11. On Response vs. Frequency
1.8
0
0
21
1.6
1.4
0.8
0.2
1.2
0.6
1.0
0.4
LOGIC THRESHOLD VOLTAGE (V)
V
DD
(V)
3456
V
IN
RISING
V
IN
FALLING
02800-012
Figure 12. Logic Threshold Voltage vs. Supply Voltage
Data Sheet ADG801/ADG802
Rev. B | Page 9 of 16
TERMINOLOGY
VDD
The most positive power supply potential.
IDD
Positive supply current.
GND
Ground (0 V) reference.
S
The source terminal can be an input or an output.
D
The drain terminal can be an input or an output.
IN
Logic control input.
VD (VS)
Analog voltage on Terminal D and Terminal S.
RON
Ohmic resistance between Terminal D and Terminal S.
RFLAT(ON)
The difference between the maximum and minimum value of
on resistance as measured over the specified analog signal range.
IS (Off)
Source leakage current with the switch off.
ID (Off)
Drain leakage current with the switch off.
ID, IS (On)
Channel leakage current with the switch on.
VINL
Maximum input voltage for Logic 0.
VINH
Minimum input voltage for Logic 1.
IINL (IINH)
Input current of the digital input.
CS (Off)
The off switch source capacitance is measured with reference
to ground.
CD (Off)
The off switch drain capacitance is measured with reference
to ground.
CD, CS (On)
The on switch capacitance is measured with reference
to ground.
CIN
Digital input capacitance.
tON
The delay between applying the digital control input and when
the output switches on. See Figure 16.
tOFF
The delay between applying the digital control input and when
the output switches off.
Charge Injection
A measure of the glitch impulse transferred from the digital
input to the analog output during switching.
Off Isolation
A measure of unwanted signal coupling through an off switch.
Bandwidth
The frequency at which the output is attenuated by 3 dB.
On Response
The frequency response of the on switch.
Insertion Loss
The loss due to the on resistance of the switch.
ADG801/ADG802 Data Sheet
Rev. B | Page 10 of 16
TEST CIRCUITS
V1
SD
I
DS
V
S
R
ON
= V1/I
DS
0
2800-013
Figure 13. On Resistance
SD
A
V
D
A
I
S
(OFF)
I
D
(OFF)
02800-014
Figure 14. Off Leakage
A
NC
NC = NO CONNECT
SD
V
D
I
D
(ON)
0
2800-015
Figure 15. On Leakage
IN
GND
ADG801
ADG802
V
DD
0.1µF
V
DD
SD
V
S
V
OUT
R
L
50Ω
C
L
35pF
50% 50%
50% 50%
90% 90%
V
IN
V
IN
V
OUT
t
ON
t
OFF
02800-016
Figure 16. Switching Times
IN
GND
ADG801
ADG802
OFF
ON
V
DD
V
DD
SD
V
S
V
OUT
C
L
1nF
R
S
V
IN
V
IN
V
OUT
∆V
OUT
Q
INJ
= C
L
× ∆V
OUT
02800-017
Figure 17. Charge Injection
Data Sheet ADG801/ADG802
Rev. B | Page 11 of 16
S
D
GND
IN
V
DD
V
DD
VIN
50Ω
0.1µF
NETWORK
ANALYZER
50Ω
RL
50Ω
VOUT
VS
OFF ISOLATION = 20 log
VOUT
VS
02800-018
Figure 18. Off Isolation
IN
GND
S
D
INSERTION LOSS = 20 log
V
DD
VDD
V
IN
0.1µF
NETWORK
ANALYZER
50Ω
R
L
50Ω
V
OUT
V
S
V
OUT
WITH SWITCH
V
OUT
WITHOUT SWITCH
02800-019
Figure 19. Bandwidth
ADG801/ADG802 Data Sheet
Rev. B | Page 12 of 16
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-178-AB
10°
4°
0°
SEATING
PLANE
1.90
BSC
0.95 BSC
0.60
BSC
65
123
4
3.00
2.90
2.80
3.00
2.80
2.60
1.70
1.60
1.50
1.30
1.15
0.90
0.15 MAX
0.05 MIN
1.45 MAX
0.95 MIN
0.20 MAX
0.08 MIN
0.50 MAX
0.30 MIN
0.55
0.45
0.35
PIN 1
INDICATOR
12-16-2008-A
Figure 20. 6-Lead Small Outline Transistor Package [SOT-23]
(RJ-6)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-187-AA
6°
0°
0.80
0.55
0.40
4
8
1
5
0.65 BSC
0.40
0.25
1.10 MAX
3.20
3.00
2.80
COPLANARITY
0.10
0.23
0.09
3.20
3.00
2.80
5.15
4.90
4.65
PIN 1
IDENTIFIER
15° MAX
0.95
0.85
0.75
0.15
0.05
10-07-2009-B
Figure 21. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
Data Sheet ADG801/ADG802
Rev. B | Page 13 of 16
ORDERING GUIDE
Model1 Temperature Range Package Description Package Option Branding2
ADG801BRM −40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 SLB
ADG801BRM-REEL −40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 SLB
ADG801BRM-REEL7 −40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 SLB
ADG801BRMZ −40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 S06
ADG801BRMZ-REEL −40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 S06
ADG801BRMZ-REEL7 −40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 S06
ADG801BRT-500RL7 −40°C to +125°C 6-Lead Small Outline Transistor Package [SOT-23] RJ-6 SLB
ADG801BRT-REEL7 −40°C to +125°C 6-Lead Small Outline Transistor Package [SOT-23] RJ-6 SLB
ADG801BRTZ-500RL7 −40°C to +125°C 6-Lead Small Outline Transistor Package [SOT-23] RJ-6 S06
ADG801BRTZ-REEL −40°C to +125°C 6-Lead Small Outline Transistor Package [SOT-23] RJ-6 S06
ADG801BRTZ-REEL7 −40°C to +125°C 6-Lead Small Outline Transistor Package [SOT-23] RJ-6 S06
ADG802BRM −40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 SMB
ADG802BRM-REEL −40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 SMB
ADG802BRM-REEL7 −40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 SMB
ADG802BRMZ −40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 S0F
ADG802BRMZ-REEL −40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 S0F
ADG802BRMZ-REEL7 −40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 S0F
ADG802BRT-500RL7 −40°C to +125°C 6-Lead Small Outline Transistor Package [SOT-23] RJ-6 SMB
ADG802BRTZ-500RL7 −40°C to +125°C 6-Lead Small Outline Transistor Package [SOT-23] RJ-6 S0F
ADG802BRTZ-REEL −40°C to +125°C 6-Lead Small Outline Transistor Package [SOT-23] RJ-6 S0F
ADG802BRTZ-REEL7 −40°C to +125°C 6-Lead Small Outline Transistor Package [SOT-23] RJ-6 S0F
1 Z = RoHS Compliant Part.
2 Branding on SOT-23 and MSOP packages is limited to three characters due to space constraints.
3
ADG801/ADG802
Rev. B | Page 14 of 16
NOTES
Data Sheet ADG801/ADG802
Rev. B | Page 15 of 16
NOTES
