STPS2L40 Low drop power Schottky rectifier Features A Very small conduction losses Negligible switching losses Low forward voltage drop Surface mount miniature package Avalanche capability specified ECOPACK2(R) halogen-free component (SMAflat and SMBflat) K SMB STPS2L40U A A K K Description SMAflat STPS2L40AF Single chip Schottky rectifiers suited to Switched Mode Power Supplies and high frequency DC to DC converters. Packaged in SMB, low profile SMB and low profile SMA, this device is especially intended for surface mounting and used in low voltage, high frequency inverters, free wheeling and polarity protection applications. September 2008 Table 1. Rev 4 SMBflat STPS2L40UF Device summary IF(AV) 2A VRRM 40 V Tj (max) 150 C VF(max) 0.34 V 1/10 www.st.com 10 Characteristics 1 STPS2L40 Characteristics Table 2. Absolute ratings (limiting values) Symbol VRRM IF(AV) Value Unit 40 V 2 A Repetitive peak reverse voltage Average forward current SMB TL = 130 C = 0.5 SMBflat TL = 140 C = 0.5 SMAflat TL = 130 C = 0.5 IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 75 A PARM Repetitive peak avalanche power tp = 1 s Tj = 25 C 2200 W -65 to + 150 C 150 C Value Unit Tstg dPtot --------------dTj Storage temperature range Operating junction temperature (1) Tj 1. Parameter < Table 3. 1 -------------------------Rth ( j - a ) condition to avoid thermal runaway for a diode on its own heatsink Thermal resistances Symbol Rth (j-l) Table 4. Parameter Junction to lead SMB 20 SMBflat 10 SMAflat 20 Static electrical characteristics Symbol Tests conditions Min. Typ. Tj = 25 C IR(1) Reverse leakage current Tj = 100 C VR = 40 V Tj = 125 C Tj = 25 C Tj = 125 C VF (1) Forward voltage drop Tj = 25 C Tj = 125 C Tj = 25 C Tj = 125 C 38 IF = 1 A Max. Unit 220 A 20 mA 80 mA 0.39 0.25 0.28 V IF = 2 A IF = 4 A 1. Pulse test: tp = 380 s, < 2 To evaluate the conduction losses use the following equation: P = 0.22 x IF(AV) + 0.06 IF2(RMS) 2/10 C/W 0.43 0.31 0.34 0.5 V 0.39 0.45 STPS2L40 Characteristics Figure 1. Average forward power dissipation Figure 2. versus average forward current Average forward current versus ambient temperature ( = 0.5) SMB IF(AV)(A) PF(AV)(W) 2.2 1.2 = 0.1 = 0.2 Rth(j-a)=Rth(j-l) = 0.5 = 0.05 1.0 SMB 2.0 1.8 Rth(j-a)=100C/W 1.6 0.8 =1 1.4 1.2 0.6 1.0 0.8 0.4 0.6 T T 0.4 0.2 IF(AV)(A) 0.0 0.2 0.4 Figure 3. 0.6 0.8 1.0 1.2 1.4 1.6 0.2 =tp/T 0.0 1.8 2.0 2.2 =tp/T tp 0.0 2.4 2.6 2.8 Average forward current versus ambient temperature ( = 0.5) SMBflat 0 25 Figure 4. IF(AV)(A) Tamb(C) tp 50 75 100 125 150 Average forward current versus ambient temperature ( = 0.5) SMAflat IF(AV)(A) 2.2 2.2 Rth(j-a)=Rth(j-l) SMBflat 2.0 SMAflat Rth(j-a)=Rth(j-l) 2.0 1.8 1.8 Rth(j-a)=100C/W 1.6 1.6 1.4 1.4 1.2 1.2 1.0 1.0 0.8 0.8 0.6 Rth(j-a)=200 C/W 0.6 T T 0.4 0.4 0.2 =tp/T 0.0 0 =tp/T 0.2 Tamb(C) tp Tamb(C) tp 0.0 25 Figure 5. 50 75 100 125 0 150 Non repetitive surge peak forward current versus overload duration (maximum values) SMB 25 Figure 6. 50 75 100 125 150 Non repetitive surge peak forward current versus overload duration (maximum values) SMBflat IM(A) IM(A) 30 12 SMBflat SMB 11 25 10 9 20 8 Ta=25C 7 TL=25C 15 6 Ta=75C 5 TL=75C 10 4 3 2 1 Ta=125C IM t(s) =0.5 IM t t(s) =0.5 0 1.E-03 TL=125C 5 t 0 1.E-02 1.E-01 1.E+00 1.E-03 1.E-02 1.E-01 1.E+00 3/10 Characteristics Figure 7. STPS2L40 Non repetitive surge peak forward current versus overload duration (maximum values) SMAflat Figure 8. IM(A) Normalized avalanche power derating versus pulse duration PARM(tp) PARM(1s) 8 SMAflat 1 7 6 5 0.1 Ta=25 C 4 Ta=75 C 3 0.01 2 Ta=125 C IM 1 t t(s) =0.5 0 1.E-03 tp(s) 0.001 0.01 1.E-02 Figure 9. 1.E-01 0.1 1 10 100 1000 1.E+00 Normalized avalanche power derating versus junction temperature Figure 10. Relative variation of thermal impedance junction to ambient versus pulse duration - SMB Zth(j-a)/Rth(j-a) PARM(Tj) PARM(25C) 1.0 SMB 0.9 1.2 0.8 1 0.7 0.8 0.6 0.5 0.6 0.4 0.4 0.3 T 0.2 0.2 Single pulse Tj(C) 0.1 tp(s) 0 25 50 75 100 125 150 1.E-02 Figure 11. Relative variation of thermal impedance junction to lead versus pulse duration - SMBflat 1.E-01 1.E+00 1.E+01 1.E+02 tp 1.E+03 Figure 12. Relative variation of thermal impedance junction to ambient versus pulse duration - SMAflat Zth(j-l)/Rth(j-l) Zth(j-a)/Rth(j-a) 1.0 0.9 =tp/T 0.0 1.0 SMAflat SMBflat 0.9 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 T 0.2 0.2 Single pulse 0.1 0.1 tp(s) =tp/T 0.0 1.E-04 4/10 1.E-03 1.E-02 1.E-01 1.E+00 tp 1.E+01 Single pulse tp(s) 0.0 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 STPS2L40 Characteristics Figure 13. Reverse leakage current versus reverse voltage applied (typical values) Figure 14. Junction capacitance versus reverse voltage applied (typical values) IR(mA) C(pF) 1.E+02 1000 F=1MHz VOSC=30mVRMS Tj=25C Tj=125C 1.E+01 1.E+00 100 1.E-01 Tj=25C 1.E-02 VR(V) VR(V) 10 1.E-03 0 5 10 15 20 25 30 35 1 40 Figure 15. Forward voltage drop versus forward current (high level) 10 100 Figure 16. Forward voltage drop versus forward current (low level) IFM(A) IFM(A) 10.0 3.0 Tj=125C (typical values) 2.5 2.0 Tj=25C (maximum values) Tj=125C (maxmimum values) Tj=125C (typical values) Tj=25C (maximum values) 1.0 1.5 Tj=125C (maxmimum values) 1.0 0.5 VFM(V) VFM(V) 0.1 0.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 Figure 17. Thermal resistance junction to ambient versus copper surface under each lead, SMB, SMBflat (epoxy printed board FR4, copper thickness = 35 m) 0.0 0.2 0.3 0.4 0.5 0.6 Figure 18. Thermal resistance junction to ambient versus copper surface under each lead, SMAflat (epoxy printed board FR4, copper thickness = 35 m) Rth(j-a)(C/W) Rth(j-a)(C/W) 110 200 100 180 90 0.1 SMAflat 160 SMB 80 140 70 120 60 100 50 SMBflat 80 40 60 30 40 20 10 20 SCU(cm) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 SCU(cm) 0 0 3.5 4.0 4.5 5.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5/10 Package Information 2 STPS2L40 Package Information Epoxy meets UL94,V0 In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Table 5. SMB dimensions Dimensions Ref. Millimeters Inches E1 D E A1 A2 C L b Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 D 3.30 3.95 0.130 0.156 L 0.75 1.50 0.030 0.059 Figure 19. SMB footprint dimensions in Figure 20. Marking information millimeters (inches) 1.62 2.60 (0.064) (0.102) 1.62 (0.064) Cathode bar (unidirectional devices only ) 2.18 (0.086) 5.84 (0.300) 6/10 e3 x x x z y ww e3: ECOPACK ( Leadfree) XXX: Marking Z: Manufacturing location Y: Year WW: week STPS2L40 Package Information Table 6. SMBflat dimensions Dimensions Ref. D L L2 E E1 L L1 b Inches Min. Typ. Max. Min. A 0.90 1.10 0.035 0.043 b(1) 1.95 2.20 0.077 0.087 c(1) 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.156 E 5.10 5.60 0.200 0.220 E1 4.05 4.60 0.189 0.181 L 0.75 1.50 0.029 0.059 A c Millimeters Typ. L1 0.40 0.016 L2 0.60 0.024 Max. 1. Applies to plated leads Figure 21. SMBflat footprint dimensions Figure 22. Marking information optimized for SMBflat(1) 5.84 (0.230) Cathode bar (unidirectional devices only ) 2.07 (0.082) 1.20 (0.047) 3.44 (0.136) 1.20 (0.047) e3 x x x z y ww e3: ECOPACK ( Leadfree) XXX: Marking Z: Manufacturing location Y: Year WW: week millimeters (inches) 1. SMB footprint may also be used. 7/10 Package Information Table 7. STPS2L40 SMAflat dimensions Dimensions Ref. A L 2x L1 2x E E1 L L2 2x b Inches Min. Typ. Max. Min. A 0.90 1.10 0.035 0.043 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 D 2.25 2.95 0.088 0.116 E 4.80 5.60 0.189 0.220 E1 3.95 4.60 0.156 0.181 L 0.75 1.50 0.030 0.059 c D Millimeters Typ. L1 0.50 0.019 L2 0.50 0.019 Max. Figure 23. SMAflat footprint dimensions Figure 24. Marking information optimized for SMAflat(1) 5.52 (0.217) Cathode bar (unidirectional devices only ) 1.52 (0.060) 1.20 (0.047) 3.12 (0.123) 1.20 (0.047) millimeters (inches) 1. SMA footprint may also be used. 8/10 e3 x x x z y ww e3: ECOPACK ( Leadfree) XXX: Marking Z: Manufacturing location Y: Year WW: week STPS2L40 3 Ordering Information Ordering Information Table 8. 4 Ordering information Order code Marking Package Weight Base qty Delivery mode STPS2L40U GD4 SMB 0.107 g 2500 Tape and reel STPS2L40UF FGD4 SMBflat 0.50 g 5000 Tape and reel STPS2L40AF F2L4 SMAflat 0.35 g 10000 Tape and reel Revision history Table 9. Document revision history Date Revision Description of changes Jul-2003 2A 31-Jan-2007 3 Reformatted to current standard. Added ECOPACK statement. Added SMBflat package. 18-Sep-2008 4 Reformatted to current standard. Updated ECOPACK statement. Added SMAflat package. Last update. 9/10 STPS2L40 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 10/10