September 2008 Rev 4 1/10
10
STPS2L40
Low drop power Schottky rectifier
Features
■Very small conduction losses
■Negligible switching losses
■Low forward voltage drop
■Surface mount miniature package
■Avalanche capability specified
■ECOPACK2® halogen-free component
(SMAflat and SMBflat)
Description
Single chip Schottky rectifiers suited to Switched
Mode Power Supplies and high frequency DC to
DC converters.
Packaged in SMB, low profile SMB and low profile
SMA, this device is especially intended for surface
mounting and used in low voltage, high frequency
inverters, free wheeling and polarity protection
applications.
Table 1. Device summary
IF(AV) 2 A
VRRM 40 V
Tj (max) 150 °C
VF(max) 0.34 V
K
A
K
A
K
A
SMB
STPS2L40U
SMBflat
STPS2L40UF
SMAflat
STPS2L40AF
www.st.com
Characteristics STPS2L40
2/10
1 Characteristics
To evaluate the conduction losses use the following equation:
P = 0.22 x IF(AV) + 0.06 IF2(RMS)
Table 2. Absolute ratings (limiting values)
Symbol Parameter Value Unit
VRRM Repetitive peak reverse voltage 40 V
IF(AV) Average forward current
SMB TL = 130 °C δ = 0.5
2ASMBflat TL = 140 °C δ = 0.5
SMAflat TL = 130 °C δ = 0.5
IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 75 A
PARM Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 2200 W
Tstg Storage temperature range -65 to + 150 °C
TjOperating junction temperature (1)
1. condition to avoid thermal runaway for a diode on its own heatsink
150 °C
Table 3. Thermal resistances
Symbol Parameter Value Unit
Rth (j-l) Junction to lead
SMB 20
°C/W SMBflat 10
SMAflat 20
Table 4. Static electrical characteristics
Symbol Tests conditions Min. Typ. Max. Unit
IR(1)
1. Pulse test: tp = 380 µs, δ < 2
Reverse leakage current
Tj = 25 °C
VR = 40 V
220 µA
Tj = 100 °C 20 mA
Tj = 125 °C 38 80 mA
VF(1) Forward voltage drop
Tj = 25 °C IF = 1 A 0.39
V
Tj = 125 °C 0.25 0.28
Tj = 25 °C IF = 2 A 0.43
Tj = 125 °C 0.31 0.34
Tj = 25 °C IF = 4 A 0.5 V
Tj = 125 °C 0.39 0.45
d
Ptot
dTj
-
-------------- 1
Rth j a–()
--------------------------
<
STPS2L40 Characteristics
3/10
Figure 1. Average forward power dissipation
versus average forward current
Figure 2. Average forward current versus
ambient temperature (δ = 0.5) SMB
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8
P (W)
F(AV)
T
δ=tp/T tp
I (A)
F(AV)
δ= 1
δ= 0.05
δ= 0.1 δ= 0.2 δ= 0.5
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
0 25 50 75 100 125 150
I (A)
F(AV)
T (°C)
amb
R =100°C/W
th(j-a)
R=R
th(j-a) th(j-l)
SMB
T
δ=tp/T tp
Figure 3. Average forward current versus
ambient temperature (δ = 0.5)
SMBflat
Figure 4. Average forward current versus
ambient temperature (δ = 0.5)
SMAflat
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
0 25 50 75 100 125 150
I(A)
F(AV)
SMBflat
T (°C)
amb
R =100°C/W
th(j-a)
R=R
th(j-a) th(j-l)
T
δ
=tp/T tp
I (A)
F(AV)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
0 25 50 75 100 125 150
R
th(j-a)
=R
th(j-l)
T
δ=tp/T tp
R
th(j-a)
=200 °C/W
SMAflat
T (°C)
amb
Figure 5. Non repetitive surge peak forward
current versus overload duration
(maximum values) SMB
Figure 6. Non repetitive surge peak forward
current versus overload duration
(maximum values) SMBflat
0
1
2
3
4
5
6
7
8
9
10
11
12
1.E-03 1.E-02 1.E-01 1.E+00
I
M
t
δ
=0.5
I (A)
M
t(s)
T =25°C
a
T =75°C
a
T =125°C
a
SMB
0
5
10
15
20
25
30
1.E-03 1.E-02 1.E-01 1.E+00
I (A)
M
T =25°C
L
T =75°C
L
T =125°C
L
SMBflat
I
M
t
δ
=0.5
t(s)
Characteristics STPS2L40
4/10
Figure 7. Non repetitive surge peak forward
current versus overload duration
(maximum values) SMAflat
Figure 8. Normalized avalanche power
derating versus pulse duration
I(A)
M
0
1
2
3
4
5
6
7
8
1.E-03 1.E-02 1.E-01 1.E+0
0
Ta=25 °C
Ta=75 °C
Ta=125 °C
I
M
t
δ
=0.5
SMAflat
t(s)
0.001
0.01
0.10.01 1
0.1
10 100 1000
1
t (µs)
p
P(t)
P (1µs)
ARM p
ARM
Figure 9. Normalized avalanche power
derating versus junction
temperature
Figure 10. Relative variation of thermal
impedance junction to ambient
versus pulse duration - SMB
0
0.2
0.4
0.6
0.8
1
1.2
25 50 75 100 125 150
T (°C)
j
P(T)
P (25°C)
ARM j
ARM
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Z/R
th(j-a) th(j-a)
T
δ=tp/T tp
t (s)
p
Single pulse
SMB
Figure 11. Relative variation of thermal
impedance junction to lead
versus pulse duration - SMBflat
Figure 12. Relative variation of thermal
impedance junction to ambient
versus pulse duration - SMAflat
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
Z/R
th(j-l) th(j-l)
SMBflat
T
δ=tp/T tp
t (s)
p
Single pulse
Z/R
th(j-a) th(j-a)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Single pulse
SMAflat
t (s)
p
STPS2L40 Characteristics
5/10
Figure 13. Reverse leakage current versus
reverse voltage applied (typical
values)
Figure 14. Junction capacitance versus
reverse voltage applied (typical
values)
Figure 15. Forward voltage drop versus
forward current (high level)
Figure 16. Forward voltage drop versus
forward current (low level)
I (mA)
R
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
0 5 10 15 20 25 30 35 40
T
j
=125°C
T
j
=25°C
V (V)
R
10
100
1000
1 10 100
C(pF)
V (V)
R
F=1MHz
V =30mV
T =25°C
OSC RMS
j
0.1
1.0
10.0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7
I (A)
FM
V (V)
FM
T =25°C
(maximum values)
j
T =125°C
(maxmimum values)
j
T =125°C
(typical values)
j
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0.0 0.1 0.2 0.3 0.4 0.5 0.6
I (A)
FM
V (V)
FM
T =25°C
(maximum values)
j
T =125°C
(maxmimum values)
j
T =125°C
(typical values)
j
Figure 17. Thermal resistance junction to
ambient versus copper surface
under each lead, SMB, SMBflat
(epoxy printed board FR4, copper
thickness = 35 µm)
Figure 18. Thermal resistance junction to
ambient versus copper surface
under each lead, SMAflat (epoxy
printed board FR4, copper
thickness = 35 µm)
0
10
20
30
40
50
60
70
80
90
100
110
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
S (cm²)
CU
SMB
R (°C/W)
th(j-a)
SMBflat
0
20
40
60
80
100
120
140
160
180
200
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
SMAflat
S (cm²)
CU
R (°C/W)
th(j-a)
Package Information STPS2L40
6/10
2 Package Information
●Epoxy meets UL94,V0
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at www.st.com.
Table 5. SMB dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.096
A2 0.05 0.20 0.002 0.008
b 1.95 2.20 0.077 0.087
c 0.15 0.40 0.006 0.016
E 5.10 5.60 0.201 0.220
E1 4.05 4.60 0.159 0.181
D 3.30 3.95 0.130 0.156
L 0.75 1.50 0.030 0.059
Figure 19. SMB footprint dimensions in
millimeters (inches)
Figure 20. Marking information
E
C
L
E1
D
A1
A2
b
2.60
5.84
1.62
2.18
1.62
(0.064) (0.102)
(0.300)
(0.064)
(0.086)
y w w
e3
z
x x x
e3: ECOPACK (Leadfree)
XXX: Marking
Z: Manufacturing location
Y: Year
WW: week
Cathode bar (unidirectional devices only )
STPS2L40 Package Information
7/10
Table 6. SMBflat dimensions
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 0.90 1.10 0.035 0.043
b(1)
1. Applies to plated leads
1.95 2.20 0.077 0.087
c(1) 0.15 0.40 0.006 0.016
D 3.30 3.95 0.130 0.156
E 5.10 5.60 0.200 0.220
E1 4.05 4.60 0.189 0.181
L 0.75 1.50 0.029 0.059
L1 0.40 0.016
L2 0.60 0.024
Figure 21. SMBflat footprint dimensions
optimized for SMBflat(1)
1. SMB footprint may also be used.
Figure 22. Marking information
D
A
L
L
L1
L2
EE1
b
c
1.20
(0.047)
1.20
(0.047)
3.44
(0.136)
5.84
(0.230)
2.07
(0.082)
millimeters
(inches)
y w w
e3
z
x x x
e3: ECOPACK (Leadfree)
XXX: Marking
Z: Manufacturing location
Y: Year
WW: week
Cathode bar (unidirectional devices only )
Package Information STPS2L40
8/10
Table 7. SMAflat dimensions
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 0.90 1.10 0.035 0.043
b 1.25 1.65 0.049 0.065
c 0.15 0.40 0.006 0.016
D 2.25 2.95 0.088 0.116
E 4.80 5.60 0.189 0.220
E1 3.95 4.60 0.156 0.181
L 0.75 1.50 0.030 0.059
L1 0.50 0.019
L2 0.50 0.019
Figure 23. SMAflat footprint dimensions
optimized for SMAflat(1)
1. SMA footprint may also be used.
Figure 24. Marking information
D
A
L 2x
L
L2 2x
L1 2x
EE1
b
c
1.20
(0.047)
1.20
(0.047)
3.12
(0.123)
5.52
(0.217)
1.52
(0.060)
millimeters
(inches)
y w w
e3
z
x x x
e3: ECOPACK (Leadfree)
XXX: Marking
Z: Manufacturing location
Y: Year
WW: week
Cathode bar (unidirectional devices only )
STPS2L40 Ordering Information
9/10
3 Ordering Information
4 Revision history
Table 8. Ordering information
Order code Marking Package Weight Base qty Delivery mode
STPS2L40U GD4 SMB 0.107 g 2500 Tape and reel
STPS2L40UF FGD4 SMBflat 0.50 g 5000 Tape and reel
STPS2L40AF F2L4 SMAflat 0.35 g 10000 Tape and reel
Table 9. Document revision history
Date Revision Description of changes
Jul-2003 2A Last update.
31-Jan-2007 3 Reformatted to current standard. Added ECOPACK
statement. Added SMBflat package.
18-Sep-2008 4 Reformatted to current standard. Updated ECOPACK
statement. Added SMAflat package.
STPS2L40
10/10
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