SPHWWTHDNA45YHVTJC - SAMSUNG - Datasheet.Directory

http://www.samsungled.com 1/19

Rev : 003

Introduction

Features

· 13W COB LED : 25.25 x 20.25 x 1.5 (mm)

·InGaN/GaN MQW LED with long-time reliability

·Lead (Pd) free product -RoHS compliant

Applications

·Spot /Down light

·LED Retrofit Bulbs

·Outdoor illumination

·Other applications

Product Family Data Sheet

LC153A

-COB(Chip On Board) LED

SAMSUNG ELECTRONICS

95, Samsung2-Ro, Giheung-Gu,

Yongin

City, Gyeonggi

Do 446

711, KOREA

change without notice. SAMSUNG, is aregistered trademark of SAMSUNG ELECTRONICS.

http://www.samsungled.com 2/19

Contents

1. Absolute Maximum Rating ----------------- 3

2. Characteristics ----------------- 3

3. Binning Structure ----------------- 5

4. Chromaticity Coordinates ----------------- 6

5. Typical Characteristics Graph ----------------- 7

6. Outline Drawing &Dimension ----------------- 10

7. Reliability Test Items and Conditions ----------------- 11

8. Label Structure ----------------- 12

9. Lot Number ----------------- 13

10. Tray Dimension ----------------- 14

11. Aluminum Bag Dimension ----------------- 14

12. Box &Pad Dimension ----------------- 15

13. Packing Structure ----------------- 16

14. Precaution for use ----------------- 18

15. Revision History ----------------- 19

http://www.samsungled.com 3/19

1. Absolute Maximum Rating

1) Operation Forward Current (T

= 25°C) ........................................................ 450 mA

2) Flash Mode Peak Pulsed Forward Current .................................................. 470 mA

(Pulse width t

≤

10msec, Duty ratio=0.06, T

=25°C)

3) Thermal Resistance ( R

th,j-c

) .......................................................................... 1.5°C/W

4) LED Junction Temperature ( T

) ..................................................................... 150°C

5) Operating Temperature Range ( T

opr

) ............................................... -40°C

∼

85°C

6) Storage Temperature Range ( T

stg

) ................................................. -40°C

∼

120°C

2. Characteristics

1) Electro-Optical characteristics (T

: 25°C)

Item Unit Condition Rank Min Typ Max

Luminous Flux

lm I

= 350 mA

3000K JC

JB 950 - 1050

MA 1050 -

5000K MC

MB 1050 - 1150

PA 1150 - -

Forward Voltage V

= 350 mA YH 34 36.5 38.5

CRI I

= 350 mA - 80 - -

View Angle

° I

= 350 mA - - 115° -

Note :

1) Samsung LED tested in pulsed condition. T

=25°C, pulse width is 10ms at rated test current.

2) Samsung LED has ±10% tolerance of flux measurements.

3) Samsung LED has ±5% tolerance of forward voltage measurements.

4) Samsung LED has ±5% tolerance of CCT measurements.

5) Samsung LED tested in DC=350mA after Iuminous flux is saturated.

6) Samsung LED has ±0.15 mm tolerance on device dimensions.

http://www.samsungled.com 4/19

2) Current Sweep Characteristics

(mA)

Vf (V)

CCT

Flux (Lm) Lm/W CRI

Typ Typ Typ Min

60 32.45

3000K

194 100

5000K

212 109

100 33.14

3000K

322 97

5000K

353 106

150 33.90

3000K

477 97

5000K

522 103

200 34.58

3000K

627 91

5000K

686 99

250 35.24

3000K

771 88

5000K

845 96

300 35.89

3000K

913 85

5000K

1000 93

350 36.50

3000K

1050 82

5000K

1150 90

400 37.16

3000K

1184 80

5000K

1296 87

450 37.74

3000K

1313 77

5000K

1438 85

Note :

1) These values on the table are for reference only.

http://www.samsungled.com 5/19

3. Binning Structure

(Condition : I

= 350 mA, T

: 25°C)

1) Color Binning

CCT Product Code Color Rank Chromaticity Bins

3000K

SPHWWTHDNA45YHVTJC VT

(Whole Bin)

VB, VC, VD, VE,

VF, VG, VH

SPHWWTHDNA45YHVUJC VU

(Half Bin) VB, VC, VD

SPHWWTHDNA45YHVPJC VP

(Quarter Bin) VB

5000K SPHCWTHDNA45YHRTMC RT

(Whole Bin) RW, RX, RY, RZ

2) Luminous Flux Binning

CCT Product Code Flux

Rank

Flux

Bin

Range (lm)

Min Typ Max

3000K

SPHWWTHDNA45YHVTJC

SPHWWTHDNA45YHVUJC

SPHWWTHDNA45YHVPJC

JB 950 - 1050

MA 1050 -

5000K SPHCWTHDNA45YHRTMC MC

MB 1050 - 1150

PA 1150 - -

http://www.samsungled.com 6/19

4. Chromaticity Coordinates

(Condition : I

= 350 mA, T

: 25°C)

1) 3000K

Table CIE XCIE YTable CIE XCIE Y

0.4451 0.4146

0.4562 0.4260

0.4324 0.4100 0.4431 0.4213

0.4244 0.3922 0.4388 0.4122

0.4361 0.3964 0.4515 0.4168

0.4324 0.4100

0.4303 0.3944

0.4261 0.4077 0.4185 0.3902

0.4185 0.3902 0.4147 0.3814

0.4244 0.3922 0.4260 0.3854

0.4515 0.4168

0.4420 0.3985

0.4451 0.4146 0.4303 0.3944

0.4361 0.3964 0.4260 0.3854

0.4420 0.3985 0.4373 0.3893

0.4431 0.4213

0.4299 0.4165

0.4261 0.4077

0.4388 0.4122

2) 5000K

Table CIE XCIE Y

0.3376 0.3616

0.3463 0.3687

0.3451 0.3554

0.3371 0.3490

0.3451 0.3554

0.3440 0.3428

0.3366 0.3369

0.3463 0.3687

0.3551 0.3760

0.3533 0.3620

0.3451 0.3554

0.3533 0.3620

0.3515 0.3487

0.3440 0.3428

Note :

1) The Chromaticity Coordinates refers to ANSI C78.377-2008

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5. Typical Characteristics Graph

*These graphs show typical values. (Ta : 25°C)

Forward Current vs. Relative Luminous Flux Forward Current vs. Forward Voltage

Forward current vs. Chromaticity Coordination Temperature vs. Chromaticity Coordination

http://www.samsungled.com 8/19

Temperature vs. Voltage Temperature vs. Relative Luminous Flux

Radiation Pattern

http://www.samsungled.com 9/19

Relative Spectral Emission

<3000K> <5000K>

Derating Curve

http://www.samsungled.com 10/19

6. Outline Drawing &Dimension

unit :mm

Tolerance : ± 0.15

http://www.samsungled.com 11/19

7. Reliability Test Items and Conditions

1) Test Items

Test ItemsTest Conditions Test

Hours/Cycles

MSL test

125°C 24h drying

→

MSL 2a(Sunnix5) 60°C, 60%RH 120h(drying after 2h)

→

260°C 10sec 3time(each Cycle

Room Temperature cooling, MSL after 15min during 4h)

1time

Room Temperature

life test 25°C, I

=Max 1,000 h

High Temperature humidity

life test 85°C, 85% RH, DC Derating I

=Max 1,000 h

High Temperature life test 85°C, DC Derating I

=Max 1,000 h

Low Temperature life test -40°C, DC 450 mA 1,000 h

High Temperature Storage 120°C 1,000 h

Low Temperature Storage -40°C 1,000 h

Thermal Shock -45°C/15min

→

125°C/15min

Temperature changes in 5min. 200 cycles

Temperature Cycle

On/Off test

-40 / 85°C, each 20min, 100min transfer

Power On/off each 5min, DC 350 mA 100 cycles

Temperature humidity

Cycle Storage -10°C

↔

25°C, 95%RH

↔

85°C, 95%RH[24h/1Cycle] 100 cycles

ESD(HBM) R1 : 10

㏁

,R2 : 1.5

㏀

, C : 100

㎊

5times

(± 5

㎸

)

ESD(MM) R1 : 10

㏁

,R2 : 0

㏀

, C : 200

㎊

5times

(± 0.5

㎸

)

Vibration

20~80

㎐

(Displacement:0.06inch, Max 20G)

80~2

㎑

(Max 20G)

Min. Frequency

↔

Max. Frequency 4min transfer

4times

Shock 1500G, 0.5ms, Every 6faces (3axis X 2faces) 5times

Salt Spray 35°C, salt water 5% 8h spray

→

16h leaving alone 2cycles

2) Criteria for Failure

* U.S.L. : Upper Standard Level L.S.L. : Lower Standard Level

Item Symbol Test Condition

= 25°C]

Limit

Min.Max.

Forward Voltage V

350 mA L.S.L. × 0.9 U.S.L. × 1.1

Luminous flux lm 350 mA L.S.L. × 0.7 U.S.L. × 1.3

http://www.samsungled.com 12/19

8. Label Structure

*Bag &Inner box *Box

[Box Label]

N.B) Denoted rank is the only example.

Rank Code

ⓐⓑ

:Forward Voltage (V

)Rank (refer to page. 3)

ⓒⓓ

:Chromaticity Coordinate Rank (refer to page. 5)

ⓔⓕ

:Luminous Flux (Φ

)Rank (refer to page. 3)

SPHCWTHDNA45YHRTMC YHRTMC 01

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●◎◇◆□■△△△

/ I

▲▲▲

/XXX PCS

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IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII

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OEB1906005/50

SPHCWTHDNA45YHRTMC YHRTMC 01

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●◎◇◆□■△△△

/ I

▲▲▲

/XXX PCS

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IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII

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Rank

Code

Rank

Code

YHRTMC

Lot

number

Tray

number

/Q'ty

http://www.samsungled.com 13/19

9. Lot Number

The Lot number is composed of the following characters

●◎◇◆□■△△△

/ I

▲▲▲

/xxx PCS

●

:Production Site (S:SAMSUNG ELECTRONICS, G:Gosin China,A:Aprosystems)

◎

: L (LED)

◇

:Product State (A:Normality, B: Bulk, C:First Production, R:reproduction, S:Sample)

◆

:Year (S:2008, T:2009, U:2010, V:2011...)

□

:Month (1 ~ 9, A~C)

■

:Day (1 ~ 9, A, B ~ V)

△

: SAMSUNG LED Product number (1 ~ 999)

▲

:Tray Number (1 ~ 999)

http://www.samsungled.com 14/19

10. Tray Dimension

11. Aluminum Bag Dimension

Silica gel &Humidity Indicator Card in Aluminum Bag

http://www.samsungled.com 15/19

12. Box &Pad Dimension

1) Out BOX

2) Inner BOX

3) Pe-foam PAD

http://www.samsungled.com 16/19

13. Packing Structure

1-1). Tray Packing (When 5Trays)

Max Amount(pcs)

Tray Al Bag Box

40 200 800

http://www.samsungled.com 17/19

1-2). Tray Packing (When Less than 5Trays)

EX) Module tray 2pcs :Pe-foam(10t) * 3pcs

Module tray 3pcs :Pe-foam(10t) * 2pcs

Module tray 4pcs :Pe-foam(10t) * 1pcs

http://www.samsungled.com 18/19

14. Precaution for use

1) Shelf life in sealed bag : 12 months at < 40

Cand < 90% relative humidity(RH)

2) Peak package body temperature : 240

3) After this bag is opened, devices that will be subjected to reflow solder

or other high temperature processes must be :

a. Mounted within 672 hours at factory conditions of equal to or

less than 30

C / 60% RH, or

b. Stored at < 10% RH

4) Devices require bake, before mounting, if :

a. Humidity Indicator Card is > 65% when read at 23 ± 5

C, or

b. 2a is not met.

5) If baking is required, devices must be baked for 1hours at 60 ± 5

Note :If device containers cannot be subjected to high temperature or

shorter bake times are desired, reference IPC /JEDEC J-STD-033

for bake procedure.

6) TheLEDs are sensitive to the static electricity and surge current.

It is recommended to use awrist band or anti-electrostatic glove when handling

the LEDs. If voltage exceeding the absolute maximum rating is applied to LEDs,

it may cause damage or even destruction to LED devices.

Damaged LEDs may show some unusual characteristics such as increase in

leakage current, lowered turn-on voltage, or abnormal lighting of LEDs at low

current.

7) Please do not following behavior in resin area.

(Handling, Pressing, Touching, Rubbing, Contacting tweezers, Cleaning)

But it's ok in handling area.

http://www.samsungled.com 19/19

Date Revision History Writer

Drawn Approved

2012.02.17 New Version SH.AN HK.KIM

2012.03.29 1st Version SH.AN HK.KIM

2012.11.26 2st Version SH.AN HK.KIM

Revision History