DATA SH EET
Product specification
Supersedes data of 1997 May 07 1998 Feb 23
INTEGRATED CIRCUITS
TDA8551
1 W BTL audio amplifier with digital
volume control
1998 Feb 23 2
NXP Semiconductors Product specification
1 W BTL audio amplifier with digital volume
control TDA8551
FEATURES
One pin digital volume contro l
Volume setting with UP/DOWN pulses
Flexibility in use
Few external components
Low saturation voltage of output stage
Standby mode controlled by CMOS compatible levels
Low standby current
No switch-on/switch-off plops
High supply voltage ripple rejection
Protected against electrostatic discharge
Outputs short circuit safe to ground, VP and across the
load
Thermally protected.
GENERAL DESCRIPTION
The TDA8551; TDA8551T is a one channel 1 W
Bridge-Tied Lo ad (BTL) audio power amplifier capable of
delivering 1 W output power to an 8 Ω load at THD = 10%
using a 5 V power supply. The circuit contains a BTL
power amplifier, a digital volume control and standby/mute
logic. The TDA85 51 T co mes in an 8 pin SO package and
the TDA8551 in a 8 pin DIP package.
APPLICATIONS
Portable consumer prod ucts
Personal computers
Telephony.
QUICK REFERENCE DATA
ORDERING INFORMATION
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
VPsupply voltage 2.7 5 5.5 V
Iqquiescent current VP=5V 610mA
Istb standby current −−10 μA
Pooutput power THD = 10 %; RL=8Ω; VP=5V 1 1.4 W
Gvvoltage gain 60 +20 dB
nvol number of volume steps 64
THD total harmonic distortion Po=0.5W 0.15 %
SVRR supply voltage ripple rejection 48 −−dB
TYPE
NUMBER PACKAGE
NAME DESCRIPTION VERSION
TDA8551T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
TDA8551 DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1
1998 Feb 23 3
NXP Semiconductors Product specification
1 W BTL audio amplifier with digital volume
control TDA8551
BLOCK DIAGRAM
Fig.1 Block diagram.
handbook, full pagewidth
MGK363
20 kΩ
TDA8551
5 kΩ
15 kΩ
15 kΩ
STANDBY/
MUTE/
OPERATING
VOLUME
CONTROL
UP/DOWN
COUNTER
INTERFACE
27
R
R
8
5
3
16
4
downup
VP
VP
SLAVE
MASTER
OUT+
GND
MODE
OUT
IN
SVR
UP/DOWN
PINNING
SYMBOL PIN DESCRIPTION
UP/DOWN 1 digital trinary input for volume
control
MODE 2 digital trinary input for mode
selection (st andb y, mute, oper ating)
SVR 3 half supply voltage, decoupling
ripple rejection
IN 4 audio input
OUT5 negative loudspeaker output
terminal
VP6 supply voltage
GND 7 ground
OUT+ 8 positive loudspeaker output
terminal Fig.2 Pin configuration.
handbook, halfpage 1
2
3
4
8
7
6
5
MGK362
TDA8551
OUT+
GNDMODE
VP
OUT
IN
SVR
UP/DOWN
1998 Feb 23 4
NXP Semiconductors Product specification
1 W BTL audio amplifier with digital volume
control TDA8551
FUNCTIONAL DESCRIPTION
The TDA8551; TDA8551T is a 1 W BTL audio power
amplifier capable of delivering 1 W output power to an 8 Ω
load at THD = 10% using a 5 V power supply. The gain of
the amplifier can be set by the digital volume control. In the
maximum volume setting the gain is 20 dB. Using the
MODE pin the device can be switched to the standby
condition, the mute con dition and the normal operating
condition. The device is protected by an internal thermal
shutdown protec tion mechanism.
Power amplifier
The power amplifier is a Bridge Tied Load (BTL) amplifier
with a complementary CMOS output stage. The total
voltage loss for both output power MOS transistors is
within 1 V and with a 5 V supply and an 8 Ω loudspeaker
an output power of 1 W can be delivered. The total gain of
this power amplifier is internally fixed at 20 dB.
Volume control
The volume control operates as a digital controlled
attenuator betwee n the audio input pin and the power
amplifier. In the maximum volume control setting the
attenuation is 0 dB and in the minimum v olume control
setting the typical attenuation is 80 dB. The attenuation
can be set in 64 steps by the UP/DOWN pin.
This UP/DOWN pin is a trinary input:
Floating UP/DOWN pin: volume remains unchanged
Negative pulses: setting volume towards minimum
Positive pulses: setting volume towards maximum.
Each pulse on the UP/DOWN pin results in a change in
gain of 80/64 = 1.25 dB (typical value). In the basic
application the UP/DOWN pin is switched to ground or VP
by a double push-button. When the supply voltag e is
initially connected, after a complete removal of the supply,
the initial state of the volume c ontrol is an attenuation of
40 dB (low volume), so the gain of the total amplifier is
20 d B . After powering-up, some positive pulses have to
be applied to th e UP/D OWN p in f or tur ning up to li ste ning
volume. When the device is switched with the MODE
select pin to the mute or the standby co ndition, the volume
control attenuation setting rema in s on its value , ass ume d
that the voltage on pin VP does not fall below the minimum
supply voltage. Afte r switching the device ba ck to the
operation mode, the previous volume setting is
maintained.
Mode select pin
The device is in the standby mode (with a very low current
consumption) if the voltage at the MODE pin is between VP
and VP0.5 V. At a mode select voltage level of less than
0.5 V the amplifier is fully operational. In the range
between 1 V and VP1.4 V the amplifier is in the mute
condition. The mute condition is useful for using it as a ‘fast
mute’; in this mode output signal is suppressed, while the
volume setting remains at its value. It is advised to keep
the device in the mute co ndition while the input capacitor
is being charged. This can be done by holding the MODE
pin at a level of 0.5VP, or by waiting approximately 100 ms
before giving the first volume-UP pulses.
1998 Feb 23 5
NXP Semiconductors Product specification
1 W BTL audio amplifier with digital volume
control TDA8551
LIMITING VALUES
In accordance with th e Absolute Ma ximum Ratin g System (IEC 1 34).
QUALITY SPECIFICATION
Quality according to “SNW-FQ-611 part E”, if this type is used as an audio amplifier. Quality specifications are listed in
the “Quality refe rence handbook”, order number 9397 750 00192.
THERMAL CHARACTE RISTICS
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VPsupply voltage 0.3 +5.5 V
VIinput voltage 0.3 VP+0.3 V
IORM repetitive peak output current 1A
Tstg storage temperature 55 +150 °C
Tamb operating temperature 40 +85 °C
Vsc AC and DC short-circuit safe voltage 5.5 V
Ptot maximum power dissipation SO8 0.8 W
DIP8 1.2 W
SYMBOL PARAMETER CONDITIONS VALUE UNIT
Rth j-a thermal resistance from junction to ambient in free air
SO8 160 K/W
DIP8 100 K/W
1998 Feb 23 6
NXP Semiconductors Product specification
1 W BTL audio amplifier with digital volume
control TDA8551
CHARACTERISTICS
VP=5V; T
amb =25°C; RL=8Ω; VMODE = 0 V; total gain setting at +7 dB (unles s otherwise specified); measur ed in
test circuit of Fig.4.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
DC characteristics
VPsupply voltage 2.7 5 5.5 V
Iqquiescent current RL=; note 1 610 mA
Istb standby current VMODE =V
P−−10 μA
VODC output voltage note 2 2.5 V
VOUT+ VOUTdifferential output offset −−50 mV
Mode select pin
VMODE input voltage standby mode VP0.5 VPV
mute mode 1 VP1.4 V
operating mode 0 0.5 V
IMODE input current 0 < VMODE <V
P−−100 nA
αmute attenuation note 3 80 90 dB
Volume control
trep pulse repetition time 100 −− ns
Vth(UP) UP/DOWN pin up threshold level 4.2 VPV
Vfloat(max) UP/DOWN pin floating high level −−3.4 V
Vfloat(min) UP/DOWN pin floating low level 1.0 −− V
Vth(DOWN) UP/DOWN pin down threshold level 0 0.6 V
IUP/DOWN input current UP/DOWN pin 0 < VUP/DOWN <V
P−−200 μA
Gv(max) maximum voltage gain (including
power amplifier) 19 20 21 dB
Gv(min) minimum voltage gain (including
power amplifier) 62 60 58 dB
nvol number of volume steps 64
ΔGvvoltage gain variation per step 1.25 dB
Ziinput impedance 14 20 kΩ
Vi(rms)(max) maximum input voltage (RMS value) −−2.0 V
AC characteristics (f = 1 kHz)
Pooutput power THD = 1 0% 1 1.4 W
THD = 0.5% 0.6 1.0 W
THD total harmonic distortion Po= 0.5 W; note 4 0.15 0.5 %
Vn(o) noise output voltage note 5 60 100 μV
SVRR supply voltage ripple rejection note 6 48 53 dB
Vi(IN)(max) maximum input voltage on pin IN THD = 1%;
Gv=50 dB
to0dB
−−2.0 V
1998 Feb 23 7
NXP Semiconductors Product specification
1 W BTL audio amplifier with digital volume
control TDA8551
Notes to the Characteristics
1. With a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal
to the DC output offset voltage divided by RL.
2. The DC output vo ltage with respect to ground is approximate l y 0.5VP.
3. Output voltage in mute position is measured with an input of 1 V (RMS), including noise, in a ban dwidth of 20 kHz.
4. Total gain settin g at +20 dB.
5. The noise output voltage is measured at the output in a frequency band from 20 Hz to 20 kHz (unweighted), input
source impedance R source =0Ω.
6. Supply voltage ripp le rejection is measured at th e output, with a source impedance of Rsource =0Ω at the input.
The ripple voltage is a sine wave with frequency of 1 kHz and an amplitude of 100 mV (RMS) is applied to the positive
supply rail.
Fig.3 Timing UP/DOWN pin.
The rise time (tr) and the width of the pulse (tw) are not cr itical.
handbook, full pagewidth
MGK365
tr
VP
VUP/DOWN
0
Vth(UP)
Vth(DOWN)
Vfloat(max)
Vfloat(min)
tw
increasing volume
decreasing volume
floating
trep
tr
ttw
trep
1998 Feb 23 8
NXP Semiconductors Product specification
1 W BTL audio amplifier with digital volume
control TDA8551
TEST AND APPLICATION INFORMATION
Fig.4 Test and applicatio n c i rc uit.
handbook, full pagewidth
MGM560
20 kΩ
TDA8551 5 kΩ
8 Ω
15 kΩ
15 kΩ
C2
100
μF
C4
220
μF
C1
330 nF
C5 100 nF
C3
100
nF
2.2 kΩ
R1
STANDBY/
MUTE/
OPERATING
VOLUME
CONTROL
27
R
R
8
5
3
operating
standby
VP
mute
UP
DOWN
volume
control
16
4
VP
VPVP = 5 V
V
P
Vi
SLAVE
MASTER
OUT+
GND
MODE
OUT
IN
SVR
UP/DOWN
Reduction of the value of capacitor C2 results in a
decrease of the SVRR performance at low frequencies
(see Fig.9).
The UP/DOWN pin can be driven by a 3-state logic output
stage (microcontroller) without extra external components.
If the UP/DOWN pin is driven by push-buttons, then it is
advised to have an RC filte r between the buttons and the
UP/DOWN pin. Advised values fo r the RC filter are 2.2 kΩ
and 100 nF.
The volume control circuit responds to the trailing edge of
the pulse on the volume pin; connecting to VP results in a
one step (1.25 dB) high er gain; connecting to gr ound
results in a one step lower gain.
To avoid audible plops while switching the supply voltage
on and off pin MODE has to be connected to VP (standby
condition) during charge or discharge of the input and
SVRR capacitors.
The measured thermal resistance of the IC package is
highly depende nt on the configuration and size of the
application board. Data may not be comparable between
different semiconductor manufacturers because the
application boards and test me thods are not st andardized
yet. In addition, the thermal performance of packages for a
specific application may be different than presented here,
because the configuration of the application boards
(copper area) may be different. NXP Semiconductors uses
FR-4 type application boards with 1 oz. copper traces with
solder coating . The measur ements ha ve been carr ied out
with vertical placed bo ar ds.
1998 Feb 23 9
NXP Semiconductors Product specification
1 W BTL audio amplifier with digital volume
control TDA8551
When a practical PCB layout is used with wider copper
tracks and some extra copper added both to the IC pin
connections and underneath the IC, the thermal resistance
from junction to ambient can be reduced. Without these
measures Rth j-a = 160 K/W for the SO8 package; see
Chapter “Ther m al characteristic s”. The power dissipatio n
can be calculated as follows:
For a maximum ambient temperature of 50 °C, VP=5V
and RL=8Ω this results in a worst case sin e wave
dissipatio n of 0.63 W.
Figures 5 to 15 represent test results obtained while using
the test circuit given in Fig.4. The following test conditions
apply: Tamb =25°C; VP=5V; f=1kHz; R
L=8Ω;
Gv= 20 dB; audio b an dwidth from 22 Hz to 22 kHz
(except for Fig s 8 and 9); un less otherwise specified.
PTamb
Rth j-a
--------------
=
Fig.5 Supply current as a function of supply
voltage.
handbook, halfpage
0246
10
0
8
6
4
2
MGM554
VP (V)
IP
(mA)
Fig.6 Total harmonic distortion as a function of
output power at different frequencies.
(1) f = 10 kHz.
(2) f = 1 kHz.
(3) f = 100 Hz.
handbook, halfpage
10
10
1
1
10
2
MGM551
10
2
10
1
110
Po (W)
THD
(%)
(3)
(2)
(1)
Fig.7 Total harmonic distortion as a function of
output power at different gains.
f=1kHz.
(1) Gv=0dB.
(2) Gv=7dB.
(3) Gv=20dB.
handbook, halfpage
10
10
1
1
10
2
MGM552
10
2
10
1
110
P
o
(W)
THD
(%)
(1)
(2)
(3)
1998 Feb 23 10
NXP Semiconductors Product specification
1 W BTL audio amplifier with digital volume
control TDA8551
Fig.8 Total harmonic distortion as a function of
frequency at different ga ins .
Po=0.1W.
(1) Gv=0dB. (2) Gv=7dB.
(3) Gv=20dB.
handbook, halfpage
10
1
101
102
MGM550
10 102103104105
(3)
(2)
(1)
f (Hz)
THD
(%)
Fig.9 Supply voltage ripple rejection as a function
of frequency.
(3) C2 = 100 μF; Gv=20dB.
(4) C2 = 10 μF; Gv=10 dB.
(5) C2 = 100 μF; Gv=7dB.
(6) C2 = 100 μF; Gv=10 dB.
Vripple =100mV.
Rsource =0Ω.
(1) C2 = 10 μF; Gv=20dB.
(2) C2 = 10 μF; Gv=7dB.
handbook, halfpage
60
40
20
0MGM549
10 102103104105
f (Hz)
SVRR
(dB) (1)
(2)
(3)
(4)
(5)
(6)
Fig.10 Input voltage as a function of voltage gain.
THD = 1 %.
handbook, halfpage
60 020 20
2.4
0
0.8
1.6
2.0
0.4
1.2
MGM559
Gv (dB)
Vi
(V)
40
Fig.11 Output voltage as a function of mode select
input voltage at different supply volta ge s.
(1) VP=3V.
(2) VP=5V.
handbook, halfpage
513240
1
101
102
103
104
105
MGM555
VMODE
Vo
(V)
(1) (2)
1998 Feb 23 11
NXP Semiconductors Product specification
1 W BTL audio amplifier with digital volume
control TDA8551
Fig.14 Power diss ipation as a function of supply
voltage.
(1) RL=4Ω.
(2) RL=8Ω.
(3) RL=16Ω.
handbook, halfpage
002 6
1.5
0.5
1
4
MGM556
P
(W)
VP (V)
(1)
(2)
(3)
Fig.15 Power diss ipation as a function of output
power.
(1) VP=5V; R
L=4Ω.
(2) VP=5V; R
L=8Ω.
(3) VP= 3.3 V; RL=4Ω.
(4) VP=5V; R
L=16Ω.
(5) VP= 3.3 V; RL=8Ω.
handbook, halfpage
0 2.0
1.5
0.5
0
1
0.4 0.8 1.2 1.6
MGM557
P
(W)
Po (W)
(5)
(4)
(3)
(2)
(1)
Fig.12 Volume gain as a function of volume steps .
handbook, halfpage
02040 80
nvol
Gv
(dB)
20
80
0
60
20
40
60
MGM553
Fig.13 Outp ut power as a functio n of supply
voltage.
THD = 10 %.
(1) RL=4Ω.
(2) RL=8Ω.
handbook, halfpage
0
3
2
1
0264
MGM558
Po
(W)
VP (V)
(1)
(2)
Po(max) is limited by Ptot and a
maximum available repetitive
peak output current of 1 A.
1998 Feb 23 12
NXP Semiconductors Product specification
1 W BTL audio amplifier with digital volume
control TDA8551
Fig.16 Layout of printed-circuit board.
Dimensions in mm.
handbook, full pagewidth
bottom viewtop view
MGM561
OUT
OUT+
+VPGND
51.2
51.1
UPDOWN
VOLUME
CONTROL
J1
18
R1
C1
C2
S1 S2
C5
C3
C4
Vi
stand-by operating
mute
TDA
8551
AUDIO POWER
CIC NIJMEGEN
TDA8551
1998 Feb 23 13
NXP Semiconductors Product specification
1 W BTL audio amplifier with digital volume
control TDA8551
PACKAGE OUTLINES
UNIT A
max. A1A2A3bpcD
(1) E(2) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm
inches
1.75 0.25
0.10 1.45
1.25 0.25 0.49
0.36 0.25
0.19 5.0
4.8 4.0
3.8 1.27 6.2
5.8 1.05 0.7
0.6 0.7
0.3 8
0
o
o
0.25 0.10.25
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
1.0
0.4
SOT96-1
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
4
5
pin 1 index
1
8
y
076E03 MS-012
0.069 0.010
0.004 0.057
0.049 0.01 0.019
0.014 0.0100
0.0075 0.20
0.19 0.16
0.15 0.05 0.244
0.228 0.028
0.024 0.028
0.012
0.010.010.041 0.004
0.039
0.016
0 2.5 5 mm
scale
S
O8: plastic small outline package; 8 leads; body width 3.9 mm SOT96
-1
99-12-27
03-02-18
1998 Feb 23 14
NXP Semiconductors Product specification
1 W BTL audio amplifier with digital volume
control TDA8551
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
SOT97-1 99-12-27
03-02-13
UNIT A
max. 12 b1(1) (1) (1)
b2cD E e M Z
H
L
mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
min. A
max. bmax.
w
ME
e1
1.73
1.14 0.53
0.38 0.36
0.23 9.8
9.2 6.48
6.20 3.60
3.05 0.2542.54 7.62 8.25
7.80 10.0
8.3 1.154.2 0.51 3.2
inches 0.068
0.045 0.021
0.015 0.014
0.009
1.07
0.89
0.042
0.035 0.39
0.36 0.26
0.24 0.14
0.12 0.010.1 0.3 0.32
0.31 0.39
0.33 0.0450.17 0.02 0.13
b2
050G01 MO-001 SC-504-8
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
8
1
5
4
b
E
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
pin 1 index
D
IP8: plastic dual in-line package; 8 leads (300 mil) SOT97
-1
1998 Feb 23 15
NXP Semiconductors Product specification
1 W BTL audio amplifier with digital volume
control TDA8551
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth acco un t of sold er ing ICs can be found in
our “IC Package Databook” (order code 93 98 652 90011).
DIP
SOLDERING BY DIPPING OR BY WAVE
The maximum permissible temperatur e of the s old er is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic bod y mus t not ex ceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature with in the permissible limit.
REPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-s yringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperature s range from
215to250°C.
Preheating is necessary to dry the paste and evap orate
the binding agent. Preheating duration: 45 minutes at
45 °C.
WAVE SOLDERING
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
techniqu e sh ould be used.
The longitudinal ax is of the package footprint must be
parallel to the solder flow.
The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adh esive. The adhesive c an be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temp erature is 260 °C, and
maximum duration of pack age immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 sec onds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
REPAIRING SOLDERED JOINTS
Fix the component by first so ldering two diagonally -
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limit ed to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operatio n wi th in 2 to 5 seconds between
270 and 320 °C.
1998 Feb 23 16
NXP Semiconductors Product specification
1 W BTL audio amplifier with digital volume
control TDA8551
DATA SHEET STATUS
Notes
1. Please consult the most rec en tly issued document before initiating or completing a design.
2. The product s tatus of device(s) described in this document may ha ve changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
DOCUMENT
STATUS(1) PRODUCT
STATUS(2) DEFINITION
Objective data sheet Development This doc ument contains data from the objective specificatio n for product
development.
Preliminary data sheet Qualification This document contains data from the preliminary specification.
Product data sheet Production This document contains the pr oduct specification.
DISCLAIMERS
Limited warranty and liability Information in this
document is believed to be accurate and re liable.
However, NXP Semiconduc tors does not give any
representations or warranties, expressed or implied, as to
the accuracy or completeness of such information and
shall have no liability for the consequences of use of such
information.
In no event shall NXP Semiconductors be liable for any
indirect, incidental, punitive, special or cons equential
damages (including - without limitation - lost profits, lost
savings, busin es s interru ption, costs related to the
removal or replacement of any products or rework
charges) whether or not such damages are based on tort
(including negligence), warranty, breach of contract or any
other legal theory.
Notwithstanding any damages that customer might incur
for any reason whatsoever, NXP Semiconductors
aggregate and cu mulative liability towa rds customer for
the products described herein shall be limited in
accordance with the Terms and conditions of comme rcial
sale of NXP Semiconductors.
Right to make changes NXP Semiconductors
reserves the right to make changes to information
published in this doc ument, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication hereof.
Suitability for use NXP Semiconduct ors pr oduc ts are
not designed, au thorized or warranted to be suitable for
use in life support, life-critical or safety-critical systems or
equipment, nor in applications where failure or malfunction
of an NXP Semiconductors product can reas onably be
expected to result in pe rs onal injury, death or severe
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductor s pr oducts in such equipment or
application s and therefore such inc l us ion and/or use is at
the customer’s own risk.
Applications Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of
their applications and products using NXP
Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or
customer product design. It is customer’s sole
responsibility to determine whether the NXP
Semiconductors pro du ct is su itable and fit for the
customer’s applications and products planned, as well as
for the planned a pplication and use of custo m er’s third
party customer(s). Customers should provide appropriate
design and opera t ing saf eg ua rd s to minimize the risks
associated with their applications an d products.
NXP Semiconduc tors does n ot a ccept any liabil ity rela ted
to any default, damage, costs or problem which is based
on any weakne ss or default in t he customer’s applic ations
or products, or the application or use by customer’s third
party customer( s) . C us to m er is responsible for doing all
necessary testing for the customer’s applications and
products using NXP Semiconductors produc ts in order to
avoid a default of the applic ations and the products or of
the application or use by customer’s third party
customer(s). NXP does not accept any liability in this
respect.
1998 Feb 23 17
NXP Semiconductors Product specification
1 W BTL audio amplifier with digital volume
control TDA8551
Limiting values Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) will cause permanent damage to
the device. Limiting values are stress ratings only and
(proper) operation of the device at these or any other
conditions abo ve those given in the Recommended
operating conditions section (if present) or the
Characteristics sections of this document is not warranted.
Constant or repeated exposure to limiting values will
permanently and irreversibly affect the quality and
reliability of the device.
Terms and conditions of commercial sale NXP
Semiconductors products are sold s ubject to the general
terms and conditio ns of commercial sale, as published at
http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written ind i vidual agreement. In case an
individual agreeme nt is co nc luded only the terms and
conditions of the resp ective agreement shall app ly. NXP
Semiconductors hereby expressly objects to a pplying the
customer’s general terms and conditions with regard to the
purchase of NXP Semicon ductors products by customer.
No offer to sell or license Nothing in this document
may be interpreted or construed as an offer to sell products
that is open for acceptance or the grant, conveyance or
implication of any license under any copyrights, patents or
other industrial or intellectual proper ty rights.
Export control This document as well as the item(s)
described he re in may be subject to export contro l
regulations. Export might require a prior authorization from
national auth or itie s.
Quick refer ence data The Quick reference data is an
extract of th e product data given in the Limiting values and
Characteristics sections of this document, and as such is
not complete, exhaus tive or legally binding.
Non-automotive qualified products Unless this data
sheet expressly states that this specific NXP
Semiconductors product is au tomotive qualified, the
product is not suitable for automotive use. It is neither
qualified nor te sted in accordanc e with automot ive testing
or application requirements. NXP Semiconductors accepts
no liability for inclusion and/or use of non-automotive
qualified prod ucts in automotive equipment or
applications.
In the event that customer uses the product for design-in
and use in automotive applications to automotive
specifications and standards, customer (a) shall use the
product without NXP Semiconductors’ warranty of the
product for such au t omo tive applications, use an d
specifications, and (b) whenever customer uses the
product for automotive applications beyond NXP
Semiconductors’ specifications such use shall be so lely at
customer’s own ris k, and (c) customer fully indemnifies
NXP Semiconductors for any liability, damages or failed
product clai ms r esult ing fr om custo mer desi gn an d us e o f
the product for automotive ap plic ations beyond NXP
Semiconductors st andard warran ty and NXP
Semiconductors’ product specifications.
NXP Semiconductors
provides High Performance Mixed Signal and Standard Product
solutions that leverage its leading RF, Analog, Power Management,
Interface, Security and Digital Processing expertise
Contact information
For additional information p lease visit: http://www.nxp.com
For sales offices addresses send e-mail to: salesaddresses@nxp.com
© NXP B.V. 2010
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information pr e sent ed in this document does not fo rm p ar t o f an y q uot ation or co ntract, is believed to be accurate a nd reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimer s. No changes were made to the technical content, exc ept for package outline
drawings which were updated to the latest version.
Printed in The Netherlands 545102/25/02/pp18 Date of release: 1998 Feb 23 Document order number: 9397 750 03173