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D/CRCW e3
Vishay
Standard Thick Film Chip Resistors
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FEATURES
Stability R/R = 1 % for 1000 h at 70 ° C
2 mm pitch packaging option for 0603 size
Pure tin solder contacts on Ni barrier layer
provides compatibility with lead (Pb)-free and lead
containing soldering processes
Metal glaze on high quality ce ramic
AEC-Q200 qualified
Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
Notes
These resistors do not feature a limited lifetime when operated within the p ermissible limits. However, resistance va lue drift increasing over
operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime.
Marking: See data sheet “Surface Mount Resistor Marking” (document number 20020).
Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material.
STANDARD ELECTRICAL SPECIFICATIONS
MODEL SIZE RATED
DISSIPATION
P70 °C
W
LIMITING
ELEMENT
VOLTAGE
Umax. AC/DC
TEMPERATURE
COEFFICIENT
ppm/K TOLERANCE
%RESISTANCE
RANGE
SERIES
INCH METRIC
D10/CRCW0402 0402 RR 1005M 0.063 50 ± 100
± 200 ± 1
± 5 1R0 to 10M E24; E96
E24
Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 1.5 A
D11/CRCW0603 0603 RR 1608M 0.10 75 ± 100
± 200 ± 1
± 5 1R0 to 10M E24; E96
E24
Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 2.0 A
D12/CRCW0805 0805 RR 2012M 0.125 150 ± 100
± 200 ± 1
± 5 1R0 to 10M E24; E96
E24
Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 2.5 A
D25/CRCW1206 1206 RR 3216M 0.25 200 ± 100
± 200 ± 1
± 5 1R0 to 10M E24; E96
E24
Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 3.5 A
CRCW1210 1210 RR 3225M 0.5 200 ± 100
± 200 ± 1
± 5 1R0 to 10M E24; E96
E24
Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 5.0 A
CRCW1218 1218 RR 3246M 1.0 200 ± 100
± 200 ± 1
± 5 1R0 to 2M2 E24; E96
E24
Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 7.0 A
CRCW2010 2010 RR 5025M 0.75 400 ± 100
± 200 ± 1
± 5 1R0 to 10M E24; E96
E24
Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 6.0 A
CRCW2512 2512 RR 6332M 1.0 500 ± 100
± 200 ± 1
± 5 1R0 to 10M E24; E96
E24
Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 7.0 A
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D/CRCW e3
Vishay Standard Thick Film Chip Resistors
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Note
(1)
The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the
printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 155 °C is not exceeded.
TECHNICAL SPECIFICATIONS
PARAMETER UNIT D10/
CRCW0402 D11/
CRCW0603 D12/
CRCW0805 D25/
CRCW1206 CRCW1210 CRCW1218 CRCW2010 CRCW2512
Rated dissipation P70 (1) W 0.063 0.1 0.125 0.25 0.5 1.0 0.75 1.0
Limiting element voltage
Umax. AC/DC V 50 75 150 200 200 200 400 500
Insulation voltage
Uins (1 min) V > 75 > 100 > 200 > 300 > 300 > 300 > 300 > 300
Insulation resistance > 109
Category temperature
range °C - 55 to + 155
Failure rate h-1 < 0.1 x 10- 9
Weight mg 0.65 2 5.5 10 16 29.5 25.5 40.5
PART NUMBER AND PR ODUCT DESCRIPTION
Part Number: CRCW0603562RFKEC
MODEL VALUE TOLERANCE TCR PACKAGING SPECIAL
CRCW0402
CRCW0603
CRCW0805
CRCW1206
CRCW1210
CRCW1218
CRCW2010
CRCW2512
R = Decimal
K = Thousand
M = Million
0000 = Jumper
F = ± 1.0 %
J = ± 5.0 %
Z = Jumper
K = ± 100 ppm/K
N = ± 200 ppm/K
0 = Jumper
EA, EB,
EC, ED,
EE, EF,
EG, EH,
EI, EL,
EK
Up to 2 digits
Product Description: D11/CRCW0603 100 562R 1 % ET6 e3
D11/CRCW0603 100 562R 1 % ET6 e3
MODEL TCR RESISTANCE VALUE TOLERANCE PACKAGING LEAD (Pb)-FREE
D10/CRCW0402
D11/CRCW0603
D12/CRCW0805
D25/CRCW1206
CRCW1210
CRCW1218
CRCW2010
CRCW2512
± 200 ppm/K
± 100 ppm/K 10R = 10
562R = 562
10K = 10 k
1M0 = 1 M
0R0 = Jumper
± 5 %
± 1 % ET1, ET2,
ET3, ET4,
ET5, ET6,
ET7, ET8,
ET9, EF4,
E02, E67,
E82
e3 = Pure tin
termination finish
C R C W 0 6 0 3 5 6 2 R F K E C
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DIMENSIONS
PACKAGING
MODEL CODE QUANTITY CARRIER TAPE WIDTH PITCH REEL DIAMETER
CRCW0402 ED = ET7 10 000
Paper tape acc.
to IEC 60068-3
Type I
8 mm 2 mm 180 mm/7"
EE = EF4 50 000 330 mm/13"
CRCW0603
EI = ET2 5000
8 mm 2 mm
180 mm/7"
ED = ET3 10 000 180 mm/7"
EL = ET4 20 000 285 mm/11.25"
EE = ET8 50 000 330 mm/13"
EA = ET1 5000 8 mm 4 mm 180 mm/7"
EB = ET5 10 000 285 mm/11.25"
EC = ET6 20 000 330 mm/13"
CRCW0805 EA = ET1 5000 8 mm 4 mm 180 mm/7"
EB = ET5 10 000 285 mm/11.25"
EC = ET6 20 000 330 mm/13"
CRCW1206 EA = ET1 5000 8 mm 4 mm 180 mm/7"
EB = ET5 10 000 285 mm/11.25"
EC = ET6 20 000 330 mm/13"
CRCW1210 EA = ET1 5000 8 mm 4 mm 180 mm/7"
EB = ET5 10 000 285 mm/11.25"
EC = ET6 20 000 330 mm/13"
CRCW1218 EK = ET9 4000 Blister tape acc.
to IEC 60068-3
Type II
12 mm 4 mm 180 mm/7"
CRCW2010 EF = E02 4000 12 mm 4 mm 180 mm/7"
CRCW2512 EG = E67 2000 12 mm 8 mm 180 mm/7"
EH = E82 4000 4 mm
SIZE DIMENSIONS in millimeters SOLDER PAD DIMENSIONS in millimeters
REFLOW SOLDERING WAVE SOLDERING
INCH METRIC L W H T1 T2 a b l a b l
0402 1005 1.0 ± 0.05 0.5 ± 0.05 0.35 ± 0.05 0.25 ± 0.05 0.2 ± 0.1 0.4 0.6 0.5
0603 1608 1.55 + 0.10
- 0.05 0.85 ± 0.1 0.45 ± 0.05 0.3 ± 0.2 0.3 ± 0.2 0.5 0.9 1.0 0.9 0.9 1.0
0805 2012 2.0 + 0.20
- 0.10 1.25 ± 0.15 0.45 ± 0.05 0.3 + 0.20
- 0.10 0.3 ± 0.2 0.7 1.3 1.2 0.9 1.3 1.3
1206 3216 3.2 + 0.10
- 0.20 1.6 ± 0.15 0.55 ± 0.05 0.45 ± 0.2 0.4 ± 0.2 0.9 1.7 2.0 1.1 1.7 2.3
1210 3225 3.2 ± 0.2 2.5 ± 0.2 0.55 ± 0.05 0.45 ± 0.2 0.4 ± 0.2 0.9 2.5 2.0 1.1 2.5 2.2
1218 3246 3.2 + 0.10
- 0.20 4.6 ± 0.15 0.55 ± 0.05 0.45 ± 0.2 0.4 ± 0.2 1.05 4.9 1.9 1.25 4.8 1.9
2010 5025 5.0 ± 0.15 2.5 ± 0.15 0.6 ± 0.1 0.6 ± 0.2 0.6 ± 0.2 1.0 2.5 3.9 1.2 2.5 3.9
2512 6332 6.3 ± 0.2 3.15 ± 0.15 0.6 ± 0.1 0.6 ± 0.2 0.6 ± 0.2 1.0 3.2 5.2 1.2 3.2 5.2
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D/CRCW e3
Vishay Standard Thick Film Chip Resistors
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FUNCTIONAL PERFORMANCE
1000
100
10
1
0.1
0.01
Single Pulse
Pulse Load max. (W)
P
2512
1218
2010
1210
1206
0805
0603
0402
10
-6
Pulse Duration
i
(s)
t
10
-5
10
-4
10
-3
10
-2
10
-1
1 10 100
Maximum pulse load, single pulse; applicable if P 0 and n < 1000 and Û Ûmax.;
for permissible resistance change equivalent to 8000 h operation
1000
10
1
0.1
0.01
10
-6
Continuous Pulse
Maximum pulse load, continuous pulses; applicable if P P (ϑamb) and Û Ûmax.;
for permissible resistance change equivalent to 8000 h operation
Pulse Duration i (s)
Continuous Pulse Load
max.
(W)
t
P
100
10
-5
10
-4
10
-3
10
-2
10
-1
1 10 100
2512
1218
2010
1210
1206
0805
0603
0402
2000
200
0
10
- 6
10
- 5
10
- 4
10
- 3
10
- 2
10
- 1
110
Maximum pulse voltage, single and continuous pulses; applicable if
P P
max.
; for permissible resistance change equivalent to 8000 h operation
Pulse Duration i (s)
400
600
800
1000
1200
1400
1600
1800
Pulse Voltage
max.
(V)
2512
2010
1206/1210/1218
0805 0603
0402
t
Û
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- 50 0 50 100 150
0
Derating
Ambient Temperature amb
Fraction of Rated Dissipation P70
50
100
70 °C
%
ϑ
10
120
Resistance Value R in Ω
Attenuation of 3rd Harmonic A3 in dB
100
80
40
60
20
0100 1K 10K 100K 1M 10M
1206, 2010
0805
0603
0402
100 1K 10K 100K 1M 10M
100
10
1
0.1
0.01
Current Noise A1 in µV/V
2010
1206
0805
0603
0402
Resistance Value R in Ω
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D/CRCW e3
Vishay Standard Thick Film Chip Resistors
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TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
SIZE 0402 to 2512
STABILITY
CLASS 1
OR BETTER
STABILITY
CLASS 2
OR BETTER
Stability for product types:
D/CRCW e3 1to 10 M
4.5 - Resistance - ± 1 % ± 5 %
4.7 - Voltage proof U = 1.4 x Uins; 60 s No flashover or breakdown
4.13 - Short time overload U= 2.5 x
2 x Umax.;
duration: Acc. to style ±0.25 % R + 0.050.5 % R + 0.05)
4.17.2 58 (Td) Solderability
Solder bath method;
Sn60Pb40
non activated flux;
(235 ± 5) °C
(2 ± 0.2) s
Good tinning ( 95 % covered)
no visible damage
Solder bath method;
Sn96.5Ag3Cu0.5
non-activated flux;
(245 ± 5) C
(3 ± 0.3) s
Good tinning ( 95 % covered)
no visible damage
4.8.4.2 - Temperature
coefficient (20/- 55/20) C and
(20/125/20) C± 100 ppm/K ± 200 ppm/K
4.32 21 (Uu3)Shear
(adhesion) RR 1608 and smaller: 9 N
RR 2012 and larger: 45 N No visible damage
4.33 21 (Uu1) Substrate bending Depth 2 mm;
3 times No visible damage, no open circuit in bent position
± (0.25 % R + 0.05 )
4.19 14 (Na) Rapid change of
temperature
30 min. at - 55 °C;
30 min. at 125 °C
5 cycles ± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 )
1000 cycles ± (1 % R + 0.05 (1 % R + 0.05 )
4.23 - Climatic sequence: -
± (1 % R + 0.05 (2 % R + 0.1 )
4.23.2 2 (Ba) Dry heat 125 °C; 16 h
4.23.3 30 (Db) Damp heat, cyclic 55 °C; 90 % RH;
24 h; 1 cycle
4.23.4 1 (Aa) Cold - 55 °C; 2 h
4.23.5 13 (M) Low air pressure 1 kPa; (25 ± 10) °C; 1 h
4.23.6 30 (Db) Damp heat, cyclic 55 °C; 90 % RH;
24 h; 5 cycles
4.23.7 - DC load U=
4.25.1 - Endurance
at 70 °C
U= Umax.;
1.5 h on; 0.5 h off;
70 °C; 1000 h ± (1 % R + 0.05 (2 % R + 0.1 )
70 °C; 8000 h ± (2 % R + 0.1 (4 % R + 0.1 )
P70 x R
P70 x R
P70 x R
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All tests are carried out in accordance with the following specificatio ns:
EN 60115-1, generic specification
EN 140400, sectional specification
EN 140401-802, detail specification
IEC 60068-2-x, environmental test procedures
Packaging of components is done in paper or blister tapes according to IEC 60286-3.
4.18.2 58 (Td) Resistance to
soldering heat
Solder bath method
(260 ± 5) C;
(10 ± 1) s ± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 )
4.35 - Flamability,
needle flame test IEC 60695-11-5;
10 s No burning after 30 s
4.24 78 (Cab) Damp heat,
steady state
(40 ± 2) °C;
(93 ± 3) % RH;
56 days ± (1 % R + 0.05 )
4.25.3 - Endurance at
upper category
temperature 155 °C, 1000 h ± (1 % R + 0.05 (2 % R + 0.1 )
4.40 - Electrostatic
discharge
(human body model)
IEC 61340-3-1;
3 pos. + 3 neg.
discharges;
ESD voltage acc. to size
± (1 % R + 0.05 )
4.29 45 (XA) Component solvent
resistance Isopropyl alcohol;
50 °C; method 2 No visible damage
4.30 45 (XA) Solvent resistance
of marking
Isopropyl alcohol;
50 °C; method 1,
toothbrush
Marking legible,
no visible damage
4.22 6 (Fc) Vibration, endurance
by sweeping
f = 10 Hz to 2000 Hz;
x, y, z 1.5 mm;
A 200 m/s2;
10 sweeps per axis
± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 )
4.37 - Periodic electric
overload
U=
2 x Umax.;
0.1 s on; 2.5 s off;
1000 cycles
± (1 % R + 0.05 )
4.27 - Single pulse high
voltage overload,
10 µs/700 µs
Û= 10 x
2 x Umax.;
10 pulses ± (1 % R + 0.05 )
TEST PROCEDUR ES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
SIZE 0402 to 2512
STABILITY
CLASS 1
OR BETTER
STABILITY
CLASS 2
OR BETTER
Stability for product types:
D/CRCW e3 1to 10 M
15 x P70 x R
P70 x R