DS07-16202-2E
FUJITSU SEMICONDUCTOR
DATA SHEET
32-bit Proprietary Microcontroller
CMOS
FR Family MB91191/192 Series
MB91191R/MB91192/MB91F191A/MB91F192
DESCRIPTION
The MB91191/192 series is a single-chip microcontroller using a 32-bit RISC-CPU (FR series) as its core. It
contains peripheral I/O resources suitable for software servo control in applications such as VTRs that require
high-speed CPU processing.
FEATURES
CPU
32-bit RISC (FR series) , load/store architecture, 5-stage pipeline
General-purpose registers : 16 × 32-bit
16-bit fixed-length instructions (basic instructions) , 1 instruction per cycle
Includes memory-to-memory transfer, bit manipulation, and barrel shift instructions :
Optimized for embedded applications
Includes function entry/exit instructions and multiple-register load/store instructions :
Instruction set supports high le vel languages
Register interlock function : For efficient assembly language coding
Branch instructions with delay slots : Reduced overhead for branch operations
Internal multiplier unit is supported at instruction level
Signed 32-bit multiplication : 5 cycles
Signed 16-bit multiplication : 3 cycles
Interrupts (PC and PS saving) : 6 cycles, 16 priority levels
(Continued)
PACKAGE
Plastic, LQFP, 120-pin
(FPT-120P-M05)
Plastic, FLGA, 144-pin
(LGA-144P-M02)
MB91191/192 Series
2
Bus Interface
16-bit address output, 8/16-bit data input and output
Basic bus cycle : 2 clock cycles
Supports interfaces for various types of memory
Multiplexed data/address input/output
Automatic wait cycles : Between 0 and 7 wait cycles can be specified independently for each memory area
Unused data/address pins can be configured as input/output ports
Supports little endian mode
Bit Search Module
Searches, starting from the MSB, for the position of the first 1/0 bit transition in a word. The operation is
performed in one cycle.
Serial I/O
3 channels with internal buffer RAM (automatic transfer of up to 128 bytes)
Independent send and receive buffer mode (automatic transfer of up to 64 bytes)
A/D Converter (Successive Approximation Type)
10-bit × 16 channels
Uses successive approximation conversion method (conversion time : 8.4 µs @ 20 MHz)
Channel scan function
Hardware and software conversion start functions
Internal FIFO (Software conversion : 6 stages, Hardware conversion : 6 stages)
Timers
16-bit × 4 channels
16-bit timer/counter × 1 channel (with square wave output)
8/16-bit timer/counter × 1 channel (with square wave output)
FG input unit
Incorporates capstan, drum, and reel input circuits
Capture unit
Internal 24-bit free-run counter (Minimum resolution = 50 ns @ 20 MHz)
Internal FIFO (Data : 21-bit × 8, Detection : 8-bit × 8)
Programmable pattern generator
Inter nal RAM buffer (PPG0 : 256 bytes, PPG1 : 64 bytes)
Output timing resolution : 800 ns @ 20 MHz
Includes an A/D converter hardware start function
Realtime timing generator
RTG : 3 circuits
Output timing resolution : 400 ns or 800 ns selectable
Timing output ports : 5 ports
PWM
12-bit PWM × 6 channels (rate, mu lti-type)
Base frequency = 78.1 kHz or 39.0 kHz (@ 20 MHz) selectable
(Continued)
MB91191/192 Series
3
(Continued)
PWC
•8-bit PWC × 1 channel (with mask input)
Measurement resolution : 400 ns @ 20 MHz
General-purpose prescaler
10-bit prescaler × 1 channel (with square wave and pulse outputs)
Dedicated inter nal oscillator circuit
Includes load function driven by PPG output
Interrupt control
External interrupts : 3 inputs
Key input interrupt : 8 inputs
MB91191/192 Series
4
PIN ASSIGNMENT
(Continued)
PA0/AN-8/KEY0
PB7/AN-7
PB6/AN-6
PB5/AN-5
PB4/AN-4
PB3/AN-3
PB2/AN-2
PB1/AN-1
PB0/AN-0
AVDD
AVRH
AVSS
VSS
P17/RTG4
P16/RTG3
P15/RTG2
P14/RTG1
P13/RTG0
P12/EC5/INT1
P11/EC4/INT0
P10/PMSK
P07/EXI2/PMI
P06/EXI1
P05/EXI0
P04/CFG
P03/DFG
P02/DPG
P01/RFG0
P00/RFG1
VDD
P93/PPG02
P94/PPG03
P80/PPG04
P81/PPG05
P82/PPG06
P83/PPG07
P84/PPG08
P85/PPG09
P86/PPG10
P87/PPG11
P40/PPG12
P41/PPG13
P42/PPG14
P43/PPG15
P44/PPG16
P45/PPG17
P46/PPG18
P47
P57
P56
P55
P54
P53
P52
P51
P50
VSS
P37
P36
P35
A15
A14
A13
A12
A11
A10
A09
A08
D31/A07
D30/A06
D29/A05
P57
P56
P55
P54
P53
P52
P51
P50
D31/A15
D30/A14
D29/A13
PA1/AN-9/KEY1
PA2/AN-A/KEY2
PA3/AN-B/KEY3
PA4/AN-C/KEY4
PA5/AN-D/KEY5
PA6/AN-E/KEY6
PA7/AN-F/KEY7
PD0/SI2
PD1/SO2
PD2/SCK2
PD3/SI1/INT2
PD4/SO1
PD5/SCK1
PD6/SCS0
PD7/SI0
PC0/SO0
PC1/SCK0
PC2/PWM5/SCS1
PC3/PWM4/SCS2
PC4/PWM3
PC5/PWM2
PC6/PWM1
PC7/PWM0
VSS
OSCI/PCK
OSCO
VDD
P90/P0
P91/PPG00
P92/PPG01
ALE
WR1
WR0
RD
A00/D16
A01/D17
A02/D18
A03/D19
A04/D20
A05/D21
A06/D22
A07/D23
A08/D24
A09/D25
A10/D26
A11/D27
A12/D28
ALE
P62
WR0
RD
P20
P21
P22
P23
P24
P25
P26
P27
A00/D24
A01/D25
A02/D26
A03/D27
A04/D28
X0
X1
VSS
MD2
MD1
MD0
RST
P70/XOUT
P67/T40
P66/T501
P65
P64
P63
P62
P61
P60
P20
P21
P22
P23
P24
P25
P26
P27
VDD
P30
P31
P32
P33
P34
16-bit MPX mode
8-bit MPX mode
95
100
105
110
115
120
90
85
80
75
70
65
5
10
15
20
25
30
60
55
50
45
40
35
(TOP VIEW)
(FPT-120P-M05)
MB91191/192 Series
5
(Continued)
Top View
65
OSCO66
OSCI 30
P34 28
P32 29
P33
64
VDD
68
PC7 69
PC6 27
P31 25
VDD 26
P30
67
VSS
71
PC4 72
PC3 24
P27 22
P25 23
P26
70
PC5
74
PC1 75
PC0 21
P24 19
P22 20
P23
73
PC2
77
PD6 76
PD7 18
P21 16
P60 17
P20
78
PD5
80
PD3 79
PD4 13
P63 15
P61 14
P62
81
PD2
83
PD0 82
PD1 10
P66 12
P64 11
P65
84
PA7
86
PA5 85
PA6 7
RST 9
P67 8
P70
87
PA4
89
PA2 88
PA3 4
MD2 6
MD0 5
MD1
90
PA1
32
P36
59
P94 56
P82 53
P85 50
P40 47
P43 44
P46 41
P56 38
P53 35
P50
33
P37
58
P80 55
P83 52
P86 49
P41 46
P44 45
P45 42
P57 39
P54 36
P51
62
P91 63
P90 31
P35
61
P92 60
P93 57
P81 54
P84 51
P87 48
P42 43
P47 40
P55 37
P52 34
VSS
1
X0 3
VSS 2
X1
91
PA0 94
PB5 97
PB2 100
AVDD 103
VSS 108
P13 111
P10 114
P05 117
P02 120
VDD
93
PB6 96
PB3 99
PB0 102
AVSS 105
P16 106
P15 109
P12 112
P07 115
P04 118
P01
92
PB7 95
PB4 98
PB1 101
AVRH 104
P17 107
P14 110
P11 113
P06 116
P03 119
P00
(LGA-144P-M02)
Note : The FLGA-144 package is not supplied for the MB91191 series.
It is supplied only for the MB91192 series.
MB91191/192 Series
6
PIN DESCRIPTIONS
(Continued)
Pin No. Pin Name Circuit
Type Function
1 X0 (I) A Crystal oscillator pins
2 X1 (O)
3V
SS VSS pin
4MD2
BOperation mode setting pins
CMOS Schmitt inputs
5MD1
6MD0
7RST B Reset input pin. CMOS Schmitt input.
8 P70/XOUT C Shared pin with clock output (X0/2, PCK/2) . CMOS input.
9 P67/T40
C
Shared pin with timer 4 square wave output. CMOS input.
10 P66/T501 Shared pin with timer 5 square wave output. CMOS input.
11 P65 General-purpose I/O port. CMOS input.
12 P64 General-purpose I/O port. CMOS input.
13 P63/ALE/ALE Shared pin with address strobe output. CMOS input.
14 P62/P62/WR1 Shared pin with write strobe output 1. CMOS input.
15 P61/WR0/WR0 Shared pin with write strobe output 0. CMOS input.
16 P60/RD/RD Shared pin with read strobe output. CMOS input.
17 P20/P20/D16 : A00
CGeneral-purpose I/O ports.
CMOS inputs.
18 P21/P21/D17 : A01
19 P22/P22/D18 : A02
20 P23/P23/D19 : A03
21 P24/P24/D20 : A04
22 P25/P25/D21 : A05
23 P26/P26/D22 : A06
24 P27/P27/D23 : A07
25 VDD Power supply pin
26 P30/D24 : A00/D24 : A08
CShared external bus pins and high-current I/O ports.
CMOS inputs.
27 P31/D25 : A01/D25 : A09
28 P32/D26 : A02/D26 : A10
29 P33/D27 : A03/D27 : A11
30 P34/D28 : A04/D28 : A12
31 P35/D29 : A05/D29 : A13
32 P36/D30 : A06/D30 : A14
33 P37/D31 : A07/D31 : A15
34 VSS VSS pin
MB91191/192 Series
7
(Continued)
Pin No. Pin Name Circuit
Type Function
35 P50/A08/P50
CShared external bus pins and high-current I/O ports.
CMOS inputs.
36 P51/A09/P51
37 P52/A10/P52
38 P53/A11/P53
39 P54/A12/P54
40 P55/A13/P55
41 P56/A14/P56
42 P57/A15/P57
43 P47
C
General-purpose I/O port. CMOS input.
44 P46/PPG18
Shared pins with PPG outputs.
CMOS inputs.
45 P45/PPG17
46 P44/PPG16
47 P43/PPG15
48 P42/PPG14
49 P41/PPG13
50 P40/PPG12
51 P87/PPG11
CShared pins with PPG outputs.
CMOS inputs.
52 P86/PPG10
53 P85/PPG09
54 P84/PPG08
55 P83/PPG07
56 P82/PPG06
57 P81/PPG05
58 P80/PPG04
59 P94/PPG03 CShared pins with PPG outputs.
CMOS inputs.
60 P93/PPG02
61 P92/PPG01
CShared pins with PPG outputs.
CMOS inputs.
62 P91/PPG00
63 P90/P0 Shared pin with general-purpose prescaler output. CMOS input.
64 VDD Power supply pin
65 OSCO (O) ACrystal oscillator pins for dedicated general-purpose prescaler
oscillation.
66 OSCI/PCK (I)
67 VSS VSS pin
MB91191/192 Series
8
(Continued)
Pin No. Pin Name Circuit
Type Function
68 PC7/PWM0
CShared pins with PWM outputs.
CMOS inputs.
69 PC6/PWM1
70 PC5/PWM2
71 PC4/PWM3
72 PC3/PWM4/SCS2
F
Shared pin with PWM output and serial 2 chip select.
CMOS Schmitt input.
73 PC2/PWM5/SCS1 Shared pin with PWM output and serial 1 chip select.
CMOS Schmitt input.
74 PC1/SCK0 Shared pin with serial 0 shift clock.
CMOS Schmitt input.
75 PC0/SO0 C Shared pin with serial 0 serial output. CMOS input.
76 PD7/SI0
F
Shared pin with serial 0 serial input.
CMOS Schmitt input.
77 PD6/SCS0 Shared pin with serial 0 chip select input.
CMOS Schmitt input.
78 PD5/SCK1 Shared pin with serial 1 shift clock.
CMOS Schmitt input.
79 PD4/SO1 C Shared pin with serial 1 serial output. CMOS input.
80 PD3/SI1/INT2 F
Shared pin with serial 1 serial input and external interrupt 2.
CMOS Schmitt input.
81 PD2/SCK2 Shared pin with serial 2 shift clock.
CMOS Schmitt input.
82 PD1/SO2 C Shared pin with serial 2 serial output. CMOS input.
83 PD0/SI2 F Shared pin with serial 2 serial input.
CMOS Schmitt input.
84 PA7/AN-F/KEY7
EShared pins with analog inputs and key inputs.
CMOS Schmitt inputs
85 PA6/AN-E/KEY6
86 PA5/AN-D/KEY5
87 PA4/AN-C/KEY4
88 PA3/AN-B/KEY3
89 PA2/AN-A/KEY2
90 PA1/AN-9/KEY1
91 PA0/AN-8/KEY0
MB91191/192 Series
9
(Continued)
Pin No. Pin Name Circuit
Type Function
92 PB7/AN-7
DShared pins with analog inputs.
CMOS Schmitt inputs.
93 PB6/AN-6
94 PB5/AN-5
95 PB4/AN-4
96 PB3/AN-3
97 PB2/AN-2
98 PB1/AN-1
99 PB0/AN-0
100 AVDD A/D converter power supply pin
101 AVRH A/D converter reference power supply pin
102 AVSS A/D converter VSS pin
103 VSS VSS pin
104 P17/RTG4
CShared pins with RTG outputs.
CMOS inputs.
105 P16/RTG3
106 P15/RTG2
107 P14/RTG1
108 P13/RTG0
109 P12/EC5/INT1
F
Shared pin with timer 5 clock input and external interrupt input.
CMOS Schmitt input.
110 P11/EC4/INT0 Shared pin with timer 4 clock input and external interrupt input.
CMOS Schmitt input.
111 P10/PMSK Shared pin with PWC mask input. CMOS Schmitt input.
112 P07/EXI2/PMI
F
Shared pin with external capture input and PWC input.
CMOS Schmitt input.
113 P06/EXI1 Shared pin with external capture input.
CMOS Schmitt input.
114 P05/EXI0
115 P04/CFG Shared pin with capstan FG input. CMOS Schmitt input.
116 P03/DFG Shared pin with drum FG input. CMOS Schmitt input.
117 P02/DPG Shared pin with drum pulse input. CMOS Schmitt input.
118 P01/RFG0 Shared pins with reel FG inputs.
CMOS Schmitt inputs.
119 P00/RFG1
120 VDD Power supply pin
MB91191/192 Series
10
I/O CIRCUITS
(Continued)
Type Circuit Remarks
A
Oscillation feedback
resistor : 1 M approx.
B
CMOS Schmitt input
C
CMOS level output
CMOS input
No standby control
D
CMOS level output
CMOS input
with input control
Analog input
X0,OSCI
X1,OSCO
Clock input
Standby control signal
Input
Standby control signal = 1 (fixed)
Output data
Input
DC test
DC test
Input control
Output data
DC test
DC test
Analog input
CH selection
Digital input
MB91191/192 Series
11
(Continued)
Type Circuit Remarks
E
CMOS level output
CMOS Schmitt input
with input control
Analog input
F
CMOS level output
CMOS Schmitt input
No standby control
H
CMOS level output
CMOS Schmitt input
No standby control
Input control
Input data
DC test
DC test
Analog input
CH selection
Digital input
Standby control signal = 1 (fixed)
Output data
Input
DC test
DC test
Output data
Input
DC test
DC test
MB91191/192 Series
12
BLOCK DIAGRAM
P47
P46/PPG18
P45/PPG17
P44/PPG16
P43/PPG15
P42/PPG14
P41/PPG13
P40/PPG12
P87/PPG11
P86/PPG10
P85/PPG09
P84/PPG08
P83/PPG07
P82/PPG06
P81/PPG05
P80/PPG04
P94/PPG03
P93/PPG02
P92/PPG01
P91/PPG00
P90/P0
PD0/SI2
PD1/SO2
PD2/SCK2
PD3/SI1/INT2
PD4/SO1
PD5/SCK1
PD6/SCS0
PD7/SI0
PC0/S00
PC1/SCK0
PC2/PWM5/SCS1
PC3/PWM4/SCS2
PC4/PWM3
PC5/PWM2
PC6/PWM1
PC7/PWM0
PA7/AN-F/KEY7
PA6/AN-E/KEY6
PA5/AN-D/KEY5
PA4/AN-C/KEY4
PA3/AN-B/KEY3
PA2/AN-A/KEY2
PA1/AN-9/KEY1
PA0/AN-8/KEY0
PB7/AN-7
PB6/AN-6
PB5/AN-5
PB4/AN-4
PB3/AN-3
PB2/AN-2
PB1/AN-1
PB0/AN-0
MD0
MD1
MD2
RST
P37/D31
P30/D24
P27/D23
P20/D16
P57/A15
P50/A08
P60/RD
P61/WR0
P62/WR1
P63/ALE
P64
P65
P66/T501
P67/T40
P17/RTG4
P16/RTG3
P15/RTG2
P14/RTG1
P13/RTG0
P12/EC5/INT1
P11/EC4/INT0
P10/PMSK
P07/EXI2/PMI
P06/EXI1
P05/EXI0
P04/CFG
P03/DFG
P02/DPG
P01/RFG0
P00/RFG1
P70/XOUT
X0
X1
OSCI
OSCO
Mode control
Port 2/3
Port 5
Port 6
Port 7
Port 1
Port 0
OSC
OSC
FR20 CPU core
I-bus
I-bus
D-bus
D-bus
D-bus
C-bus
RAM 2 KB
External bus control
16-bit timers 0 to 3
8/16-bit timer
16-bit timer 4
8-bit PWC
Interrupt
controller
CFG
DFG
RFG0
RFG1
C-unit
10-bit programmable
prescaler
24-bit
FRC
FIFO
29-bit × 8
RAM 256 byte PPG0
PPG1
RAM 64 byte
Bit search
R-bus
RAM
128 byte Serial
ch 0
RAM
128 byte Serial
ch 1
RAM
128 byte Serial
ch 2
12-bit PWM00-02
12-bit PWM10-12
External interrupts
16-bit RTG0-2
External interrupts
(key inputs)
10-bit A/DC
FIFO
(software) FIFO
(hardware)
Port 4
Port 8/9Port C/DPort A/B
INT2 to INT0 (from port 1, D)
RTG4 to RTG0 (to port 1)
MB91191R
MB91192
MB91F191A
MB91F192
:RAM 6 KB
:RAM 8 KB
:RAM 6 KB
:RAM 8 KB
MB91191R
MB91192
MB91F191A
MB91F192
:ROM 254 KB
:ROM 384 KB
:FLASH 254 KB
:FLASH 384 KB
to
to
to
MB91191/192 Series
13
(Bus names)
I b us : 16-bit bus f or internal instructions. As the FR f amily of CPUs use the Harv ard architecture, instructions
and data use separate buses. A bus converter is connected to the I bus.
D bus : Internal 32-bit data bus. The internal peripherals are connected to the D bu s.
C bus : Inter nal multiplexed bus. Connected to the I and D bu ses via a switch. An external interface module
is connected to the C bus. Data and instructions are multiplexed on the external data bus.
R b us : Internal 16-bit data bus . The R bus connects to the D b us via an adapter. The I/O, clock oscillator, and
interrupt controller are connected to the R bus. As the R bus is only 16 bits wide, address and data
are multiplexed on the bus and therefore multiple cycles are required when the CPU accesses these
resources.
MB91191/192 Series
14
MEMORY MAP
I/O area
PPG0 Data RAM area
256 bytes
SIO0 Data RAM area
128 bytes
PPG1 Data RAM area
64 bytes
I/O area
I/O area
Access inhibited
SIO1 Data RAM area
128 bytes
SIO2 Data RAM area
128 bytes
Access inhibited
Access inhibited
Reset vector
External extended area
MB91191R
I/O area
PPG0 Data RAM area
256 bytes
SIO0 Data RAM area
128 bytes
PPG1 Data RAM area
64 bytes
I/O area
I/O area
Access inhibited
SIO1 Data RAM area
128 bytes
SIO2 Data RAM area
128 bytes
Access inhibited
Access inhibited
Access inhibited
Reset vector
External extended area
MB91192
1 KB
Initial vector area
Direct
access
area
00000000H
000001FFH
00000200H
000002FFH
00000300H
0000037FH
00000380H
000003BFH
000003C0H
000003FFH
00000400H
000007FFH
00000800H
00000FFFH
00001000H
0000107FH
00001080H
000010FFH
00001100H
0000E7FFH
0000E800H
0000FFFFH
00010000H
000BFFFFH
000C0000H
000C07FFH
000C0800H
000FFFFBH
000FFFFCH
00100000H
FFFFFFFFH
00000000H
000001FFH
00000200H
000002FFH
00000300H
0000037FH
00000380H
000003BFH
000003C0H
000003FFH
00000400H
000007FFH
00000800H
00000FFFH
00001000H
0000107FH
00001080H
000010FFH
00001100H
0000DFFFH
0000E000H
0000FFFFH
00010000H
0007FFFFH
00080000H
000807FFH
00080800H
0009FFFFH
000A0000H
000FFFFBH
000FFFFCH
00100000H
FFFFFFFFH
Internal RAM area
6 Kbytes Internal RAM area
8 Kbytes
Internal RAM area
2 Kbytes
Internal ROM area
384 Kbytes
Internal RAM area
2 Kbytes
Internal ROM area
254 Kbytes
to
to
to
to
to
to
to
to
to
to
to
to
to
to
to
to
to
to
to
to
to
to
to
to
to
to
to
to
to
to
to
Note : The single chip mode does not allow access to the external extended area.
For access to the external extended area, use the mode register to select
the internal ROM external bus mode.
MB91191/192 Series
15
FLASH MEMORY MAP AND SECTOR CONFIGURATION
Flash memor y is address-mapped differently between when accessed from the FR-CPU and when accessed
from the ROM programmer.* Shown below is address mapping at access from the CPU.
* : While the on-board flash memory uses the little endian format, the FR-CPU interface circuit converts data into
big endian. As this conversion function does not work during access from the ROM programmer, address mapping
is different from that in CPU mode.
MSB side 16 bit LSB side 16 bit
Flash Memory
area
Internal RAM area
Status resistor
FFFFFFFFH
000FFFFFH
000C0800H
000C0000H
000007C0H
00000000H
000FFFFFH
000F8003H
000F4003H
000F0003H
000E0003H
000C0803H
SA4 (16 Kbyte)
SA3 (8 Kbyte)
SA2 (8 Kbyte)
SA1 (32 Kbyte)
SA0 (63 Kbyte)
SA9 (16 Kbyte)
SA8 (8 Kbyte)
SA7 (8 Kbyte)
SA6 (32 Kbyte)
SA5 (63 Kbyte)
000FFFFCH
31 16 15 0
000F8000H
000F4000H
000F0000H
000E0000H
000C0800H000C0801H
000E0001H
000F0001H
000F8001H
000F4001H
000FFFFDH000FFFFEH
000F8002H
000F4002H
000F0002H
000E0002H
000C0802H
MSB side 16 bit LSB side 16 bit
Status resistor
Internal RAM area
Flash Memory
area
FFFFFFFFH
000FFFFFH
000A0000H
00080800H
00080000H
000007C0H
00000000H
000FFFFFH
000F4003H
000F0003H
000E0003H
000C0003H
000A0003H
31 16 15 0
SA5 (16 Kbyte)
SA4 (8 Kbyte)
SA3 (8 Kbyte)
SA2 (32 Kbyte)
SA1 (64 Kbyte)
SA0 (64 Kbyte)
SA11 (16 Kbyte)
SA10 (8 Kbyte)
SA9 (8 Kbyte)
SA8 (32 Kbyte)
SA7 (64 Kbyte)
SA6 (64 Kbyte)
000FFFFCH
000F8000H
000F4000H
000F0000H
000E0000H
000C0000H
000A0000H
000FFFFDH
000F8001H
000F4001H
000F0001H
000E0001H
000C0001H
000A0001H
000FFFFEH
000F4002H
000F0002H
000E0002H
000C0002H
000A0002H
000F8003H000F8002H
MB91F191A
MB91F192 Sector Configuration (SA = Sector address)
Memory Map
Sector Configuration (SA = Sector address)
Memory Map
MB91191/192 Series
16
ELECTRICAL CHARACTERISTICS
1. Absolute Maximu m Ratings (VSS = AVSS = 0 V)
*1 : Care must be taken that AVDD and AVRH do not exceed VDD + 0.3 V such as when turning on the device.
Also care must be taken that AVRH does not exceed AVDD.
*2 : VI and VO may not exceed VDD + 0.3 V.
*3 : The maximum output current is the peak value for a single pin.
*4 : The average output current is the average current for a single pin over a period of 100 ms.
*5 : The total average output current is the average current for all pins over a period of 100 ms.
WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current,
temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.
Parameter Symbol Rating Unit Remarks
Min Max
Power supply voltage VDD VSS 0.3 VSS + 3.5 V
Analog power supply voltage AVDD VSS 0.3 VSS + 3.5 V *1
Analog reference voltage AVRH VSS 0.3 VSS + 3.5 V *1
Input voltage VIVSS 0.3 VSS + 3.5 V *2
Output voltage VOVSS 0.3 VSS + 3.5 V *2
“L” level maximum output current IOL 10 mA *3
“L” level average output current IOLAV 8mA*4
“L” level total maximum output current ΣIOL 100 mA
“L” level total average output current ΣIOLAV 50 mA *5
“H” level maximum output current IOH −10 mA *3
“H” level average output current IOHAV −4mA*4
“H” level total maximum output current ΣIOH −50 mA
“H” level total average output current ΣIOHAV −20 mA *5
Power consumption PD500 mW
Operating temperature TA20 +70 °C
Storage temperature Tstg 55 +150 °C
MB91191/192 Series
17
2. Recommended Operating Conditions (VSS = AVSS = 0 V)
WARNING: The recommended operating conditions are required in order to ensure the normal operation of the
semiconductor device. All of the device’s electrical characteristics are warranted when the device is
operated within these ranges.
Always use semiconductor devices within their recommended operating condition ranges. Operation
outside these ranges may adversely affect reliability and could result in device failure.
No warranty is made with respect to uses, operating conditions, or combinations not represented on
the data sheet. Users considering application outside the listed conditions are advised to contact their
FUJITSU representatives beforehand.
Parameter Symbol Value Unit Remarks
Min Max
Power supply voltage VDD
2.7 3.3 VNormal operation
2.0 3.3 Maintaining RAM state in
stop mode
Analog power supply voltage AVDD VSS 0.3 VDD + 0.2 V
Analog reference voltage AVRH AVSS AVDD V
Operating temperature TA20 70 °C
MB91191/192 Series
18
3. DC Characteristics (VDD = 3.0 V ± 0.3 V, VSS = AVSS = 0 V, TA = 20 °C to +70 °C)
*1 : X0, X1, OSCI, OSCO
*2 : RST, PC3 to PC1, PD6, PD5, PD3, PD2, PA7 to PA0, P12 to P10, P07 to P00, PD7, PD0
*3 : Inputs other than *1, *2, MD2 to MD0
*4 : P07 to P00, P17 to P10, P27 to P20, P47 to P40, P67 to P60, P70, P87 to P80, P94 to P90, PA7 to PA0,
PB7 to PB0, PC7 to PC2, PD7, PD6, PD3, PD0
*5 : P37 to P30, P57 to P50
*6 : PD5, PD4, PD2, PD1, PC1, PC0
*7 : Operating current for X0 = 20 MHz, OSCI = VSS (fix ed) , all port outputs = low, gear selection : CPU = 10 MHz,
peripherals = 20 MHz
*8 : Operating current in sleep mode for X0 = 20 MHz, OSCI = VSS (fixed), all port outputs = low, gear selection :
CPU = 10 MHz, peripherals = 20 MHz
*9 : Operating current in stop mode for X0 = 20 MHz, OSCI = VSS (fixed) , all port outputs = low, gear selection :
CPU = 10 MHz, peripherals = 20 MHz
Parameter Symbol Pin Name Condition Value Unit Remarks
Min Typ Max
“H” level
input voltage
VIH *3 0.7 VDD VDD + 0.3 V
VIHS *1 VDD 0.4 VDD + 0.3 V
*2 0.8 VDD VDD + 0.3 V
VIHM MD2 to MD0 VDD VDD + 0.3 V
“L” level
input
voltage
VIL *3 VSS 0.3 0.2 VDD V
VILS *1 VSS 0.3 VSS + 0.4 V
*2 VSS 0.3 0.2 VDD V
VILM MD2 to MD0 VSS 0.3 VSS V
“H” level
output
voltage
VOH1 *4 VDD = 3.0 V,
IOH = 4.0 mA 2.4 V MB91F191A
2.4 V MB91191R
VOH2 *5, *6 VDD = 3.0 V,
IOH = 8.0 mA 2.4 V MB91F191A
2.4 V MB91191R
“L” level
output
voltage
VOL1 *4 VDD = 3.0 V,
IOL = 4.0 mA 0.6 V
VOL2 *5, *6 VDD = 3.0 V,
IOL = 8.0 mA 0.6 V
VOL3 *4, *5, *6 VDD = 3.0 V,
IOL = 1.0 mA 0.3 V MB91191R
Input leak
current ILI1 *2 VDD = 3.0 V,
VSS < VI < VDD
±1±5µA
ILIX X0, OSCI ±8±20 µA
Power
supply
current
IDD
VDD
VDD = 3.0 V, *7 50.1 60 mA MB91F191A
16 25 mA MB91191R
IDDS VDD = 3.0 V, *8 24 36 mA MB91F191A
13 18 mA MB91191R
IDDH VDD = 3.0 V,
TA = 25 °C, *9 1240µA MB91F191A
10 300 µA MB91191R
Input
capacitance CIN Other than VDD, VSS,
AVDD, AVSS, and AVRH 10 pF
MB91191/192 Series
19
4. AC Characteristics
(1) Clock Timings (VDD = 3.0 V ± 0.3 V, VSS = AVSS = 0 V, TA = 20 °C to +70 °C)
* : The frequency fluctuation value is the maximum percentage deviation from the preset center frequency when
using the multiplier (when PLL is locked) .
Parameter Symbol Condition Value Unit Remarks
Min Max
Clock frequency fC10 20 MHz
Clock cycle time tC50 100 ns
Frequency fluctuation* (PLL locked) r10 %
Input clock pulse width PWH 20 ns
PWL
Input clock rise/fall time tCR 8ns
tCF
Internal operating clock
frequency CPU fCP When wait
controller set to
1 wait cycle
520MHz
Peripherals fCPP 10 20 MHz
Internal operating clock
cycle time CPU tCP 50 200 ns
Peripherals tCPP 50 100 ns
f =Center frequency f0
−α
+
| α |
f0× 100 (%)
tc
PWH
tcf
PWL
tcr
Frequency (Hz)
Power supply voltage (V)
3.3
2.7
Guaranteed operation range
fcp
fcpp
10 M 20 M
MB91191/192 Series
20
The figure below shows the relationship between the X0 input and the inter nal clock based on the GCR (Gear
Control Register) , CHC, CCK1, and CCK0 bit settings.
Where tCYCH is the H level width of the internal clock and tCYCL is the L level width.
For example, when set to source oscillation × 1/2, gear × 1/4 and X0 input frequency = 20 MHz : tCYC = 400 ns,
tCYCH = 350 ns, tCYCL = 50 ns
CCK1/0:11
X0 input
Source oscillation × 1
(CHC bit in GCR = 0)
(a) gear × 1 Internal clock
CCK1/0:00
tCYC
tCYC
tCYC
tCYC
tCYC
tCYC
tCYC
tCYC
(b) gear × 1/2 Internal clock
Internal clock
Internal clock
CCK1/0:01
(c) gear × 1/4
Internal clock
CCK1/0:10
(d) gear × 1/8
CCK1/0:11
Source oscillation × 1/2
(CHC bit in GCR = 1)
(a) gear x 1 Internal clock
CCK1/0:00
(b) gear x 1/2
CCK1/0:01
(c) gear x 1/4 Internal clock
CCK1/0:10
(d) gear x 1/8 Internal clock
MB91191/192 Series
21
(2) Multiplex Bus Read/Write Operation (VDD = +3.0 V ± 0.3 V, VSS = AVSS = 0 V, TA = 20 °C to +70 °C)
*1 : When the bus is delayed by automatic wait insertion, add (tCYC × number of wait cycles) to this value.
*2 : This value is for gear setting = ×1
For the value for gear settings 1/2, 1/4, and 1/8, substitute 1/2, 1/4, and 1/8 respectively for n in the formula below .
Formula : tCYCH = (1 n / 2) × tCYC
tCYCL = (n / 2) × tCYC
Parameter Symbol Pin Name Condi-
tion Value Unit Re-
marks
Min Typ Max
ALE pulse width tEHEL ALE tCYC 10 ns
Address delay time tEHAV A15 to A0,
D31 to D16 tCYCH 15 tCYCH tCYCH + 15 ns *2
Address clear time tEHAX tCYCL 2tCYCL tCYCL + 10 ns *2
Data delay time tELDV D31 to D16 tCYCL + 26 ns *2
RD delay time tELRL RD tCYC 11 tCYC tCYC + 11 ns
RD pulse width tRLRH tCYC 11 tCYC tCYC + 11 ns *1
WR0, WR1 delay time tELWL WR0, WR1 tCYC 11 tCYC tCYC + 11 ns
WR0, WR1 pulse width tWLWH tCYC 11 tCYC tCYC + 11 ns *1
Data setup RD time tDSRH RD,
D31 to D16 15 ns
RD ↑→ Data hold time tRHDX 0ns
tWLWH
Internal
clock
ALE
Read time
D31 to D16
MPX bus
RD
Write time
D31 to D16
MPX bus
WR0 , WR1
A15 to A08
When not
multiplexed
tEHEL
tEHAV tELAX tDSRH tRHDX
tELRL tRLRH
tELDV tWHDX
tELWL
MB91191/192 Series
22
(3) Reset Input Ratings (VDD = 3.0 V ± 0.3 V, VSS = AVSS = 0 V, TA = 20 °C to +70 °C)
(4) Power-On Reset (VDD = 3.0 V ± 0.3 V, VSS = AVSS = 0 V, TA = 20 °C to +70 °C)
Parameter Symbol Pin Name Value Unit Remarks
Min Max
Reset input time tRSTL RST 5 tCP ns
Paramete Symbol Pin Name Value Unit Remarks
Min Max
Power supply rise time tRVDD 20 ms
Power supply cutoff time tOFF 2ms
0.2 VDD
RST
tRSTL
VDD
tR
2.7 V
0.2 V
tOFF
When turning on the power, start with
the RST pin in the "L" level state and
allow a time of tRSTL after reaching
the VDD power supply level before
changing the pin to the "H" level.
VDD 3.0 V
2.0 V
VSS
VDD
RST
Maintain RAM data
tRSTL
Recommended rate of voltage
rise is 50 mV/ms or less.
Sudden changes in the power supply voltage may cause a power-on reset.
The recommended practice if you wish to change the power supply voltage while the device is operating
is to raise the voltage smoothly.
MB91191/192 Series
23
(5) Serial I/O (CH0 to 2) (VDD = +3.0 V ± 0.3 V, VSS = AVSS = 0 V, TA = 20 °C to +70 °C)
Parameter Sym-
bol Condition Value Unit Remarks
Min Max
Serial clock cycle time tSCYC
Internal clock
8 tCPP ns
SCK SO delay time tSLOV 10 50 ns
Valid SI SCK tIVSH 50 ns
SCK valid SI hold time tSHIX 50 ns
Serial clock “H” pulse width tSHSL
External clock
4 tCPP 10 ns
Serial clock “L” pulse width tSLSH 4 tCPP 10 ns
SCK SO delay time tSLOV 050ns
Valid SI SCK tIVSH 50 ns
SCK valid SI hold time tSHIX 50 ns
Serial busy time tBUSY 6 tCPP ns
SCS SCK, SO delay time tCLZO 50 ns
SCS SCK input mask time tCLSL 3 tCPP ns
SCS SCK, SO Hi-Z time tCHOZ 50 ns
tSCYC
SCK
tSLOV
SO
SI
tIVSH tSHIX
tCLSL
tCLZO tSLSH
tSLOV
tSHSL tBUSY tCHOZ
SCK
SO
SI
tIVSH tSHIX
SCS
Internal shift clock mode
External shift clock mode
MB91191/192 Series
24
(6) FG Pulse Input (VDD = 3.0 V ± 0.3 V, VSS = AVSS = 0 V, TA = 20 °C to +70 °C)
Note : tC is the clock cycle time of the X0 and X1 pin oscillation.
(7) Timer External Clock Input (VDD = +3.0 V ± 0.3 V, VSS = AVSS = 0 V, TA = 20 °C to +70 °C)
Parameter Symbol Pin Name Value Unit Remarks
Min Max
Servo input “H” pulse width tSPWH CFG, DFG, DPG,
RFG0, RFG1,
EXI0 to EXI2
tC + 50 ns
Servo input “L” pulse width tSPWL tC + 50 ns
Parameter Symbol Pin Name Value Unit Remarks
Min Max
Timer 4 input “H” pulse width tECWH EC4 4 tC + 50 ns
Timer 4 input “L” pulse width tECWL 4 tC + 50 ns
Timer 5 input “H” pulse width tECWH EC5 4 tCPP ns
Timer 5 input “L” pulse width tECWL 4 tCPP ns
CFG
DFG, DPG
RFG0, RFG1
EXI0 to EXI2 tSPWH
tf
tSPWL
tr
EC4,
EC5
tr
tECWH
tf
tECWL
MB91191/192 Series
25
(8) General-Purpose Prescaler (VDD = 3.0 V ± 0.3 V, VSS = AVSS = 0 V, TA = 20 °C to +70 °C)
Parameter Symbol Pin Name Value Unit Remarks
Min Max
PCK input clock frequency fCP
PCK
12 MHz
PCK input “H” pulse width tSPWH 33 ns
PCK input “L” pulse width tSPWL 33 ns
PCK input Fall time tfPCK 100 ns
Rise time tr
PO output delay time tPOPI PO 80 ns
PCK
PO
tSPWH tftSPWL tr
tPOPI
MB91191/192 Series
26
5. Electrical Characteristics for the A/D Converter
(VDD = 3.0 V + 0.3 V, VSS = AVSS = 0 V, TA = 20 °C to +70 °C)
Notes : The relative error increases as |AVRH| becomes smaller.
Ensure that the output impedance of the external circuit connected to the analog input meets the following
condition :
Output impedance of external circuit < 7 k (approx.)
If the output impedance of the external circuit is too high, the analog voltage sampling time may be too
short. (Sampling time = 6.4 µs for a 20 MHz machine clock)
Parameter Symbol Pin
Name Condition Value Unit Remarks
Min Typ Max
Resolution  10 bit
Conversion time  8.4 µs
Total error 
VDD = AVDD = 3.0 V,
AVRH = 3.0 V
±4.0 LSB
Linearity error  ±3.5 LSB
Differential linearity error  ±2.0 LSB
Zero transition error VOT AN-0 to
AN-F VDD = AVDD = 3.0 V,
AVRH = 3.0 V
AVSS
1.5 AVSS +
0.5 AVSS +
2.5 LSB
Full-scale transition error VFST AN-0 to
AN-F AVRH
5.5 AVRH
1.5 AVRH +
0.5 LSB
Analog input current IAIN AN-0 to
AN-F 0.1 10 µA
Analog input voltage VAIN AN-0 to
AN-F AVSS AVRH V
Reference voltage AVRH AVRH AVDD V
Power
supply
current
During
conversion IAAVDD VDD = AVDD = 3.0 V 3.0 mA
Conver-
sion halted IAH 5.0 µA
Reference
voltage
supply
current
During
conversion IRAVRH VDD = AVDD = 3.0 V,
AVRH = 3.0 V
100 µA
Conver-
sion halted IRH 10 µA
Variation between
channels AN-0 to
AN-F 4LSB
MB91191/192 Series
27
6. Flash Memory Erase and Programming performance
Parameter Condition Value Unit Remarks
Min Typ Max
Sector erase time
TA = +25 °C,
VCC = 3.0 V
115s
Excludes 00H programming prior
erasure
Chip erase time 10 sMB91F191A Excludes 00H
programming prior
erasure
12 MB91F192
Half word
(16 bit width)
programming time 16 3,600 µs Excludes system-level overhead
Erase/Program
cycle 10,000 cycle
Data holding time 100,000 h
MB91191/192 Series
28
7. A/D Converter Glossary
Resolution : The change in analog voltage that can be recognized by the A/D converter.
Linearity error
The deviation between the actual conversion characteristics and the line linking the zero transition point
(“00 0000 0000B←→ “00 0000 0001B”) and the full scale transition point (“11 1111 1110B←→ “11 1111
1111B”) .
Differential linearity error
The variation from the ideal input voltage required to change the output code by 1 LSB.
Total error
The total error is the difference between the actual value and the theoretical value.
Includes the zero transition error, full-scale transition error and linearity error.
1 LSB’ (Theoretical) = [V]
Total error for digital output N =
VOT’ (Theoretical) = AVSS + 0.5 LSB’ [V]
VFST’ (Theoretical) = AVRH 1.5 LSB’ [V]
VNT : Voltage at which digital output changes from (N + 1) to N
AVRH AVSS
1024
VNT {1 LSB’ × (N 1) + 0.5 LSB’}
1 LSB’
1.5 LSB’
Digital Output
3FF
3FE
3FD
004
003
002
001
AVSS
0.5 LSB’
Theoretical characteristic
Actual conversion
characteristic
{1 LSB’ × (N 1) + 0.5 LSB’}
Actual conversion
characteristic
Total Error
AVRH
Analog Input
VNT
(Measured value)
MB91191/192 Series
29
= [LSB]
VOT’ (Theoretical) = [V]
VOT : Voltage at which digital output changes from (000) H to (001) H.
VFST : Voltage at which digital output changes from (3FE) H to (3FF) H.
VFST VOT
1022
= 1 LSB [LSB]
V (N+1) T VNT
1 LSB’
Differential linearity error
for digital output N
VNT {1 LSB × (N 1) + VOT}
1 LSB’
Linearity error for
digital output N
Digital Output
Digital Output
Analog Input
Linearity Error
AVSS AVRH Analog Input
AVSS AVRH
VOT (Measured value)
Theoretical characteristic
Actual conversion
characteristic
VNT
(Measured
value)
{1 LSB × (N 1) + VoT’}
Actual conversion characteristic
3FF
3FE
3FD
004
003
002
001
Differential Linearity Error
Actual conversion characteristic
V
NT
(Measured value)
Actual conversion characteristic
Theoretical characteristic
N + 1
N
N 1
N 2
VFST
(Measured
value)
V
FST
(Measured
value)
MB91191/192 Series
30
ORDERING INFOMATION
Part No. Package Remarks
MB91191RPFF
MB91192PFF
MB91F191APFF
MB91F192PFF
Plastic LQFP, 120-pin
(FPT-120P-M05)
MB91192LGA
MB91F192LGA Plastic FLGA, 144-pin
(LGA-144P-M02)
MB91191/192 Series
31
PACKAGE DIMENSION
(Continued)
Plastic LQFP, 120-pin
(FPT-120P-M05)
Note 1) * : These dimensions do not include resin protrusion.
Note 2) Pins width and pins thickness include plating thickness.
Note 3) Pins width do not include tie bar cutting remainder.
Dimensions in mm (inches).
C
2003 FUJITSU LIMITED F120006S-c-4-5
0.07(.003) M
INDEX
16.00±0.20(.630±.008)SQ
14.00±0.10(.551±.004)SQ
130
31
6091
120
6190
LEAD No.
(Stand off)
0.10±0.10
(.004±.004)
0.25(.010)
(.024±.006)
0.60±0.15
(.020±.008)
0.50±0.20
(Mounting height)
0~8˚
Details of "A" part
1.50 +0.20
–0.10
+.008
–.004
.059
"A"
0.40(.016) 0.16±0.03
(.006±.001) 0.145±0.055
(.006±.002)
0.08(.003)
*
MB91191/192 Series
32
(Continued)
Plastic FLGA, 144-pin
(LGA-144P-M02)
Dimensions in mm (inches).
C
2001 FUJITSU LIMITED L144002S-c-1-1
11.00±0.10
0.08(.003)
0.65(.026)TYP
INDEX AREA
9.10±0.10
A
1
0.45(.018)
0.45(.018)
144-ø0.35
(.358±.004)
0.08(.003) M
(144-ø.014)
(.433±.004)
(3-ø.018)
3-ø0.45
Max.
1.40(.055)
11.00±0.10(.433±.004)SQ
REF
5.175(.204)
2
3
4
5
6
7
8
9
10
11
12
13
14
15
BCDEFGHJKLMNPR
5.175
(.204)
MB91191/192 Series
FUJITSU LIMITED
All Rights Reserved.
The contents of this document are subject to change without notice.
Customers are advised to consult with FUJITSU sales
representatives before ordering.
The information, such as descriptions of function and application
circuit examples, in this document are presented solely for the
purpose of reference to show examples of operations and uses of
Fujitsu semiconductor device; Fujitsu does not warrant proper
operation of the device with respect to use based on such
information. When you develop equipment incorporating the
device based on such information, you must assume any
responsibility arising out of such use of the information. Fujitsu
assumes no liability for any damages whatsoever arising out of
the use of the information.
Any information in this document, including descriptions of
function and schematic diagrams, shall not be construed as license
of the use or exercise of any intellectual property right, such as
patent right or copyright, or any other right of Fujitsu or any third
party or does Fujitsu warrant non-infringement of any third-
partyÅfs intellectual property right or other right by using such
information. Fujitsu assumes no liability for any infringement of
the intellectual property rights or other rights of third parties which
would result from the use of information contained herein.
The products described in this document are designed, developed
and manufactured as contemplated for general use, including
without limitation, ordinary industrial use, general office use,
personal use, and household use, but are not designed, developed
and manufactured as contemplated (1) for use accompanying fatal
risks or dangers that, unless extremely high safety is secured, could
have a serious effect to the public, and could lead directly to death,
personal injury, severe physical damage or other loss (i.e., nuclear
reaction control in nuclear facility, aircraft flight control, air traffic
control, mass transport control, medical life support system, missile
launch control in weapon system), or (2) for use requiring
extremely high reliability (i.e., submersible repeater and artificial
satellite).
Please note that Fujitsu will not be liable against you and/or any
third party for any claims or damages arising in connection with
above-mentioned uses of the products.
Any semiconductor devices have an inherent chance of failure. You
must protect against injury, damage or loss from such failures by
incorporating safety design measures into your facility and
equipment such as redundancy, fire protection, and prevention of
over-current levels and other abnormal operating conditions.
If any products described in this document represent goods or
technologies subject to certain restrictions on export under the
Foreign Exchange and Foreign Trade Law of Japan, the prior
authorization by Japanese government will be required for export
of those products from Japan.
F0302
FUJITSU LIMITED Printed in Japan