V2
U-L-M photonics GmbH Phone: ++49 177 200 2974
Albert-Einstein-Allee 45 Fax: ++49 731 50 26021
89081 Ulm email: info@ulm-photonics.de
Germany www.ulm-photonics.de
1 for chip only
ELECTRO-OPTICAL-CHARACTERISTICS, (VCSEL CHIP)
PARAMETER SYMBOL UNITS MIN TYP MAX TEST CONDITIONS
Emission wavelengt h λR nm 835 850 860 T = 20°C
Threshold current ITH mA 1.5 2.5 T = 20°C
Threshold current variation ∆ITH mA 1.0 T = 0 .. 70°C
Threshold voltage UTH V 1.5 1.8 2.0
Laser current IOP mA 6 8.0 Popt = 3 mW 1
Laser voltage UOP V 2.0 Popt = 3 mW 1
Wallplug efficiency ηWP % 20 Popt = 3 mW 1
Slope efficiency W/A 0.2 0.5 0.7 T = 0 .. 70°C
Variation of slope efficiency W/A 0.2 T = 0 .. 70°C
Differential series resistance RS Ω 25 50 100 Popt = 3 mW 1
3dB modulation bandwidth ν3dB GHz 8 Popt = 3 mW 1
Rise and fall time tR/tF ps 40/60 10%..90%;
Poff=0.5mW, Pon=3.0mW
1
Relative intensity noise RIN dB/Hz-0.5 -130 -120 Popt = 3 mW @ 1 GHz
Wavelength tuning over current nm/mA 0.15 0.20
Wavelength tuning over temp. nm/K 0.07
Thermal resistance RTHERMAL K/mW 2
Beam divergence θ ° 15 25 35 Popt = 3 mW 1,
full width 1/e²
Spectral bandwidth ∆λ nm 2 rms
ABSOLUTE MAXIMUM RATINGS
Storage temperature -40 .. 85°C
Operating temperature 0 .. 70°C
Electrical power dissipation 30 mW
Continous forward current 12 mA
Revers e voltage 8V @ I = 10 µA
Soldering temperature 270°C
GEOMETRICAL SPECIFICATIONS
Chip area 250x250 µm²
Chip thickness 150 +/- 20 µm
Emission area centered on chip Φ < 15µm
Substrate side metallization VCSEL cathode
Top side metallization VCSEL anode
Warning:
Laser radiation, avoid
exposu re to b eam.
Class 3B laser product,
potenti a l eye h a zard .
• High speed up to 10 Gb/s
• High reliability
• Low current and voltage
• Lowest power consumption
• Single devices and linear arrays
Available on chip level,
array formats
or in TO18/46 can
850 nm multimode 1 x n, 10 Gbps
VCSEL for high speed data trans
V2
U-L-M photonics GmbH Phone: ++49 177 200 2974
Albert-Einstein-Allee 45 Fax: ++49 731 50 26021
89081 Ulm email: info@ulm-photonics.de
Germany www.ulm-photonics.de
Diagram:
Chip layout after dice (µm)
