Surface Mount RF PIN Diodes Technical Data HSMP-383x Series Features * Diodes Optimized for: Low Capacitance Switching Low Current Attenuator * Surface Mount SOT-23 Package Single and Dual Versions Tape and Reel Options Available Package Lead Code Identification (Top View) SINGLE SERIES #0 #2 COMMON ANODE COMMON CATHODE #3 #4 * Low Failure in Time (FIT) Rate[1] * Lead-free Option Available Note: 1. For more information see the Surface Mount PIN Reliability Data Sheet. Description/Applications The HSMP-383x series of general purpose PIN diodes are designed for two classes of applications. The first is attenuators where current consumption is the most important design consideration. The second application for this series of diodes is in switches where low capacitance is the driving issue for the designer. The HSMP-386x series Total Capacitance (CT) and Total Resistance (RT) are typical specifications. For applications that require guaranteed performance, the general purpose HSMP-383x series is recommended. A SPICE model is not available for PIN diodes as SPICE does not provide for a key PIN diode characteristic, carrier lifetime. 2 Absolute Maximum Ratings[1] TC = 25C Symbol If Pt Piv Tj TSTG Parameter Units Absolute Maximum Forward Current (1 ms Pulse) Total Device Dissipation Peak Inverse Voltage Junction Temperature Storage Temperature Amp mW [2] -- C C 1 250 Same as VBR 150 -65 to 150 Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to this device. 2. CW Power Dissipation at TLEAD = 25C. Derate to zero at maximum rated temperature. PIN General Purpose Diodes, Electrical Specifications TC = 25C Part Number HSMP- Package Marking Code[1] Lead Code Configuration 3830 3832 3833 3834 K0 K2 K3 K4 0 2 3 4 Single Series Common Anode Common Cathode Minimum Breakdown Voltage VBR (V) Maximum Series Resistance RS () Maximum Total Capacitance CT (pF) 200 1.5 0.3 VR = VBR Measure IR 10 mA IF = 100 mA f = 100 MHz VR = 50 V f = 1 MHz Test Conditions Typical Parameters at TC = 25C Part Number HSMP- Series Resistance RS () Carrier Lifetime (ns) Reverse Recovery Time Trr (ns) Total Capacitance CT (pF) 383x 20 500 80 0.20 @ 50 V IF = 1 mA f = 100 MHz IF = 50 mA IR = 250 mA VR = 10 V IF = 20 mA 90% Recovery Test Conditions Note: 1. Package marking code is white. 3 Typical Parameters at TC = 25C (unless otherwise noted), Single Diode 10 1 0.1 RF RESISTANCE (OHMS) TOTAL CAPACITANCE (pF) IF - FORWARD CURRENT (mA) 1000 0.35 100 0.30 1 MHz 0.25 100 MHz 0.20 1 GHz 100 10 1 125C 25C -50C 0.01 0.2 0.4 0.6 0.8 1.0 0.15 1.2 0 2 VF - FORWARD VOLTAGE (mA) 8 INPUT INTERCEPT POINT (dBm) 90 80 70 60 50 Diode Mounted as a Series Attenuator in a 115 50 Ohm Microstrip and Tested at 123 MHz 110 105 100 95 90 85 100 10 DIODE RF RESISTANCE () Figure 4. 2nd Harmonic Input Intercept Point vs. Diode RF Resistance for Attenuators. 1 10 30 IF - FORWARD BIAS CURRENT (mA) Figure 5. 2nd Harmonic Input Intercept Point vs. Forward Bias Current for Switches. 0.1 1 10 100 IF - FORWARD BIAS CURRENT (mA) 120 Diode Mounted as a 110 Series Attenuator in a 50 Ohm Microstrip 100 and Tested at 123 MHz 0.1 0.01 10 12 14 16 18 20 Figure 2. RF Capacitance vs. Reverse Bias. 120 INPUT INTERCEPT POINT (dBm) 6 REVERSE VOLTAGE (V) Figure 1. Forward Current vs. Forward Voltage. 40 1000 4 Figure 3. RF Resistance at 25C vs. Forward Bias Current. Trr - REVERSE RECOVERY TIME (nS) 0 1000 HSMP-3830 VR = 5V VR = 10V 100 VR = 20V 10 10 20 30 FORWARD CURRENT (mA) Figure 6. Reverse Recovery Time vs. Forward Current for Various Reverse Voltage. 4 Typical Applications for Multiple Diode Products RF COMMON RF COMMON RF 2 RF 1 RF 1 RF 2 BIAS 1 BIAS 2 Figure 7. Simple SPDT Switch, Using Only Positive Current. BIAS BIAS Figure 8. High Isolation SPDT Switch, Dual Bias. RF COMMON RF COMMON BIAS RF 1 RF 2 RF 2 RF 1 BIAS Figure 9. Switch Using Both Positive and Negative Current. Figure 10. Very High Isolation SPDT Switch, Dual Bias. 5 Typical Applications for Multiple Diode Products (continued) VARIABLE BIAS RF IN/OUT INPUT FIXED BIAS VOLTAGE Figure 11. Four Diode Attenuator. See AN1048 for details. BIAS Figure 12. High Isolation SPST Switch (Repeat Cells as Required). 6 Package Dimensions PC Board Footprints Outline 23 (SOT-23) SOT-23 1.02 (0.040) 0.89 (0.035) 0.54 (0.021) 0.37 (0.015) PACKAGE MARKING CODE (XX) 0.037 0.95 0.037 0.95 DATE CODE (X) 3 1.40 (0.055) 1.20 (0.047) XXX 0.079 2.0 2 1 0.60 (0.024) 0.45 (0.018) 2.65 (0.104) 2.10 (0.083) 2.04 (0.080) 1.78 (0.070) 0.035 0.9 TOP VIEW 0.031 0.8 0.152 (0.006) 0.066 (0.003) 3.06 (0.120) 2.80 (0.110) DIMENSIONS IN 1.02 (0.041) 0.85 (0.033) 0.69 (0.027) 0.45 (0.018) 0.10 (0.004) 0.013 (0.0005) SIDE VIEW END VIEW DIMENSIONS ARE IN MILLIMETERS (INCHES) Package Characteristics Lead Material ...................................................................................... Alloy 42 Lead Finish ............................................................................ Tin-Lead 85-15% Maximum Soldering Temperature .............................. 260C for 5 seconds Minimum Lead Strength .......................................................... 2 pounds pull Typical Package Inductance .................................................................. 2 nH Typical Package Capacitance .............................. 0.08 pF (opposite leads) Ordering Information Specify part number followed by option. For example: HSMP - 383x - XXX Bulk or Tape and Reel Option Part Number Surface Mount PIN Diode Profile Option Descriptions -BLK = Bulk -TR1 = 3K pc. Tape and Reel, Device Orientation; See Figure 13 -TR2 = 10K pc. Tape and Reel, Device Orientation; See Figure 13 Tape and Reeling conforms to Electronic Industries RS-481, "Taping of Surface Mounted Components for Automated Placement." For lead-free option, the part number will have the character "G" at the end, eg. -TR2G for a 10K pc lead-free reel. inches mm 7 Device Orientation For Outlines SOT-23 TOP VIEW REEL END VIEW 4 mm 8 mm ABC ABC ABC ABC CARRIER TAPE USER FEED DIRECTION Note: "AB" represents package marking code. "C" represents date code. Figure 13. Options -TR1, -TR2 for SOT-23 Packages. COVER TAPE Tape Dimensions and Product Orientation For Outline SOT-23 P P2 D E P0 F W D1 t1 Ko 9 MAX B0 A0 DESCRIPTION 13.5 MAX 8 MAX SYMBOL SIZE (mm) SIZE (INCHES) CAVITY LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER A0 B0 K0 P D1 3.15 0.10 2.77 0.10 1.22 0.10 4.00 0.10 1.00 + 0.05 0.124 0.004 0.109 0.004 0.048 0.004 0.157 0.004 0.039 0.002 PERFORATION DIAMETER PITCH POSITION D P0 E 1.50 + 0.10 4.00 0.10 1.75 0.10 0.059 + 0.004 0.157 0.004 0.069 0.004 CARRIER TAPE WIDTH THICKNESS W t1 8.00 +0.30 -0.10 0.229 0.013 0.315 +0.012 -0.004 0.009 0.0005 DISTANCE BETWEEN CENTERLINE CAVITY TO PERFORATION (WIDTH DIRECTION) F 3.50 0.05 0.138 0.002 CAVITY TO PERFORATION (LENGTH DIRECTION) P2 2.00 0.05 0.079 0.002 www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (65) 6756 2394 India, Australia, New Zealand: (65) 6755 1939 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (65) 6755 2044 Taiwan: (65) 6755 1843 Data subject to change. Copyright (c) 2004 Agilent Technologies, Inc. Obsoletes 5968-7688E March 24, 2004 5989-0484EN