Sep - 09
D25XB40 ........ D25XB100
25 Amp. Glass Passivated Bridge Rectifier
Maximum Ratings, according to IEC publication No. 134
VRRM Peak recurrent reverse voltage (V)
Maximum RMS Voltage (V)
IFSM 8.3 ms. peak forward surge current
(Jedec Method)
300 A
VRMS
TjOperating temperature range -55 to +150 °C
Junction-case. With Heatsink.
IF(AV) Max. Average forward current with heatsink
without heatsink
1 °C/W
Rth (j-c)
Tstg Storage temperature range -55 to +150 °C
Electrical Characteristics at Tamb = 25 °C
1.10 V
VF
Max. forward voltage drop per diode at IF = 25 A
IR
Max. instantaneous reverse current at VRRM
5 µA
400
280
600
420
800
560
D25XB
40 D25XB
60 D25XB
80
I2tCurrent squared time (rating for fusing)
(1ms.<t<10ms. Tc = 25°C)
373 A
2sec
Rth (j-a)
35 °C/W
1000
700
D25XB
100
Voltage
600 to 1000 V
Current
25 A
R
Junction-Ambient. Without Heatsink.
MAXIMUM THERMAL RESISTANCE
• Mounting Instructions
• High temperature soldering guaranteed: 260 ºC – 10 sc.
• Recommended mounting torque: 8 Kg.cm.
Plastic
Case
• Glass Passivated Junction Chips.
• The plastic material carries U/L recognition 94 V-O.
• Lead and polarity identifications.
• Case: Molded Plastic.
• Ideal for printed circuit board
• High surge current
V
DIS
Dielectric strength (terminals to case, AC 1 min.)
2500 V
25.0 A at Tc: 75 °C
3.2 A at 25 °C
.386(9.8)
1.193(30.3)
1.169(29.7)
.402(10.2)
.106(2.7)
.091(2.3)
.094(2.4)
.079(2.0)
.043(1.1)
.035(0.9)
.709(18.0)
.669(17.0)
.165(4.2)
.150(3.8)
.303
(7.7) .303
(7.7)
.287
(7.3) .287
(7.3)
.189(4.8)
.799(20.3)
.776(19.7)
.031(0.7)
.024(0.6)
.114(2.9)
.098(2.5)
.134(3.4)
.122(3.1)
.150(3.8)
.134(3.4)
.189(4.8)
.173(4.4)
.441(11.2)
.425(10.8)
C.118(3.0)
x45°
Rating And Characteristic Curves
Sep - 09
VF, instantaneous forward voltage (V)
IF, instantaneous forward current (A)
IF (AV), average forward rectified current (A)
TYPICAL FORWARD CHARACTERISTIC
Tamb, ambient temperature (°C)
FORWARD CURRENT DERATING CURVE
0
10
100
1
0.6 1.0 1.40 0 50 100 150 17512525 75
MAXIMUM NON-REPETITIVE PEAK
FORWARD SURGE CURRENT
Number of cycles at 50 Hz.
300
225
150
75
010 100
1
IFSM, peak forward surge current (A)
D
25
XB40 ........ D
25
XB100
25
15
10
5
0
20
heatsink
Tc Tc
sine wave
R-load
on heatsink
+
- ~ ~
Tamb = 25 °C
on glass-epoxi substrate
P.C.B.
soldering land 5 mm ø
sine wave
R-load
free in air
+
- ~ ~
