MPX2100AP - FREESCALE SEMICONDUCTOR

MPX2100

Rev 10, 10/2008

Freescale Semiconductor

Pressure

+100 kPa On-Chip Temperature

Compensated and Calibrated

Silicon Pressure Sensors

The MPX2100 series devices silicon piezoresistive pressure sensors

providing a highly accurate and line ar voltage output directly proportional to

the applied pressure. The sensor is a single, monolithic silicon diaphragm

with the strain gauge and a thin-film resistor network integrated on-chip.

The chip is laser trimme d for precise span and offset calibration an

temperature compensation.

Features

• Temperature Compensated Over 0°C to +85°C

• Available in Absolute, Differential and Gauge Configurations

• Easy to Use Chip Carrier Package Options

• Ratiometric to Supply Voltage

•±0.25% Linearity (MPX2100D Series)

ORDERING INFORMATION

Device Name Package

Options Case

No. # of Ports Pressure Type Device

Marking

None Single Dual Gauge Differential Absolute

Unibody Package (MPX2100 Series)

MPX2100A Tray 344 • • MPX2100A

MPX2100D Tray 344 • • MPX2100D

MPX2100AP Tray 344B • • MPX2100AP

MPX2100GP Tray 344B • • MPX2100GP

MPX2100DP Tray 344C • • MPX2100DP

MPX2100GVP Tray 344D • • MPX2100GVP

MPX2100ASX Tray 344F • • MPX2100A

MPX2100

Series

0 to 100 kPa (0 to 14.5 psi)

40 mV Full Scale Span

(Typical)

PACKAGES

MPX2100A/D

CASE 344-15 MPX2100AP/GP

CASE 344B-01 MPX2100DP

CASE 344C-01 MPX2100ASX

CASE 344F-01

MPX2100GVP

CASE 344D-01

Application Examples

• Pump/Motor Contro llers

• Robotics

• Level Indicators

• Medical Diagnostics

• Pressure Switching

• Barometers

MPX2100

Sensors

2Freescale Semiconductor

Pressure

Figure 1 shows a block diagram of the internal circuitry on the stand-alone pressure sensor chip.

Figure 1. Temperature Compen sated Pressure Sensor Sch ematic

Voltage Output versus Applied Differen tial Pressure

The differential voltage output of the sensor is directly

proportional to the differential pressure applied.

The absolute sensor has a built-in reference vacuum. The

output voltage will decrease as vacuum, relative to ambient,

is drawn on the pressure (P1) side.

The output voltage of the differential or gauge sensor

increases with increasing pressure applied to the pressure

side (P1) relative to the vacuum side (P2). Similarly, output

voltage increases as increasing vacuum is applied to the

vacuum side (P2) relative to the pressure side (P1).

Sensing

Element

Thin Film

Temperature

Compensation

and Calibration

Circuitry

+VOUT

-VOUT

GND

MPX2100

Sensors

Freescale Semiconductor 3

Pressure

Operating Characteristics

Table 1. Operating Characteristics

(VS = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2)

Characteristics Symbol Min Typ Max Unit

Pressure Range(1)

1. 1.0 kPa (kiloPascal) equals 0.145 psi.

POP 0—100kPa

Supply Voltage(2)

2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional

error due to device self-heating.

VS—1016Vdc

Supply Current Io—6.0—mAdc

Full Scale Span(3)

3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the

minimum rated pressure.

VFSS 38.5 40 41.5 mV

Offset(4)

MPX2100D Series

MPX2100A Series

4. Offset (Voff) is defined as the output voltage at the minimum rated pressure.

Voff -1.0

-2.0 —

—1.0

2.0 mV

Sensitivity ΔV/ΔP— 0.4 —mV/kPa

Linearity(5)

MPX2100D Series

MPX2100A Series

5. Accuracy (error budget) consists of the following:

Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified

pressure range.

Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and

from the minimum or maximum operating temperature points, with zero differential pressure applied.

Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum

or maximum rated pressure, at 25°C.

TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.

TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C.

—

—-0.25

-1.0 —

—0.25

1.0 %VFSS

Pressure Hysteresis(5) (0 to 100 kPa) ——±0.1 — %VFSS

Temperature Hysteresis(5) (-40°C to +125°C) ——±0.5 — %VFSS

Temperature Effect on Full Scale Span(5) TCVFSS -1.0 — 1.0 %VFSS

Temperature Effect on Offset(5) TCVoff -1.0 — 1.0 mV

Input Impedance Zin 1000 — 2500 Ω

Output Impedance Zout 1400 — 3000 Ω

Response Time(6) (10% to 90%)

6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a

specified step change in pressure.

tR—1.0—ms

Warm-Up ——20—ms

Offset Stability(7)

7. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.

——±0.5 — %VFSS

MPX2100

Sensors

4Freescale Semiconductor

Pressure

Maximum Ratings

LINEARITY

Linearity refers to how well a transducer's output follows

the equation: Vout = Voff + sensitivity x P over the operating

pressure range. There are two basic methods for calculating

nonlinearity: (1) end point straight line fit (see Figure 2) or (2)

a least squares best line fit. While a least squares fit gives the

“best case” linearity error (lower numerical value ) , th e

calculations required are burdensome.

Conversely , an end point fit will give the “worst case” error

(often more desirable in error budget calculations) and the

calculations are more straightforward for the user . Motorola's

specified pressure sensor linearities are based on the end

point straight line method measured at the midrange

pressure.

Figure 2. Linearity Specification Comparison

Table 2. Maximum Ratings(1)

1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.

Rating Symbol Value Unit

Maximum Pressure (P1 > P2) Pmax 400 kPa

Storage Temperature Tstg -40 to +125 °C

Operating Temperature TA-40 to +125 °C

Relative Voltage Output

Pressure (% Fullscale)

0 50 100

End Point

Straight Line Fit

Exaggerated

Performance

Curve

Least Squares Fit

Least

Square

Deviation

Straight Line

Deviation

Offset

MPX2100

Sensors

Freescale Semiconductor 5

Pressure

On-Chip Temperature Compensation and Calibration

Figure 3 shows the output characteristics of the

MPX2100 series at 25°C. The output is directly proportional

to the differential pressure and is essentially a straight line.

The effects of temperature on Full-Scale Span and Offset

are very small and are shown under Operating

Characteristics.

Figure 3. Output versus Pressure Differential

Figure 4. Cross-Sectional Diag ram (not to scale)

Figure 4 illustrates the absolute sensing configuration

(right) and the differential or gauge configuration in the basic

chip carrier (Case 344). A silicone gel isolates the die surface

and wire bonds from the environment, while allowing the

pressure signal to be transmitted to the silicon diaphragm.

The MPX2100 series pressure sensor operating

characteristics and internal reliability and quali fi c ation tests

are based on use of dry air as the pressure media. Media

other than dry air may have adverse effects on sensor

performance and long term reliability. Contact the factory for

information regarding media compatibility in your application.

Output (mVdc)

kPa

PSI

-5025

3.62 50

7.25 75

10.87 100

14.5

Offset

(Typ)

20 MAX

TYP

MIN

VS = 10 Vdc

TA = 25°C

P1 > P2

Span

Range

(Typ)

Silicone Gel

Die Coat Absolute

Die P1 Metal Cover Epoxy

Case

Absolute Element

Lead Frame

Wire Bond

Die

Bond

Stainless Steel

Lead Frame

Wire Bond

Differential/Gauge

Die

Silicone Gel

Die Coat

Differential/Gauge

P2 Die

Bond

Epoxy

Case

Stainless Steel

Metal Cover

Element

MPX2100

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6Freescale Semiconductor

Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

Freescale designates the two sides of the pressure sensor

as the Pressure (P1) side and the Vacuum (P2) side. The

Pressure (P1) side is the side containing the silicone gel

which isolates the die. The differential or gauge sensor is

designed to operate with positive differential pressure

applied, P1 > P2. The absolute sensor is designed for

vacuum applied to P1 side.

The Pressure (P1) side may be identified by using the

tab l e below:

Part Number Case Type Pressure (P1) Side Identifier

MPX2100A, MPX2100D 344 Stainless Steel Cap

MPX2100DP 344C Side with Part Marking

MPX2100AP, MPX2100GP 344B Side with Port Attached

MPX2100ASX 344F Side with Port Attached

MPX2100GVP 344D Stainless Steel Cap

MPX2100

Sensors

Freescale Semiconductor 7

Pressure

PACKAGE DIMENSIONS

NOTES:

DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

CONTROLLING DIMENSION: INCH.

DIMENSION -A- IS INCLUSIVE OF THE MOLD

STOP RING. MOLD STOP RING NOT TO EXCEED

16.00 (0.630).

0.136 (0.005) T

1234

PIN 1

D4 PL

SEATING

PLANE

-T-

B-A-

DAMBAR TRIM ZONE:

THIS IS INCLUDED

WITHIN DIM. "F" 8 PL

123

STYLE 1:

PIN 1. GROUND

2. + OUTPUT

3. + SUPPLY

4. - OUTPUT

STYLE 2:

PIN 1. VCC

2. - SUPPLY

3. + SUPPLY

4. GROUND

STYLE 3:

PIN 1. GND

2. -VOUT

3. VS

4. +VOUT

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A0.595 0.630 15.11 16.00

B0.514 0.534 13.06 13.56

C0.200 0.220 5.08 5.59

D0.016 0.020 0.41 0.51

F0.048 0.064 1.22 1.63

G0.100 BSC 2.54 BSC

J0.014 0.016 0.36 0.40

L0.695 0.725 17.65 18.42

M30˚ NOM 30˚ NOM

N0.475 0.495 12.07 12.57

R0.430 0.450 10.92 11.43

Y0.048 0.052 1.22 1.32

Z0.106 0.118 2.68 3.00

NOTES:

DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

CONTROLLING DIMENSION: INCH.

D4 PL

PORT #1

POSITIVE

PRESSURE

(P1)

PIN 1

-A-

-Q-

-P-

0.25 (0.010) T

0.13 (0.005) QS

12 34

SEATING

PLANE

-T-

STYLE 1:

PIN 1. GROUND

2. + OUTPUT

3. + SUPPLY

4. - OUTPUT

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A1.145 1.175 29.08 29.85

B0.685 0.715 17.40 18.16

C0.305 0.325 7.75 8.26

D0.016 0.020 0.41 0.51

F0.048 0.064 1.22 1.63

G0.100 BSC 2.54 BSC

H0.182 0.194 4.62 4.93

J0.014 0.016 0.36 0.41

K0.695 0.725 17.65 18.42

L0.290 0.300 7.37 7.62

N0.420 0.440 10.67 11.18

P0.153 0.159 3.89 4.04

Q0.153 0.159 3.89 4.04

R0.230 0.250 5.84 6.35

U0.910 BSC 23.11 BSC

0.220 0.240 5.59 6.10

CASE 344B-01

ISSUE B

UNIBODY PACKAGE

CASE 344-15

ISSUE AA

UNIBODY PACKAGE

MPX2100

Sensors

8Freescale Semiconductor

Pressure

PACKAGE DIMENSIONS

NOTES:

DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

CONTROLLING DIMENSION: INCH.

PORT #2

PORT #1

PORT #2

VACUUM

(P2) (P1)

SEATING

PLANE SEATING

PLANE

D4 PL

PORT #1

POSITIVE PRESSURE

-Q-

12 43

PIN 1

-P-

-T- -T- S

0.25 (0.010) T

0.13 (0.005) Q S

-A-

STYLE 1:

PIN 1. GROUND

2. + OUTPUT

3. + SUPPLY

4. - OUTPUT

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A1.145 1.175 29.08 29.85

B0.685 0.715 17.40 18.16

C0.405 0.435 10.29 11.05

D0.016 0.020 0.41 0.51

F0.048 0.064 1.22 1.63

G0.100 BSC 2.54 BSC

H0.182 0.194 4.62 4.93

J0.014 0.016 0.36 0.41

K0.695 0.725 17.65 18.42

L0.290 0.300 7.37 7.62

N0.420 0.440 10.67 11.18

P0.153 0.159 3.89 4.04

Q0.153 0.159 3.89 4.04

R0.063 0.083 1.60 2.11

U0.910 BSC 23.11 BSC

V0.248 0.278 6.30 7.06

W0.310 0.330 7.87 8.38

0.220 0.240 5.59 6.10

CASE 344C-01

ISSUE B

UNIBODY PACKAGE

NOTES:

DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

CONTROLLING DIMENSION: INCH.

-T-

PORT #1

POSITIVE

PRESSURE

(P1)

PIN 1

4 PL

-P-

0.25 (0.010) T

0.13 (0.005) Q S

-Q-

4321

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A1.080 1.120 27.43 28.45

B0.740 0.760 18.80 19.30

C0.630 0.650 16.00 16.51

D0.016 0.020 0.41 0.51

E0.160 0.180 4.06 4.57

F0.048 0.064 1.22 1.63

G0.100 BSC 2.54 BSC

J0.014 0.016 0.36 0.41

N0.070 0.080 1.78 2.03

P0.150 0.160 3.81 4.06

Q0.150 0.160 3.81 4.06

R0.440 0.460 11.18 11.68

S0.695 0.725 17.65 18.42

U0.840 0.860 21.34 21.84

V0.182 0.194 4.62 4.92

0.220 0.240 5.59 6.10

STYLE 1:

PIN 1. GROUND

2. V (+) OUT

3. V SUPPLY

4. V (-) OUT

CASE 344F-01

ISSUE B

UNIBODY PACKAGE

MPX2100

Sensors

Freescale Semiconductor 9

Pressure

PACKAGE DIMENSIONS

NOTES:

DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

CONTROLLING DIMENSION: INCH.

D4 PL

PORT #2

VACUUM

(P2) POSITIVE

PRESSURE

(P1)

PIN 1

-A-

-Q-

-P-

0.25 (0.010) T

0.13 (0.005) Q S

12 34

SEATING

PLANE

-T-

STYLE 1:

PIN 1. GROUND

2. + OUTPUT

3. + SUPPLY

4. - OUTPUT

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A1.145 1.175 29.08 29.85

B0.685 0.715 17.40 18.16

C0.305 0.325 7.75 8.26

D0.016 0.020 0.41 0.51

F0.048 0.064 1.22 1.63

G0.100 BSC 2.54 BSC

H0.182 0.194 4.62 4.93

J0.014 0.016 0.36 0.41

K0.695 0.725 17.65 18.42

L0.290 0.300 7.37 7.62

N0.420 0.440 10.67 11.18

P0.153 0.159 3.89 4.04

Q0.153 0.158 3.89 4.04

R0.230 0.250 5.84 6.35

U0.910 BSC 23.11 BSC

0.220 0.240 5.59 6.10

CASE 344D-01

ISSUE B

UNIBODY PACKAGE

MPX2100

Rev. 10

10/2008

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