IC Sockets XR2 111
IC Sockets
XR2
OMRON’s IC Connectors Have Excellent
Reliability and Can Tolerate Momentary
Interruptions in Power.
• Round pins and 4-point (4-finger) contact construction with
contact entry holes that are large for easy insertion.
• IC lead contacts placed high for solid connections.
• A wide product range: open-frame, closed-frame, single-
row, carrier-type DIP terminals, wrap terminals, solder-
sleeve terminals, and low-profile DIP terminals.
• Conforms to UL standards (file no. E 103202) and CSA
standards (file no. LR 62678).
■Construction ■Contact Dimensions
■Ratings and Characteristics
Note: The contact insertion force and contact removal force are for a
test gauge, t = 0.432 mm.
■Materials and Finish
Note: For non-standard plating, contact your OMRON representative.
■
Applicable Wrap Post Wire Sizes
AWG30, AWG28, AWG26, AWG24
(Solid wire: 0.25 to 0.51 mm dia.)
■Wrap Post Length
3 wires
■Applicable IC Lead Dimensions
DIP, Wrap, and Solder-sleeve Terminals
Note: Do not use wire where the diagonal is more than 0.56 mm.
Low-profile DIP Terminals
Note: Do not use wire where the diagonal is more than 0.52 mm.
Inner clip
Base
Outer sleeve
Carrier
Inner clip
Outer sleeve
1.83 dia.
0.51 dia.
1.83 dia.
0.635 0.635
1.83 dia.
0.79 dia.
1.83 dia.
1.35 dia.
DIP
Terminals
Wrap
Terminals
Low-profile DIP
Terminals
Solder-sleeve
Terminals
Item Gold plated Gold flash plated
Rated current 1 A
Rated voltage 300 VAC
Contact resistance 20 mΩ max. (at 20 mV, 100 mA max.)
Insulation resistance 1,000 MΩ min. (at 500 VDC)
Dielectric strength 1,000 VAC for 1 min (leakage current: 1 mA max.)
Contact insertion
(See note.)
400 gf (3.92 N) max.
Contact removal
(See note.)
65 gf (0.64 N) min. with gold plating or with solder plating
Insertion durability
100 times (0.75-
μ
m gold plating),
50 times (0.25-
μ
m gold plating)
20 times
Ambient temperature Operating: –55 to 125°C (with no icing)
Base Fiber-glass reinforced PBT resin (UL94V-0)/black
Carrier Aluminum
Inner clip Beryllium copper/nickel base, gold plated
Outer sleeve Brass/nickel base, gold flash plating
Depth × width (mm)
Flat lead 0.29 ±0.09 × 0.46 ±0.08 (See note.)
Round lead 0.53 dia. max. 0.41 dia. min.
Depth × width (mm)
Flat lead 0.29 ±0.09 × 0.46 ±0.08 (See note.)
Round lead 0.50 dia. max. 0.41 dia. min.