1.6X0.8mm SMD CHIP LED LAMP Part Number: APT1608SYCK-AMT Super Bright Yellow Description Features The Super Bright Yellow device is made with AlGaInP z High reliability LED package. (on GaAs substrate) light emitting diode chip. z 1.6mmx0.8mm SMT LED,0.75mm thickness z Low power consumption. z Wide viewing angle. Applications z Ideal for backlight and indicator. z Traffic signaling. z Various colors and lens types available. z Backlighting (illuminated advertising , general lighting). z Package: 2000pcs / reel . z Interior and exterior automotive lighting. z Moisture sensitivity level : level 3. z Substitution of micro incandescent lamps. z RoHS compliant. z Reading lamps. z Signal and symbol luminaire for orientation. z Marker lights (e.g. Steps, exit ways, etc). z Decorative and entertainment lighting. z Indoor and outdoor commercial and residential architectural lighting. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.1(0.004") unless otherwise noted. 3. The specifications, characteristics and technical data described in the datasheet are subject to change without notice. 4. The device has a single mounting surface. The device must be mounted according to the specifications. SPEC NO: DSAI6419 REV NO: V.4 DATE: JUN/15/2011 PAGE: 1 OF 6 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: C.H.HAN ERP: 1203007538 Selection Guide Part No. Dice APT1608SYCK-AMT Iv (mcd) [2] @ 20mA Lens Type Super Bright Yellow (AlGaInP) Viewing Angle [1] Code. Min. Max. M 80 120 N 120 200 P 200 300 Water Clear 21/2 120 Notes: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value. 2. Luminous intensity/ luminous Flux: +/-15%. Absolute Maximum Ratings at Ta=25C Parameter Symbol Value Unit Power dissipation PD 75 mW Reverse Voltage VR 5 V Junction temperature TJ 120 C Operating Temperature Top -40 To +100 C Storage Temperature Tstg -40 To +120 C IF 30 mA IFM 175 mA 3000 V 350 C/W DC Forward Current[1] Peak Forward Current [2] Electrostatic Discharge Threshold (HBM) Thermal Resistance (Junction/ambient) [1] Rth j-a Notes: 1. Rth(j-a) Results from mounting on PC board FR4 (pad size16 mm 2 per pad), 2. 1/10 Duty Cycle, 0.1ms Pulse Width. Electrical / Optical Characteristics at Ta=25C Parameter Symbol Wavelength at peak emission Dominant Wavelength Spectral bandwidth at 50% Forward Voltage IF=20mA IF=20mA REL MAX IF=20mA IF=20mA Value Code. Min. peak dom [1] Typ. Max. 590 nm 2 584 586 3 586 588 4 588 590 5 590 592 20 VF [2] 2.0 Unit nm nm 2.5 V 10 uA Reverse Current (VR = 5V) IR Temperature coefficient of peak IF=20mA, -10 C T100 C TC peak 0.13 nm/ C Temperature coefficient of dom IF=20mA, -10 C T100 C TC dom 0.04 nm/ C Temperature coefficient of VF IF=20mA, -10 C T100 C TCV -1.9 mV/ C Notes: 1.The dominant Wavelength ( d) above is the setup value of the sorting machine. (Tolerance d : 1nm. ) 2. Forward Voltage: +/-0.1V. SPEC NO: DSAI6419 REV NO: V.4 DATE: JUN/15/2011 PAGE: 2 OF 6 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: C.H.HAN ERP: 1203007538 Super Bright Yellow APT1608SYCK-AMT SPEC NO: DSAI6419 REV NO: V.4 DATE: JUN/15/2011 PAGE: 3 OF 6 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: C.H.HAN ERP: 1203007538 APT1608SYCK-AMT Reflow soldering is recommended and the soldering profile is shown below. Other soldering methods are not recommended as they might cause damage to the product. Recommended Soldering Pattern (Units : mm; Tolerance: 0.1) Tape Specifications (Units : mm) Reel Dimension SPEC NO: DSAI6419 REV NO: V.4 DATE: JUN/15/2011 PAGE: 4 OF 6 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: C.H.HAN ERP: 1203007538 PACKING & LABEL SPECIFICATIONS APT1608SYCK-AMT SPEC NO: DSAI6419 REV NO: V.4 DATE: JUN/15/2011 PAGE: 5 OF 6 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: C.H.HAN ERP: 1203007538 Reliability Test Items And Conditions The reliability of products shall be satisfied with items listed below Lot Tolerance Percent Defective (LTPD) : 10% No. Test Item Standards Test Times / Number of Cycles Damaged Test Condition 1 Continuous operating test - Ta =25C ,IF = maximum rated current* 1,000 h 0 / 22 2 High Temp. operating test EIAJ ED4701/100(101) Ta = 100C IF = maximum rated current* 1,000 h 0 / 22 3 Low Temp. operating test - Ta = -40C, IF = maximum rated current* 1,000 h 0 / 22 4 High temp. storage test EIAJ EDTa = maximum rated storage temperature 4701/100(201) 1,000 h 0 / 22 5 Low temp. storage test EIAJ ED4701/100(202) Ta = -40C 1,000 h 0 / 22 6 High temp. & humidity storage test EIAJ ED4701/100(103) Ta = 60C, RH = 90% 1,000 h 0 / 22 7 High temp. & humidity operating test EIAJ ED4701/100(102) Ta = 60C, RH = 90% IF = maximum rated current* 1,000 h 0 / 22 8 Soldering reliability test EIAJ ED4701/100(301) Moisture soak : 30C,70% RH, 72h Preheat : 150~180C(120s max.) Soldering temp : 260C(10s) 3 times 0 / 18 9 Thermal shock operating test - Ta = -40C(15min) ~ 100C(15min) IF = derated current at 100C 1,000 cycles 0 / 22 10 Thermal shock test - Ta = -40C(15min) ~ maximum rated storage temperature(15min) 1,000 cycles 0 / 22 11 Electric Static Discharge (ESD) EIAJ ED4701/100(304) C = 100pF , R2 = 1.5K V = 3000V Once each Polarity 0 / 22 12 Vibration test - a = 196m/s , f = 100~2KHz , t = 48min for all xyz axes 4 times 0 / 22 * : Refer to forward current vs. derating curve diagram Failure Criteria Items Symbols Conditions Failure Criteria luminous Intensity lv IF = 20mA Testing Min. Value