INTEGRATED CIRCUITS NE/SA/SE5532/5532A Internally-compensated dual low noise operational amplifier Product specification IC11 Data Handbook 1997 Sept 29 Philips Semiconductors Product specification Internally-compensated dual low noise operational amplifier DESCRIPTION NE/SA/SE5532/5532A PIN CONFIGURATIONS The 5532 is a dual high-performance low noise operational amplifier. Compared to most of the standard operational amplifiers, such as the 1458, it shows better noise performance, improved output drive capability and considerably higher small-signal and power bandwidths. FE, N, D8 Packages This makes the device especially suitable for application in high-quality and professional audio equipment, instrumentation and control circuits, and telephone channel amplifiers. The op amp is internally compensated for gains equal to one. If very low noise is of prime importance, it is recommended that the 5532A version be used because it has guaranteed noise voltage specifications. 8 V+ OUTPUT A 1 INVERTING INPUT A 2 NON-INVERTING INPUT A 3 6 INVERTING INPUT B V- 4 5 NON-INVERTING INPUT B A 7 OUTPUT B B TOP VIEW D Package1 FEATURES * Small-signal bandwidth: 10MHz * Output drive capability: 600, 10VRMS * Input noise voltage: 5nV Hz (typical) * DC voltage gain: 50000 * AC voltage gain: 2200 at 10kHz * Power bandwidth: 140kHz * Slew rate: 9V/s * Large supply voltage range: 3 to 20V * Compensated for unity gain -INA 1 16 NC +INA 2 15 NC NC 3 14 NC -VCC 4 13 OUTA NC 5 12 +VCC NC 6 11 OUTB +INB 7 10 NC -INB 8 9 NC TOP VIEW NOTE: 1. SOL and non-standard pinout. SL00332 Figure 1. Pin Configurations ORDERING INFORMATION TEMPERATURE RANGE ORDER CODE DWG # 8-Pin Plastic Dual In-Line Package (DIP) DESCRIPTION 0 to 70C NE5532N SOT97-1 8-Pin Plastic Dual In-Line Package (DIP) -40C to +85C SA5532N SOT97-1 8-Pin Plastic Dual In-Line Package (DIP) -40C to +85C SA5532AN SOT97-1 8-Pin Ceramic Dual In-Line Package (CERDIP) 0 to 70C NE5532FE 0580A 8-Pin Plastic Dual In-Line Package (DIP) 0 to 70C NE5532AN SOT97-1 8-Pin Ceramic Dual In-Line Package (CERDIP) 0 to 70C NE5532AF 0580A 8-Pin Ceramic Dual In-Line Package (CERDIP) -55C to +125C SE5532FE 0580A 8-Pin Ceramic Dual In-Line Package (CERDIP) -55C to +125C SE5532AF 0580A 8-Pin Small Outline Package (SO) 0 to 70C NE5532AD8 SOT96-1 8-Pin Small Outline Package (SO) -40C to 85C SA5532D8 SOT96-1 8-Pin Small Outline Package (SO) -40C to 85C SA5532AD8 SOT96-1 8-Pin Small Outline Package (SO) -55C to +125C SE5532AD8 SOT96-1 8-Pin Small Outline Package (SO) 0 to 70C NE5532D8 SOT96-1 8-Pin Small Outline Package (SO) -40C to 85C SA5532D8 SOT96-1 8-Pin Small Outline Package (SO) -40C to 85C SA5532AD8 SOT96-1 8-Pin Small Outline Package (SO) -55C to +125C SE5532D8 SOT96-1 0 to 70C NE5532D SOT162-1 -55C to +125C SE5532N SOT38-4 16-Pin Plastic Small Outline Large (SOL) Package 16-Pin Plastic Dual In-Line Package (DIP) 1997 Sept 29 2 853-0949 16639 Philips Semiconductors Product specification Internally-compensated dual low noise operational amplifier NE/SA/SE5532/5532A EQUIVALENT SCHEMATIC (EACH AMPLIFIER) + _ SL00333 Figure 2. Equivalent Schematic (Each Amplifier) ABSOLUTE MAXIMUM RATINGS SYMBOL PARAMETER RATING UNIT 22 V VSUPPLY V 0.5 V Operating temperature range SA5532/A NE5532/A SE5532/A -40 to +85 0 to 70 -55 to +125 C C C TSTG Storage temperature -65 to +150 C TJ Junction temperature 150 C PD Maximum power dissipation, TA=25C (still-air)2 8 D8 package 8 N package 8 FE package 16 D package 780 1200 1000 1200 mW mW mW mW Lead soldering temperature (10sec max) 300 C VS Supply voltage VIN Input voltage VDIFF Differential input voltage1 TA TSOLD NOTES: 1. Diodes protect the inputs against over-voltage. Therefore, unless current-limiting resistors are used, large currents will flow if the differential input voltage exceeds 0.6V. Maximum current should be limited to 10mA. 2. Thermal resistances of the above packages are as follows: N package at 100C/W F package at 135C/W D package at 105C/W D8 package at 160C/W 1997 Sept 29 3 Philips Semiconductors Product specification Internally-compensated dual low noise operational amplifier NE/SA/SE5532/5532A DC ELECTRICAL CHARACTERISTICS TA=25C VS=15V, unless otherwise specified. 1, 2, 3 SYMBOL VOS PARAMETER TEST CONDITIONS SE/5532/5532A Min Offset voltage Typ Max 0.5 Over temperature VOS/T IOS Min IOS/T Max 2 3 0.5 4 5 mV mV V/C 100 200 10 150 200 nA nA pA/C 800 1000 nA nA nA/C 16 mA 5 200 Input current 200 Over temperature IB/T 200 400 700 200 5 8 UNIT Typ 5 Offset current Over temperature IB NE/SA/5532/5532A 5 10.5 8 ICC Supply current VCM Common-mode input range 12 13 12 13 V CMRR Common-mode rejection ratio 80 100 70 100 dB PSRR Power supply rejection ratio 50 25 40 20 100 25 15 15 10 100 Large-signal voltage gain RL2k, VO=10V Over temperature RL600, VO=10V Over temperature VOUT Output Out ut swing RL600 Over temperature RL600, VS=18V Over temperature RL2k Over temperature 12 10 15 12 13 12 13 12 16 14 13.5 12.5 12 10 15 12 13 10 13 12 16 14 13.5 12.5 RIN Input resistance 30 300 30 300 ISC Output short circuit current 10 38 10 38 Over temperature AVOL 13 10 mA 50 50 60 10 100 V/V V/mV V/mV V/mV V/mV 50 V k 60 mA NOTES: 1. Diodes protect the inputs against overvoltage. Therefore, unless current-limiting resistors are used, large currents will flow if the differential input voltage exceeds 0.6V. Maximum current should be limited to 10mA. 2. For operation at elevated temperature, derate packages based on the package thermal resistance. 3. Output may be shorted to ground at VS=15V, TA=25C Temperature and/or supply voltages must be limited to ensure dissipation rating is not exceeded. AC ELECTRICAL CHARACTERISTICS TA=25C VS=15V, unless otherwise specified. SYMBOL ROUT PARAMETER Output resistance Overshoot AV Gain GBW Gain bandwidth product SR Slew rate Power bandwidth 1997 Sept 29 TEST CONDITIONS NE/SA/SE5532/5532A Min Typ Max UNIT AV=30dB Closed-loop f=10kHz, RL=600 0.3 Voltage-follower VIN=100mVP-P CL=100pF, RL=600 10 % f=10kHz 2.2 V/mV CL=100pF, RL=600 10 MHz 9 V/s 140 100 kHz kHz VOUT=10V VOUT=14V, RL=600, VCC=18V 4 Philips Semiconductors Product specification Internally-compensated dual low noise operational amplifier NE/SA/SE5532/5532A ELECTRICAL CHARACTERISTICS TA=25C VS=15V, unless otherwise specified. SYMBOL PARAMETER NE/SE5532 TEST CONDITIONS Min Typ NE/SA/SE5532A Max Min Typ Max 12 6 UNIT VNOISE Input noise voltage fO=30Hz fO=1kHz 8 5 8 5 nV/Hz nV/Hz INOISE Input noise current fO=30Hz fO=1kHz 2.7 0.7 2.7 0.7 pA/Hz pA/Hz Channel separation f=1kHz, RS=5k 110 110 dB TYPICAL PERFORMANCE CHARACTERISTICS Closed-Loop Frequency Response Open-Loop Frequency Response Large-Signal Frequency Response 60 120 40 TYPICAL VALUES TYPICAL VALUES VS = +15V TYPICAL VALUES RF = 10k; RE = 100 40 GAIN (dB) GAIN (dB) 80 40 30 RF = 9k; RE = 1k (V) Vo(p-p) 20 RF = 1k; RE = 0 10 0 -40 20 0 102 103 104 105 106 107 -20 10 102 103 104 105 106 107 103 104 105 106 f (Hz) 107 108 f (Hz) f (Hz) Output Short-Circuit Current Input Commom-Mode Voltage Range Input Bias Current 80 1,4 30 VS = +15V VS = +15V 60 TYPICAL VALUES 1,2 20 IO 40 (mA) II (mA) TYP 0,8 VIN (V) 10 20 0,4 0 -55 -25 0 0 25 50 75 100 +125 -55 -25 0 25 TA (oC) 50 75 100 +125 TA (oC) Supply Current 0 0 10 20 Vp; -VN (V) Input Noise Voltage Density 6 10-2 IO = 0 10 TYP 4 TYP IP IN (nV Hz) 1 (mA) 2 10-1 10-2 0 0 10 10 102 103 104 f (Hz) 20 SL00334 Vp; -VN (V) Figure 3. Typical Performance Characteristics 1997 Sept 29 5 Philips Semiconductors Product specification Internally-compensated dual low noise operational amplifier NE/SA/SE5532/5532A TEST CIRCUITS + V+ 5532 (1/2) RS 25 5532 - VOUT - + VIN RF 1k 100pF V- VI RE 100pF 600 800 Voltage-Follower Closed-Loop Frequency Response SL00335 Figure 4. Test Circuits 1997 Sept 29 6 Philips Semiconductors Product specification Internally-compensated dual low noise operational amplifier DIP8: plastic dual in-line package; 8 leads (300 mil) 1997 Sept 29 NE/SA/SE5532/5532A SOT97-1 7 1997 Sept 29 853-0580A 006688 8 SEATING PLANE -T- -D- PIN # 1 0.023 (0.58) 0.015 (0.38) 0.070 (1.78) 0.050 (1.27) 0.408 (10.36) 0.376 (9.55) T E D 0.010 (0.254) 0.165 (4.19) 0.125 (3.18) 0.200 (5.08) 0.165 (4.19) 0.100 (2.54) BSC 0.303 (7.70) 0.245 (6.22) 0.055 (1.40) 0.030 (0.76) 0.015 (0.38) 0.010 (0.25) 0.035 (0.89) 0.020 (0.51) 0.175 (4.45) 0.145 (3.68) Internally-compensated dual low noise operational amplifier 0.395 (10.03) 0.300 (7.62) BSC 0.300 (7.62) (NOTE 4) 0.320 (8.13) 0.290 (7.37) (NOTE 4) 5. Pin numbers start with Pin #1 and continue counterclockwise to Pin #8 when viewed from the top. 2. Dimension and tolerancing per ANSI Y14. 5M-1982. 3. "T", "D", and "E" are reference datums on the body and include allowance for glass overrun and meniscus on the seal line, and lid to base mismatch. 4. These dimensions measured with the leads constrained to be perpendicular to plane T. NOTES: 1. Controlling dimension: Inches. Millimeters are shown in parentheses. 0580A -E- 0.055 (1.40) 0.030 (0.76) Philips Semiconductors Product specification NE/SA/SE5532/5532A 8-PIN (300 mils wide) CERAMIC DUAL IN-LINE (F) PACKAGE Philips Semiconductors Product specification Internally-compensated dual low noise operational amplifier SO8: plastic small outline package; 8 leads; body width 3.9mm 1997 Sept 29 9 NE/SA/SE5532/5532A SOT96-1 Philips Semiconductors Product specification Internally-compensated dual low noise operational amplifier SO16: plastic small outline package; 16 leads; body width 7.5 mm 1997 Sept 29 10 NE/SA/SE5532/5532A SOT162-1 Philips Semiconductors Product specification Internally-compensated dual low noise operational amplifier DIP16: plastic dual in-line package; 16 leads (300 mil) 1997 Sept 29 11 NE/SA/SE5532/5532A SOT38-4 Philips Semiconductors Product specification Internally-compensated dual low noise operational amplifier NE/SA/SE5532/5532A DEFINITIONS Data Sheet Identification Product Status Definition Objective Specification Formative or in Design This data sheet contains the design target or goal specifications for product development. Specifications may change in any manner without notice. Preliminary Specification Preproduction Product This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Product Specification Full Production This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes at any time without notice, in order to improve design and supply the best possible product. Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. LIFE SUPPORT APPLICATIONS Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices, or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale. Copyright Philips Electronics North America Corporation 1997 All rights reserved. Printed in U.S.A. Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088-3409 Telephone 800-234-7381 print code Document order number: 1997 Sept 29 12 Date of release: 04-96 9397 750 01699