CBT3306PW,118 - NXP Semiconductors

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CBT3306

Dual bus switch

Product data

File under Integrated Circuits — ICL03

2001 Nov 08

INTEGRATED CIRCUITS

Philips Semiconductors Product data

CBT3306Dual bus switch

2001 Nov 08 853-2304 27313

FEATURES

•5 Ω switch connection between two ports

•TTL-compatible input levels

•Package options include plastic small outline (SO) and

thin shrink small outline (TSSOP)

•Latch-up protection exceeds 100 mA per JESD78

•ESD protection exceeds 2000 V HBM per JESD22-A114 and

1000 V CDM per JESD22-C101

DESCRIPTION

The CBT3306 Dual FET Bus Switch features independent line

switches. Each switch is disabled with the associated Output Enable

(OE) input is high.

The CBT3306 is characterized for operation from –40 to +85 °C.

PIN CONFIGURATION

1OE

GND

VCC

2OE

SA00535

PIN DESCRIPTION

PIN NUMBER SYMBOL NAME AND FUNCTION

1, 7 1OE, 2OE Output enable

2, 5 1A, 2A A port inputs

3, 6 1B, 2B B port outputs

4 GND Ground (0 V)

8 VCC Positive supply voltage

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS

Tamb = 25 °C; GND = 0 V TYPICAL UNIT

tPLH

tPHL Propagation delay

A to B or B to A CL = 50 pF; VCC = +5.0 V ±0.5 V 0.25 (MAX) ns

CIO(OFF) Pin capacitance (OFF state) VO = 3 V or 0; OE = VCC 6.45 pF

ICC Quiescent supply current VCC = 5.5 V ; IO = 0, VI = VCC or GND 3µA

ORDERING INFORMATION

PACKAGES TEMPERATURE RANGE ORDER CODE DWG NUMBER

8-pin plastic SO –40 to 85 °C CBT3306D SOT96-1

8-pin plastic TSSOP –40 to 85 °C CBT3306PW SOT530-1

Standard packing quantities and other packaging data is available at www.philipslogic.com/packaging.

LOGIC DIAGRAM (positive logic)

1A 31B

SA00534

1OE

2A 62B

2OE

FUNCTION TABLE

INPUT

FUNCTION

LA port = B port

H Disconnect

Philips Semiconductors Product data

CBT3306Dual bus switch

2001 Nov 08 3

ABSOLUTE MAXIMUM RATINGS1

Tamb = –40 to +85 °C, unless otherwise specified.

SYMBOL PARAMETER CONDITIONS RATING UNIT

VCC DC supply voltage –0.5 to +7.0 V

VIDC input voltage2–0.5 to +7.0 V

IOUT DC output current 128 mA

IIK Diode current VI/O < 0 –50 mA

Tstg Storage temperature range –65 to +150 °C

NOTES:

1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the

device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to

absolute-maximum-rated conditions for extended periods may affect device reliability.

2. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.

3. The package thermal impedance is calculated in accordance with JESD 51.

RECOMMENDED OPERATING CONDITIONS1

SYMBOL

PARAMETER

LIMITS

UNIT

SYMBOL

PARAMETER

MIN MAX

UNIT

VCC DC supply voltage 4.5 5.5 V

VIH High-level input voltage 2.0 — V

VIL Low-level Input voltage — 0.8 V

Tamb Operating free-air temperature range –40 +85 °C

NOTE:

1. All unused control inputs of the device must be held at VCC or GND to ensure proper device operation.

DC ELECTRICAL CHARACTERISTICS

Tamb = –40 to +85 °C, unless otherwise specified.

LIMITS

SYMBOL PARAMETER TEST CONDITIONS Tamb = –40 to +85 °C UNIT

MIN TYP1MAX

VIK Input clamp voltage VCC = 4.5 V ; II = –18 mA — — –1.2 V

IIInput leakage current VCC = 5.5 V ; VI = GND or 5.5 V — — ±1µA

ICC Quiescent supply current VCC = 5.5 V ; IO = 0, VI = VCC or GND — — 3 µA

VPOutput high pass voltage VI = VCC = 5.0 V; IO = –100 µA 3.4 3.6 3.9 V

∆ICC Additional supply current per input pin2VCC = 5.5 V, one input at 3.4 V,

other inputs at VCC or GND — — 2.5 mA

CIControl pin capacitance VI= 3 V or 0 — 3.15 — pF

CIO(OFF) Port off capacitance VO = 3 V or 0; OE = VCC — 6.45 — pF

VCC = 4.5 V ; VI = 0 V; II = 64 mA — 3.4 5 Ω

ron

On-resistance VCC = 4.5 V ; VI = 0 V; II = 30 mA — 3.4 5 Ω

VCC = 4.5 V ; VI = 2.4 V; II = 15 mA — 6.8 7.5 Ω

NOTES:

1. All typical values are at VCC = 5 V, Tamb = 25 °C.

2. This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND

3. Measured by the voltage drop between the A and the B terminals at the indicated current through the switch.

On-state resistance is determined by the lowest voltage of the two (A or B) terminals.

Philips Semiconductors Product data

CBT3306Dual bus switch

2001 Nov 08 4

AC CHARACTERISTICS

Tamb = –40 to +85 °C; CL = 50 pF

LIMITS

SYMBOL PARAMETER FROM (INPUT) TO

(OUTPUT)

VCC = +5.0 V ±0.5 V UNIT

(OUTPUT)

MIN MAX

tpd Propagation delay1A or B B or A — 0.25 ns

ten Output enable time

to High and Low level OE A or B 1.8 5 ns

tdis Output disable time

from High and Low level OE A or B 1 5 ns

NOTE:

1. The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance,

when driven by an ideal voltage source (zero output impedance).

AC WAVEFORMS

VM = 1.5 V, VIN = GND to 3.0 V

INPUT 1.5 V

OUTPUT

tPLH tPHL

SA00028

1.5 V

1.5 V 1.5 V

3 V

0 V

VOH

VOL

W aveform 1. Input to Output Propagation Delays

Output Control

(Low-level

enabling )

1.5 V

tPZH tPHZ VOH

VOL

tPZL tPLZ 3.5 V

0 V

VOL + 0.3 V

VOH – 0.3 V

SA00029

1.5 V

1.5 V 1.5 V

0 V

3 V

Output

Waveform 1

S1 at 7 V

(see Note)

Note:

Waveform 1 is for an output with internal conditions such that

the output is low except when disabled by the output control.

Waveform 2 is for an output with internal conditions such that

the output is high except when disabled by the output control.

Output

Waveform 2

S1 at Open

(see Note)

W aveform 2. 3-State Output Enable and Disable Times

NOTES:

1. tPLZ and tPHZ are the same as tdis.

2. tPZL and tPZH are the same as ten.

3. tPLH and tPHL are the same as tpd.

TEST CIRCUIT AND WAVEFORMS

CL = 50 pF 500 Ω

Load Circuit

DEFINITIONS

CL = Load capacitance includes jig and probe capacitance;

see AC CHARACTERISTICS for value.

TEST S1

tpd open

tPLZ/tPZL 7 V

tPHZ/tPZH open

SA00012

500 Ω

From Output

Under Test

S1 7 V

Open

GND

NOTES:

1. All input pulses are supplied by generators having the following

characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤2.5 ns, tf ≤2.5 ns.

2. The outputs are measured one at a time with one transition per

measurement.

Philips Semiconductors Product data

CBT3306Dual bus switch

2001 Nov 08 5

TSSOP8: plastic thin shrink small outline; 8 leads; body width 4.4 mm SOT530-1

Philips Semiconductors Product data

CBT3306Dual bus switch

2001 Nov 08 6

SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

Philips Semiconductors Product data

CBT3306Dual bus switch

2001 Nov 08 7

NOTES

Philips Semiconductors Product data

CBT3306Dual bus switch

2001 Nov 08 8

Definitions

Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For

detailed information see the relevant data sheet or data handbook.

Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one

or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or

at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended

periods may af fect device reliability.

Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips

Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or

modification.

Disclaimers

Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can

reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications

do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.

Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard

cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no

responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these

products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless

otherwise specified.

Contact information

For additional information please visit

http://www.semiconductors.philips.com. Fax: +31 40 27 24825

For sales offices addresses send e-mail to:

sales.addresses@www.semiconductors.philips.com.

 Koninklijke Philips Electronics N.V. 2001

Date of release: 11-01

Document order number: 9397 750 091 15

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Data sheet status[1]

Objective data

Preliminary data

Product data

Product

status[2]

Development

Qualification

Production

Definitions

This data sheet contains data from the objective specification for product development.

Philips Semiconductors reserves the right to change the specification in any manner without notice.

This data sheet contains data from the preliminary specification. Supplementary data will be

published at a later date. Philips Semiconductors reserves the right to change the specification

without notice, in order to improve the design and supply the best possible product.

This data sheet contains data from the product specification. Philips Semiconductors reserves the

right to make changes at any time in order to improve the design, manufacturing and supply.

Changes will be communicated according to the Customer Product/Process Change Notification

(CPCN) procedure SNW-SQ-650A.

Data sheet status

[1] Please consult the most recently issued data sheet before initiating or completing a design.

[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL

http://www.semiconductors.philips.com.