Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) X5R Dielectric, 4 - 50 VDC (Commercial Grade) Overview KEMET's X5R dielectric features an 85C maximum operating temperature and is considered "semi-stable." The Electronics Components, Assemblies & Materials Association (EIA) characterizes X5R dielectric as a Class II material. Components of this classification are fixed, ceramic dielectric capacitors suited for bypass and decoupling applications or for frequency discriminating circuits where Q and stability of capacitance characteristics are not critical. X5R exhibits a predictable change in capacitance with respect to time and voltage and boasts a minimal change in capacitance with reference to ambient temperature. Capacitance change is limited to 15% from -55C to +85C. Benefits Applications * * * * * * * * * Typical applications include decoupling, bypass, and filtering. -55C to +85C operating temperature range Pb-Free and RoHS Compliant Temperature stable dielectric EIA 0201, 0402, 0603, 0805, 1206, and 1210 case sizes DC voltage ratings of 4 V, 6.3 V, 10 V, 16 V, 25 V, 35 V, and 50 V Capacitance offerings ranging from 0.01 F to 100 F Available capacitance tolerances of 10% and 20% Non-polar device, minimizing installation concerns 100% pure matte tin-plated termination finish allowing for excellent solderability Ordering Information C 1206 Ceramic Case Size (L" x W") 1005 = 01005 0201 0402 0603 0805 1206 1210 1 2 C 107 M Specification/ Capacitance Code Capacitance Series (pF) Tolerance C = Standard 2 Significant Digits + Number of Zeros K = 10% M = 20% 9 P Voltage Dielectric 7=4V 9 = 6.3 V 8 = 10 V 4 = 16 V 3 = 25 V 6 = 35 V 5 = 50 V P = X5R A C TU Failure Rate/ Termination Finish1 Design A = N/A Packaging/Grade (C-Spec)2 C = 100% Matte Sn Blank = Bulk TU = 7" Reel Unmarked TM = 7" Reel Marked Additional termination finish options may be available. Contact KEMET for details. Additional reeling or packaging options may be available. Contact KEMET for details. One world. One KEMET (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1006_X5R_SMD * 8/15/2012 1 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) - X5R Dielectric, 4 - 50 VDC (Commercial Grade) Dimensions - Millimeters (Inches) 100% Tin or SnPb Plate L W B T Nickel Plate Electrodes EIA Size Code Metric Size Code L Length 01005 0201 0402 0603 0805 1206 1210 1812 1825 2220 2225 0402 0603 1005 1608 2012 3216 3225 4532 4564 5650 5664 0.40 (.016) 0.02 (.001) 0.60 (.024) 0.03 (.001) 1.00 (.040) 0.05 (.002) 1.60 (.063) 0.15 (.006) 2.00 (.079) 0.20 (.008) 3.20 (.126) 0.20 (.008) 3.20 (.126) 0.20 (.008) 4.50 (.177) 0.30 (.012) 4.50 (.177) 0.30 (.012) 5.70 (.224) 0.40 (.016) 5.60 (.220) 0.40 (.016) Conductive Metalization W Width T Thickness 0.20 (.008) 0.02 (.001) 0.30 (.012) 0.03 (.001) 0.50 (.020) 0.05 (.002) 0.80 (.032) 0.15 (.006) 1.25 (.049) 0.20 (.008) See Table 2 for 1.60 (.063) 0.20 (.008) Thickness 2.50 (.098) 0.20 (.008) 3.20 (.126) 0.30 (.012) 6.40 (.252) 0.40 (.016) 5.00 (.197) 0.40 (.016) 6.40 (.248) 0.40 (.016) B Bandwidth 0.10 (.004) 0.03 (.001) 0.15 (.006) 0.05 (.002) 0.30 (.012) 0.10 (.004) 0.35 (.014) 0.15 (.006) 0.50 (0.02) 0.25 (.010) 0.50 (0.02) 0.25 (.010) 0.50 (0.02) 0.25 (.010) 0.60 (.024) 0.35 (.014) 0.60 (.024) 0.35 (.014) 0.60 (.024) 0.35 (.014) 0.60 (.024) 0.35 (.014) Qualification/Certification Ceramic Surface Mount S S Separation Minimum N/A 0.30 (.012) 0.70 (.028) 0.75 (.030) N/A Mounting Technique Solder Reflow Only Solder Wave or Solder Reflow Solder Reflow Only Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in Table 4, Performance & Reliability. Environmental Compliance Pb-Free and RoHS Compliant. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1006_X5R_SMD * 8/15/2012 2 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) - X5R Dielectric, 4 - 50 VDC (Commercial Grade) Electrical Parameters/Characteristics Item Parameters/Characteristics Operating Temperature Range -55C to +85C Capacitance Change with Reference to +25C and 0 VDC Applied (TCC) 15% Aging Rate (Maximum % Capacitance Loss/Decade Hour) 4.0% Dielectric Withstanding Voltage (DWV) Dissipation Factor (DF) Maximum Limit @ 25C Insulation Resistance (IR) Limit @ 25C 250% of rated voltage (5 1 seconds and charge/discharge not exceeding 50 mA) See Dissipation Factor Limit Table See Insulation Resistance Limit Table (Rated voltage applied for 120 5 seconds @ 25C) Regarding aging rate: Capacitance measurements (including tolerance) are indexed to a referee time of 48 or 1,000 hours. Please refer to a part number specific datasheet for referee time details. To obtain IR limit, divide M-F value by the capacitance and compare to G limit. Select the lower of the two limits. Capacitance and dissipation factor (DF) measured under the following conditions: 1 kHz 50 Hz and 1.0 0.2 Vrms if capacitance 10 F 120 Hz 10 Hz and 0.5 0.1 Vrms if capacitance > 10 F Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as Automatic Level Control (ALC). The ALC feature should be switched to "ON." Post Environmental Limits High Temperature Life, Biased Humidity, Moisture Resistance Dielectric Rated DC Voltage Capacitance Value > 25 X5R Dissipation Factor (Maximum %) Insulation Resistance 20% 10% of Initial Limit 3.0 All 25 Capacitance Shift 7.5 < 25 < 0.56 F 7.5 < 25 0.56 F 12.0 Dissipation Factor Limit Table Rated DC Voltage Capacitance Dissipation Factor 50 - 200 V All 3% 25 V All 5% < 25 V < 0.56 F 5% < 25 V 0.56 F 10% (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1006_X5R_SMD * 8/15/2012 3 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) - X5R Dielectric, 4 - 50 VDC (Commercial Grade) Insulation Resistance Limit Table EIA Case Size 1,000 Megohm Microfarads or 100 G 500 Megohm Microfarads or 10 G 0201 N/A ALL 0402 < 0.012 F 0.012 F 0603 < 0.047 F 0.047 F 0805 < 0.047 F 0.047 F 1206 < 0.22 F 0.22 F 1210 < 0.39 F 0.39 F 1808 ALL N/A 1812 < 2.2 F 2.2 F 1825 ALL N/A 2220 < 10 F 10 F 2225 ALL N/A (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1006_X5R_SMD * 8/15/2012 4 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) - X5R Dielectric, 4 - 50 VDC (Commercial Grade) Table 1 - Capacitance Range/Selection Waterfall (1005 - 1210 Case Sizes) Series 16 4 6.3 10 16 25 50 4 6.3 10 16 25 50 8 4 3 5 9 8 4 3 1 9 8 4 3 6 5 FD FD FD FD FF FH FD FD FD FG FG FH FJ FK FG FJ FK FT FD FF FG FH FD FD FD FD FF FH FD FD FD FG FG FH FJ FK FG FJ FK FT FD FG FH FJ FD FD FD FD FF FH FD FD FD FG FG FH FJ FK FE FJ FG FH FD FD FD FD FF FH FH BB BB BB BB BB BB BB BB BB BB BB BB BC CC CC CC C1005 DH DG EH EH EH FS FS FS FS DC DD DE DF DG DC DC DD DG DL DL DG DH DG DG 10 16 4 6.3 10 16 25 50 4 6.3 10 16 25 50 4 6.3 10 16 25 DG DG DG 4 9 EH EH DC DD DE DF DG DC DC DD DG DL DL DG DG DG DG 6.3 4 7 DG DG FD FD FD FD FF FH FD FD FD FG FG FH FJ FK FG FJ FK FT FD FF FG FH DC DD DE DF DG DC DC DD DG DL DL DG DG DG DG CC CC 7 9 8 4 7 9 8 3 5 4 7 9 8 4 3 5 7 9 8 4 3 C0201 C0402 C0603 EB EB EB EC ED EE EF EG EC EC EC EE EF EH EH EH EH C0805 EH 5 9 8 4 3 C1206 FT FS 35 CC CC EB EB EB EC ED EE EF EF EC EC EC EE EF EH EH EH EH EH EH EH 50 BB EB EB EB EC ED EE EF EF EC EC EC EE EF EH EH EH EK EK ED EH 25 CC CC CC CC EB EB EB DC DC EC DD DD ED DE DE EE DF DF EF DG DG DG EF DC EC DC EC DD EC DG EE DL EF DG EH DG EH DH DG EH EK EK ED DG EH 16 CC CC CC CC CC CC CC CC CC 10 CC CC CC CC CC CC CC CC 50 BB BB BB BB BB CC CC CC CC CC CC CC CC 6.3 BB BB BB CC CC CC CC CC CC CC CC 25 BB BB 16 BB BB BB BB BB BB BB BB BB BB BB BB 10 BB BB BB BB BB BB BB BB BB BB BB BB 50 AB AB BB BB BB BB BB BB BB BB BB BB BB BB 6.3 AB AB AB AB 6.3 Voltage DC 9 Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M Voltage Code 7 35 5 50 3 16 4 25 8 10 9 50 7 C1210 6.3 5 16 3 25 4 10 8 50 9 6.3 7 16 4 25 8 10 9 4 7 C1206 6.3 9 10 Cap Cap Code C0805 7 Cap Tolerance K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K C0603 4 103 123 153 183 223 273 333 393 473 563 683 823 104 124 154 184 224 274 334 394 474 564 684 824 105 125 155 185 225 275 335 395 475 565 685 825 106 126 156 186 226 276 336 396 476 107 Voltage DC C0402 6.3 10,000 pF 12,000 pF 15,000 pF 18,000 pF 22,000 pF 27,000 pF 33,000 pF 39,000 pF 47,000 pF 56,000 pF 68,000 pF 82,000 pF 0.10 uF 0.12 uF 0.15 uF 0.18 uF 0.22 uF 0.27 uF 0.33 uF 0.39 uF 0.47 uF 0.56 uF 0.68 uF 0.82 uF 1.0 uF 1.2 uF 1.5 uF 1.8 uF 2.2 uF 2.7 uF 3.3 uF 3.9 uF 4.7 uF 5.6 uF 6.8 uF 8.2 uF 10 uF 12 uF 15 uF 18 uF 22 uF 27 uF 33 uF 39 uF 47 uF 100 uF Voltage Code C0201 4 Cap Code C1005 6.3 Cap Series 5 9 8 4 3 6 5 C1210 xx Available only in M tolerance. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com Roll Over for Order Info. C1006_X5R_SMD * 8/15/2012 5 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) - X5R Dielectric, 4 - 50 VDC (Commercial Grade) Table 2 - Chip Thickness/Packaging Quantities Paper Quantity Plastic Quantity Thickness Code Case Size Thickness Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel AB BB BC CC DC DD DL DE DF DG DH EB EK EC ED EE EF EH FD FE FF FG FH FJ FT FK FS 0201 0402 0402 0603 0805 0805 0805 0805 0805 0805 0805 1206 1206 1206 1206 1206 1206 1206 1210 1210 1210 1210 1210 1210 1210 1210 1210 0.30 0.03 0.50 0.05 0.50 0.10 0.80 0.10 0.78 0.10 0.90 0.10 0.95 0.10 1.00 0.10 1.10 0.10 1.25 0.15 1.25 0.20 0.78 0.10 0.80 0.10 0.90 0.10 1.00 0.10 1.10 0.10 1.20 0.15 1.60 0.20 0.95 0.10 1.00 0.10 1.10 0.10 1.25 0.15 1.55 0.15 1.85 0.20 1.90 0.20 2.10 0.20 2.50 0.20 15,000 10,000 10,000 4,000 4,000 4,000 0 0 0 0 0 4,000 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 50,000 50,000 10,000 10,000 10,000 0 0 0 0 0 10,000 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 4,000 2,500 2,500 2,500 2,500 4,000 2,000 4,000 2,500 2,500 2,500 2,000 4,000 2,500 2,500 2,500 2,000 2,000 1,500 2,000 1,000 0 0 0 0 0 0 10,000 10,000 10,000 10,000 10,000 10,000 8,000 10,000 10,000 10,000 10,000 8,000 10,000 10,000 10,000 10,000 8,000 8,000 4,000 8,000 4,000 Thickness Code Case Size Thickness Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel Paper Quantity Plastic Quantity Package quantity based on finished chip thickness specifications. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1006_X5R_SMD * 8/15/2012 6 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) - X5R Dielectric, 4 - 50 VDC (Commercial Grade) Table 3 - Chip Capacitor Land Pattern Design Recommendations per IPC-7351 EIA Size Code Metric Size Code 01005 Density Level A: Maximum (Most) Land Protrusion (mm) Density Level B: Median (Nominal) Land Protrusion (mm) Density Level C: Minimum (Least) Land Protrusion (mm) C Y X V1 V2 C Y X V1 V2 C Y X V1 V2 0402 0.33 0.46 0.43 1.60 0.90 0.28 0.36 0.33 1.30 0.70 0.23 0.26 0.23 1.00 0.50 0201 0603 0.38 0.56 0.52 1.80 1.00 0.33 0.46 0.42 1.50 0.80 0.28 0.36 0.32 1.20 0.60 0402 1005 0.50 0.72 0.72 2.20 1.20 0.45 0.62 0.62 1.90 1.00 0.40 0.52 0.52 1.60 0.80 0603 1608 0.90 1.15 1.10 4.00 2.10 0.80 0.95 1.00 3.10 1.50 0.60 0.75 0.90 2.40 1.20 0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 0.95 1.35 2.80 1.70 1206 3216 1.60 1.35 1.90 5.60 2.90 1.50 1.15 1.80 4.70 2.30 1.40 0.95 1.70 4.00 2.00 1210 3225 1.60 1.35 2.80 5.65 3.80 1.50 1.15 2.70 4.70 3.20 1.40 0.95 2.60 4.00 2.90 1808 4520 2.30 1.75 2.30 7.40 3.30 2.20 1.55 2.20 6.50 2.70 2.10 1.35 2.10 5.80 2.40 1812 4532 2.15 1.60 3.60 6.90 4.60 2.05 1.40 3.50 6.00 4.00 1.95 1.20 3.40 5.30 3.70 1825 4564 2.15 1.60 6.90 6.90 7.90 2.05 1.40 6.80 6.00 7.30 1.95 1.20 6.70 5.30 7.00 2220 5650 2.75 1.70 5.50 8.20 6.50 2.65 1.50 5.40 7.30 5.90 2.55 1.30 5.30 6.60 5.60 2225 5664 2.70 1.70 6.90 8.10 7.90 2.60 1.50 6.80 7.20 7.30 2.50 1.30 6.70 6.50 7.00 Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. KEMET only recommends wave soldering of EIA 0603, 0805, and 1206 case sizes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC Standard 7351 (IPC-7351). Soldering Process Recommended Soldering Technique: * Solder wave or solder reflow for EIA case sizes 0603, 0805, and 1206 * All other EIA case sizes are limited to solder reflow only Recommended Soldering Profile: * KEMET recommends following the guidelines outlined in IPC/JEDEC J-STD-020 (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1006_X5R_SMD * 8/15/2012 7 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) - X5R Dielectric, 4 - 50 VDC (Commercial Grade) Table 4 - Performance & Reliability: Test Methods and Conditions Stress Reference Test or Inspection Method Terminal Strength JIS-C-6429 Appendix 1, Note: Force of 1.8 kg for 60 seconds. Board Flex JIS-C-6429 Appendix 2, Note: Standard termination system - 2.0 mm (minimum) for all except 3 mm for C0G. Flexible termination system - 3.0 mm (minimum). Magnification 50 X. Conditions: Solderability J-STD-002 a) Method B, 4 hours @ 155C, dry heat @ 235C b) Method B @ 215C category 3 c) Method D, category 3 @ 260C Temperature Cycling JESD22 Method JA-104 Biased Humidity MIL-STD-202 Method 103 Moisture Resistance MIL-STD-202 Method 106 1,000 Cycles (-55C to +125C). Measurement at 24 hours +/- 2 hours after test conclusion. Load Humidity: 1,000 hours 85C/85% RH and rated voltage. Add 100 K ohm resistor. Measurement at 24 hours +/- 2 hours after test conclusion. Low Volt Humidity: 1,000 hours 85C/85% RH and 1.5 V. Add 100 K ohm resistor. Measurement at 24 hours +/- 2 hours after test conclusion. t = 24 hours/cycle. Steps 7a and 7b not required. Unpowered. Measurement at 24 hours +/- 2 hours after test conclusion. -55C/+125C. Note: Number of cycles required - 300, maximum transfer time - 20 seconds, dwell time - 15 minutes. Air - Air. Thermal Shock MIL-STD-202 Method 107 High Temperature Life MIL-STD-202 Method 108 /EIA-198 Storage Life MIL-STD-202 Method 108 150C, 0 VDC for 1,000 hours. Mechanical Shock MIL-STD-202 Method 213 Figure 1 of Method 213, Condition F. Resistance to Solvents MIL-STD-202 Method 215 Add aqueous wash chemical, OKEM Clean or equivalent. 1,000 hours at 125C (85C for X5R, Z5U and Y5V) with 2 X rated voltage applied. Storage and Handling Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature- reels may soften or warp and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40C and maximum storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of receipt. Construction Reference A B C D E Item Finish Barrier Layer Base Metal Inner Electrode Termination System Dielectric Material Material 100% Matte Sn Ni Cu Ni BaTiO3 Note: Image is exaggerated in order to clearly identify all components of construction. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1006_X5R_SMD * 8/15/2012 8 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) - X5R Dielectric, 4 - 50 VDC (Commercial Grade) Tape & Reel Packaging Information KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips. Bar Code Label Anti-Static Reel (R) Embossed Plastic* or Punched Paper Carrier. ET KEM Chip and KPS Orientation in Pocket (except 1825 Commercial, and 1825 and 2225 Military) Sprocket Holes Embossment or Punched Cavity 8 mm, 12 mm or 16 mm Carrier Tape 178 mm (7.00") or 330 mm (13.00") Anti-Static Cover Tape (.10 mm (.004") Maximum Thickness) *EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only. Table 5 - Carrier Tape Configuration - Embossed Plastic & Punched Paper (mm) EIA Case Size Tape Size (W)* Lead Space (P1)* 01005 - 0402 8 2 0603 - 1210 8 4 1805 - 1808 12 4 1812 12 8 KPS 1210 12 8 KPS 1812 & 2220 16 12 Array 0508 & 0612 8 4 *Refer to Figures 1 & 2 for W and P1 carrier tape reference locations. *Refer to Tables 6 & 7 for tolerance specifications. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1006_X5R_SMD * 8/15/2012 9 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) - X5R Dielectric, 4 - 50 VDC (Commercial Grade) Figure 1 - Embossed (Plastic) Carrier Tape Dimensions P2 T T2 ODo [10 pitches cumulative tolerance on tape 0.2 mm] Po E1 Ao F Ko W B1 E2 Bo S1 P1 T1 Center Lines of Cavity OD 1 Cover Tape B 1 is for tape feeder reference only, including draft concentric about B o. Embossment For cavity size, see Note 1 Table 4 User Direction of Unreeling Table 6 - Embossed (Plastic) Carrier Tape Dimensions Metric will govern Constant Dimensions -- Millimeters (Inches) Tape Size D0 8 mm 12 mm 1.5 +0.10/-0.0 (0.059 +0.004/-0.0) 16 mm D1 Minimum Note 1 1.0 (0.039) 1.5 (0.059) E1 1.75 0.10 (0.069 0.004) R Reference S1 Minimum Note 2 Note 3 25.0 (0.984) 4.0 0.10 2.0 0.05 (0.079 0.600 (0.157 0.004) 0.002) (0.024) 30 (1.181) P0 P2 T Maximum T1 Maximum 0.600 (0.024) 0.100 (0.004) Variable Dimensions -- Millimeters (Inches) Tape Size Pitch 8 mm Single (4 mm) 12 mm Single (4 mm) & Double (8 mm) 16 mm Triple (12 mm) B1 Maximum Note 4 4.35 (0.171) 8.2 (0.323) 12.1 (0.476) E2 Minimum 6.25 (0.246) 10.25 (0.404) 14.25 (0.561) F P1 3.5 0.05 4.0 0.10 (0.138 0.002) (0.157 0.004) 8.0 0.10 (0.315 5.5 0.05 0.004) (0.217 0.002) 5.5 0.05 8.0 0.10 (0.315 (0.217 0.002) 0.004) T2 Maximum 2.5 (0.098) 4.6 (0.181) 4.6 (0.181) W Maximum 8.3 (0.327) 12.3 (0.484) 16.3 (0.642) A0,B0 & K0 Note 5 1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 2. The tape with or without components shall pass around R without damage (see Figure 6). 3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b). 4. B1 dimension is a reference dimension for tape feeder clearance only. 5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20 maximum for 8 and 12 mm tapes and 10 maximum for 16 mm tapes (see Figure 3). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4). (e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket. (f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1006_X5R_SMD * 8/15/2012 10 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) - X5R Dielectric, 4 - 50 VDC (Commercial Grade) Figure 2 - Punched (Paper) Carrier Tape Dimensions P2 T Po ODo [10 pitches cumulative tolerance on tape 0.2 mm] E1 A0 F P1 T1 T1 Top Cover Tape W E2 B0 Bottom Cover Tape G Cavity Size, See Note 1, Table 7 Center Lines of Cavity Bottom Cover Tape User Direction of Unreeling Table 7 - Punched (Paper) Carrier Tape Dimensions Metric will govern Constant Dimensions -- Millimeters (Inches) Tape Size D0 E1 P0 P2 T1 Maximum G Minimum 8 mm 1.5 +0.10 -0.0 (0.059 +0.004 -0.0) 1.75 0.10 (0.069 0.004) 4.0 0.10 (0.157 0.004) 2.0 0.05 (0.079 0.002) 0.10 (0.004) Maximum 0.75 (0.030) R Reference Note 2 25 (0.984) T Maximum W Maximum A0 B 0 1.1 (0.098) 8.3 (0.327) 8.3 (0.327) Variable Dimensions -- Millimeters (Inches) Tape Size Pitch 8 mm Half (2 mm) 8 mm Single (4 mm) E2 Minimum 6.25 (0.246) F 3.5 0.05 (0.138 0.002) P1 2.0 0.05 (0.079 0.002) 4.0 0.10 (0.157 0.004) Note 1 1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that: a) the component does not protrude beyond either surface of the carrier tape. b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. c) rotation of the component is limited to 20 maximum (see Figure 3). d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4). e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements. 2. The tape with or without components shall pass around R without damage (see Figure 6). (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1006_X5R_SMD * 8/15/2012 11 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) - X5R Dielectric, 4 - 50 VDC (Commercial Grade) Packaging Information Performance Notes 1. Cover Tape Break Force: 1.0 Kg minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8 mm 0.1 to 1.0 Newton (10 to 100 gf) 12 and 16 mm 0.1 to 1.3 Newton (10 to 130 gf) The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165 to 180 from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 10 mm/minute. 3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA Standards 556 and 624. Figure 3 - Maximum Component Rotation T Maximum Component Rotation Top View Maximum Component Rotation Side View Typical Pocket Centerline Tape Width (mm) 8,12 16 - 200 Bo Maximum Rotation ( 20 10 T) Typical Component Centerline Ao Figure 4 - Maximum Lateral Movement 8 mm & 12 mm Tape 0.5 mm maximum 0.5 mm maximum 16 mm Tape s Tape Maximum Width (mm) Rotation ( 8,12 20 16 - 56 10 72 - 200 5 S) Figure 5 - Bending Radius Embossed Carrier Punched Carrier 1.0 mm maximum 1.0 mm maximum R Bending Radius (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com R C1006_X5R_SMD * 8/15/2012 12 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) - X5R Dielectric, 4 - 50 VDC (Commercial Grade) Figure 6 - Reel Dimensions Full Radius, See Note W3 (Includes Access Hole at Slot Location (O 40 mm minimum) flange distortion at outer edge) W2 (Measured at hub) D A N (See Note) C (Arbor hole diameter) B (see Note) W1 (Measured at hub) If present, tape slot in core for tape start: 2.5 mm minimum width x 10.0 mm minimum depth Note: Drive spokes optional; if used, dimensions B and D shall apply. Table 8 - Reel Dimensions Metric will govern Constant Dimensions -- Millimeters (Inches) Tape Size A B Minimum C D Minimum 8 mm 178 0.20 (7.008 0.008) or 330 0.20 (13.000 0.008) 1.5 (0.059) 13.0 +0.5/-0.2 (0.521 +0.02/-0.008) 20.2 (0.795) 12 mm 16 mm Variable Dimensions -- Millimeters (Inches) Tape Size N Minimum W1 W2 Maximum W3 50 (1.969) 8.4 +1.5/-0.0 (0.331 +0.059/-0.0) 12.4 +2.0/-0.0 (0.488 +0.078/-0.0) 16.4 +2.0/-0.0 (0.646 +0.078/-0.0) 14.4 (0.567) 18.4 (0.724) 22.4 (0.882) Shall accommodate tape width without interference 8 mm 12 mm 16 mm (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1006_X5R_SMD * 8/15/2012 13 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) - X5R Dielectric, 4 - 50 VDC (Commercial Grade) Figure 7 - Tape Leader & Trailer Dimensions Embossed Carrier Carrier Tape Punched Carrier 8 mm & 12 mm only END Round Sprocket Holes START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) Trailer 160 mm Minimum Components 100 mm Minimum Leader 400 mm Minimum Top Cover Tape Figure 8 - Maximum Camber Elongated sprocket holes (32 mm & wider tapes) Carrier Tape Round Sprocket Holes 1 mm Maximum, either direction Straight Edge 250 mm (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1006_X5R_SMD * 8/15/2012 14 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) - X5R Dielectric, 4 - 50 VDC (Commercial Grade) Figure 9 - Bulk Cassette Packaging (Ceramic Chips Only) Meets Dimensional Requirements IEC-286 and EIAJ 7201 6 8 0.1 8 8 0.1 12.0 0.1 Unit mm *Reference 19.0* 36 00.2 31.5 0.2 0 53 3* 10* 1.5 2.0 3.0 0.1 0 0 0.1 0.2 0 5 0* 110 0.7 Table 9 - Capacitor Dimensions for Bulk Cassette Cassette Packaging - Millimeters EIA Size Code Metric Size Code L Length W Width B Bandwidth S Separation Minimum T Thickness Number of Pieces/Cassette 0402 1005 1.0 0.05 0.5 0.05 0.2 to 0.4 0.3 0.5 0.05 50,000 0603 1608 1.6 0.07 0.8 0.07 0.2 to 0.5 0.7 0.8 0.07 15,000 Table 10 - Capacitor Marking Numeral Alpha Character A B C D E F G H J K L M N P Q R S T U V W X Y Z a b d e f m n t y Capacitance (pF) For Various Numeral Identifiers 9 0.1 0.11 0.12 0.13 0.15 0.16 0.18 0.2 0.22 0.24 0.27 0.3 0.33 0.36 0.39 0.43 0.47 0.51 0.56 0.62 0.68 0.75 0.82 0.91 0.25 0.35 0.4 0.45 0.5 0.6 0.7 0.8 0.9 0 1 1.1 1.2 1.3 1.5 1.6 1.8 2 2.2 2.4 2.7 3 3.3 3.6 3.9 4.3 4.7 5.1 5.6 6.2 6.8 7.5 8.2 9.1 2.5 3.5 4 4.5 5 6 7 8 9 1 10 11 12 13 15 16 18 20 22 24 27 30 33 36 39 43 47 51 56 62 68 75 82 91 25 35 40 45 50 60 70 80 90 2 100 110 120 130 150 160 180 200 220 240 270 300 330 360 390 430 470 510 560 620 680 750 820 910 250 350 400 450 500 600 700 800 900 3 1000 1100 1200 1300 1500 1600 1800 2000 2200 2400 2700 3000 3300 3600 3900 4300 4700 5100 5600 6200 6800 7500 8200 9100 2500 3500 4000 4500 5000 6000 7000 8000 9000 4 10000 11000 12000 13000 15000 16000 18000 20000 22000 24000 27000 30000 33000 36000 39000 43000 47000 51000 56000 62000 68000 75000 82000 91000 25000 35000 40000 45000 50000 60000 70000 80000 90000 5 100000 110000 120000 130000 150000 160000 180000 200000 220000 240000 270000 300000 330000 360000 390000 430000 470000 510000 560000 620000 680000 750000 820000 910000 250000 350000 400000 450000 500000 600000 700000 800000 900000 6 1000000 1100000 1200000 1300000 1500000 1600000 1800000 2000000 2200000 2400000 2700000 3000000 3300000 3600000 3900000 4300000 4700000 5100000 5600000 6200000 6800000 7500000 8200000 9100000 2500000 3500000 4000000 4500000 5000000 6000000 7000000 8000000 9000000 7 10000000 11000000 12000000 13000000 15000000 16000000 18000000 20000000 22000000 24000000 27000000 30000000 33000000 36000000 39000000 43000000 47000000 51000000 56000000 62000000 68000000 75000000 82000000 91000000 25000000 35000000 40000000 45000000 50000000 60000000 70000000 80000000 90000000 (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com Laser marking is available as an extracost option for most KEMET ceramic chips. Such marking is two sided and includes a K to identify KEMET, followed by two characters (per EIA-198) to identify the capacitance value. Note that marking is not available for any Y5V chip. ln addition, the 0603 marking option is limited to the K only. (Marking Optional - Not Available for 0402 Size) Example shown is 1,000 pF capacitor C1006_X5R_SMD * 8/15/2012 15 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) - X5R Dielectric, 4 - 50 VDC (Commercial Grade) KEMET Corporation World Headquarters Europe Asia 2835 KEMET Way Simpsonville, SC 29681 Southern Europe Geneva, Switzerland Tel: 41-22-715-0100 Northeast Asia Paris, France Tel: 33-1-4646-1009 Shenzhen, China Tel: 86-755-2518-1306 Sasso Marconi, Italy Tel: 39-051-939111 Beijing, China Tel: 86-10-5829-1711 Milan, Italy Tel: 39-02-57518176 Shanghai, China Tel: 86-21-6447-0707 Fort Lauderdale, FL Tel: 954-766-2800 Rome, Italy Tel: 39-06-23231718 Taipei, Taiwan Tel: 886-2-27528585 North America Madrid, Spain Tel: 34-91-804-4303 Southeast Asia Mailing Address: P.O. Box 5928 Greenville, SC 29606 www.kemet.com Tel: 864-963-6300 Fax: 864-963-6521 Corporate Offices Southeast Lake Mary, FL Tel: 407-855-8886 Northeast Wilmington, MA Tel: 978-658-1663 West Chester, PA Tel: 610-692-4642 Central Europe Hong Kong Tel: 852-2305-1168 Singapore Tel: 65-6586-1900 Landsberg, Germany Tel: 49-8191-3350800 Penang, Malaysia Tel: 60-4-6430200 Dortmund, Germany Tel: 49-2307-3619672 Bangalore, India Tel: 91-806-53-76817 Kwidzyn, Poland Tel: 48-55-279-7025 Central Novi, MI Tel: 248-994-1030 Carmel, IN Tel: 317-706-6742 West Milpitas, CA Tel: 408-433-9950 Mexico Zapopan, Jalisco Tel: 52-33-3123-2141 Northern Europe Bishop's Stortford, United Kingdom Tel: 44-1279-757201 Weymouth, United Kingdom Tel: 44-1305-830747 Coatbridge, Scotland Tel: 44-1236-434455 Farjestaden, Sweden Tel: 46-485-563934 Espoo, Finland Tel: 358-9-5406-5000 Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of KEMET Electronics Corporation. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1006_X5R_SMD * 8/15/2012 16 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) - X5R Dielectric, 4 - 50 VDC (Commercial Grade) Other KEMET Resources Tools Resource Location Configure A Part: CapEdge http://capacitoredge.kemet.com SPICE & FIT Software http://www.kemet.com/spice Search Our FAQs: KnowledgeEdge http://www.kemet.com/keask Product Information Resource Location Products Technical Resources (Including Soldering Techniques) RoHS Statement Quality Documents http://www.kemet.com/products http://www.kemet.com/technicalpapers http://www.kemet.com/rohs http://www.kemet.com/qualitydocuments Product Request Resource Location Sample Request Engineering Kit Request http://www.kemet.com/sample http://www.kemet.com/kits Contact Resource Location Website Contact Us Investor Relations www.kemet.com http://www.kemet.com/contact http://www.kemet.com/ir Call Us 1-877-MyKEMET Twitter http://twitter.com/kemetcapacitors Disclaimer All product specifications, statements, information and data (collectively, the "Information") are subject to change without notice. All Information given herein is believed to be accurate and reliable, but is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on our knowledge of typical operating conditions for such applications, but are not intended to constitute - and we specifically disclaim - any warranty concerning suitability for a specific customer application or use. This Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by us with reference to the use of our products is given gratis, and we assume no obligation or liability for the advice given or results obtained. Although we design and manufacture our products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product-related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicated or that other measures may not be required. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1006_X5R_SMD * 8/15/2012 17 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) - X5R Dielectric, 4 - 50 VDC (Commercial Grade) Digitally signed by Jeannette Calvo DN: c=US, st=FL, l=Fort Lauderdale, o=KEMET Corp., ou=Marketing Communications, cn=Jeannette Calvo, email=jeannettecalvo@kemet.com Date: 2012.09.18 11:07:37 -04'00' (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1006_X5R_SMD * 8/15/2012 18